Inching suspension wire PCB (printed circuit board) and preparation method thereof
By secondary cutting of the PCB board to form a suspended wire, replacing the movable bracket, the camera's anti-shake and focus function is realized, reducing the cost of use, and the precise positioning of the photosensitive chip is achieved through the elasticity of the suspended wire.
Patent Information
- Application Number
- CN202411737865.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-02-28
AI Technical Summary
The PCB board of the existing camera assembly needs to be moved when focusing, and the prior art needs to rely on a movable bracket, resulting in increased usage costs.
By secondary cutting of the PCB board, a hanging wire is formed, and the movable bracket is replaced by the elasticity of the hanging wire, so that the photosensitive chip can be positioned by the hanging wire when it moves in various directions.
The camera's anti-shake, focus and other functions are realized, which reduces the cost of use, and the precise positioning of the photosensitive chip is achieved through the elasticity of the hanging wire.
Smart Images

Figure CN119545667A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a PCB board with inch-movable suspension wires and a preparation method thereof, belonging to the technical field of electronic equipment. Background Art
[0002] The camera assembly usually needs to focus when taking pictures, which requires the PCB of the existing camera assembly to move at a certain time. The existing PCB board is an independent device (the hard board cannot be deformed, and the soft board can only be bent). To move, it must be installed on a movable bracket and moved by connecting with the soft board. However, in this way, the user needs to rely on other components when using it, which increases the cost of use.
[0003] In view of this, it is indeed necessary to improve the existing PCB board to solve the above problems. Summary of the invention
[0004] In order to solve the above technical problems, the present invention provides a PCB board with inch-movable suspension wires, which can replace the movable bracket and realize the functions of camera anti-shake, focusing, etc.
[0005] The technical solution of the present invention is:
[0006] A method for preparing a PCB board with an inching suspension wire comprises the following steps:
[0007] Perform the first cutting on the PCB board and form the area to be cut and the installation area;
[0008] Laminating a steel sheet in the installation area;
[0009] Setting a cutting alignment point on the area to be cut;
[0010] Performing a second cutting on the area to be cut according to the cutting alignment point, and cutting a plurality of hanging wires on the area to be cut, wherein the width of the hanging wires is 160um-190um;
[0011] Wash the PCB board after the second cutting;
[0012] Wherein, during the second cutting, a carrier film is attached to the bottom surface of the PCB board to increase the suction force between the PCB board and the processing table.
[0013] As a further improvement of the present invention, a preset area is provided in the area to be cut, and the cutting alignment points are arranged on the periphery of the preset area.
[0014] As a further improvement of the present invention, there are at least four cutting alignment points, the connecting line between the four cutting alignment points is a rectangle, a connecting point is provided on the connecting line between the PCB board and two adjacent cutting alignment points, and the suspension wire is connected to the PCB board at the connecting point.
[0015] As a further improvement of the present invention, the second cutting comprises the following steps:
[0016] Select a cutting site and cut along the adjacent cutting sites in a straight line;
[0017] After skipping the connection point on the cutting path, the straight-line cutting is continued toward the adjacent cutting counterpoint.
[0018] As a further improvement of the present invention, the area to be cut and the installation area are connected via a flexible member.
[0019] As a further improvement of the present invention, the flexible member is composed of 4 to 8 layers of pure soft boards.
[0020] As a further improvement of the present invention, the suspension wire is composed of a plurality of thin wires, and the number of the thin wires in the suspension wire is less than or equal to 3 on the same side of the area to be cut.
[0021] As a further improvement of the present invention, after the PCB board cut for the second time is washed with water, the PCB board is packaged by using a bonding carrier film.
[0022] The present invention also provides a PCB board with an inch-movable suspension wire, which is prepared by the above-mentioned preparation method.
[0023] As a further improvement of the present invention, a preset area is provided in the area to be cut, and the preset area is used to install a photosensitive chip. The photosensitive chip can be driven to move in various directions, and the suspension wire is used to position the photosensitive chip after the movement.
[0024] The beneficial technical effect of the present invention is: the present invention performs a secondary cutting on the PCB board to cut out a suspension wire on the area to be cut formed by the first cutting, and relies on the elasticity of the suspension wire to replace the movable bracket, so that the photosensitive chip can be positioned by the suspension wire. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 The diagram is a schematic structural diagram of a PCB board with an inch-movable suspension wire in accordance with a preferred embodiment of the present invention.
[0026] Figure 2 yes Figure 1 Schematic diagram of the structure after hiding some parts.
[0027] Figure 3The present invention is in accordance with a preferred embodiment of the present invention a process flow chart of a method for preparing a PCB board with an inch-movable suspension wire.
[0028] Figure 4 yes Figure 3 Figure 1 shows the area where the first cut is made on the PCB.
[0029] Figure 5 yes Figure 3 Figure 1. The second cut area on the PCB. DETAILED DESCRIPTION
[0030] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.
[0031] See also Figures 1 to 5 As shown, the present invention discloses a PCB board 100 with suspension wires that can be moved in an inching manner. The PCB board 100 is used to install a photosensitive chip 400. The photosensitive chip 400 can be driven to move slightly in an inching manner toward the front, back, left, right, up, and down. The PCB board 100 is provided with suspension wires 5 located at the periphery of the photosensitive chip 400. The suspension wires 5 are used to position the photosensitive chip 400 after the inching. In this way, it can replace the movable bracket to be used for anti-shake, focus adjustment, etc. of the camera.
[0032] The present invention also discloses a method for preparing a PCB board 100 with an inching suspension wire, comprising the following steps:
[0033] The PCB board 100 is cut for the first time to form the area to be cut 1 and the mounting area 2; preferably, a high-precision cutting machine is used to cut the PCB board 100 for the first time. During the cutting process, the cutting path needs to be precisely controlled to ensure the formation of the area to be cut 1 and the mounting area 2. The area to be cut 1 is the part to be cut for the second time, and the mounting area 2 is used for the subsequent steel sheet bonding.
[0034] The steel sheet 3 is bonded in the mounting area 2; preferably, in the mounting area 2, a precise bonding device is used to bond the steel sheet 3 to the PCB board 100. The size and shape of the steel sheet 3 match the mounting area 2 to ensure that it can provide sufficient support and protection.
[0035] Setting a cutting alignment point 4 on the area to be cut 1;
[0036] The to-be-cut area 1 is cut for the second time according to the cutting alignment point 4, and a plurality of hanging wires 5 are cut out on the to-be-cut area 1, wherein the width of the hanging wires 5 is 160um-190um;
[0037] The PCB board 100 after the second cutting is washed with water; preferably, deionized water or a special cleaning liquid is used in the washing process to ensure the cleanliness of the PCB board 100. During the washing process, an SMT fixture is used for clamping and protection to prevent deformation of the PCB board 100 caused by spray pressure washing.
[0038] After the PCB board 100 cut for the second time is washed, the PCB board 100 is packaged by using a laminating carrier film, so that the PCB board can be prevented from being deformed after reaching the client.
[0039] During the second cutting, a carrier film is attached to the bottom surface of the PCB board 100 to increase the suction force between the PCB board 100 and the processing table to prevent the suspension wire 5 from shaking and causing cutting deviation.
[0040] Preferably, a preset area 11 is provided in the area to be cut 1, and the cutting alignment point 4 is arranged at the periphery of the preset area 11. Preferably, the cutting alignment point 4 can be positioned and determined before the first cutting.
[0041] There are at least four cutting alignment points 4, the connection line between the four cutting alignment points 4 is a rectangle, a connection point 41 is provided on the connection line between the PCB board 100 and two adjacent cutting alignment points 4, and the suspension wire 5 is connected to the PCB board 100 at the connection point 41.
[0042] In this embodiment, the second cutting includes the following steps:
[0043] Select a cutting pair site 4, and cut along the adjacent cutting pair site 4 in a straight line;
[0044] After skipping the connection point 41 on the cutting path, the straight-line cutting continues toward the adjacent cutting point 4 .
[0045] Preferably, a hard board 200 is further provided at the bottom of the PCB board 100, and the suspension wire 5 is connected to the hard board 200 at the connection point 41. A processing layer 300 for secondary cutting is also provided above the hard board 200, and the suspension wire 5 is a filament formed after the material on the processing layer 300 is cut.
[0046] In this embodiment, a reserved point is provided on the processing layer 300, and the reserved point is a reserved hard board 200 after the processing layer 300 is cut out. Therefore, the hard board 200 at the reserved point is integrated with the processing layer 300, and the connection point 41 is a part of the hard board 200 located at the reserved point. During the second cutting, the processing layer 300 is cut into the hanging wire 5, and the hanging wire 5 is still integrated with the connection point 41. By skipping the connection point 41, the hanging wire 5 can be fixed on the connection point 41.
[0047] Preferably, the suspension wire 5 is composed of a plurality of thin wires, and the number of the thin wires in the suspension wire 5 on the same side of the to-be-cut area 1 is less than or equal to 3. Experiments have shown that the effect of the suspension wire 5 is best at this time.
[0048] The area to be cut 1 and the installation area 2 are connected by a flexible member 6. Preferably, the flexible member is composed of 4-8 layers of pure soft boards. In this embodiment, the installation area 2 is subsequently used to install electronic devices such as connectors that can be directly connected to mobile phones and cameras. Therefore, the arrangement of the flexible member 6 can ensure smooth insertion.
[0049] In summary, the present invention provides a PCB board 100 with an incised suspension wire and a preparation method thereof, by performing a secondary cutting on the PCB board 100 to cut out a suspension wire 5 on the area to be cut 1 formed by the first cutting, and relying on the elasticity of the suspension wire 5, replacing the movable bracket, so that when the photosensitive chip 400 is driven to move in various directions, the suspension wire 5 is used to position the photosensitive chip 400.
[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A method for preparing a PCB board with an inching suspension wire, wherein the PCB board is used to install a photosensitive chip, characterized in that: The following steps are involved: Perform the first cutting on the PCB board and form the area to be cut and the installation area; Laminating a steel sheet in the installation area; Setting a cutting alignment point on the area to be cut; Performing a second cutting on the area to be cut according to the cutting alignment point, and cutting a plurality of hanging wires on the area to be cut, wherein the width of the hanging wires is 160um-190um; Wash the PCB board after the second cutting; Wherein, during the second cutting, a carrier film is attached to the bottom surface of the PCB board to increase the suction force between the PCB board and the processing table.
2. The method for preparing a PCB board with an inching suspension wire according to claim 1, characterized in that: A preset area is provided in the area to be cut, and the cutting alignment points are arranged at the periphery of the preset area.
3. The method for preparing a PCB board with an inching suspension wire according to claim 2, characterized in that: There are at least four cutting alignment points, the connection line between the four cutting alignment points is a rectangle, a connection point is provided on the connection line between the PCB board and two adjacent cutting alignment points, and the suspension wire is connected to the PCB board at the connection point.
4. The method for preparing a PCB board with an inching suspension wire according to claim 3, characterized in that: The second cutting process includes the following steps: Select a cutting site and cut along the adjacent cutting sites in a straight line; After skipping the connection point on the cutting path, the straight-line cutting is continued toward the adjacent cutting counterpoint.
5. The method for preparing a PCB board with an inching suspension wire according to claim 1, characterized in that: The area to be cut and the installation area are connected via a flexible member.
6. The method for preparing a PCB board with an inching suspension wire according to claim 5, characterized in that: The flexible component is composed of 4 to 8 layers of pure soft boards.
7. The method for preparing a PCB board with an inching suspension wire according to claim 1, characterized in that: The suspension wire is composed of a plurality of thin wires, and the number of the thin wires in the suspension wire is less than or equal to 3 on the same side of the area to be cut.
8. The method for preparing a PCB board with an inching suspension wire according to claim 1, characterized in that: After the PCB board cut for the second time is washed with water, the PCB board is packaged by using a laminating carrier film.
9. A PCB board with movable suspension wire, characterized in that: Prepared by the preparation method described in any one of claims 1 to 8.
10. The inch-movable suspension wire PCB board according to claim 9, characterized in that: A preset area is provided in the area to be cut, and the preset area is used to install a photosensitive chip. The photosensitive chip can be driven to move in various directions, and the suspension wire is used to position the photosensitive chip after the movement.