Light-emitting panel, preparation method thereof and display device

Abstract

The invention discloses a light-emitting panel and a preparation method thereof and a display device, the light-emitting panel comprises a driving backboard, an insulating substrate, an electric connection part and a light-emitting diode, the driving backboard comprises a first surface and an electrode layer located on the first surface, and the electrode layer comprises a plurality of electrode terminals arranged at intervals; the insulating substrate is located on the first surface, the thickness of the insulating substrate is larger than that of the electrode layer, the insulating substrate comprises opening parts in one-to-one correspondence with the electrode terminals, and orthographic projections of the opening parts on the first surface and orthographic projections of the corresponding electrode terminals on the first surface are at least partially overlapped; the electric connecting part is positioned in the opening part and is connected with the electrode terminal; the light-emitting diode is located on the side, away from the driving backboard, of the insulating substrate and comprises an electrode part, and the electrode part is connected with the electric connection part. The display effect of the light-emitting panel provided by the invention is remarkably improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a light-emitting panel and a preparation method thereof, and a display device. Background Art

[0002] At present, a bonding process is usually used to achieve electrical connection between a micro light emitting diode (Micro-LED) and a driving substrate. The electrodes of the micro-LED and the binding terminals of the driving substrate are electrically connected through bonding metals. However, different bonding metals have height inconsistencies, which can easily cause the light-emitting surface of the micro-LED to be uneven, thereby seriously affecting the display effect. Summary of the invention

[0003] The purpose of the present application is to at least solve the problem of poor display effect of the light-emitting panel. This purpose is achieved through the following technical solutions:

[0004] A first aspect of the present application provides a light-emitting panel, characterized in that it comprises:

[0005] A driving backplane, the driving backplane comprising a first surface and an electrode layer located on the first surface, the electrode layer comprising a plurality of electrode terminals arranged at intervals;

[0006] an insulating substrate, located on the first surface, wherein the thickness of the insulating substrate is greater than the thickness of the electrode layer, the insulating substrate comprises openings corresponding to the electrode terminals one by one, and the orthographic projections of the openings on the first surface at least partially overlap with the orthographic projections of the corresponding electrode terminals on the first surface;

[0007] an electrical connection portion, located in the opening and connected to the electrode terminal;

[0008] The light emitting diode is located on a side of the insulating substrate away from the driving backplane, and the light emitting diode includes an electrode portion, and the electrode portion is connected to the electrical connection portion.

[0009] The light-emitting panel provided in the present application includes a driving backplane, an insulating substrate, an electrical connection part and a light-emitting diode, wherein a driving circuit is formed in the driving backplane for driving the light-emitting diode to emit light, thereby realizing the display of the light-emitting panel. The driving backplane includes a first surface and an electrode layer located on the first surface, the electrode layer includes a plurality of electrode terminals arranged at intervals, and the plurality of electrode terminals are arranged in pairs. The light-emitting diode includes an electrode part, each light-emitting diode includes a first electrode part and a second electrode part, the first electrode part is connected to one of each pair of electrode terminals, and the second electrode part is connected to the other of each pair of electrode terminals, thereby forming a passage. Specifically, the first electrode part may be a cathode, and the second electrode part may be an anode. The electrode part is connected to the electrode terminal through an electrical connection part. By providing an insulating substrate, the height of the electrical connection part can be limited, thereby improving the height uniformity between the electrical connection parts. Specifically, the insulating substrate is located on the first surface, the thickness of the insulating substrate is greater than the thickness of the electrode layer, and an opening is formed on the insulating substrate, the opening corresponds to the electrode terminal one by one and exposes at least part of the surface of the electrode terminal on the side away from the first surface, that is, the orthographic projection of the opening on the first surface overlaps at least partly with the orthographic projection of the corresponding electrode terminal on the first surface, so as to facilitate the subsequent contact and connection between the electrical connection part and the electrode terminal. The electrical connection part is located in the opening part and is connected to the electrode terminal. By arranging the electrical connection part inside the opening part of the insulating substrate, that is, the electrical connection part does not exceed the opening part, the height of the electrical connection part can be limited, which helps to improve the uniformity of the height of the electrical connection part, that is, reduce the difference in distance between the surface of the side of the different electrical connection parts away from the driving backplane and the first surface, thereby helping to improve the flatness of the light-emitting surface of the light-emitting diode, thereby improving the brightness and chromaticity differences caused by the unevenness of the light-emitting surface, improving the uniformity of the display brightness and chromaticity, and improving the display effect. At the same time, the position of the electrical connection part can be limited by providing an insulating substrate, and the electrical connection part can be provided inside the opening to prevent short circuit caused by mutual connection between the electrical connection parts during the electrical connection process, which helps to improve the yield of the light-emitting panel.

[0010] In some embodiments of the present application, a surface of the electrical connection portion facing away from the driving back plate is flush with a surface of the insulating substrate facing away from the driving back plate.

[0011] In some embodiments of the present application, an orthographic projection of one end of the opening portion close to the electrode terminal on the first surface is located within the orthographic projection of the electrode terminal on the first surface.

[0012] In some embodiments of the present application, the orthographic projection of the electrode terminal on the first surface is located on the inner side of the orthographic projection of one end of the opening close to the electrode terminal on the first surface.

[0013] In some embodiments of the present application, the electrical connection portion includes:

[0014] a seed layer located on at least a portion of the surface within the opening;

[0015] The bonding material is located in the opening and in contact with a surface of the seed layer that is away from the driving back plate.

[0016] In some embodiments of the present application, the seed layer has a thickness ranging from 100 nm to 500 nm; and / or,

[0017] The material of the seed layer includes at least one of copper, gold, aluminum, palladium and rhodium.

[0018] In some embodiments of the present application, the electrical connection portion includes a plurality of conductive layers stacked in a direction away from the electrode terminal, and the material of the conductive layers includes at least one of copper, gold, aluminum, palladium and rhodium.

[0019] In some embodiments of the present application, the thickness of the insulating substrate is in the range of 8 μm-12 μm.

[0020] In some embodiments of the present application, the material of the insulating substrate includes ceramic or light-shielding resin material.

[0021] In some embodiments of the present application, the surface roughness of a surface of the insulating substrate on a side facing away from the driving backplane is less than or equal to 15 nanometers; and / or,

[0022] The surface roughness of a surface of the electrical connection portion facing away from the driving back plate is less than or equal to 15 nanometers.

[0023] The second aspect of the present application also provides a method for preparing a light-emitting panel, comprising:

[0024] A driving backplane and a light emitting diode are provided, wherein the driving backplane comprises a first surface and an electrode layer located on the first surface, the electrode layer comprises a plurality of electrode terminals arranged at intervals, and the light emitting diode comprises an electrode portion;

[0025] An insulating substrate is formed on the first surface where the electrode layer is provided, wherein the thickness of the insulating substrate is greater than the thickness of the electrode layer, and the insulating substrate includes openings corresponding to the electrode terminals one by one, and the orthographic projections of the openings on the first surface at least partially overlap with the orthographic projections of the corresponding electrode terminals on the first surface;

[0026] forming an electrical connection portion in the opening, the electrical connection portion being connected to the electrode terminal;

[0027] The electrode portion of the light emitting diode is connected to a surface of the electrical connection portion which is away from the driving backplane.

[0028] In some embodiments of the present application, forming an electrical connection portion in the opening portion includes:

[0029] forming a seed layer on at least a portion of the surface within the opening;

[0030] A bonding material is formed in the opening where the seed layer is formed, the bonding material contacts a surface of the seed layer on one side away from the driving back plate and fills the opening.

[0031] In some embodiments of the present application, forming a seed layer on at least a portion of the surface in the opening includes:

[0032] forming an auxiliary layer on a side of the insulating substrate away from the first surface, the auxiliary layer comprising a shielding portion and a hollow portion, the hollow portion corresponding to the opening portion, and the shielding portion being located on a side of the insulating substrate away from the first surface;

[0033] Depositing a seed film on a side of the auxiliary layer away from the driving back plate;

[0034] The auxiliary layer and the seed film on the surface of the auxiliary layer are removed, and the seed film on the surface in the opening is left to form the seed layer.

[0035] In some embodiments of the present application, the step of forming a bonding material in the opening where the seed layer is formed includes:

[0036] The bonding material is formed by an electroplating process; or,

[0037] A metal slurry is injected into the opening and solidified.

[0038] In some embodiments of the present application, forming an electrical connection portion in the opening portion includes:

[0039] A plurality of conductive layers are sequentially formed in the opening, and a material of the conductive layers includes at least one of copper, gold, aluminum, palladium, and rhodium.

[0040] In some embodiments of the present application, it also includes:

[0041] The surface of the electrical connection portion facing away from the driving back plate is polished so that the surface of the electrical connection portion facing away from the driving back plate is flush with the surface of the insulating substrate facing away from the driving back plate.

[0042] The third aspect of the present application further provides a display device, comprising any one of the light-emitting panels provided in the first aspect of the present application, or comprising a light-emitting panel prepared by any one of the light-emitting panel preparation methods provided in the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0044] Figure 1 It is a partial structural schematic diagram of a light-emitting panel in the prior art;

[0045] Figure 2 is a cross-sectional view of a light-emitting panel provided in an embodiment of the present application;

[0046] Figure 3 yes Figure 2 The first cross-sectional view along the M-M' line;

[0047] Figure 4 yes Figure 2 The second cross-sectional view along the middle line M-M';

[0048] Figure 5 yes Figure 2 A third cross-sectional view along the middle line M-M';

[0049] Figure 6 yes Figure 2 A fourth cross-sectional view along the middle line M-M';

[0050] Figure 7 yes Figure 2 The fifth cross-sectional view along the middle line M-M';

[0051] Figure 8 yes Figure 2 The sixth cross-sectional view along the middle line M-M';

[0052] Fig. 9 is a flow chart of a method for preparing a light-emitting panel provided in an embodiment of the present application;

[0053] Figures 10 to 18 It is a schematic diagram of film layer changes during the preparation process of a light-emitting panel provided in an embodiment of the present application;

[0054] Fig.19 This is a schematic diagram of a display device provided in an embodiment of the present application.

[0055] The reference numerals are as follows:

[0056] 01. Micro-LED; 02. Driving substrate; 03. Binding terminal; 04. Bonding metal; 05. Electrode; 1. Light-emitting panel; 11. Driving backplane; 111. First surface; 112. Electrode terminal; 12. Insulating substrate; 121. Opening; 13. Electrical connection; 131. Seed layer; 132. Bonding material; 133. Conductive layer; 134. Metal layer; 14. Light-emitting diode; 141. Electrode; 15. Auxiliary layer; 151. Shielding; 152. Hollow part; 16. Seed film; 17. Microlens; 18. Encapsulation layer; 2. Display device. DETAILED DESCRIPTION

[0057] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0058] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0059] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0060] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0061] According to research, at present, the micro-LED 01 (Micro Light Emitting Diode, Micro-LED) and the driving substrate 02 are usually electrically connected by a bonding process, that is, the electrode 05 of the micro-LED 01 and the binding terminal 03 of the driving substrate 02 are electrically connected by a bonding metal 04, but different bonding metals 04 have the problem of uneven height, such as Figure 1 As shown, there is generally a height difference of several microns, which easily leads to an uneven light-emitting surface of the micro-LED 01. In particular, for the red, green, and blue three-in-one micro-LED 01, due to the existence of its light type, the brightness and chromaticity of the micro-LED 01 at each angle are inconsistent. When the light-emitting surface is uneven, the brightness and chromaticity uniformity of the displayed image will deteriorate, thereby seriously affecting the display effect. Therefore, the present application provides a light-emitting panel and a preparation method thereof, and a display device, which effectively improves the display effect of the light-emitting panel.

[0062] like Figure 2 and Figure 3As shown, according to an embodiment of the present application, a light-emitting panel 1 is proposed, which includes a driving backplane 11, an insulating substrate 12, an electrical connection portion 13 and a light-emitting diode 14. The driving backplane 11 includes a first surface 111 and an electrode layer located on the first surface 111, and the electrode layer includes a plurality of electrode terminals 112 arranged at intervals. The insulating substrate 12 is located on the first surface 111, and the thickness of the insulating substrate 12 is greater than the thickness of the electrode layer. The insulating substrate 12 includes an opening portion 121 corresponding to the electrode terminal 112 one by one, and the orthographic projection of the opening portion 121 on the first surface 111 overlaps at least partially with the orthographic projection of the corresponding electrode terminal 112 on the first surface 111. The electrical connection portion 13 is located in the opening portion 121 and is connected to the electrode terminal 112. The light-emitting diode 14 is located on the side of the insulating substrate 12 away from the driving backplane 11, and the light-emitting diode 14 includes an electrode portion 141, and the electrode portion 141 is connected to the electrical connection portion 13.

[0063] The light-emitting panel 1 provided in the present application includes a driving backplane 11, an insulating substrate 12, an electrical connection portion 13 and a light-emitting diode 14, wherein a driving circuit is formed in the driving backplane 11 for driving the light-emitting diode 14 to emit light, thereby realizing the display of the light-emitting panel 1. The driving backplane 11 includes a first surface 111 and an electrode layer located on the first surface 111, and the electrode layer includes a plurality of electrode terminals 112 arranged at intervals, and the plurality of electrode terminals 112 are arranged in pairs. The light-emitting diode 14 includes an electrode portion 141, and each light-emitting diode 14 includes a first electrode portion 141 and a second electrode portion 141, and the first electrode portion 141 is connected to one of each pair of electrode terminals 112, and the second electrode portion 141 is connected to the other of each pair of electrode terminals 112, thereby forming a passage. Specifically, the first electrode portion 141 can be a cathode, and the second electrode portion 141 can be an anode. The electrode portion 141 is connected to the electrode terminal 112 through the electrical connection portion 13. The insulating substrate 12 is provided to limit the height of the electrical connection portion 13, thereby improving the height uniformity between the electrical connection portions 13. Specifically, the insulating substrate 12 is located on the first surface 111, the thickness of the insulating substrate 12 is greater than the thickness of the electrode layer, and an opening 121 is formed on the insulating substrate 12, the opening 121 corresponds to the electrode terminal 112 one by one and exposes at least part of the surface of the electrode terminal 112 facing away from the first surface 111, that is, the orthographic projection of the opening 121 on the first surface 111 overlaps at least partly with the orthographic projection of the corresponding electrode terminal 112 on the first surface 111, so as to facilitate the subsequent contact and connection between the electrical connection portion 13 and the electrode terminal 112. The electrical connection part 13 is located in the opening 121 and is connected to the electrode terminal 112. By setting the electrical connection part 13 inside the opening 121 of the insulating substrate 12, that is, the electrical connection part 13 does not exceed the opening 121, the height of the electrical connection part 13 can be limited, which helps to improve the height uniformity of the electrical connection part 13, that is, reduce the difference in the distance between the surface of the different electrical connection parts 13 away from the driving backplane 11 and the first surface 111, thereby helping to improve the flatness of the light-emitting surface of the light-emitting diode 14, and then improve the brightness and chromaticity differences caused by the unevenness of the light-emitting surface, improve the uniformity of the displayed brightness and chromaticity, and improve the display effect. At the same time, by setting the insulating substrate 12, the position of the electrical connection part 13 can be limited. By setting the electrical connection part 13 inside the opening 121, the electrical connection parts 13 can be prevented from being connected to each other during the electrical connection process to cause a short circuit, which helps to improve the yield of the light-emitting panel 1.

[0064] In the above implementation, if Figure 3 As shown, the light emitting diode 14 may be a single-color light emitting diode 14, such as a red light emitting diode 14, a green light emitting diode 14, a blue light emitting diode 14, etc., or as Figure 4As shown, the light-emitting diode 14 can be a three-in-one red, green and blue light-emitting diode 14. Due to its light type, the brightness and chromaticity of the light-emitting diode 14 at different angles are inconsistent. When the flatness of the light-emitting surface is improved, the brightness and chromaticity uniformity of the picture displayed by the light-emitting panel 1 can be improved, thereby improving the display effect.

[0065] In a possible implementation, Figure 3 and Figure 4 As shown, the surface of the electrical connection portion 13 facing away from the driving back plate 11 is flush with the surface of the insulating substrate 12 facing away from the driving back plate 11 .

[0066] In the above embodiment, the surface of the electrical connection portion 13 away from the driving backplane 11 is flush with the surface of the insulating substrate 12 away from the driving backplane 11. On the one hand, it helps to reduce the difference in the distance between the surface of the side of the electrical connection portion 13 away from the driving backplane 11 and the first surface 111, thereby improving the flatness of the light-emitting surface of the light-emitting diode 14, thereby improving the brightness and chromaticity differences caused by the unevenness of the light-emitting surface, improving the uniformity of the displayed brightness and chromaticity, and improving the display effect. On the other hand, it helps to improve the connection yield between the electrical connection portion 13 and the electrode portion 141, and reduce the problem that the electrical connection portion 13 is difficult to connect with the electrode portion 141 due to its too low height, wherein the height of the electrical connection portion 13 is the distance between the surface of the side of the electrical connection portion 13 away from the first surface 111 and the first surface 111.

[0067] In a feasible implementation manner, the orthographic projection of one end of the opening 121 close to the electrode terminal 112 on the first surface 111 is located within the orthographic projection of the electrode terminal 112 on the first surface 111 .

[0068] In the above embodiment, the orthographic projection of one end of the opening 121 close to the electrode terminal 112 on the first surface 111 is located within the orthographic projection of the electrode terminal 112 on the first surface 111, including: Figure 5 As shown, the orthographic projection of one end of the opening 121 close to the electrode terminal 112 on the first surface 111 coincides with the edge of the orthographic projection of the electrode terminal 112 on the first surface 111, or Figure 4 As shown, the edge of the orthographic projection of one end of the opening 121 close to the electrode terminal 112 on the first surface 111 is located inside the edge of the orthographic projection of the electrode terminal 112 on the first surface 111 .

[0069] In the above embodiment, the opening 121 only exposes part or all of the surface of the electrode terminal 112 that is away from the first surface 111, and does not expose the first surface 111. The electrical connection portion 13 is in contact with the surface of the electrode terminal 112 that is away from the first surface 111, and the volume of the electrical connection portion 13 is small, which can save the material of the electrical connection portion 13 and reduce the material cost.

[0070] In another possible implementation, if Figure 6 As shown, the orthographic projection of the electrode terminal 112 on the first surface 111 is located on the inner side of the orthographic projection of one end of the opening 121 close to the electrode terminal 112 on the first surface 111 .

[0071] In the above embodiment, the opening portion 121 is arranged around the circumference of the electrode terminal 112, so that the electrical connection portion 13 can be arranged in contact with the circumferential side surface of the electrode terminal 112 and the side surface of the electrode terminal 112 facing away from the first surface 111, thereby increasing the contact area between the electrical connection portion 13 and the electrode terminal 112, thereby reducing the resistance. At the same time, the volume of the electrical connection portion 13 is larger, which can further reduce the resistance.

[0072] In a possible implementation, Figure 7 As shown, the electrical connection portion 13 includes a seed layer 131 and a bonding material 132. The seed layer 131 is located on at least a portion of the surface in the opening 121. The bonding material 132 is located in the opening 121 and contacts the surface of the seed layer 131 facing away from the driving backplane 11.

[0073] In the above embodiment, when the bonding material 132 is formed by electroplating, the electrical connection portion 13 may include a seed layer 131 and a bonding material 132. The seed layer 131 may be formed by a sputtering process. When preparing the bonding material 132, the seed layer 131 acts as a cathode. During the electroplating process, the anode may be made of a material with a higher activity than the cathode. For example, the seed layer 131 may be made of copper, the anode may be made of aluminum, iron, zinc, etc., and the electroplating solution may be made of copper sulfate. The metal ions in the electroplating solution may form the bonding material 132 located on the surface of the seed layer 131 during the electroplating process.

[0074] In the above embodiment, the seed layer 131 can be located on the inner side wall and the bottom wall of the opening 121 (i.e., the side surface of the electrode terminal 112 facing away from the first surface 111), thereby accelerating the preparation speed of the bonding material 132 and improving the filling yield of the bonding material 132 for the opening 121.

[0075] In a feasible implementation manner, the thickness of the seed layer 131 ranges from 100 nm to 500 nm.

[0076] In the above-mentioned embodiment, if the seed layer 131 is too thick, the preparation time of the seed layer 131 will be increased, and if the seed layer 131 is too thin, the feasibility of the process of forming the bonding material 132 by electroplating will be affected.

[0077] Specifically, the thickness of the seed layer 131 may be 100 nm, 101 nm, 110 nm, 111 nm, 125 nm, 133 nm, 149 nm, 166 nm, 230 nm, 248 nm, 299 nm, 300 nm, 365 nm, 377 nm, 390 nm, 400 nm, 450 nm, 480 nm, 500 nm, or the like.

[0078] In a feasible implementation manner, the material of the seed layer 131 includes at least one of copper, gold, aluminum, palladium and rhodium.

[0079] Specifically, the seed layer 131 may be made of a single metal such as copper, gold, aluminum, palladium or rhodium, or may be made of an alloy including at least part of the elements of copper, gold, aluminum, palladium or rhodium.

[0080] In a possible implementation, Figure 8 As shown, the electrical connection portion 13 includes a plurality of conductive layers 133 stacked in a direction away from the electrode terminal 112 , and the material of the conductive layer 133 includes at least one of copper, gold, aluminum, palladium and rhodium.

[0081] In the above embodiment, the multi-layered conductive layer 133 can increase the mechanical stress of the electrical connection portion 13 and the bonding strength between the electrical connection portion 13 and the electrode portion 141 and the electrode terminal 112 , thereby improving the stability and reliability of the light-emitting panel 1 .

[0082] In a feasible implementation manner, the thickness of the insulating substrate 12 is in the range of 8 μm-12 μm.

[0083] Specifically, the thickness of the insulating substrate 12 may be 8 μm, 9 μm, 10 μm, 1 μm, 12 μm, or the like.

[0084] In the above embodiment, the thickness of the insulating substrate 12 is limited to 8 μm-12 μm, so that the thickness of the electrical connection portion 13 along the thickness direction of the driving backplane 11 can be guaranteed to ensure the yield of the electrical connection.

[0085] In a feasible implementation manner, the material of the insulating substrate 12 includes ceramic or light-shielding resin material.

[0086] In the above embodiment, on the one hand, the insulating substrate 12 is made of insulating material, and the insulating substrate 12 plays the role of limiting the position of the electrical connection part 13 and insulating, so that the height difference between different electrical connection parts 13 can be reduced while improving the problem of short circuit of adjacent electrical connection parts 13, so as to improve the flatness of the light-emitting surface of the light-emitting diode 14 and improve the connection yield of the light-emitting diode 14 and the driving backplane 11. On the other hand, the insulating substrate 12 can be made of a material with strong high temperature resistance and good heat dissipation, such as ceramic, so that the heat generated by the light-emitting diode 14 can be quickly diffused, the performance of the light-emitting diode 14 can be improved, and the insulating substrate 12 can be avoided from having adverse effects when preparing subsequent film layers. For example, in the process of preparing the bonding material 132 at high temperature, the adverse effects of the heat of the bonding material 132 during preparation on the insulating substrate 12 can be reduced.

[0087] In the above embodiment, the insulating substrate 12 may be made of a light-shielding material, thereby reducing the crosstalk between adjacent light-emitting diodes 14 .

[0088] In a feasible implementation manner, the surface roughness of the surface of the insulating substrate 12 on the side facing away from the driving backplane 11 is less than or equal to 15 nanometers.

[0089] In the above embodiment, the surface of the insulating substrate 12 facing away from the driving back plate 11 includes a surface parallel to the first surface 111 and an inner wall of the opening 121 .

[0090] In the above embodiment, by setting the surface roughness of the side surface of the insulating substrate 12 away from the driving backplane 11 to be less than or equal to 15 nanometers, the surface roughness of the side surface of the insulating substrate 12 away from the driving backplane 11 can be made smaller, which helps to improve the uniformity of the thickness of the film layer, that is, helps to improve the uniformity of the seed layer 131, thereby helping to improve the preparation yield of the seed layer 131 and the preparation yield of the bonding material 132.

[0091] Specifically, the surface roughness of the surface of the insulating substrate 12 on one side facing away from the driving back plate 11 may be 1 nm, 5 nm, 8 nm, 9 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, etc.

[0092] In a feasible implementation manner, the surface roughness of a surface of the electrical connection portion 13 facing away from the driving back plate 11 is less than or equal to 15 nanometers.

[0093] In the above embodiment, the surface roughness of the surface of the connection portion facing away from the driving back plate 11 is set to be less than or equal to 15 nanometers, so that the connection effect between the connection portion and the electrode portion 141 can be improved.

[0094] Specifically, the surface roughness of the surface of the electrical connection portion 13 facing away from the driving back plate 11 may be 1 nm, 4 nm, 5 nm, 10 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, etc.

[0095] The present application also provides a method for preparing the light-emitting panel 1, such as Fig. 9 As shown, including:

[0096] S200, such as Fig.10 As shown, a driving backplane 11 and a light emitting diode 14 are provided. The driving backplane 11 includes a first surface 111 and an electrode layer located on the first surface 111 . The electrode layer includes a plurality of electrode terminals 112 arranged at intervals. The light emitting diode 14 includes an electrode portion 141 .

[0097] Specifically, the LED 14 may be a single-color LED 14 , such as a red LED 14 , a green LED 14 , a blue LED 14 , etc., or the LED 14 may be a three-in-one LED 14 of red, green and blue.

[0098] S400, such as Fig.11 As shown, an insulating substrate 12 is formed on a first surface 111 provided with an electrode layer, the thickness of the insulating substrate 12 is greater than the thickness of the electrode layer, and the insulating substrate 12 includes openings 121 corresponding one-to-one to the electrode terminals 112, and the orthographic projection of the openings 121 on the first surface 111 at least partially overlaps with the orthographic projection of the corresponding electrode terminal 112 on the first surface 111.

[0099] Specifically, the preparation process of the insulating substrate 12 may include: forming an insulating material layer on the side of the electrode layer of the driving backplane 11 away from the first surface 111 and in the area on the first surface 111 not covered by the electrode terminal 112, and then patterning the insulating material layer to form the insulating substrate 12, forming an opening portion 121 in the insulating material layer in the area opposite to the electrode terminal 112, and the opening portion 121 penetrates the insulating material layer along the thickness direction of the insulating material layer and exposes at least a portion of the surface of the side of the electrode terminal 112 away from the first surface 111.

[0100] S600, such as Fig.12 As shown, the electrical connection portion 13 is formed in the opening portion 121 , and the electrical connection portion 13 is connected to the electrode terminal 112 .

[0101] S800, such as Figure 7 As shown, the electrode portion 141 of the light emitting diode 14 is connected to a surface of the electrical connection portion 13 which is away from the driving backplane 11 .

[0102] Specifically, the method includes aligning the electrode portion 141 of the light emitting diode 14 and the electrical connection portion 13 in a direction perpendicular to the first surface 111 and bonding them together.

[0103] In the above preparation method, an insulating substrate 12 is formed on a first surface 111 on which an electrode layer is provided in a driving backplane 11, and openings 121 corresponding to the electrode terminals 112 are formed on the insulating substrate 12. Between each pair of corresponding electrode terminals 112 and the openings 121, the openings 121 expose at least a portion of a side surface of the electrode terminal 112 away from the first surface 111, and an electrical connection portion 13 is formed in the openings 121. The electrical connection portion 13 corresponds to the electrode terminal 112 one by one and is connected to each other. The driving backplane 11 limits the electrical connection portion 13 in the openings 121, so that on the one hand, the height of the electrical connection portion 13 can be limited, and the height difference between different electrical connection portions 13 can be reduced, so that the flatness of the light-emitting surface of the light-emitting diode 14 can be improved, thereby improving the brightness uniformity and chromaticity uniformity of the display image, thereby improving the display effect. On the other hand, by driving the opening 121 in the back panel 11, the electrical connection part 13 can be confined within the opening 121, thereby isolating adjacent electrical connection parts 13 from each other, thereby reducing the risk of adjacent electrical connection parts 13 being connected to each other and short-circuiting, which helps to improve the yield of the light-emitting panel 1.

[0104] In the above-mentioned embodiment, the material of the driving backplane 11 may include a ceramic material, and the preparation method includes: using a physical method such as vacuum thermal evaporation or magnetron sputtering, or a chemical method such as metal-organicchemical vapor deposition (MOCVD) or chemical vapor deposition (CVD), or a process of mixing a ceramic particle slurry, spin-coating it on the first surface 111, and then sintering it for preparation.

[0105] In a possible implementation, Fig.12 As shown, step S600 includes:

[0106] S620 , forming a seed layer 131 on at least a portion of the surface in the opening 121 .

[0107] S640 , forming a bonding material 132 in the opening 121 where the seed layer 131 is formed. The bonding material 132 contacts a surface of the seed layer 131 on a side away from the driving back plate 11 and fills the opening 121 .

[0108] In the above embodiment, the seed layer 131 may be prepared by a sputtering process.

[0109] In the above-mentioned embodiment, the bonding material 132 may be prepared by an electroplating process, or may be prepared by injecting metal slurry and curing at high temperature.

[0110] In the above embodiment, in order to ensure the yield and speed of forming the bonding material 132 by the electroplating process, the seed layer 131 can cover the inner surface of the opening 121 and the side surface of the electrode terminal 112 away from the first surface 111. In the process of forming the bonding material 132 by the electroplating process, the seed layer 131 acts as a cathode and works together with the anode and the electroplating solution to form the bonding material 132.

[0111] In the above embodiment, the bonding material 132 fills the opening 121, so that the side surface of the bonding material 132 facing away from the first surface 111 can be flush with the side surface of the driving backplane 11 facing away from the first surface 111. On the one hand, it is convenient for the subsequent connection between the electrical connection part 13 and the electrode part 141 to prevent the problem of poor contact and help improve the connection stability between the electrical connection part 13 and the electrode part 141. On the other hand, it can further improve the height consistency of the electrical connection part 13, thereby improving the flatness of the light-emitting surface of the light-emitting diode 14.

[0112] In a feasible implementation manner, S620 includes:

[0113] S621, such as Fig.13 As shown, an auxiliary layer 15 is formed on the side of the insulating substrate 12 away from the first surface 111 , and the auxiliary layer 15 includes a blocking portion 151 and a hollow portion 152 . The hollow portion 152 corresponds to the opening 121 , and the blocking portion 151 is located on the side of the insulating substrate 12 away from the first surface 111 .

[0114] S622, such as Fig.14 As shown, a seed film 16 is deposited on the side of the auxiliary layer 15 facing away from the driving back plate 11 .

[0115] S623, such as Fig.15 As shown, the auxiliary layer 15 and the seed film 16 on the surface of the auxiliary layer 15 are removed, and the seed film 16 on the surface in the opening 121 remains to form a seed layer 131 .

[0116] In the above embodiment, the material of the auxiliary layer 15 may include optical glue, and the auxiliary layer 15 may be prepared as a whole layer first, and the position opposite to the opening 121 may be exposed and developed to form the hollow portion 152. The seed film 16 may be prepared as a whole layer, that is, the seed film 16 may cover the surface of the side of the shielding portion 151 away from the driving back plate 11 and cover the inner wall of the opening 121 and the bottom wall of the opening 121. Then, the auxiliary layer 15 is removed to simultaneously remove the portion of the seed layer 131 located on the side of the shielding portion 151 away from the driving back plate 11, and only the portion located in the opening 121 is retained. Thus, the preparation of the seed layer 131 is completed.

[0117] In a feasible implementation manner, step S640 includes:

[0118] The bonding material 132 is formed by an electroplating process; or,

[0119] Metal paste is injected into the opening 121 and solidified.

[0120] In the above embodiment, when the bonding material 132 is formed by electroplating, the seed layer 131 is equivalent to the cathode. The bonding material 132 is formed by electroplating at a lower temperature, which has little effect on the driving backplane 11, the insulating substrate 12, etc.

[0121] In the above embodiment, the bonding material 132 may be formed by injecting metal slurry and curing at high temperature. In this case, the preparation of the seed layer 131 may be omitted.

[0122] In a feasible implementation manner, step S600 includes:

[0123] like Fig.16 As shown, multiple conductive layers 133 are sequentially formed in the opening 121 , and the material of the conductive layers 133 includes at least one of copper, gold, aluminum, palladium, and rhodium.

[0124] In the above embodiment, the multi-layer conductive layer 133 may include seed layers 131 and metal layers 134 that are alternately arranged, and a seed layer 131 is arranged on the surface of one side of any metal layer 134 close to the driving backplane 11, and the upper metal layer 134 is formed by electroplating by using the lower seed layer 131 as a cathode.

[0125] In the above embodiment, each conductive layer 133 may also be formed by injecting metal slurry and curing it.

[0126] In a feasible implementation manner, the method for preparing the light-emitting panel 1 further includes:

[0127] The surface of the electrical connection portion 13 facing away from the driving back plate 11 is polished so that the surface of the electrical connection portion 13 facing away from the driving back plate 11 is flush with the surface of the insulating substrate 12 facing away from the driving back plate 11 .

[0128] In the above embodiment, the surface of the electrical connection portion 13 away from the driving backplane 11 can be processed by chemical mechanical polishing, which can ensure that the surface of the electrical connection portion 13 away from the driving backplane 11 is flush with the surface of the insulating substrate 12 away from the driving backplane 11, thereby helping to improve the flatness of the light-emitting surface of the light-emitting diode 14. On the other hand, by processing the surface of the electrical connection portion 13 away from the driving backplane 11, the flatness of the surface of the electrical connection portion 13 away from the first surface 111 and the activity of the metal ions can be ensured, and the surface impurities and the oxide layer formed by surface oxidation can be removed, thereby helping to improve the connection yield between the electrical connection portion 13 and the electrode portion 141.

[0129] In the above embodiment, the electrical connection portion 13 and the electrode portion 141 may be connected by eutectic bonding or thermocompression bonding.

[0130] In a possible implementation, Fig.17 As shown, a microlens array is formed on the side of the light emitting diode 14 away from the insulating substrate 12 to achieve regulation of the light emitted by the light emitting diode 14, thereby improving the brightness of the light emitting diode 14 and reducing the power consumption of the light emitting panel 1.

[0131] Specifically, the microlens array includes a plurality of microlenses 17 . The microlenses 17 are in contact with a surface of the insulating substrate 12 that is away from the first surface 111 . The microlenses 17 correspond to the light emitting diodes 14 one by one, and the microlenses 17 cover the corresponding light emitting diodes 14 .

[0132] In a possible implementation, Fig.18 As shown, a packaging layer 18 is formed on the side of the microlens 17 array away from the first surface 111. The packaging layer 18 can isolate the light-emitting diode 14 from corrosion by water and oxygen, protect the light-emitting diode 14, and improve its yield and service life.

[0133] The present application also provides a display device 2, such as Fig.19 As shown, it includes any one of the light-emitting panels 1 provided in the above embodiments, or includes a light-emitting panel 1 prepared by using any one of the light-emitting panel 1 preparation methods provided in the above embodiments.

[0134] The display device provided in the embodiment of the present application has the beneficial effects of the light-emitting panel 1 in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the light-emitting panel 1, which will not be repeated in the embodiment of the present application. The light-emitting panel 1 in the embodiment of the present application can be assembled in the display device 2 as a display panel, or assembled in the display device 2 as a light source. The display device 2 can be: electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable display device, and any other product or component with display function.

[0135] The light-emitting panel 1 in the embodiment of the present application can also be used as a light source in lighting products.

[0136] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A light-emitting panel, characterized in that: include: A driving backplane, the driving backplane comprising a first surface and an electrode layer located on the first surface, the electrode layer comprising a plurality of electrode terminals arranged at intervals; an insulating substrate, located on the first surface, wherein the thickness of the insulating substrate is greater than the thickness of the electrode layer, the insulating substrate comprises openings corresponding to the electrode terminals one by one, and the orthographic projection of the openings on the first surface at least partially overlaps with the orthographic projection of the corresponding electrode terminal on the first surface; an electrical connection portion, located in the opening and connected to the electrode terminal; The light emitting diode is located on a side of the insulating substrate away from the driving backplane, and the light emitting diode includes an electrode portion, and the electrode portion is connected to the electrical connection portion.

2. The light emitting panel according to claim 1, characterized in that: A surface of the electrical connection portion facing away from the driving back plate is flush with a surface of the insulating substrate facing away from the driving back plate.

3. The light emitting panel according to claim 1, characterized in that: An orthographic projection of one end of the opening portion close to the electrode terminal on the first surface is located within the orthographic projection of the electrode terminal on the first surface.

4. The light emitting panel according to claim 1, characterized in that: The orthographic projection of the electrode terminal on the first surface is located inside the orthographic projection of one end of the opening close to the electrode terminal on the first surface.

5. The light emitting panel according to claim 1, characterized in that: The electrical connection portion comprises: a seed layer located on at least a portion of the surface within the opening; The bonding material is located in the opening and in contact with a surface of the seed layer that is away from the driving back plate.

6. The light emitting panel according to claim 5, characterized in that: The thickness of the seed layer is in the range of 100 nm to 500 nm; and / or, The material of the seed layer includes at least one of copper, gold, aluminum, palladium and rhodium.

7. The light emitting panel according to claim 1, characterized in that: The electrical connection portion includes a plurality of conductive layers stacked in a direction away from the electrode terminal, and the conductive layers are made of at least one of copper, gold, aluminum, palladium and rhodium.

8. The light emitting panel according to claim 1, characterized in that: The thickness of the insulating substrate is in the range of 8 μm to 12 μm.

9. The light emitting panel according to claim 1, characterized in that: The insulating substrate is made of ceramic or light-shielding resin material.

10. The light emitting panel according to claim 1, characterized in that: The surface roughness of the surface of the insulating substrate on one side away from the driving backplane is less than or equal to 15 nanometers; and / or, The surface roughness of a surface of the electrical connection portion facing away from the driving back plate is less than or equal to 15 nanometers.

11. A method for preparing a light-emitting panel, characterized in that: include: A driving backplane and a light emitting diode are provided, wherein the driving backplane comprises a first surface and an electrode layer located on the first surface, the electrode layer comprises a plurality of electrode terminals arranged at intervals, and the light emitting diode comprises an electrode portion; An insulating substrate is formed on the first surface where the electrode layer is provided, wherein the thickness of the insulating substrate is greater than the thickness of the electrode layer, and the insulating substrate includes openings corresponding to the electrode terminals one by one, and the orthographic projections of the openings on the first surface at least partially overlap with the orthographic projections of the corresponding electrode terminals on the first surface; forming an electrical connection portion in the opening, the electrical connection portion being connected to the electrode terminal; The electrode portion of the light emitting diode is connected to a surface of the electrical connection portion which is away from the driving backplane.

12. The method for preparing a light emitting panel according to claim 11, characterized in that: The step of forming an electrical connection portion in the opening portion comprises: forming a seed layer on at least a portion of the surface within the opening; A bonding material is formed in the opening where the seed layer is formed, the bonding material contacts a surface of the seed layer on one side away from the driving back plate and fills the opening.

13. The method for preparing a light emitting panel according to claim 12, characterized in that: The step of forming a seed layer on at least a portion of the surface of the opening comprises: forming an auxiliary layer on a side of the insulating substrate away from the first surface, the auxiliary layer comprising a shielding portion and a hollow portion, the hollow portion corresponding to the opening portion, and the shielding portion being located on a side of the insulating substrate away from the first surface; Depositing a seed film on a side of the auxiliary layer away from the driving back plate; The auxiliary layer and the seed film on the surface of the auxiliary layer are removed, and the seed film on the surface in the opening is left to form the seed layer.

14. The method for preparing a light emitting panel according to claim 12, characterized in that: The step of forming a bonding material in the opening where the seed layer is formed comprises: The bonding material is formed by an electroplating process; or, A metal slurry is injected into the opening and solidified.

15. The method for preparing a light emitting panel according to claim 11, characterized in that: The step of forming an electrical connection portion in the opening portion comprises: A plurality of conductive layers are sequentially formed in the opening, and a material of the conductive layers includes at least one of copper, gold, aluminum, palladium, and rhodium.

16. The method for preparing a light-emitting panel according to any one of claims 12 to 15, characterized in that: Also includes: The surface of the electrical connection portion facing away from the driving back plate is polished so that the surface of the electrical connection portion facing away from the driving back plate is flush with the surface of the insulating substrate facing away from the driving back plate.

17. A display device, characterized in that: The invention comprises a light-emitting panel as claimed in any one of claims 1 to 10, or comprises a light-emitting panel prepared by the method for preparing a light-emitting panel as claimed in any one of claims 11 to 16.

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