A method for punching multiple wires on the same welding window of a chip and a packaging structure

Abstract

The present invention provides a method and packaging structure for punching multiple wires on the same welding window of a chip, including a chip body, and a wire welding platform constructed on at least one welding window thereof, which increases the wire welding area of ​​the chip welding window and makes it possible to punch multiple wires on the same welding window. The wire welding platform includes a wire welding platform and a supporting structure. The constructed wire welding platform maintains a safe distance from other welding windows of the chip body to prevent adverse effects after the two come into contact. The present invention adopts a method of constructing a wire welding platform on the chip welding window to increase the wire welding area of ​​the chip welding window, so that the wire welding process can weld multiple wires in the same welding window, and expand the welding window to realize multi-functional electrical connection and function. At the same time, during the design process, the number of welding windows with the same function on the chip body or the area of ​​the welding windows can be reduced, so that the chip space occupied can be further reduced, the chip and packaging costs can be reduced, and the size of electronic devices can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of chip packaging, and in particular relates to a method for punching multiple wires on a same welding window of a chip and a packaging structure. Background Art

[0002] With the development of chip packaging technology, the number of products that can package multiple chips in the same package to achieve multiple complex functions of an electronic device is gradually increasing. In the prior art, a wire is usually tied in a soldering window of the chip, one end of which is connected to the chip soldering window part, and the other end is connected to the frame. In some special functions, when multiple wires need to be tied due to functional requirements, it is necessary to use multiple windows or enlarge and widen the soldering window to solve the problem. In this way, a relatively large chip area is required to support the basic requirements of multiple soldering windows or large soldering windows. In addition, in order to ensure that there are enough connection points for the same function on the chip when the product is used, chip models with more soldering windows will be selected. This type of chip often occupies a larger area than other chips with the same function, increasing the package volume. Summary of the invention

[0003] In view of this, the present invention aims to provide a method for bonding multiple wires on the same soldering window of a chip and a packaging structure to reduce the footprint of the chip package.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0005] A method for punching multiple wires on the same soldering window of a chip, comprising:

[0006] S1: constructing a wire bonding platform on at least one welding window of the chip to be packaged, so that a safety gap is maintained between the edge of the wire bonding platform and the adjacent welding window of the welding window connected to the wire bonding platform;

[0007] S2: Installing the chip with the wire bonding platform fixed thereto and other chips to be packaged at predetermined positions of the packaging frame;

[0008] S3: placing a first solder ball on one of the wire bonding platforms, connecting one end of the wire bonding to a solder window of another chip, another wire bonding platform or a predetermined position of a packaging frame, and then connecting the other end of the wire bonding to the first solder ball.

[0009] Furthermore, the packaging method also includes

[0010] S4: Repeat step S3 to connect the welding window with the welding wire platform fixed thereon to the welding windows of the multiple chips.

[0011] The present application also provides a packaging structure for punching multiple wires on the same welding window of a chip, including a chip body and a welding wire platform constructed on the welding window of the chip body, wherein the welding wire platform extends downward from a supporting structure, the supporting structure is fixedly connected to the welding window of the chip, the welding wire platform is placed above the welding window, and a space is left between the welding wire platform and the chip; the area of ​​the welding wire platform is larger than the area of ​​the welding window.

[0012] Furthermore, the thickness of the wire bonding platform gradually decreases from the center to the edge.

[0013] Furthermore, the number of bonding wires connected to one bonding wire platform is less than or equal to five.

[0014] Furthermore, the cross-sectional area of ​​the bottom end of the support structure is larger than the cross-sectional area of ​​the top end.

[0015] Compared with the prior art, the method and packaging structure for bonding multiple wires on the same soldering window of a chip described in the present invention have the following advantages:

[0016] The present invention adopts a method of arranging a welding wire platform on the welding window, so that the welding wire connected to the welding window can be connected through the welding wire platform, so that the welding window can be electrically connected to the welding windows of multiple other chips, and then the number of welding windows with the same function on the chip or the area of ​​the welding windows can be reduced during the design process, so that the chip space can be further reduced, the chip and packaging costs are reduced, and the size of the electronic device is reduced;

[0017] The use of a welding wire platform changes the horizontal spacing of each welding point to the vertical, horizontal, and left-right spacing, which can reduce the product size while maintaining the spacing between welding points.

[0018] The thickness of the edge of the wire bonding platform is reduced to increase the distance between the wire bonding platform and other welding windows, so as to avoid short circuit caused by the close distance between the solder balls of other welding windows and the wire bonding platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 This is a schematic diagram of the chip distribution in the package and the connection requirements between the solder window;

[0021] Figure 2 This is a schematic diagram of welding the welding window through the welding line platform;

[0022] Figure 3 This is a schematic diagram of the electrical connection between the welding window and multiple positions through the welding wire platform.

[0023] Description of reference numerals:

[0024] 1-chip body; 11-welding window; 2-wire bonding platform; 21-support structure; 3-packaging frame; 4-welding wire; 5-first solder ball; 6-second solder ball. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0028] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0029] Combination Figure 1 , Figure 2 and Figure 3As shown, the packaging structure of punching multiple wires on the same welding window of a chip according to the present invention comprises a packaging frame 3, and a plurality of chip bodies 1 are fixedly arranged at a preset position of the packaging frame 3, and as required, the designer can fix the chip bodies 1 on the packaging frame 3 by overlapping the chip bodies 1 with each other, laying them flat in sequence, etc. A welding wire platform 2 is constructed on at least one welding window 11 of at least one chip body 1, and the welding wire platform 2 extends downwardly out of a support structure 21, and the support structure 21 is fixedly connected to the welding window 11, and the welding wire platform 2 is placed above the welding window 11, and a space is left between the welding wire platform 2 and the chip body 1; the area of ​​the welding wire platform 2 is larger than the cross-sectional area of ​​the support structure 21, and further, the area of ​​the welding wire platform 2 is larger than the area of ​​the welding window 11. Specifically, in this embodiment, the bottom end surface of the support structure 21 and the welding window 11 can be constructed by surrounding the chemical vapor deposition method, the physical vapor deposition method, or the welding wire platform 2 can be fixed on the welding window 11 by welding. The thickness of the wire bonding platform 2 gradually decreases from the center to the edge, so that the lower surface of the wire bonding platform 2 maintains a safe distance from other surrounding welding windows 11, avoiding short circuits and other phenomena when power is turned on due to the small distance between the wire bonding platform 2 and the surrounding welding windows 11 after the wire bonding is completed, and at the same time reducing the deadweight of the wire bonding platform 2, so that the connection between the wire bonding platform 2 and the welding window 11 is more stable. The cross-sectional area of ​​the bottom end of the support structure 21 is larger than the cross-sectional area of ​​the top end. In this embodiment, the support structure 21 gradually becomes thinner in the direction away from the chip body 1, thereby further reducing the deadweight of the wire bonding platform 2 and reducing the burden on the connection between the chip body 1 and the wire bonding platform 2.

[0030] In this embodiment, one wire bonding platform 2 is connected to five or less bonding wires 4 to prevent the splitting knife of the wire bonding equipment from affecting the already bonded bonding wires 4 after bonding on the wire bonding platform 2 .

[0031] Based on the above-mentioned packaging structure of punching multiple wires on the same solder window of a chip, the present application also provides a method for punching multiple wires on the same solder window of a chip, comprising:

[0032] S1: construct a wire bonding platform 2 on at least one welding window of the chip to be packaged, and maintain a safety gap between the edge of the wire bonding platform 2 and the adjacent welding window 11 of the welding window 11 connected to the wire bonding platform 2; in other embodiments, as needed, multiple wire bonding platforms 2 can be constructed on the same chip, and wire bonding platforms 2 can also be constructed on multiple chips respectively; the safety gap should be larger than the minimum gap between the welding windows 11 of the chip body 1. In this embodiment, since the wire bonding platform 2 is placed above the welding window 11, the gap between the welding windows 11 in the horizontal direction is changed to a gap in the horizontal and vertical directions. Therefore, although the area of ​​the wire bonding platform 2 is larger than the area of ​​the welding window 11, the safety gap will not be reduced;

[0033] S2: According to the requirements, when there is only one chip in the package, the chip with the wire bonding platform 2 fixed thereto is mounted at a predetermined position of the package frame 3; when there are multiple chips in the package, the chip with the wire bonding platform 2 fixed thereto and other chips to be packaged are mounted at predetermined positions of the package frame 3; in this embodiment, the chip can be bonded to the package frame 3 by conductive adhesive;

[0034] S3: A first solder ball 5 is punched on one of the wire bonding platforms 2, one end of the soldering wire 4 is connected to a predetermined position of the soldering window 11 of the other chip, another wire bonding platform 2 or a packaging frame 3, and then the other end of the soldering wire 4 is connected to the first solder ball 5. Specifically, in the present embodiment, a second solder ball 6 is provided at a predetermined position of the soldering window 11 of the other chip, another wire bonding platform 2 or a packaging frame 3, and the end of the soldering wire 4 is connected to the second solder ball 6.

[0035] S4: Repeat step S3 to connect the welding window 11 fixed with the welding wire platform 2 to the welding window 11 of other chips, and the number of repetitions of S3 is less than or equal to four times, so that the number of solder balls on the welding wire platform 2 is less than five, so as to avoid that the welding wire 4 equipment may affect the already connected welding wire 4 during the wiring process due to the excessive number of wiring on the welding wire platform 2.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for punching multiple wires on the same welding window of a chip, characterized in that: S1: constructing a wire bonding platform on at least one welding window of the chip to be packaged, wherein the area of ​​the wire bonding platform is larger than the area of ​​the welding window, and a safety gap is maintained between the edge of the wire bonding platform and the adjacent welding window to which the wire bonding platform is connected; S2: Mounting the chip with the wire bonding platform fixed on a predetermined position of the packaging frame; S3: placing a first solder ball on the wire bonding platform, connecting one end of the solder wire to a predetermined position of the packaging frame, and then connecting the other end of the solder wire to the first solder ball.

2. A method for punching multiple wires on the same welding window of a chip, characterized in that: S1: constructing a wire bonding platform on at least one welding window of the chip to be packaged, wherein the area of ​​the wire bonding platform is larger than the area of ​​the welding window, and a safety gap is maintained between the edge of the wire bonding platform and the adjacent welding window to which the wire bonding platform is connected; S2: Installing the chip with the wire bonding platform fixed thereto and other chips to be packaged at predetermined positions of the packaging frame; S3: placing a first solder ball on one of the wire bonding platforms, connecting one end of the wire bonding to a solder window of another chip, another wire bonding platform or a predetermined position of a packaging frame, and then connecting the other end of the wire bonding to the first solder ball.

3. A method for punching multiple wires on a same soldering window of a chip according to claim 2, characterized in that: Also includes S4: Repeat step S3 to connect the welding window with the welding wire platform fixed thereon to the welding windows of other chips.

4. A method for punching multiple wires on a same soldering window of a chip according to claim 3, characterized in that: In step S4, S3 is repeated less than or equal to four times.

5. A packaging structure in which multiple wires are punched on the same soldering window of a chip, characterized in that: The invention comprises a chip body and a wire bonding platform constructed on the bonding window of the chip body, wherein the area of ​​the wire bonding platform is larger than the area of ​​the bonding window, and the wire bonding platform extends downward out of the supporting structure so that a space is left between the wire bonding platform and the chip body; and the area of ​​the wire bonding platform is larger than the cross-sectional area of ​​the supporting structure.

6. The packaging structure of claim 5 wherein multiple wires are punched on the same soldering window of a chip, characterized in that: The thickness of the wire bonding platform gradually decreases from the center to the edge.

7. The packaging structure of claim 5 wherein multiple wires are punched on the same soldering window of a chip, characterized in that: The number of bonding wires connected to one bonding wire platform is less than or equal to five.

8. The packaging structure of claim 5 wherein multiple wires are punched on the same soldering window of a chip, characterized in that: The cross-sectional area of ​​the bottom end of the support structure is larger than the cross-sectional area of ​​the top end.

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