Magnetic grounding techniques for cable shielding

Abstract

The invention relates to magnetic grounding techniques for cable shielding. A magnetic grounding technique implements a magnet assembly. The magnet assembly may be soldered to the assembly to facilitate grounding of the metal shielding layer of the cable assembly. The cable plating may be plated to an exposed portion of an insulator of the cable assembly to form the cable assembly, and the cable plating is in galvanic contact with a metal shield of the cable assembly. The cable plating may include an electrically conductive magnetic material to ensure magnetic attraction with the magnet assembly. The magnet assembly is thereby magnetically attracted to the cable coating and also provides current contact between the cable coating and ground, thereby providing current contact between the metal shield of the cable and ground, thereby reducing RFI. The magnet assembly also magnetically aligns the cable connection pins with pins of a mating connector, thereby reducing stresses exerted on the connector.

Description

Technical Field

[0001] The present disclosure relates to magnetic grounding techniques for cable shielding. Background Art

[0002] Cables are often used in electronic devices to carry electrical signals to and from various components. These electrical signals may include high-speed I / O (HSIO) signals that include high-speed data signals. HSIO signals may include video data signals or other data signals for high-speed communication. Cables used to carry such HSIO signals typically include a grounded metal shield to mitigate radio frequency interference (RFI). However, current processes for grounding the metal shield have various disadvantages, particularly in terms of design complexity, cost, reusability, and PCB footprint.

[0003] Thus, there is a need to provide an improved cable shield that addresses these and other known problems.To address these issues, the disclosure described herein generally relates to grounding techniques for cable shielding, and more specifically to using magnets to facilitate cable ground shielding and mitigate RFI. Summary of the invention

[0004] According to an embodiment of the present disclosure, a magnetic grounding system is provided, comprising: a magnet assembly including a permanent magnet, the magnet assembly being coupled to the ground in a current manner; and a cable assembly including: a metal shielding layer encapsulating one or more conductors; and a cable plating in current contact with the metal shielding layer, the cable plating comprising a conductive magnetic material, wherein, when the cable plating is magnetically fixed to the magnet assembly via a magnetic attraction force between the cable plating and the permanent magnet, the metal shielding layer is coupled to the ground in a current manner via the electrical contact between the cable plating and the magnet assembly.

[0005] According to an embodiment of the present disclosure, an electronic device is provided, comprising: a printed circuit board (PCB), including a PCB ground; a magnet assembly, including a permanent magnet, the magnet assembly being coupled to the PCB ground in a current manner, and a cable assembly, comprising: (i) a metal shielding layer encapsulating one or more conductors, and (ii) a cable plating in current contact with the metal shielding layer, wherein the cable plating comprises a conductive magnetic material, and wherein, when the cable plating is magnetically fixed to the magnet assembly via the magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is coupled to the PCB ground in a current manner via the electrical contact between the cable plating and the magnet assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present disclosure and, together with the description, further help explain the principles and enable one skilled in the relevant art to make and use the techniques discussed herein.

[0007] In the drawings, like reference numerals generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, with emphasis generally being placed on illustrating the principles of the present disclosure. In the following description, reference is made to the following drawings, in which:

[0008] Figure 1A-1B The diagram shows the impact of grounded and ungrounded traditional flexible flat cable (FFC) on radio frequency interference (RFI);

[0009] Figure 2 The effect of RFI on the throughput of a wireless link is shown in the figure;

[0010] Figure 3 illustrates a side view and a top view of a conventional fabric-over-foam pad implementation for grounding an FFC cable shield;

[0011] Figure 4A illustrates a side view of a magnetic grounding system for grounding an FFC cable shield according to the present disclosure;

[0012] Figure 4B illustrates a top view of a magnetic grounding system for grounding an FFC cable shield according to the present disclosure;

[0013] Figure 4C illustrates a cross-sectional side view of a cable for use in conjunction with a magnetic grounding system according to the present disclosure;

[0014] Figure 4D illustrates a cross-sectional elevation view of a cable for use in conjunction with a magnetic grounding system according to the present disclosure;

[0015] Figure 4E illustrates a bottom view of a cable assembly for use in conjunction with a magnetic grounding system according to the present disclosure;

[0016] Figure 4F illustrates a top view of a cable assembly for use in conjunction with a magnetic grounding system according to the present disclosure;

[0017] Figure 4G illustrates a side view of a cable assembly for use in conjunction with a magnetic grounding system according to the present disclosure;

[0018] Figure 4H illustrates a cross-sectional side view of a cable assembly for use in conjunction with a magnetic grounding system according to the present disclosure;

[0019] Fig. 4Iillustrates a cross-sectional elevation view of a cable assembly for use in conjunction with a magnetic grounding system according to the present disclosure;

[0020] Figure 5 illustrates a cable assembly coupled to a mating connector using a magnetic grounding system to facilitate alignment of connector pins in accordance with the present disclosure;

[0021] Figure 6 An electronic device according to the present disclosure is illustrated; and

[0022] Figure 7 A process flow according to the present disclosure is illustrated.

[0023] The present disclosure will be described with reference to the accompanying drawings.The drawing in which an element first appears is generally indicated by the leftmost digit(s) in the corresponding reference number. DETAILED DESCRIPTION

[0024] The following detailed description refers to the accompanying drawings, which illustrate exemplary details in which the present disclosure may be implemented. In the following description, many specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be clear to those skilled in the art that various designs, including structures, systems and methods, may be implemented without these specific details. The descriptions and representations herein are common means for experienced or skilled persons in the art to most effectively convey the essence of their work to other persons skilled in the art. In other cases, well-known methods, processes, components and circuits are not described in detail to avoid unnecessarily obscuring the present disclosure.

[0025] Common cable types used to facilitate data signal routing (e.g., HSIO signals) in electronic devices include flat flexible cables (FFCs), although the present disclosure is not limited to these particular cable types. Without effective cable shielding, FFCs and other cables more generally designed to carry HSIO signals tend to emit much higher noise radiation, and this problem is often more severe for HSIO data signals than for lower frequency or lower bit rate signals. Figure 1A-1B As shown in , this noise can affect nearby system integrated antennas. Specifically, Figure 1A The diagram shows a wrapped FFC with a "floating" (i.e., ungrounded) metal shield, while Figure 1B The figure shows the same wrapped FFC with a grounded metal shield. Figure 1B Compared with the FFC with grounded metal shield shown in Figure 1A The FFC shown with a floating metal shield may cause higher noise radiation to nearby antennas.

[0026] Radiated noise (also referred to herein as RFI) can affect surrounding electronic components and degrade performance. Thus, reducing RFI levels to mitigate this problem and / or meet regulatory requirements is a common proactive design effort. For example, RFI can include broadband noise and spurious noise, the presence of each of which can negatively impact the throughput of wireless communications to nearby system integrated antennas, such as Figure 2 That is, Figure 1A-1B The radiated noise shown propagating to nearby antennas can cause broadband and spurious RFI, and significantly high levels of this RFI can desensitize receivers in networks such as Wi-Fi, potentially affecting the end-user experience.

[0027] This is in Figure 2 , which is a graph that plots the throughput versus wideband and spurious RFI levels for a 20 MHz bandwidth WiFi downlink channel 6. Wideband RFI is considered to represent the noise over a wide frequency range covering the entire 20 MHz WiFi channel 6, while spurious RFI can be considered to represent more narrowband noise occurring at narrow frequency bands or "spikes" within the 20 MHz channel, such as at 2436 MHz as shown. Figure 2 It is shown that when the presence of wideband RFI exceeds a threshold level of about -116.5 dB, such a WiFi channel will experience a throughput degradation of about 3.3% for every 1 dB increase in the wideband RFI level. In addition, when the presence of spurious RFI exceeds a threshold level of about -106 dB, such a WiFi channel will experience a throughput degradation of about 2.4% for every 1 dB increase in the spurious RFI level for Wi-Fi.

[0028] thereby, Figure 2 It is illustrated that in this scenario, broadband noise has a higher impact on the overall performance of wireless communication. However, in both cases, a threshold RFI value (e.g., -116.5dB for broadband RFI and -106dB for stray RFI) can be identified as a design specification for RFI caused by the signal cable. The shielding technology discussed further herein can ensure that the RFI level is maintained at or below such an RFI level, or any predetermined RFI level (depending on the specific implementation), to ensure that the RFI caused by the signal cable does not affect (or only minimally affects) the throughput of adjacent wireless communications. Of course, these RFI levels are provided in a non-limiting and illustrative manner to show how to measure the RFI level and use it as a design specification. The magnetic shielding grounding technology discussed herein can be implemented to meet any appropriate RFI threshold specification to solve problems related to reduced data throughput and / or other performance issues caused by high RFI levels.

[0029] Thus, for FFC cables, RFI mitigation techniques include coupling the FFC metal shield to the system ground, such as Figure 1B However, conventional techniques for achieving this typically include EMI fabric-over-foam pads. Figure 3 An example of this conventional implementation is shown in further detail. Figure 3 The side and top views of a conventional fabric-wrapped foam pad implementation for grounding an FFC cable shield are illustrated. In this arrangement, the EMI fabric-wrapped foam pad is used as a ground contact between the FFC metal shield and the PCB ground, chassis, or heat sink, depending on the specific application.

[0030] However, this design presents complex design consideration challenges in terms of reliability and reusability, as well as PCB footprint issues. For example, installing EMI fabric wrapped foam gaskets is very difficult because the gaskets need to be highly compressed (>20%) to ensure sufficient conductivity between the shielding layer and the proper system grounding to have the maximum impact on conductive shielding. But this compression will affect the reliability of the performance of the fabric wrapped foam gasket. In addition, EMI fabric wrapped foam gaskets require lower attenuation levels to continuously compress the foam while maintaining high conductivity and shielding attenuation over the expected service life of the product. In order to ensure that the EMI fabric wrapped foam gasket is not easy to bend (when compressed), the base area of ​​the EMI fabric wrapped foam gasket needs to be larger relative to its height, introducing PCB footprint issues.

[0031] Furthermore, in terms of long-term reliability, EMI fabric wrapped foam pads are prone to deformation when subjected to long-term pressure or force, especially when coupled with non-ideal temperature conditions. As a result, the effectiveness of grounding through the pad may decrease over time. In addition, EMI fabric wrapped foam pads may have reusability issues due to material degradation after being repaired. Therefore, a new pad needs to be used for each repair and maintenance, which is disadvantageous in terms of sustainability.

[0032] The magnetic grounding technology as described herein solves these problems and can be used to replace the use of traditional EMI fabric wrapped foam pads. In various technologies discussed in further detail below, it is assumed that the cable assembly includes a metal shielding layer that can partially or completely surround the conductor carrying the electrical signal in the cable. These solutions implement a magnet assembly that includes a permanent magnet that may include a conductive material, or the permanent magnet may be plated with a magnet coating that includes a conductive material. The magnet assembly can be welded to any appropriate component to facilitate the grounding of the metal shielding layer of the cable, such as a PCB ground. This can be facilitated by bonding the cable coating of a conductive magnetic material to the metal shielding layer of the cable, which can include trimming off a portion of the insulation layer of the cable assembly for this purpose. Thus, a current (i.e., conductive) contact is provided between the metal shielding layer of the cable and the cable coating. And because the cable coating may also include magnetic material, a magnetic attraction force with the magnet assembly is also provided.

[0033] Thus, the technology further described herein utilizes a magnet assembly that includes a permanent magnet that is optionally plated with a conductive material to provide electrical contact between a cable metal shield and a suitable ground for grounding purposes via magnetic attraction. In addition, the solution described herein facilitates magnetic alignment between the connector pins of the cable assembly and the pins of the mating connector, thereby reducing the stress applied to the connector. Thus, the magnetic grounding system discussed herein can replace the traditional EMI fabric wrapped foam pad with a conductive magnet assembly that acts as a grounding medium between the cable metal shield and the ground.

[0034] I. Magnetic Grounding System

[0035] Figure 4A and Figure 4B A side view and a top view of a magnetic grounding system for grounding an FFC cable shield according to the present disclosure are illustrated, respectively. The magnetic grounding system is described herein for a flat flexible cable (FFC) including a metal shielding layer. However, this is only a non-limiting and illustrative scenario, and it is understood that the magnetic grounding system as described herein can be implemented to ground any suitable portion of any suitable type of cable to reduce RFI, or for other applications.

[0036] In addition, the magnetic grounding system discussed herein is shown as using a printed circuit board (PCB) ground, but this is also a non-limiting and illustrative scenario. Thus, the magnetic grounding system as described herein can be implemented to provide an electrical path for any appropriate type of cable that can be grounded, and can include the use of any appropriate metal structure to achieve this, to supplement or replace the PCB ground, such as a metal case, a heat pipe, an evaporation chamber, etc., which can be used as a grounding point in an applicable system. In various scenarios, alternative cable types may include coaxial cables, grounded Ethernet cables, flexible printed circuit (flexible printed circuit, FPC) cables, etc. In addition, the magnetic grounding system is also discussed herein for providing a single grounding point for a cable assembly, but this is also a non-limiting and illustrative scenario. The magnetic grounding system discussed herein can be implemented to provide grounding points at any appropriate number of locations about the cable assembly, such as multiple locations along the cable, structure and / or PCB. The magnetic grounding system discussed herein can thus provide a customizable and flexible solution that can be implemented in various applications.

[0037] Now watch Figure 4A-Figure 4I ,exist Figure 4A-Figure 4I 4 shows a side view of a magnetic grounding system 400. The magnetic grounding system 400 includes a magnet assembly 402 and a cable assembly 405. As discussed further below, the cable assembly 405 includes a cable coating 403, which can be a conductive magnetic material and is coupled to a metal shield 404.2 of a cable 404. The magnet assembly 402 includes a permanent magnet 402.1, which is optionally coated with a magnet coating 402.2. The permanent magnet 402.1 can be any suitable type of permanent magnet material, which can include conductive or non-conductive materials, so that the permanent magnet 402.1 generates a persistent magnetic field. Therefore, when the permanent magnet 402.1 includes a conductive material, the magnet coating 402.2 is optional, but when the permanent magnet 402.1 includes a non-conductive material, the coating 402.2 should be implemented. Thus, in either scenario, the cable coating 403 is coupled to the ground in a galvanic manner via the magnet assembly 402.

[0038] In any case, the magnet assembly 402 can be magnetically secured to the cable assembly 405 via a magnetic attraction between the permanent magnet 402.1 and the cable plating 403. As further discussed herein, due to this magnetically secured relationship, the metal shield 404.2 is galvanically coupled to the PCB ground 408 via a galvanic (i.e., electrical) contact between the cable plating 403 and the magnet assembly 402, which may include galvanic contact with the permanent magnet 402.1 or the magnet plating 402.2, as further discussed herein.

[0039] Thus, the permanent magnet 402.1 can be any suitable material that provides a sufficiently strong magnetic field so that the magnetic attraction between the magnet assembly 402 and the cable plating 403 provides a strong and reliable (but removable) mechanical coupling, and is also used to provide galvanic contact between the metal shield layer 404.2 and the PCB ground 408. Other considerations for permanent magnet materials may include corrosion resistance, maximum operable operating temperature, availability, cost, and whether the permanent magnet material has inherent conductivity. In various non-limiting and exemplary scenarios, the permanent magnet 402.1 may include permanent magnet materials, such as flexible polymers, ferrite magnet materials, AlNiCo magnet materials, SmCo magnet materials, neodymium (NdFeB) magnet materials, and the like. As used herein, various magnet materials may include any suitable alloys thereof, such as AlNiCo 1-9, AlNiCo 5DG, AlNiCo 8HC, SmCo series 1:5, SmCo series 2:17, sintered Nd2Fe 14 B. Bonding Nd2Fe 14 B, etc.

[0040] It is noted that while the permanent magnet material may be of a variety of different types, the use of Alnico magnet material may be particularly advantageous because such material has a high operating temperature of 500 degrees Celsius, which is a useful property when the magnet assembly 402 is to be soldered to the PCB 410. In addition, Alnico magnets exhibit a fairly high level of inherent corrosion resistance without a coating, which advantageously provides further durability and service life. In addition, Alnico magnets are a cost-effective solution and have good magnetic strength compared to other permanent magnet materials. Thus, the selection of Alnico permanent magnet material is an appropriate and reliable option. In addition, the inherent conductive properties of the Alnico permanent magnet material are also useful because the components of the alloying elements aluminum, nickel, and cobalt are each reliable conductors, which when coupled with the magnet coating 402.2, promote excellent grounding of the metal shielding layer 404.2.

[0041] Likewise, given the availability of such permanent magnet materials and these tradeoffs, it is noted that magnet plating 402.2 is optional in some scenarios, such as those where the permanent magnet material may have inherent conductivity and good corrosion resistance, and thus the use of magnet plating 402.2 may depend on the specific application and / or the material selected for permanent magnet 402.1. Thus, when magnet plating 402.2 is not present, permanent magnet 402.1 may be bonded directly to PCB ground 408, rather than as Figure 4AAs shown, a joint 406 exists between the magnet coating 402.2 and the PCB ground 408. In addition, when the magnet coating 402.2 is not present, the metal shield 404.2 can also be galvanically coupled to the PCB ground 408 via galvanic contact with the permanent magnet 402.1, and the permanent magnet 402.1 can also include a conductive magnetic material, which in turn is galvanically coupled to the PCB ground 408. Therefore, the magnet assembly 402 can include the permanent magnet 402.1 and the magnet coating 402.2 as shown, or the magnet assembly 402 can include only the permanent magnet 402.1.

[0042] However, the use of the magnet coating 402.1 may advantageously allow for a lower cost permanent magnet 402.1 (i.e., a permanent magnet with lower corrosion resistance or lower electrical conductivity). Thus, the magnet coating 402.2, when present, may include any suitable type of conductive material to ensure that when the cable coating 403 is magnetically fixed to the magnet assembly 402 via the magnetic attraction between the cable coating 403 and the permanent magnet 402.1, the metal shield 404.2 is coupled to the PCB ground 408 in a galvanic manner via the galvanic contact between the cable coating 403 and the magnet coating 402.2. That is, the magnet coating 402.2 should be selected from materials that promote good electrical connection between the magnet coating 402.2 and the cable coating 403. The magnet coating 402.2 may also advantageously include a ferromagnetic material, thereby having both electrical conductivity and ferromagnetism. Thus, as discussed further below, alloys including these two properties, such as nickel-gold, may be particularly useful for the magnet coating 402.2. Thus, the magnetic coating 402.2 may include a powder coating, an electroplated layer, etc. The interaction of these components and other options for the magnetic coating 402.2 material will be discussed in further detail below.

[0043] In any case, the magnet assembly 402 is galvanically coupled to the PCB ground 408 via the joint 406, which may include any suitable type of joint that fixedly and galvanically couples the magnet assembly 402 and the PCB ground 408 to each other. The joint 406 may thus include a solder connection or other suitable connection, such as via a conductive adhesive, welding, etc. Thus, the magnet assembly 402 is fixedly and galvanically coupled to the PCB ground 408, which may occur as part of the assembly and / or manufacture of the PCB 410 or other suitable process.

[0044] Likewise, cable assembly 405 includes cable 404 and cable plating 403. As described herein, cable 404 can be implemented as any suitable type of cable, such as a flexible printed circuit (FPC) cable, a coaxial cable, a grounded Ethernet cable, etc., but cable 404 is depicted as an FFC cable in the accompanying drawings as a non-limiting and illustrative scenario. Cable 404 can be implemented as any suitable cable type, such as a known or "off-the-shelf" FFC (or other) cable type, and with the additional modifications discussed herein, adding cable plating 403 to ensure compatibility with magnetic grounding system 400. Such off-the-shelf FFCs are typically composed of several parallel flat conductive strips (one or more conductors 404.4) that are laminated between two layers of insulating films (substrate 404.3). A cross-sectional view of cable 404 is shown in FIG. Figure 4C-4D As further shown in detail in FIG. 4 , a cross-sectional view of a cable assembly 405 including a cable 404 and a cable coating 403 is shown in FIG. Figure 4H-Figure 4I Further details are shown in .

[0045] like Figure 4A , Figure 4C , Figure 4D , Figure 4H and Fig. 4I As shown, cable 404 includes an insulating layer 404.1, a metal shielding layer 404.2, a substrate 404.3 and one or more conductors 404.4. The number of layers and layer types representing cable 404 are shown as non-limiting and exemplary scenarios. Depending on the specific application, cable 404 may include additional or alternative layers, or other components. This may include additional metal shielding layers, additional insulating layers, and the like.

[0046] The insulating layer 402.1 may include any suitable type of material that acts as an electrical insulator and protects other components within the cable 404. The insulating layer may be a polymer, a thermoplastic material such as polyvinyl chloride (PVC), etc. The substrate 404.3 may also be any suitable type of material that acts as an electrical insulator and on which one or more conductors 404.4 may be arranged, deposited, embedded, etc. Likewise, the substrate 404.3 may include a laminate film with one or more conductors 404.4 arranged therebetween. Thus, the substrate 404.3 may also include a polymer, a thermoplastic material such as polyvinyl chloride (PVC), etc.

[0047] The one or more conductors 404.4 may include any suitable number and / or type of electrical conductors configured to carry electrical signals within the cable 404. The one or more conductors 404.4 may be arranged within the cable 404 in any suitable manner, but as described herein, the one or more conductors may advantageously be arranged within the metal shield 404.2 to reduce RFI. The one or more conductors 404.4 may be configured to carry any suitable type of electrical signal, such as a data signal, a video signal, a control signal, etc., depending on the specific device and / or application in which the magnetic grounding system 400 is implemented. In addition, the one or more conductors 404.4 may carry electrical signals of any suitable frequency and / or bit rate depending on the specific application. To provide some non-limiting and exemplary scenarios, the one or more conductors 404.4 may carry high-speed input / output (HSIO) signals, which may include signals with frequencies exceeding 240 GHz, or signals carrying data at bit rates exceeding 40 Gbps.

[0048] Regardless of the number and / or type of signals carried by one or more conductors 404.4, the conductors may be terminated in connection pins 450, such as Figure 4E and Figure 4G Thus, Figure 4A-4B As shown, the cable 404 can be terminated into a mating connector 420, which can include pins and / or additional connectors that interface and / or engage with the connection pins 450 and in turn interface and / or engage with the one or more conductors 404.4. The connector 420 can be coupled to any suitable component of the device in which the magnetic grounding system 400 is implemented to couple the electrical signals carried by the one or more conductors 404.4 to these components. Thus, the cable 404 can be coupled to any suitable number of such connectors, each connector being coupled to a corresponding component, and for simplicity, a single connector 420 is shown in the figure.

[0049] The connector 420 can thereby be coupled to the PCB 410 (e.g., via a solder connection), which can include a PCB ground 408, as discussed further herein. Likewise, while the ground connection is shown in the figures as including a PCB ground, this is only a non-limiting and exemplary scenario, and the PCB ground 408 can additionally or alternatively include any suitable type of electrical path to ground, metal structures, etc. In this way, the metal shield 404.2 is grounded rather than floating, as described above with reference to Figure 1A and Figure 1B described. Figure 4B Also shown in FIG. 4 is a top view of magnetic grounding system 400 showing connector 420 coupled to cable assembly 405 .

[0050] Likewise, the cable assembly 405 includes a metal shielding layer 404.2, which is shown in the figures as being arranged directly below the outer insulating layer 404.1. The metal shielding layer 404.2 may also be alternatively referred to herein as simply a shielding layer. The metal shielding layer 404.2 may (but is not required to) be bonded to the insulating layer 404.1. To provide some illustrative and non-limiting scenarios, the metal shielding layer 404.2 may be formed on the insulating layer 404.1 and / or the substrate 404.3 via a deposition process, bonded to the insulating layer 404.1 and / or the substrate 404.3 using any suitable adhesive, and the like. The metal shielding layer 404.2 may be composed of any suitable type of conductive material and may partially or completely encapsulate one or more conductors 404.4.

[0051] Additional details of cable 404 and its components are provided in Figure 4C and Figure 4D As shown in Figure 4D As shown in the cross-sectional front view of the cable 404 in FIG. 4 , the insulating layer 404.1 completely surrounds the metal shield 404.2, which in turn completely surrounds one or more conductors 404.4. Thus, as shown, the cable 404 includes a fully enclosed FFC, although this is only a non-limiting and illustrative scenario. It is noted that the metal shield 404.2 may alternatively partially enclose one or more conductors 404.4, but the use of a fully enclosed metal shield 404.2 is particularly beneficial for reducing RFI because, in this case, once the metal shield 404.2 is properly grounded, noise leakage is further mitigated.

[0052] return Figure 4A , the cable assembly 405 also includes a cable plating 403 that is in galvanic contact with the metal shield 404.2. The cable plating 403 can thus be coupled to the metal shield 404.2 in any suitable manner to ensure that galvanic (i.e., electrical) contact is maintained between the metal shield 404.2 and the cable plating 403. This may include a sputtering or deposition process, or a joining process using a conductive adhesive, welding, soldering, etc. To facilitate coupling the cable plating 403 to the metal shield 404.2, portions of the insulating layer 404.1 may first be removed, such as Figure 4E 4. The removal of the portion of the insulating layer 404.1 may be accomplished via any suitable process, which may include automated and / or manual processes, such that a portion of the metal shield 404.2 beneath the insulating layer 404.1 is exposed. The cable plating 403 is then bonded to the exposed portion of the metal shield 404.2 to facilitate galvanic contact between the cable plating 403 and the metal shield 404.2.

[0053] Regardless of the coupling method of the cable plating 403 and the metal shielding layer 404.2, to ensure compatibility with the magnetic grounding system 400, the cable plating 403 can be composed of a material that is both conductive and magnetic. Thus, the magnet plating 402.2 can include any suitable material having these properties, which can include any suitable type of alloy including ferromagnetic materials. In an illustrative and non-limiting scenario, the cable plating 403 can include nickel-gold, which may be a particularly advantageous choice for the cable plating 403 and the magnet plating 402.2. This is because nickel is a ferromagnetic material, which allows the nickel-gold cable plating 403 to be firmly (but removably) attached to the magnet assembly 402. Other suitable alloys containing ferromagnetic materials can also be used, such as iron, cobalt, gadolinium, neodymium, ferromagnetic ceramics, etc. It should be noted that nickel also has chemical stability and good anti-rust properties, which ensures good reliability for long-term use. In addition, gold has low resistance and excellent electrical conductivity, which ensures good electrical connection between the cable plating 403 and the magnet assembly 402, thereby ensuring good electrical connection between the metal shielding layer 404.2 and the PCB ground 408. In addition, since gold is resistant to oxidation, the use of nickel-gold plating material ensures that good electrical conductivity is maintained for a long time. In various non-limiting and exemplary scenarios, the magnet plating 402.2 may include the same material as the cable plating 403 (e.g., nickel-gold), or may be a different material.

[0054] Thus, since the cable plating 403 includes a material that is both conductive and magnetic, the cable plating 403 is magnetically attracted to the magnet assembly 402. Specifically, the cable plating 403 is primarily magnetically attracted to the permanent magnet 402.1. Therefore, the cable plating 403 can be magnetically attracted to the magnet assembly 402, such that the cable plating 403 and the magnet assembly 402 form a magnetic (i.e., secure but removable) fixed connection when they are close to each other. Due to this connection, the metal shielding layer 404.2 is thereby galvanically coupled to the PCB ground 408 through the magnetic assembly 402. Specifically, the electrical connection between the metal shielding layer 404.2 and the PCB ground 408 is facilitated by the connection between the cable plating 403 and the magnetic assembly 402. That is, the metal shield 404.2 (galvanically coupled to the PCB ground 408) is also galvanically coupled to the PCB ground 408 via electrical contact between the cable plating 403 and the magnet assembly 402 (which may include contact with the permanent magnet 402.1 or the magnet plating 402.2 as described herein). Thus, the metal shield 404.2 is grounded to the PCB ground 408, thereby reducing noise propagation from the cable 404.

[0055] exist Figure 4E , Figure 4G , Figure 4H and Fig. 4IThe cable plating 403 is further shown in detail in FIG. However, it should be noted that these figures are not drawn to scale and that the cable plating 403 can have any suitable height and can be Figure 4H-Figure 4I The insulating layer 404.1 may be the same as that depicted in FIG. 1 , or may have a thickness such that the cable coating 403 extends beyond the thickness of the insulating layer 404.1, such as Figure 4G As described below, Figure 4G and Figure 5 As further discussed, the thickness of the cable plating 403 (and the height of the magnet assembly 402 ) may be selected to facilitate alignment of the connection pins 450 of the cable assembly 405 with the connection pins of the mating connector 420 .

[0056] That is to say, now refer to Figure 5 , the magnet assembly 402 can be coupled to the PCB 410 to form a soldered (or other suitable) connection with the PCB ground 408, which can be adjacent to the entrance of the mating connector 420. Figure 4E and Figure 4G As shown, one or more conductors 404.4 of the cable assembly 405 can be coupled to a set of connection pins 450. The connection pins 450 can be conductive contacts having any suitable shape that are configured to align and mate with corresponding conductors of the mating connector 420. The connection can be of any suitable type, and thus the connection pins 450 and the conductors of the mating connector 420 can be of any suitable type to facilitate electrical contact therebetween, including known types. The connection pins 450 can be implemented in different ways depending on the cable 404, the mating connector 420, and the type of conductors of the mating connector 420 with which the connection pins 450 are configured to mate. As shown in FIG. Figure 5 As shown, as an illustrative and non-limiting scenario, the mating connector 420 includes flip / slide lock connector pins as conductors that mate with the connecting pins 450 .

[0057] Thus, the connection pin 450 can represent the termination of one or more conductors 404.4 at the connection end of the cable assembly 405. The connection pin 450 can be implemented as another layer of the cable assembly 405, which is only present at the termination end of the cable assembly 405. Alternatively, the connection pin 450 can be implemented by removing the insulation layer 404.1 and the metal shielding layer 404.2 at the termination end of the cable assembly 405. Therefore, although the connection pin 450 is Figure 5 4. In the embodiment shown as being arranged at the bottom portion of the cable assembly 405, the connecting pin 450 can be arranged at any position in the z direction within the cable assembly 405. In this scenario, the z direction is as shown in FIG. Figure 5 The illustration is orthogonal to the alignment plane, which is parallel to the PCB 410 .

[0058] Regardless of the location of the connection pin 450 within the cable assembly 405, the magnetic grounding system 400 ensures that the cable plating 403 is Figure 5 4, the connection pins 450 of the cable assembly 430 are aligned with the corresponding connectors of the mating connector 420, both of which are in the alignment plane. Thus, the height of the magnet assembly 402 and the cable plating 403 can be selected so that when the cable assembly 405 is magnetically secured to the magnet assembly 402, the connection pins 450 are aligned with the conductors of the mating connector 420. In this way, the magnet assembly 402 helps to magnetically secure the cable assembly 405 while aligning the connection pins 450 with the corresponding connector pins of the mating connector 420. In addition, this magnetic alignment and securing provides additional support by reducing the stress experienced by the connector 420.

[0059] The magnetic grounding system 400 can thus reduce the RFI generated by the cable assembly 405 during the propagation of the electrical signal to less than a predetermined threshold, ensuring that nearby communications are not affected, as described above with reference to Figure 2 As described above. In addition, due to the specified dimensions allocated for the permanent magnets, the magnetic grounding system 400 alleviates PCB space issues. The magnetic grounding system 400 also provides less complex design considerations by eliminating the need for EMI gasket compression, and is very reliable under operational on-board time and thermal conditions. Likewise, the permanent magnets have excellent corrosion resistance and very stable magnetic levels, and also have an average maximum operating temperature of 180 degrees Celsius. Compared to traditional EMI fabric-wrapped foam gasket solutions, the magnetic grounding system 400 is also reusable for maintenance and repair services. Moreover, in addition to providing consistent grounding effects (compared to fabric-wrapped foam gasket solutions that require 20% compression to conduct electricity), the magnetic grounding system 400 also acts as a latching mechanism, thereby magnetically aligning the connecting pins 450 between the cable assembly 405 and the mating connector 420.

[0060] II. Electronic equipment

[0061] Figure 6An electronic device according to the present disclosure is illustrated. The electronic device 600 may be considered to represent any suitable type of device that implements the magnetic grounding system 400 discussed herein to facilitate grounding of the metallic shielding layer of one or more cables, thereby reducing RFI. The electronic device 600 may be considered to represent any suitable device that utilizes a cable assembly (such as the cable assembly 405 discussed herein) that carries data signals. Thus, the electronic device 600 may be considered to represent a wireless device, a user equipment (UE), a mobile phone, a laptop computer, a tablet device, a wearable device, and the like.

[0062] The electronic device 600 may include a display screen 602, which may be considered to represent any suitable type of display screen. The electronic device 600 may also include components 604, 612, which may be considered to represent any suitable type of components that receive and / or transmit electrical signals via a coupled cable assembly (e.g., the cable assembly 405 discussed herein) in a non-limiting and illustrative scenario. Such components may include a system on a chip (SoC), a driver, a graphical display unit (GPU), a central processing unit (GPU), a display component, and the like.

[0063] like Figure 6 As shown, components 604, 612 can be considered to represent individual components of the electronic device 600, which can use coupled cable assemblies (such as cable assembly 405 discussed herein) to send and / or receive data signals between each other. Magnetic grounding systems 606, 608 can be considered to represent magnetic grounding system 400 discussed herein. The cable assembly can be coupled to each component 604, 612 discussed herein via a corresponding magnetic grounding system 606, 608. Thus, as shown in FIG. Figure 6 As shown, the cable assemblies may include cable plating at each end, and each cable assembly may be magnetically secured to a respective magnet assembly to ensure grounding of the metallic shield of the cable, thereby reducing RFI. Figure 6 Two magnetic grounding systems 606, 608 are shown in FIG. 1 , but this is only a non-limiting and exemplary scenario, and the cable assembly may implement any suitable number of magnetic grounding systems, such as only one or more than two.

[0064] The electronic device 600 may include a processing circuit 614, which may be configured as any appropriate number and / or type of computer processors and may function to control the electronic device 600 and / or other components of the electronic device 600. The processing circuit 614 may be considered to represent one or more processors (or appropriate portions thereof) implemented by the electronic device 600. The processing circuit 614 may be considered to represent one or more processors, such as a host processor, a digital signal processor, one or more microprocessors, a graphics processor, a baseband processor, a microcontroller, an application-specific integrated circuit (ASIC), a portion (or all) of a field-programmable gate array (FPGA), and the like.

[0065] In any case, the processing circuit 614 may be configured to execute instructions to perform arithmetic, logical and / or input / output (I / O) operations, and / or control the operation of one or more components of the electronic device 600 to perform various functions as described herein. The processing circuit 614 may include one or more microprocessor cores, memory registers, buffers, clocks, etc., and may generate electronic control signals associated with the components of the electronic device 600 to control and / or modify the operation of these components. The processing circuit 614 may communicate with the memory 616 and any other components of the electronic device 600 and / or control the functions associated therewith.

[0066] The memory 616 stores data and / or instructions so that when the processing circuit 614 executes these data and / or instructions, the electronic device 600 performs various functions, such as controlling, monitoring and / or adjusting the operation of the electronic device 600, providing data to be sent and / or received between components 604, 612, etc., and / or processing signals received via components 604, 612, etc., as discussed herein. The memory 616 can be implemented as any suitable type of volatile and / or non-volatile memory, including read-only memory (ROM), random access memory (RAM), flash memory, magnetic storage media, optical disks, erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), etc. The memory 616 can be non-removable, removable, or a combination of the two. The memory 616 can be implemented as a non-transitory computer-readable medium that stores one or more executable instructions, such as logic, algorithms, codes, etc. As shown in the figure, the instructions, logics, codes, etc. stored in the memory 616 are represented by an (operating system) OS module 617, which enables the functions of the electronic device 600 to be functionally implemented.

[0067] III. Process Flow

[0068] Figure 7 The process flow according to the present disclosure is illustrated. Figure 7 , process 700 may be a manual process, a fully automated process, or a partially automated process. When fully or partially automated, any part or all of process 700 may be implemented as a computer-implemented process performed by and / or otherwise associated with one or more processors. These processors may be associated with one or more computing components, which are considered to represent any suitable computing device, such as a computing device or manufacturing component configured to perform such functions.

[0069] One or more processors, which are considered to represent one or more computing components discussed herein, may execute instructions stored on any suitable computer-readable storage medium. For simplicity, process 700 may include Figure 7 Alternative or additional steps not shown and may be different from Figure 7 The steps are performed in the order shown in .

[0070] Flow 700 may begin by mechanically coupling a magnet assembly to a ground (block 702). This may include soldering, welding, or otherwise joining a magnet assembly (e.g., magnet assembly 402 discussed herein) to a ground (e.g., PCB ground 408 discussed herein). This may include actions performed as part of a manufacturing process, such as a pick and place machine for a PCB (e.g., PCB 410).

[0071] Process 700 may also include removing (block 704) a portion of insulation from the cable to expose a metallic shield of the cable. The cable may include cable 404 discussed herein. The removal process may be performed via a machine configured to perform this function in an automated manner.

[0072] The process 700 may also include bonding (block 706) the cable plating to the exposed metal shield of the cable to form a cable assembly. As discussed herein, the metal shield may include metal shield 404.2 and the cable plating may include cable plating 403. Thus, the resulting cable assembly may include cable assembly 405 as discussed herein. The bonding process may be performed via an automated machine configured to perform this function, which may include sputtering, deposition, bonding, and the like.

[0073] Process 700 may also include magnetically securing (block 708) the cable coating of the cable assembly to the magnet assembly so as to ground the metal shield of the cable. This may include magnetically securing the cable coating 403 to the magnet assembly 402 via magnetic attraction, as discussed herein. The magnetic securing process may be performed via an automated machine (e.g., a pick and place machine) configured to perform this function. The process of magnetically securing (block 708) the cable coating of the cable assembly to the magnet assembly may optionally include connecting the connecting pins of the cable assembly to the mating connector of the PCB, facilitating alignment thereof as described herein.

[0074] Process 700 may also include reducing the RFI of the cable to a predetermined RFI value (block 710). Thus, once the magnetic grounding system is installed, the RFI emitted by the cable of the cable assembly may be reduced to a predetermined value that is known to have no negative impact (or only minimal impact) on throughput or other performance metrics, as discussed herein.

[0075] IV. General Configuration of Magnetic Grounding System

[0076] A magnetic grounding system is provided. The magnetic grounding system includes a magnet assembly including a permanent magnet and a cable assembly, wherein the magnet assembly is coupled to the ground in a current manner. The cable assembly includes a metal shielding layer encapsulating one or more conductors, and a cable plating in current contact with the metal shielding layer, the cable plating including a conductive magnetic material, when the cable plating is magnetically fixed to the magnet assembly via the magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is coupled to the ground in a current manner via the electrical contact between the cable plating and the magnet assembly. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the magnet assembly also includes a magnet plating plated on the permanent magnet, the magnet plating including a conductive material and coupled to the ground in a current manner. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, when the cable plating is magnetically fixed to the magnet assembly via the magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is coupled to the ground in a current manner via the electrical contact between the cable plating and the magnet plating. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the cable plating includes a nickel-gold plating. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the cable plating and the magnet plating each include a nickel-gold plating. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the cable assembly includes a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the cable assembly further includes an insulating layer surrounding the metal shielding layer, a portion of the insulating layer is removed to expose a portion of the metal shielding layer, and the cable plating is in galvanic contact with the exposed portion of the metal shielding layer. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the permanent magnet includes an AlNiCo material. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the metal shielding layer completely encapsulates one or more conductors of the cable assembly. In addition or in lieu of the optional features previously described in this paragraph and in any combination therewith, one or more conductors of the cable assembly are coupled to a set of corresponding connection pins, and when the cable plating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of the mating connector. In addition or in lieu of the optional features previously described in this paragraph and in any combination therewith, the ground is a printed circuit board (PCB) ground, and the magnet assembly is coupled to the PCB ground via a solder connection.

[0077] V. General Configuration of Electronic Equipment

[0078] An electronic device is provided. The electronic device includes a printed circuit board (PCB) including a PCB ground, a magnet assembly including a permanent magnet, the magnet assembly being coupled to the PCB ground in a current manner, and a cable assembly. The cable assembly includes a metal shielding layer encapsulating one or more conductors, and a cable plating in current contact with the metal shielding layer. The cable plating includes a conductive magnetic material, and when the cable plating is magnetically fixed to the magnet assembly via a magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is coupled to the PCB ground in a current manner via the electrical contact between the cable plating and the magnet assembly. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the magnet assembly also includes a magnet plating plated onto the permanent magnet, the magnet plating includes a conductive material and is coupled to the PCB ground in a current manner. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, when the cable plating is magnetically fixed to the magnet assembly via the magnetic attraction between the cable plating and the permanent magnet, the metal shield is galvanically coupled to the PCB ground via the electrical contact between the cable plating and the magnet plating. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the cable plating includes a nickel-gold plating. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the cable assembly includes a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the cable assembly also includes an insulating layer bonded to the metal shield, a portion of the insulating layer is removed to expose a portion of the metal shield, and the cable plating is in galvanic contact with the exposed portion of the metal shield. In addition to or in place of the optional features previously described in this paragraph and in any combination with these optional features, the permanent magnet includes an AlNiCo material. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, the metal shield completely encapsulates one or more conductors of the cable assembly. In addition or in lieu of the optional features previously described in this paragraph and in any combination with these optional features, one or more conductors of the cable assembly are coupled to a set of corresponding connection pins, and when the cable plating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of the mating connector.

[0079] Example

[0080] The following examples relate to various techniques of this disclosure.

[0081] One example (e.g., Example 1) is directed to a magnetic grounding system, comprising: a magnet assembly including a permanent magnet, the magnet assembly being galvanically coupled to ground; and a cable assembly including: a metal shielding layer encapsulating one or more conductors; and a cable plating in galvanic contact with the metal shielding layer, the cable plating comprising a conductive magnetic material, wherein, when the cable plating is magnetically fixed to the magnet assembly via a magnetic attraction force between the cable plating and the permanent magnet, the metal shielding layer is galvanically coupled to the ground via electrical contact between the cable plating and the magnet assembly.

[0082] Another example (eg, Example 2) relates to the previously described examples (eg, Example 1), wherein the magnet assembly further comprises a magnet coating plated onto the permanent magnet, the magnet coating comprising a conductive material and coupled to the ground in a galvanic manner.

[0083] Another example (e.g., Example 3) relates to the previously described examples (e.g., one or more of Examples 1-2), wherein the cable coating is magnetically secured to the magnet assembly via magnetic attraction between the cable coating and the permanent magnet, and wherein the metal shield is galvanically coupled to the ground via electrical contact between the cable coating and the magnet coating.

[0084] Another example (eg, Example 4) relates to the previously described examples (eg, one or more of Examples 1-3), wherein the cable plating includes a nickel-gold plating.

[0085] Another example (eg, Example 5) relates to the previously described examples (eg, one or more of Examples 1-4), wherein the cable plating and the magnet plating each include a nickel-gold plating.

[0086] Another example (eg, Example 6) relates to the previously described examples (eg, one or more of Examples 1-5), wherein the cable assembly comprises a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

[0087] Another example (e.g., Example 7) relates to the previously described examples (e.g., one or more of Examples 1-6), wherein: the cable assembly also includes an insulating layer surrounding the metal shielding layer, a portion of the insulating layer is removed to expose a portion of the metal shielding layer, and the cable plating is in galvanic contact with the exposed portion of the metal shielding layer.

[0088] Another example (eg, Example 8) relates to the previously described examples (eg, one or more of Examples 1-7), wherein the permanent magnet comprises AlNiCo material.

[0089] Another example (eg, Example 9) relates to the previously described examples (eg, one or more of Examples 1-8), wherein the metallic shielding layer completely encapsulates one or more conductors of the cable assembly.

[0090] Another example (e.g., Example 10) relates to the previously described examples (e.g., one or more of Examples 1-9), wherein one or more conductors of the cable assembly are coupled to a set of corresponding connection pins, and wherein, when the cable coating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of a mating connector.

[0091] Another example (eg, Example 11) relates to the previously described examples (eg, one or more of Examples 1-10), wherein the ground is a printed circuit board (PCB) ground, and wherein the magnet assembly is coupled to the PCB ground via a solder connection.

[0092] One example (e.g., Example 12) is directed to an electronic device, comprising: a printed circuit board (PCB) including a PCB ground; a magnet assembly including a permanent magnet, the magnet assembly being galvanically coupled to the PCB ground; a cable assembly, comprising: (i) a metal shielding layer encapsulating one or more conductors, and (ii) a cable plating in galvanic contact with the metal shielding layer, wherein the cable plating comprises a conductive magnetic material, and wherein, when the cable plating is magnetically fixed to the magnet assembly via a magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is galvanically coupled to the PCB ground via the electrical contact between the cable plating and the magnet assembly.

[0093] Another example (eg, Example 13) relates to the previously described examples (eg, Example 12), wherein the magnet assembly further comprises a magnet plating plated onto the permanent magnet, the magnet plating comprising a conductive material and coupled to the PCB ground in a current manner.

[0094] Another example (e.g., Example 14) relates to the previously described examples (e.g., one or more of Examples 12-13), wherein the cable plating is magnetically secured to the magnet assembly via magnetic attraction between the cable plating and the permanent magnet, and wherein the metal shielding layer is galvanically coupled to the PCB ground via electrical contact between the cable plating and the magnet plating.

[0095] Another example (eg, Example 15) relates to the previously described examples (eg, one or more of Examples 12-14), wherein the cable plating includes a nickel-gold plating.

[0096] Another example (eg, Example 16) relates to the previously described examples (eg, one or more of Examples 12-15), wherein the cable assembly comprises a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

[0097] Another example (e.g., Example 17) relates to the previously described examples (e.g., one or more of Examples 12-16), wherein: the cable assembly also includes an insulating layer joined to the metal shielding layer, a portion of the insulating layer is removed to expose a portion of the metal shielding layer, and the cable plating is in galvanic contact with the exposed portion of the metal shielding layer.

[0098] Another example (eg, Example 18) relates to the previously described examples (eg, one or more of Examples 12-17), wherein the permanent magnet comprises AlNiCo material.

[0099] Another example (eg, Example 19) relates to the previously described examples (eg, one or more of Examples 12-18), wherein the metallic shield completely encapsulates one or more conductors of the cable assembly.

[0100] Another example (e.g., Example 20) relates to the previously described examples (e.g., one or more of Examples 12-19), wherein one or more conductors of the cable assembly are coupled to a set of corresponding connection pins, and wherein, when the cable coating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of a mating connector.

[0101] One example (e.g., Example 21) is directed to a magnetic grounding system, comprising: a magnet assembly device including a permanent magnet, the magnet assembly device being coupled to ground in a current manner; and a cable assembly device including: a metal shielding device encapsulating one or more conductors; and a cable coating device in current contact with the metal shielding device, the cable coating device including a conductive magnetic material, wherein, when the cable coating device is magnetically fixed to the magnet assembly device via a magnetic attraction force between the cable coating device and the permanent magnet, the metal shielding device is current coupled to the ground via electrical contact between the cable coating device and the magnet assembly device.

[0102] Another example (eg, Example 22) relates to the previously described example (eg, Example 21), wherein the magnet assembly device further comprises a magnet coating device plated onto the permanent magnet, the magnet coating device comprising a conductive material and coupled to the ground in a current manner.

[0103] Another example (e.g., Example 23) relates to the previously described examples (e.g., one or more of Examples 21-22), wherein the cable coating device is magnetically secured to the magnet assembly device via magnetic attraction between the cable coating device and the permanent magnet, and wherein the metal shielding device is galvanically coupled to the ground via electrical contact between the cable coating device and the magnet coating device.

[0104] Another example (eg, Example 24) relates to the previously described examples (eg, one or more of Examples 21-23), wherein the cable plating device includes nickel-gold plating.

[0105] Another example (eg, Example 25) relates to the previously described examples (eg, one or more of Examples 21-24), wherein the cable plating device and the magnet plating device each include a nickel-gold plating.

[0106] Another example (eg, Example 26) relates to the previously described examples (eg, one or more of Examples 21-25), wherein the cable assembly device comprises a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

[0107] Another example (e.g., Example 27) relates to the previously described examples (e.g., one or more of Examples 21-26), wherein: the cable assembly device also includes an insulating layer surrounding the metal shielding device, a portion of the insulating layer is removed to expose a portion of the metal shielding device, and the cable plating device is in current contact with the exposed portion of the metal shielding device.

[0108] Another example (eg, Example 28) relates to the previously described examples (eg, one or more of Examples 21-27), wherein the permanent magnet comprises AlNiCo material.

[0109] Another example (eg, Example 29) relates to the previously described examples (eg, one or more of Examples 21-28), wherein the metal shielding device completely encapsulates one or more conductors of the cable assembly device.

[0110] Another example (e.g., Example 30) relates to a previously described example (e.g., one or more of Examples 21-29), wherein one or more conductors of the cable assembly device are coupled to a set of corresponding connection pins, and wherein, when the cable coating device is magnetically secured to the magnet assembly device, the set of corresponding connection pins of the cable assembly device are aligned with corresponding conductors of a mating connector.

[0111] Another example (eg, Example 31) relates to the previously described examples (eg, one or more of Examples 21-30), wherein the ground is a printed circuit board (PCB) ground, and wherein the magnet assembly device is coupled to the PCB ground via a solder connection.

[0112] An example (e.g., Example 32) is directed to an electronic device, comprising: a printed circuit board (PCB) including a PCB ground; a magnet assembly device including a permanent magnet, the magnet assembly being coupled to the PCB ground in a current manner, a cable assembly device, which includes (i) a metal shielding device encapsulating one or more conductors, and (ii) a cable plating device in current contact with the metal shielding device, wherein the cable plating device includes a conductive magnetic material, and wherein, when the cable plating device is magnetically fixed to the magnet assembly device via the magnetic attraction between the cable plating device and the permanent magnet, the metal shielding device is coupled to the PCB ground in a current manner via the electrical contact between the cable plating device and the magnet assembly device.

[0113] Another example (e.g., Example 33) relates to the previously described examples (e.g., Example 32), wherein the magnet assembly device also includes a magnet coating device plated onto the permanent magnet, the magnet coating device including a conductive material and coupled to the PCB ground in a current manner.

[0114] Another example (e.g., Example 34) relates to the previously described examples (e.g., one or more of Examples 32-33), wherein the cable plating device is magnetically secured to the magnet assembly device via magnetic attraction between the cable plating device and the permanent magnet, and wherein the metal shielding device is galvanically coupled to the PCB ground via electrical contact between the cable plating device and the magnet plating device.

[0115] Another example (eg, Example 35) relates to the previously described examples (eg, one or more of Examples 32-34), wherein the cable plating device includes nickel-gold plating.

[0116] Another example (eg, Example 36) relates to the previously described examples (eg, one or more of Examples 32-35), wherein the cable assembly device comprises a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

[0117] Another example (e.g., Example 37) relates to the previously described examples (e.g., one or more of Examples 32-36), wherein: the cable assembly device also includes an insulating layer joined to the metal shielding device, a portion of the insulating layer is removed to expose a portion of the metal shielding device, and the cable plating device is in galvanic contact with the exposed portion of the metal shielding device.

[0118] Another example (eg, Example 38) relates to a previously described example (eg, one or more of Examples 32-37), wherein the permanent magnet comprises AlNiCo material.

[0119] Another example (eg, Example 39) relates to a previously described example (eg, one or more of Examples 32-38), wherein the metal shielding device completely encapsulates one or more conductors of the cable assembly device.

[0120] Another example (e.g., Example 40) relates to the previously described examples (e.g., one or more of Examples 32-39), wherein one or more conductors of the cable assembly device are coupled to a set of corresponding connection pins, and wherein, when the cable coating device is magnetically secured to the magnet assembly device, the set of corresponding connection pins of the cable assembly device are aligned with corresponding conductors of the mating connector.

[0121] An apparatus as shown and described.

[0122] A method is shown and described.

[0123] in conclusion

[0124] The above description will fully reveal the general nature of the implementation of the present disclosure, so that others can easily modify and / or adapt such specific implementations for various applications by applying knowledge within the technical scope of the art, without excessive experimentation and without departing from the general concept of the present disclosure. Therefore, based on the teachings and guidance given herein, it is expected that such adaptations and modifications are within the meaning and scope of equivalents of the disclosed implementations. It is to be understood that the wording or terminology herein is for description rather than for limitation, and thus the terms or wording of this specification should be interpreted by those skilled in the art based on the teachings and guidance.

[0125] Each implementation described may include a particular feature, structure, or characteristic, but not every implementation may include the particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same implementation. In addition, when a particular feature, structure, or characteristic is described in connection with an implementation, it is considered to be within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in connection with other implementations (whether or not explicitly described).

[0126] The exemplary implementations described herein are provided for illustration and not for limitation. Other implementations are possible, and modifications may be made to the exemplary implementations. Therefore, the specification is not intended to limit the present disclosure. Rather, the scope of the present disclosure is limited only by the appended claims and their equivalents.

[0127] Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures, unless otherwise noted.

[0128] The terms "at least one" and "one or more" may be understood to include numerical quantities greater than or equal to one (e.g., one, two, three, four, [...], etc.). The term "plurality" may be understood to include numerical quantities greater than or equal to two (e.g., two, three, four, five, [...], etc.).

[0129] The words "plurality" and "multiple" in the specification and claims clearly refer to a quantity greater than one. Therefore, any phrase that explicitly invokes the above words referring to a quantity of elements (e.g., "plurality (elements)", "multiple (elements)") clearly refers to more than one of the elements. The terms "group", "set", "collection", "series", "sequence", "grouping", etc. and similar terms in the specification and claims, if any, refer to a quantity equal to or greater than one, that is, one or more. The terms "proper subset", "reduced subset" and "smaller subset" refer to a subset of a set that is not equal to the set, and, as an example, refer to a subset of a set that contains fewer elements than the set.

[0130] The phrase "at least one" with respect to a set of elements may be used herein to mean at least one element from the group consisting of these elements. The phrase "at least one" with respect to a set of elements may be used herein to mean a selection of the following listed items: one of the listed elements, one of a plurality of listed elements, a plurality of individual listed elements, or a plurality of elements from a plurality of individual listed elements.

Claims

1. A magnetic grounding system, comprising: a magnet assembly including a permanent magnet, the magnet assembly being galvanically coupled to ground; as well as Cable assembly, including: a metallic shield enclosing one or more conductors; and a cable coating in galvanic contact with the metal shielding layer, the cable coating comprising a conductive magnetic material, Wherein, when the cable plating is magnetically fixed to the magnet assembly via magnetic attraction between the cable plating and the permanent magnet, the metal shielding layer is galvanically coupled to the ground via electrical contact between the cable plating and the magnet assembly.

2. The magnetic grounding system of claim 1, wherein: The magnet assembly also includes a magnet plating plated onto the permanent magnet, the magnet plating including a conductive material and galvanically coupled to the ground.

3. The magnetic grounding system of claim 2, wherein: When the cable plating is magnetically secured to the magnet assembly via magnetic attraction between the cable plating and the permanent magnet, the metal shield is galvanically coupled to the ground via electrical contact between the cable plating and the magnet plating.

4. The magnetic grounding system of claim 2, wherein: The magnet plating layer includes a nickel-gold plating layer.

5. The magnetic grounding system of claim 1, wherein: The cable plating layer includes a nickel-gold plating layer.

6. The magnetic grounding system according to any one of claims 1 to 5, wherein: The cable assembly includes a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

7. The magnetic grounding system according to any one of claims 1 to 5, wherein: The cable assembly also includes an insulating layer surrounding the metal shielding layer, A portion of the insulating layer is removed to expose a portion of the metal shielding layer, and The cable plating is in galvanic contact with the exposed portion of the metal shield.

8. The magnetic grounding system according to any one of claims 1 to 5, wherein: The permanent magnet comprises AlNiCo material.

9. The magnetic grounding system according to any one of claims 1 to 5, wherein: The metallic shield completely encapsulates one or more conductors of the cable assembly.

10. The magnetic grounding system according to any one of claims 1 to 5, wherein: One or more conductors of the cable assembly are coupled to a corresponding set of connection pins, and Wherein, when the cable coating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of a mating connector.

11. The magnetic grounding system according to any one of claims 1 to 5, wherein: The ground is a printed circuit board (PCB) ground, and Wherein, the magnet assembly is coupled to the PCB ground via a soldering connection.

12. An electronic device comprising: Printed circuit board (PCB), including PCB ground; a magnet assembly including a permanent magnet, the magnet assembly being coupled to the PCB ground in a galvanic manner, A cable assembly comprising: (i) a metal shielding layer enclosing one or more conductors, and (ii) a cable coating in galvanic contact with the metal shielding layer, Wherein, the cable coating comprises a conductive magnetic material, and Wherein, when the cable plating is magnetically fixed to the magnet assembly via the magnetic attraction force between the cable plating and the permanent magnet, the metal shielding layer is galvanically coupled to the PCB ground via the electrical contact between the cable plating and the magnet assembly.

13. The electronic device according to claim 12, wherein: The magnet assembly also includes a magnet plating plated onto the permanent magnet, the magnet plating including a conductive material and galvanically coupled to the PCB ground.

14. The electronic device according to claim 13, wherein: When the cable plating is magnetically secured to the magnet assembly via magnetic attraction between the cable plating and the permanent magnet, the metal shield is galvanically coupled to the PCB ground via electrical contact between the cable plating and the magnet plating.

15. The electronic device according to claim 13, wherein: The magnet plating layer includes a nickel-gold plating layer.

16. The electronic device according to claim 12, wherein: The cable plating layer includes a nickel-gold plating layer.

17. The electronic device according to any one of claims 12 to 16, wherein: The cable assembly includes a flexible flat cable (FFC) or a flexible printed circuit (FPC) cable.

18. The electronic device according to any one of claims 12 to 16, wherein: The cable assembly further includes an insulating layer bonded to the metal shielding layer, A portion of the insulating layer is removed to expose a portion of the metal shielding layer, and The cable plating is in galvanic contact with the exposed portion of the metal shield.

19. The electronic device according to any one of claims 12 to 16, wherein: The permanent magnet comprises AlNiCo material.

20. The electronic device according to any one of claims 12 to 16, wherein: The metallic shield completely encapsulates one or more conductors of the cable assembly.

21. The electronic device according to any one of claims 12 to 16, wherein: One or more conductors of the cable assembly are coupled to a corresponding set of connection pins, and Wherein, when the cable coating is magnetically secured to the magnet assembly, the set of corresponding connection pins of the cable assembly are aligned with corresponding conductors of a mating connector.

22. The electronic device according to any one of claims 12 to 16, wherein: The magnet assembly is coupled to the PCB ground via a solder connection.

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