Electronic device

Abstract

Disclosed is an electronic device including a display layer and a sensor layer, in which the sensor layer includes a plurality of first sensing electrodes including one end and the other end, a plurality of second sensing electrodes, a plurality of first traces and a plurality of second traces connected to the plurality of first sensing electrodes, and a plurality of third traces connected to the plurality of second sensing electrodes, wherein, during the sensing of the first section of the frame, the sensor layer operates in a self-touch scheme, and wherein, during the sensing of the first section of the frame, driving signals are provided only to the plurality of first traces and the plurality of third traces.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2023-0115044 filed on August 31, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Embodiments of the present disclosure described herein relate to an electronic device having improved sensing reliability. Background Art

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, etc. are equipped with electronic devices for displaying images. In addition to typical input schemes such as buttons, keyboards, mice, etc., the electronic devices may have a sensor layer that can provide a touch-based input scheme that allows users to easily, intuitively, and conveniently input information or commands. The sensor layer can sense whether the user's body has made a touch input. Summary of the invention

[0004] Embodiments of the present disclosure provide an electronic device with improved sensing reliability.

[0005] According to an embodiment, an electronic device includes: a display layer; and a sensor layer, which is arranged on the display layer and includes an active area and a peripheral area arranged adjacent to the active area, the sensor layer includes: a plurality of first sensing electrodes, extending along a first direction, each of the plurality of first sensing electrodes including one end and the other end spaced apart from each other in the first direction; a plurality of second sensing electrodes, extending along a second direction intersecting the first direction; a plurality of first traces, respectively electrically connected to one ends of at least some of the plurality of first sensing electrodes; a plurality of second traces, respectively electrically connected to the other ends of the remaining first sensing electrodes of the plurality of first sensing electrodes; and a plurality of third traces, respectively electrically connected to the plurality of second sensing electrodes, during a first segment of a sensing frame, the plurality of first sensing electrodes and the plurality of second sensing electrodes operate in a self-touch scheme, and during the first segment of the sensing frame, driving signals are provided only to the plurality of first traces and the plurality of third traces.

[0006] The electronic device may further include: a data driver that drives the display layer; a sensor driver that drives the sensor layer; and a display signal line that is electrically connected to the data driver and transmits a signal for controlling the display layer, the sensor driver may be electrically connected to a plurality of second traces, and the plurality of second traces may overlap with the display signal line in a plan view.

[0007] The sensor driver may be electrically connected to the plurality of first trace lines, and the plurality of first trace lines may not overlap the display signal lines in a plan view.

[0008] The sensor driver may be electrically connected to the plurality of third trace lines, and the plurality of third trace lines may not overlap the display signal lines in a plan view.

[0009] The electronic device may further include: a flexible circuit board electrically connected to the display layer and the sensor layer, and the display signal line and the sensor driver may be provided on the flexible circuit board.

[0010] The plurality of first traces may include: first-first lines, respectively connected to one ends of at least some of the plurality of first sensing electrodes; and first-second lines, respectively extending from the first-first lines and connected to the sensor driver, the first-first lines may be arranged in the peripheral area, and the first-second lines may be arranged on the flexible circuit board.

[0011] During a second section of the sensing frame following the first section of the sensing frame, the plurality of first sensing electrodes and the plurality of second sensing electrodes may be driven in a mutual touch scheme.

[0012] During the second section, transmission signals may be provided to the plurality of first traces and the plurality of second traces, and reception signals generated based on the transmission signals may be provided to the plurality of third traces.

[0013] At least some of the plurality of first sensing electrodes and the remaining first sensing electrodes of the plurality of first sensing electrodes may be alternately arranged along the second direction.

[0014] A portion of each of the plurality of first trace lines may be disposed on one side of the peripheral area.

[0015] A portion of each of the plurality of second traces may be disposed at another side of the peripheral region, the other side of the peripheral region being spaced apart from the one side of the peripheral region in the first direction.

[0016] A portion of each of the plurality of third traces may be disposed adjacent to the portion of each of the plurality of first traces.

[0017] According to an embodiment, an electronic device includes: a display layer; a data driver driving the display layer; a sensor layer disposed on the display layer; a sensor driver driving the sensor layer; and a display signal line electrically connected to the data driver, the sensor layer including: a plurality of first sensing electrodes extending along a first direction, each of the plurality of first sensing electrodes including one end and the other end spaced apart from each other in the first direction; a plurality of first traces electrically connected to one ends of at least some of the plurality of first sensing electrodes, respectively; and a plurality of second traces electrically connected to the other ends of the remaining first sensing electrodes, respectively, the plurality of first traces and the plurality of second traces being connected to the sensor driver, the plurality of second traces overlapping with the display signal lines in a plan view, the plurality of first traces not overlapping with the display signal lines in a plan view, and during a first segment of a sensing frame, a driving signal is provided to the plurality of first traces.

[0018] At least some of the plurality of first sensing electrodes and the rest of the plurality of first sensing electrodes may be alternately arranged.

[0019] The electronic device may further include: a flexible circuit board electrically connected to the display layer and the sensor layer, and the display signal line and the sensor driver may be provided on the flexible circuit board.

[0020] The sensor layer may further include: a plurality of second sensing electrodes extending along a second direction intersecting the first direction; and a plurality of third traces electrically connected to the plurality of second sensing electrodes, respectively, and during the first section, the plurality of third traces may be provided with driving signals.

[0021] During the first section, the plurality of first sensing electrodes and the plurality of second sensing electrodes may operate in a self-touch scheme.

[0022] The plurality of third trace lines may be spaced apart from the display signal lines in a plan view.

[0023] The sensing frame may further include a second section after the first section, and during the second section, the plurality of first sensing electrodes and the plurality of second sensing electrodes may be driven in a mutual touch scheme.

[0024] During the second section, transmission signals may be provided to the plurality of first traces and the plurality of second traces, and reception signals generated based on the transmission signals may be provided to the plurality of third traces. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0026] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0027] Figure 2 is a block diagram schematically illustrating an electronic device according to an embodiment of the present disclosure.

[0028] Figure 3A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0029] Figure 3B is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0030] Figure 4 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0031] Figure 5 is a top view of a display layer, a flexible substrate, and a sensor driver according to an embodiment of the present disclosure.

[0032] Figure 6 is a top view of a sensor layer according to an embodiment of the present disclosure.

[0033] Figure 7 is a conceptual diagram for illustrating the operation of the sensor driver according to an embodiment of the present disclosure.

[0034] Figure 8 is a diagram for illustrating the operation of a sensor layer according to an embodiment of the present disclosure.

[0035] Fig. 9 is a diagram for illustrating the operation of a sensor layer according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] As used herein, when a component (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another component, this means that the component may be directly disposed / directly connected / directly coupled to the other component, or a third component may be disposed between the component and the other component.

[0037] The same reference numerals represent the same components. In addition, in the drawings, in order to effectively describe the technical content, the thickness, proportion and size of the components are exaggerated. "And / or" includes all of one or more combinations that can be defined for the relevant components.

[0038] Various components may be described using terms such as first, second, etc., but these components should not be limited by the terms. The above terms are only used for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present disclosure, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0039] In addition, terms such as "under", "below", "on", and "over" are used to describe the relationship of components shown in the drawings. The above terms are relative concepts and are described with reference to the directions indicated in the drawings.

[0040] It should be understood that terms such as “include” and / or “have” are intended to illustrate the presence of the features, quantities, steps, operations, components, parts or combinations thereof described in the specification, but do not exclude the possibility of adding or existing one or more other features, quantities, steps, operations, components, parts or combinations thereof.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0043] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0044] Reference Figure 1 , the electronic device 1000 may be a device that is activated in response to an electrical signal. The electronic device 1000 may include various embodiments. For example, the electronic device 1000 may be used not only for large electronic devices such as televisions, monitors, or external billboards, but also for small and medium-sized electronic devices such as personal computers, laptop computers, personal digital terminals, vehicle navigation units, game consoles, portable electronic devices, and cameras. In addition, these are presented only as embodiments, and the electronic device 1000 may also be used for other electronic devices without departing from the concept of the present disclosure. In the present embodiment, as an example, the electronic device 1000 is shown as a smart phone.

[0045] The electronic device 1000 may include a display surface 1000-F parallel to each of a first direction DR1 and a second direction DR2 crossing the first direction DR1. The display surface 1000-F may include a transmissive region 1000-T and a bezel region 1000-B.

[0046] The image 1000-I may be displayed in the third direction DR3 in the transmissive region 1000-T. The third direction DR3 may be a thickness direction. The image 1000-I may include a still image and a dynamic image. Figure 1 , a clock and an icon are shown as examples of the image 1000 -I. The display surface 1000 -F on which the image 1000 -I is displayed may correspond to the front surface of the electronic device 1000.

[0047] In this embodiment, the front surface (or top surface) and the rear surface (or bottom surface) of each member can be defined based on the direction in which the image 1000-I is displayed. The front surface and the rear surface can be opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface can be parallel to the third direction DR3. As used herein, "when viewed on a plane" can mean "when viewed in the third direction DR3".

[0048] The image 1000 -I may not be displayed in the bezel area 1000 -B.

[0049] The electronic device 1000 according to one embodiment of the present disclosure may sense a user's input applied from the outside. For example, the electronic device 1000 may sense a user's body 2000 applied from the outside. The user's input may include various types of external inputs such as a user's body part, light, heat, or pressure. In addition, the electronic device 1000 may sense an input applied to a side surface or a rear surface of the electronic device 1000 according to the structure of the electronic device 1000, and may not be limited to any one embodiment.

[0050] Figure 2 is a block diagram schematically illustrating an electronic device according to an embodiment of the present disclosure.

[0051] Reference Figure 2 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , a display driver 100C, a sensor driver 200C, and a controller 1000C.

[0052] The display layer 100 may be a component that actually displays an image. The display layer 100 may be a light-emitting display layer, but may not be particularly limited thereto. For example, the display layer 100 may be an organic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The light-emitting layer of the organic light-emitting display layer may include an organic light-emitting material. The light-emitting layer of the quantum dot display layer may include quantum dots and quantum rods. The light-emitting layer of the micro-LED display layer may include micro-LEDs. The light-emitting layer of the nano-LED display layer may include nano-LEDs.

[0053] The sensor layer 200 may be provided on the display layer 100. The sensor layer 200 may sense an external input applied from the outside. The sensor layer 200 may sense an external input from a body 2000 of a user.

[0054] The controller 1000C may control the overall operation of the electronic device 1000. For example, the controller 1000C may control the operations of the display driver 100C and the sensor driver 200C. The controller 1000C may include at least one microprocessor, and the controller 1000C may be referred to as a host.

[0055] The display driver 100C may control the display layer 100. The controller 1000C may further include a graphics controller. The display driver 100C may receive image data RGB and a control signal D-CS from the controller 1000C. The control signal D-CS may include various signals. For example, the control signal D-CS may include an input vertical synchronization signal, an input horizontal synchronization signal, a master clock, a data enable signal, and the like.

[0056] The display driver 100C may generate a vertical synchronization signal and a horizontal synchronization signal for controlling a timing of providing a signal to the display layer 100 based on the control signal D-CS.

[0057] The sensor driver 200C may control the sensor layer 200. The sensor driver 200C may receive a control signal I-CS from the controller 1000C. The control signal I-CS may include a clock signal.

[0058] The sensor driver 200C may calculate the coordinate information of the external input based on the signal received from the sensor layer 200, and provide the coordinate signal I-SS including the coordinate information to the controller 1000C. The controller 1000C may perform an operation corresponding to the user's input based on the coordinate signal I-SS. For example, the controller 1000C may operate the display driver 100C so that a new application image is displayed on the display layer 100 based on the coordinate signal I-SS.

[0059] Figure 3A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0060] Reference Figure 3A , the electronic device 1000 may include a display layer 100 and a sensor layer 200. The display layer 100 may include a base layer 110, a circuit layer 120, a light emitting element layer 130, and an encapsulation layer 140.

[0061] The base layer 110 may be a member providing a surface on which the circuit layer 120 is disposed. The base layer 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, the embodiment may not be limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0062] The base layer 110 may have a multi-layer structure. For example, the base layer 110 may include a first synthetic resin layer, a silicon oxide (SiOx ) layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as a substrate barrier layer.

[0063] Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin. In addition, each of the first synthetic resin layer and the second synthetic resin layer may include at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl (vLCyl)-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In one example, here, the "~~"-based resin may mean a resin including a "~~" functional group.

[0064] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 via coating, deposition, etc., and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned via a plurality of photolithography processes. Then, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 may be formed.

[0065] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0066] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles.

[0067] The sensor layer 200 may be formed on the display layer 100 via a continuous process. In this case, the sensor layer 200 may be directly disposed on the display layer 100. Directly disposed may mean that no third component is disposed between the sensor layer 200 and the display layer 100. That is, no separate bonding member may be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 may be bonded to the display layer 100 via a bonding member. The bonding member may include an existing adhesive or an adhesive.

[0068] Figure 3B is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0069] Reference Figure 3B, the electronic device 1000-1 may include a display layer 100-1 and a sensor layer 200-1. The display layer 100-1 may include a base layer 110-1, a circuit layer 120-1, a light emitting element layer 130-1, a package substrate 140-1, and a bonding member 150-1.

[0070] Each of the base layer 110 - 1 and the encapsulation substrate 140 - 1 may be a glass substrate, a metal substrate, a polymer substrate, etc., but may not be particularly limited thereto.

[0071] The bonding member 150-1 may be disposed between the base layer 110-1 and the encapsulation substrate 140-1. The bonding member 150-1 may bond the encapsulation substrate 140-1 to the base layer 110-1 or the circuit layer 120-1. The bonding member 150-1 may include an inorganic material or an organic material. For example, the inorganic material may include a glass frit seal, and the organic material may include a photocurable resin or a photoplastic resin. However, the material constituting the bonding member 150-1 is not limited to the above examples.

[0072] The sensor layer 200-1 may be directly disposed on the package substrate 140-1. Directly disposed may mean that no third component is disposed between the sensor layer 200-1 and the package substrate 140-1. That is, no separate adhesive member may be disposed between the sensor layer 200-1 and the package substrate 140-1. However, the present disclosure may not be limited thereto, and an adhesive layer may be further disposed between the sensor layer 200-1 and the package substrate 140-1.

[0073] Figure 4 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. Figure 4 The same reference numerals are used for Figure 3A Components described in and their description is omitted.

[0074] Reference Figure 4 , at least one inorganic layer may be formed on the top surface of the base layer 110. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed as a multilayer. A plurality of inorganic layers may constitute a barrier layer and / or a buffer layer. In the present embodiment, the display layer 100 includes a buffer layer BFL.

[0075] The buffer layer BFL may improve the bonding strength between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and the silicon nitride layer may be alternately stacked.

[0076] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, not limited thereto, the semiconductor pattern may include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0077] Figure 4 Only a portion of the semiconductor pattern is shown, and the semiconductor pattern may also be arranged in another area. The semiconductor pattern may be arranged throughout the pixels in a specific order. The electrical characteristics of the semiconductor pattern may vary according to the doping concentration. The semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be an undoped region, or may be doped with a concentration less than that of the first region.

[0078] The conductivity of the first region may be greater than that of the second region, and the first region may be substantially used as an electrode or a signal line. The second region may substantially correspond to an active region (or a channel region) of a transistor. In other words, a portion of the semiconductor pattern may be an active region of a transistor, another portion thereof may be a source or a drain of the transistor, and another portion thereof may be a connecting electrode or a connecting signal line.

[0079] Each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and a light emitting element, and the equivalent circuit of the pixel may be modified into various forms. Figure 4 One transistor 100PC and a light emitting element 100PE included in a pixel are shown as an example.

[0080] The transistor 100PC may include a source SC1, an active area A1, a drain D1, and a gate G1. The source SC1, the active area A1, and the drain D1 may be formed of a semiconductor pattern. The source SC1 and the drain D1 may extend in opposite directions from the active area A1 in a cross section. Figure 4 A portion of a connection signal line SCL formed of a semiconductor pattern is shown Although not separately shown, the connection signal line SCL may be electrically connected to the drain D1 of the transistor 100PC in a plan view.

[0081] The first insulating layer 10 may be disposed on the semiconductor pattern on the buffer layer BFL. The first insulating layer 10 may be overlapped with a plurality of pixels in common and may cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. The first insulating layer 10 and the insulating layer of the circuit layer 120 to be described later may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above materials, but the present disclosure may not be limited thereto.

[0082] The gate G1 is disposed on the first insulating layer 10. The gate G1 may be a part of a conductive layer (eg, a metal pattern). The gate G1 may overlap the active area A1. The gate G1 may be used as a self-aligned mask in a process of doping the semiconductor pattern.

[0083] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate G1. The second insulating layer 20 may be overlapped with the pixel in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single layer or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0084] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single layer or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0085] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT-1 formed through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0086] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0087] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT-2 formed through the fourth insulating layer 40 and the fifth insulating layer 50.

[0088] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0089] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element 100PE. For example, the light emitting element layer 130 may include an organic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0090] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE. The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a contact hole CNT-3 formed through the sixth insulating layer 60.

[0091] The pixel defining film 70 may be disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0092] Transmission area 1000-T (see Figure 1 ) may include a light emitting region PXA and a non-light emitting region NPXA disposed adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In the present embodiment, the light emitting region PXA is defined to correspond to a partial region of the first electrode AE ​​exposed by the opening 70-OP.

[0093] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed in a region corresponding to the opening 70-OP. That is, the light-emitting layer EL may be formed separately in each pixel. When the light-emitting layer EL is formed separately in each pixel, each light-emitting layer EL may emit light of at least one color among blue, red, and green. However, the present disclosure may not be limited thereto, and the light-emitting layer EL may be connected to the pixel and disposed in common for the pixel. In this case, the light-emitting layer EL may provide blue light or white light.

[0094] The second electrode CE may be disposed on the light emitting layer EL. The second electrode CE may have an integral shape and may be commonly disposed in a plurality of pixels.

[0095] Although not shown, a hole control layer may be provided between the first electrode AE ​​and the light emitting layer EL. The hole control layer may be provided in common in the light emitting region PXA and the non-light emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be provided between the light emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be formed in common in a plurality of pixels using an opening mask.

[0096] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked, but the layers constituting the encapsulation layer 140 may not be limited thereto.

[0097] The inorganic layer can protect the light emitting element layer 130 from moisture and oxygen, and the organic layer can protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc. The organic layer may include an acrylic organic layer, but may not be limited thereto.

[0098] The sensor layer 200 may be formed on the display layer 100 via a continuous process. In this case, the sensor layer 200 may be directly disposed on the display layer 100. Directly disposed may mean that no third component is disposed between the sensor layer 200 and the display layer 100. That is, no separate bonding member may be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 may be bonded to the display layer 100 via a bonding member. The bonding member may include an existing adhesive or an adhesive.

[0099] The sensor layer 200 may include a base insulating layer 201 , a first conductive layer 202 , a sensing insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0100] The base insulating layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base insulating layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide resin. The base insulating layer 201 may have a single-layer structure or a structure having multiple layers stacked along the third direction DR3.

[0101] Each of the first conductive layer 202 and the second conductive layer 204 may have a single layer structure or a structure having a plurality of layers stacked along the third direction DR3 .

[0102] The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, a metal nanowire, graphene, etc.

[0103] The conductive layer having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of, for example, titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0104] At least one of the sensing insulating layer 203 and the capping insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0105] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0106] Figure 5 is a top view of a display layer, a flexible substrate, and a sensor driver according to an embodiment of the present disclosure.

[0107] Reference Figure 5 , electronic device 1000 (see Figure 1 ) may include a display layer 100, a power pattern VDD, a data driver DIC, a flexible circuit board CF, a sensor driver 200C, a display signal line DSL, a first-second line TL1-2, a second-second line TL2-2, a third-second line TL3-2, and a connector CNT.

[0108] In the display layer 100, a display area DP-DA and a non-display area DP-NDA disposed adjacent to the display area DP-DA may be defined. The display area DP-DA may be an area where an image is displayed. A plurality of pixels PX may be disposed in the display area DP-DA. The non-display area DP-NDA may be an area where a driving circuit, a driving wiring, etc. are disposed.

[0109] The display layer 100 may include a base layer 110 , a plurality of pixels PX, a plurality of signal wirings GL, DL, PL, and EEL, a plurality of display pads (also referred to as bonding pads or pads) P1 and P2 , and a plurality of sensing pads PDT.

[0110] Each of the plurality of pixels PX may display one of the primary colors or one of the mixed colors. The primary colors may include red, green, or blue. The mixed colors may include various colors such as white, yellow, cyan, or magenta. However, the color displayed by each pixel PX is not limited thereto.

[0111] A plurality of signal wirings GL, DL, PL, and EEL may be disposed on the base layer 110. The plurality of signal wirings GL, DL, PL, and EEL may be connected to a plurality of pixels PX and transmit electrical signals to the plurality of pixels PX. The plurality of signal wirings GL, DL, PL, and EEL may include a plurality of scan wirings GL, a plurality of data wirings DL, a plurality of power lines PL, and a plurality of light emission control wirings EEL. However, this is an example, and the configuration of the plurality of signal wirings GL, DL, PL, and EEL according to an embodiment of the present disclosure is not limited thereto. For example, the plurality of signal wirings GL, DL, PL, and EEL according to an embodiment of the present disclosure may further include an initialization voltage wiring.

[0112] The power pattern VDD may be disposed in the non-display area DP-NDA. The power pattern VDD may be connected to a plurality of power lines PL. Each of the plurality of pixels PX may receive a power supply voltage ELVDD provided by the power line PL.

[0113] A plurality of display pads P1 and P2 may be disposed in the non-display area DP-NDA. The plurality of display pads P1 and P2 may include a first pad P1 and a second pad P2. The first pad P1 may include a plurality of first pads. The plurality of first pads P1 may be connected to a plurality of data wirings DL, respectively. The second pad P2 may be connected to a power pattern VDD and electrically connected to a plurality of power lines PL. The display layer 100 may provide an externally provided electrical signal to a plurality of pixels PX via the plurality of display pads P1 and P2. In one example, in addition to the first pad P1 and the second pad P2, the plurality of display pads P1 and P2 may further include a pad for receiving other electrical signals, and the present disclosure may not be limited to any one embodiment.

[0114] The data driver DIC may be installed in the non-display area DP-NDA on the display layer 100. The data driver DIC may be a chip-type timing control circuit. The data driver DIC may respond to the image data RGB (see Figure 2 ) outputs grayscale voltages to the plurality of data wirings DL according to frame data of the display layer 100. The data driver DIC may drive the display layer 100. The plurality of data wirings DL may be electrically connected to the plurality of first pads P1, respectively, via the data driver DIC. However, this is an example, and the data driver DIC according to one embodiment of the present disclosure may be mounted on a film separated from the display layer 100. The data driver DIC may be electrically connected to the plurality of display pads P1 and P2 via the film.

[0115] A plurality of sensing pads PDT may be disposed in the non-display area DP-NDA. The plurality of sensing pads PDT may be electrically connected to a plurality of sensing electrodes SP of the sensor layer 200, respectively (see FIG. Figure 6 ). The plurality of sensing pads PDT may include a plurality of first sensing pads TD1 and a plurality of second sensing pads TD2.

[0116] The flexible circuit board CF may be electrically connected to the plurality of display pads P1 and P2 and the plurality of sensing pads PDT. In other words, the flexible circuit board CF may be electrically connected to the display layer 100 and the sensor layer 200.

[0117] The sensor driver 200C may be disposed on the flexible circuit board CF. The sensor driver 200C may drive the sensor layer 200 (see Figure 6 ). The sensor driver 200C may be electrically connected to the plurality of sensing pads PDT.

[0118] Connector CNT can connect the controller 1000C (see Figure 2 ) is electrically connected to the display layer 100. The connector CNT may be disposed on the flexible circuit board CF.

[0119] The display signal line DSL may be provided between the display layer 100 and the controller 1000C (see Figure 2) and electrically connected to the display layer 100 and the controller 1000C. For example, the display signal line DSL may be disposed between and connected to the plurality of display pads P1 and P2 and the connector CNT. In other words, the display signal line DSL may be electrically connected to the data driver DIC. The display signal line DSL may transmit and receive signals for controlling the display layer 100. The display signal line DSL may be disposed on the flexible circuit board CF. The display signal line DSL may be a mobile industry processor interface (MIPI) wiring.

[0120] Figure 6 is a top view of a sensor layer according to an embodiment of the present disclosure.

[0121] Reference Figure 5 and Figure 6 , the sensor layer 200 may have an active area AR and a peripheral area NAR disposed adjacent to the active area AR. The active area AR may be an area activated in response to an electrical signal. The active area AR may be an area for sensing input. The active area AR may overlap with the display area DP-DA of the display layer 100. The peripheral area NAR may overlap with the non-display area DP-NDA of the display layer 100.

[0122] The sensor layer 200 may include a base insulating layer 201, a plurality of sensing electrodes SP, a plurality of first-first lines TL1-1, a plurality of second-first lines TL2-1, and a plurality of third-first lines TL3-1. The plurality of sensing electrodes SP may be disposed in the active region AR, and the plurality of first-first lines TL1-1, a plurality of second-first lines TL2-1, and a plurality of third-first lines TL3-1 may be disposed in the peripheral region NAR.

[0123] The base insulating layer 201 may be directly formed on the display layer 100. Alternatively, the base insulating layer 201 may be bonded to the display layer 100 via an adhesive member.

[0124] The plurality of sensing electrodes SP may include a plurality of first sensing electrodes TE1 and a plurality of second sensing electrodes TE2. The plurality of second sensing electrodes TE2 may cross the plurality of first sensing electrodes TE1 with an insulating layer disposed therebetween.

[0125] Each of the plurality of first sensing electrodes TE1 may extend along the second direction DR2, and the plurality of first sensing electrodes TE1 may be arranged along the first direction DR1. Each of the plurality of first sensing electrodes TE1 may include a plurality of first sensing patterns SP1 and a plurality of first connection patterns BSP1. Each of the plurality of first connection patterns BSP1 may electrically connect the first sensing patterns SP1 disposed adjacent to each other in the second direction DR2. The plurality of first sensing patterns SP1 and the plurality of first connection patterns BSP1 may have a mesh structure. The plurality of first sensing patterns SP1 may be referred to as a plurality of first sensing portions SP1. The plurality of first connection patterns BSP1 may be referred to as a plurality of first connection portions BSP1. The plurality of first sensing electrodes TE1 may be referred to as a plurality of sensing electrodes.

[0126] Each of the plurality of first sensing electrodes TE1 may have one end ED1 defined therein and another end ED2 spaced apart from the one end ED1 in the second direction DR2 .

[0127] At least some of the plurality of first sensing electrodes TE1 may be connected to the plurality of first traces TL1, respectively. For example, at least some of the plurality of first sensing electrodes TE1 may be the plurality of first sensing electrodes TE1 arranged in odd rows. The plurality of first traces TL1 may contact one end ED1 of at least some of the plurality of first sensing electrodes TE1, respectively.

[0128] The remaining first sensing electrodes among the plurality of first sensing electrodes TE1 may be connected to the plurality of second traces TL2, respectively. For example, the remaining first sensing electrodes among the plurality of first sensing electrodes TE1 may be the plurality of first sensing electrodes TE1 arranged in even-numbered rows. The plurality of second traces TL2 may be in contact with the other ends ED2 of the remaining first sensing electrodes among the plurality of first sensing electrodes TE1, respectively. At least some of the plurality of first sensing electrodes TE1 and the remaining first sensing electrodes among the plurality of first sensing electrodes TE1 may be arranged alternately.

[0129] Each of the plurality of second sensing electrodes TE2 may extend along the first direction DR1, and the plurality of second sensing electrodes TE2 may be arranged along the second direction DR2. Each of the plurality of second sensing electrodes TE2 may include a plurality of second sensing patterns SP2 and a plurality of second connection patterns BSP2. Each of the plurality of second connection patterns BSP2 may electrically connect the second sensing patterns SP2 disposed adjacent to each other in the first direction DR1. The plurality of second sensing patterns SP2 and the plurality of second connection patterns BSP2 may have a mesh structure. The plurality of second sensing patterns SP2 may be referred to as a plurality of second sensing portions SP2. The plurality of second connection patterns BSP2 may be referred to as a plurality of second connection portions BSP2.

[0130] The plurality of first connection patterns BSP1 may be arranged in different layers from the plurality of second connection patterns BSP2. The plurality of second connection patterns BSP2 may cross the plurality of first sensing electrodes TE1, with an insulating layer disposed therebetween. For example, the plurality of first connection patterns BSP1 may cross the plurality of second connection patterns BSP2, respectively, with an insulating layer disposed therebetween. For example, the plurality of first sensing patterns SP1, the plurality of first connection patterns BSP1, and the plurality of second sensing patterns SP2 may be formed by the second conductive layer 204 (see Figure 4 ), a plurality of second connection patterns BSP2 may be formed by the first conductive layer 202 (see Figure 4 )form.

[0131] The plurality of second sensing electrodes TE2 may be respectively connected to the plurality of third traces TL3 .

[0132] exist Figure 6 2 shows that the plurality of sensing electrodes SP have a square shape as an example, but the present disclosure is not limited thereto. For example, the plurality of sensing electrodes SP may have a polygonal shape.

[0133] The plurality of sensing electrodes SP may include a conductive material. For example, the conductive material may include a metal or an alloy thereof. The metal may include gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), etc. However, this is an example, and the plurality of sensing electrodes SP may be made of a transparent conductive material. The transparent conductive material may be silver nanowire (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO 2 ), carbon nanotubes, graphene, etc. The plurality of sensing electrodes SP may be composed of a single layer or multiple layers.

[0134] The plurality of first traces TL1 may include a plurality of first-first lines TL1 - 1 and a plurality of first-second lines TL1 - 2 .

[0135] The plurality of first-first lines TL1-1 may be electrically connected to one ends ED1 of the plurality of first sensing electrodes TE1 arranged in odd rows, respectively. The one end ED1 may refer to a portion of each of the plurality of first sensing electrodes TE1 arranged adjacent to the left side of the peripheral area NAR defined in the sensor layer 200. That is, the plurality of first-first lines TL1-1 may be electrically connected to one ends ED1 of at least some of the plurality of first sensing electrodes TE1, respectively, and the plurality of first-first lines TL1-1 may be arranged on one side of the peripheral area NAR. For example, the plurality of first-first lines TL1-1 may be arranged on the left side of the peripheral area NAR.

[0136] The plurality of first-first lines TL1-1 may be electrically connected to the plurality of first sensing pads TD1 via contact holes, respectively. That is, the plurality of first-first lines TL1-1 may be disposed between and electrically connected to the plurality of sensing electrodes SP and the plurality of first sensing pads TD1.

[0137] The plurality of first-second lines TL1-2 may extend from the plurality of first-first lines TL1-1. The plurality of first-second lines TL1-2 may be disposed between the sensor layer 200 and the sensor driver 200C, and electrically connected to the sensor layer 200 and the sensor driver 200C. For example, the plurality of first-second lines TL1-2 may be disposed between the plurality of first sensing pads TD1 and the sensor driver 200C, and connected to the plurality of first sensing pads TD1 and the sensor driver 200C. In other words, the sensor driver 200C may be electrically connected to the plurality of first traces TL1. The plurality of first-second lines TL1-2 may be disposed on the flexible circuit board CF.

[0138] The plurality of first traces TL1 can transmit and receive the driving signal XS (see Figure 8 ), or can transmit (send) a transmission signal TXM (see Fig. 9 ). When viewed on a plane, the plurality of first trace lines TL1 may not overlap the display signal line DSL. That is, when viewed on a plane, the plurality of first trace lines TL1 may be arranged to be spaced apart from the display signal line DSL.

[0139] The plurality of second traces TL2 may include a plurality of second-first lines TL2 - 1 and a plurality of second-second lines TL2 - 2 .

[0140] The plurality of second-first lines TL2-1 may be electrically connected to the other ends ED2 of the plurality of first sensing electrodes TE1 arranged in even-numbered rows, respectively. The other end ED2 may refer to a portion of each of the plurality of first sensing electrodes TE1 that is arranged adjacent to the right side of the peripheral area NAR defined in the sensor layer 200. That is, the plurality of second-first lines TL2-1 may be electrically connected to the other ends ED2 of the remaining first sensing electrodes among the plurality of first sensing electrodes TE1, respectively, and the plurality of second-first lines TL2-1 may be disposed on the other side that is spaced apart in the second direction DR2 from the side of the peripheral area NAR where the plurality of first-first lines TL1-1 are arranged. For example, the plurality of second-first lines TL2-1 may be disposed on the right side of the peripheral area NAR.

[0141] The plurality of second-first lines TL2-1 may be electrically connected to the plurality of first sensing pads TD1 via contact holes, respectively. That is, the plurality of second-first lines TL2-1 may be disposed between the plurality of sensing electrodes SP and the plurality of first sensing pads TD1 and electrically connected to the plurality of sensing electrodes SP and the plurality of first sensing pads TD1.

[0142] A plurality of second-second lines TL2-2 may extend from a plurality of second-first lines TL2-1. A plurality of second-second lines TL2-2 may be disposed between the sensor layer 200 and the sensor driver 200C, and electrically connected to the sensor layer 200 and the sensor driver 200C. For example, a plurality of second-second lines TL2-2 may be disposed between a plurality of first sensing pads TD1 and the sensor driver 200C, and connected to the plurality of first sensing pads TD1 and the sensor driver 200C. In other words, the sensor driver 200C may be electrically connected to a plurality of second traces TL2. A plurality of second-second lines TL2-2 may be disposed on the flexible circuit board CF.

[0143] The plurality of second traces TL2 can transmit (send) a transmission signal TXM (see Fig. 9 ). When viewed on a plane, the plurality of second traces TL2 may overlap the display signal line DSL. An interference capacitor may be formed between the plurality of second traces TL2 and the display signal line DSL.

[0144] Unlike the present disclosure, when the plurality of second traces TL2 are not provided and the plurality of first traces TL1 are respectively connected to all of the plurality of first sensing electrodes TE1, all of the plurality of first traces TL1 may be provided on the left side of the display area DP-DA in the peripheral area NAR, so that the peripheral area NAR on the left side of the display area DP-DA may be increased. However, according to the present disclosure, some of the plurality of first sensing electrodes TE1 may be connected to the plurality of second traces TL2 provided on the right side of the display area DP-DA in the peripheral area NAR and connected to the sensing pad PDT. The plurality of first traces TL1, the plurality of second traces TL2, and the plurality of third traces TL3 may be arranged in a dispersed manner in the peripheral area NAR. An electronic device 1000 having a reduced peripheral area NAR may be provided (see Figure 1 ).

[0145] The plurality of third traces TL3 may include a plurality of third-first lines TL3 - 1 and a plurality of third-second lines TL3 - 2 .

[0146] The plurality of third-first lines TL3-1 may be electrically connected to the plurality of second sensing electrodes TE2, respectively. The plurality of third-first lines TL3-1 may be electrically connected to the second sensing pads TD2, respectively, via contact holes. That is, the plurality of third-first lines TL3-1 may be disposed between the plurality of sensing electrodes SP and the plurality of second sensing pads TD2, and electrically connected to the plurality of sensing electrodes SP and the plurality of second sensing pads TD2. The plurality of third-first lines TL3-1 may be disposed adjacent to the plurality of first-first lines TL1-1. For example, when viewed on a plane, the contact holes of the plurality of third-first lines TL3-1 may be defined between the data driver DIC and the plurality of first-first lines TL1-1.

[0147] The plurality of third-second lines TL3-2 may extend from the plurality of third-first lines TL3-1. The plurality of third-second lines TL3-2 may be disposed between the sensor layer 200 and the sensor driver 200C, and electrically connected to the sensor layer 200 and the sensor driver 200C. For example, the plurality of third-second lines TL3-2 may be disposed between the plurality of second sensing pads TD2 and the sensor driver 200C, and connected to the plurality of second sensing pads TD2 and the sensor driver 200C. In other words, the sensor driver 200C may be electrically connected to the plurality of third traces TL3.

[0148] A plurality of third-second lines TL3-2 may be disposed on the flexible circuit board CF. The plurality of third-second lines TL3-2 may be arranged adjacent to the plurality of first-second lines TL1-2. For example, on the flexible circuit board CF, the plurality of third-second lines TL3-2 may be placed on the right side of the plurality of first-second lines TL1-2.

[0149] The third plurality of traces TL3 can transmit and receive drive signals XS (see Figure 8 ) or can transmit (send) a transmission signal TXM (see Fig. 9 ). When viewed on a plane, the plurality of third traces TL3 may not overlap the display signal line DSL. That is, when viewed on a plane, the plurality of third traces TL3 may be arranged to be spaced apart from the display signal line DSL.

[0150] Unlike the present disclosure, the plurality of third traces may be arranged to be divided into two groups with the data driver DIC interposed therebetween. In this case, when connected to the sensor driver 200C, the third trace arranged on the right side of the data driver DIC overlaps with the display signal line DSL. As a result, since an interference capacitor is formed between the plurality of third traces and the display signal line DSL, the signal of the display signal line DSL may be transmitted as noise to the signal transmitted via the plurality of third traces. However, according to the present disclosure, all of the plurality of third traces TL3 may be arranged to be adjacent to the plurality of first traces TL1. When viewed on a plane, the size of the area where the plurality of first traces TL1, the plurality of second traces TL2, and the plurality of third traces TL3 overlap with the display signal line DSL may be reduced. The signals transmitted via the plurality of first traces TL1, the plurality of second traces TL2, and the plurality of third traces TL3 may be less affected by the interference capacitor. Therefore, an electronic device 1000 with improved sensing reliability may be provided (see Figure 1 ).

[0151] Unlike the present disclosure, when the driving signal XS is transmitted and received via the plurality of second traces TL2 in the sensor layer 200 operating in the self-touch scheme (see Figure 8 ), the signal of the display signal line DSL may be transmitted to the plurality of second traces TL2 as a noise signal due to the interference capacitor. However, according to the present disclosure, in the sensor layer 200 operating in the self-touch scheme, the driving signal XS (see Figure 8 ) can be transmitted and received only via the plurality of first traces TL1 and the plurality of third traces TL3 that do not overlap with the display signal line DSL. Therefore, the occurrence of noise signals can be prevented. Therefore, the electronic device 1000 with improved sensing reliability can be provided (see Figure 1 ).

[0152] Figure 7 is a conceptual diagram for illustrating the operation of the sensor driver according to an embodiment of the present disclosure. Figure 8 and Fig. 9 is a diagram for illustrating the operation of a sensor layer according to an embodiment of the present disclosure.

[0153] Reference Figures 6 to 9 , the sensor layer 200 may operate in units of a sensing frame SFR. The sensing frame SFR may include a first section SS1 and a second section SS2. The second section SS2 may be performed after the first section SS1.

[0154] The first section SS1 may be a section operated in a self-touch scheme. During the first section SS1, the sensor driver 200C may output a driving signal XS. The driving signal XS may include a plurality of first-first sensing signals TXS1 and TXS3 to TXSx and a plurality of first-second sensing signals RXS1 and RXS2 to RXSz.

[0155] The sensor driver 200C may output a plurality of first-first sensing signals TXS1 and TXS3 to TXSx to the plurality of first sensing electrodes TE1 arranged in odd rows, respectively. That is, the plurality of first-first sensing signals TXS1 and TXS3 to TXSx may be provided to the plurality of first traces TL1 during the first section SS1.

[0156] The sensor driver 200C may output a plurality of first-second sensing signals RXS1 and RXS2 to RXSz to the plurality of second sensing electrodes TE2 , respectively. That is, the plurality of first-second sensing signals RXS1 and RXS2 to RXSz may be provided to the plurality of third traces TL3 during the first section SS1 .

[0157] The sensor driver 200C may not output the driving signal XS to the plurality of second trace lines TL2 disposed in even-numbered rows.

[0158] When the plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2 are integrated into one electrode, the sensor layer 200 may sense the body 2000 (see FIG. 2 ) of the user. Figure 2 ) by touch. In this regard, the sensor layer 200 may be defined as operating in a self-touch scheme. During the first segment SS1, some of the first sensing electrodes TE1 and the second sensing electrodes TE2 may operate in a self-touch scheme. The sensor layer 200 may detect input based on a change in capacitance of each of the plurality of first sensing electrodes TE1 and a change in capacitance of each of the plurality of second sensing electrodes TE2.

[0159] According to the present disclosure, when the sensor layer 200 operates in a self-touch scheme, the driving signal XS may be provided only to the plurality of first traces TL1 and the plurality of third traces TL3. Since the plurality of first traces TL1 and the plurality of third traces TL3 are not connected to the display signal line DSL (see Figure 5 ) are stacked, so the noise signal can be reduced or eliminated. Figure 5 ) and the interference capacitors between the plurality of second traces TL2, the driving signal XS is not provided to the plurality of second traces TL2 that may generate noise. Therefore, an electronic device 1000 with improved sensing reliability can be provided (see Figure 1 ).

[0160] The second section SS2 may be a section operated in a mutual touch scheme. During the second section SS2, the sensor driver 200C may transmit (send) a transmission signal TXM and receive a reception signal RXM generated based on the transmission signal TXM. The transmission signal TXM may include a plurality of second-first sensing signals TXM1 and TXM3 to TXMx and a plurality of second-second sensing signals TXM2 and TXM4 to TXMy. The reception signal RXM may include a plurality of second-third sensing signals RXM1 and RXM2 to RXMz.

[0161] The sensor driver 200C may transmit a plurality of second-first sensing signals TXM1 and TXM3 to TXMx to the plurality of first sensing electrodes TE1 arranged in odd rows, respectively, and transmit a plurality of second-second sensing signals TXM2 and TXM4 to TXMy to the plurality of first sensing electrodes TE1 arranged in even rows, respectively. During the second segment SS2, the transmission signal TXM may be provided to the plurality of first traces TL1 and the plurality of second traces TL2.

[0162] The plurality of second-third sensing signals RXM1 and RXM2 to RXMz may be generated based on the plurality of second-first sensing signals TXM1 and TXM3 to TXMx and the plurality of second-second sensing signals TXM2 and TXM4 to TXMy.

[0163] The sensor driver 200C may receive a plurality of second-third sensing signals RXM1 and RXM2 to RXMz from the plurality of second sensing electrodes TE2 , respectively. During the second section SS2 , the reception signal RXM generated based on the transmission signal TXM may be provided to the plurality of third traces TL3 .

[0164] The sensor driver 200C can send a signal to the controller 1000C (see Figure 2 ) outputs a coordinate signal I-SS derived based on a plurality of second-third sensing signals RXM1 and RXM2 to RXMz (see Figure 2 ).

[0165] When the plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2 are capacitively coupled to each other, the sensor layer 200 may sense the body 2000 (see FIG. 2 ) of the user. Figure 2 ). In this regard, the sensor layer 200 may be defined as operating in a mutual touch scheme. During the second section SS2, the plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2 may be driven in a mutual touch scheme.

[0166] Unlike the present disclosure, when the sensor driver 200C is connected to the display signal line DSL (see Figure 5) When the plurality of second traces TL2 overlapped receive the reception signal RXM, they are provided to the display signal line DSL (see Figure 5 ) will pass through the display signal line DSL (see Figure 5 ) and the plurality of second traces TL2 and is sensed as a noise signal to the reception signal RXM. However, according to the present disclosure, when the sensor layer 200 operates in the mutual touch scheme, the transmission signal TXM may be transmitted via the plurality of first traces TL1 and the plurality of second traces TL2. The sensor driver 200C may be connected via the display signal line DSL (see FIG. 1 ) which is not connected to the display signal line DSL in a plan view. Figure 5 ) The plurality of third traces TL3 overlapped receive the reception signal RXM. Even when the display signal line DSL (see Figure 5 ) signal is formed on the display signal line DSL (see Figure 5 ) and the interference capacitor between the plurality of second traces TL2 and transmitted to the transmission signal TXM as a noise signal, because the third trace TL3 does not overlap with the display signal line DSL, the influence of the noise signal on the reception signal RXM can be reduced or eliminated. Therefore, the sensor driver 200C can send a signal to the controller 1000C (see Figure 2 ) outputs a coordinate signal I-SS derived from the received signal RXM excluding the noise signal (see Figure 2 ). Therefore, it is possible to provide an electronic device 1000 having improved sensing reliability (see Figure 1 ).

[0167] In the above, although it has been described with reference to an embodiment of the present disclosure, it will be understood by those skilled in the art or ordinary technicians in the art that the present disclosure can be modified and changed in various ways within the scope without departing from the spirit and technical scope of the present disclosure described in the claims. Therefore, the technical scope of the present disclosure should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

[0168] As described above, when the sensor layer operates in a self-touch scheme, a driving signal may be provided only to the plurality of first traces and the plurality of third traces. Because the plurality of first traces and the plurality of third traces do not overlap with the display signal lines, noise signals may be reduced or eliminated. The driving signal may not be provided to the plurality of second traces that may generate noise due to interference capacitors formed between the display signal lines and the plurality of second traces. Therefore, an electronic device with improved sensing reliability may be provided.

[0169] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to one of ordinary skill in the art that various changes and modifications may be made thereto without departing from the spirit and scope of the present disclosure as set forth in the claims.

Claims

1. An electronic device, comprising: Display layer; as well as a sensor layer disposed on the display layer and comprising an active area and a peripheral area disposed adjacent to the active area, Wherein, the sensor layer comprises: a plurality of first sensing electrodes extending along a first direction, each of the plurality of first sensing electrodes including one end and another end spaced apart from each other in the first direction; a plurality of second sensing electrodes extending along a second direction intersecting with the first direction; a plurality of first traces, respectively electrically connected to the one ends of at least some of the plurality of first sensing electrodes; a plurality of second traces electrically connected to the other ends of the remaining first sensing electrodes of the plurality of first sensing electrodes, respectively; and a plurality of third traces, electrically connected to the plurality of second sensing electrodes respectively, wherein during a first section of a sensing frame, the plurality of first sensing electrodes and the plurality of second sensing electrodes operate in a self-touch scheme, and During the first section of the sensing frame, driving signals are only provided to the plurality of first traces and the plurality of third traces.

2. The electronic device according to claim 1, further comprising: a data driver configured to drive the display layer; a sensor driver configured to drive the sensor layer; as well as a display signal line electrically connected to the data driver and transmitting a signal for controlling the display layer, wherein the sensor driver is electrically connected to the plurality of second traces, and Wherein, the plurality of second traces overlap with the display signal lines in a plan view.

3. The electronic device according to claim 2, wherein: The sensor driver is electrically connected to the plurality of first traces, and Wherein, the plurality of first traces do not overlap with the display signal lines in a plan view.

4. The electronic device according to claim 2, wherein: The sensor driver is electrically connected to the plurality of third traces, and Wherein, the plurality of third traces do not overlap with the display signal lines in a plan view.

5. The electronic device according to claim 2, further comprising: a flexible circuit board electrically connected to the display layer and the sensor layer, Wherein, the display signal line and the sensor driver are arranged on the flexible circuit board.

6. The electronic device according to claim 5, wherein: The plurality of first traces include: first-first lines respectively connected to the one ends of the at least some of the plurality of first sensing electrodes; and first-second lines respectively extending from the first-first lines and connected to the sensor driver, wherein the first-first line is arranged in the peripheral area, and Wherein, the first-second lines are arranged on the flexible printed circuit board.

7. The electronic device according to claim 1, wherein: During a second section of the sensing frame following the first section of the sensing frame, the plurality of first sensing electrodes and the plurality of second sensing electrodes are driven in a mutual touch scheme.

8. The electronic device according to claim 7, wherein: During the second section, a transmission signal is provided to the plurality of first traces and the plurality of second traces, and Wherein, receiving signals generated based on the transmission signals are provided to the plurality of third traces.

9. The electronic device according to claim 1, wherein: The at least some of the plurality of first sensing electrodes and the remaining first sensing electrodes of the plurality of first sensing electrodes are alternately arranged along the second direction.

10. The electronic device according to claim 1, wherein: A portion of each of the plurality of first traces is disposed at one side of the peripheral area.

11. The electronic device according to claim 10, wherein: A portion of each of the plurality of second traces is disposed at another side of the peripheral region, the another side of the peripheral region being spaced apart from the one side of the peripheral region in the first direction.

12. The electronic device according to claim 10, wherein: A portion of each of the plurality of third traces is disposed adjacent to the portion of each of the plurality of first traces.

13. An electronic device, comprising: Display layer; a data driver configured to drive the display layer; A sensor layer, disposed on the display layer; a sensor driver configured to drive the sensor layer; as well as display signal lines, electrically connected to the data driver, Wherein, the sensor layer comprises: a plurality of first sensing electrodes extending along a first direction, each of the plurality of first sensing electrodes including one end and another end spaced apart from each other in the first direction; a plurality of first traces electrically connected to the one ends of at least some of the plurality of first sensing electrodes, respectively; and a plurality of second traces, electrically connected to the other ends of the remaining first sensing electrodes of the plurality of first sensing electrodes, respectively; wherein the plurality of first traces and the plurality of second traces are connected to the sensor driver, wherein the plurality of second traces overlap with the display signal lines in a plan view, wherein the plurality of first traces do not overlap with the display signal lines in a plan view, and During a first section of a sensing frame, a driving signal is provided to the plurality of first traces.

14. The electronic device according to claim 13, wherein: The at least some of the plurality of first sensing electrodes and the remaining first sensing electrodes of the plurality of first sensing electrodes are alternately arranged.

15. The electronic device according to claim 13, further comprising: a flexible circuit board electrically connected to the display layer and the sensor layer, Wherein, the display signal line and the sensor driver are arranged on the flexible circuit board.

16. The electronic device according to claim 13, wherein: The sensor layer further comprises: a plurality of second sensing electrodes extending along a second direction intersecting with the first direction; and a plurality of third traces, electrically connected to the plurality of second sensing electrodes respectively, and During the first section, the driving signal is provided to the plurality of third traces.

17. The electronic device according to claim 16, wherein: During the first section, the plurality of first sensing electrodes and the plurality of second sensing electrodes operate in a self-touch scheme.

18. The electronic device according to claim 16, wherein: The plurality of third trace lines are spaced apart from the display signal lines in a plan view.

19. The electronic device according to claim 16, wherein: The sensing frame further includes a second segment following the first segment, and During the second section, the plurality of first sensing electrodes and the plurality of second sensing electrodes are driven in a mutual touching scheme.

20. The electronic device according to claim 19, wherein: During the second section, a transmission signal is provided to the plurality of first traces and the plurality of second traces, and Wherein, receiving signals generated based on the transmission signals are provided to the plurality of third traces.

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