A spin-spray type wafer wet processing all-in-one machine

Abstract

The application discloses a rotary-spraying type wafer wet processing all-in-one machine which comprises a wafer processing cylinder, a spraying mechanism, a driving mechanism, a filtering mechanism and a liquid storage tank. The wafer processing cylinder is provided with a processing cavity, and a rotating frame is arranged in the processing cavity. The driving mechanism is used for driving the rotating frame to rotate, and the spraying mechanism is used for spraying liquid medicine on the wafer. The filtering mechanism comprises a filtering box and a filtering element. A liquid discharge pipe is used for discharging the processed mixed liquid into the filtering element. The liquid storage tank is used for storing the filtered liquid medicine. After the processed mixed liquid is filtered by the filtering element, the liquid medicine enters a cavity, and the filtered liquid medicine in the cavity flows into the liquid storage tank through a pipeline. The rotary-spraying type wafer wet processing all-in-one machine realizes automatic filtering of the mixed liquid, does not need frequent operation of the operator, saves time and effort, and meanwhile, the liquid medicine or cleaning liquid flowing back to the liquid storage tank can be reused after being filtered, so that the processing cost of the wafer is greatly reduced.

Description

Technical Field

[0001] This invention belongs to the technical field of wafer processing equipment, and in particular relates to a rotary spray type integrated machine for wet wafer processing. Background Technology

[0002] The rotary spray wafer wet processing machine is a wet drying machine used in the semiconductor industry for wafer manufacturing. It can be used for wet processing of strong acids, strong alkalis, organic solvents, etc., and is suitable for most wet processes of wafers from 2 inches to 12 inches.

[0003] Currently, conventional spin-jet wet wafer processing machines require the use of chemicals to remove the photoresist from the wafer surface within the wafer processing cylinder during the photoresist removal process. The removed photoresist detaches into the chemical solution and is discharged from the wafer processing cylinder along with the solution, resulting in chemical waste. Existing spin-jet wet wafer processing machines employ a method where a filter bag is placed at the outlet of the wafer processing cylinder. The filter bag separates the photoresist from the chemical solution, collecting the photoresist within it. The filtered chemical solution then flows back to the chemical solution storage tank through a pipeline, avoiding waste. However, in actual operation, the filter bag needs to be replaced when it reaches a certain amount of photoresist. Obviously, this method is inconvenient, requires frequent replacement by operators, and is time-consuming and labor-intensive. Summary of the Invention

[0004] The purpose of this invention is to provide a rotary spray wafer wet processing integrated machine to solve the problem that conventional rotary spray wafer wet processing integrated machines require operators to frequently change filter bags, resulting in inconvenience in operation.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A rotary spray type wet wafer processing machine includes a frame and a wafer processing cylinder, a spraying mechanism, a drive mechanism, a filtration mechanism, and a liquid storage tank disposed on the frame, wherein:

[0007] The wafer processing cylinder has a processing cavity for wafer processing, and a rotating frame for carrying the wafer to be processed is rotatably disposed in the processing cavity; the fixed end of the driving mechanism is mounted on the wafer processing cylinder, and the driving end of the driving mechanism extends into the processing cavity and is connected to the rotating frame; the driving mechanism is configured to drive the rotating frame to rotate, thereby causing the wafer to be processed to rotate.

[0008] The spraying mechanism is mounted on the wafer processing cylinder and is configured to spray the chemical solution or cleaning water onto the wafer located in the processing chamber to treat the wafer surface.

[0009] The filtration mechanism includes a filter box and a filter element. The filter box is connected to the processing chamber via a drain pipe. The drain pipe is configured to discharge the mixed liquid after treatment in the processing chamber into the filter element. The filter element has multiple filter holes. A cavity for temporarily storing the filtered medicine or cleaning water is formed between the filter element and the filter box. The storage tank is configured to store the filtered medicine or cleaning water. The cavity is connected to the storage tank via a pipeline. After the treated mixed liquid is filtered by the filter element, the medicine or cleaning water enters the cavity. The filtered medicine or cleaning water in the cavity flows into the storage tank via a pipeline.

[0010] Furthermore, the spraying mechanism includes a nozzle assembly and a fine filter assembly. The nozzle assembly is mounted on the wafer processing cylinder, with the spray end of the nozzle assembly facing the wafer to be processed. The nozzle assembly is connected to the first end of the fine filter assembly via a pipeline, and the second end of the fine filter assembly is connected to the storage tank via a pipeline. The fine filter assembly is configured to perform secondary fine filtration on the filtered drug solution or cleaning water. The filtered drug solution or cleaning water located in the storage tank is transported to the nozzle assembly after secondary fine filtration by the fine filter assembly.

[0011] Furthermore, the nozzle assembly includes several liquid supply channels and several sets of nozzle units, wherein:

[0012] The wafer processing cylinder has several liquid supply channels spaced circumferentially inside its inner wall, and each liquid supply channel corresponds to a set of nozzle units.

[0013] Each group of nozzle units includes a plurality of nozzles spaced apart along the length of the liquid supply channel. The wafer processing barrel is provided with a mounting hole that penetrates the liquid supply channel for each nozzle. Each nozzle is rotatably mounted in the corresponding mounting hole.

[0014] Each nozzle includes a first nozzle and a second nozzle. The first end of the second nozzle extends into the cavity of the wafer processing cylinder, and the second end of the second nozzle has a groove. A liquid spraying channel is provided inside the second nozzle. The first end of the first nozzle has a protrusion, and the second end of the first nozzle has an adjustment part. The first nozzle and the second nozzle are sealed and installed in the corresponding mounting holes. The protrusion is located in the groove, and a liquid distribution channel is formed between the protrusion and the groove. The first end of the liquid distribution channel is connected to the liquid supply channel, and the second end of the liquid distribution channel is connected to the liquid spraying channel. The first nozzle is rotated by adjusting the adjustment part, which in turn drives the second nozzle to rotate, thereby adjusting the liquid spraying angle of the nozzle.

[0015] Furthermore, each group of nozzle units also includes a pressure plate, which is detachably fixed to the outer wall of the wafer processing cylinder and presses against the adjustment portion of all the first nozzles of each group of nozzle units to fix all the nozzles of each group of nozzle units in the corresponding mounting holes. The pressure plate is provided with a through hole corresponding to the adjustment portion of each first nozzle, and a set of fixing holes is provided on the pressure plate corresponding to each nozzle. A threaded hole is provided on the wafer processing cylinder corresponding to the fixing hole, and a fixing screw passes through the fixing hole and is fixed in the corresponding threaded hole to detachably fix the pressure plate to the outer wall of the wafer processing cylinder.

[0016] Furthermore, the filtration mechanism also includes a cleaning pipe, a first control valve, and an air blowing assembly. The first end of the cleaning pipe is connected to the bottom end of the filter element, and the second end of the cleaning pipe is connected to the plant sewage pipe. After the treated mixed liquid is filtered by the filter element, the medicine or cleaning water enters the cavity. The colloids in the mixed liquid are separated into the filter element and discharged into the plant sewage pipe through the cleaning pipe. The first control valve is installed on the cleaning pipe and is configured to control the opening and closing of the cleaning pipe. The air blowing assembly is installed on the filter box, and the air blowing end of the air blowing assembly faces the filter element. The air blowing assembly is configured to blow air towards the colloids deposited in the filter element during sewage discharge.

[0017] During normal operation, the first control valve is in the closed state, and the colloid filtered by the filter element is deposited at the bottom of the filter element. When the amount of colloid deposited in the filter element reaches a preset value, the first control valve is in the open state, and at the same time, the air blowing assembly blows air into the colloid deposited in the filter element, so that the colloid in the filter element is discharged into the plant sewage pipe through the cleaning pipe.

[0018] Furthermore, the filtration mechanism also includes a rinsing assembly, which is configured to rinse the filter element after the colloid inside the filter element is discharged into the cleaning pipe, thereby cleaning the filter element. The rinsing assembly includes a rinsing pipe and a rinsing connector. The rinsing connector is installed on the filter box. The first end of the rinsing pipe is connected to the rinsing pipeline of the processing chamber. The cleaning water after cleaning the wafer processing chamber flows into the rinsing pipe through the rinsing pipeline. The second end of the rinsing pipe is installed on the rinsing connector.

[0019] Furthermore, the drive mechanism includes a drive motor and a first protective cover, wherein:

[0020] The fixed end of the drive motor is mounted on the wafer processing cylinder, and the drive end of the drive motor extends into the wafer processing cylinder and is connected to the rotating frame. The first protective cover is sealed and installed around the drive motor. An air inlet is provided inside the first protective cover, and gas is supplied into the first protective cover through the air inlet to create a positive pressure inside the first protective cover to prevent external gas from entering the first protective cover.

[0021] Furthermore, the rotary jet wafer wet processing integrated machine also includes a moving base and a locking assembly, wherein:

[0022] The wafer processing cylinder is mounted on the movable base, which is reciprocally mounted on the rack in a first direction to move the wafer processing cylinder to a working position or an operating position. The working position is located inside the rack, and the operating position is located outside the rack.

[0023] The locking component is configured to secure the movable seat, which is in the working position, to the frame.

[0024] Furthermore, the locking assembly includes two locking units spaced apart along a second direction. Each locking unit includes a locking element, a first disassembly assembly, and a second disassembly assembly. The locking element is a "Z"-shaped plate. The upper end of the locking element is detachably mounted on a preset position of the movable seat via the first disassembly assembly, and the lower end of the locking element plate is detachably mounted on a preset position of the frame via the second disassembly assembly.

[0025] Furthermore, the rotary jet wafer wet processing integrated machine also includes an automatic lifting door mounted on the frame, the automatic lifting door comprising a first drive assembly, a lifting component, a second drive assembly, and a door panel assembly; wherein:

[0026] The rack is provided with a first clearance hole, which is at the same height as the opening of the processing cavity of the wafer processing cylinder. The lifting component is movably mounted on the rack. The fixed end of the first drive assembly is mounted on the rack, and the drive end of the first drive assembly is connected to the lifting component. The first drive assembly is configured to drive the lifting component to move up and down.

[0027] The fixed end of the second drive member is mounted on the lifting member, and the drive end of the second drive member is connected to the door panel assembly. The second drive member is configured to drive the door panel assembly closer to or further away from the frame.

[0028] The first drive component drives the lifting member to rise to the height corresponding to the first clearance hole, and the second drive component drives the door panel assembly to move closer to the frame, so that the door panel assembly passes through the first clearance hole and closes the opening of the processing cavity.

[0029] Compared with existing technologies, the advantages of the described rotary jet wafer wet processing integrated machine are as follows:

[0030] 1) Through the cooperation of the spraying mechanism, drive mechanism, filtration mechanism and storage tank, the spraying mechanism sprays the chemical solution or cleaning water onto the wafer located in the processing chamber to treat the wafer surface. The drain pipe discharges the mixed liquid after treatment in the processing chamber into the filter element. After the mixed liquid is filtered by the filter element, the chemical solution or cleaning water enters the chamber. The filtered chemical solution or cleaning water in the chamber flows into the storage tank through the pipeline. This realizes automatic filtration of the mixed liquid, eliminates the need for frequent operation by operators, saves time and labor. At the same time, the chemical solution or cleaning solution that flows back to the storage tank can be reused after fine filtration, which greatly reduces the processing cost of the wafer.

[0031] 2) By cooperating with the first and second nozzles, the nozzles can adjust the spray angle in the wafer processing cylinder, and at the same time, the liquid in the liquid supply channel is diverted, so that the nozzles clean the wafer more evenly and improve the wafer processing effect.

[0032] 3) Through the cooperation of the first control valve, the air blowing assembly and the filter element, the filtered colloid is first deposited in the filter element, and then discharged through the cleaning pipe after a certain amount of colloid has been deposited. This avoids the colloid clogging the filter pores of the filter element and improves the filtration efficiency and filtration effect of the filter element.

[0033] 4) A rinsing component is provided to rinse the filter element after sewage discharge, so as to prevent residual colloids from clogging the filter pores. Moreover, the rinsing component uses the secondary water used for wafer cleaning to clean the filter element, which saves water while ensuring rinsing effect, which is conducive to saving and reducing emissions and reducing production costs.

[0034] 5) With the cooperation of the moving base and the locking component, the moving base can be reciprocated along the first direction and installed on the rack to move the wafer processing tube to the working position or the operating position. The locking component fixes the moving base in the working position to the rack. When it is necessary to pick up or put down materials or perform maintenance, the operator only needs to move the moving base from the working position to the operating position to carry out subsequent operations, which is convenient.

[0035] 6) The opening and closing door of the rotary spray wafer wet processing integrated machine is set to a lifting type by means of the first drive component, the lifting component, the second drive component and the door panel component, which saves space. Attached Figure Description

[0036] To more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the accompanying drawings used in the background technology and embodiment descriptions of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0037] Figure 1 This is a three-dimensional structural schematic diagram of the rotary spray type wafer wet processing integrated machine provided in an embodiment of the present invention;

[0038] Figure 2 This is a three-dimensional structural schematic diagram of the spraying mechanism provided in an embodiment of the present invention;

[0039] Figure 3 This is a three-dimensional structural diagram of the nozzle assembly provided in an embodiment of the present invention;

[0040] Figure 4 This is a three-dimensional structural schematic diagram of the driving mechanism provided in an embodiment of the present invention;

[0041] Figure 5 This is another three-dimensional structural schematic diagram of the driving mechanism provided in the embodiment of the present invention;

[0042] Figure 6 This is a three-dimensional structural diagram of the filtration mechanism provided in an embodiment of the present invention;

[0043] Figure 7 This is another three-dimensional structural schematic diagram of the filtration mechanism provided in the embodiment of the present invention;

[0044] Figure 8 This is a three-dimensional structural diagram of the automatic lifting door provided in an embodiment of the present invention;

[0045] Figure 9 This is a cross-sectional schematic diagram of an automatic lifting door provided in an embodiment of the present invention. Detailed Implementation

[0046] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0047] To facilitate understanding of the present invention, a more complete description of the invention will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0048] Please see Figures 1 to 9 As shown, in this embodiment, a rotary spray type integrated wafer wet processing machine includes a frame 1 and a wafer processing cylinder 2, a spraying mechanism 3, a drive mechanism 4, a filtration mechanism 5, and a storage tank 6 disposed on the frame 1. The wafer processing cylinder 2 has a processing chamber 20 for wafer processing, and a rotating frame 21 for carrying the wafer to be processed is rotatably disposed within the processing chamber 20. The fixed end of the drive mechanism 4 is mounted on the wafer processing cylinder 2, and the drive end of the drive mechanism 4 extends into the processing chamber 20 and is connected to the rotating frame 21. The drive mechanism 4 is configured to drive the rotating frame 21 to rotate, thereby rotating the wafer to be processed. The spraying mechanism 3 is mounted on the wafer processing cylinder 2 and is configured to spray a chemical solution or cleaning water onto the wafer located in the processing chamber 20. The wafer surface is treated. The filtration mechanism 5 includes a filter box 50 and a filter element 51. The filter box 50 is connected to the processing chamber 20 through a drain pipe 52. The drain pipe 52 is configured to discharge the mixed liquid after treatment in the processing chamber 20 into the filter element 51. The filter element 51 has multiple filter holes 510. A cavity 500 for temporarily storing the filtered medicine or cleaning water is formed between the filter element 51 and the filter box 50. The storage tank 6 is configured to store the filtered medicine or cleaning water. The cavity 500 is connected to the storage tank 6 through a pipeline. After the treated mixed liquid is filtered by the filter element 51, the medicine or cleaning water enters the cavity 500. The filtered medicine or cleaning water in the cavity 500 flows into the storage tank 6 through the pipeline.

[0049] As can be seen, through the cooperation of the spraying mechanism 3, the driving mechanism 4, the filtering mechanism 5, and the storage tank 6, the spraying mechanism 3 sprays the chemical solution or cleaning water onto the wafer located in the processing chamber 20 to treat the wafer surface. The drain pipe 52 discharges the mixed liquid after treatment in the processing chamber 20 into the filter element 51. After the treated mixed liquid is filtered by the filter element 51, the chemical solution or cleaning water enters the chamber 500. The filtered chemical solution or cleaning water in the chamber 500 flows into the storage tank 6 through the pipeline. This realizes the automatic filtration of the mixed liquid, eliminates the need for frequent operation by operators, and saves time and effort. At the same time, the chemical solution or cleaning solution that flows back to the storage tank 6 can be reused after fine filtration, which greatly reduces the processing cost of the wafer.

[0050] In one embodiment, the spraying mechanism 3 includes a nozzle assembly and a fine filter assembly. The nozzle assembly is mounted on the wafer processing cylinder 2, with the spray end of the nozzle assembly facing the wafer to be processed. The nozzle assembly is connected to the first end of the fine filter assembly through a pipeline, and the second end of the fine filter assembly is connected to the storage tank 6 through a pipeline. The fine filter assembly is configured to perform secondary fine filtration on the filtered drug solution or cleaning water. The filtered drug solution or cleaning water located in the storage tank 6 is transported to the nozzle assembly after secondary fine filtration by the fine filter assembly.

[0051] In one embodiment, the nozzle assembly includes several liquid supply channels 30 and several sets of nozzle units 31, wherein: several liquid supply channels 30 are circumferentially spaced inside the wall of the wafer processing barrel 2, and each liquid supply channel 30 corresponds to a set of nozzle units 31; each set of nozzle units 31 includes multiple nozzles spaced along the length of the liquid supply channel 30, and the wafer processing barrel 2 is provided with a mounting hole penetrating the liquid supply channel 30 for each nozzle, and each nozzle is rotatably mounted in the corresponding mounting hole; each nozzle includes a first nozzle 310 and a second nozzle 311, the first end of the second nozzle 311 extending into the cavity 500 of the wafer processing barrel 2, the second nozzle 311 extending into the cavity 500 of the wafer processing barrel 2, the third nozzle 311 extending into the cavity 500 of the wafer processing barrel 2, the second ... The second end of the second nozzle 311 has a groove 34, and a liquid spraying channel is provided inside the second nozzle 311. The first end of the first nozzle 310 has a protrusion 33, and the second end of the first nozzle 310 has an adjustment part. After the first nozzle 310 and the second nozzle 311 are sealed and installed in corresponding mounting holes, the protrusion 33 is located in the groove 34, and a liquid distribution channel 32 is formed between the protrusion 33 and the groove 34. The first end of the liquid distribution channel 32 is connected to the liquid supply channel 30, and the second end of the liquid distribution channel 32 is connected to the liquid spraying channel. The first nozzle 310 is rotated by adjusting the adjustment part, which in turn drives the second nozzle 311 to rotate, so as to adjust the spraying angle of the nozzle.

[0052] As can be seen, by cooperating with the first nozzle 310 and the second nozzle 311, the nozzle can adjust the spray angle in the wafer processing cylinder 2, and at the same time, the liquid in the liquid supply channel 30 is diverted, so that the nozzle cleans the wafer more evenly and improves the wafer processing effect.

[0053] Specifically, each nozzle unit 31 also includes a pressure plate 35, which is detachably fixed to the outer wall of the wafer processing cylinder 2 and presses against the adjustment part of all the first nozzles 310 of each nozzle unit 31 to fix all the nozzles of each nozzle unit 31 in the corresponding mounting holes. The pressure plate 35 is provided with through holes corresponding to the adjustment part of each first nozzle 310. Obviously, fixing the nozzle by the pressure plate 35 is simple in structure, improves the installation stability of the nozzle, and is also easy to disassemble and install, which facilitates the later maintenance of the nozzle.

[0054] Specifically, a set of fixing holes is provided on the pressure plate 35 for each nozzle 31, and a threaded hole is provided on the wafer processing cylinder 2 for the corresponding fixing hole. The fixing screw passes through the fixing hole and is fixed in the corresponding threaded hole so that the pressure plate 4 can be detachably fixed to the outer wall of the wafer processing cylinder 2.

[0055] In one embodiment, the filtration mechanism 5 further includes a cleaning pipe 53, a first control valve 54, and an air blowing assembly 55. The first end of the cleaning pipe 53 is connected to the bottom end of the filter element 51, and the second end of the cleaning pipe 53 is connected to the plant's sewage pipe. After the treated mixed liquid is filtered by the filter element 51, the medicine or cleaning water enters the cavity 500. The colloids in the mixed liquid are separated into the filter element 51 and discharged into the plant's sewage pipe through the cleaning pipe 53. The first control valve 54 is installed on the cleaning pipe 53 and is configured to control the opening and closing of the cleaning pipe 53. The air blowing assembly... The air blowing assembly 55 is installed on the filter box 50, and the air blowing end of the air blowing assembly 55 is set towards the filter element 51. The air blowing assembly 55 is configured to blow air towards the colloid deposited in the filter element 51 during sewage discharge. During normal operation, the first control valve 54 is in the closed state, and the colloid filtered by the filter element 51 is deposited at the bottom of the filter element 51. When the amount of colloid deposited in the filter element 51 reaches a preset value, the first control valve 54 is in the open state, and at the same time, the air blowing assembly 55 blows air into the colloid deposited in the filter element 51, so that the colloid in the filter element 51 is discharged into the plant sewage pipe through the cleaning pipe 53.

[0056] As can be seen, through the cooperation of the first control valve 54, the air blowing assembly 55 and the filter element 51, the filtered colloid is first deposited in the filter element 51, and then discharged through the cleaning pipe 53 after a certain amount of colloid has been deposited. This avoids the colloid clogging the filter holes 510 of the filter element 51 and improves the filtration efficiency and filtration effect of the filter element 51.

[0057] In one embodiment, the filtration mechanism 5 also includes a rinsing assembly 56, which is configured to rinse the filter element 51 after the colloid in the filter element 51 is discharged into the cleaning pipe 53, so as to clean the filter element 51. The rinsing assembly 56 includes a rinsing pipe and a rinsing connector. The rinsing connector is installed on the filter box 50. The first end of the rinsing pipe is connected to the rinsing pipeline of the processing chamber 20. The cleaning water after cleaning the wafer processing chamber 20 flows into the rinsing pipe through the rinsing pipeline. The second end of the rinsing pipe is installed on the rinsing connector.

[0058] As can be seen, a rinsing component 56 is provided to rinse the filter element 51 after sewage discharge, so as to prevent residual colloids from clogging the filter holes 510 of the filter element 51. Moreover, the rinsing component 56 uses secondary water from wafer cleaning to clean the filter element 51, which saves water while ensuring rinsing effect, which is conducive to saving and reducing emissions and lowering production costs.

[0059] Specifically, the filter element 51 has a conical structure that is larger at the top and smaller at the bottom. The density of the filter holes 510 on the filter element 51 increases from top to bottom, and the pore size of the filter holes 510 on the filter element 51 decreases from top to bottom.

[0060] Specifically, the storage tank 6 is located below the box body, and the filtered medicine in the cavity 500 flows into the storage tank 6 by its own weight.

[0061] In one embodiment, the drive mechanism 4 includes a drive motor 40 and a first protective cover 41, wherein: the fixed end of the drive motor 40 is mounted on the wafer processing cylinder 2, and the drive end of the drive motor 40 extends into the wafer processing cylinder 2 and is connected to the rotating frame 21; the first protective cover 41 is sealed and mounted on the periphery of the drive motor 40, and an air inlet 410 is provided inside the first protective cover 41, through which gas is supplied into the first protective cover 41, so that a positive pressure is formed inside the first protective cover 41 to prevent external gas from entering the first protective cover 41.

[0062] As can be seen, by opening an air inlet 410 on the first protective cover 41, the first protective cover 41 is sealed and installed around the drive motor 40. Gas is supplied into the first protective cover 41 through the air inlet, so that a positive pressure is formed inside the first protective cover 41 to prevent external gas from entering the first protective cover 41. This can effectively prevent the evaporated medicine or cleaning water from sticking to the surface of the drive motor 40, and greatly improve the service life of the drive motor 40.

[0063] Specifically, the gas is nitrogen, which is configured to protect and cool the drive motor 40 when it is operating.

[0064] As one embodiment, a rotary spray type wafer wet processing integrated machine further includes a movable base 7 and a locking assembly 8, wherein: the wafer processing cylinder 2 is mounted on the movable base 7, and the movable base 7 can move along a first direction ( Figure 1 The wafer processing tube 2 is reciprocally mounted on the rack 1 in the X direction to move the wafer processing tube 2 to a working position or an operating position, wherein the working position is located inside the rack 1 and the operating position is located outside the rack 1; the locking assembly 8 is configured to fix the moving seat 7 in the working position to the rack 1.

[0065] As can be seen, with the cooperation of the movable seat 7 and the locking component 8, the movable seat 7 can be reciprocated and installed on the frame 1 in the first direction to move the wafer processing cylinder 2 to the working position or the operating position. The locking component 8 fixes the movable seat 7 in the working position to the frame 1. When it is necessary to pick up or put down materials or perform maintenance, the operator only needs to move the movable seat 7 from the working position to the operating position to carry out subsequent operations, which is convenient.

[0066] In one implementation, the locking component 8 includes two components along the second direction ( Figure 1 The locking units are spaced apart in the Y direction. Each locking unit includes a locking element 80, a first disassembly assembly 81, and a second disassembly assembly 82. The locking element 80 is a "Z"-shaped plate. The upper end of the locking element 80 is detachably mounted on the preset position of the movable seat 7 through the first disassembly assembly 81, and the lower end of the locking element 80 is detachably mounted on the preset position of the frame 1 through the second disassembly assembly 82.

[0067] Specifically, the locking member 80 has a reinforcing structure in the middle, which is a reinforcing rib 83. The first end of the reinforcing rib 83 is located in the middle of the locking member 80 along the height direction, and the second end of the reinforcing rib 83 extends to the lower end of the locking member 80.

[0068] Clearly, by setting up a reinforced structure, the strength of the locking component 80 has been greatly improved, and its service life has been extended.

[0069] Specifically, the two ends of the bottom of the movable seat 7 are slidably mounted on the frame 1 via sliding units. The sliding units include a first concave slide rail 84 mounted on the bottom of the movable seat 7 and a second concave slide rail 85 mounted on the frame 1. The concave surfaces of the first concave slide rail 84 and the second concave slide rail 85 are arranged opposite to each other. The first concave slide rail 84 is slidably mounted in the concave surface of the second concave slide rail 85. Through the sliding cooperation of the first concave slide rail 84 and the second concave slide rail 85, the movable seat 7 can be slidably mounted on the frame 1.

[0070] Obviously, through the sliding engagement of the first concave slide rail 84 and the second concave slide rail 85, the movable seat 7 can be slidably mounted on the frame 1, and the sliding method is simple and easy to implement.

[0071] In one embodiment, a rotary spray type wafer wet processing integrated machine further includes an automatic lifting door 9 mounted on a frame 1. The automatic lifting door 9 includes a first drive assembly 90, a lifting component 91, a second drive component 92, and a door panel assembly 93. Specifically, a first clearance hole 10 is provided on the frame 1, and the first clearance hole 10 is at the same height as the opening of the processing chamber 20 of the wafer processing cylinder 2. The lifting component 91 is vertically and vertically mounted on the frame 1. The fixed end of the first drive assembly 90 is mounted on the frame 1, and the driving end of the first drive assembly 90 is connected to the lifting component. 91. The first drive assembly 90 is configured to drive the lifting member 91 to rise and fall; the fixed end of the second drive assembly 92 is mounted on the lifting member 91, and the driving end of the second drive assembly 92 is connected to the door panel assembly 93. The second drive assembly 92 is configured to drive the door panel assembly 93 to move closer to or away from the frame 1; the first drive assembly 90 drives the lifting member 91 to rise to the height corresponding to the first clearance hole 10, and the second drive assembly 92 drives the door panel assembly 93 to move closer to the frame 1, so that the door panel assembly 93 passes through the first clearance hole 10 and closes the opening of the processing cavity 20.

[0072] As can be seen, the opening and closing door of the rotary spray wafer wet processing integrated machine is set to a lifting type by means of the first drive component 90, the lifting component 91, the second drive component 92 and the door panel component 93, which saves space.

[0073] The working principle of the above-mentioned rotary jet wafer wet processing integrated machine for chemical filtration is as follows:

[0074] S1, the wafer to be processed is placed on the rotating frame 21, the driving mechanism 4 drives the rotating frame 21 to rotate, and at the same time the spraying mechanism 3 sprays the liquid onto the wafer located in the processing chamber 20 to process the wafer surface.

[0075] S2, the drain pipe 52 drains the mixed liquid after treatment in the treatment chamber 20 into the filter element 51. The filter element 51 filters the mixed liquid after treatment through multiple filter holes 510. After the mixed liquid is filtered by the filter element 51, the medicine enters the chamber 500. The medicine filtered in the chamber 500 flows into the storage tank 6 through the pipeline.

[0076] S3, when the amount of colloid deposited in the filter element 51 reaches the preset value, the first control valve 54 switches to the open state, and at the same time, the air blowing assembly 55 blows air downward into the filter element 51, so that the colloid in the filter element 51 is discharged into the cleaning pipe 53. After the colloid in the filter element 51 is discharged into the cleaning pipe 53, the flushing assembly 56 sprays cleaning water onto the filter element 51 to clean the colloid remaining on the surface of the filter element 51.

[0077] S4, the filtered medicine in the storage tank 6 is transported to the nozzle assembly after secondary fine filtration by the fine filtration component.

[0078] S5, the nozzle assembly processes the wafer in the processing chamber 20 to achieve the recycling of the liquid.

[0079] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above examples. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A spin-spray type wafer wet processing all-in-one machine, characterized in that, The rotary spray wafer wet processing all-in-one machine comprises a rack, a wafer processing cylinder, a spraying mechanism, a driving mechanism, a filtering mechanism and a liquid storage tank arranged on the rack, wherein: The wafer processing cylinder has a processing cavity for wafer processing, and a rotating frame for carrying the wafer to be processed is rotatably arranged in the processing cavity; the fixed end of the driving mechanism is mounted on the wafer processing cylinder, the driving end of the driving mechanism extends into the processing cavity and is connected to the rotating frame, and the driving mechanism is configured to drive the rotating frame to rotate to drive the wafer to be processed to rotate; The spraying mechanism is mounted on the wafer processing cylinder, and the spraying mechanism is configured to spray liquid medicine or cleaning water onto the wafer located in the processing cavity to perform processing on the wafer surface; The filtering mechanism comprises a filtering box and a filter element, the filtering box is connected to the processing cavity through a liquid discharge pipe, the liquid discharge pipe is configured to discharge the mixed liquid after processing in the processing cavity into the filter element, a plurality of filter holes are formed in the filter element, a cavity for temporarily storing the filtered liquid medicine or cleaning water is formed between the filter element and the filtering box, the liquid storage tank is configured to store the filtered liquid medicine or cleaning water, the cavity is connected to the liquid storage tank through a pipeline, and after the processed mixed liquid is filtered by the filter element, the liquid medicine or cleaning water enters the cavity, and the filtered liquid medicine or cleaning water in the cavity flows into the liquid storage tank through the pipeline.

2. The spin-spray wafer wet processing all-in-one machine according to claim 1, wherein, The spraying mechanism comprises a spray head assembly and a fine filtering assembly, the spray head assembly is mounted on the wafer processing cylinder, the water spraying end of the spray head assembly faces the wafer to be processed, the spray head assembly is connected to the first end of the fine filtering assembly through a pipeline, the second end of the fine filtering assembly is connected to the liquid storage tank through a pipeline, and the fine filtering assembly is configured to perform secondary fine filtering on the filtered liquid medicine or cleaning water, and the filtered liquid medicine or cleaning water in the liquid storage tank is transported to the spray head assembly after secondary fine filtering by the fine filtering assembly.

3. The spin-spray wafer wet processing all-in-one machine according to claim 2, wherein, The spray head assembly comprises a plurality of liquid supply channels and a plurality of groups of nozzle units, wherein: The plurality of liquid supply channels are arranged in the circumferential direction at intervals in the cylinder wall of the wafer processing cylinder, and each liquid supply channel corresponds to a group of nozzle units; Each group of nozzle units comprises a plurality of nozzles arranged at intervals along the length direction of the liquid supply channel, and the wafer processing cylinder is provided with a mounting hole penetrating the liquid supply channel corresponding to each nozzle, and each nozzle is rotatably mounted in the corresponding mounting hole; Each of the nozzles comprises a first nozzle and a second nozzle, a first end of the second nozzle extends into a cavity of the wafer processing cylinder, a second end of the second nozzle is provided with a groove, a liquid spraying channel is arranged in the second nozzle, a first end of the first nozzle is provided with a protruding part, a second end of the first nozzle is provided with an adjusting part, after the first nozzle and the second nozzle are sealingly installed in the corresponding mounting holes, the protruding part is located in the groove, a liquid distribution channel is formed between the protruding part and the groove, a first end of the liquid distribution channel is in communication with the liquid supply channel, a second end of the liquid distribution channel is in communication with the liquid spraying channel, the liquid spraying angle of the nozzle is adjusted by rotating the first nozzle through the adjusting part, and then the second nozzle is rotated to adjust the liquid spraying angle of the nozzle.

4. The spin-spray wafer wet processing all-in-one machine according to claim 3, wherein, Each of the nozzle units further comprises a pressing plate, the pressing plate is detachably fixed to the outer wall of the wafer processing cylinder and is pressed against the adjusting part of each of the first nozzles of each of the nozzle units, so as to fixedly install all of the nozzles of each of the nozzle units in the corresponding mounting holes, a through hole corresponding to each of the adjusting parts of the first nozzles is arranged on the pressing plate, a group of fixing holes corresponding to each of the nozzles are arranged on the pressing plate, threaded holes corresponding to the fixing holes are arranged on the wafer processing cylinder, and a fixing screw passes through the fixing hole and is fixed in the corresponding threaded hole, so as to detachably fix the pressing plate to the outer wall of the wafer processing cylinder.

5. The spin-spray wafer wet processing all-in-one machine according to claim 1, wherein, The filtering mechanism further comprises a cleaning pipe, a first control valve and a blowing assembly, a first end of the cleaning pipe is in communication with a bottom end of the filter, a second end of the cleaning pipe is connected to a factory sewage pipe, after the mixed liquid is filtered by the filter, the liquid medicine or the cleaning water enters the cavity, the colloid in the mixed liquid is separated into the filter and is discharged into the factory sewage pipe through the cleaning pipe, the first control valve is arranged on the cleaning pipe, the first control valve is configured to control the opening and closing of the cleaning pipe, and the blowing assembly is installed on the filter box, a blowing end of the blowing assembly is arranged towards the filter, and the blowing assembly is configured to blow air towards the colloid deposited in the filter. In normal operation, the first control valve is in a closed state, and the colloid filtered by the filter is deposited at the bottom of the filter; when the deposition amount of the colloid in the filter reaches a preset value, the first control valve is in an open state, and the blowing assembly blows air towards the colloid deposited in the filter, so that the colloid in the filter is discharged into the factory sewage pipe through the cleaning pipe.

6. The spin-spray wafer wet processing all-in-one machine according to claim 5, wherein, The filtering mechanism further comprises a flushing assembly, the flushing assembly is configured to flush the filter after the colloid in the filter is discharged into the cleaning pipe, so as to clean the filter, the flushing assembly comprises a flushing pipe and a flushing connector, the flushing connector is installed on the filter box, a first end of the flushing pipe is in communication with a flushing pipeline of the processing cavity, cleaning water after cleaning the wafer processing cavity flows into the flushing pipe through the flushing pipeline, and a second end of the flushing pipe is installed on the flushing connector.

7. The spin-shooter wafer wet processing all-in-one machine according to claim 1, wherein, The driving mechanism comprises a driving motor and a first protective cover, wherein: The fixed end of the driving motor is mounted on the wafer processing cylinder, the driving end of the driving motor extends into the wafer processing cylinder and is connected to the rotating frame, the first protective cover is sealingly mounted on the periphery of the driving motor, a gas inlet is arranged in the first protective cover, and gas is sent into the first protective cover through the gas inlet to form a positive pressure in the first protective cover to prevent external gas from entering the first protective cover.

8. The spin-shooter wafer wet processing all-in-one machine according to claim 1, wherein, The rotating-jet wafer wet processing all-in-one machine further comprises a moving seat and a locking assembly, wherein: The wafer processing cylinder is mounted on the moving seat, the moving seat is reciprocally movably mounted on the rack in a first direction to move the wafer processing cylinder to a working position or an operating position, the working position is located in the rack, and the operating position is located outside the rack; The locking assembly is configured to fix the moving seat in the working position on the rack.

9. The spin-spray wafer wet processing all-in-one machine according to claim 8, wherein, The locking assembly comprises two locking units spaced apart in a second direction, each locking unit comprises a locking piece, a first dismounting assembly and a second dismounting assembly, the locking piece is a "Z" type plate, the upper end of the locking piece is detachably mounted at a preset position of the moving seat through the first dismounting assembly, and the lower end of the locking piece is detachably mounted at a preset position of the rack through the second dismounting assembly.

10. The spin-spray wafer wet processing all-in-one machine of claim 1, wherein, The rotating-jet wafer wet processing all-in-one machine further comprises an automatic lifting door arranged on the rack, the automatic lifting door comprises a first driving assembly, a lifting piece, a second driving piece and a door plate assembly; wherein: The rack is provided with a first avoiding hole, the first avoiding hole is at the same height as the opening of the processing cavity of the wafer processing cylinder, the lifting piece is movably mounted on the rack, the fixed end of the first driving assembly is mounted on the rack, the driving end of the first driving assembly is connected to the lifting piece, and the first driving assembly is configured to drive the lifting piece to move up and down; The fixed end of the second driving piece is mounted on the lifting piece, the driving end of the second driving piece is connected to the door plate assembly, and the second driving piece is configured to drive the door plate assembly to move close to or away from the rack; The first driving assembly drives the lifting piece to rise to the height corresponding to the first avoiding hole, and the second driving piece drives the door plate assembly to move close to the rack, so that the door plate assembly passes through the first avoiding hole and closes the opening of the processing cavity.

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