Pipeline fixing cover plate, fixing assembly thereof and photoetching machine

By designing the pipeline fixed cover plate in the lithography machine and setting the spacing between the bottom of the board main body and the pipeline, the problem of downtime caused by pipeline wear is solved, and production stability and yield rate are improved.

CN119535899APending Publication Date: 2025-02-28GEKKO SEMICON (SHANGHAI) CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202311118422.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-08-31
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

During the chip production process, the equipment downtime due to abnormal pipeline wear, which affects the production progress and yield rate.

Method used

A pipeline fixed cover plate is designed, with a spacing between the inner surface of the bottom of the board main body and the lowest surface of the upper pipeline part, reducing the pressure between the pipeline fixed cover plate and the pipeline and reducing the probability of equipment downtime.

Benefits of technology

It effectively reduces abnormal wear and tear of the pipeline at the bottom of the workbench, reduces the probability of equipment downtime, and ensures the stability of the chip production process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119535899A_ABST
    Figure CN119535899A_ABST
Patent Text Reader

Abstract

The invention discloses a pipeline fixing cover plate, a fixing assembly thereof and a photoetching machine, the pipeline fixing cover plate is used for a workbench of the photoetching machine, the pipeline fixing cover plate comprises a plate main body, the plate main body is arranged on the outer side of at least part of pipelines at the bottom of the workbench, and in an initial installation state, the plate main body is fixed to the workbench; and a gap is formed between the inner side surface of the bottom of the plate main body and the lowest surface of the pipeline part above the plate main body. The pipeline fixing cover plate has the advantages that the distance is formed between the inner side surface of the bottom of the plate body and the lowest surface of the pipeline part above the plate body, abnormal abrasion of the pipeline at the bottom of a workbench can be effectively reduced, the pressure between the pipeline fixing cover plate and the pipeline is reduced through the distance, the probability of downtime of equipment is reduced, and the service life of the equipment is prolonged. And the production process of the chip can be ensured.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the field of integrated circuit manufacturing, and in particular to a pipeline fixing cover plate and a fixing component thereof and a photolithography machine. Background Art

[0002] With the vigorous development of semiconductor technology, the size of chips is getting smaller and smaller, and the integration of devices is also increasing. In order to ensure the quality of chips, the process requirements for semiconductors are becoming more and more stringent. In order to explore the next generation of power devices, issues such as device integration and size reduction have received widespread attention. By improving the integration of devices, cost-effectiveness and equipment performance can be improved simultaneously. The number of stacking layers of devices also increases. A normal chip requires thousands of process flows from silicon wafers to the final packaging. Multiple process flows have inevitably generated complexity in the processing process, especially in multiple patterning technology.

[0003] Among them, the photolithography machine is the core equipment for manufacturing chips. It uses a technology similar to photo printing to print the fine patterns on the mask plate onto the substrate through light exposure, thereby forming tiny circuit elements. Therefore, the continuous and stable operation of the photolithography machine is crucial. However, in the chip production process, various factors will affect the continuous and stable operation of the photolithography machine, thereby affecting the chip production process and yield rate. For example, in the production process, the machine may generate an alarm due to abnormal wear of parts, causing the entire equipment to shut down. Each time the equipment is down, it takes a long time to troubleshoot the fault, and the equipment takes a long time to resume work, which affects the production progress, and then affects the output and preparation scale of integrated circuits, etc., causing great losses to production. Therefore, it is necessary to improve the existing equipment.

[0004] It should be understood that the above statements merely provide background technology related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0005] Based on the aforementioned technical problems, the object of the present invention is to provide a pipeline fixing cover plate, a fixing assembly thereof and a photolithography machine, wherein the pipeline fixing cover plate has a spacing between the inner surface of the bottom of the plate main body and the lowest surface of the pipeline part above it, which can effectively reduce the abnormal wear of the pipeline at the bottom of the workbench. The spacing reduces the pressure between the pipeline fixing cover plate and the pipeline, reduces the probability of equipment downtime, and helps to ensure the chip production process.

[0006] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0007] A pipeline fixing cover plate for a photolithography machine workbench, comprising:

[0008] The plate body is arranged outside at least part of the pipeline at the bottom of the workbench. In the initial installation state, there is a distance between the inner surface of the bottom of the plate body and the lowest surface of the pipeline part above it.

[0009] Optionally, the spacing ranges from 1 to 10 mm.

[0010] Optionally, the board body comprises:

[0011] A top plate, which is arranged above at least part of the pipeline at the bottom of the workbench, and the shape of the top plate matches the top shape of at least part of the pipeline below it;

[0012] A side plate connected to the top plate, the side plate being located at a side of the pipeline away from the center of the workbench, and the shape of the side plate matches the shape of the side of the pipeline away from the center of the workbench;

[0013] A bottom plate is connected to the side plates. The bottom plate is the bottom of the plate body and is located below at least part of the pipeline. The shape of the bottom plate matches the shape of the bottom of at least part of the pipeline above it. There is a gap between the inner surface of the bottom plate and the lowest surface of the pipeline part above it.

[0014] Optionally, the board body further comprises:

[0015] The inclined cover plate is formed by extending the side plate toward the center of the workbench, and the inclined cover plate covers at least a portion of the inclined portion of the pipeline.

[0016] Optionally, the top plate and the side plate are integrally formed;

[0017] And / or, the side panel and the bottom panel are integrally formed.

[0018] Optionally, the side plate is provided with a chamfered structure on the boundary edge between the side plate and the top plate.

[0019] Optionally, the plate body is made of metal material.

[0020] Optionally, also include:

[0021] A wear-resistant insulating layer is at least arranged on the inner side surface of the bottom of the plate body.

[0022] Optionally, a wear-resistant insulating layer is provided on the inner surface of the plate body.

[0023] Optionally, the wear-resistant insulating layer includes a plating layer, a spray coating layer or a film layer of a wear-resistant insulating material.

[0024] Optionally, the wear-resistant insulating layer comprises Teflon material.

[0025] Optionally, the wear-resistant insulating layer has a thickness ranging from 0.15 to 0.24 mm.

[0026] Optionally, a fixing component comprises:

[0027] The aforementioned pipeline fixing cover plate;

[0028] A tightening belt is wrapped around the outside of the pipeline fixing cover plate.

[0029] Optionally, the side plate of the pipeline fixing cover plate is provided with a chamfered structure at the junction edge between the side plate and the top plate, and the fastening belt is in contact with the chamfered structure.

[0030] Optionally, a photolithography machine comprises:

[0031] A workbench comprises a work surface, the bottom of which comprises the aforementioned pipeline fixing cover plate, and the pipeline fixing cover plate is used to fix at least part of the pipelines at the bottom of the work surface.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] In a pipeline fixing cover plate, a fixing assembly thereof and a photolithography machine of the present invention, by providing a spacing between the inner surface of the bottom of the plate body of the pipeline fixing cover plate and the lowest surface of the pipeline part above it, abnormal wear of the pipeline at the bottom of the workbench can be effectively reduced. The spacing reduces the pressure between the pipeline fixing cover plate and the pipeline, reduces the probability of equipment downtime, and helps to ensure the chip production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of an application of a fixing component of the present invention;

[0035] Figure 2 This is a schematic diagram of laying a pipeline fixing cover plate according to the present invention;

[0036] Figure 3 It is a schematic diagram of the application state of a pipeline fixing cover plate of the present invention. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that, in this article, the terms "include", "comprises", "has" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "includes..." or "comprising..." do not exclude the existence of other elements in the process, method, article or terminal device including the elements.

[0039] It should be noted that the drawings are all in very simplified form and use inaccurate ratios, and are only used to conveniently and clearly assist in explaining the embodiments of the present invention.

[0040] As mentioned above, the continuous and stable operation of semiconductor lithography equipment is extremely important. However, in actual applications, many factors will affect the continuous and stable operation of lithography equipment. If abnormal conditions are not discovered in time, the entire equipment will be down. The processing time for each downtime is usually more than 4 hours. The frequency of equipment downtime in the industry is about 1.5 months / time, and new equipment is about 2 months / time. As production increases, the frequency of downtime will also increase accordingly. If the cause of the downtime is component damage, the component needs to be replaced, and the recovery time will exceed 48 hours, which will cause great losses to production.

[0041] Based on the above, the applicant team conducted research on the lithography equipment and found that the connecting pipelines of the lithography machine workbench (stage) would be abnormally worn. These connecting pipelines are connected to various functional components of the lithography machine and usually carry functions such as signal transmission. If the pipelines are worn to a certain extent, it will affect the signal transmission and other functions of these pipelines, causing the machine to generate an alarm and cause the entire equipment to shut down. In actual production, if the worn pipelines are not discovered in time, it is easy to cause equipment shutdown due to abnormal working conditions, thereby affecting production progress. After in-depth research, it was found that the wear position of the connecting pipelines is usually in the measurement area and the exposure area. The wear of the pipelines in this area will cause abnormal operation of the entire connecting pipeline, thereby triggering a machine alarm and causing the equipment to shut down.

[0042] Based on the above, if Figures 1 to 3As shown, the present invention provides a fixing assembly 100, which is used to fix at least part of the pipeline at the bottom of the workbench. Specifically, the fixing assembly 100 includes a pipeline fixing cover plate 110 and a fastening belt 120, the fastening belt 120 is wrapped around the outside of the pipeline fixing cover plate 110, and the pipeline fixing cover plate 110 includes a plate body 111, which is arranged on the outside of at least part of the pipeline at the bottom of the workbench to protect the pipeline. In the initial installation state, there is a gap between the inner surface of the bottom of the plate body 111 and the lowest surface of the pipeline part above it, and the gap can ensure that the inner surface of the bottom of the plate body 111 and the lowest surface of the pipeline part above it do not contact, avoiding the pipeline fixing cover plate 110 directly contacting the pipeline due to the narrow opening of the pipeline fixing cover plate 110 to generate a certain pressure on it, preventing the pipeline at the bottom of the workbench and the pipeline fixing cover plate 110 from abnormal wear, so that there will be no interference between the two. In the working state, even if the workbench causes the pipeline to move slightly during the movement, the spacing between the pipeline and the pipeline fixing cover plate 110 reduces the influence of the pipeline fixing cover plate 110 on the pipeline, prevents the pipeline from being worn due to contact friction between the two, and avoids the alarm of the lithography machine causing downtime, which helps to ensure the chip production progress. The design of the pipeline fixing cover plate 110 is of great significance for avoiding downtime caused by abnormal wear of the workbench pipeline. Furthermore, the fixing assembly 100 with the pipeline fixing cover plate 110 can achieve effective protection of the pipeline at the bottom of the workbench surface to improve the production efficiency of the equipment. Of course, the pipeline fixing cover plate 110 is not limited to being fixed and constrained by the fastening belt 120, and it can also be constrained and fixed by other means, which is not limited by the present invention, for example, it is fixed and constrained by a bolt fastening device (bolt holes can be opened on the plate body 111).

[0043] like Figure 2As shown, in this embodiment, the plate body 111 includes: a top plate 112, a side plate 113 and a bottom plate 114. The top plate 112 is arranged above at least part of the pipeline at the bottom of the workbench, and the shape of the top plate 112 matches the top shape of at least part of the pipeline below it. The side plate 113 is connected to the top plate 112, and the side plate 113 is located on the side of the pipeline away from the center of the workbench, and the shape of the side plate 113 matches the shape of the side of the pipeline away from the center of the workbench. The bottom plate 114 is connected to the side plate 113, and the bottom plate 114 is the bottom of the plate body 111, which is located below at least part of the pipeline, and the shape of the bottom plate 114 matches the shape of at least part of the bottom of the pipeline above it, and there is a gap between the inner surface of the bottom plate 114 and the lowest surface of the pipeline part above it. Compared with the inner surface of the bottom plate 114 being closely attached to the lowest surface of the pipeline portion above it, the plate body 111 in this embodiment is equivalent to moving the bottom plate 114 down a certain distance so that there is a distance between it and the lowest surface of the pipeline portion, so as to reduce the influence of the plate body 111 on the pipeline in the working state. Even if the pipeline moves slightly with the workbench, the pipeline fixing cover plate 110 will not generate excessive pressing force on the pipeline to cause pipeline wear, thereby reducing the possibility of equipment downtime and helping to ensure the progress of chip production.

[0044] Optionally, the spacing between the inner surface of the bottom of the plate body 111 and the lowest surface of the pipeline part above it is in the range of 1 to 10 mm. In this embodiment, according to the position measurement of the machine pipeline fixing cover plate 110, the spacing is 5 mm, that is, the spacing between the inner surface of the bottom plate 114 of the plate body 111 and the lowest surface of the pipeline part above it is 5 mm. Compared with setting the bottom plate 114 close to the pipeline, the plate body 111 is equivalent to extending the length of the side plate 113 of the part connected with the bottom plate 114 downward by 5 mm, and the bottom plate 114 is also moved down by 5 mm accordingly. This spacing will not make the distance between the pipeline fixing cover plate 110 and the pipeline it acts on too far, avoiding occupying too much space, and ensuring that the pipeline in the working state will not have more contact with the pipeline fixing cover plate 110 due to the change of the state of the workbench, so as to produce wear, so that there is no interference between the two, and the pressure between the pipeline fixing cover plate 110 and the pipeline is released, taking into account both space utilization and equipment stability.

[0045] Furthermore, in this embodiment, the side plate 113 of the pipeline fixing cover plate 110 is provided with a chamfered structure 115 at the junction edge with the top plate 112, and the fastening belt 120 is in contact with the chamfered structure 115. In actual application, the fastening belt 120 passes through the chamfered structure 115 to constrain the pipeline fixing cover plate 110.

[0046] Further, such as Figure 1As shown, according to the actual layout characteristics of the pipelines, the plate body 111 also includes an inclined cover plate 116, which is extended from the side plate 113 toward the center of the workbench. The inclined cover plate 116 covers at least part of the inclined portion of the pipeline to protect the pipelines in the corresponding area.

[0047] Optionally, the plate body 111 is made of a metal material. On the other hand, the top plate 112 and the side plate 113 can be integrally formed; and / or, the side plate 113 and the bottom plate 114 can be integrally formed. In this embodiment, the plate body 111 is made of a stainless steel material, which has sufficient strength and can be arranged into a desired structure. Furthermore, the top plate 112, the side plate 113 and the bottom plate 114 are integrally formed. During actual preparation, a whole piece of stainless steel plate can be processed without the need for an additional splicing process, thereby simplifying the production process and reducing production costs.

[0048] Furthermore, the pipeline fixing cover plate 110 also includes a wear-resistant insulating layer, and the wear-resistant insulating layer is at least arranged on the inner surface of the bottom of the plate body 111 to further avoid wear on the pipeline in the corresponding area. Optionally, the wear-resistant insulating layer includes a plating layer or a spray layer or a film layer of a wear-resistant insulating material. Further optionally, the thickness range of the wear-resistant insulating layer is 0.15 to 0.24 mm. It can be understood that the present invention does not limit the material composition and setting method of the wear-resistant insulating layer, as long as the corresponding functional effects can be achieved. On the other hand, the thickness range of the wear-resistant insulating layer is not limited to the above-mentioned values. In other embodiments, it can also be set to other values ​​according to actual needs and site conditions, and the present invention is not limited to this.

[0049] In this embodiment, a wear-resistant insulating layer is provided on the inner surface of the plate body 111. Of course, the wear-resistant insulating layer is not limited to being provided on the inner surface of the plate body 111, and it can also be provided in other areas according to actual needs, and the present invention is not limited to this.

[0050] In this embodiment, the wear-resistant insulating layer includes Teflon material. Specifically, a layer of Teflon tape is attached to the inner surface of the plate body 111, and the thickness of the Teflon tape is 0.18 mm. The Teflon tape has the characteristics of extremely strong wear resistance, smooth surface, high temperature resistance, good fire retardancy, excellent electrical insulation, and excellent anti-adhesion, and can be widely used in the electronic and electrical industry. After the pipeline fixing cover plate 110 is made of Teflon tape, it can further prevent the workbench from driving the pipeline to directly contact the plate body 111 and generate friction during the movement. Due to the smooth surface of the Teflon tape, the friction between the pipeline and the pipeline fixing cover plate 110 is greatly reduced, which can effectively protect the pipeline of the workbench. Because Teflon tape has strong wear resistance, it is impossible for this friction to wear out the tape. If ordinary tape is used, these ordinary tapes may be worn off due to natural aging or friction after a period of time, and some residual glue will be left. If the residual glue is not found in time, the wear will increase. Once the ordinary tape is worn through, the surface of the plate body 111 and the residual glue will increase the wear of the pipeline, increase the frequency of downtime, and shorten the life of the workbench pipeline. Therefore, the use of ordinary tape is only a temporary solution. Compared with the use of ordinary tape, the Teflon tape used in the present invention has more advantages. On the other hand, since the pipeline fixing cover plate 110 is an electrical component used in the machine, the Teflon tape has excellent electrical insulation and can effectively prevent static electricity and electrical signal interference.

[0051] Based on the same inventive concept, the present invention also provides a photolithography machine, which includes a workbench, the workbench includes a work surface, the bottom of the work surface includes the aforementioned pipeline fixing cover plate 110, and the pipeline fixing cover plate 110 is used to fix at least part of the pipelines at the bottom of the work surface to protect the pipelines in the corresponding area and reduce the probability of equipment downtime. It has been verified in actual work that the application of the above pipeline fixing cover plate 110 in the photolithography machine can effectively avoid abnormal wear of the pipelines at the bottom of the workbench, greatly reducing the probability of downtime.

[0052] In summary, in a pipeline fixing cover plate 110 and its fixing assembly 100 and a photolithography machine of the present invention, by providing a spacing between the inner surface of the bottom of the plate body 111 of the pipeline fixing cover plate 110 and the lowest surface of the pipeline part above it, abnormal wear of the pipeline at the bottom of the workbench can be effectively reduced. The spacing reduces the pressure between the pipeline fixing cover plate 110 and the pipeline, reduces the probability of equipment downtime, and helps to ensure the chip production process.

[0053] Furthermore, a wear-resistant insulating layer is provided on the plate body 111 of the pipeline fixing cover plate 110, which can further prevent the pipeline from directly contacting the plate body 111 and causing friction during the movement of the workbench, thereby avoiding abnormal wear of the pipeline and effectively protecting the pipeline of the workbench.

[0054] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A pipeline fixing cover plate for a photolithography machine workbench, characterized in that: Include: The plate body is arranged outside at least part of the pipeline at the bottom of the workbench. In the initial installation state, there is a distance between the inner surface of the bottom of the plate body and the lowest surface of the pipeline part above it.

2. The pipeline fixing cover plate for a photolithography machine workbench according to claim 1, characterized in that: The range of the spacing is 1 to 10 mm.

3. The pipeline fixing cover plate for a photolithography machine workbench according to claim 1, characterized in that: The board body comprises: A top plate, which is arranged above at least part of the pipeline at the bottom of the workbench, and the shape of the top plate matches the top shape of at least part of the pipeline below it; A side plate connected to the top plate, the side plate being located at a side of the pipeline away from the center of the workbench, and the shape of the side plate matches the shape of the side of the pipeline away from the center of the workbench; A bottom plate is connected to the side plates. The bottom plate is the bottom of the plate body and is located below at least part of the pipeline. The shape of the bottom plate matches the shape of the bottom of at least part of the pipeline above it. There is a gap between the inner surface of the bottom plate and the lowest surface of the pipeline part above it.

4. The pipeline fixing cover plate for a photolithography machine workbench according to claim 3, characterized in that: The board body also includes: The inclined cover plate is formed by extending the side plate toward the center of the workbench, and the inclined cover plate covers at least a portion of the inclined portion of the pipeline.

5. The pipeline fixing cover plate for a photolithography machine workbench according to claim 3, characterized in that: The top plate and the side plate are integrally formed; And / or, the side panel and the bottom panel are integrally formed.

6. The pipeline fixing cover plate for a photolithography machine workbench according to claim 3, characterized in that: The side plate is provided with a chamfer structure on the border edge between the side plate and the top plate.

7. The pipeline fixing cover plate for a photolithography machine workbench according to claim 1, characterized in that: The plate body is made of metal material.

8. The pipeline fixing cover plate for a photolithography machine workbench according to claim 1, characterized in that: Also includes: A wear-resistant insulating layer is at least arranged on the inner side surface of the bottom of the plate body.

9. The pipeline fixing cover plate for a photolithography machine workbench according to claim 8, characterized in that: A wear-resistant insulating layer is arranged on the inner surface of the plate body.

10. The pipeline fixing cover plate for a photolithography machine workbench according to claim 8, characterized in that: The wear-resistant insulating layer comprises a plating layer, a spraying layer or a film layer of a wear-resistant insulating material.

11. The pipeline fixing cover plate for a photolithography machine workbench according to claim 8 or 10, characterized in that: The wear-resistant insulating layer comprises Teflon material.

12. The pipeline fixing cover plate for a photolithography machine workbench according to claim 8, characterized in that: The thickness of the wear-resistant insulating layer ranges from 0.15 to 0.24 mm.

13. A fixing assembly, characterized in that: Include: The pipeline fixing cover plate according to any one of claims 1 to 12; A tightening belt is wrapped around the outside of the pipeline fixing cover plate.

14. The fixing assembly according to claim 13, characterized in that: The side plate of the pipeline fixing cover plate is provided with a chamfered structure at the junction edge between the side plate and the top plate, and the fastening belt is in contact with the chamfered structure.

15. A photolithography machine, characterized in that: Include: A workbench comprises a work surface, the bottom of which comprises a pipeline fixing cover plate as claimed in any one of claims 1 to 12, wherein the pipeline fixing cover plate is used to fix at least part of the pipeline at the bottom of the work surface.