Wiring substrate, preparation method thereof and display device

Abstract

The embodiment of the invention provides a wiring substrate, a preparation method thereof and a display device, relates to the technical field of display, and is used for improving the production yield. The wiring substrate includes a substrate, a plurality of electrodes, and a plurality of leads. The substrate is provided with a first surface, a second surface and a plurality of side surfaces, the first surface and the second surface are oppositely arranged, the side surfaces are connected with the first surface and the second surface, and at least one side surface in the side surfaces is a selected side surface. The plurality of electrodes are arranged on the first surface of the substrate at intervals along the first direction, and / or are arranged on the second surface of the substrate at intervals along the first direction. The plurality of leads are arranged at intervals along a first direction. The plurality of leads comprise a plurality of first leads and a plurality of second leads, and the at least one electrode is in lap joint with the at least two first leads; the plurality of second leads are insulated from the electrode. Moreover, on the first surface or the second surface of the substrate, at least one second lead is arranged between two adjacent first leads which are connected with different electrodes. The method is used for image display.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a wiring substrate and a preparation method thereof, and a display device. Background Art

[0002] With the development of light emitting diode technology, light emitting substrates using sub-millimeter (Mini) or even micron (Micro) light emitting diodes (Light Emitting Diode, LED) have been widely used. As a result, not only can the screen contrast of products such as liquid crystal displays (Liquid Crystal Display, LCD) using the light emitting substrate reach the level of organic light emitting diode (Organic Light Emitting Diode, OLED) display products, but also the products can retain the technical advantages of liquid crystal display, thereby improving the display effect of the picture and providing users with a better visual experience. Among them, improving the yield of products is a constant pursuit of those skilled in the art. Summary of the invention

[0003] The present invention provides a wiring substrate and a manufacturing method thereof, and a display device, so as to reduce the risk of lead short circuit and open circuit and improve the yield.

[0004] In one aspect, a wiring substrate is provided. The wiring substrate comprises a substrate, a plurality of electrodes and a plurality of leads. The substrate comprises a first surface and a second surface arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface. The plurality of electrodes are arranged at intervals on the first surface of the substrate along a first direction, and / or are arranged at intervals on the second surface of the substrate along the first direction.

[0005] The plurality of leads are arranged at intervals along the first direction. Each lead includes a first routing segment, a second routing segment, and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface. The plurality of leads include a plurality of first leads and a plurality of second leads, at least one of the electrodes is overlapped with at least two of the first leads; the plurality of second leads are insulated from the electrodes. Moreover, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

[0006] In some embodiments, the plurality of electrodes include a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes are arranged at intervals on the first surface of the substrate along the first direction. The plurality of second electrodes are arranged at intervals on the second surface of the substrate along the first direction and correspond to the plurality of first electrodes one by one. At least one of the first electrodes and the corresponding second electrode are connected by at least two of the first leads.

[0007] In some embodiments, the orthographic projection of any of the first electrodes on the substrate at least partially overlaps with the orthographic projection of the corresponding second electrode on the substrate. The substrate comprises a first substrate and a second substrate, and the first substrate and the second substrate are relatively fixedly arranged. The first electrode is arranged on a surface of the first substrate away from the second substrate, and the second electrode is arranged on a surface of the second substrate close to or away from the first substrate.

[0008] In some embodiments, the first electrode and the second electrode connected to the same first lead constitute an electrode pair, and any electrode pair is connected by a first lead group, and each first lead group includes at least two first leads.

[0009] In some embodiments, a ratio of a width of the first lead group along the first direction to a width of the electrode pair along the first direction is greater than or equal to 1 and less than or equal to 1.8.

[0010] In some embodiments, different first lead groups include the same number of first leads.

[0011] In some embodiments, the number of first leads included in any one of the first lead groups is positively correlated with the width of the electrode pair connected thereto along the first direction.

[0012] In some embodiments, the widths of the first leads in all the first lead groups along the first direction are the same; and / or the intervals between two adjacent first leads in all the first lead groups are the same.

[0013] In some embodiments, in each of the first lead groups, a distance between any two adjacent first lead lines along the first direction is less than or equal to a width of any first lead line along the first direction.

[0014] In some embodiments, the distance between any two adjacent leads along the first direction is the same; and / or the width of any two leads along the first direction is the same.

[0015] In some embodiments, a distance between any two adjacent lead lines along the first direction is less than or equal to a width of any one lead line along the first direction.

[0016] In the wiring substrate of the embodiment of the present disclosure, at least one lead (i.e., the second lead) is located between two first leads connected to different electrodes and adjacent to each other, and the second lead and the first lead adjacent to each other are spaced from each other. Since the extension direction of each of the multiple leads is the same, and the multiple leads are spaced along the first direction. The spacing between the multiple leads can be achieved by etching process, and the value range of the spacing can be within 15μm; in the case of using laser etching to achieve the spacing between the multiple leads, there is a probability of short circuit between the two adjacent leads due to metal melting and diffusion caused by laser etching, however, since the second lead is also arranged between the two first leads connected to different electrodes and adjacent to each other, the probability of short circuit between the two first leads will be greatly reduced. It can be understood that the probability of short circuit will decrease with the increase of the number of second leads arranged between the two first leads; at the same time, due to the existence of the second lead and the spacing between the adjacent leads, the spacing between the two first leads will also increase, further reducing the probability of short circuit between the two, thereby improving the yield and reliability.

[0017] In addition, as long as there is one complete first lead, the electrode overlapped with at least two first lead wires can still transmit electrical signals, thereby reducing the risk of circuit breaking and improving production yield.

[0018] In another aspect, a display device is provided. The display device comprises a wiring substrate according to any one of the above embodiments, an electronic component and a driving circuit board. The electronic component is arranged on the first surface of the substrate of the wiring substrate, and the driving circuit board is connected to the wiring substrate.

[0019] In another aspect, a method for preparing a wiring substrate is provided. The method for preparing a wiring substrate is used to prepare the wiring substrate of any of the above embodiments, and the method comprises:

[0020] A substrate is provided. The substrate has a first surface and a second surface arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface. The first surface of the substrate includes a plurality of electrodes arranged at intervals along a first direction, and / or the second surface of the substrate includes a plurality of electrodes arranged at intervals along the first direction.

[0021] A plurality of leads are formed. The plurality of leads are arranged at intervals along the first direction; each lead comprises a first routing segment, a second routing segment and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads comprises a plurality of first leads and a plurality of second leads, at least one of the electrodes overlaps with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

[0022] In some embodiments, forming the plurality of leads comprises: forming a conductive layer; the conductive layer covers selected side surfaces of the substrate and extends to the first surface and the second surface; etching specific areas of the conductive layer multiple times; and forming the plurality of leads in the unetched portions of the conductive layer.

[0023] In some embodiments, etching the specific region of the conductive layer multiple times includes: etching the first specific region of the conductive layer multiple times; the unetched portion of the conductive layer forms multiple initial leads. Etching the second specific region of each of the initial leads; the unetched portion of the initial leads forms multiple leads.

[0024] In some embodiments, the etching sequence of the multiple etchings includes at least one of etching sequentially from one side to the other side of the conductive layer, etching alternately from the middle to both sides of the conductive layer, and etching alternately from both sides to the middle of the conductive layer.

[0025] The beneficial effects of the display device and the method for preparing the wiring substrate provided by the embodiments of the present disclosure are the same as the beneficial effects of the wiring substrate provided by the above technical solution, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0027] Figure 1 is a structural diagram of a display device according to some embodiments;

[0028] Figure 2 is a structural diagram of another display device according to some embodiments;

[0029] Figure 3 for Figure 1 Sectional view along AA';

[0030] Figure 4 is a partial cross-sectional view of a display device according to some embodiments;

[0031] Figure 5 is a top view of a light emitting substrate according to some embodiments;

[0032] Figure 6 is a circuit diagram of a light emitting substrate according to some embodiments;

[0033] Figure 7 is a partial cross-sectional view of a wiring substrate according to some embodiments;

[0034] Figure 8 is a partial cross-sectional view of another wiring substrate according to some embodiments;

[0035] Fig. 9 is a partial cross-sectional view of yet another wiring substrate according to some embodiments;

[0036] Fig.10 is a partial cross-sectional view of yet another wiring substrate according to some embodiments;

[0037] Fig.11 is a diagram showing a connection structure between electrodes and leads of a wiring substrate according to some embodiments;

[0038] Fig.12 A diagram showing a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0039] Fig.13 is a diagram showing a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0040] Fig.14 A diagram showing a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0041] Fig.15 is a diagram showing a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0042] Figure 16 to Figure 18 is a flow chart of a method for preparing a wiring substrate according to some embodiments;

[0043] Fig.19 is a step diagram of a method for preparing a wiring substrate according to some embodiments;

[0044] Fig. 20 is a step diagram of another method for preparing a wiring substrate according to some embodiments;

[0045] Fig.21 is a step diagram of another method for preparing a wiring substrate according to some embodiments;

[0046] Fig. 22 FIG. 4 is a structural diagram of initial leads of a wiring substrate according to some embodiments. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0048] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0049] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0050] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0051] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0052] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0053] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0054] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0055] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0056] As used herein, "parallel", "perpendicular", and "equal" include the conditions described and conditions similar to the conditions described, the range of which is within an acceptable range of deviations, wherein the acceptable range of deviations is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, wherein the acceptable range of deviations for approximate equality may include, for example, a difference between the two being equal that is less than or equal to 5% of either.

[0057] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0058] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0059] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 1000, which may be any device that displays images, whether in motion (eg, video) or fixed (eg, still image), and whether text or images.

[0060] For example, see Figure 1 and Figure 2 The display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc.

[0061] For example, Figure 1 As shown, the display device 1000 may be a portable display product; for example, the display device 1000 may be Figure 1 For another example, see Figure 2 , the display device 1000 may be a wearable device; for example, the display device 1000 may be Figure 2 The watch shown in.

[0062] It should be noted that, depending on different application scenarios, the shape of the display surface of the display device 1000 is not unique, and the shape of the display surface of the display device 1000 can be any one of circular, elliptical or polygonal, which is not specifically limited in the embodiments of the present disclosure.

[0063] In some embodiments, the display device 1000 may be a liquid crystal display device (LCD) and a mini / micro light emitting display device (MLED), etc., which is not specifically limited in the embodiments of the present disclosure.

[0064] The following takes the display device 1000 as a liquid crystal display device as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display device 1000 can also be considered as long as the same technical concept is applied.

[0065] In some embodiments, see Figure 3 The display device 1000 includes a light-emitting substrate 210 and a driving circuit board 230. The light-emitting substrate 210 has a light-emitting side and a non-light-emitting side opposite to each other, and the light-emitting side refers to the side of the light-emitting substrate 210 that can emit light ( Figure 3 The non-luminous side refers to the other side opposite to the luminous side ( Figure 3 The driving circuit board 230 is disposed on the non-light-emitting side of the light-emitting substrate 210 and is connected to the light-emitting substrate 210 to provide a light-emitting signal to the light-emitting substrate 210. The light-emitting substrate 210 may emit light of only one color or may emit light of multiple colors. In some examples, a light-emitting device capable of emitting red light, a light-emitting device capable of emitting green light, and a light-emitting device capable of emitting blue light are respectively disposed on the light-emitting substrate 210, and the light-emitting substrate 210 can directly realize full-color display.

[0066] In some embodiments, see Figure 4 The display device 1000 includes a display panel 100 , a backlight module 200 , a housing 300 and a cover plate 400 .

[0067] like Figure 4 As shown, the display panel 100 includes a display side and a non-display side that are arranged opposite to each other. The display side refers to the side of the display panel 100 that is used to display the picture ( Figure 3 The non-display side refers to the other side opposite to the display side ( Figure 3The lower side of the display panel 100). The cover plate 400 is arranged on the light-emitting side of the display panel 100, and the cover plate 400 is used to protect the display panel 100. Exemplarily, the material used for the cover plate 400 can be a rigid material such as glass, quartz, plastic, or a flexible material such as polymer resin. The backlight module 200 is arranged on the non-light-emitting side of the display panel 100, and the backlight module 200 is used to provide a light source for the display panel 100. The shell 300 can be an open box-shaped structure, the display panel 100 and the backlight module 200 are arranged in the shell 300, the cover plate 400 is arranged on the light-emitting side of the display panel 100, and is located at the opening of the shell 300, and the backlight module 200 is arranged on the non-light-emitting side of the display panel 100. The backlight module 200 includes a light-emitting substrate 210 and a driving circuit board 230,

[0068] In other examples, the backlight module 200 further includes a plurality of optical films 220, and the light-emitting substrate 210 can directly emit white light, which is then emitted toward the display panel 100 after being homogenized by the plurality of optical films 220. Alternatively, the light-emitting substrate 210 can also emit light of other colors (e.g., blue light), which is then emitted toward the display panel 100 after being color-converted and homogenized by the plurality of optical films 220.

[0069] For example, see Figure 4 , along a direction perpendicular to the light emitting substrate 210 and away from the light emitting substrate 210 , the plurality of optical films 220 include a diffuser plate 221 , a quantum dot film 222 , a diffuser sheet 223 and a composite film 224 which are sequentially arranged.

[0070] The diffuser 221 can blur the light emitted by the light-emitting substrate 210 and provide support for the quantum dot film 222, the diffuser 223 and the composite film 224. The quantum dot film 222 can convert the light of a certain color emitted by the light-emitting substrate 210 into white light under the stimulation of the light, so as to improve the utilization rate of the light energy of the light-emitting substrate 210. The diffuser 223 can homogenize the light passing through the diffuser 223. The composite film 224 can improve the light extraction efficiency of the backlight module 200 and improve the display brightness of the display device 1000.

[0071] It should be noted that the composite film 224 may include a brightness enhancement film (BEF) and a dual brightness enhancement film (DBEF), which utilizes the principles of total reflection, refraction and polarization to increase the light flux within a certain angle range to improve the brightness of the display device 1000.

[0072] For example, the light-emitting substrate 210 emits blue light in a direction away from the light-emitting substrate 210. The quantum dot film 222 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting substrate 210 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue light, the red light, and the green light are mixed and superimposed in a certain proportion to present white light. Finally, the diffuser 221 and the diffuser sheet 223 can mix the white light to improve the light shadow produced by the light-emitting substrate 210 and improve the display quality of the display device 1000.

[0073] In some embodiments, see Figure 4 The light emitting substrate 210 includes a wiring substrate 10 and an electronic component 20 , and the electronic component 20 is disposed on the wiring substrate 10 .

[0074] like Figure 4 and Figure 5 As shown, the electronic component 20 may include a light emitting device 21 and / or a microchip 22 .

[0075] The light emitting device 21 may include a Micro LED and / or a Mini LED. For example, the size (e.g., length) of the Micro LED is less than 50 microns, such as 10 microns to 50 microns. For another example, the size (e.g., length) of the Mini LED is 50 microns to 150 microns, such as 80 microns to 120 microns.

[0076] The microchip 22 may include a sensor chip and a driver chip. The sensor chip may be, for example, a photosensitive sensor chip or a thermal sensor chip, etc. The driver chip is used to provide a driving signal to the light emitting device 21 .

[0077] For example, Figure 5 and Figure 6 As shown, the light emitting substrate 210 includes a plurality of driving units 211 arranged in an array, and each driving unit 211 includes a plurality of light emitting devices 21 connected in series and / or in parallel.

[0078] For example, Figure 5 and Figure 6 As shown, each driving unit 211 includes 4 light emitting devices 21 connected in series. Of course, each driving unit 211 may also include 3, 5, 6 or 8 light emitting devices 21, and the connection mode of the multiple light emitting devices 21 in the driving unit 211 is not limited to series connection, but may also be parallel connection, or a combination of series and parallel connection, and the embodiments of the present disclosure are not limited thereto.

[0079] In addition, one microchip 22 can drive multiple light-emitting devices 21 in one driving unit 211 to emit light, or can drive multiple light-emitting devices 21 in multiple driving units 211 to emit light respectively.

[0080] For example, Figure 5 and Figure 6 As shown, every four driving units 211 are electrically connected to a microchip 22, and the microchip 22 is electrically connected to the multiple light-emitting devices 21 in the four driving units 211, respectively, so as to drive the multiple light-emitting devices 21 in the four driving units 211 to emit light.

[0081] like Figure 5 As shown, the wiring substrate 10 has a light emitting area A1 and a binding area A2, and the binding area A2 is located at one side of the light emitting area A1 along the second direction Y. The light emitting area A1 is configured to set the electronic component 20, and the binding area A2 is configured to set the electrode 40.

[0082] In addition, the wiring substrate 10 may further have a test area A3, and the test area A3 is located on a side of the light emitting area A1 away from the binding area A2 along the first direction X. The test area A3 is configured to set a test pad.

[0083] It should be noted that the electronic component 20 and the electrode 40 are respectively arranged on two opposite surfaces of the wiring substrate 10, and the test pad can be located on the same surface as the electronic component 20 or the electrode 40, which is not specifically limited in the embodiment of the present disclosure.

[0084] Some embodiments of the present disclosure provide a wiring substrate 10, referring to Figure 7 , Figure 8 and Fig. 9 The wiring substrate 10 includes a substrate 30 , a plurality of electrodes 40 , and a plurality of leads 50 .

[0085] In some examples, such as Figure 7 to Figure 10 As shown, the substrate 30 has a first surface 30A and a second surface 30B that are oppositely disposed, and a plurality of side surfaces 30C connecting the first surface 30A and the second surface 30B, at least one of the plurality of side surfaces 30C is a selected side surface 30CC. For example, the selected side surface 30CC is the substrate 30 that is away from or close to the test area A3 (see Figure 5 ) side surface.

[0086] It should be noted that, of the first surface 30A and the second surface 30B, one is the surface of the substrate 30 for mounting the electronic component 20, and the other is the surface of the substrate 30 for mounting the driving circuit board 230. For example, the first surface 30A is the surface of the substrate 30 for mounting the electronic component 20, and the second surface 30B is the surface of the substrate 30 for mounting the driving circuit board 230.

[0087] For some examples, see Figure 5 and Figure 7 The first surface 30A is the surface of the substrate 30 for mounting the electronic component 20, and the plurality of electrodes 40 are arranged at intervals along the first direction X in an area near the edge of the first surface 30A of the substrate 30; or, the second surface 30B is the surface of the substrate 30 for mounting the electronic component 20, and the plurality of electrodes 40 are arranged at intervals along the first direction X in an area near the edge of the second surface 30B of the substrate 30.

[0088] For other examples, see Figure 8 to Figure 10 Among the plurality of electrodes 40, a portion of the electrodes 40 are arranged at intervals on the first surface 30A of the substrate 30 along the first direction X, and another portion of the electrodes 40 are arranged at intervals on the second surface 30B of the substrate 30 along the first direction X. The region where the electrodes 40 located on the first surface 30A are located is directly opposite to the region where the electrodes 40 located on the second surface 30B are located, that is, the orthographic projections of the two on the first surface 30A or the second surface 30B at least partially overlap.

[0089] For example, Figure 8 to Figure 10 As shown, the plurality of electrodes 40 include a plurality of first electrodes 41 and a plurality of second electrodes 42. The plurality of first electrodes 41 are arranged at intervals on the first surface 30A of the substrate 30 along the first direction X. The plurality of second electrodes 42 are arranged at intervals on the second surface 30B of the substrate 30 along the first direction X.

[0090] In some examples, such as Figure 7 to Figure 15 As shown, a plurality of leads 50 are arranged at intervals along a first direction X, and each lead 50 includes a first routing segment 501, a second routing segment 502, and a third routing segment 503 connected in sequence. The first routing segment 501 is located on the first surface 30A, the second routing segment 502 is located on the selected side surface 30CC, and the third routing segment 503 is located on the second surface 30B.

[0091] In the following, some embodiments of the present disclosure are schematically described by taking the first surface 30A as the surface of the substrate 30 for mounting the electronic component 20 and the second surface 30B as the surface of the substrate 30 for mounting the driving circuit board 230 as an example, but the embodiments of the present disclosure are not limited thereto.

[0092] At this time, the driving circuit board 230 can be connected to the third wiring segment 503 on the second surface 30B of the wiring substrate 10, so as to provide a light-emitting signal to the electronic component 20 disposed on the first surface 30A of the wiring substrate 10. That is, there is no need to leave a bending avoidance space between the housing 300 of the display device 1000 and the wiring substrate 10, which is conducive to reducing the frame of the display device 1000.

[0093] In some examples, such as Figure 7 and Fig.11 As shown, the plurality of leads 50 may include a plurality of first leads 51 and a plurality of second leads 52. The electrode 40 overlaps the first leads 51 and is insulated from all the second leads 52. On the first surface 30A or the second surface 30B of the substrate 30, there is at least one second lead 52 between two adjacent first leads 51 connected to different electrodes 40.

[0094] In this case, at least one lead 50 (i.e., the second lead 52) is located between two adjacent first lead 51 connected to different electrodes 40, and the second lead 52 is spaced apart from the adjacent first lead 51. Since the extension direction of each of the plurality of lead 50 is the same, and the plurality of lead 50 is spaced apart along the first direction X. An etching process can be used to achieve the spacing between multiple leads 50, and the value range of the spacing can be within 15μm; when laser etching is used to achieve the spacing between multiple leads 50, there is a probability that a short circuit will occur between two adjacent leads 50 due to metal melting and diffusion caused by laser etching. However, since a second lead 52 is also provided between two adjacent first leads 51 connected to different electrodes 40, the probability of a short circuit between the two first leads 51 will be greatly reduced. It can be understood that the probability of a short circuit will decrease with the increase in the number of second leads 52 provided between the two first leads 51; at the same time, due to the existence of the second lead 52 and the spacing between adjacent leads, the spacing between the two first leads 51 will also become larger, further reducing the probability of a short circuit between the two, thereby improving the yield and reliability.

[0095] Among them, the above-mentioned electrode 40 is overlapped with the first lead 51, including any one of the following: the first lead 51 is located on the side of the first electrode 41 away from the substrate 30, the first electrode 41 is located on the side of the first lead 51 away from the substrate 30, or the first lead 51 is in direct contact with the end face of the first electrode 41 (that is, the orthographic projections of the two on the first surface 30A overlap only at the boundary).

[0096] In the following, some embodiments of the present disclosure are schematically described and illustrated by taking the case where the first lead 51 is located on the side of the first electrode 41 away from the substrate 30 as an example, but the embodiments of the present disclosure are not limited thereto.

[0097] On this basis, at least one electrode 40 is overlapped with at least two first leads 51. In this way, as long as there is a complete first lead 51, the electrode 40 overlapped with at least two first leads 51 can still transmit electrical signals, reducing the risk of circuit breakage and improving production yield.

[0098] For example, Figure 12 to Figure 15As shown, the plurality of second electrodes 42 correspond to the plurality of first electrodes 41 one by one, and at least one first electrode 41 and the corresponding second electrode 42 are connected via at least two first lead wires 51 .

[0099] At this time, as long as there is a complete lead 50 between the connected first electrode 41 and the second electrode 42, the first electrode 41 and the second electrode 42 can still transmit electrical signals, so that the driving circuit board 230 (see Figure 3 ) can provide a luminous signal to the wiring substrate 10, reduce the risk of disconnection between the connected first electrode 41 and the second electrode 42, and improve the production yield.

[0100] In some embodiments, Fig. 9 , Fig.10 and Fig.12 As shown, the orthographic projection of any first electrode 41 on the substrate 30 and the orthographic projection of the corresponding second electrode 42 on the substrate 30 at least partially overlap.

[0101] The substrate 30 includes a first substrate 31 and a second substrate 32, which are fixedly arranged relative to each other. The first electrode 41 is arranged on a surface of the first substrate 31 away from the second substrate 32, and the second electrode 42 is arranged on a surface of the second substrate 32 close to or away from the first substrate 31.

[0102] In some examples, such as Fig. 9 As shown, the first electrode 41 is disposed on the surface of the first substrate 31 away from the second substrate 32, that is, the first surface 30A is the surface of the first substrate 31 away from the second substrate 32. The second electrode 42 is disposed on the surface of the second substrate 32 close to the first substrate 31, that is, the second surface 30B is the surface of the second substrate 32 close to the first substrate 31.

[0103] Furthermore, the third routing segment 503 of the first lead 51 is located between the first substrate 31 and the second substrate 32 , and the second electrode 42 overlaps the third routing segment 503 of the first lead 51 , thereby being connected to the corresponding first electrode 41 through at least two first leads 51 .

[0104] For example, see Fig. 9 The wiring substrate 10 also includes a first circuit layer 60, which is arranged on the first surface 30A of the substrate 30. The first electrode 41 can be located in the first circuit layer 60 and connected to the signal line 110 (power signal line, address signal line, data signal line and ground signal line, etc.) included in the first circuit layer 60.

[0105] It should be noted that the first circuit layer 60 can be a single-layer structure or a multi-layer structure, which is not specifically limited in the embodiments of the present disclosure. Among them, the end of the second electrode 42 away from the selected side surface 30CC can be directly connected to the driving circuit board 230 to provide a light-emitting signal to the wiring substrate 10. Exemplarily, the second substrate 32 can be made of materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide (PI), and the second substrate 32 can be a flexible substrate.

[0106] In other examples, such as Fig.10 As shown, the first electrode 41 is disposed on the surface of the first substrate 31 away from the second substrate 32, that is, the first surface 30A is the surface of the first substrate 31 away from the second substrate 32. The second electrode 42 is disposed on the surface of the second substrate 32 away from the first substrate 31, that is, the second surface 30B is the surface of the second substrate 32 away from the first substrate 31.

[0107] Furthermore, the third wiring segment 503 of the first lead 51 is located on a side of the second substrate 32 away from the first substrate 31. The second electrode 42 overlaps the third wiring segment 503 of the first lead 51, and is connected to the corresponding first electrode 41 through at least two first leads 51.

[0108] For example, see Fig.10 The wiring substrate 10 further includes a first wiring layer 60 and a second wiring layer 70. The first wiring layer 60 is disposed on the first surface 30A of the substrate 30, and the first electrode 41 may be located in the first wiring layer 60 and connected to the signal line 110 included in the first wiring layer 60. The second wiring layer 70 is disposed on the second surface 30B of the substrate 30, and the second electrode 42 may be located in the second wiring layer 70 and connected to the signal line 110 included in the second wiring layer 70.

[0109] It should be noted that the second circuit layer 70 can be a single-layer structure or a multi-layer structure, which is not specifically limited in the embodiments of the present disclosure. Among them, the second substrate 32 plays a supporting role. In some embodiments, the second electrode 42 can be connected to the driving circuit board 230 through a flexible circuit board to provide a luminous signal to the wiring substrate 10; in other embodiments, the end of the second electrode 42 away from the selected side surface 30CC can be directly connected to the driving circuit board 230 to provide a luminous signal to the wiring substrate 10. Exemplarily, the second substrate 32 can be made of materials such as PET, PEN or PI. Exemplarily, the second substrate 32 can be made of rigid materials such as glass, quartz, plastic or polymethylmethacrylate (PMMA).

[0110] In some embodiments, see Figure 8 to Figure 15 The first electrode 41 and the second electrode 42 connected to the same first lead 51 constitute an electrode pair 410 . Any electrode pair 410 is connected by a first lead group 510 . Each first lead group 510 includes at least two first leads 51 .

[0111] That is to say, any first electrode 41 and the corresponding second electrode 42 are connected by at least two first leads 51. Thus, as long as there is a complete lead 50 between any first electrode 41 and the second electrode 42, the first electrode 41 and the second electrode 42 can still transmit electrical signals, so that the driving circuit board 230 can provide a light-emitting signal to the wiring substrate 10, reduce the risk of disconnection between the first electrode 41 and the second electrode 42, and improve the production yield.

[0112] It can be understood that the width and the interval between the first electrode 41 and the second electrode 42 along the first direction X can be set according to actual conditions.

[0113] In some embodiments, see Fig.14 The width L1 of the first electrode 41 along the first direction X is positively correlated with the width L2 of the signal line 110 connected thereto along the first direction X. And / or, the spacing S1 between two adjacent first electrodes 41 is positively correlated with the spacing S2 between the signal lines 110 connected thereto respectively.

[0114] At this time, the signal line 110 corresponds to the first electrode 41 one by one, the structure is regular, and it is beneficial to reduce the contact resistance. At the same time, the signal line 110 corresponds to the first electrode 41 one by one, which is convenient for distinguishing the signal line connected to the second electrode 42, thereby facilitating the alignment connection between the second electrode 42 transmitting different signals and the driving circuit board 230.

[0115] In other embodiments, see Fig.12The width L1 of each first electrode 41 along the first direction X is the same, and / or the interval S1 between two adjacent first electrodes 41 is the same.

[0116] At this time, the width L1 of the plurality of first electrodes 41 along the first direction X may not correspond to a specific signal line 110, and the preparation process is simple and the process difficulty is low. In addition, the signal line 110 does not need to be aligned and connected to a specific first electrode 41, and each signal line 110 can be connected to one first electrode 41 or multiple first electrodes 41, respectively, and the risk of a circuit break between the signal line 110 and the first electrode 41 is smaller, and the alignment process of the signal line 110 and the first electrode 41 can be omitted, simplifying the process flow and improving the production yield.

[0117] In some embodiments, see Fig.12 The second electrode 42 is a block electrode, and each first electrode 41 is connected to a corresponding second electrode 42 via a plurality of first leads 51 of a first lead group 510. Here, along the first direction X, the width of the first electrode 41 and the width of the second electrode 42 may be substantially equal, for example.

[0118] At this time, a first electrode 41 corresponds to a second electrode 42 one by one, the structure is regular, and it is beneficial to reduce the contact resistance; at the same time, each second electrode 42 is independently connected to a different signal line, which is convenient for alignment connection with the driving circuit board 230.

[0119] In other embodiments, see Fig.13 Each second electrode 42 includes a plurality of sub-electrodes 421 , and along the first direction X, all the sub-electrodes 421 have substantially the same width, and all the sub-electrodes 421 have substantially the same spacing. In addition, along the first direction X, the width of the sub-electrode 421 is smaller than the width of any first electrode 41 .

[0120] At this time, the width of the plurality of sub-electrodes 421 along the first direction X does not need to correspond to the first electrode 41, and the plurality of sub-electrodes 421 included in each second electrode 42 are connected to one first electrode 41 through a plurality of first leads 51 of one first lead group 510. For example, one sub-electrode 421 is connected to one first electrode 41 through one first lead 51, and the risk of a circuit break between the first electrode 41 and the second electrode 42 is smaller.

[0121] It should be noted that some of the sub-electrodes 421 among the plurality of sub-electrodes 421 may overlap with the second lead 52 , and the embodiment of the present disclosure does not specifically limit this.

[0122] In the following, some embodiments of the present disclosure are schematically described by taking the second electrode 42 as a block electrode as an example, but the embodiments of the present disclosure are not limited thereto.

[0123] It can be understood that the width and the spacing of the first leads 51 in the first lead group 510 along the first direction X can be set according to actual conditions.

[0124] For example, see Fig.14 and Fig.15 In each first lead group 510, the width L2 of any first lead 51 along the first direction X is the same. On this basis, Fig.15 As shown, the width L2 of all the leads 50 (including the second lead 52 ) along the first direction X is the same to simplify the manufacturing process.

[0125] For example, see Fig.14 and Fig.15 In each first lead group 510, the distance between any two adjacent first lead lines 51 along the first direction X is the same. On this basis, Fig.15 As shown, the spacing between all the leads 50 along the first direction X is the same to simplify the manufacturing process.

[0126] For example, see Fig.14 and Fig.15 In each first lead group 510, the width L2 of any first lead 51 along the first direction X is the same, and in each first lead group 510, the spacing S3 between any two adjacent first lead 51 along the first direction X is the same. On this basis, Fig.15 As shown, the width L2 of all the leads 50 along the first direction X is the same, and the interval S3 of all the leads 50 along the first direction X is the same, so as to simplify the manufacturing process.

[0127] In some embodiments, see Fig.14 and Fig.15 In each first lead group 510, the spacing S3 between any two adjacent first lead lines 51 along the first direction X is less than or equal to the width L2 of any first lead line 51 along the first direction X. On this basis, Fig.14 and Fig.15 As shown, the spacing S3 of all the leads 50 along the first direction X is less than or equal to the width L2 of any lead 50 along the first direction X, so as to simplify the manufacturing process.

[0128] The spacing between the two adjacent leads 50 is less than or equal to 15 μm. When laser etching is used to form each lead 50, since the width of the etching path that can be formed by a single etching is small, in order to avoid the problem that the spacing between the two adjacent leads 50 is too large, multiple etchings are required, resulting in a long process time and damage to the surface of the underlying film layer (such as the substrate 30). For example, the spacing between the two adjacent leads 50 can be set to any one of 15 μm, 10 μm, 8 μm, 7 μm, 6 μm, 5 μm, 4 μm, 2 μm and 1 μm.

[0129] In the first direction, the width of the lead 50 is 5 μm to 20 μm. By way of example, the width of the lead 50 is any one of 5 μm, 8 μm, 10 μm, 13 μm, 14 μm, 15 μm, 18 μm, 19 μm and 20 μm.

[0130] In some embodiments, Fig.14 and Fig.15 As shown, the ratio of the width L3 of the first lead set 510 along the first direction X to the width L4 of the electrode pair 410 along the first direction X is greater than or equal to 1 and less than or equal to 1.8.

[0131] The width L3 of the first lead group 510 along the first direction X refers to the distance between the two opposite sides of the two farthest first lead lines 51 among the plurality of first lead lines 51 included in the first lead group 510. The width L4 of the electrode pair 410 along the first direction X refers to the larger one of the widths of the first electrode 41 and the second electrode 42 along the first direction X in the electrode pair 410.

[0132] Exemplarily, along the first direction X, the widths of the first electrode 41 and the second electrode 42 are the same, and the ratio of the width L3 of the first lead group 510 along the first direction X to the width L1 of the first electrode 41 along the first direction X is greater than or equal to 1, and less than or equal to 1.8. In this case, in the second direction Y, the orthographic projections of the two opposite boundaries of the first electrode 41 and the second electrode 42 on the substrate 30 are both located within the range of the orthographic projection of the first lead group 510 on the substrate 30, and the cross-sectional area of ​​the plurality of first leads 51 connected to the first electrode 41 and the second electrode 42 is larger as a whole, and the resistance is smaller. It should be noted that the cross section is perpendicular to the second direction Y. Moreover, when laser etching is used to form each lead 50, it can be controlled so that the boundary of any lead 50 along the second direction Y does not overlap with the boundary of any first electrode 41 along the second direction Y or the boundary of any second electrode 42 along the second direction Y. That is, in the process of laser etching, the route of the laser can be prevented from overlapping with the boundary of the first electrode 41 along the second direction Y or the boundary of the second electrode 42 along the second direction Y, thereby preventing laser damage to the edges of the first electrode 41 and the second electrode 42.

[0133] In some embodiments, Fig.12 and Fig.14 As shown, different first lead groups 510 include the same number of first lead lines 51 .

[0134] For example, Fig.14 As shown, along the first direction X, there are at least two first electrodes 41 with different widths. For example, the width of the first electrode 41 along the first direction X is positively correlated with the width of the signal line connected thereto along the first direction X. At this time, along the first direction X, the width of the first lead 51 is positively correlated with the width of the first electrode 41 connected thereto.

[0135] For example, see Fig.14 In the first direction X, the widths of the two first electrodes 41 are different, and the number of first leads 51 included in the two first lead groups 510 connected to the two first electrodes 41 is the same.

[0136] like Fig.14 As shown, the width of the first lead 51 connected to the first electrode 41 with a larger width is greater than the width of the first lead 51 connected to the first electrode 41 with a smaller width.

[0137] For example, Fig.12 As shown, along the first direction X, the widths of all the first electrodes 41 are the same, and the number of first leads 51 included in the two first lead groups 510 connected to the two first electrodes 41 is the same. At this time, along the first direction X, the widths L2 of the first leads 51 in all the first lead groups 510 along the first direction X may be the same; the intervals S3 between two adjacent first leads 51 in all the first lead groups 51 may be the same.

[0138] In other embodiments, see Fig.15 The number of first leads 51 included in any first lead group 510 is positively correlated with the width L4 of the electrode pair 410 connected thereto along the first direction X.

[0139] The width L4 of the electrode pair 410 along the first direction X refers to the larger one of the widths of the first electrode 41 and the second electrode 42 along the first direction X in the electrode pair 410 .

[0140] For example, Fig.15 As shown, there are at least two first electrodes 41 with different widths along the first direction X. For example, the width of the first electrode 41 along the first direction X is positively correlated with the width of the signal line 110 connected thereto along the first direction X.

[0141] For example, see Fig.15In the first direction X, the widths of the two first electrodes 41 are different, and the number of first leads 51 included in the two first lead groups 510 connected to the two first electrodes 41 is positively correlated with the width L4 of the electrode pair 410 connected thereto along the first direction X.

[0142] At this time, the number of the first lead lines 51 connected to the first electrodes 41 having a larger width is greater than the number of the first lead lines 51 connected to the first electrodes 41 having a smaller width.

[0143] like Fig.15 As shown, one first electrode 41 is connected to six first leads 51 , and another first electrode 41 is connected to three first leads 51 . Moreover, the width of the first electrode 41 connected to six first leads 51 is greater than the width of the first electrode 41 connected to three first leads 51 .

[0144] Some embodiments of the present disclosure also provide a method for preparing a wiring substrate 10, which is used to prepare the wiring substrate 10 of any of the above embodiments. Fig.16 As shown, the preparation method includes S100 to S200.

[0145] S100: providing a substrate.

[0146] In the above steps, refer to Figure 19 to Figure 21 The substrate 30 has a first surface 30A and a second surface 30B that are opposite to each other, and a plurality of side surfaces 30C connecting the first surface 30A and the second surface 30B, at least one side surface 30C of the plurality of side surfaces 30C being a selected side surface 30CC.

[0147] In addition, see Figure 19 to Figure 21 The first surface 30A of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X, and / or the second surface 30B of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X.

[0148] S200: forming a plurality of leads.

[0149] In the above steps, refer to Figure 11 to Figure 15 , a plurality of leads 50 are arranged at intervals along the first direction X. Each lead 50 includes a first routing segment 501, a second routing segment 502, and a third routing segment 503 connected in sequence, the first routing segment 501 is located on the first surface 30A, the second routing segment 502 is located on the selected side surface 30CC, and the third routing segment 503 is located on the second surface 30B.

[0150] In addition, see Figure 11 to Figure 15The plurality of leads 50 include a plurality of first leads 51 and a plurality of second leads 52, and at least one electrode 40 is overlapped with at least two first leads 51. The plurality of second leads 52 are insulated from the electrode 40. Moreover, on the first surface 30A or the second surface 30B of the substrate 30, between two adjacent first leads 51 connected to different electrodes 50, there is at least one second lead 52.

[0151] It should be understood that the process method adopted in the above S200 is not unique. S200 can adopt sputtering film formation and then be combined with a laser etching process; it can also adopt a mask and sputtering process; it can also adopt a printing process, a pad printing process; or after film formation, it can be implemented by combining at least one of laser selective melting and electron beam selective melting.

[0152] The following uses S200, which uses sputtering film formation combined with laser etching process, as an example to schematically illustrate some embodiments of the present disclosure. However, the implementation methods of the present disclosure are not limited to this, and any other process methods can also be considered as long as the same technical concept is applied.

[0153] For example, see Fig.17 , the above S200 includes S210 to S220.

[0154] S210: forming a conductive layer.

[0155] In the above steps, refer to Figure 19 to Figure 21 The conductive layer 50 ′ covers the selected side surface 30CC of the substrate 30 and extends to the first surface 30A and the second surface 30B.

[0156] For example, combined with Fig.12 and Fig.19 , the first surface 30A of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X, and the second surface 30B of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X. At this time, on the first surface 30A, the conductive layer 50 ′ at least extends to one side of the electrode 40 and overlaps the electrode 40. On the second surface 30B, the conductive layer 50 ′ at least extends to one side of the electrode 40 and overlaps the electrode 40.

[0157] For some examples, see Fig.19 The above S210 specifically includes: bombarding the first target material M1 with an inert gas.

[0158] In the above steps, refer to Fig.19, the first target M1 swings between the first position and the second position. The angle between the first target M1 and the plane where the second surface 30B is located in the first position is substantially equal to the angle between the first target M1 and the plane where the second surface 30B is located in the second position. The angle between the first target M1 and the plane where the second surface 30B is located in the first position is greater than or equal to 75°.

[0159] It should be noted that the inert gas includes any one of helium, neon, argon, etc., and the embodiments of the present disclosure do not specifically limit this.

[0160] For other examples, see Fig. 20 S210 specifically includes: bombarding the second target material M2 and the third target material M3 with an inert gas, and the substrate 30 moves between the second target material M2 and the third target material M3 at a non-uniform speed.

[0161] In the above steps, refer to Fig. 20 The second target M2 and the third target M3 are located on opposite sides of the substrate 30 and are substantially parallel to the second surface 30B of the substrate 30 .

[0162] For some further examples, see Fig.21 , S210 specifically includes: bombarding the fourth target material M4 and the fifth target material M5 with an inert gas.

[0163] In the above steps, refer to Fig.21 The fourth target M4 and the fifth target M5 are located on opposite sides of the substrate 30 and are tilted relative to the substrate 30. For example, the angle between the fourth target M4 and the fifth target M5 and the plane where the second surface 30B is located is 10° to 30°.

[0164] Herein, the materials of the first target M1, the second target M2, the third target M3, the fourth target M4 and the fifth target M5 may be the same or different. Among them, the materials of the first target M1, the second target M2, the third target M3, the fourth target M4 and the fifth target M5 include conductive materials. In some embodiments, the conductive material includes a metal element or alloy, for example, at least one of copper, aluminum, nickel, chromium, gold and silver. In other embodiments, the conductive material includes a non-metal, for example, carbon and / or silicon. In some further embodiments, the conductive material includes a metal oxide, for example, aluminum oxide and / or indium tin oxide.

[0165] S220: etching and removing specific areas of the conductive layer to form a plurality of leads.

[0166] In the above steps, a specific area of ​​the conductive layer 50' is etched multiple times, and the portion of the conductive layer 50' that is not etched away forms a plurality of leads 50. The etching sequence of the multiple etchings includes at least one of etching from one side of the conductive layer 50' to the other side, etching alternately from the middle of the conductive layer 50' to both sides, and etching alternately from both sides to the middle of the conductive layer 50'. It should be noted that the etching process may be a laser etching process.

[0167] It should be noted that the specific area is a pre-set area, which is the area between the multiple lead wires 50 that are finally formed, and can be specifically set according to actual conditions.

[0168] In addition, along the first direction X, from the first side to the second side of the conductive layer 50 ′, the multiple etchings are sequentially the first to Nth etchings. The first side and the second side are two opposite sides of the conductive layer 50 ′ in the first direction X.

[0169] For example, the etching sequence may also be: the first etching, the second etching, the third etching, the fourth etching...the N-1th etching, the Nth etching.

[0170] At this time, multiple etchings are performed sequentially from the first side to the second side, the process difficulty is low, and the production efficiency is high.

[0171] For another example, the etching sequence may also be: the first etching, the Nth etching, the second etching, the N-1th etching... the N / 2+1th etching, the N / 2th etching.

[0172] At this time, multiple etchings are performed alternately from both sides to the middle of the conductive layer 50 ′, and the risk of residual molten liquid droplets between two adjacent leads 50 is low, and the risk of short circuit between two adjacent leads 50 is low.

[0173] For another example, the etching sequence may be: 1st etching, 2nd etching...N / 2nd etching, Nth etching, N-1th etching...N / 2+1th etching. Or the etching sequence may be: N / 2th etching, N / 2-1th etching...1st etching, N / 2+1th etching, N / 2+2th etching...Nth etching.

[0174] At this time, the multiple etchings are divided into two stages, one stage is sequentially performed from the first side to the second side, and the other stage is sequentially performed from the second side to the first side. The risk of residual molten droplets between two adjacent leads 50 is low, and the risk of short circuit between two adjacent leads 50 is low.

[0175] In some embodiments, see Fig.18 , the above S220 includes S221~S222.

[0176] S221: etching the first specific region of the conductive layer multiple times.

[0177] In the above steps, refer to Fig. 22 The unetched portion of the conductive layer 50' forms a plurality of initial leads 51'. The etching sequence of the multiple etchings includes at least one of etching from one side of the conductive layer 50' to the other side, etching alternately from the middle of the conductive layer 50' to both sides, and etching alternately from both sides to the middle of the conductive layer 50'.

[0178] The initial leads 51 ′ include a lead area 511 and a spacer area 512 . The lead area 511 and the spacer area 512 extend along the second direction Y and are arranged in a staggered manner in the first direction X.

[0179] For example, in combination Fig.15 and Fig. 22 , the boundary of a portion of the initial leads 51' along the second direction Y is the boundary of the first lead group 510 to be formed along the second direction Y; the boundary of another portion of the initial leads 51' along the second direction Y is the boundary of the second lead group 520 formed by the plurality of second leads 52 between the adjacent first lead groups 510 along the second direction Y. The first specific area is the area between the first lead group 510 and the second lead group 520.

[0180] It should be noted that the etching sequence of the multiple etchings here can refer to the above, and the embodiments of the present disclosure will not be described in detail here.

[0181] S222: Etching a second specific region of each initial lead.

[0182] In the above steps, refer to Fig. 22 The unetched portion of the initial lead 51' (lead region 511) forms a plurality of leads 50 (see Fig.15 ).

[0183] The first specific area and the second specific area can be etched according to actual conditions. The first specific area and the second specific area are all areas that need to be etched.

[0184] For example, see Fig.15 and Fig. 22 The first specific area is the area between the first lead group 510 and the second lead group 520 , and the second specific area is the spacing area 512 between the first lead group 510 and the second lead group 520 .

[0185] Exemplarily, along the first direction X, from the first side to the second side of the conductive layer 50 ′, the multiple etchings are sequentially 1st to Nth etchings. The first side and the second side are two opposite sides of the conductive layer 50 ′ in the first direction X.

[0186] At this time, the first specific area may be, for example, an area etched an odd number of times, and the second specific area may be, for example, an area etched an even number of times. Alternatively, the first specific area may be, for example, an area etched an odd number of times, and the second specific area may be, for example, an area etched an even number of times, which is not specifically limited in the embodiments of the present disclosure.

[0187] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0188] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wiring substrate, characterized in that: include: A substrate having a first surface and a second surface disposed opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one side surface of the plurality of side surfaces being a selected side surface; A plurality of electrodes are arranged on the first surface of the substrate at intervals along a first direction; and / or, arranged at intervals on the second surface of the substrate along the first direction; A plurality of leads are arranged at intervals along the first direction; each lead comprises a first routing segment, a second routing segment and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one of the electrodes is overlapped with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

2. The wiring substrate according to claim 1, wherein: The plurality of electrodes include: A plurality of first electrodes are arranged at intervals on the first surface of the substrate along the first direction; A plurality of second electrodes are arranged at intervals along the first direction on the second surface of the substrate and correspond one-to-one to the plurality of first electrodes; at least one of the first electrodes and the corresponding second electrode are connected through at least two of the first leads.

3. The wiring substrate according to claim 2, wherein: The orthographic projection of any one of the first electrodes on the substrate at least partially overlaps with the orthographic projection of the corresponding second electrode on the substrate; The substrate includes a first substrate and a second substrate, the first substrate and the second substrate are relatively fixedly arranged; the first electrode is arranged on a surface of the first substrate away from the second substrate, and the second electrode is arranged on a surface of the second substrate close to or away from the first substrate.

4. The wiring substrate according to claim 2, wherein: The first electrode and the second electrode connected to the same first lead wire form an electrode pair. Any electrode pair is connected by a first lead wire group. Each first lead wire group includes at least two first lead wires.

5. The wiring substrate according to claim 4, characterized in that A ratio of a width of the first lead group along the first direction to a width of the electrode pair along the first direction is greater than or equal to 1 and less than or equal to 1.

8.

6. The wiring substrate according to claim 4, characterized in that Different first lead groups include the same number of first lead lines.

7. The wiring substrate according to claim 4, characterized in that: The number of first leads included in any one of the first lead groups is positively correlated with the width of the electrode pair connected thereto along the first direction.

8. The wiring substrate according to claim 4, characterized in that: The widths of the first leads in all the first lead groups along the first direction are the same; and / or the intervals between two adjacent first lead lines in all the first lead groups are the same.

9. The wiring substrate according to claim 4, characterized in that: In each of the first lead groups, a distance between any two adjacent first lead lines along the first direction is less than or equal to a width of any first lead line along the first direction.

10. The wiring substrate according to any one of claims 1 to 9, wherein: The distance between any two adjacent lead lines along the first direction is the same; and / or the width of any two lead lines along the first direction is the same.

11. The wiring substrate according to any one of claims 1 to 9, wherein: The distance between any two adjacent lead lines along the first direction is less than or equal to the width of any one lead line along the first direction.

12. A display device, characterized in that: include: The wiring substrate according to any one of claims 1 to 11; An electronic component is disposed on a first surface of a substrate of the wiring substrate; A driving circuit board is connected to the wiring substrate.

13. A method for preparing a wiring substrate, characterized in that: For preparing a wiring substrate according to any one of claims 1 to 11, the preparation method comprising: A substrate is provided; the substrate has a first surface and a second surface arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface; the first surface of the substrate includes a plurality of electrodes arranged at intervals along a first direction, and / or the second surface of the substrate includes a plurality of electrodes arranged at intervals along the first direction; A plurality of leads are formed; the plurality of leads are arranged at intervals along the first direction; each lead comprises a first routing segment, a second routing segment and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one of the electrodes is overlapped with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

14. The preparation method according to claim 13, characterized in that: The forming of a plurality of leads comprises: forming a conductive layer; the conductive layer covers selected side surfaces of the substrate and extends to the first surface and the second surface; Specific areas of the conductive layer are etched multiple times; unetched portions of the conductive layer form the multiple leads.

15. The preparation method according to claim 14, characterized in that: The etching of the specific area of ​​the conductive layer multiple times includes: Etching the first specific area of ​​the conductive layer multiple times; the unetched portion of the conductive layer forms a plurality of initial leads; The second specific region of each of the initial leads is etched; and the unetched portion of the initial leads forms a plurality of leads.

16. The preparation method according to claim 14 or 15, characterized in that: The etching sequence of the multiple etchings includes at least one of sequentially etching from one side to the other side of the conductive layer, alternately etching from the middle to both sides of the conductive layer, and alternately etching from both sides to the middle of the conductive layer.

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