Low-adhesion ultrasonic vibration type measuring device and method

Abstract

The invention discloses a low-adhesion ultrasonic vibration type measuring device and method, and relates to the technical field of viscous substance physical property analysis, the device comprises an ultrasonic vibration emitter, a vibration sample plate fixing module, a vibration sample plate, a sample plate and a collection plate; the ultrasonic vibration transmitter is fixed together with the vibration sample plate and is used for generating vibration force; the vibration sample plate fixing module is used for fixing a vibration sample plate; the vibration sample plate is provided with a clamping groove structure for mounting the sample plate; the sample piece is used for adhering a substance to be detected; the collecting plate is used for charging a to-be-tested substance, and the to-be-tested substance is fixed on the sample piece through an electric field between the sample piece and the collecting plate. The adhesive force and the adhesion coefficient of an adhesive force substance lower than 50 psi (0.4 MPa) can be conveniently and accurately measured, and viscous substance adhesion characteristic measurement and viscous fluid adhesion and deposition mechanism, mechanism and rule research are supported.

Description

Technical Field

[0001] The present application relates to the technical field of physical property analysis of viscous substances, and in particular to a low-adhesion ultrasonic vibration measurement device and method. Background Art

[0002] Adhesion measurement is widely used in the performance evaluation of coatings, colloids, coke, etc. Due to the large variety and complexity of materials, adhesion measurement is limited by the form and characteristics of the medium. Some materials have high viscosity and can directly adhere to the wall and are stable, while some materials have low viscosity and are difficult to adhere to the wall or adhere to the wall in an unstable form (such as oil); some materials are Newtonian fluids (sugar water), and the adhesion is proportional to the shear force; and some materials are non-Newtonian fluids (glue), and the adhesion is nonlinear with the shear force. Therefore, it is difficult to accurately measure adhesion.

[0003] Most of the existing traditional adhesion measurement devices use the pulling method and the cutting method. These two methods are mostly used to measure materials with large adhesion and stable shape. However, when measuring materials with small adhesion (less than 50psi), the traditional method has limitations and cannot accurately measure the lower limit value. In recent years, some foreign research institutions have also used advanced surface mechanics instruments, such as atomic force microscopes (AFM) and surface plasmon resonance (SPR) instruments, to measure the adhesion coefficient. These instruments have high sensitivity and high resolution and can be used to study adhesion at the microscopic scale, but they need to be measured in a specific experimental environment. They have poor portability and are difficult to simulate and measure the adhesion conditions under actual engineering conditions. In addition, some scholars have used contact angle meters to measure the contact angle of liquids on solid surfaces, thereby indirectly inferring the size of adhesion. This is an indirect qualitative measurement method that is difficult to accurately quantify.

[0004] Therefore, how to conveniently and accurately measure the adhesion of low-adhesion materials has become a technical problem that needs to be urgently solved in this field. Summary of the invention

[0005] The purpose of this application is to provide a low-adhesion ultrasonic vibration measurement device and method, which can conveniently and accurately measure the adhesion of low-adhesion materials.

[0006] To achieve the above objectives, this application provides the following solutions:

[0007] In a first aspect, the present application provides a low-adhesion ultrasonic vibration measuring device, which includes: an ultrasonic vibration transmitter, a vibrating sample plate fixing module, a vibrating sample plate, a sample sheet and a collecting plate.

[0008] The ultrasonic vibration transmitter is fixed together with the vibration sample plate and is used to generate vibration force.

[0009] The vibrating sample plate fixing module is used to fix the vibrating sample plate.

[0010] The vibrating sample plate is provided with a slot structure for installing the sample piece.

[0011] The sample sheet is used to adhere to the substance to be tested.

[0012] The collecting plate is used to charge the substance to be tested, and fix the substance to be tested on the sample piece through the electric field between the sample piece and the collecting plate; the distance between the collecting plate and the sample piece is adjustable.

[0013] In a second aspect, the present application provides a low-adhesion ultrasonic vibration measurement method, which is implemented based on the low-adhesion ultrasonic vibration measurement device described above, and the low-adhesion ultrasonic vibration measurement method includes:

[0014] When the substance to be tested is able to adhere to the sample piece, determine the contact area after the initial adhesion between the substance to be tested and the sample piece is stabilized, and the vibration force at the moment when the substance to be tested completely leaves the sample piece. Based on the vibration force, the force balance relationship between the gravity and adhesion force of the substance to be tested and the contact area, calculate the adhesion force per unit area.

[0015] When the substance to be tested cannot adhere to the sample piece, the substance to be tested is first charged, and the substance to be tested is fixed on the sample piece through the electric field between the sample piece and the collecting plate. The contact area after the initial adhesion between the substance to be tested and the sample piece is stabilized, as well as the vibration force at the moment when the substance to be tested completely leaves the sample piece are determined. According to the force balance relationship among the vibration force, electric field force, gravity and adhesion force of the substance to be tested and the contact area, the adhesion force per unit area is calculated.

[0016] The adhesion coefficient is calculated based on the contact area, the gravity of the substance to be tested and the magnitude of the adhesion force.

[0017] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0018] The present application provides a low-adhesion ultrasonic vibration measuring device and method, the measuring device comprising: an ultrasonic vibration transmitter, a vibrating sample plate fixing module, a vibrating sample plate, a sample piece and a collecting plate; the ultrasonic vibration transmitter is fixed together with the vibrating sample plate to generate a vibration force; the vibrating sample plate fixing module is used to fix the vibrating sample plate; the vibrating sample plate is provided with a slot structure for installing the sample piece; the sample piece is used to adhere to a substance to be tested; the collecting plate is used to charge the substance to be tested and fix the substance to be tested on the sample piece through the electric field between the sample piece and the collecting plate. When the substance to be tested can adhere to the sample piece, the contact area between the substance to be tested and the sample piece after the initial adhesion is stabilized, and the vibration force at the moment when the substance to be tested completely leaves the sample piece are determined, and the adhesion force per unit area is calculated based on the vibration force, the force balance relationship between the gravity and adhesion force of the substance to be tested, and the contact area; when the substance to be tested cannot adhere to the sample piece, the substance to be tested is first charged, and the substance to be tested is fixed on the sample piece through the electric field between the sample piece and the collecting plate, and the contact area between the substance to be tested and the sample piece after the initial adhesion is stabilized, and the vibration force at the moment when the substance to be tested completely leaves the sample piece are determined, and the adhesion force per unit area is calculated based on the vibration force, electric field force, the force balance relationship between the gravity and adhesion force of the substance to be tested, and the contact area; the adhesion coefficient can be calculated based on the contact area, the gravity and adhesion force of the substance to be tested. This application calculates the adhesion force per unit area based on the force balance relationship among vibration force, gravity, and adhesion force or the balance relationship among vibration force, electric field force, gravity, and adhesion force, as well as the contact area between the substance to be tested and the sample piece, and obtains the adhesion coefficient based on the gravity per unit area, thereby providing methodological support for the measurement of adhesion characteristics of viscous substances, and the study of adhesion, deposition mechanism, mechanism, and law of viscous fluids. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic structural diagram of a low-adhesion ultrasonic vibration measuring device provided in one embodiment of the present application.

[0021] Figure 2 Another structural schematic diagram of a low-adhesion ultrasonic vibration measuring device provided in one embodiment of the present application.

[0022] Figure 3A schematic diagram of a base plate structure of a sample piece fixing module provided in one embodiment of the present application.

[0023] Figure 4 A schematic diagram of another base plate structure of a sample piece fixing module provided in one embodiment of the present application.

[0024] Figure 5 A schematic flow chart of a low-adhesion ultrasonic vibration measurement method provided in one embodiment of the present application.

[0025] Reference numerals:

[0026] 1-ultrasonic vibration transmitter; 2-vibration sample plate; 3-vibration sample plate fixing module; 4-sample piece; 5-collection plate; 6-charging line; 7-semiconductor temperature control piece; 8-dot magnetic fixing piece; 9-temperature sensor; 10-thermocouple heater; 11-thermal oil pipe; 12-piece magnetic fixing piece. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] like Figure 1 and Figure 2 As shown, a low-adhesion ultrasonic vibration measuring device is provided, which includes: an ultrasonic vibration transmitter 1, a vibration sample plate fixing module 3, a vibration sample plate 2, a sample piece 4 and a collecting plate 5.

[0030] The ultrasonic vibration transmitter 1 is fixed together with the vibrating sample plate 2 to generate vibration force. The ultrasonic vibration transmitter 1 and the vibrating sample plate 2 can be interchanged with the sample piece 4 in upper and lower positions.

[0031] The vibrating sample plate fixing module 3 is used to fix the vibrating sample plate 2 .

[0032] The vibrating sample plate 2 is provided with a slot structure for mounting the sample piece 4 .

[0033] The sample sheet 4 is used to adhere to the substance to be tested. The sample sheet can be heated, cooled and kept warm to ensure that the temperature of the substance to be tested is constant.

[0034] The collecting plate 5 is used to charge the substance to be tested, and fix the substance to be tested on the sample piece 4 through the electric field between the sample piece 4 and the collecting plate 5 .

[0035] On the device, the adhesion of the substance to be tested at a known temperature is measured, and the substance to be tested adhering to the sample piece 4 is made to fall off by controlling the ultrasonic emission frequency and slowly increasing the mechanical vibration frequency / amplitude. The contact area after the initial adhesion of the substance to be tested and the sample piece 4 is stabilized, as well as the vibration frequency and amplitude at the moment of completely leaving the sample piece 4 are recorded, and the adhesion per unit area is calculated based on the force balance relationship of vibration force, gravity, and adhesion force and the contact area between the substance to be tested and the sample piece 4. Among them, when the substance with too small adhesion force (i.e., the substance that cannot be stably fixed on the sample piece 4), the substance to be tested can be charged first, and it can be fixed on the sample piece first through the electric field between the sample piece 4 and the collecting plate 5 (equivalent to adding an electric field force perpendicular to the direction of the sample piece 4), and the adhesion per unit area is calculated based on the balance relationship of vibration force, electric field force, gravity and adhesion force per unit area and the contact area between the substance to be tested and the test piece 4. Finally, the adhesion per unit area of ​​the substance to be tested is divided by the gravity of the substance to be tested per unit area to obtain the adhesion coefficient (which can be greater than 1).

[0036] In an exemplary embodiment, the ultrasonic vibration transmitter 1 needs to output stable vibration frequency and amplitude, the vibration frequency and amplitude deviations are both less than 10% (less than 5% in this embodiment), and the vibration frequency and amplitude are the same within Φ100mm of the vibration source center; the vibration frequency and amplitude can be finely adjusted by voltage, wherein the voltage stability is less than 0.1%, the ripple is less than 0.01%, and it has overload and short-circuit protection functions.

[0037] In an exemplary embodiment, the vibration sample plate fixing module 3 needs to ensure that the ultrasonic vibration transmitter 1 is tightly connected and level with the vibration sample plate 2, including but not limited to sliding sleeves / screws / threads or combinations thereof to avoid vibration-off designs (in this embodiment, a thread + rotating sleeve structure is used to avoid vibration-off designs); wherein, there need to be at least 3 local screws, which are evenly arranged at the same angle.

[0038] In an exemplary embodiment, the thickness of the vibrating sample plate 2 does not exceed 5 mm, and the diameter is not less than 30 cm. It is recommended that the material be made of lightweight and high-strength material to ensure that no deformation or damage occurs during the vibration process. The vibrating sample plate 2 is provided with a slot structure (i.e., a sample fixing module) for installing the sample piece 4. The slot is surrounded by charging modules (with voltage) for the sample piece 4 and an insulation design is used to prevent the vibrating sample plate 2 from being charged. The design of the slot should ensure a stable connection between the sample piece and the vibration plate to avoid instability during the vibration process. The connection method of the slot can be in a variety of forms, including but not limited to threaded connection, snap connection, and magnetic connection. In addition, a constant temperature heat exchange module is also embedded in the slot of the vibrating sample plate 2 to ensure that the temperature of the sample piece 4 is constant, wherein the constant temperature heat exchange module installs a heating element (such as a heating wire or a heating resistor), a temperature sensor (such as a thermistor or a thermocouple), and a micro heat exchange plate (see Figure 4 ), the temperature of the metal sheet is monitored by a feedback control system and the power of the heating element is adjusted to maintain the required temperature. The temperature deviation must be controlled within ±2℃.

[0039] like Figure 3 As shown, the size of the card slot is a 10cm×10cm groove, and a semiconductor temperature control sheet 7 is arranged every 2cm to ensure the temperature control of each part of the card slot. The temperature is set to 80°C in this example, and the alarm temperature is set for the semiconductor temperature control sheet 7 in advance using software so that an alarm is issued when it is higher than 80.5°C or lower than 79.5°C. The dot magnetic fixing sheets 8 are arranged in three rows and three columns with a spacing of 2.5cm. The middle fixing sheet is replaced by a temperature sensor 9. The dot magnetic fixing sheet 8 can fix the sample sheet 4 by magnetic attraction. The temperature sensor 9 can output a temperature signal. A thermocouple heater 10 is placed on the right side of the card slot. When the temperature of the sample sheet 4 is too low, the thermocouple heater 10 can be started first for rapid heating. The temperature sensor 9 will measure the temperature of the sample sheet 4. When the temperature sensor 9 displays the specified temperature (80°C), the thermocouple heater 10 is turned off to stop heating. When the temperature reaches the specified temperature of about 80°C, a stable voltage of 12V is added to the charging line 6 to charge the sample piece 4 and the object to be tested. When the temperature of the sample piece 4 is higher than the set maximum temperature of 80.5°C, the semiconductor temperature control piece 7 will issue a warning and start cooling to make it lower than 80.5°C; when the temperature is lower than the set minimum temperature of 79.5°C, the semiconductor temperature control piece 7 will also issue a warning and start heating, so as to achieve the purpose of controlling the temperature of the sample piece 4.

[0040] like Figure 4As shown, the heat transfer oil pipes 11 are distributed at intervals of 2 cm, the oil pipes are filled with heat transfer oil, and there is a heating resistor inside the heat transfer oil pipe 11 to heat the heat transfer oil. A temperature sensor is arranged in the middle of the card slot to sense the temperature of the sample and display it on the external screen. The minimum size of the sheet-mounted magnetic fixing sheet 12 is 1 cm × 7 cm, and it is arranged at intervals of 2.5 cm. Its function is to fix the sample 4 by magnetic attraction. When the temperature of the temperature sensor is lower than the minimum temperature of 80.5 ° C, the heating resistor in the oil pipe is energized to heat the sample 4; when the temperature of the temperature sensor is higher than the maximum temperature of 79.5 ° C, the heating resistor in the oil pipe is de-energized to stop heating the sample 4, so as to achieve the purpose of making the sample 4 reach the set temperature.

[0041] In an exemplary embodiment, the sample piece 4 can be made according to the material that the substance to be tested actually contacts in the actual environment, but the size, thickness and local shape must be strictly processed in accordance with the slot form of the vibration sample plate 2, wherein the area size is not less than 0.0025m 2 , thickness not less than 5mm.

[0042] In an exemplary embodiment, the collecting plate 5 is made of a good conductive material (such as copper, silver, etc.) and is uniformly charged. A micro-voltage regulating module is used to accurately adjust the voltage on the collecting plate to ensure that a stable electric field is formed between the collecting plate 5 and the sample piece 4, and the electric field force cannot be too large and cannot affect the vibration of the substance to be tested. The area of ​​the collecting plate 5 should cover the entire sample piece 4 in the axial direction, and the installation should be horizontal and flush with the sample piece 4. The spacing between the collecting plate 5 and the sample plate 4 is at least 10 cm, and the collecting plate 5 can be flexibly adjusted in a direction perpendicular to the sample piece 4 to change the spacing between the collecting plate 5 and the sample plate 4, with an adjustment range of at least 10 cm.

[0043] The measuring device can measure the adhesion and adhesion coefficient of materials with adhesion below 50psi (0.4MPa), solving the problem that traditional pull-off and scratch adhesion measurement methods cannot measure adhesion below 50psi (0.4MPa).

[0044] like Figure 5 As shown, in another exemplary embodiment of the present application, a low adhesion ultrasonic vibration measurement method is provided, and the low adhesion ultrasonic vibration measurement method is implemented based on any of the low adhesion ultrasonic vibration measurement devices described above, and the low adhesion ultrasonic vibration measurement method includes:

[0045] S1: When the substance to be tested can adhere to the sample piece, determine the contact area between the substance to be tested and the sample piece after the initial adhesion is stabilized, and the vibration force when the substance to be tested completely leaves the sample piece. According to the vibration force, the force balance relationship between the gravity and adhesion force of the substance to be tested and the contact area, calculate the adhesion force per unit area.

[0046] S2: When the substance to be tested cannot adhere to the sample piece, first charge the substance to be tested, and fix the substance to be tested on the sample piece through the electric field between the sample piece and the collecting plate, determine the contact area after the initial adhesion between the substance to be tested and the sample piece is stabilized, and the vibration force when the substance to be tested completely leaves the sample piece, and calculate the adhesion force per unit area based on the force balance relationship among the vibration force, electric field force, gravity and adhesion force of the substance to be tested and the contact area.

[0047] S3: Calculate the adhesion coefficient according to the contact area, the gravity and the adhesion force of the substance to be tested.

[0048] Specifically, when the substance to be tested can adhere to the sample piece and the vibrating sample plate is located on the upper part of the sample piece, the calculation formula for the adhesion force is:

[0049] F 附着力 =F 振动力 +G 重力 ;

[0050]

[0051] Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

[0052] When the substance to be tested can adhere to the sample and the vibrating sample plate is located at the bottom of the sample, the calculation formula for the adhesion force is:

[0053] F 附着力 =F 振动力 -G 重力 ;

[0054]

[0055] Among them, F 附着力 is the adhesion force per unit area, N; F 振动力is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

[0056] When the substance to be tested cannot adhere to the specimen and the vibrating specimen plate is located on the upper part of the specimen, the formula for calculating the adhesion force is:

[0057] F 附着力 =F 振动力 +G 重力 -F 电场力 ;

[0058]

[0059] Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 ; F 电场力 is the electric field force per unit area, N; U is the potential difference between the sample and the collecting plate, V; d is the distance between the plates, m; q is the charge of the substance to be tested, C.

[0060] When the substance to be tested cannot adhere to the specimen and the vibrating specimen plate is located at the bottom of the specimen, the formula for calculating the adhesion force is:

[0061] F 附着力 =F 振动力 -G 重力 +F 电场力 ;

[0062]

[0063] Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 ; F 电场力is the electric field force per unit area, N; U is the potential difference between the sample and the collecting plate, V; d is the distance between the plates, m; q is the charge of the substance to be tested, C.

[0064] The calculation formula of the adhesion coefficient is:

[0065]

[0066] Where Sc is the adhesion coefficient; F 附着力 is the adhesion force per unit area, N; G 重力 is the gravity of the substance to be measured per unit area, N; m is the mass of the substance to be measured, kg; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

[0067] It should be noted that for substances that can be stably attached to the sample piece 4, when measuring, it is first necessary to measure the gravity of the substance to be tested to determine its weight on the sample piece 4. This step is crucial for subsequent experimental data analysis, because the performance of adhesion is usually related to the weight of the object. Next, start the vibration transmitter to start vibrating, and fix the amplitude to ensure the stability and consistency of the vibration. Subsequently, gradually increase the frequency of the vibration and gradually increase the intensity of the vibration until the substance to be tested is observed to detach from the sample piece 4. At this critical moment, it is necessary to accurately record the amplitude and frequency data when the substance to be tested detaches.

[0068] For substances with too little adhesion (i.e. substances that cannot be stably fixed on the sample plate 4), when measuring the adhesion, it is first necessary to charge the substance to be tested with a certain amount of electricity to ensure that it can adhere to the sample piece 4 more stably. This pre-charging operation can increase the performance of adhesion and make the experimental results more accurate and reliable. Next, it is necessary to measure the gravity and charge of the substance to be tested, which will provide important references for subsequent experiments. Measuring gravity helps to understand the weight of the substance on the sample piece 4, while measuring the charge can help analyze the effect of charge on adhesion. Subsequently, start the vibration transmitter to start vibrating, and fix the amplitude to ensure the stability and consistency of the vibration. During the vibration process, gradually increase the frequency of the vibration, and gradually increase the intensity of the vibration until the substance to be tested is observed to detach from the sample piece 4. At this critical moment, it is necessary to accurately record the amplitude and frequency data when the substance to be tested detaches.

[0069] This application can measure the adhesion and adhesion coefficient of materials with an adhesion force lower than 50psi (0.4MPa), and support the measurement of adhesion characteristics of viscous materials, and the study of adhesion, deposition mechanism, mechanism and law of viscous fluids.

[0070] The present application also provides an application scenario, which applies the above-mentioned low adhesion ultrasonic vibration measurement method. Specifically: The low adhesion ultrasonic vibration measurement method provided in this embodiment can be applied in the physical property analysis scenario of viscous materials. The physical property analysis scenario of viscous materials includes: viscosity judgment link, charging link, adhesion magnitude calculation link and adhesion coefficient calculation link. When the substance to be tested can adhere to the sample piece, there is no need to perform a charging step. The contact area between the substance to be tested and the sample piece after the initial adhesion is stabilized, as well as the vibration force at the moment when the substance to be tested completely leaves the sample piece are directly determined. The adhesion force per unit area can be calculated based on the vibration force, the force balance relationship between the gravity and adhesion force of the substance to be tested, and the contact area. When the substance to be tested cannot adhere to the sample piece, a charging step is required. The substance to be tested is first charged, and the substance to be tested is fixed on the sample piece through the electric field between the sample piece and the collecting plate. The contact area between the substance to be tested and the sample piece after the initial adhesion is stabilized, as well as the vibration force at the moment when the substance to be tested completely leaves the sample piece are determined. The adhesion force per unit area can be calculated based on the vibration force, electric field force, the force balance relationship between the gravity and adhesion force of the substance to be tested, and the contact area. Then, the adhesion coefficient can be calculated based on the contact area, the gravity and adhesion force of the substance to be tested.

[0071] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A low-adhesion ultrasonic vibration measuring device, characterized in that: The low-adhesion ultrasonic vibration measuring device comprises: an ultrasonic vibration transmitter, a vibration sample plate fixing module, a vibration sample plate, a sample sheet and a collecting plate; The ultrasonic vibration transmitter is fixed together with the vibration sample plate and is used to generate vibration force; The vibrating sample plate fixing module is used to fix the vibrating sample plate; The vibrating sample plate is provided with a slot structure for mounting the sample piece; The sample sheet is used to adhere to the substance to be tested; The collecting plate is used to charge the substance to be tested, and fix the substance to be tested on the sample piece through the electric field between the sample piece and the collecting plate.

2. The low adhesion ultrasonic vibration measuring device according to claim 1, characterized in that: The distance between the collecting plate and the sample piece is adjustable.

3. The low adhesion ultrasonic vibration measuring device according to claim 1, characterized in that: The vibrating sample plate fixing module adopts a sliding sleeve / screw / thread or a combination of these structures.

4. The low adhesion ultrasonic vibration measuring device according to claim 1, characterized in that: The slot structure of the vibrating sample plate is also embedded with a constant temperature heat exchange module, and the constant temperature heat exchange module is used to ensure that the temperature of the sample piece is constant.

5. A low adhesion ultrasonic vibration measurement method, which is implemented based on the low adhesion ultrasonic vibration measurement device according to any one of claims 1 to 4, characterized in that: The low adhesion ultrasonic vibration measurement method comprises: When the substance to be tested can adhere to the sample sheet, determine the contact area between the substance to be tested and the sample sheet after the initial adhesion is stable, and the vibration force when the substance to be tested completely leaves the sample sheet, and calculate the adhesion force per unit area according to the vibration force, the force balance relationship between the gravity of the substance to be tested and the adhesion force, and the contact area; When the substance to be tested cannot adhere to the sample sheet, the substance to be tested is first charged, and the substance to be tested is fixed on the sample sheet through the electric field between the sample sheet and the collecting plate, and the contact area after the initial adhesion between the substance to be tested and the sample sheet is stabilized, and the vibration force when the substance to be tested completely leaves the sample sheet is determined, and the adhesion force per unit area is calculated according to the force balance relationship among the vibration force, the electric field force, the gravity of the substance to be tested and the adhesion force, and the contact area; The adhesion coefficient is calculated based on the contact area, the gravity of the substance to be tested and the magnitude of the adhesion force.

6. The low adhesion ultrasonic vibration measurement method according to claim 5, characterized in that: When the substance to be tested can adhere to the sample and the vibrating sample plate is located on the upper part of the sample, the calculation formula for the adhesion force is: F 附着力 =F 振动力 +G 重力 ; Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

7. The low adhesion ultrasonic vibration measurement method according to claim 5, characterized in that: When the substance to be tested can adhere to the sample and the vibrating sample plate is located at the bottom of the sample, the calculation formula for the adhesion force is: F 附着力 =F 振动力 -G 重力 ; Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

8. The low adhesion ultrasonic vibration measurement method according to claim 5, characterized in that: When the substance to be tested cannot adhere to the specimen and the vibrating specimen plate is located on the upper part of the specimen, the formula for calculating the adhesion force is: F 附着力 =F 振动力 +G 重力 -F 电场力 ; Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 ; F 电场力 is the electric field force per unit area, N; U is the potential difference between the sample and the collecting plate, V; d is the distance between the plates, m; q is the charge of the substance to be tested, C.

9. The low adhesion ultrasonic vibration measurement method according to claim 5, characterized in that: When the substance to be tested cannot adhere to the specimen and the vibrating specimen plate is located at the bottom of the specimen, the formula for calculating the adhesion force is: F 附着力 =F 振动力 -G 重力 +F 电场力 ; Among them, F 附着力 is the adhesion force per unit area, N; F 振动力 is the vibration force per unit area, N; m is the mass of the substance to be measured, kg; f is the vibration frequency, Hz; α is the amplitude, m; G 重力 is the gravity of the substance to be measured per unit area, N; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 ; F 电场力 is the electric field force per unit area, N; U is the potential difference between the sample and the collecting plate, V; d is the distance between the plates, m; q is the charge of the substance to be tested, C.

10. The low adhesion ultrasonic vibration measurement method according to claim 5, characterized in that: The calculation formula of the adhesion coefficient is: Where Sc is the adhesion coefficient; F 附着力 is the adhesion force per unit area, N; G 重力 is the gravity of the substance to be measured per unit area, N; m is the mass of the substance to be measured, kg; g is the acceleration due to gravity, m / s 2 ; A is the contact area between the substance to be tested and the sample, m 2 .

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