Transceiver multi-beam network and antenna based on ultra-multi-layer mixed-pressure PCB technology

Abstract

The present invention relates to a transceiver multi-beam network and antenna based on an ultra-multi-layer mixed-pressure PCB process. The transceiver multi-beam network includes a microwave combining network layer, a dielectric substrate, and a multi-beam chip layer. The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate. Any of the microwave combining network layers and the multi-beam chip layer are connected via quasi-coaxial vertical vias. The microwave combining network layer is provided with capacitor and inductor branches around the connection with the quasi-coaxial vertical vias. Through the above-mentioned arrangement, the present invention supports multiple independent beams while effectively reducing the phased array profile, achieving high inter-channel isolation, reducing spatial crosstalk, and achieving good antenna matching.

Description

Technical Field

[0001] The present invention relates to the technical field of radar antennas, and in particular to a transceiver multi-beam network and antenna based on an ultra-multi-layer mixed-press PCB process. Background Art

[0002] Phased array antennas, also known as phase-controlled array antennas, are antennas that adjust their radiation pattern by precisely controlling the feed phase of each radiating element in the array. In recent years, this technology has been widely used in a variety of technical fields, including radar systems, communications, remote control and telemetry, and electronic countermeasures.

[0003] Traditional phased array antennas mostly adopt a brick-type multi-beam architecture and achieve high-density integration through micro-assembly technology, but the overall size and weight are large, the cost is high, and it is not conducive to large-scale and rapid manufacturing.

[0004] The tile-like phased array antenna architecture, with its device circuitry laid out parallel to the antenna plane, offers a low profile and conformal platform integration, making it a promising research prospect. Currently, tile-like architectures exist for co-aperture phased array antennas for both transmit and receive, as well as for multi-beam phased array antennas. However, a clear technical solution for a scalable tile-like architecture for multi-beam co-aperture phased array antennas for transmit and receive remains to be seen. Summary of the Invention

[0005] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a transceiver multi-beam network and antenna based on an ultra-multi-layer mixed-pressure PCB process, so as to reduce the phased array profile, achieve high inter-channel isolation, reduce spatial crosstalk, and thus improve the performance of the antenna.

[0006] To achieve the above-mentioned purpose of the invention, the present invention provides a transceiver multi-beam network based on an ultra-multi-layer hybrid PCB process, comprising a microwave combining network layer, a dielectric substrate, and a multi-beam chip layer;

[0007] The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate;

[0008] Any of the microwave combining network layers and the multi-beam chip layer is connected via quasi-coaxial vertical vias;

[0009] The microwave combining network layer is provided with capacitor and inductor branches around the connection with the quasi-coaxial vertical via hole.

[0010] According to a technical solution of the present invention, the microwave combining network layer has N layers, and shielding layers are provided above and below any of the microwave combining network layers, and the shielding layers have N+1 layers.

[0011] According to a technical solution of the present invention, the multi-beam transmitting and receiving network is expanded by interconnecting connectors.

[0012] According to a technical solution of the present invention, the circuit of the microwave combining network layer is realized by cascading multi-stage Wilkins bridges of microstrip lines based on a buried resistor process, and the characteristic impedance of the microstrip lines is a standard 50 ohm characteristic impedance.

[0013] According to a technical solution of the present invention, any of the microwave combining network layers forms an independent beam.

[0014] According to a technical solution of the present invention, the microwave combining network layers have equal phases.

[0015] According to a technical solution of the present invention, a stripline impedance converter and a chip interface are provided on the multi-beam chip layer. The chip interface is connected to the stripline impedance converter, and the stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

[0016] According to a technical solution of the present invention, the multi-beam transceiver network further includes: a clock network layer, a data network layer, a data download network layer, and a chip select network layer.

[0017] According to one aspect of the present invention, there is provided a tile-type phased array antenna including the above-mentioned transceiver multi-beam network, comprising a radiation unit layer and a control chip layer.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. This invention proposes a broadband, low-loss multi-beam network based on a novel coaxial-like process, which achieves high channel-to-channel isolation through multi-stage Wilkins bridge cascade and stripline structure design.

[0020] 2. The multi-layer network integrated PCB pressing process is used to achieve high-density integration of multi-beam networks, effectively reducing the phased array profile while supporting multiple independent beams.

[0021] 3. The multi-beam network can be easily connected to external circuits for vertical expansion, optimize the transmission line impedance value, and compress the vertical transmission distance of the signal.

[0022] 4. A shielding layer design is used between microwave combining network layers to improve the isolation of the beam network and reduce spatial crosstalk.

[0023] 5. The present invention significantly reduces production costs through the stacked multi-beam network architecture and multi-layer network integrated PCB pressing process, facilitating mass production and promotion and application.

[0024] 6. By loading capacitor and inductor branches near the quasi-coaxial vertical via used for feeding, the inductance and capacitance brought by the quasi-coaxial structure are offset, thereby achieving good matching of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0026] Figure 1 Schematically showing the overall cascade structure of the multi-beam network of the present invention;

[0027] Figure 2 Schematically showing the cascade structure diagram of the multi-beam transceiver network of the present invention;

[0028] Figure 3 Schematically showing the network distribution diagram of the microwave combining network layer of the present invention;

[0029] Figure 4 Schematic diagram showing the hierarchical structure of the microwave combining network layer of the present invention;

[0030] Figure 5 Schematic diagram showing the structure of the microwave combining network layer and the shielding layer stripline combining network of the present invention;

[0031] Figure 6 Schematic diagram of the microwave combining network layer power splitter and combiner of the present invention;

[0032] Figure 7 The figure schematically shows the capacitance and inductance branches loaded near the quasi-coaxial vertical vias in the microwave combining network layer of the present invention.

[0033] 1-Capacitor and inductor branches; 2-Microwave combining network layer; 3-Multi-beam chip layer; 4-Feeder line. DETAILED DESCRIPTION

[0034] The description of the embodiments in this specification should be combined with the corresponding drawings, which should be considered a complete part of this specification. In the drawings, the shapes and thicknesses of the embodiments may be exaggerated and indicated for simplicity or convenience. Furthermore, the various structural components in the drawings will be described separately. It is worth noting that components not shown in the drawings or not described in words are known to those of ordinary skill in the art.

[0035] The description of the embodiments herein and any references to directions and orientations are for ease of description only and are not to be construed as limiting the scope of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination. The present invention is not specifically limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0036] like Figures 1 to 7 As shown, an embodiment of the present invention is a transceiver multi-beam network device of a tile-type phased array antenna based on an ultra-multi-layer mixed-pressure PCB process, which is a power receiving combining network and / or a transmitting power distribution network of the antenna.

[0037] like Figure 1 As shown, the multi-beam network device includes a microwave combining network layer 2, a dielectric substrate, and a multi-beam chip layer 3;

[0038] The microwave combining network layer 2 and the multi-beam chip layer 3 are sequentially arranged on the dielectric substrate;

[0039] Multiple multi-beam networks can be connected and expanded to form a multi-beam phased array module, which facilitates vertical interconnection with external circuits.

[0040] The multi-beam transceiver network based on the ultra-multi-layer mixed-pressure PCB process can significantly reduce the phased array profile, while realizing multiple simultaneous independent beams, saving connector interconnection, significantly reducing production costs, and facilitating mass production and promotion and application.

[0041] The multi-beam network cascade structure is as follows Figure 2 As shown, the circuit of the microwave combining network layer 2 is realized by cascading multi-stage Wilkins bridges of microstrip lines based on the buried resistor process. The characteristic impedance of the microstrip line is the standard 50 ohm characteristic impedance. Each layer of the microwave combining network layer 2 is isolated by a shielding layer. The output connection between the microwave combining network layer 2 and the multi-beam chip layer 3 is realized based on quasi-coaxial vertical vias. The multi-beam network layout takes into account the quasi-coaxial through holes for vertical interconnection between the microwave combining network layers 2.

[0042] The network distribution of microwave combining network layer 2 is as follows Figure 3 As shown, each microwave combining network layer 2 forms at least one independent beam, and the microwave combining network layer 2 is equiphase. The microwave combining network layer 2 based on PCB technology can be standardized and expanded and interconnected through connectors.

[0043] The transceiver multi-beam network can also set up other functional layers through PCB technology, such as clock network layer, data network layer, data download network layer, and chip select network layer.

[0044] like Figure 4As shown, the microwave combining network layer 2 has N layers, and shielding layers are provided above and below any microwave combining network layer 2. The shielding layers have N+1 layers. The shielding layers are provided to achieve high isolation of the multi-beam network and avoid spatial crosstalk.

[0045] Each microwave combining network layer 2 forms at least one independent beam, and the microwave combining network layers 2 are equiphase. Any microwave combining network layer 2 and the multi-beam chip layer 3 are connected to the BGA solder balls through quasi-coaxial vertical via transitions, and the BGA solder balls are connected to the multi-beam chip layer 3;

[0046] like Figure 7 As shown, the microwave combining network layer 2 is provided with capacitor and inductor branches 1 on the feeder 4 connected to the quasi-coaxial vertical via.

[0047] By arranging capacitor and inductor branches 1 on the feed line 4 between the quasi-coaxial vertical vias, the inductance and capacitance caused by the quasi-coaxial structure are offset, thereby achieving good matching of the antenna.

[0048] The transceiver multi-beam network is expanded through connector interconnection.

[0049] A stripline impedance converter and a chip interface are provided on the multi-beam chip layer 3. The chip interface is connected to the stripline impedance converter, and the stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

[0050] The stripline combining network structure of the microwave combining network layer 2 of the multi-layer PCB multi-beam network is as follows Figure 5 As shown, the microstrip line is connected to the BGA solder ball through a quasi-coaxial vertical via transition, the BGA solder ball is connected to the stripline impedance converter on the multi-beam chip layer 3, and the stripline impedance converter is connected to the chip interface of the multi-beam chip.

[0051] Figure 6 yes Figure 5 Enlarged schematic diagram of the power splitter and combiner.

[0052] This embodiment also provides a tile-type phased array antenna including the above-mentioned transceiver multi-beam network, including a radiation unit layer, a control chip layer, and a power supply network layer.

[0053] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A transceiver multi-beam network based on ultra-multi-layer mixed-press PCB technology, characterized in that: It includes microwave combining network layer, dielectric substrate and multi-beam chip layer; The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate; Any of the microwave combining network layers and the multi-beam chip layer are connected via quasi-coaxial vertical vias; The microwave combining network layer is provided with capacitor and inductor branches around the connection with the quasi-coaxial vertical via; The microwave combining network layer has N layers, and shielding layers are provided above and below any of the microwave combining network layers, and the shielding layers have N+1 layers; The circuit of the microwave combining network layer is realized by cascading a multi-stage Wilkins bridge of a microstrip line based on a buried resistor process, and the characteristic impedance of the microstrip line is a standard 50 ohm characteristic impedance; A stripline impedance converter and a chip interface are provided on the multi-beam chip layer. The chip interface is connected to the stripline impedance converter. The stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

2. The transceiver multi-beam network according to claim 1, wherein: The multi-beam transmitting and receiving network is expanded by interconnecting connectors.

3. The transceiver multi-beam network according to claim 1, wherein: Any of the microwave combining network layers forms an independent beam.

4. The transceiver multi-beam network according to claim 1, wherein: The microwave combining network layers are of equal phase.

5. The transceiver multi-beam network according to claim 1, wherein: The multi-beam transceiver network further includes: a clock network layer, a data network layer, a data download network layer, and a chip selection network layer.

6. A tile-type phased array antenna, characterized in that: Including, radiation unit layer, control chip layer; It also includes: a transceiver multi-beam network as described in any one of claims 1-5.

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