Wafer loading device

Abstract

The present invention provides a wafer loading device, which relates to the field of semiconductor manufacturing technology, including: a base plate; a supporting component; the supporting component includes mounting frames fixedly connected to both sides of the top end of the base plate; a feeding component; the feeding component includes a cylinder 1 fixedly connected to one side of the top end of the base plate, and the driving end of the cylinder 1 is fixedly connected to an active moving seat; a clamping component; the clamping component includes a cylinder 2 fixedly connected to the active moving seat, and the driving end of the cylinder 2 is fixedly connected to a support plate, and slide grooves are provided on both sides of the inner part of the support plate; this design, through the cooperation of the pneumatic device, the feeding and clamping processes are carried out synchronously, which improves the operating efficiency, reduces the pause time, and ensures the stability and continuity of the wafer during the transmission process. Compared with the adsorption of the vacuum suction cup, this solution does not rely on the surface characteristics of the wafer, so the surface flatness of the wafer is required to be lower, avoiding the influence of the surface flatness on the stability of the wafer, and ensuring higher stability and safety.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer loading device. Background Art

[0002] A wafer, also known as a silicon chip, is a round semiconductor material, usually made of high-purity single crystal silicon. It is the basic material for manufacturing integrated circuits and various semiconductor devices. Through complex process steps such as lithography, etching and doping on its surface, hundreds of millions of microelectronic components can be formed, which are then assembled into various electronic devices and systems.

[0003] The industry usually adopts robotic gripping, vacuum suction cup adsorption or dedicated track transportation to realize automatic loading of wafers. Robotic gripping is highly flexible, but expensive and complex to maintain; vacuum suction cup adsorption has high stability and safety, but has certain requirements for surface flatness; dedicated track transportation system is suitable for large-scale assembly line operations, but it is difficult to adjust and has poor adaptability to products of multiple specifications. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and provide a wafer loading device.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a wafer loading device, comprising:

[0006] Base plate;

[0007] Support assembly; the support assembly includes mounting brackets fixedly connected to both sides of the top of the bottom plate;

[0008] Feeding assembly; the feeding assembly comprises a cylinder 1 fixedly connected to one side of the top of the bottom plate, and the driving end of the cylinder 1 is fixedly connected to an active moving seat;

[0009] The clamping assembly comprises a second cylinder fixedly connected to the active moving seat, a support plate is fixedly connected to the driving end of the second cylinder, a slide groove is provided on both sides of the inner side of the support plate, a moving plate is slidably connected to the slide groove, and a cylinder three is fixedly connected to the adjacent ends of the two moving plates;

[0010] The rotary drive assembly comprises a mounting plate fixedly connected to the movable plate, a motor is mounted on the mounting plate, a driving end of the motor is fixedly connected to a driving gear, an extension rod 1 is fixedly connected to the driving gear, and a driven gear is fixedly connected inside the extension rod 1;

[0011] The flip assembly comprises a worm wheel and a positioning ring, the outer side of the worm wheel is fixedly connected to a support seat, both sides of the support seat are fixedly connected to a rotating block, and the interior of the positioning ring is provided with a rotating groove;

[0012] Clamping and adjusting component; the clamping and adjusting component includes a clamping frame fixedly connected to both ends of the support seat, a clamping block is fixedly connected inside the clamping frame, a clamping clamp is slidably connected to the top of the support seat, clamping grooves are provided on both sides of the clamping clamp, and a pushing groove is provided at one end of the clamping clamp.

[0013] The technical effect of adopting the above technical scheme is: by precisely controlling the movement of each component, the present invention can realize rapid loading of wafers, reduce the time and labor intensity of manual operation, and especially through the coordinated use of the shaking mechanism and the guiding mechanism, multiple wafers can be guided and arranged to prevent overlapping, thereby improving loading efficiency.

[0014] As a preferred embodiment, the mounting frame is fixedly connected to a supporting frame, and the interiors of the two supporting frames are fixedly connected to carrying rods.

[0015] The technical effect of adopting the above technical solution is: through the fixed connection of the support frame and the carrier rod, a more stable structural support can be provided to ensure the stability of the wafer during the loading process and reduce the risk of wafer damage caused by the shaking of the device. The openings on the carrier rod are used to place the wafers to maintain an equal spacing.

[0016] As a preferred embodiment, the top end of the base plate is fixedly connected to a limiting slide rail, the bottom end of the active moving seat is slidably connected to one end of the limiting slide rail, and the end of the limiting slide rail away from the active moving seat is slidably connected to a driven moving seat.

[0017] The technical effect of adopting the above technical solution is to achieve precise positioning and movement control of the wafer loading device. The drive of the active moving seat can be provided by a motor or other power device to ensure the smoothness and accuracy of the movement. The driven moving seat follows the motion trajectory of the active moving seat to ensure the synchronous movement of the entire device, thereby realizing orderly loading of the wafer. In addition, the design of the limit slide rail can also prevent excessive movement of the moving seat, ensuring the safety and reliability of the device during operation.

[0018] As a preferred embodiment, one end of the mounting plate is fixedly connected to a positioning frame, the outer side of the driving gear is rotatably connected to the mounting plate, the end of the mounting plate away from the driving gear is rotatably connected to a driven gear, one end of the driven gear is fixedly connected to an extension rod 2, and the inner part of the extension rod 2 is fixedly connected to a worm gear 2.

[0019] The technical effect of adopting the above technical scheme is: the rotation of worm gear 2 drives worm wheel 2, and then drives the driven gear to rotate, so that a precise transmission ratio can be achieved between the driving gear and the driven gear, thereby ensuring the synchronization and stability of the wafer loading device. At the same time, the worm gear transmission has a self-locking function, which can prevent the wafer from slipping due to unexpected situations during the loading process, further improving the safety of the wafer.

[0020] As a preferred embodiment, the outer sides of the worm wheel are meshingly connected with the worm one and the worm two respectively.

[0021] The technical effect of adopting the above technical solution is: the meshing connection between the worm and the worm wheel ensures the accuracy of the transmission, so that the entire wafer loading device can maintain a high degree of synchronization during operation.

[0022] As a preferred implementation, the outer sides of the positioning rings are fixedly connected to the inner sides of the positioning frame in an array shape.

[0023] The technical effect of adopting the above technical solution is that the array design of the positioning rings can effectively position multiple wafers to ensure stable transportation of the entire production line.

[0024] As a preferred implementation, the outer side of the rotating block is rotatably connected to the positioning ring via a rotating groove.

[0025] The technical effect of adopting the above technical solution is: the rotational connection design between the rotating block and the positioning ring enables the rotating block to rotate flexibly on the positioning ring, thereby achieving precise adjustment of the wafer.

[0026] As a preferred implementation, the card block is engaged with the card slot.

[0027] The technical effect of adopting the above technical solution is: the locking design of the card block and the card slot can ensure the stability of the wafer during the loading process and prevent the wafer from being displaced or falling off during high-speed operation.

[0028] Compared with the prior art, the advantages and positive effects of the present invention are:

[0029] The support component provides a stable bearing platform for the wafer through the mounting frame and support frame fixed on both sides of the top of the base plate, and the internal fixedly connected carrier rod. This design allows the carrier rod to directly contact the wafer to ensure the stability of the wafer during transportation. The feeding component uses the cylinder 1 fixed on one side of the top of the base plate as the power source, and drives the active moving seat along the limit slide rail through pneumatic or hydraulic driving, driving the driven moving seat to move synchronously to realize the transportation of the wafer. The clamping component uses the cylinder 2 as the power source. Through the cooperation of the support plate and the slide groove, the moving plate can accurately adjust the position, and the wafer is clamped by the cylinder 3; this design uses the cooperation of the pneumatic device to synchronize the feeding and clamping processes, improves the operating efficiency, reduces the pause time, and ensures the stability and continuity of the wafer during the transmission process. Compared with the vacuum suction cup adsorption, this solution does not rely on the surface characteristics of the wafer, so the surface flatness requirements of the wafer are lower, avoiding the influence of the surface flatness on the stability of the wafer, and ensuring higher stability and safety.

[0030] The active gear is driven to rotate by a motor, and the active gear transmits power to the driven gear inside the extension rod one through meshing to achieve reverse rotation. The extension rod one is fixedly connected to the inside, and the power of the driven gear is transmitted through the worm two inside the extension rod two to achieve synchronous rotation adjustment. In the flipping assembly, the worm wheel meshes with the worm one and the worm two to convert the rotational motion of the worm into its own rotational motion to achieve flipping action. The positioning ring is fixedly connected to the positioning frame, and the rotating block is connected to the positioning ring through the rotating groove to ensure stability and accuracy during the flipping process. This design has the function of accurately adjusting the position and posture of the wafer, so that the entire device can flexibly cope with wafers of various specifications and sizes, so that it can easily cope with the production needs of products of various specifications. Compared with traditional vacuum suction cups, this design is easier to adapt to the needs of various products and greatly reduces the dependence on complex track adjustments.

[0031] The clamping adjustment assembly is fixed to both ends of the support base through a card rack. The card block is built into the card rack and engages with the card slot on the clamping clamp to achieve clamping fixation and adjustment. The top end of the clamping clamp is connected to the support base by sliding, allowing it to move left and right along the support base to adapt to the clamping requirements of wafers of different heights. The push groove receives external driving force to achieve the opening and closing action of the clamping clamp. This design can adapt to wafers of different heights and specifications, increases the flexibility and versatility of the device, and the arc-shaped groove design of the card block avoids shaking of the wafer when it is flipped, while reducing the risk of damage to the wafer and improving the safety of clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A three-dimensional diagram of a wafer loading device provided by the present invention;

[0033] Figure 2 A schematic diagram of the structure of a clamping assembly of a wafer loading device provided by the present invention;

[0034] Figure 3 A schematic diagram of the structure of a rotary drive assembly of a wafer loading device provided by the present invention;

[0035] Figure 4 A schematic diagram of the driven gear structure of a wafer loading device provided by the present invention;

[0036] Figure 5 A schematic diagram of the structure of a flip assembly of a wafer loading device provided by the present invention;

[0037] Figure 6 A schematic diagram of the structure of a clamping and adjusting component of a wafer loading device provided by the present invention.

[0038] 1. Bottom plate;

[0039] 2. Support assembly; 21. Mounting frame; 22. Support frame; 23. Carrying rod;

[0040] 3. Feeding assembly; 31. Cylinder 1; 32. Active moving seat; 33. Driven moving seat; 34. Limiting slide rail;

[0041] 4. Clamping assembly; 41. Cylinder 2; 42. Support plate; 43. Slide; 44. Cylinder 3; 45. Moving plate;

[0042] 5. Rotation drive assembly; 51. Mounting plate; 52. Motor; 53. Driving gear; 54. Extension rod 1; 55. Worm 1; 56. Driven gear; 57. Extension rod 2; 58. Worm 2; 59. Positioning frame;

[0043] 6. Flip assembly; 61. Worm gear; 62. Support seat; 63. Rotating block; 64. Positioning ring; 65. Rotating groove;

[0044] 7. Clamping adjustment assembly; 71. Card frame; 72. Card block; 73. Clamping clip; 74. Card slot; 75. Push slot. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] like Figure 1 As shown, this embodiment provides a technical solution: a wafer loading device, comprising: a base plate 1;

[0047] Support assembly 2; the support assembly 2 includes a mounting frame 21 fixedly connected to both sides of the top of the bottom plate 1, the mounting frame 21 is fixedly connected to a support frame 22, and the interior of the two support frames 22 is fixedly connected to a load-bearing rod 23;

[0048] The base plate 1 is the foundation of the entire device to ensure stability. The function of the mounting frame 21 is to provide a stable mounting platform for the support frame 22. The support frame 22 is a component designed on the mounting frame 21 to provide a stable mounting platform for the support frame 22. The support frame 22 is a component installed on the mounting frame 21. A carrying rod 23 is fixedly connected inside to directly carry the wafer. The carrying rod 23 is a component that directly contacts the wafer to ensure that the wafer remains stable during transportation;

[0049] like Figure 1 and Figure 2 As shown, the feeding assembly 3; the feeding assembly 3 includes a cylinder 1 31 fixedly connected to one side of the top of the bottom plate 1, the driving end of the cylinder 1 31 is fixedly connected to an active moving seat 32, the top of the bottom plate 1 is fixedly connected to a limiting slide rail 34, the bottom end of the active moving seat 32 is slidably connected to one end of the limiting slide rail 34, and the end of the limiting slide rail 34 away from the active moving seat 32 is slidably connected to a driven moving seat 33;

[0050] The cylinder 1 31 is fixedly connected to one side of the top of the bottom plate 1, and serves as the power source of the feeding assembly 3. The power is provided by pneumatic or hydraulic means. The active moving seat 32 is a component directly connected to the cylinder 1 31, and the bottom end is slidably connected to one end of the limiting slide rail 34. This sliding connection enables the active moving seat 32 to move along the slide rail direction. The function of the limiting slide rail 34 is to provide a stable sliding path for the active moving seat 32 and the driven moving seat 33, and to limit the moving range. The driven moving seat 33 corresponds to the active moving seat 32, and moves synchronously with the active moving seat 32 under the action of the gas rod 1 to ensure the continuity of the entire feeding process.

[0051] like Figure 1 and Figure 2 As shown, the clamping assembly 4 comprises a second cylinder 41 fixedly connected to the active moving seat 32, a driving end of the second cylinder 41 is fixedly connected to a support plate 42, both sides of the support plate 42 are provided with a slide groove 43, a moving plate 45 is slidably connected to the slide groove 43, and a cylinder 3 44 is fixedly connected to the adjacent ends of the two moving plates 45;

[0052] The cylinder 2 41 is used as the power source of the clamping assembly 4, and provides movement by pneumatic or hydraulic means. The design of the support plate 42 provides a unified driving point, and slide grooves 43 are opened on both sides of the interior. The slide grooves 43 are used to slide and connect the moving plate 45. This design allows the moving plate 45 to move along the slide groove 43. The moving plate 45 moves freely in the slide groove 43. This design allows the moving plate 45 to be accurately adjusted along the slide groove 43. The adjacent ends of the two moving plates 45 are fixedly connected with the cylinder 3 44. The cylinder 3 44 is used as an actuator for the clamping action. The clamping action of the moving plate 45 is controlled by telescoping to achieve the effect of synchronous movement of the components installed on the moving plate 45.

[0053] like Figure 2-Figure 4 As shown, the rotary drive assembly 5; the rotary drive assembly 5 comprises a mounting plate 51 fixedly connected to the movable plate 45, a motor 52 is mounted on the mounting plate 51, a driving end of the motor 52 is fixedly connected to a driving gear 53, an extension rod 1 54 is fixedly connected to the driving gear 53, a driven gear 56 is fixedly connected inside the extension rod 1 54, a positioning frame 59 is fixedly connected to one end of the mounting plate 51, the outer side of the driving gear 53 is rotatably connected to the mounting plate 51, an end of the mounting plate 51 away from the driving gear 53 is rotatably connected to the driven gear 56, an extension rod 2 57 is fixedly connected to one end of the driven gear 56, and a worm 2 58 is fixedly connected inside the extension rod 2 57;

[0054] The mounting plate 51 is fixedly connected to the moving plate 45, and serves as the mounting base for the motor 52 and other components, providing sufficient strength and stability to support the motor 52 and the transmission components. The motor 52 is mounted on the mounting plate 51, and is the power source of the rotation drive assembly 5. The driving gear 53 is fixedly connected to the driving end of the motor 52, and is used to transmit the rotational motion of the motor 52 to the extension rod 1 54. The design of the driving gear 53 helps to change the direction of force transmission, so that the driven gear 56 can synchronously rotate in the opposite direction. Secondly, the extension rod 1 54 and the worm 1 55 inside it realize power conversion, and the driven gear 56 meshes with the driving gear 53. The driven gear 56 is designed to receive power from the driving gear 53 and transmit it to the extension rod 2 57. Subsequently, the extension rod 2 57 is fixedly connected to one end of the driven gear 56, and a worm 2 58 is fixedly connected inside. The extension rod 2 57 transmits the power of the driven gear 56 to the worm, thereby achieving the effect of synchronous rotation adjustment;

[0055] like Figure 3 , Figure 5 and Figure 6As shown, the flip assembly 6 comprises a worm wheel 61 and a positioning ring 64, the outer side of the positioning ring 64 is fixedly connected to the inner side of the positioning frame 59 in an array shape, the outer side of the worm wheel 61 is meshedly connected to the worm 1 55 and the worm 2 58 respectively, the outer side of the worm wheel 61 is fixedly connected to a support seat 62, both sides of the support seat 62 are fixedly connected to a rotating block 63, the interior of the positioning ring 64 is provided with a rotating groove 65, and the outer side of the rotating block 63 is rotatably connected to the positioning ring 64 through the rotating groove 65;

[0056] As the core component of the rotary drive assembly 5, the worm wheel 61 is tightly meshed with the worm 1 55 and the worm 2 58, ensuring that the rotational motion of the worm can be smoothly converted into the rotational motion of the worm wheel 61 itself. This conversion mechanism is the basis for the operation of the entire drive assembly. The outer side of the positioning ring 64 is fixedly connected to the inside of the positioning frame 59 in an array shape. This design ensures the stability of the positioning ring 64 during the flipping process. The support seat 62 is designed to provide a stable support foundation for the worm wheel 61 to ensure that it remains stable under high-load working conditions. The connection between the support seat 62 and the rotating block 63 enables the rotating block 63 to maintain a stable rotational position during the rotation process, thereby ensuring the smooth operation of the entire rotary drive assembly 5. In addition, a rotating groove 65 is provided inside the positioning ring 64, and the rotating block 63 can rotate around the positioning ring 64. This design allows the flipping action to rotate smoothly and ensures stability during rotation;

[0057] like Figure 5 and Figure 6 As shown, the clamping and adjusting assembly 7 comprises a clamping frame 71 fixedly connected to both ends of the support seat 62, a clamping block 72 is fixedly connected inside the clamping frame 71, a clamping clamp 73 is slidably connected to the top of the support seat 62, both sides of the clamping clamp 73 are provided with a clamping groove 74, the clamping block 72 is engaged with the clamping groove 74, and one end of the clamping clamp 73 is provided with a pushing groove 75;

[0058] The bracket 71 is designed to be fixedly connected to both ends of the support seat 62. Its main function is to provide necessary support and fixation to ensure the stability and reliability of the entire device. The clamping block 72 is a component directly involved in the clamping action. In order to further optimize the clamping effect, a groove is specially opened in the middle part of the clamping block 72. The shape of this groove is an arc shape. This design can not only effectively prevent falling during the flipping process, but also ensure that the wafer can be safely placed in the groove. In this way, the groove can minimize the potential damage to the wafer caused by the clamping force, thereby protecting the integrity and quality of the wafer. The top end of the clamping clamp 73 is designed to be slidably connected to the support seat 62. This design makes The clamping clamp 73 can be flexibly adjusted left and right along the support seat 62, so that the clamping clamp 73 can be accurately adjusted according to actual needs to ensure the accuracy and efficiency of the clamping action. In addition, card slots 74 are provided on both sides of the clamping clamp 73, and these card slots 74 are specifically used to engage with the card block 72. Through this engaging mechanism, it can be ensured that after adjusting to the appropriate position, the clamping clamp 73 can remain fixed, thereby providing a stable and reliable clamping effect. The pushing groove 75 is designed to receive the pushing force so that the operator can easily apply the pushing force. Through the pushing groove 75, the operator can easily realize the opening and closing action of the clamping clamp 73, thereby facilitating the loading and unloading and clamping operations of the wafer.

[0059] Working principle:

[0060] like Figure 1-Figure 6 As shown:

[0061] When in use: first, the wafer is placed on the side of the carrier rod 23 close to the cylinder 1 31 and is placed on the device, and the spacing between the hole groove on the carrier rod 23 and the clamping adjustment component 7 is the same. Then, the cylinder 2 41 is started, and the cylinder 2 41 immediately drives the support plate 42 at the top thereof to move synchronously. Then, under the drive of the cylinder 2 41, the rotary drive component 5 at the top of the support plate 42 is synchronously moved to an area parallel to the wafer on the carrier rod 23. At this time, the cylinder 3 44 is started, so that the two moving plates 45 are close to each other. The clamping clamp 73 then clamps the wafer. In this way, the material can be driven to the top. Then, the cylinder 31 is started, and the cylinder 31 pushes the active moving seat 32 to slide on the limit slide rail 34. Since the top of the active moving seat 32 and the top of the driven moving seat 33 are connected to the rotating drive assembly 5 through the clamping assembly 4, the active moving seat 32 can achieve a synchronous sliding effect with the driven moving seat 33 during the movement. When the wafer needs to be flipped, the motor 52 is started, and the motor 52 drives the extension gear on the active gear 53. The extension rod 1 54 rotates, and at this time, the driven gear 56 meshing with the driving gear 53 will also rotate. Under the connection of the extension rod 2 57, the worm 2 58 also starts to rotate. The extension rod 1 54 and the worm 2 58 rotate in opposite directions, but they work together to enable the worm wheel 61 to achieve a rotation effect under the meshing connection between the worm 1 55 and the worm 2 58. The worm wheel 61 transmits the rotation force to the rotating block 63 on the support seat 62 and makes it rotate in the positioning ring 64. In order to avoid deviation, the design of the rotating groove 65 ensures that the worm wheel 61 is It can maintain a stable working position during rotation. In this way, the wafer clamped on the clamping clamp 73 can achieve a flipping effect. When wafers of different sizes need to be adjusted, the clamping clamp 73 is pushed by pushing the groove 75, so that the card slot 74 slides on the card block 72, thereby quickly completing the spacing adjustment of the clamping clamp 73, so that wafers of different sizes are easily broken by external pressure or collision. Therefore, it only needs to adjust the clamping range to a diameter that matches the wafer size, and there is no need to apply pressure to the wafer.

[0062] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A wafer loading device, characterized in that: include: Bottom plate (1); Support assembly (2); the support assembly (2) includes a mounting frame (21) fixedly connected to both sides of the top end of the bottom plate (1); A feeding assembly (3); the feeding assembly (3) comprises a cylinder 1 (31) fixedly connected to one side of the top end of the bottom plate (1), wherein the driving end of the cylinder 1 (31) is fixedly connected to an active moving seat (32); The clamping assembly (4) comprises a second cylinder (41) fixedly connected to the active movable seat (32), the driving end of the second cylinder (41) being fixedly connected to a support plate (42), both sides of the support plate (42) being provided with a slide groove (43), a movable plate (45) being slidably connected to the slide groove (43), and the adjacent ends of the two movable plates (45) being fixedly connected to a third cylinder (44); A rotary drive assembly (5); the rotary drive assembly (5) comprises a mounting plate (51) fixedly connected to the movable plate (45), a motor (52) being mounted on the mounting plate (51), a driving gear (53) being fixedly connected to the driving end of the motor (52), an extension rod (54) being fixedly connected to the driving gear (53), and a driven gear (56) being fixedly connected to the interior of the extension rod (54); A turning assembly (6); the turning assembly (6) comprises a worm wheel (61) and a positioning ring (64); the outer side of the worm wheel (61) is fixedly connected to a support seat (62); both sides of the support seat (62) are fixedly connected to a rotating block (63); and a rotating groove (65) is provided inside the positioning ring (64); A clamping adjustment component (7); the clamping adjustment component (7) comprises a clamping frame (71) fixedly connected to both ends of a support seat (62), a clamping block (72) being fixedly connected inside the clamping frame (71), a clamping clamp (73) being slidably connected to the top end of the support seat (62), clamping grooves (74) being provided on both sides of the clamping clamp (73), and a pushing groove (75) being provided at one end of the clamping clamp (73).

2. A wafer loading device according to claim 1, characterized in that: The mounting frame (21) is fixedly connected to a support frame (22), and the interiors of the two support frames (22) are fixedly connected to object-carrying rods (23).

3. A wafer loading device according to claim 1, characterized in that: The top end of the base plate (1) is fixedly connected to a limiting slide rail (34), the bottom end of the active moving seat (32) is slidably connected to one end of the limiting slide rail (34), and the end of the limiting slide rail (34) away from the active moving seat (32) is slidably connected to a driven moving seat (33).

4. The wafer loading device according to claim 1, characterized in that: One end of the mounting plate (51) is fixedly connected to a positioning frame (59); the outer side of the driving gear (53) is rotatably connected to the mounting plate (51); an end of the mounting plate (51) away from the driving gear (53) is rotatably connected to a driven gear (56); one end of the driven gear (56) is fixedly connected to a second extension rod (57); and a second worm (58) is fixedly connected to the interior of the second extension rod (57).

5. A wafer loading device according to claim 4, characterized in that: The outer sides of the worm wheel (61) are meshingly connected to the worm gear 1 (55) and the worm gear 2 (58) respectively.

6. A wafer loading device according to claim 4, characterized in that: The outer sides of the positioning rings (64) are fixedly connected to the inside of the positioning frame (59) in an array shape.

7. The wafer loading device according to claim 1, characterized in that: The outer side of the rotating block (63) is rotatably connected to the positioning ring (64) via a rotating groove (65).

8. The wafer loading device according to claim 1, characterized in that: The clamping block (72) is engaged with the clamping slot (74).

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