Antenna substrate and method of manufacturing antenna substrate

Abstract

The invention provides an antenna substrate and a method of manufacturing the antenna substrate. The antenna substrate includes: an antenna including an antenna pattern configured to transmit or receive an RF signal; and a directivity adjustment pattern having a preset area and including a plurality of metal patterns disposed to be spaced apart from each other, the directivity adjustment pattern being disposed on one surface of the antenna through which an RF signal transmitted from the antenna pattern propagates, the height of at least one metal pattern of the plurality of metal patterns is greater than the height of each of the remaining metal patterns of the plurality of metal patterns.

Description

Technical Field

[0001] The present disclosure relates to an antenna substrate and a method for manufacturing the antenna substrate. Background Art

[0002] Recently, research on millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively conducted, and research on commercialization of antenna modules that successfully implement millimeter wave communication has also been actively conducted.

[0003] Conventionally, in order to satisfy a high level of antenna performance according to a high frequency, an antenna module providing a millimeter wave communication environment has a structure in which an integrated circuit (IC) and an antenna are provided on the antenna module and connected by a coaxial cable.

[0004] However, this structure may result in a lack of space for arranging the antenna, a limitation in the freedom of the shape of the antenna, an increase in interference between the antenna and the IC, and an increase in the size and / or cost of the antenna module. Summary of the invention

[0005] The present disclosure attempts to provide an antenna substrate capable of adjusting the directivity of a transmission beam and a method of manufacturing the antenna substrate.

[0006] According to an embodiment of the present disclosure, an antenna substrate may include: an antenna, including an antenna pattern configured to send or receive an RF signal; and a directivity adjustment pattern, having a preset area and including a plurality of metal patterns arranged to be spaced apart from each other, the directivity adjustment pattern being arranged on a surface of the antenna and being arranged so that a height of at least one of the plurality of metal patterns is greater than a height of each of the remaining metal patterns of the plurality of metal patterns.

[0007] The directivity adjustment pattern may be disposed to face the antenna pattern in a thickness direction of the antenna.

[0008] The antenna substrate may further include a wiring structure, the antenna being disposed on one surface of the wiring structure, wherein the antenna is a chip antenna.

[0009] The antenna substrate may further include an encapsulation material disposed on the one surface of the wiring structure and configured to surround at least a portion of the antenna.

[0010] The antenna substrate may further include a shielding layer having an insulating property and disposed between the directivity adjustment pattern and the antenna pattern.

[0011] The shielding layer may be disposed to cover at least a partial area of ​​the antenna pattern.

[0012] The shielding layer may be disposed on the antenna pattern, and may be disposed on at least a portion of a region of the encapsulation material adjacent to the antenna pattern.

[0013] The antenna substrate may further include a wiring structure, and the antenna is arranged on a surface of the wiring structure, wherein the antenna may further include: a dielectric layer configured to surround the antenna pattern; and a through hole connected to the antenna pattern, passing through at least a portion of the dielectric layer, and extending toward the wiring structure.

[0014] The antenna may further include a guide member disposed between the directivity adjustment pattern and the antenna pattern.

[0015] The antenna substrate may further include a shielding layer having an insulating property and disposed between the directivity adjustment pattern and the guide member.

[0016] The shielding layer may be disposed to cover at least a partial area of ​​the guide member.

[0017] The shielding layer may be disposed on the guide member, and may be disposed on at least a portion of the dielectric layer adjacent to the guide member.

[0018] The antenna pattern may be provided as a plurality of antenna patterns provided to be spaced apart from each other on a plane intersecting a thickness direction of the antenna.

[0019] The directivity adjustment pattern may have a metamaterial structure.

[0020] The RF signal transmitted from the antenna pattern may be configured to propagate through the directivity adjustment pattern.

[0021] The plurality of metal patterns may increase in height from an edge region of the directivity adjustment pattern to a center region of the directivity adjustment pattern.

[0022] Another embodiment of the present disclosure provides an antenna substrate, the antenna substrate comprising: an antenna, comprising an antenna pattern configured to transmit or receive an RF signal; and a directivity adjustment pattern having a preset area and comprising a plurality of metal patterns arranged to be spaced apart from each other, the directivity adjustment pattern being arranged on one surface of the antenna. The directivity adjustment pattern comprises: a first pattern area, arranged at a first distance from a central area of ​​the directivity adjustment pattern; and a second pattern area, arranged at a second distance from the central area of ​​the directivity adjustment pattern, the second distance being longer than the first distance. The height of one of the first pattern area and the second pattern area is greater than the height of the other of the first pattern area and the second pattern area.

[0023] The plurality of metal patterns of the first pattern area may have different heights in an upward direction or a downward direction.

[0024] The plurality of metal patterns of the second pattern area may have different heights in an upward direction or a downward direction.

[0025] Another embodiment of the present disclosure provides a method for manufacturing an antenna substrate, the method comprising: forming a first mask on a shielding layer for an antenna, the antenna having an antenna pattern configured to transmit or receive an RF signal; forming a first metal layer on the shielding layer by using the first mask; forming a second mask on the first mask, so that the second mask covers a portion of the first metal layer and exposes the rest of the first metal layer; forming a second metal layer on the rest of the first metal layer by using the second mask; and removing the first mask and the second mask, and forming a directivity adjustment pattern through the first metal layer and the second metal layer, the directivity adjustment pattern providing areas with different heights in an upward direction or a downward direction on the antenna.

[0026] At least one of the embodiments may provide an antenna substrate capable of adjusting the directivity of a transmission beam and a method of manufacturing the antenna substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a view showing an antenna substrate according to an embodiment.

[0028] Figure 2 It is shown Figure 1 A view of an area of ​​an antenna substrate where an antenna is provided.

[0029] Figures 3 to 8 is a view showing a process of manufacturing a directivity adjustment pattern.

[0030] Fig. 9 is a view showing a directivity adjustment pattern according to another embodiment.

[0031] Fig.10 is a view showing a directivity adjustment pattern according to still another embodiment.

[0032] Fig.11 is a view showing an antenna substrate according to another embodiment.

[0033] Fig.12 is a view showing an antenna substrate according to still another embodiment.

[0034] Fig.13 is a view showing an arrangement state of a plurality of guide members.

[0035] Fig.14 is a view showing an arrangement state of a plurality of guide members according to another embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, several exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily perform the exemplary embodiments. The present disclosure can be implemented in various different ways and is not limited to the embodiments described herein.

[0037] In order to clearly describe the present disclosure, parts irrelevant to the description will be omitted, and the same or similar constituent elements will be denoted by the same reference numerals throughout the specification.

[0038] In addition, for the convenience of description, the size (for example, thickness) of each constituent element shown in the drawings is arbitrarily shown, but the present disclosure is not limited thereto. In order to clearly describe several layers and regions, their thicknesses are exaggerated in the drawings.

[0039] In addition, when a component (such as a layer, film, region, or plate) is described as being "above" or "on" another component, one component may be "directly" "on" another component, and one component may also be on another component with other components interposed between one component and the other component. In contrast, when one component is described as being "directly" "on" another component, there are no other components between one component and the other component. In addition, when a component is described as being "above" or "on" a reference portion, the component may be "above" or "below" the reference portion, and this configuration does not necessarily mean that the component is "above" or "on" the reference portion in a direction opposite to gravity.

[0040] Throughout the specification, unless explicitly described to the contrary, the word “comprises / comprising” and variations such as “including” or “having” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0041] Furthermore, throughout the specification, the phrase "in a plan view" means a state in which an object is viewed from above, and the phrase "in a cross-sectional view" means a state in which a cross section made by vertically cutting the object is viewed from the side.

[0042] Figure 1 is a view showing an antenna substrate 1 according to the embodiment.

[0043] Reference Figure 1 , the antenna substrate 1 according to the embodiment includes an antenna 100 , a wiring structure 130 , and a directivity adjustment pattern 180 .

[0044] The antenna 100 may be a chip antenna. The antenna 100 may include one surface and another surface facing the one surface. Figure 1 It is shown that one surface of the antenna 100 faces upward. One surface of the antenna 100 may be referred to as an upper surface of the antenna 100, and the other surface of the antenna 100 may be referred to as a lower surface of the antenna 100. In addition, the direction in which the one surface and the other surface face each other may be referred to as a thickness direction of the antenna 100.

[0045] The body of the antenna 100 may be made of a dielectric material. In the antenna 100, an antenna pattern 101 may be provided on the upper surface of the body made of a dielectric material, and a pad pattern 102 may be provided on the lower surface of the body. A single antenna 100 or a plurality of antennas 100 may be provided. For example, a plurality of antennas 100 may be provided in various shapes such as a 1×2 array, a 1×4 array, or a 2×2 array.

[0046] The dielectric body of the antenna 100 may include a material having a high dielectric constant (Dk). For example, the dielectric body may include a ceramic layer and / or a ceramic-polymer composite layer. Optionally, the dielectric body may include an insulating layer including an insulating material having a high dielectric constant (Dk), such as polytetrafluoroethylene (PTFE). The ceramic-polymer composite layer may be made by dispersing a ceramic filler into an organic binder. The organic binder may be made using a polymer such as PTFE or epoxy resin. The ceramic filler may be a filler made using SiO2, TiO2, Al2O3, etc. The diameter of the ceramic filler may be 50 μm or less. The ceramic-polymer composite layer may include a material reinforced with a reinforcing material such as glass fiber.

[0047] The antenna pattern 101 and the pad pattern 102 may each include a metal material. The metal material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The antenna pattern 101 may be a coupling pattern. A patch pattern coupled to the antenna pattern 101 may be provided in the dielectric body. The antenna pattern 101 may transmit or receive a radio frequency (RF) signal in a thickness direction.

[0048] The pad pattern 102 enables the antenna 100 to be connected to an external component. The pad pattern 102 can connect the antenna 100 to the wiring structure 130. At least one of the plurality of pad patterns 102 can be connected to a patch pattern in the dielectric body through a feed via in the dielectric body. At least one of the plurality of pad patterns 102 can be connected to a feed pattern in the wiring structure 130. At least one of the plurality of pad patterns 102 can be connected to a ground pattern in the wiring structure 130.

[0049] The antenna 100 may be disposed on one surface of the wiring structure 130. Hereinafter, one surface of the wiring structure 130 is referred to as an upper surface of the wiring structure 130.

[0050] The wiring structure 130 includes an insulating layer 131, a wiring layer 132, and a via layer 133. The wiring layer 132 may be disposed on the insulating layer 131. In addition, the wiring layer 132 may be disposed in the insulating layer 131. The insulating layer 131 may be disposed as a plurality of insulating layers 131 defining a multilayer structure. The plurality of via layers 133 may penetrate the plurality of insulating layers 131, respectively. The via layer 133 disposed at the uppermost side may penetrate at least a portion of the encapsulation material 140.

[0051] The insulating layer 131 may include an insulating material. The insulating material may include a thermosetting resin (such as an epoxy resin) or a thermoplastic resin (such as a polyimide). In addition, the insulating material may include a reinforcing material, such as fiberglass (glass fiber, glass cloth, glass fabric) or an inorganic filler. For example, the insulating material may be a prepreg, an Ajinomoto build-up film (ABF), etc. In addition, the insulating layer 131 may include a thermoplastic resin layer and a thermosetting resin layer. For example, the insulating layer 131 may include a stack in which a thermoplastic resin layer and a thermosetting resin layer are alternately stacked. The thermoplastic resin layer may include a material that effectively transmits a high-frequency signal. The thermosetting resin layer may include a material that is conducive to transmitting a high-frequency signal and has excellent bonding. Therefore, the insulating layer 131 may have excellent high-frequency signal transmission characteristics and adhesion.

[0052] The thermoplastic resin layer can be made of liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), polyimide (PI), etc. The dielectric loss factor (Df) can be adjusted according to the type of resin in the thermoplastic resin layer, the type of filler contained in the resin, the filler content, etc. The thermoplastic resin layer with low dielectric loss characteristics is conducive to transmitting high-frequency signals and reducing losses. The dielectric loss factor (Df) of the thermoplastic resin layer can be 0.003 or less. The thermoplastic resin layer can have a low dielectric constant characteristic. For example, the dielectric constant (Dk) of the thermoplastic resin layer can be 3.5 or less. The thermosetting resin layer can be made of modified polyimide (PI), modified polyphenylene ether (PPE), modified epoxy resin, etc. The dielectric loss factor (Df) can be adjusted according to the type of resin in the thermosetting resin layer, the type of filler contained in the resin, the filler content, etc. The thermosetting resin layer with low dielectric loss characteristics is conducive to transmitting high-frequency signals and reducing losses. The dielectric loss factor (Df) of the thermosetting resin layer can be 0.003 or less. In addition, the dielectric constant (Dk) of the thermosetting resin layer can be 3.5 or less.

[0053] The wiring layer 132 may include a metal material. The metal material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or an alloy thereof. The wiring layer 132 may be formed by an additive process (AP), a semi-additive process (SAP), a modified semi-additive process (MSAP), a hole sealing (TT), etc. The wiring layer 132 may include a seed layer as an electroless plating layer and an electroplating layer formed based on the seed layer. The wiring layer 132 may also include a copper foil primer. The wiring layer 132 may include a feed pattern connected to the antenna 100. In addition, the wiring layer 132 may include a ground pattern. In addition, the wiring layer 132 may include a power pattern. In addition to the feed pattern, the wiring layer 132 may also include another signal transmission pattern. These patterns may each be formed as a line pattern, a plane pattern and / or a pad pattern.

[0054] The via layer 133 may include a metal material. The metal material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or an alloy thereof. The via layer 133 may be formed by a plating process such as an additive process (AP), a semi-additive process (SAP), a modified semi-additive process (MSAP) or a sealing hole (TT). The via layer 133 may include a seed layer as an electroless plating layer and an electroplating layer formed based on the seed layer. The via layer 133 may include a connection via for connecting a feed pattern, a connection via for connecting a ground pattern, a connection via for connecting a power pattern, a connection via for connecting other signal transmission patterns, and the like.

[0055] The via layer 133 may include a first connection via 135 and a second connection via 137. The first connection via 135 and the second connection via 137 may each have at least a partial area disposed on the upper surface of the wiring structure 130.

[0056] The wiring layer 132 disposed at the upper side of the wiring structure 130 may be connected to the antenna 100 through the first connection via 135. The first connection via 135 may be connected to the pad pattern 102 of the antenna 100. The wiring layer 132 disposed at the upper side of the wiring structure 130 may be connected to the heat dissipation structure 150 to be described through the second connection via 137. The second connection via 137 may be connected to the first metal pattern layer 152 disposed at the lower side of the heat dissipation structure 150.

[0057] The first connection via 135 may include a feeding connection via and a ground connection via. The second connection via 137 may include a ground connection via.

[0058] The encapsulation material 140 may be disposed on the upper surface of the wiring structure 130. The encapsulation material 140 surrounds at least a portion of the antenna 100. The encapsulation material 140 may cover the entire side surface of the antenna 100. The encapsulation material 140 may cover at least a portion of the lower surface of the antenna 100. The encapsulation material 140 may cover at least a portion of the upper surface of the antenna 100. The encapsulation material 140 may be disposed to fill a space defined between the wiring structure 130 and the antenna 100. The encapsulation material 140 may also be disposed to fill a space defined between the wiring structure 130 and the heat dissipation structure 150.

[0059] The encapsulation material 140 may include an insulating material. The insulating material may include a thermosetting resin (such as epoxy resin) or a thermoplastic resin (such as polyimide). In addition, the insulating material may include a reinforcing material such as an inorganic filler. For example, the insulating material may be ABF or the like.

[0060] The heat dissipation structure 150 may be disposed at the periphery of the antenna 100 . That is, a through hole 150H may be formed in a central region of the heat dissipation structure 150 , and the antenna 100 may be disposed in the through hole 150H. The heat dissipation structure 150 is disposed on an upper surface of the wiring structure 130 .

[0061] The heat dissipation structure 150 effectively discharges heat generated from the antenna 100. In addition, the heat dissipation structure 150 can improve the rigidity of the antenna substrate 1. In addition, the heat dissipation structure 150 can improve the thickness uniformity of the encapsulation material 140.

[0062] The heat dissipation structure 150 may include an insulating substrate 151 , a first metal pattern layer 152 , and a second metal pattern layer 155 . In addition, the heat dissipation structure 150 may further include a metal via layer 153 .

[0063] The insulating substrate 151 has a preset thickness and is disposed at the outer circumference of the antenna 100. A through hole 150H may be formed in a central region of the insulating substrate 151. The antenna 100 is disposed in the through hole 150H.

[0064] The insulating substrate 151 may include an insulating material. The insulating material may include an insulating material reinforced with a reinforcing material such as glass fiber, for example, a copper clad laminate (CCL), a prepreg, etc. In addition, the insulating material may include glass, ceramic, plastic, etc.

[0065] The first metal pattern layer 152 is disposed on the upper surface and the lower surface of the insulating substrate 151. The first metal pattern layer 152 disposed on the upper surface of the insulating substrate 151 and the first metal pattern layer 152 disposed on the lower surface of the insulating substrate 151 may be connected to each other through a metal via layer 153 penetrating the insulating substrate 151. The first metal pattern layer 152 may further include a copper foil primer. The first metal pattern layer 152 may include a ground pattern.

[0066] The second metal pattern layer 155 is disposed on the inner surface of the insulating substrate 151. That is, the second metal pattern layer 155 may be disposed on the wall surface of the through hole 150H. The second metal pattern layer 155 may also include a copper foil primer. The second metal pattern layer 155 may include a ground pattern.

[0067] The first metal pattern layer 152, the metal via layer 153, and the second metal pattern layer 155 may each include a metal material. The metal material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The first metal pattern layer 152, the metal via layer 153, and the second metal pattern layer 155 may each be formed by an additive process (AP), a semi-additive process (SAP), a modified semi-additive process (MSAP), or a hole sealing process (TT). The first metal pattern layer 152, the metal via layer 153, and the second metal pattern layer 155 may each include a seed layer as an electroless plating layer and an electroplating layer formed based on the seed layer.

[0068] A passivation layer 160 may be disposed on a lower surface of the wiring structure 130. The passivation layer 160 may cover at least a portion of the wiring layer 132 disposed at a lower end of the wiring structure 130. The passivation layer 160 may have an opening through which a portion of the wiring layer 132 disposed at a lower end of the wiring structure 130 is exposed.

[0069] The passivation layer 160 may include an insulating material. The insulating material may include a thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as polyimide), or a material prepared by using a reinforcing material (such as an inorganic filler) together with a thermosetting resin and / or a thermoplastic resin. For example, the insulating material may be ABF or the like. In addition, the insulating material may be a solder resist (SR) including a photosensitive material.

[0070] A connection terminal 165 may be provided in the opening of the passivation layer 160. The connection terminal 165 may be connected to the wiring layer 132 provided at the lower end of the wiring structure 130. The connection terminal 165 provides a path through which the antenna substrate 1 is connected to an external component. The connection terminal 165 may be made of a low melting point metal having a melting point lower than that of copper (Cu). For example, the connection terminal 165 may be made of tin (Sn) or an alloy including tin (Sn). For example, the connection terminal 165 may be solder or the like. The connection terminal 165 may be a pad, a solder ball, a pin, or the like. In addition, the connection terminal 165 may include a copper column and solder.

[0071] Figure 2 It is shown Figure 1 FIG. 2 is a view of a region of the antenna substrate 1 where the antenna 100 is provided.

[0072] Reference Figure 2 , a shielding layer 170 may be provided on the antenna pattern 101. The shielding layer 170 is provided to cover at least a portion of the antenna pattern 101. The shielding layer 170 may be provided to cover the structure of the entire antenna pattern 101. The shielding layer 170 may be provided on the antenna pattern 101 and on at least a portion of the encapsulation material 140 adjacent to the antenna pattern 101. The shielding layer 170 is provided to have insulating properties. The shielding layer 170 may include an insulating material. The insulating material may include a thermosetting resin (such as an epoxy resin) or a thermoplastic resin (such as polyimide). In addition, the insulating material may include a reinforcing material such as an inorganic filler. For example, the insulating material may be ABF or the like. In addition, the shielding layer 170 may be made of a photosensitive encapsulant (PIE), an epoxy molding compound (EMC), or the like. The shielding layer 170 may be made of the same material as the encapsulation material 140.

[0073] The directivity adjustment pattern 180 is disposed on one surface of the antenna 100. The directivity adjustment pattern 180 is disposed along the direction in which the RF signal transmitted from the antenna pattern 101 propagates. That is, the RF signal transmitted from the antenna pattern 101 may be configured to propagate through the directivity adjustment pattern 180. The directivity adjustment pattern 180 may be disposed to face the antenna pattern 101 in the thickness direction of the antenna 100. The shielding layer 170 may be disposed between the directivity adjustment pattern 180 and the antenna pattern 101. The directivity adjustment pattern 180 may be disposed to face the antenna pattern 101 and to interpose the shielding layer 170 between the directivity adjustment pattern 180 and the antenna pattern 101. The directivity adjustment pattern 180 may be disposed on the shielding layer 170. The directivity adjustment pattern 180 may be made of a metal material. For example, the directivity adjustment pattern 180 may be made of copper or the like. The directivity adjustment pattern 180 adjusts the directivity and direction of the beam generated by the RF signal transmitted from the antenna pattern 101. The directivity adjustment pattern 180 provides regions with different heights in the upward direction / downward direction (i.e., the upward direction or the downward direction). The directivity adjustment pattern 180 includes a plurality of metal patterns arranged to be spaced apart from each other, and the directivity adjustment pattern 180 has a preset area. In this case, the width of each of the plurality of metal patterns based on one direction intersecting (e.g., orthogonal) with the upward direction / downward direction may be less than the wavelength of the RF signal. The area of ​​the surface of the directivity adjustment pattern 180 in the direction intersecting (e.g., orthogonal) with the upward direction / downward direction may correspond to the area of ​​the corresponding surface of the antenna pattern 101. The height of at least one of the plurality of metal patterns of the directivity adjustment pattern 180 may be greater than the height of each of the remaining metal patterns of the plurality of metal patterns of the directivity adjustment pattern 180. That is, the height of the region of the directivity adjustment pattern 180 arranged to improve the directivity of the beam emitted from the antenna pattern 101 in the upward direction / downward direction may be greater than the height of each of the remaining regions of the directivity adjustment pattern 180 in the upward direction / downward direction.

[0074] The directivity adjustment pattern 180 may include a first pattern area 180 a , a second pattern area 180 b , and a third pattern area 180 c .

[0075] The first pattern area 180a may be disposed at a first distance from the central area of ​​the directivity adjustment pattern 180. For example, the first pattern area 180a may be disposed in the central area of ​​the antenna pattern 101. In the present disclosure, the expression "the A pattern area of ​​the directivity adjustment pattern is disposed in the B area of ​​the antenna pattern" and similar expressions thereof may indicate that the A pattern area is disposed in an area of ​​the directivity adjustment pattern corresponding to the B area of ​​the antenna pattern.

[0076] The second pattern area 180b may be disposed at a second distance from the central area of ​​the directivity adjustment pattern 180, the second distance being longer than the first distance. For example, the second pattern area 180b may be disposed in the middle area of ​​the antenna pattern 101. The middle area of ​​the antenna pattern 101 is disposed between the central area and the edge area of ​​the antenna pattern 101. The second pattern area 180b may be disposed at the periphery of the first pattern area 180a. The second pattern area 180b may be disposed to be spaced apart from the first pattern area 180a.

[0077] The third pattern area 180c may be disposed at a third distance from the central area of ​​the directivity adjustment pattern 180, the third distance being longer than the second distance. For example, the third pattern area 180c may be disposed in an edge area of ​​the antenna pattern 101. The third pattern area 180c may be disposed at the periphery of the second pattern area 180b. The third pattern area 180c may be disposed to be spaced apart from the second pattern area 180b.

[0078] The first pattern area 180a may be set to have a height in the upward direction / downward direction greater than the height of each of the second pattern area 180b and the third pattern area 180c in the upward direction / downward direction. In addition, the second pattern area 180b may be set to have a height in the upward direction / downward direction greater than the height of the third pattern area 180c in the upward direction / downward direction. That is, the portion of the directivity adjustment pattern 180 set in the central area of ​​the antenna pattern 101 is set to have a height greater than the height of the remaining portion. Therefore, the beam emitted from the antenna pattern 101 is concentrated on the central area of ​​the antenna pattern 101.

[0079] As described above, in the directivity adjustment pattern 180, the height of one of the first, second and third pattern areas 180a, 180b and 180c may be greater than the heights of the other pattern areas of the first, second and third pattern areas 180a, 180b and 180c.

[0080] In addition, based on a plane intersecting with the thickness direction of the antenna 100, the directivity adjustment pattern 180 provides an area with different heights in the upward direction / downward direction. That is, the first pattern area 180a may provide an area with a plurality of metal patterns, and the plurality of metal patterns have different heights in the upward direction / downward direction. The second pattern area 180b may provide an area with a plurality of metal patterns in a circumferential direction around the center of the directivity adjustment pattern 180, and the plurality of metal patterns have different heights in the upward direction / downward direction. In addition, the third pattern area 180c may provide an area with a plurality of metal patterns in a circumferential direction around the center of the directivity adjustment pattern 180, and the plurality of metal patterns have different heights in the upward direction / downward direction.

[0081] The directivity adjustment pattern 180 may have a metamaterial structure. Therefore, the directivity adjustment pattern 180 may more effectively adjust the directivity of a beam emitted from the antenna pattern 101.

[0082] Figures 3 to 8 is a view showing a process of manufacturing the directivity adjustment pattern 180 .

[0083] In the following, reference will be made to Figures 3 to 8 A method of manufacturing the directivity adjustment pattern 180 is described.

[0084] Reference Figure 3 , a first mask M1 is formed on the shielding layer 170. The first mask M1 is formed in a region facing the antenna pattern 101, and the shielding layer 170 is interposed between the first mask M1 and the antenna pattern 101. The first mask M1 and a second mask M2 and a third mask M3 to be described later may be formed by photolithography using a dry film, a photoresist, or the like. The first mask M1 may be formed so that the entire region of the shielding layer 170 on which the directivity adjustment pattern 180 is to be formed is exposed.

[0085] Reference Figure 4 , a first metal layer P1 for forming the directivity adjustment pattern 180 is formed on the shielding layer 170 by using a first mask M1. The first metal layer P1 may be formed by a plating process, a deposition process, or the like.

[0086] Reference Figure 5 , a second mask M2 is additionally formed on the first mask M1. The second mask M2 is formed in a region in which the first mask M1 is formed. The second mask M2 extends in a direction opposite to a direction from the first mask M1 toward the antenna pattern 101. The second mask M2 is formed so that the second mask M2 covers a portion of the previously formed first metal layer P1 and exposes the remaining portion of the first metal layer P1. For example, the second mask M2 is formed so that the second mask M2 covers a portion of the first metal layer P1 formed in an edge region of the antenna pattern 101 and exposes a portion of the first metal layer P1 formed in a middle region and a center region of the antenna pattern 101.

[0087] Reference Figure 6 , a second metal layer P2 is formed on the remaining portion (i.e., exposed portion) of the first metal layer P1 by using a second mask M2. Since the second mask M2 covers a portion of the previously formed first metal layer P1, the second metal layer P2 may be formed on the remaining portion (i.e., exposed portion) of the first metal layer P1. For example, the second metal layer P2 may be formed on a portion of the first metal layer P1 formed in the middle region and the center region of the antenna pattern 101. The second metal layer P2 may be formed by a plating process, a deposition process, or the like.

[0088] Reference Figure 7 , a third mask M3 is additionally formed on the second mask M2. The third mask M3 is formed in the region in which the second mask M2 is formed. The third mask M3 extends in a direction opposite to the direction from the second mask M2 toward the antenna pattern 101. The third mask M3 is formed so that the third mask M3 covers the previously formed second metal layer P2 and exposes the remaining portion of the second metal layer P2. For example, the third mask M3 may be formed so that the third mask M3 covers a portion of the second metal layer P2 formed in the middle region of the antenna pattern 101 and exposes a portion of the second metal layer P2 formed in the central region of the antenna pattern 101.

[0089] Reference Figure 8 , a third metal layer P3 is formed on the remaining portion (i.e., exposed portion) of the second metal layer P2 by using a third mask M3. Because the third mask M3 covers a portion of the previously formed second metal layer P2, the third metal layer P3 is formed on the remaining portion (i.e., exposed portion) of the second metal layer P2. For example, the third metal layer P3 may be formed on a portion of the second metal layer P2 formed in the central region of the antenna pattern 101. The third metal layer P3 may be formed by a plating process, a deposition process, or the like.

[0090] Thereafter, when the first mask M1 , the second mask M2 , and the third mask M3 are removed, the first metal layer P1 , the second metal layer P2 , and the third metal layer P3 define the directivity adjustment pattern 180 .

[0091] Fig. 9 is a view showing a directivity adjustment pattern 181 according to another embodiment.

[0092] Reference Fig. 9 , the directivity adjustment pattern 181 may be disposed such that the height of the directivity adjustment pattern 181 in the upward direction / downward direction increases from one end of the edge region toward the other end of the edge region.

[0093] For example, the directivity adjustment pattern 181 may include a first pattern area 181 a , a second pattern area 181 b , and a third pattern area 181 c .

[0094] At least a partial area of ​​the first pattern area 181 a may be disposed in a central area of ​​the antenna pattern 101 .

[0095] The second pattern area 181b is disposed at opposite sides of the first pattern area 181a. At least a portion of the second pattern area 181b may be disposed in the middle area of ​​the antenna pattern 101. Fig. 91 and 2 show that the second pattern area 181b includes two metal patterns, but is not limited thereto. For example, the second pattern area 181b and the second pattern area 182b to be described later may include multiple metal patterns. Similarly, the third pattern area 181c and the third pattern area 182c to be described below may include multiple metal patterns. In addition, for simplicity, the second pattern area and the third pattern area will be directly used for description.

[0096] A plurality of second pattern areas 181b (facing each other with the first pattern area 181a interposed therebetween) may have different heights in the upward direction / downward direction. The height of the second pattern area 181b disposed on one side of the first pattern area 181a may be greater than the height of the first pattern area 181a. The height of the second pattern area 181b disposed on the other side of the first pattern area 181a may be less than the height of the first pattern area 181a.

[0097] The third pattern area 181c is disposed opposite to the first pattern area 181a, and the second pattern area 181b is disposed between the third pattern area 181c and the first pattern area 181a. The third pattern area 181c may be disposed in an edge area of ​​the antenna pattern 101. On one side of the first pattern area 181a, the height of the third pattern area 181c may be greater than the height of the second pattern area 181b adjacent to the third pattern area 181c. On the other side of the first pattern area 181a, the height of the third pattern area 181c may be less than the height of the second pattern area 181b adjacent to the third pattern area 181c.

[0098] Fig.10 is a view showing a directivity adjustment pattern 182 according to still another embodiment.

[0099] Reference Fig.10 , the directivity adjustment pattern 182 may be disposed such that a height of the directivity adjustment pattern 182 in the middle region is greater than a height in each of the central region and the edge region.

[0100] For example, the directivity adjustment pattern 182 may include a first pattern area 182a, a second pattern area 182b, and a third pattern area 182c.

[0101] At least a partial area of ​​the first pattern area 182 a may be disposed in a central area of ​​the antenna pattern 101 .

[0102] The second pattern area 182b is disposed at opposite sides of the first pattern area 182a. At least a portion of the second pattern area 182b may be disposed in a middle area of ​​the antenna pattern 101. The height of the second pattern area 182b may be greater than that of the first pattern area 182a.

[0103] The third pattern area 182c is disposed opposite to the first pattern area 182a, and the second pattern area 182b is between the third pattern area 182c and the first pattern area 182a. The third pattern area 182c may be disposed in an edge area of ​​the antenna pattern 101. The height of the third pattern area 182c may be less than the height of the second pattern area 182b. In one example, the height of the third pattern area 182c may be less than the height of the first pattern area 182a.

[0104] Fig.11 is a view showing an antenna substrate 2 according to another embodiment.

[0105] Reference Fig.11 , an antenna substrate 2 according to another embodiment includes an antenna 200 , a wiring structure 230 , a heat dissipation structure 250 , and a directivity adjustment pattern 280 .

[0106] The heat dissipation structure 250 may be configured as a conductor block. The heat dissipation structure 250 may be made of a metal material. For example, the heat dissipation structure 250 may include copper (Cu) or the like.

[0107] The heat dissipation structure 250 is disposed on the upper surface of the wiring structure 230. The heat dissipation structure 250 may be disposed at the outer periphery of the antenna 200. At least a partial area of ​​the heat dissipation structure 250 may be covered by the encapsulation material 240.

[0108] The antenna 200 includes an antenna pattern 201 and a pad pattern 202 .

[0109] The wiring structure 230 includes an insulating layer 231, a wiring layer 232, and a via layer 233. The first connection via 235 may be connected to the antenna 200. The second connection via 237 may be connected to the heat dissipation structure 250. The encapsulation material 240 may be disposed on the upper surface of the wiring structure 230. The encapsulation material 240 surrounds at least a portion of the antenna 200.

[0110] The passivation layer 260 may be disposed on a lower surface of the wiring structure 230. The connection terminal 265 may be disposed in the opening of the passivation layer 260.

[0111] Since the antenna 200 and the wiring structure 230 are similar in structure to those in the above reference Figure 1 The described antenna 100 and wiring structure 130 are the same or similar, so repeated descriptions thereof will be omitted.

[0112] The directivity adjustment pattern 280 is disposed on the antenna pattern 201. The shielding layer 270 may be disposed between the directivity adjustment pattern 280 and the antenna pattern 201. The directivity adjustment pattern 280 and the shielding layer 270 are similar to those described above. Figure 1 , Fig. 9 and Fig.10The described directivity adjustment patterns 180 , 181 , and 182 and the shielding layer 170 are the same or similar, and a repeated description thereof will be omitted.

[0113] Fig.12 is a view showing an antenna substrate 9 according to still another embodiment.

[0114] Reference Fig.12 According to still another embodiment, an antenna substrate 9 includes an antenna 910 , a wiring structure 920 , and a directivity adjustment pattern 960 .

[0115] The antenna 910 may include one surface and another surface facing the one surface. Fig.12 It is shown that one surface of the antenna 910 is oriented upward. One surface of the antenna 910 may be referred to as an upper surface of the antenna 910, and the other surface of the antenna 910 may be referred to as a lower surface of the antenna 910. In addition, the direction in which the one surface and the other surface face each other may be referred to as a thickness direction of the antenna 910.

[0116] The antenna 910 includes a guide member 911 , an antenna pattern 912 , and a dielectric layer 914 .

[0117] The guide member 911 may be disposed adjacent to one surface (i.e., the upper surface) of the antenna 910. The guide member 911 and the antenna pattern 912 matched with the guide member 911 may receive an RF signal or transmit an RF signal. A plurality of guide members 911 may be arranged to be spaced apart from each other on a plane intersecting the thickness direction of the antenna 910. Depending on the design, the guide member 911 may not be included. In addition, a plurality of guide members 911 may be spaced apart from each other in the thickness direction of the antenna 910 and arranged to define a multilayer structure.

[0118] The antenna pattern 912 is disposed toward the other surface (ie, the lower surface) of the antenna 910 to be spaced apart from the guide member 911 .

[0119] The antenna pattern 912 may be electromagnetically connected to a guide member 911 that matches the antenna pattern 912, and receive or transmit an RF signal together with the corresponding guide member 911. The antenna pattern 912 may be provided as a plurality of antenna patterns 912. The plurality of antenna patterns 912 may be arranged to be spaced apart from each other on a plane that intersects (e.g., is orthogonal to) the thickness direction of the antenna 910. The plurality of antenna patterns 912 may be matched with the plurality of guide members 911 in a one-to-one manner. The shape of the antenna pattern 912 may correspond to the shape of the guide member 911 that matches the antenna pattern 912.

[0120] The through via 913 may be electrically connected to the antenna pattern 912. The through via 913 may provide a path for an RF signal.

[0121] The dielectric layer 914 is provided to surround the antenna pattern 912. That is, the antenna pattern 912 may be provided to be embedded in the dielectric layer 914. In addition, the through-hole 913 may be formed to pass through at least a portion of the dielectric layer 914 and extend toward the other surface of the antenna 910. The dielectric layer 914 has a preset thickness. The boundary condition of the antenna pattern 912 for RF signal transmission or reception operation may be adjusted according to the length of the through-hole 913 and the thickness of the dielectric layer 914.

[0122] An insulating member 915 may be provided on the periphery of the antenna pattern 912 and the dielectric layer 914 surrounding the antenna pattern 912, respectively. In this case, the dielectric layer 914 may be provided to have a dielectric constant greater than a dielectric constant (Dk) of the insulating member 915. For example, the dielectric layer 914 may be made of glass, ceramic, silicon, quartz, polytetrafluoroethylene (e.g., Teflon), etc. Therefore, the performance of the antenna pattern 912 of the antenna 910 may be improved. Although not shown, the insulating member 915 may have a thickness corresponding to the dielectric layer 914. The insulating member 915 may be provided as a copper clad laminate (CCL), a prepreg, etc.

[0123] The plating layer 917 may be formed on the outer surface of the insulating member 915. Therefore, the plating layer 917 may be disposed between the dielectric layer 914 and the insulating member 915. In addition, the plating layer 917 may be disposed on the upper surface of the insulating member 915. The plating layer 917 may provide a boundary condition that is beneficial to the RF signal transmission or reception operation of the antenna pattern 912. Fig.12 As shown, in the thickness direction of the antenna 910 , the sum of the thickness of the plating layer 917 and the insulating member 915 is substantially equal to the thickness of the dielectric layer 914 .

[0124] A shielding layer 916 may be provided on the guide member 911. The shielding layer 916 is provided to cover at least a partial area of ​​the guide member 911. In addition, the shielding layer 916 may be provided to cover the entire guide member 911. In addition, the shielding layer 916 may be provided on the guide member 911 and on at least a partial area of ​​the dielectric layer 914 adjacent to the guide member 911. In addition, the shielding layer 916 may be provided on the guide member 911, the dielectric layer 914 and the plating layer 917. The shielding layer 916 is provided to have insulating properties. The shielding layer 916 may include an insulating material. The insulating material may include a thermosetting resin (such as an epoxy resin) or a thermoplastic resin (such as polyimide). In addition, the insulating material may include a reinforcing material, such as an inorganic filler. For example, the insulating material may be ABF, etc. In addition, the shielding layer 916 may be made of a photosensitive encapsulant (PIE), an epoxy molding compound (EMC), etc.

[0125] The antenna 910 may be disposed on one surface of the wiring structure 920. The lower surface of the antenna 910 faces one surface of the wiring structure 920. Hereinafter, one surface of the wiring structure 920 is referred to as an upper surface of the wiring structure 920. The wiring structure 920 may include an insulating layer and a wiring layer. The wiring structure 920 may have a structure similar to that of a copper redistribution layer (RDL) of a printed circuit board (PCB).

[0126] The wiring layer may be electrically connected to the antenna pattern 912 through the through via 913 and provide a path for the RF signal. In addition, the wiring layer may provide a ground area and a power area. In addition, the wiring layer may provide an electrical path between the core member 940 and the IC 930.

[0127] The IC 930 , the connection terminals 931 , the passive elements 935 , and the core member 940 may be disposed on a lower surface of the wiring structure 920 .

[0128] The IC 930 may generate an RF signal. In addition, the IC 930 may receive an RF signal received by the antenna pattern 912. The IC 930 may receive a baseband signal through the core member 940 and perform at least some of frequency conversion, amplification, filtering, phase control, and power generation of the baseband signal, thereby generating an RF signal having a millimeter wave (mmWave) frequency band (e.g., 28 GHz or 60 GHz).

[0129] The connection terminal 931 electrically connects the IC 930 to the wiring layer 932. The connection terminal 931 may electrically connect the core member 940 to the wiring layer 932. In order to improve the arrangement stability of the IC 930, the connection terminal 931 may be encapsulated with an encapsulation material. The connection terminal 931 may be an electrode, a pin, a solder ball, a pad, or the like.

[0130] The passive element 935 may provide at least one of resistance, capacitance, and inductance to the IC 930. The passive element 935 may include a multilayer ceramic capacitor (MLCC).

[0131] The core member 940 may receive a baseband signal, power, etc. The core member 940 may transmit a low frequency signal, power, etc. to the IC 930 . The core member 940 may be electrically connected to the wiring layer through the connection terminal 931 .

[0132] The directivity adjustment pattern 960 is disposed on one surface of the antenna 910. The directivity adjustment pattern 960 is disposed along the direction in which the RF signal emitted from the antenna pattern 912 propagates. The directivity adjustment pattern 960 may be disposed to face the guide member 911 in the thickness direction of the antenna 910. The directivity adjustment pattern 960 may be disposed to face the antenna pattern 912 in the thickness direction of the antenna 910. The guide member 911 may be disposed between the directivity adjustment pattern 960 and the antenna pattern 912. The shielding layer 916 may be disposed between the directivity adjustment pattern 960 and the guide member 911. The shielding layer 916 may be disposed between the directivity adjustment pattern 960 and the antenna pattern 912. The directivity adjustment pattern 960 may be disposed to face the guide member 911 with the shielding layer 916 interposed therebetween. The directivity adjustment pattern 960 may be disposed to face the antenna pattern 912 with the shielding layer 916 interposed therebetween. The directivity adjustment pattern 960 may be disposed to face the antenna pattern 912 with the shielding layer 916 and the guide member 911 interposed therebetween. The directivity adjustment pattern 960 may be disposed on the shielding layer 916. The directivity adjustment pattern 960 may be made of a metal material. The directivity adjustment pattern 960 adjusts the directivity and direction of a beam generated by an RF signal emitted from the antenna pattern 912. The directivity adjustment pattern 960 provides regions with different heights in the upward direction / downward direction. The region of the directivity adjustment pattern 960 that is disposed to improve the directivity of the beam emitted from the antenna pattern 912 has a height in the upward direction / downward direction greater than the height of each region in the upward direction / downward direction among the remaining regions of the directivity adjustment pattern 960.

[0133] In addition, the guide member 911 may be provided so as to be buried by the dielectric layer 914. In this case, the shielding layer 916 may not be included. That is, the directivity adjustment pattern 960 may be provided so as to face the guide member 911 and the antenna pattern 912 with the dielectric layer 914 interposed therebetween, and the directivity adjustment pattern 960 may be provided at the upper side of the antenna 910. In this case, the dielectric layer 914 serves as the shielding layer 916.

[0134] In addition, in the case where the guide member 911 is not included, the shielding layer 916 may not be included. That is, the directivity adjustment pattern 960 may be provided to face the antenna pattern 912, and the dielectric layer 914 is interposed between the directivity adjustment pattern 960 and the antenna pattern 912, and is provided at the upper side of the antenna 910. In this case, the dielectric layer 914 serves as the shielding layer 916.

[0135] Because the directivity adjustment pattern 960 is structurally similar to the above reference Figure 1 , Figure 2 , Fig. 9 and Fig.10 The described directivity adjustment patterns 180 , 181 , and 182 are the same or similar, so a repeated description thereof will be omitted.

[0136] In addition, the directivity adjustment pattern 960 can be obtained by referring to Figures 3 to 8 The described method is formed, and its repeated description will be omitted.

[0137] Fig.13 9 is a view showing an arrangement state of a plurality of guide members 911.

[0138] Reference Fig.13 , multiple guide members 911 may be arranged to be spaced apart from each other on a plane that intersects (e.g., is orthogonal) with the thickness direction of the antenna 910. For example, multiple guide members 911 may be arranged to define a lattice structure. Multiple guide members 911 may have shapes corresponding to each other. When viewed in the thickness direction of the antenna 910, the guide member 911 may have a quadrilateral structure. The antenna pattern 912 may have a shape corresponding to the shape of the guide member 911. Multiple antenna patterns 912 may be matched with multiple guide members 911 in a one-to-one manner.

[0139] Fig.14 is a view showing an arrangement state of a plurality of guide members 911 a according to another embodiment.

[0140] Reference Fig.14 , multiple guide members 911a may be arranged to be spaced apart from each other on a plane that intersects (e.g., is orthogonal) with the thickness direction of the antenna 910. For example, multiple guide members 911a may be arranged to define a lattice structure. Multiple guide members 911a may have shapes corresponding to each other. When viewed in the thickness direction of the antenna 910, the guide member 911a may have a circular structure. The antenna pattern 912 may have a shape corresponding to the shape of the guide member 911a. Multiple antenna patterns 912 may match multiple guide members 911a in a one-to-one manner.

[0141] like Fig.13 and Fig.14 As shown, the structure defined by the guide member 911 or 911a when viewed along the thickness direction of the antenna 910 can be adjusted to a quadrilateral shape, a circular shape, an elliptical shape, or other polygonal shapes. Therefore, characteristic factors of the antenna 910, such as the gain, half-power beam width (HPBW), bandwidth, and input impedance of the antenna 910, can be adjusted.

[0142] Although the embodiments of the present disclosure have been described in detail above, the scope of rights of the present disclosure is not limited thereto, and it should be understood that many variations and modifications made by those skilled in the art using the basic concept of the present disclosure defined in the appended claims will also fall within the scope of rights of the present disclosure.

Claims

1. An antenna substrate, comprising: An antenna including an antenna pattern configured to transmit or receive radio frequency signals; as well as A directivity adjustment pattern has a preset area and includes a plurality of metal patterns arranged to be spaced apart from each other, the directivity adjustment pattern is arranged on a surface of the antenna, and a height of at least one of the plurality of metal patterns is greater than a height of each of the remaining metal patterns of the plurality of metal patterns.

2. The antenna substrate according to claim 1, wherein: The directivity adjustment pattern is disposed to face the antenna pattern in a thickness direction of the antenna.

3. The antenna substrate according to claim 1, further comprising: a wiring structure, wherein the antenna is arranged on a surface of the wiring structure, Wherein, the antenna is a chip antenna.

4. The antenna substrate according to claim 3, further comprising: An encapsulation material is disposed on the one surface of the wiring structure and is configured to surround at least a portion of the antenna.

5. The antenna substrate according to claim 4, further comprising: The shielding layer has an insulating property and is disposed between the directivity adjustment pattern and the antenna pattern.

6. The antenna substrate according to claim 5, wherein: The shielding layer is configured to cover at least a portion of the antenna pattern.

7. The antenna substrate according to claim 5, wherein: The shielding layer is disposed on the antenna pattern and on at least a portion of a region of the encapsulation material adjacent to the antenna pattern.

8. The antenna substrate according to claim 1, further comprising: a wiring structure, wherein the antenna is arranged on a surface of the wiring structure, Wherein, the antenna further comprises: a dielectric layer configured to surround the antenna pattern; and A through via is connected to the antenna pattern, penetrates at least a portion of the dielectric layer, and extends toward the wiring structure.

9. The antenna substrate according to claim 8, wherein: The antenna further includes a guide member disposed between the directivity adjustment pattern and the antenna pattern.

10. The antenna substrate according to claim 9, further comprising: A shielding layer has an insulating property and is disposed between the directivity adjusting pattern and the guide member.

11. The antenna substrate according to claim 10, wherein: The shielding layer is disposed to cover at least a partial area of ​​the guide member.

12. The antenna substrate according to claim 10, wherein: The shielding layer is disposed on the guide member and on at least a portion of the dielectric layer adjacent to the guide member.

13. The antenna substrate according to claim 8, wherein: The antenna pattern is provided as a plurality of antenna patterns, and the plurality of antenna patterns are provided to be spaced apart from each other on a plane intersecting a thickness direction of the antenna.

14. The antenna substrate according to claim 1, wherein: The directivity adjustment pattern has a metamaterial structure.

15. The antenna substrate according to claim 1, wherein: The radio frequency signal transmitted from the antenna pattern is configured to propagate through the directivity adjustment pattern.

16. The antenna substrate according to claim 1, wherein: The plurality of metal patterns increase in height from an edge region of the directivity adjustment pattern to a center region of the directivity adjustment pattern.

17. An antenna substrate, comprising: An antenna including an antenna pattern configured to transmit or receive radio frequency signals; as well as a directivity adjustment pattern having a preset area and including a plurality of metal patterns arranged to be spaced apart from each other, the directivity adjustment pattern being arranged on one surface of the antenna, Wherein, the directional adjustment pattern includes: a first pattern area disposed at a first distance from a central area of ​​the directivity adjustment pattern; and a second pattern area disposed at a second distance from the central area of ​​the directivity adjustment pattern, the second distance being longer than the first distance, and Wherein, a height of one of the first pattern area and the second pattern area is greater than a height of the other of the first pattern area and the second pattern area.

18. The antenna substrate according to claim 17, wherein: The plurality of metal patterns of the first pattern area have different heights in an upward direction or a downward direction.

19. The antenna substrate according to claim 17 or 18, wherein: The plurality of metal patterns of the second pattern area have different heights in an upward direction or a downward direction.

20. A method for manufacturing an antenna substrate, the method comprising: forming a first mask on a shielding layer for an antenna having an antenna pattern configured to transmit or receive a radio frequency signal; forming a first metal layer on the shielding layer by using the first mask; forming a second mask on the first mask so that the second mask covers a portion of the first metal layer and exposes the rest of the first metal layer; forming a second metal layer on the remaining portion of the first metal layer by using the second mask; as well as The first mask and the second mask are removed, and a directivity adjustment pattern providing regions having different heights in an upward direction or a downward direction on the antenna is formed by the first metal layer and the second metal layer.

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