Temperature-controlled chip package thermal curing apparatus

Abstract

The present application relates to chip packaging heat curing technical field, especially to a temperature control type chip packaging heat curing equipment, including a shell, the shell is rotatably connected with a rotating door, the shell is installed with a plurality of heating elements, the shell is fixedly connected with a circulating shell, the circulating shell is provided with symmetrically distributed cavities, the shell is installed with symmetrically distributed circulating fans, the circulating shell is provided with symmetrically distributed two groups of first holes, the circulating shell is provided with a plurality of groups of second holes which are distributed in rectangular array, the circulating fan drives the hot air in the shell to circulate, and the hot air preferentially flows through the chips in the middle position of the shell, the temperature in the shell is controlled, the heat source in the shell is prevented from being close to the inner wall to cause the middle temperature to be lower than the temperature around, so that the time required for the middle chip heat curing is avoided to be long, and the effect and rate of the chip heat curing treatment are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to chip packaging heat curing technical field, especially to a temperature control type chip packaging heat curing equipment. BACKGROUND

[0002] Chip packaging heat curing equipment is one of the key equipment in semiconductor manufacturing and packaging process, which is used for curing chip packaging material, so as to protect the chip and realize its electrical connection. The existing chip heat curing method is various, among which there is a heat curing box. The heat curing box carries out heat curing treatment on the chips placed in groups in it through the internal heat source.

[0003] The heat source of the existing heat curing box is located on the inner wall of the shell, which leads to that the temperature of the inner wall of the heat curing box is higher than that of the center position in the interior. The chips are uniformly placed in groups in the heat curing box, which makes the chips at different positions unevenly heated, so that the middle chips need a long time for heat curing, and even the temperature of the chips at the inner wall of the shell is too high to cause deformation, thereby affecting the efficiency of the overall heat curing of the chips. SUMMARY

[0004] In order to overcome the shortcomings pointed out in the above background art, the present application provides a temperature control type chip packaging heat curing equipment.

[0005] In order to solve the above technical problems, the present application adopts the following technical scheme: a temperature control type chip packaging heat curing equipment, comprising a shell, the shell is rotatably connected with a rotating door, a plurality of heating elements are installed in the shell, two groups of clamping support members arranged in straight lines are arranged in the shell, a circulating shell body is fixedly connected to the shell, the circulating shell body is used for separating the two groups of clamping support members, symmetrically distributed cavities are arranged in the circulating shell body, symmetrically distributed circulating fans are installed in the shell, the air outlets of the circulating fans are communicated with the interiors of the circulating shell body, the air inlets of the circulating fans are communicated with the interiors of the shell through pipes, center-symmetrically distributed baffles are fixedly connected to the interiors of the circulating shell body, two groups of first holes arranged in straight lines are arranged in the circulating shell body, all the first holes are located between the center-symmetrically distributed baffles, the first holes are communicated with the adjacent cavities, the circulating shell body is provided with a plurality of groups of second holes arranged in rectangular arrays, the shell is communicated with the cavities through the plurality of groups of second holes arranged in rectangular arrays, a fixed shaft is fixedly connected in the circulating shell body, a leaf fan is rotatably connected to the fixed shaft, and the fixed shaft is fixedly connected with the shell.

[0006] More preferably, the diameters of the plurality of groups of second holes are sequentially reduced from the middle to the upper and lower sides, respectively, for improving the temperature of the middle chips in the shell during heat curing.

[0007] More preferably, the number of the second holes is the same as the number of the clamping supports, and the clamping supports are located in the middle of adjacent groups of the second holes.

[0008] More preferably, the heat collecting box is further provided, the heat collecting box is fixed to the shell, the fixed shaft of the circulating shell penetrates into the heat collecting box and is fixed to the heat collecting box, the part of the fixed shaft of the circulating shell located in the heat collecting box is rotationally connected with the rotating frame, the rotating frame is made of heat-conducting material, the fixed shaft of the circulating shell is made of heat-insulating material, the rotating frame is provided with the uniformly distributed fan blade parts, the fan blade parts of the rotating frame are fixed with the heat collecting plates arranged in linear array, the fixed shaft of the circulating shell is fixed with the heat collecting frame, the heat collecting frame sequentially penetrates through the heat collecting box, the circulating shell and the shell, one part of the heat collecting frame is located in the heat collecting box and contacts with the rotating frame, and the other part of the heat collecting frame is located in the circulating shell.

[0009] More preferably, the torsional spring is fixed between the fixed shaft of the circulating shell and the fan blade, and the baffle and the fan blade are limited to cooperate, so that the fan blade can keep the same state after each stop.

[0010] More preferably, the heat collecting plates are arranged in an inclined manner, and the heat collecting plates arranged in different linear arrays on adjacent fan blade parts are symmetrically distributed.

[0011] More preferably, the fan blade is fixed with the rotating plate on the side away from the rotating door, the rotating plate is made of heat-insulating material, the rotating plate is in contact with the heat collecting frame, the circulating shell is provided with the first channel near the rotating plate, the shell is provided with the second channel in communication with the first channel, the shell is fixed with the connecting pipes symmetrically distributed and in communication with the heat collecting box, the shell is provided with the third channel, the second channel and the third channel are respectively in communication with adjacent connecting pipes, the shell is provided with the fourth channel in communication with the third channel, the circulating shell is provided with the fifth channel symmetrically distributed and in communication with the fourth channel, the fifth channel is in communication with adjacent chambers, and the fifth channel is provided with the one-way valve.

[0012] More preferably, one of the baffles is fixed with the first telescopic rod, the fixed part of the first telescopic rod is provided with the thermal expansion gas, the telescopic end of the first telescopic rod is fixed with the sealing plate, the first hole is in sealing cooperation with the sealing plate, the sealing plate is provided with two groups of through holes symmetrically distributed, the through holes are in communication with adjacent first holes, the circulating shell is rotationally connected with the rotating disc near the first channel, the rotating disc is provided with the sector hole in communication with the first channel, the sealing plate and the rotating disc are in transmission through the gear and rack, and the rotating plate is in sealing cooperation with the sector hole of the rotating disc.

[0013] More preferably, the cooling fan is installed on the outer shell away from the rotating door, and is in communication with the inside of the outer shell for cooling the inside of the outer shell through air cooling circulation.

[0014] More preferably, the outer shell is slidingly connected with the extrusion rod, and the extrusion rod is in transmission with the rotating shaft of the rotating door through a gear and a rack.

[0015] The present application has the following advantages: 1. The hot air in the outer shell is circulated by the circulation fan, and the hot air is preferentially flowed through the chips at the middle part of the outer shell, so that the temperature in the outer shell is controlled, and the temperature at the middle part is prevented from being lower than the temperature at the surrounding part due to the heat source close to the inner wall of the outer shell, thereby avoiding the long time required for the thermal curing of the middle chips, and further improving the effect and rate of the thermal curing treatment of the chips;

[0016] 2. The heat is temporarily stored in the heat collecting box by the heat collecting plate, and when the thermal curing treatment is not required in the outer shell, the heat transfer between the heat collecting box and the outer shell is isolated, and when the temperature in the outer shell is low and the thermal curing treatment is required, the outer shell is communicated with the heat collecting box, so that the heat in the heat collecting box is quickly introduced into the outer shell, the preheating time in the outer shell is reduced, and the efficiency of the thermal curing of the chips is improved.

[0017] 3. The cooling strength of the cooling fan is adjusted according to the temperature in the outer shell, so that the outer shell is adaptively cooled in stages, the temperature is prevented from being suddenly reduced when the outer shell is cooled, the deformation of the chips is prevented from being too large, the quality of the chips after the thermal curing is prevented from being affected, the air cooling circulation speed between the cooling fan and the outer shell is automatically increased when the rotating door is opened, the air flow is prevented from overflowing from the front side of the outer shell when the rotating door is opened by the operator, and the local hot air flow in the outer shell is prevented from overflowing and burning the human body. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a schematic view of the three-dimensional structure of the present application;

[0019] Figure 2The perspective view of the outer shell of the present application;

[0020] Figure 3 The perspective view of the outer shell and the circulation shell of the present application;

[0021] Figure 4 The perspective view of the heat collecting box of the present application;

[0022] Figure 5 The perspective view of the outer shell, the circulation shell and the heat collecting box of the present application;

[0023] Figure 6 The perspective view of the rotating frame and the heat collecting plate of the present application;

[0024] Figure 7 The perspective view of the first channel, the second channel and the third channel of the present application;

[0025] Figure 8 The perspective view of the fourth channel and the fifth channel of the present application;

[0026] Figure 9 The perspective view of the blocking plate of the present application;

[0027] Figure 10 The perspective view of the heat collecting frame of the present application;

[0028] Figure 11 The perspective view of the cooling fan of the present application;

[0029] Figure 12 The perspective view of the heat conducting rod of the present application;

[0030] Figure 13 The perspective view of the extruding rod of the present application;

[0031] Figure 14 The perspective view of the direction of the hot air flow in the outer shell of the present application.

[0032] The marks of the components in the drawings are as follows: 1, outer shell, 2, rotating door, 3, heating element, 4, clamping support, 5, circulation shell, 501, chamber, 6, circulation fan, 7, baffle, 8, first hole, 9, second hole, 10, fan, 11, heat collecting box, 12, rotating frame, 13, heat collecting plate, 14, heat collecting frame, 15, rotating plate, 16, first channel, 17, second channel, 18, connecting pipe, 19, third channel, 20, fourth channel, 21, fifth channel, 22, first telescopic rod, 23, blocking plate, 24, rotating disc, 25, cooling fan, 26, heat conducting rod, 27, second telescopic rod, 28, sliding plate, 29, pressure sensor, 30, extruding rod. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0034] The heat source of the existing heat curing box is located on the inner wall of the shell, which results in that the temperature at the inner wall of the heat curing box is higher than the temperature at the central position in the heat curing box. The chips are uniformly arranged in groups in the heat curing box, which causes the chips at different positions to be unevenly heated, and thus the middle chips need a long time for heat curing, and even the chips at the inner wall of the shell are deformed due to the high temperature, thereby affecting the overall heat curing efficiency of the chips.

[0035] Embodiment 1: A temperature-controlled chip packaging heat curing device, comprising a heat curing box, a temperature sensor, a temperature controller, a heat source and a heat insulation layer. Figures 1-4 Compared with the prior art, Figure 14As shown, including the shell 1, the right side of the shell 1 is provided with a control panel, the front side of the shell 1 is rotatably connected with a rotating door 2, a plurality of heating elements 3 electrically connected with the control panel are installed in the shell 1, the heating elements 3 are four and are respectively distributed on the upper side, the lower side, the left side and the right side in the shell 1, the shell 1 is provided with two groups of clamping support pieces 4 which are linearly arrayed and distributed, the clamping support pieces 4 are of the existing structure, the clamping support pieces 4 are composed of a support plate and spring clamping plates which are symmetrically distributed, the shell 1 is fixedly connected with a circulating shell 5, the circulating shell 5 is used for separating the two groups of clamping support pieces 4, the circulating shell 5 is provided with symmetrically distributed chambers 501, the shell 1 is provided with circulating fans 6 which are symmetrically distributed, the circulating fans 6 are electrically connected with the control panel, the air outlet of the circulating fan 6 is in communication with the inside of the circulating shell 5, the air inlet of the circulating fan 6 is in communication with the inside of the shell 1 through a duct, the inside of the circulating shell 5 is fixedly connected with center-symmetrically distributed baffles 7, the left part of the upper baffle 7 is provided with a gap between the circulating shell 5, the right part of the lower baffle 7 is provided with a gap between the circulating shell 5, for guiding the upper hot air to the left part of the vane 10 and guiding the lower hot air to the right part of the vane 10, the circulating shell 5 is provided with two groups of first holes 8 which are symmetrically distributed, each group of first holes 8 is composed of two front-rear symmetrically distributed first holes 8, all the first holes 8 are located between the center-symmetrically distributed baffles 7, the first holes 8 are in communication with the adjacent chambers 501, the circulating shell 5 is provided with a plurality of groups of second holes 9 which are rectangularly arrayed, the shell 1 is in communication with the chambers 501 through the plurality of groups of second holes 9 which are rectangularly arrayed, the hole diameters of the plurality of groups of second holes 9 are sequentially reduced from the middle part to the upper and lower sides, for improving the temperature of the middle chip in the shell 1 during the heat curing, so as to balance the temperature at different positions in the shell 1, the number of the second holes 9 is the same as the number of the clamping support pieces 4, the clamping support pieces 4 are located in the middle part of an adjacent group of second holes 9, for making the hot air flow through the upper and lower layers of the clamping support pieces 4 at the same time, synchronously heating the upper and lower sides of the chip on the clamping support pieces 4, so as to make the chip evenly heated, a fixed shaft is fixedly connected in the circulating shell 5, the fixed shaft is rotatably connected with a vane 10, and the fixed shaft is fixedly connected with the shell 1.

[0036] When the operator needs to use the device to heat cure the chips, the operator manually opens the rotating door 2, places several groups of chip support trays into the shell 1, clamps and supports the adjacent chip support trays by using the clamping support 4, then closes the rotating door 2 and starts all the heating elements 3 and the two circulating fans 6 through the control panel. The heating elements 3 heat and heat cure the chips placed on the chip support trays, and the two circulating fans 6 simultaneously extract the hot air in the shell 1 through the pipes, then the two circulating fans 6 respectively inject the hot air into the circulating shell 5 from the upper and lower sides. The upper hot air is blocked by the upper baffle 7, and the lower hot air is blocked by the lower baffle 7. The upper hot air is guided to the left part of the vane 10, and the lower hot air is guided to the right part of the vane 10. The upper and lower hot air jointly drives the vane 10 to rotate counterclockwise (the direction of rotation is taken as the front view of the device as the reference). Figure 1

[0037] In the process of counterclockwise rotation of the vane 10, the hot air enters the adjacent chamber 501 through the first hole 8 on the left and right sides. Taking the right chamber 501 as an example, the hot air in the right chamber 501 is first discharged from the second hole 9 adjacent to the middle part of the rectangular array, and then the hot air is discharged from the second hole 9 on the right upper and lower sides of the rectangular array. The hot air is discharged from the second hole 9 and flows to the adjacent clamping support 4 to heat cure the chips on the chip support tray. The flow direction of the hot air is shown in Figure 14 , so that the hot air in the shell 1 is continuously circulated, thereby ensuring the uniformity of the temperature distribution in the shell 1. At the same time, the hot air preferentially flows through the chips at the middle part of the shell 1, preventing the hot source near the inner wall of the shell 1 from causing the middle temperature to be lower than the temperature around it, thereby avoiding the long time required for heat curing of the middle chips, and further improving the effect and rate of heat curing treatment of the chips.

[0038] When the heat curing of the chips is completed, the operator closes all the heating elements 3 and the two circulating fans 6 through the control panel, and cools the shell 1 by using external cooling equipment. After the temperature in the shell 1 decreases to close to a safe temperature (wherein the safe temperature is generally about 40°), the operator opens the rotating door 2, then takes out the chip support tray clamped on the clamping support 4, and collects the chip support tray. Finally, the shell 1 is cleaned for the next use.

[0039] Example 2: Based on example 1, as Figures 3-6 ​As shown, it also includes a heat collection box 11, which is fixed to the rear side of the outer shell 1. The rear part of the fixed shaft on the circulation shell 5 passes through the heat collection box 11 and is fixed to it. The rear part of the fixed shaft on the circulation shell 5 is rotatably connected to a rotating frame 12. The rotating frame 12 is made of a heat-conducting material and is used to transfer the heat from the heat collection frame 14 to all the heat collection plates 13. The fixed shaft of the circulation shell 5 is made of a heat-insulating material and is used to prevent heat from being transferred through the fixed shaft of the circulation shell 5. The rotating frame 12 is provided with fan blades that are evenly distributed around the circumference. The fan blades of the rotating frame 12 are fixed to the heat collection plates 13 that are arranged in a straight array. The heat collection plates 13 are arranged at an angle. The heat collection plates 13 that are arranged in different straight arrays on adjacent fan blades are symmetrically distributed. For example, taking a fan blade that is vertical on the upper side as an example, and the following... Figure 6 From the front view, the heat collection plate 13 gradually slopes downward from left to right, while the slope of the heat collection plate 13 on the fan blade adjacent to the upper vertical fan blade is exactly opposite to that of the fan blade. This is to increase the contact area between the airflow and the surface of the heat collection plate 13 when it passes from left to right. The fixed shaft of the circulation shell 5 is fixedly connected to the heat collection frame 14. The heat collection frame 14 passes through the heat collection box 11, the circulation shell 5 and the outer shell 1 in sequence. The rear part of the heat collection frame 14 is located inside the heat collection box 11 and contacts the rotating frame 12. The front end of the heat collection frame 14 is located inside the circulation shell 5.

[0040] like Figures 4-8 As shown, a rotating plate 15 is fixedly connected to the rear side of the fan blade 10. The rotating plate 15 is made of heat-insulating material. A torsion spring is fixedly connected between the fixed shaft of the circulation housing 5 and the fan blade 10. The baffle 7 is in a limiting fit with the fan blade 10 to ensure that the fan blade 10 maintains the same placement after each stop of rotation. The rotating plate 15 is in contact with the heat collector frame 14. When the rotating plate 15 stops rotating, the torsion spring of the fan blade 10 resets and drives it to rotate back to its original position. The fan blade 10 drives the rotating plate 15 to rotate back to its original position, so that the fan blades on the left and right sides of the fan blade 10 always maintain the same horizontal height, thereby blocking the heat collector frame 14. When the rotating plate 15 rotates and loses its obstruction of the heat collector frame 14, the heat in the circulation housing 5 is conducted to the rotating frame 12 through the heat collector frame 14. A first... A first channel 16 is provided in the inner wall of the rear side of the outer shell 1, and a second channel 17 is provided in the inner wall of the outer shell 1, which is connected to the first channel 16. A connecting pipe 18 is fixedly connected to the rear side of the outer shell 1, which is symmetrically distributed on both sides and is connected to the heat collection box 11. A third channel 19 is provided in the inner wall of the rear side of the outer shell 1. The second channel 17 and the third channel 19 are respectively connected to the adjacent connecting pipe 18. A fourth channel 20 is provided in the outer shell 1, which is connected to the third channel 19. A fifth channel 21 is provided in the circulating shell 5, which is symmetrically distributed on both sides and is connected to the fourth channel 20. The fifth channel 21 is connected to the adjacent chamber 501. A one-way valve is provided in the fifth channel 21. When the airflow flows from the fifth channel 21 to the adjacent chamber 501, the one-way valve opens. When the airflow flows from the chamber 501 to the adjacent fifth channel 21, the one-way valve closes.

[0041] As Figure 5 , Figure 9 With Figure 10 shown, one of the baffles 7 is fixed with a first telescopic rod 22, a heat expansion gas is arranged in the fixed part of the first telescopic rod 22, when the temperature in the shell 1 is the optimal temperature for chip heat curing, the heat expansion gas expands to the limit, so that the telescopic end of the first telescopic rod 22 extends to the limit state, when the temperature in the shell 1 is about 40°, the heat expansion gas shrinks to the limit, so that the telescopic end of the first telescopic rod 22 shrinks to the limit state, the telescopic end of the first telescopic rod 22 is fixed with a blocking plate 23, the first hole 8 is blocked and matched with the blocking plate 23, the blocking plate 23 is provided with two groups of through holes which are symmetrically distributed left and right, each group has two through holes, the through holes are communicated and matched with the adjacent first hole 8, after the telescopic end of the first telescopic rod 22 extends to the limit state and drives the blocking plate 23 to move, the first hole 8 is communicated with the adjacent through hole, after the telescopic end of the first telescopic rod 22 shrinks to the limit state and drives the blocking plate 23 to move, the blocking plate 23 blocks the first hole 8, the rear side of the circulating shell 5 is rotatably connected with a rotating disc 24, the rotating disc 24 is provided with a sector hole which is communicated and matched with the first channel 16, the blocking plate 23 and the rotating disc 24 are driven through the gear and rack, and the rotating plate 15 is blocked and matched with the sector hole of the rotating disc 24.

[0042] In the process of heat curing of the chip, after the vane fan 10 rotates, the torsional spring of the vane fan 10 is twisted to store energy, after the vane fan 10 rotates to contact the two baffles 7, the baffles 7 limit the vane fan 10, so that the vane fan 10 cannot continue to rotate to a larger angle, and the vane fan 10 drives the rotating plate 15 to rotate in the process of rotation, the rotating plate 15 rotates to lose contact with the heat collecting frame 14, the heat collecting frame 14 contacts the hot air in the circulating shell 5, the heat collecting frame 14 conducts the heat in the circulating shell 5 to the rotating frame 12, the rotating frame 12 conducts the heat to all the heat collecting plates 13, so that part of the heat is temporarily stored in the heat collecting box 11, after the chip heat curing is completed, the torsional spring of the vane fan 10 drives it to rotate to reset, the vane fan 10 drives the rotating plate 15 to rotate to reset, so that the rotating plate 15 contacts and shields the heat collecting frame 14, preventing the heat collecting box 11 from exchanging heat with the shell 1, and then repeating the steps in the above embodiment to reduce the temperature in the shell 1.

[0043] When the temperature inside the shell 1 is lowered, the thermal expansion gas in the first telescopic rod 22 cools and shrinks (the thermal expansion gas in the first telescopic rod 22 expands due to the high temperature in the first telescopic rod 22 during the heat curing process of the chip), causing the telescopic end of the first telescopic rod 22 to shrink, the telescopic end of the first telescopic rod 22 driving the blocking plate 23 to move downward, the blocking plate 23 driving all the through holes thereon to move downward, causing the through holes of the blocking plate 23 to lose communication with the adjacent first holes 8, the first holes 8 being blocked by the blocking plate 23, and in the process of moving downward, the blocking plate 23 rotates the transmission disc 24 through the gear and rack transmission, the transmission disc 24 driving the sector holes thereon to rotate 180°, causing the sector holes of the transmission disc 24 to align with the first channel 16, and at this time, since the heat curing of the chip is completed, the torsional spring of the leaf fan 10 has reset and driven the rotation reset, the rotation plate 15 resets and shields the sector holes of the transmission disc 24, thereby preventing heat loss in the heat collection box 11. The operator takes out the heat-cured chip and places the next group of chip support trays into the shell 1.

[0044] When the sector holes of the transmission disc 24 align with the first channel 16, the operator turns on all the heating elements 3 and the two circulating fans 6 through the control panel, and since the first holes 8 are blocked by the blocking plate 23, the hot air blown by the circulating fans 6 can only enter the first channel 16, at this time, the two circulating fans 6 are turned on, causing the leaf fan 10 to rotate according to the above steps, the torsional spring of the leaf fan 10 storing energy, the leaf fan 10 driving the rotation plate 15 to rotate and losing the shielding of the sector holes of the transmission disc 24, the hot air entering the heat collection box 11 through the first channel 16, the second channel 17 and the left connecting pipeline 18 in turn, the hot air flowing through the heat collection plate 13 and carrying the heat thereon into the right connecting pipeline 18, and then the hot air entering the two fifth channels 21 through the right connecting pipeline 18, the third channel 19 and the fourth channel 20 in turn, at this time, the one-way valves of the fifth channels 21 are opened and flow through, causing the hot air to enter the adjacent chamber 501 through the fifth channels 21, the hot air carrying the heat in the heat collection box 11 into the chamber 501, and then the hot air being discharged to the vicinity of the chip support tray through the above steps and along all the second holes 9, quickly guiding the temporarily stored heat back into the shell 1, causing the heat in the heat collection box 11 to quickly exchange with the temperature inside the shell 1, thereby reducing the preheating time inside the shell 1, thereby improving the efficiency of the chip heat curing.

[0045] When the temperature inside the shell 1 begins to rise, the thermal expansion gas in the first telescopic rod 22 gradually expands and drives its telescopic end to extend, the telescopic end of the first telescopic rod 22 drives the blocking plate 23 to rise, so that the through hole of the blocking plate 23 is aligned with the adjacent first hole 8, the blocking plate 23 drives the rotating disc 24 through the gear and rack transmission, so that the sector hole of the rotating disc 24 is misaligned with the first channel 16 to block, the hot air of the circulating fan 6 repeats the above circulation steps again, and the hot air is discharged in turn through all the first holes 8, the two chambers 501 and all the second holes 9 and flows to the adjacent clamping support 4 to perform heat curing treatment on the chip.

[0046] When the chip heat curing is completed, the operator turns off all the heating elements 3 and the two circulating fans 6 through the control panel, the circulating fan 6 stops running so that the impeller 10 is no longer affected by the hot air, and the torsional spring of the impeller 10 drives it to rotate and reset, so that.

[0047] Example 3: based on example 2, as Figures 11-13 shown, it also includes a cooling fan 25 electrically connected with the control panel, the cooling fan 25 is installed at the lower part of the rear side of the shell 1, the cooling fan 25 is communicated with the inside of the shell 1, and the cooling fan 25 is used for cooling the shell 1 through air cooling circulation, the upper side of the shell 1 is fixedly connected with a heat conduction rod 26 communicated with the inside of the shell 1, the upper side of the shell 1 is fixedly connected with a second telescopic rod 27, the front part of the heat conduction rod 26 penetrates into the fixed part of the second telescopic rod 27, and the second telescopic rod 27 is provided with thermal expansion gas, when the temperature of the heat conduction rod 26 is consistent with the optimal temperature of the chip heat curing, the thermal expansion gas in the second telescopic rod 27 expands to make the telescopic end of the second telescopic rod 27 extend to the limit state, when the temperature of the heat conduction rod 26 drops to about 40°, the thermal expansion gas in the second telescopic rod 27 contracts, and the rear sliding plate 28 extrudes the telescopic end of the second telescopic rod 27 to contract to the limit state, the upper side of the shell 1 is slidably connected with the front and rear symmetrically distributed sliding plates 28 near the second telescopic rod 27, the telescopic end of the second telescopic rod 27 is fixedly connected with the adjacent sliding plate 28, the symmetrically distributed sliding plates 28 are fixedly connected with elastic elements, wherein the elastic elements are compression springs, the pressure sensor 29 is installed on the upper side of the shell 1 near the symmetrically distributed sliding plates 28, the pressure sensor 29 is electrically connected with the control panel, the pressure sensor 29 is extruded and matched with the adjacent sliding plate 28, and the pressure sensor 29 is electrically connected with the cooling fan 25.

[0048] As shown in Figure 12 and Figure 13 , the shell 1 is slidably connected with an extrusion rod 30, the extrusion rod 30 is driven by the gear and rack transmission between the rotating shaft of the rotating door 2, and the extrusion rod 30 is extruded and matched with the adjacent sliding plate 28, in the process of rotating the rotating door 2, the rotating door 2 drives the extrusion rod 30 to move forward and extrude the rear sliding plate 28 through the gear and rack.

[0049] In the process of chip thermal curing, the heat conduction rod 26 conducts the temperature in the shell 1 to the fixed part of the second telescopic rod 27, at this time the temperature in the shell 1 is at the optimal temperature for chip thermal curing, the thermal expansion gas in the fixed part of the second telescopic rod 27 expands due to heat, so that the telescopic end of the second telescopic rod 27 gradually extends and presses the rear sliding plate 28, the elastic member of the rear sliding plate 28 is pressed, so that the pressing force of the front sliding plate 28 on the pressure sensor 29 increases, but at this time the cooling fan 25 is not started, after the chip thermal curing is completed, the operator starts the cooling fan 25 through the control panel, the cooling fan 25 extracts the hot air in the shell 1, and the cooling fan 25 cools the extracted hot air and then sends it back to the shell 1, after the chip thermal curing is completed and the shell 1 starts to gradually cool, the temperature conducted by the heat conduction rod 26 to the second telescopic rod 27 decreases, the thermal expansion gas cools and shrinks, the elastic member of the rear sliding plate 28 gradually resets and drives the rear sliding plate 28 to reset, so that the pressure of the front sliding plate 28 on the pressure sensor 29 gradually decreases, the pressure sensor 29 feeds back the instruction to the control panel, the control panel controls the gradually increasing power of the cooling fan 25, and the cooling intensity of the cooling fan 25 on the shell 1 is enhanced, so that the shell 1 is adaptively cooled in stages, so as to adapt to the cooling intensity that can be borne by the chip at different stages, and prevent the temperature from suddenly dropping when the shell 1 is cooled, so that the chip deformation is too large, and then the quality of the chip after thermal curing is affected.

[0050] When the temperature in the shell 1 drops to a safe temperature, the operator opens the rotating door 2, the rotating door 2 rotates and drives the extrusion rod 30 through the gear and rack transmission, the extrusion rod 30 moves backward and extrudes the front sliding plate 28, the front sliding plate 28 moves backward and extrudes the elastic member, so that the extrusion force of the front sliding plate 28 on the pressure sensor 29 is suddenly reduced, so as to increase the power of the cooling fan 25 and enhance the air cooling circulation speed between the cooling fan 25 and the shell 1, so as to prevent the air flow from overflowing from the front of the shell 1 when the operator opens the rotating door 2, so as to avoid that the local hot air flow in the shell 1 overflows and burns the human body.

[0051] When the chip thermal curing is completed, the operator closes all the heating elements 3, the two circulating fans 6 and the cooling fan 25 through the control panel, after the operator opens the rotating door 2, the chip support tray clamped on the clamping support 4 is taken out, and the chip support tray is collected, and finally the shell 1 is cleaned for the next use.

[0052] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature-controlled chip packaging thermosetting device, comprising a housing (1), wherein a rotating door (2) is rotatably connected to the housing (1), a plurality of heating elements (3) are installed inside the housing (1), two sets of clamping support members (4) arranged in a linear array are provided inside the housing (1), a circulating shell (5) is fixedly connected inside the housing (1), the circulating shell (5) is used to separate the two sets of clamping support members (4), and symmetrically distributed chambers (501) are provided inside the circulating shell (5), characterized in that, It also includes symmetrically distributed circulating fans (6), all of which are installed on the outer casing (1). The air outlets of the circulating fans (6) are connected to the interior of the circulating housing (5), and the air inlets of the circulating fans (6) are connected to a cavity located inside the outer casing (1) and outside the circulating housing (5) via ducts. The interior of the circulating housing (5) is fixed with centrally symmetrically distributed baffles (7), and the circulating housing (5) is provided with two sets of symmetrically distributed first holes (8). All of them The first holes (8) are all located between the baffles (7) that are centrally symmetrically distributed. The first holes (8) are connected to the adjacent chambers (501). The circulation shell (5) is provided with a number of sets of second holes (9) arranged in a rectangular array. The cavity inside the outer shell (1) is connected to the chambers (501) through the number of sets of second holes (9) arranged in a rectangular array. A fixed shaft is fixedly connected inside the circulation shell (5). The fixed shaft is rotatably connected to the blade fan (10). The fixed shaft is fixedly connected to the outer shell (1). The diameter of several groups of the second holes (9) decreases sequentially from the middle to the upper and lower sides, which is used to increase the temperature of the chip in the middle of the shell (1) during thermal curing; The number of sets of the second holes (9) is the same as the number of clamping supports (4), and the clamping supports (4) are located in the middle of an adjacent set of the second holes (9); A torsion spring is fixed between the fixed shaft of the circulating housing (5) and the blade (10), and the baffle (7) is in a limiting fit with the blade (10) to ensure that the blade (10) can maintain the same placement state after each stop of rotation. Both the baffle (7) and the blade (10) are located in the middle of the circulation housing (5).

2. The temperature-controlled chip packaging thermosetting equipment according to claim 1, characterized in that, It also includes a heat collection box (11), which is fixed to the outer shell (1). The fixed shaft of the circulation shell (5) passes through the heat collection box (11) and is fixed to it. The part of the fixed shaft on the circulation shell (5) located inside the heat collection box (11) is rotatably connected to a rotating frame (12). The rotating frame (12) is made of a heat-conducting material, and the fixed shaft of the circulation shell (5) is made of a heat-insulating material. The rotating frame (12) is provided with fan blades that are evenly distributed in the circumference. The fan blades of the rotating frame (12) are fixed to a heat collection plate (13) that is distributed in a straight array. The fixed shaft of the circulation shell (5) is fixed to a heat collection frame (14). The heat collection frame (14) passes through the heat collection box (11), the circulation shell (5) and the outer shell (1) in sequence. A part of the heat collection frame (14) is located inside the heat collection box (11) and is in contact with the rotating frame (12). The other part of the heat collection frame (14) is located inside the circulation shell (5).

3. The temperature-controlled chip packaging thermosetting equipment according to claim 2, characterized in that, The heat collection plate (13) is arranged at an angle, and the heat collection plates (13) on adjacent fan blades are distributed in different linear arrays in a symmetrical manner.

4. The temperature-controlled chip packaging thermosetting equipment according to claim 3, characterized in that, A rotating plate (15) is fixedly connected to the side of the blade fan (10) away from the rotating door (2). The rotating plate (15) is made of heat-insulating material. The rotating plate (15) is in contact with the heat collection frame (14). A first channel (16) is provided on the circulation shell (5) near the rotating plate (15). A second channel (17) is provided on the outer shell (1) and communicates with the first channel (16). The outer shell (1) is fixedly connected with symmetrically distributed connecting pipes (18) that communicate with the heat collection box (11). The outer shell (1) is provided with a third channel (19), the second channel (17) and the third channel (19) are respectively connected to the adjacent connecting pipe (18), the outer shell (1) is provided with a fourth channel (20) connected to the third channel (19), the circulating shell (5) is provided with symmetrically distributed fifth channels (21) all connected to the fourth channel (20), the fifth channel (21) is connected to the adjacent chamber (501), and a one-way valve is provided in the fifth channel (21).

5. The temperature-controlled chip packaging thermosetting equipment according to claim 4, characterized in that, One of the baffles (7) is fixedly connected to a first telescopic rod (22). The fixed part of the first telescopic rod (22) is provided with thermal expansion gas. The telescopic end of the first telescopic rod (22) is fixedly connected to a sealing plate (23). The first hole (8) is sealed and cooperated with the sealing plate (23). The sealing plate (23) is provided with two sets of symmetrically distributed through holes. The through holes are connected and cooperated with the adjacent first hole (8). The circulation shell (5) is rotatably connected to a rotating disk (24) near the first channel (16). The rotating disk (24) is provided with a fan-shaped hole that is connected and cooperated with the first channel (16). The sealing plate (23) and the rotating disk (24) are driven by a gear and rack. The rotating plate (15) is sealed and cooperated with the fan-shaped hole of the rotating disk (24).

6. The temperature-controlled chip packaging thermosetting equipment according to claim 5, characterized in that, It also includes a cooling fan (25), which is installed on the outer casing (1) away from the rotating door (2). The cooling fan (25) is connected to the interior of the outer casing (1) and is used to cool the interior of the outer casing (1) through air cooling circulation. A heat-conducting rod (26) connected to the interior of the outer casing (1) is fixedly connected to the outer casing (1) near the rotating door (2). A second telescopic rod (27) is fixedly connected to the outer casing (1) near the rotating door (2). A part of the heat-conducting rod (26) passes through the fixed part of the second telescopic rod (27). The telescopic rod (27) is filled with thermally expanding gas. The outer shell (1) is slidably connected to symmetrically distributed sliding plates (28) near the second telescopic rod (27). The telescopic end of the second telescopic rod (27) is fixedly connected to the adjacent sliding plate (28). An elastic element is fixedly connected between the symmetrically distributed sliding plates (28). A pressure sensor (29) is installed on the outer shell (1) near the symmetrically distributed sliding plates (28). The pressure sensor (29) is pressed and engaged with the adjacent sliding plate (28). The pressure sensor (29) is electrically connected to the cooling fan (25).

7. The temperature-controlled chip packaging thermosetting equipment according to claim 6, characterized in that, The outer shell (1) is slidably connected to a pressing rod (30), and the pressing rod (30) is connected to the rotating shaft of the rotating door (2) by a gear and rack transmission. The pressing rod (30) is pressed and engaged with the adjacent sliding plate (28).

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