Display panel and display device

Abstract

The invention provides a display panel. The display panel is provided with a plurality of light-emitting areas and a non-light-emitting area connected with the light-emitting areas. The display panel comprises an array substrate. The light-emitting module is arranged on one side of the array substrate, the organic layer is arranged on the surface of the side, away from the array substrate, of the light-emitting module, and the first inorganic layer is arranged on the side, close to the array substrate, of the organic layer. The second inorganic layer is arranged on the side, away from the array substrate, of the organic layer; and the third inorganic layer is arranged on the side, close to or away from the array substrate, of the organic layer and located in the light-emitting area. By reducing the thickness of the inorganic film layer in the non-light-emitting area, the problem that the yellowness of the display panel is high due to the fact that the inorganic film layer is thick is solved, and then the overall transparency of the transparent display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display equipment, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, the requirements for display screens are getting higher and higher. For example, transparent display screens, in addition to display functions, also need to be able to see what is behind them. At present, all competing companies have begun to lay out in this field, which is one of the important development directions in the future. Transparent display screens are widely used in various fields, such as traffic windows, museum showcases, shopping mall windows, and AR. They can enhance the display effect, make the scene cooler, and enrich the display effect.

[0003] In order to increase the immersiveness of transparent displays, transparent displays need to achieve a glass-like transparency when not in display mode. However, due to their own material properties, transparent displays tend to turn yellow overall, which greatly limits the application of transparent displays in different scenarios. Summary of the invention

[0004] The object of the present invention is to provide a display panel and a display device to solve the problem that the existing transparent display screen is yellowish as a whole and has low transparency.

[0005] To achieve the above object, the present invention provides a display panel having a plurality of light-emitting areas and a non-light-emitting area connected to the light-emitting areas. The display panel comprises an array substrate, a light-emitting module disposed on one side of the array substrate, an organic layer disposed on a surface of the light-emitting module on a side away from the array substrate, a first inorganic layer disposed on a side of the organic layer close to the array substrate, a second inorganic layer disposed on a side of the organic layer away from the array substrate, and a third inorganic layer disposed on a side of the organic layer close to or away from the array substrate and located in the light-emitting area. In a direction perpendicular to the plane where the array substrate is located, the thickness of the first inorganic layer and the second inorganic layer is less than the thickness of the third inorganic layer.

[0006] Furthermore, along a direction perpendicular to the plane where the array substrate is located, the thicknesses of the first inorganic layer and the second inorganic layer are 0.005 micrometers to 0.1 micrometers respectively, and the thickness of the third inorganic layer is 0.8 micrometers to 2 micrometers.

[0007] Further, the third inorganic layer is arranged on a side of the organic layer close to the array substrate, and the first inorganic layer is in contact with at least part of the surface of the third inorganic layer. Preferably, the third inorganic layer is located on a side of the first inorganic layer close to the array substrate, and the first inorganic layer covers a side surface of the third inorganic layer away from the array substrate, and wraps the side surface of the third inorganic layer. Alternatively, the third inorganic layer is located on a side of the first inorganic layer away from the array substrate, and the first inorganic layer is in contact with a side surface of the third inorganic layer close to the array substrate, and the organic layer covers a side surface of the third inorganic layer away from the array substrate and wraps at least part of the side surface of the third inorganic layer.

[0008] Further, the third inorganic layer is disposed on a side of the organic layer away from the array substrate, and the second inorganic layer is in contact with at least a portion of the surface of the third inorganic layer. Preferably, the third inorganic layer is located between the second inorganic layer and the organic layer, and the second inorganic layer covers a side surface of the third inorganic layer away from the array substrate and wraps a side surface of the third inorganic layer.

[0009] Furthermore, the display panel further comprises a planar layer disposed on a side of the second inorganic layer away from the array substrate. Preferably, the material of the planar layer comprises optical glue.

[0010] Further, the display panel further comprises a fourth inorganic layer disposed on a side of the organic layer away from the third inorganic layer and located in the light emitting area. Preferably, the fourth inorganic layer is disposed on a side of the second inorganic layer close to the array substrate, and the second inorganic layer covers a surface of the fourth inorganic layer on a side away from the array substrate and wraps a side surface of the fourth inorganic layer. Preferably, the fourth inorganic layer is disposed on a side of the second inorganic layer away from the array substrate, and the second inorganic layer is in contact with a surface of the fourth inorganic layer on a side close to the array substrate. Preferably, in a direction perpendicular to the plane where the array substrate is located, the thickness of the first inorganic layer and the second inorganic layer is less than the thickness of the fourth inorganic layer. Preferably, in a direction perpendicular to the plane where the array substrate is located, the thickness of the fourth inorganic layer is 0.8 micrometers to 2 micrometers, respectively.

[0011] Furthermore, the display panel further includes a first via hole penetrating the first inorganic layer and a second via hole penetrating the second inorganic layer, and the first via hole and the second via hole are both located in the light-emitting area. The third inorganic layer and the fourth inorganic layer fill the first via hole and the second via hole respectively. Preferably, the third inorganic layer is located on a side of the organic layer close to the array substrate, the organic layer covers a side surface of the third inorganic layer away from the array substrate and wraps at least part of the side surface of the third inorganic layer, and the first inorganic layer is in contact with at least part of the side surface of the third inorganic layer. Preferably, the fourth inorganic layer is located on a side of the organic layer away from the array substrate, and the second inorganic layer is in contact with at least part of the side surface of the fourth inorganic layer.

[0012] Furthermore, the display panel further comprises a flat layer disposed on a side of the second inorganic layer away from the array substrate. Preferably, the fourth inorganic layer is located on a side of the second inorganic layer away from the array substrate, the flat layer is located on a side of the fourth inorganic layer away from the array substrate, the flat layer covers a surface of a side of the fourth inorganic layer away from the array substrate and wraps at least part of a side of the fourth inorganic layer. Alternatively, the fourth inorganic layer is located on a side of the second inorganic layer close to the array substrate, the flat layer is located on a side of the second inorganic layer away from the array substrate, and the flat layer covers a surface of the second inorganic layer away from the array substrate. Preferably, the material of the flat layer comprises optical adhesive.

[0013] Further, the light-emitting module includes a first electrode layer, a hole functional layer arranged on a side of the first electrode layer away from the array substrate, a light-emitting layer arranged on a side of the hole functional layer away from the array substrate, an electronic functional layer arranged on a side of the light-emitting layer away from the array substrate, a second electrode layer arranged on a side of the electronic functional layer away from the array substrate, a light extraction layer arranged on a side of the second electrode layer away from the array substrate, and a covering layer arranged on a side of the light extraction layer away from the array substrate. Preferably, the light-emitting layer includes a plurality of spaced-apart sub-light-emitting portions, and the sub-light-emitting portions are located in the corresponding light-emitting areas. Preferably, the orthographic projection of the sub-light-emitting portion on the array substrate is located within the orthographic projection range of the third inorganic layer on the array substrate.

[0014] Furthermore, the first inorganic layer and the second inorganic layer are prepared by an atomic layer deposition process, and the third inorganic layer is prepared by a chemical vapor deposition process. Preferably, the fourth inorganic layer is prepared by a chemical vapor deposition process.

[0015] The present invention further provides a display device, comprising the display panel as described above.

[0016] The advantages of the present invention are:

[0017] A display panel and a preparation method thereof of the present invention prepare a first inorganic layer and a second inorganic layer with relatively thin thickness in a non-luminous area through an atomic layer deposition process, thereby reducing the thickness of the inorganic film layer in the non-luminous area, effectively improving the transmittance of short-wavelength 380-480nm blue light in a packaging module, solving the problem of high yellowness of the display panel caused by the thick inorganic film layer, improving the light transmittance of the display panel, and reducing its light reflectivity, thereby improving the overall transparency of the transparent display panel and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 is a schematic diagram of the layered structure of the display panel in Example 1 of the present invention;

[0020] Figure 2 is a schematic diagram of the layered structure of the display panel in Example 1 of the present invention;

[0021] Figure 3 A schematic diagram of partitions of a display panel in Embodiment 1 of the present invention;

[0022] Figure 4 is a schematic flow chart of a method for preparing a display panel in Example 1 of the present invention;

[0023] Figure 5 is a schematic diagram of the layered structure of a display panel in Example 2 of the present invention;

[0024] Figure 6 is a schematic flow chart of a method for preparing a display panel in Example 2 of the present invention;

[0025] Figure 7 is a schematic diagram of the layered structure of a display panel in Example 3 of the present invention;

[0026] Figure 8 is a schematic flow chart of a method for preparing a display panel in Example 3 of the present invention;

[0027] Fig. 9 is a schematic diagram of the layered structure of a display panel in Example 4 of the present invention;

[0028] Fig.10 is a schematic flow chart of a method for preparing a display panel in Example 4 of the present invention;

[0029] Fig.11 FIG. 4 is a schematic diagram of a layered structure of a display panel in another embodiment of the present invention.

[0030] The components in the figure are shown as follows:

[0031] Display panel 1; Light emitting area 1A;

[0032] Non-luminous area 1B; Array substrate 10;

[0033] Light emitting module 20; First electrode layer 21;

[0034] Hole functional layer 22; Hole injection layer 221;

[0035] Hole transport layer 222; Light emitting layer 23;

[0036] Red sub-light emitting unit 23R; Green sub-light emitting unit 23G;

[0037] Blue sub-light emitting portion 23B; Electronic functional layer 24;

[0038] Electron transport layer 241; Electron injection layer 242;

[0039] A second electrode layer 25; A light extraction layer 26;

[0040] Covering layer 27; Packaging module 30;

[0041] First inorganic layer 31; First via hole 311;

[0042] The second inorganic layer 32; The second via hole 321;

[0043] A third inorganic layer 33; A fourth inorganic layer 34;

[0044] Organic layer 35; Planar layer 36. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0046] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0047] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0048] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0049] Example 1

[0050] In the process of realizing the present invention, the inventors found that in the related art, as the thickness of the inorganic film layer in the panel packaging structure increases, the overall light transmittance of the panel will decrease, especially the blue light transmittance in the 380-480nm band is significantly reduced. Flexible transparent display panels are usually packaged using the TFE (Thin Film Encapsulation) process, but the TFE process usually prepares multiple thick inorganic film layers, resulting in a higher overall yellowness, lower transmittance, and higher reflectivity of the transparent display panel.

[0051] In an embodiment of the present invention, a display panel 1 is provided. The display panel 1 includes an array substrate 10, a light emitting module 20, and a packaging module 30. Figure 1 As shown, the light-emitting module 20 is stacked on a surface of the array substrate 10, and the packaging module 30 is stacked on a surface of the light-emitting module 20 away from the array substrate 10. The array substrate 10 is provided with a plurality of thin-film transistors arranged in an array, and the thin-film transistors are used to control the power-on status of the light-emitting module. After the light-emitting module 20 is powered on, it can convert electrical energy into light energy, thereby providing visible light for the display panel 1 to form a display screen. The packaging module 30 is used to package and protect the light-emitting module 20 to prevent the components in the light-emitting module 20 from being corroded by water and oxygen. Further, as Figure 2 As shown, the display panel 1 has a plurality of light-emitting areas 1A and non-light-emitting areas 1B connected to the light-emitting areas 1A.

[0052] like Figure 3 As shown, the light-emitting module 20 includes a first electrode layer 21, a hole function layer 22, a light-emitting layer 23, an electron function layer 24 and a second electrode layer 25. The first electrode layer 21 is disposed on the array substrate 10 and is electrically connected to the thin film transistor in the array substrate 10. The hole function layer 22 is disposed on the first electrode layer 21, and includes a hole injection layer 221 and a hole transport layer 222. The hole injection layer 221 is disposed on a side surface of the first electrode layer 21 away from the array substrate 10, and the hole transport layer 222 is disposed on a side surface of the hole injection layer 221 away from the array substrate 10. The light-emitting layer 23 is disposed on a side surface of the hole transport layer 222 away from the array substrate 10 (i.e., a side surface of the hole functional layer 22 away from the array substrate 10), and is provided with a plurality of spaced sub-light-emitting portions, which include a red sub-light-emitting portion 23R, a green sub-light-emitting portion 23G, and a blue sub-light-emitting portion 23B. Each light-emitting area 1A is provided with a sub-light-emitting portion, and each sub-light-emitting portion can emit light of a corresponding color, thereby realizing color display. The electronic functional layer 24 is disposed on the light-emitting layer 23, and includes an electron injection layer 242 and an electron transport layer 241. The electron transport layer 241 is disposed on a side surface of the light-emitting layer 23 away from the array substrate 10, and the electron injection layer 242 is disposed on a side surface of the electron transport layer 241 away from the array substrate 10. The second electrode layer 25 is disposed on a surface of the electron injection layer 242 away from the electron transport layer 241 (i.e., a side surface of the electronic functional layer 24 away from the array substrate 10).

[0053] Specifically, the first electrode layer 21 and the second electrode layer 25 serve as an anode and a cathode, respectively, to increase holes and electrons for the light-emitting layer 23. After the first electrode layer 21 and the second electrode layer 25 are powered, the electrons and holes are respectively injected from the first electrode layer 21 and the second electrode layer 25 into the hole injection layer 221 and the electron injection layer 242 under the driving of the voltage, and migrate to the light-emitting layer 23 through the hole transport layer 222 and the electron transport layer 241, and finally combine in the light-emitting layer 23 and excite the light-emitting material in the light-emitting layer 23 to emit visible light.

[0054] The light emitting module 20 further includes a light extraction layer 26 (capping layer, CPL) and a covering layer 27. The light extraction layer 26 is disposed on the surface of the second electrode layer 25 away from the array substrate 10, and the covering layer 27 is disposed on the surface of the light extraction layer 26 away from the array substrate 10. The light extraction layer 26 adjusts the optical interference distance through the light extraction material used, suppresses the extinction caused by the emission of external light and the movement of surface plasma, thereby improving the brightness and contrast of the display panel 1, and the stacked structure formed by the combination of the second electrode layer 25, the light extraction layer 26 and the covering layer 27 still has good transmittance. Furthermore, the light extraction layer 26 and the covering layer 27 have conductive properties, so that the stacked structure of the light extraction layer 26 and the covering layer 27 also has the conductive properties of the second electrode layer 25, which is equivalent to increasing the thickness of the second electrode layer 25, thereby improving the conductivity of the second electrode layer 25 without changing the overall structure of the display panel 1, thereby reducing or eliminating the voltage drop of the display panel 1, and improving the brightness uniformity of the display panel 1. Optionally, the material of the cover layer 27 may be lithium fluoride (LiF).

[0055] The packaging module 30 includes a first inorganic layer 31, a second inorganic layer 32, a third inorganic layer 33, a fourth inorganic layer 34 and an organic layer 35. The first inorganic layer 31 and the third inorganic layer 33 are both disposed on a side of the organic layer 35 close to the array substrate 100, and the second inorganic layer 32 and the fourth inorganic layer 34 are both disposed on a side of the organic layer 35 away from the array substrate 10.

[0056] The first inorganic layer 31 is disposed on a surface of the light-emitting module 20 on a side away from the array substrate 10 and is located in the non-light-emitting area 1B. A plurality of first via holes 311 are disposed in the first inorganic layer 31, and the first via holes 311 penetrate the first inorganic layer 31 and are located in the light-emitting area 1A. The third inorganic layer 33 is located on a side of the light-emitting module 20 away from the array substrate 10 (i.e., a side of the organic layer 35 close to the array substrate 10), and fills the first via holes 311, so that the first inorganic layer 31 is in contact with at least part of the side surface of the third inorganic layer 33. Among them, the surfaces of the first inorganic layer 31 and the third inorganic layer 33 that are in contact with the light-emitting module 20 are located in the same plane, and the thickness of the first inorganic layer 31 in the direction perpendicular to the plane where the array substrate 10 is located is less than the thickness of the third inorganic layer 33, which causes a height difference between the top surface of the first inorganic layer 31 (that is, the side surface of the first inorganic layer 31 away from the array substrate 10) and the top surface of the third inorganic layer 33 (that is, the side surface of the third inorganic layer 33 away from the array substrate 10) (that is, the heights of the two top surfaces in the display panel 1 are inconsistent), which causes the top surface of the first inorganic layer 31 to be unable to be flush with the top surface of the third inorganic layer 33, thereby making the surface of the inorganic film layer uneven and having gaps, thereby affecting the flatness of the packaging module 30.

[0057] The organic layer 35 is disposed on the surface of the first inorganic layer 21 on the side away from the array substrate 10, and covers the top surface of the third inorganic layer 33 (i.e., the surface of the third inorganic layer 33 on the side away from the array substrate 10) and wraps part of the side surface of the third inorganic layer 33, and also covers the top surface of the first inorganic layer 31 in the non-luminous area 1B (i.e., the surface of the first inorganic layer 31 on the side away from the array substrate 10). In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the organic layer 35 is greater than the height difference between the top surface of the first inorganic layer 31 and the top surface of the third inorganic layer 33, thereby filling the gap on the surface of the inorganic film layer and improving the flatness of the packaging module 30. Optionally, the organic layer 35 contains one or more organic materials such as polyvinyl alcohol, polyurethane, epoxy resin, acrylate, silicone, etc.

[0058] The second inorganic layer 32 is disposed on a surface of the organic layer 35 away from the first inorganic layer 31 and is located in the non-luminescent area 1B. A plurality of second via holes 321 are disposed in the second inorganic layer 32, the second via holes 321 penetrate the second inorganic layer 32 and are located in the luminescent area 1A, and the fourth inorganic layer 34 is located on a side of the organic layer 35 away from the array substrate 10 and fills the second via holes 321, so that the second inorganic layer 32 is in contact with at least part of the side surface of the fourth inorganic layer 34. Among them, a surface where the second inorganic layer 32 and the fourth inorganic layer 34 are in contact with the organic layer 35 is located in the same plane, and the thickness of the second inorganic layer 32 in the direction perpendicular to the plane where the array substrate 10 is located is less than the thickness of the fourth inorganic layer 34, which causes a height difference between the top surface of the second inorganic layer 32 (that is, a surface of the second inorganic layer 32 away from the organic layer 35) and the top surface of the fourth inorganic layer 34 (that is, a surface of the fourth inorganic layer 34 away from the organic layer 35), causing the top surface of the second inorganic layer 32 to be unable to be flush with the top surface of the fourth inorganic layer 34, thereby making the surface of the inorganic film layer uneven and having gaps, thereby affecting the flatness of the packaging module 30.

[0059] Furthermore, the orthographic projection of the third inorganic layer 33 on the array substrate 10 overlaps with the orthographic projection of the fourth inorganic layer 34 on the array substrate 10 , and the orthographic projection of the sub-light-emitting portion on the array substrate 10 is located within the range of the orthographic projections of the third inorganic layer 33 and the fourth inorganic layer 34 on the array substrate 10 .

[0060] The encapsulation module 30 further includes a flat layer 36, which is disposed on the side of the second inorganic layer 32 and the fourth inorganic layer 34 away from the array substrate 10. The flat layer 36 covers the side surface of the fourth inorganic layer 34 away from the array substrate 10 and wraps part of the side surface of the fourth inorganic layer 34. At the same time, the flat layer 36 also covers the side surface of the second inorganic layer 32 away from the array substrate 10 in the non-luminous area 1B. In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the flat layer 36 is greater than the height difference between the top surface of the second inorganic layer 32 and the top surface of the fourth inorganic layer 34, thereby filling the gap on the surface of the inorganic film layer and promoting the flattening of the surface of the encapsulation module 30. The flat layer 36 is made of an organic material with good flexibility, such as optical adhesive (OC adhesive).

[0061] In the packaging module 30 provided in the embodiment of the present invention, the thickness of the inorganic film layer in the non-display area 1B can be reduced by setting a thinner first inorganic layer 31 and a second inorganic layer 32, thereby solving the problem of high yellowness of the transparent display panel due to the thicker inorganic film layer, improving the transparency of the display panel 1, and improving the packaging reliability of the packaging module 30 in the light-emitting area 1A by the thicker third inorganic layer 33 and the fourth inorganic layer 34.

[0062] Optionally, in a direction perpendicular to the plane of the array substrate 10, the thickness of the first inorganic layer 31 and the second inorganic layer 32 is 0.005 micrometers to 0.1 micrometers, and the thickness of the third inorganic layer 33 and the fourth inorganic layer 34 is 0.8 micrometers to 2 micrometers. Further, the thickness of the first inorganic layer 31 is equal to the thickness of the second inorganic layer 32, and the thickness of the third inorganic layer 33 is equal to the thickness of the fourth inorganic layer 34.

[0063] The materials of the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 can be selected from one or more inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc. Optionally, the third inorganic layer 33 and the fourth inorganic layer 34 are selected from silicon nitride (SiNx).

[0064] In the packaging module 30, the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 are used to block the invasion of water vapor and protect the light-emitting module 20 from being corroded by water and oxygen and causing failure; the organic layer 35 is used to improve the flatness of the first inorganic layer 31, the third inorganic layer 33, the second inorganic layer 32 and the fourth inorganic layer 34, and to improve the flexibility of the packaging module 30 to prevent the packaging module 30 from cracking.

[0065] The present invention also provides a method for manufacturing a display panel, which is used to manufacture the display panel 1 as described above. The manufacturing process of the display panel is as follows: Figure 4 As shown, it includes steps S11-S18.

[0066] Step S11) providing an array substrate 10: the array substrate 10 can be prepared by an array process.

[0067] Step S12) preparing a light emitting module 20 on one side surface of the array substrate 10:

[0068] The light-emitting module 20 is formed on the array substrate 10 through the organic electroluminescent device preparation process; wherein the area corresponding to the sub-light-emitting portion of the light-emitting module 20 is the light-emitting area 1A, and the remaining area is the non-light-emitting area 1B because no light-emitting device is set.

[0069] Step S13) forming a first inorganic layer 31 on a side of the light emitting module 20 away from the array substrate 10:

[0070] A layer of inorganic material with a thickness of 0.005 microns to 0.1 microns is deposited on the side of the light-emitting module 20 away from the array substrate 10 through an atomic layer deposition process (ALD) to form a first inorganic layer 31; the first inorganic layer 31 located in the light-emitting area 1A is removed through a patterning process, and the first inorganic layer 31 located in the non-light-emitting area 1B is retained, thereby forming a first via hole 311 that penetrates the first inorganic layer 31 and is located in the light-emitting area 1A.

[0071] Step S14) forming a third inorganic layer 33 in the first via hole 311 in the light emitting area 1A:

[0072] A layer of inorganic material with a thickness of 0.8 μm to 2 μm and filling the first via hole 311 is deposited on the side of the light-emitting module 20 away from the array substrate 10 through a chemical vapor deposition process to form a third inorganic layer 33; the third inorganic layer 33 located in the non-light-emitting area 1B is removed through a patterning process, and the third inorganic layer 33 located in the light-emitting area 1A is retained.

[0073] Step S15) forming an organic layer 35 on the side of the first inorganic layer 31 and the third inorganic layer 33 away from the array substrate 10:

[0074] A layer of organic material is sprayed on the side of the first inorganic layer 31 and the third inorganic layer 33 away from the array substrate 10 by inkjet printing (IJP) process to form an organic layer 35 .

[0075] Step S16) forming a second inorganic layer 32 on the side of the organic layer 35 away from the array substrate 10:

[0076] A layer of inorganic material with a thickness of 0.005 microns to 0.1 microns is deposited on the surface of the side of the organic layer 35 away from the array substrate 10 through an atomic layer deposition process to form a second inorganic layer 32; the second inorganic layer 32 located in the light-emitting area 1A is removed through a patterning process, and the second inorganic layer 32 located in the non-light-emitting area 1B is retained, thereby forming a second via hole 321 that penetrates the second inorganic layer 32 and is located in the light-emitting area 1A.

[0077] Step S17) forming a fourth inorganic layer 34 in the light emitting area 1A in the second via hole 321:

[0078] A layer of inorganic material with a thickness of 0.8 μm to 2 μm and filling the second via hole 321 is deposited on the side of the organic layer 35 away from the array substrate 10 through a chemical vapor deposition process to form a fourth inorganic layer 34; the fourth inorganic layer 34 located in the non-luminous area 1B is removed through a patterning process, and the fourth inorganic layer 34 located in the luminous area 1A is retained.

[0079] Step S18) forming a planarization layer 36 on the side of the second inorganic layer 32 and the fourth inorganic layer 34 away from the array substrate 10:

[0080] A layer of organic material is coated on the side of the second inorganic layer 32 and the fourth inorganic layer 34 away from the organic layer 35 to form a planarization layer 36 .

[0081] In the preparation method provided in the embodiment of the present invention, the preparation order between the first inorganic layer 31 and the third inorganic layer 33 and between the second inorganic layer 32 and the fourth inorganic layer 34 is not limited. Optionally, in other embodiments of the present invention, the third inorganic layer 33 may be prepared first, and the first inorganic layer 31 may be prepared after the third inorganic layer 33 is patterned. Optionally, in other embodiments of the present invention, the fourth inorganic layer 34 may be prepared first, and the second inorganic layer 32 may be prepared after the fourth inorganic layer 34 is patterned.

[0082] The patterning process used in the preparation method can be selected from one of etching processes such as photolithography, wet etching, and dry etching.

[0083] In the display panel and preparation method thereof provided in the embodiment of the present invention, a first inorganic layer and a second inorganic layer with a relatively thin thickness are prepared in the non-luminescent area by an atomic layer deposition process, thereby reducing the thickness of the inorganic film layer in the non-luminescent area, effectively improving the transmittance of short-wavelength 380-480nm blue light in the packaging module, solving the problem of high yellowness of the display panel due to the thick inorganic film layer, improving the light transmittance of the display panel, and reducing its light reflectivity, thereby improving the overall transparency of the transparent display panel and improving the user experience. At the same time, the first inorganic layer and the second inorganic layer prepared by the atomic layer deposition process have excellent compactness, and the packaging effect is better than that of the inorganic film layer prepared by the conventional TFE process. In addition, the packaging method combined with the atomic deposition process in this embodiment can be well compatible with other process production lines, and the development difficulty and cost are low.

[0084] Example 2

[0085] In an embodiment of the present invention, a display panel 1 is provided. Figure 5 As shown, the display panel 1 includes an array substrate 10, a light-emitting module 20 and a packaging module 30. The structures of the array substrate 10 and the light-emitting module 20 are the same or similar to those of the array substrate and the light-emitting module provided in Embodiment 1, and therefore are not described in detail here. Furthermore, the display panel 1 has a plurality of light-emitting areas 1A and non-light-emitting areas 1B connected to the light-emitting areas 1A.

[0086] The packaging module 30 includes a first inorganic layer 31, a second inorganic layer 32, a third inorganic layer 33, a fourth inorganic layer 34 and an organic layer 35. The first inorganic layer 31 and the third inorganic layer 33 are both arranged on a side of the organic layer 35 close to the array substrate 10, and the second inorganic layer 32 and the fourth inorganic layer 34 are both arranged on a side of the organic layer 35 away from the array substrate 10.

[0087] The first inorganic layer 31 is disposed on a surface of the light-emitting module 20 away from the array substrate 10, and covers the light-emitting area 1A and the non-light-emitting area 1B. The third inorganic layer 33 is disposed on a surface of the first inorganic layer 31 away from the array substrate 10, and is located in the light-emitting area 1A, that is, the first inorganic layer 31 is in contact with a surface of the third inorganic layer 33 close to the array substrate 10. In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the first inorganic layer 31 is less than the thickness of the third inorganic layer 33. Among them, since the third inorganic layer 33 is stacked on the surface of the first inorganic layer 31, the third inorganic layer 33 protrudes from the top surface of the first inorganic layer 31 (that is, the side surface of the first inorganic layer 31 away from the array substrate 10), that is, the top surface of the first inorganic layer 31 and the top surface of the third inorganic layer 33 (that is, a surface of the third inorganic layer 33 away from the array substrate 10) have a height difference in the direction perpendicular to the plane of the array substrate 10 (that is, the heights of the two top surfaces in the display panel 1 are inconsistent), thereby making the surface of the inorganic film layer uneven and having gaps, which in turn affects the flatness of the packaging module 30.

[0088] The organic layer 35 is disposed on the surface of the first inorganic layer 21 on the side away from the array substrate 10, and covers the top surface of the third inorganic layer 33 (i.e., the side surface of the third inorganic layer 33 away from the array substrate 10) and wraps the side surface of the third inorganic layer 33, and also covers the top surface of the first inorganic layer 31 located in the non-luminous area 1B (i.e., the side surface of the first inorganic layer 31 away from the array substrate 10). In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the organic layer 35 is greater than the height difference between the top surface of the first inorganic layer 31 and the top surface of the third inorganic layer 33 (in this embodiment, the height difference between the top surface of the first inorganic layer 31 and the top surface of the third inorganic layer 33 is equal to the thickness of the third inorganic layer 33), thereby filling the gap on the surface of the inorganic film layer and improving the flatness of the packaging module 30. Optionally, the organic layer 35 contains one or more organic materials such as polyvinyl alcohol, polyurethane, epoxy resin, acrylate, and silicone.

[0089] The second inorganic layer 32 is disposed on a side surface of the organic layer 35 away from the first inorganic layer 31, and covers the light-emitting area 1A and the non-light-emitting area 1B. The fourth inorganic layer 34 is disposed on a side surface of the second inorganic layer 32 away from the array substrate 10, and is located in the light-emitting area 1A. In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the second inorganic layer 32 is less than the thickness of the fourth inorganic layer 34. In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the second inorganic layer 32 is less than the thickness of the fourth inorganic layer 34. In the direction perpendicular to the plane where the array substrate 10 is located, the fourth inorganic layer 34 is stacked on the surface of the second inorganic layer 32, so that the fourth inorganic layer 34 protrudes from the top surface of the second inorganic layer 32 (i.e., a surface of the second inorganic layer 32 away from the organic layer 35), that is, the top surface of the second inorganic layer 32 and the top surface of the fourth inorganic layer 34 (i.e., a surface of the fourth inorganic layer 34 away from the organic layer 35) have a height difference in the direction perpendicular to the plane where the array substrate 10 is located, so that the surface of the inorganic film layer is uneven and has gaps, thereby affecting the flatness of the packaging module 30.

[0090] Furthermore, the orthographic projection of the third inorganic layer 33 on the array substrate 10 overlaps with the orthographic projection of the fourth inorganic layer 34 on the array substrate 10 , and the orthographic projection of the sub-light-emitting portion in the light-emitting module 20 on the array substrate 10 is located within the range of the orthographic projections of the third inorganic layer 33 and the fourth inorganic layer 34 on the array substrate 10 .

[0091] The encapsulation module 30 further includes a flat layer 36, which is disposed on the side of the second inorganic layer 32 and the fourth inorganic layer 34 away from the array substrate 10. The flat layer 36 covers the side surface of the fourth inorganic layer 34 away from the array substrate 10 and wraps the side surface of the fourth inorganic layer 34. At the same time, the flat layer 36 also covers the side surface of the second inorganic layer 32 away from the array substrate 10 in the non-luminous area 1B. In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the flat layer 36 is greater than the height difference between the top surface of the second inorganic layer 32 and the top surface of the fourth inorganic layer 34 (in this embodiment, the height difference between the top surface of the second inorganic layer 32 and the top surface of the fourth inorganic layer 34 is equal to the thickness of the fourth inorganic layer 34), thereby filling the gaps on the surface of the inorganic film layer and promoting the flattening of the surface of the encapsulation module 30. The flat layer 36 is made of an organic material with good flexibility, such as optical adhesive (OC adhesive).

[0092] In the packaging module 30 provided in the embodiment of the present invention, the thickness of the inorganic film layer in the non-display area 1B can be reduced by setting a thinner first inorganic layer 31 and a second inorganic layer 32, thereby solving the problem of high yellowness of the transparent display panel due to the thicker inorganic film layer, improving the transparency of the display panel 1, and improving the packaging reliability of the packaging module 30 in the light-emitting area 1A by the thicker third inorganic layer 33 and the fourth inorganic layer 34.

[0093] Optionally, in a direction perpendicular to the plane of the array substrate 10, the thickness of the first inorganic layer 31 and the second inorganic layer 32 is 0.005 micrometers to 0.1 micrometers, and the thickness of the third inorganic layer 33 and the fourth inorganic layer 34 is 0.8 micrometers to 2 micrometers. Further, the thickness of the first inorganic layer 31 is equal to the thickness of the second inorganic layer 32, and the thickness of the third inorganic layer 33 is equal to the thickness of the fourth inorganic layer 34.

[0094] The materials of the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 can be selected from one or more inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc. Optionally, the third inorganic layer 33 and the fourth inorganic layer 34 are selected from silicon nitride (SiNx).

[0095] In the packaging module 30, the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 are used to block the invasion of water vapor and protect the light-emitting module 20 from being corroded by water and oxygen and causing failure; the organic layer 35 is used to improve the flatness of the first inorganic layer 31, the third inorganic layer 33, the second inorganic layer 32 and the fourth inorganic layer 34, and to improve the flexibility of the packaging module 30 to prevent the packaging module 30 from cracking.

[0096] The present invention also provides a method for manufacturing a display panel, which is used to manufacture the display panel 1 as described above. The manufacturing process of the display panel is as follows: Figure 6 As shown, it includes steps S21-S28.

[0097] Step S21) providing an array substrate 10: the array substrate 10 can be prepared by an array process.

[0098] Step S22) preparing a light emitting module 20 on one side surface of the array substrate 10:

[0099] A light-emitting module 20 is formed on an array substrate 10 through an organic electroluminescent device preparation process; wherein the area corresponding to the sub-light-emitting portion of the light-emitting module 20 is the light-emitting area 1A, and the remaining area is the non-light-emitting area 1B because no light-emitting device is set.

[0100] Step S23) forming a first inorganic layer 31 on a side of the light emitting module 20 away from the array substrate 10:

[0101] A layer of inorganic material with a thickness of 0.005 micrometers to 0.1 micrometers is deposited on the side of the light emitting module 20 away from the array substrate 10 by an atomic layer deposition process to form a first inorganic layer 31 .

[0102] Step S24) forming a third inorganic layer 33 located in the light emitting area 1A on the side of the first inorganic layer 31 away from the array substrate 10:

[0103] A layer of inorganic material with a thickness of 0.8 microns to 2 microns is deposited on the side of the first inorganic layer 31 away from the array substrate 10 through a chemical vapor deposition process to form a third inorganic layer 33; the third inorganic layer 33 located in the non-luminous area 1B is removed through a patterning process, and the third inorganic layer 33 located in the luminous area 1A is retained.

[0104] Step S25) forming an organic layer 35 on the side of the first inorganic layer 31 and the third inorganic layer 33 away from the array substrate 10:

[0105] A layer of organic material capable of covering the third inorganic layer 33 is sprayed on the side of the first inorganic layer 31 and the third inorganic layer 33 away from the array substrate 10 by inkjet printing process to form an organic layer 35 .

[0106] Step S26) forming a second inorganic layer 32 on the side of the organic layer 35 away from the array substrate 10:

[0107] A layer of inorganic material with a thickness of 0.005 micrometers to 0.1 micrometers is deposited on the surface of the organic layer 35 away from the array substrate 10 by an atomic layer deposition process to form a second inorganic layer 32 .

[0108] Step S27) forming a fourth inorganic layer 34 located in the light emitting area 1A on the side of the second inorganic layer 32 away from the array substrate 10:

[0109] A layer of inorganic material with a thickness of 0.8 microns to 2 microns is deposited on the side of the second inorganic layer 32 away from the array substrate 10 through a chemical vapor deposition process to form a fourth inorganic layer 34; the fourth inorganic layer 34 located in the non-luminous area 1B is removed through a patterning process, and the fourth inorganic layer 34 located in the luminous area 1A is retained.

[0110] Step S28) forming a planarization layer 36 on the side of the second inorganic layer 32 and the fourth inorganic layer 34 away from the array substrate 10:

[0111] A layer of organic material covering the fourth inorganic layer 34 is coated on a side of the second inorganic layer 32 away from the array substrate 10 to form a planarization layer 36 .

[0112] In the display panel and the preparation method thereof provided in the embodiments of the present invention, the structural design of the vias in the first inorganic layer and the second inorganic layer is eliminated, and the third inorganic layer and the fourth inorganic layer are directly prepared on the side of the first inorganic layer and the second inorganic layer away from the light-emitting module, respectively. Similarly, the thickness of the inorganic film layer in the non-luminous area can be thinned by the atomic layer deposition process, thereby solving the problem of high yellowness of the display panel caused by the thick inorganic film layer, improving the light transmittance of the display panel, and reducing its light reflectivity, thereby improving the overall transparency of the transparent display panel and improving the user experience.

[0113] Moreover, the display panel provided in the embodiment of the present invention eliminates the structural design of the vias, which makes the film structure of the first inorganic layer and the second inorganic layer more complete, further improves the compactness of the first inorganic layer and the second inorganic layer, and thus further improves the packaging effect of the packaging module. The preparation method provided in the embodiment of the present invention also eliminates the step of opening vias with the elimination of the via structure, thereby improving the production line efficiency and reducing the production cost. At the same time, the first inorganic layer and the second inorganic layer in the embodiment of the present invention can block the over-engraving phenomenon that occurs when the third inorganic layer and the fourth inorganic layer are patterned, solve the packaging failure problem caused by over-engraving, and further improve the stability of the packaging module.

[0114] Example 3

[0115] In an embodiment of the present invention, a display panel 1 is provided. Figure 7 As shown, the display panel 1 includes an array substrate 10, a light-emitting module 20 and a packaging module 30. The structures of the array substrate 10 and the light-emitting module 20 are the same or similar to those of the array substrate and the light-emitting module provided in Embodiment 1, and therefore are not described in detail here. Furthermore, the display panel 1 has a plurality of light-emitting areas 1A and non-light-emitting areas 1B connected to the light-emitting areas 1A.

[0116] The packaging module 30 includes a first inorganic layer 31, a second inorganic layer 32, a third inorganic layer 33, a fourth inorganic layer 34 and an organic layer 35. The first inorganic layer 31 and the third inorganic layer 33 are both arranged on a side of the organic layer 35 close to the array substrate 10, and the second inorganic layer 32 and the fourth inorganic layer 34 are both arranged on a side of the organic layer 35 away from the array substrate 10.

[0117] The third inorganic layer 33 is disposed on a side of the first inorganic layer 31 close to the array substrate 10 and is located in the light-emitting area 1A. The first inorganic layer 31 covers the top surface of the third inorganic layer 33 (i.e., the side surface of the third inorganic layer 33 away from the array substrate 10) and wraps the side surface of the third inorganic layer 33, and also covers the top surface of the light-emitting module 20 located in the non-light-emitting area 1B (i.e., the side surface of the light-emitting module 20 away from the array substrate 10). In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the first inorganic layer 31 is less than the thickness of the third inorganic layer 33. Since the thickness of the first inorganic layer 31 is less than that of the third inorganic layer 33, the first inorganic layer 31 cannot fill the gaps between adjacent third inorganic layers 33, resulting in a height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 (i.e., a surface of the first inorganic layer 31 away from the array substrate 10) (i.e., the heights of the highest point and the lowest point in the display panel 1 are inconsistent), thereby making the surface of the inorganic film layer uneven and having gaps, thereby affecting the flatness of the packaging module 30.

[0118] The organic layer 35 covers the surface of the first inorganic layer 31 on one side away from the array substrate 10, and the thickness of the organic layer 35 in the direction perpendicular to the plane where the array substrate 10 is located is greater than the height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 (in this embodiment, the height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 is equal to the thickness of the third inorganic layer 33), thereby filling the gap on the surface of the inorganic film layer and improving the flatness of the packaging module 30. Optionally, the organic layer 35 contains one or more organic materials such as polyvinyl alcohol, polyurethane, epoxy resin, acrylate, silicone, etc.

[0119] The fourth inorganic layer 34 is disposed on a side surface of the organic layer 35 away from the array substrate 10 and is located in the light-emitting area 1A. The second inorganic layer 32 is disposed on a side surface of the organic layer 35 away from the array substrate 10, covers a side surface of the fourth inorganic layer 34 away from the array substrate 10 and wraps the side surface of the fourth inorganic layer 32. In a direction perpendicular to the plane where the array substrate 10 is located, the thickness of the second inorganic layer 32 is less than the thickness of the fourth inorganic layer 34. Among them, since the thickness of the second inorganic layer 32 is less than the thickness of the fourth inorganic layer 34, the second inorganic layer 32 cannot fill the gap between adjacent fourth inorganic layers 34, which causes a height difference between the highest point and the lowest point on the top surface of the second inorganic layer 32 (i.e., a surface of the second inorganic layer 32 away from the organic layer 35), so that the surface of the inorganic film layer is uneven and has gaps, thereby affecting the flatness of the packaging module 30.

[0120] Furthermore, the orthographic projection of the third inorganic layer 33 on the array substrate 10 overlaps with the orthographic projection of the fourth inorganic layer 34 on the array substrate 10 , and the orthographic projection of the sub-light-emitting portion in the light-emitting module 20 on the array substrate 10 is located within the range of the orthographic projections of the third inorganic layer 33 and the fourth inorganic layer 34 on the array substrate 10 .

[0121] The encapsulation module 30 further includes a flat layer 36, which is disposed on a side of the organic layer 35 away from the array substrate 10 and is stacked on a surface of the second inorganic layer 32 away from the array substrate 10. In a direction perpendicular to the plane where the array substrate 10 is located, the thickness of the flat layer 36 is greater than the height difference between the highest point and the lowest point on the top surface of the second inorganic layer 32 (in this embodiment, the height difference between the highest point and the lowest point on the top surface of the second inorganic layer 32 is equal to the thickness of the fourth inorganic layer 34), thereby filling the gaps on the surface of the inorganic film layer and promoting the flattening of the surface of the encapsulation module 30. The flat layer 36 is made of an organic material with good flexibility, such as optical adhesive (OC adhesive).

[0122] In the packaging module 30 provided in the embodiment of the present invention, the thickness of the inorganic film layer in the non-display area 1B can be reduced by setting a thinner first inorganic layer 31 and a second inorganic layer 32, thereby solving the problem of high yellowness of the transparent display panel due to the thicker inorganic film layer, improving the transparency of the display panel 1, and improving the packaging reliability of the packaging module 30 in the light-emitting area 1A by the thicker third inorganic layer 33 and the fourth inorganic layer 34.

[0123] Optionally, in a direction perpendicular to the plane of the array substrate 10, the thickness of the first inorganic layer 31 and the second inorganic layer 32 is 0.005 micrometers to 0.1 micrometers, and the thickness of the third inorganic layer 33 and the fourth inorganic layer 34 is 0.8 micrometers to 2 micrometers. Further, the thickness of the first inorganic layer 31 is equal to the thickness of the second inorganic layer 32, and the thickness of the third inorganic layer 33 is equal to the thickness of the fourth inorganic layer 34.

[0124] The materials of the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 can be selected from one or more inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc. Optionally, the third inorganic layer 33 and the fourth inorganic layer 34 are selected from silicon nitride (SiNx).

[0125] In the packaging module 30, the first inorganic layer 31, the second inorganic layer 32, the third inorganic layer 33 and the fourth inorganic layer 34 are used to block the invasion of water vapor and protect the light-emitting module 20 from being corroded by water and oxygen and causing failure; the organic layer 35 is used to improve the flatness of the first inorganic layer 31, the third inorganic layer 33, the second inorganic layer 32 and the fourth inorganic layer 34, improve the flexibility of the packaging module 30, and prevent the packaging module 30 from cracking.

[0126] The present invention also provides a method for preparing a display panel, which is used to prepare the display panel as described above. The preparation process of the display panel is as follows: Figure 8 As shown, it includes steps S31-S38.

[0127] Step S31) providing an array substrate 10: the array substrate 10 can be prepared by an array process.

[0128] Step S32) preparing a light emitting module 20 on one side surface of the array substrate 10:

[0129] A light-emitting module 20 is formed on an array substrate 10 through an organic electroluminescent device preparation process; wherein the area corresponding to the sub-light-emitting portion of the light-emitting module 20 is the light-emitting area 1A, and the remaining area is the non-light-emitting area 1B because no light-emitting device is set.

[0130] Step S33) forming a third inorganic layer 33 located in the light emitting area 1A on the side of the light emitting module 20 away from the array substrate 10:

[0131] A layer of inorganic material with a thickness of 0.8 microns to 2 microns is deposited on the side of the light-emitting module 20 away from the array substrate 10 through a chemical vapor deposition process to form a third inorganic layer 33; the third inorganic layer 33 located in the non-luminous area 1B is removed through a patterning process, and the third inorganic layer 33 located in the light-emitting area 1A is retained.

[0132] Step S34) forming a first inorganic layer 31 on a side of the light emitting module 20 and the third inorganic layer 33 away from the array substrate 10:

[0133] An inorganic material having a thickness of 0.005 micrometers to 0.1 micrometers and covering the third inorganic layer 33 is deposited on the light emitting module 20 by an atomic layer deposition process to form the first inorganic layer 31 .

[0134] Step S35) forming an organic layer 35 on a side of the first inorganic layer 31 away from the array substrate 10:

[0135] A layer of organic material is sprayed on a side of the first inorganic layer 31 away from the third inorganic layer 33 by an inkjet printing process to form an organic layer 35 .

[0136] Step S36) forming a fourth inorganic layer 34 located in the light emitting area 1A on the side of the organic layer 35 away from the array substrate 10:

[0137] A layer of inorganic material with a thickness of 0.8 microns to 2 microns is deposited on the side of the organic layer 35 away from the array substrate 10 through a chemical vapor deposition process to form a fourth inorganic layer 34; the fourth inorganic layer 34 located in the non-luminous area 1B is removed through a patterning process, and the fourth inorganic layer 34 located in the luminous area 1A is retained.

[0138] Step S37) forming a second inorganic layer 32 on the side of the organic layer 35 and the fourth inorganic layer 34 away from the array substrate 10:

[0139] An inorganic material having a thickness of 0.005 micrometers to 0.1 micrometers and covering the fourth inorganic layer 34 is deposited on the organic layer 35 by an atomic layer deposition process to form the second inorganic layer 32 .

[0140] Step S38) forming a planar layer 36 on the side of the second inorganic layer 32 away from the organic layer 35:

[0141] A layer of organic material is coated on a side of the second inorganic layer 32 away from the fourth inorganic layer 34 to form a planarization layer 36 .

[0142] In the display panel and its preparation method provided in the embodiments of the present invention, the structural design of the vias in the first inorganic layer and the second inorganic layer is eliminated, and the third inorganic layer and the fourth inorganic layer are directly prepared on the side of the first inorganic layer and the second inorganic layer close to the light-emitting module, respectively. Similarly, the thickness of the inorganic film layer in the non-light-emitting area can be thinned by the atomic layer deposition process, thereby solving the problem of high yellowness of the display panel caused by the thick inorganic film layer, improving the light transmittance of the display panel, and reducing its light reflectivity, thereby improving the overall transparency of the transparent display panel and improving the user experience.

[0143] Moreover, the display panel provided in the embodiment of the present invention eliminates the structural design of the vias, which makes the film structure of the first inorganic layer and the second inorganic layer more complete, further improves the compactness of the first inorganic layer and the second inorganic layer, and further improves the packaging effect of the packaging module. The preparation method provided in the embodiment of the present invention also eliminates the step of opening vias with the elimination of the via structure, thereby improving the production line efficiency and reducing the production cost. At the same time, the first inorganic layer and the second inorganic layer in the embodiment of the present invention can cover and compensate for the over-engraving marks of the third inorganic layer and the fourth inorganic layer during the patterning process, solve the packaging failure problem caused by over-engraving, and further improve the stability of the packaging module.

[0144] Example 4

[0145] In an embodiment of the present invention, a display panel 1 is provided. Fig. 9 As shown, the display panel 1 includes an array substrate 10, a light-emitting module 20 and a packaging module 30. The structures of the array substrate 10 and the light-emitting module 20 are the same or similar to those of the array substrate and the light-emitting module provided in Embodiment 3, and therefore are not described in detail here. Furthermore, the display panel 1 has a plurality of light-emitting areas 1A and non-light-emitting areas 1B connected to the light-emitting areas 1A.

[0146] The packaging module 30 includes a first inorganic layer 31, a second inorganic layer 32, a third inorganic layer 33, an organic layer 35 and a planar layer 36, wherein the first inorganic layer 31 and the third inorganic layer 33 are both arranged on a layer of the organic layer 35 close to the array substrate 10, and the second inorganic layer 32 and the planar layer 36 are arranged on a side of the organic layer 35 away from the array substrate 10.

[0147] The third inorganic layer 33 is disposed on a side surface of the light-emitting module 20 away from the array substrate 10 and is located in the light-emitting area 1A. The first inorganic layer 31 covers the top surface of the third inorganic layer 33 (i.e., the side surface of the third inorganic layer 33 away from the array substrate 10) and wraps the side surface of the third inorganic layer 33, and also covers the top surface of the light-emitting module 20 located in the non-light-emitting area 1B (i.e., the side surface of the light-emitting module 20 away from the array substrate 10). In the direction perpendicular to the plane where the array substrate 10 is located, the thickness of the first inorganic layer 31 is less than the thickness of the third inorganic layer 33. Since the thickness of the first inorganic layer 31 is less than that of the third inorganic layer 33, the first inorganic layer 31 cannot fill the gaps between adjacent third inorganic layers 33, resulting in a height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 (i.e., a surface of the first inorganic layer 31 away from the array substrate 10) (i.e., the heights of the highest point and the lowest point in the display panel 1 are inconsistent), thereby making the surface of the inorganic film layer uneven and having gaps, thereby affecting the flatness of the packaging module 30.

[0148] The organic layer 35 covers the surface of the first inorganic layer 31 on one side away from the array substrate 10, and the thickness of the organic layer 35 in the direction perpendicular to the plane where the array substrate 10 is located is greater than the height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 (in this embodiment, the height difference between the highest point and the lowest point on the top surface of the first inorganic layer 31 is equal to the thickness of the third inorganic layer 33), thereby filling the gap on the surface of the inorganic film layer and improving the flatness of the packaging module 30. Optionally, the organic layer 35 contains one or more organic materials such as polyvinyl alcohol, polyurethane, epoxy resin, acrylate, silicone, etc.

[0149] The second inorganic layer 32 is stacked on the surface of the side of the organic layer 35 away from the array substrate 10, and covers the light-emitting area 1A and the non-light-emitting area 1B. The flat layer 36 is stacked on the surface of the side of the second inorganic layer 32 away from the organic layer 35, which also covers the light-emitting area 1A and the non-light-emitting area 1B, and flattens the surface of the second inorganic layer 32. The flat layer 36 is made of an organic material with good flexibility, such as optical adhesive (OC adhesive).

[0150] Furthermore, the orthographic projection of the sub-light-emitting portion in the light-emitting module 20 on the array substrate 10 is located within the orthographic projection range of the third inorganic layer 33 on the array substrate 10 .

[0151] In the packaging module 30 provided in the embodiment of the present invention, the thickness of the inorganic film layer in the non-display area 1B can be reduced by setting a thinner first inorganic layer 31 and a second inorganic layer 32, thereby solving the problem of high yellowness of the transparent display panel due to the thicker inorganic film layer, improving the transparency of the display panel 1, and improving the packaging reliability of the packaging module 30 in the light-emitting area 1A by the thicker third inorganic layer 33 and the fourth inorganic layer 34.

[0152] Optionally, in a direction perpendicular to the plane of the array substrate 10 , the thickness of the first inorganic layer 31 and the second inorganic layer 32 is 0.005 μm-0.1 μm, and the thickness of the third inorganic layer 33 is 0.8 μm-2 μm. Further, the thickness of the first inorganic layer 31 is equal to the thickness of the second inorganic layer 32.

[0153] The materials of the first inorganic layer 31, the second inorganic layer 32 and the third inorganic layer 33 can be selected from one or more inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc. Optionally, the third inorganic layer 33 is selected from silicon nitride (SiNx).

[0154] In the packaging module 30, the first inorganic layer 31, the second inorganic layer 32 and the third inorganic layer 33 are used to block the invasion of water vapor and protect the light-emitting module 20 from being corroded by water and oxygen and causing failure; the organic layer 35 is used to improve the flatness of the first inorganic layer 31, the third inorganic layer 33 and the second inorganic layer 32, improve the flexibility of the packaging module 30, and prevent the packaging module 30 from cracking.

[0155] The present invention also provides a method for preparing a display panel, which is used to prepare the display panel as described above. The preparation process of the display panel is as follows: Fig.10 As shown, it includes steps S41-S47.

[0156] Step S41) providing an array substrate 10: the array substrate 10 can be prepared by an array process.

[0157] Step S42) preparing a light emitting module 20 on one side surface of the array substrate 10:

[0158] A light-emitting module 20 is formed on an array substrate 10 through an organic electroluminescent device preparation process; wherein the area corresponding to the sub-light-emitting portion of the light-emitting module 20 is the light-emitting area 1A, and the remaining area is the non-light-emitting area 1B because no light-emitting device is set.

[0159] Step S43) forming a third inorganic layer 33 located in the light emitting area 1A on the side of the light emitting module 20 away from the array substrate 10:

[0160] A layer of inorganic material with a thickness of 0.8 microns to 2 microns is deposited on the side of the light-emitting module 20 away from the array substrate 10 through a chemical vapor deposition process to form a third inorganic layer 33; the third inorganic layer 33 located in the non-luminous area 1B is removed through a patterning process, and the third inorganic layer 33 located in the light-emitting area 1A is retained.

[0161] Step S44) forming a first inorganic layer 31 on a side of the light emitting module 20 and the third inorganic layer 33 away from the array substrate 10:

[0162] An inorganic material having a thickness of 0.005 micrometers to 0.1 micrometers and covering the third inorganic layer 33 is deposited on the light emitting module 20 by an atomic layer deposition process to form the first inorganic layer 31 .

[0163] Step S45) forming an organic layer 35 on a side of the first inorganic layer 31 away from the array substrate 10:

[0164] A layer of organic material is sprayed on a side of the first inorganic layer 31 away from the third inorganic layer 33 by an inkjet printing process to form an organic layer 35 .

[0165] Step S46) forming a second inorganic layer 32 on the side of the organic layer 35 away from the array substrate 10:

[0166] An inorganic material having a thickness of 0.005 micrometers to 0.1 micrometers is deposited on the organic layer 35 by an atomic layer deposition process to form the second inorganic layer 32 .

[0167] Step S47) forming a planarization layer 36 on a side of the second inorganic layer 32 away from the array substrate 10:

[0168] A layer of organic material is coated on a side of the second inorganic layer 32 away from the array substrate 10 to form a planarization layer 36 .

[0169] In another embodiment of the present invention, the third inorganic layer 33 may also be disposed between the second inorganic layer 32 and the organic layer 35. Fig.11 As shown, the rest of the structure of the packaging module 30 in the display panel 1 is similar to the packaging module 30 provided in this proposal, the only difference being that the film layer position of the third inorganic layer 33 is different. The technical problems it solves and the technical effects it achieves are the same as those of the display panel provided in this proposal. Fig.11 The preparation method of the display panel 1 shown in the figure is different from the preparation method provided in this embodiment in that the preparation step of the third inorganic layer 33 is moved to be performed after the organic layer 35 is formed as the film layer structure changes, thereby forming the third inorganic layer 33 located in the light-emitting area 1A on the side of the organic layer 35 away from the light-emitting module 20, and the preparation steps of the other film layers remain unchanged.

[0170] The display panel and preparation method provided in the embodiment of the present invention are extended embodiments of embodiment 3. The fourth inorganic layer is eliminated in the embodiment of the present invention. On the basis of embodiment 3, the thickness of the inorganic film layer in the encapsulation module is further reduced, thereby further reducing the yellowness of the display panel and improving the light transmittance of the display panel, thereby improving the overall transparency of the transparent display panel and improving the user experience. At the same time, due to the elimination of the fourth inorganic layer, the preparation method of the display panel provided in this embodiment also eliminates the preparation step of the fourth inorganic layer, further improving the production line efficiency and reducing the production cost.

[0171] In another embodiment of the present invention, a display device is provided, which may be an OLED (organic electroluminescent) display device, comprising any one of the display panels 1 described in the above embodiments, and the display panel 1 is used to provide a display image for the display device. The display device may be any display device with a display function, such as a mobile phone, a laptop computer, a tablet computer, etc.

[0172] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: It has a plurality of light-emitting areas and non-light-emitting areas connected to the light-emitting areas; The display panel comprises: An array substrate; A light emitting module, arranged on one side of the array substrate; An organic layer is provided on a surface of the light emitting module which is away from the array substrate; A first inorganic layer, disposed on a side of the organic layer close to the array substrate; A second inorganic layer is provided on a side of the organic layer away from the array substrate; The third inorganic layer is arranged on a side of the organic layer close to or away from the array substrate and is located in the light-emitting area; along a direction perpendicular to the plane where the array substrate is located, the thickness of the first inorganic layer and the second inorganic layer is less than the thickness of the third inorganic layer.

2. The display panel according to claim 1, wherein: Along a direction perpendicular to the plane where the array substrate is located, the thickness of the first inorganic layer and the second inorganic layer are 0.005 micrometers to 0.1 micrometers respectively; Along a direction perpendicular to the plane where the array substrate is located, the thickness of the third inorganic layer is 0.8 micrometers to 2 micrometers.

3. The display panel according to claim 1, wherein: The third inorganic layer is disposed on a side of the organic layer close to the array substrate, and the first inorganic layer is in contact with at least a portion of the surface of the third inorganic layer; Preferably, the third inorganic layer is located on a side of the first inorganic layer close to the array substrate, the first inorganic layer covers a surface of the third inorganic layer away from the array substrate, and wraps a side surface of the third inorganic layer; alternatively, the third inorganic layer is located on a side of the first inorganic layer away from the array substrate, the first inorganic layer is in contact with a surface of the third inorganic layer close to the array substrate, and the organic layer covers a surface of the third inorganic layer away from the array substrate and wraps at least part of a side surface of the third inorganic layer.

4. The display panel according to claim 1, wherein: The third inorganic layer is disposed on a side of the organic layer away from the array substrate, and the second inorganic layer is in contact with at least a portion of the surface of the third inorganic layer; Preferably, the third inorganic layer is located between the second inorganic layer and the organic layer, and the second inorganic layer covers a surface of the third inorganic layer that is away from the array substrate and wraps a side surface of the third inorganic layer.

5. The display panel according to claim 1, wherein: Also includes: a planarization layer, disposed on a side of the second inorganic layer away from the array substrate; Preferably, the material of the planar layer includes optical adhesive.

6. The display panel according to claim 1, wherein: Also includes: a fourth inorganic layer, disposed on a side of the organic layer away from the array substrate and located in the light emitting area; Preferably, the fourth inorganic layer is located on a side of the second inorganic layer close to the array substrate, and the second inorganic layer covers a surface of the fourth inorganic layer away from the array substrate and wraps a side surface of the fourth inorganic layer; Preferably, the fourth inorganic layer is located on a side of the second inorganic layer away from the array substrate, and the second inorganic layer is in contact with a surface of a side of the fourth inorganic layer close to the array substrate; Preferably, along a direction perpendicular to the plane where the array substrate is located, the thickness of the first inorganic layer and the second inorganic layer is less than the thickness of the fourth inorganic layer; Preferably, along a direction perpendicular to the plane where the array substrate is located, the thickness of the fourth inorganic layer is 0.8 micrometers to 2 micrometers.

7. The display panel according to claim 6, wherein: Also includes: a first via hole, penetrating the first inorganic layer and located in the light emitting area; a second via hole, penetrating the second inorganic layer and located in the light emitting area; The third inorganic layer and the fourth inorganic layer fill the first via hole and the second via hole respectively; Preferably, the third inorganic layer is located on a side of the organic layer close to the array substrate, the organic layer covers a surface of the third inorganic layer away from the array substrate and wraps at least part of a side surface of the third inorganic layer, and the first inorganic layer is in contact with at least part of a side surface of the third inorganic layer; Preferably, the fourth inorganic layer is located on a side of the organic layer away from the array substrate, and the second inorganic layer is in contact with at least a portion of a side surface of the fourth inorganic layer.

8. The display panel according to claim 6, wherein: Also includes: a planarization layer, disposed on a side of the second inorganic layer away from the array substrate; Preferably, the fourth inorganic layer is located on a side of the second inorganic layer away from the array substrate, the flat layer is located on a side of the fourth inorganic layer away from the array substrate, and the flat layer covers a surface of the fourth inorganic layer away from the array substrate and wraps at least part of a side surface of the fourth inorganic layer; or, The fourth inorganic layer is located on a side of the second inorganic layer close to the array substrate, the flat layer is located on a side of the second inorganic layer away from the array substrate, and the flat layer covers a surface of the second inorganic layer away from the array substrate; Preferably, the material of the planar layer includes optical adhesive.

9. The display panel according to claim 1, wherein: The light emitting module comprises: a first electrode layer; A hole function layer, disposed on a side of the first electrode layer away from the array substrate; A light-emitting layer is provided on a side of the hole functional layer away from the array substrate; An electronic functional layer, disposed on a side of the light-emitting layer away from the array substrate; A second electrode layer is provided on a side of the electronic functional layer away from the array substrate; A light extraction layer, disposed on a side of the second electrode layer away from the array substrate; A covering layer, disposed on a side of the light extraction layer away from the array substrate; Preferably, the light-emitting layer comprises a plurality of sub-light-emitting portions arranged at intervals, and the sub-light-emitting portions are located in the corresponding light-emitting areas; Preferably, the orthographic projection of the sub-light-emitting portion on the array substrate is located within the orthographic projection range of the third inorganic layer on the array substrate.

10. The display panel according to claim 6, wherein: The first inorganic layer and the second inorganic layer are prepared by an atomic layer deposition process; The third inorganic layer is prepared by a chemical vapor deposition process; Preferably, the fourth inorganic layer is prepared by a chemical vapor deposition process.

11. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-10.

Images