Display device, electronic device, and method for manufacturing display device

Abstract

A display device, an electronic device, and a method for manufacturing the display device are provided. The display device includes a display panel including a display area and a non-display area at least partially surrounding the display area. The input sensor is disposed on the display panel and includes a sensing electrode configured to detect an electromagnetic induction current. The display panel includes: a base layer including a plurality of resin layers; a plurality of pixels disposed on the base layer and overlapping the display area; and a charging electrode disposed under at least one of the plurality of resin layers and overlapping the display area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0111711 filed on August 25, 2023, which is hereby incorporated by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device, an electronic device, and a method for manufacturing the display device, and more particularly, to a display device including an input sensor, an electronic device, and a method for manufacturing the display device. Background Art

[0004] Various types of display devices have been developed for multimedia devices such as mobile phones, tablet computers, navigation systems, and portable game consoles. Input devices for display devices include keyboards or mice. In addition, the display device is provided with an input sensor as an input device.

[0005] The input sensor may detect user input through a capacitive mode (eg, a self-capacitive mode). The input sensor may also detect input from a stylus pen through electromagnetic induction. Summary of the invention

[0006] The display device includes a display panel including a display area and a non-display area at least partially surrounding the display area. The input sensor is arranged on the display panel and includes a sensing electrode for detecting an electromagnetic induction current. The display panel includes: a base layer including a plurality of resin layers; a plurality of pixels arranged on the base layer and overlapping the display area; and a charging electrode arranged under at least one resin layer of the plurality of resin layers and overlapping the display area. The plurality of resin layers include: a first resin layer; and a second resin layer arranged on the first resin layer.

[0007] The charging electrode may be disposed on the first resin layer, and may be covered by the second resin layer.

[0008] The display panel may further include a shielding pattern disposed on the second resin layer and overlapping the charging electrode.

[0009] The display panel may further include a connection line connected to the charging electrode through a contact hole penetrating the second resin layer and including the same material as that included in the shielding pattern.

[0010] The base layer may further include a third resin layer disposed under the first resin layer. The charging electrode may be disposed on the third resin layer and may be covered by the first resin layer.

[0011] The display device may further include a flexible circuit board, at least a portion of which is disposed below the display panel. The charging electrode may be electrically connected to the flexible circuit board through a contact hole defined in the third resin layer.

[0012] The display panel may further include an encapsulation layer disposed on the base layer and covering the plurality of pixels. The input sensor may be directly disposed on the encapsulation layer.

[0013] The plurality of pixels may each include a light emitting element and at least one transistor connected to the light emitting element. The charging electrode may overlap at least a portion of the light emitting element.

[0014] The charging electrode may define a current path that receives a constant voltage and generates a magnetic field from the constant voltage.

[0015] The charging electrode may include a plurality of unit charging electrodes extending in a first direction and spaced apart from each other in a second direction crossing the first direction.

[0016] The charging electrode may include molybdenum, silver, titanium, copper, aluminum and / or alloys thereof.

[0017] The charging electrode may have a thickness of about 0.1 μm to about 1 μm.

[0018] At least a portion of the charging electrode may include a conductive line having a grid shape. The conductive line may be patterned to correspond to at least some of the plurality of pixels.

[0019] The sensing electrode may have a thickness of about 0.1 μm to about 1 μm.

[0020] The sensing electrode may have a line resistance of about 100Ω or less.

[0021] At least a portion of the sensing electrode may have a mesh shape.

[0022] The sensing electrodes may include: a first group of first electrodes extending in a first direction; a first group of second electrodes extending in a second direction intersecting the first direction and capacitively coupled to the first group of first electrodes; a second group of first electrodes extending in the first direction and configured to detect electromagnetically induced current; and a second group of second electrodes extending in the second direction and configured to detect electromagnetically induced current. The input sensor may further include: a first group of first signal lines connected to one end of the first group of first electrodes; a first group of second signal lines connected to one end of the first group of second electrodes; a second group of first signal lines connected to one end of the second group of first electrodes; and a second group of second signal lines connected to one end of the second group of second electrodes.

[0023] The first group of first electrodes may include: a 1-1 extension portion extending in the first direction; a 1-2 extension portion extending in the first direction and spaced apart from the 1-1 extension portion in the second direction; and a first intermediate portion disposed between one end of the 1-1 extension portion and one end of the 1-2 extension portion. The second group of first electrodes may be disposed between the 1-1 extension portion and the 1-2 extension portion.

[0024] The first group of second electrodes may include: a 2-1 extension portion extending in the second direction; a 2-2 extension portion extending in the second direction and spaced apart from the 2-1 extension portion in the first direction; and a second intermediate portion disposed between one end of the 2-1 extension portion and one end of the 2-2 extension portion. The second group of second electrodes may be disposed between the 2-1 extension portion and the 2-2 extension portion.

[0025] The electronic device includes: a housing; an electronic module disposed in the housing; and a display device overlapping the electronic module. The display device includes: a display panel including a display area and a non-display area at least partially surrounding the display area; and an input sensor disposed on the display panel and configured to detect a resonant signal transmitted from a stylus including a resonant circuit. The display panel includes: a base layer including a plurality of resin layers; a plurality of pixels disposed on the base layer and overlapping the display area; and a charging electrode to charge the stylus. The plurality of resin layers include a first resin layer; and a second resin layer disposed on the first resin layer, and the charging electrode is disposed below the second resin layer.

[0026] A method for manufacturing a display device includes: providing a display panel including a display area and a non-display area at least partially surrounding the display area; and forming an input sensor including a sensing electrode on the display panel. Providing the display panel includes: providing a substrate including a charging electrode and a plurality of resin layers; and forming a plurality of pixels on the substrate to overlap the display area. Providing the substrate includes: providing a lower resin layer; patterning a metal material on the lower resin layer to form a charging electrode; and forming an upper resin layer covering the charging electrode.

[0027] The providing of the substrate may further include forming a contact hole in the lower resin layer or the upper resin layer to electrically connect the charging electrode to the connection line.

[0028] The providing of the display panel may further include forming an encapsulation layer covering the plurality of pixels. The input sensor may be formed on the encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the inventive concept and together with the description are used to explain the principles of the inventive concept. In the accompanying drawings:

[0030] Figures 1A to 1C is a perspective view of an electronic device according to an embodiment of the inventive concept;

[0031] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the inventive concept;

[0032] Figure 3 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0033] Figure 4 is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0034] Figure 5 is a plan view of a display panel according to an embodiment of the inventive concept;

[0035] Figure 6 is an enlarged cross-sectional view of a display module according to an embodiment of the inventive concept;

[0036] Fig. 7A and Figure 7B Each is a cross-sectional view showing a portion of a display module according to an embodiment of the inventive concept;

[0037] Figure 8 is a plan view of a charging electrode included in a display panel according to an embodiment of the inventive concept;

[0038] 9A to 9C is a plan view illustrating a charging section among operation sections of a charging electrode included in a display panel according to an embodiment of the inventive concept;

[0039] Fig.10 is a plan view of an input sensor according to an embodiment of the inventive concept;

[0040] Fig.11 is an enlarged plan view of a portion of an input sensor according to an embodiment of the inventive concept;

[0041] Fig.12 and Fig.13 Each is a cross-sectional view showing a portion of an input sensor according to an embodiment of the inventive concept;

[0042] Fig.14 is an enlarged plan view of a portion of an input sensor according to an embodiment of the inventive concept;

[0043] Fig.15 is a plan view illustrating a first operation section of an electrode included in an input sensor according to an embodiment of the present inventive concept;

[0044] Fig.16 is a plan view illustrating a second operation section of an electrode included in an input sensor according to an embodiment of the present inventive concept;

[0045] 17A to 17C is a cross-sectional view illustrating steps in a method for manufacturing a display device according to an embodiment of the inventive concept; and

[0046] 18A to 18C are cross-sectional views illustrating steps in a method for manufacturing a display device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0047] It will be understood that when an element (or region, layer, portion, etc.) is referred to as being "on," "connected to" or "coupled to" another element, the element can be directly disposed on, directly connected to or coupled to the other element, or intervening elements can be disposed between the element and the other element.

[0048] However, in the present application, “directly disposed on” may mean that there is no additional layer, film, region, plate, etc. between a layer, film, region, plate, etc. and another layer, film, region, plate, etc. For example, “directly disposed on” may mean that two layers or two members are disposed without using an additional member such as an adhesive member disposed therebetween.

[0049] Throughout the specification and drawings, the same reference numerals may refer to the same elements. Although each of the drawings may represent one or more specific embodiments of the present disclosure and may be drawn to scale so that relative lengths, thicknesses, and angles can be inferred therefrom, it should be understood that the present disclosure is not necessarily limited to the relative lengths, thicknesses, and angles shown. For example, these values ​​may be changed in the spirit and scope of the present disclosure in view of manufacturing limitations, etc. The term "and / or" includes all combinations of one or more that the associated configuration may define.

[0050] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements are not necessarily limited by these terms. These terms are used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the teachings of the present disclosure. Singular forms are intended to also include plural forms unless the context clearly indicates otherwise.

[0051] In addition, terms such as "below", "lower", "above" or "upper" may be used to describe the relationship of components shown in the drawings. These terms are used as relative concepts and are described with reference to directions indicated in the drawings.

[0052] It should be understood that in the present disclosure, the terms "including" or "having" are intended to specify the presence of stated features, integers, steps, operations, elements, parts or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts or combinations thereof.

[0053] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0054] Figures 1A to 1C is a perspective view of an electronic device ED according to an embodiment of the inventive concept. Figure 1A shows the expanded state, and Figure 1B and Figure 1C The folded state is shown.

[0055] refer to Figures 1A to 1C According to an embodiment of the inventive concept, the electronic device ED may include a display surface DS defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1. The electronic device ED may provide an image IM to a user through the display surface DS.

[0056] The display surface DS may include a display area DA and a non-display area NDA at least partially surrounding the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display the image IM. The non-display area NDA may surround the display area DA. However, embodiments of the inventive concept are not necessarily limited thereto, and the shape of the display area DA and the shape of the non-display area NDA may be modified.

[0057] Hereinafter, a direction intersecting substantially perpendicularly with a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. The front surface and the rear surface of each member are distinguished from each other with respect to the third direction DR3. In addition, as used herein, "when viewed on a plane" or "in a plan view" may be defined as a state viewed in the third direction DR3. Hereinafter, the first direction DR1, the second direction DR2, and the third direction DR3 are directions indicated by a first direction axis, a second direction axis, and a third direction axis, respectively, and are assigned the same reference numerals as those of the first direction axis, the second direction axis, and the third direction axis.

[0058] The electronic device ED may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. In the second direction DR2, the folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2. In the current embodiment, a foldable electronic device ED is shown as an example, but embodiments of the inventive concept are not necessarily limited thereto. The electronic device ED may be bar-shaped (e.g., a rigid rectangle), rollable, or slidable.

[0059] The electronic device ED can detect input from the stylus STP and input from the user's body part FG. A finger is shown as the user's body part FG. The electronic device ED can detect input from the user's body part FG during a first mode section and detect input from the stylus STP during a second mode section by time division driving.

[0060] like Figure 1B As shown in , the folding area FA can be folded about a folding axis FX extending in a first direction DR1. The folding area FA has a predetermined curvature and a predetermined radius of curvature R1. The first non-folding area NFA1 and the second non-folding area NFA2 face each other, and the electronic device ED can be folded inwardly so that the display surface DS is folded onto itself and is not exposed to the outside.

[0061] In an embodiment of the present invention, the electronic device ED may be folded outward so that the display surface DS is folded so that the respective faces are placed back to back and the display surface DS is exposed to the outside. In an embodiment of the present invention, the electronic device ED may be configured so that the inward folding operation or the outward folding operation is repeated interactively from the unfolding operation, but the embodiment of the present invention is not necessarily limited thereto. In an embodiment of the present invention, the electronic device ED may be configured to select any one of the unfolding operation, the inward folding operation, and the outward folding operation.

[0062] like Figure 1B As shown in FIG. 1 , the distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be substantially equal to twice the radius of curvature R1, but as shown in FIG. Figure 1C As shown in FIG. 1 , the distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be less than twice the curvature radius R1 . Figure 1B and Figure 1C The display surface DS is shown, and the housing HM (see FIG. Figure 2 ) may contact at end regions of the first non-folding area NFA1 and the second non-folding area NFA2.

[0063] In the present embodiment, an electronic device ED that can be applied to a mobile phone is shown as an example. The mobile phone can be configured by connecting an electronic module, a camera module, a power module, etc. mounted on a main board to a display device DD (see Figure 2 ) are placed together in a bracket / housing to form. However, the embodiments of the present inventive concept are not necessarily limited thereto, and according to the embodiments of the present inventive concept, the electronic device ED can be used not only for large electronic devices such as televisions and monitors, but also for small and medium-sized electronic devices such as tablet terminals, car navigation systems, game consoles, and smart watches.

[0064] Figure 2 is an exploded perspective view of an electronic device ED according to an embodiment of the inventive concept.

[0065] like Figure 2 As shown in FIG. 1 , the electronic device ED may include a display device DD, an electronic module EM, a power module PSM, and a housing HM. The electronic device ED may further include a mechanical structure configured to control a folding operation of the display device DD. The adhesive layer may be used to Figure 2 The components shown in FIG.

[0066] The display device DD may generate an image and detect an external input. The display device DD may include a window WM and a display module DM. The window WM provides a front surface of the electronic device ED. The display device DD may further include an additional component between the window WM and the display module DM, or may further include an additional component below the display module DM.

[0067] The display module DM may include at least a display panel 100 . Figure 2 Only the display panel 100 among the stack structure of the display module DM is illustrated, but the display module DM may further include a plurality of components disposed on an upper side of the display panel 100. A detailed description of the stack structure of the display module DM will be provided later.

[0068] The display panel 100 is not necessarily particularly limited to the depicted arrangement, and may be, for example, a light-emitting display panel such as an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting display panel.

[0069] The display panel 100 includes display areas DA (see Figure 1A ) and non-display area NDA (see Figure 1A) corresponds to a display area 100-DA and a non-display area 100-NDA. The pixel PX is arranged in the display area 100-DA. In the non-display area 100-NDA, the pixel PX is not arranged, and a signal line for supplying a voltage to the pixel PX is arranged. As used herein, the wording "area / portion corresponds to area / portion" indicates that they overlap and are not necessarily limited to the same area.

[0070] like Figure 2 As shown in , the driving chip DIC may be disposed on the non-display area 100-NDA of the display panel 100. The flexible circuit board FCB may be bonded to the non-display area 100-NDA of the display panel 100. The flexible circuit board FCB may be connected to the main circuit board. The main circuit board may be an electronic component constituting the electronic module EM. In addition, the electronic module EM may further include a control module (e.g., an application processor), a wireless communication module, an image input module, and the like. For example, Figure 2 Unlike shown in FIG. 1 , a portion of the flexible circuit board FCB may be disposed under the display panel 100 . In the electronic device ED of the embodiment, a portion of the flexible circuit board FCB or a portion of the display module DM is bent, and thus the portion of the flexible circuit board FCB may be disposed under the display panel 100 .

[0071] The driving chip DIC may include driving elements (eg, a data driving circuit) for driving the pixels PX of the display panel 100 . Figure 2 A structure is shown in which the driving chip DIC is mounted on the display panel 100 , but embodiments of the inventive concept are not necessarily limited thereto. For example, the driving chip DIC may be mounted on a flexible circuit board FCB.

[0072] refer to Figure 2 , the electronic module EM can be arranged in each of the first shell HM1 and the second shell HM2, and the power supply module PSM can be arranged in each of the first shell HM1 and the second shell HM2. The electronic module EM arranged in the first shell HM1 and the electronic module EM arranged in the second shell HM2 can be electrically connected through a flexible circuit board. The shell HM is coupled to the display device DD (specifically, coupled to the window WM) to accommodate the above-mentioned other modules. The shell HM is shown as including a separated first shell HM1 and a second shell HM2, but is not necessarily limited to this. The electronic device ED may further include a hinge structure configured to connect the first shell HM1 and the second shell HM2.

[0073] Figure 3 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 3 is the display device DD and Figure 2 The cross-sectional view corresponding to the line II' shown in FIG.

[0074] refer to Figure 3 , the display device DD may include a window WM, a display module DM, a panel protection layer PPL, a cushion layer CSL, a first conductive sheet CTL1, a second conductive sheet CTL2, and first to fifth adhesive layers AL1 to AL5. The first to fifth adhesive layers AL1 to AL5 each combine two adjacently stacked components among the above components. The first to fifth adhesive layers AL1 to AL5 may include a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA), but the types of the first to fifth adhesive layers AL1 to AL5 are not necessarily limited thereto.

[0075] The window WM provides the outer surface of the display device DD. The window WM may include a base layer WIN, a window protection layer WP, a hard coating layer HC, and a printed layer PIT (or a black matrix layer). The base layer WIN may have optically transparent properties. The base layer WIN may include glass or a synthetic resin film. The window protection layer WP is bonded to the base layer WIN by an adhesive layer AL. The window protection layer WP may include a flexible plastic material such as polyimide or polyethylene terephthalate (PET). The hard coating layer HC may be disposed on the upper surface of the window protection layer WP.

[0076] The printing layer PIT may be disposed on the lower surface of the window protection layer WP. The printing layer PIT may be a black matrix layer. The printing layer PIT may be black, but the color of the printing layer PIT is not necessarily limited thereto. The printing layer PIT may be adjacent to the edge of the window protection layer WP. The printing layer PIT may overlap with the non-display area NDA. However, the stacking structure of the window WM is not necessarily limited to the above structure.

[0077] The panel protection layer PPL may be disposed below the display module DM. The panel protection layer PPL may protect the lower portion of the display module DM. The panel protection layer PPF may include a flexible plastic material. For example, the panel protection layer PPL may include polyethylene terephthalate (PET). In an embodiment of the inventive concept, the panel protection layer PPL may not be provided.

[0078] The cushion layer CSL is disposed under the panel protection layer PPL. The cushion layer CSL absorbs external impact. The cushion layer CSL may include foam plastic. In an embodiment of the present inventive concept, the cushion layer CSL may not be provided.

[0079] The first conductive sheet CTL1 may be disposed under the cushion layer CSL. The first conductive sheet CTL1 may include a material having high magnetic permeability. The first conductive sheet CTL1 may include a ferromagnetic substance. For example, the first conductive sheet CTL1 may include a magnetic metal powder layer. The magnetic metal powder layer may include a base resin and a magnetic metal powder mixed with the base resin. In an embodiment of the inventive concept, the first conductive sheet CTL1 may not be provided.

[0080] The second conductive sheet CTL2 may be disposed below the first conductive sheet CTL1. Figure 2 The second conductive sheet CTL2 may include a diamagnetic material to dissipate the electromagnetic waves generated by the electronic module EM to prevent the electromagnetic waves from interfering with the display module DM. The second conductive sheet CTL2 may include a diamagnetic material. In addition, the second conductive sheet CTL2 may dissipate the heat generated by the display module DM.

[0081] The second conductive sheet CTL2 may include a metal layer such as a copper layer, an aluminum layer, a gold layer, or a titanium layer. The second conductive sheet CTL2 may include a metal oxide layer such as an ITO layer or an IZO layer. The second conductive sheet CTL2 may include a carbon nanotube (e.g., a carbon nanotube coated with a conductive polymer) or graphite.

[0082] Figure 4 is a cross-sectional view of a display module DM according to an embodiment of the inventive concept. Figure 4 , the display module DM may include a display panel 100 , an input sensor 200 , and an anti-reflector 300 .

[0083] The display panel 100 may include a base layer 110, a driving element layer 120, a light emitting element layer 130, and an encapsulation layer 140. The base layer 110 may provide a base surface on which the driving element layer 120 is disposed.

[0084] The base layer 110 may be a rigid substrate or a bendable, foldable or rollable flexible substrate.

[0085] The base layer 110 has a multi-layer structure. The base layer 110 of the embodiment includes a plurality of resin layers. The base layer 110 may include a plurality of resin layers and a single-layer or multi-layer inorganic layer disposed between the plurality of resin layers. The specific structure of the base layer 110 will be described later.

[0086] The driving element layer 120 may be disposed on the base layer 110. The driving element layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The driving element layer 120 includes a reference Figure 2 The light emitting element layer 130 may be disposed on the driving element layer 120. The light emitting element layer 130 may include a reference Figure 2 The light emitting element of the pixel PX is described.

[0087] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign matter such as dust particles. The encapsulation layer 140 may include at least one inorganic layer. The encapsulation layer 140 may include a stacked structure of inorganic layer / organic layer / inorganic layer.

[0088] The input sensor 200 may be disposed on the display panel 100. The input sensor 200 may detect Figure 1A The input from the stylus STP and the input from the user's body part (e.g., finger) FG shown in FIG. The input sensor 200 may be formed on the display panel 100 by a roll-to-roll process. In this case, the input sensor 200 may be directly disposed on the display panel 100. The input sensor 200 may be directly disposed on the encapsulation layer 140. As used herein, "component B is directly disposed on component A" indicates that an adhesive layer is not disposed between component A and component B.

[0089] The anti-reflector 300 may be disposed on the input sensor 200. The anti-reflector 300 may reduce reflectivity of external light. The anti-reflector 300 may be directly disposed on the input sensor 200 through a roll-to-roll process.

[0090] The anti-reflector 300 may include a color filter. The color filter has a color corresponding to the color of the source light. For example, a red color filter is disposed on a light emitting element that generates red light. The anti-reflector 300 may further include a light blocking pattern disposed between the color filters.

[0091] Figure 5 is a plan view of a display panel 100 according to an embodiment of the inventive concept.

[0092] refer to Figure 5 , the display panel 100 may include a plurality of pixels PX, a scan drive circuit SDV, a light emitting drive circuit EDV, a plurality of signal lines, and a plurality of first pads PD1. The driving chip DIC mounted on the non-display area 100-NDA may include a data drive circuit. In an embodiment of the inventive concept, the data drive circuit may also be integrated into the display panel 100, like the scan drive circuit SDV and the light emitting drive circuit EDV.

[0093] The plurality of signal lines may include a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, first and second control lines SL-C1 and SL-C2, and first and second power lines PL1 and PL2. Here, m and n are each an integer of 2 or more.

[0094] The scan lines SL1 to SLm may extend in the first direction DR1 and may be connected to the pixels PX and the scan driving circuit SDV. The data lines DL1 to DLn may extend in the second direction DR2 and may be connected to the pixels PX and the driving chip DIC. The emission lines EL1 to ELm may extend in the first direction DR1 and may be connected to the pixels PX and the emission driving circuit EDV.

[0095] The first power line PL1 receives a first power voltage, and the second power line PL2 receives a second power voltage at a level lower than that of the first power voltage. A second electrode (ie, cathode) of the light emitting element is connected to the second power line PL2.

[0096] The first control line SL-C1 may be connected to the scan driving circuit SDV and may extend toward the lower end of the display panel 100. The second control line SL-C2 may be connected to the light emitting driving circuit EDV and may extend toward the lower end of the display panel 100. The first pad PD1 may be disposed in the non-display area 100-NDA adjacent to the lower end of the display panel 100 and may be closer to the lower end of the display panel 100 than the driving chip DIC. The first pad PD1 may be connected to the driving chip DIC and some of the signal lines.

[0097] The scan driving circuit SDV may generate a plurality of scan signals, and the scan signals may be applied to the pixels PX through the scan lines SL1 to SLm. The driving chip DIC may generate a plurality of data voltages, and the data voltages may be applied to the pixels PX through the data lines DL1 to DLn. The light emitting driving circuit EDV may generate a plurality of light emitting signals, and the light emitting signals may be applied to the pixels PX through the light emitting lines EL1 to ELm.

[0098] The pixel PX may be supplied with a data voltage in response to the scan signal, and the pixel PX may display an image by emitting light having a brightness corresponding to the data voltage in response to the light emission signal.

[0099] Figure 6 is an enlarged cross-sectional view of a display module DM according to an embodiment of the inventive concept.

[0100] Figure 6 A cross section corresponding to one light emitting area LA and a non-light emitting area NLA surrounding the light emitting area LA is shown. Figure 6 A pixel PX is shown (see Figure 2 ) includes a light emitting element LD and a transistor TFT connected to the light emitting element LD. The transistor TFT may be a pixel PX (see Figure 2) is one of a plurality of transistors included in a driving circuit of a TFT. In the current embodiment, the transistor TFT is described as a silicon transistor, but alternatively, the transistor TFT may be a metal oxide transistor.

[0101] The base layer 110 has a multi-layer structure. The base layer 110 of the embodiment includes a plurality of resin layers. The base layer 110 may include a plurality of resin layers and a single-layer or multi-layer inorganic layer disposed between the plurality of resin layers.

[0102] The base layer 110 may include a first resin layer 110-1 and a second resin layer 110-2. The second resin layer 110-2 may be disposed on the first resin layer 110-1. The first resin layer 110-1 and the second resin layer 110-2 may each include a polymer resin. The first resin layer 110-1 and the second resin layer 110-2 may each include, for example, an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin and / or a perylene resin. The first resin layer 110-1 and the second resin layer 110-2 may each include polyimide.

[0103] The base layer 110 may further include a single layer or multiple layers of an inorganic layer disposed between the first resin layer 110-1 and the second resin layer 110-2. The inorganic layer may include, for example, silicon oxide, silicon nitride, or silicon oxynitride.

[0104] The display panel 100 of the embodiment includes a charging electrode PCE. The charging electrode PCE is disposed under at least one of the plurality of resin layers 110-1 and 110-2 included in the base layer 110. Figure 6 As shown in , the charging electrode PCE may be disposed below the second resin layer 110-2. The charging electrode PCE may be disposed on the first resin layer 110-1 and may be covered by the second resin layer 110-2. For example, when the base layer 110 further includes a single or multiple inorganic layer disposed between the first resin layer 110-1 and the second resin layer 110-2, the charging electrode PCE may be disposed on the inorganic layer.

[0105] The charging electrode PCE charges the stylus STP during the charging section (see Figure 1A ) resonant circuit. The charging electrode PCE can form a coil-type current path by a constant voltage applied externally and thus can generate a magnetic field, and accordingly, the stylus STP (see Figure 1A ) can be charged by receiving the generated magnetic field. This will be described in more detail later.

[0106] Reference together Figure 5 and Figure 6 , when viewed on a plane, the charging electrode PCE overlaps the display area 100-DA. When viewed on a plane, the charging electrode PCE may overlap the pixel PX provided in the display area 100-DA. When viewed on a plane, at least a portion of the charging electrode PCE may overlap the light emitting element LD. For example, at least a portion of the charging electrode PCE may overlap the light emitting area LA. Unlike the conductive pattern layers 200-CL1 and 200-CL2 of the input sensor 200, the charging electrode PCE is provided below the driving element layer 120 and the light emitting element layer 130, and therefore, even when overlapping the light emitting area LA, the charging electrode PCE may not affect the light emitting efficiency of the light emitting element LD, which will be described later.

[0107] The charging electrode PCE may have a single layer structure or a structure having multiple layers stacked along the third direction DR3. The multilayer charging electrode PCE may include at least one metal layer. The multilayer charging electrode PCE may further include a transparent conductive layer. The multilayer charging electrode PCE may include a metal layer containing different metals. Each of the transparent conductive layers may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires and / or graphene. Each of the metal layers may include molybdenum, silver, titanium, copper, aluminum and / or their alloys.

[0108] The charging electrode PCE may have a thickness of about 0.1 μm to about 1 μm. When the thickness of the charging electrode PCE is less than 0.1 μm, line resistance may increase, and thus the stylus pen STP (see Figure 1A ) may have reduced charging efficiency. When the thickness of the charging electrode PCE is greater than 1 μm, the charging electrode PCE and the base layer 110 on which the charging electrode PCE is disposed may have excessively increased thicknesses, thereby increasing the electronic device ED (see Figure 1A )'s total thickness and deteriorates the folding characteristics.

[0109] The buffer layer 10br may be disposed on the base layer 110. The buffer layer 10br may prevent metal atoms or impurities from diffusing from the base layer 110 into the semiconductor pattern thereon. The semiconductor pattern includes a source area SA1, an active area AC1, and a drain area DA1 of the transistor TFT.

[0110] The shielding pattern BMLa may be disposed under the transistor TFT. The shielding pattern BMLa may block external light from reaching the transistor TFT. The shielding pattern BMLa may be disposed between the base layer 110 and the buffer layer 10br. In an embodiment of the inventive concept, a barrier layer of an inorganic layer may be further disposed between the shielding pattern BMLa and the buffer layer 10br. The shielding pattern BMLa may be connected to an electrode or a wire and may receive a constant voltage or signal from the electrode or the wire.

[0111] When viewed on a plane, the shielding pattern BMLa may overlap with the charging electrode PCE. The shielding pattern BMLa may be disposed on the second resin layer 110-2, and when viewed on a plane, the shielding pattern BMLa may completely overlap with the charging electrode PCE. For example, the shielding pattern BMLa may cover the upper portion of the charging electrode PCE. However, embodiments of the present invention are not necessarily limited thereto, and the shielding pattern BMLa may overlap only a portion of the charging electrode PCE. The shielding pattern BMLa may be disposed above the charging electrode PCE, and thus the parasitic capacitance generated by the charging electrode PCE may be prevented from deteriorating the characteristics of the semiconductor pattern, the conductive pattern, and the signal line included in the driving element layer 120.

[0112] The semiconductor pattern may be disposed on the buffer layer 10br. The semiconductor pattern may include a silicon semiconductor. For example, the silicon semiconductor may include amorphous silicon or polycrystalline silicon, etc. For example, the semiconductor pattern may include low temperature polycrystalline silicon.

[0113] The semiconductor pattern may include a first region having a higher conductivity and a second region having a lower conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region, or may be doped at a concentration lower than that of the first region.

[0114] The first region has a conductivity greater than that of the second region and can be substantially used as an electrode or a signal line. The second region can substantially correspond to an active region (or channel) of a transistor. For example, a portion of the semiconductor pattern can be an active region of a transistor, another portion of the semiconductor pattern can be a source or drain of the transistor, and another portion of the semiconductor pattern can be a connection electrode or a connection signal line.

[0115] The source area SA1 (or source), active area AC1 (or channel), and drain area DA1 (or drain) of the transistor TFT may be formed of a semiconductor pattern. In a cross-sectional view, the source area SA1 and the drain area DA1 may extend in opposite directions from the active area AC1.

[0116] The first insulating layer 10 may be disposed on the buffer layer 10br. The first insulating layer 10 may be disposed on the plurality of pixels PX (see Figure 2 ) overlap in common and may cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide and / or hafnium oxide. In the current embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layer of the driving element layer 120 to be described later may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above materials, but is not necessarily limited thereto.

[0117] The gate GT1 of the transistor TFT is disposed on the first insulating layer 10. The gate GT1 may be a part of the metal pattern. The gate GT1 overlaps the active area AC1. In the process of doping the semiconductor pattern, the gate GT1 may be used as a mask. The gate GT1 may include titanium (Ti), silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN x ), tungsten (W), tungsten nitride (WN x ), copper (Cu), indium tin oxide (ITO) and / or indium zinc oxide (IZO), etc., but is not necessarily limited thereto.

[0118] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate GT1. The third insulating layer 30 may be disposed on the second insulating layer 20. The second electrode CE20 of the storage capacitor Cst may be disposed between the second insulating layer 20 and the third insulating layer 30. In addition, the first electrode CE10 of the storage capacitor Cst may be disposed between the first insulating layer 10 and the second insulating layer 20.

[0119] The first connection electrode CN1 may be disposed on the third insulating layer 30. The first connection electrode CN1 may be connected to the drain area DA1 of the transistor TFT through a contact hole passing through the first to third insulating layers 10, 20, and 30.

[0120] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The second connection electrode CN2 may be disposed on the fourth insulating layer 40. The second connection electrode CN2 may be connected to the first connection electrode CN1 through a contact hole passing through the fourth insulating layer 40. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 and may cover the second connection electrode CN2. The stacked structure of the first to fifth insulating layers 10 to 50 is presented only as an example, and in addition to the first to fifth insulating layers 10 to 50, additional conductive layers and insulating layers may be further provided.

[0121] Each of the fourth insulating layer 40 and the fifth insulating layer 50 may be an organic layer. For example, the organic layer may include a general polymer (e.g., benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA), or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or a mixture thereof.

[0122] The light emitting element LD may include a first electrode AE ​​(or a pixel electrode or an anode), an emission layer EL, and a second electrode CE (or a common electrode or a cathode). The first electrode AE ​​may be disposed on the fifth insulating layer 50. The first electrode AE ​​may be a (semi) light-transmitting electrode or a reflective electrode. The first electrode AE ​​may include a reflective layer formed of Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, a compound or mixture thereof (e.g., LiF, AgMg, AgYb, or MgYb) or a material having a multilayer structure (e.g., LiF / Ca or LiF / Al), and a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ) and / or aluminum-doped zinc oxide (AZO). For example, the first electrode AE ​​may include a stacked structure of ITO / Ag / ITO.

[0123] The pixel definition film PDL may be disposed on the fifth insulating layer 50. According to an embodiment, the pixel definition film PDL may have a light absorption characteristic, and for example, the pixel definition film PDL may be black. The pixel definition film PDL may include a black colorant. The black colorant may include a black dye and a black pigment. The black colorant may include carbon black, a metal such as chromium, or an oxide thereof. The pixel definition film PDL may correspond to a light blocking pattern having a light blocking characteristic.

[0124] The pixel defining film PDL may cover a portion of the first electrode AE ​​(eg, anode). For example, an opening PDL-OP exposing a portion of the first electrode AE ​​may be defined in the pixel defining film PDL. The opening PDL-OP of the pixel defining film PDL may define the light emitting area LA.

[0125] The pixel defining film PDL may increase the distance between the edge of the first electrode AE ​​and the second electrode CE (eg, cathode) and accordingly, the pixel defining film PDL may be used to prevent an arc from being generated at the edge of the first electrode AE.

[0126] The hole control layer may be disposed between the first electrode AE ​​and the emission layer EL. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be disposed between the emission layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer.

[0127] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer 141, an organic layer 142, and an inorganic layer 143, which are sequentially stacked, but the layers forming the encapsulation layer 140 are not necessarily limited thereto.

[0128] The inorganic layers 141 and 143 may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer 142 may protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layers 141 and 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer 142 may include an acrylic organic layer, but embodiments of the inventive concept are not necessarily limited thereto.

[0129] The input sensor 200 may be disposed on the display panel 100. The input sensor 200 may include a first insulating layer 200-IL1, a first conductive pattern layer 200-CL1, a second insulating layer 200-IL2, a second conductive pattern layer 200-CL2, and a third insulating layer 200-IL3. The first insulating layer 200-IL1 may be disposed directly on the encapsulation layer 140.

[0130] In an embodiment of the present inventive concept, each of the first insulating layer 200-IL1 and the third insulating layer 200-IL3 may not be provided. When the first insulating layer 200-IL1 is not provided, the first conductive pattern layer 200-CL1 may be disposed on the uppermost insulating layer of the encapsulation layer 140. The third insulating layer 200-IL3 may be replaced with an insulating layer of an adhesive layer or an anti-reflector 300 disposed on the input sensor 200.

[0131] The first conductive pattern layer 200-CL1 may include a first conductive pattern, and the second conductive pattern layer 200-CL2 may include a second conductive pattern. Hereinafter, the first conductive pattern layer 200-CL1 and the first conductive pattern will be referred to by the same reference numerals, and the second conductive pattern layer 200-CL2 and the second conductive pattern will be referred to by the same reference numerals. The first conductive pattern 200-CL1 is disposed on the first insulating layer 200-IL1. The second conductive pattern 200-CL2 is disposed on the second insulating layer 200-IL2. For example, the first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 may each correspond to a sensing electrode, which will be described later.

[0132] The first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 may each have a single layer structure or a structure having multiple layers stacked along the third direction DR3. The multi-layer conductive pattern may include at least one metal layer. The multi-layer conductive pattern may further include a transparent conductive layer. The multi-layer conductive pattern may include a metal layer containing different metals. Each of the transparent conductive layers may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires and / or graphene. Each of the metal layers may include molybdenum, silver, titanium, copper, aluminum and / or their alloys.

[0133] The first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 may each have a thickness of about 0.1 μm to about 1 μm. When the thickness of each of the first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 is less than 0.1 μm, line resistance may increase, and the input sensor 200 may have reduced input detection performance. When the thickness of each of the first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 is greater than 1 μm, the input sensor 200 may have an excessively increased thickness, thereby increasing the electronic device ED (see Figure 1A )'s total thickness and deteriorates the folding characteristics.

[0134] In the current embodiment, the first to third insulating layers 200-IL1 to 200-IL3 may be inorganic layers or organic layers. In the current embodiment, the first to third insulating layers 200-IL1 to 200-IL3 may be inorganic layers. The inorganic layers may include silicon oxide, silicon nitride, or silicon oxynitride.

[0135] In an embodiment of the present inventive concept, at least one of the first to third insulating layers 200-IL1 to 200-IL3 may be an organic layer. For example, the third insulating layer 200-IL3 may be an organic layer. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0136] The anti-reflector 300 may be disposed on the input sensor 200. The anti-reflector 300 may include a light blocking pattern 310, a color filter 320, and a planarization layer 330. In an embodiment of the present inventive concept, the light blocking pattern 310 may not be provided.

[0137] As long as the material of the light blocking pattern 310 absorbs light, the material is not particularly limited to any specific substance. The light blocking pattern 310 is a black layer, and in an embodiment, the light blocking pattern 310 may include a black colorant. The black colorant may include a black dye and a black pigment. The black colorant may include carbon black, a metal such as chromium, or an oxide thereof.

[0138] When viewed on a plane, the light blocking pattern 310 may overlap the first conductive pattern 200-CL1 and the second conductive pattern 200-CL2. The light blocking pattern 310 may prevent the first conductive pattern 200-CL1 and the second conductive pattern 200-CL2 from reflecting external light. An opening 310-OP may be defined in the light blocking pattern 310. The opening 310-OP of the light blocking pattern 310 may overlap the first electrode AE ​​and may have an area larger than that of the opening PDL-OP of the pixel defining film PDL. The opening 310-OP of the light blocking pattern 310 may define a pixel area PXA. The pixel area PXA may be defined as an area in which light generated from the light emitting element LD is emitted to the outside. As the area of ​​the pixel area PXA increases, the brightness of the image may be improved.

[0139] The color filter 320 may overlap at least the pixel area PXA. The color filter 320 may further overlap the non-pixel area NPXA. A portion of the color filter 320 may be disposed on the light blocking pattern 310. The color filter 320 may transmit light generated from the light emitting element LD and may block external light of some wavelength bands. Accordingly, the color filter 320 may reduce reflection of external light by the first electrode AE ​​or the second electrode CE.

[0140] The planarization layer 330 may cover the light blocking pattern 310 and the color filter 320. The planarization layer 330 may include an organic material, and the planarization layer 330 may provide a flat upper surface.

[0141] Fig. 7A and Figure 7B Each is a cross-sectional view illustrating a portion of a display module DM according to an embodiment of the inventive concept. Fig. 7A and Figure 7B Each shows a cross section of three light emitting elements LD-1, LD-2, and LD-3 and transistors TFT-1, TFT-2, and TFT-3 connected thereto. For example, Fig. 7A and Figure 7B Each shows a stacked structure of a display panel 100 and an input sensor 200 included in a display module DM, and an anti-reflection film 300 (see Figure 6 ) is not provided.

[0142] Reference together Figure 6 and Fig. 7A The display panel 100 may include a plurality of pixels, and each pixel may include a light emitting element LD-1, LD-2 or LD-3 disposed in the light emitting element layer 130 and a transistor TFT-1, TFT-2 or TFT-3 connected to a corresponding one of the light emitting elements LD-1, LD-2 and LD-3.

[0143] The display module DM may include a non-light emitting area NLA and light emitting areas LA-1, LA-2, and LA-3. The light emitting areas LA-1, LA-2, and LA-3 may each be an area that emits light generated from a corresponding one of the light emitting elements LD-1, LD-2, and LD-3. When viewed on a plane, the light emitting areas LA-1, LA-2, and LA-3 may be spaced apart.

[0144] The light-emitting areas LA-1, LA-2 and LA-3 may each be an area separated by a pixel defining film PDL. The non-light-emitting area NLA may be an area between adjacent light-emitting areas LA-1, LA-2 and LA-3, and may correspond to the pixel defining film PDL. The pixel defining film PDL may separate the light-emitting elements LD-1, LD-2 and LD-3. The emission layers EL1, EL2 and EL3 of the light-emitting elements LD-1, LD-2 and LD-3 may be separated by being arranged in an opening PDL-OP defined in the pixel defining film PDL.

[0145] The light emitting areas LA-1, LA-2, and LA-3 may be divided into a plurality of groups according to the colors of the lights generated from the light emitting elements LD-1, LD-2, and LD-3. Fig. 7A and Figure 7B In the display module DM of the embodiment shown in FIG, three light emitting areas LA-1, LA-2 and LA-3 emitting red light, green light and blue light are shown as examples. For example, according to an embodiment, the display module DM may include a separated first light emitting area LA-1, a second light emitting area LA-2 and a third light emitting area LA-3.

[0146] According to an embodiment, in the display module DM, a plurality of light emitting elements LD-1, LD-2, and LD-3 may emit light having different wavelength ranges. For example, in an embodiment, the display module DM may include a first light emitting element LD-1 emitting red light, a second light emitting element LD-2 emitting green light, and a third light emitting element LD-3 emitting blue light. For example, the first light emitting area LA-1, the second light emitting area LA-2, and the third light emitting area LA-3 of the display module DM may correspond to the first light emitting element LD-1, the second light emitting element LD-2, and the third light emitting element LD-3, respectively.

[0147] However, the embodiments of the present inventive concept are not necessarily limited thereto, and the first to third light emitting elements LD-1, LD-2, and LD-3 may emit light in the same wavelength range or may emit light in at least one different wavelength range. For example, the first to third light emitting elements LD-1, LD-2, and LD-3 may all emit blue light.

[0148] The first to third light-emitting elements LD-1, LD-2 and LD-3 may each include a first electrode AE, an emission layer EL1, EL2 or EL3 and a second electrode CE (or a common electrode). The first electrode AE ​​may be disposed on the fifth insulating layer 50. The first electrode AE ​​may be a (semi) light-transmitting electrode or a reflective electrode. The first electrode AE1 may include a reflective layer formed of Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, a compound or mixture thereof (e.g., LiF, AgMg, AgYb or MgYb) or a material having a multilayer structure (e.g., LiF / Ca or LiF / Al) and a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ) and / or aluminum-doped zinc oxide (AZO). For example, the first electrode AE ​​may include a stacked structure of ITO / Ag / ITO.

[0149] The emission layers EL1, EL2 and EL3 may have a single layer formed of a single material, a single layer formed of multiple different materials, or a multilayer structure having multiple layers formed of multiple different materials. The emission layers EL1, EL2 and EL3 may include known hosts and dopants for emitting light in the above-mentioned wavelength range.

[0150] The second electrode CE may be provided as a common layer and may be a semi-transmissive reflective electrode or a transmissive electrode. The second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, a compound or a mixture thereof (e.g., LiF, AgMg, AgYb, or MgYb), or a material having a multilayer structure (e.g., LiF / Ca or LiF / Al).

[0151] The display panel 100 of the embodiment may include a charging electrode PCE, and the charging electrode PCE may overlap with a pixel. When viewed on a plane, at least a portion of the charging electrode PCE may overlap with at least a portion of the plurality of light-emitting elements LD-1, LD-2, and LD-3. For example, at least a portion of the charging electrode PCE may overlap with at least a portion of the first light-emitting area LA-1, the second light-emitting area LA-2, and the third light-emitting area LA-3. As an example, Fig. 7A and Figure 7B The charging electrode PCE is respectively shown to overlap with the first light-emitting area LA-1 and the third light-emitting area LA-3, but the embodiments of the present invention are not necessarily limited to this, and the charging electrode PCE may overlap with any one of the first light-emitting area LA-1, the second light-emitting area LA-2, and the third light-emitting area LA-3 or may overlap with each of the first light-emitting area LA-1, the second light-emitting area LA-2, and the third light-emitting area LA-3.

[0152] The base layer 110 includes a plurality of resin layers, and the charging electrode PCE is disposed under at least one of the plurality of resin layers. Fig. 7A As shown in , the base layer 110 may include a first resin layer 110-1 and a second resin layer 110-2, and the charging electrode PCE may be disposed below the second resin layer 110-2. The upper surface of the charging electrode PCE may be covered by the second resin layer 110-2. For example, when the base layer 110 further includes a single-layer or multi-layer inorganic layer disposed between the first resin layer 110-1 and the second resin layer 110-2, the charging electrode PCE may be disposed on the inorganic layer.

[0153] The charging electrode PCE may be disposed between a plurality of resin layers of the display panel 100, and may be spaced apart from the conductive pattern layers 200-CL1 and 200-CL2 included in the input sensor 200. The charging electrode PCE may be spaced apart from the conductive pattern layers 200-CL1 and 200-CL2, wherein a plurality of pixels are disposed between the charging electrode PCE and the conductive pattern layers 200-CL1 and 200-CL2. The charging electrode PCE may be spaced apart from the conductive pattern layers 200-CL1 and 200-CL2, wherein the driving element layer 120 and the light emitting element layer 130 are disposed between the charging electrode PCE and the conductive pattern layers 200-CL1 and 200-CL2. In the third direction DR3, the driving element layer 120, the light emitting element layer 130, and the encapsulation layer 140 may be disposed between the charging electrode PCE and the conductive pattern layers 200-CL1 and 200-CL2.

[0154] When viewed on a plane, the shielding pattern BMLa may overlap the charging electrode PCE. The shielding pattern BMLa may cover an upper portion of the charging electrode PCE.

[0155] The display panel 100 of the embodiment may further include a connection line CNE1 connected to the charging electrode PCE and applying a ground voltage to the charging electrode PCE. The connection line CNE1 may be connected to the charging electrode PCE through a resin layer disposed on the charging electrode PCE. In the embodiment, the connection line CNE1 may be connected to the charging electrode PCE through a contact hole CNH1 passing through the second resin layer 110-2.

[0156] The connection line CNE1 may be disposed on the same layer as the shielding pattern BMLa. The connection line CNE1 may be disposed on the second resin layer 110-2 in the same manner as the shielding pattern BMLa, and may include the same material as the shielding pattern BMLa. The connection line CNE1 may be formed by the same process as the shielding pattern BMLa. For example, a conductive layer formed on the second resin layer 110-2 may be patterned to form the connection line CNE1 and the shielding pattern BMLa.

[0157] For example, in Figure 6 and Fig. 7A , as an example, the base layer 110 is illustrated as having a structure in which two resin layers are stacked, but embodiments of the inventive concept are not necessarily limited thereto, and the base layer 110 may have a structure in which three or more resin layers are stacked.

[0158] refer to Figure 7B, the base layer 110 may include a first resin layer 110-1, a second resin layer 110-2, and a third resin layer 110-3. The second resin layer 110-2 may be disposed on the first resin layer 110-1, and the third resin layer 110-3 may be disposed below the first resin layer 110-1. The first resin layer 110-1, the second resin layer 110-2, and the third resin layer 110-3 may each include a polymer resin. The first resin layer 110-1, the second resin layer 110-2, and the third resin layer 110-3 may each include, for example, acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and / or perylene resin. The first resin layer 110-1, the second resin layer 110-2, and the third resin layer 110-3 may each include polyimide.

[0159] The base layer 110 may further include a single inorganic layer or multiple inorganic layers disposed between the first resin layer 110-1 and the second resin layer 110-2 and between the first resin layer 110-1 and the third resin layer 110-3. The inorganic layer may include, for example, silicon oxide, silicon nitride, or silicon oxynitride.

[0160] The charging electrode PCE-1 is disposed under at least one of the plurality of resin layers. Figure 7B As shown in , the charging electrode PCE-1 may be disposed below the first resin layer 110-1 and the second resin layer 110-2. The upper surface of the charging electrode PCE-1 may be covered by the first resin layer 110-1. For example, when the base layer 110 further includes a single or multiple inorganic layer disposed between the first resin layer 110-1 and the third resin layer 110-3, the charging electrode PCE-1 may be disposed on the inorganic layer.

[0161] The charging electrode PCE-1 may be electrically connected to the flexible circuit board FCB. The flexible circuit board FCB may be disposed under at least a portion of the display panel 100, and may be connected to the charging electrode PCE-1 to apply a ground voltage to the charging electrode PCE-1. In an embodiment, the charging electrode PCE-1 and the flexible circuit board FCB may be electrically connected through a resin layer disposed under the charging electrode PCE-1. In an embodiment, the charging electrode PCE may be connected to the flexible circuit board FCB through a contact hole CNH2 passing through the third resin layer 110-3. The charging electrode PCE-1 may be electrically connected to a connection line CNE2 included in the flexible circuit board FCB. For example, Figure 7B Different from that shown in FIG. 1 , the charging electrode PCE- 1 may be electrically connected to the flexible circuit board FCB via a separate additional connection line.

[0162] Figure 8is a plan view of a charging electrode PCE included in a display panel according to an embodiment of the inventive concept. 9A to 9C It is shown Figure 8 A plan view of the charging section within the operating section of the charging electrode.

[0163] Reference together Figures 6 to 8 , the charging electrode PCE or PCE-1 may be disposed under at least one of the plurality of resin layers 110-1 and 110-2 or 110-1, 110-2, and 110-3 included in the base layer 110. Fig. 7A As shown in , the charging electrode PCE may be disposed on the first resin layer 110-1 and may be covered by the second resin layer 110-2. Figure 7B As shown in FIG. 1 , the charging electrode PCE- 1 may be disposed on the third resin layer 110 - 3 and may be covered by the first resin layer 110 - 1 .

[0164] The charging electrode PCE may include a stripe-type electrode extending in one direction. The charging electrode PCE may extend along the second direction DR2 and may include a plurality of unit charging electrodes PCE-U spaced apart along the first direction DR1. Figure 8 , the charging electrode PCE is illustrated as an example including six strip-type unit charging electrodes PCE-U, but embodiments of the inventive concept are not necessarily limited thereto, and the number of unit charging electrodes PCE-U may be provided in various ways depending on the type and size of the electronic device.

[0165] For example, the charging electrode PCE may be Figure 8 For example, the charging electrode PCE may have a configuration similar to that of the input sensor 200 (see Fig.10 ) in the same form as the sensing electrode of the driving element layer 120. In addition, the charging electrode PCE may have a mesh structure. The unit charging electrodes PCE-U included in the charging electrode PCE may each include a mesh-type sheet composed of a plurality of conductive lines, and the conductive lines having the mesh structure may be patterned to correspond to the semiconductor pattern, the conductive pattern, and the signal line included in the driving element layer 120. The conductive lines included in the charging electrode PCE may be arranged according to each pixel PX (see Figure 5 )'s arrangement period is patterned.

[0166] The display panel 100 may further include a signal line connected to the charging electrode PCE. In an embodiment, a plurality of unit charging electrodes PCE-U included in the charging electrode PCE may include two ends spaced apart along the second direction DR2, and the display panel 100 may include a first voltage line PCL1 connected to one end of each of the unit charging electrodes PCE-U and a second voltage line PCL2 connected to the other end of each of the unit charging electrodes PCE-U. The second voltage line PCL2 may include a first portion PCL2-1 extending in the first direction DR1 and connected to the other end disposed in the upper region of the charging electrode PCE, a second portion PCL2-2 bent from the first portion PCL2-1 and connected to the first voltage pad PPD1, and a third portion PCL2-3 bent from the first portion PCL2-1 and connected to the second voltage pad PPD2.

[0167] At least a portion of the charging electrode PCE may overlap the display area 100-DA. The first voltage line PCL1 and the second voltage line PCL2 may each be disposed in the non-display area NDA. The charging electrode PCE and each of the first voltage line PCL1 and the second voltage line PCL2 may be disposed in the same layer, or may be disposed in different layers. In an embodiment, the first voltage line PCL1 and the second voltage line PCL2 may each be Fig. 7A The connection lines CNE1 shown in the figure may be connected to Figure 7B FIG. 4 is a diagram showing the connection lines of the flexible printed circuit board (FCB).

[0168] The display panel 100 may include a first voltage pad PPD1 and a second voltage pad PPD2. The first voltage pad PPD1 and the second voltage pad PPD2 may be disposed in regions spaced apart from each other in the first direction DR1. The first voltage line PCL1 and the second voltage line PCL2 may each be connected to at least one corresponding pad among the first voltage pad PPD1 and the second voltage pad PPD2. When viewed on a plane, the first voltage pad PPD1 and the second voltage pad PPD2 may be adjacent to a lower end of the display panel 100. When viewed on a plane, Figure 5 The first pad PD1 shown in FIG. 1 may be disposed between the first voltage pad PPD1 and the second voltage pad PPD2 .

[0169] 9A to 9C It is shown Figure 8 A plan view of the charging section within the operating section of the charging electrode PCE.

[0170] exist 9A to 9CFor ease of description, among the three first voltage lines PCL1, the left first voltage line PCL1 is defined as a 1-1th voltage line PCL1-1, the middle first voltage line PCL1 is defined as a 1-2th voltage line PCL1-2, and the right first voltage line PCL1 is defined as a 1-3th voltage line PCL1-3.

[0171] During the charging section, the second voltage line PCL2 may receive a drive signal or a ground voltage from at least one of the first voltage pad PPD1 and the second voltage pad PPD2. For the line receiving the ground voltage, some of the 1-1st voltage line PCL1-1, the 1-2nd voltage line PCL1-2, and the 1-3rd voltage line PCL1-3 are selected, and some of the 1-1st voltage line PCL1-1, the 1-2nd voltage line PCL1-2, and the 1-3rd voltage line PCL1-3 may not be selected. The selected line may receive a drive signal or a ground voltage. The charging electrode PCE connected to the selected line may also receive a drive signal or a ground voltage. The unselected line may be in a floating state. Some of the second voltage line PCL2, the charging electrode PCE, and the first voltage line PCL1 may be selected to form a coil-type current path (or to define a coil).

[0172] refer to Fig. 9A , during the first section of the charging section, the driving circuit of the display module may select the first voltage pad PPD1 connected to the second voltage line PCL2 and the first voltage pad PPD1 connected to the 1-2 voltage line PCL1-2. The driving circuit of the display module applies a driving signal to the first voltage pad PPD1 connected to the second voltage line PCL2, and applies a ground voltage to the first voltage pad PPD1 connected to the 1-2 voltage line PCL1-2. In this case, the 1-1 voltage line PCL1-1 and the 1-3 voltage line PCL1-3 may be in a floating state. The second voltage line PCL2, the unit charging electrode PCE-U disposed in the middle among the charging electrodes PCE, and the 1-2 voltage line PCL1-2 define a coil-type current path. The coil-type current path may generate a magnetic field.

[0173] refer to Fig. 9B, during the second section of the charging section, the driving circuit of the display module may select the first voltage pad PPD1 connected to the 1-1 voltage line PCL1-1 and the second voltage pad PPD2 connected to the 1-3 voltage line PCL1-3. The driving circuit of the display module applies a driving signal to the first voltage pad PPD1 connected to the 1-1 voltage line PCL1-1, and applies a ground voltage to the second voltage pad PPD2 connected to the 1-3 voltage line PCL1-3. The 1-1 voltage line PCL1-1, the unit charging electrode PCE-U disposed on the left side among the charging electrodes PCE, the second voltage line PCL2, the unit charging electrode PCE-U disposed on the right side among the charging electrodes PCE, and the 1-3 voltage line PCL1-3 define a coil-type current path. The coil-type current path may generate a magnetic field.

[0174] refer to Fig. 9C , during the third section of the charging section, the driving circuit of the display module may select the first voltage pad PPD1 connected to the 1-2 voltage line PCL1-2 and the second voltage pad PPD2 connected to the second voltage line PCL2. The driving circuit of the display module applies a driving signal to the first voltage pad PPD1 connected to the 1-2 voltage line PCL1-2, and applies a ground voltage to the second voltage pad PPD2 connected to the second voltage line PCL2. The 1-2 voltage line PCL1-2, the unit charging electrode PCE-U disposed in the middle among the charging electrodes PCE, and the second voltage line PCL2 define a coil-type current path. The coil-type current path may generate a magnetic field.

[0175] exist 9A to 9C During the charging section described in , a constant voltage may be applied to some of the unit charging electrodes PCE-U among the charging electrodes PCE through the first voltage line PCL1 and the second voltage line PCL2 . 9A to 9C The driving order of the charging sections described in the embodiment is presented as an example, and the embodiments of the present inventive concept are not necessarily limited thereto. The operation order of the first to third sections may vary. In addition, among the charging electrodes PCE, the two most adjacent unit charging electrodes PCE-U may define a portion of the coil-type current path.

[0176] refer to Fig. 9B , the resonant circuit of the stylus pen STP can be charged during the second section of the charging section. The resonant circuit of the stylus pen STP set on the unit charging electrode PCE-U set in the middle receives the reference Fig. 9B The magnetic field formed in the current path is described. The resonant circuit of the stylus STP uses the reference Fig. 9BThe resonant circuit of the stylus pen STP may include an inductor L and a capacitor C connected to the inductor L. The LC resonant circuit may be formed by the inductor L and the capacitor C. The capacitor C may be a variable capacitor having a variable capacity.

[0177] Fig.10 is a plan view of an input sensor 200 according to an embodiment of the inventive concept.

[0178] refer to Fig.10 , the input sensor 200 can detect the first input through the capacitive mode and detect the second input through the electromagnetic induction mode. The first input can be from the reference Figure 1A The second input may be an input from a body part FG of the user described by Figure 1A The input of the stylus STP described. For example, the first input may be an input that can change capacitance, and the second input may be an input that provides a magnetic field signal (or a resonance signal).

[0179] By time-division driving, the input sensor 200 can detect a first input and a second input. The input sensor 200 may include sensing electrodes for detecting the first input and the second input. The section in which the input sensor 200 operates in the first mode to detect the first input may be defined as a first operating section, and the section in which the input sensor 200 operates in the second mode to detect the second input may be defined as a second operating section. The first mode and the second mode may be switched by a user's selection, or any one of the first mode and the second mode may be activated or switched by activation of a specific application. When the input sensor 200 operates alternately in the first mode and the second mode, when the first input is detected, the input sensor 200 may remain in the first mode, or when the second input is detected, the input sensor 200 may remain in the second mode.

[0180] The sensing electrodes of the input sensor 200 may include a first group of electrodes SE for detecting a first input and a second group of electrodes PSE for detecting a second input. As an example, six second groups of first electrodes PSE1 and eight second groups of second electrodes PSE2 are shown, but the input sensor 200 may include a greater number of second groups of first electrodes PSE1 and second groups of second electrodes PSE2. For example, the form of the first group of electrodes SE and the second group of electrodes PSE is not necessarily limited to Fig.10 The form shown in FIG. 2 and the input sensor 200 may be modified into various forms for the input sensor 200 to detect the first input and the second input.

[0181] The first group of electrodes SE may include a first group of first electrodes SE1 arranged in the first direction DR1 and extending in the second direction DR2 and a first group of second electrodes SE2 crossing the first group of first electrodes SE1. The first group of first electrodes SE1 and the first group of second electrodes SE2 may be capacitively coupled.

[0182] The driving circuit of the input sensor 200 provides a driving signal to any one of the first group of first electrodes SE1 and the first group of second electrodes SE2, and the detection circuit of the input sensor 200 measures the change in capacitance of the mutual capacitor formed between the first group of first electrodes SE1 and the first group of second electrodes SE2 through the other electrode of the first group of first electrodes SE1 and the first group of second electrodes SE2. After performing the above operation during the first section of the first operation section, the above operation may be reversely performed during the second section of the first operation section. The first section and the second section may be repeated as a set.

[0183] The second group of electrodes PSE may include a second group of first electrodes PSE1 arranged in the first direction DR1 and extending in the second direction DR2 and a second group of second electrodes PSE2 crossing the second group of first electrodes PSE1. Figure 1A ) can be detected by the second group of first electrodes PSE1 and the second group of second electrodes PSE2. The driving circuit of the input sensor 200 provides a driving signal to at least one of the second group of first electrodes PSE1 and the second group of second electrodes PSE2, and the detection circuit of the input sensor 200 detects the electromagnetic induction current formed in the second group of first electrodes PSE1 and the second group of second electrodes PSE2.

[0184] The input sensor 200 may include a first group of first signal lines SL1 connected to one end of each of the first group of first electrodes SE1, a first group of second signal lines SL2 connected to one end of each of the first group of second electrodes SE2, a second group of first signal lines PSL1 connected to one end of each of the second group of first electrodes PSE1, and a second group of second signal lines PSL2 connected to one end of each of the second group of second electrodes PSE2.

[0185] The first group of first electrodes SE1, the first group of second electrodes SE2, the second group of first electrodes PSE1, and the second group of second electrodes PSE2 may be disposed in the display area DA. The first group of first signal lines SL1, the first group of second signal lines SL2, the second group of first signal lines PSL1, and the second group of second signal lines PSL2 may be disposed in the non-display area NDA. The electrodes SE1, SE2, PSE1, and PSE2 and the signal lines SL1, SL2, PSL1, and PSL2 may be disposed in the same layer or in different layers.

[0186] The input sensor 200 may include a second pad PD2 and a third pad PD3. The second pad PD2 and the third pad PD3 may be disposed in a region spaced apart from each other in the first direction DR1. The first group of first signal lines SL1, the first group of second signal lines SL2, the second group of first signal lines PSL1, and the second group of second signal lines PSL2 may each be connected to at least one corresponding pad among the second pad PD2 and the third pad PD3. When viewed on a plane, the second pad PD2 and the third pad PD3 may be adjacent to the lower end of the input sensor 200. When viewed on a plane, Figure 5 The first pad PD1 shown in FIG. 5 may be disposed between the second pad PD2 and the third pad PD3 .

[0187] The input sensor 200 may be divided into a left area and a right area with respect to the center of the input sensor 200 in the first direction DR1. The second pad PD2 is disposed in the left area, and the third pad PD3 is disposed in the right area. The first group of first signal lines SL1 connected to the first group of first electrodes SE1 disposed in the left area may be connected to the second pad PD2. The first group of first signal lines SL1 connected to the first group of first electrodes SE1 disposed in the right area may be connected to the third pad PD3.

[0188] The input sensor 200 may be divided into an upper area and a lower area with respect to the center of the input sensor 200 in the second direction DR2. Some of the first group of second signal lines SL2 may be connected to the left end of the first group of second electrodes SE2 disposed in the lower area. Some of the first group of second signal lines SL2 may be connected to the second pad PD2. Other of the first group of second signal lines SL2 may be connected to the right end of the first group of second electrodes SE2 disposed in the upper area. Other of the first group of second signal lines SL2 may be connected to the third pad PD3.

[0189] The first group of first electrodes SE1 may each include a 1-1 extension portion SE1-1 and a 1-2 extension portion SE1-2 extending in the second direction DR2 and spaced apart from each other in the first direction DR1. The 1-1 extension portion SE1-1 and the 1-2 extension portion SE1-2 may be symmetrical (e.g., horizontally symmetrical or bilaterally symmetrical) with respect to the second direction DR2. The second group of first electrodes PSE1 may be disposed between the 1-1 extension portion SE1-1 and the 1-2 extension portion SE1-2.

[0190] The first group of first electrodes SE1 may each further include a first middle portion SE1-3. As an example, Fig.10The first middle portion SE1-3 disposed in the lower area is shown. The first middle portion SE1-3 may not be disposed in the upper area. The first middle portion SE1-3 may extend in the first direction DR1. The first middle portion SE1-3 may be disposed between one end of the 1-1 extension portion SE1-1 and one end of the 1-2 extension portion SE1-2. The first group of first signal lines SL1 may be connected to the first middle portion SE1-3.

[0191] The first group of second electrodes SE2 may each include a 2-1 extension portion SE2-1 and a 2-2 extension portion SE2-2 extending in the first direction DR1 and spaced apart from each other in the second direction DR2. The 2-1 extension portion SE2-1 and the 2-2 extension portion SE2-2 may be symmetrical (e.g., vertically symmetrical or vertically symmetrical) with respect to the first direction DR1. The second group of second electrodes PSE2 may be disposed between the 2-1 extension portion SE2-1 and the 2-2 extension portion SE2-2.

[0192] The first group of second electrodes SE2 may each further include a second middle portion SE2-3. The second middle portion SE2-3 of the first group of second electrodes SE2 disposed in the upper region may be disposed on the right side and may not be disposed on the left side. The second middle portion SE2-3 of the first group of second electrodes SE2 disposed in the lower region may be disposed on the left side and may not be disposed on the right side.

[0193] The second middle portion SE2-3 may extend in the second direction DR2. The second middle portion SE2-3 may be disposed between one end of the 2-1st extension portion SE2-1 and one end of the 2-2nd extension portion SE2-2. The first group of second signal lines SL2 may be connected to the second middle portion SE2-3.

[0194] The second group of first electrodes PSE1 may each extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1. The second group of first electrodes PSE1 may be disposed at the same layer as the first group of first electrodes SE1. The second group of first electrodes PSE1 may be disposed between the 1-1 extension portion SE1-1 and the 1-2 extension portion SE1-2 of the corresponding first group of first electrodes SE1.

[0195] In the upper region, the ends of the second group of first electrodes PSE1 may be connected through the second group of first signal lines PSL1. One end of the second group of first signal lines PSL1 may be connected to the second pad PD2, and the other end of the second group of first signal lines PSL1 may be connected to the third pad PD3. The second group of first signal lines PSL1 may include a first portion PSL1-1 extending in the first direction DR1 and connected to the ends of the second group of first electrodes PSE1 disposed in the upper region, a second portion PSL1-2 bent from the first portion PSL1-1 and connected to the second pad PD2, and a third portion PSL1-3 bent from the first portion PSL1-1 and connected to the third pad PD3.

[0196] The second group of second electrodes PSE2 may each extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. The second group of second electrodes PSE2 may be disposed at the same layer as the first group of second electrodes SE2. The second group of second electrodes PSE2 may be disposed between the 2-1 extension portion SE2-1 and the 2-2 extension portion SE2-2 of the corresponding first group of second electrodes SE2.

[0197] The left end of the second group of second electrodes PSE2 disposed in the upper area may be connected to one of the second group of second signal lines PSL2. The right end of the second group of second electrodes PSE2 disposed in the lower area may be connected to another of the second group of second signal lines PSL2. However, the connection relationship between the second group of second electrodes PSE2 and the second group of second signal lines PSL2 is not necessarily limited to that described above. For example, in an embodiment of the inventive concept, the left end or the right end of the second group of second electrodes PSE2 may all be connected to the same second group of second signal lines PSL2.

[0198] Fig.11 is an enlarged plan view of a portion of an input sensor according to an embodiment of the inventive concept. Fig.11 yes Fig.10 An enlarged plan view of the intersection area AA1. Fig.12 and Fig.13 Each is a cross-sectional view illustrating a portion of an input sensor according to an embodiment of the inventive concept. Fig.12 is with Fig.11 Line II-II' corresponds to a cross-sectional view of the input sensor. Fig.13 is with Fig.11 Line III-III' corresponds to a cross-sectional view of the input sensor. Fig.14 is an enlarged plan view of a portion of an input sensor according to an embodiment of the inventive concept. Fig.14 yes Fig.11 An enlarged plan view of some of the electrodes shown in FIG.

[0199] refer to Fig.11 and Fig.12 , the 1-1 extension portion SE1-1 and the 1-2 extension portion SE1-2 of the first group of first electrodes SE1 may each include a first sensing portion SP1 arranged in the second direction DR2 and a first middle portion EP1 (or an intersection portion) connecting two adjacent sensing portions among the first sensing portions SP1. The first sensing portion SP1 may be bent. For example, the first sensing portion SP1 may be bent toward the left or toward the right in the first direction DR1 to maintain a constant distance from the second group of first electrodes PSE1. The first sensing portion SP1 may have a width greater than that of the first middle portion EP1.

[0200] The first middle portion EP1 is disposed at a different layer from the first sensing portion SP1. The first middle portion EP1 disposed below the second insulating layer 200-IL2 may correspond to a bridge. A bridge such as the first middle portion EP1 may be disposed in an area where conductive patterns intersect. The bridge may be formed by a portion of the first conductive pattern among the first conductive pattern and the second conductive pattern. The second conductive pattern may be disposed at a different layer from the bridge.

[0201] The first middle portion EP1, which is a bridge, can prevent short circuits between the 1-1 extension portion SE1-1 and the 1-2 extension portion SE1-2 and the first and second groups of second electrodes SE2 and PSE2. The first middle portion EP1 can connect two adjacent first sensing portions SP1 to each other through a first contact hole T-CH1 passing through the second insulating layer 200-IL2.

[0202] The 2-1 extension portion SE2-1 and the 2-2 extension portion SE2-2 of the first group of second electrodes SE2 may each include a second sensing portion SP2 arranged in the first direction DR1 and a second middle portion EP2 connecting two adjacent sensing portions of the second sensing portions SP2. The second sensing portion SP2 may be bent. For example, the second sensing portion SP2 may be bent upward or downward in the second direction DR2 to maintain a constant distance from the second group of second electrodes PSE2.

[0203] The second middle portion EP2 is disposed on the same layer as the second sensing portion SP2 (eg, on the second insulating layer 200 - IL2 ). The second middle portion EP2 may have a single body shape together with the second sensing portion SP2 .

[0204] The first sensing portion SP1 and the second sensing portion SP2 may not overlap each other and may be spaced apart from each other. The first sensing portion SP1 and the second sensing portion SP2 may be alternately disposed in the first crossing direction CDR1 and the second crossing direction CDR2. A mutual capacitor may be formed between the first sensing portion SP1 and the second sensing portion SP2.

[0205] refer to Fig.11 and Fig.13 , the second group of first electrodes PSE1 may include third sensing parts PSP1 arranged in the second direction DR2 and a third middle part PEP1 connecting two adjacent sensing parts among the third sensing parts PSP1. The third sensing parts PSP1 may protrude toward the left and right in the first direction DR1. The third sensing parts PSP1 may have a rhombus-like shape.

[0206] The third intermediate portion PEP1 is disposed at a different layer from the third sensing portion PSP1. The third intermediate portion PEP1 disposed under the second insulating layer 200-IL2 corresponds to a bridge. The third intermediate portion PEP1, which is a bridge, can prevent a short circuit between the third sensing portion PSP1 and the first and second groups of second electrodes SE2 and PSE2. The third intermediate portion PEP1 connects two adjacent third sensing portions PSP1 through a second contact hole T-CH2 that passes through the second insulating layer 200-IL2.

[0207] The second group of second electrodes PSE2 may include fourth sensing parts PSP2 arranged in the first direction DR1 and fourth intermediate parts PEP2 connecting two adjacent sensing parts among the fourth sensing parts PSP2. The fourth sensing parts PSP2 may protrude upward and downward in the second direction DR2. The fourth intermediate parts PEP2 are disposed on the same layer as the fourth sensing parts PSP2 (e.g., disposed on the second insulating layer 200-IL2). The fourth intermediate parts PEP2 may have a single body shape together with the fourth sensing parts PSP2.

[0208] The position of the bridge may be changed, and the portion including the bridge may be changed. Figures 10 to 13 Unlike the described embodiment, a bridge may be provided in each of the first group of second electrodes SE2 and the second group of second electrodes PSE2.

[0209] Fig.10 Some of the first group of first signal lines SL1, the first group of second signal lines SL2, the second group of first signal lines PSL1, and the second group of second signal lines PSL2 shown in FIG. Fig.10The other parts of the first group of first signal lines SL1, the first group of second signal lines SL2, the second group of first signal lines PSL1 and the second group of second signal lines PSL2 shown in the figure can be arranged in the same layer as the third sensing part PSP1. This arrangement is designed to prevent short circuits in the above-mentioned signal lines. In an embodiment of the present invention, most of the above-mentioned signal lines can be arranged in the same layer. However, a bridge can be arranged in an area where the signal lines intersect.

[0210] For example, refer to Figures 10 to 13 The first group of electrodes SE and the second group of electrodes PSE described may each have a thickness of about 0.1 μm to about 1 μm. When the thickness of each of the first group of electrodes SE and the second group of electrodes PSE is less than 0.1 μm, line resistance may increase, and the input sensor 200 may have reduced input detection performance. When the thickness of each of the first group of electrodes SE and the second group of electrodes PSE is greater than 1 μm, the input sensor 200 may have an excessively increased thickness, thereby increasing the electronic device ED (see Figure 1A )'s total thickness and deteriorates the folding characteristics.

[0211] The line resistance of each of the first electrode SE and the second electrode PSE may be less than 100Ω. The first electrode SE and the second electrode PSE may each have a low resistance value of less than 100Ω. Figures 6 to 8 As described in, for the stylus STP (see Figure 1A ) is separately provided between the plurality of resin layers included in the base layer 110 of the display panel 100, and accordingly, in the input sensor 200, there is no need to provide a charging electrode for charging the stylus pen STP (see Figure 1A ) The space of the electrodes and wires charged by the first group of electrodes SE and the second group of electrodes PSE results in a greater number of channels. Accordingly, the sensing electrodes such as the first group of electrodes SE and the second group of electrodes PSE can have a low resistance value below 100Ω, and the driving voltage for driving the sensing electrodes can be reduced to below about 3.3V.

[0212] Fig.14 Shows Fig.11 1 and 2. An enlarged view of the first sensing part SP1 and the third sensing part PSP1 shown in FIG. The first sensing part SP1 is shown to represent the first group of electrodes SE, and the third sensing part PSP1 is shown to represent the second group of electrodes PSE.

[0213] refer to Fig.14, the first sensing part SP1 and the third sensing part PSP1 may be in the shape of a grid. For example, the first sensing part SP1 and the third sensing part PSP1 may each include a first conductive wire BP1 extending in the second cross direction CDR2 and a second conductive wire BP2 extending in the first cross direction CDR1. The first conductive wire BP1 and the second conductive wire BP2 are formed by the same process and may have a single body shape. The grid-type sheet formed by the first conductive wire BP1 and the second conductive wire BP2 may be patterned to form a first group of first electrodes SE1, a first group of second electrodes SE2, a second group of first electrodes PSE1, and a second group of second electrodes PSE2.

[0214] The opening T-OP having a rhombus shape may be defined by the first conductive wire BP1 and the second conductive wire BP2. Figure 6 For example, the first conductive line BP1 and the second conductive line BP2 are connected to the light emitting area LA shown in FIG. Figure 6 The non-luminous area NLA shown in FIG.

[0215] Fig.15 is a plan view illustrating a first operation section of an electrode included in an input sensor according to an embodiment of the present inventive concept. Fig.15 It is shown Fig.10 A plan view of the operating section of the first set of electrodes SE in FIG.

[0216] During the first operating section, Fig.10 The second group of electrodes PSE in the input sensor does not participate in the operation of the input sensor. For example, the driving signal is not provided to the second group of electrodes PSE, and no signal is detected from the second group of electrodes PSE. Fig.10 The second set of electrodes PSE can be Fig.15 is omitted in the depicted arrangement.

[0217] During the first operation section, the driving circuit of the input sensor provides a driving signal to the first group of first electrodes SE1 or the first group of second electrodes SE2. For example, the driving circuit of the input sensor scans the first group of first electrodes SE1 or the first group of second electrodes SE2. For example, the driving signal is sequentially provided to the first group of first electrodes SE1 through the first group of first signal lines SL1. The activation sections of the driving signal provided to the first group of first electrodes SE1 may be different. The driving signal may include a plurality of pulse waves or a plurality of sine waves in the activation section. The driving circuit of the input sensor may be embedded in a separately provided driving chip of the input sensor, or may be embedded in a display panel mounted on the display panel 100 (see Figure 2 ) on the driver chip DIC (see Figure 2 )middle.

[0218] A current path is formed that advances from the electrode receiving the drive signal among the first group of first electrodes SE1 to the first group of second electrodes SE2. The current path passes through a mutual capacitor formed between the first group of first electrodes SE1 and the first group of second electrodes SE2. The change in the capacitance of the mutual capacitor is detected by the first group of second electrodes SE2. The detection circuit of the input sensor measures the current passing through the first group of second electrodes SE2, and thereby calculates the amount of change in the capacitance of the mutual capacitor. For example, among the first group of second electrodes SE2, the electrode at which the input is transmitted from the user's body part FG has a current different from that of the other electrodes. The detection circuit of the input sensor may be embedded in a separately provided driver chip of the input sensor, or may be embedded in a chip mounted on the display panel 100 (see Figure 2 ) on the driver chip DIC (see Figure 2 )middle.

[0219] Fig.16 is a plan view illustrating a second operation section of an electrode included in an input sensor according to an embodiment of the present inventive concept. Fig.16 FIG. 1 shows a first group of first electrodes SE1 and a second group of first electrodes PSE1 in which electromagnetic induction current is generated by the magnetic field signal output from the stylus pen STP. Fig.16 Electromagnetic induction current is generated in a first group of second electrodes SE2 and a second group of second electrodes PSE2 shown in FIG.

[0220] refer to Fig.10 and Fig.16 During the second operation section, the detection circuit of the input sensor may ground the second group of first signal lines PSL1 and may ground the second group of second signal lines PSL2. Fig.16 , the second pad PD2 connected to the second group of first signal lines PSL1 may be grounded, and the second pad PD2 connected to the second group of second signal lines PSL2 disposed in the left area may be grounded. The resonant circuit of the stylus STP is discharged, and accordingly, a magnetic field is generated. By the magnetic field emitted from the stylus STP, an electromagnetic induction current may be generated in the input sensor 200 inductively coupled to the resonant circuit of the stylus STP.

[0221] The first capacitor ICP1 may be defined between the first group of first electrodes SE1 and the second group of first electrodes PSE1, and the second capacitor ICP2 may be defined between the first group of second electrodes SE2 and the second group of second electrodes PSE2. Since the second group of first signal lines PSL1 is grounded, the first electromagnetic induction current IC1 may flow from the first group of first electrodes SE1 to the second group of first electrodes PSE1 through the first capacitor ICP1. In addition, since the second group of second signal lines PSL2 is grounded, the second electromagnetic induction current IC2 may flow from the first group of second electrodes SE2 to the second group of second electrodes PSE2 through the second capacitor ICP2. The detection circuit of the input sensor may detect the first electromagnetic induction current IC1 through the first group of first signal lines SL1 and the second pad PD2 connected to the first group of first signal lines SL1 and may detect the second electromagnetic induction current IC2 through the first group of second signal lines SL2 and the third pad PD3 connected to the first group of second signal lines SL2, and thus may recognize the input from the stylus STP.

[0222] According to an embodiment of the present invention, in a display device including a display panel and an input sensor, a sensing electrode for detecting an electromagnetic induction current caused by a stylus is included in the input sensor, and a charging electrode for charging the stylus is provided under at least one of the resin layers included in the base layer of the display panel. For example, in a display device according to an embodiment, a sensing electrode for detecting the input of a stylus and a charging electrode for charging the stylus can be separated by a driving element layer and a light-emitting element layer, wherein a pixel is provided between the sensing electrode and the charging electrode. Accordingly, a structure for detecting the input of a stylus and charging the stylus can be built into the display device, and the input sensor can also include a structure dedicated to detecting the input of the stylus. Accordingly, in the display device of the embodiment, the number of channels of the sensing electrode included in the input sensor can be larger, and thus the sensing electrode can have improved sensing performance. In addition, in the electronic device of the embodiment, a structure for detecting the input of the stylus pen and charging the stylus pen is built into the display device, and accordingly, the electronic device of the embodiment can have a thickness smaller than that of an electronic device (e.g., a digitizer) including a separate pen sensing and charging device, and thus can have improved folding characteristics.

[0223] 17A to 17C are cross-sectional views illustrating steps in a method for manufacturing a display device according to an embodiment of the inventive concept. 18A to 18C 2 is a cross-sectional view showing steps in a method for manufacturing a display device according to an embodiment of the inventive concept. 17A to 18C When, with reference Figures 1A to 16Components that are identical / similar to the components described may be described using identical / similar reference numerals, and if an element is not described in detail with respect to the figure, it is understood that the element is at least similar to corresponding elements that have been described elsewhere in the present disclosure. For example, 17A to 17C shows the method for making and Fig. 7A The steps in the method of the display device in the corresponding cross-sectional view, and 18A to 18C shows the method for making and Figure 7B The steps in the method of the display device in the corresponding cross-sectional view.

[0224] According to an embodiment of the present inventive concept, a method includes: providing a display panel; and forming an input sensor including a sensing electrode on the display panel. Providing the display panel includes: providing a substrate; and forming a plurality of pixels on the substrate. Providing the substrate includes: providing a lower resin layer; patterning a metal material on the lower resin layer to form a charging electrode; and forming an upper resin layer covering the charging electrode.

[0225] 17A to 17C The method for manufacturing a display device according to an embodiment of the inventive concept sequentially shows the steps of providing a substrate (corresponding to Fig. 7A The steps of the base layer 110 shown in FIG. Fig.17A , the charging electrode PCE may be formed on the first resin layer 110-1. The first resin layer 110-1 providing the substrate surface on which the charging electrode PCE is formed may be described as a "lower resin layer". The first resin layer 110-1 may be formed using a polymer resin. The first resin layer 110-1 may be formed of, for example, polyimide.

[0226] The charging electrode PCE may be formed by depositing a metal material through a deposition process to form a metal film and then patterning the metal film. The charging electrode PCE may be formed of, for example, molybdenum, silver, titanium, copper, aluminum, and / or alloys thereof.

[0227] refer to Fig.17A and Fig. 17B , the second resin layer 110-2 may be formed on the first resin layer 110-1. The second resin layer 110-2 formed on and covering the charging electrode PCE may be described as an "upper resin layer". The second resin layer 110-2 may cover at least a portion of the charging electrode PCE. The second resin layer 110-2 may be formed using a polymer resin. The second resin layer 110-2 may be formed of, for example, polyimide.

[0228] The contact hole CNH1 may be formed in the second resin layer 110-2. A portion of the upper surface of the charging electrode PCE may be exposed through the contact hole CNH1. The second resin layer 110-2 may completely cover the upper surface of the charging electrode PCE except for a portion where the contact hole CNH1 is formed.

[0229] refer to Fig. 17B and Fig. 17C , the shielding pattern BMLa and the connection line CNE1 may be formed on the second resin layer 110-2. The connection line CNE1 and the shielding pattern BMLa may be formed by the same process. For example, the conductive layer formed on the second resin layer 110-2 may be patterned to form the connection line CNE1 and the shielding pattern BMLa.

[0230] When viewed on a plane, the shielding pattern BMLa may overlap the charging electrode PCE. The shielding pattern BMLa may cover an upper portion of the charging electrode PCE. The connection line CNE1 may be connected to the charging electrode PCE through a contact hole CNH1 passing through the second resin layer 110-2. The connection line CNE1 may apply a driving signal or a ground voltage to the charging electrode PCE.

[0231] refer to Fig. 17C and Fig. 7A , after forming the substrate, the driving element layer 120, the light emitting element layer 130, and the encapsulation layer 140 may be sequentially formed on the substrate layer 110 to form the display panel 100. Thereafter, the input sensor 200 may be formed on the display panel 100. The input sensor 200 may be formed on the encapsulation layer 140. In the method for manufacturing a display device of the embodiment, the input sensor 200 including a sensing electrode for detecting an electromagnetic induction current caused by a stylus is formed on the encapsulation layer 140 and the charging electrode PCE for charging the stylus is formed under the second resin layer 110-2 included in the substrate layer 110, and accordingly, a structure for detecting an input of the stylus and charging the stylus may be built into the display device and the input sensor 200 may have a structure dedicated to detecting an input of the stylus. Accordingly, the sensing electrode may have an improved sensing performance, and an electronic device including a display device formed by the method for manufacturing a display device according to the embodiment may have an improved folding characteristic.

[0232] 18A to 18C The method for manufacturing a display device according to an embodiment of the inventive concept sequentially shows the steps of providing a substrate (corresponding to Figure 7B The steps of the base layer 110 shown in FIG. Fig.18A, the charging electrode PCE-1 may be formed on the third resin layer 110-3. The third resin layer 110-3 providing the substrate surface on which the charging electrode PCE-1 is formed may be described as a "lower resin layer". The third resin layer 110-3 may be formed using a polymer resin. The third resin layer 110-3 may be formed of, for example, polyimide.

[0233] The charging electrode PCE-1 may be formed by depositing a metal material through a deposition process to form a metal film and then patterning the metal film. The charging electrode PCE-1 may be formed of, for example, molybdenum, silver, titanium, copper, aluminum, and / or alloys thereof.

[0234] refer to Fig.18A and Fig.18B , the first resin layer 110-1 and the second resin layer 110-2 may be sequentially formed on the third resin layer 110-3. The first resin layer 110-1 formed on and covering the charging electrode PCE-1 may be described as an "upper resin layer". The first resin layer 110-1 may completely cover the charging electrode PCE-1. The first resin layer 110-1 and the second resin layer 110-2 may be formed using a polymer resin. The first resin layer 110-1 and the second resin layer 110-2 may be formed of, for example, polyimide.

[0235] After forming the first resin layer 110-1 and the second resin layer 110-2 on the third resin layer 110-3, the contact hole CNH2 may be formed in the third resin layer 110-3. A portion of the lower surface of the charging electrode PCE-1 may be exposed through the contact hole CNH2. The process of forming the contact hole CNH2 may be performed, for example, by a laser drilling process.

[0236] refer to Fig.18B and Fig. 18C , a portion of the flexible circuit board FCB may be provided under the third resin layer 110-3, and accordingly, the charging electrode PCE-1 may be electrically connected to the flexible circuit board FCB. The flexible circuit board FCB may be disposed under at least a portion of the third resin layer 110-3, and may be connected to the charging electrode PCE-1 to apply a driving signal or a ground voltage to the charging electrode PCE-1. In an embodiment, the charging electrode PCE-1 and the flexible circuit board FCB may be electrically connected through the third resin layer 110-3 disposed under the charging electrode PCE-1. In an embodiment, the charging electrode PCE may be connected to the flexible circuit board FCB through a contact hole CNH2 passing through the third resin layer 110-3. The charging electrode PCE-1 may be electrically connected to a connection line CNE2 included in the flexible circuit board FCB. For example, with Fig. 18C Different from that shown in FIG. 1 , the charging electrode PCE- 1 may be electrically connected to the flexible circuit board FCB via a separate additional connection line.

[0237] refer to Fig. 18C and Figure 7B After forming the substrate, the driving element layer 120, the light emitting element layer 130 and the encapsulation layer 140 may be sequentially formed on the substrate layer 110 to form the display panel 100. Thereafter, the input sensor 200 may be formed on the display panel 100. The input sensor 200 may be formed on the encapsulation layer 140.

[0238] According to an embodiment of the present inventive concept, a sensing electrode for detecting an input from a stylus pen and a charging electrode for charging the stylus pen are spaced apart, wherein pixels are provided between the sensing electrode and the charging electrode, thereby increasing the number of channels of the sensing electrode included in the input sensor, and accordingly, the sensing electrode can have improved sensing performance.

[0239] In the electronic device of the embodiment, a structure for detecting an input of a stylus pen and charging the stylus pen is built in the display device, and accordingly, the electronic device may have a reduced thickness and an improved folding property.

[0240] Although the inventive concept has been described with reference to various embodiments of the present disclosure, it will be understood that the inventive concept should not necessarily be limited to these embodiments, but various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the inventive concept.

Claims

1. A display device, comprising: The display panel comprises a display area and a non-display area at least partially surrounding the display area; as well as an input sensor disposed on the display panel and comprising a sensing electrode configured to detect an electromagnetic induced current, Wherein, the display panel comprises: A base layer including a plurality of resin layers; a plurality of pixels disposed on the base layer and overlapping the display area; and A charging electrode overlapping the display area, Wherein, the plurality of resin layers include: a first resin layer; and a second resin layer disposed on the first resin layer, and Wherein, the charging electrode is arranged below the second resin layer.

2. The display device according to claim 1, wherein: The charging electrode is provided on the first resin layer and is covered by the second resin layer.

3. The display device according to claim 2, wherein: The display panel further includes a shielding pattern disposed on the second resin layer and overlapping the charging electrode.

4. The display device according to claim 3, wherein: The display panel further includes a connection line connected to the charging electrode through a contact hole penetrating the second resin layer and including the same material as that included in the shield pattern.

5. The display device according to claim 1, wherein: The base layer further includes a third resin layer disposed below the first resin layer, and The charging electrode is disposed on the third resin layer and is covered by the first resin layer.

6. The display device according to claim 5, further comprising a flexible circuit board, at least a portion of which is disposed below the display panel, in, The charging electrode is electrically connected to the flexible circuit board through a contact hole defined in the third resin layer.

7. The display device according to claim 1, wherein: The display panel further includes an encapsulation layer disposed on the base layer and covering the plurality of pixels, and Wherein, the input sensor is directly arranged on the packaging layer.

8. The display device according to claim 1, wherein: Each of the plurality of pixels includes a light emitting element and at least one transistor connected to the light emitting element, and Wherein, the charging electrode overlaps with at least a portion of the light emitting element.

9. The display device according to claim 1, wherein: The charging electrode defines a current path that receives a constant voltage and generates a magnetic field from the constant voltage.

10. The display device according to claim 1, wherein: The charging electrode includes a plurality of unit charging electrodes extending in a first direction and spaced apart from each other in a second direction crossing the first direction.

11. The display device according to any one of claims 1 to 10, wherein: The charging electrode includes molybdenum, silver, titanium, copper, aluminum and / or alloys thereof.

12. The display device according to any one of claims 1 to 10, wherein: The charging electrode has a thickness of 0.1 μm to 1 μm.

13. The display device according to any one of claims 1 to 10, wherein: At least a portion of the charging electrode includes conductive wires having a mesh shape, and The conductive lines are patterned to correspond to at least some of the plurality of pixels.

14. The display device according to any one of claims 1 to 10, wherein: The sensing electrode has a thickness of 0.1 μm to 1 μm.

15. The display device according to any one of claims 1 to 10, wherein: The sensing electrode has a line resistance of 100Ω or less.

16. The display device according to any one of claims 1 to 10, wherein: At least a portion of the sensing electrode has a mesh shape.

17. The display device according to claim 1, wherein: The sensing electrode comprises: A first group of first electrodes extending in a first direction; a first set of second electrodes extending in a second direction intersecting the first direction and capacitively coupled to the first set of first electrodes; a second group of first electrodes extending in the first direction and configured to detect the electromagnetic induced current; and a second group of second electrodes extending in the second direction and configured to detect the electromagnetic induced current, and Wherein, the input sensor further comprises: A first group of first signal lines connected to one end of the first group of first electrodes; A first group of second signal lines connected to one end of the first group of second electrodes; A second group of first signal lines connected to one end of the second group of first electrodes; and A second group of second signal lines is connected to one end of the second group of second electrodes.

18. The display device according to claim 17, wherein: The first group of first electrodes comprises: A 1-1 extending portion extending in the first direction; a 1-2 extending portion extending in the first direction and spaced apart from the 1-1 extending portion in the second direction; and a first intermediate portion, disposed between one end of the 1-1 extension portion and one end of the 1-2 extension portion, and Wherein, the second group of first electrodes is arranged between the 1-1 extension portion and the 1-2 extension portion.

19. The display device according to claim 17, wherein: The first set of second electrodes comprises: A 2-1 extending portion extending in the second direction; a 2-2 extending portion extending in the second direction and spaced apart from the 2-1 extending portion in the first direction; and a second intermediate portion disposed between one end of the 2-1 extension portion and one end of the 2-2 extension portion, and Wherein, the second group of second electrodes is arranged between the 2-1 extension portion and the 2-2 extension portion.

20. An electronic device comprising: case; An electronic module is disposed in the housing; as well as A display device overlaps the electronic module, Wherein, the display device comprises: A display panel comprising a display area and a non-display area at least partially surrounding the display area; and an input sensor disposed on the display panel and configured to detect a resonance signal transmitted from a stylus including a resonance circuit, Wherein, the display panel comprises: A base layer including a plurality of resin layers; a plurality of pixels disposed on the base layer and overlapping the display area; and A charging electrode for charging the stylus, Wherein, the plurality of resin layers include: a first resin layer; and a second resin layer disposed on the first resin layer, and Wherein, the charging electrode is arranged below the second resin layer.

21. A method for manufacturing a display device, the method comprising: providing a display panel including a display area and a non-display area at least partially surrounding the display area; as well as forming an input sensor including a sensing electrode on the display panel, Wherein, the providing of the display panel includes: providing a substrate including a charging electrode and a plurality of resin layers; and forming a plurality of pixels on the substrate to overlap the display area, and Wherein, the providing of the substrate comprises: providing a lower resin layer; patterning the metal material on the lower resin layer to form the charging electrode; and An upper resin layer is formed to cover the charging electrode.

22. The method according to claim 21, wherein: The providing of the substrate further includes forming a contact hole in the lower resin layer or the upper resin layer to electrically connect the charging electrode to a connection line.

23. The method according to claim 21, wherein: The providing of the display panel further includes forming an encapsulation layer covering the plurality of pixels, and Wherein, the input sensor is formed on the packaging layer.

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