Electronic control device

Abstract

An electronic control device is provided with an electronic device, a cooling plate (330), movable members (410, 420) that hold the cooling plate in a movable state and have protrusions (417, 427), and a heat conduction member (150) that is in contact with the electronic device and the cooling plate. The electronic device is provided with a slide block (141), and the slide block (141) is a part where the protruding part is arranged and is provided with a guide groove. In the slider, holding parts (SL12, SL15) for holding the protruding parts at the ends on the opposite side in the mounting direction are provided as the guide grooves. In a state in which the electronic device is mounted on the holder, the protruding portion is held by the holding portion, whereby the heat conduction member is pressed by the electronic device and the cooling plate. The electronic control device includes a spring member (SP1) that constantly applies stress to the movable member in a direction in which the electronic device is separated from the cooling plate. As a result, the electronic control device can improve the installability of the electronic device.

Description

Technical Field

[0001] The invention relates to an electronic control device. Background Art

[0002] Patent Document 1 discloses a structure in which a cooling plate is fixed to a printed circuit board.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 8-125371

[0004] However, the electronic control device may include an electronic device, a bracket on which the electronic device is mounted, and a cooling plate disposed on the bracket. In addition, the electronic control device may include a movable component disposed on the bracket to move the cooling plate toward the electronic device. However, in the electronic control device, the mountability of the electronic device relative to the bracket may deteriorate depending on the position of the movable component. In addition, in the above viewpoints or other viewpoints not mentioned, further improvements are required for the electronic control device. Summary of the invention

[0005] An object of the present invention is to provide an electronic control device capable of improving the mountability of an electronic device.

[0006] The electronic control device disclosed herein is an electronic device that can be mounted on a bracket, and is characterized by comprising:

[0007] a cooling plate mounted on the bracket in a state of being movable in a thickness direction of the electronic device orthogonal to a mounting direction of the electronic device with respect to the bracket; and

[0008] The movable component is installed in the bracket at a position where the electronic device is clamped from a direction perpendicular to the installation direction and the thickness direction, and holds the cooling plate in a state where it can move in the thickness direction, and has a protrusion protruding toward the electronic device.

[0009] The electronic device has a guide component, which is arranged at both ends of a direction perpendicular to the mounting direction and the thickness direction and is provided with a guide groove, the guide groove being a portion where the protrusion is arranged and extending along the mounting direction.

[0010] In the guide member, the end portion on the mounting direction side is open as a guide groove, and a holding portion for holding the protrusion is provided at the end portion on the opposite side of the mounting direction.

[0011] When the electronic device is mounted on the bracket, the protrusion is held by the holding portion, and the electronic device and the cooling plate are arranged at opposing mounting positions.

[0012] The electronic control device further includes a biasing portion that applies a stress to the movable member at all times in a direction in which the electronic device is separated from the cooling plate.

[0013] In this way, the electronic control device includes a force-applying portion that always applies stress to the movable component in the direction of separation of the electronic device and the cooling plate. Therefore, in the electronic control device, when the electronic device is not installed on the bracket, it is easy to keep the movable component at a specified position. Therefore, in the electronic control device, when installing the electronic device on the bracket, it is easy to arrange the protrusion in the guide groove, which can improve the mountability of the electronic device relative to the bracket. In addition, the electronic control device is configured so that when the electronic device is installed on the bracket, the protrusion is held by the holding portion, and the electronic device and the cooling plate are arranged in opposite mounting positions. Therefore, the electronic control device can improve the heat dissipation of the cooling plate to the electronic device.

[0014] The various methods disclosed in this specification use different technical means to achieve their respective purposes. The purposes, features and effects disclosed in this specification will become more apparent by referring to the subsequent detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view showing a schematic structure of an electronic control device.

[0016] Figure 2 This is a perspective view showing a state where the electronic device of the electronic control device is disassembled.

[0017] Figure 3 It is an exploded perspective view showing a schematic structure of an electronic control device.

[0018] Figure 4 This is an exploded perspective view showing a schematic configuration of an electronic device.

[0019] Figure 5 It is a plan view showing a schematic structure of a circuit board.

[0020] Figure 6 It is a perspective view showing a schematic structure of the casing.

[0021] Figure 7 It is a side view showing the schematic structure of the back of the housing.

[0022] Figure 8 It is a perspective view showing a schematic structure of an electronic device and a cooling plate.

[0023] Fig. 9 It is a perspective view showing a schematic structure of a sliding member.

[0024] Fig.10 It is a perspective view showing a schematic structure of a slider.

[0025] Fig.11 It is a perspective view showing a schematic structure of a slider.

[0026] Fig.12 It is a cross-sectional view showing a schematic structure of a sliding component.

[0027] Fig.13 It is a perspective view showing a holding structure of a cooling plate.

[0028] Fig.14 It is a perspective view showing a schematic structure of a holding member and a movable member.

[0029] Fig.15 It is a plan view showing the schematic structure of the holding member and the movable member.

[0030] Fig.16 It is a perspective view showing a schematic structure of a movable part.

[0031] Fig.17 It is a perspective view showing a schematic structure of a positioning member and a base substrate.

[0032] Fig.18 It is a perspective view showing a schematic structure of a positioning member.

[0033] Fig.19 yes Fig.18 Magnified view of section XIX.

[0034] Fig. 20 It is along Fig.19 Cross-sectional view of line XX-XX.

[0035] Fig.21 It is a perspective view showing the schematic structure of a positioning member, a base substrate, and an electronic device.

[0036] Fig. 22 It is an enlarged perspective view showing a schematic structure of a positioning member.

[0037] Fig.23 It is a perspective view showing a schematic structure of a positioning member, a base substrate, and a wiring substrate.

[0038] Fig.24 It is along Fig.23 A cross-sectional view of line XXIV-XXIV.

[0039] Fig.25 This is a conceptual diagram for explaining positioning by the second positioning unit.

[0040] Fig.26 This is a conceptual diagram for explaining positioning by the first positioning unit.

[0041] Fig. 27 This is a conceptual diagram for explaining the installation of electronic devices.

[0042] Fig.28This is a conceptual diagram for explaining the installation of electronic devices.

[0043] Fig.29 This is a conceptual diagram illustrating the disassembly of an electronic device.

[0044] Fig.30 It is a perspective view showing a holding member and a movable member according to a modified example. DETAILED DESCRIPTION

[0045] Hereinafter, the mode for implementing the present invention will be described with reference to the accompanying drawings. In addition, in the following, three directions orthogonal to each other are represented as the X direction, the Y direction, and the Z direction. In addition, one side of the X direction, namely X1, is set as the first outer direction, and the other side, namely X2, is set as the second outer direction. One side of the Y direction, namely Y1, is set as the installation direction, and the other side, namely Y2, is set as the extraction direction. One side of the Z direction, namely Z1, is set as the upper direction, and the other side, namely Z2, is set as the lower direction.

[0046] The Z direction is a direction orthogonal to the mounting direction Y1, and corresponds to the thickness direction of the electronic device 100. The Y direction corresponds to the thickness direction of the base substrate 600. In addition, the X direction may also be referred to as the left-right direction. In this case, the first outer direction X1 is set to the right direction, and the second outer direction X2 is set to the left direction. In addition, the thickness direction of the base substrate 600 is the same as the insertion direction of the substrate-to-substrate connector 611 and the substrate-to-substrate connector 113.

[0047] <Electronic Control Unit>

[0048] use Figure 1 to Figure 3 The overall structure of the electronic control device 1000 is described in detail. Figure 1 , Figure 3 As shown, the electronic control device 1000 includes the electronic device 100 , a heat conducting member 150 , a bracket 200 , a cooling member 300 , movable members 410 , 420 , a positioning structure 500 (positioning member 510 ), a base substrate 600 , and the like.

[0049] The electronic control device 1000 is configured to be mounted on a mobile object such as a vehicle. Examples of the vehicle include a gasoline vehicle, a diesel vehicle, a hybrid vehicle, an electric vehicle, a fuel cell vehicle, etc. In addition, the mobile object may be a flying object other than a vehicle.

[0050] Each electronic device 100 may also have a function as a control device. The electronic control device 1000 may also be called an integrated control device, a control device complex, or the like.

[0051] The electronic control device 1000 is stacked with a plurality of electronic devices 100 in the Z direction. Hereinafter, for two electronic devices 100 arranged adjacent to each other in the Z direction, the upper electronic device 100 is set as the upper electronic device, and the lower electronic device 100 is set as the lower electronic device. That is, among the two electronic devices 100, the electronic device 100 arranged relatively on the upper direction Z1 side is the upper electronic device, and the electronic device 100 arranged on the lower direction Z2 side is the lower electronic device.

[0052] The plurality of electronic devices 100 are configured to be mountable relative to the bracket 200. In addition, the plurality of electronic devices 100 are configured to be detachable from the bracket 200. The plurality of electronic devices 100 are mounted on the bracket 200 by moving in the mounting direction Y1. It can also be said that the plurality of electronic devices 100 are mounted on the bracket 200 by being inserted into the bracket 200. The plurality of electronic devices 100 are detachable from the bracket 200 by moving in the extraction direction Y2. That is, the electronic devices 100 are configured to be replaceable.

[0053] In addition, the electronic device 100 may also be referred to as a replaceable ECU, etc. ECU is an abbreviation of Electronic Control Unit.

[0054] The plurality of electronic devices 100 are electrically connected to the base substrate 600 when mounted on the bracket 200. The plurality of electronic devices 100 are mounted in an orthogonal direction relative to the base substrate 600. In addition, the orthogonal here includes a relationship in which each electronic device 100 is not orthogonal to the base substrate 600 with a certain degree of error. Therefore, it can also be said that the plurality of electronic devices 100 are mounted in a substantially orthogonal direction relative to the base substrate 600.

[0055] The state in which the electronic device 100 is mounted on the bracket 200 is referred to as the mounted state. In the mounted state, the electronic device 100 is fixed to the bracket 200. In addition, in the mounted state, the cooling plate 330 described later moves in the downward direction Z2. Furthermore, in the mounted state, the heat conducting member 150 is compressed from the electronic device 100 and the cooling plate 330.

[0056] The state in which the electronic device 100 is only inserted into the bracket 200 is called the inserted state. In the inserted state, the cooling plate 330 does not move in the downward direction Z2. The state in which the electronic device 100 is not installed in the bracket 200 is also called the non-installed state. In the non-installed state, the electronic device 100 is not inserted into the bracket 200. In addition, the electronic device 100 will be described in detail later.

[0057] like Figure 3 As shown, the stand 200 includes a stand side portion 210 , a stand front portion 220 , a stand upper portion 230 , a stand bottom portion 240 , a stand back portion 250 , etc. Furthermore, the stand 200 includes a holding member 260 .

[0058] The bracket 200 forms a housing by the bracket side portion 210, the bracket front portion 220 and the bracket back portion 250. The bracket 200 is provided with a bracket upper portion 230 and a bracket bottom portion 240 as a cover on the upper side and the lower side of the housing. The bracket upper portion 230 and the bracket bottom portion 240 are fixed to the housing by screw fixing, welding, etc. The bracket 200 forms an insertion space IN1 for configuring the electronic device 100 by the housing, the bracket upper portion 230 and the bracket bottom portion 240.

[0059] The bracket side portion 210 has two Z-direction side portions along the Z direction and a Y-direction side portion connecting the two Z-direction side portions along the Y direction. The Z-direction side portion and the Y-direction side portion are fixed by screwing, welding, etc. In addition, the bracket side portions 210 are arranged in pairs in a manner of sandwiching the electronic device 100 in the X direction. Furthermore, a part of the cooling component 300 is arranged between the two Z-direction side portions.

[0060] A holding member 260 is fixed to the bracket side portion 210. The holding member 260 is a portion that holds the movable members 410 and 420 in a state that is movable in the Z direction. That is, the movable members 410 and 420 are configured to be movable in the Z direction relative to the holding member 260. In addition, the movable members 410 and 420 are fixed to the cooling plate 330 of the cooling member 300. Therefore, the holding member 260 can also be said to be a portion that holds the cooling plate 330 in a state that is movable in the Z direction. The cooling plate 330 is configured to be movable in the Z direction together with the movable members 410 and 420.

[0061] The holding member 260 is provided independently for each electronic device 100. The movable members 410 and 420 are provided independently for each electronic device 100. The holding member 260 and the movable members 410 and 420 will be described in detail later.

[0062] The bracket front portion 220 has two Z-direction front portions along the Z direction and an X-direction front portion connecting the two Z-direction front portions along the X direction. The Z-direction front portion and the X-direction front portion are fixed by screwing, welding, etc. In addition, an insertion port IN2 for the electronic device 100 is formed between the two Z-direction front portions.

[0063] The bracket back 250 has two Z-direction backs along the Z direction and two X-direction backs connecting them along the X direction. The Z-direction back and the X-direction back are fixed by screwing, welding, etc. In addition, a part of the positioning structure 500 is arranged in the opening surrounded by the two Z-direction backs and the two X-direction backs.

[0064] In addition, if Fig.12As shown, a fixing portion 251 for fixing the push-back member 142 is provided on the bracket back 250. The fixing portion 251 is provided with an internal thread engaged with an external thread provided at the front end of the push-back member 142. In addition, the push-back member 142 will be described in detail later.

[0065] The bracket 200 has a four-layer structure capable of accommodating four electronic devices 100. However, the bracket 200 may also be configured to accommodate five or more electronic devices 100. In addition, the bracket 200 may also be configured to accommodate three or less electronic devices 100. That is, the bracket 200 may also be configured to accommodate only one electronic device 100. Therefore, the electronic control device 1000 may be a device having a plurality of electronic devices 100 or a device having only one electronic device 100.

[0066] like Figure 2 , Figure 3 As shown, the cooling member 300 includes an inflow portion 310, an outflow portion 320, a cooling plate 330, a back portion 340, and a cooling hose 350. The cooling member 300 is provided to cool the electronic device 100. The cooling member 300 is mainly used to cool the heat generating component 112 of the electronic device 100.

[0067] The cooling plate 330 is provided separately for each electronic device 100. The cooling member 300 includes four cooling plates 330. The four cooling plates 330 are stacked in the Z direction. One electronic device 100 is arranged between the cooling plates 330. The cooling plates 330 refer to the space between two cooling plates 330 adjacent to each other in the Z direction.

[0068] However, the number of cooling plates 330 is not limited to 4. The cooling member 300 only needs to include the same number of cooling plates 330 as the number of electronic devices 100 that can be accommodated in the rack 200 .

[0069] The cooling member 300 cools the electronic device 100 mainly through the cooling plate 330. The cooling plate 330 is mainly composed of a metal having a high thermal conductivity such as aluminum. The cooling plate 330 forms a refrigerant space through which a liquid refrigerant such as cooling water flows.

[0070] The electronic device 100 to be cooled is arranged opposite to the surface on the lower side of the cooling plate 330 in the direction Z2. Therefore, the electronic control device 1000 is sequentially arranged with the cooling plate 330 and the electronic device 100 to be cooled by the cooling plate 330 in the lower direction Z2. That is, the cooling plate 330 is arranged in the opposite direction of the gravity direction to the electronic device 100 to be cooled. Thus, the cooling plate 330 can suppress the generation of an air layer between the liquid refrigerant and the electronic device 100.

[0071] In addition, if Figure 2 As shown, the surface on the lower side of the cooling plate 330 in the direction Z2 is the opposing surface SF4. On the other hand, the surface of the electronic device 100 that is opposite to the cooling plate 330 is the opposing surface SF1. The opposing surface SF1 is the surface on the upper side of the electronic device 100 in the direction Z1. Therefore, when the electronic device 100 and the cooling plate 330 are installed, the opposing surface SF1 and the opposing surface SF4 are arranged to be opposite to each other. The opposing surfaces SF1 and SF4 are, for example, flat surfaces.

[0072] The cooling plate 330 is provided with an inflow portion 310 on one side in the X direction and an outflow portion 320 on the other side. Liquid refrigerant flows into the refrigerant space from the inflow portion 310, flows in the refrigerant space, and is discharged from the outflow portion 320. The positional relationship between the inflow portion 310 and the outflow portion 320 may be reversed.

[0073] The inflow portion 310 and the outflow portion 320 have a refrigerant flow path through which the liquid refrigerant flows. A cooling hose 350 having a refrigerant flow path is attached to the inflow portion 310 and the outflow portion 320 .

[0074] The cooling hose 350 is attached to the inlet 310 and the outlet 320 of each cooling plate 330. One end of the cooling hose 350 is attached to the inlet 310 or the outlet 320, and the other end is attached to the back portion 340. The back portion 340 has a refrigerant flow path through which the liquid refrigerant supplied to the cooling plate 330 flows, and a refrigerant flow path through which the liquid refrigerant discharged from the cooling plate 330 flows.

[0075] Furthermore, if Figure 3 As shown, movable members 410 and 420 are mounted at four corners of the cooling plate 330. The movable members 410 and 420 are mounted at both ends of the cooling plate 330 in the X direction and in the front-back direction of the Y direction. The movable members 410 and 420 are fixed to the cooling plate 330 by screws, welding, or the like.

[0076] As described above, the cooling plate 330 is configured to be movable in the Z direction. That is, the cooling plate 330 is movable in the Z direction relative to the bracket 200 (holding member 260). In addition, it can also be said that the cooling plate 330 is mounted on the bracket 200 in a state of being movable in the thickness direction Z orthogonal to the mounting direction Y1. Therefore, the cooling hose 350 is composed of a deformable member such as rubber.

[0077] In addition, the movable members 410 and 420 are mounted on the bracket 200 at positions sandwiching the electronic device 100. The movable members 410 and 420 have protrusions 417 and 427 protruding toward the electronic device 100. The movable members 410 and 420 will be described in detail later.

[0078] like Figure 2, Figure 3 As shown, the back surface portion 340 is mounted on the inner side of the mounting direction Y1 of the bracket 200. In addition, the back surface portion 340 is mounted on the bracket 200 with the positioning member 510 and the base substrate 600 disposed between the back surface portion 340 and the bracket back 250.

[0079] The positioning member 510 is disposed between the base substrate 600 and the plurality of electronic devices 100. The positioning member 510 is a member for positioning the substrate-to-substrate connector 611 of the base substrate 600 and the substrate-to-substrate connector 113 of the electronic device 100. The positioning member 510 and the base substrate 600 will be described in detail later. The electronic control device 1000 may not include the positioning member 510 and the base substrate 600. The substrate-to-substrate connector 611 is equivalent to the first connector. The substrate-to-substrate connector 113 is equivalent to the second connector.

[0080] In addition, if Figure 2 As shown, the heat conducting member 150 is provided in contact with the electronic device 100 in the non-installed state and the inserted state. That is, the heat conducting member 150 is not in contact with the cooling plate 330 in the non-installed state and the inserted state. The heat conducting member 150 is provided separately for each electronic device 100. In addition, the heat conducting member 150 is sometimes also referred to as TIM (Thermal Interface Material).

[0081] In addition, the heat conducting member 150 is arranged between the electronic device 100 and the cooling plate 330 in the mounted state. Furthermore, the heat conducting member 150 is also in contact with the cooling plate 330 in the mounted state. Therefore, the heat conducting member 150 is arranged in contact with the facing surfaces SF1 and SF4. The heat conducting member 150 is pressed (compressed) from the electronic device 100 and the cooling plate 330 in the mounted state. In addition, the heat conducting member 150 is arranged between the cooling plate 330 and the electronic device 100 which is the cooling target of the cooling plate 330.

[0082] The heat conducting member 150 is a member for facilitating heat transfer of the electronic device 100 to the cooling plate 330. In addition, the heat conducting member 150 can also be said to be a member for reducing the thermal resistance between the electronic device 100 and the cooling plate 330. The heat conducting member 150 is a sheet-like member that can be elastically deformed. In addition, the heat conducting member 150 can also be made of gel, grease, etc. The heat conducting member 150 will be described in detail later.

[0083] <Electronic Devices>

[0084] use Figures 4 to 8 The electronic devices 100 are described. Each electronic device 100 has the same configuration. However, the circuit configuration and processing contents of each electronic device 100 are different. Figure 4 , Figure 5 As shown, the electronic device 100 includes a circuit board 110 and a housing for housing the circuit board 110 .

[0085] The circuit substrate 110 includes a wiring substrate 111, a heat generating component 112 as an electronic component, a substrate-to-substrate connector 113, and an external connector 114. The wiring substrate 111 is provided with conductive wiring on an electrically insulating substrate such as resin. The wiring substrate 111 has a surface SF2 and a surface SF3 opposite to the surface SF2. The wiring substrate 111 is a so-called printed substrate. The wiring substrate 111 is arranged along the XY plane in the installed state. The XY plane is a plane defined by an X-axis extending along the X direction and a Y-axis extending along the Y direction.

[0086] Circuit elements including a heat generating component 112 are mounted on the wiring substrate 111. The circuit elements are electrically connected to the wiring of the wiring substrate 111. The heat generating component 112 is a circuit element that generates heat due to operation. The heat generating component 112 is a semiconductor switching element such as SoC (System on a chip), MOSFET, IGBT, etc. In addition, the wiring substrate 111 may also be mounted with circuit elements other than the heat generating component 112.

[0087] The heat generating component 112 is mounted on, for example, a surface of the wiring substrate 111 that faces the facing surface SF1. This is preferred because the heat generating component 112 can be efficiently cooled.

[0088] The wiring substrate 111 is provided with a substrate-to-substrate connector 113 for electrical connection with the base substrate 600. The substrate-to-substrate connector 113 is electrically connected to the wiring and circuit elements of the wiring substrate 111. The substrate-to-substrate connector 113 is electrically connected to the substrate-to-substrate connector 611 of the base substrate 600. The substrate-to-substrate connectors 113 and 611 are sometimes referred to as substrate-to-substrate connectors (BtoB). In addition, one of the substrate-to-substrate connectors 113 and 611 is inserted into the other to be electrically connected.

[0089] For example, the inter-substrate connectors 113 and 611 can be floating connectors. In this case, at least one of the inter-substrate connectors 113 and 611 has a floating mechanism that is movable in two directions orthogonal to the connection direction. Thus, even if the inter-substrate connectors 113 and 611 are displaced during connection, the displaced position can be absorbed. In addition, the connection direction of the inter-substrate connectors 113 and 611 is the Y direction.

[0090] An external connector 114 for electrically connecting to an external device provided outside the electronic control device 1000 is mounted on the wiring substrate 111. The external connector 114 is electrically connected to wirings and circuit elements of the wiring substrate 111.

[0091] The wiring substrate 111 is provided with a positioning slit 115. The positioning slit 115 is provided for positioning the inter-substrate connectors 113 and 611 in the X direction. The positioning slit 115 corresponds to a second positioning hole.

[0092] In the positioning slit 115 , at least in the mounted state, the first positioning portion 530 of the positioning member 510 is disposed. When the electronic device 100 is moved in the mounting direction Y1 , the first positioning portion 530 of the positioning member 510 gradually enters the positioning slit 115 .

[0093] The positioning slit 115 is provided along the planar direction of the wiring substrate 111. The positioning slit 115 is a hole that penetrates in the plate thickness direction (Z direction) of the wiring substrate 111. In addition, the positioning slit 115 has an opening on one side wall of the wiring substrate 111. The positioning slit 115 can also be said to be a cutout provided along the installation direction Y1. In addition, a chamfered portion 115a is provided at the opening end of the positioning slit 115. Therefore, the positioning component 510 can easily enter the positioning slit 115. In addition, the plate thickness direction of the wiring substrate 111 is equivalent to the interval between one surface SF2 and the opposite surface SF3. The planar direction of the wiring substrate 111 is the same as the insertion direction of the inter-board connector 611 and the inter-substrate connector 113.

[0094] like Figure 4 , Figure 6 , Figure 7 As shown, the housing includes a base 120 on which a circuit substrate 110 is mounted, and a cover covering the circuit substrate 110. The circuit substrate 110 is fixed to the base 120 by screws, adhesives, etc. The housing forms a storage space for the circuit substrate 110 by assembling the base 120 and the cover. The base 120 and the cover are fixed by screws, adhesives, etc. The housing is equivalent to a casing.

[0095] The cover includes a housing upper portion 130, a guide holding portion 131, a disassembly opening 132, a housing back 133, and a screw hole 134. The cover is provided in a concave shape so as to cover the circuit substrate 110. The housing upper portion 130 is arranged opposite to one surface SF2 of the wiring substrate 111. The base 120 is arranged opposite to the opposite surface SF3.

[0096] Furthermore, the housing upper portion 130 includes a portion facing the heat generating component 112. The surface of the housing upper portion 130 is a facing surface SF1. Figure 8 As shown, in the mounted state, the electronic device 100 has a cooling plate 330 disposed on the facing surface SF1.

[0097] like Figure 4 , Figure 6As shown, the guide holding portion 131 is connected to the upper portion 130 of the housing. The guide holding portion 131 is provided at both ends of the cover in the X direction. The guide holding portion 131 constitutes the side wall of the cover along the Y direction. The guide holding portion 131 is a groove for configuring the sliding member 140. The electronic device 100 is provided with the sliding member 140 at both ends in the X direction. The guide holding portion 131 can also be said to be a sliding holding portion.

[0098] In addition, the sliding member 140 includes a slider 141. Therefore, it can be said that the slider 141 is disposed in the guide holding portion 131. The sliding member 140 will be described in detail later.

[0099] The guide holding portion 131 is provided with a disassembly opening 132 at the end in the Y direction. The disassembly opening 132 is an opening for exposing the push-back member 142 of the slide member 140. That is, the disassembly opening 132 is provided so that one end of the push-back member 142 is exposed to the outside of the cover.

[0100] like Figure 7 As shown, the housing back 133 is a side wall on the Y direction side. The housing back 133 is connected to the housing upper part 130. In addition, Figure 7 The state where the circuit board 110 is accommodated in the casing is shown.

[0101] The housing back 133 is provided with a first opening 133a, a second opening 133b, and a connection opening 133c. Each of the openings 133a to 133c is a hole that penetrates the housing back 133 in the plate thickness direction. Figure 7 In the figure, the wiring substrate 111 can be seen from each of the openings 133a to 133c.

[0102] The first opening 133a is an opening for arranging the first positioning portion 530 of the positioning member 510 at least in the mounted state. The first opening 133a is an opening for arranging the first positioning portion 530 of the positioning member 510 arranged outside the electronic device 100 to the storage space side.

[0103] The second opening 133b is an opening for arranging a part of the second positioning part 540 at least in the mounted state. The second opening 133b is an opening for arranging a part of the second positioning part 540 of the positioning member 510 arranged outside the electronic device 100 on the storage space side.

[0104] The connection opening 133c is an opening for connecting the substrate-to-substrate connectors 113 and 611. That is, the connection opening 133c is a mechanism for connecting the substrate-to-substrate connector 113 of the circuit substrate 110 disposed in the storage space and the substrate-to-substrate connector 611 of the base substrate 600 disposed outside the electronic device 100. The connection opening 133c is configured to accommodate at least one of the substrate-to-substrate connectors 113 and 611 in the mounted state.

[0105] The screw hole 134 is a hole for inserting a fixing screw 1 for fixing the electronic device 100 to the bracket 200. The electronic device 100 is fixed to the bracket 200 by the fixing screw 1 and the push-back member 142 in the mounted state. The method of fixing the electronic device 100 to the bracket 200 is not limited to the above.

[0106] <Sliding Parts>

[0107] use Figure 4 , Figure 6 , Figures 9 to 12 The sliding member 140 will be described. Figure 4 , Figure 6 As shown, the sliding members 140 are arranged in pairs at both ends of the cover in the X direction. That is, the electronic device 100 includes two sliding members 140. In addition, the electronic device 100 is arranged in pairs with a sliding member 140 arranged on the first outer direction X1 side and a sliding member 140 arranged on the second outer direction X2 side.

[0108] The sliding member 140 includes a slider 141, a push-back member 142, a slider holder 143, a slider cover 144, etc. The slider 141 is equivalent to a guide member. Figures 9 to 11 , the slider 141 is arranged on the first outer direction X1 side of the electronic device 100. That is, Figures 9 to 11 The slider 141 is shown arranged in the right direction.

[0109] like Fig. 9 As shown, the slider 141 is mounted on the slider holder 143. The slider 141 is arranged on the guide holding portion 131 in a state of being mounted on the slider holder 143. In addition, the slider 141 is held by the slider cover 144 so as not to be separated from the guide holding portion 131.

[0110] The slider 141 is configured to be movable in the mounting direction Y1. The slider 141 is movable in the mounting direction Y1 when arranged in the guide holder 131. The slider 141 is movable in the Y direction relative to the slider holder 143 and the housing (housing upper portion 130, etc.).

[0111] like Fig.10 , Fig.11As shown, the slider 141 is formed by, for example, stamping a plate-shaped member mainly composed of metal. The slider 141 mainly includes side wall portions 141c, 141d, and 141h facing each other, and a connecting portion 141a connected to the side wall portions 141c, 141d, and 141h. In addition, the side wall portions 141c, 141d, and 141h are portions along the YZ plane. On the other hand, the connecting portion 141a is a portion along the XY plane. The YZ plane is a plane defined by the Y axis and the Z axis extending along the Z direction.

[0112] The side wall portions 141c and 141d are provided on one end side of the connection portion 141a. The side wall portion 141h is provided on the other end side of the connection portion 141a. Therefore, the side wall portions 141c and 141d are arranged to face the side wall portion 141h.

[0113] The side wall portion 141c is disposed further back than the side wall portion 141d when the electronic device 100 is disposed in the insertion space IN1. Therefore, it can be said that the side wall portion 141c is disposed further to the mounting direction Y1 side than the side wall portion 141d.

[0114] The side wall portion 141d is provided via an extended portion 141b provided on a portion of the connecting portion 141a. The extended portion 141b is a portion of the connecting portion 141a extending in the first outer direction X1. The extended portion 141b is provided in order to arrange the side wall portion 141d at a position closer to the first outer direction X1 than the side wall portion 141c. Therefore, the side wall portion 141d is located at a position closer to the first outer direction X1 than the side wall portion 141c. In addition, the interval between the side wall portion 141h and the side wall portion 141d is wider than the interval between the side wall portion 141h and the side wall portion 141c. In addition, the interval here is the distance in the X direction.

[0115] The slider 141 disposed in the left direction has the same structure as the slider 141 disposed in the right direction. However, the slider 141 disposed in the left direction is provided with an extended portion 141b in order to dispose the side wall portion 141d at a position closer to the second outer direction X2 than the side wall portion 141c. Therefore, the side wall portion 141d is located at a position closer to the second outer direction X2 than the side wall portion 141c.

[0116] Furthermore, guide grooves 141e and 141f are provided along the mounting direction Y1 in the side wall portions 141c and 141d. The guide grooves 141e and 141f can be said to be cutouts penetrating in the plate thickness direction of the slider 141. The guide grooves 141e and 141f are grooves in which the protrusions 417 and 427 of the movable members 410 and 420 described later are arranged. In addition, the guide grooves 141e and 141f are grooves in which the protrusions 417 and 427 can move (slide). That is, the slider 141 can move in the Y direction in a state where the protrusions 417 and 427 are arranged in the guide grooves 141e and 141f.

[0117] The ends of the guide grooves 141e and 141f on the installation direction Y1 side are open. That is, the guide grooves 141e and 141f are grooves provided with openings 141f1 and 141e1 on the installation direction Y1 side. In the process of installing the electronic device 100 on the bracket 200, the protrusions 417 and 427 enter from the open ends of the guide grooves 141e and 141f of the slider 141. The guide grooves 141e and 141f can be said to be slits, cutouts, etc. for guidance.

[0118] In addition, the side wall portions 141c and 141d are formed with openings 141f1 and 141e1 in such a manner that the opening width becomes wider as it approaches the mounting direction Y1 side. In addition, it can be said that the opening width of the guide grooves 141e and 141f of the slider 141 gradually becomes wider as it approaches the open end. Therefore, the protrusions 417 and 427 easily enter the guide grooves 141e and 141f.

[0119] The guide grooves 141e and 141f include inclined portions SL11 and SL14 inclined relative to the installation direction Y1. The inclined portions SL11 and SL14 are inclined in such a manner that the installation direction Y1 side is in the upper direction Z1 than the removal direction Y2 side. The inclined portions SL11 and SL14 are portions for pulling the cooling plate 330 to the electronic device 100 side. That is, the inclined portions SL11 and SL14 are portions for pulling the cooling plate 330 to the electronic device 100 side when the electronic device 100 is installed on the bracket 200. In addition, the inclined portions SL11 and SL14 are portions for pulling the cooling plate 330 away from the electronic device 100 when the electronic device 100 is removed from the bracket 200. This will be described in detail later.

[0120] The guide grooves 141e and 141f include holding portions SL12 and SL15 at the ends on the opposite side of the mounting direction Y1. The holding portions SL12 and SL15 are portions that hold the protrusions 417 and 427. Thus, the guide grooves 141e and 141f are grooves that extend from the openings 141f1 and 141e1 to the holding portions SL12 and SL15.

[0121] Furthermore, the guide grooves 141e and 141f include flat portions SL10 and SL13 between the open openings 141e1 and 141f1 and the inclined portions SL11 and SL14. The flat portions SL10 and SL13 are provided along the mounting direction Y1.

[0122] Here, use Fig.10 , Fig.11 The guide grooves 141e and 141f are described in detail. The slider 141 is provided with a first guide groove 141e and a second guide groove 141f as guide grooves. In addition, the first movable member 410 described later includes a first protrusion 417. On the other hand, the second movable member 420 includes a second protrusion 427. The first guide groove 141e is a groove in which the first protrusion 417 is arranged. The second guide groove 141f is a groove in which the second protrusion 427 is arranged.

[0123] The side wall portion 141c is formed with a first guide groove 141e. The flat portion SL10 is formed between the first guide surfaces SF10 and SF20. The first guide surfaces SF10 and SF20 are surfaces facing each other and along the Y direction. The first guide surfaces SF10 and SF20 are, for example, flat surfaces. The opening width of the flat portion SL10 is equivalent to the distance between the first guide surfaces SF10 and SF20.

[0124] The inclined portion SL11 is formed between the first inclined surfaces SF11 and SF21. The first inclined surfaces SF11 and SF21 are surfaces that are opposite to each other and inclined relative to the Y direction. The inclined portion SL11 is inclined toward the upward direction Z1 as it approaches the mounting direction Y1. The opening width of the inclined portion SL11 is equivalent to the distance between the first inclined surfaces SF11 and SF21.

[0125] The holding portion SL12 is formed between the first holding surfaces SF12 and SF22. The first holding surfaces SF12 and SF22 are surfaces that are opposite to each other and are along the Y direction. In addition, the holding portion SL12 may also include a surface connected to the first holding surface SF12 and the first holding surface SF22. The surface connected to the first holding surfaces SF12 and SF22 is the inside of the first guide groove 141e. The holding portion SL12 is located at a position in the direction Z2 below the flat portion SL10.

[0126] The opening width of the holding portion SL12 corresponds to the distance between the first holding surfaces SF12 and SF22. The opening widths of the flat portion SL10, the inclined portion SL11, and the holding portion SL12 correspond to the opening width of the first guide groove 141e.

[0127] The side wall portion 141d is formed with a second guide groove 141f. The flat portion SL13 is formed between the second guide surfaces SF13 and SF23. The second guide surfaces SF13 and SF23 are surfaces that face each other and extend along the Y direction. The second guide surfaces SF13 and SF23 are, for example, flat surfaces. The opening width of the flat portion SL13 is equivalent to the distance between the second guide surfaces SF13 and SF23.

[0128] The inclined portion SL14 is formed between the second inclined surfaces SF14 and SF24. The second inclined surfaces SF14 and SF24 are surfaces that are opposite to each other and inclined relative to the Y direction. The inclined portion SL14 is inclined toward the upward direction Z1 as it approaches the mounting direction Y1. The opening width of the inclined portion SL14 is equivalent to the distance between the second inclined surfaces SF14 and SF24.

[0129] The holding portion SL15 is formed between the second holding surfaces SF15 and SF25. The second holding surfaces SF15 and SF25 are surfaces that are opposite to each other and are along the Y direction. In addition, the holding portion SL15 may also include a surface connected to the second holding surface SF15 and the second holding surface SF25. The surface connected to the second holding surfaces SF15 and SF25 is the inside of the second guide groove 141f. The holding portion SL15 is located at a position lower than the flat portion SL13 in the direction Z2.

[0130] The opening width of the holding portion SL15 corresponds to the distance between the second holding surfaces SF15 and SF25. The opening widths of the flat portion SL13, the inclined portion SL14, and the holding portion SL15 correspond to the opening width of the second guide groove 141f.

[0131] The opening width of each guide groove 141e, 141f is set according to the diameter (thickness) of the protrusions 417, 427. That is, the opening width of each guide groove 141e, 141f is the size that the corresponding protrusion 417, 427 can move. Although it will be described later, the first protrusion 417 is set to be thicker than the second protrusion 427. Therefore, the opening width of the first guide groove 141e is wider than the opening width of the second guide groove 141f. However, if the protrusions 417, 427 have the same thickness, the opening widths of each guide groove 141e, 141f may also be the same.

[0132] As described above, the side wall portion 141c is disposed on the mounting direction Y1 side relative to the side wall portion 141d. Therefore, when the electronic device 100 is mounted on the bracket 200, the first guide groove 141e is inserted into the insertion space IN1 before the second guide groove 141f.

[0133] In addition, the first guide groove 141e and the second guide groove 141f are provided at different positions in the Y direction. The first guide groove 141e is arranged at a position closer to the inner side of the installation direction Y1 than the second guide groove 141f. Therefore, the first guide groove 141e can be said to be a guide groove arranged at the inner side of the installation direction Y1. On the other hand, the second guide groove 141f can be said to be a guide groove arranged at the near front side of the installation direction Y1.

[0134] In this way, the electronic device 100 is provided with two guide grooves 141e and 141f at one end side in the X direction, and two guide grooves 141e and 141f at the other end side. As a result, the electronic device 100 can move the cooling plate 330 in the Z direction with good balance. It can also be said that the electronic device 100 can move the cooling plate 330 while maintaining the positional relationship of the opposing surface SF1 and the opposing surface SF4 being parallel.

[0135] In addition, the imaginary center line of the flat portion SL10 coincides with the imaginary center line of the flat portion SL13 in the Z direction. The imaginary center line of the holding portion SL12 coincides with the imaginary center line of the holding portion SL15 in the Z direction. Each imaginary center line is an imaginary straight line that passes through the center of each portion SL10, SL12, SL13, SL15 in the Z direction and is along the Y direction.

[0136] like Fig. 9 As shown in FIG. 1 and FIG. 2 , the push-back member 142 is disposed in a space sandwiched between the side wall portions 141c and 141d and the side wall portion 141h. The push-back member 142 is provided to push back the slider 141 when the electronic device 100 is disassembled. Fig.12 As shown, the push-back member 142 includes a rod-shaped portion 142 a and a flange portion 142 b protruding from the rod-shaped portion 142 a .

[0137] On the other hand, the slider 141 is provided with a pressed portion 141g at the end portion on the mounting direction Y1 side. As the push-back member 142 moves in the extraction direction Y2, the pressed portion 141g is pressed by the flange portion 142b in the extraction direction Y2. As the pressed portion 141g is pressed, the slider 141 moves in the extraction direction Y2.

[0138] In addition, the electronic device 100 may include an elastically deformable member such as a spring instead of the push-back member 142. That is, the electronic device 100 only needs to include a mechanism for moving the slider 141 in the extraction direction Y2.

[0139] In addition, the push-back member 142 is also used to fix the electronic device 100 relative to the bracket 200. The rod-shaped portion 142a is provided with an external thread at the front end of the flange portion 142b side. The external thread engages with the internal thread of the fixing portion 251 provided on the bracket back 250. That is, the rod-shaped portion 142a is screwed and fixed to the fixing portion 251 in a state where the housing back 133 is arranged between the flange portion 142b and the bracket back 250.

[0140] Thus, the push-back member 142 is fixed to the bracket back 250. Also, by fixing the push-back member 142 to the bracket back 250, the electronic device 100 is fixed to the bracket 200. In addition, the electronic device 100 is fixed to the bracket 200 by the push-back member 142 and the fixing screw 1.

[0141] However, the push-back component 142 may not have a mechanism for fixing the electronic device 100 and the bracket 200 .

[0142] <Holding parts and movable parts>

[0143] Next, use Figure 3 , Figure 13 to Figure 16 The holding member 260 and the movable members 410 and 420 are described in detail. Figure 3 The holding member 260 and the movable members 410 and 420 are shown in a simplified manner. Fig.16 This shows a state where the holding member 260 is not mounted.

[0144] The first movable member 410 and the second movable member 420 have many common features. Therefore, the common features will be described using the first movable member 410 or the second movable member 420.

[0145] exist Fig.15 In order to simplify the drawing, only a portion of the holding member 260 and the second movable member 420 are shown. The first movable member 410 includes a sliding portion that is the same as the sliding portion 426. In addition, the first movable member 410 includes a spring receiving surface that is the same as the spring receiving surface 425a.

[0146] First, the retaining member 260 will be described. Fig.13 , Fig.16 As shown, the holding member 260 is provided at multiple locations of the bracket side portion 210. The holding member 260 is fixed to the bracket side portion 210 by screws, welding, or the like.

[0147] The holding member 260 is provided separately for the plurality of movable members 410 and 420. Therefore, the number of the holding members 260 is the same as the number of the movable members 410 and 420. The holding member 260 is provided at four locations for one electronic device 100. Figure 3As shown, four retaining members 260 are provided on each layer of the bracket 200 .

[0148] like Fig.14 As shown, the holding member 260 includes a holding base 261 and holding side portions 262 provided at both ends of the holding base 261. That is, the holding side portions 262 are provided on both sides of the holding base 261 in the Y direction. The holding base 261 and the two holding side portions 262 are provided as an integral body, for example.

[0149] like Fig.15 As shown, the holding side portion 262 is provided with a slit 263 in order to hold the second movable member 420 in a state where it can move in the Z direction. A sliding portion 426 as a part of the second movable member 420 is arranged in the slit 263. The second movable member 420 can move in the Z direction in a state where the sliding portion 426 is arranged in the slit 263. That is, the sliding portion 426 can slide in the Z direction in the slit 263.

[0150] like Fig.14 , Fig.15 As shown, the recess 264 is a bottomed hole with an opening in the upper direction Z1. A spring member SP1 mainly composed of metal is arranged in the recess 264. However, the spring member SP1 is not limited to a member mainly composed of metal. The spring member SP1 is equivalent to a force applying part and an elastic member. The force applying part may also be made of rubber or the like.

[0151] like Fig.15 As shown, the spring component SP1 is arranged between the second movable component 420 provided corresponding to the upper electronic device and the retaining component 260 provided corresponding to the lower electronic device. It can also be said that the retaining component 260 provided corresponding to the lower electronic device has a recessed portion 254 for configuring the spring component SP1. The second movable component 420 provided corresponding to the upper electronic device has a spring receiving surface 425a in contact with the spring component SP1. The spring component SP1 is elastically deformed between the retaining component 260 and the second movable component 420. The spring component SP1 always applies stress to the second movable component 420 in the direction of separation of the electronic device 100 and the cooling plate 330. The direction of separation is equivalent to the Z1 direction.

[0152] In addition, the uppermost holding member 260 in the upward direction Z1 may not be provided with the recessed portion 264. In addition, the uppermost holding member 260 may not be provided with the spring member SP1 in the recessed portion 264.

[0153] like Fig.14 , Fig.15As shown, the holding member 260 is provided with a recessed portion 264 on each holding side portion 262. Therefore, the spring member SP1 is arranged on both sides of the holding base 261 in the Y direction. In addition, it can also be said that the holding member 260 is provided with a recessed portion 264 on both sides of the second protrusion 427 in the mounting direction Y1. Therefore, it can also be said that the spring member SP1 is provided on both sides of the protrusions 417 and 427 in the mounting direction Y1.

[0154] The spring member SP1 is a member that presses the second movable member 420 in the upward direction Z1. The upward direction Z1 corresponds to the opposite direction of the pressing direction of the cooling plate 330 pressing the heat conductive member 150. Therefore, the pressing direction here is the downward direction Z2.

[0155] The spring component SP1 is provided to maintain the position of the second movable component 420 in the Z direction in the non-installed state. That is, since the electronic control device 1000 includes the spring component SP1, it is easy to maintain the second movable component 420 in a predetermined position. As a result, it is easy to insert the electronic device 100 into the insertion space IN1. In other words, the electronic control device 1000 is such that when the electronic device 100 is installed, it is easy to make the positions of the guide grooves 141e and 141f in the Z direction coincide with the positions of the protrusions 417 and 427. In addition, when the electronic control device 100 is installed on the bracket 200, it is easy to arrange the protrusions 417 and 427 in the guide grooves 141e and 141f, which can improve the mountability of the electronic device 100 relative to the bracket 200.

[0156] Furthermore, the spring member SP1 is pressed in the downward direction Z2 by the spring receiving surface 425a in the mounted state. This is because the second movable member 420 moves in the downward direction Z2 in the mounted state. This will be described in detail later.

[0157] In addition, if Fig.30 As shown, the holding member 260 may be provided in common to the plurality of movable members 410 and 420. That is, the holding member 260 is provided in common to the plurality of first movable members 410 arranged in the Z direction. In addition, the holding member 260 is provided in common to the plurality of second movable members 420 arranged in the Z direction.

[0158] In this case, the plurality of first movable members 410 arranged in the Z direction are mounted on the holding member 260 while sliding in the Z direction, for example. Therefore, the plurality of first movable members 410 arranged in the Z direction preferably have different sizes in the Y direction. Fig.30 In FIG. 4 , as an example, the size of the plurality of first movable members 410 in the Y direction increases as it goes toward the downward direction Z2. The same is true for the plurality of second movable members 420.

[0159] Next, the movable members 410 and 420 will be described. Fig.14 A state in which the cooling plate 330 is not installed is shown.

[0160] like Figure 3 As shown, the movable parts 410 and 420 are installed at the four corners of the cooling plate 330. Therefore, four movable parts 410 and 420 are arranged on each layer of the bracket 200. In addition, two first movable parts 410 and two second movable parts 420 are installed on the cooling plate 330. Fig.14 As shown, the first movable member 410 is arranged at a position further back than the second movable member 420 in the mounting direction Y1.

[0161] like Fig.14 , Fig.15 , Fig.16 As shown, the first movable member 410 includes a movable base 411 and movable side portions 412 provided at both ends of the movable base 411. That is, the movable side portions 412 are provided on both sides of the movable base 411 in the Y direction. The movable base 411 and the two movable side portions 412 are provided as an integral body, for example.

[0162] The movable base 411 includes a cooling fixing portion 413 and a first protrusion 417. The cooling fixing portion 413 is a portion fixed to the cooling plate 330. The cooling fixing portion 413 and the cooling plate 330 are fixed by screwing, welding, or the like.

[0163] The first protrusion 417 is a portion that protrudes in the X direction relative to the movable base 411. The first protrusion 417 disposed in the right direction protrudes in the second outer direction X2. The first protrusion 417 disposed in the left direction protrudes in the first outer direction X1. The first protrusion 417 has a cylindrical shape.

[0164] The first protrusion 417 is provided corresponding to the first guide groove 141e. The movable members 410 and 420 fixed to one cooling plate 330 have the same number of protrusions 417 and 427 as the guide grooves 141e and 141f provided in one electronic device 100.

[0165] In addition, the first protrusion 417 is configured as a separate body from the movable base 411. And, the first protrusion 417 is attached to the movable base 411. However, the first protrusion 417 may be configured as an integral body with the movable base 411.

[0166] like Fig.14 , Fig.16As shown, the movable side portion 412 includes a cooling pressing portion 414 and a spring receiving portion 415. The cooling pressing portion 414 is provided at the end portion of the movable side portion 412 on the upper direction Z1 side. The cooling pressing portion 414 is in contact with the pressing auxiliary portion 331 of the cooling plate 330. As described above, the first movable component 410 moves the cooling plate 330 in the downward direction Z2 while being fixed to the cooling plate 330. That is, the first movable component 410 presses the cooling plate 330 in the downward direction Z2. The cooling pressing portion 414 is a portion that assists in the pressing. By including the cooling pressing portion 414, the first movable component 410 can increase the pressing force on the cooling plate 330 in the downward direction Z2. However, the first movable component 410 may not include the cooling pressing portion 414.

[0167] The second movable member 420 includes a movable base 421 and movable side portions 422 provided at both ends of the movable base 421. The movable base 421 includes a cooling fixing portion 423 and a second protrusion 427. The second protrusion 427 is provided corresponding to the second guide groove 141f.

[0168] The movable side portion 422 includes a cooling pressing portion 424, a spring receiving portion 425, and a sliding portion 426. As described above, the spring receiving portion 425 has a spring receiving surface 425a. As described above, the sliding portion 426 is a portion disposed in the slit 263. In addition, the sliding portion 426 is a portion that slides in the Z direction in the slit 263. In addition, the sliding portion 426 can also be said to be a flat plate portion that is disposed in the slit 263 and can move in the slit 263.

[0169] like Fig.14 As shown, the first protrusion 417 is longer than the second protrusion 427. In other words, the second protrusion 427 arranged on the front side of the installation direction Y1 is shorter than the first protrusion 417 arranged on the back side of the installation direction Y1. As a result, the electronic control device 1000 can insert the electronic device 100 while suppressing the contact between the sliding member 140 and the second protrusion 427. That is, the electronic control device 1000 can improve the guidance when inserting the electronic device 100 into the insertion space IN1. In addition, the guidance can also be said to be insertion performance and installation performance.

[0170] However, the first protrusion 417 and the second protrusion 427 are subjected to force from the slider 141 when the cooling plate 330 is pressed downward in the downward direction Z2. This force is also applied to the boundary portion between the first protrusion 417 and the movable base 411 and the boundary portion between the second protrusion 427 and the movable base 421. In addition, as described above, the first protrusion 417 is longer than the second protrusion 427. Therefore, the force applied to the boundary portion between the first protrusion 417 and the movable base 411 is greater than the force applied to the boundary portion between the second protrusion 427 and the movable base 421.

[0171] Therefore, if Fig.14 As shown, the diameter of the first protrusion 417 is larger than the diameter of the second protrusion 427. This can improve the strength of the boundary portion between the first protrusion 417 and the movable base 411. However, the first protrusion 417 may have the same diameter as the second protrusion 427 as long as the strength can be ensured.

[0172] <Positioning components and base substrate>

[0173] use Figures 17 to 26 The positioning member 510 and the base substrate 600 are described. Fig.23 In order to easily understand the relationship between the positioning member 510 and the wiring substrate 111, only one positioning member 510 is shown, and only one wiring substrate 111 is shown. In addition, for the same reason, the housing of the electronic device 100 is omitted. Fig.25 , Fig.26 In the figure, the inter-substrate connectors 113 and 611 are simplified.

[0174] First, use Fig.17 , Fig.21 , Fig.23 etc. to explain the base substrate 600. The base substrate 600 includes a wiring substrate 610 and an inter-substrate connector 611, etc. The wiring substrate 610 is provided with conductive wiring on an electrically insulating substrate such as resin. The wiring substrate 610 is a so-called printed substrate. The wiring substrate 610 is arranged along the XZ plane when electrically connected to the electronic device 100. The XZ plane is a plane defined by the X-axis and the Z-axis. The state in which the wiring substrate 610 is electrically connected to the electronic device 100 is called the inter-substrate connection state. In addition, the wiring substrate 610 and the electronic device 100 are in the inter-substrate connection state, for example, in the inserted state.

[0175] The wiring substrate 610 has a mounting surface SF5 on which the inter-substrate connector 611 is mounted, and a surface SF6 opposite to the mounting surface SF5. The inter-substrate connector 611 is electrically connected to the wiring of the wiring substrate 610. Fig.23 As shown, the inter-substrate connector 611 is electrically connected to the inter-substrate connector 113. That is, the electronic device 100 is mounted on the mounting surface SF5. In addition, circuit elements such as semiconductor switch elements, resistor elements, and capacitor elements may also be mounted on the wiring substrate 610.

[0176] The number of electronic devices 100 that can be mounted on the base substrate 600 is preset. In this embodiment, as an example, a base substrate 600 that can mount four electronic devices 100 is used. Therefore, the base substrate 600 is provided with the same number of inter-substrate connectors 611 as the number of electronic devices 100 that can be mounted.

[0177] The wiring substrate 610 is provided with a positioning hole 612. In the state where the substrates are connected, the first protrusion 520 of the positioning member 510 is arranged in the positioning hole 612. The positioning hole 612 corresponds to the first positioning hole.

[0178] The positioning hole 612 is provided individually for each electronic device 100 mounted on the base substrate 600. Furthermore, in the present embodiment, a positioning member 510 is provided for each electronic device 100. Therefore, the positioning hole 612 is provided individually corresponding to each positioning member 510.

[0179] Two positioning holes 612 are provided for one positioning member 510. One positioning hole 612 is provided for positioning the substrate-to-substrate connectors 113 and 611 in the X and Z directions. The other positioning hole 612 is provided for suppressing rotational offset. In addition, rotational offset means that the base substrate 600 and the positioning member 510 rotate about the Y axis as the rotation axis.

[0180] The positioning hole 612 is a hole that penetrates in the plate thickness direction (Y direction) of the wiring substrate 610. In addition, the positioning hole 612 is a through hole set along the Y direction. The plate thickness direction of the wiring substrate 610 is equivalent to the interval between the mounting surface SF5 and the opposite surface SF6. The plate thickness direction of the wiring substrate 610 can also be said to be the thickness direction of the base substrate 600. In addition, the positioning hole 612 can also be a bottomed hole opened on the mounting surface SF5. That is, the positioning hole 612 can also be a concave part.

[0181] In addition, two positioning holes 612 corresponding to one positioning member 510 are provided at positions offset in the X direction. For example, the two positioning holes 612 are provided on both sides of the board-to-board connector 611 in the X direction. In addition, the positions of the two positioning holes 612 in the Z direction are consistent.

[0182] Next, use Figures 17 to 26 The positioning member 510 is described in detail below. The positioning member 510 is provided separately for each electronic device 100 mounted on the base substrate 600. Fig.17 As shown, a plurality of positioning members 510 are stacked and arranged in the Z direction to form the positioning structure 500. The plurality of positioning members 510 are provided separately.

[0183] like Fig.21 As shown, a plurality of positioning components 510 are arranged between the base substrate 600 and the plurality of electronic devices 100. The positioning components 510 are components for positioning the substrate-to-substrate connector 611 of the base substrate 600 and the substrate-to-substrate connector 113 of the electronic device 100. The plurality of positioning components 510 have the same structure. Hereinafter, the positioning components 510 will be described as a representative example.

[0184] like Fig.17 , Fig.18 , Fig.21 , Fig. 22 As shown in the figures, the positioning member 510 includes a positioning base 511 having a connector opening 512 and a member placement hole 513. The connector opening 512 is a through hole for placing the inter-substrate connector 611. The member placement hole 513 is a through hole for placing the push-back member 142.

[0185] The positioning base 511 is provided with a first protrusion 520 on a surface facing the base substrate 600 . The first protrusion 520 protrudes toward the mounting direction Y1 relative to the periphery. The first protrusion 520 is a protrusion for positioning the base substrate 600 . The first protrusion 520 is inserted into the positioning hole 612 .

[0186] like Fig.18 , Fig.23 As shown in FIG. 1 and FIG. 2 , the positioning member 510 includes a first positioning portion 530 and a second positioning portion 540 on a surface facing the electronic device 100. The second positioning portion 540 corresponds to a clamping portion.

[0187] The first positioning portion 530 includes a second protrusion 531 and a reinforcing portion 532 protruding in a direction intersecting the second protrusion 531. The second protrusion 531 is a protrusion for positioning the positioning member 510 and the wiring substrate 111. The second protrusion 531 is a portion protruding in the extraction direction Y2 side relative to the periphery. In addition, the second protrusion 531 can also be said to be a protrusion for positioning the substrate-to-substrate connector 611 and the substrate-to-substrate connector 113 in the X direction.

[0188] like Fig.24 As shown, the housing (housing back 133) of the electronic device 100 is arranged between the positioning member 510 and the wiring substrate 111. A portion of the second protrusion 531 is inserted into the first opening 133a and arranged on the wiring substrate 111 side. And, the second protrusion 531 is inserted into the positioning slit 115. The second protrusion 531 has, for example, a flat plate shape extending from the positioning base 511 along the Y direction. However, the second protrusion 531 can be any shape as long as it can be inserted into the positioning slit 115.

[0189] like Fig.26As shown in FIG. 1 , the second protrusion 531 is coaxially arranged with the center axis RL1 of the first protrusion 520. That is, the center line of the second protrusion 531 and the center line of the first protrusion 520 are arranged in the same straight line. The center line of the second protrusion 531 is an imaginary straight line that passes through the center of the second protrusion 531 in the X direction and the Z direction and extends along the Y direction. The center line of the first protrusion 520 is an imaginary straight line that passes through the center of the first protrusion 520 in the X direction and the Z direction and extends along the Y direction. Therefore, the imaginary straight line is consistent with the center axis RL1.

[0190] In addition, the second protrusion 531 is inserted into the positioning slit 115 of the wiring substrate 111. Therefore, the center line of the second protrusion 531 can be considered to coincide with the center line of the positioning slit 115. The center line of the positioning slit 115 is an imaginary straight line that passes through the center of the positioning slit 115 in the X direction and the Z direction and extends along the Y direction.

[0191] Furthermore, it can be said that the axis of the first protrusion 520 extending in the Y direction is coaxial with the center line of the second protrusion 531 in the X direction and the Z direction. Furthermore, it can be said that the center line of the second protrusion 531 coincides with the center line of the first protrusion 520 in the X direction and the Z direction.

[0192] Thus, in the X direction, the positioning slit 115 becomes the position reference of the wiring substrate 111. On the other hand, the second protrusion 531 of the positioning member 510 becomes the position reference on the wiring substrate 111 side. In addition, the first protrusion 520 of the positioning member 510 becomes the position reference on the base substrate 600 side. And the position reference on the wiring substrate 111 side is common to the position reference on the base substrate 600 side. In addition, the position reference of the wiring substrate 111 can be regarded as the center line of the positioning slit 115. The position reference of the positioning member 510 can be regarded as the center axis RL1.

[0193] like Fig.24 As shown in the figures, the positioning member 510 has only one second protrusion 531. The positioning member 510 has only one second protrusion 531, and the second protrusion 531 is inserted into the positioning slit 115 provided in one wiring substrate 111. The position for positioning the inter-substrate connector 113, 611 in the X direction is only one second protrusion 531.

[0194] The reinforcing portion 532 is provided to reinforce the second protrusion 531. In addition, the reinforcing portion 532 and the second protrusion 531 are formed as an integral body. The reinforcing portion 532 is provided, for example, at the end of the second protrusion 531. In this case, the first positioning portion 530 has a T-shape in the cross section along the XZ plane. However, the reinforcing portion 532 is not limited to the above. In addition, the first positioning portion 530 may not have the reinforcing portion 532.

[0195] The second positioning portion 540 is a portion that clamps the electronic device 100 in the Z direction. The second positioning portion 540 is a portion for positioning the positioning component 510 and the wiring substrate 111. In addition, the second positioning portion 540 can also be said to be a portion for positioning the inter-substrate connector 611 and the inter-substrate connector 113 in the Z direction. The positioning component 510 has a plurality of second positioning portions 540 for one electronic device 100.

[0196] The second positioning portion 540 includes a contact portion 541 and a reinforcement portion 542 that protrudes in a direction intersecting the contact portion 541. Fig.23 , Fig.24 As shown in FIG. 1 and FIG. 2 , the contact portion 541 is a portion that protrudes in the extraction direction Y2 relative to the periphery. In addition, the reinforcement portion 542 is configured in the same manner as the reinforcement portion 532. The reinforcement portion 542 may not be provided.

[0197] The contact portion 541 is a portion that contacts the wiring substrate 111. Specifically, the contact portion 541 has a contact surface 541a that contacts the wiring substrate 111 (SF2). The contact portion 541 has, for example, a flat plate shape extending from the positioning base 511 along the Y direction. However, the contact portion 541 may be any shape as long as it can contact one surface SF2 of the wiring substrate 111.

[0198] Furthermore, if Fig.18 , Fig.19 , Fig. 20 As shown in the figures, the second positioning portion 540 includes a pressing member 543 disposed at a position opposite to the contact portion 541. The pressing member 543 presses the electronic device 100 (wiring substrate 111) between the contact portion 541. The pressing member 543 is a cantilever leaf spring. The second positioning portion 540 includes a mounting portion 544 on which the pressing member 543 is mounted. The mounting portion 544 is, for example, provided as an integral body with the positioning base 511. In addition, the pressing member 543 can also be a leaf spring with both ends fixed.

[0199] like Fig.24 As shown, a part of the contact portion 541 is inserted into the second opening 133b and arranged on the wiring substrate 111 side. In addition, the contact surface 541a contacts one surface SF2 of the wiring substrate 111. On the other hand, the pressing member 543 is arranged outside the housing. The pressing member 543 contacts the base 120 and presses the base 120. The wiring substrate 111 is fixed to the base 120. Therefore, the pressing member 543 presses the wiring substrate 111 via the base 120. In addition, the pressing member 543 presses the wiring substrate 111 toward the contact surface 541a side.

[0200] In this way, the second positioning portion 540 holds the wiring substrate 111 in the Z direction. Alternatively, the pressing member 543 may be inserted into the housing to directly press the reverse surface SF3 of the wiring substrate 111 .

[0201] like Fig.25 As shown, the contact surface 541a is provided along the central axis RL1 of the first protrusion 520. The contact surface 541a is aligned with the central axis RL1 in the Z direction. That is, in the Z direction, one surface SF2 becomes a position reference (reference surface). As in the case of the X direction, the position reference of the positioning component 510 is the central axis RL1 of the first protrusion 520. Furthermore, the pressing component 543 presses the wiring substrate 111 so that one surface SF2 is aligned with the central axis RL1.

[0202] In addition, the pressing member 543 may be provided as a member different from the second positioning portion 540. The pressing member 543 only needs to be able to press the wiring substrate 111 so that the one surface SF2 coincides with the central axis RL1.

[0203] <Installation and Removal>

[0204] Next, use Figure 27 to Figure 29 The installation and removal of the electronic device 100 are described. In addition, here, the positional relationship between the slider 141 and the protrusions 417 and 427 in each state, and the positions of the movable parts 410 and 420 are also described. In addition, the installation and removal of the electronic device 100 can be performed by an operator of a dealer, a factory, etc.

[0205] First, use Fig. 27 , Fig.28 The installation of the electronic device 100 relative to the bracket 200 is described. Fig. 27 As shown, when the electronic device 100 is mounted on the bracket 200, the electronic device 100 is inserted into the insertion space IN1 from the insertion port IN2. The electronic device 100 is inserted with the heat conducting member 150 provided on the facing surface SF1. Alternatively, the heat conducting member 150 may be provided on the facing surface SF4 of the cooling plate 330. Fig. 27 Indicates the insertion status.

[0206] The electronic device 100 is moved in the mounting direction Y1 in a state where the first protrusion 417 is arranged on the flat portion SL10 and the second protrusion 427 is arranged on the flat portion SL13. Then, the electronic device 100 is inserted into the inner side of the insertion space IN1. That is, the electronic device 100 is moved to the mounting position facing the cooling plate 330 in a state where the heat conducting member 150 is in contact with only one of the electronic device 100 and the cooling plate 330.

[0207] In this state, the external thread provided at the front end of the push-back member 142 is screwed to the fixing portion 251 provided on the bracket back 250. In addition, the electronic device 100 is fixed to the bracket 200 by the fixing screw 1. Thus, the electronic device 100 is fixed to the bracket 200.

[0208] In the inserted state, a portion of the slider 141 is located outside the insertion port IN2. In addition, the first protrusion 417 is located on the flat portion SL10, and the second protrusion 427 is located on the flat portion SL13. Therefore, the movable members 410 and 420 do not move in the downward direction Z2. Therefore, the heat-conducting member 150 does not contact the cooling plate 330 (opposing surface SF4). That is, a gap is formed between the heat-conducting member 150 and the cooling plate 330 in the Z direction. In addition, the heat-conducting member 150 is in an uncompressed state.

[0209] Then, if Fig.28 After the electronic device 100 is moved to the mounting position, the positions of the protrusions 417 and 427 are displaced from the inclined portions SL11 and SL14 to the holding portions SL12 and SL15, thereby moving the movable members 410 and 420 closer to each other. Fig.28 Indicates the installation status.

[0210] Specifically, when the electronic device 100 is moved to the installation position, the slider 141 is pressed in the installation direction Y1. That is, after the electronic device 100 is moved to the installation position, the slider 141 is moved in the installation direction Y1, thereby displacing the position of the first protrusion 417 from the inclined portion SL11 to the holding portion SL12. Similarly, the position of the second protrusion 427 is displaced from the inclined portion SL14 to the holding portion SL15. In addition, the slider 141 can be moved by an operator.

[0211] Thus, the positions of the protrusions 417 and 427 are displaced from the inclined portions SL11 and SL14 to the holding portions SL12 and SL15. As a result, the movable members 410 and 420 are pressed down in the downward direction Z2 by the slider 141. Therefore, the movable members 410 and 420 move in the downward direction Z2.

[0212] The cooling plate 330 is fixed to the movable members 410 and 420. Therefore, the cooling plate 330 moves in the downward direction Z2 along with the movement of the movable members 410 and 420. The cooling plate 330 moves in the downward direction Z2 and contacts the heat conducting member 150. Furthermore, the cooling plate 330 compresses the heat conducting member 150 between the cooling plate 330 and the electronic device 100.

[0213] Therefore, the heat conducting member 150 is in contact with the cooling plate 330 (opposing surface SF4). In addition, the heat conducting member 150 is pressed (compressed) by the electronic device 100 and the cooling plate 330 in the Z direction. In this way, the electronic device 100 is mounted on the bracket 200 in a state where the heat conducting member 150 is in contact with both the electronic device 100 and the cooling plate 330.

[0214] As described above, in the mounted state, the first protrusion 417 is located on the holding portion SL12, and the second protrusion 427 is located on the holding portion SL15. The protrusions 417 and 427 engage with the holding portions SL12 and SL15. In addition, the slider 141 is restricted from moving in the mounting direction Y1 by arranging the protrusions 417 and 427 on the holding portions SL12 and SL15.

[0215] The movement amount of the first protrusion 417 in the Z direction is equivalent to the orthogonal distance between the flat portion SL10 and the retaining portion SL12. Similarly, the movement amount of the second protrusion 427 in the Z direction is equivalent to the orthogonal distance between the flat portion SL13 and the retaining portion SL15. In addition, the two movement distances are the same. The orthogonal distance can also be said to be the interval between the flat portion SL10 and the retaining portion SL12 in the Z direction.

[0216] Furthermore, the cooling plate 330 moves by the orthogonal distance by moving the slider 141 in the mounting direction Y1. The orthogonal distance is set according to the desired compression amount (compression amount, compression force) of the heat conductive member 150. The orthogonal distance for achieving the optimal compression force can be set by experiments, simulations, etc.

[0217] Furthermore, the perpendicular distance may be set in consideration of a gap to be ensured when the electronic device 100 is mounted on the bracket 200 . In addition, the inclination angles of the inclined portions SL11 and SL14 are set to an angle that does not hinder the movement of the slider 141 .

[0218] Next, use Fig.29 The removal of the electronic device 100 from the bracket 200 is described. First, the push-back component 142 is removed from the fixing portion 251. Then, the push-back component 142 is moved in the removal direction Y2. At this time, the push-back component 142 is moved in the removal direction Y2 while the flange portion 142b is in contact with the pressed portion 141g. As a result, the slider 141 moves in the removal direction Y2. That is, the slider 141 is pushed back in the removal direction Y2.

[0219] Then, the slider 141 moves in the extraction direction Y2 to displace the first protrusion 417 from the holding portion SL12 to the inclined portion SL11 and the flat portion SL10 . Similarly, the second protrusion 427 displaces from the holding portion SL15 to the inclined portion SL14 and the flat portion SL13 .

[0220] Thus, the protrusions 417 and 427 are displaced from the holding portions SL12 and SL15 to the flat portions SL10 and SL13. Therefore, the movable members 410 and 420 are pushed upward in the direction Z1 by the slider 141. In addition, the cooling plate 330 moves upward in the direction Z1 as the movable members 410 and 420 move.

[0221] At this time, the first protrusion 417 is located at the flat portion SL10, and the second protrusion 427 is located at the flat portion SL13. Then, the movable members 410 and 420 move in the upward direction Z1. As a result, the heat conducting member 150 is separated from the cooling plate 330. In this state, the electronic device 100 can be removed from the bracket 200 by moving the electronic device 100 in the removal direction Y2.

[0222] <Effect>

[0223] As described above, the electronic control device 1000 is configured to be able to mount the electronic device 100 on the bracket 200. When the electronic device 100 is mounted on the bracket 200, the heat conducting member 150 is placed in contact with the electronic device 100 at the mounting position facing the cooling plate 330. After the electronic device 100 is placed at the mounting position, the positions of the protrusions 417 and 427 are displaced from the inclined portions SL11 and SL14 to the holding portions SL12 and SL15.

[0224] Thus, the electronic device 100 is mounted on the bracket 200 in a state where the heat conducting member 150 is in contact with both the electronic device 100 and the cooling plate 330. Therefore, when the electronic control device 1000 is mounted on the bracket 200, the heat conducting member 150 can be prevented from curling, shearing, etc. In addition, the electronic control device 1000 can also prevent other loads generated by the electronic device 100 and the cooling plate 330 on the heat conducting member 150 during mounting. In addition, the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0225] The electronic control device 1000 can transfer the heat of the electronic device 100 to the cooling plate 330 via the heat conducting member 150. Therefore, the electronic control device 1000 can cool the electronic device 100 through the cooling plate 330. In addition, the heat conducting member 150 is in good contact with the electronic device 100 and the cooling plate 330. Therefore, the electronic control device 1000 can effectively cool the electronic device 100.

[0226] The electronic control device 1000 includes: a first protrusion 520 for positioning the base substrate 600 and the positioning member 510; and a second protrusion 531, which is provided coaxially with the central axis RL1 of the first protrusion 520 and positions the electronic device 100 and the positioning member 510. Therefore, the electronic control device 1000 does not need to consider the tolerance caused by the first protrusion 520 and the second protrusion 531 not being coaxial. Therefore, the electronic control device 1000 can improve the relative position accuracy of the inter-substrate connectors 113 and 611.

[0227] The electronic control device 1000 includes the contact portion 541 (contact surface 541 a ) provided along the central axis RL1 of the first protrusion 520 . Therefore, the electronic control device 1000 can further improve the relative positional accuracy of the inter-board connectors 113 , 611 .

[0228] In addition, the central axis RL1 of the first protrusion 520 of the positioning component 510 is consistent with the reference position of the wiring substrate 111 in the X direction and the reference surface of the wiring substrate 111 in the Z direction. As a result, the electronic control device 1000 can connect the substrate connectors 113 and 611 within the tolerance range. In addition, it can also be said that the positioning component 510 can connect the substrate connectors 113 and 611 within the range of the floating amount of the floating connector. In addition, even if the electronic control device 1000 does not have the sliding component 140, the movable components 410 and 420, etc., it can still exert the effect related to positioning.

[0229] In addition, by separately providing (four in the case of this embodiment) a positioning component 510 for each electronic device 100, the distance from the portion positioned by the positioning hole 612 and the first protrusion 520 in each electronic device 100 is shortened, so that the dimensional tolerance can be set smaller and easily converged within the tolerance range of the substrate connectors 113, 611.

[0230] In addition, in the electronic control device 1000, the protrusions 417 and 427 of the movable members 410 and 420 holding the cooling plate 330 are held by the holding portions SL12 and SL15 of the slider 141 included in the electronic device 100 when the heat conductive member 150 is pressed. Therefore, the electronic control device 1000 can suppress the cooling plate 330 and the electronic device 100 from being separated due to the reaction force of the heat conductive member 150. Therefore, the electronic control device 1000 can be configured such that the heat conductive member 150 is in contact with the cooling plate 330 and the electronic device 100. In addition, the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0231] In addition, the orthogonal distance is set through experiments, simulations, etc. so that the compressive force on the heat-conducting member 150 becomes an optimal value. Therefore, the electronic control device 1000 can compress the heat-conducting member 150 with an appropriate compressive force. Furthermore, it can be said that the electronic control device 1000 can set the interval between the cooling plate 330 and the electronic device 100 so that the compressive force on the heat-conducting member 150 becomes an optimal value. Therefore, the electronic control device 1000 can keep the heat transfer distance between the cooling plate 330 and the electronic device 100 constant.

[0232] Furthermore, the electronic device 100 is provided with the holding portions SL12 and SL15 at four corners that engage with the protrusions 417 and 427. Therefore, the electronic control device 1000 can compress the heat conductive member 150 in a state where the facing surface SF1 and the facing surface SF4 maintain a parallel positional relationship.

[0233] In addition, the present embodiment adopts an example having a heat-conducting component 150 as a preferred mode. However, the present invention may not have the heat-conducting component 150. Even with such a configuration, when the electronic device 100 is installed on the bracket 200, after being arranged at the installation position opposite to the cooling plate 330, the positions of the protrusions 417 and 427 are displaced from the inclined portions SL11 and SL14 to the retaining portions SL12 and SL15. By such displacement, the electronic device 100 is moved in a manner of pulling the movable components 410 and 420 closer and is installed on the bracket 200. That is, when the electronic device 100 is installed on the bracket, the cooling plate 330 on which the movable components 410 and 420 are installed can be pulled closer. Therefore, the electronic control device 1000 can bring the electronic device 100 close to the cooling plate 330. Therefore, the electronic control device 1000 can improve the cooling efficiency of the electronic device 100.

[0234] In addition, the electronic control device is configured such that when the electronic device 100 is mounted on the bracket 200, the protrusions 417 and 427 are held by the holding portions SL12 and SL15, and the electronic device 100 and the cooling plate 330 are arranged at opposing mounting positions. Therefore, the electronic control device 1000 can improve the heat dissipation of the electronic device 100 by the cooling plate 330.

[0235] Furthermore, in the present embodiment, the second protrusion 531 disposed coaxially with the center axis RL1 of the first protrusion 520 is preferably used. However, the present invention may also employ the second protrusion 531 that is not disposed coaxially with the center axis RL1 of the first protrusion 520. Even with such a configuration, the positioning component 510 includes the first protrusion 520 for positioning the base substrate 600 and the positioning component 510, and the second protrusion 531 for positioning the electronic device 100 and the positioning component 510. That is, the positioning component 510 includes both the first protrusion 520 for positioning with the base substrate 600 and the second protrusion 531 for positioning with the electronic device 100. Therefore, the electronic control device can improve the relative position accuracy of the substrate-to-substrate connectors 113 and 611.

[0236] Preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and can be modified in various ways without departing from the gist of the present invention.

Claims

1. An electronic control device, comprising an electronic device that can be mounted on a bracket, characterized in that: have: a cooling plate mounted on the bracket in a state of being movable in a thickness direction of the electronic device orthogonal to a mounting direction of the electronic device relative to the bracket; as well as The movable member is installed in the bracket at a position where the electronic device is clamped from a direction orthogonal to the installation direction and the thickness direction, and holds the cooling plate in a state where it can move in the thickness direction, and has a protrusion protruding toward the electronic device. The electronic device has a guide member, which is arranged at both ends of a direction orthogonal to the mounting direction and the thickness direction and is provided with a guide groove, the guide groove being a location where the protrusion is arranged and along the mounting direction. In the guide member, the guide groove has an open end on the mounting direction side and a holding portion for holding the protrusion at the end on the opposite side of the mounting direction. When the electronic device is mounted on the bracket, the protrusion is held by the holding portion, and the electronic device and the cooling plate are arranged at opposing mounting positions. The electronic control device further includes a biasing portion that applies a stress to the movable member at all times in a direction in which the electronic device is separated from the cooling plate.

2. The electronic control device according to claim 1, characterized in that: The electronic control device includes a heat conducting member, and when the electronic device is mounted on the bracket, the heat conducting member is disposed between the electronic device and the cooling plate and is in contact with the electronic device and the cooling plate.

3. The electronic control device according to claim 2, characterized in that: When the electronic device is mounted on the bracket, the protrusion is held by the holding portion, whereby the heat conductive member is pressed via the electronic device and the cooling plate.

4. The electronic control device according to claim 2 or 3, characterized in that: The electronic control device further includes a holding member that is fixed to the bracket and holds the movable member in a state where the movable member can move in the thickness direction.

5. The electronic control device according to claim 4, characterized in that: The bracket is configured to be capable of mounting a plurality of the electronic devices. The cooling plate, the movable member, the heat conducting member, and the holding member are provided separately for each electronic device.

6. The electronic control device according to any one of claims 1 to 3, characterized in that: The urging portion is an elastic member.

7. The electronic control device according to claim 6, characterized in that: The elastic member is a spring member mainly composed of metal.

8. The electronic control device according to claim 4, characterized in that: The upper electronic device of the two electronic devices arranged adjacent to each other in the thickness direction is defined as an upper electronic device, and the lower electronic device is defined as a lower electronic device. The urging portion is disposed between the movable member provided corresponding to the upper electronic device and the holding member provided corresponding to the lower electronic device.

9. The electronic control device according to claim 8, characterized in that: The movable member provided corresponding to the upper electronic device has a flat surface in contact with the force applying portion. The holding member provided corresponding to the lower electronic device has a recessed portion in which the biasing portion is arranged.

10. The electronic control device according to any one of claims 1 to 3, characterized in that: The force applying portion is provided on both sides of the protrusion in the mounting direction.

11. The electronic control device according to claim 4, characterized in that: The bracket is configured to be capable of mounting a plurality of the electronic devices. The cooling plate, the movable member and the heat conducting member are provided separately for each electronic device. The holding member is provided commonly to the plurality of movable members.

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