Repair method of display module, display module and display device

Abstract

The invention provides a display module repairing method, a display module and a display device.The repairing method comprises the steps that a first packaging body around a bad lamp bead in the display module is removed, a gap is formed after the bad lamp bead is replaced with a new lamp bead, the display module comprises a lamp panel and a lamp bead arranged on one side of the lamp panel, and the lamp bead is arranged on the other side of the lamp panel; a first packaging body is packaged on the surface of the lamp bead; and packaging the ultraviolet light curing glue at the position of the gap for two times in sequence, and forming a second packaging body flush with the first packaging body after the ultraviolet light curing glue is cured. According to the repair method provided by the invention, high-efficiency and high-yield repair of the dead pixels in the display module after integrated packaging can be realized.

Description

Technical Field

[0001] The present application relates to the technical field of display modules, and in particular to a display module repair method, a display module and a display device. Background Art

[0002] With the advent of the optical display era, the emergence of MIP (Molded Interconnect Package) packaging technology has greatly promoted the development of Micro LED technology in the field of large-screen display. First of all, in terms of display effect, MIP packaging technology ensures that LED lamp beads have excellent performance in brightness, color consistency and contrast at different viewing angles through light splitting and light mixing. Secondly, in terms of adaptability, a mature MIP device can match the production of a variety of dot pitch products. Finally, in terms of cost, based on the previously mature SMT (Surface Mount Technology) technology, MIP packaging technology is compatible with SMT production equipment and has low transfer costs. Overall, MIP packaging technology still has a broader market and prospects for further development and application. Although MIP packaging technology has many advantages, display modules integrated and packaged using MIP packaging technology will inevitably have problems such as dead lights and other bad points after packaging. At this time, how to repair bad points has become a difficult problem in the industry. Summary of the invention

[0003] Based on this, the present application provides a display module repair method, a display module and a display device, which can realize high-efficiency and high-yield repair of bad pixels in the integrated packaged display module.

[0004] A first aspect of the present application provides a method for repairing a display module, comprising:

[0005] Removing the first packaging body around the bad lamp bead in the display module, and replacing the bad lamp bead with a new lamp bead to form a gap, wherein the display module includes a lamp board and lamp beads arranged on one side of the lamp board, and the surface of the lamp bead is packaged with the first packaging body;

[0006] The UV curing glue is packaged twice at the position of the notch, and then twice, and a second packaging body flush with the first packaging body is formed after curing.

[0007] In some embodiments of the present application, the UV-curable glue comprises the following raw materials by mass percentage: bisphenol A epoxy methacrylate, 40% to 65%; methacrylate, 10% to 40%; vinyl pyrrolidone, 10% to 30%; hydroxyalkyl methacrylate, 10% to 35%; photoinitiator, 1% to 8%;

[0008] Optionally, the hydroxyalkyl methacrylate comprises hydroxyethyl methacrylate;

[0009] Optionally, the photoinitiator comprises 2,2-dimethoxy-2-phenylacetophenone.

[0010] In some embodiments of the present application, the step of encapsulating the UV-curable glue twice at the position of the notch, first and second, comprises:

[0011] Add the UV-curable glue to the notch to a height of 3 / 4 to 5 / 6 of the notch, and perform a first curing treatment on the UV-curable glue;

[0012] On the basis of the first curing process, continue to add the UV-curable glue to the gap until the UV-curable glue overflows the gap;

[0013] The ultraviolet light curing glue overflowing from the notch is subjected to surface flattening treatment and semi-curing treatment.

[0014] In some embodiments of the present application, the conditions of the first curing treatment are: irradiation with ultraviolet light with a wavelength of 365nm~400nm for 6s~20s.

[0015] In some embodiments of the present application, the surface planarization treatment includes:

[0016] A release film and a support plate are sequentially stacked on the surface of the UV-curable glue overflowing from the notch, and pressure is applied, wherein the release film is in direct contact with the UV-curable glue.

[0017] In some embodiments of the present application, the semi-curing treatment is performed under the following conditions: irradiation with ultraviolet light having a wavelength of 365 nm to 400 nm for 3 s to 10 s.

[0018] In some embodiments of the present application, after the semi-curing treatment, the method further includes: removing the release film and the support plate, and performing a second curing treatment on the basis of the semi-curing treatment;

[0019] Optionally, the second curing treatment is performed under the following conditions: irradiating with ultraviolet light having a wavelength of 365 nm to 400 nm for 3 s to 10 s.

[0020] In some embodiments of the present application, the first encapsulation body includes epoxy resin.

[0021] A second aspect of the present application provides a display module, which is repaired using the display module repair method described in the first aspect of the present application.

[0022] A third aspect of the present application provides a display device, comprising the display module described in the second aspect of the present application.

[0023] The display module rework method provided in the present application uses UV-curing glue in combination with two packaging operations, one first and one second, to package the gap after replacing the new lamp bead. Among them, the UV-curing glue has good fluidity, and it can fill the gap very quickly and solidify very quickly after entering the gap. At the same time, the second package body after solidification still has a high light transmittance (equivalent to the light transmittance of the first package body), as well as excellent chemical resistance and stability; combined with two packaging operations, while the gap is completely filled and packaged, it can also form a flat packaging surface flush with the first package body, so that the polishing process can be omitted, and the problems of dark lights and color cast of the display module caused by polishing can be reduced, so that the supplementary light position can play a normal display effect, and improve the rework efficiency and repair yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG. 1 is a schematic flow chart of a method for repairing a display module according to an embodiment of the present application.

[0025] FIG. 2 is a schematic diagram of the display module after repair in Example 1. FIG.

[0026] FIG. 3 is a schematic diagram of the display module after repair in Example 1. FIG.

[0027] Figure 4 This is a schematic diagram of the display module of comparative example 1 after repair.

[0028] FIG. 5 is a schematic diagram of the display module of Comparative Example 1 after repair.

[0029] FIG. 6 is a schematic diagram of the display module after repair in Example 2. FIG.

[0030] Reference numerals: 1 lamp board; 2 lamp beads; 3 first packaging body; 4 notch; 4' second packaging body; 11 release film; 12 support plate. DETAILED DESCRIPTION

[0031] In order to facilitate understanding of the present application, the present application will be described more comprehensively below. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0032] For simplicity, this application only explicitly discloses some numerical ranges. However, any lower limit can be combined with any upper limit to form an unclearly recorded range; and any lower limit can be combined with other lower limits to form an unclearly recorded range, and any upper limit can be combined with any other upper limit to form an unclearly recorded range. In addition, although not clearly recorded, each point or single value between the range endpoints is included in the range. Thus, each point or single value can be combined with any other point or single value as its own lower limit or upper limit or with other lower limits or upper limits to form an unclearly recorded range.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. It should be noted that, unless otherwise specified, the term "and / or" used herein includes any and all combinations of one or more related listed items, and "above" and "below" are inclusive of the number, and the meaning of "multiple" in "one or more" is more than two.

[0034] Herein, when it comes to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values ​​within the numerical interval is considered to be continuous and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical interval, and each numerical value between the two numerical endpoints. Unless otherwise specified, when a numerical interval only refers to integers within the numerical interval, including the two endpoint integers of the numerical range, and each integer between the two endpoints, is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all sub-ranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. "Numerical interval" allows broadly including numerical interval types such as percentage intervals, ratio intervals, and ratio intervals.

[0035] In this article, if there are multiple steps involved in the method flow, unless there is a clear different description in this article, there is no strict order restriction for the execution of these steps, and they can be executed in other orders than described. Moreover, any step can include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn, alternating or simultaneously with other steps or parts of sub-steps or stages of other steps.

[0036] The above application content of the present application is not intended to describe each disclosed embodiment or each implementation in the present application. The following description more specifically illustrates exemplary embodiments. In many places throughout the application, guidance is provided by a series of examples, which can be used in various combinations. In each example, enumeration is only used as a representative group and should not be interpreted as exhaustive.

[0037] At present, in order to solve the problem of dead lights and other bad points in integrated packaged display modules after packaging, the traditional single-point repair method is usually to directly add epoxy resin glue after digging out the glue at the bad point to fill the light, and then polish it after the epoxy resin is cured to make the overall surface of the display module smooth. However, polishing can easily cause pits and polishing marks to appear at the position of the fill light of the display module, and polishing marks and pits can easily lead to problems such as dark lights and color cast, affecting the appearance of the display module and the final display effect, resulting in low repair efficiency and yield. In order to solve this technical problem, the inventor proposed the following technical solution of this application.

[0038] In a first aspect, the present application provides a method for repairing a display module, which may include the following steps S1-S2:

[0039] S1: removing a first packaging body around a bad lamp bead in a display module, and replacing the bad lamp bead with a new lamp bead to form a gap, wherein the display module comprises a lamp board and lamp beads arranged on one side of the lamp board, and the surface of the lamp bead is packaged with the first packaging body;

[0040] S2: encapsulating the position of the notch with UV-curable glue twice, first and second, to form a second encapsulation body flush with the first encapsulation body after curing.

[0041] The display module rework method provided in the present application uses UV-curing glue in combination with two packaging operations, one first and one second, to package the gap after replacing the new lamp bead. Among them, the UV-curing glue has good fluidity, and it can fill the gap very quickly and solidify very quickly after entering the gap. At the same time, the second package body after solidification still has a high light transmittance (equivalent to the light transmittance of the first package body), as well as excellent chemical resistance and stability; combined with two packaging operations, while the gap is completely filled and packaged, it can also form a flat packaging surface flush with the first package body, so that the polishing process can be omitted, and the problems of dark lights and color cast of the display module caused by polishing can be reduced, so that the supplementary light position can play a normal display effect, and improve the rework efficiency and repair yield.

[0042] In some embodiments, the UV-curable glue includes the following raw materials by mass percentage: bisphenol A epoxy methacrylate, 40% to 65%; methacrylate, 10% to 40%; vinyl pyrrolidone, 10% to 30%; hydroxyalkyl methacrylate, 10% to 35%; photoinitiator, 1% to 8%.

[0043] The UV light-curing glue provided in the present application uses bisphenol A epoxy methacrylate as the main matrix material and is combined with the other components mentioned above to enable the glue to have the characteristics of rapid light curing and excellent adhesion, mechanical properties, chemical resistance and light transmittance. When the glue is used as a packaging material and combined with the packaging operation described in the present application, a smooth packaging surface can be naturally formed at the notch without the need for surface polishing and other processes, thereby reducing the phenomenon of polishing marks and pits that are prone to cause dark light and color cast problems, thereby improving the rework efficiency and repair yield.

[0044] In addition, the UV-curable glue of the present application uses bisphenol A epoxy methacrylate as the main matrix material. The package formed after curing has good light aging resistance and yellowing resistance, excellent environmental reliability, and has high chemical stability even when exposed to outdoor environment for a long time, so that the display module can be used in outdoor environment. If bisphenol A epoxy methacrylate is replaced with epoxy acrylate, the package formed after curing has poor light aging resistance and yellowing resistance, and the display module is difficult to achieve reliable application in outdoor environment.

[0045] It is understood that the “hydroxyalkyl methacrylate” mentioned in the present application refers to methacrylate in which the ester portion contains a hydroxyalkyl group (-ROH, R is an alkyl group).

[0046] In some embodiments, the hydroxyalkyl methacrylate includes hydroxyethyl methacrylate, which is beneficial for improving the adhesion of acrylic resin.

[0047] In some embodiments, the photoinitiator comprises a free radical polymerization photoinitiator.

[0048] In some embodiments, the photoinitiator includes 2,2-dimethoxy-2-phenylacetophenone. This photoinitiator has good solubility and reactivity in organic solvents, good stability and high initiation efficiency, can initiate polymerization at a lower concentration, thereby improving the curing efficiency of the material; and has high intersystem crossing efficiency, is non-toxic and odorless, and meets environmental protection requirements.

[0049] In some embodiments, removing the first package around the defective lamp bead in the display module may include the following step S10: heating the first package around the defective lamp bead and removing the first package after it softens. Optionally, the heating temperature is 350°C to 400°C.

[0050] In some embodiments, encapsulating the UV-curable glue twice at the position of the notch, first and second, may include the following steps S20-S22:

[0051] S20: adding the UV-curable glue to the notch to a height of 3 / 4 to 5 / 6 of the notch, and performing a first curing treatment on the UV-curable glue;

[0052] S21: continuing to add the UV-curable glue to the gap on the basis of the first curing process, until the UV-curable glue overflows the gap;

[0053] S22: performing surface planarization and semi-curing treatment on the UV-curing glue overflowing from the notch.

[0054] The UV-curable glue used in this application cures very quickly and has strong shrinkage, which can easily cause obvious pits to appear on the flat surface due to shrinkage. Based on this, the above steps S20~S22 are performed twice when encapsulating the notch, and are combined with surface flattening treatment, so that the final package body has a flat surface. Specifically, after adding UV-curable glue to 3 / 4~5 / 6 of the notch height for the first time and performing a curing treatment, pits will appear on the surface of the package body formed by the UV-curable glue; the second time, UV-curable glue is added to the notch to perform a glue repair treatment. Since the amount of glue used for the glue repair is much less than the amount of glue used for the first encapsulation, and the UV-curable glue overflowing the notch is subjected to a surface flattening treatment, the surface of the package body finally formed at the notch can be flat.

[0055] It can be understood that the "notch height" mentioned in the present application refers to the height from the highest point of the notch to the surface of the lamp board on which the lamp beads are provided; wherein the surface on which the lamp beads are provided refers to the surface of the lamp board on which the lamp beads are installed (i.e., the lamp bead installation surface).

[0056] In some embodiments, the first curing treatment is performed under the condition of: irradiating with ultraviolet light having a wavelength of 365 nm to 400 nm for 6 s to 20 s. Thus, the first curing treatment can completely cure the ultraviolet light-curable glue and cure it into a second package.

[0057] In some embodiments, the semi-curing treatment is performed under the condition of: irradiating with ultraviolet light having a wavelength of 365 nm to 400 nm for 3 seconds to 10 seconds. The semi-curing treatment is conducive to removing the residual ultraviolet light-cured glue overflowing from the notch after the planarization treatment.

[0058] In some embodiments, the surface flattening treatment includes: laminating a release film and a support plate in sequence on the surface of the UV-curable glue overflowing from the notch, and applying pressure, wherein the release film is in direct contact with the UV-curable glue. The UV-curable glue overflowing from the notch is pressed by the support plate and the release film, so that the surface of the package finally formed at the notch is flat.

[0059] In some embodiments, after the semi-curing treatment, step S23 may be further included: removing the release film and the support plate, and performing a second curing treatment on the basis of the semi-curing treatment.

[0060] In some embodiments, in step S23, after removing the release film and the support plate and before the second curing process, a step of removing the residual glue at the overflow gap is also included. Specifically, alcohol can be dripped on the glue filling area to wipe off the residual glue overflowed due to pressing.

[0061] In some embodiments, the support plate may be a glass sheet.

[0062] Optionally, the second curing treatment is performed under the condition of: irradiating with ultraviolet light having a wavelength of 365 nm to 400 nm for 3 s to 10 s. In this way, the second curing treatment can completely cure the semi-cured ultraviolet curing glue and cure it into a second package.

[0063] In some embodiments, the first encapsulant includes epoxy resin.

[0064] As a non-limiting example, referring to FIG. 1 , the display module repair method provided in the present application includes the following steps, wherein the display module includes a lamp board and lamp beads arranged on one side of the lamp board, and the surface of the lamp beads is encapsulated with the first encapsulation body:

[0065] S10': Use a hot air gun to heat at 350°C-400°C to remove the first packaging body 3 around the defective lamp bead, dig out the defective lamp bead and replace it with a new one, and finally form a gap 4.

[0066] S20': adding ultraviolet curing glue to the gap 4 in an amount of 3 / 4 to 5 / 6 of the gap height, and irradiating with ultraviolet light with a wavelength of 365nm to 400nm for 6 to 20 seconds to completely cure it, thereby forming a second packaging body 4'.

[0067] S30': Continue to add UV-curing glue to the cured glue to perform glue repair until the UV-curing glue overflows the gap 4.

[0068] S40': press the release film 11 and the support plate 12 on the glue patch (i.e., the UV-curable glue overflowing from the gap) in sequence, press the support plate hard to ensure its flatness, and irradiate with a UV lamp with a wavelength of 365nm-400nm for 3-10 seconds for semi-curing.

[0069] S50': After removing the release film and the support plate, drip alcohol on the glue patch to wipe off the residual glue overflowed by pressing around, and then continue to irradiate the glue patch with a UV lamp with a wavelength of 365nm~400nm for 3~10 seconds to completely cure it, forming a second packaging body 4'.

[0070] In a second aspect, the present application provides a display module, which is repaired using the display module repair method described in the first aspect of the present application.

[0071] The display module of the second aspect of the present application solves the problems of dark light and color cast easily caused by grinding marks and pits, improves the appearance of the display module and the final display effect, improves the rework efficiency and yield, and facilitates large-scale rework mass production.

[0072] In a third aspect, the present application provides a display device, comprising the display module described in the second aspect of the present application.

[0073] Example

[0074] The following are specific examples, which more specifically describe the contents disclosed in this application, and these examples are only for illustrative purposes, because it is obvious to those skilled in the art that various modifications and variations are made within the scope of the disclosure of this application. Unless otherwise stated, all parts, percentages, and ratios reported in the following examples are based on weight, and all reagents used in the examples are commercially available or synthesized according to conventional methods and can be used directly without further processing, and the instruments used in the examples are commercially available.

[0075] Example 1

[0076] (1) Use a hot air gun to heat at 350°C to remove the first packaging body (i.e. epoxy resin) around the defective lamp bead, dig out the defective lamp bead and replace it with a new one, which will eventually form a gap.

[0077] (2) Add UV-curable glue to the notch in an amount equal to 3 / 4 of the notch height, and irradiate with UV light with a wavelength of 365 nm for 20 seconds to completely cure it, thereby forming a second package.

[0078] Among them, the UV-curing glue includes the following raw materials in percentage by mass: bisphenol A epoxy methacrylate, 54%; methacrylate, 15%; vinyl pyrrolidone, 16%; hydroxyethyl methacrylate, 10%; 2,2-dimethoxy-2-phenylacetophenone, 5%.

[0079] (3) Continue to add UV-curing glue to the cured glue to fill the gap until the UV-curing glue overflows the gap.

[0080] (4) Press the release film and glass sheet on the glue patch (i.e., the UV-curing glue that overflows the gap) in turn, press the glass sheet hard to ensure its flatness, and irradiate it with a UV lamp with a wavelength of 365nm for 10 seconds for semi-curing.

[0081] (5) After removing the release film and glass sheet, drop some alcohol on the glue patch to wipe off the residual glue that overflowed due to pressing. Then continue to irradiate the glue patch with a UV lamp with a wavelength of 365nm for 10 seconds to completely cure it to form a second package.

[0082] Example 2

[0083] The process is similar to that of Example 1, with the main difference being that bisphenol A epoxy methacrylate is replaced with methacrylate of the same mass percentage in the raw materials of the UV-curing glue.

[0084] (1) Use a hot air gun to heat at 350°C to remove the first packaging body (i.e. epoxy resin) around the defective lamp bead, dig out the defective lamp bead and replace it with a new one, which will eventually form a gap.

[0085] (2) Add liquid epoxy resin to the notch, and polish it after curing so that the cured epoxy resin encapsulation body is flush with the first encapsulation body.

[0086] The display modules of Examples 1-2 and Comparative Example 1 after repair were subjected to high temperature and high humidity tests and high and low temperature impact tests respectively. The test conditions were: after being stored at 85°C and 85%RH (relative humidity) for 168 hours, the high and low temperature impact cycles were performed 100 times (storing at -40°C for 30 minutes, and then transferring to 85°C for 30 minutes as one cycle). The display modules after the test were subjected to brightness tests using a Minolta CA-410 brightness meter (data obtained under white light). The results are shown in Table 1 below, where the luminous intensity of the pixel = brightness * module spacing.

[0087] Table 1

[0088]

[0089] From Table 1 and Figure 3, it can be seen that the display module in Example 1, the luminous intensity of the repaired point remains normal after lighting, and is consistent with the luminous intensity of the unrepaired point; and from Figure 2, it can be seen that the UV curing glue at the repaired point does not separate from the surrounding epoxy resin, peeling, and other undesirable phenomena. Figure 4 It can be seen that in the display module of comparative example 1, the repair point has obvious grinding marks after rework, and it can be seen from Figure 5 that the lamp beads have obvious color cast after rework (the part circled in red in the figure), and the luminous intensity of the repair point is significantly lower than that of the unrepaired point. As can be seen from Table 1 and Figure 6, after the UV light curing glue of Example 2 uses acrylate instead of bisphenol A epoxy methacrylate, the brightness of the repair point after rework is significantly higher (the part circled in red in the figure), which is quite different from the overall light transmittance of the display module, making it difficult to maintain the overall light intensity consistent; and the surface hardness of the package formed after curing is relatively low, and it is easy to be scratched and worn. The above shows that the rework method of the present application can effectively reduce the phenomenon of grinding marks and pits that are prone to cause dark lights and color cast problems, and improve the rework efficiency and repair yield.

[0090] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A method for repairing a display module, characterized in that: include: Removing the first packaging body around the bad lamp bead in the display module, and replacing the bad lamp bead with a new lamp bead to form a gap, wherein the display module includes a lamp board and lamp beads arranged on one side of the lamp board, and the surface of the lamp bead is packaged with the first packaging body; The UV curing glue is packaged twice at the position of the notch, and then twice, and a second packaging body flush with the first packaging body is formed after curing.

2. The repair method according to claim 1, characterized in that: The UV curing glue comprises the following raw materials by mass percentage: bisphenol A epoxy methacrylate, 40% to 65%; methacrylate, 10% to 40%; vinyl pyrrolidone, 10% to 30%; hydroxyalkyl methacrylate, 10% to 35%; photoinitiator, 1% to 8%; Optionally, the hydroxyalkyl methacrylate comprises hydroxyethyl methacrylate; Optionally, the photoinitiator comprises 2,2-dimethoxy-2-phenylacetophenone.

3. The repair method according to claim 1 or 2, characterized in that: The method of encapsulating the UV-curing glue twice at the position of the notch, first and second, comprises: Add the UV-curable glue to the notch to a height of 3 / 4 to 5 / 6 of the notch, and perform a first curing treatment on the UV-curable glue; On the basis of the first curing process, continue to add the UV-curable glue to the gap until the UV-curable glue overflows the gap; The ultraviolet light curing glue overflowing from the notch is subjected to surface flattening treatment and semi-curing treatment.

4. The repair method according to claim 3, characterized in that: The conditions of the first curing treatment are: irradiation with ultraviolet light having a wavelength of 365nm-400nm for 6s-20s.

5. The repair method according to claim 3, characterized in that: The surface flattening treatment comprises: A release film and a support plate are sequentially stacked on the surface of the UV-curable glue overflowing from the notch, and pressure is applied, wherein the release film is in direct contact with the UV-curable glue.

6. The repair method according to claim 3, characterized in that: The semi-curing treatment conditions are: irradiation with ultraviolet light having a wavelength of 365nm-400nm for 3s-10s.

7. The repair method according to claim 5, characterized in that: After the semi-curing treatment, the method further includes: removing the release film and the support plate, and performing a second curing treatment on the basis of the semi-curing treatment; Optionally, the second curing treatment is performed under the following conditions: irradiating with ultraviolet light having a wavelength of 365 nm to 400 nm for 3 s to 10 s.

8. The repair method according to claim 1 or 2, characterized in that: The first encapsulation body includes epoxy resin.

9. A display module, characterized in that: The display module is repaired by the display module repair method according to any one of claims 1 to 8.

10. A display device, characterized in that: Comprising the display module described in claim 9.

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