Modular data center for immersion cooling system

Abstract

A modular data center is disclosed. The modular data center comprises: a containing unit; the first rack system is mounted in the accommodating unit and extends along a first side wall of the accommodating unit; and the second rack system is mounted in the accommodating unit and extends along the second side wall of the accommodating unit. The second wall is opposite the first wall, the first rack system and the second rack system are spaced apart from each other and define an aisle between the first rack system and the second rack system. The first rack system and the second rack system are configured to house an electronic device, the electronic device being disposed in an immersion housing, the immersion housing being filled with an immersion cooling liquid. The modular data center further includes a removable mobile device for servicing the electronic equipment, the removable mobile device being operably connected to the floor surface of the containment unit, and the removable mobile device being configured to travel along the aisle.

Description

Technical Field

[0001] The present technology relates to overall data center configurations, and in particular to modular data center configurations for immersion cooling systems. Background Art

[0002] In order to process massive amounts of data in near real time, permanent data centers house and serve a large number of racks that contain electronic equipment such as computer server components, dedicated processors, memory components, high-speed network modules, etc.; they also contain supporting infrastructure equipment such as power facilities, air handling systems, liquid cooling structures, etc.

[0003] Data centers and other large computing facilities may contain thousands of racks, supporting thousands or even tens of thousands of servers. Since servers and other electronic equipment generate considerable amounts of heat, ensuring that the electronic equipment stored in the racks is adequately cooled is an important consideration. It is worth noting that excessive heat may impair the performance of the electronic equipment and in some cases even cause failures. Immersion cooling (sometimes referred to as immersion cooling) is a recently introduced solution for cooling electronic equipment such as servers. It involves storing the servers in immersion tanks (also called "immersion racks" because they replace traditional racks used in data centers) that are fully or partially filled with immersion cooling liquid. In this way, good thermal contact is obtained between the electronic equipment and the cooling medium (i.e., the medium cooling liquid).

[0004] However, there may be situations where some space-constrained geographic areas with high data processing needs (such as urban areas, research campuses, etc.) may not be able to accommodate a sprawling modular data center configuration. Therefore, it may be desirable to provide a modular data center configuration with a smaller footprint and using an immersion cooling system.

[0005] The subject matter discussed in the background section should not be considered to be prior art simply because it is mentioned in the background section. Similarly, problems mentioned in the background section or problems associated with the background section subject matter should not be considered to be problems recognized in the prior art. The background section subject matter simply represents different approaches. Summary of the invention

[0006] The purpose of the present technology is to improve at least some of the inconveniences of the prior art.

[0007] In a first broad aspect of the present technology, a modular data center is provided, the modular data center comprising: a housing unit having: a first side wall extending along the longitudinal axis of the housing unit; and a second side wall, the second side wall being opposite to the first side wall and extending along the longitudinal axis of the housing unit; a rack system installed in the housing unit and extending along the first side wall, the rack system being configured to accommodate electronic equipment, the electronic equipment being arranged in an immersion shell filled with immersion cooling liquid; and a pull-out mobile device for maintaining the electronic equipment. The pull-out mobile device comprises: a shifting device; a support arrangement device for receiving at least one immersion shell in the immersion shell; and a body extending from the shifting device to the support arrangement device. The pull-out mobile device is configured to navigate along the rack system.

[0008] Broadly speaking, the pull-out mobile device can facilitate manipulation of electronic equipment within relatively confined spaces of modular data center configurations having a small footprint, and in particular manipulation of immersion cooled electronic equipment where the immersion cooling liquid cannot spill. Thus, the pull-out mobile device can facilitate protection of the physical integrity of a human operator. Thus, in the case of a modular data center, the pull-out mobile device can perform maintenance actions in a manner more suitable for a human operator.

[0009] In some non-limiting implementations, the extractable movement device is further configured to align the support arrangement device longitudinally and vertically in front of the at least one immersion shell when the at least one immersion shell is located in the rack system.

[0010] In some non-limiting implementations, the extraction mobile device is further configured to extract the at least one immersion housing from the rack system.

[0011] In some non-limiting implementations, the extractable movement device is further configured to displace the at least one immersion housing to a maintenance area.

[0012] In some non-limiting implementations, the accommodation unit further comprises an operating platform in a maintenance area, the operating platform being configured to receive the at least one immersion shell.

[0013] In some non-limiting implementations, the modular data center further includes a second rack system, the second rack system is installed in the accommodation unit and the second rack system extends along a second side wall of the accommodation unit, the second wall is opposite to the first wall, the first rack system and the second rack system are spaced apart from each other and define an aisle between the first rack system and the second rack system, the first rack system and the second rack system are configured to accommodate electronic equipment, the electronic equipment is arranged in an immersion shell, the immersion shell is filled with immersion cooling liquid. The extraction mobile device is configured to travel along the aisle and extract at least one of the immersion shells from either the first rack system or the second rack system.

[0014] In some non-limiting implementations, the modular data center also includes a cooling loop for cooling the electronic equipment, the cooling loop including: a cooling liquid unit, the cooling liquid unit being in thermal contact with the electronic equipment and being used to transfer heat energy generated by the electronic equipment to a channelized cooling liquid flowing in the cooling loop; and a liquid cooling module, the liquid cooling module being used to cool the channelized cooling liquid.

[0015] In some non-limiting implementations, the modular data center further includes an air-to-liquid heat exchanger mounted on a top surface of the containment unit and configured to cool the channelized cooling liquid by discharging thermal energy of the channelized cooling liquid to a vicinity of an exterior of the containment unit.

[0016] In some non-limiting embodiments, the air to liquid heat exchanger includes at least one fan capable of rotating about a respective rotation axis and configured to draw ambient air into the air to liquid heat exchanger, wherein the rotation axis extends substantially horizontally and parallel to the top surface of the containment unit.

[0017] In some non-limiting implementations, the air-to-liquid heat exchanger includes a heat exchanger plate defining a cooling coil for circulating a channelized cooling liquid therein, the heat exchanger plate extending substantially vertically and orthogonal to a top surface of the containment unit.

[0018] In some non-limiting implementations, the modular data center further includes an air cooling module for cooling air within the accommodation unit.

[0019] In some non-limiting implementations, the modular data center further includes an electronic switch electrically coupled to the electronic device, the electronic switch fixedly attached to a ceiling surface of the housing unit.

[0020] In some non-limiting implementations, the electronic device is a server.

[0021] In some non-limiting implementations, the containment unit is a shipping container.

[0022] In a second broad aspect of the present technology, a method for operating a pull-out mobile device in a modular data center is provided. The method includes: positioning the pull-out mobile device in front of a rack row of a rack system in a receiving unit of the modular data center, the rack system being configured to accommodate electronic equipment, the electronic equipment being arranged in an immersion shell, the immersion shell being filled with immersion cooling liquid; positioning a support arrangement device of the pull-out mobile device in front of a given rack shelf of the rack row; actuating the support arrangement device to extract at least one of the immersion shells from the rack system; and actuating a displacement device of the pull-out mobile device to move the pull-out mobile device toward a maintenance area; and causing the pull-out mobile device to dispose of the at least one of the immersion shells in the maintenance area.

[0023] In some non-limiting implementations, a maintenance area is defined within a containment unit of the modular data center.

[0024] In a third broad aspect of the present technology, there is provided a pull-out mobile device, the pull-out mobile device comprising: a chassis; an elongated body extending substantially vertically from the chassis; a support arrangement device movably mounted to the elongated body; a shifting device operably connected to the chassis to shift the pull-out mobile device along a rack system, the rack system comprising rack-mounted components; and a controller communicatively connected to the shifting device and the support arrangement device. The controller is configured to: receive an instruction to extract a target rack-mounted component; cause the pull-out mobile device to move along the rack system; adjust the height of the support arrangement device relative to the target rack-mounted component to be extracted; and cause the support arrangement device to extract the target rack-mounted component.

[0025] In some non-limiting implementations, the displacement device is operably connected to a ground surface of the receiving unit, and the rack system is disposed along a longitudinal side wall of the receiving unit.

[0026] In some non-limiting implementations, the accommodation unit further comprises a second rack system, the second rack system being installed in the accommodation unit and extending along a second side wall of the accommodation unit, the second wall being opposite to the first wall, the first rack system and the second rack system being spaced apart from each other and defining an aisle between the first rack system and the second rack system, the first rack system and the second rack system being configured to accommodate rack-mounted components, the elongated body being pivotably connected to the displacement device, and the extraction movement device being configured to travel along the aisle and extract at least one of the immersion shells from either the first rack system or the second rack system by rotating the elongated body.

[0027] In some non-limiting implementations, the containment unit is a shipping container.

[0028] In some non-limiting implementations, the extractable mobile device further includes a sensor communicatively connected to the controller, the controller being configured to identify the target rack-mounted component based on instructions and data provided by the sensor.

[0029] In the context of this specification, unless otherwise expressly specified, a computer system may refer to but is not limited to an "electronic device", "operating system", "system", "computer-based system", "controller unit", "monitoring device", "control device" and / or any combination thereof suitable for the current relevant task.

[0030] In the context of this specification, unless otherwise expressly provided, the expressions "computer-readable medium" and "memory" are intended to include media of any nature and kind, non-limiting examples of which include RAM, ROM, disks (CD-ROM, DVD, floppy disks, hard disk drives, etc.), USB keys, flash memory cards, solid-state drives, and tape drives. Still in the context of this specification, "a" computer-readable medium and "the" computer-readable medium should not be understood to be the same computer-readable medium. On the contrary, "a" computer-readable medium and "the" computer-readable medium may also be understood as a first computer-readable medium and a second computer-readable medium, where appropriate.

[0031] In the context of this specification, unless expressly specified otherwise, the words "first", "second", "third" etc. are used as adjectives merely for the purpose of allowing the nouns they modify to be distinguished from each other, rather than for the purpose of describing any specific relationship between these nouns.

[0032] The implementation of the present technology has at least one of the above purposes and / or aspects, but not necessarily all of the purposes and / or aspects. It should be understood that some aspects of the present technology generated in an attempt to achieve the above purpose may not meet the purpose and / or may meet other purposes not specifically described herein.

[0033] Additional and / or alternative features, aspects, and advantages of implementations of the present techniques will become apparent from the following description, drawings, and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] These and other features, aspects and advantages of the present technology will become better understood through the following description, appended claims and accompanying drawings, in which:

[0035] Figure 1 is a perspective view of a modular data center according to a non-limiting implementation of the present technology;

[0036] Figure 2 yes Figure 1 A top view of an air-to-liquid heat exchanger of a modular data center;

[0037] Figure 3 yes Figure 1 A perspective view of a housing unit of a modular data center;

[0038] Figure 4 yes Figure 3 A perspective view of a first side portion of a cross section of the receiving unit;

[0039] Figure 5 yes Figure 3 A perspective view of a second side portion of a cross section of the accommodation unit;

[0040] Figure 6 is a perspective view of a rack system for housing a plurality of electronic devices according to a non-limiting implementation of the present technology;

[0041] Figure 7 is a perspective view of a rack-mounted assembly including one of the electronic devices according to a non-limiting implementation of the present technology;

[0042] Figure 8 A perspective view showing a removable mobile device according to a non-limiting implementation of the present technology;

[0043] Fig. 9 yes Figure 8 A three-dimensional diagram of a shifting mechanism of a removable moving device;

[0044] Fig.10 When extracting a rack-mounted component from the corresponding rack system, Figure 8A three-dimensional diagram of a supporting arrangement device for a pull-out mobile device;

[0045] Fig.11 yes Fig.10 A three-dimensional view of a locking mechanism of a support arrangement device;

[0046] Fig.12 Once a rack-mounted component is removed from the corresponding rack system Fig.10 A three-dimensional view of the support arrangement of FIG.

[0047] Fig.13 is a block diagram of a controller according to a non-limiting implementation of the present technology.

[0048] It should also be noted that the accompanying drawings are not drawn to scale unless explicitly stated otherwise herein. DETAILED DESCRIPTION

[0049] The embodiments and conditional language described herein are intended primarily to help readers understand the principles of the present technology, rather than to limit its scope to these specific embodiments and conditions described herein. It is understood that a person skilled in the art can design various arrangements that, although not explicitly described or shown herein, embody the principles of the present technology.

[0050] In addition, to facilitate understanding, the following description may describe a relatively simplified implementation of the present technology. As those skilled in the art will appreciate, various implementations of the present technology may be more complex.

[0051] In some cases, examples that are believed to be useful modifications of the present technology may also be described. This is done only to aid understanding and is not intended to limit the scope of the present technology or to describe its boundaries. These modifications are not an exhaustive list, and other modifications may be made by those skilled in the art while remaining within the scope of the present technology. In addition, where examples of modifications are not listed, it should not be interpreted that any modification is impossible and / or that what is described is the only way to implement the elements of the present technology.

[0052] In addition, all statements describing the principles, aspects, and implementations of the present technology and specific embodiments thereof are intended to encompass both structural and functional equivalents thereof, whether currently known or developed in the future. Thus, for example, it will be appreciated by those skilled in the art that any block diagram herein represents a conceptual view of an illustrative system embodying the principles of the present technology.

[0053] Figure 11 is a perspective view of a modular data center 100 including a containment unit 1000 and an air-to-liquid heat exchanger 2000 mounted on a top surface 1050 of the containment unit 1000. The containment unit 1000 may be embodied by a trailer, a shipping container, or other similarly configured structure. In use, the containment unit 1100 contains and services components of multiple racks, which contain electronic equipment, such as computer server components, special processors, memory components, high-speed network modules, and supporting infrastructure equipment, such as power facilities, air handling systems, liquid cooling structures, etc. It is understood that each of the containment units 1000 may contain different components and equipment of the overall modular data center system. The containment unit 1000 may include one or more openings (not shown) to enable ventilation of data processing equipment and to adapt the routing of associated cables and / or duct arrangements to another containment unit and / or external resources.

[0054] As will be described in more detail immediately below, the housing unit 1000 houses electronic devices such as servers, which may generate a considerable amount of heat. Therefore, the modular data center 100 may use a cooling system to cool the electronic devices to prevent damage to the electronic devices. In this implementation, the cooling system in the modular data center 100 is a hybrid cooling system including an immersion cooling system and a channelized cooling system.

[0055] As used herein, an immersion cooling system is a cooling system in which an electronic device is in direct contact with a cooling liquid (e.g., a non-electrically conductive cooling liquid), the cooling liquid flows through at least a portion of the electronic device, or at least a portion of the electronic device is immersed in the cooling liquid. As used herein, a channelized cooling system is a cooling system in which a heat generating component (i.e., its electronic component) or a dielectric cooling liquid of an electronic device is cooled using a liquid cooling unit, the channelized cooling liquid flows through the liquid cooling unit to collect thermal energy, and these liquid cooling units may also be referred to as "cold plates" or "water blocks" (although the channelized cooling liquid circulated through the "water block" may be any of a variety of known heat transfer liquids in addition to water). The channelized cooling liquid may also be cooled using an air-to-liquid heat exchanger such as air-to-liquid heat exchanger 2000. In this embodiment, the channelized cooling liquid flowing in the closed loop may be water, but the channelized cooling liquid may also be a dielectric fluid, a refrigerant fluid, a two-phase fluid, or any other fluid suitable for collecting and discharging thermal energy.

[0056] like Figure 1 As shown, and additionally with reference to Figure 2, the air-to-liquid heat exchanger 2000 extends substantially orthogonal to the top surface 1050 of the containing unit 1000. More specifically, the air-to-liquid heat exchanger 2000 includes a heat exchanger plate 2200 for discharging heat energy of the channelized cooling liquid to the atmosphere. In particular, the heat exchanger plate 2200 is a liquid-to-air heat exchanger plate 2200 that transfers heat energy from the channelized cooling liquid circulating in the liquid-to-air heat exchanger plate 2200 to air flowing through the liquid-to-air heat exchanger plate 2200. More specifically, the heat exchanger plate 2200 may have an air inlet side and an air outlet side, and in use, air enters the heat exchanger plate 2200 through the air inlet side and leaves the heat exchanger plate 2200 through the air outlet side, respectively.

[0057] The heat exchanger plate 2200 may include: a cooling coil (not shown) for circulating a channelized cooling liquid in the cooling coil; and a plurality of fins (not shown) in thermal contact with the cooling coil. Figure 1 As depicted, the cooling coil has an inlet and an outlet for feeding channelized cooling liquid into the cooling coil and exhausting heat transfer fluid from the cooling coil. The fins may be spaced apart from one another so that air flows between the air inlet side to the air outlet side of the heat exchanger plate 2200.

[0058] It is contemplated that the air to liquid heat exchanger 2000 may optionally include at least one cooling pad 2100 or evaporative pad disposed on an exterior face of the heat exchanger 2000. Figure 2 , the cooling pad 2100 is disposed on the lateral side of the heat exchanger 2000. A cooling liquid may be dispensed onto the cooling pad 2100, thereby providing a cooling surface. Ambient air is drawn through the cooling surface of the cooling pad 2100, thereby cooling the ambient air before it contacts the heat exchanger plate 2200. When in use, the cooling liquid may be sprayed onto the cooling pad 2100. The cooling liquid may be water, possibly with additives such as polyethylene glycol (PEG) and / or polypropylene glycol (PPG).

[0059] The distribution system can distribute the second cooling fluid to the surrounding environment of the air-to-liquid heat exchanger 2000. It is worth noting that in the present embodiment, the distribution system can distribute the second cooling fluid to the cooling pad 2100 so that the ambient air flows through the wet cooling pad 2100. Therefore, as the portion of the second cooling fluid (such as water droplets) distributed on the cooling pad 2100 evaporates, the temperature of the ambient air flowing through the cooling pad 2100 decreases. In this way, the thermal energy of the ambient air is absorbed by the evaporation of the portion of the second cooling fluid, so that the temperature of the air flow decreases. The cooling pad 2100 can be made of plastic material, cellulose or glass fiber, but other materials can also be considered in alternative embodiments.

[0060] The heat exchanger 2000 includes a fan assembly 2300 that, when in use, causes air to flow through the heat exchanger 2000. In particular, the fan assembly 2300 includes a plurality of fans 2310 ( Figure 2 In this embodiment, the fans 142 are capable of rotating about their respective horizontal axes 2312 to draw ambient air into the liquid heat exchanger plate 2200. In this implementation, the rotation axis 2312 extends substantially in a horizontal direction parallel to the top surface 1050 of the housing unit 1000 and at an angle to the normal of the heat exchanger plate 2200. For example, the angle may be between 45° and 90°.

[0061] Thus, the heat exchanger 2000 functions by pumping heated channelized cooling liquid drawn from the electronic equipment and through the cooling coils of the heat exchanger plate 2200 while drawing ambient air between the fins and around the cooling coils of the heat exchanger plate 2200. The ambient air absorbs heat from the heated channelized cooling liquid circulating through the cooling coils. As the ambient air is drawn into the interior of the heat exchanger 2000 through the heat exchanger plate 2200, thermal energy is transferred from the channelized cooling liquid circulating in the heat exchanger plate 2200 to the ambient air. The now heated air is then exhausted from the interior of the heat exchanger 2000 through the fan assembly 2300. In this way, the channelized cooling liquid circulating in the heat exchanger plate 2200 is cooled and recirculated back into the cooling loop to further collect thermal energy from the electronic equipment to cool the electronic equipment.

[0062] It is understood that the configuration of the heat exchanger 2000 described above is provided as an example only to help understand the present technology. In other examples, the heat exchanger 2000 can be configured in different ways. For example, a plurality of heat exchanger plates 20 can be provided, and the fan assembly 2300 can include a single fan 2310.

[0063] like Figure 1 As shown and additionally referred to Figures 3 to 5 , the containment unit 1000 includes two rack systems 1100, cooling modules 1200, and electrical cabinets 1300, which are arranged to form an aisle 1400 substantially located in the center of the containment unit 1000 and extending along the length of the containment unit 1000. Anti-skid honeycomb mats can be provided along the aisle 1400 and storage tanks or circulation grooves, which can receive any potential spilled liquids (such as oil, cooling liquid, etc.) through the mats.

[0064] In some implementations, such as Figure 4 and Figure 5 As best shown, the housing unit 1000 also includes an electronic switch 1500 that is electrically coupled to the electronic device 220 (see Figure 7 ), the electronic switch 1500 is fixedly attached to the ceiling surface of the accommodation unit. This can optimize the use of the interior space of the accommodation unit 1000. The accommodation unit 100 can include a false floor and / or a false ceiling configured to accommodate wires to achieve electrical connections between electrical devices and electronic devices of the modular data center 10, and / or the accommodation unit 100 can include pipes for circulating cooling liquid.

[0065] The cooling module 1200 may include pumps, piping assemblies, temperature sensors, liquid flow sensors, controllers, and other data processing systems to automate the cooling of the electronic device 220 .

[0066] In some implementations, each of the electrical cabinets 1300 can include a router, a power distribution unit, power equipment, network equipment, fuses, sensors, data collection equipment, or any other suitable electrical components involved in the proper operation of the modular data center 100 .

[0067] Figure 6 A rack system 1100 is shown in accordance with some implementations of the present technology. In use, according to an embodiment of the present disclosure, the rack system 1100 is used to accommodate a plurality of rack-mounted components 104 including electronic equipment, and the plurality of rack-mounted components 104 are used to provide immersion cooling to the electronic equipment. As shown, the rack system 1100 may include a rack frame 102, rack-mounted components 104, a liquid cooling inlet duct 106, and a liquid cooling outlet duct 108. The rack-mounted components 104 may be oriented vertically relative to the rack frame 102 similar to books on a library shelf. Relative to conventional arrangements, particularly relative to conventional arrangements of immersion cooled rack-mounted components, this arrangement may provide for mounting a large number of such rack-mounted components 104 in the rack frame 102.

[0068] In addition, as shown in the figure, the rack system 1100 may also include a power distribution unit (PDU) 110 and a liquid coolant inlet / outlet connector 112. Note that the rack system 1100 may include other components, such as a heat exchanger, cables, pumps, etc., but for ease of understanding, Figure 6 Such components are omitted. Figure 6 As shown, the rack frame 102 may include a rack shelf 103 for accommodating one or more rack-mounted components 104. As described above, the one or more rack-mounted components 104 may be arranged vertically relative to the rack shelf 103. In some embodiments, guide members (not shown) may be used on the rack shelf 103 to guide the rack-mounted components 104 to the appropriate position during loading and unloading and to provide appropriate spacing between the rack-mounted components 104 for loading and unloading. Figure 6 As further shown, the rack frame 102 may further include a rack column 105 , and the rack column 105 is used to support the rack shelf 103 .

[0069] Figure 7 A perspective view of a rack-mount assembly 104 according to an implementation of the present disclosure is shown. As shown, the rack-mount assembly 104 includes a removable frame or "plate" 218 on which an electronic device 220 (e.g., a server) is mounted, and an immersion housing 216 into which the plate is inserted. The plate 218 houses heat-generating electronic components 222 of the electronic device 220, and the plate 218 can be immersed in an immersion cooling liquid within the immersion housing 216. Examples of heat-generating components include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs), neural processing units (NPUs), tensor processing units (TPUs), power circuit systems, and application-specific integrated circuits (ASICs), including, for example, ASICs configured for high-speed encryption.

[0070] Although the immersion housing 216, the board 218, and the electronic component 222 are shown as separate parts, it will be appreciated by those skilled in the art that in some implementations, two or more of these components may be combined. For example, the electronic component 222 may be directly fixed to the board 218 and / or the immersion housing 216.

[0071] It is expected that the electronic equipment 220 can generate a considerable amount of heat. Therefore, the rack system 1100 can use a cooling system to cool the electronic equipment 220 to prevent damage to the electronic equipment 220. In the present implementation, the cooling system of the rack-mounted components 104 is a hybrid cooling system including an immersion cooling system and a channelized cooling system.

[0072] In this implementation, the immersion housing 216 may contain an immersion cooling liquid. In addition, the board 218 including the electronic component 222 may be at least partially immersed in the immersion cooling housing 216. In some implementations, the immersion cooling liquid and the board 218 may be inserted into the immersion housing 216 through the opening 205 at the top of the immersion housing 216. In some implementations, the opening 205 may remain at least partially open during operation of the electronic device 220, thereby providing a non-sealed configuration for the immersion housing 216. Such a non-sealed configuration may be easier to manufacture and maintain than a sealed configuration, but may not be suitable, for example, for a two-phase system, where the immersion cooling liquid may boil during operation of the electronic device 220.

[0073] In the present implementation, the channelized cooling system is additionally used to cool the immersion cooling liquid and / or the electronic device 220. For example, a liquid cooling unit (also referred to as a "cold plate" or "water block") and / or a convection inducing structure, such as a serpentine convection coil 124, may be used to cool the immersion cooling liquid and / or the electronic device 220, in which a channelized cooling liquid (e.g., water) flow is maintained. As described below, the channelized cooling liquid is also cooled by the air-to-liquid heat exchanger 2000 before being redirected back to the rack-mounted components 104, thereby forming a cooling loop.

[0074] like Figures 3 to 5 As best shown, the modular data center 100 includes: a first rack system 1100, which is installed in the accommodation unit 1000 and the first rack system 1100 extends along a first side wall of the accommodation unit 1000; and a second rack system, which is installed in the accommodation unit 1000 and extends along a second side wall of the accommodation unit 1000, the second wall being opposite the first wall. In this implementation, the first side wall and the second side wall extend along the length of the accommodation unit 1000. The first rack system 1100 and the second rack system 1100 are spaced apart from each other to define an aisle 1400 between the first rack system 1100 and the second rack system 1100 (see Figure 5 ).

[0075] Reference Figure 5 and Figure 8, the accommodation unit 1000 also includes a removable mobile device 3000, which, when in use, performs maintenance on the rack-mounted components 104. In the context of the present disclosure, maintenance includes, but is not limited to: inserting the rack-mounted components 104 into the rack system 1100, extracting the rack-mounted components 104 from the rack system, shifting the rack-mounted components 104, and disconnecting and connecting the rack-mounted components 104 from the power supply. When in use, the removable mobile device 3000 is configured to travel along any one of the rack systems 1100. It should be noted that the rack-mounted components 104 may be relatively heavy to be carried by a human operator, and the physical integrity of the human operator must be protected. In addition, the rack-mounted components 104 contain sensitive and expensive components, as well as immersion cooling liquid that cannot be spilled. Therefore, the removable mobile device 3000 can perform these actions in a more appropriate manner relative to a human operator.

[0076] To this end, the extractable mobile device 3000 includes a displacement device 3042 for traveling along the aisle 1400. For example, the displacement element 3042 may include a wheel, an endless track, and / or a mechanism that moves along the aisle 1400 on a track that is fixedly attached to the housing unit 1000. In this implementation, and as Fig. 9 As best shown, the extractable mobile device 3000 includes a support surface or chassis 3040 on which a displacement device 3042 is mounted. In this implementation, the displacement device 3042 is a wheel that engages a track 1090 fixed to the ground surface of the receiving unit 1000.

[0077] Return to reference Figure 8 , the extractable mobile device 3000 includes a body having an elongated shape. Therefore, the body can be referred to as a rod-shaped member 3100, which extends substantially vertically from the chassis 3040. The support arrangement device 3200 is used to receive at least one of the rack-mounted components 104 or at least one of the immersion shells 216, and the support arrangement device 3200 is slidably connected to the rod-shaped member 3100 (in the direction of the aisle 1400, i.e., the Y axis). Therefore, when in use, the support arrangement device 3200 can slide along the rod-shaped member 3100 (for example, using a motor 3300 mounted to the rod-shaped member 3100 or the chassis 3040) to adjust the height of the support arrangement device 3200. In some other implementations, the rod-shaped member 3100 is retractable, so that the height of the support arrangement device 3200 can be adjusted by actuating the retractable rod-shaped member 3100.

[0078] In this implementation, the support arrangement device 3200 is connected to the rod-shaped member 3100 via a mechanical arm 3210, and the mechanical arm 3210 can translate the support arrangement device 3200 in a horizontal direction. Figure 8 As depicted, the support arrangement 3200 can translate in a horizontal direction perpendicular to the aisle 1400 (i.e., along the X-axis). In addition, the rod 3100 is pivotally connected to the chassis 3040 and can be rotated about the vertical axis (i.e., the Y-axis) by the motor 3300, so that the support arrangement 3200 can also translate in any horizontal direction orthogonal to the vertical axis. Therefore, the support arrangement 3200 can approach or contact any rack-mounted component 104 through the vertical displacement along the rod 3100, its rotation and horizontal displacement provided by the robot arm 3210. Once the support arrangement 3200 contacts a given rack-mounted component 104, the support arrangement 3200 can remove the rack-mounted component 104 from the corresponding rack system 100 to perform maintenance on the rack-mounted component 104.

[0079] Fig.10 The support arrangement 3200 is shown when a rack-mounted component is being extracted from a corresponding rack system. For simplicity, Fig.10 Only the housing 216 of the rack-mounted assembly is depicted. In this implementation, the support arrangement 3200 is in contact with the housing 216 (e.g., via actuation of the robotic arm 3210). A locking mechanism 3250 movably mounted to the support arrangement 3200 also connects the housing 216 to the support arrangement 3200.

[0080] More specifically, the support arrangement 3200 includes a support plate 3220 that extends substantially along a horizontal plane to support the housing 216 once the housing 216 is extracted. The support arrangement 3200 also includes a guide plate 3230 that extends perpendicular to the support plate 3220. In this implementation, the locking mechanism 3250 is slidably connected to a track mounted to the guide plate 3230. When in use, the position of the locking mechanism 3250 along the track can be controlled by a controller and / or a command module.

[0081] like Fig.11As best shown, the locking mechanism 3250 includes a sliding element 3252 that is slidingly connected to the track; and a tab 3254 that is connected to the sliding element 3252. The tab 3254 extends substantially vertically, and the tab 3254 is configured to engage with a housing tab 217 extending from the housing 216. In the present implementation, the housing tab 217 extends substantially horizontally, and the housing tab 217 defines an opening for receiving the tab 3254, which locks the housing 216 to the support arrangement 3200. In use, once the support arrangement 3200 is aligned with the housing 216, the locking mechanism 3250 is slid along the track toward the housing 216. Once the locking mechanism 3250 reaches the housing 216, the tab 3254 engages with the housing 216 (e.g., by being inserted into an opening defined in the housing tab 217). At this point, the support arrangement 3200 is mechanically connected to the housing 216. In other implementations, the locking mechanism 3250 can be implemented in alternative ways, such as, for example but not limited to, a clamp, a hook, a magnetic assembly, etc.

[0082] Fig.12 The support arrangement device 3200 is shown once the housing 216 is extracted from the corresponding rack system. More specifically, once the support arrangement device 3200 is mechanically connected to the housing 216, the position of the locking mechanism 3250 will be further adjusted to pull the housing 216 out of the rack system and onto the support plate 3220. Thus, the housing 216 is transferred to the support plate 3220, and the extraction type mobile device 3000 can thus carry the housing 216 and the components therein to the desired destination. Before or after the housing 216 is transferred to the support plate 3220, the disconnection of the electrical connection and / or the cooling liquid connection can be performed. The disconnection can be automatic (for example, when the housing 216 is pulled out of the rack system 100). The extraction device can include, for example, a mechanical arm that is configured to disconnect the components of the rack-mounted assembly 104 from the rack system 100. Alternatively, the components may be manually disconnected by an operator as the rack-mount assembly 104 is extracted.

[0083] When in use, the extractable mobile device 3000 travels along any rack system 100, and the target rack-mounted component 104 will be extracted from the rack system 100. The extractable mobile device 3000 can be, for example but not limited to, manually operated by a human operator, autonomously or semi-autonomously operated. In this implementation, the extractable mobile device 3000 includes a controller 700, which can receive instructions from a human operator, for example, via a network device embedded in the extractable mobile device 3000, and the controller 700 and the user device associated with the human operator are connected in a communication manner. The extractable mobile device 3000 may include a dedicated computer system, a chassis controller and / or a sensor to ensure the safe displacement of the extractable mobile device 3000 along the aisle 1400. The instruction may, for example, include an indication of an identifier of the target rack-mounted component 104. The identifier may be a barcode, a QR code, or any other visual or non-visual feature associated with each rack-mounted component 104. In some implementations, the extractor mobile device 3000 may include a sensor (eg, an RGB camera, an RGB-depth camera, a LIDAR system, a scanning system, etc.) for identifying a target rack-mount component 104 based on an identifier associated with the target rack-mount component 104 .

[0084] Therefore, the extraction mobile device 3000 can be shifted and arranged near the rack system 1100, which responds to instructions received from a human operator and encloses the electronic device 220 to be extracted from the rack system 1100. The function of this device is to ensure the extraction of the "book" component in a narrow environment.

[0085] Once the target rack-mounted component 104 is extracted from the corresponding rack system 100, the extraction mobile device 3000 can be further moved along the aisle 1400 to reach the maintenance area 1600 (see Figure 5 ), and positions the electronic device 220 on the area. When in use, the robot control arm 3055 can also change the orientation of the electronic device 220 between extracting the electronic device 220 and disposing the electronic device 220 on the operating platform of the maintenance area 1600. The operating platform 1060 corresponds to the following position on the extraction type mobile device 3000, where the operator can perform maintenance on the electronic device 220. In the present implementation, the surface of the operating platform 1060 defines a hole so that the residual immersion cooling liquid is drained during or before the maintenance of the electronic device 220.

[0086] Broadly speaking, the extraction mover 3000 identifies a target rack-mounted component 104 , extracts the target rack-mounted component 104 from a corresponding rack system 100 , and can move the target rack-mounted component 104 to perform maintenance on the target rack-mounted component 104 .

[0087] As an example, Fig.13 is a schematic block diagram of a controller 700 of a removable mobile device 3000 according to an embodiment of the present technology. The controller 700 includes a processor or multiple co-processors (represented as a processor 710 for simplicity), a memory device or multiple memory devices (represented as a memory device 730 for simplicity), and an input / output interface 720, allowing the controller 700 to communicate with other components of the removable mobile device 3000 and / or other components that communicate remotely with the removable mobile device 3000. The processor 710 is operably connected to the memory device 730 and the input / output interface 720. The memory device 730 includes a memory for storing parameters 734, which include, for example and without limitation, a predetermined extraction speed of the electronic device 220, a maximum translation speed of the locking mechanism 3250, or a predetermined maximum acceleration and maximum speed of the removable mobile device 3000. The memory device 730 may include a non-transitory computer-readable medium for storing code instructions 732 that are executable by the processor 710 to allow the controller 700 to perform various tasks assigned to the controller 700 for operating the removable mobile device 3000 .

[0088] The controller 700 is operably connected to the robot arm 3210, the motor 3300, and the displacement element 3042 via the input / output interface 720. The controller 700 executes the code instructions 732 stored in the memory device 730 to implement the various functions described above that may exist in a specific embodiment. Figure 7 A non-limiting implementation is shown in which the controller 700 coordinates the operation of the extractable mobile device 3000. This particular implementation is not intended to be limiting of the present disclosure, but is provided for illustration purposes.

[0089] It is understood that although the embodiments presented herein have been described with reference to specific features and structures, various modifications and combinations may be made without departing from the present disclosure. Therefore, as defined in the appended claims, this specification and drawings are only regarded as illustrative of the implementation or embodiment discussed and its principles, and are considered to cover any and all modifications, variations, combinations or equivalents within the scope of the present disclosure.

Claims

1. A modular data center (100), the modular data center (100) comprising: A containing unit (1000), the containing unit (1000) comprising: a first side wall, the first side wall extending along the longitudinal axis of the containing unit (1000); and a second side wall, the second side wall being opposite to the first side wall and extending along the longitudinal axis of the containing unit (1000); a rack system (1100), the rack system (1100) being installed in the accommodation unit (1000) and extending along the first side wall, the rack system (1100) being configured to accommodate electronic equipment (220), the electronic equipment (220) being arranged in an immersion housing (216), the immersion housing (216) being filled with an immersion cooling liquid; as well as A removable mobile device (3000), the removable mobile device (3000) is used to maintain the electronic device (220), and the removable mobile device (3000) comprises: Shifting device (3042); a support arrangement (3200) for receiving at least one of the immersion shells (216), and a body (3100), the body (3100) extending from the displacement device (3042) toward the support arrangement device (3200); The extractable mobile device (3000) is configured to travel along the rack system (1100).

2. The modular data center (100) according to claim 1, wherein: The extractable movement device (3000) is also configured to align the support arrangement device (3200) longitudinally and vertically in front of the at least one immersion shell (216) when the at least one immersion shell (216) is located in the rack system (1100).

3. The modular data center (100) according to claim 2, wherein: The extraction movement device (3000) is also configured to extract the at least one immersion housing (216) from the rack system (1100).

4. The modular data center (100) according to claim 3, wherein: The extractable movement device (3000) is also configured to move the at least one immersion housing to a maintenance area (1600).

5. The modular data center (100) according to claim 1, further comprising a second rack system (1100), the second rack system (1100) being installed in the accommodation unit (1000) and extending along a second side wall of the accommodation unit (1000), the second wall being opposite to the first wall, the first rack system (1100) and the second rack system (1100) being spaced apart from each other and defining an aisle between the first rack system (1100) and the second rack system (1100), the first rack system (1100) and the second rack system (1100) being configured to accommodate electronic equipment (220), the electronic equipment (220) being disposed in an immersion housing (216), the immersion housing (216) being filled with an immersion cooling liquid, in, The extractable mobile device (3000) is configured to: travelling along said aisle, and At least one of the immersion shells (216) is extracted from any one of the first rack system (1100) and the second rack system (1100).

6. The modular data center (100) of claim 1, further comprising an electronic switch electrically coupled to the electronic device (220), the electronic switch fixedly attached to a ceiling surface of the accommodation unit (1000).

7. The modular data center (100) of claim 1, wherein: The electronic device (220) is a server.

8. The modular data center (100) of claim 1, wherein: The containing unit (1000) is a transport container.

9. A method for operating a removable mobile device (3000) in a modular data center, the method comprising: Positioning the extractable mobile device (3000) in front of a rack row of a rack system (1100) within a receiving unit (1000) of the modular data center, wherein the rack system (1100) is configured to receive electronic equipment (220), wherein the electronic equipment (220) is disposed in an immersion housing (216), wherein the immersion housing (216) is filled with an immersion cooling liquid; Positioning the support arrangement device (3200) of the extractable mobile device (3000) in front of a given rack shelf of the rack row; actuating a support arrangement (3200) to extract at least one of the immersion shells (216) from the rack system (1100), and Actuating the shifting device (3042) of the withdrawable mobile device (3000) to move the withdrawable mobile device (3000) toward the maintenance area (1600); and The extractable moving device (3000) is caused to dispose at least one of the immersion shells (216) in the maintenance area (1600).

10. The method according to claim 9, wherein: The maintenance area (1600) is defined within the housing unit of the modular data center.

11. A removable mobile device (3000), comprising: Chassis (3040); an elongated body (3100) extending substantially vertically from the chassis (3040); a support arrangement (3200), the support arrangement (3200) being movably mounted to the elongated body (3100); a shifting device (3042) operably connected to the chassis to shift the extractable mobile device (3000) along a rack system (1100), the rack system (1100) comprising rack-mounted components; as well as A controller, the controller being connected to the displacement device (3042) and the support arrangement device (3200) in a communicable manner, the controller being configured to: receiving an instruction to extract a target rack-mounted component; Allowing the extractable mobile device (3000) to move along the rack system (1100); Adjusting the height of the support arrangement (3200) relative to the target rack-mounted component to be extracted; as well as The support arrangement device (3200) is caused to extract the target rack-mounted component.

12. The extractable mobile device (3000) according to claim 11, wherein: The displacement device (3042) is operably connected to the ground surface of the accommodation unit, and the rack system (1100) is arranged along the longitudinal side wall of the accommodation unit.

13. The extractable mobile device (3000) according to claim 12, wherein: The accommodation unit (1000) further comprises a second rack system (1100), the second rack system (1100) being installed in the accommodation unit (1000) and extending along a second side wall of the accommodation unit (1000), the second wall being opposite to the first wall, the first rack system (1100) and the second rack system (1100) being spaced apart from each other and defining an aisle between the first rack system (1100) and the second rack system (1100), the first rack system (1100) and the second rack system (1100) being configured to accommodate the rack-mounted components, The elongated body (3100) is pivotably connected to the displacement device (3042), and The extractable mobile device (3000) is configured to: travelling along said aisle, and At least one of the immersion shells (216) is extracted from either of the first rack system (1100) and the second rack system (1100) by rotating the elongated body (3100).

14. The extractable mobile device according to claim 12, wherein: The containing unit is a transport container.

15. The extractable mobile device according to claim 13, wherein: The elongated body (3100) is pivotally connected to the chassis (3040).

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