A multi-zone phase change radiator and heat source cooling system

Abstract

The present application provides a multi-zone phase change radiator and a heat source heat dissipation system, wherein the multi-zone phase change radiator includes a substrate, a heat dissipation fin and a working fluid pump. A plurality of heat absorption evaporation chambers and a liquid storage chamber are sequentially arranged in the substrate from top to bottom. The working fluid pump transports the heat transfer working fluid in the liquid storage chamber to the heat absorption evaporation chamber. Each heat absorption evaporation chamber is provided with an overflow port, the steam zone is above the overflow port, and the liquid phase working fluid zone is below the overflow port. Excess liquid working fluid in the heat absorption evaporation chamber overflows through the overflow port and eventually flows back to the liquid storage chamber. A heat source mounting portion is provided on the first surface of the substrate corresponding to the liquid phase working fluid zone. Several heat dissipation fins are installed on the second surface of the substrate, and each heat dissipation fin is provided with a condensation pipeline, the steam zone of the heat absorption evaporation chamber is connected to the condensation pipeline, and the gas phase working fluid flows back to each heat absorption evaporation chamber and / or flows back to the liquid storage chamber after being cooled into a liquid phase working fluid in the condensation pipeline. The present application constructs a multi-zone three-dimensional radiator layout for multiple heat sources, which effectively improves the heat dissipation capacity and heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of phase change radiators, and in particular to a multi-zone phase change radiator and a heat source heat dissipation system. Background Art

[0002] With the rapid development of semiconductor technology, the integration of high-power components is getting higher and higher, and the power density is getting higher and higher. The heat generated during operation is getting larger and larger, and the heat flux density is getting higher and higher. Conventional heat sinks can hardly meet the heat dissipation needs of high heat flux density. If the heat generated by the power device cannot be dissipated quickly and in time, the chip temperature in the power device will increase, which will cause the working efficiency to decrease and the service life to shorten, and even cause the device to be damaged and fail. Therefore, it is necessary to develop an efficient heat sink to solve the heat dissipation problem of high-power devices with high heat flux density and high heat.

[0003] In order to solve the heat dissipation problem of multi-heat source high heat flux chips, most manufacturers are currently developing three-dimensional (3D) phase change heat dissipation technology, that is, the heat sink substrate in contact with the chip (heat source) and the heat sink fins combined with the heat sink substrate are set as a connected sealed cavity, and a certain amount of heat transfer medium is filled in the sealed cavity. The heat transfer medium absorbs heat in the heat source joint in the heat sink substrate cavity and evaporates into gas, enters the heat sink fin cavity to condense and release heat, and conducts heat to the air flowing through the heat sink fins and takes it away. After the gas condenses, it returns to the heat sink substrate cavity by gravity to participate in the next evaporation and condensation heat conduction and heat dissipation cycle. This type of heat sink has a fast thermal conductivity rate and high heat dissipation efficiency. It meets the heat dissipation needs of the latest high heat flux chips in the 5G communication, power electronics and other industries. It is a new type of high-efficiency heat dissipation technology.

[0004] However, for chip heat dissipation with multiple heat sources, especially when the heat sources (chips) are not on the same horizontal plane, the lower heat sources are located below the liquid level of the heat transfer medium, and the upper heat sources are often located above the liquid level of the heat transfer medium. The heat dissipation of the upper heat source only relies on the thermal conductivity of the substrate, which leads to deterioration of heat dissipation and limits the application of the radiator. Summary of the invention

[0005] The purpose of the present application is to provide a multi-zone phase change radiator and a heat source heat dissipation system, which constructs a multi-zone three-dimensional heat dissipation layout for multiple heat sources, so that the heat source components located at different heights can be below the liquid level of the liquid working medium, effectively improving the heat dissipation capacity and heat dissipation efficiency of the phase change radiator.

[0006] In a first aspect, the multi-zone phase change heat sink provided in the present application includes a substrate, heat dissipation fins and a working fluid pump.

[0007] N heat-absorbing evaporation chambers and a liquid storage chamber for storing heat transfer medium are arranged in sequence from top to bottom inside the substrate, where N ≥ 2. The medium pump is used to transport the heat transfer medium in the liquid storage chamber to each heat-absorbing evaporation chamber. Each heat-absorbing evaporation chamber is provided with an overflow port, the area above the height of the overflow port is the steam area, and the area below the height of the overflow port is the liquid phase medium area. Excess liquid medium in the heat-absorbing evaporation chamber overflows through the overflow port and eventually flows back to the liquid storage chamber.

[0008] The substrate includes a first surface and a second surface opposite to each other, and a heat source mounting portion is provided at a position of the first surface of the substrate corresponding to the liquid phase working medium area of ​​the heat absorbing evaporation chamber. A plurality of heat dissipating fins are installed on the second surface of the substrate; a condensation pipeline is provided in each heat dissipating fin, and the steam area of ​​the heat absorbing evaporation chamber is connected to the condensation pipeline of the heat dissipating fin, and the gas phase working medium is cooled into a liquid phase working medium in the condensation pipeline and then flows back to each heat absorbing evaporation chamber and / or directly flows back to the liquid storage chamber.

[0009] In an implementable solution, the N endothermic evaporation chambers are sequentially arranged from the first endothermic evaporation chamber to the Nth endothermic evaporation chamber from top to bottom, and each endothermic evaporation chamber is also provided with a liquid return port, the height of which is lower than the overflow port. In any upper and lower adjacent Mth endothermic evaporation chamber and M+1th endothermic evaporation chamber, 1≤M≤N-1, the overflow port of the Mth endothermic evaporation chamber is connected to the steam region of the M+1th endothermic evaporation chamber; the overflow port of the Nth endothermic evaporation chamber is connected to the liquid storage chamber. The inlet of the working fluid pump is connected to the liquid storage chamber, and the outlet of the working fluid pump is connected to the steam region of the first endothermic evaporation chamber.

[0010] The steam area of ​​the N-1 heat absorbing evaporation chambers below the first heat absorbing evaporation chamber is connected to the steam area of ​​the first heat absorbing evaporation chamber through a steam rising tube cavity. The condensation pipe of each heat dissipation fin is divided into N heat releasing condensation areas from top to bottom. The N heat releasing condensation areas are from the first heat releasing condensation area to the Nth heat releasing condensation area from top to bottom, and are connected to the return liquid ports from the first heat absorbing evaporation chamber to the Nth heat absorbing evaporation chamber in sequence. The upper side of the first heat releasing condensation area is connected to the steam area of ​​the first heat absorbing evaporation chamber. Any upper and lower adjacent Mth heat releasing condensation area is connected to the side of the M+1th heat releasing condensation area away from the substrate through the cavity connection area, and the height of the upper entrance of the cavity connection area is not lower than the height of the overflow port of the Mth heat absorbing evaporation chamber.

[0011] In an implementable solution, a liquid infusion tube cavity is provided in the substrate, the upper end of the liquid infusion tube cavity is connected to the steam area of ​​the first heat release condensation area, and the lower end of the liquid infusion tube cavity extends toward the liquid storage cavity. The inlet of the working fluid pump is connected to the liquid storage cavity through a liquid inlet pipe, and the outlet of the working fluid pump is connected to the lower end of the liquid infusion tube cavity through a liquid outlet pipe.

[0012] In an practicable solution, the lower side of each heat release condensation zone of the heat dissipation fin is inclined, and the side away from the substrate is higher than the side close to the substrate. A cooling medium return port is provided at the bottom of the heat release condensation zone close to the substrate, and the cooling medium return port is connected to the liquid return port of the heat absorption evaporation chamber.

[0013] In an implementable solution, the condensation pipes in the heat dissipation fins are composed of a plurality of grid-like pipes that are interconnected.

[0014] In an practicable solution, the heat dissipation fin is a composite plate structure, including a first plate and a second plate that are assembled together, and the condensation pipeline is formed by a rolling and blowing process or a mold forming and brazing process.

[0015] In an implementable solution, in any upper and lower adjacent Mth heat absorption evaporation chamber and M+1th heat absorption evaporation chamber, the overflow port of the Mth heat absorption evaporation chamber is connected with the steam region of the M+1th heat absorption evaporation chamber through an overflow tube cavity.

[0016] In an implementable solution, an enhanced evaporation heat exchange structure is provided on the inner wall of the heat absorption evaporation chamber corresponding to the heat source installation portion.

[0017] In an practicable solution, vertical guide blocks are arranged on both sides of the enhanced evaporation heat exchange structure. The upper end of the guide block extends to the steam area of ​​the heat absorption evaporation chamber, and a gap is left between the lower end of the guide block and the bottom wall of the heat absorption evaporation chamber.

[0018] In a second aspect, the present application provides a heat source heat dissipation system, including a heat source component, a working fluid pump controller and the aforementioned multi-zone phase change radiator. The heat source component is mounted on a heat source mounting portion provided on the surface of a substrate of the multi-zone phase change radiator. The working fluid pump controller is used to obtain the temperature of the heat source component, and control the start and stop of the working fluid pump based on the obtained temperature.

[0019] Compared with the prior art, the beneficial effects of the present application include at least: in the multi-zone phase change heat sink of the present application, a plurality of heat absorbing evaporation chambers arranged in the height direction are provided, a heat source mounting portion is provided on the surface of the substrate corresponding to each heat absorbing evaporation chamber for mounting the heat source component, and a liquid phase working medium is transported into the heat absorbing evaporation chamber by a working medium pump to ensure that the liquid level in each heat absorbing evaporation chamber is higher than the heat source mounting portion, so that the heat source components at different heights can be below the liquid level of the liquid phase working medium, and then the heat generated by the heat source components at different heights can be quickly conducted out and dissipated through the phase change of the heat transfer working medium. It can be seen from this that the present application constructs a multi-zone three-dimensional heat dissipation layout for multiple heat sources, which effectively improves the heat dissipation capacity and heat dissipation efficiency of the phase change heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A three-dimensional diagram of a multi-zone phase change heat sink shown in an embodiment of the present application.

[0022] Figure 2 This is a cross-sectional view of a multi-zone phase change heat sink along a direction parallel to the heat dissipation fins according to an embodiment of the present application.

[0023] Figure 3 This is a cross-sectional view of an embodiment of the present application after the heat source component is installed, taken along a direction parallel to the heat dissipation fins.

[0024] Figure 4 This is a cross-sectional view of a substrate along a direction parallel to the substrate according to an embodiment of the present application.

[0025] Figure 5 This is a working fluid path diagram in a substrate shown in an embodiment of the present application.

[0026] Figure 6 for Figure 2 Section view along AA.

[0027] In the figure: 1. substrate; 01. substrate shell; 02. substrate cover; 11. heat absorption evaporation chamber; 111. steam zone; 112. liquid phase working medium zone; 1121. single-phase liquid working medium zone; 1122. gas-liquid two-phase mixing zone; 114. heat source installation part; 115. enhanced evaporation heat exchange structure; 116. guide block; 101. overflow port; 102. liquid return port; 103. steam rising tube cavity; 104. liquid replenishing tube cavity; 105. overflow tube cavity; 12. liquid storage cavity; 2. heat dissipation fins; 21. heat release condensation zone; 22. cavity connection zone; 23. cooling working medium reflux port; 24. steam inlet; 25. isolation part; 201. condensation pipeline; 202. first plate; 203. second plate; 3. working medium pump; 31. liquid inlet pipe; 32. liquid outlet pipe; 4. heat source component. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0030] Root Figure 1 As shown, an embodiment of the present application provides a multi-zone phase change heat sink, including a substrate 1, heat dissipation fins 2 and a working fluid pump 3.

[0031] Specifically, Figure 2 , Figure 4 and Figure 5 As shown, N heat-absorbing evaporation chambers 11 and a liquid storage chamber 12 for storing heat transfer medium are sequentially arranged inside the substrate 1 from top to bottom, wherein N≥2. The substrate 1 may include a substrate shell 01 and a substrate cover plate 02, wherein a cavity structure is arranged inside the substrate shell 01, and the substrate cover plate 02 may be a flat plate structure, wherein the substrate cover plate 02 and the substrate shell 01 are assembled to form a heat-absorbing evaporation chamber 11, a liquid storage chamber 12 and other cavities. The working medium pump 3 is used to transport the heat transfer medium in the liquid storage chamber 12 to each heat-absorbing evaporation chamber 11.

[0032] like Figure 4 and Figure 5 As shown, each endothermic evaporation chamber 11 is provided with an overflow port 101, the area above the overflow port 101 is a steam area 111, and the area below the overflow port 101 is a liquid phase working medium area 112. Excess liquid working medium in the endothermic evaporation chamber 11 overflows through the overflow port 101 and eventually flows back into the liquid storage chamber 12.

[0033] like Figure 1 and Figure 2 As shown, the substrate 1 includes a first surface and a second surface opposite to each other, and a heat source mounting portion 114 is provided at a position on the first surface of the substrate 1 corresponding to the liquid-phase working medium region 112 of the heat absorbing evaporation chamber 11. A plurality of heat sinks 2 are installed on the second surface of the substrate 1, and a condensation pipeline 201 is provided in each heat sink 2. The vapor region 111 of the heat absorbing evaporation chamber 11 is connected to the condensation pipeline 201 of the heat absorbing evaporation chamber 11, and the gas phase working medium is cooled into a liquid phase working medium in the condensation pipeline 201 and then flows back to each heat absorbing evaporation chamber 11 or directly flows back to the liquid storage chamber 12.

[0034] In the multi-zone phase change heat sink of the embodiment of the present application, a plurality of heat absorbing evaporation chambers 11 are arranged in the height direction, and a heat source mounting portion 114 is provided on the surface of the substrate 1 corresponding to each heat absorbing evaporation chamber 11 for mounting a heat source component 4 (see Figure 3), and the liquid phase working medium is transported to the heat absorbing evaporation chamber 11 through the working medium pump 3 to ensure that the liquid level in each heat absorbing evaporation chamber 11 is higher than the heat source mounting portion 114, so that the heat source components 4 at different heights can be below the liquid level of the liquid phase working medium, and then the heat generated by the heat source components 4 at different heights can be quickly dissipated through the phase change of the heat transfer medium. It can be seen that the present application constructs a multi-zone three-dimensional heat dissipation layout for multiple heat sources, which effectively improves the heat dissipation capacity and heat dissipation efficiency of the phase change radiator.

[0035] At the same time, the working medium pump 3 is set to work intermittently to ensure the quality of the liquid working medium in each heat absorption evaporation chamber 11 and avoid the deterioration of heat dissipation caused by the reduction of the liquid working medium due to evaporation.

[0036] In one embodiment, the overflow port 101 of each endothermic evaporation chamber 11 may be directly connected to the liquid storage chamber 12 , so that the redundant liquid phase working medium of each endothermic evaporation chamber 11 directly overflows into the liquid storage chamber 12 .

[0037] In one embodiment, the steam region 111 of each heat absorption evaporation chamber 11 may be directly connected to the condensation pipeline 201 of the heat dissipation fin 2 , so that the gas phase working medium generated by each heat absorption evaporation chamber 11 directly enters the condensation pipeline 201 of the heat dissipation fin 2 .

[0038] In one embodiment, after the gas phase working medium is cooled into the liquid phase working medium in the condensation pipeline 201 , it can directly flow back to the liquid storage chamber 12 .

[0039] In a preferred embodiment, if Figure 4 and Figure 5 As shown, in the upper and lower adjacent endothermic evaporation chambers 11, the overflow port 101 of the upper endothermic evaporation chamber 11 is connected to the steam area 111 of the lower endothermic evaporation chamber 11, and the overflow port 101 of the lower endothermic evaporation chamber 11 is connected to the liquid storage chamber 12, so that the liquid phase working medium overflowing from the upper endothermic evaporation chamber 11 flows to the lower endothermic evaporation chamber 11, and finally overflows from the lower endothermic evaporation chamber 11 and flows into the liquid storage chamber 12.

[0040] In a preferred embodiment, if Figure 4 and Figure 5 As shown, the steam areas 111 of each endothermic evaporation chamber 11 are connected to the steam area 111 of the uppermost endothermic evaporation chamber 11, and then connected to the condensation pipeline 201 of the heat dissipation fin 2, so that the steam areas 111 of each endothermic evaporation chamber 11 are connected to each other to balance the pressure.

[0041] In a preferred embodiment, if Figure 2As shown, the condensation pipeline 201 can be divided into N heat release condensation areas 21 from top to bottom, which are respectively connected to the liquid phase working medium areas 112 of the N heat absorption evaporation chambers 11. After the gas phase working medium is cooled into liquid phase working medium in the condensation pipeline 201, it flows back to each heat absorption evaporation chamber 11 to replenish the consumption of liquid phase working medium in the heat absorption evaporation chamber 11, reducing the number of liquid replenishment and the starting frequency of the working medium pump. At the same time, the N heat release condensation areas 21 are interconnected to balance the pressure and make full use of the cooling and heat exchange area of ​​the heat dissipation fins 2.

[0042] In a preferred embodiment, the aforementioned preferred embodiments are combined, such as Figures 2 to 5 As shown, the N endothermic evaporation chambers 11 are sequentially from the first endothermic evaporation chamber to the Nth endothermic evaporation chamber from top to bottom, and each endothermic evaporation chamber 11 is also provided with a liquid return port 102, the height of which is lower than the overflow port 101. In any upper and lower adjacent Mth endothermic evaporation chamber and M+1th endothermic evaporation chamber, 1≤M≤N-1, the overflow port 101 of the Mth endothermic evaporation chamber is connected to the steam region 111 of the M+1th endothermic evaporation chamber, and the overflow port 101 of the Nth endothermic evaporation chamber is connected to the liquid storage chamber 12. The inlet of the working fluid pump 3 is connected to the liquid storage chamber 12, and the outlet of the working fluid pump 3 is connected to the steam region 111 of the first endothermic evaporation chamber. The steam region 111 of the N-1 endothermic evaporation chambers 11 below the first endothermic evaporation chamber is connected to the steam region 111 of the first endothermic evaporation chamber through a steam riser cavity 103.

[0043] like Figure 2 and Figure 3 As shown, the condensation pipeline 201 of each heat dissipation fin 2 is divided into N heat release condensation zones 21 from top to bottom, and the N heat release condensation zones 21 are sequentially divided from the first heat release condensation zone to the Nth heat release condensation zone from top to bottom, and are respectively connected with the return liquid ports 102 of the first heat absorption evaporation chamber to the Nth heat absorption evaporation chamber. The upper side of the first heat release condensation zone is connected with the steam zone 111 of the first heat absorption evaporation chamber. Any upper and lower adjacent Mth heat release condensation zone is connected with the M+1th heat release condensation zone on the side away from the substrate 1 through the cavity connection zone 22, and the height of the upper side entrance of the cavity connection zone 22 is not lower than the height of the overflow port 101 of the Mth heat absorption evaporation chamber.

[0044] by Figures 2 to 5 Taking the multi-zone phase change heat sink shown as an example, it has three heat absorption evaporation chambers 11, which are the first heat absorption evaporation chamber, the second heat absorption evaporation chamber, and the third heat absorption evaporation chamber from top to bottom. The overflow port 101 of the first heat absorption evaporation chamber is connected to the steam zone 111 of the second heat absorption evaporation chamber, the overflow port 101 of the second heat absorption evaporation chamber is connected to the steam zone 111 of the third heat absorption evaporation chamber, and the overflow port 101 of the third heat absorption evaporation chamber is connected to the liquid storage chamber 12. The working medium pump 3 transports the heat transfer working medium in the liquid storage chamber 12 to the first heat absorption evaporation chamber, and then overflows to the second and third heat absorption evaporation chambers below in sequence.

[0045] The steam zones 111 of the second and third heat absorption evaporation chambers are connected to the steam zone 111 of the first heat absorption evaporation chamber through the steam riser cavity 103, and then are uniformly connected to the condensation pipeline 201 of the heat dissipation fins 2, so that the gas phase working medium in the steam zone 111 of each heat absorption evaporation chamber 11 enters the condensation pipeline 201 of the heat dissipation fins 2.

[0046] Correspondingly, the condensation pipeline 201 of each heat dissipation fin 2 is divided into three heat release condensation zones 21 from top to bottom, and the three heat release condensation zones 21 are the first heat release condensation zone, the second heat release condensation zone, and the third heat release condensation zone from top to bottom. Adjacent heat release condensation zones 21 are separated from each other by an isolation portion 25, and the condensation pipeline 201 is not provided in the area of ​​the isolation portion 25. The first heat release condensation zone is connected to the second heat release condensation zone on the side away from the substrate 1 through the cavity connection area 22, and the second heat release condensation zone is connected to the third heat release condensation zone on the side away from the substrate 1 through the cavity connection area 22. The first heat release condensation zone is provided with a steam inlet 24, which is connected to the steam zone 111 of the first heat absorption evaporation chamber. The bottom of the first to third heat release condensation zones close to the substrate 1 is provided with a cooling medium reflux port 23, which is respectively connected to the liquid return port 102 of the first to third heat absorption evaporation chambers.

[0047] Combination Figure 3 and Figure 5 The heat transfer medium circulation path diagram shown in the figure describes in detail the working principle of the multi-zone phase change heat dissipation of this embodiment.

[0048] The heat generated by the heat source components 4 (such as chips) at different heights is absorbed by the liquid phase working medium in the heat absorption evaporation chamber 11 at the corresponding height, and steam bubbles are generated. Since the steam bubbles have a small density, they float in the liquid phase working medium, driving the liquid to flow upward, and gas-liquid separation is performed in the steam area 111 of the heat absorption evaporation chamber 11.

[0049] The steam in the steam area 111 of each heat absorbing evaporation chamber 11 is collected to the steam area 111 of the uppermost heat absorbing evaporation chamber 11 through the steam rising tube cavity 103, and then enters the condensation pipeline 201 of the heat dissipation fin 2 for heat release condensation. The steam entering the condensation pipeline 201 of the heat dissipation fin 2 is distributed to each heat release condensation area 21 for heat release condensation, and the liquid phase working medium condensed in each heat release condensation area 21 is returned to the liquid phase working medium area 112 of the corresponding heat absorbing evaporation chamber 11 through the liquid return port 102 to replenish the consumption of the liquid phase working medium in the heat absorbing evaporation chamber 11.

[0050] When the working fluid level in any area of ​​each endothermic evaporation chamber 11 in the substrate 1 reaches the lowest liquid level line, the temperature of the high heat flux chip (heat source) rises due to insufficient liquid working fluid. At this time, the heat source temperature signal can be fed back to a working fluid pump controller to control the working fluid pump 3 to start working, or the working fluid pump 3 can be started in a timing manner without the help of a temperature signal. The liquid working fluid in the liquid storage chamber 12 passes through the liquid inlet pipe 31, the working fluid pump 3, and the liquid outlet pipe 32, and is transported to the steam zone 111 of the first endothermic evaporation chamber. When the liquid working fluid level of the first endothermic evaporation chamber reaches the height of the overflow port 101, the liquid working fluid enters the steam zone 111 of the second endothermic evaporation chamber below through the overflow port 101 in turn, until it overflows into the Nth endothermic evaporation chamber (that is, the Nth endothermic evaporation chamber at the lowest part) in turn. Figure 4 and Figure 5 When the liquid level of the liquid phase working medium in the Nth heat absorption evaporation chamber reaches the height of the overflow port 101, the liquid phase working medium enters the liquid storage chamber 12 through the overflow port 101. After the working medium pump 3 runs for a predetermined time or the heat source temperature is controlled within a desired range, the working medium pump 3 stops working.

[0051] In the above preferred embodiment, a plurality of heat-absorbing evaporation chambers 11 are arranged in the substrate 1 of the radiator, so that the heat source components 4 located at different heights are all below the liquid surface of the liquid phase medium, ensuring that each heat source component 4 quickly conducts away the heat through the phase change of the heat transfer medium. Furthermore, the liquid phase medium in the plurality of heat-absorbing evaporation chambers 11 is separated from each other, thereby reducing the heat dissipation effect between the heat source components 4 at different heights, so that the heat source components 4 at each height layer can have a good and basically consistent heat dissipation effect.

[0052] At the same time, the condensation pipeline 201 of the heat dissipation fin 2 is divided into a plurality of heat release condensation areas 21 corresponding to the heat absorption evaporation chamber 11, and the liquid phase working medium of each heat release condensation area 21 flows back to the corresponding heat absorption evaporation chamber 11 to replenish the consumption of the liquid phase working medium in the heat absorption evaporation chamber 11, thereby reducing the number of times of replenishing liquid and the start-up frequency of the working medium pump 3. Due to the arrangement of a plurality of heat absorption evaporation chambers 11 and a plurality of heat release condensation areas 21 at different heights, the amount of liquid phase heat transfer working medium used can be reduced, ensuring that the amount of accumulated liquid in the condensation pipeline 201 of the heat dissipation fin 2 is relatively small, so that the heat dissipation area occupied by the liquid phase heat transfer working medium is small, the condensation heat exchange area is relatively increased, and the heat dissipation capacity and heat dissipation efficiency of the radiator are improved.

[0053] Furthermore, the steam zones 111 of each heat-absorbing evaporation chamber 11 are connected to the steam zone 111 of the uppermost heat-absorbing evaporation chamber 11 and enter the uppermost heat-releasing condensation zone 21, and each heat-releasing condensation zone 21 is interconnected, thereby ensuring the pressure balance in each steam zone 111 and each heat-releasing condensation zone 21, and the heat-releasing condensation zones 21 that are interconnected can most effectively utilize the condensation and heat-dissipating area of ​​the heat-dissipating fins 2, thereby improving the heat-dissipating efficiency.

[0054] In one embodiment, if Figure 4 and Figure 5 As shown, a liquid infusion lumen 104 may be provided in the substrate 1, the upper end of the liquid infusion lumen 104 is connected to the steam area 111 of the first heat release condensation area, and the lower end of the liquid infusion lumen 104 extends toward the liquid storage cavity 12. The inlet of the working fluid pump 3 is connected to the liquid storage cavity 12 through a liquid inlet pipe 31, and the outlet of the working fluid pump 3 is connected to the lower end of the liquid infusion lumen 104 through a liquid outlet pipe 32.

[0055] In one embodiment, if Figure 2 and Figure 3 As shown, the lower side of each heat release condensation area 21 of the heat dissipation fin 2 can be inclined, and the side away from the substrate 1 is higher than the side close to the substrate 1. A cooling medium return port 23 is provided at the bottom of the heat release condensation area 21 close to the substrate 1, and the cooling medium return port 23 is connected to the liquid return port 102 of the heat absorption evaporation chamber 11. The lower side of the heat release condensation area 21 can be inclined to facilitate the condensed liquid phase medium to flow back to the heat absorption evaporation chamber 11.

[0056] In one embodiment, if Figure 2 and Figure 3 As shown, the condensation pipeline 201 in the heat dissipation fin 2 is composed of a plurality of interconnected grid-like pipelines. The grid-like pipelines can be hexagonal honeycomb, multiple U-shaped, diamond-shaped, triangular, circular ring-shaped or any combination thereof connected end to end.

[0057] In one embodiment, if Figure 6 As shown, the heat dissipation fin 2 can be a composite plate structure, including a first plate 202 and a second plate 203 assembled together, and the condensation pipeline 201 is formed by a rolling and inflation process or a mold forming and brazing process. The materials of the first plate 202 and the second plate 203 are both metal materials with good thermal conductivity, specifically, they can include but are not limited to copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or any combination of any one or more, that is, the first plate 202 and the second plate 203 can be a single layer material layer or a multi-layer material layer, but the inner layer is preferably an aluminum material layer.

[0058] In one example, the first plate 202 and the second plate 203 may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, or a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, or a titanium-aluminum composite plate including a titanium material layer and an aluminum material layer. The inner layers of the first plate 202 and the second plate 203 may be set as aluminum material layers and contact each other. When the first plate 202 and the second plate 203 are aluminum-copper composite plates, it can be ensured that the copper material layer is located on the outside, that is, the outer surface of the heat sink fin 2 is a copper layer, which can be directly welded and has excellent heat dissipation performance.

[0059] In one embodiment, if Figure 4 and Figure 5 As shown, except for the bottom heat absorption evaporation chamber 11 (the Nth heat absorption evaporation chamber), in any upper and lower adjacent Mth heat absorption evaporation chamber and M+1th heat absorption evaporation chamber, the overflow port 101 of the Mth heat absorption evaporation chamber is connected with the steam area 111 of the M+1th heat absorption evaporation chamber through an overflow tube cavity 105. The overflow tube cavity 105 may be a cavity structure provided in the substrate 1, or may be replaced by an external pipeline.

[0060] In one embodiment, if Figures 2 to 5 As shown, an enhanced evaporation heat exchange structure 115 may be provided on the inner wall of the heat absorbing evaporation chamber 11 corresponding to the heat source mounting portion 114. The enhanced evaporation heat exchange structure 115 may be a convex structure arranged in an array, and may be manufactured on the substrate 1 body by subtractive processing. The enhanced evaporation heat exchange structure 115 increases the contact area with the liquid phase working medium, and can absorb heat and transfer heat faster.

[0061] In one embodiment, if Figure 5 As shown, vertical guide blocks 116 are arranged on both sides of the enhanced evaporation heat exchange structure 115. The upper end of the guide block 116 extends to the steam area 111 of the heat absorption evaporation chamber 11, and a gap is left between the lower end of the guide block 116 and the bottom wall of the heat absorption evaporation chamber 11. During operation, in the liquid phase working medium area 112, the area between the guide blocks 116 where the enhanced evaporation heat exchange structure 115 is located is a gas-liquid two-phase mixing area 1122, and the area between the guide blocks 116 where the enhanced evaporation heat exchange structure 115 is not arranged is a single-phase liquid working medium area 1121.

[0062] Among them, the liquid phase working medium on the surface of the enhanced evaporation heat exchange structure 115 absorbs heat and evaporates, generating a large number of steam bubbles. Due to the low density of the steam bubbles, they quickly float up in the liquid phase working medium, driving the liquid to flow upward together, and gas-liquid separation is carried out in the upper steam zone 111, and the liquid phase returns to the single-phase liquid working medium zone 1121, and the steam is in the steam zone 111. At the same time, the liquid phase working medium in the single-phase liquid working medium zone 1121 enters the lower part of the gas-liquid two-phase mixing zone 1122 through the lower gap of the guide block 116 to replenish the liquid reduced by evaporation. It can be seen that by setting the enhanced evaporation heat exchange structure 115 and the guide block 116, the heat exchange area is increased, the fluidity of the working medium is improved, which helps to increase the heat exchange rate and reduce the temperature difference of the heat source.

[0063] like Figure 3As shown, the embodiment of the present application provides a heat source heat dissipation system, including a heat source component 4 (such as a chip), a working fluid pump controller (not shown in the figure) and the aforementioned multi-zone phase change radiator. The heat source component 4 is installed on a heat source installation portion 114 provided on the surface of the substrate 1 of the multi-zone phase change radiator, and the working fluid pump controller is used to obtain the temperature of the heat source component 4, and control the start and stop of the working fluid pump 3 based on the obtained temperature.

[0064] The heat source component 4 may be a chip with a temperature detection function. The temperature data acquired by the chip itself is transmitted to the working fluid pump controller, so that the working fluid pump controller controls the start and stop of the working fluid pump 3 based on the acquired temperature.

[0065] An independent temperature detection sensor may also be arranged near the heat source component 4 and communicated with the working fluid pump controller. The temperature data acquired by the temperature detection sensor is transmitted to the working fluid pump controller, so that the working fluid pump controller controls the start and stop of the working fluid pump 3 based on the acquired temperature.

[0066] The multi-zone phase change heat sink of the present application can be widely used in 5G communications, AI large model training data centers and edge computing, high-power laser equipment, power electronics and new energy and other fields.

[0067] The above description is only a partial embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-zone phase change heat sink, comprising a substrate (1) and heat dissipation fins (2), characterized in that: It also includes a working fluid pump (3); N heat-absorbing evaporation chambers (11) and a liquid storage chamber (12) for storing a heat transfer medium are sequentially arranged inside the substrate (1) from top to bottom, wherein N is ≥ 2; The working fluid pump (3) is used to transport the heat transfer working fluid in the liquid storage chamber (12) to the heat absorption evaporation chamber (11); Each of the heat-absorbing evaporation chambers (11) is provided with an overflow port (101), the area above the height of the overflow port (101) is a steam area (111), and the area below the height of the overflow port (101) is a liquid-phase working medium-containing area (112); Excess liquid working medium in the heat absorption evaporation chamber (11) overflows through the overflow port (101) and eventually flows back into the liquid storage chamber (12); The substrate (1) comprises a first surface and a second surface opposite to each other, and a heat source mounting portion (114) is provided at a position on the first surface of the substrate (1) corresponding to the liquid phase working medium containing region (112) of the heat absorption evaporation chamber (11); A plurality of the heat dissipation fins (2) are mounted on the second surface of the substrate (1); each of the heat dissipation fins (2) is provided with a condensation pipeline (201); the steam region (111) of the heat absorption evaporation chamber (11) is connected to the condensation pipeline (201) of the heat dissipation fin (2); and the gas phase working medium is cooled into a liquid phase working medium in the condensation pipeline (201) and then flows back into each of the heat absorption evaporation chambers (11) and / or directly flows back into the liquid storage chamber (12); An enhanced evaporation heat exchange structure (115) is provided on the inner wall of the heat absorption evaporation chamber (11) corresponding to the heat source mounting portion (114); Vertical guide blocks (116) are arranged on both sides of the enhanced evaporation heat exchange structure (115); The upper end of the guide block (116) extends to the steam region (111) of the heat absorption evaporation chamber (11), and a gap is left between the lower end of the guide block (116) and the bottom wall of the heat absorption evaporation chamber (11).

2. The multi-zone phase change heat sink according to claim 1, characterized in that: The N heat absorption evaporation chambers (11) are sequentially from the first heat absorption evaporation chamber to the Nth heat absorption evaporation chamber from top to bottom; Each of the heat-absorbing evaporation chambers (11) is further provided with a liquid return port (102), and the height of the liquid return port (102) is lower than the overflow port (101); In any upper and lower adjacent Mth heat absorption evaporation chamber and M+1th heat absorption evaporation chamber, 1≤M≤N-1, the overflow port (101) of the Mth heat absorption evaporation chamber is connected to the steam area (111) of the M+1th heat absorption evaporation chamber; the overflow port (101) of the Nth heat absorption evaporation chamber is connected to the liquid storage chamber (12); The inlet of the working fluid pump (3) is in communication with the liquid storage chamber (12), and the outlet of the working fluid pump (3) is in communication with the steam region (111) of the first heat absorption evaporation chamber; The steam areas (111) of the N-1 heat absorbing evaporation chambers (11) below the first heat absorbing evaporation chamber are connected to the steam area (111) of the first heat absorbing evaporation chamber via a steam rising tube cavity (103); The condensation pipeline (201) of each heat dissipation fin (2) is divided into N heat release condensation areas (21) from top to bottom, and the N heat release condensation areas (21) are sequentially from the first heat release condensation area to the Nth heat release condensation area from top to bottom, and are respectively connected to the liquid return ports (102) of the first heat absorption evaporation chamber to the Nth heat absorption evaporation chamber in sequence; The upper side of the first heat release condensation zone is connected to the steam zone (111) of the first heat absorption evaporation chamber; Any upper and lower adjacent Mth heat release condensation zone and M+1th heat release condensation zone are connected via a cavity connection zone (22) on the side away from the substrate (1), and the height of the upper entrance of the cavity connection zone (22) is not lower than the height of the overflow port (101) of the Mth heat absorption evaporation chamber.

3. The multi-zone phase change heat sink according to claim 2, characterized in that: The substrate (1) is provided with a liquid infusion lumen (104), the upper end of the liquid infusion lumen (104) being in communication with the steam region (111) of the first heat release condensation region, and the lower end of the liquid infusion lumen (104) extending in a direction close to the liquid storage chamber (12); The inlet of the working fluid pump (3) is connected to the liquid storage chamber (12) via a liquid inlet pipe (31), and the outlet of the working fluid pump (3) is connected to the lower end of the liquid infusion lumen (104) via a liquid outlet pipe (32).

4. The multi-zone phase change heat sink according to claim 2, characterized in that: The lower side of each of the heat release condensation areas (21) of the heat dissipation fins (2) is inclined, and the side away from the substrate (1) is higher than the side close to the substrate (1); A cooling medium return port (23) is provided at the bottom of the heat release condensation zone (21) on the side close to the substrate (1), and the cooling medium return port (23) is connected to the liquid return port (102) of the heat absorption evaporation chamber (11).

5. The multi-zone phase change heat sink according to claim 4, characterized in that: The condensation pipeline (201) in the heat dissipation fin (2) is composed of a plurality of grid-like pipelines that are interconnected.

6. The multi-zone phase change heat sink according to claim 2, characterized in that: The heat dissipation fin (2) is a composite plate structure, comprising a first plate (202) and a second plate (203) that are assembled together, and the condensation pipeline (201) is formed by a rolling and inflation process or a mold forming and brazing process.

7. The multi-zone phase change heat sink according to claim 2, characterized in that: In any upper and lower adjacent Mth heat absorption evaporation chamber and M+1th heat absorption evaporation chamber, the overflow port (101) of the Mth heat absorption evaporation chamber is connected to the steam area (111) of the M+1th heat absorption evaporation chamber via an overflow tube cavity (105).

8. A heat source heat dissipation system, comprising a heat source component (4), characterized in that: It also includes a working fluid pump controller and a multi-zone phase change heat sink as claimed in any one of claims 1 to 7; The heat source component (4) is mounted on a heat source mounting portion (114) provided on the surface of the substrate (1) of the multi-zone phase change heat sink; The working fluid pump controller is used to obtain the temperature of the heat source component (4), and to control the start and stop of the working fluid pump (3) based on the obtained temperature.

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