Thermal management method and system

By monitoring the temperature of the thermal load equipment and modules, calculating the temperature difference and adjusting the opening of the control valve, the problem that existing thermal management systems are difficult to quickly adapt to different environments and conditions is solved, and efficient temperature management of thermal load equipment is achieved.

CN119556775AActive Publication Date: 2025-03-04GUANGZHOU ENERGY TECH CO LTD
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Patent Information

Application Number
CN202411606837.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-12
Publication Date
2025-03-04
Estimated Expiration
2044-11-12

AI Technical Summary

Technical Problem

The existing thermal management system is difficult to quickly adapt to different working environments and thermal load conditions, and it is impossible to adjust the heat dissipation strategy in time to maintain good equipment performance.

Method used

By monitoring the temperature of the entire thermal load device and the module, the first and second temperature differences are calculated, and the opening of the control valve needs to be adjusted according to the preset values ​​to optimize the thermal management efficiency.

Benefits of technology

The rapid response to thermal load equipment and the optimization of temperature distribution are achieved, reducing the risk of local overheating, extending the service life of the equipment, and improving the thermal management efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a thermal management method and system, and relates to the technical field of thermal management. The method is applied to a thermal management system comprising thermal load equipment, a controller and a control valve. The thermal load equipment comprises a plurality of thermal load modules, and each thermal load module is connected with the control valve; the method comprises: monitoring a first temperature difference and a second temperature difference of a thermal load device based on a controller; the opening degree of the control valve is adjusted based on the temperature of each thermal load module in the T time period; wherein the first temperature difference is the difference value between the highest temperature of the whole thermal load equipment in the T time period and the lowest temperature of the whole thermal load equipment in the T time period, and the second temperature difference is the maximum value in the difference value of the highest temperature of each thermal load module. According to the thermal management method, the temperature of the thermal load module is adjusted by monitoring the thermal monitoring data of the thermal management system and adjusting the opening degree of the control valve, the overheating condition is prevented, the equipment is protected against thermal damage, and the service life of the equipment is prolonged.
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Description

Technical Field

[0001] The present application relates to the field of thermal management technology, and in particular to a thermal management method and system. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated by heat load devices during operation is increasing, which puts higher requirements on thermal management systems. Existing thermal management systems mainly rely on temperature sensors to monitor the temperature of the device and adjust the operating status of the heat dissipation device based on the temperature reading, such as fan speed or coolant flow, to reduce the heat of the heat load device. However, when faced with different working environments and heat load conditions, traditional thermal management systems are difficult to adapt quickly and cannot adjust the heat dissipation strategy in time to maintain good performance of the device. Summary of the invention

[0003] In view of this, an object of an embodiment of the present application is to provide a thermal management method to improve the problem in the prior art that the thermal management system cannot adjust the heat dissipation strategy in time to maintain good performance of the device.

[0004] The method is applied to a thermal management system including a heat load device, a controller and a control valve; the heat load device includes a plurality of heat load modules, each of which is connected to the control valve; the method includes: monitoring the maximum temperature and the minimum temperature of the heat load device as a whole within a T time period, and calculating a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device as a whole within the T time period and the minimum temperature of the heat load device as a whole within the T time period; judging whether the first temperature difference is greater than a first temperature preset value; if it is judged that the first temperature difference is greater than the first temperature preset value, monitoring the maximum temperature of each heat load module, and calculating a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; judging whether the second temperature difference is greater than a second temperature preset value; if it is judged that the second temperature difference is greater than the second temperature preset value, monitoring the temperature of each heat load module within the T time period, and adjusting the opening of the control valve based on the temperature of each heat load module within the T time period.

[0005] In the above implementation process, the maximum temperature and minimum temperature of the heat load device as a whole within the set T time period are first monitored. Based on the monitored maximum temperature and minimum temperature, the first temperature difference is calculated, and the first temperature difference represents the temperature fluctuation range of the entire heat load device within the T time period. The calculated first temperature difference is compared with the first temperature preset value. If the first temperature difference exceeds the first temperature preset value, it means that there is a large temperature difference inside the system. Under different environmental conditions, the heat load device may show different temperature fluctuations; monitoring the first temperature difference helps the system adapt to changes in the external environment. When the first temperature difference exceeds the preset value, the maximum temperature of each heat load module is further monitored, and the second temperature difference is calculated. The second temperature difference is the maximum value of the maximum temperature difference of all heat load modules, which provides information on the temperature difference between the heat load modules. The system compares the second temperature difference with the second temperature preset value. If the second temperature difference also exceeds the second temperature preset value, the system may be at risk of local overheating, and the control valve needs to be adjusted to balance the temperature. Controlling the second temperature difference helps prevent local overheating, thereby extending the service life of the equipment. When the adjustment needs are met (i.e., when the first temperature difference and the second temperature difference both exceed the preset values), the system will adjust the opening of the control valve connected to each heat load module based on the specific temperature of the module within the time period T. Specifically, more cooling will be given to the hotter areas and less cooling to the less hot areas, thereby improving the overall thermal management efficiency of the system.

[0006] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the T time period includes: sorting the temperature of each of the heat load modules and numbering them in sequence; and adjusting the control valve connected to the heat load module with the highest temperature to a first opening value.

[0007] In the above implementation process, the temperature data of all heat load modules in the time period T are collected and sorted from high to low. After sorting, the system assigns a number to each heat load module, and for the module with the highest temperature, the system adjusts the control valve connected to it to the first opening value. This first opening value is a pre-set value, which is intended to provide the heat load module with a better cooling effect than other heat load modules in the system, so as to quickly reduce its temperature. By giving priority to the modules with the highest temperature, the system can respond quickly to possible overheating situations and reduce the risk of equipment performance degradation or damage due to local overheating.

[0008] In one embodiment of the present application, the module with the highest temperature is numbered 0, followed by number 1, and so on, until all heat load modules are numbered. For the module with the highest temperature, numbered 0, the control valve connected to it is adjusted to the maximum opening value to achieve a better cooling effect.

[0009] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules in the time period T further includes: calculating and adjusting the openings of the remaining control valves according to the following calculation rules:

[0010]

[0011] After the adjustment is completed, keep the first time and set the adjustment times plus 1.

[0012] In the above implementation process, using the formula

[0013]

[0014] Taking into account the first temperature difference (temperature fluctuation of the whole equipment) and the second temperature difference (maximum temperature difference between modules), the control valve opening is dynamically adjusted according to the number of adjustments (historical adjustment situation), so that the system can respond to temperature changes instead of relying solely on static preset values, which helps to reduce temperature non-uniformity inside the equipment and improve thermal management efficiency. The first time provides a time period for monitoring when the temperature of the heat load equipment tends to stabilize after adjustment. By setting the first time, frequent and possibly unnecessary adjustments are avoided, reducing control valve wear. After the first time is over, the system adds 1 to the number of adjustments, which helps to track the number of iterations of the adjustment and provide a reference for the next adjustment.

[0015] Optionally, the method further includes: if it is determined that the first temperature difference is not greater than the first temperature preset value, maintaining the second time and setting the adjustment times to an initial value; continuing to monitor the maximum temperature and the minimum temperature of the heat load device as a whole within the T time period, and calculating the first temperature difference.

[0016] In the above implementation process, when the first temperature difference is not greater than the first temperature preset value, the second time is maintained, and the system resets the number of adjustments to the initial value to prepare for subsequent adjustments. At the same time, the temperature state of the system will continue to be monitored, and adjustments will be made only when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). The system can save energy and improve efficiency, and avoid unnecessary control valve actions.

[0017] Optionally, the method further includes: if the second temperature difference is not greater than the second temperature preset value, maintaining the second time and setting the adjustment number to an initial value; continuing to monitor the maximum temperature and the minimum temperature of the heat load equipment as a whole within the T time period, and calculating the first temperature difference; and when the first temperature difference is greater than the first temperature preset value, calculating the second temperature difference.

[0018] In the above implementation process, when the second temperature difference is not greater than the second temperature preset value, the second time is also maintained, and the system resets the number of adjustments to the initial value in preparation for subsequent adjustments during the second time. At the same time, the temperature state of the system continues to be monitored, and adjustments are made only when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). The system can save energy and improve efficiency, and avoid unnecessary control valve actions.

[0019] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: after the first time has passed, determining whether the opening of the control valve connected to the heat load module with the lowest temperature reaches a second opening value.

[0020] In the above implementation process, after the first time is over, the system will evaluate the opening state of the control valve connected to the heat load module with the lowest temperature. If the opening of the control valve does not reach the second opening value, the system may increase the opening so that there is enough coolant flowing through the module with lower temperature, reducing the temperature rise caused by insufficient cooling. If the opening of the control valve has reached or is lower than the second opening value, the system may maintain the current opening or make fine adjustments as needed.

[0021] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the T time period also includes: if it is determined that the opening of the control valve has not reached the preset opening value, continuing to monitor the maximum temperature and the minimum temperature of the heat load device within the T time period to calculate a first temperature difference; determining whether the first temperature difference is greater than the first temperature preset value; if the first temperature difference is greater than the first temperature preset value, determining whether the second temperature difference is greater than the second temperature preset value; if the second temperature difference is greater than the second temperature preset value, adjusting the opening of the control valve again until the second opening value is reached.

[0022] In the above implementation process, after the first time, the system checks whether the opening of the control valve connected to each heat load module reaches the preset opening value. If the opening of the control valve does not reach the preset value, the system will continue to monitor the maximum and minimum temperatures of the heat load equipment during the T time period. After calculating the first temperature difference, it is determined whether the calculated first temperature difference is greater than the preset first temperature value. If the first temperature difference is greater than the preset value, the system will further calculate the second temperature difference to determine whether the calculated second temperature difference is greater than the preset second temperature value. If the second temperature difference is greater than the preset value, it indicates that there is a large temperature difference between the modules, and the system will adjust the opening of the control valve again to reduce the temperature difference and maintain the thermal stability of the heat load equipment. The system will continue to adjust the opening of the control valve until it reaches the second opening value, which is another preset opening value used to control the temperature without excessive cooling and causing energy waste.

[0023] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the T time period also includes: if it is determined that the opening of the control valve reaches the second opening value, maintaining the second time, setting the adjustment times to an initial value, and connecting each of the heat load modules to the control valve to adjust them to the same opening.

[0024] In the above implementation process, the system resets the number of adjustments to the initial value within the second time. This means that the system will start counting the number of adjustments again to prepare for the next adjustment cycle. The system adjusts the control valve connected to each heat load module to the same opening, and all modules receive the same cooling effect. After the second time is over, the system will recalculate the first temperature difference and the second temperature difference to evaluate whether further adjustment of the control valve opening is required. The system may repeat this process until the temperature distribution of the heat load equipment reaches a better state, or until external conditions change and a new adjustment strategy is required.

[0025] The embodiment of the present application also provides a thermal management system, which includes: a control valve, a heat load device and a controller; the heat load device includes a plurality of heat load modules, each of which is connected to the control valve; the controller is configured to: monitor the maximum temperature and the minimum temperature of the heat load device as a whole within a T time period, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device as a whole within the T time period and the minimum temperature of the heat load device as a whole within the T time period; determine whether the first temperature difference is greater than a first temperature preset value; if it is determined that the first temperature difference is greater than the first temperature preset value, monitor the maximum temperature of each heat load module and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; determine whether the second temperature difference is greater than a second temperature preset value; if it is determined that the second temperature difference is greater than the second temperature preset value, monitor the temperature of each heat load module within the T time period, and adjust the opening of the control valve based on the temperature of each heat load module within the T time period.

[0026] In the above implementation process, the thermal management system includes: a control valve, a heat load device and a controller. The controller first monitors the maximum temperature and the minimum temperature of the heat load device within the set time period T, and calculates the first temperature difference, that is, the difference between the maximum temperature and the minimum temperature of the heat load device as a whole within the T time period. Determine whether the calculated first temperature difference is greater than the preset first temperature value. If the first temperature difference is greater than the preset value, the controller will further monitor the maximum temperature of each heat load module and calculate the second temperature difference, that is, the maximum value of the maximum temperature difference of each heat load module. Determine whether the calculated second temperature difference is greater than the preset second temperature value. If the second temperature difference is greater than the preset value, the controller will adjust the opening of the control valve based on the temperature of each heat load module within the T time period to balance the temperature distribution. The controller continuously monitors the temperature of the heat load device and dynamically adjusts the opening of the control valve according to real-time data to respond to temperature changes.

[0027] Optionally, the thermal management system also includes: a heat exchange device; the heat exchange device has a first channel and a second channel built in; the first channel is connected to the first circuit, and the second channel is connected to the second circuit; the first circuit is composed of a fluid storage device, a fluid transport device, the control valve, the heat load device and the heat exchange device; the second circuit is composed of a compression device, a condensing device, a throttling device and the heat exchange device; the first circuit and the second circuit are connected in parallel, and heat exchange is performed based on the heat exchange device.

[0028] In the above implementation process, the system includes a heat exchange device, which has two built-in channels: a first channel and a second channel, which connect the first circuit and the second circuit respectively. The first circuit is composed of a fluid storage device, a fluid transport device, a control valve, a heat load device and a heat exchange device, and is responsible for taking heat away from the heat load device. The second circuit is composed of a compression device, a condensing device, a throttling device and a heat exchange device, and is responsible for the circulation and recompression of the cooling fluid. In the heat exchange device, the fluid carrying heat in the first circuit exchanges heat with the cooling fluid in the second circuit, thereby realizing heat transfer and cooling. The controller monitors the temperature of the heat load device and adjusts the opening of the control valve as needed to control the speed and amount of the fluid flowing through the heat exchange device, thereby adjusting the temperature of the heat load device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1A simple flow chart of the thermal management method provided in an embodiment of the present application;

[0031] Figure 2 A flow chart of adjusting the opening of a control valve using a thermal management method provided in an embodiment of the present application;

[0032] Figure 3 Flow chart of the thermal management method provided in the embodiment of the present application;

[0033] Figure 4 An overall flow chart of the thermal management method provided in the embodiment of the present application;

[0034] Figure 5 A simple schematic diagram of a thermal management system provided in an embodiment of the present application;

[0035] Figure 6 Schematic diagram of a thermal electronic device provided in an embodiment of the present application.

[0036] Icons: 100-control valve; 200-heat load device; 210-heat load module; 300-fluid storage device; 400-fluid transport device; 500-heat exchange device; 600-compression device; 700-throttling device; 800-condensing device; 900-electronic device; 910-memory; 920-storage controller; 930-processor; 940-peripheral interface; 950-input and output unit; 960-display unit. DETAILED DESCRIPTION

[0037] The technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the embodiments of the present application.

[0038] An embodiment of the present application provides a thermal management method, which is applied to a thermal management system including a thermal load device 200, a controller, and a control valve 100; the thermal load device 200 includes a plurality of thermal load modules 210, and each thermal load module 210 is connected to the control valve 100.

[0039] See also Figure 1 , Figure 1 A simple flow chart of the thermal management method provided in an embodiment of the present application.

[0040] First, the maximum temperature and the minimum temperature of the heat load device 200 as a whole within the T time period are monitored to calculate the first temperature difference; then, it is determined whether the first temperature difference is greater than the first temperature preset value; if it is determined that the first temperature difference is greater than the first temperature preset value, the maximum temperature of each heat load module 210 is monitored to calculate the second temperature difference; at this time, it is determined whether the second temperature difference is greater than the second temperature preset value; if it is determined that the second temperature difference is greater than the second temperature preset value, the temperature of each heat load module 210 within the T time period is monitored, and based on the temperature of each heat load module 210 within the T time period, the opening of the control valve 100 is adjusted.

[0041] In the above implementation process, the maximum temperature and the minimum temperature of the heat load device 200 as a whole in the set T time period are first monitored. Based on the monitored maximum temperature and minimum temperature, the first temperature difference is calculated. Among them, the first temperature difference is the difference between the maximum temperature of the heat load device 200 as a whole in the T time period and the minimum temperature of the heat load device 200 as a whole in the T time period, and the first temperature difference represents the temperature fluctuation range of the entire heat load device 200 in the T time period. Compare the calculated first temperature difference with the first temperature preset value. If the first temperature difference exceeds the first temperature preset value, it means that there is a large temperature difference inside the system. Under different environmental conditions, the heat load device 200 may show different temperature fluctuations; monitoring the first temperature difference helps the system adapt to changes in the external environment. When the first temperature difference exceeds the preset value, the maximum temperature of each heat load module 210 is further monitored, and the second temperature difference is calculated. Among them, the second temperature difference is the maximum value of the difference in the maximum temperature of each heat load module 210, which provides information on the temperature difference between each heat load module 210. The system compares the second temperature difference with the second temperature preset value. If the second temperature difference also exceeds the second temperature preset value, the system may be at risk of local overheating, and the control valve 100 needs to be adjusted to balance the temperature. Controlling the second temperature difference helps prevent local overheating, thereby extending the service life of the equipment. When the adjustment is required (i.e., when both the first temperature difference and the second temperature difference exceed the preset value), the system will adjust the opening of the control valve 100 connected to each heat load module 210 based on the specific temperature of each heat load module 210 in the time period T, which is specifically manifested as more cooling for hot areas and less cooling for less hot areas, thereby improving the overall thermal management efficiency of the system.

[0042] Optionally, see Figure 2 , Figure 2 The embodiment of the present application provides a flow chart of adjusting the opening of the control valve 100 using a thermal management method.

[0043] Based on the temperature of each heat load module 210 in the T time period, the opening of the control valve 100 is adjusted, including: sorting the temperature of each heat load module 210 and numbering them in sequence; adjusting the control valve 100 connected to the heat load module 210 with the highest temperature to the first opening value. The openings of the remaining control valves 100 are calculated and adjusted according to the following calculation rules:

[0044]

[0045] After the adjustment is completed, keep it for the first time and set the number of adjustments plus 1.

[0046] In the above implementation process, the temperature data of all heat load modules 210 in the time period T are collected and sorted in order from high to low. After sorting, the system assigns a number to each heat load module 210, and for the module with the highest temperature, the system adjusts the control valve 100 connected to it to the first opening value. This first opening value is a pre-set value, which is intended to provide the heat load module 210 with a better cooling effect than other heat load modules 210 in the system, so as to quickly reduce its temperature. By giving priority to the modules with the highest temperature, the system can respond quickly to possible overheating situations and reduce the risk of equipment performance degradation or damage due to local overheating. Using the formula Taking into account the first temperature difference (temperature fluctuation of the entire device) and the second temperature difference (maximum temperature difference between modules), the opening of the control valve 100 is dynamically adjusted according to the number of adjustments (historical adjustments), so that the system can respond to temperature changes instead of relying solely on static preset values, which helps to reduce temperature non-uniformity inside the device and improve thermal management efficiency. The first time provides a time period for monitoring when the temperature of the heat load device 200 tends to stabilize after adjustment. By setting the first time, frequent and potentially unnecessary adjustments are avoided, reducing wear on the control valve 100. After the first time ends, the system adds 1 to the number of adjustments, which helps to track the number of iterations of the adjustment and provide a reference for the next adjustment.

[0047] In one embodiment of the present application, the module with the highest temperature is numbered 0, followed by number 1, and so on, until all heat load modules 210 are numbered. The module with the highest temperature is numbered 0, and the control valve 100 connected to it is adjusted to the maximum opening value. The remaining heat load modules 210 are calculated according to the number using the formula

[0048] Adjust the opening of the control valve 100 to the calculated value.

[0050] Optionally, see Figure 3 , Figure 3A flow chart of a thermal management method provided in an embodiment of the present application.

[0051] Based on monitoring the maximum temperature and the minimum temperature of the heat load device 200 as a whole in the T time period, when the first temperature difference is calculated, if it is determined that the first temperature difference is not greater than the first temperature preset value, the second time is maintained and the number of adjustments is set to the initial value; the maximum temperature and the minimum temperature of the heat load device 200 as a whole in the T time period are continued to be monitored to calculate the first temperature difference. Based on monitoring the maximum temperature of each heat load module 210, when the second temperature difference is calculated, if the second temperature difference is not greater than the second temperature preset value, the second time is maintained and the number of adjustments is set to the initial value; the maximum temperature and the minimum temperature of the heat load device 200 as a whole in the T time period are continued to be monitored to calculate the first temperature difference; when the first temperature difference is greater than the first temperature preset value, the second temperature difference is calculated.

[0052] In the above implementation process, when the first temperature difference is not greater than the first temperature preset value, the second time is maintained, and the system resets the number of adjustments to the initial value to prepare for subsequent adjustments. When the second temperature difference is not greater than the second temperature preset value, the second time is also maintained, and the system resets the number of adjustments to the initial value within the second time to prepare for subsequent adjustments. At the same time, the temperature state of the system will continue to be monitored, and adjustments will be made only when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). The system can save energy and improve efficiency, and avoid unnecessary control valve 100 actions.

[0053] See also Figure 4 , Figure 4 An overall flow chart of the thermal management method provided in an embodiment of the present application.

[0054] In one embodiment of the present application, the system starts from an initial state, at which time the adjustment times are set to an initial value, and the opening degrees of the control valves 100 of all the heat load modules 210 are the same.

[0055] At the first process node, the system monitors the maximum temperature and the minimum temperature of the heat load device 200 within the T time period, calculates the first temperature difference, and compares it with the first temperature preset value. If the first temperature difference is greater than the preset value, the system proceeds to the next step to calculate the second temperature difference; if the first temperature difference is not greater than the preset value, the system maintains the second time and returns to the first process node to continue monitoring and calculating the first temperature difference until the first temperature difference exceeds the preset value.

[0056] At the second process node, after calculating the second temperature difference, the system determines whether the second temperature difference is greater than the second temperature preset value. If the second temperature difference is not greater than the preset value, the system maintains the second time, returns to the initial state, resets the adjustment times to the initial value, and then restarts monitoring and calculating the first temperature difference.

[0057] If the second temperature difference is greater than the preset value, the system continues to monitor the temperature and adjust the control valve 100 .

[0058] If it is determined that the second temperature difference is greater than the second temperature preset value, the temperature of each heat load module 210 in the T time period is monitored, the temperature of each heat load module 210 is sorted and numbered in sequence; the control valve 100 connected to the heat load module 210 with the highest temperature is adjusted to the first opening value. Preferably, the first opening value is the maximum opening value of the control valve 100.

[0059] Calculate and adjust the remaining control valve openings by 100% according to the following calculation rules:

[0060]

[0061] After the adjustment is completed, the first time is maintained, and the number of adjustments is set to be increased by 1 to prepare for the next adjustment. After the first time has passed, it is determined whether the opening of the control valve 100 connected to the heat load module 210 with the lowest temperature reaches the second opening value.

[0062] If not reached, the system returns to the first process node and continues to monitor and calculate the temperature difference.

[0063] If reached, the system maintains the second time, returns to the initial state, resets the adjustment times to the initial value, and adjusts all control valves 100 to the same opening.

[0064] In the above implementation process, the system continuously adjusts the opening of the control valve 100 in this cyclic manner to respond to the temperature change of the heat load device 200 to ensure that the temperature is controlled within the preferred range. It can dynamically respond to temperature changes and achieve temperature control of the heat load device 200 through continuous monitoring and adjustment. Based on the method of conditional judgment and cyclic adjustment, the thermal management system can adapt to different working conditions and environmental changes, optimize energy consumption, and improve the stability and safety of the system. Optionally, the system can record all relevant temperature data and the adjustment history of the control valve 100 to provide a basis for subsequent analysis and optimization.

[0065] See also Figure 5 , Figure 5 A simple schematic diagram of a thermal management system provided in an embodiment of the present application.

[0066] The thermal management system includes: a control valve 100, a heat load device 200, a controller and a heat exchange device 500; the heat load device 200 includes a plurality of heat load modules 210, each heat load module 210 is connected to the control valve 100; the heat exchange device 500 has a first channel and a second channel built in; the first channel is connected to the first circuit, and the second channel is connected to the second circuit; the first circuit is composed of a fluid storage device 300, a fluid transportation device 400, a control valve 100, a heat load device 200 and a heat exchange device 500; the second circuit is composed of a compression device 600, a condensation device 800, a throttling device 700 and a heat exchange device 500; the first circuit and the second circuit are connected in parallel, and heat exchange is performed based on the heat exchange device 500. The fluid storage device 300 stores heat exchange medium for thermal management and provides sufficient heat exchange medium for the heat exchange process. The fluid transportation device 400 is responsible for transporting the coolant from the storage device to the heat load device 200 and the heat exchange device 500, so that the coolant circulates in the system.

[0067] In one embodiment of the present application, in the second loop, the compression device 600 is used to compress the heat exchange medium, increase its temperature and pressure, and provide power for the circulation of the heat exchange medium. The condensing device 800 is used to cool the compressed heat exchange medium to condense it and release heat to the environment to prepare for the recycling of the heat exchange medium. The throttling device 700 controls the flow rate of the heat exchange medium into the evaporator, reduces the temperature of the heat exchange medium through the throttling effect, and prepares for heat exchange.

[0068] In one embodiment of the present application, the controller is configured to: monitor the maximum temperature and the minimum temperature of the heat load device 200 as a whole within the T time period, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device 200 as a whole within the T time period and the minimum temperature of the heat load device 200 as a whole within the T time period; determine whether the first temperature difference is greater than a first temperature preset value; if it is determined that the first temperature difference is greater than the first temperature preset value, monitor the maximum temperature of each heat load module 210 and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference of the maximum temperature of each heat load module 210; determine whether the second temperature difference is greater than the second temperature preset value; if it is determined that the second temperature difference is greater than the second temperature preset value, monitor the temperature of each heat load module 210 within the T time period, and adjust the opening of the control valve 100 based on the temperature of each heat load module 210 within the T time period.

[0069] In one embodiment of the present application, the fluid storage device 300, the fluid transport device 400, the control valve 100, the heat load device 200 and the heat exchange device 500 are responsible for the heat transfer of the heat load device 200; the compression device 600, the condensing device 800, the throttling device 700 and the heat exchange device 500 are responsible for the circulation and recompression of the coolant; the first circuit and the second circuit are connected in parallel, and heat exchange is performed through the heat exchange device 500. The parallel connection allows the two circuits to operate independently, and the working state of each circuit can be adjusted as needed.

[0070] Optionally, in the heat exchange device 500, the counter-flow configuration can provide the maximum temperature difference across the heat exchanger, and the recuperation configuration can provide a lower temperature difference throughout the heat exchange process. The counter-flow configuration can be selected in applications that need to handle a large amount of heat or perform heat exchange in a compact space, but the recuperation configuration can also be selected according to different thermal management strategies.

[0071] In the above implementation process, the system can control and manage the heat generated by the heat load device 200, keep the device running at a suitable temperature, and improve the overall performance and reliability of the system. At the same time, through heat management, the system can make the heat load device 200 run at an optimal operating temperature, extend the service life of the device, and improve the overall efficiency.

[0072] Optionally, see Figure 6 , Figure 6 Schematic diagram of an electronic device provided in an embodiment of the present application. The electronic device 900 may include a memory 910, a storage controller 920, a processor 930, a peripheral interface 940, an input and output unit 950, and a display unit 960. A person skilled in the art may understand that Figure 6 The structure shown is only for illustration and does not limit the structure of the electronic device 900. For example, the electronic device 900 may also include Figure 6 More or fewer components as shown, or with Figure 6 Different configurations are shown.

[0073] The memory 910, storage controller 920, processor 930, peripheral interface 940, input / output unit 950 and display unit 960 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, these components can be electrically connected to each other through one or more communication buses or signal lines. The processor 930 is used to execute the executable module stored in the memory.

[0074] The memory 910 may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable read-only memory (EEPROM), etc. The memory 910 is used to store programs, and the processor 930 executes the program after receiving the execution instruction. The method executed by the electronic device 900 defined by the process disclosed in any embodiment of the present application can be applied to the processor 930 or implemented by the processor 930.

[0075] The processor 930 may be an integrated circuit chip with signal processing capabilities. The processor 930 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor.

[0076] The above-mentioned peripheral interface 940 couples various input / output devices to the processor 930 and the memory 910. In some embodiments, the peripheral interface 940, the processor 930 and the memory controller 920 can be implemented in a single chip. In some other examples, they can be implemented by separate chips.

[0077] The input / output unit 950 is used to provide input data to the user. The input / output unit 950 may be, but is not limited to, a mouse and a keyboard.

[0078] The display unit 960 provides an interactive interface (e.g., a user operation interface) between the electronic device 900 and the user or is used to display image data for the user's reference. In this embodiment, the display unit 960 may be a liquid crystal display or a touch display. If it is a touch display, it may be a capacitive touch screen or a resistive touch screen that supports single-point and multi-point touch operations. Supporting single-point and multi-point touch operations means that the touch display can sense touch operations generated simultaneously from one or more positions on the touch display, and the sensed touch operations are handed over to the processor 930 for calculation and processing.

[0079] The electronic device 900 in this embodiment can be used to perform each step in the thermal management method provided in the embodiment of the present application. Since the principle of solving the problem by the device in the embodiment of the present application is similar to that of the aforementioned embodiment of the thermal management method, the implementation of the device in this embodiment can refer to the description in the embodiment of the aforementioned method, and the repeated parts will not be repeated.

[0080] In several embodiments provided in the present application, it should be understood that the disclosed device can also be implemented in other ways. The device embodiments described above are merely schematic, for example, the block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices according to the multiple embodiments of the present application. In this regard, each box in the block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram, and the combination of the block diagrams, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0081] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

[0082] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A thermal management method, characterized in that: The method is applied to a thermal management system including a thermal load device, a controller and a control valve; the thermal load device includes a plurality of thermal load modules, each of which is connected to the control valve; the method includes: Monitor the maximum temperature and the minimum temperature of the heat load device as a whole in the T time period, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device as a whole in the T time period and the minimum temperature of the heat load device as a whole in the T time period; Determine whether the first temperature difference is greater than a first temperature preset value; if it is determined that the first temperature difference is greater than the first temperature preset value, monitor the maximum temperature of each of the heat load modules and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; Determine whether the second temperature difference is greater than a second temperature preset value; if it is determined that the second temperature difference is greater than the second temperature preset value, monitor the temperature of each of the heat load modules within the T time period, and adjust the opening of the control valve based on the temperature of each of the heat load modules within the T time period.

2. The method according to claim 1, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules in the T time period includes: Sort the temperatures of each of the heat load modules and number them in sequence; The control valve connected to the heat load module with the highest temperature is adjusted to a first opening value.

3. The method according to claim 2, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules in the T time period also includes: The remaining control valve openings are calculated and adjusted according to the following calculation rules: After the adjustment is completed, keep the first time and set the adjustment times plus 1.

4. The method according to claim 3, characterized in that The method further comprises: If it is determined that the first temperature difference is not greater than the first temperature preset value, maintaining the second time and setting the number of adjustments to an initial value; Continue to monitor the maximum temperature and the minimum temperature of the entire heat load device within the T time period, and calculate the first temperature difference.

5. The method according to claim 3, characterized in that: The method further comprises: If the second temperature difference is not greater than the second temperature preset value, maintaining the second time, and setting the adjustment times to the initial value; Continue to monitor the maximum temperature and the minimum temperature of the entire heat load device within the T time period, and calculate the first temperature difference; when the first temperature difference is greater than the first temperature preset value, calculate the second temperature difference.

6. The method according to claim 5, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules in the T time period also includes: After the first time has passed, it is determined whether the opening of the control valve connected to the heat load module with the lowest temperature reaches a second opening value.

7. The method according to claim 6, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules in the T time period also includes: If it is determined that the opening of the control valve does not reach the preset opening value, continue to monitor the maximum temperature and the minimum temperature of the heat load device within the T time period, and calculate the first temperature difference; Determining whether the first temperature difference is greater than the first temperature preset value; In the case where the first temperature difference is greater than the first temperature preset value, determining whether the second temperature difference is greater than the second temperature preset value; When the second temperature difference is greater than the second temperature preset value, the opening of the control valve is adjusted again until the second opening value is reached.

8. The method according to claim 7, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules in the T time period also includes: If it is determined that the opening of the control valve reaches the second opening value, the second time is maintained, the adjustment times are set to an initial value, and each of the heat load modules connected to the control valve is adjusted to the same opening.

9. A thermal management system, applied to an energy storage device, characterized in that: The thermal management system comprises: a control valve, a heat load device and a controller; the heat load device comprises a plurality of heat load modules, each of which is connected to the control valve; The controller is configured as follows: Monitor the maximum temperature and the minimum temperature of the heat load device as a whole in the T time period, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device as a whole in the T time period and the minimum temperature of the heat load device as a whole in the T time period; Determining whether the first temperature difference is greater than a first temperature preset value; If it is determined that the first temperature difference is greater than the first temperature preset value, the maximum temperature of each of the heat load modules is monitored to calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; Determining whether the second temperature difference is greater than a second temperature preset value; If it is determined that the second temperature difference is greater than the second temperature preset value, the temperature of each of the heat load modules in the T time period is monitored, and the opening of the control valve is adjusted based on the temperature of each of the heat load modules in the T time period.

10. The system according to claim 9, characterized in that The thermal management system further comprises: a heat exchange device; The heat exchange device has a first channel and a second channel built therein; the first channel is connected to the first circuit, and the second channel is connected to the second circuit; The first circuit is composed of a fluid storage device, a fluid transport device, the control valve, the heat load device and the heat exchange device; The second circuit is composed of a compression device, a condensation device, a throttling device and the heat exchange device; The first loop and the second loop are connected in parallel and perform heat exchange based on the heat exchange device.

Citation Information

Patent Citations

  • Battery temperature control method, battery management controller, battery temperature control system and automobile

    CN112038731A

  • Control method and device of refrigeration equipment, electronic equipment and storage medium

    CN116801582A

  • Temperature control method, temperature control system and electric equipment

    CN118610660A

  • Temperature controller

    JP1989269848A

  • Energy saving method and system for climate control system

    WO2011025517A1