Micro-vibration measurement system and data processing method for spacecraft

The modularly designed on-orbit micro-vibration measurement system for spacecraft solves the problem of high-precision measurement of micro-vibrations under high-resolution imaging of large spacecraft, and realizes synchronous measurement of acceleration and angular displacement, thereby improving the accuracy and precision of the data.

CN119555317BActive Publication Date: 2026-02-03BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
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Patent Information

Application Number
CN202411714157.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2026-02-03
Estimated Expiration
2044-11-27

AI Technical Summary

Technical Problem

Existing technologies are insufficient to meet the high-precision measurement requirements of micro-vibrations under the high-resolution imaging needs of large spacecraft, especially the synchronous measurement of on-orbit acceleration and angular displacement. Furthermore, the data volume is large and the reliability requirements are high. Existing systems cannot meet the requirements of high resolution and high synchronization.

Method used

The on-orbit measurement system for spacecraft micro-vibration, which adopts a modular design, includes an acceleration sensing module, a signal conditioning module, a rotation measurement module, and a control and storage module. The modular design allows for flexible arrangement of the load positions, and interference isolation is set between the modules to improve data accuracy and measurement precision.

Benefits of technology

It enables high-precision measurement of micro-vibrations of spacecraft, improves data accuracy and measurement precision, and meets the requirements of high-resolution imaging of large spacecraft.

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Abstract

The embodiment of the specification provides a micro-vibration on-orbit measurement system and a data processing method of a spacecraft, wherein the system comprises: an acceleration sensing module, which is used for acquiring an acceleration signal and determining acceleration information based on the acceleration signal; a signal conditioning module, which is used for powering the acceleration sensing module, acquiring acceleration information and temperature information of the acceleration sensing module, and conditioning the acceleration information and the temperature information; a rotation measurement module, which is used for acquiring an angular vibration signal and determining angular vibration information based on the angular vibration signal; and a control storage module, which is used for communicating with a spacecraft platform, controlling the acceleration sensing module, the signal conditioning module and the rotation measurement module, receiving and storing data of the acceleration sensing module, the signal conditioning module and the rotation measurement module. Since a modular design is adopted, the load position can be arranged flexibly, and interference isolation is arranged between the modules, so that the accuracy and the measurement precision of the data are improved.
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Description

TECHNICAL FIELD

[0001] Embodiments of the present specification relate to the technical field of aerospace, and particularly relate to a micro-vibration on-orbit measurement system of a spacecraft. BACKGROUND

[0002] The micro-vibration generated by active components such as momentum wheels for adjusting the attitude of the spacecraft, refrigerators for maintaining the performance of the camera, and the like on the spacecraft when working is transmitted to the camera through the structure, which can cause imaging blur. With the improvement of the performance of the spacecraft, the observation resolution is greatly improved, and the control level of the micro-vibration is improved, and the micro-vibration effect has become a technical bottleneck. In order to test the influence of the micro-vibration on the imaging quality on orbit and correct the imaging through the micro-vibration measurement data, it is necessary to arrange measurement points on the key parts of the micro-vibration transmission path of the spacecraft to measure the micro-vibration response. The micro-vibration response is characterized by physical quantities such as micro-acceleration and micro-rotation of the imaging link. In order to realize effective acquisition of the micro-vibration response on the high-resolution spacecraft, it is necessary to develop a high-resolution micro-vibration on-orbit measurement system and adapt to the application requirements of the spacecraft.

[0003] The prior art is aimed at the on-orbit micro-vibration measurement requirements of conventional satellites, and the imaging resolution of large spacecraft is higher, the distribution distance of the measurement points is farther, the reliability requirement is higher, and the data volume is larger. Not only is it necessary to measure the on-orbit acceleration, but also it is necessary to synchronously measure the on-orbit angular displacement with high precision. The requirements for the background noise, resolution, and synchronicity of the micro-vibration measurement system are higher. Therefore, a better scheme is urgently needed. SUMMARY

[0004] Therefore, the embodiments of the present specification provide a micro-vibration on-orbit measurement system of a spacecraft. One or more embodiments of the present specification also relate to a micro-vibration on-orbit measurement data processing method, a micro-vibration on-orbit measurement data processing device, a computing device, a computer-readable storage medium, and a computer program to solve the technical defects in the prior art.

[0005] According to a first aspect of the embodiments of the present specification, a micro-vibration on-orbit measurement system of a spacecraft is provided, comprising:

[0006] An acceleration sensing module is configured to acquire an acceleration signal and determine acceleration information based on the acceleration signal;

[0007] A signal conditioning module is configured to power the acceleration sensing module, acquire acceleration information and temperature information of the acceleration sensing module, and condition the acceleration information and the temperature information;

[0008] A rotation measurement module is configured to acquire an angular vibration signal and angular vibration information;

[0009] The control storage module is configured to communicate with the spacecraft platform, control the signal conditioning module and the rotation measurement module, receive data of the signal conditioning module and the rotation measurement module, and store the data.

[0010] In a possible implementation, the acceleration sensing module includes an acceleration sensor and a temperature sensor.

[0011] In a possible implementation, the signal conditioning module includes a power supply unit, a control unit and an acquisition unit.

[0012] The power supply unit is configured to supply power to the control unit and the acquisition unit, and to the acceleration sensing module.

[0013] The control unit is configured to receive a synchronization signal of the control storage module, and control the acquisition unit to acquire data based on the synchronization signal.

[0014] The acquisition unit is configured to receive acceleration information and temperature information of the acceleration sensing module, and condition the acceleration information and the temperature information.

[0015] In a possible implementation, the rotation measurement module includes a power conversion unit, a main control unit and a sensor servo unit.

[0016] The sensor unit is configured to convert a primary power supply into a secondary power supply, and supply power to the main control unit and the sensor servo unit based on the secondary power supply.

[0017] The main control unit is configured to receive a synchronization signal of the control storage module, and acquire data according to the synchronization signal.

[0018] The sensor servo unit is configured to perform closed-loop control on a feedback loop of the sensor probe.

[0019] In a possible implementation, the control storage module includes a power supply and distribution unit and a data processing unit.

[0020] The power supply and distribution unit is configured to process and convert a primary power supply into a secondary power supply, and supply power to the data processing unit based on the secondary power supply.

[0021] The data processing unit is configured to receive a control signal of the spacecraft platform, maintain a control state, acquire data and send the data.

[0022] In a possible implementation, the data processing unit includes an FPGA, a storage circuit, an AD acquisition circuit and a 1553B bus communication circuit.

[0023] The FPGA receives the control signal of the spacecraft platform through the 1553B bus communication circuit; the control signal includes a data instruction signal and a time code signal.

[0024] The FPGA acquires data of the signal conditioning module and the rotation measurement module through the AD acquisition circuit to perform internal telemetry.

[0025] The FPGA stores the data of the signal conditioning module and the rotation measurement module into the storage circuit, and performs data reading based on a data instruction signal.

[0026] According to a second aspect of the embodiments of the present specification, a micro-vibration on-orbit measurement data processing method is provided, applied to a micro-vibration on-orbit measurement system of a spacecraft as described above, comprising:

[0027] The data acquisition mode and the downlink section are set, the initial data is determined by controlling the storage module to perform data acquisition and downlink based on the on-orbit instruction and the data storage section, and the initial data is sent to a ground data processing end;

[0028] The ground data processing end performs downlink data numbering based on the initial data, and stores the downlink data into a corresponding working condition folder to obtain preprocessed data.

[0029] The ground data processing end performs data decoding, data conversion to physical quantity, data coordinate direction conversion, and data temperature correction based on the preprocessed data to obtain target data.

[0030] According to a third aspect of the embodiments of the present specification, a micro-vibration on-orbit measurement data processing device is provided, comprising:

[0031] The data acquisition module is configured to set a series of on-orbit instructions and data routes, determine initial data by controlling the storage module to perform data acquisition and downlink based on the on-orbit instructions and the data routes, and send the initial data to a ground data processing end.

[0032] The data arrangement module is configured to perform downlink data numbering by the ground data processing end based on the initial data, and store the downlink data into a corresponding working condition folder to obtain preprocessed data.

[0033] The data processing module is configured to perform data decoding, data conversion to physical quantity, data direction conversion, and data temperature correction by the ground data processing end based on the preprocessed data to obtain target data.

[0034] According to a fourth aspect of the embodiments of the present specification, a computing device is provided, comprising:

[0035] a memory and a processor;

[0036] The memory is configured to store computer executable instructions, and the processor is configured to execute the computer executable instructions, and the computer executable instructions, when executed by the processor, implement the steps of the above-mentioned micro-vibration on-orbit measurement data processing method.

[0037] According to a fifth aspect of the embodiments of the present specification, a computer readable storage medium is provided, which stores computer executable instructions, and the instructions, when executed by a processor, implement the steps of the micro-vibration on-orbit measurement data processing method.

[0038] According to a sixth aspect of the embodiments of the present specification, a computer program is provided, which, when executed in a computer, causes the computer to perform the steps of the micro-vibration on-orbit measurement data processing method.

[0039] The embodiments of the present specification provide a micro-vibration on-orbit measurement system and data processing method of a spacecraft, wherein the system comprises: an acceleration sensing module, configured to obtain an acceleration signal and determine acceleration information based on the acceleration signal; a signal conditioning module, configured to power the acceleration sensing module, obtain acceleration information and temperature information of the acceleration sensing module, and condition the acceleration information and the temperature information; a rotation measurement module, configured to obtain an angular vibration signal and determine angular vibration information based on the angular vibration signal; and a control storage module, configured to communicate with a spacecraft platform, control the acceleration sensing module, the signal conditioning module and the rotation measurement module, receive and store data of the acceleration sensing module, the signal conditioning module and the rotation measurement module. Due to the modular design, the load position can be flexibly arranged, and interference isolation is provided between the modules, thereby improving the accuracy of the data and the measurement precision. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is an architecture schematic diagram of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0041] Figure 2 is a connection schematic diagram of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0042] Figure 3 is a first schematic diagram of a signal conditioning module of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0043] Figure 4 is a second schematic diagram of a signal conditioning module of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0044] Figure 5 is a third schematic diagram of a signal conditioning module of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0045] Figure 6 is a schematic diagram of an acceleration sensing module of a micro-vibration on-orbit measurement system of a spacecraft provided by an embodiment of the present specification;

[0046] Figure 7 is a control storage module schematic diagram of a micro-vibration on-orbit measurement system of a spacecraft provided by one embodiment of the present specification;

[0047] Figure 8 is a working mode schematic diagram of a micro-vibration on-orbit measurement system of a spacecraft provided by one embodiment of the present specification;

[0048] Figure 9 is a flow chart of a micro-vibration on-orbit measurement data processing method provided by one embodiment of the present specification;

[0049] Figure 10 is a structural schematic diagram of a micro-vibration on-orbit measurement data processing device provided by one embodiment of the present specification;

[0050] Figure 11 is a structural block diagram of a computing device provided by one embodiment of the present specification. DETAILED DESCRIPTION

[0051] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present specification. However, the present specification can be practiced without the specific details, other than in the examples, set forth in this description. Those skilled in the art, in light of the description, can implement the present specification without limiting to the specific details disclosed in this description.

[0052] The terminology used in one or more embodiments of the present specification is for the purpose of describing particular embodiments only and is not intended to be limiting of one or more embodiments of the present specification. As used in one or more embodiments of the present specification and the accompanying claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in one or more embodiments of the present specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0053] It will be understood that, although the terms first, second, etc. can be used herein to describe various information, these terms are not intended to denote a temporal or chronological order. Rather, these terms are used solely to distinguish one from another only. For example, without departing from the scope of one or more embodiments of the present specification, first can be termed second, and similarly, second can be termed first. Depending on the context, the word "if' as used herein can be interpreted to mean "when" or "in response to determining" or "in response to a determination".

[0054] This specification provides an on-orbit measurement system for micro-vibrations in spacecraft. One or more embodiments of this specification also relate to a method for processing on-orbit micro-vibration measurement data, a device for processing on-orbit micro-vibration measurement data, a computing device, a computer-readable storage medium, and a computer program, which will be described in detail in the following embodiments.

[0055] See Figure 1 , Figure 1 A schematic diagram of the architecture of an on-orbit microvibration measurement system for a spacecraft, according to one embodiment of this specification, is shown.

[0056] The system includes: an acceleration sensing module for acquiring acceleration signals and determining acceleration information based on these signals; a signal conditioning module for powering the acceleration sensing module, acquiring and conditioning the acceleration and temperature information from the acceleration sensing module; a rotation measurement module for acquiring angular vibration signals and determining angular vibration information based on these signals; and a control and storage module for communicating with the spacecraft platform, controlling the acceleration sensing module, signal conditioning module, and rotation measurement module, and receiving and storing data from these modules.

[0057] For details, see Figure 2 , Figure 2 The diagram shows the connection of the system, which may include an acceleration sensing module 1, a signal conditioning module 2, a control and storage module 3, a rotation measurement module 4, a spacecraft platform 5, and a large camera 6.

[0058] In practical applications, 16 accelerometer modules are installed along different vibration transmission paths on a large spacecraft and directly connected to nearby signal conditioning modules. One signal conditioning module can connect to four accelerometer modules. The analog signals output from the accelerometer modules to the signal conditioning module are locally conditioned, and then the signal conditioning module transmits the conditioned digital signals to the control and storage module for storage. Simultaneously, the control and storage module supplies power to two rotation measurement modules, whose analog signals are locally conditioned and directly transmitted to the control, communication, and storage module.

[0059] It should be noted that, in order to meet the requirements of high-precision micro-vibration acquisition, this embodiment uses a high-resolution accelerometer to form an accelerometer sensing module and a high-resolution spatial four-frequency laser gyroscope as the angular vibration sensor of the rotation measurement module.

[0060] In one possible implementation, the acceleration sensing module includes an acceleration sensor and a temperature sensor.

[0061] In practical applications, the accelerometer module consists of a mounting base, three high-resolution accelerometers, electrical connectors for the three accelerometers, one temperature measurement connector, and four temperature sensors. The accelerometers are designed to float at the mounting location, with the signal ground and housing ground shorted at the signal conditioning module. The structure of the mounting base is determined based on the selected accelerometer; the envelope dimensions, total weight, natural frequency, electrical connectors, and on-board mounting method of the mounting base and accelerometer assembly must meet the requirements.

[0062] Because the on-orbit temperature varies considerably, the impact of temperature changes on measurement accuracy must be considered. The effect of temperature changes on the sensor manifests as a deviation in measurement sensitivity. This invention employs a synchronous temperature measurement and recompensation method to ensure testing accuracy. Synchronous temperature measurement refers to measuring the sensor temperature simultaneously with the micro-vibration response. Recompensation involves transmitting the temperature data and micro-vibration data back to Earth, and then performing data compensation and correction on the ground based on the correlation between temperature and sensitivity. This process constitutes the determination of acceleration information.

[0063] In one possible implementation, the signal conditioning module includes a power supply unit, a control unit, and a data acquisition unit; the power supply unit supplies power to the control unit, the data acquisition unit, and the acceleration sensing module; the control unit receives the synchronization signal from the control storage module and controls the data acquisition unit to acquire data based on the synchronization signal; the data acquisition unit receives acceleration and temperature information from the acceleration sensing module and conditions the acceleration and temperature information.

[0064] In practical applications, see Figure 3 The signal conditioning module is a standalone design, mainly composed of three modules: a power supply module, a control module, and a data acquisition module, namely the power supply unit, control unit, and data acquisition unit mentioned above. The data acquisition module primarily provides a constant current source to the sensor and conditions (amplifies and filters) and performs analog-to-digital conversion on the sensor's output signal. Specifically, SDI is the input interface, SDO is the output interface, SCK is the clock interface, and CNV is the conversion interface. The control module receives the sampling clock synchronization signal from the control communication and storage module and sends it to the data acquisition module. It also receives the sampled data processed by the AD chip (within the data acquisition module). The sampled data is ultimately sent to the micro-vibration measurement signal control communication and storage module via the LVDS interface (control module). The power supply and control modules each consist of one circuit board, and the data acquisition module consists of two circuit boards, for a total of four circuit boards.

[0065] Furthermore, to maintain acquisition accuracy and resolution, the circuit employs multi-stage transformation. A fuse protection circuit is installed at the power input, using fuses connected in parallel to prevent permanent short circuits to the platform power bus. The surge suppression circuit adopts a soft-start design, consisting of a PMOS transistor, resistors, and capacitors, offering advantages such as high reliability, low static power consumption, and simple implementation. To improve the reliability of the surge suppression circuit and prevent the loss of backup due to open-circuit failure in the soft-start circuit, a parallel design is used.

[0066] See Figure 4 The accelerometer's power supply interface is an IEPE interface, so a constant current source circuit was designed. The +28V power supply is converted to +24V output using LDCD / (20-50)-12-15F / D1 to provide 3~5mA constant current source excitation to the sensor. The voltage signal output by the sensor is a dynamic signal superimposed on the 8~12V DC component.

[0067] See Figure 5 Power supply noise significantly affects the accuracy of analog-to-digital conversion (ADC) acquisition. To reduce the impact of DC-DC output ripple on the acquisition circuit, LM117 / LM137 is used to convert the ±12V output of the DC-DC converter to ±6V for the acquisition circuit. Similarly, a separate LDO is used for the AD converter to convert +12V to +5V and +2.5V. 0.01uF, 0.1uF, and 2.2uF capacitors to ground are used at the chip power supply terminals to filter noise at different frequencies. A 100uF capacitor to ground is added at the power supply terminal of the acquisition board to filter out low-frequency noise.

[0068] Furthermore, during the process from sensor signal generation to data acquisition by the acquisition module, high-frequency interference signals inevitably aliased into the useful signal. When the frequency of these signals exceeds the range specified by the sampling theorem, some uncertain signals will be acquired, interfering with the useful signal; this is known as frequency aliasing. To suppress or eliminate the impact of aliasing on the dynamic signal acquisition of the acquisition and storage module to the greatest extent possible, anti-aliasing filtering needs to be applied to the electrical signal output by the sensor to attenuate and filter out useless or interfering signals.

[0069] Furthermore, a Butterworth low-pass filter is selected for the filtering circuit. This filter has a maximally flat frequency response curve with minimal fluctuations in its passband, while gradually decreasing to zero in the stopband. Specifically, a 5th-order Butterworth low-pass filter is used, which has a fast stopband attenuation rate and excellent anti-aliasing effect.

[0070] Furthermore, the analog input of the AD converter is in differential form, which conditions the input signal, transforming the single-ended waveform signal into a suitable differential signal.

[0071] In one possible implementation, the rotation measurement module includes a power conversion unit, a main control unit, and a sensor servo unit; the sensor unit is used to convert the primary power supply to obtain a secondary power supply, and to power the main control unit and the sensor servo unit based on the secondary power supply; the main control unit is used to receive the synchronization signal from the control storage module and to acquire data according to the synchronization signal; the sensor servo unit is used to perform closed-loop control of the feedback loop of the sensor probe.

[0072] In practical applications, see Figure 6 The system consists of one main control board, which is the aforementioned main control unit. Its functions include task scheduling and management, coordinating the normal operation of various modules, acquiring and processing angular displacement signals based on the synchronization clock signal, and transmitting data through the LVDS interface. The FPGA's main functions are to receive commands and clock synchronization signals through the LVDS interface, calculate the TTL pulses output by the sensor servo board (calculation frequency: 100MHz), determine sensor health signals, package measurement data, and transmit measurement and telemetry data through the LVDS interface. The sensor servo board is the sensor servo unit. A single power supply and distribution board is also included, serving as the aforementioned power conversion unit. Its main function is to convert 28V power to secondary power for the equipment. The main control board requires +5V (3W), while the sensor servo board, high-voltage board, and preamplifier board require ±5V and +15V power respectively. Due to size and power consumption considerations, the servo control of the three sensor probes uses a single servo control circuit. The main function of the sensor servo board is to perform closed-loop control of the feedback loops of the three sensor probes, provide a stable frequency drive signal to keep the cavity length of the sensor probe's resonant cavity stable, and convert the analog signal output by the sensor probe into a frequency-modulated square wave output. The above process is what determines the angular vibration information.

[0073] Furthermore, there is one high-voltage board, a single-unit design. Its function is to provide high-voltage power to the three sensor probes and provide gain for the laser through a high-voltage current-stabilizing circuit. This part of the circuit uses a single-ended flyback DC / DC converter based on a current feedback PWM controller to achieve high-voltage output. There are three preamplifier boards, each corresponding to one sensor probe, all of which are single-unit designs. The main function of the preamplifier board is to amplify and condition the current signal output from the photoelectric converter into a suitable voltage signal for subsequent processing. One part of the signal is used for frequency stabilization control and power monitoring, while another part of the signal is the analog signal output from the gyroscope, which is then converted into a frequency-modulated wave signal output by the sensor servo board.

[0074] In one possible implementation, the control storage module includes a power supply and distribution unit and a data processing unit; the power supply and distribution unit is used to process and convert the primary power supply to obtain the secondary power supply, and to supply power to the data processing unit based on the secondary power supply; the data processing unit is used to receive control signals from the spacecraft platform, maintain the control status, collect data, and transmit data.

[0075] In practical applications, see Figure 7 The control and storage module consists of two types of sub-modules: a control sub-module and a power supply and distribution module. The control sub-module is the data processing unit, and the power supply and distribution module is the power supply and distribution unit. To improve reliability, a primary backup design is used by default, and the primary backup functions of each module are completely identical.

[0076] The control storage module consists of an FPGA, CPU, EEPROM, AD acquisition, LVDS circuit, Ethernet interface circuit, 1553B interface circuit, relay instruction drive circuit, reset circuit, clock circuit, power conversion circuit, etc.

[0077] A fuse protection circuit is installed at the bus inlet. Magnetic latching relays are used for bus control. The main and backup power supply boards each have one filter and one power module, converting the primary 100V voltage to +5V and ±12V for use by the control and storage modules. The filters have built-in surge suppression circuits, eliminating the need for a separate surge suppression circuit in the main circuit. Furthermore, the control and storage module's DC / DC circuit converts the bus 100V to 28V for powering downstream loads.

[0078] In the specific implementation, the main / backup power supply unit board of the control storage module receives a primary power supply of +100V. The primary power supply of +100V is controlled by input programmable commands. After the primary power supply is turned on, it passes through a fuse, surge suppression circuit, and EMI filter, and then is converted by DC / DC to obtain a secondary power supply of +5V and ±12V, which is used by the control communication and storage module motherboard.

[0079] Furthermore, to address the single-event upset (SET) problem in SRAM-based FPGAs, a dynamic refresh strategy for the FPGA configuration area is adopted. An antifuse FPGA is added between the main FPGA and the configuration data storage PROM device. This antifuse FPGA acts as the configuration controller for the main FPGA, responsible for global configuration or dynamic refresh of the main FPGA.

[0080] To improve reliability, the storage array management supports the removal of damaged chips. When any one or more chips in the storage array are damaged (or have too many bad blocks, etc.), they can be removed from the storage array and no longer used.

[0081] The control storage module needs to acquire telemetry analog signals for itself and its downstream loads; therefore, an analog switch and AD converter are designed to achieve this. The analog signal conditioning circuit uses an operational amplifier to implement an emitter follower circuit, conditioning the analog output impedance to a low impedance state. At the same time, the high input impedance of the operational amplifier ensures a high common-mode rejection ratio for the acquisition circuit, suppressing interference from other signals besides the measured parameters.

[0082] In one possible implementation, the data processing unit includes an FPGA, a storage circuit, an AD acquisition circuit, and a 1553B bus communication circuit. The FPGA receives control signals from the spacecraft platform via the 1553B bus communication circuit. The control signals include data command signals and time code signals. The FPGA acquires data from the signal conditioning module and the rotation measurement module via the AD acquisition circuit for internal telemetry. The FPGA stores the data from the signal conditioning module and the rotation measurement module in the storage circuit and reads the data based on the data command signals.

[0083] In practical applications, the FPGA, storage circuit, AD acquisition circuit, 1553B bus communication circuit, and other circuits include the following specific functions.

[0084] 1) FPGA

[0085] The data commands and time codes are injected by the 1553B receiving platform.

[0086] Telemetry data is sent via the 1553B interface protocol;

[0087] Generate relay drive command signals based on the injected instructions;

[0088] Send a synchronous sampling signal;

[0089] Control the multi-channel analog switch and AD acquisition device to complete the AD acquisition function (internal telemetry);

[0090] Receive detection data from each payload unit via the LVDS interface;

[0091] The FPGA performs the functions of combining and storing data from signal conditioning modules 1, 2, 3, and 4, and rotation measurement modules 1 and 2; replaying and reading data from the FLASH memory according to the above data instructions; managing bad blocks in the large-capacity FLASH memory; and reading and writing EEPROM.

[0092] 2) Large capacity storage

[0093] Large-capacity storage uses FLASH. The main function of EEPROM is to store the "read" and "write" addresses of FLASH cells. It can be automatically loaded after each power-on, improving processing speed and reliability.

[0094] 3) Acquisition Circuit

[0095] Under the control of the FPGA, the multi-channel analog signals are acquired by an analog-to-digital converter (ADC) to process general voltage / temperature telemetry signals.

[0096] 4) LVDS circuit

[0097] Its main function is to convert the CMOS signal output by the FPGA into a differential signal at LVDS level.

[0098] 5) Relay command drive circuit

[0099] Used to convert the CMOS signal output from the FPGA into an OC signal output.

[0100] 6) Power conversion circuit

[0101] The power conversion circuit is used to convert +5V voltage to +3.3V and +1.5V. The +3.3V is used for logic interface circuits (including FPGA I / O ports), and the +1.5V is the FPGA core voltage.

[0102] 7) 1553B interface

[0103] 1553B protocol communication.

[0104] 8) Timed refresh

[0105] The control storage module adopts a partial reconfiguration (refresh) method to enhance single-event reliability. The target FPGA to be fault-tolerant adopts a triple-modal redundancy design to mitigate SEU and implements periodic refresh operation to prevent SEU accumulation.

[0106] It should be noted that, see Figure 8 In this embodiment, the control storage module has four working modes: self-test mode, standby mode, measurement mode, and download mode. The control communication and storage module enters self-test mode by default when powered on, and enters standby mode after the self-test is completed.

[0107] In self-test mode, only the control communication and storage modules are powered on; the other load units are not powered on. The control communication and storage modules default to self-test mode upon power-up. In self-test mode, the status of each module in the host computer is checked, and after the self-test is completed, the system enters standby mode.

[0108] In standby mode, the tasks performed by the control communication and storage module include: (1) receiving time codes and injected data sent by the platform via 1553B; (2) maintaining the status of the control communication and storage module itself, including large-capacity storage units, AD acquisition units, time code synchronization, etc.; (3) collecting engineering parameters and analog data, and periodically sending the current telemetry status of the control communication and storage module.

[0109] The measurement mode is to power on and measure and store data according to the instructions. The tasks completed include: (1) receiving the time code and injected data sent by the platform through 1553B; (2) maintaining the status of the control communication and storage module itself, including the large capacity storage unit, AD acquisition unit, time code calibration, etc.; (3) collecting engineering parameters and analog data, and sending the current telemetry status at regular intervals; (4) sending synchronous acquisition control to the lower-level load; (5) receiving the micro-vibration measurement data of the lower-level load, and storing it in a package.

[0110] In the downlink mode, after receiving a command to allow downlink, the FPGA is controlled to read the measurement data from the specified address in the FLASH memory and send the measurement data to the platform via Ethernet.

[0111] This specification provides an on-orbit micro-vibration measurement system and data processing method for spacecraft. The system includes: an acceleration sensing module for acquiring acceleration signals and determining acceleration information based on the acceleration signals; a signal conditioning module for powering the acceleration sensing module, acquiring acceleration and temperature information from the acceleration sensing module, and conditioning the acceleration and temperature information; a rotation measurement module for acquiring angular vibration signals and determining angular vibration information based on the angular vibration signals; and a control and storage module for communicating with the spacecraft platform, controlling the signal conditioning module and the rotation measurement module, and receiving and storing data from the signal conditioning module and the rotation measurement module. Due to the modular design, the load positions can be flexibly arranged, and interference isolation can be set between modules, thereby improving the accuracy of the data and the measurement precision.

[0112] See Figure 9 , Figure 9 A flowchart of a micro-vibration on-orbit measurement data processing method according to an embodiment of this specification is shown, which is applied to the micro-vibration on-orbit measurement system of a spacecraft as described above, and specifically includes the following steps.

[0113] Step 901: Set the data acquisition interval, and based on the data acquisition interval, control the storage module to acquire data, determine the initial data, and send the initial data to the ground data processing terminal;

[0114] Step 902: The ground data processing terminal assigns data numbers based on the initial data and stores them in the corresponding working condition folder to obtain preprocessed data;

[0115] Step 903: The ground data processing terminal performs data decoding, data conversion to physical quantities, data direction conversion, and data temperature correction based on the preprocessed data to obtain the target data.

[0116] In practical applications, considering the need to complete thousands of micro-vibration tests and data downlink under various operating conditions during spacecraft ground testing, an automatic data acquisition and downlink function is designed on the ground software side. The application method is as follows:

[0117] 1) Using the 1553B command of the load, set the automatic completion interval according to the test conditions, and automatically send commands such as acquisition preparation, acquisition start, acquisition end, and data download according to the set interval.

[0118] 2) Regarding ground data reception, the software functions can automatically create working condition folders, automatically number the transmitted data, and automatically record data acquisition logs.

[0119] 3) In terms of ground data analysis, based on the coordinates of the measurement points and the measured temperature, the system automatically completes the decoding of measurement data, conversion of data into physical quantities, conversion of data coordinate direction, and correction of data temperature.

[0120] The embodiments in this specification utilize the design of ground control software to achieve automatic data acquisition and downlink during spacecraft testing, thereby improving development efficiency.

[0121] Corresponding to the above method embodiments, this specification also provides embodiments of a micro-vibration on-orbit measurement data processing device. Figure 9 A schematic diagram of a micro-vibration on-orbit measurement data processing device according to one embodiment of this specification is shown. Figure 9 As shown, the device includes:

[0122] The data acquisition module 1001 is configured to set a data acquisition interval, and based on the data acquisition interval, to acquire data by controlling the storage module, determine the initial data, and send the initial data to the ground data processing terminal.

[0123] The data processing module 1002 is configured to send down data numbers based on the initial data and store them in the corresponding working condition folder to obtain preprocessed data.

[0124] The data processing module 1003 is configured to perform data decoding, data conversion to physical quantities, data direction conversion, and data temperature correction based on preprocessed data to obtain target data at the ground data processing end.

[0125] The above is a schematic scheme of a micro-vibration on-orbit measurement data processing device according to this embodiment. It should be noted that the technical solution of this micro-vibration on-orbit measurement data processing device and the technical solution of the micro-vibration on-orbit measurement data processing method described above belong to the same concept. For details not described in detail in the technical solution of the micro-vibration on-orbit measurement data processing device, please refer to the description of the technical solution of the micro-vibration on-orbit measurement data processing method described above.

[0126] Figure 11 A structural block diagram of a computing device 1100 according to one embodiment of this specification is shown. The components of the computing device 1100 include, but are not limited to, a memory 1110 and a processor 1120. The processor 1120 is connected to the memory 1110 via a bus 1130, and a database 1150 is used to store data.

[0127] The computing device 1100 also includes an access device 1140, which enables the computing device 1100 to communicate via one or more networks 1160. Examples of these networks include Public Switched Telephone Network (PSTN), Local Area Network (LAN), Wide Area Network (WAN), Personal Area Network (PAN), or combinations of communication networks such as the Internet. The access device 1140 may include one or more of any type of wired or wireless network interface (e.g., a network interface card (NIC)), such as an IEEE 802.11 Wireless Local Area Network (WLAN) wireless interface, a Wi-MAX (Worldwide Interoperability for Microwave Access) interface, an Ethernet interface, a Universal Serial Bus (USB) interface, a cellular network interface, a Bluetooth interface, or a Near Field Communication (NFC) interface.

[0128] In one embodiment of this specification, the aforementioned components of the computing device 1100 and Figure 11 Other components, not shown, can also be connected to each other, for example, via a bus. It should be understood that... Figure 11 The block diagram of the computing device shown is for illustrative purposes only and is not intended to limit the scope of this specification. Those skilled in the art can add or replace other components as needed.

[0129] The computing device 1100 can be any type of stationary or mobile computing device, including mobile computers or mobile computing devices (e.g., tablet computers, personal digital assistants, laptop computers, notebook computers, netbooks, etc.), mobile phones (e.g., smartphones), wearable computing devices (e.g., smartwatches, smart glasses, etc.) or other types of mobile devices, or stationary computing devices such as desktop computers or personal computers (PCs). The computing device 1100 can also be a mobile or stationary server.

[0130] The processor 1120 is configured to execute the following computer-executable instructions, which, when executed by the processor, implement the steps of the above-described micro-vibration on-orbit measurement data processing method. The above is a schematic representation of a computing device according to this embodiment. It should be noted that the technical solution of this computing device and the technical solution of the above-described micro-vibration on-orbit measurement data processing method belong to the same concept. Details not described in detail in the technical solution of the computing device can be found in the description of the technical solution of the above-described micro-vibration on-orbit measurement data processing method.

[0131] An embodiment of this specification also provides a computer-readable storage medium storing computer-executable instructions that, when executed by a processor, implement the steps of the above-described micro-vibration on-orbit measurement data processing method.

[0132] The above is an illustrative scheme of a computer-readable storage medium according to this embodiment. It should be noted that the technical solution of this storage medium belongs to the same concept as the technical solution of the above-described micro-vibration on-orbit measurement data processing method. For details not described in detail in the technical solution of the storage medium, please refer to the description of the technical solution of the above-described micro-vibration on-orbit measurement data processing method.

[0133] An embodiment of this specification also provides a computer program, wherein when the computer program is executed in a computer, it causes the computer to perform the steps of the above-described micro-vibration on-orbit measurement data processing method.

[0134] The above is an illustrative example of a computer program according to this embodiment. It should be noted that the technical solution of this computer program belongs to the same concept as the technical solution of the above-described micro-vibration on-orbit measurement data processing method. Details not described in detail in the computer program's technical solution can be found in the description of the technical solution of the above-described micro-vibration on-orbit measurement data processing method.

[0135] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0136] The computer instructions include computer program code, which may be in the form of source code, object code, executable file, or certain intermediate forms. The computer-readable medium may include any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium may be appropriately added to or subtracted according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media may not include electrical carrier signals and telecommunication signals.

[0137] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments in this specification are not limited to the described order of actions, because according to the embodiments in this specification, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the embodiments in this specification.

[0138] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0139] The preferred embodiments disclosed above are merely illustrative of this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the embodiments described herein. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the embodiments, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. An on-orbit measurement system for micro-vibrations in a spacecraft, characterized in that, include: An acceleration sensing module is used to acquire acceleration signals and determine acceleration information based on the acceleration signals; The signal conditioning module is used to power the acceleration sensing module, acquire acceleration and temperature information from the acceleration sensing module, and condition the acceleration and temperature information. A rotation measurement module is used to acquire angular vibration signals and determine angular vibration information based on the angular vibration signals; The control and storage module is used to communicate with the spacecraft platform and control the signal conditioning module and the rotation measurement module, as well as to receive and store data from the signal conditioning module and the rotation measurement module; The signal conditioning module includes a power supply unit, a control unit, and a data acquisition unit; The power supply unit is used to supply power to the control unit, the acquisition unit, and the acceleration sensing module; The control unit is used to receive the synchronization signal from the control storage module and control the acquisition unit to acquire data based on the synchronization signal; The acquisition unit is used to receive acceleration information and temperature information from the acceleration sensing module, and to process the acceleration information and temperature information. The rotation measurement module includes a power conversion unit, a main control unit, and a sensor servo unit; The power conversion unit is used to convert the primary power supply to obtain the secondary power supply, and to supply power to the main control unit and the sensor servo unit based on the secondary power supply. The main control unit is used to receive the synchronization signal from the control storage module and to collect data according to the synchronization signal; The sensor servo unit is used to perform closed-loop control of the feedback loop of the sensor probe. The rotation measurement module includes an angular vibration sensor, which is a spatial four-frequency laser gyroscope. The acceleration sensing modules are installed on different vibration transmission paths of the spacecraft and connected to the signal conditioning module; the analog signals output by the acceleration sensing modules to the signal conditioning module are locally conditioned, and then the signal conditioning module transmits the conditioned digital signals to the control storage module for storage; one signal conditioning module is connected to four acceleration sensing modules. The acceleration sensing module includes an acceleration sensor and a temperature sensor; The power supply interface of the accelerometer is an IEPE interface, which includes a constant current source circuit. The constant current source circuit converts the +28V power supply to a +24V output for the accelerometer and provides a 3~5mA constant current source excitation to the accelerometer. The acquisition unit amplifies, filters, and performs analog-to-digital conversion on the sensor output signal. The acquisition unit includes: SDI as an input interface, SDO as an output interface, SCK as a clock interface, and CNV as a conversion interface. The control unit receives the sampling clock synchronization signal from the control storage module and sends it to the acquisition unit, while simultaneously receiving the sampled data processed by the AD chip in the acquisition unit.

2. The on-orbit micro-vibration measurement system for spacecraft according to claim 1, characterized in that, The control storage module includes a power supply and distribution unit and a data processing unit; The power supply and distribution unit is used to process and convert the primary power supply to obtain the secondary power supply, and to supply power to the data processing unit based on the secondary power supply. The data processing unit is used to receive control signals from the spacecraft platform, maintain control status, collect data, and transmit data.

3. The on-orbit micro-vibration measurement system for spacecraft according to claim 2, characterized in that, The data processing unit includes an FPGA, a storage circuit, an AD acquisition circuit, and a 1553B bus communication circuit. The FPGA receives control signals from the spacecraft platform through the 1553B bus communication circuit; wherein, the control signals include data command signals and time code signals; The FPGA acquires data from the signal conditioning module and the rotation measurement module through the AD acquisition circuit for internal telemetry. The FPGA stores the data from the signal conditioning module and the rotation measurement module in the storage circuit and reads the data based on the data command signal.

4. A method for processing micro-vibration on-orbit measurement data, applied to the micro-vibration on-orbit measurement system of the spacecraft according to any one of claims 1-3, comprising: Set a data acquisition interval, and based on the data acquisition interval, perform data acquisition through the control storage module to determine initial data, and send the initial data to the ground data processing terminal; The ground data processing terminal assigns a data number based on the initial data and stores it in the corresponding working condition folder to obtain preprocessed data. The ground data processing terminal performs data decoding, data conversion to physical quantities, data coordinate direction transformation, and data temperature correction based on the preprocessed data to obtain the target data.

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