A printer's hot bed platform data acquisition method and system

By integrating sensors on the 3D printer hot bed platform to monitor temperature and heat flow data in real time and calculate multiple indexes, intelligent management of the hot bed platform is achieved, solving the problem of insufficient data collection on the hot bed platform and improving printing quality and equipment life.

CN119567564BActive Publication Date: 2025-09-30SHENZHEN ELEGOO TECH CO LTD
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Patent Information

Application Number
CN202411751598.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-02
Publication Date
2025-09-30
Estimated Expiration
2044-12-02

AI Technical Summary

Technical Problem

The hot bed platform of existing 3D printers is difficult to achieve effective data collection and analysis when faced with the diversity of material types and printer types, resulting in unstable printing quality and shortened equipment life.

Method used

By integrating temperature sensors and heat flow sensors, the temperature and heat flow data of multiple locations on the surface of the hot bed platform are monitored in real time. The temperature stability, uniformity, heat flow stability and uniformity index are calculated to form a thermal environment monitoring index, and systematic multi-parameter evaluation and intelligent management are carried out.

Benefits of technology

It improves the processing accuracy of 3D printers, improves printing quality, and extends the service life of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a data collection method and system for a printer's hot bed platform. The method includes: real-time monitoring of temperature data and heat flow data at multiple locations on the hot bed platform during operation; calculating a temperature stability index and a temperature uniformity index based on the temperature data; calculating a heat flow stability index and a heat flow uniformity index based on the heat flow data; calculating a thermal environment monitoring index based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index; using the temperature data and the heat flow data as raw data, and packaging the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a thermal environment data set. Using embodiments of the present invention, data collection and intelligent management of a printer's hot bed platform can be achieved, helping to improve the processing accuracy of 3D printers, enhance print quality, and extend the service life of the equipment.
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Description

Technical Field

[0001] The present invention belongs to the field of printing technology, and in particular to a method and system for collecting data from a hot bed platform of a printer. Background Art

[0002] As 3D printing technology becomes increasingly popular, the printer's heated bed, as a key component, plays a crucial role in ensuring the stability and quality of the printing process. The heated bed's primary function is to provide a controlled heating environment to ensure that printed materials adhere to the print bed during printing, avoiding warping, deformation, and other quality issues. However, with the increasing diversity of materials and printer types, the printer's heated bed faces a series of technical challenges in practical application, challenges that urgently need to be addressed through innovative data collection and analysis methods. Summary of the Invention

[0003] The purpose of the present invention is to provide a data collection method and system for a printer's hot bed platform to address the deficiencies in the prior art. Through systematic multi-parameter monitoring and comprehensive index evaluation, the present invention can achieve data collection and intelligent management of the printer's hot bed platform, thereby helping to improve the processing accuracy of 3D printers, enhance print quality, and extend the service life of the equipment.

[0004] An embodiment of the present application provides a method for collecting data from a hot bed platform of a printer, the method comprising:

[0005] The temperature sensor and heat flow sensor integrated into the printer's hot bed platform monitor the temperature and heat flow data at multiple locations on the hot bed platform during operation in real time, thereby capturing the temperature distribution and heat flow dynamics of the hot bed surface in real time.

[0006] Calculating the temperature stability index and temperature uniformity index of the hot bed platform according to the temperature data to evaluate the temperature distribution of the hot bed platform;

[0007] Calculating a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data to evaluate the heat flow dynamics of the hot bed platform;

[0008] Calculating a thermal environment monitoring index of the hot bed platform according to the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0009] The temperature data and heat flow data are taken as raw data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a final collected and processed thermal environment data set.

[0010] Optionally, the calculation formulas for the temperature stability index and temperature uniformity index of the hot bed platform include:

[0011]

[0012]

[0013] Among them, the is the temperature stability index, is the temperature of the i-th position point, is the average temperature of all locations, is the temperature standard deviation of all locations, n is the number of locations, is the temperature uniformity index, is the maximum temperature of all locations, is the minimum temperature of all locations.

[0014] Optionally, the calculation formulas for the heat flow stability index and the heat flow uniformity index include:

[0015]

[0016]

[0017] Among them, the is the heat flow stability index, is the heat flow at the i-th position, is the average heat flow at all locations, is the standard deviation of heat flow at all locations, n is the number of locations, is the heat flux uniformity index, is the maximum heat flow at all locations, is the minimum heat flux at all locations.

[0018] Optionally, calculating the thermal environment monitoring index of the hot bed platform according to the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index includes:

[0019] Calculating the temperature monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index to evaluate the impact of temperature on the overall heating performance;

[0020] Calculating the heat flow monitoring index of the hot bed platform according to the heat flow stability index and the heat flow uniformity index to evaluate the influence of the heat flow on the overall heating performance;

[0021] The temperature monitoring index and the heat flow monitoring index are weighted to obtain a thermal environment monitoring index of the hot bed platform.

[0022] Optionally, the method further includes:

[0023] Comparing each data in the thermal environment data set with a preset threshold value corresponding to the data to determine whether there is abnormal data;

[0024] If abnormal data exists, an early warning message is sent to the control terminal of the printer so that the control terminal optimizes the configuration parameters of the hot bed platform and returns to the step of monitoring the temperature data and heat flow data of multiple position points on the surface of the hot bed platform in real time during operation through the temperature sensor and heat flow sensor integrated in the hot bed platform of the printer until the obtained thermal environment data set contains no abnormal data.

[0025] Another embodiment of the present application provides a data acquisition system for a hot bed platform of a printer, the system comprising:

[0026] The monitoring module is used to monitor the temperature and heat flow data of multiple locations on the surface of the hot bed platform during operation through the temperature sensor and heat flow sensor integrated into the printer's hot bed platform, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time;

[0027] a first evaluation module, configured to calculate a temperature stability index and a temperature uniformity index of the hot bed platform according to the temperature data, so as to evaluate the temperature distribution of the hot bed platform;

[0028] a second evaluation module, configured to calculate a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data, so as to evaluate the heat flow dynamics of the hot bed platform;

[0029] a third evaluation module, configured to calculate a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0030] An acquisition module is used to take the temperature data and heat flow data as raw data, and to package the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a final collected and processed thermal environment data set.

[0031] Yet another embodiment of the present application provides a storage medium, wherein the storage medium stores a computer program, wherein the computer program is configured to execute any of the above methods when run.

[0032] Yet another embodiment of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute any of the above methods.

[0033] Compared with the prior art, the present invention provides a data acquisition method for a hot bed platform of a printer, which monitors the temperature data and heat flow data of multiple position points on the surface of the hot bed platform in real time during operation; calculates the temperature stability index and the temperature uniformity index based on the temperature data; calculates the heat flow stability index and the heat flow uniformity index based on the heat flow data; calculates the thermal environment monitoring index based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index; uses the temperature data and the heat flow data as raw data, and packages the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a thermal environment data set, thereby enabling data acquisition and intelligent management of the printer hot bed platform to be realized through systematic multi-parameter monitoring and comprehensive index evaluation, which helps to improve the processing accuracy of the 3D printer, improve the printing quality, and extend the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A hardware structure block diagram of a computer terminal for a method for collecting data from a hot bed platform of a printer provided by an embodiment of the present invention;

[0035] Figure 2 A schematic flow chart of a method for collecting data from a hot bed platform of a printer provided in an embodiment of the present invention;

[0036] Figure 3 This is a structural diagram of a data acquisition system for a hot bed platform of a printer provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0037] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0038] The embodiment of the present invention first provides a method for collecting data from a hot bed platform of a printer. The method can be applied to electronic devices, such as computer terminals, specifically ordinary computers, etc.

[0039] The following describes it in detail by taking running on a computer terminal as an example. Figure 1 The hardware structure block diagram of the computer terminal of the printer hot bed platform data acquisition method provided by the embodiment of the present invention. Figure 1 As shown, the computer device includes a processor, a memory, and a network interface connected via a system bus, wherein the memory may include a non-volatile storage medium and an internal memory.

[0040] The non-volatile storage medium can store an operating system and a computer program. The computer program includes program instructions, and when the program instructions are executed, the processor can execute any one of the printer hot bed platform data acquisition methods.

[0041] The processor is used to provide computing and control capabilities and support the operation of the entire computer equipment.

[0042] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor, the processor can execute any method for collecting data from the hot bed platform of the printer.

[0043] The network interface is used for network communication, such as sending assigned tasks, etc. Those skilled in the art will understand that Figure 1 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0044] It should be understood that the processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0045] See also Figure 2 , an embodiment of the present invention provides a method for collecting data from a hot bed platform of a printer, which may include the following steps:

[0046] S201, using a temperature sensor and a heat flow sensor integrated into the hot bed platform of the printer to monitor temperature data and heat flow data of multiple locations on the surface of the hot bed platform during operation in real time, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time;

[0047] By placing multiple temperature and heat flow sensors on the surface of the hot bed platform, this method can collect temperature and heat flow data at multiple locations on the hot bed in real time. This not only captures the temperature distribution across the entire hot bed surface, but also provides insights into heat flow dynamics, thereby fully understanding the thermal environment of the hot bed during operation. The real-time collection of temperature and heat flow data enables dynamic monitoring and analysis of the hot bed platform's temperature and heat flow. This real-time data provides the basis for further analysis of the hot bed platform's temperature stability and uniformity, as well as heat flow stability and uniformity. Through comprehensive analysis of this data, the hot bed platform's overall heating performance can be effectively evaluated, providing accurate feedback for subsequent temperature control and heat flow adjustments.

[0048] To monitor temperature and heat flow data at multiple locations on the printer's heated bed in real time, multiple temperature and heat flow sensors are evenly distributed across the bed. These sensors can use high-precision thermocouples or RTDs to ensure accurate temperature data. Heat flow sensors can use micro heat flow meters, which accurately capture changes in heat flow.

[0049] These sensors connect to the printer's control system via a communication interface, transmitting the collected data to the control system in real time. The control system's built-in data processing unit then analyzes this data in real time, calculating the temperature and heat flow at each location, as well as the overall temperature stability index, temperature uniformity index, heat flow stability index, and heat flow uniformity index.

[0050] The control system can also dynamically adjust the heating power and distribution of the heated bed based on changes in monitoring data. For example, if the temperature in a certain area is too high or too low, the system can adjust the heating power in that area accordingly to achieve a balanced temperature distribution. Furthermore, if abnormal changes in heat flow are detected, the system can also adjust the heated bed's heating mode to ensure heat flow stability.

[0051] This approach allows the 3D printer to continuously monitor and adjust the thermal environment of the heated bed throughout the printing process, ensuring stability and improving print quality. This method is not only applicable to common FDM (fused deposition modeling) 3D printers, but can also be extended to other types of printing equipment, demonstrating its broad applicability and significant application prospects.

[0052] Real-time monitoring of temperature and heat flow data at multiple locations on the hot bed platform surface is of great significance. First, it significantly improves 3D printing quality, as uniform temperature and heat flow distribution helps prevent warping and deformation of the printed material, thereby ensuring the accuracy and consistency of the printed part. Second, by providing accurate real-time data, it provides timely feedback to the printer's control system, enabling the system to dynamically adjust the heating strategy and optimize the temperature control and heat flow management of the hot bed. This not only improves the stability of the printing process but also helps to save energy and reduce printing costs. Furthermore, a uniform and stable thermal environment helps reduce thermal fatigue and wear on the equipment, extending the lifespan of the printer. Finally, real-time monitoring and analysis of data can also promptly detect and warn of abnormal conditions on the hot bed platform, allowing preventive measures to be taken to avoid printing failures or equipment damage, ensuring the smooth progress of printing tasks.

[0053] S202, calculating a temperature stability index and a temperature uniformity index of the hot bed platform based on the temperature data to evaluate the temperature distribution of the hot bed platform;

[0054] The Temperature Stability Index (TSI) and Temperature Uniformity Index (TUI) are calculated based on the temperature data to accurately assess the temperature distribution characteristics of the heated bed. The Temperature Stability Index quantifies the degree of temperature fluctuation at each point on the heated bed, thereby assessing the bed's ability to maintain a constant temperature over time. By analyzing the fluctuations at each temperature point, the TSI provides a numerical indicator reflecting the temperature stability of the entire platform. The Temperature Uniformity Index measures the consistency of the temperature distribution across the heated bed surface. The TUI measures the temperature uniformity of the heated bed surface by comparing the ratio of the difference between the maximum and minimum temperatures relative to the average temperature. These two indices, combined, provide precise baseline data for optimizing heated bed heating strategies.

[0055] Specifically, a calculation formula for the temperature stability index and temperature uniformity index of a hot bed platform includes:

[0056]

[0057]

[0058] The TSI formula uses an exponential function to standardize the degree of temperature dispersion at each point. By normalizing the squared difference between the temperature of each sampling point and the average temperature and adjusting the weights using the standard deviation, this formula can effectively quantify the stability of temperature fluctuations. The TUI formula simply calculates the ratio of the maximum and minimum deviations relative to the average temperature, which can directly reflect the non-uniformity of the heated bed surface temperature and is an intuitive indicator for measuring this non-uniformity.

[0059] Among them, the is the temperature stability index, is the temperature of the i-th position point, The average temperature of all locations is used as a benchmark to measure the temperature distribution of the entire hot bed. is the temperature standard deviation of all the locations, reflecting the degree of dispersion of the temperature of all the locations, and is used to evaluate the fluctuation range of the temperature change. is the temperature uniformity index, is the maximum temperature of all locations, is the minimum temperature of all locations.

[0060] Calculating the Temperature Stability Index and Temperature Uniformity Index is crucial for improving 3D printing processes. Good temperature stability means the heated bed provides consistent heating, helping to prevent material shrinkage and part deformation caused by temperature fluctuations. Furthermore, temperature uniformity is crucial for ensuring uniform adhesion of printed materials to the heated bed, minimizing localized overheating or overcooling, thereby improving overall part quality. These indices enable a quantitative assessment of heated bed performance, enabling optimization of the device's heating configuration and improving printing reliability and accuracy.

[0061] S203, calculating a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data to evaluate the heat flow dynamics of the hot bed platform;

[0062] Based on the heat flow data, the heat flow stability index (QSI) and heat flow uniformity index (QUI) of the hot bed platform are calculated to evaluate the heat flow dynamics of the hot bed platform. The key to this step is to quantify the stability and uniformity of the heat flow by analyzing the heat flow data at each location. The QSI measures the ability of the hot bed to maintain a stable heat flow over a period of time. By evaluating the fluctuations in heat flow at different locations, it provides a quantitative indicator of the overall heat flow stability. The QUI compares the difference between the highest and lowest heat flows and measures the consistency of the heat flow distribution by comparing it to the average heat flow. These two indices comprehensively capture the dynamic characteristics of the heat flow during operation and provide a basis for evaluating and optimizing the heating performance of the hot bed.

[0063] Specifically, a calculation formula for the heat flow stability index and the heat flow uniformity index includes:

[0064]

[0065]

[0066] Similarly, the QSI formula uses an exponential expression to standardize and quantify the degree of dispersion of heat flux at each location on the hot bed. By comparing the squared difference between the heat flux at each sampling point and the average heat flux and using the heat flux standard deviation for weight adjustment, this formula provides a reliable quantitative tool for heat flux stability. The QUI formula directly measures the consistency of heat flux distribution by the relative difference between the maximum and minimum heat flux values, using the average heat flux as a benchmark, providing a unitless and standardized uniformity indicator.

[0067] Among them, the is the heat flow stability index, is the heat flow at the i-th position, is the average heat flow at all locations, is the standard deviation of heat flow at all locations, n is the number of locations, is the heat flux uniformity index, is the maximum heat flow at all locations, is the minimum heat flux at all locations.

[0068] Calculating the heat flow stability index and heat flow uniformity index is crucial for improving the efficiency and reliability of the 3D printing process. First, stable heat flow is essential for ensuring uniform heating and consistent adhesion of materials. This significantly reduces the risk of uneven material processing due to heat flow fluctuations, thereby improving the quality and structural integrity of printed parts. Second, uniform heat flow distribution ensures efficient heat transfer across all areas of the hot bed, preventing localized overheating or overcooling and ensuring that the printed material receives consistent thermal support throughout the entire printing area. Monitoring and analyzing these indices provides the necessary feedback for optimizing the device's heat flow management and heating strategies, ultimately improving the overall performance and lifespan of the printer.

[0069] S204, calculating a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0070] During this process, the heated bed's heating performance is comprehensively evaluated from multiple perspectives through comprehensive analysis of temperature and heat flow data. The Heat Environment Monitoring Index (HEMI) provides a comprehensive metric that quantifies the temperature and heat flow characteristics of the heated bed during actual operation. The Temperature Stability Index and Temperature Uniformity Index reflect temperature fluctuations and distribution, while the Heat Flow Stability Index and Heat Flow Uniformity Index reveal the stability and uniformity of heat flow transfer. By weighting these indices, a holistic Thermal Environment Monitoring Index is formed, enabling an accurate assessment of the heated bed's heating effectiveness and its impact on the printing process.

[0071] Specifically, the temperature monitoring index of the hot bed platform can be calculated according to the temperature stability index and the temperature uniformity index to evaluate the influence of temperature on the overall heating performance;

[0072] In this step, the Temperature Monitoring Index (TMI) is first calculated using the Temperature Stability Index (TSI) and Temperature Uniformity Index (TUI). The TMI reflects the degree to which the temperature stability and uniformity of the heated bed during heating affect overall heating performance. This calculation considers temperature data from multiple locations, providing a comprehensive perspective on the heated bed's temperature characteristics. The formula incorporates the nonlinear relationship between temperature stability and uniformity, making the index sensitive to the potential impact of temperature variations.

[0073] By calculating the Temperature Monitoring Index (TMI), we can accurately determine the degree to which the heated bed's temperature performance affects heating effectiveness. This is crucial for ensuring print quality, as uneven or fluctuating temperatures can lead to poor adhesion, deformation, or other defects in printed parts. TMI assessment helps engineers identify deficiencies in temperature management and implement necessary optimization measures to improve product quality and production efficiency.

[0074] For example, a temperature monitoring index TMI may be:

[0075]

[0076] in, : The corresponding weight coefficients represent the different importance of temperature stability and uniformity. These coefficients need to be adjusted and optimized according to the specific application. A small positive number to prevent the denominator from being 0.

[0077] This formula design uses an inverse calculation to process the temperature stability index to emphasize the importance of stability. Furthermore, an exponential decay is used to process the temperature uniformity index, resulting in a nonlinear, decreasing effect of uniformity on overall heating performance. This formula structure more accurately reflects the impact of temperature characteristics on overall heating performance. The inverse of the TSI in the inverse calculation does indeed mean that a larger TSI (indicating more stable temperature) contributes less to the temperature monitoring index (TMI). Correspondingly, a smaller TUI value indicates more uniform temperature. This beneficial effect of uniformity is typically compensated in the formula through a penalty term (e.g., a nonlinear treatment of nonuniformity). Generally, more stable and uniform temperature has a smaller impact on overall heating performance, so a smaller TMI in the design implies a lower impact. While the expression of this effect may require consideration of other environmental variables in practical applications, stability and uniformity are the primary drivers.

[0078] Calculating the heat flow monitoring index of the hot bed platform according to the heat flow stability index and the heat flow uniformity index to evaluate the influence of the heat flow on the overall heating performance;

[0079] In this step, the Heat Flow Monitoring Index (HFMI) is calculated based on the Heat Flow Stability Index (QSI) and the Heat Flow Uniformity Index (QUI). The HFMI evaluates the heat flow characteristics of the heated bed during the heating process by analyzing the stability and uniformity of the heat flow. This specific calculation formula reveals the direct impact of heat flow on heating performance under various conditions and helps identify deficiencies in heat flow distribution, which is crucial for uniform heating during printing.

[0080] Calculating the Heat Flow Monitoring Index (HFMI) provides a deeper understanding of the impact of heat flow on overall heating performance during actual printing. Uniform and stable heat flow is crucial for ensuring print quality. HFMI results can effectively guide operators in optimizing heating strategies, ensuring the heated bed provides ideal heat flow to support high-precision printing tasks. Monitoring and adjusting heat flow can help reduce failures and material waste, thereby improving production efficiency.

[0081] For example, a heat flow monitoring index HFMI may be:

[0082]

[0083] The formula is Processing heat flow stability index (QSI), this inverse form means that the larger the QSI (i.e. the more stable the heat flow), the smaller the contribution to HFMI, emphasizing the reduction of the impact of heat flow stability on overall performance. The form deals with the heat flow uniformity index (QUI), where is an adjustment factor. The square of the QUI further amplifies the negative effects of uniformity. This design emphasizes the importance of uniformity in influencing heating consistency by applying a nonlinear penalty to nonuniformity. A larger QSI indicates more stable heat flow and less impact on heating performance. A smaller QUI indicates more uniform heat flow distribution, which is beneficial for improving heating performance.

[0084] The temperature monitoring index and the heat flow monitoring index are weighted to obtain a thermal environment monitoring index of the hot bed platform.

[0085] In this step, the calculated Temperature Monitoring Index (TMI) and Heat Flow Monitoring Index (HFMI) are weighted. This weighting process combines the importance of these two indicators to overall heating performance to form a comprehensive Thermal Environment Monitoring Index (HEMI). This weighting process ensures that the influence of different indicators is more proportional, thereby improving the accuracy and representativeness of the final results. Setting appropriate weighting factors to suit different printing tasks and material characteristics ensures more targeted results.

[0086] The Thermal Environment Monitoring Index (HEMI) calculation provides a comprehensive assessment tool for a printer's overall heating performance. By comprehensively considering both temperature and heat flow monitoring indicators, HEMI comprehensively reflects the heating effectiveness of the heated bed, thereby achieving greater stability and reliability during production. This comprehensive index allows operators to quickly identify the performance status of the heated bed and adjust heating parameters in a timely manner to improve print quality, reduce errors, and ultimately optimize production efficiency and material utilization.

[0087] For example, a thermal environment monitoring index may be:

[0088]

[0089] Among them, inverse operation and nonlinear processing: : Inverse operation processing temperature monitoring index TMI, emphasizing the importance of temperature stability and uniformity; : The heat flow monitoring index HFMI is processed by square root and then the inverse is taken, which increases the nonlinear characteristics and amplifies the high sensitivity to heat flow.

[0090] Combination items: : Emphasize the interactive influence of temperature and heat flow, especially the compound effect of high heat flow changes on temperature monitoring, to ensure that the thermal environment dynamics of the hot bed platform are fully reflected.

[0091] Weighting Factor: Three weighting factors are used to adjust the influence of each part on the overall index. They can be adjusted according to actual needs to adapt to different application scenarios and device requirements.

[0092] Calculating the thermal environment monitoring index is of great practical significance for optimizing the overall heating performance of the hot bed platform. First, a comprehensive thermal environment monitoring index can provide a comprehensive assessment of the hot bed's performance, helping to identify potential uneven or unstable heating issues and make timely adjustments. This not only helps improve the quality and consistency of prints, but also significantly reduces printing failures and scrap rates. Second, accurate monitoring and evaluation data provides a scientific basis for equipment maintenance, extending equipment life and reducing operating costs. By continuously monitoring the thermal environment monitoring index, the heating strategy can be dynamically optimized to ensure that the hot bed platform is always in the optimal heating state to meet the needs of high-precision printing.

[0093] S205 , taking the temperature data and heat flow data as raw data, and packaging the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a final collected and processed thermal environment data set.

[0094] During the data packaging step, the printer's hot bed platform uses built-in temperature sensors and heat flow sensors to collect real-time temperature and heat flow data from the platform surface. These temperature and heat flow data are considered raw data, representing the detailed thermal distribution at a specific moment. These raw data are then used through a series of calculations to derive the temperature stability index, temperature uniformity index, heat flow stability index, and heat flow uniformity index. These indices, which represent the stability and uniformity characteristics of the temperature and heat flow on the hot bed surface, are referred to as processed data. To facilitate storage, analysis, and transmission, these raw and processed data are packaged into a comprehensive dataset, called the thermal environment dataset, which provides a comprehensive view of the thermal performance of the hot bed platform.

[0095] Packaging thermal environment datasets is fundamental to hot bed platform performance monitoring and optimization. By combining raw and processed data into a single dataset, we simplify data storage and transmission while providing a comprehensive, quantifiable framework for evaluating hot bed performance. This not only facilitates real-time monitoring of device status but also provides a crucial foundation for subsequent data analysis and troubleshooting. Through systematic data management, printers can effectively identify and resolve hot bed heating issues, improving print accuracy and quality.

[0096] Furthermore, after obtaining the thermal environment data set that is finally collected and processed, each data in the thermal environment data set may be compared with a preset threshold value corresponding to the data to determine whether there is abnormal data.

[0097] In this step, each data point in the thermal environment dataset is examined to determine if it exceeds previously established safety or performance thresholds. These thresholds are typically based on ideal hot bed operating conditions, with the goal of identifying anomalies in the data. Through real-time comparison, any deviation from the normal range is immediately identified, indicating a possible technical issue or malfunction.

[0098] The significance of this step lies in the ability to quickly identify and respond to abnormalities in the heated bed platform. By comparing data against preset thresholds, abnormalities in operation are detected promptly, preventing them from escalating or negatively impacting print quality. This real-time anomaly detection mechanism not only improves equipment reliability and safety but also provides early warning to maintenance personnel, reducing downtime and saving maintenance costs.

[0099] During implementation, each data item to be monitored is first extracted from the thermal environment dataset. Each data item is then compared against a pre-defined threshold in the database. Thresholds can be based on historical data, manufacturer recommendations, or industry standards. If a data item exceeds a threshold, the system records the anomaly and generates an alert. The alert information can include a timestamp, the specific value of the data item, the threshold range, and the potential impact. This information is then transmitted to the control terminal for further processing and analysis.

[0100] If abnormal data exists, an early warning message is sent to the control terminal of the printer so that the control terminal optimizes the configuration parameters of the hot bed platform and returns to the step of monitoring the temperature data and heat flow data of multiple position points on the surface of the hot bed platform in real time during operation through the temperature sensor and heat flow sensor integrated in the hot bed platform of the printer until the obtained thermal environment data set contains no abnormal data.

[0101] When abnormal data is detected, the system automatically generates an alert and sends it to the printer's control terminal. The control terminal analyzes the alert to determine how to optimize the hot bed platform's configuration parameters to eliminate the anomaly. This optimization can involve existing technical measures such as adjusting the power of heating elements, correcting temperature setpoints, or adjusting other relevant parameters. The system also resumes monitoring temperature and heat flow after adjustments to ensure the effectiveness of the optimization measures until the data returns to normal range.

[0102] By sending warnings and automatically optimizing parameters as soon as an anomaly is detected, the system accelerates response to issues, reduces manual intervention, and increases automation. This closed-loop feedback mechanism ensures the printer continues to operate at optimal levels, reducing defective products and resource waste caused by temperature anomalies while extending the life of the equipment.

[0103] When implementing this step, the system first detects abnormal data and generates an early warning message, which is transmitted to the control terminal via an internal communication protocol. After receiving the message, the control terminal evaluates the type of abnormal data and, based on the abnormal data, uses a preset abnormal data and optimization instruction mapping table to execute the corresponding optimization instructions, such as adjusting PID controller parameters, modifying the heater's output power, or recalibrating the sensor. Subsequently, the terminal instructs the hot bed to re-enter the real-time monitoring state and continue to collect temperature and heat flow data. Through this continuous monitoring and adjustment cycle, it is ensured that all data returns to normal and remains stable until there is no abnormal data. Among them, the mapping table can only record the mapping relationship between common abnormal data and optimization instructions. For data with very few abnormalities, an alarm notification can be sent to the terminal's operation and maintenance personnel to manually check the fault and implement optimization, realizing a combination of automatic optimization and manual optimization, and improving the comprehensiveness of optimization.

[0104] It can be seen that the temperature data and heat flow data of multiple position points on the surface of the hot bed platform are monitored in real time during operation; the temperature stability index and temperature uniformity index are calculated based on the temperature data; the heat flow stability index and heat flow uniformity index are calculated based on the heat flow data; the thermal environment monitoring index is calculated based on the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index; the temperature data and heat flow data are used as original data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a thermal environment data set, so that through systematic multi-parameter monitoring and comprehensive index evaluation, data collection and intelligent management of the printer hot bed platform can be realized, which helps to improve the processing accuracy of the 3D printer, improve the printing quality, and extend the service life of the equipment.

[0105] Another embodiment of the present invention provides a data acquisition system for a hot bed platform of a printer, see Figure 3 , the system may include:

[0106] The monitoring module 301 is used to monitor the temperature and heat flow data of multiple locations on the surface of the hot bed during operation through the temperature sensor and heat flow sensor integrated into the printer's hot bed platform, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time;

[0107] A first evaluation module 302 is configured to calculate a temperature stability index and a temperature uniformity index of the hot bed platform based on the temperature data to evaluate the temperature distribution of the hot bed platform;

[0108] A second evaluation module 303 is configured to calculate a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data, so as to evaluate the heat flow dynamics of the hot bed platform;

[0109] A third evaluation module 304 is configured to calculate a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0110] The acquisition module 305 is used to take the temperature data and heat flow data as raw data, and package the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain the final collected and processed thermal environment data set.

[0111] It can be seen that the temperature data and heat flow data of multiple position points on the surface of the hot bed platform are monitored in real time during operation; the temperature stability index and temperature uniformity index are calculated based on the temperature data; the heat flow stability index and heat flow uniformity index are calculated based on the heat flow data; the thermal environment monitoring index is calculated based on the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index; the temperature data and heat flow data are used as original data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a thermal environment data set, so that through systematic multi-parameter monitoring and comprehensive index evaluation, data collection and intelligent management of the printer hot bed platform can be realized, which helps to improve the processing accuracy of the 3D printer, improve the printing quality, and extend the service life of the equipment.

[0112] An embodiment of the present invention further provides a storage medium storing a computer program, wherein the computer program is configured to execute the steps of any one of the above method embodiments when running.

[0113] Specifically, in this embodiment, the above-mentioned storage medium may be configured to store a computer program for performing the following steps:

[0114] S201, using a temperature sensor and a heat flow sensor integrated into the hot bed platform of the printer to monitor temperature data and heat flow data of multiple locations on the surface of the hot bed platform during operation in real time, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time;

[0115] S202, calculating a temperature stability index and a temperature uniformity index of the hot bed platform based on the temperature data to evaluate the temperature distribution of the hot bed platform;

[0116] S203, calculating a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data to evaluate the heat flow dynamics of the hot bed platform;

[0117] S204, calculating a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0118] S205 , taking the temperature data and heat flow data as raw data, and packaging the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a final collected and processed thermal environment data set.

[0119] It can be seen that the temperature data and heat flow data of multiple position points on the surface of the hot bed platform are monitored in real time during operation; the temperature stability index and temperature uniformity index are calculated based on the temperature data; the heat flow stability index and heat flow uniformity index are calculated based on the heat flow data; the thermal environment monitoring index is calculated based on the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index; the temperature data and heat flow data are used as original data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a thermal environment data set, so that through systematic multi-parameter monitoring and comprehensive index evaluation, data collection and intelligent management of the printer hot bed platform can be realized, which helps to improve the processing accuracy of the 3D printer, improve the printing quality, and extend the service life of the equipment.

[0120] An embodiment of the present invention further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any one of the above method embodiments.

[0121] Specifically, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0122] Specifically, in this embodiment, the processor may be configured to execute the following steps through a computer program:

[0123] S201, using a temperature sensor and a heat flow sensor integrated into the hot bed platform of the printer to monitor temperature data and heat flow data of multiple locations on the surface of the hot bed platform during operation in real time, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time;

[0124] S202, calculating a temperature stability index and a temperature uniformity index of the hot bed platform based on the temperature data to evaluate the temperature distribution of the hot bed platform;

[0125] S203, calculating a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data to evaluate the heat flow dynamics of the hot bed platform;

[0126] S204, calculating a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform;

[0127] S205 , taking the temperature data and heat flow data as raw data, and packaging the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a final collected and processed thermal environment data set.

[0128] It can be seen that the temperature data and heat flow data of multiple position points on the surface of the hot bed platform are monitored in real time during operation; the temperature stability index and temperature uniformity index are calculated based on the temperature data; the heat flow stability index and heat flow uniformity index are calculated based on the heat flow data; the thermal environment monitoring index is calculated based on the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index; the temperature data and heat flow data are used as original data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a thermal environment data set, so that through systematic multi-parameter monitoring and comprehensive index evaluation, data collection and intelligent management of the printer hot bed platform can be realized, which helps to improve the processing accuracy of the 3D printer, improve the printing quality, and extend the service life of the equipment.

[0129] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A method for collecting data from a hot bed platform of a printer, characterized in that: The method comprises: The temperature sensor and heat flow sensor integrated into the printer's hot bed platform monitor the temperature and heat flow data at multiple locations on the hot bed platform during operation in real time, thereby capturing the temperature distribution and heat flow dynamics of the hot bed surface in real time. Calculating a temperature stability index and a temperature uniformity index of the hot bed platform based on the temperature data to evaluate the temperature distribution of the hot bed platform; Calculating a heat flow stability index and a heat flow uniformity index of the hot bed platform according to the heat flow data to evaluate the heat flow dynamics of the hot bed platform; Calculating a thermal environment monitoring index of the hot bed platform according to the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform; The temperature data and heat flow data are used as raw data, and the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index are packaged as processed data to obtain a final collected and processed thermal environment data set; The calculation formulas for the temperature stability index and temperature uniformity index of the hot bed platform include: Among them, the is the temperature stability index, is the temperature of the i-th position point, is the average temperature of all locations, is the temperature standard deviation of all locations, n is the number of locations, is the temperature uniformity index, is the maximum temperature of all locations, is the minimum temperature of all locations; The calculation formulas for the heat flow stability index and the heat flow uniformity index include: Among them, the is the heat flow stability index, is the heat flow at the i-th position, is the average heat flow at all locations, is the standard deviation of heat flow at all locations, n is the number of locations, is the heat flux uniformity index, is the maximum heat flow at all locations, is the minimum heat flow at all locations; Calculating the thermal environment monitoring index of the hot bed platform according to the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index includes: Calculating the temperature monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index to evaluate the impact of temperature on the overall heating performance; Calculating the heat flow monitoring index of the hot bed platform according to the heat flow stability index and the heat flow uniformity index to evaluate the influence of the heat flow on the overall heating performance; The temperature monitoring index and the heat flow monitoring index are weighted to obtain a thermal environment monitoring index of the hot bed platform.

2. The method according to claim 1, characterized in that The method further comprises: Comparing each data in the thermal environment data set with a preset threshold value corresponding to the data to determine whether there is abnormal data; If abnormal data exists, an early warning message is sent to the control terminal of the printer so that the control terminal optimizes the configuration parameters of the hot bed platform and returns to the step of monitoring the temperature data and heat flow data of multiple position points on the surface of the hot bed platform in real time during operation through the temperature sensor and heat flow sensor integrated in the hot bed platform of the printer until the obtained thermal environment data set contains no abnormal data.

3. A printer hot bed platform data acquisition system, characterized in that: The system comprises: The monitoring module is used to monitor the temperature and heat flow data of multiple locations on the surface of the hot bed platform during operation through the temperature sensor and heat flow sensor integrated into the printer's hot bed platform, so as to capture the temperature distribution and heat flow dynamics of the hot bed surface in real time; a first evaluation module, configured to calculate a temperature stability index and a temperature uniformity index of the hot bed platform according to the temperature data, so as to evaluate the temperature distribution of the hot bed platform; a second evaluation module, configured to calculate a heat flow stability index and a heat flow uniformity index of the hot bed platform based on the heat flow data, so as to evaluate the heat flow dynamics of the hot bed platform; a third evaluation module, configured to calculate a thermal environment monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index, so as to evaluate the overall heating performance of the hot bed platform; an acquisition module, configured to take the temperature data and heat flow data as raw data, and package the temperature stability index and temperature uniformity index, the heat flow stability index and heat flow uniformity index, and the thermal environment monitoring index as processed data to obtain a final collected and processed thermal environment data set; The calculation formulas for the temperature stability index and temperature uniformity index of the hot bed platform include: Among them, the is the temperature stability index, is the temperature of the i-th position point, is the average temperature of all locations, is the temperature standard deviation of all locations, n is the number of locations, is the temperature uniformity index, is the maximum temperature of all locations, is the minimum temperature of all locations; The calculation formulas for the heat flow stability index and the heat flow uniformity index include: Among them, the is the heat flow stability index, is the heat flow at the i-th position, is the average heat flow at all locations, is the standard deviation of heat flow at all locations, n is the number of locations, is the heat flux uniformity index, is the maximum heat flow at all locations, is the minimum heat flow at all locations; Calculating the thermal environment monitoring index of the hot bed platform according to the temperature stability index and the temperature uniformity index, and the heat flow stability index and the heat flow uniformity index includes: Calculating the temperature monitoring index of the hot bed platform based on the temperature stability index and the temperature uniformity index to evaluate the impact of temperature on the overall heating performance; Calculating the heat flow monitoring index of the hot bed platform according to the heat flow stability index and the heat flow uniformity index to evaluate the influence of the heat flow on the overall heating performance; The temperature monitoring index and the heat flow monitoring index are weighted to obtain a thermal environment monitoring index of the hot bed platform.

4. A storage medium, characterized in that The storage medium stores a computer program, wherein the computer program is configured to execute the method according to any one of claims 1 to 2 when executed.

5. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to run the computer program to perform the method according to any one of claims 1 to 2.

Citation Information

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