Antenna module configured in vehicle
By designing a broadband transparent antenna assembly with complex conductive patterns on vehicle glass, using the asymmetric structure and the optimization of transparent dielectric substrate, the transparent antenna efficiency and invisibility problems in the prior art are solved, and efficient and stable 4G/5G wireless communication is achieved.
Patent Information
- Application Number
- CN202280098125.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-13
- Publication Date
- 2025-02-28
AI Technical Summary
In the prior art, transparent antennas have problems such as deterioration of electrical loss, radiation efficiency and impedance bandwidth characteristics when configured on vehicle glass, and virtual grid configuration will lead to degradation of antenna performance.
A broadband transparent antenna assembly with complex conductive patterns is designed to reduce feed loss through the optimization of asymmetric structure conductive patterns and transparent dielectric substrates, and ensure the invisibility and performance of the antenna through the design of low-temperature bonding and open virtual patterns.
It improves the efficiency and invisibility of transparent antennas on vehicle glass, reduces feed loss, and maintains the stability of antenna performance in 4G/5G band wireless communications.
Smart Images

Figure CN119547273A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a transparent antenna configured for a vehicle. Certain embodiments relate to an antenna assembly implemented with a transparent material so that the antenna area cannot be identified on the vehicle glass. Background Art
[0002] Vehicles can perform wireless communication services with other vehicles or surrounding objects, infrastructure or base stations. In this regard, a variety of communication services can be provided by a wireless communication system that applies LTE communication technology or 5G communication technology. On the other hand, a portion of the LTE frequency band can be allocated to provide 5G communication services.
[0003] On the other hand, since the vehicle body and the roof are formed of metal materials, there is a problem of blocking radio waves. Therefore, an additional antenna structure can be arranged on the upper part of the vehicle body or the roof. Alternatively, when the antenna structure is arranged on the lower part of the vehicle body or the roof, the part of the vehicle body or the roof corresponding to the antenna arrangement area can be formed of a non-metallic material.
[0004] However, from the design point of view, the vehicle body or the roof needs to be formed in one piece. In this case, the appearance of the vehicle body or the roof may be formed of a metal material. Therefore, there is a problem that the antenna efficiency may be greatly reduced due to the vehicle body or the roof.
[0005] In order to increase the communication capacity without changing the exterior design of the vehicle, a transparent antenna can be placed on the glass of the vehicle window. However, there is a problem that the electrical loss of the transparent material antenna deteriorates the antenna radiation efficiency and impedance bandwidth characteristics.
[0006] If the antenna pattern is formed on a dielectric substrate with a metal mesh structure in which metal wires are connected to each other, a transparent antenna in which the metal wires cannot be distinguished by the naked eye can be realized. However, if the metal mesh structure is not formed in the dielectric region surrounding the antenna region in which the antenna pattern is formed, there is a problem that the antenna region and the dielectric region are distinguished by the naked eye, resulting in a difference in visibility.
[0007] Although a dummy grid may be arranged in the dielectric region to solve this problem, there is a problem that the arrangement of the dummy grid causes interference with the antenna pattern, resulting in degradation of antenna performance.
[0008] On the other hand, when a transparent material antenna is arranged on the vehicle glass, the transparent antenna pattern can be configured to be electrically connected to a feeding pattern arranged on an additional dielectric substrate. In this regard, feeding loss and antenna performance degradation caused by the connection between the transparent antenna pattern and the feeding pattern may occur. In addition, a transparency difference may occur between a transparent region (transparent region) formed with a transparent antenna pattern and an opaque region (opaque region) formed with a feeding pattern. Due to this transparency difference, the area where the antenna is arranged and other areas can be distinguished by eye. Therefore, a technical solution is needed that minimizes the visibility difference between the antenna area and other areas in the vehicle glass despite the existence of such a transparency difference. Summary of the invention
[0009] Problem to be solved
[0010] The purpose of this specification is to solve the above problems and other problems. In addition, another purpose of this specification is to provide a broadband transparent antenna assembly that can be configured on vehicle glass.
[0011] Another object of the present specification is to improve the antenna efficiency of a broadband transparent antenna assembly that can be configured on vehicle glass.
[0012] Another object of the present specification is to provide a broadband antenna structure made of a transparent material that can reduce feed loss and improve antenna efficiency while operating in a broadband manner.
[0013] Another object of the present specification is to improve the efficiency of a feeding structure of a broadband transparent antenna assembly that can be configured on vehicle glass and to ensure the reliability of a mechanical structure including the feeding structure.
[0014] Another object of the present specification is to minimize interference between a virtual grid configured in a dielectric area and an antenna area.
[0015] Yet another object of the present specification is to ensure the invisibility of a transparent antenna and an antenna assembly including the same without deteriorating the antenna performance.
[0016] Still another object of the present specification is to ensure invisibility with respect to the shape of the antenna assembly and invisibility when the antenna assembly is attached to a display or glass.
[0017] Yet another object of the present specification is to improve the visibility of a transparent antenna without degradation of antenna performance through optimal design of a dummy pattern with open areas.
[0018] Technical solutions to the problem
[0019] An antenna assembly of one aspect of the present specification for achieving the above or other purposes includes: a dielectric substrate; a first region including a conductive pattern on one side of the dielectric substrate and radiating a wireless signal; and a second region including a ground conductive pattern and a feed pattern. The conductive pattern may include: a first conductive pattern including a first portion and a second portion; a second conductive pattern electrically connected to the first portion of the ground conductive pattern; and a third conductive pattern electrically connected to the second portion of the ground conductive pattern. The size of the second conductive pattern may be formed to be smaller than the size of the third conductive pattern. The size of the third conductive pattern may be formed to be larger than the size of the first conductive pattern.
[0020] As an embodiment, the first portion of the first conductive pattern may be perpendicular to the second portion, and the second portion may be electrically connected to the feed pattern. The second conductive pattern may be arranged between the first portion of the first conductive pattern and the second portion of the first conductive pattern. The first portion of the first conductive pattern and the third conductive pattern may be arranged on opposite sides with respect to the second portion of the first conductive pattern.
[0021] The antenna assembly of another aspect of the present specification includes: a first dielectric substrate; a first region including a conductive pattern on one side of the first dielectric substrate and radiating a wireless signal; a second dielectric substrate; a second region including a ground conductive pattern and a feed pattern on one side of the second dielectric substrate. The conductive pattern may include: a first conductive pattern including a first portion and a second portion; a second conductive pattern electrically connected to the first portion of the ground conductive pattern; and a third conductive pattern electrically connected to the second portion of the ground conductive pattern. The size of the second conductive pattern may be formed to be smaller than the size of the third conductive pattern. The size of the third conductive pattern may be formed to be larger than the size of the first conductive pattern.
[0022] As an embodiment, the first portion of the first conductive pattern may be perpendicular to the second portion, and the second portion may be electrically connected to the feed pattern. The second conductive pattern may be arranged between the first portion of the first conductive pattern and the second portion of the first conductive pattern. The first portion of the first conductive pattern and the third conductive pattern may be arranged on opposite sides with respect to the second portion of the first conductive pattern.
[0023] Embodiments related to the antenna assembly of one aspect and the antenna assembly of another aspect of the present specification may be constructed as follows. As an embodiment, the first conductive pattern and the third conductive pattern may operate in a dipole antenna mode in a first frequency band. The first conductive pattern and the third conductive pattern may be constructed to have an asymmetrical structure.
[0024] As an embodiment, the first conductive pattern may operate in a monopole antenna mode in a second frequency band. The second frequency band is characterized by being higher than the first frequency band.
[0025] As an embodiment, the second conductive pattern may operate in a third frequency band. The third frequency band is characterized by being higher than the second frequency band.
[0026] As an embodiment, the first boundary side of the first portion of the first conductive pattern may be formed to have a first step structure. The second boundary side of the first portion of the first conductive pattern has a second step structure, and the second step structure may have a shape different from the first step structure. The third boundary side of the first portion of the first conductive pattern may be configured between the first end of the first boundary side of the first portion of the first conductive pattern and the first end of the second boundary side of the first portion of the first conductive pattern. The fourth boundary side of the first portion of the first conductive pattern may be configured between the second end of the first boundary side of the first portion of the first conductive pattern and the second end of the second boundary side of the first portion of the first conductive pattern.
[0027] As an embodiment, a portion of the first boundary side of the first portion of the first conductive pattern may be formed to face the first boundary side of the second conductive pattern. A portion of the first boundary side of the second conductive pattern may be formed to face the second boundary side of the second conductive pattern.
[0028] As an embodiment, the first boundary side of the third conductive pattern may be formed to have a third step structure. The first end of the first boundary side of the third conductive pattern may be connected to the second portion of the ground conductive pattern. The second boundary side of the third conductive pattern may be arranged on the opposite side of the first boundary side of the third conductive pattern. The third boundary side of the third conductive pattern may be arranged between the first end of the first boundary side of the third conductive pattern and the first end of the second boundary side of the third conductive pattern. The fourth boundary side of the fourth conductive pattern may be arranged between the second end of the first boundary side of the third conductive pattern and the second end of the second boundary side of the third conductive pattern.
[0029] As an embodiment, the third boundary side of the third conductive pattern may be arranged on the opposite side of the fourth boundary side of the fourth conductive pattern. A portion of the second portion of the first conductive pattern may be formed to face the fourth boundary side of the third conductive pattern.
[0030] As an embodiment, a length of the third boundary side of the third conductive pattern may be the same as a length of the third boundary side of the first conductive pattern.
[0031] As an embodiment, the first portion of the second region may include a first groove. The length of the first groove may be formed to be within λ / 2 to λ. An opened region of the first groove may be formed to face the feeding pattern.
[0032] As an embodiment, the second portion of the second region may include a second groove. The length of the second groove may be formed to be within λ / 2 to λ. An open area of the second groove may be formed to face the first region.
[0033] As an embodiment, the first conductive pattern, the second conductive pattern, and the third conductive pattern may be formed on the dielectric substrate in a metal mesh shape having a plurality of open areas. The first conductive pattern, the second conductive pattern, and the third conductive pattern may be formed on the dielectric substrate in a coplanar waveguide (CPW) structure.
[0034] As an embodiment, the antenna assembly may include a plurality of virtual grid patterns at an outside portion of the first region on the dielectric substrate. The plurality of virtual grid patterns may be formed to be not connected to the feed pattern and the ground conductive pattern. The plurality of virtual grid patterns may be configured to be separate from each other.
[0035] Effects of the Invention
[0036] Next, the technical effects of the broadband transparent antenna assembly that can be configured on the vehicle glass as described above will be described.
[0037] According to the present specification, a broadband transparent antenna assembly having a plurality of conductive patterns that can be arranged on vehicle glass is provided, thereby enabling 4G / 5G broadband wireless communication in the vehicle.
[0038] According to the present specification, the shape of the conductive pattern in the broadband transparent antenna assembly that can be configured on the vehicle glass can be optimized, and the antenna efficiency can be improved by the conductive pattern structure having an asymmetric structure.
[0039] According to the present specification, the end portion of the conductive pattern of the transparent dielectric substrate and the end portion of the conductive pattern of the opaque substrate are connected to each other so as to overlap, thereby being able to reduce the feeding loss.
[0040] According to the present specification, a broadband antenna structure made of a transparent material can be realized that can reduce feed loss and improve antenna efficiency by setting antenna operation modes differently for each frequency band.
[0041] According to the present specification, the feeding pattern of the feeding structure implemented by the opaque substrate disposed in the opaque area of the vehicle glass is directly combined with the transparent antenna, thereby improving the efficiency of the feeding structure of the broadband transparent antenna assembly.
[0042] According to the present specification, the feed pattern of the feed structure and the conductive pattern of the antenna module are combined by low-temperature bonding, thereby making it possible to ensure the reliability of the mechanical structure including the feed structure.
[0043] According to the present specification, an open dummy region in which a slit is formed is formed in the dielectric region, thereby minimizing the difference in visibility between the region where the antenna of the transparent material is arranged and other regions.
[0044] According to the present specification, the boundary of the antenna region is spaced apart from the boundary of the dummy pattern region by a prescribed interval, thereby being able to ensure invisibility of the transparent antenna and the antenna assembly including the same without deteriorating antenna performance.
[0045] According to the present specification, the open dummy structure is formed such that the intersection of the metal wires of the dummy region or a portion of the metal wires is cut off, thereby ensuring the invisibility of the transparent antenna and the antenna assembly including the same without deteriorating the antenna performance.
[0046] According to the present specification, visibility in a transparent antenna can be improved without deterioration of antenna performance through optimal design of a slit having a dummy pattern of an open area and an open area with a radiator area.
[0047] According to the present specification, a broadband antenna structure made of a transparent material that can operate in a broadband, reduce feed loss, and improve antenna efficiency can be provided through vehicle glass or a display area of an electronic device.
[0048] According to the present specification, a transparent antenna structure capable of minimizing antenna performance variation and transparency differences between an antenna area and a surrounding area and capable of wireless communication in 4G and 5G frequency bands.
[0049] The following detailed description will further clarify the scope of the additional application of this specification. However, since a person skilled in the art can clearly understand the various changes and modifications within the concept and scope of the present invention, it should be understood that the specific embodiments of the preferred embodiments described in detail and this specification are only examples. BRIEF DESCRIPTION OF THE DRAWINGS
[0050] Figure 1 FIG. 1 is a diagram showing glass of a vehicle on which an antenna structure according to an embodiment of the present specification can be arranged.
[0051] Figure 2a Indicated in Figure 1 A front view of a vehicle in which antenna assemblies are disposed at different regions of a front glass of the vehicle.
[0052] Figure 2b Indicated in Figure 1 A perspective view of the interior front of a vehicle in which antenna assemblies are arranged at different areas of a front glass of the vehicle.
[0053] Figure 2c Indicated in Figure 1 A side perspective view of a vehicle with an antenna assembly configured on an upper glass of the vehicle.
[0054] Figure 3 Indicates the type of V2X application.
[0055] Figure 4 This is a block diagram for explaining a vehicle and an antenna system mounted on the vehicle according to an embodiment of the present specification.
[0056] Figure 5a to Figure 5c This specification shows a configuration in which the antenna assembly is disposed on a vehicle glass.
[0057] Figure 6a Various embodiments of the frit pattern of this specification are shown. Figure 6b and Figure 6c A transparent antenna pattern according to an embodiment and a structure in which the transparent antenna pattern is arranged on vehicle glass are shown.
[0058] Figure 7a Showing the front view and cross-sectional view of the transparent antenna assembly of the present specification. Figure 7b It is a diagram showing the mesh structure of the metal mesh radiator area and the virtual metal mesh area according to the embodiment.
[0059] Figure 8a Represents the layered structure of the antenna module and the feeding module. Figure 8b It represents a layered structure in which an antenna module and a feeding structure are combined and an opaque substrate including a combined portion.
[0060] Figure 9aThe figure shows the bonding structure of the transparent antenna disposed in the transparent area and the frit area of the vehicle glass.
[0061] Figure 9b It will form Figure 9a A magnified front view of the area where the transparent antenna glass is bonded to the vehicle's main structure. Fig.9c Indicates observation from different positions Figure 9b A cross-sectional view of the combined structure of vehicle glass and main structure.
[0062] Fig.10 2 is a diagram showing a stacked structure of an antenna assembly according to an embodiment and attachment areas to a vehicle glass and a vehicle frame.
[0063] Fig.11a and Fig.11b A front view of an antenna assembly according to an embodiment of the present specification is shown.
[0064] Fig.12a This is a diagram comparing the radiation patterns of a monopole antenna operating in a single frequency band and the antenna assembly of this specification.
[0065] Figure 12b It is a comparison Fig.12a A diagram of the gain characteristics of the monopole antenna and the gain characteristics of the antenna assembly of the present specification.
[0066] Figures 13a to 13c Yes means Fig.11b A conceptual diagram of the principle of operation of the antenna assembly 1000 in various frequency bands.
[0067] Fig.14a and Fig.14b This shows a structure in which the shape of the second conductive pattern and the shape of the third conductive pattern are changed.
[0068] Fig.14c Represents a structure in which the shapes of the first conductive pattern and the third conductive pattern are formed in a continuous structure.
[0069] Fig.15a It is a comparison Fig.11a and Fig.14c A plot of the reflection coefficient characteristics of an antenna assembly. Fig.15b It is a comparison Fig.11a and Fig.14c A graph of the antenna efficiency characteristics of an antenna assembly.
[0070] Fig.16a Yes means Fig.11b The antenna efficiency of the asymmetric structure antenna assembly and Fig.14b Plot of the antenna efficiency of the symmetrically structured antenna assembly. Fig.16b Yes means Fig.11b The electric field distribution of the asymmetric antenna component and Fig.14b Diagram of the electric field distribution of the antenna component with a symmetrical structure.
[0071] Fig.17a The first groove structure and the second groove structure formed in the ground conductive pattern of the antenna assembly of the present specification are shown.
[0072] Fig.17b It means in Fig.17a A diagram of a first groove structure, a second groove structure, and current distribution around the ground conductive pattern formed by the ground conductive pattern of the antenna component.
[0073] Fig.17c is a diagram showing a circular groove structure of an antenna assembly according to an embodiment.
[0074] Figures 18a to 18c It shows the electric field distribution of the conductive pattern formed on the antenna component in the first frequency band to the third frequency band.
[0075] Fig.19 The reflection coefficient characteristics that change depending on whether or not there is a groove for impedance matching in the CPW antenna structure according to the present specification.
[0076] Fig. 20 FIG. 4 shows a structure in which a first dielectric substrate and a second dielectric substrate of an antenna assembly according to an embodiment are combined.
[0077] Fig.21a and Figure 21b The process flow of combining the antenna assembly of the embodiment with a glass panel is shown.
[0078] Fig. 22 This shows a configuration in which a plurality of antenna modules disposed at different positions of the vehicle of this specification are combined with other components of the vehicle. DETAILED DESCRIPTION
[0079] The embodiments disclosed in this specification are described in detail below with reference to the accompanying drawings. Here, the same or similar constituent elements are given the same figure marks regardless of the figure numbers, and repeated descriptions thereof will be omitted. The suffixes "module" and "unit" used in the following description for the constituent elements are only given or mixed for the convenience of writing the specification, and they themselves do not have mutually distinguishing meanings or functions. In addition, in the process of describing the embodiments disclosed in this specification, if it is determined that the specific description of the relevant known technology will cause confusion with the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only for the purpose of facilitating the understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification should not be limited by the attached drawings, but should be understood as covering all changes, equivalents and even substitutes included in the ideas and technical scope of the present invention.
[0080] Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from other components.
[0081] If a certain component is mentioned as being "connected" or "coupled" to another component, it may be directly connected to or coupled to the other component, but it can also be understood that there are other components between them. Conversely, if a certain component is mentioned as being "directly connected" or "directly coupled" to another component, it should be understood that there are no other components between them.
[0082] Unless the context clearly indicates otherwise, expressions in the singular shall include expressions in the plural.
[0083] In the present application, terms such as "including" or "having" are only used to specify the existence of features, numbers, steps, operations, constituent elements, parts or their combinations recorded in the specification, and are not intended to preclude the possibility of the existence or addition of one or more other features or numbers, steps, operations, constituent elements, parts or their combinations.
[0084] The antenna system described in this specification can be mounted on a vehicle. The configuration and operation of the embodiments described in this specification can also be applied to a communication system, i.e., an antenna system, mounted on a vehicle. In this regard, the antenna system mounted on a vehicle may include a plurality of antennas and a transceiver circuit and a processor for controlling the plurality of antennas.
[0085] Hereinafter, an antenna assembly (antenna module) that can be placed on a vehicle window and a vehicle antenna system including the antenna assembly are described. Herein, the antenna assembly refers to a structure in which a conductive pattern is bonded to a dielectric substrate, and may also be referred to as an antenna module.
[0086] Regarding this, Figure 1 FIG. 1 is a diagram showing a glass of a vehicle on which an antenna structure can be configured according to an embodiment of the present specification. Figure 1 The vehicle 500 may include a front glass 310, a door glass 320, a rear glass 330, and a corner window glass 340. On the other hand, the vehicle 500 may further include an upper glass 350 formed at a roof in an upper region.
[0087] Therefore, the glass constituting the window of the vehicle 500 may include a front glass 310 arranged in the front area of the vehicle, a door glass 320 arranged in the door area of the vehicle, and a rear glass 330 arranged in the rear area of the vehicle. On the other hand, the glass constituting the window of the vehicle 500 may also include a corner window glass 340 arranged in a part of the door area of the vehicle. In addition, the glass constituting the window of the vehicle 500 may also include an upper glass 350, which is separated from the rear glass 330 and is arranged in the upper area of the vehicle. Therefore, each glass constituting the window of the vehicle 500 may also be referred to as a window.
[0088] The front glass 310 prevents the wind from the front direction from blowing into the interior of the vehicle, and thus can be called a front windshield. The front glass 310 can be formed in a double-layer joint structure with a thickness of about 5.0 to 5.5 mm. The front glass 310 can be formed in a joint structure of glass / anti-shatter film / glass.
[0089] The door glass 320 may be formed of a double-layered joint structure or a single-layered compressed glass. The rear glass 330 may be formed of a double-layered joint structure or a single-layered compressed glass having a thickness of about 3.5 to 5.5 mm. In the rear glass 330, a distance is required between the hot wire, the AM / FM antenna, and the transparent antenna. The corner window glass 340 may be formed of a single-layered compressed glass having a thickness of about 3.5 to 4.0 mm, but is not limited thereto.
[0090] The size of the corner window glass 340 varies according to the type of vehicle, and the size of the corner window glass 340 may be smaller than the size of the front glass 310 and the size of the rear glass 330 .
[0091] Hereinafter, the structure in which the antenna assembly of this specification is arranged in different regions of the front glass of the vehicle will be described. The antenna assembly attached to the vehicle glass can be implemented as a transparent antenna. Figure 2a Indicated in Figure 1 A front view of a vehicle in which antenna assemblies are disposed at different regions of a front glass of the vehicle. Figure 2b Indicated in Figure 1 A perspective view of the interior front of a vehicle in which antenna assemblies are arranged at different areas of a front glass of the vehicle. Figure 2c Indicated in Figure 1 A side perspective view of a vehicle with an antenna assembly configured on an upper glass of the vehicle.
[0092] Reference Figure 2a , a front view of a vehicle 500 shows a configuration of a transparent antenna for a vehicle that can be configured with the present specification. A pane assembly 22 may include an antenna in an upper region 310a. The pane assembly 22 may include an antenna in an upper region 310a, an antenna in a lower region 310b, and / or an antenna in a side region 310c. In addition, the pane assembly 22 may include a translucent pane glass 26 formed of a dielectric substrate. The antenna in the upper region 310a, the antenna in the lower region 310b, and / or the antenna in the side region 310c are configured to support at least one of various communication systems.
[0093] The antenna module 1100 can be implemented in the upper area 310a, or the lower area 310b or the side area 310c of the front glass 310. In the case where the antenna module 1100 is configured in the lower area 310b of the front glass 310, the antenna module 1100 can be extended to the main body 49 of the lower area of the translucent window glass 26. The main body 49 of the lower area of the translucent window glass 26 can be implemented to have lower transparency than other parts. In the main body 49 of the lower area of the translucent window glass 26, a part of the feed part or other interface lines can be implemented. The connector assembly 74 can be implemented in the main body 49 of the lower area of the translucent window glass 26. The main body 49 of the lower area can constitute a vehicle body of a metal material.
[0094] Reference Figure 2b The antenna assembly 1000 may include a telematics control unit (TCU) 300 and an antenna module 1100. The antenna module 1100 may be disposed in different regions of the vehicle glass.
[0095] Reference Figure 2a and Figure 2b , the upper area 310a, the lower area 310b and / or the side area 310c of the vehicle glass may be configured with an antenna assembly. Figure 2a to Figure 2c Antenna assemblies may be disposed on the front glass 310 , the rear glass 330 , the corner window glass 340 , and the upper glass 350 of the vehicle.
[0096] Reference Figure 2a to Figure 2c, the antenna in the upper area 310a of the front glass 310 of the vehicle can be configured to operate in the LB (low band), MB (mid band), HB (high band) and 5G Sub6 bands of the 4G / 5G communication system. The antenna in the lower area 310b and / or the antenna in the side area 310c can also be configured to operate in the LB, MB, HB and 5G Sub6 bands of the 4G / 5G communication system. In the rear glass 330 of the vehicle, the antenna structure 1100b can also be configured to operate in the LB, MB, HB and 5G Sub6 bands of the 4G / 5G communication system. In the upper glass 350 of the vehicle, the antenna structure 1100c can also be configured to operate in the LB, MB, HB and 5G Sub6 bands of the 4G / 5G communication system. In the corner window glass 350 of the vehicle, the antenna structure 1100d can also be configured to operate in the LB, MB, HB and 5G Sub6 bands of the 4G / 5G communication system.
[0097] At least a portion of the outer contour area of the front glass 310 of the vehicle may be formed by the translucent window glass 26. The translucent window glass 26 may include: a first portion, formed with a portion of the antenna and the feeder; and a second portion, formed with a portion of the feeder and a dummy structure. In addition, the translucent window glass 26 may also include a dummy area where no conductive pattern is formed. As an example, the transparent area of the window glass assembly 22 may be formed to be transparent to ensure light transmission and field of view.
[0098] Although the example in which the conductive pattern can be formed in a part of the front glass 310 is described, it can be extended to be formed in Figure 1 The side glass 320, the rear glass 330 and any other glass structures of the vehicle 500 can be seen by a passenger or a driver through the window glass assembly 22. In addition, the passenger or the driver can see the road and the surrounding environment without being obstructed by the antenna of the upper area 310a, the antenna of the lower area 310b and / or the antenna of the side area 310c.
[0099] Vehicle 500 may be configured to communicate with pedestrians, surrounding infrastructure, and / or servers in addition to surrounding vehicles. Figure 3 Indicates the type of V2X application. Figure 3V2X (Vehicle-to-Everything) communication includes V2V (Vehicle-to-Vehicle) which refers to the communication between vehicles, V2I (Vehicle to Infrastructure) which refers to the communication between vehicles and eNB or RSU (Road Side Unit), V2P (Vehicle-to-Pedestrian) which refers to the communication between vehicles and terminals carried by individuals (pedestrians, cyclists, vehicle drivers or passengers), V2N (vehicle-to-network), and other communications between vehicles and all individuals.
[0100] on the other hand, Figure 4 This is a block diagram for explaining a vehicle and an antenna system mounted on the vehicle according to an embodiment of the present specification.
[0101] The vehicle 500 may include a communication device 400 and a processor 570. The communication device 400 may correspond to a telematics control unit of the vehicle 500.
[0102] The communication device 400 is a device for performing communication with an external device. Here, the external device may be another vehicle, a mobile terminal or a server. In order to perform communication, the communication device 400 may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit and an RF element capable of implementing various communication protocols. The communication device 400 may include a short-range communication unit 410, a location information unit 420, a V2X communication unit 430, an optical communication unit 440, a 4G wireless communication module 450 and a 5G wireless communication module 460. The communication device 400 may include a processor 470. According to an embodiment, the communication device 400 may also include other constituent elements in addition to the described constituent elements, or may not include a part of the described constituent elements.
[0103] The 4G wireless communication module 450 and the 5G wireless communication module 460 can perform wireless communication with more than one communication system through one or more antenna modules. The 4G wireless communication module 450 can send and / or receive signals with a device in the first communication system through a first antenna module. In addition, the 5G wireless communication module 460 can send and / or receive signals with a device in the second communication system through a second antenna module. The 4G wireless communication module 450 and the 5G wireless communication module 460 can also be physically implemented as an integrated communication module. Here, the first communication system can be an LTE communication system, and the second communication system can be a 5G communication system. However, the first communication system and the second communication system are not limited to this, and can be extended to any communication system that is different from each other.
[0104] The processor of the device in the vehicle 500 can be implemented by an MCU (Micro Control Unit) or a modem. The processor 470 of the communication device 400 is equivalent to a modem, and the processor 470 can be implemented as an integrated modem. The processor 470 can obtain surrounding information from other surrounding vehicles, objects, or infrastructure through wireless communication. The processor 470 can use the acquired surrounding information to perform vehicle control.
[0105] The processor 570 of the vehicle 500 may be a processor of a CAN (Car Area Network) or an ADAS (Advanced Driver Assistance System), but is not limited thereto. When the vehicle 500 is implemented in a distributed control manner, the processor 570 of the vehicle 500 may be replaced by a processor of each device.
[0106] On the other hand, the antenna module configured inside the vehicle 500 may include a wireless communication unit. The 4G wireless communication module 450 can transmit and receive 4G signals with a 4G base station through a 4G mobile communication network. At this time, the 4G wireless communication module 450 can transmit more than one 4G transmission signal to the 4G base station. In addition, the 4G wireless communication module 450 can receive more than one 4G reception signal from the 4G base station. In this regard, uplink (UL: Up-Link) multiple-input multiple-output (MIMO: Multi-Input Multi-Output) can be performed by transmitting a plurality of 4G transmission signals to the 4G base station. In addition, downlink (DL: Down-Link) multiple-input multiple-output (MIMO: Multi-Input Multi-Output) can be performed by receiving a plurality of 4G reception signals from the 4G base station.
[0107] The 5G wireless communication module 460 can transmit and receive 5G signals with the 5G base station through the 5G mobile communication network. Here, the 4G base station and the 5G base station can be non-independent (NSA: Non-Stand-Alone) structures. For example, the 4G base station and the 5G base station can be configured as a non-independent (NSA: Non Stand-Alone) structure. Alternatively, the 5G base station can be configured as an independent (SA: Stand-Alone) structure at a location different from the 4G base station. The 5G wireless communication module 460 can transmit and receive 5G signals with the 5G base station through the 5G mobile communication network. At this time, the 5G wireless communication module 460 can transmit more than one 5G transmission signal to the 5G base station. In addition, the 5G wireless communication module 460 can receive more than one 5G reception signal from the 5G base station. At this time, the 5G frequency band can use the same frequency band as the 4G frequency band, and it is called LTE reconfiguration (re-farming). On the other hand, as a 5G frequency band, the Sub6 frequency band, which is a frequency band below 6GHz, can be used. On the contrary, in order to perform broadband high-speed communication, the millimeter wave (mmWave) frequency band can be used as the 5G frequency band. In the case of using the millimeter wave (mmWave) frequency band, electronic devices can perform beam forming to expand the communication coverage with the base station.
[0108] On the other hand, regardless of the 5G frequency band, in order to increase the transmission speed, a larger number of multiple-input multiple-output (MIMO) can be supported in the 5G communication system. In this regard, uplink (UL: Up-Link) MIMO can be performed by transmitting a plurality of 5G transmission signals to a 5G base station. In addition, downlink (DL: Down-Link) MIMO can be performed by receiving a plurality of 5G reception signals from a 5G base station.
[0109] On the other hand, through the 4G wireless communication module 450 and the 5G wireless communication module 460, it is possible to be in a dual connection (DC: Dual Connectivity) state with the 4G base station and the 5G base station. The dual connection with the 4G base station and the 5G base station as described above may be referred to as EN-DC (EUTRAN NR DC; Evolved Universal Terrestrial Radio Access Network New Wireless Dual Connection). On the other hand, if the 4G base station and the 5G base station are co-located structures, the throughput can be improved by heterogeneous carrier aggregation (inter-CA (Carrier Aggregation)). Therefore, if the 4G base station and the 5G base station are in the EN-DC state, the 4G reception signal and the 5G reception signal can be received simultaneously by the 4G wireless communication module 450 and the 5G wireless communication module 460. On the other hand, the 4G wireless communication module 450 and the 5G wireless communication module 460 can be used to perform close range communication between electronic devices (e.g., vehicles). In one embodiment, wireless communication can be performed in a V2V manner between vehicles without via a base station after resources are allocated.
[0110] On the other hand, in order to improve the transmission speed and converge the communication system, at least one of the 4G wireless communication module 450 and the 5G wireless communication module 460 and the Wi-Fi (Wireless High Fidelity) communication module 113 may be used to perform carrier aggregation (CA). In this regard, 4G+WiFi carrier aggregation (CA) may be performed using the 4G wireless communication module 450 and the Wi-Fi communication module 113. Alternatively, 5G+WiFi carrier aggregation (CA) may be performed using the 5G wireless communication module 460 and the Wi-Fi communication module.
[0111] On the other hand, the communication device 400 may realize a vehicle display device together with the user interface device. In this case, the vehicle display device may be named a telematics device or an AVN (Audio Video Navigation) device.
[0112] On the other hand, the broadband transparent antenna structure that can be configured on the glass of a vehicle of the present specification can be implemented by a single dielectric substrate on the same plane as the CPW feeder. In addition, the broadband transparent antenna structure that can be configured on the glass of a vehicle of the present specification can be implemented with a structure in which grounding is formed on both sides of the radiator, thereby forming a broadband structure.
[0113] The following describes the antenna components related to the broadband transparent antenna structure of this specification. Figure 5a to Figure 5cThis shows the configuration in which the antenna assembly of this specification is disposed on the vehicle glass. Figure 5a , the antenna assembly 1000 may include a first dielectric substrate 1010a and a second dielectric substrate 1010b. The first dielectric substrate 1010a may be implemented as a transparent substrate, and thus may be referred to as a transparent substrate 1010a. The second dielectric substrate 1010b may be implemented as an opaque substrate 1010b.
[0114] The glass panel 310 may include a transparent glass region 311 and an opaque region 312. The opaque region 312 of the glass panel 310 may be a frit region formed by a frit layer. The opaque region 312 may be formed to surround the transparent region 311. The opaque region 312 may be formed in an outer region of the transparent region 311. The opaque region 312 may form a boundary region of the glass panel 310.
[0115] The signal pattern formed on the dielectric substrate 1010 can be connected to the telematics control unit (TCU) 300 through a connector component 313 such as a coaxial cable. The telematics control unit (TCU) 300 can be configured inside the vehicle, but is not limited thereto. The telematics control unit (TCU) 300 can be configured in the dashboard inside the vehicle or in the roof area inside the vehicle, but is not limited thereto.
[0116] Figure 5b The antenna assembly 1000 is shown as being disposed in a partial region of the glass panel 310 . Figure 5c The structure in which the antenna assembly 1000 is arranged over the entire area of the glass panel 310 is shown.
[0117] Reference Figure 5b and Figure 5c, the glass panel 310 may include a transparent area 311 and an opaque area 312. The opaque area 312 is a non-visible area whose transparency is below a specified level, and may be referred to as a frit area, or a BP (Black Printing) area, or a BM (Black Matrix) area. The opaque area 312, which is equivalent to the opaque area, may be formed to surround the transparent area 311. The opaque area 312 may be formed in an outer area of the transparent area 311. The opaque area 312 may form a boundary area of the glass panel 310. A second dielectric substrate 1010b or a heat plate 360a, 360b, which is equivalent to a feed substrate, may be arranged in the opaque area 312. The second dielectric substrate 1010b arranged in the opaque area 312 may be referred to as an opaque substrate. As Figure 5c As shown, when the antenna assembly 1000 is disposed on the entire area of the glass panel 310 , the heating plates 360 a and 360 b may be disposed in the opaque area 312 .
[0118] Reference Figure 5b , the antenna assembly 1000 may include a first transparent dielectric substrate 1010a and a second dielectric substrate 1010b. Figure 5b and Figure 5c , the antenna assembly 1000 may include an antenna module 1100 formed of a conductive pattern and a second dielectric substrate 1010b. The antenna module 1100 may be formed by a transparent electrode portion and implemented as a transparent antenna module. The antenna module 1100 may be implemented by more than one antenna element. The antenna module 1100 may include a MIMO antenna and / or other antenna elements for wireless communication. Other antenna elements may include at least one of GNSS / radio / broadcast / WiFi / satellite communication / UWB (ultra-wideband), RKE (Remote Keyless Entry) antennas for vehicle applications.
[0119] Reference Figure 5a to Figure 5c , the antenna assembly 1000 can be connected to the telematics control unit (TCU) 300 through the connector component 313. The connector component 313 can be electrically connected to the TCU300 by forming a connector 313c at the end of the cable. The signal pattern of the second dielectric substrate 1010b formed on the antenna assembly 1000 can be connected to the TCU300 using the connector component 313 such as a coaxial cable. Through the connector component 313, the antenna module 1100 can be electrically connected to the TCU300. The TCU300 can be configured inside the vehicle, but is not limited to this. The TCU300 can be configured on the dashboard inside the vehicle or the roof area inside the vehicle, but is not limited to this.
[0120] On the other hand, when the transparent antenna assembly of the present specification is attached to the inside or surface of the glass panel 310 , the transparent electrode portion including the antenna pattern and the dummy pattern may be disposed in the transparent region 311 . Conversely, the opaque substrate portion may be disposed in the opaque region 312 .
[0121] The antenna assembly formed on the vehicle glass of the present specification can be configured in the transparent area and the opaque area. In this regard, Figure 6a Various embodiments of the frit pattern of this specification are shown. Figure 6b and Figure 6c A transparent antenna pattern according to an embodiment and a structure in which the transparent antenna pattern is arranged on vehicle glass are shown.
[0122] Reference Figure 6a (a), the frit pattern 312a can be formed as a metal pattern in a circular (or polygonal, elliptical) shape with a specified diameter. The frit pattern 312a can be configured in a two-dimensional structure along two axial directions. The frit pattern 312a can be formed in an offset structure in which the center points between the patterns forming adjacent rows are separated by a specified interval.
[0123] Reference Figure 6a In (b), the frit pattern 312b may be formed in a rectangular pattern in one axis direction. The frit pattern 312c may be configured in a one-dimensional structure along one axis direction or in a two-dimensional structure along two axis directions.
[0124] Reference Figure 6a (c), the frit pattern 312c may be formed as a groove pattern in which the metal pattern is removed in a circular (or polygonal, elliptical) shape with a prescribed diameter. The frit pattern 312b may be configured in a two-dimensional structure along two axial directions. The frit pattern 312c may be formed in an offset structure in which the center points between the patterns forming adjacent rows are separated by a prescribed interval.
[0125] Reference Figures 5a to 6c In the opaque region 312, the opaque substrate 1010b and the transparent substrate 1010a may be electrically connected. In this regard, in order to make the transparent antenna pattern invisible, a dummy pattern that is electrically very small and below a specified size may be arranged around the antenna pattern. Thus, the pattern in the transparent electrode cannot be distinguished by the eye without deteriorating the antenna performance. The dummy pattern may be designed to have a light transmittance similar to that of the antenna pattern within a specified range.
[0126] The transparent antenna assembly including the opaque substrate 1010b bonded to the transparent electrode portion can be mounted on the glass panel 310. In this regard, in order to ensure invisibility, the opaque substrate 1010b connected to the RF connector or the coaxial cable is arranged in the opaque region 312 of the vehicle glass. On the other hand, the transparent electrode portion is arranged in the transparent region 311 of the vehicle glass, thereby ensuring the invisibility of the antenna outside the vehicle glass.
[0127] A portion of the transparent electrode portion may be attached to the opaque region 312 as appropriate. The frit pattern of the opaque region 312 may be formed to form a gradient from the opaque region 312 to the transparent region 311. If the transmittance of the frit pattern and the transmittance of the transparent electrode portion are made consistent within a specified range, the transmission efficiency of the transmission line can be improved while improving the invisibility of the antenna. On the other hand, a metal mesh shape similar to the frit pattern can be used to ensure invisibility while reducing sheet resistance. In addition, by increasing the line width of the metal mesh in the area connected to the opaque substrate 1010b, the risk of disconnection of the transparent electrode layer during manufacturing and assembly can be reduced.
[0128] Reference Figure 6a (a) and Figure 6b , the conductive pattern 1110 of the antenna module may be composed of a metal grid of the same line width in the opaque region 312. The conductive pattern 1110 may include a connection pattern 1110c connecting the transparent plate 1010a and the opaque substrate 1010b. In the opaque region 312, a frit pattern of a prescribed shape may be arranged at a prescribed interval and formed on the connection pattern 1110c and both sides of the connection pattern 1110c. The connection pattern 1110c may include a first transmittance portion 1111c formed with a first transmittance and a second transmittance portion 1112c formed with a second transmittance.
[0129] In the frit pattern 312a formed in the opaque region 312, metal grids of a predetermined diameter may be arranged along one axis and another axis. The metal grids of the frit pattern 312a may be arranged at intersections of the metal grids with the second transmittance portions 1112c of the connection pattern 1110c.
[0130] Reference Figure 6a (b) and Figure 6b In the frit pattern 312b formed in the opaque region 312, the groove grid of the prescribed diameter in which the metal region is removed can be arranged along one axis direction and another axis direction. The groove grid of the frit pattern 312b can be arranged between the metal grids in the connection pattern 1110c. Thus, the metal region of the frit pattern 312b without the groove grid can be arranged at the intersection of the metal grids.
[0131] Reference Figure 6aand Figure 6c , the connection pattern 1110c may be formed of a metal mesh having a first line width W1 in a first transmittance portion 1111c adjacent to the transparent region 311. The connection pattern 1110c may be formed of a second line width W2 thicker than the first line width W1 in a second transmittance portion 1112c adjacent to the opaque substrate 1010b. In this regard, the first transparency of the first transmittance portion 1111c may be set to be higher than the second transparency of the second transmittance portion 1112c.
[0132] like Figure 5a to Figure 5c When the transparent antenna assembly is attached to the inside of the vehicle glass, the transparent electrode portion can be arranged in the transparent region 311, and the opaque substrate 1010b can be arranged in the opaque region 312. In this regard, the transparent electrode portion can be arranged in the opaque region 312 according to the situation.
[0133] A portion of the metal pattern of the low-transmittance pattern electrode portion and the high-transmittance pattern electrode portion located in the opaque region 312 can be arranged in the gradient region of the opaque region 312. In the case where the transmission line portion in the antenna pattern and the low-transmittance pattern electrode is composed of a transparent electrode, a gain drop may occur due to a decrease in transmission efficiency caused by an increase in sheet resistance. As a solution to improve this gain drop, the transmittance of the frit pattern 312 where the electrode is located and the transmittance of the transparent electrode can be made consistent within a specified range.
[0134] By increasing the line width of the transparent electrode in the region with low transmittance in the frit patterns 312a, 312b, 312c or adding the same shape as the frit patterns 312a, 312b, 312c, a lower sheet resistance can be achieved. This can solve the problem of reduced transmission efficiency while ensuring invisibility. The transmittance and pattern of the opaque region 312 are not limited to Figure 6a The structure of the transmission line may vary depending on the glass manufacturer or vehicle manufacturer. Therefore, the shape and transparency (line width and spacing) of the transparent electrode of the transmission line may vary differently.
[0135] Figure 7a Showing the front view and cross-sectional view of the transparent antenna assembly of the present specification. Figure 7b It is a diagram showing the mesh structure of the metal mesh radiator area and the virtual metal mesh area according to the embodiment.
[0136] Figure 7a (a) shows a front view of the transparent antenna assembly 1000, Figure 7a (b) is a cross-sectional view of the transparent antenna component 1000, showing the layered structure of the transparent antenna component 1000. Figure 7a, the antenna assembly 1000 may include a first transparent dielectric substrate 1010a and a second dielectric substrate 1010b. A conductive pattern 1110 acting as a radiator may be configured on one side of the first transparent dielectric substrate 1010a. A feed pattern 1120f and ground patterns 1121g and 1122g may be formed on one side of the second dielectric substrate 1010b. The conductive pattern 1110 acting as a radiator may include more than one conductive pattern. The conductive pattern 1110 may include a first pattern 1111 connected to the feed pattern 1120f and a second pattern 1112 connected to the ground pattern 1121g. The conductive pattern 1110 may also include a third pattern 1113 connected to the ground pattern 1122g.
[0137] The conductive pattern 1110 constituting the antenna module may be implemented as a transparent antenna. Figure 7b , the conductive pattern 1110 may be formed of a metal grid pattern 1020a having a line width below a specified line width and forming a metal mesh radiator region. A dummy metal grid pattern 1020b may be formed in the inner region or outer region between the first pattern to the third pattern 1111, 1112, 11113 of the conductive pattern 1100 to maintain transparency below a specified level. The metal grid pattern 1020a and the dummy metal grid pattern 1020b may form a metal mesh layer 1020.
[0138] Figure 7b (a) shows the structure of a typical metal grid pattern 1020a and a dummy metal grid pattern 1020b. Figure 7b (b) shows the structure of an atypical metal grid pattern 1020a and a virtual metal grid pattern 1020b. Figure 7b As shown in (a), the metal mesh layer 1020 can be formed into a transparent antenna structure by a plurality of metal meshes. The metal mesh layer 1020 can be formed in a regular metal mesh shape such as a quadrilateral, a rhombus, or a polygon. The conductive pattern can be formed into a plurality of metal meshes to act as a feeder or a radiator. The metal mesh layer 1020 constitutes a transparent antenna area. As an example, the metal mesh layer 1020 can be implemented with a thickness of about 2 mm, but is not limited thereto.
[0139] The metal mesh layer 1020 may include a metal grid pattern 1020a and a dummy metal grid pattern 1020b. The metal grid pattern 1020a and the dummy metal grid pattern 1020b may form an open area (OA) whose ends are disconnected so as not to be electrically connected. The dummy metal grid pattern 1020b may be formed with slits SL so that the ends of the respective meshes CL1, CL2, ..., CLn are not connected.
[0140] Reference Figure 7b(b), the metal mesh layer 1020 may be formed of a plurality of atypical metal meshes. The metal mesh layer 1020 may include a metal grid pattern 1020a and a dummy metal grid pattern 1020b. The metal grid pattern 1020a and the dummy metal grid pattern 1020b may form an open area OA whose ends are disconnected so as not to be electrically connected. The dummy metal grid pattern 1020b may be formed with slits SL so that the ends of the individual grids CL1, CL2, ..., CLn are not connected.
[0141] On the other hand, the transparent substrate on which the transparent antenna of the present specification is formed can be arranged on the glass of a vehicle. Figure 8a Represents the layered structure of the antenna module and the feeding module. Figure 8b It represents a layered structure in which an antenna module and a feeding structure are combined and an opaque substrate including a combined portion.
[0142] Reference Figure 8a (a), the antenna module 1100 may include a first transparent dielectric substrate 1010a formed on a first layer and a first conductive pattern 1110 formed on a second layer disposed on the first layer. Figure 7b , the first conductive pattern 1110 may be implemented as a metal mesh layer 1020 including a metal lattice pattern 1020a and a dummy metal lattice pattern 1020b. The antenna module 1100 may further include a protective layer 1031 and an adhesive layer 1041a disposed on the second layer.
[0143] Reference Figure 8a (b), the feeding structure 1100f may include a second dielectric substrate 1010b, a second conductive pattern 1120, and a third conductive pattern 1130. The feeding structure 1100f may further include a first protective layer 1033 and a second protective layer 1034, each stacked on the second conductive pattern 1120 and the third conductive pattern 1130. The feeding structure 1100f may further include an adhesive layer 1041b formed on a portion of the second conductive pattern 1120.
[0144] A second conductive pattern 1120 may be disposed on one side of a second dielectric substrate 1010b implemented as an opaque substrate. A third conductive pattern 1130 may be disposed on the other side of the second dielectric substrate 1010b. A first protective layer 1033 may be formed on the upper portion of the third conductive pattern 1130. A second protective layer 1034 may be formed on the lower portion of the second conductive pattern 1120. The first protective layer 1033 and the second protective layer 1034 are configured to have a low dielectric constant (low permittivity) below a specified value, thereby enabling low-loss feeding to the transparent antenna region.
[0145] Reference Figure 8b(a), the antenna module 1100 may be combined with a feeding structure 1100f implemented by a second dielectric substrate 1010b as an opaque substrate. A first conductive pattern 1110 implemented by a metal mesh layer as a transparent electrode layer may be formed on the upper portion of the first transparent dielectric substrate 1010a. A protective layer 1031 may be formed on the upper portion of the first conductive pattern 1110. A protective layer 1031 and a first adhesive layer 1041a may be formed on the upper portion of the first conductive pattern 1110. The first adhesive layer 1041a may be formed adjacent to the protective layer 1031.
[0146] The first adhesive layer 1041a formed on the upper portion of the first conductive pattern 1110 may be bonded to the second adhesive layer 1041b formed on the lower portion of the second conductive layer 1120. The first transparent dielectric substrate 1010a and the second dielectric substrate 1010b may be bonded by bonding between the first adhesive layer 1041a and the second adhesive layer 1041b. Thus, the metal mesh formed on the first transparent dielectric substrate 1010a may be electrically connected to the feeding pattern formed on the second dielectric substrate 1010b.
[0147] The second dielectric substrate 1010b may be formed with a feeding structure 1100f having a second conductive pattern 1120 on one side and a third conductive pattern 1130 on the other side. The feeding structure 1100f may be implemented by a flexible printed circuit board (Flexible Printed Circuit Board), but is not limited thereto. A first protective layer 1033 may be disposed on the upper portion of the third conductive pattern 1130, and a second protective layer 1034 may be disposed on the lower portion of the second conductive pattern 1120. The adhesive layer 1041b at the lower portion of the third conductive pattern 1130 may be bonded to the adhesive layer 1041a of the antenna module 1100. Thus, the feeding structure 1100f may be combined with the antenna module 1100, and the first conductive pattern 1110 and the second conductive pattern 1120 may be electrically connected.
[0148] The thickness of the antenna module 1100 implemented by the first transparent dielectric substrate 1010a can be formed with a first thickness. The thickness of the feed structure 1100f implemented by the second dielectric substrate 1010b can be formed with a second thickness. For example, the thickness of the dielectric substrate 1010a of the antenna module 1100 can be 75um, the thickness of the first conductive pattern 1110 can be 9um, and the thickness of the protective layer 1031 can be 25um. The first thickness of the antenna module 1100 can be 109um. The thickness of the second dielectric substrate 1010b of the feed structure 1100f can be 50um, the thickness of the second conductive pattern 1120 can be 18um, the thickness of the third conductive pattern 1130 can be 18um, and the thickness of the first protective layer 1033 and the second protective layer 1034 can be 28um. Thus, the second thickness of the feed structure 1100f can be 142um. Since the adhesive layer 1041a is formed on the upper portion of the first conductive pattern 1110 and the adhesive layer 1041b is formed on the lower portion of the second conductive pattern 1120, the entire antenna assembly can be formed with a thickness less than the sum of the first thickness and the second thickness. For example, the thickness of the antenna assembly 1000 including the antenna module 1100 and the feeding structure 1100f can be 198 um.
[0149] Reference Figure 8b (b), a conductive pattern 1120 may be formed on one side of the second dielectric substrate 1010b forming the feeding structure 1100f. The conductive pattern 1120 may be formed in a feeding structure having a CPW (co-planar waveguide) structure having a feeding pattern 1120f and ground patterns 1121g and 1122g formed on both sides. Figure 8b (a), the feeding structure 1100f may be combined with the antenna module 1100 using the region where the adhesive layer 1041 is formed.
[0150] The antenna module and the feeding structure constituting the antenna assembly of this specification can be configured on the vehicle glass and combined through a specific combination structure. Figure 9a The figure shows the bonding structure of the transparent antenna disposed in the transparent area and the frit area of the vehicle glass.
[0151] Reference Figure 9a, the first transparent dielectric substrate 1010a can be bonded to the glass panel 310 using an adhesive layer 1041. The conductive pattern of the first transparent dielectric substrate 1010a can be bonded to the conductive pattern 1130 of the second dielectric substrate 1010b by ACF bonding. ACF bonding is a method of bonding the bonding surface for several seconds using an adhesive tape with metal balls added under high temperature / high pressure conditions (e.g., 120-150 degrees, 2-5 MPa), which can be achieved by contacting the electrodes with metal balls. ACF bonding electrically connects the conductive pattern while curing the adhesive layer 1041 due to heat to provide bonding force.
[0152] The first transparent dielectric substrate 1010a formed with a transparent electrode layer can be attached to the second dielectric substrate 1010b in the form of an FPCB by using a local soldering technology. The connection pattern of the FPCB and the transparent antenna electrode can be connected by local soldering based on a coil in a magnetic field induction manner. During such local soldering, the temperature of the soldering portion does not rise, or the FPCB does not deform and can maintain a flat surface. Thus, by local soldering between the conductive patterns of the first transparent dielectric substrate 1010a and the second dielectric substrate 1010b, a highly reliable electrical connection can be achieved.
[0153] The first transparent dielectric substrate 1010a, Figure 7a The metal mesh layer 1020, the protective layer 1033 and the adhesive layer 1041 can form a transparent electrode. The second dielectric substrate 1010b as an opaque substrate can be implemented by an FPCB, but is not limited thereto. It can be configured such that the second dielectric substrate 1010b as an FPCB formed with a feeding pattern is connected to the connector part 313 and the transparent electrode.
[0154] The second dielectric substrate 1010b as an opaque substrate may be attached to a portion of the first transparent dielectric substrate 1010a. The first transparent dielectric substrate 1010a may be formed in the transparent region 311 of the glass panel 310. The second dielectric substrate 1010b may be formed in the opaque region 312 of the glass panel 310. A portion of the first transparent dielectric substrate 1010a may be formed in the opaque region 312, and the first transparent dielectric substrate 1010a may be combined with the second dielectric substrate 1010b in the opaque region 312.
[0155] The first transparent dielectric substrate 1010a and the second dielectric substrate 1010b may be bonded by bonding between the adhesive layers 1041a and 1041b. The position where the second dielectric substrate 1010b is bonded to the adhesive layer 1041 may be set as the first position P1. The position where the connector component 313 is welded to the opaque substrate 1010b may be set as the second position P2.
[0156] On the other hand, the vehicle glass formed with the antenna assembly of the present specification can be combined with the main structure of the vehicle. In this regard, Figure 9b It will form Figure 9a A magnified front view of the area where the transparent antenna glass is bonded to the vehicle's main structure. Fig.9c Indicates observation from different positions Figure 9b A cross-sectional view of the combined structure of vehicle glass and main structure.
[0157] Reference Figure 9b A first transparent dielectric substrate 1010a having a transparent antenna formed thereon may be disposed in a transparent region 311 of the glass panel 310. A second dielectric substrate 1010b may be disposed in an opaque region 312 of the glass panel 310. Since the transmittance of the opaque region 312 is lower than the transmittance of the transparent region 311, the opaque region 312 may also be referred to as a BM (Black Matrix) region. A portion of the first transparent dielectric substrate 1010a having a transparent antenna formed thereon may be extended to the opaque region 312 corresponding to the BM region. The first transparent dielectric substrate 1010a and the opaque region 312 may be formed to overlap along a single axis direction by an overlap length OL.
[0158] Fig.9c (a) indicates along Figure 9b A cross-sectional view of the antenna assembly taken along line AB. Fig.9c (a) indicates along Figure 9b A cross-sectional view of the CD line antenna assembly
[0159] Reference Figure 9b and Fig.9c (a), a first transparent dielectric substrate 1010a having a transparent antenna formed thereon may be disposed in a transparent region 311 of a glass panel 310. A second dielectric substrate 1010b may be disposed in an opaque region 312 of the glass panel 310. A portion of the first transparent dielectric substrate 1010a may be extended to the opaque region 312, so that a feeding pattern formed on the second dielectric substrate 1010b and a metal mesh layer of the transparent antenna can be joined and connected.
[0160] The interior cover 49c may be configured to accommodate a connector component 313 connected to the second dielectric substrate 1010b. The connector component 313 may be disposed in a space between the main body 49b of the metal material and the interior cover 49c, and the connector component 313 may be coupled to an in-vehicle cable. The interior cover 49c may be disposed in an upper region of the main body 49b of the metal material. One end of the interior cover 49c may be bent to be coupled to the main body 49b of the metal material.
[0161] The inner cover 49c may be formed of a metal material or a dielectric material. In the case where the inner cover 49c is formed of a metal material, the inner cover 49c and the main body 49b of the metal material form a metal frame 49. In this regard, the vehicle may include the metal frame 49. The opaque region 312 of the glass panel 310 may be supported by a portion of the metal frame 49. To this end, a portion of the main body 49b of the metal frame 49 may be bent so as to be combined with the opaque region 312 of the glass panel 310.
[0162] When the inner cover 49c is formed of a metal material, at least a portion of the metal region may be removed from the upper region of the second dielectric substrate 1010b in the inner cover 49c. A recess portion 49R where the metal region is removed may be formed in the inner cover 49c. Thus, the metal frame 49 may include the recess portion 49R. The second dielectric substrate 1010b may be disposed in the recess portion 49R of the metal frame 49.
[0163] The recess 49R may also be referred to as a metal cut region. One side of the recess 49R may be separated from one side of the opaque substrate 1010b by a first length L1 equal to or greater than a critical value. The lower boundary side of the recess 49R may be separated from the lower boundary side of the opaque substrate 1010b by a second length L2 equal to or greater than a critical value. As the metal of a portion of the inner cover 49c of the metal material is removed, signal loss and changes in antenna characteristics caused by the surrounding metal structure can be prevented.
[0164] Reference Figure 9b and Fig.9c (b), the area where the connector components and the opaque substrate are not configured can be configured so that the inner cover 49c does not form a recessed portion such as a metal removal area. In this regard, not only can the inner cover 49c protect the internal components of the antenna module 1100, but also can be used to Figure 9b and Fig.9cThe recess 49R of (a) discharges the internal heat to the outside. In addition, the recess 49R of the internal cover 49c can immediately determine whether the connection part needs to be repaired or replaced. On the other hand, since the internal cover 49c does not form a recess in the area where the connector component and the second dielectric substrate are not configured, the internal components of the antenna module 1100 can be protected.
[0165] On the other hand, the antenna assembly 1000 of the present specification can be formed in various forms on the glass panel 310, and the glass panel 310 can be attached to the vehicle frame. Fig.10 2 is a diagram showing a stacked structure of an antenna assembly according to an embodiment and attachment areas to a vehicle glass and a vehicle frame.
[0166] Reference Fig.10 (a), the glass panel 310 may include a transparent area 311 and an opaque area 312. The antenna assembly 1000 may include an antenna module 1100 and a feed structure 1100f. The antenna module 1100 may include a first transparent dielectric substrate 1010a, a transparent electrode layer 1020, and an adhesive layer 1041. The feed structure 1100f implemented by the opaque substrate and the transparent electrode layer 1020 implemented by the transparent substrate may be electrically connected. The feed structure 1100f and the transparent electrode layer 1020 may be directly connected through the first bonding area BR1. The feed structure 1100f and the connector component 313 may be directly connected through the second bonding area BR2. Heat may be applied to the first bonding area BR1 and the second bonding area BR2 for bonding. Thus, the bonding areas BR1 and BR2 may be referred to as heating intervals. In the side end area in the opaque area 312 of the glass panel 310, an attachment area AR equivalent to a sealant area for attaching the glass panel 310 and the vehicle frame may be formed.
[0167] Reference Fig.10(b), the glass panel 310 may include a transparent area 311 and an opaque area 312. The antenna assembly 1000 may include an antenna module 1100 and a feed structure 1100f. The antenna module 1100 may include a protective layer 1031, a transparent electrode layer 1020, a first transparent dielectric substrate 1010a, and an adhesive layer 1041. The feed structure 1100f implemented by the opaque substrate and a portion of the antenna module 1100 implemented by the transparent substrate may overlap. The feed structure 1100f and the transparent electrode layer 1020 of the antenna module 1100 may be coupled feed. The feed structure 1100f and the connector component 313 may be directly connected via a bonding area BR. Heat may be applied to the bonding area BR1 for bonding. Thus, the bonding area BR may be referred to as a heating interval. In the side end area in the opaque area 312 of the glass panel 310, an attachment area AR equivalent to a sealant area for attaching the glass panel 310 and the vehicle frame may be formed.
[0168] Reference Fig.10 (a) and Fig.10 (b), the transparent substrate 1010a may include a (hard) coating layer to protect the transparent electrode layer 1020 from the external environment. On the other hand, the adhesive layer 1041 may be added with a UV blocking component to prevent yellowing due to sunlight.
[0169] The broadband transparent antenna structure that can be configured on the glass of a vehicle of the present specification can be implemented by a single dielectric substrate on the same plane as the CPW feeder. In addition, the broadband transparent antenna structure that can be configured on the glass of a vehicle of the present specification can be implemented by a structure with grounding formed on both sides of the radiator, thereby forming a broadband structure.
[0170] The following describes the antenna components related to the broadband transparent antenna structure of this specification. Fig.11a and Fig.11b A front view of an antenna assembly according to an embodiment of the present specification is shown.
[0171] Reference Fig.11a and Fig.11b , the antenna assembly 1000 may include a dielectric substrate 1010a, a first region 1100a, and a second region 1100b. The first region 1100a may include a conductive pattern on one side of the dielectric substrate 1010 and radiate a wireless signal. The second region 1100b may include a grounded conductive pattern 1110g and a feeding pattern 1110f. The first region 1100a may also be referred to as a radiator region, and the second region 1100b may be referred to as a grounding region (or a feeding region).
[0172] The plurality of conductive patterns formed in the first region 1100a of the antenna assembly 1000 may be implemented by more than two conductive patterns and operate in a plurality of frequency bands. Fig.11a , the plurality of conductive patterns formed in the first region 1100a may include a first conductive pattern 1110 and a third conductive pattern 1130. Fig.11b , the plurality of conductive patterns may be configured to include a first conductive pattern 1110 , a second conductive pattern 1120 and a third conductive pattern 1130 .
[0173] The first conductive pattern 1110 may be composed of a plurality of sub-patterns, i.e., a plurality of conductive portions. The first conductive pattern 1110 may include a first portion 1111 and a second portion 1112. The first portion 1111 may be formed to be perpendicular to the second portion 1112. The second portion 1112 may be electrically connected to the feed pattern 1110f. In this regard, the meaning of "electrically connected" may include that each conductive portion is directly connected or coupled at a specified interval.
[0174] Reference Fig.11a and Fig.11b The third conductive pattern 1130 may be disposed on the other side of the first conductive pattern 1110. The third conductive pattern 1130 may be electrically connected to the second portion 1112g of the ground conductive pattern 1110g.
[0175] Reference Fig.11b The second conductive pattern 1120 may be disposed on a side region or a lower region of the first conductive pattern 1110. The second conductive pattern 1120 may be electrically connected to the first portion 1111g of the ground conductive pattern 1110g. By further configuring the second conductive pattern 1120 in the antenna assembly 1000, resonance may be achieved in a frequency band different from the operating frequency bands of the first conductive pattern 1110 and the third conductive pattern 1130.
[0176] The size of the second conductive pattern 1120 may be smaller than that of the third conductive pattern 1130. Thus, the antenna assembly 1000 may operate as a radiator in a higher frequency band through the second conductive pattern 1120. The second conductive pattern 1120 may be disposed between the first portion 1111 of the first conductive pattern 1110 and the second portion 1112 of the first conductive pattern 1110. Thus, the second conductive pattern 1120 is disposed in the lower region of the first conductive pattern 1110, and the size of the antenna assembly 1000 can be reduced compared to the case where the second conductive pattern 1120 is disposed in the region on one side of the first conductive pattern 1110. The first portion 1111 of the first conductive pattern 1110 and the third conductive pattern 1130 may be disposed on opposite sides with respect to the second portion 1112 of the first conductive pattern 1110. The first portion 1111 of the first conductive pattern 1110 and the third conductive pattern 1130 may be disposed in the region on one side and the region on the other side with respect to the second portion 1112 of the first conductive pattern 1110.
[0177] The antenna assembly of the present specification can perform broadband operation to enable 4G wireless communication and 5G wireless communication. In addition, the antenna assembly of the present specification can operate in a dipole antenna mode to reduce interference between antenna elements during multiple input and output (MIMO) operation. In this regard, Fig.12a This is a diagram comparing the radiation patterns of a monopole antenna operating in a single frequency band and the antenna assembly of this specification. Figure 12b It is a comparison Fig.12a A diagram of the gain characteristics of the monopole antenna and the gain characteristics of the antenna assembly of the present specification.
[0178] Reference Fig.12a (a) The radiation patterns RP1a and RP2a of the monopole antennas 1100-1 and 1100-2 are formed in a direction parallel to the antenna element. That is, the radiation patterns are formed in one direction and the other direction of the antenna element. Therefore, when the monopole antenna 1100a is spaced apart for MIMO operation, interference between the antenna elements may occur.
[0179] On the contrary, refer to Fig.12a (b), the radiation patterns RP1 and RP2 of the antenna assembly 1000 are formed in a direction perpendicular to the antenna arrangement. That is, the radiation patterns are formed in the upper direction and the lower direction of the antenna element. Thus, even when the antenna assembly 1000 is configured to be separated for MIMO operation, the interference between the antenna elements can be minimized to below a predetermined level.
[0180] Reference Fig.12a (a) and Figure 12b(a), the monopole antennas 1100-1 and 1100-2 operate to resonate in a single frequency band. The monopole antennas 1100-1 and 1100-2 operate as radiators only in a predetermined frequency band based on the center frequency f1. Therefore, they cannot cover the entire frequency band used for 4G / 5G wireless communications.
[0181] On the contrary, refer to Fig.12a (b) and Figure 12b In (b), the antenna component 1000 operates to resonate in multiple frequency bands. The antenna component 1000 operates as a radiator in the first frequency band to the third frequency band based on multiple resonant frequencies, such as f1, f2 and f3. The antenna component 1000 can operate in a first mode in the first frequency band, in a second mode in the second frequency band, and in a third mode in the third frequency band. As a result, the antenna component 1000 can operate as a radiator in the low frequency band (LB: low band), mid frequency band (MB: mid band), high frequency band (HB: high band) and 5G Sub6 band used for 4G / 5G wireless communications.
[0182] To this end, each of the plurality of conductive patterns of the antenna assembly 1000 and their combination can act as a radiator in each frequency band. Figures 13a to 13c Yes means Fig.11b A conceptual diagram of the principle of operation of the antenna assembly 1000 in various frequency bands.
[0183] Reference Fig.11b , Figure 12b as well as Fig.13a , the antenna assembly 1000 can operate in a dipole antenna mode in 617 to 960 MHz as a first frequency band. The first frequency band is not limited thereto and may change according to the application for 4G / 5G LB communication. The first conductive pattern 1110 and the third conductive pattern 1130 can operate in a dipole antenna mode in the first frequency band. In this regard, in the first frequency band, a first current I1a can be formed from the first portion 1111 of the first conductive pattern 1110 to the second portion 1112 of the first conductive pattern 1110. In addition, in the first frequency band, the second current I2a formed in the third conductive pattern 1130 can be formed in a direction opposite to the first current I1a formed in the first conductive pattern 1110. Thus, in the first frequency band, the first conductive pattern 1110 and the third conductive pattern 1130 can operate in a dipole antenna mode.
[0184] The first conductive pattern 1110 and the third conductive pattern 1130 may be formed to have an asymmetrical structure. The first conductive pattern 1110 may be formed in a stepped structure in which a plurality of conductive portions have different heights from each other. The third conductive pattern 1130 may be formed in a straight line structure in which the upper end regions of the plurality of conductive portions are in a straight line form. For impedance matching, the end of the lower end region of the third conductive pattern 1130 may be formed at different positions.
[0185] Reference Fig.11b , Figure 12b as well as Fig.13b , the antenna assembly 1000 can operate in a monopole antenna mode at 1520 to 4500 MHz as a second frequency band. In this regard, the second frequency band is a higher frequency than the first frequency band and can change according to the application for 4G / 5GMB / HB communication. The first conductive pattern 1110 can operate in a monopole antenna mode in the second frequency band. In this regard, in the second frequency band, a first current I1b can be formed from the first portion 1111 of the first conductive pattern 1110 to the second portion 1112 of the first conductive pattern 1110. In addition, in the second frequency band, a second current I2b can be formed from the second portion 1112 of the first conductive pattern 1110 to the first portion 1111 of the first conductive pattern 1110. Therefore, in the second frequency band, the first conductive pattern 1110 can operate in a monopole antenna mode.
[0186] Since the second frequency band is set to have a larger value than the first frequency band, even if the second frequency band is operated in the monopole antenna mode, the interference between the plurality of antenna elements is smaller than that in the first frequency band. Therefore, in the first frequency band, the antenna assembly 1000 operates in the dipole antenna mode for interference between the antenna elements. In the second frequency band, the antenna assembly 1000 operates in the monopole antenna mode for broadband operation.
[0187] Reference Fig.11b , Figure 12b as well as Fig.13c , the antenna assembly 1000 can act as a radiator by additional resonance in the third frequency band of 4500 to 6000 MHz. In this regard, in the third frequency band, a third current I3 can be formed in the second conductive pattern 1120. In the third frequency band, a third current I3 can be formed in the second conductive pattern 1120. Thus, in the third frequency band, the third conductive antenna 1130 can act as a radiator.
[0188] In this regard, the third frequency band is a higher frequency than the second frequency band, and may vary according to the application for 4G / 5G UHB and 5G Sub 6 communications. The second conductive pattern 1120 may act as a radiator in a third frequency band higher than the second frequency band. Thus, in addition to the first frequency band and the second frequency band, the antenna assembly 1000 also acts as a radiator in the third frequency band, thereby covering the entire frequency band for 4G / 5G wireless communications.
[0189] Regarding the first conductive pattern 1110, it can be combined with the third conductive pattern 1130 to operate in a monopole antenna mode in the first frequency band and operate in a dipole antenna mode in the second frequency band alone. To this end, the shape of the first conductive pattern 1110 can be optimized into a step structure for broadband operation. In this regard, the first conductive pattern 1110 can be formed to have a plurality of boundary sides.
[0190] Reference Fig.11a , Fig.11b as well as Figures 13a to 13c , the first portion 1111 of the first conductive pattern 1110 may be formed to have a plurality of boundary sides. The first portion 1111 of the first conductive pattern 1110 may be formed to have first to fourth boundary sides BS1 to BS4.
[0191] A first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to have a first step structure. A second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110 may be formed to have a second step structure. The second step structure may be formed in a different shape from the first step structure.
[0192] The third boundary side BS3 of the first portion 1111 of the first conductive pattern 1110 may be disposed between a first end of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 and a first end of the second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110. The fourth boundary side BS4 of the first portion 1111 of the first conductive pattern 1110 may be disposed between a second end of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 and a second end of the second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110. Thus, the shape of the first portion 1111 of the first conductive pattern 1110 may be optimized to perform broadband operation in the first frequency band and the second frequency band.
[0193] The second conductive pattern 1120 may also be formed to have a first boundary side BS1 and a second boundary side BS2. A portion of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to face the first boundary side BS1 of the second conductive pattern 1120. A portion of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to face the second boundary side BS2 of the second conductive pattern 1120.
[0194] The third conductive pattern 1130 may also be formed to have a plurality of boundary sides for a step structure. The third conductive pattern 1130 may be formed to have a first boundary side BS1 to a fourth boundary side BS4. The first boundary side BS1 of the third conductive pattern 1130 may be formed to have a third step structure. The first end of the first boundary side BS1 of the third conductive pattern 1130 may be connected to the second portion 1112g of the ground conductive pattern 1110g. The second boundary side BS2 of the third conductive pattern 1130 may be arranged on the opposite side of the first boundary side BS1 of the third conductive pattern 1130.
[0195] The third boundary side BS3 of the third conductive pattern 1130 may be configured between a first end of the first boundary side BS1 of the third conductive pattern and a first end of the second boundary side BS2 of the third conductive pattern 1130. The fourth boundary side BS4 of the third conductive pattern 1130 may be configured between a second end of the first boundary side BS1 of the third conductive pattern 1130 and a second end of the second boundary side BS2 of the third conductive pattern 1130. The third boundary side BS3 of the third conductive pattern 1130 may be configured on the opposite side of the fourth boundary side BS4 of the third conductive pattern 1130. A portion of the second portion 1112 of the first conductive pattern 1110 may be formed to face the fourth boundary side BS4 of the third conductive pattern 1130.
[0196] The length of the third boundary side BS3 of the third conductive pattern 1130 may be the same as the length of the third boundary side BS3 of the first conductive pattern 1110. Thus, the antenna assembly 1000 may be implemented with the length of the third boundary side BS3 of the first conductive pattern 1110 and the third conductive pattern 1130, which can minimize the size of the entire antenna.
[0197] On the other hand, the antenna assembly of the present specification can be formed in a transparent antenna structure. Figure 7b and Fig.11a, the first conductive pattern 1110 and the third conductive pattern 1130 of the antenna assembly 1000 may be formed in a metal mesh shape 1020 having a plurality of open areas OA on a dielectric substrate 1010a. The first conductive pattern 1110 and the third conductive pattern 1130 may be formed by a metal grid pattern 1020a. The metal grid pattern 1020a may be formed to have a dummy metal grid pattern 1020b and an open area OA. The first conductive pattern 1110 and the third conductive pattern 1130 may be formed in a CPW structure on a dielectric substrate 1010a.
[0198] Reference Figure 7b and Fig.11b , the first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed on the dielectric substrate 1010 in a metal mesh shape 1020 having a plurality of open areas OA. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be implemented in a CPW structure on the dielectric substrate 1010. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed by a metal grid pattern 1020a. The metal grid pattern 1020a may be formed to have a dummy metal grid pattern 1020b and an open area OA. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed in a CPW structure on the dielectric substrate 1010a.
[0199] The antenna assembly 1000 may include a plurality of dummy grid patterns 1020b in the radiator region on the dielectric substrate 1010a, that is, in the outside portion of the first region 1100a. On the other hand, the plurality of dummy grid patterns 1020b may also be configured in the dielectric region between the first conductive pattern 1110 to the third conductive pattern 1130. The plurality of dummy grid patterns 1020b may be formed to be not connected to the feed pattern 1110f and the ground conductive pattern 1110g. The plurality of dummy grid patterns 1020b may be formed to be separated from each other.
[0200] The conductive pattern of the antenna assembly of this specification can be changed in various shapes. In this regard, Fig.14a and Fig.14b This shows a structure in which the shape of the second conductive pattern and the shape of the third conductive pattern are changed.
[0201] Reference Fig.11b , a portion of the upper end of the second conductive pattern 1120 of the antenna assembly 1000 may be formed in a triangular shape. Fig.14a, the second conductive pattern 1120b of the antenna component 1000a can be configured in a quadrilateral shape. The second conductive pattern 1120b can be configured in a side area or a lower area of the first conductive pattern 1110. The second conductive pattern 1120b can be electrically connected to the first portion 1111g of the ground conductive pattern 1110g. Through the second conductive pattern 1120b, the antenna component 1000 can operate as a radiator in the third frequency band. In this regard, through the second conductive pattern 1120, the antenna component 1000 can also operate as a radiator in the third frequency band. The impedance matching characteristics in the third frequency band can change locally as the shape of the second conductive pattern 1120b changes.
[0202] The size of the second conductive pattern 1120b may be smaller than the size of the third conductive pattern 1130. Thus, the antenna assembly 1000 may operate as a radiator in the third frequency band, which is a higher frequency band, through the second conductive pattern 1120b. The second conductive pattern 1120b may be disposed between the first portion 1111 of the first conductive pattern 1110 and the second portion 1112 of the first conductive pattern 1110. Thus, the second conductive pattern 1120b is disposed in the lower region of the first conductive pattern 1110, and the size of the antenna assembly 1000 can be reduced compared to the case where the second conductive pattern 1120b is disposed in the region on one side of the first conductive pattern 1110.
[0203] Reference Fig.14b , the third conductive pattern 1130b of the antenna assembly 1000b may be formed in a symmetrical structure with the first conductive pattern 1110. Similar to the first conductive pattern 1110, the third conductive pattern 1130b may also include a first portion 1131 and a second portion 1132. Similar to the first conductive pattern 1110, the upper end and the lower end of the third conductive pattern 1130b may also be formed in a stepped structure, respectively. Figure 12b Compared with the size of the third conductive pattern 1130b, Fig.11b The size of the third conductive pattern 1130 may be larger.
[0204] On the other hand, the conductive pattern of the antenna assembly of the present specification may also be formed in a continuous structure instead of a stepped structure. Fig.14c Represents a structure in which the shapes of the first conductive pattern and the third conductive pattern are formed in a continuous structure.
[0205] Reference Fig.14cThe antenna assembly 1000c may include a first conductive pattern 1110c, a second conductive pattern 1120, and a third conductive pattern 1130c. Each connection portion of the first conductive pattern 1110c may be formed in a continuous connection structure. Each connection portion of the third conductive pattern 1130c may also be formed in a continuous connection structure.
[0206] Reference Fig.14a and Fig.14b , each connection part of the first conductive pattern 1110 can be formed in a vertical step structure. Thus, the first conductive pattern 1110 formed in a step structure can increase the current component in the vertical direction. Each connection part of the third conductive patterns 1130 and 1130b can be formed in a vertical step structure. Thus, the third conductive pattern 1110 formed in a step structure can increase the current component in the vertical direction.
[0207] Regarding this, Fig.15a It is a comparison Fig.11a and Fig.14c A plot of the reflection coefficient characteristics of an antenna assembly. Fig.15b It is a comparison Fig.11a and Fig.14c A graph of the antenna efficiency characteristics of an antenna assembly.
[0208] Reference Fig.11a , each connection portion of the first conductive pattern 1110 of the antenna assembly 1000 is formed in a vertical step structure, thereby increasing the vertical current component. Fig.14c , the various connection parts of the first conductive pattern 1110 of the antenna assembly 1000c are formed in a continuous connection structure, thereby the current component in the vertical direction may be reduced. Fig.15a , in a frequency band above about 3 GHz, the reflection coefficient of (i) the antenna component 1000c formed with a continuous structure may be degraded compared to the reflection coefficient of (ii) the antenna component 1000 formed with a stepped structure.
[0209] Reference Fig.11a , each connection portion of the first conductive pattern 1110 of the antenna assembly 1000 is formed in a vertical step structure, thereby increasing the vertical current component. Fig.14c , the various connection parts of the first conductive pattern 1110 of the antenna assembly 1000c are formed in a continuous connection structure, thereby the current component in the vertical direction may be reduced. Fig.15b, in the frequency band above about 1.5 GHz, the antenna efficiency of the antenna assembly 1000c (i) formed with a continuous structure may be degraded compared to the antenna efficiency of the antenna assembly 1000 (ii) formed with a stepped structure. In particular, at about 4 GHz, the antenna efficiency of the antenna assembly 1000c (i) formed with a continuous structure may be degraded by more than 0.3 dB compared to the antenna efficiency of the antenna assembly 1000 (ii) formed with a stepped structure. At about 5.5 GHz, the antenna efficiency of the antenna assembly 1000c (i) formed with a continuous structure may be degraded by more than 0.5 dB compared to the antenna efficiency of the antenna assembly 1000 (ii) formed with a stepped structure.
[0210] Below, by comparison Fig.14b The symmetrical structure of the antenna assembly 1000b and Fig.11b The electrical characteristics of the asymmetric antenna assembly 1000b are described. Fig.16a Yes means Fig.11b The antenna efficiency of the asymmetric structure antenna assembly and Fig.14b Plot of the antenna efficiency of the symmetrically structured antenna assembly. Fig.16b Yes means Fig.11b The electric field distribution of the asymmetric antenna component and Fig.14b Diagram of the electric field distribution of the antenna component with a symmetrical structure.
[0211] Reference Fig.14b and Fig.16a , in the frequency band above 3.5 GHz, the antenna efficiency of the antenna assembly 1000b of (i) symmetrical structure has a value of about -4 dBi. Fig.11b and Fig.16a , in the frequency band above 3.5 GHz, (ii) the antenna efficiency of the asymmetric structure antenna assembly 1000 has a value of about -3dBi to -3.5dBi. Therefore, Fig.11b The antenna efficiency of the asymmetric structure antenna assembly 1000 is better than Figure 12b The antenna efficiency of the symmetrical structure of the antenna assembly 1000b is about 0.5 to 1.0 dB higher.
[0212] In the frequency band above about 3 GHz, the antenna efficiency of the asymmetric structure antenna assembly 1000 is about 0.5 to 1.0 dB higher than the antenna efficiency of the symmetric structure antenna assembly 1000b. Therefore, in the frequency band above about 3 GHz in the second frequency band and the third frequency band, the antenna efficiency of the asymmetric structure antenna assembly 1000 can be improved.
[0213] Fig.16b (a) indicates the condition of 3.5GHz Fig.14b The electric field distribution of the antenna assembly 1000b with a symmetrical structure is shown in FIG. Fig.16b (b) represents the condition of 3.5GHz Fig.11b FIG. 1 is a diagram of the electric field distribution of the antenna assembly 1000 with an asymmetric structure. Fig.11b The size of the third conductive pattern 1130 of the asymmetric structure of the antenna assembly 1000 can be larger than Fig.14b The size of the third conductive pattern 1130b is larger. Therefore, it is equivalent to increasing the grounding size of the monopole antenna through the third conductive pattern 1130 of the antenna component 1000 with an asymmetric structure that is larger than the third conductive pattern 1130b. As the size of the third conductive pattern 1130 of the antenna component 1000 with an asymmetric structure increases, the electric field radiation of the monopole antenna mode in the second frequency band will increase.
[0214] Reference Fig.14b and Fig.16b (a), the peak area of the electric field distribution appears in the first area R1p between the first conductive pattern 1100 and the third conductive pattern 1130 through the third conductive pattern 1130 having a symmetrical structure with the first conductive pattern 1100. Fig.11b and Fig.16b (b), the peak area of the electric field distribution appears in the second area R2p closer to the third conductive pattern 1130 than the first area R1p due to the third conductive pattern 1130 which is larger than the first conductive pattern 1100. In addition, as the size of the third conductive pattern 1130 of the asymmetric antenna component 1000 increases, the area of the second area R2p, which is the peak area of the electric field distribution, also increases compared with the area of the first area Rp1. As a result, the antenna efficiency of the asymmetric antenna component 1000 can be improved in the frequency band above about 3 GHz and the third frequency band.
[0215] On the other hand, the ground conductive pattern 1110g of the second region 1100b of the antenna assembly 1100 of the present specification may have more than one groove for broadband impedance matching. In this regard, Fig.17a The first groove structure and the second groove structure formed by the ground conductive pattern of the antenna component of this specification are shown. On the other hand, Fig.17b It means in Fig.17a A diagram of a first groove structure, a second groove structure, and current distribution around the ground conductive pattern formed by the ground conductive pattern of the antenna component.
[0216] Reference Fig.17a, the ground conductive pattern 1110g may include a first groove 1111s and a second groove 1112s. The first portion 1111g of the ground conductive pattern 1110g may include a first groove 1111s. The length of the first groove 1111s may be formed with a length within λ / 2 to λ based on about 5 GHz. An open region of the first groove 1111s may be formed to face the feed pattern 1110f. The second portion 1112g of the ground conductive pattern 1110g may include a second groove 1112s. The length of the second groove 1112s may be formed with a length within λ / 2 to λ based on about 5 GHz. The open region of the second groove 1112s may be formed to face the first region 1110a as a radiator region.
[0217] Reference Fig.17b It can be seen that the current distribution is concentrated around the feeding pattern 1110f and the first groove 1111s and the second groove 1112s formed on both sides of the feeding pattern 1110f. As a result, the impedance matching characteristics of the HB band and the UHB band, that is, the 3.5 to 6 GHz band, are improved, and the antenna assembly can perform broadband operation.
[0218] On the other hand, the groove structure of the antenna assembly of this specification is not limited to a quadrilateral groove. In this regard, Fig.17c 2 is a diagram showing a circular groove structure of an antenna assembly according to an embodiment. Fig.17c , a circular first groove 1111s2 may be formed in the first portion 1111g of the ground conductive pattern 1110g, and a circular second groove 1112s2 may be formed in the second portion 1112g of the ground conductive pattern 1110g. In this regard, the shapes of the first groove 1111s1 and the second groove 1112s2 are not limited to circular shapes, and may be implemented in an elliptical shape or any polygonal shape. Fig.17a and Fig.17c In the first portion 1111g of the ground conductive pattern 1110g, any one of the first grooves 1111s and 1111s2 may be formed. In addition, in the second portion 1111g of the ground conductive pattern 1110g, any one of the second grooves 1112s and 1112s2 may be formed.
[0219] In the antenna assembly of this specification, the conductive patterns that act as a radiator according to a plurality of antenna operation modes are configured differently, thereby enabling broadband operation. Figures 18a to 18c It shows the electric field distribution formed on the conductive pattern of the antenna component in the first frequency band to the third frequency band.
[0220] Reference Fig.13a and Fig.18aIn the first frequency band, the current distribution on the first conductive pattern 1110 and the third conductive pattern 1130 of the antenna assembly 1000 is higher than the current distribution in other regions. A first region Rp1a as a peak region of the current distribution may be formed in a region of the first conductive pattern 1110. A second region Rp2a as a peak region of the current distribution may be formed in a region of the third conductive pattern 1130. Thus, the first conductive pattern 1110 and the third conductive pattern 1130 may act as radiators in the first frequency band.
[0221] The first frequency band may be set to 617 to 960 MHz, but is not limited thereto. The first conductive pattern 1110 and the third conductive pattern 1130 may act as a dipole antenna in the first frequency band. The first conductive pattern 1110 and the third conductive pattern 1130 may act in a dipole antenna mode, such as Fig.12a (b) , a radiation pattern is formed along the vertical direction.
[0222] Reference Fig.13b and Fig.18b In the second frequency band, the current distribution on the first conductive pattern 1110 of the antenna assembly 1000 is higher than the current distribution in other regions. A peak region Rpb of the current distribution may be formed in the boundary region of the first conductive pattern 1110. Thus, the first conductive pattern 1110 may act as a radiator in the second frequency band.
[0223] The second frequency band may be set to 1520 to 4500 MHz, but is not limited thereto. Thus, the first conductive pattern 1110 may act as a monopole antenna in the second frequency band. The first conductive pattern 1110 acts in a monopole antenna mode, such as Fig.12a (a), a radiation pattern can be formed along the side direction.
[0224] Reference Fig.13c and Fig.18c , in the third frequency band, the current distribution on the second conductive pattern 1120 of the antenna assembly 1000 is higher than the current distribution in other areas. A peak area Rpb of the current distribution can be formed in the boundary area of the second conductive pattern 1120. Thus, the second conductive pattern 1120 can act as a radiator in the third frequency band. The third frequency band can be set to 4500 to 6000 MHz, but is not limited thereto. Therefore, the second conductive pattern 1120 can act as a monopole antenna in the third frequency band. By operating the second conductive pattern 1120 in a monopole antenna mode, as Fig.12a (a), a radiation pattern can be formed along the side direction.
[0225] On the other hand, the antenna assembly according to the present specification that operates in multiple operation modes can operate as a radiator in multiple frequency bands. Fig.19The reflection coefficient characteristics that change depending on whether or not there is a groove for impedance matching in the CPW antenna structure according to the present specification.
[0226] Fig.19 (i) represents the reflection coefficient of the first structure in which no groove for impedance matching is formed in the feeding region of the CPW antenna structure. Fig.19 (ii) represents the reflection coefficient of the second structure in which a groove for impedance matching is formed in the feeding region of the CPW antenna structure. Fig.19 (ii) indicates that a CPW antenna structure has a feed region formed therein for impedance matching. Fig.17a The reflection coefficient of the second structure of the first groove 1111s and the second groove 1112s2 is Fig.19 , the reflection coefficient of the first structure without the groove has a value of -12.4 to -15.3 dB in the third frequency band. The reflection coefficient of the second structure with the first groove 1111s and the second groove 1112s2 formed has a value of -19 to -30.3 dB in the third frequency band. Therefore, it can be seen that as the groove for impedance matching is formed in the feeding area of the CPW antenna structure, the impedance matching characteristics of the third frequency band are improved.
[0227] Reference Fig.13a and Fig.19 In the first frequency band, the antenna assembly 1000 operates as a radiator in the first operation mode. In the first frequency band of 617 to 960 MHz, the reflection coefficient has a value of about -10 dB or less. Fig.13b and Fig.19 In the second frequency band, the antenna assembly 1000 operates as a radiator in the second operation mode. In the second frequency band of 1520 to 4500 MHz, the reflection coefficient has a value of about -10 dB or less. Fig.13c and Fig.19 In the third frequency band, the antenna assembly 1000 operates as a radiator in the third operation mode. In the third frequency band of 4500 to 6000 MHz, the reflection coefficient has a value of about -10 dB or less.
[0228] With the addition Fig.17a The first groove 1111s and the second groove 1112s can improve the reflection coefficient value at about 5 GHz. In this regard, with the addition of the first groove 1111s and the second groove 1112s, it can be known that the reflection coefficient is greatly improved at 5 GHz and 6 GHz. In addition, with the addition of the first groove 1111s and the second groove 1112s, the reflection coefficient has a value of about -15 dB or less at a frequency between 5 GHz and 6 GHz.
[0229] The above is a description of an antenna assembly according to one aspect of the present specification. The following is a description of an antenna assembly according to another aspect of the present specification, which is composed of a plurality of dielectric substrates. Fig. 20 FIG. 4 shows a structure in which a first dielectric substrate and a second dielectric substrate of an antenna assembly according to an embodiment are combined.
[0230] Reference Fig. 20 , the antenna assembly 1000 may include a first dielectric substrate 1010a as a transparent substrate and a second dielectric substrate 1010b as an opaque substrate. The antenna assembly 1000 may include a first region 1100a corresponding to a radiator region and a second region 1100b corresponding to a feeding region. The antenna assembly 1000 may further include a protective layer 1031 and adhesive layers 1041 and 1042. The antenna module 1100 implemented by one or more transparent antenna elements may be configured in the first region 1100a. The feeding structure implemented by one or more second dielectric substrates 1010b may be configured in the second region 1100b.
[0231] The glass panel 310 to which the antenna assembly 1000 may be attached may include a transparent region 311 and an opaque region 312. The first dielectric substrate 1010a formed with a transparent antenna element may be attached to the transparent region 311 of the glass panel 310 by means of an adhesive layer 1041. A protective layer 1031 may be formed on an upper region of the first dielectric substrate 1010a.
[0232] The opaque area 312 of the glass panel 310 may be formed with Figure 6a A frit layer 312f having a frit pattern may be formed on the frit layer 312f of the opaque region 312. The frit pattern of the region where the second dielectric substrate 1010b is configured may be removed from the frit layer 312f of the opaque region 312. The second dielectric substrate 1010b may be configured in the opaque region 312 where the frit pattern is removed. An adhesive layer 1042 may be formed in the opaque region 312 where the frit pattern is removed, and the second dielectric substrate 1010b may be attached to the opaque region 312 of the glass panel 310 by means of the adhesive layer 1042.
[0233] Reference Figures 9a to 9c , Fig.11b , Fig.17a as well as Fig. 20, an antenna component 1000 composed of a plurality of dielectric substrates is described. The antenna component 1000 may include a first dielectric substrate 1010a, a first region 1100a, a second dielectric substrate 1010b, and a second region 1100b. The first region 1100a may be configured to include a conductive pattern on one side of the first dielectric substrate 1010a and radiate a wireless signal. The second region 1100b may include a ground conductive pattern 1110g and a feed pattern 1110f on one side of the second dielectric substrate 1010b. The first region 1100a may also be referred to as a radiator region, and the second region 1100b may be referred to as a ground region (or a feed region).
[0234] The plurality of conductive patterns formed in the first region 1100a of the antenna assembly 1000 may be implemented by more than two conductive patterns, so as to operate in a plurality of frequency bands. Referring to FIG. 17 , the plurality of conductive patterns may include a first conductive pattern 1110 , a second conductive pattern 1120 , and a third conductive pattern 1130 .
[0235] The first conductive pattern 1110 may be composed of a plurality of sub-patterns, i.e., a plurality of conductive portions. The first conductive pattern 1110 may include a first portion 1111 and a second portion 1112. The first portion 1111 may be formed to be perpendicular to the second portion 1112. The second portion 1112 may be electrically connected to the feed pattern 1110f. In this regard, the meaning of "electrically connected" may include that each conductive portion is directly connected or coupled at a specified interval.
[0236] The second conductive pattern 1120 may be disposed on a side region or a lower region of the first conductive pattern 1110. The second conductive pattern 1120 may be electrically connected to the first portion 1111g of the ground conductive pattern 1110g. By further configuring the second conductive pattern 1120 in the antenna assembly 1000, resonance may be achieved in a frequency band different from the operating frequency bands of the first conductive pattern 1110 and the third conductive pattern 1130.
[0237] The third conductive pattern 1130 may be disposed on the other side of the first conductive pattern 1110. The third conductive pattern 1130 may be electrically connected to the second portion 1112g of the ground conductive pattern 1110g. By further configuring the third conductive pattern 1130 in the antenna assembly 1000, resonance may be achieved in a frequency band different from the operating frequency bands of the first conductive pattern 1110 and the second conductive pattern 1120.
[0238] The size of the second conductive pattern 1120 may be smaller than that of the third conductive pattern 1130. Thus, the antenna assembly 1000 may operate as a radiator in a higher frequency band through the second conductive pattern 1120. The second conductive pattern 1120 may be disposed between the first portion 1111 of the first conductive pattern 1110 and the second portion 1112 of the first conductive pattern 1110. Thus, the second conductive pattern 1120 is disposed in the lower region of the first conductive pattern 1110, and the size of the antenna assembly 1000 can be reduced compared to the case where the second conductive pattern 1120 is disposed in the region on one side of the first conductive pattern 1110. The first portion 1111 of the first conductive pattern 1110 and the third conductive pattern 1130 may be disposed on opposite sides with respect to the second portion 1112 of the first conductive pattern 1110. The first portion 1111 of the first conductive pattern 1110 and the third conductive pattern 1130 may be disposed in the region on one side and the region on the other side with respect to the second portion 1112 of the first conductive pattern 1110.
[0239] The first conductive pattern 1110 is combined with the third conductive pattern 1130 and operates in a monopole antenna mode in a first frequency band, and the first conductive pattern 1110 operates alone in a dipole antenna mode in a second frequency band. To this end, the shape of the first conductive pattern 1110 may be optimized into a step structure for broadband operation. In this regard, the first conductive pattern 1110 may be formed to have a plurality of boundary sides.
[0240] Reference Fig.11a , Fig.11b as well as Figures 13a to 13c , the first portion 1111 of the first conductive pattern 1110 may be formed to have a plurality of boundary sides. The first portion 1111 of the first conductive pattern 1110 may be formed to have first to fourth boundary sides BS1 to BS4.
[0241] A first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to have a first step structure. A second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110 may be formed to have a second step structure. The second step structure may be formed in a different shape from the first step structure.
[0242] The third boundary side BS3 of the first portion 1111 of the first conductive pattern 1110 may be disposed between a first end of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 and a first end of the second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110. The fourth boundary side BS4 of the first portion 1111 of the first conductive pattern 1110 may be disposed between a second end of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 and a second end of the second boundary side BS2 of the first portion 1111 of the first conductive pattern 1110. Thus, the shape of the first portion 1111 of the first conductive pattern 1110 may be optimized to perform broadband operation in the first frequency band and the second frequency band.
[0243] The second conductive pattern 1120 may also be formed to have a first boundary side BS1 and a second boundary side BS2. A portion of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to face the first boundary side BS1 of the second conductive pattern 1120. A portion of the first boundary side BS1 of the first portion 1111 of the first conductive pattern 1110 may be formed to face the second boundary side BS2 of the second conductive pattern 1120.
[0244] The third conductive pattern 1130 may also be formed to have a plurality of boundary sides for a step structure. The third conductive pattern 1130 may be formed to have a first boundary side BS1 to a fourth boundary side BS4. The first boundary side BS1 of the third conductive pattern 1130 may be formed to have a third step structure. The first end of the first boundary side BS1 of the third conductive pattern 1130 may be connected to the second portion 1112g of the ground conductive pattern 1110g. The second boundary side BS2 of the third conductive pattern 1130 may be arranged on the opposite side of the first boundary side BS1 of the third conductive pattern 1130.
[0245] The third boundary side BS3 of the third conductive pattern 1130 may be configured between a first end of the first boundary side BS1 of the third conductive pattern and a first end of the second boundary side BS2 of the third conductive pattern 1130. The fourth boundary side BS4 of the third conductive pattern 1130 may be configured between a second end of the first boundary side BS1 of the third conductive pattern 1130 and a second end of the second boundary side BS2 of the third conductive pattern 1130. The third boundary side BS3 of the third conductive pattern 1130 may be configured on the opposite side of the fourth boundary side BS4 of the third conductive pattern 1130. A portion of the second portion 1112 of the first conductive pattern 1110 may be formed to face the fourth boundary side BS4 of the third conductive pattern 1130.
[0246] The length of the third boundary side BS3 of the third conductive pattern 1130 may be the same as the length of the third boundary side BS3 of the first conductive pattern 1110. Thus, the antenna assembly 1000 may be implemented with the length of the third boundary side BS3 of the first conductive pattern 1110 and the third conductive pattern 1130, which can minimize the size of the entire antenna.
[0247] On the other hand, the ground conductive pattern 1110g of the second region 1100b of the antenna assembly 1100 of the present specification may have more than one groove for broadband impedance matching. As mentioned above, Fig.17a and Fig.17b The diagram shows a first groove structure and a second groove structure of a ground conductive pattern formed in the antenna assembly of the present specification, and current distribution around the ground conductive pattern.
[0248] Reference Fig.17a , the ground conductive pattern 1110g may include a first groove 1111s and a second groove 1112s. The first portion 1111g of the ground conductive pattern 1110g may include a first groove 1111s. The length of the first groove 1111s may be formed with a length within λ / 2 to λ based on about 5 GHz. An open region of the first groove 1111s may be formed to face the feed pattern 1110f. The second portion 1112g of the ground conductive pattern 1110g may include a second groove 1112s. The length of the second groove 1112s may be formed with a length within λ / 2 to λ based on about 5 GHz. The open region of the second groove 1112s may be formed to face the first region 1110a as a radiator region.
[0249] On the other hand, the antenna assembly of the present specification can be formed in a transparent antenna structure. Figure 7b , Fig.11a as well as Fig. 20 , the first conductive pattern 1110 and the third conductive pattern 1130 of the antenna assembly 1000 may be formed in a metal mesh shape 1020 having a plurality of open areas OA on a dielectric substrate 1010a. The first conductive pattern 1110 and the third conductive pattern 1130 may be formed by a metal grid pattern 1020a. The metal grid pattern 1020a may be formed to have a dummy metal grid pattern 1020b and an open area OA. The first conductive pattern 1110 and the third conductive pattern 1130 may be formed in a CPW structure on a dielectric substrate 1010a.
[0250] Reference Figure 7b , Fig.11b as well as Fig. 20, the first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed on the dielectric substrate 1010 in a metal mesh shape 1020 having a plurality of open areas OA. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be implemented in a CPW structure on the dielectric substrate 1010. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed by a metal grid pattern 1020a. The metal grid pattern 1020a may be formed to have a dummy metal grid pattern 1020b and an open area OA. The first conductive pattern 1110, the second conductive pattern 1120, and the third conductive pattern 1130 may be formed in a CPW structure on the dielectric substrate 1010a.
[0251] The antenna assembly 1000 may include a radiator region on a dielectric substrate 1010a, that is, a plurality of virtual grid patterns 1020b are included in the outside portion of the first region 1100a. On the other hand, the plurality of virtual grid patterns 1020b may also be configured in the dielectric region between the first conductive pattern to the third conductive pattern 1110 to 1130. The plurality of virtual grid patterns 1020b may be formed to be not connected to the feed pattern 1110f and the ground region 1110g. The plurality of virtual grid patterns 1020b may be formed to be separated from each other.
[0252] On the other hand, the antenna assembly of the present specification may include a first transparent dielectric substrate and a second dielectric substrate formed with a transparent electrode layer. In this regard, Fig.21a and Figure 21b It shows the process flow of combining the antenna assembly of the embodiment with the glass panel.
[0253] Reference Fig.21a (a), a first transparent dielectric substrate 1000a having a transparent electrode layer can be manufactured. In addition, a second dielectric substrate 1000b having a feeding pattern 1120f and grounding patterns 1121g and 1122g formed on both sides of the feeding pattern 1120f can be manufactured. The second dielectric substrate 1000b can be implemented by an FPCB, but is not limited thereto. Adhesion areas corresponding to the adhesive layer 1041 can be formed on the first transparent dielectric substrate 1000a and the second dielectric substrate 1000b, respectively.
[0254] Reference Fig.21a(b), a glass panel 310 having a transparent area 311 and an opaque area 312 can be manufactured. In addition, the antenna assembly 1000 can be manufactured by combining at least one second dielectric substrate 1000b in the lower area of the first transparent dielectric substrate 1000a. The first transparent dielectric substrate 1000a and the second dielectric substrate 1000b can be combined by ACF bonding or low-temperature welding to realize a transparent antenna assembly. Thus, the first conductive pattern formed on the first transparent dielectric substrate 1000a can be electrically connected to the second conductive pattern formed on the second dielectric substrate 1000b. When a plurality of antenna elements are implemented on the glass panel 310, the feeding structure 1100f made of the second dielectric substrate 1000b can also be implemented as a plurality of feeding structures.
[0255] Reference Fig.21a (c), the transparent antenna assembly 1000 may be attached to the glass panel 310. In this regard, the first transparent dielectric substrate 1000a formed with a transparent electrode layer may be disposed in the transparent region 311 of the glass panel 310. On the other hand, the second dielectric substrate 1000b as an opaque substrate may be disposed in the opaque region 312 of the glass panel 310.
[0256] Reference Fig.21a (d), the first transparent dielectric substrate 1000a and the second dielectric substrate 1000b can be joined at the first position P1. The connector component 313 such as the fakra cable can be joined to the second dielectric substrate 1000b at the second position P2. The transparent antenna assembly 1000 can be combined with the telematics control unit (TCU) 300 using the connector component 313. To this end, the second conductive pattern formed on the second dielectric substrate 1010b can be electrically connected to the connector at one end of the connector component 313. The connector at the other end of the connector component 313 can be electrically connected to the telematics control unit (TCU) 300.
[0257] Figure 21b The antenna components and Fig.21a The difference in the structure of the antenna assembly is that the opaque substrate is integrally made on the glass panel 310, rather than being made separately. Figure 21b In the antenna assembly, the feeding structure implemented by the opaque substrate is implemented by directly printing on the glass panel 310, rather than being made separately by the FPCB.
[0258] Reference Figure 21b(a), a first transparent dielectric substrate 1000a having a transparent electrode layer formed thereon can be manufactured. In addition, a glass panel 310 having a transparent region 311 and an opaque region 312 can be manufactured. In the glass panel manufacturing process of the vehicle, a metal wire / plate for connector connection can be realized (fired). As in the case of a heat wire realized in the glass of the vehicle, a transparent antenna mounting portion can be realized in a metal form on the glass panel 310. In this regard, in order to electrically connect to the first conductive pattern of the first transparent dielectric substrate 1000a, a second conductive pattern can be realized in the region having the adhesive layer 1041 formed thereon.
[0259] In this regard, the second dielectric substrate 1000b formed with the second conductive pattern may be manufactured integrally with the glass panel 310. The second dielectric substrate 1000b may be integrally formed with the glass panel 310 at the opaque region 312 of the glass panel 310. The frit pattern 312 formed with the opaque region 312 of the second dielectric substrate 1000b may be removed. The second conductive pattern may be realized by forming a feed pattern 1120f on the second dielectric substrate 1000b and forming ground patterns 1121g, 1122g on both sides of the feed pattern 1120f.
[0260] Reference Figure 21b (b), the transparent antenna assembly 1000 can be attached to the glass panel 310. In this regard, a first transparent dielectric substrate 1000a formed with a transparent electrode layer can be configured in a transparent region 311 of the glass panel 310. The antenna assembly 1000 can be manufactured by combining at least one second dielectric substrate 1000b in a lower region of the first transparent dielectric substrate 1000a. The first transparent dielectric substrate 1000a and the second dielectric substrate 1000b can be combined by ACF bonding or low-temperature welding to realize a transparent antenna assembly. Thus, the first conductive pattern formed on the first transparent dielectric substrate 1000a can be electrically connected to the second conductive pattern formed on the second dielectric substrate 1000b. When a plurality of antenna elements are implemented on the glass panel 310, the feeding structure 1100f made of the second dielectric substrate 1000b can also be implemented as a plurality of feeding structures.
[0261] Reference Figure 21b(c), the first transparent dielectric substrate 1000a and the second dielectric substrate 1000b can be joined at the first position P1. The connector component 313 such as the fakra cable can be joined to the second dielectric substrate 1000b at the second position P2. The transparent antenna assembly 1000 can be combined with the telematics control unit (TCU) 300 using the connector component 313. To this end, the second conductive pattern formed on the second dielectric substrate 1010b can be electrically connected to the connector at one end of the connector component 313. The connector at the other end of the connector component 313 can be electrically connected to the telematics control unit (TCU) 300.
[0262] Hereinafter, a vehicle having an antenna module according to one aspect of the present specification will be described in detail. Fig. 22 This shows a configuration in which a plurality of antenna modules disposed at different positions of the vehicle of this specification are combined with other components of the vehicle.
[0263] Reference Figures 1 to 22 The vehicle 500 has a conductive vehicle body that acts as an electrical ground. The vehicle 500 may have a plurality of antennas 1100a to 1100d that may be disposed at different positions of the glass panel 310. The antenna assembly 1000 may be configured such that the plurality of antennas 1100a to 1100d include a communication module 300. The communication module 300 may include a transceiver circuit 1250 and a processor 1400. The communication module 300 may be equivalent to a TCU of the vehicle or constitute at least a portion of a TCU.
[0264] The vehicle 500 may include an object detection device 520 and a navigation system 550. The vehicle 500 may include an additional processor 570 in addition to the processor 1400 included in the communication module 300. The additional processor 570 may be physically distinguished from the processor 1400 or may be functionally distinguished and implemented on a substrate. The processor 1400 may be implemented as a TCU, and the processor 570 may be implemented as an ECU (Electronic Control Unit).
[0265] In the case where the vehicle 500 is an autonomous driving vehicle, the processor 570 may be an autonomous driving integrated controller (ADCU: Automated Driving Control Unit) integrated with an ECU. Based on the information sensed by the camera 531, the radar 532, and / or the laser radar 533, the processor 570 may search for a path and control the increase or decrease of the speed of the vehicle 500. To this end, the processor 570 may be linked with the processor 530 equivalent to the MCU in the object detection device 520 and / or the communication module 300 equivalent to the TCU.
[0266] The vehicle 500 may include a first transparent dielectric substrate 1010a and a second dielectric substrate 1010b configured on a glass panel 310. The first transparent dielectric substrate 1010a may be formed inside the glass panel 310 of the vehicle or attached to the surface of the glass panel 310. The first transparent dielectric substrate 1010a may be configured to form a conductive pattern in the form of a metal mesh. The vehicle 500 may include an antenna module 1100 on one side of the dielectric substrate 1010, wherein the antenna module 1100 is formed with a conductive pattern formed in the shape of a metal mesh to radiate a wireless signal.
[0267] The antenna assembly 1000 may include a first antenna module 1100a to a fourth antenna module 1100d to perform multiple input and output (MIMO). The first antenna module 1100a may be configured at the upper left side of the glass panel 310, the second antenna module 1100b may be configured at the lower left side, the third antenna module 1100c may be configured at the upper right side, and the fourth antenna module 1100d may be configured at the lower right side. The first antenna module 1100a may be referred to as the first antenna ANT1, the second antenna module 1100b may be referred to as the second antenna ANT2, the third antenna module 1100c may be referred to as the third antenna ANT3, and the fourth antenna module 1100d may be referred to as the fourth antenna ANT4. The first antenna ANT1 may be referred to as the first antenna module ANT1, the second antenna ANT2 may be referred to as the second antenna module ANT2, the third antenna ANT3 may be referred to as the third antenna module ANT3, and the fourth antenna ANT4 may be referred to as the fourth antenna module ANT4.
[0268] As described above, the vehicle 500 may include a telematics control unit (TCU) 300 as a communication module. The TCU 300 may be controlled to transmit and receive signals through at least one of the first to fourth antenna modules 1100a to 1100d. The TCU 300 may include a transceiver circuit 1250 and a baseband processor 1400.
[0269] Thus, the vehicle may further include a transceiver circuit 1250 and a processor 1400. A portion of the transceiver circuit 1250 may also be configured in units of antenna modules or a combination thereof. The transceiver circuit 1250 may be controlled so that a wireless signal of at least one of the first to third frequency bands is radiated through antenna modules ANT1 to ANT4. The first to third frequency bands may be a low frequency band (LB), a middle frequency band (MB), and a high frequency band (HB) for 4G / 5G wireless communications, but are not limited thereto.
[0270] The processor 1400 is operably combined with the transceiver circuit 1250 and can be composed of a modem operating at a baseband. The processor 1400 can be configured to receive or send a signal through at least one of the first antenna module ANT1 and the second antenna module ANT2. The processor 1400 can perform a diversity operation or a MIMO operation using the first antenna module ANT1 and the second antenna module ANT2 to transmit the signal to the interior of the vehicle.
[0271] The antenna module may be disposed in different areas on one side and the other side of the glass panel 310. The antenna module may simultaneously receive signals from the front direction of the vehicle and perform multiple input and output (MIMO). In this regard, the antenna module may further include a third antenna module ANT3 and a fourth antenna module ANT4 in addition to the first antenna module ANT1 and the second antenna module ANT2 to perform 4X4 MIMO.
[0272] The processor 1400 may be configured to select an antenna module to communicate with the entity based on the driving path of the vehicle and the communication path of the entity communicating with the vehicle. The processor 1400 may perform MIMO operation using the first antenna module ANT1 and the second antenna module ANT2 based on the direction of the vehicle. Alternatively, the processor 1400 may perform MIMO operation using the third antenna module ANT2 and the second antenna module ANT4 based on the direction of the vehicle.
[0273] The processor 1400 may perform multiple input and output (MIMO) in the first frequency band through two or more antennas among the first antenna ANT1 to the fourth antenna ANT4. The processor 1400 may perform multiple input and output (MIMO) in at least one of the second frequency band and the third frequency band through two or more antennas among the first antenna ANT1 to the fourth antenna ANT4.
[0274] Therefore, when the signal transmission and reception performance of the vehicle decreases in a certain frequency band, the vehicle can transmit and receive signals through other frequency bands. As an example, for a wider communication coverage and connection reliability, the vehicle can preferentially perform communication connection in the first frequency band, which is a low frequency band, and then perform communication connection in the second and third frequency bands.
[0275] The processor 1400 can control the transceiver circuit 1250 to perform carrier aggregation (CA) or dual connectivity (DC) through at least one of the first antenna ANT1 to the fourth antenna ANT4. In this regard, the communication capacity can be expanded by aggregating the second and third frequency bands that are wider than the first frequency band. In addition, the communication reliability can be improved by utilizing a plurality of antenna elements configured in different areas of the vehicle to provide dual connectivity with surrounding vehicles or entities.
[0276] The broadband transparent antenna assembly that can be disposed on the vehicle glass and the vehicle having the same have been described above. Next, the technical effects of the broadband transparent antenna assembly that can be disposed on the vehicle glass and the vehicle as described above will be described.
[0277] According to the present specification, a broadband transparent antenna assembly having a plurality of conductive patterns that can be arranged on vehicle glass is provided, thereby enabling 4G / 5G broadband wireless communication in the vehicle.
[0278] According to the present specification, the shape of the conductive pattern in the broadband transparent antenna assembly that can be configured on the vehicle glass can be optimized, and the antenna efficiency can be improved by the conductive pattern structure having an asymmetric structure.
[0279] According to the present specification, the end portion of the conductive pattern of the transparent dielectric substrate and the end portion of the conductive pattern of the opaque substrate are connected to each other so as to overlap, thereby being able to reduce the feeding loss.
[0280] According to the present specification, a broadband antenna structure made of a transparent material can be realized that can reduce feed loss and improve antenna efficiency by setting antenna operation modes differently for each frequency band.
[0281] According to the present specification, the feeding pattern of the feeding structure implemented by the opaque substrate disposed in the opaque area of the vehicle glass is directly combined with the transparent antenna, thereby improving the efficiency of the feeding structure of the broadband transparent antenna assembly.
[0282] According to the present specification, the feed pattern of the feed structure and the conductive pattern of the antenna module are combined by low-temperature bonding, thereby making it possible to ensure the reliability of the mechanical structure including the feed structure.
[0283] According to the present specification, an open dummy region in which a slit is formed is formed in the dielectric region, thereby minimizing the difference in visibility between the region where the antenna of the transparent material is arranged and other regions.
[0284] According to the present specification, the boundary of the antenna region is spaced apart from the boundary of the dummy pattern region by a prescribed interval, thereby being able to ensure invisibility of the transparent antenna and the antenna assembly including the same without deteriorating antenna performance.
[0285] According to the present specification, the open dummy structure is formed such that the intersection of the metal wires of the dummy region or a portion of the metal wires is cut off, thereby ensuring the invisibility of the transparent antenna and the antenna assembly including the same without deteriorating the antenna performance.
[0286] According to the present specification, visibility in a transparent antenna can be improved without deterioration of antenna performance through optimal design of a slit having a dummy pattern of an open area and an open area with a radiator area.
[0287] According to the present specification, a broadband antenna structure made of a transparent material that can operate in a broadband, reduce feed loss, and improve antenna efficiency can be provided through vehicle glass or a display area of an electronic device.
[0288] According to the present specification, a transparent antenna structure capable of minimizing antenna performance variation and transparency differences between an antenna area and a surrounding area and capable of wireless communication in 4G and 5G frequency bands.
[0289] According to the present specification, a transparent antenna structure capable of minimizing antenna performance variation and a transparency difference between an antenna region and a peripheral region and capable of wireless communication in a millimeter wave frequency band can be provided.
[0290] The following detailed description will further clarify the additional scope to which this specification can be applied. However, since a person skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, it should be understood that the specific embodiments of the preferred embodiments described in detail and this specification are only examples.
[0291] In connection with the aforementioned present specification, the design of the antenna assembly including the transparent antenna and the vehicle controlling it and its driving can be implemented by a computer-readable code on a medium having a program recorded thereon. Computer-readable media include all types of storage devices storing data that can be read by a computer system. Examples of computer-readable media include HDD (Hard Disk Drive), solid-state drive (Solid State Disk, SSD), SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc., and can also be implemented in the form of a carrier wave (e.g., Internet-based transmission). In addition, the computer may also include a control unit of the terminal. Therefore, the detailed description described above should not be construed as restrictive in all respects, but should be construed as exemplary. The scope of this specification should be determined by a reasonable interpretation of the attached claims, and all changes within the equivalent scope of this specification should fall within the scope of this specification.
Claims
1. An antenna assembly, wherein: include: Dielectric substrate; A first region including a conductive pattern on one side of the dielectric substrate and radiating a wireless signal; as well as a second region including a ground conductive pattern and a feed pattern; The conductive pattern comprises: A first conductive pattern, comprising a first portion and a second portion, wherein the first portion is perpendicular to the second portion, and the second portion is electrically connected to the feeding pattern; a second conductive pattern electrically connected to the first portion of the ground conductive pattern; and a third conductive pattern electrically connected to the second portion of the ground conductive pattern; The size of the second conductive pattern is smaller than the size of the third conductive pattern, The second conductive pattern is arranged between the first portion of the first conductive pattern and the second portion of the first conductive pattern, The first portion of the first conductive pattern and the third conductive pattern are arranged on opposite sides with respect to the second portion of the first conductive pattern.
2. The antenna assembly according to claim 1, wherein: The first conductive pattern and the third conductive pattern operate in a dipole antenna mode in a first frequency band, The first conductive pattern and the third conductive pattern have an asymmetric structure.
3. The antenna assembly according to claim 2, characterized in that: The first conductive pattern operates in a monopole antenna mode in the second frequency band, The second frequency band is higher than the first frequency band.
4. The antenna assembly according to claim 3, characterized in that: The second conductive pattern operates in a third frequency band, The third frequency band is higher than the second frequency band.
5. The antenna assembly according to claim 1, wherein: A first boundary side of the first portion of the first conductive pattern has a first step structure, A second boundary side of the first portion of the first conductive pattern has a second step structure, the second step structure having a shape different from the first step structure, The third boundary side of the first portion of the first conductive pattern is arranged between the first end portion of the first portion of the first conductive pattern on the first boundary side and the first end portion of the first portion of the first conductive pattern on the second boundary side. The fourth boundary side of the first portion of the first conductive pattern is arranged between the second end portion of the first portion of the first conductive pattern on the first boundary side and the second end portion of the first portion of the first conductive pattern on the second boundary side.
6. The antenna assembly according to claim 5, wherein: a portion of the first boundary side of the first portion of the first conductive pattern faces the first boundary side of the second conductive pattern, A portion of the first boundary side of the second conductive pattern faces the second boundary side of the second conductive pattern.
7. The antenna assembly according to claim 6, wherein: The first boundary side of the third conductive pattern has a third step structure, The first end portion of the third conductive pattern on the first boundary side is connected to the second portion of the ground conductive pattern. The second boundary side of the third conductive pattern is arranged on the opposite side of the first boundary side of the third conductive pattern, The third boundary side of the third conductive pattern is arranged between the first end portion of the first boundary side of the third conductive pattern and the first end portion of the second boundary side of the third conductive pattern. The fourth boundary side of the fourth conductive pattern is arranged between the second end portion of the first boundary side of the third conductive pattern and the second end portion of the second boundary side of the third conductive pattern. The third boundary side of the third conductive pattern is arranged on the opposite side of the fourth boundary side of the fourth conductive pattern, A portion of the second portion of the first conductive pattern faces the fourth boundary side of the third conductive pattern.
8. The antenna assembly according to claim 7, characterized in that: The length of the third boundary side of the third conductive pattern is the same as the length of the third boundary side of the first conductive pattern.
9. The antenna assembly according to claim 1, wherein: The first portion of the second region includes a first groove, The length of the first groove is within a range of λ / 2 to λ, An open area of the first groove faces the feeding pattern.
10. The antenna assembly according to claim 1, wherein: The second portion of the second region includes a second groove, The length of the second groove is within a range from λ / 2 to λ, An open area of the second groove faces the first area.
11. The antenna assembly according to claim 1, characterized in that: The first conductive pattern, the second conductive pattern, and the third conductive pattern are formed on the dielectric substrate in a metal mesh shape having a plurality of open areas. The first conductive pattern, the second conductive pattern, and the third conductive pattern are formed on the dielectric substrate in a coplanar waveguide structure.
12. The antenna assembly according to claim 1, wherein: The antenna assembly includes a plurality of virtual grid patterns at an outer portion of the first region on the dielectric substrate, A plurality of the virtual grid patterns are not connected to the feed pattern and the ground conductive pattern. The plurality of virtual grid patterns are separated from each other.
13. An antenna assembly, wherein: include: a first dielectric substrate; A first region including a conductive pattern on one side of the first dielectric substrate and radiating a wireless signal; a second dielectric substrate; as well as a second region including a ground conductive pattern and a feed pattern on one side of the second dielectric substrate; The conductive pattern comprises: A first conductive pattern, comprising a first portion and a second portion, wherein the first portion is perpendicular to the second portion, and the second portion is electrically connected to the feeding pattern; a second conductive pattern electrically connected to the first portion of the ground conductive pattern; and a third conductive pattern electrically connected to the second portion of the ground conductive pattern; The size of the second conductive pattern is smaller than the size of the third conductive pattern, The second conductive pattern is arranged between the first portion of the first conductive pattern and the second portion of the first conductive pattern, The first portion of the first conductive pattern and the third conductive pattern are arranged on opposite sides with respect to the second portion of the first conductive pattern.
14. The antenna assembly according to claim 13, wherein: The first conductive pattern and the third conductive pattern operate in a dipole antenna mode in a first frequency band, The first conductive pattern and the third conductive pattern have an asymmetric structure.
15. The antenna assembly according to claim 14, characterized in that: The first conductive pattern operates in a monopole antenna mode in the second frequency band, The second frequency band is higher than the first frequency band.
16. The antenna assembly according to claim 15, characterized in that The second conductive pattern operates in a third frequency band, The third frequency band is higher than the second frequency band.
17. The antenna assembly according to claim 13, wherein: A first boundary side of the first portion of the first conductive pattern has a first step structure, A second boundary side of the first portion of the first conductive pattern has a second step structure, the second step structure having a shape different from the first step structure, The third boundary side of the first portion of the first conductive pattern is arranged between the first end portion of the first portion of the first conductive pattern on the first boundary side and the first end portion of the first portion of the first conductive pattern on the second boundary side. The fourth boundary side of the first portion of the first conductive pattern is arranged between the second end portion of the first portion of the first conductive pattern on the first boundary side and the second end portion of the first portion of the first conductive pattern on the second boundary side.
18. The antenna assembly according to claim 17, wherein: a portion of the first boundary side of the first portion of the first conductive pattern faces the first boundary side of the second conductive pattern, A portion of the first boundary side of the second conductive pattern faces the second boundary side of the second conductive pattern.
19. The antenna assembly according to claim 18, wherein: The first boundary side of the third conductive pattern has a third step structure, The first end portion of the third conductive pattern on the first boundary side is connected to the second portion of the ground conductive pattern. The second boundary side of the third conductive pattern is arranged on the opposite side of the first boundary side of the third conductive pattern, The third boundary side of the third conductive pattern is arranged between the first end portion of the first boundary side of the third conductive pattern and the first end portion of the second boundary side of the third conductive pattern. The fourth boundary side of the fourth conductive pattern is arranged between the second end portion of the first boundary side of the third conductive pattern and the second end portion of the second boundary side of the third conductive pattern. The third boundary side of the third conductive pattern is arranged on the opposite side of the fourth boundary side of the fourth conductive pattern, A portion of the second portion of the first conductive pattern faces the fourth boundary side of the third conductive pattern.
20. The antenna assembly of claim 13, wherein: The first portion of the second region includes a first groove, The length of the first groove is within a range of λ / 2 to λ, An open area of the first groove faces the feeding pattern.
21. The antenna assembly of claim 13, wherein: The second portion of the second region includes a second groove, The length of the second groove is within a range of λ / 2 to λ, An open area of the second groove faces the first area.
22. The antenna assembly according to claim 13, wherein: The first conductive pattern, the second conductive pattern, and the third conductive pattern are formed on the dielectric substrate in a metal mesh shape having a plurality of open areas. The first conductive pattern, the second conductive pattern, and the third conductive pattern are formed on the dielectric substrate in a coplanar waveguide structure.
23. The antenna assembly of claim 13, wherein: The antenna assembly includes a plurality of virtual grid patterns at an outer portion of the first region on the dielectric substrate, A plurality of the virtual grid patterns are not connected to the feed pattern and the ground conductive pattern. The plurality of virtual grid patterns are separated from each other.