Electronic device

Abstract

The invention provides electronic equipment, which comprises a display panel and a photosensitive device, and is characterized in that the display panel comprises a substrate, a light-emitting device arranged on the substrate and a pixel definition layer; the pixel definition layer is provided with opening areas distributed in an array mode and non-opening areas arranged between the adjacent opening areas, and the opening areas are configured to be used for limiting the light-emitting devices; the photosensitive device is arranged on one side, deviating from the pixel definition layer, of the substrate; the non-opening area of the pixel definition layer is provided with a first through hole and a micro lens, and the micro lens covers the first through hole to enlarge the angle of light passing through the first through hole; the photosensitive device is opposite to the first through hole so as to receive the light passing through the first through hole. According to the electronic equipment provided by the invention, the micro lens covering the first through hole is arranged on the pixel definition layer, so that the angle of the light entering the first through hole is enlarged, and then the photosensitive device arranged opposite to the first through hole can obtain large-angle light, so that the field angle of the photosensitive device is increased.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment structure, and in particular to an electronic equipment. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panels have many advantages such as light weight, active light emission, fast response speed, large viewing angle, wide color gamut, high brightness and low power consumption. They have gradually become the third generation display technology after liquid crystal displays.

[0003] In order to meet the use requirements of the under-screen light-sensing device, a hole is usually dug in a part of the display panel so that external light can reach the under-screen light-sensing device. However, the light-transmitting hole on the display surface cannot meet the wide field of view requirements of the under-screen light-sensing device, and the user experience is poor. Summary of the invention

[0004] An embodiment of the present application provides an electronic device, the electronic device comprising a display panel and a photosensitive device, the display panel comprising a substrate, a light-emitting device disposed on the substrate, and a pixel definition layer; the pixel definition layer has opening areas distributed in an array and non-opening areas disposed between adjacent opening areas, the opening areas being configured to limit the light-emitting device; the photosensitive device is disposed on a side of the substrate away from the pixel definition layer;

[0005] Among them, a first through hole and a microlens are provided on the non-opening area of ​​the pixel definition layer, and the microlens covers the first through hole to expand the angle of the light passing through the first through hole; the photosensitive device is opposite to the first through hole to receive the light passing through the first through hole.

[0006] The electronic device provided in the embodiment of the present application, by disposing a microlens covering the first through hole on the pixel definition layer, enables the angle of light entering the first through hole to be expanded, thereby enabling the photosensitive device arranged opposite to the first through hole to obtain light at a large angle, thereby improving the field of view angle of the photosensitive device, and further improving the photosensitivity of the photosensitive device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 is a schematic diagram of the structure of an electronic device in some embodiments of the present application;

[0009] Figure 2 yes Figure 1 A schematic diagram of the structural disassembly of the electronic device in the embodiment;

[0010] Figure 3 is a schematic diagram of the internal structure of an electronic device in some embodiments of the present application;

[0011] Figure 4 is a schematic diagram of the front structure of a display panel in some embodiments of the present application;

[0012] Figure 5 yes Figure 4 A schematic diagram of a cross-sectional structure of a display panel along the AA direction in the embodiment;

[0013] Figure 6 yes Figure 4 A schematic diagram of a cross-sectional structure of a display panel along the BB direction in the embodiment;

[0014] Figure 7 is a schematic diagram of a partial cross-sectional structure of a display panel in some other embodiments of the present application;

[0015] Figure 8 is a schematic diagram of a partial cross-sectional structure of a display panel in some other embodiments of the present application;

[0016] Fig. 9 and Fig.10 is a schematic diagram of a structure in which microlenses and support pillars are formed on a pixel definition layer in some embodiments of the present application;

[0017] Fig.11 It is a schematic diagram of the structural composition of mobile terminal devices in other embodiments of the present application. DETAILED DESCRIPTION

[0018] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0019] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0021] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of an electronic device 100 in some embodiments of the present application, Figure 2 yes Figure 1 Schematic diagram of the structural disassembly of the electronic device 100 in the embodiment.

[0022] The electronic device 100 provided in the embodiment of the present application may specifically be a mobile phone, a tablet computer, a laptop computer, and the like. The following description is given below with the electronic device 100 being a mobile phone. The electronic device 100 may include a housing assembly 10 and a display panel 20 connected to one side of the housing assembly 10. The housing assembly 10 is connected to the display panel 20, and together they enclose a housing space for the electronic device 100. The housing space of the electronic device 100 may be used to install electronic devices required by the electronic device 100, such as a battery, a photosensitive device, a circuit board, and a camera.

[0023] Specifically, the housing assembly 10 may include a middle frame 110 and a cover plate 120. The display panel 20 may be connected to one side of the middle frame 110, and the cover plate 120 may be connected to the other opposite side of the middle frame 110, that is, the display panel 20 and the cover plate 120 may be respectively disposed on opposite sides of the middle frame 110, thereby forming a housing space for the electronic device 100 together with the middle frame 110.

[0024] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] like Figure 2 As shown, the middle frame 110 may include a middle plate 111 of an integral structure and a frame 112 surrounding at least part of the outer periphery of the middle plate 111, and the two may be integrally formed by injection molding, stamping molding, heat absorption molding and other processes. Among them, the frame 112 may be formed by the side wall of the middle plate 111 extending in the thickness direction of the middle plate 111, so that the two sides of the middle frame 110 that are relatively arranged can form corresponding open structures. The display panel 20 and the cover plate 120 may be respectively covered on the open structures on the opposite sides of the middle frame 110, thereby forming a housing space for the electronic device 100 together with the middle frame 110. In some embodiments, the middle plate 111 and the frame 112 may also be two independent structural members, and the two may be connected by one of the assembly methods such as snap-on, bonding and welding and a combination thereof. Alternatively, the middle frame 110 may also include only the frame 112.

[0026] In addition, the material of the middle frame 110 can be glass, metal, hard plastic, etc., so that the middle frame 110 has a certain structural strength. Among them, since the middle frame 110 is generally directly exposed to the external environment, the middle frame 110 can also have certain wear-resistant, corrosion-resistant and scratch-resistant properties, or a layer of functional materials for wear-resistant, corrosion-resistant and scratch-resistant is coated on the outer surface of the middle frame 110 (that is, the outer surface of the electronic device 100). In addition, in some embodiments, a corresponding brand logo (LOGO) can also be provided on the middle frame 110 to beautify the appearance of the electronic device 100 and improve brand recognition. Further, the middle frame 110 is arranged between the display panel 20 and the cover plate 120, and is respectively connected to the display panel 20 and the cover plate 120 to form the overall structural frame of the electronic device 100. In the structural application of the electronic device 100, the middle frame 110 is generally used to carry or fix the internal components such as the circuit board, battery, camera or photosensitive device of the electronic device 100.

[0027] It should be noted that the electronic device in the embodiment of the present application may be an electronic device with an identification function, for example, a fingerprint recognition or face recognition module may be used to quickly perform the unlocking and waking functions of the electronic device. The identification module can usually use the photosensitive device under the screen of the electronic device to obtain images or light to achieve the purpose of identification. It is understandable that the electronic device in the embodiment of the present application may be a tablet computer, a mobile phone, a camera, a personal computer, a laptop computer, a vehicle-mounted device, a wearable device, and other smart devices with a photosensitive device under the screen.

[0028] In some embodiments, the electronic device may have a photosensitive device, which may be disposed under the display screen of the electronic device and realize the recognition function or the ambient light sensing function by acquiring the light passing through the display screen. For example, the photosensitive device may be configured to recognize fingerprints or recognize faces to quickly perform the unlocking and waking functions of the electronic device. For another example, the photosensitive device may be configured to sense the light intensity of the environment in which the electronic device is located to realize the corresponding function.

[0029] See also Figure 3 , Figure 3 Schematic diagram of the internal structure of the electronic device 100 in some embodiments of the present application. Among them, the display panel 20 may have a display surface 201 and a non-display surface 202, and the display surface 201 and the non-display surface 202 may be arranged opposite to each other. For example, the display surface 201 is located outside the electronic device 100 for display and corresponding human-computer interaction operations, and the non-display surface 202 is located inside the electronic device 100 for connection with other structures of the electronic device 100. An identification area 203 is provided on the display panel 20, so that the user can perform identification operations on the identification area 203, so that the electronic device 100 can perform functions such as unlocking and waking up more conveniently. The display panel 20 can be a display screen for display such as an LED (light emitting diode) display screen, an OLED (Organic Light-Emitting Diode) display screen, etc.

[0030] Furthermore, the electronic device 100 may also include a photosensitive device 40, a battery 50 and a circuit board 60 arranged in its accommodating space, that is, the photosensitive device 40, the battery 50 and the circuit board 60 are arranged on the side of the non-display surface of the display panel 20. The photosensitive device 40 is a device that can convert biometric information into electronic signals. The battery 50 can provide power for the operation of the electronic device 100, and the circuit board 60 can be used to implement the corresponding control functions of the electronic device 100. Among them, the photosensitive device 40 can obtain the user's biometric information through the identification area 203, and convert the obtained biometric information into an electronic signal to send it to the processor of the electronic device 100, so that the processor of the electronic device 100 can perform corresponding operations according to the received electronic signal; for example, it can be used to implement functions such as fingerprint unlocking, automatic screen off, and brightness self-adjustment.

[0031] The biometric information of the user obtained by the photosensitive device 40 through the identification area 203 may be information such as fingerprints, palm prints, or facial features. Fingerprints refer to the lines formed by the uneven skin on the end of the fingertips of human fingers; palm prints refer to the lines on the entire palm; facial features refer to the features of the human face, including face shape, arrangement of facial features and appearance. For a user, the above biometric information is unique, and therefore can be used to identify a unique user. The biometric information obtained by the above photosensitive device 40 can be summarized as image information, that is, the biometric information in the embodiment of the present application is exemplified by image information. Further, the photosensitive device 40 can convert the acquired image information into an electronic signal.

[0032] Optionally, the photosensitive device 40 may be a camera equipped with one or more sensors of CCD (Charge-coupled Device), CMOS (Complementary Metal Oxide Semiconductor) and CIS (CMOS Image Sensor). The receiving surface of the photosensitive device 40 is arranged opposite to the identification area 203 so as to obtain the user's biometric information through the identification area 203. The identification area 203 may be a light-transmitting area formed on the display panel 20 so that light can pass through the identification area 203 and reach the photosensitive device 40 to obtain the biometric information.

[0033] Of course, in other embodiments, the photosensitive device 40 may be a light sensor, which can sense the light intensity of the external environment of the electronic device 100 by acquiring light passing through the display screen.

[0034] See also Figures 4 to 6 , Figure 4 is a schematic diagram of the front structure of the display panel 20 in some embodiments of the present application, Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure of the display panel 20 along the AA direction in the embodiment, Figure 6 yes Figure 4 Schematic diagram of the cross-sectional structure of the display panel 20 along the BB direction in the embodiment. The display panel 20 can be used to provide an image display function for the electronic device 100, and the display panel 20 can be covered on one side of the middle frame 110, and the two can be bonded and fixed by adhesive.

[0035] Among them, the display surface 203 of the display panel 20 may include an identification area 203 and a non-identification area 204, the identification area 203 is arranged on one side of the non-identification area 204, or the non-identification area 204 is arranged around the identification area 203, and the embodiment of the present application does not make specific restrictions on this.

[0036] It can be understood that the non-recognition area 204 is only used to realize the display of the display panel 20 and the corresponding human-computer interaction operation. The recognition area 203 can not only be used to realize the display of the display panel 20 and the corresponding human-computer interaction operation, but also allow light to pass through to be captured by the photosensitive device 40 disposed under the recognition area 203, thereby realizing the recognition function or photosensitive function of the electronic device. It should be noted that Figure 5 It is indicated in Figure 4 A schematic cross-sectional structure diagram of the non-recognition area 204 of the display panel 20 in the embodiment, Figure 6 It is indicated in Figure 4 A schematic cross-sectional structure diagram of the identification area 203 of the display panel 20 in the embodiment.

[0037] Specifically, the display panel 20 may include a substrate 210, a flat layer 220 disposed on the substrate 210, a light-emitting device 230 and a pixel definition layer 240 disposed on the flat layer 220, an encapsulation layer 250 disposed on the light-emitting device 230 and the pixel definition layer 240, a touch layer 260 disposed on the encapsulation layer 250, and a filter 270 disposed on the touch layer 260.

[0038] Among them, the substrate 210 can be configured as a driving circuit for integrating and driving the light-emitting device 230 to emit light, that is, the driving circuit can include a TFT (Thin Film Transistor) circuit. It can be understood that the TFT circuit is electrically connected to the light-emitting device 230, thereby driving the light-emitting device 230 to emit light. The source of the thin film field effect transistor is connected and conducted with the corresponding electrode of the light-emitting device 230. In other words, the source of the thin film field effect transistor and the corresponding electrode of the light-emitting device 230 are conducted through the flat layer 220. The flat layer 220 can be a single-layer structure or a multi-layer structure. The flat layer 220 can be made of organic materials, such as: photoresist, acrylic polymer, silicon-based polymer and other materials. Among them, the light-emitting device 230 can be conducted with the substrate 210 by opening a via (such as a metal via) on the flat layer 220.

[0039] It can be understood that the substrate 210 may include a base, a buffer layer disposed on the base, an active layer disposed on the buffer layer, a first gate insulating layer covering the active layer, a first gate disposed on the first gate insulating layer, a second gate insulating layer covering the first gate, a second gate disposed on the second gate insulating layer, an interlayer insulating layer covering the second gate, and a source and drain disposed on the interlayer insulating layer (not shown in the figure). Among them, the flat layer 220 is disposed on the interlayer insulating layer and covers the source and drain. It should be noted that the above-mentioned technical features of the substrate 210 are within the scope of understanding of those skilled in the art, so this application will not be repeated. In some embodiments, the first gate insulating layer and the second gate insulating layer can be combined into one gate insulating layer, in which case the first gate and the second gate can be combined into one gate. In other words, in some embodiments, the substrate 210 may include a first gate insulating layer and a first gate disposed on the first gate insulating layer; or, the substrate may include a second gate insulating layer and a second gate disposed on the second gate insulating layer. It should be noted that the terms "first", "second", and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] The light emitting device 230 may include an anode 231 disposed on the flat layer 220, a cathode 232 spaced apart from the anode 231, and a light emitting layer 233 disposed between the anode 231 and the cathode 232. The anode 231 of the light emitting device 230 may be electrically connected to the substrate 210 through a metal via. The anode 231 may be made of materials such as indium tin oxide, indium zinc oxide, or zinc oxide. The anode 231 may be electrically connected to the source and drain of the substrate 210 through a metal via.

[0041] The pixel definition layer 240 may cover the flat layer 220, and may have a pixel opening exposing at least part of the anode 231, and the light-emitting layer 233 is located in the opening of the pixel definition layer 240 and formed on the anode 231. The light-emitting layer 233 may include a small molecule organic material or a polymer molecule organic material, and may be a fluorescent light-emitting material or a phosphorescent light-emitting material, and may emit red light, green light, blue light, or white light, etc.; and, according to different actual needs, in different examples, the light-emitting layer 233 may further include an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer and other functional layers. The cathode 232 covers the light-emitting layer 233, and the material of the cathode 232 includes but is not limited to one of Mg / Ag, Ca / Al, Mg / MgAg, Gd / Al, Al / Li, Sn / Al and Ag / Al alloys. Among them, the pixel definition layer 240 may be made of an organic material such as a photoresist. Of course, in other embodiments, the material of the pixel definition layer 240 may include silicon nitride, silicon oxide or silicon oxynitride. It is understandable that the display panel 20 may include a plurality of light emitting devices 230 distributed in an array, wherein the anodes 231 of the light emitting devices 230 are independent of each other, and the cathodes 232 of the light emitting devices 230 may be connected over the entire surface to serve as a common electrode of the plurality of light emitting devices 230 .

[0042] Further, the pixel definition layer 240 may have a plurality of opening regions 2401 distributed in an array, and a non-opening region 2402 located between adjacent opening regions 2401. The anode 231 is disposed on the planar layer 220 and is at least partially exposed in the opening region 2401 of the pixel definition layer 240. The cathode 232 may cover the opening region 2401 and the non-opening region 2402 of the pixel definition layer 240.

[0043] The encapsulation layer 250 may be disposed on the side of the light emitting device 230 away from the substrate 210, that is, the encapsulation layer 250 may be disposed on the cathode 232 of the light emitting device 230. The encapsulation layer 250 may be a thin film encapsulation (TFE) layer structure, including a first inorganic layer 251 and a second inorganic layer 252 alternately stacked, and a buffer layer 253 disposed between the first inorganic layer 251 and the second inorganic layer 252. The first inorganic layer 251 and the second inorganic layer 252 may be a stacked combination of one or more of a silicon oxide (SiOx) layer, a silicon nitride (SiNx) layer, and a silicon oxynitride (SiON) layer. The buffer layer 253 may be formed by inkjet printing, and its material includes at least one of acrylic acid, hexamethyldisiloxane, acrylates, polycarbonates, and polystyrene.

[0044] It is understood that the stacked structure of the encapsulation layer 250 is not limited to the above embodiment. For example, in other embodiments, the first inorganic layer 251 or the second inorganic layer 252 may be provided with one or more layers respectively; the buffer layer 253 is provided between two adjacent first inorganic layers 251, or the buffer layer 253 is provided between two adjacent second inorganic layers 252, or the buffer layer 253 is provided between the adjacent first inorganic layer 251 and the second inorganic layer 252.

[0045] Optionally, the first inorganic layer 251 is disposed on the cathode 232 of the light emitting device 230 , and the second inorganic layer 252 is disposed on a side of the first inorganic layer 251 facing away from the cathode 232 .

[0046] The touch layer 260 is disposed on the side of the encapsulation layer 250 away from the substrate 210, and is used to respond to the user's touch operation and convert the corresponding touch operation into an electrical signal and transmit it to the processor of the electronic device 100, so that the electronic device 100 can respond to the user's touch operation. The touch layer 260 can be electrically connected to the substrate 210, so that the touch layer 260 can respond to the user's touch operation and convert the corresponding touch operation into an electrical signal and transmit it to the processor of the electronic device 100, so that the electronic device 100 can respond to the user's touch operation.

[0047] The filter 270 may be disposed on the touch layer 260, that is, on the side of the touch layer 260 facing away from the substrate 210. Of course, in other embodiments, when the display panel 20 removes the structural setting of the touch layer 260, the filter 270 may be disposed on the side of the encapsulation layer 250 facing away from the substrate 210.

[0048] Furthermore, the optical filter 270 may include a filter layer 271, a protective layer 272, and a cover layer 273 which are stacked in sequence. The filter layer 271 is configured to select the wavelength band light waves to be passed through, and block and filter other wavelength bands that are not desired to pass through. The protective layer 272 is arranged on the side of the filter layer 271 away from the substrate 210 to improve the flatness and light transmittance of the surface of the filter 270, and is required to have good heat resistance and strength to protect the filter film from damage. The cover layer 273 is arranged on the side of the protective layer 272 away from the filter layer 271 to improve the flatness and light transmittance of the surface of the filter 270, and at the same time ensure the heat resistance and strength of the filter 270.

[0049] The material of the cover layer 273 may be glass (such as ultra-thin glass UTG), polyethylene glycol terephthalate (PET), or polyimide (PI), etc. Optionally, the cover layer 273 may include a stacked UTG film and a PET film to improve the comprehensive performance of the cover layer 273.

[0050] The protective layer 272 is generally formed by coating a resin material on the filter layer 271. The material of the protective layer 272 can be photoresist, acrylic polymer, or silicon polymer.

[0051] The filter layer 271 may include a plurality of filter sections 2711 distributed in an array and a light shielding section 2712 disposed between adjacent filter sections 2711. One filter section 2711 is disposed corresponding to one light emitting device 230. Further, the plurality of filter sections 2711 may include a red filter section (R), a green filter section (G), and a blue filter section (B). Of course, in other embodiments, the plurality of filter sections 2711 may also include a white filter section. Different color filter sections 2711 allow visible light of the same color to pass through, while blocking other light from passing through.

[0052] In other words, the filter 2711 is disposed opposite to the opening area 2401 of the pixel definition layer 240, so that the light emitted by the light emitting layer 233 can be emitted through the filter 2711. The light shielding portion 2712 is disposed opposite to the non-opening area 2402 of the pixel definition layer 240 to block the light from passing through.

[0053] As mentioned above, the opening area 2401 of the pixel definition layer 240 is used to limit the layout area of ​​the light emitting device 230. Based on the light emitting devices 230 distributed in an array, the non-opening area 2402 of the pixel definition layer 240 can be made of the same material as the light shielding portion 2712 to block the passage of light. Furthermore, the non-opening area 2402 of the pixel definition layer 240 can also prevent the light emitted by adjacent light emitting devices 230 from crosstalk, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity.

[0054] The photosensitive device 40 is arranged on one side of the non-display surface of the display panel 20, and is arranged opposite to the identification area 203 of the display panel 20, so as to obtain light through the identification area 203 of the display panel 20, so as to realize the corresponding function. In order to enable the photosensitive device 40 to obtain external light of the electronic device 100, a first through hole 2713 is provided on the non-opening area 2402 of the pixel definition layer 240, and a second through hole 2714 opposite to the first through hole 2713 is provided on the light shielding portion 2712, so that external light can be sequentially obtained by the photosensitive device 40 through the first through hole 2713 and the second through hole 2714. Among them, the projection of the first through hole 2713 on the display surface of the display panel 20 is located on the identification area 203, and the projection of the second through hole 2714 on the display surface of the display panel 20 is located on the identification area 203. Optionally, the first through hole 2713 and the second through hole 2714 are coaxial.

[0055] It should be noted that the names such as “first through hole” and “second through hole” can be interchangeable in some embodiments, or can be collectively referred to as “through hole”, and the present application does not impose any limitation on this.

[0056] See also Figure 7 , Figure 7 is a partial cross-sectional structural schematic diagram of the display panel 20 in some other embodiments of the present application, Figure 7 The cross-sectional structure of the identification area 204 of the display panel 20 is schematically shown.

[0057] The display panel 20 may include a substrate 210, a planar layer 220 disposed on the substrate 210, a light emitting device 230 and a pixel definition layer 240 disposed on the planar layer 220, an encapsulation layer 250 disposed on the light emitting device 230 and the pixel definition layer 240, a touch layer 260 disposed on the encapsulation layer 250, and a filter 270 disposed on the touch layer 260. For details, please refer to the above embodiments.

[0058] As mentioned above, the pixel definition layer 240 has an array of opening areas 2401 and a non-opening area 2402 disposed between adjacent opening areas 2401, and the opening area 2401 is configured to limit the light-emitting device 230. The photosensitive device 40 is disposed on the side of the substrate 210 away from the pixel definition layer 240, and can obtain external light of the electronic device 100 through the first through hole 2713 and the second through hole 2714.

[0059] Further, a microlens 2715 is provided on the side of the pixel definition layer 240 facing away from the substrate 210, and the microlens 2715 covers the first through hole 2713 and is configured to expand the angle of the light passing through the first through hole 2713. The photosensitive device 40 is arranged opposite to the first through hole 2713 to receive the light passing through the first through hole 2713. Specifically, the external light of the electronic device 100 is emitted from the display panel 20 through the second through hole 2714 and the first through hole 2713 in sequence and reaches the photosensitive device 40.

[0060] It is understandable that when external light with a large angle enters the display panel 20, it is generally difficult to pass through the first through hole 2713 to reach the photosensitive device 40, that is, the field of view of the photosensitive device 40 is limited. The present application can play a light-gathering role by providing a microlens 2715 covering the first through hole 2713, that is, the angle of the large-angle light changes through the microlens 2715 so that it can pass through the first through hole 2713, thereby increasing the field of view of the photosensitive device 40, thereby improving the photosensitivity effect.

[0061] Furthermore, the projection of the inner wall of the second through hole 2714 on the pixel definition layer 240 surrounds the periphery of the first through hole 2713, so that more light can pass through the second through hole 2714 and enter the first through hole 2713 through the microlens 2715, thereby expanding the field of view of the photosensitive device 40. In one embodiment, the distance between the projection of the inner wall of the second through hole 2714 on the pixel definition layer 240 and the outer periphery of the first through hole 2713 is not less than 0.2 microns. For example, the above distance can be 0.3 microns, 0.5 microns, 1 micron, 2 microns or 3 microns, etc.

[0062] Optionally, the second through hole 2714 and the first through hole 2713 are coaxially arranged, and the inner diameter of the second through hole 2714 is larger than the inner diameter of the first through hole 2713. The difference between the inner diameter of the second through hole 2714 and the inner diameter of the first through hole 2713 is not less than 0.2 micrometers. For example, the above difference may be 0.3 micrometers, 0.5 micrometers, 1 micrometer, 2 micrometers, or 3 micrometers.

[0063] It can be understood that the first through hole 2713 on the pixel definition layer 240 is limited by the opening area 2401 of the pixel definition layer 240, and its inner diameter is limited. For different display panels, when the inner diameters of the first through hole 2713 and the second through hole 2714 are the same, the light that can be received by the photosensitive device 40 is basically the same. Under this premise, when the inner diameter of the second through hole 2714 is larger than the inner diameter of the first through hole 2713, more light can enter the second through hole 2714, thereby increasing the light passing through the first through hole 2713. Further, by setting a microlens 2715 to cover the first through hole 2713, the light passing through the second through hole 2714 can be converged to pass through the first through hole 2713, so that more light can pass through the first through hole 2713, thereby improving the field of view of the photosensitive device 40.

[0064] See again Figure 7 The display panel 20 includes an encapsulation layer 250 disposed on the light emitting device 230, that is, the encapsulation layer 250 can be disposed on the side of the light emitting device 230 away from the substrate 210, that is, the encapsulation layer 250 can be disposed on the cathode 232 of the light emitting device 230. The encapsulation layer 250 may include a first inorganic layer 251 and a second inorganic layer 252 stacked, and a buffer layer 253 disposed between the first inorganic layer 251 and the second inorganic layer 252. The first inorganic layer 251 may be disposed on the pixel definition layer 240 and cover the above-mentioned microlens 2715; the second inorganic layer 252 is disposed on the side of the first inorganic layer 251 away from the pixel definition layer 240.

[0065] In one embodiment, the refractive index of the microlens 2715 is greater than the refractive index of the first inorganic layer 251 to form a better focusing effect. In other words, the material refractive index of the microlens 2715 is greater than the material refractive index of the first inorganic layer 251 to form a better focusing effect. Optionally, the material refractive index of the microlens 2715 can be 1.6-1.7. The material refractive index of the first inorganic layer 251 can be 1.45-1.65. Of course, in other embodiments, the material refractive index of the second inorganic layer 252 can also be 1.45-1.65. In addition, in some embodiments, the material refractive index of the microlens 2715, the first inorganic layer 251 and the second inorganic layer 252 gradually decreases.

[0066] Optionally, in order to improve the defect that the thickness of the buffer layer 253 is too thick and causes the light attenuation at a wide viewing angle to be too fast, the buffer layer 253 of the embodiment of the present application can be formed by coating, so that the thickness of the buffer layer 253 can be 2-8 microns. For example, the thickness of the buffer layer 253 can be 3 microns, 4 microns, 5 microns, 6 microns, or 7 microns. Among them, the material of the buffer layer 253 can be photoresist, and the photoresist can be coated. In the case of a thin thickness, the flatness of the film layer can be ensured as much as possible, reducing the stress problem in the encapsulation layer 250. Of course, in other embodiments, the buffer layer 253 can also be made of a transparent colloid such as a transparent resin.

[0067] See also Figure 8 , Figure 8 2 is a schematic diagram of a partial cross-sectional structure of a display panel 20 in other embodiments of the present application. The display panel 20 may include a substrate 210, a flat layer 220 disposed on the substrate 210, a light-emitting device 230 and a pixel definition layer 240 disposed on the flat layer 220, an encapsulation layer 250 disposed on the light-emitting device 230 and the pixel definition layer 240, a touch layer 260 disposed on the encapsulation layer 250, and a filter 270 disposed on the touch layer 260. Please refer to the above embodiments for details. Among them, a first through hole 2713 is provided on the non-opening area 2402 of the pixel definition layer 240, and a second through hole 2714 opposite to the first through hole 2713 is provided on the light shielding portion 2712 of the filter 270, so that external light can pass through the first through hole 2713 and the second through hole 2714 in sequence and be acquired by the photosensitive device 40.

[0068] Further, a support column 2716 may be provided on the non-opening area 2402 of the pixel definition layer 240, and the support column 2716 is spaced apart from the microlens 2715. Specifically, the projections of the support column 2716 and the microlens 2715 on the display surface of the display panel 20 may both be located on the identification area 203; or, the projection of the microlens 2715 on the display surface of the display panel 20 is located on the identification area 203, and the projection of the support column 2716 on the display surface of the display panel 20 is located on the non-identification area 204; or, there may be a plurality of support columns 2716, and the projections of some support columns 2716 on the display surface of the display panel 20 are located on the non-identification area 204, and the projections of another part of the support columns 2716 on the display surface of the display panel 20 are located on the identification area 203. Those skilled in the art may flexibly set the support column 2716 according to actual needs. The support pillars 2716 can be used to support the mask when the light-emitting device 230 is formed on the pixel definition layer 240 to avoid scratching the mask during the process of forming the light-emitting device 230 by evaporation.

[0069] Optionally, the height of the support column 2716 protruding from the pixel definition layer 240 is greater than the height of the microlens 2715 protruding from the pixel definition layer 240. The curvature of the surface of the microlens 2715 away from the pixel definition layer 240 is smaller than the curvature of the surface of the support column 2716 away from the pixel definition layer 240.

[0070] Combined with reference Fig. 9 and Fig.10 , Fig. 9 and Fig.10 It is a schematic diagram of the structure of forming microlenses 2715 and support pillars 2716 on the pixel definition layer 240 in some embodiments of the present application.

[0071] The microlens 2715 and the support column 2716 can be formed simultaneously on the non-opening area 2402 of the pixel definition layer 240. For example, the first lens portion 2715a, the second lens portion 2715b and the support portion 2716a can be formed on the pixel definition layer 240 by a grayscale mask process. The first lens portion 2715a and the second lens portion 2715b are stacked, the first lens portion 2715a is arranged on the non-opening area 2402 of the pixel definition layer 240, the second lens portion 2715b is arranged on the side of the first lens portion 2715a away from the pixel definition layer 240, and the projection of the second lens portion 2715b on the pixel definition layer 240 completely covers the projection of the first lens portion 2715a on the pixel definition layer 240. In other words, the second lens portion 2715b is located in the middle area of ​​the first lens portion 2715a, and the outer periphery of the second lens portion 2715b is retracted compared to the outer periphery of the first lens portion 2715a. The support portion 2716a and the first lens portion 2715a are spaced apart.

[0072] like Fig. 9 As shown, a conventional mask can be used to form a support portion 2716a on the pixel definition layer 240. A mask with different transmittance areas can be used to form a first lens portion 2715a and a second lens portion 2715b that are stacked. For example, the mask can have a first transparent portion with a first transmittance and a second transparent portion with a second transmittance, and the second transparent portion can surround the periphery of the first transparent portion. The first transmittance is greater than the second transmittance, so that the first lens portion 2715a and the second lens portion 2715b can be formed on the pixel definition layer 240 by using a mask having a first transparent portion and a second transparent portion. Among them, the first transmittance can be 80%-100%, for example, 90%. The second transmittance can be 20%-50%, for example, 30%, or 40%.

[0073] like Fig.10As shown, after forming the first lens portion 2715a, the second lens portion 2715b and the support portion 2716a on the pixel definition layer 240, a leveling process may be performed to form a microlens 2715 and a support column 2716. The height of the support column 2716 is greater than the height of the microlens 2715. The surface curvature of the microlens 2715 is less than the surface curvature of the support column 2716.

[0074] The electronic device provided by the embodiment of the present application is provided with a microlens covering the first through hole on the pixel definition layer, so that the angle of light entering the first through hole is expanded, so that the photosensitive device arranged opposite to the first through hole can obtain light at a large angle, so as to improve the field of view of the photosensitive device. In addition, based on the microlens, the field of view of the photosensitive device is expanded, and the inner diameter of the second through hole on the light shielding portion can be further reduced to reduce the reflectivity of the recognition area, and then the reflectivity difference between the recognition area and the non-recognition area of ​​the display panel can be reduced, so as to improve the display effect and appearance visual effect of the display panel.

[0075] Furthermore, in some other embodiments of the present application, a mobile terminal device 900 is provided. Fig.11 , Fig.11 It is a schematic diagram of the structure of a mobile terminal device in other embodiments of the present application. The mobile terminal device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the terminal device 900 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display panel 20 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire terminal device 900.

[0076] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941 (i.e., the display panel 20 in the above embodiment); the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the mobile terminal device. For the relevant technical features of the display module, please refer to the relevant description of the above display module embodiment, which will not be described in detail here.

[0077] It should be noted that the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0078] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A display panel, comprising a substrate, a light-emitting device disposed on the substrate, and a pixel definition layer; the pixel definition layer has opening areas distributed in an array and non-opening areas disposed between adjacent opening areas, and the opening areas are configured to limit the light-emitting device; A photosensitive device is disposed on a side of the substrate away from the pixel definition layer; Among them, a first through hole and a microlens are provided on the non-opening area of ​​the pixel definition layer, and the microlens covers the first through hole to expand the angle of the light passing through the first through hole; the photosensitive device is opposite to the first through hole to receive the light passing through the first through hole.

2. The electronic device according to claim 1, characterized in that: The display panel also includes a filter arranged on a side of the light-emitting device away from the substrate, the filter having a filter portion arranged opposite to the light-emitting device and a shading portion arranged between adjacent filter portions; wherein the shading portion is provided with a second through hole opposite to the first through hole.

3. The electronic device according to claim 2, characterized in that: The projection of the inner wall of the second through hole on the pixel definition layer surrounds the periphery of the first through hole.

4. The electronic device according to claim 3, characterized in that: The distance between the projection of the inner wall of the second through hole on the pixel definition layer and the outer periphery of the first through hole is not less than 0.2 micrometers.

5. The electronic device according to claim 1, characterized in that: The display panel also includes an encapsulation layer arranged on the light-emitting device, the encapsulation layer includes a first inorganic layer and a second inorganic layer stacked together, and a buffer layer arranged between the first inorganic layer and the second inorganic layer; wherein the refractive index of the microlens is greater than the refractive index of the first inorganic layer.

6. The electronic device according to claim 5, characterized in that: The refractive index of the material of the microlens is 1.6-1.7; the refractive index of the material of the first inorganic layer is 1.45-1.

65.

7. The electronic device according to claim 5, characterized in that: The material of the buffer layer is photoresist.

8. The electronic device according to claim 1, characterized in that: A support column is also provided on the non-opening area of ​​the pixel definition layer, and the support column is spaced apart from the microlens; wherein the height of the support column protruding from the pixel definition layer is greater than the height of the microlens protruding from the pixel definition layer.

9. The electronic device according to claim 8, characterized in that: The curvature of the surface of the microlens away from the pixel definition layer is smaller than the curvature of the surface of the support column away from the pixel definition layer.

10. The electronic device according to claim 1, characterized in that: The electronic device further comprises a housing component, wherein the housing component and the display panel together enclose a housing space of the electronic device, and the photosensitive device is arranged in the housing space.

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