A laser debonding device and method

Abstract

This invention discloses a laser debonding device and method. The device includes: a laser emitter; a beam splitter that splits the received initial laser into a first laser directed towards a focal spot analyzer and a second laser directed towards a sacrificial layer of the bonded member, wherein the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same; an infrared vision component that acquires an infrared spot image of the second laser on the sacrificial layer; and a controller configured to: acquire the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; initially adjust the working distance from the laser emitter to the sacrificial layer to achieve an optimal spot size for the second laser; finely adjust the working distance from the laser emitter to the sacrificial layer by acquiring the infrared spot image of the second laser via the infrared vision component; and, in response to the laser emitter being adjusted to the optimal working distance, perform laser scanning debonding on the sacrificial layer. This invention can quickly and accurately find the optimal working distance of the laser emitter.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and specifically to a laser debonding device, a laser debonding method, and a computer-readable storage medium. Background Technology

[0002] In laser debonding equipment, the laser needs to be focused so that the focal point ultimately falls on the sacrificial layer of the bonded component to modify or thermally expand the sacrificial layer material, thus achieving debonding. Since the laser power density is crucial to whether the sacrificial layer reaches the critical point of modification or thermal expansion, and the power density is typically highest at the laser focal point, accurate positioning of the laser focal point on the sacrificial layer is essential for complete debonding. In the optical system of laser debonding, adjusting the working distance of the laser scanning head to find its focal point and focus it precisely on the target sacrificial layer is critical, as it significantly impacts the final process outcome.

[0003] Current technology primarily identifies the minimum focal spot by observing the laser's effect on the sacrificial layer of the bonded component, thereby determining the optimal working distance of the laser scanning head. However, observation typically requires microscopic examination; for example, observing the finest line obtained by laser scribing based on the actual process results. This process is not only time-consuming but also requires multiple adjustments to adjust the laser scanning head to a suitable working distance for laser debonding. However, this working distance is not precise and may not be the optimal one. Performing laser debonding at this distance may still waste some laser energy, and multiple verifications of the process results are needed to determine if it is indeed the optimal working distance. Therefore, it cannot meet the requirements of some systems with strict requirements for scanning accuracy and focal point position.

[0004] In order to solve the above-mentioned problems in the existing technology, there is an urgent need in the field for an improved laser debonding technology that can quickly and accurately adjust the laser emitter to the optimal working distance, without the need for multiple process effect verifications, thus shortening the process time and improving the process efficiency. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the existing technology, the present invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitter to the optimal working distance without requiring multiple process effect verifications, thus shortening the process time and improving process efficiency.

[0007] Specifically, the laser debonding apparatus provided according to the first aspect of the present invention includes: a laser emitter that emits an initial laser for debonding; a beam splitter that splits the received initial laser into a first laser directed toward a focal spot analyzer and a second laser directed toward a sacrificial layer of the bonding member, wherein the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same; an infrared vision component that acquires an infrared spot pattern of the second laser on the sacrificial layer; and a controller configured to: acquire the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; initially adjust the working distance from the laser emitter to the sacrificial layer to make the spot size of the second laser reach an optimal size; acquire the infrared spot pattern of the second laser via the infrared vision component and fine-tune the working distance from the laser emitter to the sacrificial layer to compensate for the error of the focal spot analyzer; and, in response to the laser emitter adjusting to the optimal working distance, perform laser scanning debonding on the sacrificial layer.

[0008] Furthermore, in some embodiments of the present invention, the laser emitter, the beam splitter, and the bonding member are aligned in a straight line. The step of initially adjusting the working distance between the laser emitter and the sacrificial layer to make the spot size of the second laser reach the optimal size includes: moving the laser emitter along the straight line to adjust the working distance between the laser emitter and the sacrificial layer; and obtaining the first minimum size of the spot of the second laser as the optimal size based on the first round of spot size change pattern of the first laser in the focal spot analyzer, wherein the spot size change pattern includes a process in which the spot first decreases in size and then increases in size.

[0009] Furthermore, in some embodiments of the present invention, the step of acquiring the spot pattern of the second laser via the infrared vision component and fine-tuning the working distance from the laser emitter to the sacrificial layer to compensate for the error of the focal spot analyzer includes: determining whether the spot of the second laser meets the process requirements for debonding based on the infrared spot pattern of the second laser acquired by the infrared vision component; responding to the fact that the laser energy of the second laser spot of the first minimum size is insufficient to ablate the sacrificial layer, continuing to move the laser emitter along the straight line direction and adjusting the working distance from the laser emitter to the sacrificial layer; and obtaining the second minimum size of the spot of the second laser as the optimal size based on the second round spot size change law of the first laser in the focal spot analyzer, wherein the second minimum size is smaller than the first minimum size.

[0010] Furthermore, in some embodiments of the present invention, the step of determining whether the spot of the second laser meets the process requirements for debonding further includes: responding to the laser energy of the second laser spot of the first minimum size ablates the device layer below the sacrificial layer, continuing to move the laser emitter along the straight line direction, and adjusting the working distance between the laser emitter and the sacrificial layer; and obtaining the third minimum size of the spot of the second laser as the optimal size by means of the third round of spot size change law of the first laser in the focal spot analyzer, wherein the third minimum size is greater than the first minimum size.

[0011] Furthermore, in some embodiments of the present invention, the laser debonding device further includes: a moving platform on which the bonding member is placed, wherein the step of performing laser scanning debonding on the sacrificial layer in response to the laser emitter being adjusted to an optimal working distance includes: fixing the laser emitter at the position of the optimal working distance; in response to the bonding area on the sacrificial layer being completely ablated by the second laser, determining the position of the next bonding area to be ablated by using the infrared spot pattern of the sacrificial layer acquired by the infrared vision component; and translating the bonding member in the x and / or y directions via the moving platform so that the second laser irradiates the next bonding area.

[0012] Furthermore, in some embodiments of the present invention, after the step of performing laser scanning debonding on the sacrificial layer in response to the laser emitter being adjusted to the optimal working distance, in response to the completion of the laser scanning debonding, an infrared full image of the sacrificial layer is acquired via the infrared vision component to detect whether each bonding region of the sacrificial layer has completed debonding; in response to the existence of at least one bonding region that has not completed debonding, the at least one bonding region is marked, and the moving platform is moved so that the at least one bonding region is scanned by the second laser again; in response to the completion of debonding of each bonding region, the stripped device layer is transferred to the next process.

[0013] Furthermore, in some embodiments of the present invention, the laser emitting element includes: a laser for providing the initial laser; and an optical component for adjusting the transmission angle of the initial laser to transmit the initial laser to the beam splitter.

[0014] Furthermore, in some embodiments of the present invention, the optical components include a collimating and beam expanding system, a reflecting mirror, and a field mirror, wherein the collimating and beam expanding system is used to adjust the spot size of the initial laser to match the spot size of the field mirror, and the reflecting mirror is used to reflect the initial laser into the field mirror so that the field mirror focuses the initial laser onto the bonding layer sacrificial layer.

[0015] Furthermore, in some embodiments of the present invention, the reflector is connected to a motor, and the motor drives the reflector to rotate, thereby vibrating and adjusting the reflection angle of the reflector to fine-tune the output light path of the second laser reflected by it, so that the second laser performs local scanning on the sacrificial layer.

[0016] Furthermore, in some embodiments of the present invention, the laser debonding device further includes: a power meter disposed above the reflector, for detecting the power value of the reflected light of the second laser incident on the bonding member reflected by the surface of the bonding member.

[0017] Furthermore, in some embodiments of the present invention, the laser debonding device further includes: an infrared thermal imager disposed above the bonding member, used to acquire a temperature distribution map of the sacrificial layer; the step of performing laser scanning debonding on the sacrificial layer in response to the laser emitter being adjusted to the optimal working distance includes: acquiring the power value of the second laser incident on the sacrificial layer and the temperature distribution map of the sacrificial layer via the power meter and the infrared thermal imager, respectively; and adjusting the output power of the laser in response to the presence of an abnormal temperature value in the temperature distribution map, and monitoring the power adjustment process via the power meter.

[0018] Furthermore, in some embodiments of the present invention, the laser debonding device further includes: a laser rangefinder, disposed at the bottom of the focal spot analyzer, for detecting the distance from the beam splitter to the focal spot analyzer and the sacrificial layer, wherein the distance from the beam splitter to the focal spot analyzer is fixed as L, the distance from the light outlet of the laser rangefinder to the beam splitter is L1, and the distance from it to the bonding member is L2, and the thickness of the substrate layer above the bonding member is d, such that L = L1 + L2 + d.

[0019] Furthermore, in some embodiments of the present invention, the ratio of the first laser and the second laser after the initial laser is split by the beam splitter is in the range of 1:9 to 3:7.

[0020] Furthermore, in some embodiments of the present invention, the infrared vision component includes an infrared camera, an infrared light source, and a filter, wherein the filter is located in front of the lens of the infrared camera and is used to filter out reflected light of the second laser light incident on the bonding member that is reflected by the surface of the bonding member.

[0021] Furthermore, the laser debonding method provided by the second aspect of the present invention includes the following steps: emitting an initial laser for debonding via a laser emitter in the laser debonding apparatus provided by the first aspect of the present invention, wherein the initial laser is split into two beams by the beam splitter, a first laser is directed toward a focal spot analyzer, and a second laser is directed toward a sacrificial layer of the bonded member, and the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same; obtaining the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; initially adjusting the working distance from the laser emitter to the sacrificial layer to make the spot size of the second laser reach an optimal size; obtaining an infrared spot image of the second laser via the infrared vision component, finely adjusting the working distance from the laser emitter to the sacrificial layer to compensate for the error of the focal spot analyzer; and performing laser scanning debonding on the sacrificial layer in response to the laser emitter being adjusted to the optimal working distance.

[0022] Furthermore, according to a third aspect of the present invention, a computer-readable storage medium is provided having computer instructions stored thereon. When the computer instructions are executed by a processor, the laser debonding method described above according to the second aspect of the present invention is implemented. Attached Figure Description

[0023] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0024] Figure 1 A schematic diagram of a laser debonding device according to some embodiments of the present invention is shown;

[0025] Figure 2 for Figure 1 A magnified view of the beam splitter, focal spot analyzer, and bonding component shown.

[0026] Figure 3 A flowchart of a laser debonding method according to some embodiments of the present invention is shown;

[0027] Figure 4 A schematic diagram of a laser debonding device according to other embodiments of the present invention is shown; and

[0028] Figure 5 A flowchart of a laser debonding method according to a specific embodiment of the present invention is shown.

[0029] Figure label:

[0030] 100 Laser debonding equipment;

[0031] 110 Laser emitter;

[0032] 111 Laser;

[0033] 112 Collimation and beam expansion system;

[0034] 113. Reflector;

[0035] 114 shots;

[0036] 120 beam splitter;

[0037] 130 Infrared vision components;

[0038] 131 Infrared camera;

[0039] 1310 lens;

[0040] 132 Infrared light source;

[0041] 133 Filter;

[0042] 134. Semi-transparent and semi-reflective mirror;

[0043] 140 Focal Spot Analyzer;

[0044] 150 bonded parts;

[0045] 151 Sacrificial Layer;

[0046] 152 slides;

[0047] 153 Device layer;

[0048] 160 Mobile Platform;

[0049] 170 laser rangefinder;

[0050] 210 Initial laser;

[0051] 211 First laser;

[0052] 212 Second laser;

[0053] Steps S310~S350;

[0054] 410 Power Meter;

[0055] 420 infrared thermal imager; and

[0056] Steps S510~S570 Detailed Implementation

[0057] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0058] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0059] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0060] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0061] As mentioned above, existing technologies primarily determine the optimal working distance of the laser scanning head by observing the laser's effect on the sacrificial layer of the bonded component to find the minimum focal spot. However, observation usually requires microscopic examination, for example, observing the finest line obtained by laser scribing under a microscope based on the actual process effect. This process is not only time-consuming but also requires multiple adjustments to adjust the laser scanning head to a suitable working distance for laser debonding. However, this working distance is not precise and may not be the optimal working distance. Performing laser debonding at this working distance may still waste some laser energy, and multiple verifications of the process effect are needed to determine whether it is the optimal working distance. Therefore, it cannot meet the requirements of some systems with strict requirements for scanning accuracy and focal position.

[0062] To address the aforementioned problems in the prior art, this invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitter to the optimal working distance without requiring multiple process effect verifications, thus shortening process time and improving process efficiency.

[0063] In some non-limiting embodiments, the laser debonding apparatus provided in the first aspect of the present invention can be used to implement the laser debonding method provided in the second aspect of the present invention.

[0064] Specifically, in some non-limiting embodiments, the third aspect of the invention also provides a computer-readable storage medium having computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the laser debonding method described above in the second aspect of the invention.

[0065] The working principle of the laser debonding device described above will be described below with reference to some embodiments of laser debonding methods. Those skilled in the art will understand that these embodiments of laser debonding methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concepts of the invention and provide specific solutions convenient for public implementation, rather than limiting all operating methods or functions of the laser debonding device. Similarly, the laser debonding device is also only one non-limiting implementation provided by the present invention and does not limit the entities that can implement the steps in these laser debonding methods.

[0066] Please refer to Figure 1 , Figure 1 A schematic diagram of a laser debonding device provided according to some embodiments of the present invention is shown.

[0067] like Figure 1 As shown, in some embodiments of the present invention, the laser debonding device 100 may include a laser emitter 110, a beam splitter 120, an infrared vision component 130, and a controller (not shown in the figures). The laser emitter 110 can be used to emit an initial laser for debonding. The beam splitter 120 can be used to split the received initial laser 210 into a first laser 211 directed towards a focal spot analyzer 140 and a second laser 212 directed towards the sacrificial layer 151 of the bond 150, wherein the distance from the beam splitter 120 to the focal spot analyzer 140 and the sacrificial layer 151 is the same. The infrared vision component 130 can acquire an infrared spot pattern of the second laser 212 on the sacrificial layer 151.

[0068] Specifically, such as Figure 1 As shown, in some embodiments, the bonding element 150 may be formed by bonding a carrier layer 152 and a device layer 153. By integrating integrated circuits on a wafer, chip devices capable of specific functions can be formed. With technological advancements, thicker wafer devices struggle to meet the heat dissipation and packaging requirements of high-end chips. Therefore, in the semiconductor field, it is often necessary to thin the wafers used as devices to achieve the required thickness. However, when the wafer thickness is reduced to less than 200 micrometers, the ultrathin wafer becomes fragile and prone to warping. Therefore, a carrier layer 152 with higher mechanical strength can be used to support this structurally fragile device layer 153. Optionally, the carrier layer 152 can be made of a glass substrate or a silicon substrate.

[0069] Continue as Figure 1As shown, the laser emitter 110 may include a laser 111 and optical components. The laser 111 is used to provide an initial laser 210. When the substrate 152 is made of glass, the laser 111 can emit ultraviolet laser light to penetrate the glass substrate, reach the sacrificial layer 151, and ablate it, performing ultraviolet laser debonding. When the substrate 152 is made of silicon, the laser 111 can emit infrared laser light to penetrate the silicon substrate, reach the sacrificial layer 151, and ablate it, performing infrared laser debonding.

[0070] The optical components in the laser emitter 110 can be used to adjust the transmission angle of the initial laser 210 so that the initial laser 210 is transmitted to the beam splitter 120, and then the beam splitter 120 transmits the laser beam to the sacrificial layer 151 for laser debonding.

[0071] In some optional embodiments, the optical components may further include a collimation and beam-expanding system 112, a plurality of reflecting mirrors 113, and a field mirror 114. The collimation and beam-expanding system 112 can be used to improve the spatial divergence angle of the initial laser 210, enhance the collimation of the beam, and enable the laser beam to meet the aperture requirements of subsequent optical components. In this embodiment, the collimation and beam-expanding system 112 can compress the divergence angle of the initial laser 210 and, with the increase of the beam waist radius, expand the spot size of the initial laser 210 to match the spot size of the field mirror 114, thereby achieving the purpose of collimating and expanding the initial laser 210. The reflecting mirrors 113 can be used to reflect the initial laser 210 into the field mirror 114, so that the field mirror 114 can focus the initial laser 210 onto the sacrificial layer 151.

[0072] Continue as Figure 1 As shown, the beam splitter 120 in the laser debonding device 100 can be a semi-transparent, semi-reflective mirror. For example... Figure 1 As shown, optionally, the laser emitter 110, the beam splitter 120, and the bonding member 150 can be aligned in a straight line. A portion of the initial laser 210 can pass through the beam splitter 120 and be directed toward the bonding member 150 located opposite it to exert an effect on the sacrificial layer 151, while the other portion of the laser is reflected at a certain angle by the beam splitter 120 to the focal spot analyzer 140, which is used to obtain the size of the laser spot at this time.

[0073] Further, please see Figure 2 , Figure 2 for Figure 1 A magnified view of the beam splitter, focal spot analyzer, and bonding component shown.

[0074] like Figure 2As shown, in some embodiments, the laser debonding device 100 further includes a laser rangefinder 170. The laser rangefinder 170 can be located at the bottom of the focal spot analyzer 140 and is used to detect the distance from the beam splitter 120 to the focal spot analyzer 140 and the sacrificial layer 151. The distance from the beam splitter 120 to the focal spot analyzer 140 can be fixed as L. The distance from the light outlet of the laser rangefinder 170 (located at the bottom of the laser rangefinder 170) to the beam splitter 120 can be L1, and the distance from it to the bonding member 150 can be L2. The thickness of the substrate layer can be d, such that L = L1 + L2 + d, where L is the actual distance from the beam splitter 120 to the focal point on the sacrificial layer 151. In this embodiment, since the focal length of the field lens 114 is fixed and the addition of the beam splitter 120 does not change the focal length of the field lens 114, the introduction of the laser rangefinder 170 can ensure that the distance from the beam splitter 120 to the sacrificial layer 151 is equal to the distance from the beam splitter 120 to the focal spot analyzer 140. Therefore, the spot size data of the first laser 211 detected by the focal spot analyzer 140 can be used to represent the spot size data of the second laser 212 on the sacrificial layer 151.

[0075] In some optional embodiments, the ratio of the first laser 211 and the second laser 212 after the initial laser 210 is split by the beam splitter 120 can be in the range of 1:9 to 3:7. The ratio range of the first laser 211 and the second laser 212 needs to satisfy the following conditions: the first laser 211 reaching the focal spot analyzer 140 should not be too weak so that the focal spot analyzer 140 cannot obtain data, or it should not be too strong so as to damage the focal spot analyzer 140. At the same time, the second laser 212 reaching the sacrificial layer 151 can produce an ablation effect on the sacrificial layer 151.

[0076] Continue as Figure 1 As shown, in some embodiments, an infrared vision component 130 may be provided on the right side of the beam splitter 120, mainly used to detect the effect of the second laser 212 on the sacrificial layer 151. The infrared vision component 130 may include an infrared light source 132 and an infrared camera 131, used to acquire infrared images using the infrared energy radiated by the object. Specifically, after the single-point action of the second laser 212 ends, the light generated by the infrared light source 132 illuminates the position on the sacrificial layer 151 after the action of the second laser 212, and the infrared camera 131 takes a picture of the position to obtain the effect of the laser action at that position.

[0077] Optionally, a semi-transparent mirror 134 can be disposed between the infrared light source 132 and the camera lens 1310, thereby reflecting the infrared light emitted by the infrared light source 132 and directing it into the optical path of the lens 1310. Furthermore, the infrared vision assembly 130 may also include a filter 133. The filter 133 can be located in front of the lens 1310 of the infrared camera 131 to filter out reflected light from the second laser 212 incident on the bonding member 150 via the surface of the bonding member 150 (the surface of the substrate layer 152), preventing it from entering the infrared camera 131 and damaging the camera.

[0078] In an embodiment of the present invention, the controller in the laser debonding device 100 can be configured to: acquire the spot size of the first laser 211 via a focal spot analyzer 140, wherein the spot size of the first laser 211 is equivalent to the spot size of the second laser 212; initially adjust the working distance from the laser emitter 110 to the sacrificial layer 151 so that the spot size of the second laser 212 reaches the optimal size; acquire the infrared spot image of the second laser 212 via an infrared vision component 130, finely adjust the working distance from the laser emitter 110 to the sacrificial layer 151 to compensate for the error of the focal spot analyzer 140; and, in response to the laser emitter 110 being adjusted to the optimal working distance, perform laser scanning debonding on the sacrificial layer 151. By integrating the spot size equivalent to the second laser 212 acquired by the focal spot analyzer 140 with the spot size of the second laser 212 acquired by the infrared vision component 130, the time for finding the optimal working distance of the laser emitter 110 can be shortened, and the accuracy of judging the actual laser ablation effect generated by the optimal working distance can be improved.

[0079] The following section will use a laser debonding method provided in the second aspect of the main body to specifically illustrate the above steps performed by the controller. For details, please refer to... Figure 3 , Figure 3 A flowchart of a laser debonding method provided according to some embodiments of the present invention is shown.

[0080] like Figure 3 As shown, in some embodiments of the present invention, the laser debonding method may include the following steps. First, step S310 may be performed: emitting an initial debonding laser via a laser emitter in the laser debonding device.

[0081] Specifically, combined Figure 1As shown, in some embodiments, an initial laser 210 for debonding is emitted by a laser 111 in the laser emitter 110; for example, the initial laser 210 can be an infrared laser. The initial laser 210 is transmitted to the beam splitter 120 via an optical component adjuster at a transmission angle. The initial laser 210 is split into two beams by the beam splitter 120. The first laser 211 can be reflected into the focal spot analyzer 140 for analyzing the laser spot size data, and the second laser 212 can be transmitted to the sacrificial layer 151 of the bonding member 150 to induce an ablation effect on the sacrificial layer 151. Furthermore, a laser rangefinder 170 can be used to ensure that the distances from the beam splitter 120 to the focal spot analyzer 140 and the sacrificial layer 151 are the same.

[0082] After that, continue as Figure 3 As shown, step S320 can be performed: obtain the spot size of the first laser via a focal spot analyzer.

[0083] Specifically, combined Figure 1 As shown, since the focal length of the field lens 114 in the laser debonding device 100 is fixed, and the addition of the beam splitter 120 does not change the focal length of the field lens 114, ensuring that the distance from the beam splitter 120 to the sacrificial layer 151 is equal to the distance from the beam splitter 120 to the focal spot analyzer 140 allows the spot size data of the first laser 211 detected by the focal spot analyzer 140 to represent the spot size data of the second laser 212 on the sacrificial layer 151. The spot size of the first laser 211 detected by the focal spot analyzer 140 can be equivalent to the spot size of the second laser 212 acting on the sacrificial layer 151.

[0084] After that, continue as Figure 3 As shown, step S330 can be performed: initially adjusting the working distance between the laser emitter and the sacrificial layer so that the spot size of the second laser reaches the optimal size.

[0085] Specifically, combined Figure 1 As shown, in some embodiments, the laser emitter 110 can be moved in a straight line to adjust the working distance between the laser emitter 110 and the sacrificial layer 151. Figure 1 In the illustrated embodiment, the laser emitter 110 can move in the z-direction to change the working distance between the laser emitter 110 and the sacrificial layer 151. A series of spot size data corresponding to the first laser 211 emitted by the laser emitter 110 at different working distances can be obtained using the focal spot analyzer 140.

[0086] Subsequently, the first minimum size of the second laser 212 spot can be obtained as the optimal size by observing the first round of spot size change pattern of the first laser 211 in the focal spot analyzer 140. This spot size change pattern can include a process where the spot size first decreases and then increases again. A smaller laser spot indicates a higher laser power density. Therefore, given a fixed laser power emitted by the laser 111, finding the minimum spot size of the second laser 212 radiating onto the sacrificial layer 151 yields the maximum debonding laser power density, which is beneficial for rapid ablation of the sacrificial layer 151 or for modifying and peeling it off. By moving the laser emitter 110 in the z-direction and observing the process of the first laser 211 spot decreasing and then increasing again in the focal spot analyzer 140, it is equivalent to obtaining the process of the second laser 212 spot on the sacrificial layer 151 decreasing and then increasing again, thus determining the first minimum size of the second laser 212 spot. In an embodiment of the present invention, the working distance of the laser emitter 110 can be initially adjusted by observing the spot condition of the first laser 211 in the focal spot analyzer 140, thereby initially determining the working position of the laser emitter 110.

[0087] After that, continue as Figure 3 As shown, step S340 can be performed: acquire the infrared spot pattern of the second laser via the infrared vision component, and fine-tune the working distance from the laser emitter to the sacrificial layer to compensate for the error of the focal spot analyzer.

[0088] Specifically, due to mechanical deviations during the installation of the focal spot analyzer 140 components, there is a discrepancy between the adjusted working distance and the actual desired working position. This means there is an error in the adjustment of the working distance, which can significantly impact systems with strict requirements for scanning accuracy and focal position, making it impossible to meet their stringent system requirements. To address this, in some embodiments of the present invention, an infrared vision component 130 can be added to assist the focal spot analyzer 140 in adjusting the working distance of the laser emitter 110. The infrared vision component 130 can be used to directly observe the effect of the second laser 212 on the target position (on the sacrificial layer 151), thereby assisting the focal spot analyzer 140 in quickly and accurately finding the optimal working distance of the laser emitter 110.

[0089] Specifically, it can be combined with Figure 1It is understood that in some embodiments, based on the infrared spot image of the second laser 212 obtained by the infrared vision component 130, it can be determined whether the spot of the second laser 212 meets the process requirements for debonding. When the laser energy of the second laser 212 spot showing a first minimum size in the infrared spot image is insufficient to ablate the sacrificial layer 151, the controller can control the laser emitter 110 to continue moving along a straight direction (such as the z-direction), adjusting the working distance between the laser emitter 110 and the sacrificial layer 151. Then, the second round of spot size change pattern of the first laser 211 detected by the focal spot analyzer 140 is equivalent to obtaining the second minimum size of the second laser 212 spot as the optimal size, wherein the second minimum size is smaller than the first minimum size. At this time, the laser energy of the second laser 212 spot with the second minimum size is greater than the laser energy of the second laser 212 spot with the previous second minimum size, and therefore is sufficient to ablate the sacrificial layer 151.

[0090] When the laser energy of the second laser 212 spot, which shows the first minimum size in the infrared spot pattern, ablates the device layer 153 below the sacrificial layer 151, the controller can control the laser emitter 110 to continue moving along a straight line (such as the z-direction), adjusting the working distance between the laser emitter 110 and the sacrificial layer 151. Then, the third round of spot size change pattern of the first laser 211 detected by the focal spot analyzer 140 is equivalent to obtaining the third minimum size of the second laser 212 spot as the optimal size, where the third minimum size is larger than the first minimum size. At this time, the laser energy of the second laser 212 spot with the third minimum size is slightly lower than the laser energy of the second laser 212 spot with the first minimum size, thus achieving the process requirement of ablating only the sacrificial layer 151 without damaging the device layer 153.

[0091] After the laser emitter 110 completes one movement in the z direction, a series of spot size data and the corresponding position information of the laser emitter 110 in a certain z direction and the infrared spot image information of the sacrificial layer 151 can be obtained. The controller can obtain the optimal working position of the laser emitter 110 by analyzing the spot size data, and the infrared spot image captured by the infrared vision component 130 can be used to compensate for the mechanical installation error of the focal spot analyzer 140.

[0092] In the above embodiment, by analyzing the infrared vision component 130, the actual effect of the second laser 212 on the sacrificial layer 151 of the bonding component 150 when the laser emitter 110 is located can be obtained, thereby determining whether it meets the actual process requirements, and then fine-tuning can be made. This can more accurately determine whether the current working position of the laser emitter 110 is at the optimal working distance, reducing the error caused by the deviation in the actual installation of the focal spot analyzer 140, which ultimately fails to achieve the best process effect, and making the adjustment effect of the laser emitter 110 better.

[0093] Finally, continue as follows Figure 3 As shown, step S350 can be performed: in response to the laser emitter adjusting to the optimal working distance, laser scanning debonding is performed on the sacrificial layer.

[0094] Specifically, combined Figure 1 As shown, in some embodiments, the laser debonding device 100 may further include a moving platform 160 on which the bonding member 150 can be placed. When the infrared vision component 130 assists the focal spot analyzer 140 in adjusting the working distance of the laser emitter 110 to the optimal working distance, and the working position of the laser emitter 110 at the optimal working distance is fixed, in response to the second laser 212 ablating a bonding region on the sacrificial layer 151, the infrared spot image of the sacrificial layer 151 acquired by the infrared vision component 130 can be used to determine the position of the next bonding region to be ablated. Then, the controller can control the moving platform 160 to translate the bonding member 150 in the x and / or y directions, so that the second laser 212 can irradiate the next bonding region to ablate the next bonding region in the sacrificial layer 151. Optionally, the moving distance of the bonding member 150 carried by the mobile platform is preferably greater than the diameter of the focused spot of the second laser 212, so that another set of spot data and infrared spot map of the sacrificial layer 151 can be obtained.

[0095] Further, please see Figure 4 , Figure 4 A schematic diagram of a laser debonding device according to other embodiments of the present invention is shown.

[0096] like Figure 4As shown, in some other embodiments of the present invention, after step S350 is completed, an infrared full image of the sacrificial layer 151 in the entire bonding component 150 can be obtained by an infrared camera 131 under the illumination of an infrared light source 132, for detecting whether each bonding region of the sacrificial layer 151 has been debonded. When at least one bonding region has not been debonded, that is, when at least one bonding region of the sacrificial layer 151 has not been completely destroyed, the controller can mark this bonding region and move the moving platform 160 so that this bonding region is scanned and ablated again by the second laser 212. Until all bonding regions in the sacrificial layer 151 in the bonding component 150 have been debonded, the stripped device layer 153 can be transferred to the next process.

[0097] Furthermore, let's continue back to... Figure 1 As shown, in some preferred embodiments, several reflectors 113 in the laser emitter 110 can be connected to a motor (not shown in the figures) to form a galvanometer assembly. By driving the reflectors 113 to rotate via the motor, the reflection angle of the reflectors 113 is adjusted by vibration, thereby planning the scanning path of the galvanometer and fine-tuning the output light path of the second laser 212 reflected by it. By performing the above steps, the second laser 212 performs a local scan on the sacrificial layer 151. Compared to the method described above, where the bonding member 150 is fine-tuned using a moving platform 160 to allow a partially destroyed bonding region of the sacrificial layer 151 to be irradiated again, the galvanometer assembly moves much faster. Therefore, in this preferred embodiment, using a galvanometer structure can reduce the scanning radiation time for debonding, accelerate the local scanning debonding time, and thus improve the efficiency of debonding.

[0098] In addition, please continue as follows Figure 4 As shown, in some preferred embodiments of the present invention, the laser debonding apparatus 100 may further include a power meter 410. The power meter 410 may be disposed above the reflector 113 and may be used to detect the power value of the reflected light of the second laser 212 incident on the bonding member 150 reflected by the surface of the bonding member 150.

[0099] Optionally, such as Figure 4 As shown, the laser debonding device 100 may also include an infrared thermal imager 420, which may be located above the bonded component 150, for acquiring a temperature distribution map of the sacrificial layer 151, thereby providing feedback on the temperature changes on the sacrificial layer 151 during the laser scanning process.

[0100] Furthermore, during step S350, the power value of the second laser 212 incident on the sacrificial layer 151 and the temperature distribution map of the sacrificial layer 151 can be obtained via the power meter 410 and the infrared thermal imager 420, respectively. When there are abnormal temperature values ​​in the temperature distribution map, the controller can adjust the output power emitted by the laser 111, and the power meter 410 can monitor the power adjustment process in real time, thereby achieving uniform temperature change on the sacrificial layer 151 during the debonding process and improving the processing quality.

[0101] Specifically, such as Figure 4 The second laser 212 scans the surface of the bonding component 150. The infrared thermal imager 420 monitors the temperature changes on the surface of the bonding component 150 (i.e., the temperature changes of the sacrificial layer 151) during the debonding process. The second laser 212 is reflected from the upper surface of the bonding component 150, and the reflected light returns along its original path. After passing through the lens of the reflector 113, it is received by the power meter 410, thus detecting the power value and reflecting the power status of the laser 111. Combined with feedback from the infrared thermal imager 420, it can be determined whether the power of the laser 111 has reached the optimal process state. If the infrared thermal imager 420 detects an abnormal temperature change on the surface of the sacrificial layer 151, the abnormal temperature can be reflected in real time on the power meter 410. This allows for real-time and accurate adjustment of the output power of the laser 111, ensuring that during the debonding process, the bonding component 150 is not damaged due to excessive laser power or the debonding is not effective due to insufficient power.

[0102] In the above-mentioned embodiments provided by the present invention, by adding an infrared vision component 130, it is possible to observe the laser focal spot and also acquire an image of the target sacrificial layer 151 after the laser action, thereby intuitively and directly determining whether the sacrificial layer 151 has achieved the target process effect. Furthermore, the infrared vision component 130 can also synchronously assist the light spot information to determine whether the working distance of the laser emitter 110 is in the optimal working position. Therefore, with the infrared vision component 130, the result of adjusting the working distance of the laser emitter 110 can be more accurate.

[0103] Next, a specific embodiment will be given to fully illustrate the entire process of the laser debonding method described above. For example... Figure 5 As shown, Figure 5 A flowchart of a laser debonding method according to a specific embodiment of the present invention is shown.

[0104] Combination Figure 1 and Figure 5As shown, in a specific embodiment, the laser emitter 110 can be specifically selected as a laser scanning head. As shown in step S510, the laser 111 in the laser scanning head can emit a debonded infrared initial laser 210. Then, in step S520, the infrared initial laser 210 passes through the optical components in the laser scanning head assembly and is directed towards the beam splitter 120, where it is split into 10% reflected light and 90% transmitted light. The 10% reflected light is the first laser 211, which is directed towards the focal spot analyzer 140, and the 90% transmitted light is the second laser 212, which is directed towards the sacrificial layer 151. In step S531, the focal spot analyzer 140 can analyze and obtain the spot size of the reflected light first laser 211. In step S532, the transmitted light second laser 212 can be focused on the sacrificial layer 151, simultaneously producing ablation or modification effects on the sacrificial layer 151. Subsequently, in step S540, the image of the bonding component 150 at this time can be captured by the infrared camera 131 in the infrared vision component 130. It can be understood that the image of the bonding component 150 is the infrared spot pattern of the sacrificial layer 151, and the upper substrate layer 152 and device layer 153 in the bonding component 150 are both selected from wafers.

[0105] Next, step S550 can be executed. This involves moving the laser scanning head along the z-axis and simultaneously moving the moving platform 160 along the x-axis. A single (x, y) coordinate point on the bonding member 150 at a given z-axis position of the laser scanning head can obtain one set of focal spot data and an infrared spot image of the sacrificial layer 151. Different (x, y) coordinate points on the bonding member 150 corresponding to the same z-axis position can obtain a set of focal spot data and infrared spot images. Moving the moving platform 160 along either the x or y axis can obtain another set of focal spot data and infrared spot images. For example, the laser scanning head can be moved 200µm in 4mm strokes along the z-axis, while the moving platform can move 500µm (greater than the diameter of the spot) along the x-axis. Therefore, after one scanning operation, 20 sets of spot data can be generated within this z-axis movement range.

[0106] In step S560, the working position of the laser scanning head can be found by analyzing the data from the focal spot analyzer 140. Specifically, by analyzing the 20 sets of spot data corresponding to different positions of the laser scanning head on the z-axis obtained by the focal spot analyzer 140, it can be determined whether there is a pattern in which the spot size first decreases and then increases within a 3mm range. Based on the fact that the spot size change conforms to this pattern, the working position of the laser scanning head on the z-axis corresponding to the smallest spot size can be found.

[0107] Finally, in step S570, the infrared spot image captured by the infrared camera 131 when the laser scanning head is at this z-axis position can be compared to see if the process requirements are met, i.e., the laser energy of the debonding laser irradiating the sacrificial layer is sufficient to destroy the sacrificial layer 151 without damaging the device layer 153 located below the sacrificial layer 151. Furthermore, the position of the laser irradiation can be visually obtained through the infrared spot image. If the position of the laser scanning head meets the process requirements, this position of the laser scanning head can be fixed; if not, the z-axis position can be readjusted to compensate for the error of the focal spot analyzer 140.

[0108] In this embodiment, deviations during the actual installation of the focal spot analyzer 140 may cause deviations in the laser scanning head's data along the z-axis. For example, the data from the focal spot analyzer 140 may show that z1 is the position with the smallest focal spot (i.e., light spot). However, comparing the image captured by the infrared camera 131 at this position reveals that the process effect produced by the laser scanning head at position z1 is not ideal. In this case, the ideal z-axis position of the laser scanning head can be found from the infrared light spot image captured by the infrared camera 131, and the laser scanning head can be fixed at this position for subsequent laser scanning and debonding. In other words, the focal spot analyzer 140 can find the working position of the laser scanning head corresponding to the smallest focal spot, and the infrared image analysis obtained by the infrared vision component 130 can obtain the working position of the laser scanning head when the debonding effect is optimal, i.e., the optimal working distance.

[0109] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0110] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0111] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0112] In summary, the present invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitter to the optimal working distance without requiring multiple process effect verifications, thus shortening the process time and improving process efficiency.

[0113] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser debonding device, characterized in that, include: The laser emitter emits the initial laser for debonding; A beam splitter splits the received initial laser into a first laser directed toward a focal spot analyzer and a second laser directed toward a sacrificial layer of the bonded component, wherein the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same. An infrared vision component acquires an infrared spot pattern of the second laser on the sacrificial layer; and The controller is configured to: acquire the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; initially adjust the working distance between the laser emitter and the sacrificial layer to achieve an optimal spot size for the second laser; acquire an infrared spot image of the second laser via the infrared vision component, fine-tune the working distance between the laser emitter and the sacrificial layer to compensate for errors in the focal spot analyzer; and, in response to the laser emitter being adjusted to the optimal working distance, perform laser scanning debonding on the sacrificial layer, wherein... The step of initially adjusting the working distance between the laser emitter and the sacrificial layer to achieve the optimal size of the second laser spot includes: moving the laser emitter along a straight line to adjust the working distance between the laser emitter and the sacrificial layer; and obtaining the first minimum size of the second laser spot as the optimal size based on the first round of spot size variation pattern of the first laser in the focal spot analyzer. The step of acquiring the spot pattern of the second laser via the infrared vision component and fine-tuning the working distance between the laser emitter and the sacrificial layer to compensate for the error of the focal spot analyzer includes: determining whether the spot of the second laser meets the process requirements for debonding based on the infrared spot pattern of the second laser acquired by the infrared vision component; responding to the fact that the laser energy of the second laser spot of the first minimum size is insufficient to ablate the sacrificial layer, continuing to move the laser emitter along the straight line direction and adjusting the working distance between the laser emitter and the sacrificial layer; and obtaining the second minimum size of the spot of the second laser as the optimal size based on the second round spot size change pattern of the first laser in the focal spot analyzer, wherein the second minimum size is smaller than the first minimum size.

2. The laser debonding device as described in claim 1, characterized in that, The laser emitter, the beam splitter, and the bonding member are aligned in a straight line, and the pattern of the change in the size of the light spot includes a process in which the light spot first decreases in size and then increases in size again.

3. The laser debonding device as described in claim 1, characterized in that, The step of determining whether the spot of the second laser meets the process requirements for debonding also includes: In response to the laser energy of the second laser spot of the first minimum size ablating the device layer below the sacrificial layer, the laser emitter continues to move along the linear direction, adjusting the working distance between the laser emitter and the sacrificial layer; and Based on the variation pattern of the third spot size of the first laser in the focal spot analyzer, the third minimum size of the second laser spot is obtained as the optimal size, wherein the third minimum size is greater than the first minimum size.

4. The laser debonding device as described in claim 3, characterized in that, Also includes: A mobile platform on which the bonding component is placed. The step of laser scanning to debond the sacrificial layer in response to the laser emitter being adjusted to the optimal working distance includes: The laser emitter is fixed at the optimal working distance. In response to the second laser ablation of the bonding area on the sacrificial layer, the position of the next bonding area to be ablated is determined by the infrared spot image of the sacrificial layer acquired by the infrared vision component. as well as The bonding member is translated in the x and / or y directions via the moving platform so that the second laser irradiates the next bonding area to be ablated.

5. The laser debonding device as described in claim 4, characterized in that, After the step of laser scanning and debonding the sacrificial layer in response to the laser emitter adjusting to the optimal working distance... In response to the completion of the laser scanning debonding, the infrared full image of the sacrificial layer is obtained via the infrared vision component to detect whether each bonding region of the sacrificial layer has been debonded. In response to the presence of at least one bonded region that has not been completely debonded, the at least one bonded region is marked, and the moving platform is moved so that the at least one bonded region is scanned again by the second laser; In response to the completion of debonding in each of the bonding regions, the stripped device layer is transferred to the next process.

6. The laser debonding device as described in claim 1, characterized in that, The laser emitting element includes: A laser for providing the initial laser; An optical component is used to adjust the transmission angle of the initial laser to transmit the initial laser to the beam splitter.

7. The laser debonding device as described in claim 6, characterized in that, The optical components include a collimating and beam expanding system, a reflector, and a field lens. The collimating and beam expanding system is used to adjust the spot size of the initial laser to match the spot size of the field lens. The reflector is used to reflect the initial laser into the field lens so that the field lens focuses the initial laser onto the sacrificial layer.

8. The laser debonding device as described in claim 7, characterized in that, The reflector is connected to a motor, which drives the reflector to rotate, thereby vibrating and adjusting the reflection angle of the reflector to fine-tune the output light path of the second laser reflected by it, so that the second laser can perform local scanning on the sacrificial layer.

9. The laser debonding device as described in claim 7, characterized in that, Also includes: A power meter, located above the reflector, is used to detect the power value of the reflected light of the second laser beam incident on the bonding member, which is reflected by the surface of the bonding member.

10. The laser debonding device as described in claim 9, characterized in that, Also includes: An infrared thermal imager, positioned above the bonding member, is used to acquire a temperature distribution map of the sacrificial layer. The step of laser scanning to debond the sacrificial layer in response to the laser emitter being adjusted to the optimal working distance includes: The power value of the second laser incident on the sacrificial layer and the temperature distribution map of the sacrificial layer are obtained by the power meter and the infrared thermal imager, respectively. as well as In response to the presence of an abnormal temperature value in the temperature distribution map, the output power of the laser is adjusted, and the power adjustment process is monitored by the power meter.

11. The laser debonding device as described in claim 1, characterized in that, Also includes: A laser rangefinder is located at the bottom of the focal spot analyzer and is used to detect the distance from the beam splitter to the focal spot analyzer and the sacrificial layer. The distance from the beam splitter to the focal spot analyzer is fixed as L, the distance from the light outlet of the laser rangefinder to the beam splitter is L1, and the distance from the laser rangefinder to the bonding member is L2. The thickness of the substrate layer above the bonding member is d, such that L = L1 + L2 + d.

12. The laser debonding device as described in claim 1, characterized in that, The ratio of the first laser and the second laser after the initial laser is split by the beam splitter is in the range of 1:9 to 3:

7.

13. The laser debonding device as described in claim 1, characterized in that, The infrared vision component includes an infrared camera, an infrared light source, and a filter, wherein the filter is located in front of the lens of the infrared camera and is used to filter out the reflected light of the second laser light incident on the bonding member that is reflected by the surface of the bonding member.

14. A laser debonding method, characterized in that, Includes the following steps: An initial laser for debonding is emitted via a laser emitter in the laser debonding apparatus as described in any one of claims 1 to 13, wherein the initial laser is split into two beams by the beam splitter, the first laser is directed toward a focal spot analyzer, and the second laser is directed toward the sacrificial layer of the bonded member, and the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same. The spot size of the first laser is obtained by a focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; The working distance between the laser emitter and the sacrificial layer is initially adjusted to ensure that the spot size of the second laser reaches the optimal size. The infrared spot pattern of the second laser is acquired via the infrared vision component, and the working distance between the laser emitter and the sacrificial layer is finely adjusted to compensate for the error of the focal spot analyzer; and In response to the laser emitter adjusting to the optimal working distance, the sacrificial layer is laser-scanned and debonded.

15. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the laser debonding method as described in claim 14 is implemented.

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