Control equipment and double-sided film pasting control method for miniature connecting piece of control equipment

Abstract

The invention relates to a control device and a double-sided film pasting control method for a miniature connecting piece thereof, the control device is applied to a double-sided film pasting device, the double-sided film pasting device comprises a film pasting station and a heating adhesive pasting mechanism, and the method comprises the steps that adhesive pasting position data of a to-be-pasted element is obtained, according to the rubberizing position data, the rubberizing element is subjected to rubber stripping in a one-out-two rolling mode and then is synchronously conveyed to the position in front of the rubberizing face of the element to be rubberized, and a detection control instruction is obtained; according to the detection control instruction, deviation correction data between the heating rubberizing mechanism and the rubberizing element and / or the to-be-rubberized element is collected, and a deviation correction control instruction is obtained; according to the deviation correction control instruction and the deviation correction data, glue adjustment and deviation correction processing are conducted on the heating glue pasting mechanism and / or the glue element, and a glue pasting control instruction is obtained; and according to the rubberizing control instruction, the heating rubberizing mechanism in front of the corresponding rubberizing surface is controlled to adhere the colloid of the rubberizing element to the rubberizing surface of the to-be-rubberized element in a heating and pressurizing manner, so that double-sided rubberizing of the to-be-rubberized element is completed at one time, and the consumed time is short.

Description

Technical Field

[0001] The present application relates to the technical field of double-sided film lamination for micro-connectors, and in particular to a control device and a double-sided film lamination control method for micro-connectors thereof. Background Art

[0002] Micro connectors are small in size. If a double-sided film is applied to a micro connector, and the corresponding film is also a micro double-sided tape, then there are the following problems with applying the micro double-sided tape to the micro connector: First, the colloid of the micro double-sided tape cannot quickly detach from the isolation paper during the gluing process, and the gluing action can be completed quickly; second, in the double-sided gluing process, a single gluing needs to be completed in two times, which results in a long process. For example, because the connection between the battery pole piece and its pole ear is easy to fall off and has a problem of cold welding, resulting in poor connection at the connection, the connection between the pole ear and the pole piece needs to be glued with colloid to increase the firmness of the connection, but the pole ear and the pole piece are micro connectors, and gluing on the pole ear and the pole piece by manual or equipment is difficult and time-consuming. Summary of the invention

[0003] The present application provides a control method for double-sided film pasting of a control device and a micro connector thereof, which is used to solve the technical problem that the existing method of pasting between micro connectors and micro double-sided adhesive tapes cannot be pasted quickly and is time-consuming.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] On the one hand, a double-sided film laminating control method for a micro connector is provided, which is applied to a double-sided film laminating device, wherein the double-sided film laminating device includes a film laminating station for placing a component to be laminated and a heating laminating mechanism located directly in front of each laminating surface of the component to be laminated. The double-sided film laminating control method includes the following steps:

[0006] Obtaining glue position data of the component to be glued on the glue sticking station, and according to the glue position data, using a one-out and two-winding method to peel off the glue of the glue component and then synchronously transmit it to the front of the glue sticking surface of the component to be glued in the glue sticking station, and obtaining a detection control instruction;

[0007] According to the detection control instruction, the correction data between the heating glue-applying mechanism and the glue component and / or the component to be glued are collected to obtain the correction control instruction;

[0008] According to the deviation correction control instruction and the deviation correction data, the heating glue-applying mechanism and / or the glue element are subjected to glue adjustment and deviation correction processing to obtain the deviation-corrected glue-applying control instruction;

[0009] According to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to stick the glue of the glue component on the gluing surface of the component to be glued by heating and pressurizing, so as to complete the double-sided gluing of the component to be glued.

[0010] Preferably, the one-out-two-winding mode includes: unwinding detection control, unwinding tension control and synchronous winding control;

[0011] The unwinding detection control is used to detect whether the unwinding of the adhesive element is continuous and whether the adhesive element is being transported;

[0012] The unwinding tension control is used to control the conveyed rubber element to always be in a tensioned state;

[0013] The synchronous winding control is used to use a buffer induction element to control another winding module to run synchronously with the first winding module based on a winding module, so as to achieve synchronous winding of the two winding modules; the winding module is used to wind up the isolation paper after the adhesive element is peeled off.

[0014] Preferably, the winding directions of the two winding modules are opposite.

[0015] Preferably, if the heating glue sticking mechanism is installed on the glue sticking structure, performing glue adjustment and correction processing on the heating glue sticking mechanism and / or the glue element according to the correction control instruction and the correction data includes:

[0016] If the deflection correction data is deflection correction data between the adhesive component and the adhesive component to be adhesively bonded, the adhesive component is adjusted and deflected according to the deflection correction control instruction and the deflection correction data through the one-out and two-winding method;

[0017] If the correction data is correction data between the heating glue sticking mechanism and the glue element, the glue sticking structure is controlled to move according to the correction data according to the correction control instruction, so as to adjust the glue and correct the deviation of the heating glue sticking mechanism;

[0018] If the correction data is the correction data between the heated gluing mechanism and the glue element and the element to be glued, according to the correction control instruction and the correction data, the glue element is firstly adjusted and corrected by the one-out and two-winding method, and then the movement of the gluing structure is controlled to achieve the glue adjustment and correction of the heated gluing mechanism.

[0019] Preferably, the parameters of the heating and pressurizing method include a time of 0.1 s, a heating temperature of 85° C. to 95° C., and a pressure of 80N to 90N.

[0020] Preferably, controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing according to the glue sticking control instruction includes: controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing according to the glue sticking control instruction through a cam driving method.

[0021] Preferably, controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing according to the glue sticking control instruction includes: controlling the two heating glue sticking mechanisms in front of the corresponding glue sticking surface to stick the glue of the glue element on the two glue sticking surfaces of the component to be glued by heating and pressurizing according to the glue sticking control instruction to form a clamping type or a top pressing type to complete the double-sided gluing of the component to be glued.

[0022] Preferably, if the two heating gluing mechanisms in front of the corresponding gluing surfaces are controlled according to the gluing control instruction to form a clamping type to stick the glue of the glue element on the two gluing surfaces of the component to be glued by heating and pressurizing, the double-sided film control method also includes: limiting the moving position of the heating gluing mechanism by a limiting element.

[0023] Preferably, the double-sided film lamination control method of the micro-connector also includes: collecting the glue correction data of the component to be glued after double-sided gluing to obtain an overall control instruction; controlling the movement of the double-sided film lamination equipment according to the glue correction data based on the overall control instruction to adjust the relative position between the double-sided film lamination equipment and the component to be glued.

[0024] In another aspect, a control device is provided, comprising a processor and a memory;

[0025] The memory is used to store program codes and transmit the program codes to the processor;

[0026] The processor is used to execute the above-mentioned double-sided film lamination control method for micro-connectors according to the instructions in the program code.

[0027] The control device and the double-sided film-sticking control method of the micro-connector thereof are applied to the double-sided film-sticking device, the double-sided film-sticking device comprises a film-sticking station for placing the component to be glued and a heating glue-sticking mechanism located in front of each glue-sticking surface of the component to be glued, the double-sided film-sticking control method comprises the following steps: obtaining the glue-sticking position data of the component to be glued on the glue-sticking station, and according to the glue-sticking position data, the glue component is peeled off by a one-out and two-winding method, and then synchronously transmitted to the front of the glue-sticking surface of the component to be glued in the glue-sticking station, and a detection control instruction is obtained; according to the detection control instruction, the correction data between the heating glue-sticking mechanism and the glue component and / or the component to be glued are collected, and the correction control instruction is obtained; according to the correction control instruction, the heating glue-sticking mechanism and / or the glue component are adjusted and corrected according to the correction data, and the glue control instruction after correction is obtained; according to the glue control instruction, the heating glue-sticking mechanism in front of the corresponding glue-sticking surface is controlled to stick the glue of the glue component on the glue-sticking surface of the component to be glued in a heating and pressurizing manner, so as to complete the double-sided gluing of the component to be glued.

[0028] It can be seen from the above technical solutions that this application has the following advantages:

[0029] The double-sided film pasting control method of the micro-connector is to peel off the glue component and synchronously transmit it to the front of the film pasting surface of the component to be pasted with glue through a one-out and two-winding method, and then adjust the heating glue pasting mechanism and / or the position between the glue component and the component to be pasted with glue through the correction data to improve the film pasting accuracy; finally, the two heating glue pasting mechanisms located on the glue pasting surface of the component to be pasted with glue after correction are controlled to adhere the glue of the glue component to the glue pasting surface of the component to be pasted with glue, so as to complete the double-sided gluing of the component to be pasted in one time, and the double-sided gluing takes a short time, which solves the technical problem that the existing gluing method between micro-connectors and micro double-sided tapes cannot be quickly pasted and is time-consuming. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0031] Figure 1 This is a flow chart of the steps of the double-sided film lamination control method for a micro-connector described in an embodiment of the present application. DETAILED DESCRIPTION

[0032] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described below are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0034] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0035] Explanation of terms in this application:

[0036] Miniature refers to something that is smaller or shorter than similar things, or much smaller in size or length.

[0037] The embodiment of the present application provides a control device and a double-sided film-sticking control method for micro connectors, which solves the technical problem that the existing micro connector and micro double-sided adhesive tape cannot be quickly pasted and takes a long time. The control device and the double-sided film-sticking control method for micro connectors can be applied to the double-sided film-sticking processing of various micro connectors, and the micro connectors can be flexible circuit boards, battery tabs or battery poles, etc.

[0038] Embodiment 1:

[0039] like Figure 1 As shown, the embodiment of the present application provides a double-sided film laminating control method for a micro connector, which is applied to a double-sided film laminating device. The double-sided film laminating device includes a film laminating station for placing components to be laminated and a heating laminating mechanism located directly in front of each laminating surface of the components to be laminated. The double-sided film laminating control method includes the following steps:

[0040] S1. Obtain the glue position data of the component to be glued at the glue sticking station, and according to the glue position data, use a one-out and two-winding method to peel off the glue of the glue component and then synchronously transfer it to the front of the glue sticking surface of the component to be glued in the glue sticking station to obtain the detection control instruction.

[0041] It should be noted that in step S1, the glue position data of the component to be glued is first obtained to facilitate the subsequent transmission of the glue component and provide control data; secondly, the detection control instruction is obtained in front of the glue surface of the component to be glued using a one-out and two-winding method according to the glue position data. In this embodiment, the glue component includes a colloid and a first release paper and a second release paper adhered to both sides of the colloid. The one-out and two-winding method can be understood as an unwinding output for placing the glue component, and there are two windings of the first release paper and the second release paper. The component to be glued can be a micro-connector. The double-sided film control method of the micro-connector conveys the glue component by a one-out and two-winding method, which can quickly peel off the colloid and the release paper of the glue component, thereby improving the efficiency of filming.

[0042] S2. According to the detection control instruction, the correction data between the heating glue-applying mechanism and the glue component and / or the component to be glued are collected to obtain the correction control instruction.

[0043] It should be noted that in step S2, the correction data is obtained to ensure the gluing accuracy of the double-sided gluing of the component to be glued and provide data for the subsequent adjustment of the position between the heating gluing mechanism and the component to be glued.

[0044] S3. According to the deviation correction control instruction, the heating glue-applying mechanism and / or the glue element are subjected to glue adjustment and deviation correction processing according to the deviation correction data, and the deviation-corrected glue-applying control instruction is obtained.

[0045] It should be noted that in step S3, the position between the heating gluing mechanism and / or the glue element and the component to be glued is adjusted according to the correction data and correction control instructions obtained in step S2, so as to improve the gluing accuracy of the component to be glued for double-sided gluing.

[0046] S4. According to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to stick the glue of the glue component on the gluing surface of the component to be glued by heating and pressurizing, so as to complete the double-sided gluing of the component to be glued.

[0047] It should be noted that in step S4, the two heating glue sticking mechanisms corresponding to the glue sticking surface of the component to be glued are controlled according to the glue sticking control instruction of step S3 to stick the glue of the glue component to the glue sticking surface of the component to be glued, so as to realize the double-sided glue sticking of the component to be glued. In this embodiment, the double-sided film sticking control method of the micro-connector completes the double-sided glue sticking of the component to be glued in one time through steps S1 to S4. Compared with the existing double-sided glue sticking method of completing a single glue sticking in two times, the double-sided glue sticking of the double-sided film sticking control method of the micro-connector is time-consuming. Among them, the parameters of the heating and pressurizing method include a time of 0.1s, a heating temperature of 85℃ to 95℃, and a pressure of 80N to 90N.

[0048] The present application provides a double-sided film-sticking control method for a micro-connector, which is applied to a double-sided film-sticking device. The double-sided film-sticking device includes a film-sticking station for placing components to be glued and a heating glue-sticking mechanism located directly in front of each glue-sticking surface of the components to be glued. The double-sided film-sticking control method includes the following steps: obtaining glue position data of the components to be glued on the glue-sticking station, and according to the glue position data, using a one-out and two-winding method to peel off the glue of the glue component and then synchronously transmit it to the glue-sticking station in front of the glue-sticking surface of the components to be glued, to obtain a detection control instruction; according to the detection control instruction, collecting correction data between the heating glue-sticking mechanism and the glue component and / or the components to be glued, respectively, to obtain a correction control instruction; according to the correction control instruction, the heating glue-sticking mechanism and / or the glue component are adjusted and corrected according to the correction data to obtain a glue-sticking control instruction after correction; according to the glue control instruction, the heating glue-sticking mechanism in front of the corresponding glue-sticking surface is controlled to stick the glue of the glue component on the glue-sticking surface of the components to be glued by heating and pressurizing, so as to complete the double-sided gluing of the components to be glued. The double-sided film pasting control method of the micro-connector is to peel off the glue component and synchronously transmit it to the front of the film pasting surface of the component to be pasted with glue through a one-out and two-winding method, and then adjust the heating glue pasting mechanism and / or the position between the glue component and the component to be pasted with glue through the correction data to improve the film pasting accuracy; finally, the two heating glue pasting mechanisms located on the glue pasting surface of the component to be pasted with glue after correction are controlled to adhere the glue of the glue component to the glue pasting surface of the component to be pasted with glue, so as to complete the double-sided gluing of the component to be pasted in one time, and the double-sided gluing takes a short time, which solves the technical problem that the existing gluing method between micro-connectors and micro double-sided tapes cannot be quickly pasted and is time-consuming.

[0049] In order to allow the colloid of the adhesive element to quickly separate from the release paper and quickly complete the gluing action, in one embodiment of the present application, the one-out-two-winding method includes: unwinding detection control, unwinding tension control and synchronous winding control;

[0050] In the embodiment of the present application, the unwinding detection control is used to detect whether the unwinding adhesive element is continuous and whether there is any adhesive element being transported.

[0051] It should be noted that the unwinding detection control is to ensure whether there are any glue components being transmitted during the transmission process, whether the transmitted glue components are disconnected, and to ensure the quality of the transmission of the glue components.

[0052] In the embodiment of the present application, the unwinding tension control is used to control the conveyed adhesive element to always be in a tensioned state.

[0053] It should be noted that the unwinding tension control is to ensure that the adhesive element is always in a taut or tensioned state during the transmission process to avoid wrinkles in the adhesive element and cause poor double-sided gluing.

[0054] In an embodiment of the present application, the synchronous winding control is used to use a buffer sensing element to control another winding module to run synchronously with the first winding module based on a winding module, so as to achieve synchronous winding of the two winding modules; the winding module is used to wind up the isolation paper after the adhesive element is peeled off.

[0055] It should be noted that the buffer sensing element is used to detect the rotation speed of the winding module, and the buffer sensing element can be a synchronous regulator. The synchronous regulator uses the speed of the winding release paper of one winding module as a reference to detect the adjustment amount of the speed of the winding release paper of another winding module. Then, the speed of the winding release paper of the other winding module is adjusted according to the adjustment amount, so that the two winding modules run synchronously to ensure the transmission of the adhesive element.

[0056] In one embodiment of the present application, the winding directions of the two winding modules are opposite.

[0057] It should be noted that one winding module winds up the release paper in a clockwise direction, while the other winding module winds up the release paper in a counterclockwise direction.

[0058] In order to ensure the accuracy of double-sided gluing, it is necessary to perform a correction operation on the transferred glue element and the heated glue mechanism. In one embodiment of the present application, if the heated glue mechanism is installed on the glue structure, the glue adjustment and correction processing of the heated glue mechanism and / or glue element according to the correction control instruction and the correction data include:

[0059] If the correction data is the correction data between the adhesive component and the component to be glued, the adhesive component is adjusted and corrected according to the correction control instruction and the correction data through a one-out and two-winding method;

[0060] If the correction data is correction data between the heating glue laminating mechanism and the component to be glued, the glue laminating structure is controlled to move according to the correction data according to the correction control instruction, so as to adjust the glue and correct the deviation of the heating glue laminating mechanism;

[0061] If the correction data is the correction data between the heated gluing mechanism and the glue component and the component to be glued, according to the correction control instruction and the correction data, the glue component is first adjusted and corrected through a one-out and two-winding method, and then the movement of the glue structure is controlled to achieve glue adjustment and correction of the heated gluing mechanism.

[0062] It should be noted that the double-sided film control method of the micro connector uses different driving methods to adjust the corresponding mechanism for correction adjustment according to the obtained correction data, ensuring that the heated gluing mechanism and the glue element are directly in front of the gluing surface of the component to be glued, so as to facilitate the heated gluing mechanism to accurately stick the glue of the glue element to the gluing surface of the component to be glued, thereby improving the accuracy of gluing.

[0063] In order to realize the heating gluing mechanism to quickly stick the glue element to the gluing surface of the component to be glued. In one embodiment of the present application, according to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to stick the glue of the glue element to the gluing surface of the component to be glued by heating and pressurizing, which includes: according to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled by a cam driving method to stick the glue of the glue element to the gluing surface of the component to be glued by heating and pressurizing.

[0064] It should be noted that the cam driving method refers to the use of a cam transmission method to drive the heating glue sticking mechanism to operate so as to quickly stick the glue component to the glue sticking surface of the component to be glued, thereby increasing the glue sticking speed.

[0065] In order to apply double-sided gluing to different components to be glued, in one embodiment of the present application, according to the glue control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to heat and pressurize the glue of the glue component to the gluing surface of the component to be glued, including: according to the glue control instruction, the two heating gluing mechanisms in front of the corresponding gluing surface are controlled to heat and pressurize the glue of the glue component to form a clamping or top pressing method to complete the double-sided gluing of the component to be glued.

[0066] It should be noted that, depending on the type of component to be glued, the heating glue sticking mechanism is used in different ways to quickly stick the glue component to the glue sticking surface of the component to be glued. For example, for the double-sided glue sticking of the tab, a top-pressing heating glue sticking mechanism is used to stick the glue of the glue component to the two glue sticking surfaces of the component to be glued; for the double-sided glue sticking of the flexible circuit board, a clamping heating glue sticking mechanism is used to stick the glue of the glue component to the two glue sticking surfaces of the component to be glued.

[0067] In order to apply double-sided gluing to different components to be glued, the gluing efficiency should also be improved. In one embodiment of the present application, according to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to heat and pressurize the glue of the glue component to the gluing surface of the component to be glued, which includes: according to the gluing control instruction, the two heating gluing mechanisms in front of the corresponding gluing surface are controlled by cam driving to form a clamping or top pressing method to heat and pressurize the glue of the glue component to the gluing surface of the component to be glued.

[0068] For the sandwich-type heating glue sticking mechanism, in order to ensure that the heating glue sticking mechanism can accurately stick glue. In one embodiment of the present application, if the two heating glue sticking mechanisms in front of the corresponding glue sticking surfaces are controlled according to the glue sticking control instruction to form a sandwich-type glue sticking of the glue element on the two glue sticking surfaces of the component to be glued by heating and pressurizing, the double-sided film sticking control method also includes: limiting the moving position of the heating glue sticking mechanism by a limiting element.

[0069] It should be noted that the limiting element may be a limiting block.

[0070] In order to be applicable to components to be glued of different sizes, in one embodiment of the present application, the double-sided film laminating control method of the micro connector further includes: collecting glue correction data after double-sided glue laminating of the component to be glued to obtain an overall control instruction; and controlling the movement of the double-sided film laminating device according to the glue correction data according to the overall control instruction to adjust the relative position between the double-sided film laminating device and the component to be glued.

[0071] It should be noted that the double-sided film laminating control method of the micro connector can adjust the position between the double-sided film laminating device and the component to be glued by controlling the movement of the double-sided film laminating device according to the glue size of the component to be glued, thereby broadening the practicality of the film laminating.

[0072] Embodiment 2:

[0073] An embodiment of the present application provides a control device, including a processor and a memory;

[0074] A memory, used for storing program codes and transmitting the program codes to a processor;

[0075] The processor is used to execute the double-sided film lamination control method of the micro-connector according to the instructions in the program code.

[0076] It should be noted that the processor is used to execute the steps in the above-mentioned double-sided film laminating control method embodiment of a micro-connector according to the instructions in the program code. Alternatively, the processor implements the functions of each module / unit in the above-mentioned system / device embodiments when executing the computer program. The control device can be a PLC controller.

[0077] Exemplarily, the computer program may be divided into one or more modules / units, one or more modules / units are stored in a memory and executed by a processor to complete the present application. One or more modules / units may be a series of computer program instruction segments capable of completing a specific function, and the instruction segments are used to describe the execution process of the computer program in the control device.

[0078] The control device may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The control device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that this does not constitute a limitation on the control device, and may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the control device may also include an input / output device, a network access device, a bus, etc.

[0079] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (dSIC), field-programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0080] The memory may be an internal storage unit of the control device, such as a hard disk or memory of the control device. The memory may also be an external storage device of the control device, such as a plug-in hard disk, a smart memory card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device. Furthermore, the memory may include both an internal storage unit of the control device and an external storage device. The memory is used to store computer programs and other programs and data required by the control device. The memory may also be used to temporarily store data that has been output or is to be output.

[0081] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0082] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0083] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0084] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0085] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art, or all or part of the technical solution. The computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0086] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A double-sided film laminating control method for a micro connector, applied to a double-sided film laminating device, characterized in that: The double-sided film laminating equipment comprises a film laminating station for placing the component to be glued and a heating glue laminating mechanism located directly in front of each glue-laminating surface of the component to be glued. The double-sided film laminating control method comprises the following steps: Obtaining glue position data of the component to be glued on the glue sticking station, and according to the glue position data, using a one-out and two-winding method to peel off the glue of the glue component and then synchronously transmit it to the front of the glue sticking surface of the component to be glued in the glue sticking station, and obtaining a detection control instruction; According to the detection control instruction, the correction data between the heating glue-applying mechanism and the glue component and / or the component to be glued are collected to obtain the correction control instruction; According to the deviation correction control instruction and the deviation correction data, the heating glue-applying mechanism and / or the glue element are subjected to glue adjustment and deviation correction processing to obtain the deviation-corrected glue-applying control instruction; According to the gluing control instruction, the heating gluing mechanism in front of the corresponding gluing surface is controlled to stick the glue of the glue component on the gluing surface of the component to be glued by heating and pressurizing, so as to complete the double-sided gluing of the component to be glued.

2. The double-sided film lamination control method of a micro connector according to claim 1, characterized in that: The one-out-two-winding method includes: unwinding detection control, unwinding tension control and synchronous winding control; The unwinding detection control is used to detect whether the unwinding of the adhesive element is continuous and whether the adhesive element is being transported; The unwinding tension control is used to control the conveyed rubber element to always be in a tensioned state; The synchronous winding control is used to use a buffer induction element to control another winding module to run synchronously with the first winding module based on a winding module, so as to achieve synchronous winding of the two winding modules; the winding module is used to wind up the isolation paper after the adhesive element is peeled off.

3. The double-sided film lamination control method of a micro-connector according to claim 2, characterized in that: The winding directions of the two winding modules are opposite.

4. The double-sided film lamination control method of a micro connector according to claim 1, characterized in that: If the heating glue sticking mechanism is installed on the glue sticking structure, the heating glue sticking mechanism and / or the glue element are adjusted and rectified according to the rectification control instruction and the rectification data, including: If the deflection correction data is deflection correction data between the adhesive component and the adhesive component to be adhesively bonded, the adhesive component is adjusted and deflected according to the deflection correction control instruction and the deflection correction data through the one-out and two-winding method; If the correction data is correction data between the heating glue sticking mechanism and the glue element, the glue sticking structure is controlled to move according to the correction data according to the correction control instruction, so as to adjust the glue and correct the deviation of the heating glue sticking mechanism; If the correction data is the correction data between the heated gluing mechanism and the glue element and the element to be glued, according to the correction control instruction and the correction data, the glue element is firstly adjusted and corrected by the one-out and two-winding method, and then the movement of the gluing structure is controlled to achieve the glue adjustment and correction of the heated gluing mechanism.

5. The double-sided film lamination control method of a micro-connector according to claim 1, characterized in that: The parameters of the heating and pressurizing method include a time of 0.1 s, a heating temperature of 85° C. to 95° C., and a pressure of 80N to 90N.

6. The double-sided film lamination control method for a micro-connector according to any one of claims 1 to 5, characterized in that: Controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface according to the glue sticking control instruction to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing includes: controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface by cam driving according to the glue sticking control instruction to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing.

7. The double-sided film lamination control method of a micro-connector according to any one of claims 1 to 5, characterized in that: Controlling the heating glue sticking mechanism in front of the corresponding glue sticking surface according to the glue sticking control instruction to stick the glue of the glue element on the glue sticking surface of the component to be glued by heating and pressurizing includes: controlling the two heating glue sticking mechanisms in front of the corresponding glue sticking surface according to the glue sticking control instruction to stick the glue of the glue element on the two glue sticking surfaces of the component to be glued by heating and pressurizing to form a clamping type or a top pressing type, so as to complete the double-sided gluing of the component to be glued.

8. The double-sided film lamination control method of a micro-connector according to claim 7, characterized in that: If the two heating gluing mechanisms in front of the corresponding gluing surfaces are controlled according to the gluing control instructions to form a clamping type to stick the glue of the glue element to the two gluing surfaces of the component to be glued by heating and pressurizing, the double-sided film control method also includes: limiting the moving position of the heating gluing mechanism by a limiting element.

9. The double-sided film lamination control method for a micro-connector according to any one of claims 1 to 5, characterized in that: Also includes: Collect glue correction data after double-sided glueing of the component to be glued to obtain overall control instructions; According to the overall control instruction, the double-sided film laminating device is controlled to move according to the glue laminating correction data to adjust the relative position between the double-sided film laminating device and the component to be glued.

10. A control device, characterized in that: including a processor and a memory; The memory is used to store program codes and transmit the program codes to the processor; The processor is used to execute the double-sided film lamination control method of a micro-connector as described in any one of claims 1 to 9 according to the instructions in the program code.

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