Heat dissipation assembly and heat dissipation system

Abstract

The embodiment of the invention provides a heat dissipation assembly and a heat dissipation system, the heat dissipation assembly and the heat dissipation system are applied to the heat dissipation system, and the heat dissipation system comprises a compressor, a condenser assembly and a one-way valve which are connected in sequence; the heat dissipation assembly comprises a throttling device and a first liquid cooling plate, and the first liquid cooling plate is used for absorbing heat dissipated by the target equipment; the first liquid cooling plate comprises a liquid storage and cold accumulation chamber and an evaporation flow channel, an inlet of the liquid storage and cold accumulation chamber is used for being connected with an outlet of the one-way valve, the throttling device is connected between the outlet of the liquid storage and cold accumulation chamber and an inlet of the evaporation flow channel, and an outlet of the evaporation flow channel is used for being connected with an inlet of the compressor; and a preset volume of high-pressure refrigerant liquid is frequently stored in the liquid storage and cold accumulation cavity. Refrigerant liquid stored in the liquid storage and cold accumulation cavity is throttled and then conveyed to the evaporation flow channel to achieve heat dissipation and cooling of target equipment, the quick response refrigeration requirement of the heat dissipation system is met in the mode, refrigerating capacity output can be achieved once the compressor is started, and extra energy consumption is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a heat dissipation component and a heat dissipation system. Background Art

[0002] In the field of laser cutting and welding, or other similar scenarios with intermittent high heat flux density heat load, the heat load is discontinuous and the upper and lower limits differ greatly, which requires the cooling system to be able to quickly increase or decrease the load according to the load changes to maintain a relatively stable temperature.

[0003] In the process of implementing the present invention, the inventors found that the prior art has at least the following problems: Traditional refrigeration systems use inverters to adjust the compressor speed to adapt to load changes, but this generally only covers the 20~100% cooling capacity segment. In the 0~20% cooling capacity segment, the compressor start-stop control scheme is still used. It often takes a while for the compressor to start and output sufficient cooling capacity. That is, when the load of the cooled equipment increases from a low level, it may also take a while to wait, which restricts the working time of the cooled equipment.

[0004] Therefore, when the load is low, some refrigeration systems throttle and reduce the pressure of high-temperature and high-pressure refrigerant carrying heat and pass it into the evaporator to reduce the cooling output of the evaporator; when the load increases, the hot gas bypass is closed to allow the system to quickly restore the rated cooling output. However, in order to achieve a rapid response to load changes, the compressor of this type of system must continue to run when in no-load standby mode, and long-term standby mode results in high energy consumption. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a heat dissipation component and a heat dissipation system, which can at least improve the above-mentioned problems of slow system response and high energy consumption during long-term standby.

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation assembly, which can be applied to a heat dissipation system, wherein the heat dissipation system comprises: a compressor, a condenser assembly, and a one-way valve connected in sequence; The heat dissipation assembly includes a throttling device and a first liquid cooling plate, wherein the first liquid cooling plate is used to absorb the heat emitted by the target device; The first liquid cooling plate comprises a liquid storage and cold storage chamber and an evaporation flow channel, wherein the inlet of the liquid storage and cold storage chamber is used to connect to the outlet of the one-way valve, the throttling device is connected between the outlet of the liquid storage and cold storage chamber and the inlet of the evaporation flow channel, and the outlet of the evaporation flow channel is used to connect to the inlet of the compressor; A preset volume of high-pressure refrigerant liquid is always stored in the liquid storage and cold storage chamber.

[0007] In some possible implementations, the liquid-cold storage chamber and the evaporation channel are integrated and arranged adjacent to each other, and heat exchange is performed between the liquid-cold storage chamber and the evaporation channel.

[0008] In some possible implementations, when the heat dissipation system is in operation, the compressor outputs refrigerant that enters the condenser assembly for condensation, the condensed refrigerant passes through the one-way valve and enters the liquid storage cold storage chamber for cooling, the cooled refrigerant passes through the throttling device to throttle and reduce the pressure before entering the evaporation channel to cool and dissipate heat for the target device.

[0009] In some possible implementations, the throttling device includes a solenoid valve and a throttle valve connected in series; When the compressor stops, the closed solenoid valve is used to prevent the refrigerant stored in the liquid storage and cold storage chamber from flowing into the evaporation flow channel.

[0010] In some possible implementations, the throttling valve includes an electronic expansion valve or a capillary tube or a thermal expansion valve.

[0011] In a second aspect, an embodiment of the present application provides another heat dissipation component, which can be applied to a heat dissipation system, wherein the heat dissipation system comprises: a compressor, a condenser component, and a one-way valve connected in sequence; the heat dissipation component comprises a throttling device, a liquid reservoir, and a second liquid cooling plate, wherein the second liquid cooling plate is used to absorb heat emitted by a target device; The second liquid cooling plate comprises an evaporation flow channel, wherein the inlet of the liquid reservoir is used to connect to the outlet of the one-way valve, the throttling device is connected between the outlet of the liquid reservoir and the inlet of the evaporation flow channel, and the outlet of the evaporation flow channel is used to connect to the inlet of the compressor; A preset volume of high-pressure refrigerant liquid is always stored in the liquid accumulator.

[0012] In some possible implementations, the throttling device includes a solenoid valve and a throttle valve connected in series; When the compressor stops, the closed solenoid valve is used to prevent the refrigerant stored in the accumulator from flowing into the evaporation flow channel.

[0013] In some possible implementations, the throttling valve includes an electronic expansion valve or a capillary tube or a thermal expansion valve.

[0014] In a third aspect, an embodiment of the present application provides a heat dissipation system, comprising: a compressor, a condenser assembly, a one-way valve, a liquid reservoir, and a heat dissipation assembly connected in sequence, wherein the heat dissipation assembly is the heat dissipation assembly described in any one of the first aspect or the heat dissipation assembly described in any one of the second aspect.

[0015] In some possible implementations, the condenser assembly includes a condensing fan and a condensing coil, the inlet of the condensing coil is connected to the outlet of the compressor, the outlet of the condensing coil is connected to the inlet of the one-way valve, and the condensing fan is used to blow air to dissipate heat for the condensing coil; when the compressor stops running, the one-way valve is used to prevent the refrigerant in the liquid reservoir from flowing back into the condensing coil after the temperature and pressure of the condensing coil are reduced.

[0016] Compared with the prior art, the technical solution provided by this application has at least the following beneficial effects: Through the above technical solution, when the target device needs to be cooled, after the compressor is started and before a sufficient amount of liquid refrigerant flows into the one-way valve inlet, the high-pressure refrigerant liquid stored in the liquid storage chamber or the liquid storage device is throttled and then transported to the evaporation flow channel to achieve heat dissipation and cooling of the target device. The above method can achieve the rapid response of the heat dissipation system to the cooling demand, and the cooling capacity can be output as soon as the compressor is started, without additional energy consumption.

[0017] In summary, the present application can improve the problems of slow system response and high energy consumption during long-term standby in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 A schematic diagram of a heat dissipation system architecture provided for one embodiment of the present application; Figure 2 A schematic diagram of the structure of a throttling device in a heat dissipation system provided by an embodiment of the present application; Figure 3 A schematic diagram of another heat dissipation system architecture provided for an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] Figure 1A schematic diagram of a heat dissipation system architecture provided for one embodiment of the present application.

[0022] Reference Figure 1 As shown, the heat dissipation system may include a compressor 100, a condenser assembly 200, a one-way valve 300 and a heat dissipation assembly connected in sequence. The heat dissipation assembly includes a first liquid cooling plate 400, and the compressor 100, the condenser assembly 200, the one-way valve 300 and the first liquid cooling plate 400 are connected in sequence to form a refrigerant circulation loop.

[0023] In some embodiments, the first liquid cooling plate 400 can be arranged adjacent to the target device to absorb the heat emitted by the target device. It is understood that the adjacent arrangement here can refer to the first liquid cooling plate 400 being arranged in close contact with the target device, or can refer to the first liquid cooling plate 400 being thermally connected to the target device through a heat conductive member. The target device can be an electronic device with a heat load scenario with intermittent high heat flux density, for example, a device for laser cutting and welding scenarios.

[0024] In some embodiments, the first liquid cooling plate 400 may include a liquid storage and cold storage chamber 401 and an evaporation flow channel 402. The inlet of the liquid storage and cold storage chamber 401 is connected to the outlet of the one-way valve 300, the outlet of the liquid storage and cold storage chamber 401 is connected to the inlet of the evaporation flow channel 402, and the outlet of the evaporation flow channel 402 is connected to the inlet (or suction port) of the compressor 100.

[0025] In some embodiments, a preset volume of high-pressure refrigerant liquid may be stored in the liquid storage and cold storage chamber 401 at all times.

[0026] Reference Figure 1 As shown, in some embodiments, the heat dissipation component also includes a throttling device 403, which can be arranged between the outlet of the liquid storage and cold storage chamber 401 and the inlet of the evaporation flow channel 402, that is, the throttling device 403 is connected between the outlet of the liquid storage and cold storage chamber 401 and the inlet of the evaporation flow channel 402, and is used to throttle and reduce the pressure of the refrigerant output from the liquid storage and cold storage chamber 401.

[0027] Reference Figure 1 As shown, in some embodiments, the condenser assembly 200 includes a condensing fan 201 and a condensing coil 202, the inlet of the condensing coil 202 is connected to the outlet (or exhaust port) of the compressor 100, and the outlet of the condensing coil 202 is connected to the inlet of the one-way valve, and the condensing fan 201 is used to blow air to dissipate heat for the condensing coil, that is, forced convection heat exchange between the condensing coil 202 and the ambient gas is achieved through the condensing fan 201.

[0028] Reference Figure 1As shown, when the heat dissipation system is in operation, the compressor 100 outputs refrigerant into the condenser assembly 200 for condensation. For example, high-temperature and high-pressure refrigerant gas can be output and enter the condenser assembly 200 for condensation. The condensed refrigerant (for example, medium-temperature and high-pressure refrigerant liquid) passes through the one-way valve 300 and enters the liquid storage cold storage chamber 401 for cooling. The cooled refrigerant passes through the throttling device 403 and is throttled and depressurized before entering the evaporation channel 402 to cool and dissipate heat for the target device. Specifically, the throttling device 403 throttles the refrigerant output from the liquid storage cold storage chamber 401 into a low-temperature and low-pressure gas-liquid mixture (or refrigerant liquid). After entering the evaporation channel 402, the throttled refrigerant absorbs heat and evaporates into a low-temperature and low-pressure refrigerant gas, which returns to the compressor 100 through the pipeline to continue circulating.

[0029] In some application scenarios, after the compressor 100 stops running, the refrigerant liquid retained in the liquid storage cold storage chamber 401 migrates to the condensing coil 202 with the pressure gradient, resulting in insufficient refrigerant liquid in front of the throttling device 403 when the compressor 100 is started again and insufficient cooling capacity output, thereby affecting the cooling response speed of the heat dissipation system. In this embodiment, by setting the one-way valve 300, after the compressor 100 stops running, the refrigerant liquid retained in the liquid storage cold storage chamber 401 can be effectively prevented from migrating to the condensing coil 202 with the pressure gradient after the condensing coil 202 of the condenser assembly 200 is cooled and depressurized, effectively ensuring that the refrigerant liquid in front of the throttling device 403 is sufficient when the compressor 100 is started again, that is, there is sufficient cooling capacity output, thereby improving the cooling response speed of the heat dissipation system.

[0030] In some application scenarios, after the compressor 100 stops running, since the temperature and pressure in the evaporation flow channel 402 are lower than those in other pipelines, the refrigerant in the high-pressure pipeline migrates to the low-pressure pipeline through the throttling device. In order to effectively overcome the above problem, refer to Figure 2 As shown, the throttling device 403 includes at least one solenoid valve 403a and a throttle valve 403b. In this embodiment, the throttling device 403 includes the solenoid valve 403a and the throttle valve 403b connected in series, so that after the compressor 100 stops running, the solenoid valve 403a and the throttle valve 403b can be controlled to close, effectively preventing the refrigerant in the high-pressure pipeline from migrating to the low-pressure pipeline through the throttling device, such as the refrigerant liquid stored in the liquid storage cold storage chamber 401 from flowing into the evaporation flow channel 402. Further, it can also ensure that the refrigerant liquid in front of the throttling device 403 is sufficient when the compressor 100 is started again, so as to provide sufficient cooling capacity output. Figure 1The heat dissipation system shown, through the normally closed solenoid valve 403a with good shutoff performance and the general throttle valve 403b, can effectively ensure that the high and low pressure pipelines are cut off in time in the event of an accidental power failure of the system while fully maintaining the fast start-up characteristics, thereby reducing the risk caused by refrigerant migration. It can be understood that the throttle valve 403b can include an electronic expansion valve, a capillary tube, or a thermal expansion valve.

[0031] In some embodiments, the liquid storage cold storage chamber 401 and the evaporation flow channel 402 are arranged adjacent to each other, that is, the liquid storage cold storage chamber 401 and the evaporation flow channel 402 can be integrated into one body, and heat exchange is performed between the liquid storage cold storage chamber 401 and the evaporation flow channel 402. On the one hand, it is equivalent to adding a cold storage function to the first liquid cooling plate, which can stabilize the temperature of the liquid cooling plate. On the other hand, in the process of load reduction, it can absorb part of the excess cooling capacity of the refrigeration system, delay the shutdown of the compressor, and reduce the number of compressor starts and stops to a certain extent.

[0032] Figure 3 A schematic diagram of the architecture of another heat dissipation system provided in accordance with an embodiment of the present application.

[0033] Reference Figure 3 As shown, the heat dissipation system may include a compressor 100, a condenser assembly 200, a one-way valve 300 and a heat dissipation assembly connected in sequence. The heat dissipation assembly includes a liquid reservoir 500 and a second liquid cooling plate 600.

[0034] In some embodiments, the second liquid cooling plate 600 can be disposed adjacent to the target device to absorb the heat emitted by the target device. It is understood that the adjacent arrangement here can refer to the second liquid cooling plate 600 being disposed in close contact with the target device, or can refer to the second liquid cooling plate 600 being thermally connected to the target device via a heat conducting member.

[0035] In some embodiments, the liquid reservoir 500 and the second liquid cooling plate 600 are independent devices, and the second liquid cooling plate 600 may include an evaporation channel 602. The inlet of the liquid reservoir 500 is connected to the outlet of the one-way valve 300, the outlet of the liquid reservoir 500 is connected to the inlet of the evaporation channel 602, and the outlet of the evaporation channel 602 is connected to the inlet of the compressor 100.

[0036] In some embodiments, a preset volume of high-pressure refrigerant liquid may be stored in the liquid reservoir 500 at all times.

[0037] Reference Figure 3 As shown, in some embodiments, the heat dissipation assembly also includes a throttling device 603, which can be arranged between the outlet of the liquid reservoir 500 and the inlet of the evaporation flow channel 602, that is, the throttling device 603 is connected between the outlet of the liquid reservoir 500 and the inlet of the evaporation flow channel 602, and is used to throttle and reduce the pressure of the refrigerant output from the liquid reservoir 500.

[0038] Reference Figure 3 As shown, in some embodiments, the condenser assembly 200 includes a condensing fan 201 and a condensing coil 202, the inlet of the condensing coil 202 is connected to the outlet of the compressor 100, the outlet of the condensing coil 202 is connected to the inlet of the one-way valve, and the condensing fan 201 is used to blow air for the condensing coil to dissipate heat.

[0039] Reference Figure 3 As shown, when the heat dissipation system is in operation, the compressor 100 outputs refrigerant into the condenser assembly 200 for condensation, for example, it can output high-temperature and high-pressure refrigerant gas, which enters the condenser assembly 200 for condensation. The condensed refrigerant (for example, high-pressure refrigerant liquid) enters the liquid storage tank 500 through the one-way valve 300, and the refrigerant enters the evaporation flow channel 602 after throttling and reducing the pressure through the throttling device 603 to cool and dissipate heat for the target device. Specifically, after entering the evaporation flow channel 602, the refrigerant absorbs heat and evaporates into low-temperature and low-pressure refrigerant gas, and returns to the compressor 100 through the system pipeline to continue the cycle.

[0040] In some application scenarios, after the compressor 100 stops running, the condensing coil 202 of the condenser assembly 200 cools down and reduces pressure, and the refrigerant liquid retained in the liquid reservoir 500 migrates to the condensing coil 202 along with the pressure gradient, resulting in insufficient refrigerant liquid in front of the throttling device 603 when the compressor 100 is restarted and insufficient cooling capacity is output, thereby affecting the cooling response speed of the heat dissipation system. In this embodiment, by setting the one-way valve 300, after the compressor 100 stops running, the refrigerant liquid retained in the liquid reservoir 500 can be effectively prevented from migrating to the condensing coil 202 along with the pressure gradient after the condensing coil 202 of the condenser assembly 200 cools down and reduces pressure, effectively ensuring that the refrigerant liquid in front of the throttling device 603 is sufficient when the compressor 100 is restarted, that is, there is sufficient cooling capacity output, thereby improving the cooling response speed of the heat dissipation system.

[0041] In some application scenarios, after the compressor 100 stops running, since the temperature and pressure in the evaporation flow channel 602 are lower than those in other pipelines, the refrigerant in the high-pressure pipeline migrates to the low-pressure pipeline through the throttling device. In order to effectively overcome the above problem, refer to Figure 2 As shown, the throttling device 603 includes at least one electromagnetic valve and a throttling valve. In this embodiment, the throttling device 603 includes an electromagnetic valve and a throttling valve connected in series, so that after the compressor 100 stops running, the electromagnetic valve and the throttling valve can be controlled to close, effectively preventing the refrigerant in the high-pressure pipeline from migrating to the low-pressure pipeline through the throttling device, and further ensuring that the refrigerant liquid in front of the throttling device 603 is sufficient when the compressor 100 is started again, so as to provide sufficient cooling capacity output. It can be understood that the throttling valve can include an electronic expansion valve or a capillary tube or a thermal expansion valve.

[0042] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0043] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0044] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0045] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0046] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to perform some steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program codes.

[0047] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation component, characterized in that: Applied to a heat dissipation system, the heat dissipation system comprises: a compressor, a condenser assembly, and a one-way valve connected in sequence; The heat dissipation assembly includes a throttling device and a first liquid cooling plate, wherein the first liquid cooling plate is used to absorb the heat emitted by the target device; The first liquid cooling plate comprises a liquid storage and cold storage chamber and an evaporation flow channel, wherein the inlet of the liquid storage and cold storage chamber is used to connect to the outlet of the one-way valve, the throttling device is connected between the outlet of the liquid storage and cold storage chamber and the inlet of the evaporation flow channel, and the outlet of the evaporation flow channel is used to connect to the inlet of the compressor; A preset volume of high-pressure refrigerant liquid is always stored in the liquid storage and cold storage chamber.

2. The heat dissipation assembly according to claim 1, characterized in that: The liquid-cold-storage chamber and the evaporation channel are arranged adjacently and integratedly, and heat exchange is performed between the liquid-cold-storage chamber and the evaporation channel.

3. The heat dissipation assembly according to claim 2, characterized in that: When the heat dissipation system is in working state, the compressor outputs refrigerant which enters the condenser assembly for condensation, the condensed refrigerant passes through the one-way valve and enters the liquid storage cold storage chamber for cooling, the cooled refrigerant passes through the throttling device for throttling and pressure reduction and then enters the evaporation flow channel to cool and dissipate heat for the target device.

4. The heat dissipation assembly according to claim 1, characterized in that: The throttling device comprises a solenoid valve and a throttle valve connected in series; When the compressor stops, the closed solenoid valve is used to prevent the refrigerant stored in the liquid storage and cold storage chamber from flowing into the evaporation flow channel.

5. The heat dissipation assembly according to claim 4, characterized in that: The throttling valve comprises an electronic expansion valve, a capillary tube or a thermal expansion valve.

6. A heat dissipation component, characterized in that: Applied to a heat dissipation system, the heat dissipation system comprises: a compressor, a condenser assembly, and a one-way valve connected in sequence; the heat dissipation assembly comprises a throttling device, a liquid reservoir, and a second liquid cooling plate, the second liquid cooling plate being used to absorb the heat emitted by the target device; The second liquid cooling plate comprises an evaporation flow channel, wherein the inlet of the liquid reservoir is used to connect to the outlet of the one-way valve, the throttling device is connected between the outlet of the liquid reservoir and the inlet of the evaporation flow channel, and the outlet of the evaporation flow channel is used to connect to the inlet of the compressor; A preset volume of high-pressure refrigerant liquid is always stored in the liquid accumulator.

7. The heat dissipation assembly according to claim 6, characterized in that: The throttling device comprises a solenoid valve and a throttle valve connected in series; When the compressor stops, the closed solenoid valve is used to prevent the refrigerant stored in the accumulator from flowing into the evaporation flow channel.

8. The heat dissipation assembly according to claim 7, characterized in that: The throttling valve comprises an electronic expansion valve, a capillary tube or a thermal expansion valve.

9. A heat dissipation system, characterized in that: include: A compressor, a condenser assembly, a one-way valve and a heat dissipation assembly connected in sequence, wherein the heat dissipation assembly is the heat dissipation assembly described in any one of claims 1-5 or the heat dissipation assembly described in any one of claims 6-8.

10. The heat dissipation system according to claim 9, characterized in that: The condenser assembly includes a condensing fan and a condensing coil, the inlet of the condensing coil is connected to the outlet of the compressor, the outlet of the condensing coil is connected to the inlet of the one-way valve, and the condensing fan is used to blow air to dissipate heat for the condensing coil; When the compressor stops running, the one-way valve is used to prevent the refrigerant in the accumulator from flowing back into the condensing coil after the temperature and pressure of the condensing coil are reduced.

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