Array substrate, display device and maintenance method of array substrate

Abstract

The invention relates to the technical field of display, and particularly discloses an array substrate, a display device and a maintenance method of the array substrate, the array substrate comprises a substrate and a plurality of signal lines formed on the substrate, the array substrate further comprises a switch unit and at least one group of maintenance lines, the maintenance lines and the signal lines are mutually insulated, and the switch unit is arranged on the substrate. The signal line comprises two opposite end parts, the two end parts of the signal line are respectively connected with the maintenance line through the switch unit, and the switch unit is used for controlling the connection or disconnection between the two end parts of the signal line and the maintenance line. According to the array substrate, the switch unit can be used for controlling connection or disconnection between the signal line and the maintenance line. When the signal line has a defect, the two end parts of the signal line can be respectively connected with the maintenance line through the switch units, so that the maintenance line is used for replacing the signal line to transmit a signal transmitted in the signal line, and the defect of the signal line is maintained.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array substrate, a display device and a maintenance method for the array substrate. Background Art

[0002] The current OLED (Organic Light-Emitting Diode) industry has higher and higher requirements for resolution, smaller wiring space, and more complex film layers. In the current production process, the signal lines in the display may have short circuits or open circuits. The existing technology usually uses chemical vapor deposition to solve signal line defects. However, as the size of the display becomes smaller and smaller, the deposition width of this maintenance method is limited, and high-resolution products may not have space for deposition maintenance. It can be seen that the existing maintenance methods have great limitations. Summary of the invention

[0003] Based on this, it is necessary to provide an array substrate, a display device and a method for repairing the array substrate in order to address the problem that existing repair methods have great limitations.

[0004] An array substrate comprises a substrate and a plurality of signal lines formed on the substrate, the array substrate further comprising a switch unit and at least one group of maintenance lines, the maintenance lines and the signal lines are insulated from each other, the signal lines comprise two opposite ends, the two ends of the signal lines are respectively connected to the maintenance lines through the switch unit, and the switch unit is used to control the conduction or disconnection of the connection between the two ends of the signal lines and the maintenance lines.

[0005] In one embodiment, the switching unit includes a first transistor, which is a dual-gate transistor, wherein the first gate of the first transistor is connected to a cutoff signal, the second gate of the first transistor is connected to a turn-on signal, the first electrode of the first transistor is connected to an end of the signal line, and the second electrode of the first transistor is connected to the maintenance line.

[0006] In one embodiment, the first transistor is a P-type transistor.

[0007] In one embodiment, the on-signal is a low-level signal, the off-signal is a high-level signal, the first gate of the first transistor is connected to a low-level signal line, and the second gate of the first transistor is connected to a high-level signal line.

[0008] In one embodiment, the switching unit includes a second transistor, a third transistor and a fourth transistor, the first electrode of the second transistor is connected to a cutoff signal, the gate of the second transistor is connected to a turn-on signal, the second electrode of the second transistor is connected to the gate of the third transistor, the first electrode of the third transistor is connected to the turn-on signal, the second electrode of the third transistor is connected to the gate of the fourth transistor, the gate of the fourth transistor is connected to the cutoff signal, the first electrode of the fourth transistor is connected to the end of the signal line, and the second electrode of the fourth transistor is connected to the maintenance line.

[0009] In one embodiment, the second transistor, the third transistor and the fourth transistor are P-type transistors.

[0010] In one embodiment, the turn-on signal is a low-level signal, the turn-off signal is a high-level signal, the first electrode of the second transistor is connected to the high-level signal line, the gate of the second transistor is connected to the low-level signal line, the first electrode of the third transistor is connected to the low-level signal line, and the gate of the fourth transistor is connected to the high-level signal line.

[0011] In one of the embodiments, the array substrate includes a display area and a non-display area, a plurality of signal lines are arranged in an array in the display area, the switch unit and the repair line are arranged in the non-display area, and the signal line extends along a first direction to the non-display area and is connected to the switch unit.

[0012] In one embodiment, the maintenance line includes a first maintenance section, a second maintenance section and a third maintenance section, the first maintenance section extends along the first direction in the non-display area, two ends of the first maintenance section are respectively connected to the second maintenance section and the third maintenance section, and the second maintenance section and the third maintenance section extend along the second direction in the non-display area.

[0013] In one embodiment, the upper end of the signal line is connected to the second maintenance part of the maintenance line through the switch unit, and the lower end of the signal line is connected to the third maintenance part of the maintenance line through the switch unit.

[0014] In one embodiment, the maintenance line also includes a fourth maintenance portion, which extends in the non-display area along the first direction, and both ends of the fourth maintenance portion are respectively connected to the second maintenance portion and the third maintenance portion, and the first maintenance portion, the second maintenance portion, the third maintenance portion and the fourth maintenance line form a closed signal line in the non-display area.

[0015] In one of the embodiments, when there is a defect in the array substrate, the signal line corresponding to the defective position is disconnected, the switch units connected at both ends of the signal line corresponding to the defective position are turned on, and the signal transmitted on the signal line corresponding to the defective position is transmitted using the repair line.

[0016] In one of the embodiments, when there are two defects in the array substrate, the signal lines corresponding to the two defective positions are disconnected, the second maintenance section is divided into an independent first section and a second section, the third maintenance section is divided into an independent third section and a fourth section, the switch units connected at both ends of the signal lines corresponding to the two defective positions are turned on, and a signal transmitted on the signal line corresponding to one of the defective positions is transmitted via an independent maintenance line composed of the first section, the first maintenance section and the third section, and a signal transmitted on the signal line corresponding to the other defective position is transmitted via another independent maintenance line composed of the second section, the fourth maintenance section and the fourth section.

[0017] In one embodiment, the signal line is a data line and / or a scan line.

[0018] A display device comprises the array substrate as described in any one of the above embodiments.

[0019] A method for repairing an array substrate, the array substrate comprising a substrate and a plurality of signal lines formed on the substrate, the array substrate further comprising a switch unit and at least one group of repair lines, the method comprising judging whether the signal line has a defect; judging the defect type of the signal line in response to a judgment result that the signal line has a defect; when the defect type is an open circuit defect, controlling the switch unit to conduct the connection between the two ends of the signal line and the repair line, and using the repair line to transmit the signal transmitted on the signal line.

[0020] In one of the embodiments, after determining the defect type of the signal line in response to a determination result that the signal line has a defect, the method further includes, when the defect type of the signal line is a short circuit defect, determining a defect position that causes a short circuit between two adjacent signal lines; determining a short circuit area based on the defect position; cutting off a portion of one of the short-circuited signal lines that is in the short circuit area; and controlling a switch unit to conduct the connection between the two ends of the signal line and a maintenance line, and using the maintenance line to transmit the signal transmitted on the signal line.

[0021] In one of the embodiments, in response to a judgment result that there is a defect in the signal line, after judging the defect type of the signal line, the method further includes, when there are two defects in the array substrate and the repair line is a closed signal line, cutting the repair line into two independent repair lines, and the two independent repair lines are used to repair the two defects respectively.

[0022] In one embodiment, the switch unit includes a first transistor, and the control switch unit to conduct the connection between the two ends of the signal line and the maintenance line includes disconnecting a cutoff signal connected to a first gate of the first transistor.

[0023] In one of the embodiments, the laser is controlled to cut off the connection between the first gate of the first transistor and the high-level signal line.

[0024] In one embodiment, the switch unit includes a second transistor and a fourth transistor, and the control switch unit turns on the connection between the two ends of the signal line and the maintenance line, including disconnecting the cutoff signal connected to the first electrode of the second transistor and disconnecting the cutoff signal connected to the gate of the fourth transistor.

[0025] In one embodiment, the laser is controlled to cut off the connection between the first electrode of the second transistor and the high-level signal line, and the laser is controlled to cut off the connection between the gate of the fourth transistor and the high-level signal line.

[0026] The array substrate comprises a substrate and a plurality of signal lines formed on the substrate, and the array substrate further comprises a switch unit and at least one group of repair lines. The repair line and the signal line are insulated from each other, and the two ends of the signal line are respectively connected to the repair line through the switch unit. The switch unit can be used to control the conduction or disconnection of the connection between the signal line and the repair line. When a defect occurs in the signal line, the two ends of the signal line can be connected to the repair line through the switch unit respectively, so that the repair line is used to replace the signal line to transmit the signal transmitted in the signal line, thereby realizing the repair of the defect of the signal line. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the implementation methods of this specification or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1 A schematic diagram of repairing an open circuit defect of a signal line by using chemical vapor deposition in an existing solution;

[0029] Figure 2 This is a schematic diagram of the structure of an array substrate in one of the embodiments of the present application;

[0030] Figure 3 This is a schematic diagram of the structure of a switch unit in an array substrate in one of the embodiments of the present application;

[0031] Figure 4 for Figure 3 A schematic diagram showing a defect in the array substrate;

[0032] Figure 5 This is a schematic diagram of the structure of a switch unit in an array substrate in another embodiment of the present application;

[0033] Figure 6 for Figure 5 A schematic diagram showing a defect in the array substrate;

[0034] Figure 7 This is a structural schematic diagram of a maintenance line provided for an array substrate in one of the embodiments of the present application;

[0035] Figure 8 This is a structural schematic diagram of an array substrate provided with two groups of maintenance lines in one embodiment of the present application;

[0036] Fig. 9 This is a structural schematic diagram of a maintenance line provided for an array substrate in another embodiment of the present application;

[0037] Fig.10 This is a flow chart of a method for repairing an array substrate in one of the embodiments of the present application;

[0038] Fig.11 This is a flow chart of a method for repairing an array substrate in one of the embodiments of the present application. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure of the present invention more thoroughly and comprehensively.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be construed as being one in number.

[0042] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0043] In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] Figure 1 FIG. 1 is a schematic diagram of repairing an open circuit defect of a signal line by using chemical vapor deposition in an existing solution. Figure 1 The open circuit defect at the position marked by ① is achieved by chemical vapor deposition to connect the upper and lower signal lines at the open circuit position. Figure 1 The defect between the two signal lines at the position marked ② is caused by a short circuit due to foreign matter, and the chemical vapor deposition method cannot repair it.

[0045] In addition, as the display screen has higher and higher requirements for resolution, the distance between signal lines is getting closer and closer, resulting in insufficient space for chemical vapor deposition (tungsten powder deposition) repairs. The tungsten powder has a large radiation area, and the signal lines formed by deposition may cause new short circuit problems. In addition, there is the possibility of tungsten powder falling off and repair failure. Even if the repair is successful, there is a risk of disconnection of the tungsten powder connection line later. At the same time, due to the use of chemical vapor deposition technology for repairs, laser heating is required to form a connecting line. However, the organic layer may fall off during laser heating. Therefore, for the solution of using organic materials to prepare metal wires, chemical vapor deposition cannot be used for repair.

[0046] Figure 2This is a schematic diagram of the structure of an array substrate in one embodiment of the present application. In one embodiment, the array substrate may include a substrate and a plurality of signal lines 100 formed on the substrate. The array substrate may also include a switch unit 200 and at least one group of repair lines 300. The signal line 100 may be a data line, and the signal line 100 may also be a scan line.

[0047] The repair line 300 can be insulated from the signal line 100 to prevent the repair line 300 from affecting the normal transmission of the signal line 100. The signal line 100 may include two opposite ends, and the two ends of the signal line 100 may be connected to the repair line 300 through the switch unit 200, respectively. Specifically, one end of the signal line 100 is connected to the repair line 300 through the switch unit 200, and the other end of the signal line 100 is also connected to the repair line 300 through the switch unit 200. In this embodiment, the number of switch units 200 in the array substrate can be determined according to the number of signal lines 100. Preferably, the number of switch units 200 in the array substrate is not less than twice the number of signal lines 100.

[0048] The switch unit 200 can be used to control the connection between the two ends of the signal line 100 and the repair line 300. When the switch unit 200 controls the connection between the two ends of the signal line 100 and the repair line 300, the signal line 100 can normally realize signal transmission. When any signal line 100 in the array substrate has a defect, the switch unit 200 connected to the signal line 100 can conduct the connection between the two ends of the signal line 100 and the repair line 300, so that the repair line 300 can replace the defective signal line 100, and the repair line 300 can be used to transmit the signal transmitted in the signal line, thereby realizing the repair of the defect of the signal line 100.

[0049] In the array substrate provided in the present application, by designing the switch unit 200 and the repair line 300, the switch unit 200 can be used to control the connection between the signal line 100 and the repair line 300. When the signal line 100 is normal, the connection between the signal line 100 and the repair line 300 is disconnected, and the repair line 300 will not affect the normal transmission of the signal in the signal line 100; when the signal line 100 is abnormal, the connection between the signal line 100 and the repair line 300 is connected, and the repair line 300 can replace the signal line 100 to transmit the signal, thereby realizing the repair of the signal line 100.

[0050] Figure 3 Schematic diagram of the structure of a switch unit in an array substrate in one embodiment of the present application. In one embodiment, the switch unit 200 may include a first transistor T1.

[0051] In the embodiments of the present disclosure, a transistor refers to a component including at least a gate, a drain, and a source. In the present disclosure, the first electrode of the transistor may be a drain, the second electrode may be a source, or the first electrode may be a source, and the second electrode may be a drain. In the case of using transistors with opposite polarities or the current direction changes during circuit operation, the functions of the "source" and "drain" are sometimes interchanged. In the embodiments of the present disclosure, the gates of all or part of the transistors may be used as control electrodes, and the first electrode and the second electrode may be interchangeable as needed.

[0052] In the embodiment of the present disclosure, the first transistor T1 may be a dual-gate transistor. A dual-gate transistor is a special type of field effect transistor having two gates. In a dual-gate transistor design, in addition to a conventional gate, there is an additional control gate, which can provide additional flexibility and functionality for the electrical control of the transistor, and the dual-gate structure can provide more sophisticated electrical control capabilities.

[0053] The first gate of the first transistor T1 can be connected to a cut-off signal, and the second gate of the first transistor T1 can be connected to a turn-on signal. The first electrode of the first transistor T1 can be connected to the signal line 100, and the second electrode of the first transistor T1 can be connected to the maintenance line 300. Since the first gate of the first transistor T1 is connected to the cut-off signal, the first transistor T1 is in a normally closed stage, that is, the connection between the signal line 100 and the maintenance line 300 is in a disconnected state for a long time, preventing the maintenance line 300 from short-circuiting the signal line 100 and affecting the normal transmission of the signal on the signal line 100.

[0054] The cut-off signal connected to the first gate of the first transistor T1 and the turn-on signal connected to the second gate of the first transistor T1 can be determined according to the device type of the first transistor T1. When the first transistor T1 is an N-type transistor, the cut-off signal can be a low-level signal VGL, and the turn-on signal can be a high-level signal VGH; when the first transistor T1 is a P-type transistor, the cut-off signal can be a high-level signal VGH, and the turn-on signal can be a low-level signal VGL. In this embodiment, preferably, the first transistor T1 is a P-type transistor, that is, the cut-off signal is a high-level signal VGH, and the turn-on signal is a low-level signal VGL. The first gate of the first transistor T1 can be connected to the high-level signal VGH by connecting the high-level signal line, and the second gate of the first transistor T1 can be connected to the low-level signal VGL by connecting the low-level signal line.

[0055] Figure 4 for Figure 3 Schematic diagram of defects in the array substrate shown, wherein: Figure 4 The signal line 100a corresponding to the position marked ① has an open circuit defect. Figure 4There is a defect at the position marked ② in the middle, which causes a short circuit between two adjacent signal lines 100b and 100c. Figure 4 Each first transistor T1 is a P-type transistor, the first gate of each first transistor T1 is connected to a high-level signal line, and the second gate of each first transistor T1 is connected to a low-level signal line. The high-level signal line is used to transmit a high-level signal VGH, and the low-level signal line is used to transmit a low-level signal VGL. Since the first gate of each first transistor T1 is connected to the high-level signal VGH, each first transistor T1 in the array substrate is in a long-term cut-off state. The signal line 100a is used to transmit the data1 signal, the signal line 100b is used to transmit the data2 signal, and the signal line 100c is used to transmit the data3 signal.

[0056] When the array substrate is detected as Figure 4 When an open circuit defect is found in the position ① of the signal line 100a, the repair line 300 can be used to repair the signal line 100a with the open circuit defect. Specifically, the two ends of the signal line 100a are connected to the repair line 300 through two first transistors T1 respectively. By disconnecting the connection between the first gates of the two first transistors T1 and the high-level signal line, the two first transistors T1 can be turned on according to the low-level signal VGL connected to the second gate. When an open circuit defect occurs in the signal line 100a, the signal line 100a will not be able to transmit the data1 signal normally. By turning on the two first transistors T1 connected to the signal line 100a, the connection between the signal line 100a and the repair line 300 can be turned on, so that the repair line 300 can replace the signal line 100a to continue to transmit the data1 signal, thereby repairing the open circuit defect of the signal line 100a. At the same time, since the other first transistors T1 are still in the off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0057] When the array substrate is detected as Figure 4 When there is a defect in the position ② of FIG. 2 that causes a short circuit between two adjacent signal lines 100b and 100c, the repair line 300 can be used to repair the short circuit defect. Specifically, the location of the foreign object that causes the short circuit between signal line 100b and signal line 100c is determined, and the areas above and below the location of the foreign object on signal line 100b or signal line 100c are cut off to open the signal line 100b or signal line 100c. Figure 4 As shown, the areas at the upper and lower ends of the signal line 100c where the foreign matter is located are cut along the tangent lines A1 and A2 to open the signal line 100c, thereby solving the problem of short circuit between the signal line 100b and the signal line 100c.

[0058] At the same time, disconnect the connection between the first gates of the two first transistors T1 connected to the signal line 100c and the high-level signal line. By disconnecting the connection between the first gates of the two first transistors T1 and the high-level signal line, the two first transistors T1 can be turned on according to the low-level signal VGL connected to the second gate. Since the signal line 100c is opened in the pre-processing to solve the short circuit problem between the signal line 100b and the signal line 100c, the signal line 100c will not be able to transmit the data3 signal normally at this time. By turning on the two first transistors T1 connected to the signal line 100c, the connection between the signal line 100c and the maintenance line 300 can be turned on, so that the maintenance line 300 can replace the signal line 100c to continue to transmit the data3 signal. At this time, the signal line b can continue to transmit the data2 signal normally, and the maintenance line 300 replaces the signal line 100c to transmit the data3 signal, which solves the problem of Figure 4 At the same time, since the other first transistors T1 are still in the cut-off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0059] Figure 5 This is a schematic diagram of the structure of a switch unit in an array substrate in another embodiment of the present application. In one embodiment, the switch unit 200 may include a second transistor T2, a third transistor T3, and a fourth transistor T4. The first electrode of the second transistor T2 may be connected to a cutoff signal, the gate of the second transistor T2 may be connected to a turn-on signal, the second electrode of the second transistor T2 may be connected to the gate of the third transistor T3, the first electrode of the third transistor T3 may be connected to a turn-on signal, the second electrode of the third transistor T3 may be connected to the gate of the fourth transistor T4, the gate of the fourth transistor T4 may be connected to a cutoff signal, the first electrode of the fourth transistor T4 may be connected to the signal line 100, and the second electrode of the fourth transistor T4 may be connected to the maintenance line 300.

[0060] Since the gate of the second transistor T2 is connected to the conduction signal, the second transistor T2 is in the conduction state. The second transistor T2 can transmit the cut-off signal to the gate of the third transistor T3, and the third transistor T3 is cut off according to the gate cut-off signal. At the same time, since the gate of the fourth transistor T4 is connected to the cut-off signal, the fourth transistor T4 is in the cut-off state. That is, the connection between the signal line 100 and the maintenance line 300 is in a disconnected state for a long time, preventing the maintenance line 300 from shorting the signal line 100 and affecting the normal transmission of the signal on the signal line 100.

[0061] Similarly, in this embodiment, the cut-off signal and the conduction signal can also be determined according to the device types of the second transistor T2, the third transistor T3, and the fourth transistor T4. When the second transistor T2, the third transistor T3, and the fourth transistor T4 are N-type transistors, the cut-off signal can be a low-level signal VGL, and the conduction signal can be a high-level signal VGH; when the second transistor T2, the third transistor T3, and the fourth transistor T4 are P-type transistors, the cut-off signal can be a high-level signal VGH, and the conduction signal can be a low-level signal VGL.

[0062] In the embodiment of the present disclosure, preferably, the second transistor T2, the third transistor T3 and the fourth transistor T4 are P-type transistors, that is, the cut-off signal is a high-level signal VGH, and the turn-on signal is a low-level signal VGL. That is, the first electrode of the second transistor T2 can be connected to the high-level signal line, the gate of the second transistor T2 can be connected to the low-level signal line, the first electrode of the third transistor T3 can be connected to the low-level signal line, and the gate of the fourth transistor T4 can be connected to the high-level signal line.

[0063] Figure 6 for Figure 5 Schematic diagram of defects in the array substrate shown, wherein: Figure 6 The signal line 100a corresponding to the position marked ① has an open circuit defect. Figure 6 There is a defect at the position marked ② in the middle, which causes a short circuit between two adjacent signal lines 100b and 100c. Figure 6 The second transistor T2, the third transistor T3 and the fourth transistor T4 are P-type transistors. The signal line 100a is used to transmit the data1 signal, the signal line 100b is used to transmit the data2 signal, and the signal line 100c is used to transmit the data3 signal. The two ends of each signal line 100 in the array substrate are connected to the maintenance line 300 through the transistor combination formed by the second transistor T2, the third transistor T3 and the fourth transistor T4. The first electrode of the second transistor T2 is connected to the high level signal VGH, the gate of the second transistor T2 is connected to the low level signal VGL, the first electrode of the third transistor T3 is connected to the low level signal VGL, and the gate of the fourth transistor T4 is connected to the high level signal VGH.

[0064] When the array substrate is detected as Figure 6When there is an open circuit defect as shown in position ① of the signal line 100a, the maintenance line 300 can be used to repair the signal line 100a with the open circuit defect. Specifically, the connection between the first electrode of the second transistor T2 and the high-level signal line in the two groups of switch units 200 connected to the signal line 100a is disconnected, and the connection between the fourth transistor T4 and the high-level signal line is disconnected. Since the connection between the first electrode of the second transistor T2 and the high-level signal line is disconnected, the second transistor T2 will not transmit the high-level signal VGH to the gate of the third transistor T3. The gate leakage of the second transistor T2 will drive the gate of the third transistor T3 to open, so that the third transistor T3 can transmit the low-level signal VGL to the fourth transistor T4. The fourth transistor T4 can be turned on according to the low-level signal VGL, and at this time, the connection between the maintenance line 300 and the signal line 100a is turned on.

[0065] When an open circuit defect occurs in the signal line 100a, the signal line 100a will not be able to transmit the data1 signal normally. By turning on the two sets of switch units 200 connected to the signal line 100a, the connection between the signal line 100a and the repair line 300 can be turned on, so that the repair line 300 can replace the signal line 100a to continue to transmit the data1 signal, thereby repairing the open circuit defect of the signal line 100a. At the same time, since the other switch units 200 in the array substrate are still in the off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0066] When the array substrate is detected as Figure 6 When there is a defect in the position ② of FIG. 2 that causes a short circuit between two adjacent signal lines 100b and 100c, the repair line 300 can be used to repair the short circuit defect. Specifically, the location of the foreign object that causes the short circuit between signal line 100b and signal line 100c is determined, and the areas above and below the location of the foreign object on signal line 100b or signal line 100c are cut off to open the signal line 100b or signal line 100c. Figure 6 As shown, the areas at the upper and lower ends of the signal line 100c where the foreign matter is located are cut along the tangent lines B1 and B2 to open the signal line 100b, thereby solving the short circuit problem between the signal line 100b and the signal line 100c.

[0067] At the same time, the connection between the first pole of the second transistor T2 and the high-level signal line in the two groups of switch units 200 connected to the signal line 100b is disconnected, and the connection between the fourth transistor T4 and the high-level signal line is disconnected. Similarly, since the connection between the first pole of the second transistor T2 and the high-level signal line is disconnected, the second transistor T2 will not transmit the high-level signal VGH to the gate of the third transistor T3. The gate leakage of the second transistor T2 will drive the gate of the third transistor T3 to open, so that the third transistor T3 can transmit the low-level signal VGL to the fourth transistor T4. The fourth transistor T4 can be turned on according to the low-level signal VGL, and the connection between the maintenance line 300 and the signal line 100b is turned on.

[0068] Since signal line 100c is opened in the pre-processing to solve the short circuit problem between signal line 100b and signal line 100c, signal line 100b will not be able to transmit data2 signal normally. By turning on the two sets of switch units 200 connected to signal line 100b, the connection between signal line 100b and maintenance line 300 can be turned on, so that maintenance line 300 can replace signal line 100b to continue to transmit data2 signal. At this time, maintenance line 300 replaces signal line 100b to transmit data2 signal, and signal line c can continue to transmit data3 signal normally, solving the problem of Figure 6 At the same time, since other switch units 200 in the array substrate are still in the cut-off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0069] The array substrate provided by the present application is provided with a switch unit 200 and a repair line 300, and the switch unit 200 is used to control the connection between each signal line 100 and the repair line 300. When an open circuit defect and / or a short circuit defect occurs in the signal line 100, the repair line 300 can be used to perform repairs. Compared with the repair method of chemical vapor deposition, when the array substrate provided by the present application repairs the open circuit defect and / or the short circuit defect in the signal line 100, the connection between the switch unit 200 and the cutoff signal can be cut off by laser to control the switch unit 200 to conduct to achieve the technical effect of defect repair while meeting high resolution. At the same time, even if organic materials are used to prepare metal wires in the array substrate, the array substrate can be repaired normally without the problem of organic layer falling off. After the signal line is successfully repaired using the repair line 300, there is no problem of defect recurrence later.

[0070] In one embodiment, the array substrate may include a display area 10 and a non-display area 20. A plurality of signal lines 100 may be arranged in an array within the display area 10, and a switching unit 200 and a repair line 300 may be disposed in the non-display area 20. The signal lines 100 may extend in a first direction to the non-display area 20 to achieve connection with the switching unit 200 in the non-display area 20. The control module 200 may control the conduction or disconnection of the connection between the signal lines 100 and the repair line 300 by changing its state.

[0071] A plurality of pixel units may be disposed in the display area 10 of the array substrate for realizing light-emitting display. By using the signal lines 100 arranged in an array within the display area 10, signals required for the operation of each pixel unit in the display area 10, such as data signals and scan signals, may be provided. By disposing the switching unit 200 and the repair line 300 in the non-display area 20, the display area in the array substrate may be maximized, interference of the switching unit 200 and the repair line 300 with the display of the pixel units may be avoided, and the display picture in the display area 10 may be kept uniform and clear. Disposing the switching unit 200 and the repair line 300 in the non-display area 20 is also conducive to performing repair operations on the signal lines 100 and preventing interference or damage to the pixel units, signal lines 100, etc. in the display area 10 during repair.

[0072] Figure 7 It is a schematic structural diagram of the array substrate provided with a repair line in one embodiment of the present application. Figure 7 In [the figure], Y may be the first direction, and X may be the second direction. In one embodiment, the repair line 300 may include a first repair portion 310, a second repair portion 320, and a third repair portion 330. Among them, the first repair portion 310 may extend in the first direction Y in the non-display area 20, and both ends of the first repair portion 310 may be respectively connected to the second repair portion 320 and the third repair portion 330. The second repair portion 320 and the third repair portion 330 may extend in the second direction X in the non-display area 20. Preferably, the first direction Y may be perpendicular to the second direction X.

[0073] Please refer to Figure 7 , the first repair portion 310, the second repair portion 320, and the third repair portion 330 may form a "C" shape. Of course, the shape formed by the common cooperation of the first repair portion 310, the second repair portion 320, and the third repair portion 330 is not limited to this, and it may also be other shapes. The upper ends of the signal lines 300 in the array substrate may be connected to the second repair portion 320 in the repair line 300 through the switching unit 200, and the lower ends of the signal lines 300 in the array substrate may be connected to the third repair portion 330 in the repair line 300 through the switching unit 200.

[0074] Figure 8This is a structural schematic diagram of an array substrate provided with two groups of maintenance lines in one embodiment of the present application. Figure 8 In one embodiment, two groups of maintenance lines 300 formed by the cooperation of the first maintenance part 310, the second maintenance part 320 and the third maintenance part 330 may be provided in the array substrate, one group is provided on the left side of the array substrate, and the other group is provided on the right side of the array substrate. At the same time, each signal line 300 in the array substrate can be divided into left and right areas according to the position, and the signal line 100 located in the left half of the array substrate is connected to the maintenance line 300 arranged on the left side of the array substrate through the switch unit 200, and the signal line 100 located in the right half of the array substrate is connected to the maintenance line 300 arranged on the right side of the array substrate through the switch unit 200. The maintenance line 300 arranged on the left side of the array substrate can be used to repair the signal line 100 located in the left half of the array substrate, and the maintenance line 300 arranged on the right side of the array substrate can be used to repair the signal line 100 located in the right half of the array substrate.

[0075] Fig. 9 This is a structural schematic diagram of a maintenance line provided on an array substrate in another embodiment of the present application. Fig. 9 In one embodiment, the maintenance line 300 may further include a fourth maintenance portion 340. The fourth maintenance portion 340 may extend along the first direction Y in the non-display area 20, and both ends of the fourth maintenance portion 340 may be connected to the second maintenance portion 320 and the third maintenance portion 330, respectively. The first maintenance portion 310, the second maintenance portion 320, the third maintenance portion 330 and the fourth maintenance line 340 together form a closed signal line in the non-display area 20.

[0076] At the same time, the first maintenance portion 310, the second maintenance portion 320, the third maintenance portion 330 and the fourth maintenance line 340 also form a closed quadrilateral figure in the non-display area 20, enclosing the display area 10. Specifically, as Fig. 9 As shown, the four-sided figure formed by the first maintenance part 310, the second maintenance part 320, the third maintenance part 330 and the fourth maintenance line 340 can be a rectangle, and the orthographic projection of the display area 10 on the substrate is located within the orthographic projection of the four-sided figure on the substrate.

[0077] like Figure 8 In the array substrate shown in the figure, two groups of repair lines 300 are provided, so that the signal lines 100 in the left and right areas on the array substrate can be repaired. However, Figure 8The set of repair lines 300 shown can only repair one signal line 100. Therefore, when two signal lines 100 in the left half of the array substrate are defective, the repair line 300 arranged on the left side of the array substrate can only repair one of the signal lines 100, and the repair line 300 arranged on the right side of the array substrate cannot repair the other signal line 100 in the left half.

[0078] In this embodiment, by designing the repair line 300 as a closed signal line, the closed signal line can repair defects of two signal lines 100 at any position in the array substrate. Fig. 9 There are two defects in the array substrate shown. Fig. 9 The signal line 100a corresponding to the position marked ① has an open circuit defect. Fig. 9 There is a defect in the position marked by ② that causes a short circuit between two adjacent signal lines 100b and 100c. The repair method for the two defects is as described in the above embodiment and will not be repeated here. The difference is that when two defects appear in the array substrate at the same time, the cutting position of the repair line 300 can be determined according to the positions of the two defects, and the repair line 300 can be cut into two independent repair lines 300 by laser cutting at the cutting position. The two independent repair lines 300 repair the two defective signal lines 100 respectively.

[0079] Specifically, the second maintenance section 320 is divided into an independent first section and a second section according to the cutting position, and the third maintenance section 330 is divided into an independent third section and a fourth section according to the cutting position. At this time, the first section, the first maintenance section 310 and the third section constitute an independent maintenance line 300, and the second section, the fourth maintenance section 340 and the fourth section constitute another independent maintenance line 300. The signal transmitted on the signal line 100 corresponding to one defective position is transmitted by using the first section, the first maintenance section 310 and the third section, and the signal transmitted on the signal line 100 corresponding to another defective position is transmitted by using the second section, the fourth maintenance section 340 and the fourth section.

[0080] Preferably, the cutting position of the repair line 300 can be between two signal lines 100 with open circuit defects. When solving the problem of two adjacent signal lines 300 being short-circuited due to foreign matter, the short circuit between the two adjacent signal lines 300 is disconnected by cutting the foreign matter at the position where one of the short-circuited signal lines 300 is located. The cut signal line 300 can be repaired by the repair line 300. Therefore, by determining the cutting position between the two signal lines 100 with open circuit defects and cutting the repair line 300, it can be ensured that the two independent repair lines 300 after cutting can repair the two defects respectively.

[0081] like Fig. 9 In the example, signal line 100a, signal line 100b and signal line 100c are all abnormal. When solving the short circuit problem between signal line 100b and signal line 100c, the short circuit problem is solved by cutting signal line 100c to open the circuit of signal line 100c. Therefore, the cutting position of repair line 300 can be between signal line 100a and signal line 100c. Fig. 9 As shown, the second maintenance portion 320 and the third maintenance portion 330 of the maintenance line 300 are cut along the tangent line C1 and the tangent line C2 respectively to divide the maintenance line 300 into two independent maintenance lines 300 on the left and right, so that the two independent maintenance lines 300 on the left and right can repair two defects respectively.

[0082] When the short circuit problem between the signal line 100b and the signal line 100c is solved by cutting the signal line 100b to open the circuit, the cutting position of the repair line 300 can be between the signal line 100a and the signal line 100b.

[0083] In one of the embodiments, a plurality of groups of repair lines 300 may be provided in the array substrate, and the plurality of groups of repair lines 300 are used to repair defects of a plurality of signal lines 100 in the array substrate.

[0084] The embodiments of the present disclosure may also provide a display device, which may be a rigid display device or a flexible display device. The display device may be applied to any product or component with a display function, including but not limited to the following categories: mobile phones, televisions, digital cameras, tablet computers, notebook computers, desktop displays, smart bracelets, smart glasses, vehicle displays, medical equipment, industrial control equipment, touch interactive terminals, etc., and the embodiments of the present disclosure do not specifically limit this.

[0085] The embodiments of the present disclosure may further provide a method for repairing an array substrate, and the array substrate described in any one of the embodiments above may be repaired by using the method for repairing an array substrate. Fig.10 This is a flow chart of a method for repairing an array substrate in one of the embodiments of the present application. In one of the embodiments, the method for repairing an array substrate may include the following steps S100 to S300.

[0086] Step S100: Determine whether the signal line has defects.

[0087] When inspecting the array substrate, the array substrate may be tested using a detection method to determine whether there are defective signal lines 100 in the array substrate.

[0088] Step S200: In response to the determination result that a defect exists in the signal line, the defect type of the signal line is determined.

[0089] When it is determined that there is a defective signal line 100 in the array substrate, the defect type of the signal line 100 may be determined.

[0090] Step S300: When the defect type is an open circuit defect, the switch unit is controlled to conduct the connection between the two ends of the signal line and the repair line, and the signal transmitted on the signal line is transmitted through the repair line.

[0091] In this embodiment, the defect type of the signal line 100 may include an open circuit defect. That is, an open circuit occurs in the signal line 100 in the array substrate, which causes the signal line 100 to be unable to transmit signals normally. When an open circuit defect exists in the array substrate, the switch unit 200 may be controlled to be turned on to conduct the connection between the two ends of the signal line 100 and the repair line 300, so that the repair line 300 replaces the signal line 100, and the signal transmitted on the signal line 100 is transmitted by the repair line 300.

[0092] In one embodiment, controlling the switch unit to conduct the connection between the two ends of the signal line and the maintenance line may include the following steps: disconnecting the cutoff signal connected to the second gate of the first transistor. Figure 3 and Figure 4 When the switch unit 200 uses the first transistor T1 to realize the control of the connection between the two ends of the signal line 100 and the maintenance line 300, the connection between the two ends of the signal line 100 and the maintenance line 300 can be controlled by controlling the cutoff signal connected to the first gate of the first transistor T1 to disconnect. Preferably, the connection between the first gate of the first transistor T1 and the high-level signal line is cut off by controlling the laser.

[0093] When the array substrate is detected as Figure 4 When there is an open circuit defect as shown in position ① of the signal line 100a, by disconnecting the connection between the first gate of the two first transistors T1 connected to the signal line 100a and the high-level signal line, the two first transistors T1 can be turned on according to the low-level signal VGL connected at the second gate. When an open circuit defect occurs in the signal line 100a, the signal line 100a will not be able to transmit the data1 signal normally. When the two first transistors T1 connected to the signal line 100a are turned on, the connection between the signal line 100a and the maintenance line 300 can be turned on, so that the maintenance line 300 can continue to transmit the data1 signal instead of the signal line 100a, thereby repairing the open circuit defect of the signal line 100a. At the same time, since the other first transistors T1 are still in the cut-off state, the maintenance line will not affect the transmission of signals on other signal lines 100.

[0094] In one embodiment, controlling the switch unit to conduct the connection between the two ends of the signal line and the maintenance line may include the following steps: disconnecting the cutoff signal connected to the first electrode of the second transistor, and disconnecting the cutoff signal connected to the gate of the fourth transistor. Figure 5 and Figure 6 When the switch unit 200 uses the second transistor T2, the third transistor T3 and the fourth transistor T4 to realize the control of the connection between the two ends of the signal line 100 and the maintenance line 300, the connection between the two ends of the signal line 100 and the maintenance line 300 can be controlled by disconnecting the cutoff signal connected to the first electrode of the second transistor T2 and disconnecting the cutoff signal connected to the gate of the fourth transistor T4. Preferably, the laser is controlled to cut off the connection between the first electrode of the second transistor and the high-level signal line, and the laser is controlled to cut off the connection between the gate of the fourth transistor and the high-level signal line.

[0095] When the array substrate is detected as Figure 6 When there is an open circuit defect as shown in position ①, the laser can be controlled to disconnect the connection between the first electrode of the second transistor T2 and the high-level signal line in the two groups of switch units 200 connected to the signal line 100a, and disconnect the connection between the fourth transistor T4 and the high-level signal line. Since the connection between the first electrode of the second transistor T2 and the high-level signal line is disconnected, the second transistor T2 will not transmit the high-level signal VGH to the gate of the third transistor T3. The gate leakage of the second transistor T2 will drive the gate of the third transistor T3 to open, so that the third transistor T3 can transmit the low-level signal VGL to the fourth transistor T4. The fourth transistor T4 can be turned on according to the low-level signal VGL, and the connection between the maintenance line 300 and the signal line 100a is turned on.

[0096] When an open circuit defect occurs in the signal line 100a, the signal line 100a will not be able to transmit the data1 signal normally. By turning on the two sets of switch units 200 connected to the signal line 100a, the connection between the signal line 100a and the repair line 300 can be turned on, so that the repair line 300 can replace the signal line 100a to continue to transmit the data1 signal, thereby repairing the open circuit defect of the signal line 100a. At the same time, since the other switch units 200 in the array substrate are still in the off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0097] Fig.11 This is a flow chart of a method for repairing an array substrate in one of the embodiments of the present application. In one of the embodiments, in response to a judgment result that a defect exists in a signal line and after judging the defect type of the signal line, the method for repairing the array substrate may include the following steps S400 to S700.

[0098] S400: When the defect type of the signal line is a short circuit defect, determine a defect position that causes the short circuit between two adjacent signal lines.

[0099] S500: Determine the short circuit area according to the defect position.

[0100] S600: Cut off the portion of one of the short-circuited signal lines that is in the short-circuited area.

[0101] S700: Control the switch unit to conduct the connection between the two ends of the signal line and the maintenance line, and use the maintenance line to transmit the signal transmitted on the signal line.

[0102] The defect type of the signal line 100 may also include a short circuit defect. When two adjacent signal lines 100 in the array substrate are short-circuited due to foreign matter, the two signal lines 100 may fail to transmit signals normally.

[0103] See also Figure 4 , when the array substrate is detected as Figure 4 When there is a short-circuit defect as shown in position ②, the repair line 300 can be used to repair the short-circuit defect. Specifically, in the present embodiment, determining the defect position that causes the short circuit of two adjacent signal lines may refer to determining the position of the foreign matter that causes the short circuit of signal line 100b and signal line 100c. Determining the short-circuit area according to the defect position may refer to determining the short-circuit area according to the overlapping area of ​​the foreign matter and signal line 100b and signal line 100c. Since the short circuit between signal line 100b and signal line 100c is caused by foreign matter, the short circuit problem between signal line 100b and signal line 100c can be solved by cutting off the portion of signal line 100b and signal line 100c that overlaps with the foreign matter.

[0104] Cutting off the portion of one of the short-circuited signal lines in the short-circuit area may refer to cutting off the areas above and below the location of the foreign matter on the signal line 100b or the signal line 100c, so that the signal line 100b or the signal line 100c is open-circuited. Figure 4 As shown, the areas at the upper and lower ends of the signal line 100c where the foreign matter is located are cut along the tangent lines A1 and A2 to open the signal line 100c, thereby solving the problem of short circuit between the signal line 100b and the signal line 100c.

[0105] At the same time, the connection between the first electrode of the second transistor T2 and the high-level signal line in the two groups of switch units 200 connected to the signal line 100c is disconnected, and the connection between the fourth transistor T4 and the high-level signal line is disconnected. Similarly, since the connection between the first electrode of the second transistor T2 and the high-level signal line is disconnected, the second transistor T2 will not transmit the high-level signal VGH to the gate of the third transistor T3. The gate leakage of the second transistor T2 will drive the gate of the third transistor T3 to open, so that the third transistor T3 can transmit the low-level signal VGL to the fourth transistor T4. The fourth transistor T4 can be turned on according to the low-level signal VGL, and the connection between the maintenance line 300 and the signal line 100c is turned on.

[0106] Since signal line 100c is opened in the pre-processing to solve the short circuit problem between signal line 100b and signal line 100c, signal line 100c will not be able to transmit data3 signal normally. By turning on the two sets of switch units 200 connected to signal line 100c, the connection between signal line 100c and maintenance line 300 can be turned on, so that maintenance line 300 can replace signal line 100c to continue to transmit data3 signal. At this time, signal line 100b can continue to transmit data2 signal normally, and maintenance line 300 replaces signal line 100c to transmit data3 signal, solving the problem of Figure 4 At the same time, since other switch units 200 in the array substrate are still in the cut-off state, the repair line will not affect the transmission of signals on other signal lines 100.

[0107] In one of the embodiments, in response to a judgment result that a defect exists in a signal line, after determining the defect type of the signal line, the array substrate repair method may include the following steps: when there are two defects in the array substrate and the repair line is a closed signal line, the repair line is divided into two independent repair lines, and the two repair lines are used to repair the two defects respectively.

[0108] When the maintenance line 100 is Figure 6 When the closed signal line is shown, the closed signal line can repair the defects of the two signal lines 100 in the array substrate. Specifically, Figure 6 There are two defects in the array substrate shown. Figure 6 The signal line 100a corresponding to the position marked ① has an open circuit defect. Figure 6There is a defect in the position marked with ② that causes a short circuit between two adjacent signal lines 100b and 100c. The repair method for the two defects is as described in the above embodiment and will not be repeated here. The difference is that when there are two defects in the array substrate and the repair line 300 is a closed signal line, the repair line 300 should be divided into two independent repair lines first, and then the two defects should be repaired respectively using the two independent repair lines.

[0109] Specifically, when two defects occur simultaneously in the array substrate, the cutting position of the repair line 300 can be determined according to the positions of the two defects, and the repair line 300 can be cut into two independent repair lines 300 by laser cutting at the cutting position. The two independent repair lines 300 respectively repair the two defective signal lines 100.

[0110] Preferably, the cutting position of the repair line 300 can be between two signal lines 100 with open circuit defects. When solving the problem of two adjacent signal lines 300 being short-circuited due to foreign matter, the short circuit between the two adjacent signal lines 300 is disconnected by cutting the foreign matter at the position where one of the short-circuited signal lines 300 is located. The cut signal line 300 can be repaired by the repair line 300. Therefore, by determining the cutting position between the two signal lines 100 with open circuit defects and cutting the repair line 300, it can be ensured that the two independent repair lines 300 after cutting can repair the two defects respectively.

[0111] like Fig. 9 In the example, signal line 100a, signal line 100b and signal line 100c are all abnormal. When solving the short circuit problem between signal line 100b and signal line 100c, the short circuit problem between signal line 100b and signal line 100c is solved by cutting signal line 100b to open signal line 100b. At this time, the two signal lines 100 with open circuit defects in the display panel are signal line 100a and signal line 100b. The cutting position of the repair line 300 can be between signal line 100a and signal line 100b. Fig. 9 As shown, the second maintenance section 320 of the maintenance line 300 is cut along the tangent line C1, and the second maintenance section 320 is cut into an independent first subsection and a second subsection, and the third maintenance section 330 of the maintenance line 300 is cut along the tangent line C2, and the second maintenance section 320 is cut into an independent third subsection and a fourth subsection. At this time, the first subsection, the first maintenance section 310 and the third subsection constitute an independent maintenance line 300, and the second subsection, the fourth maintenance section 340 and the third subsection constitute another independent maintenance line 300, that is, the maintenance line 300 is cut into two independent maintenance lines 300 on the left and right.

[0112] The maintenance line 300 composed of the first section, the first maintenance section 310 and the third section can replace the signal line 100a to transmit the signal transmitted on the signal line 100a, and the maintenance line 300 composed of the second section, the fourth maintenance section 340 and the third section can replace the signal line 100b to transmit the signal transmitted on the signal line 100b, that is, after cutting, the two independent maintenance lines 300 on the left and right can respectively repair the two defects.

[0113] When the array substrate is repaired by the array substrate repair method provided by the present application, the connection between each signal line 100 and the repair line 300 can be controlled by controlling the switch unit 200 to be turned on or off, and the repair line 300 can be used to repair the open circuit defect and / or short circuit defect in the signal line 100. Compared with the chemical vapor deposition repair method, the array substrate repair method provided by the present application can use a laser to cut off the connection between the switch unit 200 and the cut-off signal to control the switch unit 200 to be turned on to achieve the technical effect of defect repair when repairing the open circuit defect and / or short circuit defect in the signal line 100 while meeting the high resolution. Even if the metal wire is prepared by organic material in the array substrate, the array substrate can be repaired normally without the problem of organic layer falling off. Repair can also be achieved for the bending area of ​​the array substrate. At the same time, after the signal line is successfully repaired by the repair line 300, there is no problem of defect recurrence in the later stage.

[0114] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0115] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. An array substrate, characterized in that: The array substrate includes a substrate and a plurality of signal lines formed on the substrate, the array substrate further includes a switch unit and at least one group of maintenance lines, the maintenance lines are insulated from the signal lines, the signal lines include two opposite ends, the two ends of the signal lines are respectively connected to the maintenance lines through the switch unit, The switch unit is used to control the connection between the two ends of the signal line and the maintenance line.

2. The array substrate according to claim 1, characterized in that: The switch unit comprises a first transistor, the first transistor is a dual-gate transistor, a first gate of the first transistor is connected to a cut-off signal, a second gate of the first transistor is connected to a turn-on signal, a first electrode of the first transistor is connected to an end of the signal line, and a second electrode of the first transistor is connected to the maintenance line; Preferably, the first transistor is a P-type transistor; Preferably, the on-signal is a low-level signal, the off-signal is a high-level signal, the first gate of the first transistor is connected to a high-level signal line, and the second gate of the first transistor is connected to a low-level signal line.

3. The array substrate according to claim 1, characterized in that: The switch unit comprises a second transistor, a third transistor and a fourth transistor, the first electrode of the second transistor is connected to a cut-off signal, the gate of the second transistor is connected to a turn-on signal, the second electrode of the second transistor is connected to the gate of the third transistor, the first electrode of the third transistor is connected to the turn-on signal, the second electrode of the third transistor is connected to the gate of the fourth transistor, the gate of the fourth transistor is connected to a cut-off signal, the first electrode of the fourth transistor is connected to the end of the signal line, and the second electrode of the fourth transistor is connected to the maintenance line; Preferably, the second transistor, the third transistor and the fourth transistor are P-type transistors; Preferably, the on-signal is a low-level signal, the off-signal is a high-level signal, the first electrode of the second transistor is connected to the high-level signal line, the gate of the second transistor is connected to the low-level signal line, the first electrode of the third transistor is connected to the low-level signal line, and the gate of the fourth transistor is connected to the high-level signal line.

4. The array substrate according to claim 1 or 2, characterized in that: The array substrate comprises a display area and a non-display area, a plurality of signal lines are arranged in an array in the display area, the switch unit and the repair line are arranged in the non-display area, and the signal line extends along a first direction to the non-display area and is connected to the switch unit; Preferably, the maintenance line comprises a first maintenance portion, a second maintenance portion and a third maintenance portion, the first maintenance portion extends in the non-display area along the first direction, two ends of the first maintenance portion are respectively connected to the second maintenance portion and the third maintenance portion, and the second maintenance portion and the third maintenance portion extend in the non-display area along the second direction; Preferably, the upper end of the signal line is connected to the second maintenance part of the maintenance line through the switch unit, and the lower end of the signal line is connected to the third maintenance part of the maintenance line through the switch unit; Preferably, the maintenance line further includes a fourth maintenance portion, the fourth maintenance portion extends in the non-display area along the first direction, two ends of the fourth maintenance portion are respectively connected to the second maintenance portion and the third maintenance portion, and the first maintenance portion, the second maintenance portion, the third maintenance portion and the fourth maintenance line form a closed signal line in the non-display area; Preferably, when there is a defect in the array substrate, the signal line corresponding to the defective position is disconnected, the switch units connected at both ends of the signal line corresponding to the defective position are turned on, and the signal transmitted on the signal line corresponding to the defective position is transmitted using the repair line; Preferably, when there are two defects in the array substrate, the signal lines corresponding to the two defective positions are disconnected, the second maintenance portion is divided into an independent first sub-portion and a second sub-portion, the third maintenance portion is divided into an independent third sub-portion and a fourth sub-portion, the switch units connected at both ends of the signal lines corresponding to the two defective positions are turned on, a signal transmitted on the signal line corresponding to one of the defective positions is transmitted using an independent maintenance line composed of the first sub-portion, the first maintenance portion and the third sub-portion, and a signal transmitted on the signal line corresponding to another defective position is transmitted using another independent maintenance line composed of the second sub-portion, the fourth maintenance portion and the fourth sub-portion; Preferably, the signal line is a data line and / or a scan line.

5. A display device, characterized in that: It comprises the array substrate as claimed in any one of claims 1 to 4.

6. A method for repairing an array substrate, characterized in that: The array substrate comprises a substrate and a plurality of signal lines formed on the substrate, the array substrate further comprises a switch unit and at least one group of repair lines, and the method comprises: Determining whether the signal line has a defect; In response to a determination result that the signal line has a defect, determining a defect type of the signal line; When the defect type is an open circuit defect, the switch unit is controlled to conduct the connection between the two ends of the signal line and the repair line, and the signal transmitted on the signal line is transmitted through the repair line.

7. The array substrate repair method according to claim 6, characterized in that: After determining the defect type of the signal line in response to the determination result that the signal line has a defect, the method further includes: When the defect type of the signal line is a short circuit defect, determining the defect position causing the short circuit of two adjacent signal lines; Determine the short circuit area according to the defect location; Cutting off a portion of one of the short-circuited signal lines located in the short-circuit area; The control switch unit conducts the connection between the two ends of the signal line and the maintenance line, and uses the maintenance line to transmit the signal transmitted on the signal line.

8. The array substrate repair method according to claim 7, characterized in that: After determining the defect type of the signal line in response to the determination result that the signal line has a defect, the method further includes: When there are two defects in the array substrate and the repair line is a closed signal line, the repair line is divided into two independent repair lines, and the two independent repair lines are used to repair the two defects respectively.

9. The array substrate repair method according to claim 8, characterized in that: The switch unit includes a first transistor, and the control switch unit conducts the connection between the two ends of the signal line and the maintenance line includes: disconnecting a cutoff signal connected to the first gate of the first transistor; Preferably, the laser is controlled to cut off the connection between the first gate of the first transistor and the high-level signal line.

10. The array substrate repair method according to claim 8, characterized in that: The switch unit includes a second transistor and a fourth transistor, and the control switch unit conducts the connection between the two ends of the signal line and the maintenance line includes: Disconnecting the cutoff signal connected to the first electrode of the second transistor, and disconnecting the cutoff signal connected to the gate of the fourth transistor; Preferably, the laser is controlled to cut off the connection between the first electrode of the second transistor and the high-level signal line, and the laser is controlled to cut off the connection between the gate of the fourth transistor and the high-level signal line.

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