A method and device for adaptive debugging of a field lens

Abstract

The present invention discloses a method and device for adaptive debugging of a field lens, relating to the technical field of laser cutting, and comprising the following steps: determining a suitable distance between the field lens and a black photographic paper; judging whether there is an angular inclination in the installation of the field lens; and correcting a cutting curve. During the process of installing and debugging the field lens, it is no longer necessary for technicians to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust a microscope to measure the etching marks of the laser-etched black photographic paper. The suitable distance between the field lens and the black photographic paper can be quickly confirmed through the method for adaptive debugging of the field lens described in the present invention, solving the problems of inconvenient installation and debugging and low installation and debugging efficiency when installing and debugging the field lens at present, which affect the production efficiency of the production line.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting, and particularly to a method and device for adaptive debugging of a field lens. Background Art

[0002] The OLED (organic light-emitting diode) display screen is a display technology based on organic materials, which can achieve higher contrast, wider viewing angles, and faster response times. Due to its characteristics of being thin, light, flexible, and having good backlight uniformity, the OLED display screen has become an important technology for smartphones, TVs, and other consumer electronic products. In the production process of OLED display screens, laser cutting technology is often used, such as substrate cutting, encapsulation cutting, interlayer cutting, etc.

[0003] Currently, in the field of laser cutting of OLED display screens, there are some limitations and deficiencies in the installation and debugging of field lenses. For example: when determining the most suitable working distance between the field lens and the workbench surface, technicians need to frequently remove the black photographic paper from the processing platform and then place it on the microscope platform, and manually adjust the microscope platform to measure the stripe width in the laser-etched black photographic paper, so as to determine the appropriate working distance between the field lens and the workbench surface; it is impossible to confirm whether the horizontal installation position of the field lens is appropriate and whether there is an angular tilt. At the same time, when facing different cutting contour shapes, technicians also need to frequently remove the black photographic paper from the processing platform, manually adjust the microscope platform to measure the size of the laser etching marks on the OLED screen, and gradually adjust the cutting contour parameters; when an abnormality occurs in the cutting of the OLED screen, there is no good method to determine the cause of the problem.

[0004] In summary, currently in the installation and debugging of field lenses, there are problems such as inconvenient installation and debugging, low installation and debugging efficiency, and affecting the production efficiency of the production line. Therefore, there is an urgent need for a method and device that can improve the installation and debugging efficiency of field lenses. Summary of the Invention

[0005] Based on this, in view of the above problems, the present invention proposes a method and device for adaptive debugging of a field lens, which solves the problems of inconvenient installation and debugging, low installation and debugging efficiency, and affecting the production efficiency of the production line in the current installation and debugging of field lenses.

[0006] The technical solution of the present invention is as follows:

[0007] A method for adaptive debugging of a field lens includes the following steps:

[0008] Step A: Determine the suitable distance between the field lens and the black photographic paper;

[0009] Step A1: Adsorb the black photographic paper on the vacuum adsorption table, and then move the XY moving platform under the field lens; adjust the output power and pulse frequency of the laser galvanometer, and adjust the output power and pulse frequency of the femtosecond laser to 40% of that when cutting the OLED screen.

[0010] Step A2: Use the Z-axis moving platform to adjust the limit process as the movement range, move the field lens from the lowest position in the Z-axis to the highest position. When moving, for every z1 mm the field lens moves in the Z-axis, the black photographic paper moves y1 mm in the Y-axis, and use the laser to etch a number of etching stripes with a length of b1 mm on the black photographic paper.

[0011] Step A3: Move the XY moving platform under the microscope camera, collect the images of the etching stripes on the black photographic paper through the microscope camera, and calculate the width of each etching stripe through image processing; screen out the etching stripe with the minimum width, and give the Z-axis height Z0 of the field lens corresponding to the etching stripe with the minimum width.

[0012] Step A4: Move the XY moving platform under the field lens, adjust the field lens to the height Z0 through the Z-axis moving platform, and then for every z2 mm the field lens moves in the Z-axis, the Y-axis moves y2 mm, and use the laser to etch a number of etching stripes with a length of b2 mm on the black photographic paper.

[0013] Step A5: Move the XY moving platform under the microscope camera, collect the images of the etching stripes on the black photographic paper through the microscope camera, and calculate the width of each etching stripe through image processing; screen out the etching stripe with the minimum width, and give the Z-axis height Z1 of the field lens corresponding to the etching stripe with the minimum width. Z1 is the suitable distance between the field lens and the black photographic paper.

[0014] Step B: Determine whether there is an angular tilt in the installation of the field lens.

[0015] Step C: Correct the cutting curve.

[0016] Preferably, in steps A3 and A5, the image processing calculation process is as follows: use the gray threshold to extract the image contour, calculate the number of pixel points of the two gray threshold boundary lines, and then calculate the width of each etching stripe. The calculation formula is as follows:

[0017] Among them, the number of pixel points is the number of pixels occupied by the etching stripe in the image, which can be obtained through image analysis

[0018]

[0019] The technology can be obtained. The pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the used microscope camera. The objective magnification is the magnification of the used microscope camera, which can be directly obtained according to the parameters of the microscope camera.

[0020] Preferably, in step B: judging whether there is an angular tilt in the field lens installation, the specific steps include:

[0021] Step B1: Adsorb the black photographic paper on the vacuum adsorption table, then move the XY moving platform under the field lens, and adjust the field lens to the height Z1 through the Z-direction moving platform;

[0022] Step B2: Adjust the output power and pulse frequency of the laser galvanometer. Adjust the output power of the femtosecond laser to 40% of that when cutting the OLED screen, and adjust the pulse frequency to 10% of that when cutting the OLED screen;

[0023] Step B3: Etch along the contour of the maximum area 200*200 of the field lens on the black photographic paper to obtain a number of etched points distributed along the contour and approximately circular;

[0024] Step B4: Move the XY moving platform under the microscope camera, and collect the images of the approximately circular etched points on the black photographic paper through the microscope camera. Calculate the fitting circle diameter and roundness corresponding to a number of etched points through image processing, and then compare the fitting circle diameter, roundness and morphology corresponding to the etched points symmetrically distributed up, down, left and right. When the fitting circle diameter and roundness of the four etched points distributed diagonally are inconsistent, it means that the installation angle of the field lens is tilted. Then, adjust the installation angle of the field lens according to the fitting circle diameter, roundness and morphology;

[0025] In step B4, the image processing process is as follows: Use the gray threshold to extract the image contour of the approximately circular etched points, then use two concentric circles and the image contour of the approximately circular etched points to generate the circumscribed circle and inscribed circle, and calculate the roundness. Then use a circle to fit the image contour of the approximately circular etched points and calculate the fitting circle diameter;

[0026] Among them, the roundness calculation formula is as follows:

[0027]

[0028] The long axis length calculation formula is:

[0029]

[0030] The short axis length calculation formula is:

[0031]

[0032] The fitting circle diameter calculation formula is as follows:

[0033]

[0034] Among them, the number of pixel points of the circumscribed circle diameter, the number of pixel points of the inscribed circle diameter, and the number of pixel points of the circle diameter can be obtained through image analysis technology. The pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the used microscope camera. The objective magnification is the magnification of the used microscope camera, which can be directly obtained according to the parameters of the microscope camera.

[0035] Preferably, step C: The specific steps of cutting curve correction include:

[0036] Step C1: Adsorb the black photographic paper on the vacuum adsorption table, then move the XY moving platform under the field lens, and adjust the field lens to the height Z1 through the Z-direction moving platform;

[0037] Step C2: Adjust the output power and pulse frequency of the laser galvanometer, adjust the output power of the femtosecond laser to 40% of that when cutting the OLED screen, and adjust the pulse frequency to the pulse frequency when cutting the OLED screen. Along the cutting contour line on the OLED screen drawing, etch an etching line on the black photographic paper through the laser;

[0038] Step C3: Move the XY moving platform under the microscope camera, and collect the image of the etching line on the black photographic paper through the microscope camera. Use the gray threshold to extract the cutting curve image of the etching line, and compare it with the cutting contour line on the OLED screen drawing. Calculate the size gap between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make corrections according to the size gap.

[0039] A field lens adaptive debugging device is applied to the above-mentioned field lens adaptive debugging method, including:

[0040] An installation platform for installing the XY moving platform, the Z-direction moving platform, and the microscope camera;

[0041] The XY moving platform is slidably arranged on the installation platform and is used to adjust the position of the vacuum adsorption table in the X and Y directions;

[0042] The vacuum adsorption table is arranged on the XY moving platform and is used to adsorb and fix the black photographic paper;

[0043] The Z-direction moving platform is arranged on the installation platform and is used to adjust the distance between the laser galvanometer and the field lens and the black photographic paper;

[0044] The laser galvanometer is arranged on the Z-direction moving platform and is used to emit laser light. The field lens can be installed below the laser galvanometer;

[0045] The microscope camera is arranged on the installation platform and is used to collect the etching stripe image on the black photographic paper;

[0046] Among them, the XY moving platform, the galvanometer scanner, and the microscopic camera are cooperatively arranged. The XY moving platform can move below the galvanometer scanner or below the microscopic camera. The XY moving platform includes an X-direction moving platform and a Y-direction moving platform. The X-direction moving platform is slidably arranged on the installation platform. The Y-direction moving platform is arranged on the X-direction moving platform. The vacuum adsorption table is arranged on the Y-direction moving platform. The galvanometer scanner includes a femtosecond laser, a beam expander, and a galvanometer body connected in sequence. The galvanometer body is arranged on the Z-direction moving platform. The field lens can be installed below the galvanometer body.

[0047] Preferably, the X-direction moving platform includes a first track mounting plate, a first driving structure, a pair of first sliding tracks, and at least a pair of first sliding blocks. The first track mounting plate is arranged on the installation platform, and the bottom of the first track mounting plate is slidably connected to the installation platform. A pair of first sliding tracks are arranged on the first track mounting plate. At least a pair of first sliding blocks are respectively arranged on the pair of first sliding tracks and are slidably connected to the first sliding tracks. The first driving structure is arranged on the first track mounting plate and is located between the pair of first sliding tracks.

[0048] Preferably, the Y-direction moving platform includes a second track mounting plate, a second driving structure, a pair of second sliding tracks, and at least a pair of second sliding blocks. The second track mounting plate is arranged on at least a pair of first sliding blocks and is detachably connected to the first sliding blocks. One end of the first driving structure is detachably connected to the bottom of the second track mounting plate for driving the second track mounting plate to slide along the pair of first sliding tracks. A pair of second sliding tracks are arranged on the second track mounting plate. At least a pair of second sliding blocks are respectively arranged on the pair of second sliding tracks and are slidably connected to the second sliding tracks. The second driving structure is arranged on the second track mounting plate and is located between the pair of second sliding tracks. The vacuum adsorption table is arranged on at least a pair of second sliding blocks and is detachably connected to the second sliding blocks. One end of the second driving structure is detachably connected to the bottom of the vacuum adsorption table for driving the vacuum adsorption table to slide along the pair of second sliding tracks.

[0049] Preferably, the first driving structure includes a first driving motor, a first threaded rod, and a first threaded connection block. The first driving motor is arranged on one side of the first track mounting plate and is fixedly connected to the first track mounting plate. One end of the first threaded rod is fixedly connected to the output shaft of the first driving motor. The first threaded connection block is sleeved on the first threaded rod and is threadedly connected to the first threaded rod. The first threaded rod is rotatably connected to the first track mounting plate through a pair of first bearing seats. The top of the first threaded connection block is detachably connected to the bottom of the second track mounting plate.

[0050] Preferably, the second driving structure includes a second driving motor, a second threaded rod, and a second threaded connection block. The second driving motor is arranged on one side of the second track mounting plate and fixedly connected to the second track mounting plate. One end of the second threaded rod is fixedly connected to the output shaft of the second driving motor. The second threaded connection block is sleeved on the second threaded rod and is in threaded connection with the second threaded rod. The second threaded rod is rotatably connected to the second track mounting plate through a pair of second bearing seats. The top of the second threaded connection block is detachably connected to the bottom of the vacuum adsorption table.

[0051] Preferably, the Z-direction moving platform includes a fixed mounting frame, a driving part, a rotating threaded rod, a threaded mounting block, a fixed mounting plate, a pair of fixed seats, a pair of guiding slide rods, and a pair of guiding sliders. The fixed mounting frame is arranged on the mounting platform and is arranged in cooperation with the XY moving platform. A pair of fixed seats are fixedly arranged at the upper end of the fixed mounting frame. The rotating threaded rod and a pair of guiding slide rods are arranged between the pair of fixed seats, and the rotating threaded rod is located between the pair of guiding slide rods. Both ends of the rotating threaded rod respectively penetrate through the pair of fixed seats and are rotatably connected to the fixed seats. Both ends of the pair of guiding slide rods are fixedly connected to the pair of fixed seats respectively. The driving part is arranged on one side of the upper fixed seat, and the driving part is fixedly connected to one end of the rotating threaded rod for driving the rotating threaded rod. The threaded mounting block is sleeved on the rotating threaded rod and is in threaded connection with the rotating threaded rod. The pair of guiding sliders are respectively sleeved on the pair of guiding slide rods and are slidably connected to the guiding slide rods. One side of the fixed mounting plate is fixedly connected to the threaded mounting block and the pair of guiding sliders. The laser galvanometer can be mounted on the fixed mounting plate and is detachably connected to the fixed mounting plate.

[0052] Compared with the prior art, the beneficial effects of the present invention are:

[0053] During the installation and debugging of the field lens in the present invention, it is no longer necessary for technicians to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust the microscope to measure the etching marks of the laser-etched black photographic paper. Through the field lens self-adaptive debugging method described in the present invention, the suitable distance between the field lens and the black photographic paper can be quickly confirmed, solving the problems of inconvenient installation and debugging and low installation and debugging efficiency when installing and debugging the field lens at present, which affects the production efficiency of the production line. Description of the Drawings

[0054] Figure 1 is a schematic structural diagram of a field lens self-adaptive debugging device described in an embodiment of the present invention;

[0055] Figure 2 is a schematic structural diagram of the XY moving platform described in an embodiment of the present invention;

[0056] Figure 3 is a partial structural schematic diagram of the Z-direction moving platform and the laser galvanometer described in an embodiment of the present invention;

[0057] Figure 4 It is a partial structural schematic diagram of the Z-direction moving platform described in the embodiment of the present invention;

[0058] Figure 5 It is a structural schematic diagram of the microscope camera described in the embodiment of the present invention;

[0059] Figure 6 It is a schematic diagram of the etched stripes on the black photographic paper in step A described in the embodiment of the present invention;

[0060] Figure 7 It is a schematic diagram of several etched points in the shape of an approximate circle on the black photographic paper in step B described in the embodiment of the present invention;

[0061] Figure 8 It is a schematic diagram of the etched line on the black photographic paper in step C described in the embodiment of the present invention;

[0062] Figure 9 It is a schematic diagram of several etched points in the shape of an approximate circle on the black photographic paper in step D described in the embodiment of the present invention;

[0063] Explanation of reference numerals:

[0064] 10 - Installation platform, 20 - XY moving platform, 200 - X-direction moving platform, 201 - Y-direction moving platform, 202 - First track mounting plate, 203 - First sliding track, 204 - First sliding block, 205 - Second track mounting plate, 206 - Second sliding track, 207 - Second sliding block, 208 - First driving motor, 209 - First threaded rod, 210 - First threaded connection block, 211 - First bearing seat, 212 - Second driving motor, 213 - Second threaded rod, 214 - Second threaded connection block, 215 - Second bearing seat, 30 - Vacuum adsorption table, 40 - Z-direction moving platform, 400 - Fixed mounting frame, 401 - Driving part, 402 - Rotating threaded rod, 403 - Threaded mounting block, 404 - Fixed mounting plate, 405 - Fixed seat, 406 - Guide slide bar, 407 - Guide slider, 50 - Laser galvanometer, 51 - Field lens, 500 - Femtosecond laser, 501 - Beam expander, 502 - Galvanometer body, 60 - Microscope camera, 600 - Camera mounting frame, 601 - Camera body, 602 - Microscope lens. Detailed implementation manners

[0065] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0066] Embodiment:

[0067] As Figure 1 shown, this embodiment discloses a method for self-adaptive debugging of a field lens, including the following steps:

[0068] Step A: Determine the suitable distance between the field lens 51 and the black photographic paper;

[0069] Step A1: Adsorb the black photographic paper on the vacuum adsorption table 30, and then move the XY moving platform 20 below the field lens 51; Adjust the output power and pulse frequency of the laser galvanometer 50, and adjust the output power and pulse frequency of the femtosecond laser 500 to 40% of that when cutting the OLED screen.

[0070] Step A2: Take the adjustment limit process of the Z-axis moving platform 40 as the movement range, move the field lens 51 from the lowest position in the Z-axis to the highest position. When moving, for every z1 mm movement of the field lens 51 in the Z-axis, the black photographic paper moves y1 mm in the Y-axis, and etch a number of etching stripes with a length of b1 mm on the black photographic paper through the laser.

[0071] Step A3: Move the XY moving platform 20 below the microscope camera 60, collect the images of the etching stripes on the black photographic paper through the microscope camera 60, and calculate the width of each etching stripe through image processing; Screen out the etching stripe with the minimum width, and give the Z-axis height Z0 of the field lens 51 corresponding to the etching stripe with the minimum width.

[0072] Step A4: Move the XY moving platform 20 below the field lens 51, adjust the field lens 51 to the height Z0 through the Z-axis moving platform 40, and then for every z2 mm movement in the Z-axis, move y2 mm in the Y-axis, and etch a number of etching stripes with a length of b2 mm on the black photographic paper through the laser.

[0073] Step A5: Move the XY moving platform 20 below the microscope camera 60, collect the images of the etching stripes on the black photographic paper through the microscope camera 60, and calculate the width of each etching stripe through image processing; Screen out the etching stripe with the minimum width, and give the Z-axis height Z1 of the field lens 51 corresponding to the etching stripe with the minimum width. Z1 is the suitable distance between the field lens 51 and the black photographic paper.

[0074] Step B: Judge whether there is an angular inclination in the installation of the field lens 51;

[0075] Step B1: Adsorb the black photographic paper on the vacuum adsorption table 30, and then move the XY moving platform 20 below the field lens 51, and adjust the field lens 51 to the height Z1 through the Z-axis moving platform 40.

[0076] Step B2: Adjust the output power and pulse frequency of the laser galvanometer 50, adjust the output power of the femtosecond laser 500 to 40% of that when cutting the OLED screen, and adjust the pulse frequency to 10% of that when cutting the OLED screen.

[0077] Step B3: Along the contour of the maximum area 200*200 of the field lens 51, etch on the black photographic paper to obtain a number of etched points distributed along the contour and in an approximate circular shape;

[0078] Step B4: Move the XY moving platform 20 under the micro camera 60, collect the images of the etched points in an approximate circular shape on the black photographic paper through the micro camera 60, calculate the fitting circle diameter and roundness corresponding to the number of etched points through image processing, and then compare the fitting circle diameter, roundness and morphology corresponding to the etched points symmetrically distributed up, down, left and right. When the fitting circle diameter and roundness of the four etched points distributed diagonally are inconsistent, it indicates that the installation angle of the field lens 51 is inclined, and then adjust the installation angle of the field lens 51 according to the fitting circle diameter, roundness and morphology;

[0079] Step C: Cutting curve correction;

[0080] Step C1: Adsorb the black photographic paper on the vacuum adsorption table 30, then move the XY moving platform 20 under the field lens 51, and adjust the field lens 51 to the height Z1 through the Z-direction moving platform 40;

[0081] Step C2: Adjust the output power and pulse frequency of the laser galvanometer 50, adjust the output power of the femtosecond laser 500 to 40% of that when cutting the OLED screen, adjust the pulse frequency to the pulse frequency when cutting the OLED screen, and etch an etching line on the black photographic paper through the laser along the cutting contour line on the OLED screen drawing;

[0082] Step C3: Move the XY moving platform 20 under the micro camera 60, collect the image of the etching line on the black photographic paper through the micro camera 60, extract the cutting curve image of the etching line by using the gray threshold, compare it with the cutting contour line on the OLED screen drawing, calculate the size gap between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make a correction according to the size gap.

[0083] Among them, in Steps A3 and A5, the image processing calculation process is as follows: extract the image contour by using the gray threshold, calculate the number of pixel points of the two gray threshold boundary lines, and then calculate the width of each etching stripe. The calculation formula is as follows:

[0084]

[0085] Among them, the number of pixel points is the number of pixels occupied by the etching stripe in the image, which can be obtained through image analysis technology. The pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the used micro camera 60. The objective magnification is the magnification of the used micro camera 60, which can be directly obtained according to the parameters of the micro camera 60.

[0086] In step B4, the image processing process is as follows: using a grayscale threshold to extract the image contour of the approximately circular etching points, then using two concentric circles and the image contour of the approximately circular etching points to generate an circumscribed circle and an inscribed circle, and calculating the roundness, then using a circle to fit the image contour of the approximately circular etching points, and calculating the diameter of the fitted circle;

[0087] Among them, the formula for calculating roundness is as follows:

[0088]

[0089] The formula for calculating the major axis length is:

[0090]

[0091] The formula for calculating the minor axis length is:

[0092]

[0093] The formula for calculating the diameter of the fitted circle is as follows:

[0094]

[0095] Among them, the number of pixel points of the circumscribed circle diameter, the number of pixel points of the inscribed circle diameter, and the number of pixel points of the circle diameter can be obtained through image analysis technology. The pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the used microscope camera 60. The objective magnification is the magnification of the used microscope camera 60, which can be directly obtained according to the parameters of the microscope camera 60.

[0096] During the installation and debugging of the field lens 51 of the present invention, it is no longer necessary for technicians to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust the microscope to measure the etching marks on the laser-etched black photographic paper. Through the field lens 51 self-adaptive debugging method described in the present invention, the suitable distance between the field lens 51 and the black photographic paper can be quickly confirmed, and it can be quickly determined whether the installation position of the field lens 51 is appropriate and whether the field lens 51 has an angular tilt. At the same time, when facing different cutting contour shapes, through the field lens 51 self-adaptive debugging method described in the present invention, technicians also do not need to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust the microscope to measure the size of the laser etching marks on the OLED screen and gradually adjust the cutting contour parameters. Through the present invention, the cutting curve can be quickly corrected and adjusted to suitable cutting contour parameters. It solves the problems of inconvenient installation and debugging and low installation and debugging efficiency when installing and debugging the field lens 51 at present, which affects the production efficiency of the production line.

[0097] Such as Figure 1 、 Figure 9As shown, when there are problems such as incomplete cutting and cutting residues on the OLED screen, the following steps are also included:

[0098] Step D: Cutting anomaly analysis;

[0099] Step D1: Adsorb the black photographic paper on the vacuum adsorption table 30, then move the XY moving platform 20 under the field lens 51, and adjust the field lens 51 to the height Z1 through the Z-direction moving platform 40;

[0100] Step D2: Adjust the output power and pulse frequency of the laser galvanometer 50, adjust the output power of the femtosecond laser 500 to 40% of that when cutting the OLED screen, and adjust the pulse frequency to 10% of that when cutting the OLED screen;

[0101] Step D3: According to the preset cutting profile for processing, etch the black photographic paper with a laser to obtain a number of approximately circular etching points distributed along the preset cutting profile;

[0102] Step D4: Move the XY moving platform 20 under the microscope camera 60, collect the images of the approximately circular etching points on the black photographic paper through the microscope camera 60, calculate the fitted circle diameter and roundness corresponding to a number of etching points through image processing, and then compare the fitted circle diameter and roundness corresponding to the calculated number of etching points. When the difference between the fitted circle diameter and roundness is greater than 10%, it is regarded as an abnormal point, which can be compared with the actual cutting effect to complete the cutting anomaly analysis;

[0103] Among them, the image processing calculation process in Step D4 is the same as that in Step B4.

[0104] Through the above steps, the situation of abnormal points can be quickly confirmed, so as to analyze the cutting anomaly and provide data support for the cutting anomaly analysis.

[0105] In the above embodiment, the value range of z1 is 0.4 - 0.6 mm, the value range of y1 is 2.5 - 3.5 mm, and the value range of b is 20 - 40 mm;

[0106] The value range of z2 is 0.05 - 0.15 mm, the value range of y1 is 2.5 - 3.5 mm, and the value range of b is 20 - 40 mm;

[0107] As Figures 6 to 8 shown, this embodiment provides a specific debugging value as follows:

[0108] In one of the embodiments, z1 takes 0.5, y1 takes 3, and b takes 30; z2 takes 0.1, y1 takes 3, and b takes 30.

[0109] That is, step A2 is specifically as follows: Using the Z-axis moving platform 40 to adjust the limit process as the movement range, move the field lens 51 from the lowest position in the Z-axis to the highest position. When moving, for every 0.5 mm the field lens 51 moves in the Z-axis, the black photographic paper moves 3 mm in the Y-axis, and a number of etching stripes with a length of 30 mm are etched on the black photographic paper by laser;

[0110] Step A4 is specifically as follows: Move the XY moving platform 20 below the field lens 51, adjust the field lens 51 to the height Z0 through the Z-axis moving platform 40, and then for every 0.1 mm the Z-axis moves, the Y-axis moves 3 mm, and a number of etching stripes with a length of 30 mm are etched on the black photographic paper by laser; The remaining steps are the same as those in the above embodiment.

[0111] This embodiment is the best value obtained after multiple experiments. Using this embodiment can make the use effect of the present invention the best.

[0112] Similarly, in another embodiment, for example:

[0113] Value case 1: z1 takes 0.4, y1 takes 2.5, b takes 20; z2 takes 0.05, y1 takes 2.5, b takes 20;

[0114] Value case 2: z1 takes 0.6, y1 takes 3.5, b takes 40; z2 takes 0.15, y1 takes 3.5, b takes 40;

[0115] The above two groups of value cases can both implement the method described in the present invention.

[0116] As Figures 1 to 5 shown, a field lens adaptive debugging device is applied to the above-mentioned field lens adaptive debugging method, including:

[0117] An installation platform 10, which is used to install the XY moving platform 20, the Z-axis moving platform 40 and the microscopic camera 60;

[0118] The XY moving platform 20 is slidably arranged on the installation platform 10 and is used to adjust the position of the vacuum adsorption table 30 in the X and Y directions;

[0119] The vacuum adsorption table 30 is arranged on the XY moving platform 20 and is used to adsorb and fix the black photographic paper;

[0120] The Z-axis moving platform 40 is arranged on the installation platform 10 and is used to adjust the distance between the laser galvanometer 50 and the field lens 51 and the black photographic paper;

[0121] The laser galvanometer 50 is arranged on the Z-axis moving platform 40 and is used to emit laser. The field lens 51 can be installed below the laser galvanometer 50;

[0122] The microscopic camera 60 is disposed on the mounting platform 10 and is used to collect the etched stripe images on the black photographic paper.

[0123] Among them, the XY moving platform 20, the galvanometer scanner 50 and the microscopic camera 60 are cooperatively arranged. The XY moving platform 20 can be moved under the galvanometer scanner 50 or under the microscopic camera 60. The XY moving platform 20 includes an X-direction moving platform 200 and a Y-direction moving platform 201. The X-direction moving platform 200 is slidably disposed on the mounting platform 10. The Y-direction moving platform 201 is disposed on the X-direction moving platform 200. The vacuum adsorption table 30 is disposed on the Y-direction moving platform 201.

[0124] The galvanometer scanner 50 includes a femtosecond laser 500, a beam expander 501 and a galvanometer body 502 which are connected in sequence. The galvanometer body 502 is disposed on the Z-direction moving platform 40. The field lens 51 can be mounted under the galvanometer body 502.

[0125] The microscopic camera 60 includes a camera mounting bracket 600, a camera body 601 and a microscopic lens 602. The camera mounting bracket 600 is disposed on the mounting platform 10 and is cooperatively arranged with the XY moving platform 20. The camera body 601 is mounted on the camera mounting bracket 600 and is detachably connected to the camera mounting bracket 600. The microscopic lens 602 is disposed on the camera body 601.

[0126] During use, the XY moving platform 20 can be used to move the vacuum adsorption table 30 in the X and Y directions. At the same time, since the XY moving platform 20 is slidably disposed on the mounting platform 10, the vacuum adsorption table 30 can be cooperated with the galvanometer scanner 50 and the microscopic camera 60 respectively, so as to complete the etching of the black photographic paper and the collection of the images of the black photographic paper by the microscopic camera 60.

[0127] Among them, the femtosecond laser 500, the beam expander 501, the galvanometer body 502, the camera mounting bracket 600, the camera body 601 and the microscopic lens 602 are all prior arts.

[0128] Such as Figure 2As shown in the figure, in order to facilitate the movement of the black photographic paper in the X and Y directions and thus facilitate the etching of the black photographic paper, this embodiment is improved on the basis of the above embodiment. The difference from the above embodiment is that the X-direction moving platform 200 includes a first track mounting plate 202, a first driving structure, a pair of first sliding tracks 203 and at least a pair of first sliding blocks 204. The first track mounting plate 202 is arranged on the mounting platform 10, and the bottom of the first track mounting plate 202 is slidably connected to the mounting platform 10. A pair of first sliding tracks 203 are arranged on the first track mounting plate 202. At least a pair of first sliding blocks 204 are respectively arranged on the pair of first sliding tracks 203 and are slidably connected to the first sliding tracks 203. The first driving structure is arranged on the first track mounting plate 202 and is located between the pair of first sliding tracks 203.

[0129] The Y-direction moving platform 201 includes a second track mounting plate 205, a second driving structure, a pair of second sliding tracks 206 and at least a pair of second sliding blocks 207. The second track mounting plate 205 is arranged on at least a pair of first sliding blocks 204 and is detachably connected to the first sliding blocks 204. One end of the first driving structure is detachably connected to the bottom of the second track mounting plate 205 and is used to drive the second track mounting plate 205 to slide along the pair of first sliding tracks 203. A pair of second sliding tracks 206 are arranged on the second track mounting plate 205. At least a pair of second sliding blocks 207 are respectively arranged on the pair of second sliding tracks 206 and are slidably connected to the second sliding tracks 206. The second driving structure is arranged on the second track mounting plate 205 and is located between the pair of second sliding tracks 206. The vacuum adsorption table 30 is arranged on at least a pair of second sliding blocks 207 and is detachably connected to the second sliding blocks 207. One end of the second driving structure is detachably connected to the bottom of the vacuum adsorption table 30 and is used to drive the vacuum adsorption table 30 to slide along the pair of second sliding tracks 206.

[0130] The first driving structure includes a first driving motor 208, a first threaded rod 209 and a first threaded connection block 210. The first driving motor 208 is arranged on one side of the first track mounting plate 202 and is fixedly connected to the first track mounting plate 202. One end of the first threaded rod 209 is fixedly connected to the output shaft of the first driving motor 208. The first threaded connection block 210 is sleeved on the first threaded rod 209 and is threadedly connected to the first threaded rod 209. The first threaded rod 209 is rotationally connected to the first track mounting plate 202 through a pair of first bearing seats 211. The top of the first threaded connection block 210 is detachably connected to the bottom of the second track mounting plate 205.

[0131] The second driving structure includes a second driving motor 212, a second threaded rod 213, and a second threaded connection block 214. The second driving motor 212 is disposed on one side of the second track mounting plate 205 and fixedly connected to the second track mounting plate 205. One end of the second threaded rod 213 is fixedly connected to the output shaft of the second driving motor 212. The second threaded connection block 214 is sleeved on the second threaded rod 213 and threadedly connected to the second threaded rod 213. The second threaded rod 213 is rotatably connected to the second track mounting plate 205 through a pair of second bearing seats 215. The top of the second threaded connection block 214 is detachably connected to the bottom of the vacuum adsorption table 30.

[0132] Among them, the first driving motor 208 and the second driving motor 212 can adopt servo motors in the prior art.

[0133] During use, the first driving motor 208 can drive the first threaded rod 209, thereby driving the first threaded connection block 210 and the first sliding block 204, and then driving the Y-direction moving platform 201 and the vacuum adsorption table 30 to move in the X direction, so as to realize the movement of the black photographic paper in the X direction. The second driving motor 212 can drive the second threaded rod 213, thereby driving the second threaded connection block 214 and the second sliding block 207, and then driving the vacuum adsorption table 30 to move in the Y direction, so as to realize the movement of the black photographic paper in the Y direction.

[0134] Meanwhile, the first track mounting plate 202 in the X-direction moving platform 200 is disposed on the mounting platform 10, and the bottom of the first track mounting plate 202 is slidably connected to the mounting platform 10, so that the XY moving platform 20 can move from below the field lens 51 to below the micro camera 60 to form a cooperation, which is convenient for the etching of the black photographic paper and the acquisition of the etched image.

[0135] Such as Figures 3 to 4As shown in the figure, in order to facilitate the adjustment of the height of the field lens 51, this embodiment is improved on the basis of the above embodiment. The difference from the above embodiment is that the Z-direction moving platform 40 includes a fixed mounting frame 400, a driving part 401, a rotating threaded rod 402, a threaded mounting block 403, a fixed mounting plate 404, a pair of fixed seats 405, a pair of guiding slide rods 406 and a pair of guiding sliders 407. The fixed mounting frame 400 is arranged on the mounting platform 10 and is arranged in cooperation with the XY moving platform 20. A pair of fixed seats 405 are fixedly arranged at the upper end of the fixed mounting frame 400. The rotating threaded rod 402 and the pair of guiding slide rods 406 are arranged between the pair of fixed seats 405, and the rotating threaded rod 402 is located between the pair of guiding slide rods 406. The two ends of the rotating threaded rod 402 respectively penetrate through the pair of fixed seats 405 and are rotatably connected to the fixed seats 405. The two ends of the pair of guiding slide rods 406 are respectively fixedly connected to the pair of fixed seats 405. The driving part 401 is arranged on one side of the upper fixed seat 405 and is fixedly connected to one end of the rotating threaded rod 402 for driving the rotating threaded rod 402. The threaded mounting block 403 is sleeved on the rotating threaded rod 402 and is threadedly connected to the rotating threaded rod 402. The pair of guiding sliders 407 are respectively sleeved on the pair of guiding slide rods 406 and are slidably connected to the guiding slide rods 406. One side of the fixed mounting plate 404 is fixedly connected to the threaded mounting block 403 and the pair of guiding sliders 407. The laser galvanometer 50 can be mounted on the fixed mounting plate 404 and is detachably connected to the fixed mounting plate 404.

[0136] The driving part 401 can adopt a servo motor in the prior art.

[0137] During use, the driving part 401 can be used to drive the rotating threaded rod 402, and then drive the threaded mounting block 403 and the pair of guiding sliders 407, and then drive the fixed mounting plate 404 and the laser galvanometer 50 to move, so as to realize the adjustment of the height of the laser galvanometer 50 and the field lens 51, and further facilitate the adjustment of the field lens 51 to confirm the appropriate distance between the field lens 51 and the black photographic paper.

[0138] The working principle of the present invention:

[0139] During the installation and debugging of the field lens 51 of the present invention, it is no longer necessary for technicians to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust the microscope to measure the etching marks on the laser-etched black photographic paper. Through the field lens 51 self-adaptive debugging method described in the present invention, the suitable distance between the field lens 51 and the black photographic paper can be quickly confirmed, and it can be quickly judged whether the installation position of the field lens 51 is appropriate and whether the field lens 51 has an angular tilt. At the same time, when facing different cutting contour shapes, through the field lens 51 self-adaptive debugging method described in the present invention, technicians also do not need to frequently remove the black photographic paper from the vacuum adsorption platform and manually adjust the microscope to measure the size of the laser etching marks on the OLED screen, and gradually adjust the cutting contour parameters. Through the present invention, the cutting curve can be quickly corrected and adjusted to suitable cutting contour parameters.

[0140] The above-described embodiments merely represent the specific implementation manners of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A method for adaptively debugging a field lens, characterized in that: The following steps are involved: Step A: determining a suitable distance between the field lens (51) and the black photographic paper; Step A1: adsorb the black photo paper onto the vacuum adsorption table (30), and then move the XY moving platform (20) to below the field mirror (51); adjust the output power and pulse frequency of the laser galvanometer (50), and adjust the output power and pulse frequency of the femtosecond laser (500) to 40% of that used for cutting the OLED screen; Step A2: Using the Z-direction moving platform (40) to adjust the limit process as the movement range, the field lens (51) is moved from the lowest position in the Z direction to the highest position. During the movement, for every z1mm movement of the field lens (51) in the Z direction, the black photographic paper is moved y1mm in the Y direction, and a plurality of etching stripes with a length of b1mm are etched on the black photographic paper by laser; Step A3: moving the XY moving platform (20) to below the microscope camera (60), collecting an image of the etching stripes on the black photographic paper through the microscope camera (60), and calculating the width of each etching stripe through image processing; selecting the etching stripe with the smallest width, and giving the Z-direction height Z0 of the field lens (51) corresponding to the etching stripe with the smallest width; Step A4: Move the XY moving platform (20) to below the field lens (51), adjust the field lens (51) to a height Z0 via the Z moving platform (40), and then use a laser to etch a plurality of etching stripes with a length of b2 mm on the black photographic paper at a Z-direction movement of z2 mm and a Y-direction movement of y2 mm; Step A5: moving the XY moving platform (20) to below the microscope camera (60), collecting an image of the etching stripes on the black photographic paper through the microscope camera (60), and calculating the width of each etching stripe through image processing; selecting the etching stripes with the smallest width, and providing the Z-direction height Z1 of the field lens (51) corresponding to the etching stripes with the smallest width, where Z1 is the appropriate distance between the field lens (51) and the black photographic paper; Step B: determining whether the field mirror (51) is installed at an angle of inclination; Step C: Cutting curve correction.

2. A method for adaptive debugging of a field lens according to claim 1, characterized in that: In steps A3 and A5, the image processing calculation process is: using the gray threshold to extract the image contour, calculating the number of pixels of two gray threshold boundary lines, and then calculating the width of each etching stripe. The calculation formula is as follows: Among them, the number of pixels is the number of pixels occupied by the etching stripes in the image, which can be obtained based on image analysis technology, the pixel size is the actual size corresponding to each pixel, which can be directly obtained based on the parameters of the microscope camera (60) used, and the objective lens magnification is the magnification of the microscope camera (60) used, which can be directly obtained based on the parameters of the microscope camera (60).

3. A method for adaptive debugging of a field lens according to claim 2, characterized in that: Step B: Determine whether the field mirror (51) is installed at an angle of inclination. The specific steps include: Step B1: adsorb the black photo paper onto the vacuum adsorption platform (30), then move the XY moving platform (20) to below the field lens (51), and adjust the field lens (51) to a height Z1 via the Z moving platform (40); Step B2: adjusting the output power and pulse frequency of the laser galvanometer (50), adjusting the output power of the femtosecond laser (500) to 40% of that used for cutting the OLED screen, and adjusting the pulse frequency to 10% of that used for cutting the OLED screen; Step B3: etching on black photographic paper along the contour of the field lens (51) with a maximum size of 200*200, to obtain a plurality of etching points distributed along the contour in a substantially circular shape; Step B4: Move the XY moving platform (20) to below the microscope camera (60), and collect images of approximately circular etching points on the black photographic paper through the microscope camera (60), and calculate the fitting circle diameters and roundnesses corresponding to a number of etching points through image processing, and then compare the fitting circle diameters, roundnesses and shapes corresponding to the etching points that are symmetrically distributed vertically and horizontally. If the fitting circle diameters and roundnesses corresponding to the four etching points that are distributed diagonally are inconsistent, it means that the installation angle of the field lens (51) is tilted, and then adjust the installation angle of the field lens (51) according to the fitting circle diameters, roundnesses and shapes; In step B4, the image processing process is as follows: using the grayscale threshold to extract the image contour of the approximately circular etching point, then using two concentric circles and the image contour of the approximately circular etching point to generate a circumscribed circle and an inscribed circle, and calculating the circularity, then using the circle to fit the image contour of the approximately circular etching point, and calculating the diameter of the fitting circle; The roundness calculation formula is as follows: The formula for calculating the major axis length is: The formula for calculating the minor axis length is: The calculation formula of the fitting circle diameter is as follows: The number of pixels of the circumscribed circle diameter, the number of pixels of the inscribed circle diameter, and the number of pixels of the circle diameter can be obtained through image analysis technology, the pixel size is the actual size corresponding to each pixel, and can be directly obtained according to the parameters of the microscope camera (60) used, and the objective lens magnification is the magnification of the microscope camera (60) used, and can be directly obtained according to the parameters of the microscope camera (60).

4. A method for adaptive debugging of a field lens according to claim 3, characterized in that: Step C: Cutting curve correction The specific steps include: Step C1: adsorb the black photo paper onto the vacuum adsorption platform (30), then move the XY moving platform (20) to below the field lens (51), and adjust the field lens (51) to a height Z1 via the Z moving platform (40); Step C2: adjusting the output power and pulse frequency of the laser galvanometer (50), adjusting the output power of the femtosecond laser (500) to 40% of that used for cutting the OLED screen, adjusting the pulse frequency to that used for cutting the OLED screen, and etching an etching line on the black photographic paper along the cutting contour line on the OLED screen drawing by laser; Step C3: Move the XY moving platform (20) to below the microscope camera (60), and collect an image of the etching line on the black photographic paper through the microscope camera (60), extract the cutting curve image of the etching line using the grayscale threshold, and compare it with the cutting contour line on the OLED screen drawing, calculate the size difference between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make corrections based on the size difference.

5. A field mirror adaptive debugging device, characterized in that: A method for adaptively debugging a field mirror applied to any one of claims 1 to 4, comprising: A mounting platform (10), the mounting platform (10) being used to mount an XY moving platform (20), a Z moving platform (40) and a microscope camera (60); An XY moving platform (20), the XY moving platform (20) being slidably arranged on the mounting platform (10) and used for adjusting the position of the vacuum adsorption platform (30) in the X and Y directions; A vacuum adsorption platform (30), the vacuum adsorption platform (30) is arranged on the XY moving platform (20) and is used for adsorbing and fixing the black photographic paper; A Z-direction movable platform (40), the Z-direction movable platform (40) being arranged on the mounting platform (10) and used for adjusting the distance between the laser galvanometer (50) and the field lens (51) and the black photographic paper; A laser galvanometer (50), the laser galvanometer (50) being arranged on the Z-direction movable platform (40) and used for emitting laser light, and the field lens (51) being arranged below the laser galvanometer (50); A microscope camera (60), the microscope camera (60) being arranged on the mounting platform (10) and used for collecting an image of etching stripes on the black photographic paper; The XY moving platform (20), the laser galvanometer (50) and the microscopic camera (60) are arranged in coordination; the XY moving platform (20) can be moved below the laser galvanometer (50) or below the microscopic camera (60); the XY moving platform (20) comprises an X-direction moving platform (200) and a Y-direction moving platform (201); the X-direction moving platform (200) is slidably arranged on the mounting platform (10); the Y-direction moving platform (201) is arranged on the X-direction moving platform (200); and the vacuum adsorption platform (30) is arranged on the Y-direction moving platform (201); the laser galvanometer (50) comprises a femtosecond laser (500), a beam expander (501) and a galvanometer body (502) which are connected in sequence; the galvanometer body (502) is arranged on the Z-direction moving platform (40); and the field lens (51) can be installed below the galvanometer body (502).

6. The field mirror adaptive debugging device according to claim 5, characterized in that: The X-axis moving platform (200) comprises a first rail mounting plate (202), a first driving structure, a pair of first sliding rails (203) and at least one pair of first sliding blocks (204); the first rail mounting plate (202) is arranged on the mounting platform (10), and the bottom of the first rail mounting plate (202) is slidably connected to the mounting platform (10); the pair of first sliding rails (203) are arranged on the first rail mounting plate (202); at least one pair of first sliding blocks (204) are respectively arranged on the pair of first sliding rails (203) and are slidably connected to the first sliding rails (203); and the first driving structure is arranged on the first rail mounting plate (202) and is located between the pair of first sliding rails (203).

7. The field mirror adaptive debugging device according to claim 6, characterized in that: The Y-axis moving platform (201) comprises a second track mounting plate (205), a second driving structure, a pair of second sliding tracks (206) and at least one pair of second sliding blocks (207); the second track mounting plate (205) is arranged on at least one pair of first sliding blocks (204) and is detachably connected to the first sliding blocks (204); one end of the first driving structure is detachably connected to the bottom of the second track mounting plate (205) and is used to drive the second track mounting plate (205) to slide along the pair of first sliding tracks (203); the pair of second sliding tracks (206) are arranged on the second track mounting plate (20 5), at least one pair of second sliding blocks (207) are respectively arranged on a pair of second sliding rails (206) and are slidably connected to the second sliding rails (206), a second driving structure is arranged on the second rail mounting plate (205) and is located between the pair of second sliding rails (206), a vacuum adsorption platform (30) is arranged on at least one pair of second sliding blocks (207) and is detachably connected to the second sliding blocks (207), and one end of the second driving structure is detachably connected to the bottom of the vacuum adsorption platform (30) and is used to drive the vacuum adsorption platform (30) to slide along the pair of second sliding rails (206).

8. The field mirror adaptive debugging device according to claim 7, characterized in that: The first driving structure comprises a first driving motor (208), a first threaded rod (209) and a first threaded connection block (210); the first driving motor (208) is arranged on one side of the first track mounting plate (202) and is fixedly connected to the first track mounting plate (202); one end of the first threaded rod (209) is fixedly connected to the output shaft of the first driving motor (208); the first threaded connection block (210) is sleeved on the first threaded rod (209) and is threadedly connected to the first threaded rod (209); the first threaded rod (209) is rotatably connected to the first track mounting plate (202) via a pair of first bearing seats (211); and the top of the first threaded connection block (210) is detachably connected to the bottom of the second track mounting plate (205).

9. The field mirror adaptive debugging device according to claim 8, characterized in that: The second driving structure comprises a second driving motor (212), a second threaded rod (213) and a second threaded connection block (214); the second driving motor (212) is arranged on one side of the second track mounting plate (205) and is fixedly connected to the second track mounting plate (205); one end of the second threaded rod (213) is fixedly connected to the output shaft of the second driving motor (212); the second threaded connection block (214) is sleeved on the second threaded rod (213) and is threadedly connected to the second threaded rod (213); the second threaded rod (213) is rotatably connected to the second track mounting plate (205) via a pair of second bearing seats (215); and the top of the second threaded connection block (214) is detachably connected to the bottom of the vacuum adsorption table (30).

10. The field mirror adaptive debugging device according to claim 9, characterized in that: The Z-axis moving platform (40) comprises a fixed mounting frame (400), a driving unit (401), a rotating threaded rod (402), a threaded mounting block (403), a fixed mounting plate (404), a pair of fixed seats (405), a pair of guide slide bars (406) and a pair of guide slide blocks (407). The fixed mounting frame (400) is arranged on the mounting platform (10) and is arranged in cooperation with the XY moving platform (20). The pair of fixed seats (405) are fixedly arranged on the upper end of the fixed mounting frame (400). The rotating threaded rod (402) and the pair of guide slide bars (406) are arranged between the pair of fixed seats (405). The rotating threaded rod (402) is located between the pair of guide slide bars (406). Both ends of the rotating threaded rod (402) respectively pass through the pair of fixed seats (405) and are rotatably connected to the fixed seats (405). The two ends of a pair of guide slide bars (406) are respectively fixedly connected to a pair of fixed seats (405), a driving unit (401) is arranged on one side of the fixed seat (405) located at the upper end, and the driving unit (401) is fixedly connected to the end of one end of the rotating threaded rod (402) for driving the rotating threaded rod (402), a threaded mounting block (403) is sleeved on the rotating threaded rod (402) and is threadedly connected to the rotating threaded rod (402), a pair of guide slide blocks (407) are respectively sleeved on the pair of guide slide bars (406) and are slidably connected to the guide slide bars (406), one side of the fixed mounting plate (404) is fixedly connected to the threaded mounting block (403) and the pair of guide slide blocks (407), and the laser galvanometer (50) can be mounted on the fixed mounting plate (404) and is detachably connected to the fixed mounting plate (404).

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