Micro host passive heat dissipation structure

Abstract

The present application relates to the technical field of electric digital data processing device, specifically relates to a kind of passive heat dissipation structure of micro host, it includes shell, backplate and the heat dissipation structure being arranged between the two;Heat dissipation structure includes mounting block, multiple copper bottom and multiple heat pipe;The present application is changed as multiple copper bottom perpendicular to backplate by two copper bottom parallelly arranged in traditional heat dissipation structure, reduce a gap in front-back direction, thereby reduce the use of silicone grease, improve the heat dissipation efficiency, guarantee the normal operation of micro host, in addition, copper bottom is integrally formed with backplate, reduce the use of silicone grease between copper bottom and backplate, further improve the thermal conductivity, guarantee the heat dissipation effect.Simultaneously, the contact surface of adjacent two copper bottoms and the axis of fixing bolt are all in inclined state, thereby reduce the amount of silicone grease between copper bottom and heat pipe, the fin on multiple backplate is inclined and staggered arrangement, make the air flowing through fin appear disorder, improve the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic digital data processing devices, and in particular to a passive heat dissipation structure of a micro host. Background Art

[0002] A microcomputer, also often called a mini-computer, is a small, pocket-sized computer. Using large-scale and ultra-large-scale integrated circuits, microcomputers are significantly smaller and lighter, making them easier to carry and store. Due to their advanced integrated circuit technology, microcomputers consume relatively low power, making them energy-efficient and environmentally friendly. They offer a variety of interfaces and expansion slots, allowing users to expand and upgrade their computers as needed. Despite their compact size, microcomputers possess the functionality of regular computers, meeting a variety of daily needs, including office work, study, and entertainment. However, their compact size can limit the cooling system, requiring special attention to its performance and stability to prevent localized overheating that could affect the microcomputer's operation.

[0003] In the prior art, a passive heat dissipation structure for a microcomputer host is disclosed in a Chinese patent document with publication number CN115268603A, in which one end of a heat pipe is sandwiched between a heat conducting plate and a first fixed plate, and the other end leads to a heat dissipation assembly. The heat generated by the CPU is transferred to the heat dissipation fins and the bottom of the heat dissipation fan through the heat conducting plate through the heat pipe. The heat dissipation fan then draws air under negative pressure through the heat dissipation channel formed by the heat dissipation fins to blow the hot air out of the chassis. Combining the above scheme with the analysis of the heat dissipation structure of the microcomputer host in the prior art, due to the relatively rough surfaces of the CPU, heat conducting plate, fins, and heat pipe, there will be gaps at the contact position during assembly. The air in the gaps will affect the thermal conductivity, so it is necessary to apply silicone grease at the contact position to fill the gaps. However, the thermal conductivity of silicone grease is much lower than that of copper sheet, so there are still problems of low heat dissipation efficiency and poor heat dissipation effect. Moreover, when the heat pipe and the copper base are assembled, the heat pipe will collide with the copper base, causing the heat pipe to be damaged. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the present invention proposes a passive heat dissipation structure for a micro host. The device solves the problems of low heat dissipation efficiency and poor heat dissipation effect of the micro host heat dissipation structure in the existing technology and the problem of damage to the heat pipe due to collision between the heat pipe and the copper bottom when assembling the heat pipe and the copper bottom.

[0005] A passive heat dissipation structure for a microcomputer of the present invention adopts the following technical solution. The microcomputer includes a housing, a back panel, and a control panel. The housing and the back panel are detachably fixedly connected to define a receiving cavity. The control panel and the heat dissipation structure are installed in the receiving cavity. The control panel and the back panel are arranged parallel to and spaced apart from each other. The electronic components are detachably installed on the control panel.

[0006] The heat dissipation structure includes a mounting block, a plurality of copper bases and a plurality of heat pipes;

[0007] The mounting block is detachably fixed to a side of the control panel away from the back panel; the mounting block is provided with mounting holes, with the plurality of mounting holes spaced apart in the left-right direction;

[0008] Multiple copper bottoms are closely arranged in the left-right direction, extending in the vertical direction, and arranged on the side of the back plate facing the accommodating cavity; the contacting end surfaces of two adjacent copper bottoms are each provided with a vertically through half hole, and the two half holes enclose a complete combined hole;

[0009] Multiple heat pipes are arranged at intervals along the left and right directions; one end of the heat pipe is inserted into the mounting hole, and the other end is inserted into the combination hole; a metal powder layer is sintered on the inner wall of the heat pipe, and the heat pipe is filled with coolant.

[0010] Optionally, multiple back plates are provided, which are closely arranged along the left and right directions, and the multiple back plates correspond to multiple copper bottoms respectively. The back plates and the corresponding copper bottoms are integrally formed, and fins are provided on the back plates.

[0011] Optionally, the fins on two adjacent back plates are staggered in the vertical direction.

[0012] Optionally, there is an angle between the extension direction of the fin and the vertical direction, and the angle is not a right angle.

[0013] Optionally, the inclination directions of the fins on the multiple back plates are not completely consistent.

[0014] Optionally, the end surface of the copper bottom in contact with the adjacent copper bottom is an inclined surface, and an angle exists between the contact surface and the front-back direction.

[0015] Optionally, a plurality of fixing units are provided between two adjacent copper bottoms, and the plurality of fixing units are arranged at intervals along the vertical direction, and the fixing units are used to fixedly connect the two adjacent copper bottoms.

[0016] Optionally, each fixing unit includes a threaded hole and a bolt, and threaded holes are provided on the side of the copper bottom close to the mounting block and the side close to the back plate, and the axes of the two threaded holes of the two adjacent copper bottoms close to the mounting block coincide, and a bolt is threadedly connected thereto; the axes of the two threaded holes of the two adjacent copper bottoms close to the back plate coincide, and a bolt is threadedly connected thereto; and there is a non-right angle between the axes of the threaded holes and the left and right directions.

[0017] Optionally, in the projection of the cross section of the copper bottom, the axis of the threaded hole is located between the normal direction and the front-to-back direction of two adjacent copper bottom contact surfaces.

[0018] Optionally, a sealing strip is provided between two adjacent copper bottoms. The sealing strip extends in a vertical direction and is provided between the heat pipe and the threaded hole close to one side of the back plate, and an angle is formed between the sealing strip and the contact surface of the two adjacent copper bottoms.

[0019] The beneficial effects of the present invention are as follows: a passive heat dissipation structure of a micro host of the present invention changes the two copper bottoms arranged parallel to the back plate in the traditional heat dissipation structure into multiple copper bottoms perpendicular to the back plate, thereby reducing a gap in the front and rear directions, thereby reducing the use of silicone grease, and making the heat on the copper bottom more efficient when transferred to the back plate, thereby improving the heat dissipation efficiency and avoiding affecting the operation of the micro host due to untimely heat dissipation.

[0020] Furthermore, the copper bottom and the back plate are integrally formed, reducing the gap between the copper bottom and the back plate, thereby reducing the use of silicone grease, so that the heat on the copper bottom is quickly transferred to the back plate, further improving the heat dissipation efficiency and ensuring the heat dissipation effect. The fins are arranged at an angle to increase the surface area of ​​a single fin, increase the contact area between the air and the fins, and further improve the heat dissipation efficiency. The inclination directions of the fins on multiple back plates are not completely consistent, and the fins on two adjacent back plates are arranged alternately in the vertical direction, so that when the air flows in the left and right directions, it collides with the fins on the next back plate, causing turbulence, thereby destroying the boundary layer generated when the air flows through the fins, increasing the thermal conductivity between the fins and the air, and thus improving the heat dissipation efficiency.

[0021] Furthermore, since there is an angle between the contact surface of the two adjacent copper bottoms and the front-to-back direction, the contact area between the two adjacent copper bottoms is larger, thereby improving the heat dissipation efficiency between the two adjacent copper bottoms; and when the heat pipe and the copper bottom are spliced, when the two are close to each other in the left-right direction, the copper bottom guides the heat pipe to avoid collision between the copper bottom and the heat pipe, which may cause damage to the heat pipe.

[0022] Furthermore, by setting a sealing strip, dust is prevented from passing through the back plate into the gap between the copper bottom and the heat pipe, affecting the heat dissipation effect. In the process of tightening the bolts, the silicone grease between the two adjacent copper bottoms and between the copper bottom and the heat pipe is squeezed out only from the gap on the side facing the mounting block, avoiding the silicone grease from reaching the side of the back plate where the fins are provided and on the fins, making it difficult to remove and affecting use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic diagram of the overall structure of a passive heat dissipation structure of a micro host according to the present invention;

[0025] Figure 2This is a schematic diagram of the overall structure of a cross-section of a passive heat dissipation structure of a micro host according to the present invention;

[0026] Figure 3 A schematic diagram from a first perspective of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host according to the present invention;

[0027] Figure 4 A schematic diagram from a second perspective of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host according to the present invention;

[0028] Figure 5 This is a front view of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host according to the present invention;

[0029] Figure 6 for Figure 5 Middle AA section view;

[0030] Figure 7 for Figure 6 Enlarged image at the center X.

[0031] In the picture:

[0032] 100, housing; 110, back panel; 111, receiving chamber; 112, fins; 120, control panel;

[0033] 200, heat dissipation structure; 210, mounting block; 211, mounting hole; 220, copper bottom; 221, combination hole; 222, threaded hole; 223, bolt; 224, sealing strip; 230, heat pipe; 231, metal powder layer. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] like Figures 1 to 7 As shown, an embodiment of the present invention provides a passive heat dissipation structure 200 for a micro host, which includes a housing 100, a back plate 110, and a control board 120. The housing 100 and the back plate 110 are detachably fixedly connected, and define a receiving cavity 111. The control board 120 and the heat dissipation structure 200 are installed in the receiving cavity 111. The control board 120 is parallel to the back plate 110 and is spaced apart. The electronic components are detachably installed on the control board 120.

[0036] The heat dissipation structure 200 includes a mounting block 210, a plurality of copper bases 220, and a plurality of heat pipes 230;

[0037] The mounting block 210 is detachably fixedly connected to a side of the control board 120 away from the back panel 110 ; the mounting block 210 is provided with mounting holes 211 , and a plurality of mounting holes 211 are spaced apart in the left-right direction;

[0038] Multiple copper bottoms 220 are closely arranged in the left-right direction, extending in the vertical direction. The copper bottoms 220 are arranged on the side of the back plate 110 facing the accommodating cavity 111. The contacting end surfaces of two adjacent copper bottoms 220 are each provided with a half hole extending vertically through the other, and the two half holes enclose a complete combined hole 221.

[0039] Multiple heat pipes 230 are arranged at intervals along the left and right directions; one end of the heat pipe 230 is inserted into the mounting hole 211, and the other end is inserted into the combination hole 221; the inner wall of the heat pipe 230 is sintered with a metal powder layer 231, and the heat pipe 230 is filled with coolant.

[0040] When the microcomputer is operating, its electronic components continuously generate heat. This heat is then transferred to the control board 120 and the mounting block 210. The heat from the mounting block 210 is then transferred to the heat pipe 230. After the heat pipe 230 absorbs the heat, the coolant inside evaporates into gas, which then flows through the heat pipe. When it comes into contact with a cooler heat pipe, it condenses into liquid, moves through the powder gaps in the metal powder layer 231, and refills the previously higher temperature area. Simultaneously, heat exchange occurs between the heat pipe 230 and the copper base 220, causing the heat pipe 230 to cool down. The conventional heat dissipation structure 200 has two copper bottoms 220 parallel to the back plate 110. When the heat of the heat pipe 230 is transferred to the copper bottom 220 close to the back plate 110, the heat of the copper bottom 220 only needs to pass through a layer of silicone grease to be transferred to the back plate 110. When the heat is transferred to the copper bottom 220 far away from the back plate 110, the heat of the copper bottom 220 needs to pass through the silicone grease between the two copper bottoms 220 and the silicone grease between the copper bottom 220 and the back plate 110 before it can be transferred to the back plate 110. The present invention changes the two copper bottoms 220 arranged parallel to the back plate 110 in the conventional heat dissipation structure 200 into multiple copper bottoms 220 perpendicular to the back plate 110, thereby reducing a gap in the front-to-back direction, thereby reducing the use of silicone grease, and making the heat on the copper bottom 220 more efficient in heat conduction when transferred to the back plate 110, thereby improving the heat dissipation efficiency and avoiding the impact on the operation of the micro host due to untimely heat dissipation.

[0041] In a further embodiment, a plurality of back plates 110 are provided, which are closely arranged in the left-right direction. The plurality of back plates 110 correspond to a plurality of copper bottoms 220 respectively, and the back plates 110 and their corresponding copper bottoms 220 are integrally formed. Fins 112 are provided on the back plates 110 .

[0042] By providing fins 112 on the back plate 110, the contact area between the back plate 110 and the air is increased, thereby further improving the heat dissipation efficiency. Moreover, since the copper bottom 220 and the back plate 110 are integrally formed, there is no gap between the two, and there is no need to fill the gap with silicone grease, thereby allowing the heat on the copper bottom 220 to be quickly transferred to the back plate 110, thereby further improving the heat dissipation efficiency.

[0043] In a further embodiment, the fins 112 on two adjacent back plates 110 are staggered in the vertical direction, there is an angle between the extension direction of the fins 112 and the vertical direction, and the angle is not a right angle, and the inclination directions of the fins 112 on multiple back plates 110 are not completely consistent.

[0044] By arranging the fins 112 in an inclined state, the surface area of ​​the fins 112 is increased, and the contact area between the air and the fins 112 is increased, further improving the heat dissipation efficiency. When the flowing air contacts the fins 112, heat exchange occurs between the air and the fins 112. Since the fins 112 on the two adjacent back plates 110 are staggered in the vertical direction, when the air flows in the left and right directions, when it reaches the junction between the two adjacent back plates 110, it will collide with the fins 112 on the next back plate 110, causing turbulence, thereby destroying the boundary layer generated when the air flows through the fins 112, increasing the thermal conductivity between the fins 112 and the air, and thus improving the heat dissipation efficiency.

[0045] In a further embodiment, the end surface of the copper base 220 that contacts the adjacent copper base is an inclined surface, and an angle is formed between the contact surface and the front-to-back direction. This facilitates the fixed connection of two adjacent copper bases 220. When the heat pipe 230 and the copper base 220 are spliced, the two approach each other in the left-right direction. When the contact surface between the two adjacent copper bases 220 extends in the front-to-back direction, the heat pipe 230 and the copper base 220 may collide, causing damage to the heat pipe 230. In the present invention, the contact surface between the two adjacent copper bases 220 is at an angle to the front-to-back direction, thereby increasing the contact area between the two adjacent copper bases 220 and improving the heat dissipation efficiency between the two adjacent copper bases 220. Moreover, when the copper base 220 and the heat pipe 230 approach each other in the left-to-right direction, the copper base 220 guides the heat pipe 230, preventing collision between the copper base 220 and the heat pipe 230 and damaging the heat pipe 230.

[0046] In a further embodiment, a plurality of fixing units are provided between two adjacent copper bases 220, the plurality of fixing units being spaced apart in the vertical direction, and the fixing units being used to securely connect the two adjacent copper bases 220. Each fixing unit includes a threaded hole 222 and a bolt 223. Threaded holes 222 are provided on both the side of the copper base 220 near the mounting block 210 and the side near the back plate 110. The axes of the two threaded holes 222 of the two adjacent copper bases 220 near the mounting block 210 coincide, with a bolt 223 being threadedly connected thereto. The axes of the two threaded holes 222 of the two adjacent copper bases 220 near the back plate 110 coincide, with a bolt 223 being threadedly connected thereto. Furthermore, the axes of the threaded holes 222 are at a non-perpendicular angle to the left-right direction.

[0047] When the bolt 223 is screwed into the threaded hole 222, the gap between the two adjacent copper bottoms 220 is gradually reduced, and the silicone grease filled between the heat pipe 230 and the copper bottom 220 is squeezed outward, thereby avoiding the heat dissipation effect affected by excessive silicone grease filled between the heat pipe 230 and the copper bottom 220, thereby further improving the heat dissipation efficiency.

[0048] In a further embodiment, in the projection of the cross section of the copper base 220, the axis of the threaded hole 222 is located between the normal direction and the front-to-back direction of the contact surface of two adjacent copper bases 220. As the bolt 223 is screwed into the threaded hole 222, not only can the gap between the two adjacent copper bases 220 be gradually reduced, but a force component directed toward the axis of the heat pipe 230 can also be applied to the thinner portion of the copper base 220, thereby better wrapping the heat pipe 230 with the copper base 220, reducing the gap between the two, further reducing the amount of silicone grease required to fill the gap, and further improving heat dissipation efficiency.

[0049] In a further embodiment, a sealing strip 224 is provided between two adjacent copper bases 220. The sealing strip 224 extends in the vertical direction and is provided between the heat pipe 230 and the threaded hole 222 on the side close to the back plate 110. The sealing strip 224 forms an angle with the contact surface of the two adjacent copper bases 220. This prevents dust from passing through the back plate 110 and entering the gap between the copper base 220 and the heat pipe 230, thereby affecting the heat dissipation effect. In addition, when the bolts 223 are tightened, the silicone grease between the two adjacent copper bases 220 and between the copper base 220 and the heat pipe 230 is squeezed out only from the gap facing the mounting block 210, preventing the silicone grease from reaching the side of the back plate 110 where the fins 112 are provided and on the fins 112, making it difficult to remove and affecting the use of the device.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A passive heat dissipation structure of a micro host, characterized in that: The micro host includes a housing, a back panel, and a control panel; the housing and the back panel are detachably fixedly connected, defining a receiving cavity, in which the control panel and the heat dissipation structure are installed; the control panel is parallel to and spaced apart from the back panel, and the electronic components are detachably mounted on the control panel; The heat dissipation structure includes a mounting block, a plurality of copper bases and a plurality of heat pipes; The mounting block is detachably fixed to a side of the control panel away from the back panel; the mounting block is provided with mounting holes, with the plurality of mounting holes spaced apart in the left-right direction; Multiple copper bottoms are closely arranged in the left-right direction, extending in the vertical direction, and arranged on the side of the back plate facing the accommodating cavity; the contacting end surfaces of two adjacent copper bottoms are each provided with a vertically through half hole, and the two half holes enclose a complete combined hole; Multiple heat pipes are spaced apart in the left-right direction; one end of the heat pipe is inserted into the mounting hole, and the other end is inserted into the combination hole; a metal powder layer is sintered on the inner wall of the heat pipe, and the heat pipe is filled with coolant; the end surface where the copper bottom contacts the adjacent copper bottom is an inclined surface, and there is an angle between the contact surface and the front-back direction; A plurality of fixing units are provided between two adjacent copper bottoms, the plurality of fixing units being spaced apart in the vertical direction, and the fixing units being used to fix the two adjacent copper bottoms together; each fixing unit comprises a threaded hole and a bolt, and a threaded hole is provided on both the side of the copper bottom close to the mounting block and the side close to the back plate, and the axes of the two threaded holes of the two adjacent copper bottoms close to the mounting block coincide with each other, wherein a bolt is threadedly connected; the axes of the two threaded holes of the two adjacent copper bottoms close to the back plate coincide with each other, wherein a bolt is threadedly connected, and a non-right angle is formed between the axes of the threaded holes and the left-right direction; in the projection of the cross section of the copper bottom, the axes of the threaded holes are located between the normal direction of the contact surface of the two adjacent copper bottoms and the front-to-back direction; A sealing strip is provided between two adjacent copper bottoms. The sealing strip extends in a vertical direction and is provided between the heat pipe and the threaded hole close to one side of the back plate. There is an angle between the sealing strip and the contact surface of the two adjacent copper bottoms.

2. The passive heat dissipation structure of a micro host according to claim 1, characterized in that: There are multiple back plates, which are closely arranged along the left and right directions. The multiple back plates correspond to the multiple copper bottoms respectively, and the back plates and the corresponding copper bottoms are integrally formed. Fins are arranged on the back plates.

3. The passive heat dissipation structure of a micro host according to claim 2, characterized in that: The fins on two adjacent back plates are staggered in the vertical direction.

4. The passive heat dissipation structure of a micro host according to claim 3, characterized in that: There is an angle between the extending direction of the fin and the vertical direction, and the angle is not a right angle.

5. The passive heat dissipation structure of a micro host according to claim 4, characterized in that: The inclination directions of the fins on multiple back panels are not completely consistent.

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