Ultrasonic transducer, four-dimensional ultrasonic imaging method and device

Abstract

The present application provides an ultrasonic transducer, a four-dimensional ultrasonic imaging method and device, and relates to the field of medical equipment technology. The ultrasonic transducer includes an array element, a frame, a working module and an excitation channel; there are multiple array elements; the frame includes a mounting portion, and the array element is mounted on the mounting portion; the frame is a deformable structure; there are multiple working modules, and each working module includes the same number of array elements; there are multiple excitation channels, and each excitation channel corresponds to multiple working modules; the excitation channel is used to transmit an excitation signal to the working module to obtain a sub-image. By twisting and deforming the frame, the relative position relationship between the array elements can be adjusted, so that a larger scanning range can be obtained, and scanning of complex environments can be achieved, as well as improving imaging depth and resolution; there are multiple excitation channels, and each excitation channel corresponds to multiple working modules, thereby reducing the number of excitation channels and achieving structural optimization of the excitation channels.

Description

Technical Field

[0001] The present application relates to the technical field of medical equipment, and in particular to an ultrasonic transducer, a four-dimensional ultrasonic imaging method and a device. Background Art

[0002] With the aging of the population, the incidence of arrhythmias is increasing year by year. Atrial fibrillation is the most common rapid arrhythmia in clinical practice, among which atrial fibrillation can easily lead to stroke, heart failure and even death. Interventional catheter radiofrequency ablation is the main surgical method for the treatment of paroxysmal atrial fibrillation.

[0003] For paroxysmal atrial fibrillation, the commonly used surgical method is radiofrequency ablation under the guidance of intracardiac echocardiography (ICE) imaging catheter. Ultrasound is used during the operation to accurately construct the cardiac cavity structure and navigate to guide precise ablation. The tip of the ICE catheter is equipped with an ultrasonic transducer, which is used to transmit ultrasonic waves and receive echoes. The ultrasonic transducer of the existing ICE catheter has defects such as weak signal, large crosstalk, insufficient imaging depth and poor resolution. Summary of the invention

[0004] The purpose of the present application is to overcome the defects of the prior art and to provide an ultrasonic transducer, a four-dimensional ultrasonic imaging method and a device to solve the problems in the prior art.

[0005] To solve the above problems, a first aspect of an embodiment of the present application provides an ultrasonic transducer, including an array element, a frame, a working module and an excitation channel;

[0006] There are multiple array elements;

[0007] The frame comprises a mounting portion, the array elements are mounted on the mounting portion, and the mounting portion corresponds to the array elements; the array elements are arranged in sequence along a preset direction, and any two adjacent array elements are arranged at intervals;

[0008] The frame is a deformable structure; before the ultrasonic transducer is used, the frame is twisted and deformed in advance based on the shape of the object to be scanned, so that a preset angle is formed between two adjacent array elements;

[0009] There are multiple working modules, and each of the working modules includes the same number of array elements; wherein the set of array elements of all the working modules includes all the array elements on the frame;

[0010] There is at least one array element in any of the working modules, which is different from the array elements in other working modules; and one or more array elements in any of the working modules are the same as one or more array elements in other working modules;

[0011] There are multiple excitation channels, each of which corresponds to multiple working modules, and the working modules corresponding to any two excitation channels are different; wherein the excitation channel is used to transmit an excitation signal to the working module to obtain a sub-image.

[0012] In a possible implementation manner, one of the array elements is specified in the working module and is set as a preset array element; wherein the preset array elements in any two of the working modules are two different array elements;

[0013] The excitation channel includes a main control circuit, a sub-control circuit and a switch module; each of the main control circuits corresponds to a plurality of sub-control circuits; each of the sub-control circuits corresponds to one of the working modules; the switch module is used to control the on-off between the main control circuit and the sub-control circuit, wherein, for any of the excitation channels, at the same time, the switch module can only control the main control circuit to establish a communication connection with one of the sub-control circuits;

[0014] The sub-control circuit is communicatively connected with the preset array element in the corresponding working module; wherein, after the sub-control circuit establishes a communication connection with the corresponding main control circuit, the preset array element connected to the sub-control circuit and all the array elements in the working module to which it belongs work synchronously and generate a sub-image.

[0015] In a possible implementation manner, all the working modules are numbered and sorted in sequence according to the arrangement order of the preset array elements in the working modules on the frame; for two working modules with adjacent numbers, the preset array elements of the two modules are arranged adjacently on the frame;

[0016] The excitation channel is electrically connected to a control module, wherein the control module sends the excitation signal to each of the working modules in sequence according to the order of the working modules.

[0017] In a possible implementation, the array element includes a matching portion, a piezoelectric layer, and a backing portion stacked along a set direction; the backing portion includes a first conductive backing unit and a second conductive backing unit, wherein an insulating spacer is provided between the first conductive backing unit and the second conductive backing unit;

[0018] An electrode is disposed on the outer surface of the piezoelectric layer, wherein the matching portion, the first conductive backing unit and the second conductive backing unit are all connected to the electrode;

[0019] The matching part includes one matching layer; or, the matching part includes a plurality of matching layers stacked along the set direction.

[0020] In a possible implementation, the ultrasonic transducer is connected to a circuit board module, the circuit board module includes a substrate, a signal terminal and a ground terminal, and the signal terminal and the ground terminal are both integrated on the substrate;

[0021] There are a plurality of signal terminals, and any two of the signal terminals are insulated from each other; the signal terminals correspond to the array elements, wherein the first conductive backing unit is electrically connected to the corresponding signal terminal;

[0022] There is one grounding terminal, and each of the second conductive backing units is electrically connected to the grounding terminal; or there are multiple grounding terminals, and each of the grounding terminals is electrically connected to each other, and the grounding terminals correspond to the array elements, wherein the second conductive backing units are electrically connected to the corresponding grounding terminals.

[0023] In a possible implementation manner, the signal terminal is connected to the first conductive backing unit via a first conductive member, and the ground terminal is connected to the second conductive backing unit via a second conductive member;

[0024] The substrate comprises a rigid circuit board, and the first conductive member and the second conductive member are flexible or elastic; or the substrate comprises a flexible circuit board, and the first conductive member and the second conductive member comprise conductive glue.

[0025] In a possible implementation, the circuit board module is foldable or bendable, wherein the circuit board module is used to be packaged in a catheter of an ultrasonic imaging device.

[0026] In a possible implementation manner, the mounting portion is flush with the surface of the frame; or,

[0027] The mounting portion is recessed into the surface of the frame; or,

[0028] The mounting portion protrudes from a surface of the frame.

[0029] A second aspect of an embodiment of the present application provides a four-dimensional ultrasonic imaging method, which is applied to the ultrasonic transducer as described above, comprising:

[0030] According to the number of array elements and the arrangement order of the array elements on the frame, all the array elements of the ultrasonic transducer are divided into a plurality of working modules; wherein each of the working modules includes the same number of array elements;

[0031] Performing a three-dimensional image generation operation to generate the three-dimensional image;

[0032] Repeating the three-dimensional image generation operation, and synthesizing the generated three-dimensional images according to the time sequence of generation to generate a four-dimensional ultrasound image;

[0033] Among them, the operation of generating the three-dimensional image includes: transmitting an excitation signal to each of the working modules in sequence according to a preset order; when the working module receives the excitation signal, all the array elements in the working module work synchronously and generate a sub-image; sorting the sub-images in sequence according to the generation time of the sub-images; rotating the sub-images by a preset angle, moving the sub-images by a preset distance, and aligning two adjacent sub-images; merging all the generated sub-images to obtain the three-dimensional image.

[0034] A third aspect of the embodiments of the present application provides an ultrasonic imaging device, comprising a catheter and the ultrasonic transducer as described above, wherein the ultrasonic transducer is spirally coiled on the outer wall of the catheter;

[0035] One or more ultrasonic transducers are coiled on the catheter; when the number of the ultrasonic transducers is multiple, the ultrasonic wave generated by at least one of the ultrasonic transducers is a high-frequency ultrasonic wave, and the ultrasonic wave generated by at least one of the ultrasonic transducers is a low-frequency ultrasonic wave.

[0036] The beneficial effects of this application include:

[0037] The ultrasonic transducer proposed in the present application includes an array element and a deformable frame, wherein the array elements are multiple and are respectively mounted on corresponding mounting portions of the frame. The array elements are arranged in sequence along a preset direction, and any two adjacent array elements are arranged at intervals, so that the crosstalk between the array elements can be reduced and the signal strength can be improved.

[0038] Since the frame is a deformable structure, before the ultrasonic transducer is used, the frame is twisted and deformed in advance based on the shape of the object to be scanned, so that at least some of the array elements are at a preset angle, thereby obtaining an ultrasonic transducer in a twisted form, reducing the manufacturing cost. Among them, by twisting the frame, the relative position relationship between the array elements can be adjusted to adapt to different usage scenarios, and a larger scanning range can be obtained, thereby realizing the scanning of complex structures and improving the imaging depth and resolution.

[0039] The ultrasonic transducer also includes a working module and an excitation channel. There are multiple working modules, and each working module includes the same number of array elements. Among them, the set of array elements of all working modules includes all array elements on the frame, that is, any array element belongs to one or more working modules, ensuring that each array element participates in the imaging work to ensure the integrity of the final imaging.

[0040] There is at least one array element in any working module, which is different from the array elements in other working modules. In this way, duplication of sub-images generated by different working modules can be avoided, thereby improving the final imaging efficiency.

[0041] One or more array elements in any working module are the same as one or more array elements in other working modules, so that the scanning area covered by any working module can partially overlap with the scanning area covered by other working modules, ensuring the continuity of scanning the object and avoiding missed scanning of local positions.

[0042] There are multiple excitation channels, each of which corresponds to multiple working modules, and the working modules corresponding to any two excitation channels are different. The excitation channel is used to transmit an excitation signal to the working module to obtain a sub-image. An excitation signal can be transmitted to multiple working modules through one excitation channel. Such a setting can effectively reduce the number of excitation channels and realize structural optimization of the excitation channels. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A schematic diagram of assembling an array element and a frame in an ultrasonic transducer is shown;

[0045] Figure 2 A schematic diagram of an array element is shown;

[0046] Figure 3 Shows Figure 2 Front view of the middle array element;

[0047] Figure 4 A schematic diagram of a framework is shown;

[0048] Figure 5 A schematic diagram showing the positional relationship between array elements is shown;

[0049] Figure 6 A schematic diagram showing the connection between an excitation channel and an array element in an ultrasonic transducer is shown;

[0050] Figure 7 A schematic diagram of connecting an ultrasonic transducer and a circuit board module is shown;

[0051] Figure 8 A schematic diagram of a circuit board module is shown;

[0052] Fig. 9 A flow chart of a four-dimensional ultrasound imaging method is shown;

[0053] Fig.10 A flow chart showing the operation of generating a three-dimensional image;

[0054] Fig.11 A schematic diagram of a cylindrical object to be scanned is shown;

[0055] Fig.12 A schematic diagram of a sub-image is shown;

[0056] Fig.13 A schematic diagram showing the merging of multiple sub-images is shown;

[0057] Fig.14 A schematic diagram showing an ultrasonic transducer coiled on a catheter;

[0058] Fig.15 A schematic diagram showing two ultrasound transducers coiled around a catheter.

[0059] Description of main component symbols:

[0060] 10-ultrasonic transducer; 20-catheter; 100-array element; 110-matching part; 111-matching layer; 120-piezoelectric layer; 121-electrode; 130-backing part; 131-first conductive backing unit; 132-second conductive backing unit; 133-insulating spacer; 200-frame; 210-mounting part; 300-circuit board module; 310-substrate; 320-signal terminal; 321-first conductive member; 330-ground terminal; 331-second conductive member; 411-first main control circuit; 4111-first sub-control circuit I; 4112-first sub-control circuit II; 4113-first switch module; 412-first Second main control circuit; 4121-second sub-control circuit I; 4122-second sub-control circuit II; 4123-second switch module; 413-third main control circuit; 4131-third sub-control circuit I; 4132-third sub-control circuit II; 4133-third switch module; 414-fourth main control circuit; 4141-fourth sub-control circuit I; 4142-fourth sub-control circuit II; 4143-fourth switch module; 420-control module; 500-cylindrical object to be scanned; 510-sub-image; 501-two-dimensional imaging; 511-first sub-image; 512-second sub-image; 513-third sub-image; 514-fourth sub-image. DETAILED DESCRIPTION

[0061] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0062] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0063] Example

[0064] See also Figure 1-Figure 4 In this embodiment, an ultrasonic transducer 10 is proposed, including an array element 100 and a deformable frame 200. Figure 1 The frame 200 is in a twisted and deformed state.

[0065] There are more than 100 array elements.

[0066] like Figure 4 As shown, the frame 200 includes a mounting portion 210, and the array element 100 is mounted on the mounting portion 210, and the mounting portion 210 corresponds to the array element 100. Specifically, the mounting portion 210 corresponds to the array element 100 one by one, that is, one mounting portion 210 is mounted with one array element 100.

[0067] In this embodiment, the mounting portion 210 is recessed in the surface of the frame 200. The mounting portion 210 includes a groove structure or a hole structure, wherein the array element 100 is fixedly mounted inside the corresponding mounting portion 210. When installing the array element 100, each array element 100 can be placed inside the mounting portion 210 in a certain posture, and then the array element 100 can be fixed inside the mounting portion 210 by bonding or other methods. Figure 4 In the embodiment, the array element 100 is partially located inside the mounting portion 210 .

[0068] In one embodiment, the mounting portion 210 may be flush with the surface of the frame 200 ; in another embodiment, the mounting portion 210 may protrude from the surface of the frame 200 .

[0069] The mounting portions 210 are arranged linearly on the frame 200 .

[0070] After the array elements 100 are mounted on the frame 200, they are arranged in sequence along a preset direction, and any two adjacent array elements 100 are spaced apart. Specifically, the array elements 100 can be arranged in sequence in a straight line along the length direction of the frame 200, and the spacing between any two adjacent array elements 100 can be the same or within a preset interval.

[0071] The array elements 100 are arranged in the above manner, which can reduce the crosstalk between the array elements 100 and improve the signal strength.

[0072] In this embodiment, the frame 200 is a deformable structure. The frame 200 can be made of a flexible material, so that the frame 200 can be deformed by an external force. The frame 200 can be deformed partially or as a whole.

[0073] Before the ultrasonic transducer 10 is used, the frame 200 is twisted and deformed in advance based on the shape of the object to be scanned, so that at least some of the array elements 100 are at a preset angle, thereby adapting to the shape of the object to be scanned and thereby obtaining an optimal scanning range.

[0074] The upper end surface of the array element 100 is used as the reference surface. Figure 1 When the frame 200 is twisted and deformed, the relative position relationship between the array elements 100 on the frame 200 will change accordingly. At this time, the upper end faces of two adjacent array elements 100 will form a certain preset angle. In this embodiment, when the frame 200 is in an undeformed state, the upper end faces of all array elements 100 are on the same plane; when the frame 200 is twisted and deformed, a preset angle will be formed between two adjacent array elements 100, wherein the preset angle is 0~10°. If the angle between two adjacent array elements 100 is greater than the preset angle, the imaging effect will be affected (for example, insufficient resolution, etc.) during imaging, resulting in the obtained sub-image not meeting the requirements.

[0075] Reference Figure 5 After the array elements 100 are installed on the mounting portion 210 that is not distorted, they can be arranged in a stepped manner, wherein the offset distance between two adjacent array elements 100 is 0-0.2 mm. Figure 5 In the example, the leftmost end of each array element 100 is taken as the reference, and the distance between the leftmost ends of two adjacent array elements 100 is 0-0.2 mm. Figure 5 The frame 200 is not shown.

[0076] Since the frame 200 can be deformed, by deforming the frame 200, at least some of the array elements 100 can be at a preset angle, thereby obtaining an ultrasonic transducer 10 in a twisted form, thereby reducing the manufacturing cost. Among them, by twisting and deforming the frame 200, the relative position relationship between the array elements 100 can be adjusted, thereby obtaining a larger scanning range, realizing scanning of complex structures, and improving imaging depth and resolution.

[0077] When installing the ultrasonic transducer 10, the deformation degree and deformation position of the frame 200 can be set according to the use requirements. For example, the frame 200 can be twisted and deformed uniformly or unevenly as a whole; or, only the middle part of the frame 200 can be twisted and deformed; or, only the ends of the frame 200 can be twisted and deformed; or, the part that needs to be twisted and deformed can be set at other positions, etc.

[0078] In this embodiment, the ultrasonic transducer further includes a working module and an excitation channel.

[0079] There are multiple working modules, and each working module includes the same number of array elements 100. The set of array elements 100 of all working modules includes all array elements 100 on the frame 200, that is, any array element belongs to one or more working modules, ensuring that each array element 100 participates in the imaging work to ensure the integrity of the final imaging.

[0080] The total number of array elements 100 can be adjusted as needed, but needs to be controlled within a reasonable range: if the number of array elements 100 is too small, the imaging effect will be affected; if the number of array elements 100 is too large, the volume of the ultrasonic transducer 10 will become larger, increasing the difficulty of installation and use.

[0081] The number of working modules can be set as needed, for example, the number of working modules is 3 to 100. The number of array elements 100 in each working module can be set as needed, for example, the number of array elements 100 in each working module is 4 to 60.

[0082] There is at least one array element 100 in any working module, which is different from the array elements 100 in other working modules. In this way, it is possible to avoid duplication of sub-images generated by different working modules, thereby improving the final imaging efficiency. Assuming that the array elements 100 in multiple working modules are exactly the same, the sub-images generated by these working modules are the same and repeated, which will reduce the efficiency of the final imaging and cause a waste of performance. The repeated sub-images are of no effective help in synthesizing three-dimensional images.

[0083] Furthermore, one or more array elements 100 in any working module are the same as one or more array elements 100 in other working modules. Such a setting can make the scanning area covered by any working module partially overlap with the scanning area covered by other working modules, thereby ensuring the continuity of scanning the object and avoiding the situation of missing scanning at a local position.

[0084] There are multiple excitation channels, each of which corresponds to multiple working modules, and the working modules corresponding to any two excitation channels are different, wherein the excitation channel is used to transmit an excitation signal to the working module to obtain a sub-image. An excitation signal can be transmitted to multiple working modules through one excitation channel. Such a setting can effectively reduce the number of excitation channels and realize structural optimization of the excitation channels. Assuming that each excitation channel corresponds to only one working module, when the number of working modules is too large, the complexity of wiring will become very high.

[0085] In this embodiment, an array element 100 is designated in the working module and is set as a preset array element, wherein the preset array elements in any two working modules are two different array elements.

[0086] The excitation channel includes a main control line, a sub-control line and a switch module. Each main control line corresponds to multiple sub-control lines; each sub-control line corresponds to a working module; the switch module is used to control the on and off between the main control line and the sub-control line. Among them, for any excitation channel, at the same time, the switch module can only control the main control line to establish a communication connection with one sub-control line.

[0087] The number of sub-control lines corresponding to each main control line can be set as needed. For example, the number of sub-control lines corresponding to each main control line is 2 to 20.

[0088] The sub-control circuit is connected to the preset array element in the corresponding working module. After the sub-control circuit establishes a communication connection with the corresponding main control circuit, the preset array element connected to the sub-control circuit and all the array elements 100 in the working module to which it belongs work synchronously and generate a sub-image. After a sub-image is generated, the excitation channel of the ultrasonic transducer 10 will send an excitation signal to the next working module, thereby ensuring that the sub-images are generated in chronological order.

[0089] In this embodiment, Figure 6 Four main control lines are shown, each of which corresponds to two sub-control lines. The number of working modules can be set as needed, wherein each working module includes four array elements.

[0090] For the convenience of description, Figure 6 Set the components in as follows:

[0091] The four main control lines are named as follows: the first main control line 411, the second main control line 412, the third main control line 413 and the fourth main control line 414, wherein each main control line corresponds to an excitation channel; the two sub-control lines corresponding to the first main control line 411 are named as the first sub-control line I 4111 and the first sub-control line II 4112; the two sub-control lines corresponding to the second main control line 412 are named as the second sub-control line I 4121 and the second sub-control line II 4122; the two sub-control lines corresponding to the third main control line 413 are named as the third sub-control line I 4131 and the third sub-control line II 4132 Ⅱ4132; the two sub-control lines corresponding to the fourth main control line 414 are named as: fourth sub-control line I4141 and fourth sub-control line II4142; the four switch modules are named as: first switch module 4113, second switch module 4123, third switch module 4133 and fourth switch module 4143; the array elements in the figure are named as: first array element 101, second array element 102, third array element 103, fourth array element 104, fifth array element 105, sixth array element 106, seventh array element 107, eighth array element 108 according to the arrangement order on the frame 200, and so on until the nth array element.

[0092] In this embodiment, all working modules are numbered and sorted in sequence according to the arrangement order of the preset array elements in the working modules on the frame 200. Among them, for two working modules with adjacent numbers, the preset array elements of the two modules are arranged adjacently on the frame.

[0093] Reference Figure 6 In this embodiment, the first array element 101 is a preset array element of the first working module, the second array element 102 is a preset array element of the second working module, and so on.

[0094] Specifically, the first array element 101, the second array element 102, the third array element 103 and the fourth array element 104 belong to the first working module, wherein the first array element 101 is a preset array element in the first working module, and the first array element 101 is communicatively connected with the first sub-control line I4111;

[0095] The second array element 102, the third array element 103, the fourth array element 104 and the fifth array element 105 belong to the second working module, wherein the second array element 102 is a preset array element in the second working module, and the second array element 102 is communicatively connected with the second sub-control line I 4121;

[0096] The third array element 103, the fourth array element 104, the fifth array element 105 and the sixth array element 106 belong to the third working module, wherein the third array element 103 is a preset array element in the third working module, and the third array element 103 is communicatively connected with the third sub-control line I 4131;

[0097] The fourth array element 104, the fifth array element 105, the sixth array element 106 and the seventh array element 107 belong to the fourth working module, wherein the fourth array element 104 is a preset array element in the fourth working module, and the fourth array element 104 is communicatively connected with the fourth sub-control line I 4141;

[0098] The fifth array element 105, the sixth array element 106, the seventh array element 107 and the eighth array element 108 belong to the fifth working module, wherein the fifth array element 105 is a preset array element in the fifth working module, and the fifth array element 105 is communicatively connected with the first sub-control line II 4112;

[0099] The sixth array element 106, the seventh array element 107, the eighth array element 108 and the ninth array element belong to the sixth working module, wherein the sixth array element 106 is a preset array element in the sixth working module, and the sixth array element 106 is communicatively connected with the second sub-control line II 4122;

[0100] The seventh array element 107, the eighth array element 108, the ninth array element and the tenth array element belong to the seventh working module, wherein the seventh array element 107 is a preset array element in the seventh working module, and the seventh array element 107 is communicatively connected with the third sub-control line II 4132;

[0101] The eighth array element 108 , the ninth array element, the tenth array element and the eleventh array element belong to the eighth working module, wherein the eighth array element 108 is a preset array element in the eighth working module, and the eighth array element 108 is communicatively connected to the fourth sub-control line II 4142 .

[0102] Due to the limitation of the size of the attached figure, the ninth, tenth and eleventh array elements are not shown in the figure. Figure 6 Shown in.

[0103] Figure 6 Only one wiring method between the sub-control lines and the array elements is shown. In other embodiments, the wiring method may also need to be set, for example, the first sub-control line I 4111 is connected to the first array element 101 for communication, the first sub-control line II 4112 is connected to the second array element 102 for communication, the second sub-control line I 4121 is connected to the third array element 103 for communication, the second sub-control line II 4122 is connected to the fourth array element 104 for communication, the third sub-control line I 4131 is connected to the fifth array element 105 for communication, the third sub-control line II 4132 is connected to the sixth array element 106 for communication, the fourth sub-control line I 4141 is connected to the seventh array element 107 for communication, and the fourth sub-control line II 4142 is connected to the eighth array element 108 for communication.

[0104] In this embodiment, the main control circuit of the excitation channel is electrically connected to the control module 420, wherein the control module 420 sends an excitation signal to each working module in sequence according to the sequence of the working modules.

[0105] Reference Figure 6 , each switch module is initially in the disconnected state (that is, any main control circuit and any corresponding sub-control circuit are in the disconnected state). When performing ultrasonic imaging, the first working module, the second working module, the third working module, the fourth working module, the fifth working module, the sixth working module, the seventh working module to the eighth working module are operated in sequence according to the numbering order:

[0106] The first switch module 4113 controls the first main control circuit 411 to establish a connection with the first sub-control circuit I 4111. At this time, the control module 420 sends an excitation signal to the first working module, and the first array element 101, the second array element 102, the third array element 103 and the fourth array element 104 in the first working module work synchronously and generate a first sub-image;

[0107] Cut off the connection between the first main control circuit 411 and the first sub-control circuit I 4111;

[0108] The second main control circuit 412 is controlled by the second switch module 4123 to establish a connection with the second sub-control circuit I 4121. At this time, the control module 420 sends an excitation signal to the second working module, and the second array element 102, the third array element 103, the fourth array element 104 and the fifth array element 105 in the second working module work synchronously and generate a second sub-image;

[0109] By analogy, when the eighth working module completes its operation, the eighth sub-image can be generated.

[0110] A total of eight sub-images can be obtained through the above operations, namely the first sub-image, the second sub-image to the eighth sub-image.

[0111] When more sub-images need to be acquired, the above steps can be referred to and the corresponding operations can be performed in sequence. After acquiring the required number of sub-images, the sub-images are arranged in sequence according to the time sequence of their generation; using ultrasound image processing software, the sub-images are rotated by a preset angle and moved by a preset distance so that two adjacent sub-images are aligned; all the generated sub-images are merged to obtain a three-dimensional image.

[0112] According to the above description, each excitation channel can transmit excitation signals to multiple working modules through the cooperation between the main control circuit, the sub-control circuit and the switch module, thereby realizing the excitation of a large number of array elements. In this embodiment, the excitation of eleven array elements can be realized through four excitation channels.

[0113] When the number of excitation channels is constant, by increasing the number of sub-control lines corresponding to the main control lines in the excitation channels, or / and increasing the number of array elements in each working module, more array elements can be excited and more sub-images can be obtained. The more sub-images there are, the higher the resolution and clearer the three-dimensional and four-dimensional images can be after synthesis.

[0114] In this embodiment, all array elements 100 may adopt the same structure.

[0115] like Figure 3 As shown, the array element 100 includes a matching portion 110, a piezoelectric layer 120 and a backing portion 130 stacked along a set direction. The backing portion 130 includes a first conductive backing unit 131 and a second conductive backing unit 132, wherein an insulating spacer 133 is provided between the first conductive backing unit 131 and the second conductive backing unit 132. In this embodiment, the set direction is the height direction of the array element 100, that is, parallel to Figure 3 The vertical direction of the orientation shown.

[0116] The matching part 110 mainly functions to match the acoustic impedance between the target tissue and the piezoelectric layer 120. The piezoelectric layer 120 mainly functions to convert between electrical signals and ultrasonic signals. The backing part 130 mainly functions to attenuate and support the signals propagating backward from the piezoelectric layer 120, and to transmit electrical signals.

[0117] The insulating spacer 133 may be made of insulating materials such as epoxy resin.

[0118] An electrode 121 is disposed on the outer surface of the piezoelectric layer 120 , wherein the matching portion 110 , the first conductive backing unit 131 and the second conductive backing unit 132 are all connected to the electrode 121 .

[0119] In some embodiments, the matching portion 110 includes one matching layer 111. In other embodiments, the matching portion 110 includes a plurality of matching layers 111 stacked along a set direction.

[0120] like Figure 3 As shown, in this embodiment, the matching layer 111 of the ultrasonic transducer 10 includes a plurality of matching layers 111. The number of the matching layers 111 may be two or more.

[0121] The first conductive backing unit 131 and the second conductive backing unit 132 are made of conductive material in their entirety or in part. In some embodiments, the first conductive backing unit 131 and the second conductive backing unit 132 include a conductor or a block-shaped conductor, etc., and the outer surface of the conductor or conductor may be provided with an insulating material.

[0122] like Figure 7 and Figure 8 As shown, in this embodiment, the ultrasonic transducer 10 is connected to a circuit board module 300, and the circuit board module 300 includes a substrate 310, a signal terminal 320 and a ground terminal 330, and the signal terminal 320 and the ground terminal 330 are integrated on the substrate 310. In the figure, only a schematic diagram of the connection between a single unit and the circuit board module 300 is shown.

[0123] The circuit board module 300 may be an integrated circuit board, a flexible circuit board, a high-density circuit chip, or the like.

[0124] There are multiple signal terminals 320 , and any two signal terminals 320 are insulated from each other. The signal terminals 320 correspond to the array elements 100 , wherein the first conductive backing unit 131 is electrically connected to the corresponding signal terminals 320 .

[0125] Specifically, the signal terminals 320 correspond to the array elements 100 one by one.

[0126] In this embodiment, there is only one ground terminal 330, and each second conductive backing unit 132 is electrically connected to the ground terminal 330. Since there is only one ground terminal 330, the manufacturing cost of the circuit board module 300 can be effectively reduced.

[0127] In other embodiments, there are multiple ground terminals 330, and each ground terminal 330 is electrically connected. The ground terminal 330 corresponds to the array element 100, wherein the second conductive backing unit 132 is electrically connected to the corresponding ground terminal 330. Specifically, the ground terminal 330 corresponds to the array element 100 one by one.

[0128] In this embodiment, the signal terminal 320 is connected to the first conductive backing unit 131 through the first conductive member 321 , and the ground terminal 330 is connected to the second conductive backing unit 132 through the second conductive member 331 .

[0129] In one embodiment, the substrate 310 includes a rigid circuit board, and the first conductive member 321 and the second conductive member 331 are flexible or elastic. Specifically, the first conductive member 321 and the second conductive member 331 can be made of wires, conductive springs, etc. Since the substrate 310 is rigid, the substrate 310 cannot be twisted and deformed with the frame 200. By using the first conductive member 321 and the second conductive member 331 that are flexible or elastic to connect the array element 100 of the ultrasonic transducer 10 and the circuit board module 300, the frame 200 can be deformed independently relative to the substrate 310 without being affected by the substrate 310.

[0130] In another embodiment, the substrate 310 includes a flexible circuit board, wherein the first conductive member 321 and the second conductive member 331 include conductive glue, a wire, a conductive spring, etc. When the conductive glue is used, since the substrate 310 is flexible, the substrate 310 can be torsionally deformed synchronously with the frame 200, and the array element 100 of the ultrasonic transducer 10 and the circuit board module 300 are connected by using the conductive glue, so that the substrate 310 and the frame 200 form a whole, so that the two can be torsionally deformed synchronously.

[0131] In this embodiment, the circuit board module 300 can be folded or bent, wherein the circuit board module 300 can be packaged in a catheter of an ultrasonic imaging device when assembled.

[0132] like Figure 5 As shown, each working module corresponds to an imaging area. When each working module is working, a sub-image is generated in the corresponding imaging area with the cooperation of all array elements 100 in the working module. After all working modules are operated in sequence and sub-images are generated, all sub-images are synthesized together to form a large-scale, high-definition three-dimensional image.

[0133] like Fig. 9 As shown, this embodiment also proposes a four-dimensional ultrasonic imaging method, which is applied to the ultrasonic transducer mentioned above. The method includes:

[0134] S11, dividing all array elements of the ultrasonic transducer into a plurality of working modules according to the number of array elements and the arrangement order of the array elements on the frame; wherein each working module includes the same number of array elements;

[0135] S12, performing a three-dimensional image generation operation to generate a three-dimensional image;

[0136] S13, repeating the three-dimensional image generation operation, and synthesizing the generated three-dimensional images according to the generation time sequence to generate a four-dimensional ultrasound image.

[0137] In this embodiment, an array element is specified in the working module and set as a preset array element, wherein the preset array elements in any two working modules are two different array elements. According to the arrangement order of the preset array elements in the working modules on the frame, all the working modules are numbered and sorted in sequence, wherein the preset array elements of two working modules with adjacent numbers are arranged adjacently on the frame. When performing the three-dimensional image generation operation, the excitation signal is transmitted to each working module in sequence according to the numbering order of the working modules.

[0138] like Fig.10 As shown, the generation operation of the three-dimensional image includes:

[0139] S21, transmitting an excitation signal to each working module in sequence according to a preset order;

[0140] S22, when the working module receives the excitation signal, all array elements in the working module work synchronously and generate a sub-image;

[0141] S23, sorting the sub-images in order according to the generation time of the sub-images;

[0142] S24, rotating the sub-image by a preset angle, moving the sub-image by a preset distance, and aligning two adjacent sub-images;

[0143] S25, merging all the generated sub-images to obtain a three-dimensional image.

[0144] Reference Figure 11-13 For example, for a cylindrical object 500 to be scanned, when a working module is started, a sub-image 510 can be generated, wherein: Fig.12 The circular pattern on the sub-image 510 is the two-dimensional image 501 of the cylindrical object to be scanned 500. When scanning and imaging, the first sub-image 511, the second sub-image 512, the third sub-image 513 and the fourth sub-image 514 are obtained in sequence according to the generation time of the sub-images; the first sub-image 511, the second sub-image 512, the third sub-image 513 and the fourth sub-image 514 are arranged in sequence; the first sub-image 511, the second sub-image 512, the third sub-image 513 and the fourth sub-image 514 are rotated by a preset angle and moved by a preset distance through the ultrasonic image processing software so that two adjacent sub-images are aligned; finally, through synthesis processing, a three-dimensional image of the cylindrical object to be scanned 500 can be obtained. The preset angle includes 0°, and the preset distance includes zero distance.

[0145] This embodiment further provides an imaging device, which includes a catheter 20 and the ultrasonic transducer 10 mentioned above, wherein a frame 200 of the ultrasonic transducer 10 is spirally wound on the outer wall of the catheter 20 .

[0146] The number of ultrasonic transducers 10 wound around the catheter 20 can be set as needed.

[0147] Reference Fig.14 As shown, an ultrasonic transducer 10 is coiled around the catheter 20 .

[0148] Reference Fig.15As shown, a plurality of ultrasonic transducers 10 are wound around the catheter 20. When there are a plurality of ultrasonic transducers 10, the ultrasonic wave generated by at least one ultrasonic transducer 10 is a high-frequency ultrasonic wave, and the ultrasonic wave generated by at least one ultrasonic transducer 10 is a low-frequency ultrasonic wave. Low-frequency ultrasonic waves have a greater imaging depth and a wider imaging range; high-frequency ultrasonic waves have better resolution and can distinguish smaller structures, so that a variety of imaging effects can be obtained through one imaging device.

[0149] When a plurality of ultrasonic transducers 10 are coiled on the same catheter 20 , any two ultrasonic transducers 10 are not in contact with each other. Fig.15 Two ultrasonic transducers 10 are shown. For the convenience of observation, the ultrasonic transducer on the back side is perspectively processed in the figure so that the two ultrasonic transducers 10 appear to intersect in the figure. However, in the actual device, there is no contact between the two ultrasonic transducers 10.

[0150] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0151] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An ultrasonic transducer, characterized in that: Including array elements, frames, working modules and excitation channels; There are multiple array elements; The frame comprises a mounting portion, the array elements are mounted on the mounting portion, and the mounting portion corresponds to the array elements; the array elements are arranged in sequence along a preset direction, and any two adjacent array elements are arranged at intervals; The frame is a deformable structure; before the ultrasonic transducer is used, the frame is twisted and deformed in advance based on the shape of the object to be scanned, so that a preset angle is formed between two adjacent array elements; There are multiple working modules, and each of the working modules includes the same number of array elements; wherein the set of array elements of all the working modules includes all the array elements on the frame; There is at least one array element in any of the working modules, which is different from the array elements in other working modules; and one or more array elements in any of the working modules are the same as one or more array elements in other working modules; There are multiple excitation channels, each of which corresponds to multiple working modules, and the working modules corresponding to any two excitation channels are different; wherein the excitation channel is used to transmit an excitation signal to the working module to obtain a sub-image; Specifying one of the array elements in the working module and setting it as a preset array element; wherein the preset array elements in any two of the working modules are two different array elements; According to the arrangement order of the preset array elements in the working modules on the frame, all the working modules are numbered and sorted in sequence; for two working modules with adjacent numbers, the preset array elements of the two modules are arranged adjacently on the frame; The excitation channel is electrically connected to a control module, wherein the control module sends the excitation signal to each of the working modules in sequence according to the order of the working modules; Wherein, the ultrasonic transducer is spirally coiled on the outer wall of the catheter.

2. The ultrasonic transducer according to claim 1, characterized in that: The excitation channel includes a main control circuit, a sub-control circuit and a switch module; each of the main control circuits corresponds to a plurality of sub-control circuits; each of the sub-control circuits corresponds to one of the working modules; the switch module is used to control the on-off between the main control circuit and the sub-control circuit, wherein, for any of the excitation channels, at the same time, the switch module can only control the main control circuit to establish a communication connection with one of the sub-control circuits; The sub-control circuit is communicatively connected with the preset array element in the corresponding working module; wherein, after the sub-control circuit establishes a communication connection with the corresponding main control circuit, the preset array element connected to the sub-control circuit and all the array elements in the working module to which it belongs work synchronously and generate a sub-image.

3. The ultrasonic transducer according to claim 1, characterized in that: The array element comprises a matching portion, a piezoelectric layer and a backing portion stacked along a set direction; the backing portion comprises a first conductive backing unit and a second conductive backing unit, wherein an insulating spacer is provided between the first conductive backing unit and the second conductive backing unit; An electrode is disposed on the outer surface of the piezoelectric layer, wherein the matching portion, the first conductive backing unit and the second conductive backing unit are all connected to the electrode; The matching part includes one matching layer; or, the matching part includes a plurality of matching layers stacked along the set direction.

4. The ultrasonic transducer according to claim 3, characterized in that: The ultrasonic transducer is connected to a circuit board module, the circuit board module includes a substrate, a signal terminal and a ground terminal, and the signal terminal and the ground terminal are both integrated on the substrate; There are a plurality of signal terminals, and any two of the signal terminals are insulated from each other; the signal terminals correspond to the array elements, wherein the first conductive backing unit is electrically connected to the corresponding signal terminal; There is one grounding terminal, and each of the second conductive backing units is electrically connected to the grounding terminal; or there are multiple grounding terminals, and each of the grounding terminals is electrically connected to each other, and the grounding terminals correspond to the array elements, wherein the second conductive backing units are electrically connected to the corresponding grounding terminals.

5. The ultrasonic transducer according to claim 4, characterized in that: The signal terminal is connected to the first conductive backing unit through a first conductive member, and the ground terminal is connected to the second conductive backing unit through a second conductive member; The substrate comprises a rigid circuit board, and the first conductive member and the second conductive member are flexible or elastic; or the substrate comprises a flexible circuit board, and the first conductive member and the second conductive member comprise conductive glue.

6. The ultrasonic transducer according to claim 4, characterized in that: The circuit board module can be folded or bent, wherein the circuit board module is used to be packaged in a catheter of an ultrasonic imaging device.

7. The ultrasonic transducer according to claim 1, characterized in that: The mounting portion is flush with the surface of the frame; or, The mounting portion is recessed into the surface of the frame; or, The mounting portion protrudes from a surface of the frame.

8. A four-dimensional ultrasonic imaging method, applied to the ultrasonic transducer according to any one of claims 1 to 7, characterized in that: include: According to the number of array elements and the arrangement order of the array elements on the frame, all the array elements of the ultrasonic transducer are divided into a plurality of working modules; wherein each of the working modules includes the same number of array elements; Performing a three-dimensional image generation operation to generate the three-dimensional image; Repeating the three-dimensional image generation operation, and synthesizing the generated three-dimensional images according to the time sequence of generation to generate a four-dimensional ultrasound image; Among them, the operation of generating the three-dimensional image includes: transmitting an excitation signal to each of the working modules in sequence according to a preset order; when the working module receives the excitation signal, all the array elements in the working module work synchronously and generate a sub-image; sorting the sub-images in sequence according to the generation time of the sub-images; rotating the sub-images by a preset angle, moving the sub-images by a preset distance, and aligning two adjacent sub-images; merging all the generated sub-images to obtain the three-dimensional image.

9. An ultrasonic imaging device, characterized in that: It comprises a catheter and an ultrasonic transducer as claimed in any one of claims 1 to 7, wherein the ultrasonic transducer is spirally wound on the outer wall of the catheter; One or more ultrasonic transducers are coiled on the catheter; when the number of the ultrasonic transducers is multiple, the ultrasonic wave generated by at least one of the ultrasonic transducers is a high-frequency ultrasonic wave, and the ultrasonic wave generated by at least one of the ultrasonic transducers is a low-frequency ultrasonic wave.

Images