Composition having absorbent, resin composition, and resin film

By using compositions with specific compound structures, the problem of poor compatibility and solubility of the light absorber with solvents and resin components is solved, and excellent spectral characteristics and stable optical properties are achieved, and it is suitable for a variety of optoelectronic devices.

CN119591937APending Publication Date: 2025-03-11LMS
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Patent Information

Application Number
CN202411658333.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-12-14
Filing Date
2024-11-20
Publication Date
2025-03-11

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Abstract

The present specification discloses compositions and their uses. The composition may include three or more types of absorbents, and may exhibit excellent compatibility and solubility with various solvents and resin components. The composition can be used to form a resin film exhibiting a wide absorption band in the infrared region, and the resin film can be used as an absorption film used in various applications, including optical filters, solid-state imaging devices, and / or infrared sensors.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority of Korean Patent Application No. 10-2023-0181827 filed in the Korean Intellectual Property Office on December 14, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] This specification relates to compositions and their uses. Background Art

[0004] Light absorbers, such as absorbers capable of absorbing light in the infrared region, can be applied to various applications. For example, since image capture devices or infrared sensors using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) image sensors include silicon photodiodes having sensitivity to the near infrared region, they can use light absorbers.

[0005] There are many ways to apply these absorbents, but a method using a coating solution is generally applied, which mixes the absorbent dissolved in a solvent with a resin component. Therefore, the absorbent must show excellent solubility or compatibility with both the solvent and the resin component.

[0006] If the solubility or compatibility of the absorbent with the solvent or resin component is poor, the desired spectral characteristics cannot be obtained for the absorbent film to which the absorbent is applied, or the optical characteristics deteriorate due to the phenomenon that the absorbent precipitates within the absorbent film. Therefore, it is a difficult task to obtain an absorbent that simultaneously exhibits excellent solubility or compatibility with various types of solvents and resin components.

[0007] Furthermore, for example, when a wide absorption bandwidth or other optical properties that are difficult to obtain with a single absorber are required, two or more absorbers must be used. It is a difficult task to provide all two or more types of absorbers suitable for various types of solvents and resin components while having excellent solubility or compatibility. Summary of the invention

[0008] The purpose of this specification is to disclose a composition having an absorbent and showing excellent compatibility and solubility with various solvents and resin components.

[0009] According to one embodiment of the present invention, there is provided a composition comprising a compound represented by Formula 1:

[0010]

[0011] Where R 111 To R 117 and R121 To R 127 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl, wherein in Formula 1, R 111 To R 117 and R 121 To R 127 at least one of which is alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl;

[0012] The compound represented by formula 2:

[0013]

[0014] In formula 2, R 211 To R 213 and R 221 To R 223 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl, wherein R 211 To R 213 and R 221 To R 223 At least one of them is an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group, and A1, B1, A2, and B2 are each independently a benzene structure or are absent; and

[0015] A third compound represented by Formula 3:

[0016]

[0017] Wherein R3 is hydrogen or halogen; R 311 , R 312 , R 321 and R 323 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl; R 313 and R 314 R are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl, or are linked to each other to form a benzene structure; 323 and R 324 are independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl, or are connected to each other to form a benzene structure; in Formula 3, R 311 To R 314 and R 321 To R 324wherein at least one of the groups is alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl, or includes Z, wherein Z is a heteroatom, wherein the sum of A, B and C is 30 or more and the standard deviation of A, B and C is 15 or less, wherein A, B and C are defined as follows:

[0018] A: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 1;

[0019] B: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group in Formula 2; and

[0020] C: the total number of carbon atoms of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 3.

[0021] In one embodiment, the average value of A, B and C is in the range of 8-35.

[0022] In one embodiment, for the composition, the ratio of A to B A / B is in the range of 0.1 to 10, the ratio of B to C B / C is in the range of 0.1 to 10, and the ratio of A to C A / C is in the range of 0.5 to 15.

[0023] In one embodiment, for the composition, in Formula 1, R 111 To R 117 and R 121 To R 127 At least one of them is an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group; in Formula 2, R 211 To R 213 and R 221 To R 223 When at least one of them is an alkyl group, an alkoxy group or an alkoxyalkyl group, R 211 To R 213 and R 221 To R 223 are each independently hydrogen, alkyl, alkoxy, or alkoxyalkyl; and in Formula 3, R 311 , R 312 , R 321 and R 322 When one of them is alkyl, Z is oxygen and R 311 , R 312 , R 321 and R322 Each is independently hydrogen, alkyl, or aryl.

[0024] In one embodiment, for the composition, A1 or B1 forms a benzene structure and A2 or B2 forms a benzene structure.

[0025] In one embodiment, for the composition, the other of A1 and B1 is not present and the other of A2 and B2 is not present.

[0026] In one embodiment, for the composition, R in Formula 3 313 and R 314 are connected to each other to form a benzene structure, and R 323 and R 324 Linked together to form the benzene structure.

[0027] In one embodiment, for the composition, R 311 , R 312 , R 321 and R 323 At least one of them is a branched alkyl group.

[0028] According to another embodiment, a resin composition is provided, which includes a resin component; and a composition.

[0029] In another embodiment, the resin composition further comprises a solvent.

[0030] According to yet another embodiment, provided is a resin film including a resin component; and a composition.

[0031] In still another embodiment, the resin film shows an absorption band having a bandwidth of 60 nm or more in the wavelength range of 600 nm to 900 nm.

[0032] In yet another embodiment, for the resin film, the T50% cut-on wavelength is in the range of 600 nm to 800 nm.

[0033] In yet another embodiment, for the resin film, the T50% cut-off wavelength is in the range of 700 nm to 900 nm.

[0034] In yet another embodiment, for the resin film, the resin component includes at least one or more selected from the following groups: cycloolefin (COP) based resins, polyester resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyparaphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins and silicone resins.

[0035] According to still another embodiment, there is provided an optical filter including: a substrate; and a resin film formed on one side or both sides of the substrate.

[0036] In still another embodiment, the optical filter further comprises: a dielectric film wherein the shortest wavelength exhibiting a reflectivity of 50% within a wavelength range of 600 nm to 900 nm is 710 nm or longer or does not exist.

[0037] According to yet another embodiment, a solid-state image capture device is provided that includes an optical filter.

[0038] According to still another embodiment, there is provided an infrared sensor including a resin film. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figures 1 to 3 is a diagram showing an exemplary structure of an optical filter of the present invention.

[0040] Figures 4 to 7 It is a spectrum showing the evaluation result of the transmittance of the absorption film prepared in Example or Comparative Example. DETAILED DESCRIPTION

[0041] For those physical properties that may be affected by the measurement temperature results mentioned in the present invention, unless otherwise specified, it is measured at room temperature. The term "room temperature" used in the present invention refers to a natural temperature that is not heated or reduced, for example, it refers to any temperature in the range of 10°C to 30°C, a temperature of about 23°C or about 25°C. In addition, in this specification, unless otherwise specified, the temperature unit is Celsius (°C).

[0042] Among the physical properties mentioned in this specification, in the case where the pressure of measurement affects the result, unless otherwise specified, the physical properties are physical properties measured under atmospheric pressure. The term "atmospheric pressure" refers to the natural pressure without pressurization or decompression. It usually means an air pressure of about 1 atmosphere, and its value is about 740 mmHg to 780 mmHg.

[0043] In the physical properties mentioned in this specification, if humidity affects the results, unless otherwise specified, the relevant physical properties are those measured under standard humidity. Humidity under standard conditions refers to any humidity within the range of 40% to 60% relative humidity, for example, about 40% or 60% relative humidity.

[0044] In this specification, unless otherwise specifically defined, the term "transmittance" or "absorbance" refers to actual transmittance (actual transmittance) or actual absorptance (actual absorption ratio) confirmed at a specific wavelength or wavelength range in a predetermined region. In this specification, unless otherwise specifically defined, the term transmittance or absorptance refers to transmittance or absorptance with respect to an incident angle of 0°.

[0045] In this specification, unless otherwise specifically defined, the term "average transmittance" is a result obtained by measuring the transmittance of each wavelength in a specific wavelength range while increasing the wavelength by 1 nm from the shortest wavelength, and then calculating the arithmetic mean of the measured transmittances. For example, the average transmittance in the wavelength range of 350 nm to 360 nm may be the arithmetic mean of the transmittances measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0046] In this specification, the term "maximum transmittance" refers to the maximum transmittance when the transmittance of each wavelength is measured while increasing the wavelength by 1 nm from the shortest wavelength in a specific wavelength range. For example, the maximum transmittance in the wavelength range of 350nm to 360nm may refer to the highest transmittance measured at wavelengths of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm and 360nm.

[0047] In this specification, the term "minimum transmittance" refers to the minimum transmittance when the transmittance of each wavelength is measured while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range. For example, the minimum transmittance within the wavelength range of 350nm to 360nm may refer to the lowest transmittance measured at wavelengths of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm and 360nm. The meanings of average transmittance, maximum transmittance and minimum transmittance are also applicable to average absorptance, maximum absorptance and minimum absorptance, respectively, except that transmittance becomes absorptance.

[0048] In this specification, "incident angle" is an angle measured relative to the normal of the surface to be evaluated. For example, "transmittance at a filter incident angle of 0°" refers to the transmittance of light incident in a direction substantially parallel to the normal of the filter surface. In addition, for example, an incident angle of 40° is a value where the incident light forms an angle of approximately 40° with the normal in a clockwise or counterclockwise direction. This definition of the incident angle is also applicable to other characteristics such as transmittance.

[0049] This specification discloses compositions. In this specification the term "composition" refers to a mixture of two or more components.

[0050] In this specification, the term "absorbent composition" may be a composition made of absorbents, that is, a mixture of only two or more types of absorbents. For example, the term "absorbent composition" refers to a mixture of two or three or more types of absorbents having different chemical structures.

[0051] In the present specification, the term "absorber" refers to a compound that exhibits lower transmittance at any specific wavelength compared to other wavelengths. In the present specification, the term "resin composition" refers to a mixture including a resin component and other components.

[0052] In one example, the absorbent composition may include a compound of Formula 1, a compound of Formula 2, and a compound of Formula 3. The compounds of Formula 1 to Formula 3 have different structures.

[0053]

[0054] In formula 1, R 111 To R 117 and R 121 To R 127 Can be hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl independently of each other. In formula 1, alkyl, alkoxy alkyl, alkoxy alkyl, alkylcarbonyl alkyl, alkoxycarbonyl alkyl, alkoxyalkylcarbonyl alkyl and alkylsulfonyl alkyl can be alkyl with 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms independently of each other. In addition, alkyl can be straight chain, branched or cyclic. Alkyl can be arbitrarily substituted with one or more substituents, or can be unsubstituted alkyl.

[0055] In formula 1, R 111 To R 117 and R 121 To R 127 At least one of them may be an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group. 111 and R 121 Each of R and R is independently an alkoxy group, an alkylcarbonyl group, an alkoxycarbonyl group, or an alkylsulfonyl group. 112 , R 122 , R 117 and R 127 can each independently be hydrogen or alkyl or can be hydrogen. In suitable examples of Formula 1, R 113and R 123 Each of them can be independently an alkyl group or an alkoxy group. 114 To R 116 and R 124 To R 126 Each may independently be an alkyl group, an alkoxy group or an alkyl group.

[0056]

[0057] In formula 2, R 211 To R 213 and R 221 To R 223 and R are each independently hydrogen, an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group. In Formula 2, details about the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group may be the same as those in Formula 1. In Formula 2, R 211 To R 213 and R 221 To R 223 At least one of the groups may be an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group.

[0058] In Formula 2, A1, B1, A2 and B2 are each independently a benzene structure or are absent. When a benzene structure is formed as above, the benzene structure may be in a substituted or unsubstituted state.

[0059] In a suitable example of Formula 2, R 211 and R 221 can each independently be an alkyl group, an alkoxy group or an alkoxyalkyl group. For example, they can be an alkyl group or an alkoxyalkyl group. In a suitable example of Formula 2, R 212 , R 213 , R 222 and R 223 They may each independently be hydrogen or alkyl. For example, they may be alkyl.

[0060] In a suitable example of Formula 2, at least one of A1 and B1 may be a benzene structure. For example, one of A1 and B1 may be a benzene structure, and the other may not exist. In a suitable example of Formula 2, at least one of A2 and B2 may be a benzene structure. For example, one of A2 and B2 may be a benzene structure, and the other may not exist.

[0061]

[0062]

[0063] In Formula 3, R3 may be hydrogen or halogen. For example, it may be hydrogen, chlorine, fluorine or iodine. 311 , R 312 , R 321 and R 322 can be independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl. 313 and R 314 may be each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl, or they may be connected to each other to form a benzene structure. 323 and R 324 Each may independently be hydrogen, an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, an alkylsulfonyl group or an aryl group, or they may be linked to each other to form a benzene structure.

[0064] In Formula 3, Z may be a heteroatom, i.e., an atom other than carbon and hydrogen. For example, it may be an oxygen, nitrogen, or sulfur atom. In Formula 3, details about the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group are the same as those in Formula 1.

[0065] In Formula 3, aryl is a monovalent residue derived from a benzene molecule, a compound having two or more benzene molecular structures, or a derivative thereof. The range of compounds having two or more benzene bonded structures as described above includes structures in which two or more benzenes are connected by a linker, such as phenylbenzene or diphenylmethane; structures in which two benzene bonds share two carbon atoms at the same time, such as naphthalene; and spiro compounds in which two benzene bonds share one carbon atom at the same time. Aryl can be an aryl having 6 to 30 carbon numbers, 6 to 24 carbon numbers, 6 to 18 carbon numbers, 6 to 12 carbon numbers, 6 to 10 carbon numbers, or 6 to 8 carbon numbers. These aryl groups can be in a substituted or unsubstituted state.

[0066] In a suitable example of Formula 3, R 311 , R 312 , R 321 and R 322 can each independently be hydrogen, alkyl or alkoxy. In a suitable example of Formula 3, R 311 and R 312 One of them may be hydrogen and the other may be an alkyl group or an alkoxy group. In this case, the alkyl group or the alkyl group of the alkoxy group may be a branched alkyl group.

[0067] In a suitable example of Formula 3, R 321 and R 322One of them may be hydrogen and the other may be an alkyl group or an alkoxy group. In this case, the alkyl group or the alkyl group of the alkoxy group may be a branched alkyl group.

[0068] In formula 3, when R 313 and R 314 When not connected to each other to form a benzene structure, each can be independently hydrogen, alkyl or aryl. 323 and R 324 When not connected to each other to form a benzene structure, each can independently be hydrogen, alkyl or aryl. In Formula 3, R 313 and R 314 and R 323 and R 324 Any pair of them can be connected to form a benzene structure. 313 and R 314 and R 323 and R 324 When all the benzene structures are formed, the compound of formula 3 can be represented by formula 4.

[0069]

[0070] In formula 4, R3, R 311 , R 312 , R 321 , R 322 and Z are respectively R3, R 311 , R 312 , R 321 , R 322 and Z are the same. In formula 4, R 3131 To R 3134 and R 3231 To R 3234 Each of them may be independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl. They may be, for example, hydrogen, alkyl, alkoxy, or alkoxyalkyl. In Formula 4, the details of the alkyl, alkoxy alkyl, alkoxy alkyl, alkylcarbonyl, alkoxycarbonyl alkyl, alkoxyalkylcarbonyl alkyl, and alkylsulfonyl alkyl are the same as those in Formula 1.

[0071] In one example, the absorbent composition may include a compound of Formula 1, a compound of Formula 2, and a compound of Formula 3. In order to achieve the desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins, the mixing method of the compounds of Formulas 1 to 3 may be adjusted. For example, the amounts of the following A to C may be adjusted for the mixing method:

[0072] A: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 1;

[0073] B: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group in Formula 2; and

[0074] C: the total number of carbon atoms of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 3.

[0075] In other words, A is R in Formula 1 111 To R 117 and R 121 To R 127 The total number of carbon atoms in the alkyl group, alkyl group of alkoxy, alkyl group (two alkyl groups) of alkoxyalkyl, alkyl group of alkylcarbonyl, alkyl group of alkoxycarbonyl, alkyl group of alkoxyalkylcarbonyl (two alkyl groups) and alkyl group of alkylsulfonyl present at the position. 211 To R 213 and R 221 To R 223 The total number of carbon atoms of the alkyl group, alkyl group of the alkoxy group, alkyl group of the alkoxyalkyl group (two alkyl groups), alkyl group of the alkylcarbonyl group, alkyl group of the alkoxycarbonyl group, alkyl group of the alkoxyalkylcarbonyl group (two alkyl groups), and alkyl group of the alkylsulfonyl group present at the position of the alkyl group. If in Formula 2, A1, B1, A2, and / or B2 are a benzene structure, and if the benzene structure is substituted with an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group, or an alkylsulfonyl group, the carbon number of the alkyl group of the corresponding substituent is included to calculate B.

[0076] In addition, C is R in Formula 3 311 To R 314 and R 321 To R 324 The total number of carbon atoms in the alkyl group, alkyl group of alkoxy, alkyl group of alkoxyalkyl (two alkyl groups), alkyl group of alkylcarbonyl, alkyl group of alkoxycarbonyl, alkyl group of alkoxyalkylcarbonyl (two alkyl groups) and alkyl group of alkylsulfonyl present at the position. 314 and R 313 and / or R 323 and R 324 A benzene structure is formed, and if the benzene structure (for example, R in Formula 4 3131 To R 3134 and R 3231 To R 3234) is alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl, or R in Formula 3 311 To R 314 and R 321 To R 324 Where any one or more of A, B and C is an aryl group and the aryl group is an alkyl group, an alkoxy group, an alkoxyalkyl group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkoxyalkylcarbonyl group or an alkylsulfonyl group, the carbon number of the alkyl group including the corresponding substituent is calculated to calculate C. The lower limit of the sum of A, B and C may be about 30, 35, 40, 45, 50, 55 or 60, and the upper limit may be about 200, 180, 160, 140, 120, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45 or 40. The sum of A, B and C may be in a range equal to or exceeding any one of the above lower limits, or it may be in a range equal to or exceeding any one of the lower limits and equal to or lower than any one of the above upper limits. Within this range, the absorbent composition can achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0077] The standard deviation of A, B, and C can also be within a certain range. The standard deviation can be calculated as [{(AV) 2 +(BV) 2 +(CV) 2} / 3] 0.5 The lower limit of the standard deviation may be 0, 2, 4, 6, 8, 10, or 12, and the upper limit may be 50, 45, 40, 35, 30, 25, 20, 15, 10, 8, 6, or 4. The standard deviations of A, B, and C may be in a range equal to or exceeding any one of the lower limits; in a range equal to or lower than any one of the upper limits; or in a range equal to or exceeding any one of the lower limits and equal to or lower than any one of the above upper limits. Within this range, the absorbent composition can achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0078] The lower limit of the average value (arithmetic mean) of A, B and C may be about 6, 8, 10, 12, 14, 16, 18 or 20, and the upper limit may be about 35, 33, 31, 29, 27, 25, 23, 21, 19, 17, 15 or 12. The average value (arithmetic mean) of A, B and C may be in a range equal to or exceeding any of the above lower limits; in a range equal to or lower than any of the above upper limits; or in a range equal to or exceeding any of the lower limits and equal to or lower than any of the above upper limits. Within this range, the absorbent composition can achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0079] The ratio A / B of A to B may be controlled. The lower limit of A / B may be 0.1, 0.3, 0.5, 0.7, 0.9, 1, 1.5, 2, 2.5, or 2.8, and the upper limit may be 10, 9, 8, 7, 6, 5, 4, 3, 2, 1.5, or 1. The ratio A / B may be in a range equal to or exceeding any one of the lower limits; in a range equal to or lower than any one of the upper limits; or in a range equal to or exceeding any one of the lower limits and equal to or lower than any one of the above upper limits. Within this range, the absorbent composition may achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0080] The ratio B / C of B to C can be controlled. The lower limit of B / C may be 0.1, 0.3, 0.5, 0.7, 0.9, 1, 1.2, 1.4, 1.6, 1.8, or 2, and the upper limit may be 10, 9, 8, 7, 6, 5, 4, 3, 2.5, or 2. The ratio B / C may be in a range equal to or exceeding any one of the lower limits; in a range equal to or lower than any one of the upper limits; or in a range equal to or exceeding any one of the lower limits and equal to or lower than any one of the above upper limits. Within this range, the absorbent composition can achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0081] The ratio A / C of A to C can be controlled. The lower limit of A / C may be about 0.5, 1, 1.5, 2, 2.5, 3, 3.5, or 4, and the upper limit may be about 15, 13, 11, 9, 7, 5, or 3. The ratio A / C may be in a range equal to or exceeding any one of the lower limits; in a range equal to or lower than any one of the upper limits; or in a range equal to or exceeding any one of the lower limits and equal to or lower than any one of the above upper limits. Within this range, the absorbent composition can achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins.

[0082] The structures of Formulae 1 to 3 can be controlled to more effectively ensure the desired effect. For example, in the above mixture, R 111 To R 117 and R 121 To R 127 At least one of can be alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl. For example, it can be alkoxycarbonyl, alkoxyalkyl, alkoxyalkylcarbonyl or alkylsulfonyl. In a more suitable example, it can be alkoxycarbonyl or alkoxyalkylcarbonyl.

[0083] For example, in Formula 1, R 111 , R 113 , R 121 and R 123At least one of can be alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl. For example, it can be alkoxycarbonyl, alkoxyalkyl, alkoxyalkylcarbonyl or alkylsulfonyl. In a more suitable example, it can be alkoxycarbonyl or alkoxyalkylcarbonyl.

[0084] For example, in the above mixture, R 211 To R 213 and R 221 To R 223 can be independently hydrogen, alkyl, alkoxy or alkoxyalkyl, and at least one of them can be alkyl, alkoxy or alkoxyalkyl. In addition, in appropriate examples, R in Formula 2 211 To R 213 and R 221 To R 223 Each of them may be independently hydrogen, alkyl or alkoxyalkyl. For example, they may be alkyl or alkoxyalkyl.

[0085] In addition, in a suitable example, in Formula 2, either or both of A1 and B1 may form a benzene structure, and either or both of A2 and B2 may form a benzene structure. In addition, in a suitable example, in Formula 2, one of A1 and B1 may form a benzene structure, and the other may not exist, and either of A2 and B2 may form a benzene structure, and the other may not exist.

[0086] For example, in the above mixture, Z in Formula 3 may be oxygen. For example, in the above mixture, R in Formula 3 may be 311 , R 312 , R 321 and R 322 can be independently hydrogen, alkyl or aryl, but R 311 , R 312 , R 321 and R 323 At least one of may be an alkyl group. The alkyl group may be a branched alkyl group. For example, in Formula 3, R 311 , R 312 , R 321 and R 322 At least one of the R 313 and R 314 and / or a pair of R 323 and R 324 They may be connected to each other to form a benzene structure. For example, the compound of Formula 3 may have a structure of Formula 4.

[0087] By including the above three types of compounds having such a structure, an absorbent composition showing desired performance can be provided. The ratio between the three types of compounds in the absorbent composition is not particularly limited. In other words, the ratio between the compounds can be adjusted in consideration of the desired optical properties.

[0088] For example, the lower limit of the ratio of the compound of Formula 1 in the absorbent composition may be 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, or 40 wt%, and the upper limit may be 80 wt%, 75 wt%, 70 wt%, 65 wt%, 60 wt%, 55 wt%, 50 wt%, or 45 wt%. The ratio may be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. These ratios may be changed in view of the desired effect.

[0089] For example, the lower limit of the ratio of the compound of formula 2 to 100 parts by weight of the compound of formula 1 in the absorbent composition can be about 10 parts by weight, 30 parts by weight, 50 parts by weight, or 70 parts by weight, and the upper limit can be about 200 parts by weight, 180 parts by weight, 160 parts by weight, 140 parts by weight, 120 parts by weight, 100 parts by weight, or 80 parts by weight. The ratio can be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. These ratios may be changed in view of the desired effect.

[0090] For example, the lower limit of the ratio of the compound of formula 3 to 100 parts by weight of the compound of formula 1 in the absorbent composition may be about 10 parts by weight, 30 parts by weight, 50 parts by weight, or 70 parts by weight, and the upper limit may be about 200 parts by weight, 180 parts by weight, 160 parts by weight, 140 parts by weight, 120 parts by weight, 100 parts by weight, or 80 parts by weight. The ratio may be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. These ratios may be changed in view of the desired effect.

[0091] If desired, the ratio of the total absorbent contained in the absorbent composition can be adjusted by adjusting the compound of formula 1 to formula 3. For example, the lower limit of the ratio of the total weight of the compound of formula 1 to formula 3 relative to the weight of all absorbent components contained in the absorbent composition can be 50 weight%, 55 weight%, 60 weight%, 65 weight%, 70 weight%, 75 weight%, 80 weight%, 85 weight%, 90 weight% or 95 weight%, and the upper limit can be about 100 weight%, 95 weight%, 90% or 85 weight%. The ratio can be in the range of equal to or exceeding any lower limit; in the range of equal to or lower than any upper limit; or in the range of equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. Considering the desired effect, these ratios may change.

[0092] In addition to the compounds of Formula 1 to Formula 3 above, the absorbent composition may also contain other absorbents as needed. In addition, the absorbent composition may include anions as components of the absorbent. The anions may be, for example, counterions of the compounds of Formula 3 above. Examples of anions may include known anions generated during the absorbent synthesis process, such as halogen ions, hexafluoroantimonate ions (SbF6 - ), perchlorate ion, thiocyanate ion (SCN - ), hexafluorophosphate ion (PF6 - ), phosphate ion, bis(trifluoromethanesulfonyl)imide ion, tetrakis(pentafluorophenyl)borate ion, tetrakis(3,5-bis(trifluoromethyl)phenyl)borate ion, tetrafluoroborate ion (BF4 - ), trifluoromethylcarboxylate ion, alkylsulfonate ion, benzenesulfonate ion, toluenesulfonate ion, benzenecarboxylate ion, alkylcarboxylate ion, hydrofluoroborate ion and / or tetraphenylborate ion, but are not limited thereto.

[0093] The present specification also discloses a resin composition. The resin composition may include a resin component and other components, wherein the other components may be the absorbent composition described above.

[0094] For example, the resin component can be used as an adhesive. In this case, there is no particular limitation on the type of the resin component used, and a known resin component for forming an absorption film, such as a near-infrared absorption film, can be used. The absorbent composition can exhibit appropriate compatibility or solubility with various known resin components.

[0095] The example of resin component can include cycloolefin (COP) based resin, polyester resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyparaphenylene resin, polyarylether phosphine oxide resin, polyimide resin, polyetherimide resin, polyamide-imide resin, acrylic resin, polycarbonate resin, polyethylene naphthalate resin or silicone resin, or various other organic resins or organic-inorganic hybrid resins, but not limited thereto. When applying resin component, there is no particular restriction on its ratio. For example, the lower limit of the ratio of resin component in resin composition can be 50 wt %, 55 wt %, 60 wt %, 65 wt %, 70 wt %, 75 wt %, 80 wt %, 85 wt %, it can be about 90 wt % or 95 wt %, and the upper limit can be about 100 wt %, 95 wt %, 90 wt % or 85 wt %. The ratio can be in the range of equal to or exceeding any lower limit; in the range of equal to or lower than any upper limit; or in the range of equal to or exceeding any lower limit and equal to or lower than any upper limit mentioned above. These ratios may be changed depending on the desired effect.

[0096] For the resin composition, the lower limit of the ratio of the absorbent composition to 100 parts by weight of the resin component can be about 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight. It can be about 50 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, 6 parts by weight, 6.5 parts by weight or 7 parts by weight, and the upper limit can be about 50 parts by weight, about 45 parts by weight, about 40 parts by weight, about 35 parts by weight, and it can be about 30 parts by weight, 25 parts by weight, 20 parts by weight, 15 parts by weight or 10 parts by weight. The ratio can be in the range of equal to or exceeding any lower limit; in the range of equal to or lower than any upper limit; or in the range of equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. Considering the desired effect, these ratios may change.

[0097] For example, the resin composition may further include a solvent in which the absorbent composition and / or the resin component are dispersed. In this case, there is no particular limitation on the type of solvent used, and any known solvent for forming an absorption film (e.g., a near-infrared absorption film) may be used. The absorbent component may exhibit appropriate compatibility or solubility in various known solvents.

[0098] Examples of solvents include, but are not limited to, cyclohexanone, toluene, methyl ethyl ketone, methyl isobutyl ketone, chlorobenzene or xylene. When the solvent is applied, there is no particular restriction on the ratio, and the ratio can be adjusted within a range that allows the resin component and / or the absorbent composition to be properly dispersed. In addition to the above-mentioned components, the resin composition may also include other necessary components.

[0099] The present specification also relates to the use of the absorbent composition and / or the resin composition. For example, the present specification discloses a resin film (absorbent film) containing the above resin component and the above absorbent composition.

[0100] The specific details of the resin composition and absorbent composition for forming the resin film are as described above. For example, the lower limit of the ratio of the resin component used for the resin film can be 50 weight %, 55 weight %, 60 weight %, 65 weight %, 70 weight %, 75 weight %, 80 weight %, 85 weight %, 90 weight % or 95 weight %, and the upper limit can be about 100 weight %, 95 weight %, 90% or 85 weight %. The ratio can be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. Taking into account the desired effect, these ratios may change.

[0101] For the resin film, the lower limit of the ratio of the absorbent composition to 100 parts by weight of the resin component may be about 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, 6 parts by weight, 6.5 parts by weight, or 7 parts by weight, and the upper limit may be about 50 parts by weight, 45 parts by weight, 40 parts by weight, 35 parts by weight, 30 parts by weight, 25 parts by weight, 20 parts by weight, 15 parts by weight, or 10 parts by weight. The ratio may be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. These ratios may be changed in view of the desired effect.

[0102] The resin film may be an absorption film capable of absorbing light within a predetermined wavelength range. In one example, the resin film may be an infrared absorption film or a near infrared absorption film.

[0103] For example, such a resin film can exhibit absorption characteristics in at least a portion of a wavelength range within a range of about 600nm to 900nm. For example, by applying the above-mentioned absorbent composition, the resin film can have a relatively wide bandwidth within a wavelength range of 600nm to 900nm, and can have absorption characteristics of longer wavelengths.

[0104] Due to these characteristics, the absorption film can be applied to various devices such as optical filters and infrared sensors to prevent the deviation phenomenon with respect to the incident angle. In addition, when the dielectric film is applied to optical filters or infrared sensors, etc., the reflection characteristics of the dielectric film can be adjusted to prevent defects such as so-called petal flare, so that the number of dielectric film layers can be reduced. By doing so, manufacturing advantages can also be achieved.

[0105] Therefore, in one example, the absorption film may exhibit an absorption band with a bandwidth of 60 nm or more in the wavelength range of 600 nm to 900 nm. The absorption band may refer to a region in the transmittance curve of the absorption film where the transmittance is about 70% or less.

[0106] The bandwidth refers to the difference between the longest wavelength indicating a transmittance of 20% and the shortest wavelength indicating a transmittance of 20% in the wavelength region of 600nm to 900nm of the transmittance curve of the absorber film. In this case, the lower limit of the bandwidth may be about 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, or 155nm, and the upper limit may be about 1000nm, 950nm, 900nm, 850nm, 800nm, 750nm, 700nm, 650nm, 600nm, 550nm, 500nm, 450nm, 400nm, 350nm, 300nm, 250nm, 200nm, 190nm, 180nm, 170nm, 160nm, 150nm, 140nm, 130nm, 120nm, 110nm, or 100nm. The bandwidth may be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any upper limit.

[0107] As the different bandwidths, the difference between the longest wavelength showing a transmittance of 50% and the shortest wavelength showing a transmittance of 50% in the wavelength region of 600 nm to 900 nm of the transmittance curve of the absorption film may be adjusted. In this case, the lower limit of the bandwidth may be about 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 155nm, 160nm, 165nm, 170nm, 175nm, 180nm, 185nm, 190nm or 195nm, and the upper limit may be about 1000nm, 950nm, 900nm, 850nm, 800nm, 750nm, 700nm, 650nm, 600nm, 550nm, 500nm, 450nm, 400nm, 350nm, 300nm, 250nm, 200nm, 190nm, 180nm, 170nm, 160nm, 150nm, 140nm, 130nm, 120nm, 110nm or 100nm. The bandwidth may be in a range equal to or exceeding any lower limit; in a range equal to or lower than any upper limit; or in a range equal to or exceeding any lower limit and equal to or lower than any upper limit.

[0108] In addition, the T50% starting wavelength of the absorption film may be within a predetermined range. The lower limit of the T50% starting wavelength may be approximately 600nm, 610nm, 620nm, 630nm, 640nm, or 650nm, and the upper limit may be approximately 800nm, 790nm, 780nm, 770nm, 760nm, or 750nm. The T50% starting wavelength may be within a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. The T50% starting wavelength refers to the shortest wavelength at which the transmittance curve of the absorption film shows 50% transmittance within a wavelength range of 600nm to 900nm.

[0109] The T50% cut-off wavelength of the absorbent film may be within a predetermined range. The T50% cut-off wavelength may be a wavelength longer than the T50% starting wavelength. For another example, the lower limit of the T50% cut-off wavelength may be approximately 700nm, 720nm, 740nm, 760nm, 780nm, or 800nm, and the upper limit may be approximately 900nm, 880nm, 860nm, 840nm, 820nm, 810nm, or 800nm. The T50% cut-off wavelength may be within a range equal to or exceeding any lower limit and equal to or lower than any of the above upper limits. The T50% cut-off wavelength refers to the longest wavelength at which the transmittance is 50% in the wavelength range of 600nm to 900nm of the transmittance curve of the absorbent film.

[0110] By means of absorption characteristics, the absorption film can be applied to various devices such as optical filters and infrared sensors to effectively realize the desired characteristics. The absorption film can be formed in a known manner as long as the absorbent composition is applied. For example, the absorbent composition or the resin composition can be applied in an appropriate manner, and if necessary, a curing or drying process can be performed to form the absorption film.

[0111] There is no particular limitation on the thickness of the absorption film. The thickness may be adjusted in consideration of the desired characteristics. In one example, the thickness of the absorption film may be approximately 0.1 μm to 20 μm.

[0112] The specification also discloses an optical filter, which may include a substrate and an absorption film formed on one side or both sides of the substrate layer. Figure 1 is an example showing an optical filter in which the absorption film 200 is formed on one side of the substrate 100 .

[0113] By including the above-mentioned absorption film, such an optical filter can exhibit excellent performance. For example, the optical filter can efficiently and accurately block unnecessary infrared light and achieve a visible light transmission band with high transmittance.

[0114] There is no particular restriction on the type of transparent substrate applied to the filter. A known transparent substrate for a filter can be used. In one example, the substrate can be a so-called infrared absorption substrate. An infrared absorption substrate is a substrate that exhibits absorption characteristics in at least a portion of the infrared region. The so-called blue glass is a representative example of an infrared absorption substrate, which exhibits the above-mentioned characteristics by containing copper. Such an infrared absorption substrate can be used to construct an optical filter that blocks light in the infrared region, but due to its absorption characteristics, it is disadvantageous in ensuring high transmittance in the visible light region and is also disadvantageous in durability. By selecting an infrared absorption substrate and combining it with a specific absorption film, a filter that effectively blocks the desired light, exhibits high transmittance characteristics in the visible light region, and has excellent durability can be provided.

[0115] For infrared absorption substrates, substrates exhibiting an average transmittance of 75% or more in the wavelength range of 425 nm to 560 nm may be used. In another example, the average transmittance may be in the range of 77% or more, 79% or more, 81% or more, 83% or more, 85% or more, 87% or more, or 89% or more and / or 98% or less, 96% or less, or 94% or less, 92% or less, or 90% or less.

[0116] For the infrared absorption substrate, a substrate showing a maximum transmittance of 80% or more in the wavelength range of 425nm to 560nm can be used. In another example, the maximum transmittance may be in the range of 82% or more, 84% or more, 86% or more, 88% or more, or 90% or more and / or 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, or 90% or less.

[0117] For the infrared absorption substrate, a substrate showing an average transmittance of 75% or more in the wavelength range of 350 nm to 390 nm can be used. In another example, the average transmittance can be in the range of 77% or more, 79% or more, 81% or more, or 83% or more and / or 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, 88% or less, 86% or less, or 84% or less.

[0118] For the infrared absorption substrate, a substrate showing a maximum transmittance of 80% or more in the wavelength range of 350 nm to 390 nm can be used. In another example, the maximum transmittance may be in the range of 82% or more, 84% or more, 86% or more, or 87% or more and / or 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, or 88% or less.

[0119] For infrared absorbing substrates, substrates with a transmittance in the range of 10% to 45% at a wavelength of 700 nm can be used. In another example, the transmittance can be about 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less, or 29% or less, or 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, or 28% or more.

[0120] For infrared absorption substrates, substrates exhibiting an average transmittance in the range of 5% to 30% in the wavelength range of 700nm to 800nm ​​can be used. In another example, the average transmittance can be in the range of 7% or more, 9% or more, 11% or more, 13% or more, 15% or more, 15.5% or more, 16% or more, 16.5% or more and / or 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less or 17% or less.

[0121] For infrared absorption substrates, substrates exhibiting a maximum transmittance in the range of 10% to 45% in the wavelength range of 700 nm to 800 nm may be used. In another example, the maximum transmittance may be in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, 28% or more and / or 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less or 29% or less.

[0122] For the infrared absorption substrate, a substrate showing an average transmittance in the range of 3% to 20% in the wavelength range of 800nm ​​to 1000nm can be used. In another example, the average transmittance can be further adjusted in the range of 5% or more, 7% or more, 9% or more, or 11% or more and / or 18% or less, 16% or less, 14% or less, or 12% or less.

[0123] For infrared absorption substrates, substrates exhibiting a maximum transmittance in the range of 5% to 30% in the wavelength range of 800 nm to 1000 nm may be used. In another example, the maximum transmittance may be in the range of 7% or more, 9% or more, 11% or more, 13% or more, or 15% or more and / or 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less, or 16% or less.

[0124] For the infrared absorption substrate, a substrate exhibiting an average transmittance in the range of 10% to 50% in the wavelength range of 1000nm to 1200nm can be used. In another example, the average transmittance can be further adjusted in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more or 25% or more and / or 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, 36% or less, 34% or less, 32% or less, 30% or less, 28% or less or 26% or less.

[0125] The infrared absorbing substrate may have a transmission band showing a maximum transmittance in the range of 10% to 70% in the wavelength range of 1000 nm to 1200 nm. In another example, the maximum transmittance may be 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, 28% or more, 30% or more, 32% or more, 34% or more, 36% or more and / or 68% or less, 66% or less, 64% or less, 62% or less, 60% or less, 58% or less, 56% or less, 54% or less, 52% or less, 50% or less, 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, or 37% or less.

[0126] The infrared absorption substrate having the above-mentioned characteristics can be combined with an absorption film to form a desired filter. As such a substrate, a substrate called so-called infrared absorption glass can be used. This glass is an absorption glass made by adding CuO or similar contents to fluorophosphate-based glass or phosphate-based glass. Therefore, in one example, a fluorophosphate glass substrate containing CuO or a phosphate glass substrate containing CuO can be used as an infrared absorption substrate. Phosphate glass also includes K-phosphate glass, in which a part of the glass frame is composed of SiO2. Such absorption glass is well known, and for example, the glass disclosed in Korean Patent No. 10-2056613 or other commercially available absorption glass (for example, commercial products of Hoya, Schott, PTOT, etc.) can be used.

[0127] The infrared absorbing substrate includes copper. A substrate having a copper content in the range of 1 wt % to 7 wt % can be used. In another example, the copper content can be about 1.5 wt % or more, 2 wt % or more, 2.5 wt % or more, 2.6 wt % or more, 2.7 wt % or more, or 2.8 wt % or more, or 6.5 wt % or less, 6 wt % or less, 5.5 wt % or less, 5 wt % or less, 4.5 wt % or less, 4 wt % or less, 3.5 wt % or less, 3 wt % or less, or 2.9 wt % or less. Substrates having such copper contents may exhibit the above-mentioned optical properties and can be combined with an absorbing film to form a filter having the desired properties.

[0128] The copper content can be confirmed by using an X-ray fluorescence analysis device (WD XRF, wavelength dispersive X-ray fluorescence spectrometry). When X-rays are irradiated onto a sample (substrate) using this device, characteristic secondary X-rays are generated for each element of the sample, and then the device detects the secondary X-rays according to the wavelength of each element. The intensity of the secondary X-rays is proportional to the element content, so quantitative analysis can be performed by the intensity of the secondary X-rays.

[0129] The thickness of the infrared absorption substrate may be adjusted within a range of, for example, about 0.03 mm to 5 mm, but is not limited thereto.

[0130] In addition to the substrate and the absorption film, the optical filter may also include other known components as required. For example, the optical filter may also include a dielectric film. For example, the dielectric film may also include a so-called dielectric film on one side or both sides of the substrate.

[0131] Figure 2 and Figure 3 1 and 2 are examples of optical filters to which the dielectric film 300 is added. They show a case where the dielectric film 300 is formed on one side or both sides of a stacked structure including the substrate 100 and the absorption film 200.

[0132] The dielectric film is a film formed by repeatedly stacking a dielectric material having a low refractive index and a dielectric material having a high refractive index. It is also used to form a so-called IR reflection layer and an anti-reflection (AR) layer. The dielectric film can be applied to form such a well-known IR reflection layer or AR layer.

[0133] Therefore, the dielectric film may have a multilayer structure including at least two types of sublayers each having a different refractive index and may include a multilayer structure in which the two types of sublayers are repeatedly stacked.

[0134] The type of material forming the dielectric film, in other words, the material forming each sub-layer is not particularly limited, and known materials can be applied. Generally, fluorides such as SiO2 or Na5Al3F14, Na3AlF6 or MgF2 are used to make the low-refractive sub-layer, and amorphous silicon, TiO2, Ta2O5, Nb2O5, ZnS or ZnSe, etc. can be used to make the high-refractive sub-layer, but the applied materials are not limited to the above.

[0135] The method for forming the above-mentioned dielectric film is not particularly limited, for example, it can be formed by applying a known deposition method. In industry, there is a known method for controlling the reflection or transmission characteristics of the dielectric film in consideration of the deposition thickness or the number of layers of the sublayer, and therefore, the dielectric film can be formed according to this known method.

[0136] In one example, the dielectric film included in the filter may have a shortest wavelength of 710 nm or longer, which exhibits a 50% reflectivity in a wavelength range of 600 nm to 900 nm, or the wavelength may not exist. In addition, when the wavelength does not exist, the maximum reflectivity of the dielectric film is less than 50% in a wavelength range of 600 nm to 900 nm. In another example, the shortest wavelength exhibiting 50% reflectivity (if present) may be about 715 nm or longer, 720 nm or longer, 725 nm or longer, 730 nm or longer, 735 nm or longer, 740 nm or longer, 745 nm or longer, 750 nm or longer, or 754 nm or longer. Alternatively, it may be about 900 nm or shorter, 850 nm or shorter, 800 nm or shorter, 790 nm or shorter, 780 nm or shorter, 770 nm or shorter, or 760 nm or shorter. The shortest wavelength indicating a reflectance of 50% may be within the range of the lower limit and the upper limit of the above lower limits, and in this case, the upper limit may be 900 nm.

[0137] By controlling the reflection characteristics of the dielectric film as described above, the so-called petal flare phenomenon can be prevented. The petal flare phenomenon refers to a phenomenon in which a red line that cannot be observed with the naked eye is captured in a photograph when photographing a luminous object, etc. It is called the petal flare phenomenon because the red line often has a petal shape depending on the luminous object. As the sensitivity of the sensor included in the image capture device increases and the transmittance of the filter increases to obtain a clearer image, the frequency of occurrence of petal flare is also increasing.

[0138] One of the causes of the petal flare phenomenon can be considered to be due to repeated reflection of near-infrared light within an image capture device equipped with an optical filter. Among the dielectric films generally formed in the optical filter, a so-called IR film is particularly formed to block light in the near-infrared region by reflection. As a result, the shortest wavelength at which the dielectric film exhibits 50% reflectivity is formed near visible light, generally shorter than 710nm. However, the reflection of near-infrared light within the image capture device is accelerated by the dielectric film, so the petal flare phenomenon occurs. However, if the shortest wavelength at which the dielectric film exhibits 50% reflectivity is adjusted to 710nm or higher, the infrared light blocking efficiency of the optical filter decreases.

[0139] However, by applying the absorption film, even when the shortest wavelength at which the dielectric film exhibits 50% reflectivity is adjusted to 710 nm or higher, infrared light can be effectively blocked and the petal flare phenomenon can also be prevented. Meanwhile, the design method for controlling the reflective characteristics of the dielectric film itself is well known.

[0140] The filter may further include an absorption film (referred to as an ultraviolet absorption film) which exhibits absorption characteristics for ultraviolet rays as an absorption film different from the absorption film. However, the ultraviolet absorption film is not an essential component, and for example, the ultraviolet absorber described later may be introduced into one absorption film together with the compounds of Formula 1 and Formula 2, etc.

[0141] In one example, the UV absorbing film may be designed to exhibit maximum absorption in a wavelength range of about 300 nm to 390 nm. The UV absorbing film may contain only a UV absorber, or may include two or more types of UV absorbers if necessary. For example, for the UV absorber, a known absorber that exhibits maximum absorption in a wavelength range of about 300 nm to 390 nm may be used. For example, the UV absorber may include ABS 407 from Exiton; UV381A, UV381B, UV382A, UV386A, and VIS404A from QCR Solutions Corp; HW Sands' ADA1225, ADA3209, ADA3216, ADA3217, ADA3218, ADA3230, ADA5205, ADA3217, ADA2055, ADA6798, ADA31 02. ADA3204, ADA3210, ADA2041, ADA3201, ADA32002, ADA3215, ADA3219, ADA3225, ADA3232, ADA4160, ADA5278, ADA5762, ADA6826, ADA7226, ADA4634, ADA3213, ADA3227, ADA5922, ADA5950, ADA6752, ADA7130, ADA8212, ADA2984, ADA2999, ADA3220, ADA3228, ADA3235, ADA3240, ADA3211, ADA3221, ADA5220, and ADA7158; and CRYSTALYN's DLS 381B, DLS381C, DLS 382A, DLS 386A, DLS 404A, DLS-405A, DLS405C, and DLS 403A, etc., but are not limited to these.

[0142] The materials and construction methods used to construct the ultraviolet absorbing film are not particularly limited, and known materials and configuration methods can be applied. Generally, the ultraviolet absorbing film is formed by using a material mixed with a transparent resin and an ultraviolet absorber capable of showing the desired maximum absorption. In this case, the transparent resin can be a resin component applied to the absorbent composition. In addition to the above-mentioned layers, a filter can be added so that various necessary layers do not impair the desired effect.

[0143] The present specification also discloses an imaging device including an optical filter. At this time, there is no particular limitation on the configuration of the imaging device or the application method of the optical filter, and known configurations and application methods can be applied. In addition, the use of the optical filter is not limited to the image capture device. The optical filter can be applied to various other applications (for example, display devices such as PDPs, etc.) that require near-infrared cutoff.

[0144] This specification also discloses an infrared sensor including an absorption film. The configuration of the infrared sensor is not particularly limited as long as it includes an absorption film. For example, it can be configured by introducing the absorption film into a known motion sensor, proximity sensor, or gesture sensor. In addition, the use of the absorbent composition, resin composition, or resin film (absorption film) is not limited to filters, infrared sensors, and / or image capture devices, but is used for various other applications that require infrared cutoff (for example, display devices such as PDPs, etc.). DETAILED DESCRIPTION

[0146] Composition etc. will be described in detail by the following examples, but the scope of composition etc. is not limited by the following examples. In addition, within the technical scope of the present invention, those skilled in the art can make various substitutions, modifications and changes. The effects that can be obtained by the present invention are not limited to the above effects, and those skilled in the art can clearly understand other unmentioned effects from the above description.

[0147] 1. Transmission spectrum evaluation

[0148] The transmission spectrum is measured on the sample by using a spectrophotometer (Perkelmer, Lambda750 spectrophotometer), and the sample is obtained by cutting the measurement object (such as an absorption film) so that the width and height are 10mm and 10mm respectively. According to the equipment manual, the transmission spectrum of each wavelength and incident angle is measured. The sample is placed on a straight line between the measurement beam and the detector of the spectrophotometer, and the transmission spectrum is evaluated by setting the incident angle of the measurement beam to 0°. The incident angle of 0° is a direction substantially parallel to the normal direction of the sample surface. The average transmittance within a specific wavelength range in the transmission spectrum is the result of measuring the transmittance at each wavelength while increasing the wavelength by 1nm from the shortest wavelength in the wavelength range, and then calculating the arithmetic mean of the measured transmittance. The minimum transmittance is the lowest transmittance in the transmittance measured while increasing the wavelength by 1nm, and the maximum transmittance is the highest transmittance in the transmittance measured while increasing the wavelength by 1nm. For example, the average transmittance in the wavelength range of 350nm to 360nm is the arithmetic mean of the transmittances measured at a wavelength of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm and 360nm. The maximum transmittance in the wavelength range of 350nm to 360nm is the highest transmittance among the transmittances measured at a wavelength of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm and 360nm, and the minimum transmittance in the wavelength range of 350nm to 360nm is the lowest transmittance among the transmittances measured at a wavelength of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm and 360nm.

[0149] 2. Quality Analysis

[0150] The synthesized compound was subjected to mass analysis by using a liquid chromatography / mass spectrometer (manufactured by Thermo Finnigan Co., Ltd.).

[0151] Synthesis Example 1: Preparation of Compound 1A

[0152] The compound of Chemical Formula 1A (Compound 1A) in the following Chemical Reaction Formula 1 was synthesized in the following manner.

[0153] [Chemical reaction formula 1]

[0154]

[0155] 14.1 g of compound 1A' in chemical reaction formula 1, 2.62 g of square acid and 8.7 g of tetraethyl orthoformate (TEOF) were dissolved in 100 mL of solvent (n-butanol) and reacted at 95 ° C for about 4 hours. After the reaction was cooled to room temperature (about 25 ° C), 300 mL of ethanol was added, and after further stirring for more than 6 hours, the precipitated solid was filtered by ethanol under reduced pressure. As a result, the target product (compound 1A of formula 1A) (7.4 g, 46%) was obtained.

[0156] The mass analysis results of the synthesized target compound (Compound 1A of Formula 1A) are as follows:

[0157] <Quality Analysis Results>

[0158] LC-MS m / z 690.5

[0159] Synthesis Example 2: Preparation of Compound 1B

[0160] In Chemical Reaction Formula 2, the compound of Chemical Formula 1B (Compound 1B) was synthesized by the same method as in Chemical Reaction Formula 1, except that 10.2 g of Compound 1B' was used instead of Compound 1A'.

[0161] [Chemical reaction formula 2]

[0162]

[0163] The mass analysis results of the synthesized target compound (compound 1B of formula 1B) are as follows:

[0164] <Quality Analysis Results>

[0165] LC-MS m / z 859.1

[0166] Synthesis Example 3: Preparation of Compound 1C

[0167] In Chemical Reaction Formula 3, the compound of Chemical Formula 1C (Compound 1C) was synthesized by the same method as in Chemical Reaction Formula 1, except that 5.3 g of Compound 1C' was used instead of Compound 1A'.

[0168] [Chemical reaction formula 3]

[0169]

[0170] The mass analysis results of the synthesized target compound (compound 1C of formula 1C) are as follows:

[0171] <Quality Analysis Results>

[0172] LC-MS m / z 771.0

[0173] Synthesis Example 4: Preparation of Compound 1D

[0174] In Chemical Reaction Formula 4, the compound of Chemical Formula 1D (Compound 1D) was synthesized by the same method as in Chemical Reaction Formula 1, except that 10.8 g of Compound 1D' was used instead of Compound 1A'.

[0175] [Chemical reaction formula 4]

[0176]

[0177] The mass analysis results of the synthesized target compound (compound 1D of formula 1D) are as follows:

[0178] <Quality Analysis Results>

[0179] LC-MS m / z 682.9

[0180] Synthesis Example 5: Preparation of Compound 1E

[0181] In Chemical Reaction Formula 5, the compound of Chemical Formula 1E (Compound 1E) was synthesized by the same method as in Chemical Reaction Formula 1, except that 8.5 g of Compound 1E' was used instead of Compound 1A'.

[0182] [Chemical reaction formula 5]

[0183]

[0184] The mass analysis results of the synthesized target compound (compound 1E of formula 1E) are as follows:

[0185] <Quality Analysis Results>

[0186] LC-MS m / z 851.3

[0187] Synthesis Example 6: Preparation of Compound 1F

[0188] In Chemical Reaction Formula 6, the compound of Chemical Formula 1F (Compound 1F) was synthesized by the same method as in Chemical Reaction Formula 1, except that 6.4 g of Compound 1F' was used instead of Compound 1A'.

[0189] [Chemical reaction formula 6]

[0190]

[0191] The mass analysis results of the synthesized target compound (compound 1F of formula 1F) are as follows:

[0192] <Quality Analysis Results>

[0193] LC-MS m / z 951.4

[0194] Synthesis Example 7: Preparation of Compound 1AA

[0195] In Chemical Reaction Formula 7, the compound of Chemical Formula 1AA (Compound 1AA) was synthesized by the same method as in Chemical Reaction Formula 1, except that 9.7 g of Compound 1AA' was used instead of Compound 1A'.

[0196] [Chemical reaction formula 7]

[0197]

[0198] The mass analysis results of the synthesized target compound (compound 1AA of formula 1AA) are as follows:

[0199] <Quality Analysis Results>

[0200] LC-MS m / z 542.3

[0201] Synthesis Example 8: Preparation of Compound 2A

[0202] The compound of Chemical Formula 2A (Compound 2A) in the following Chemical Reaction Formula 8 was synthesized in the following manner.

[0203] [Chemical reaction formula 8]

[0204]

[0205] 10.1g of compound 2A' in chemical reaction formula 2, 2.2g of square acid and 7.8g of tetraethyl orthoformate (TEOF) were dissolved in 100mL of solvent (n-butanol) and reacted at 95°C for 4 hours. After the reaction, it was cooled to room temperature (about 25°C), 300mL of ethanol was added, stirred for more than 6 hours, and the precipitated solid was filtered by ethanol under reduced pressure. As a result, the target product (compound 2A of formula 2A) (6.8g, 58%) was obtained.

[0206] The mass analysis results of the synthesized target compound (compound 2A of formula 2A) are as follows:

[0207] <Quality Analysis Results>

[0208] LC-MS m / z 612.2

[0209] Synthesis Example 9: Preparation of Compound 2B

[0210] In Chemical Reaction Formula 9, the compound of Chemical Formula 2B (Compound 2B) was synthesized by the same method as in Chemical Reaction Formula 8, except that 6.4 g of Compound 2B' was used instead of Compound 2A'.

[0211] [Chemical reaction formula 9]

[0212]

[0213] The mass analysis results of the synthesized target compound (compound 2B of formula 2B) are as follows:

[0214] <Quality Analysis Results>

[0215] LC-MS m / z 608.7

[0216] Synthesis Example 10: Preparation of Compound 2C

[0217] In Chemical Reaction Formula 10, the compound of Chemical Formula 2C (Compound 2C) was synthesized by the same method as in Chemical Reaction Formula 8, except that 7.8 g of Compound 2C' was used instead of Compound 2A'.

[0218] [Chemical reaction formula 10]

[0219]

[0220] The mass analysis results of the synthesized target compound (compound 2C of formula 2C) are as follows:

[0221] <Quality Analysis Results>

[0222] LC-MS m / z 664.9

[0223] Synthesis Example 11: Preparation of Compound 2D

[0224] In Chemical Reaction Formula 11, the compound of Chemical Formula 2D (Compound 2D) was synthesized by the same method as in Chemical Reaction Formula 8, except that 9.2 g of Compound 2D' was used instead of Compound 2A'.

[0225] [Chemical reaction formula 11]

[0226]

[0227] The mass analysis results of the synthesized target compound (compound 2D of formula 2D) are as follows:

[0228] <Quality Analysis Results>

[0229] LC-MS m / z 721.1

[0230] Synthesis Example 12: Preparation of Compound 2AA

[0231] In Chemical Reaction Formula 12, the compound of Chemical Formula 2AA (Compound 2AA) was synthesized by the same method as in Chemical Reaction Formula 8, except that 8.3 g of Compound 2AA' was used instead of Compound 2A'.

[0232] [Chemical reaction formula 12]

[0233]

[0234] The mass analysis results of the synthesized target compound (compound 2AA of formula 2AA) are as follows:

[0235] <Quality Analysis Results>

[0236] LC-MS m / z 524.3

[0237] Synthesis Example 13: Preparation of Compound 3A

[0238] The compound of Chemical Formula 3A (Compound 3A) in the following Chemical Reaction Formula 13 was synthesized in the following manner.

[0239] [Chemical reaction formula 13]

[0240]

[0241] 1.0.g of compound 3A' (1.86mmol) in chemical reaction formula 13 and 0.64g (4.16mmol) of LiTFSI (lithium bis (trifluoromethanesulfonyl) imide) were dissolved in 20mL of solvent (dichloromethane), 20mL of water was added, and the reaction was carried out at room temperature (25°C) for about 2 hours. After the reaction, the dichloromethane layer and the water layer were separated by using an extractor, concentrated, 100mL of ethanol was added, and filtered under reduced pressure. As a result, the target chemical substance (compound 3A of chemical formula 3A) (1.0g, 74.8%) was obtained.

[0242] The mass analysis results of the synthesized target compound (compound 3A of formula 3A) are as follows:

[0243] <Quality Analysis Results>

[0244] LC-MS(+)m / z 437.8,LC-MS(-)m / z 287.9

[0245] Synthesis Example 14: Preparation of Compound 3B

[0246] In Chemical Reaction Formula 14, the compound of Chemical Formula 3B (Compound 3B) was synthesized by the same method as in Chemical Reaction Formula 13, except that 1.4 g of Compound 3B' was used instead of Compound 3A'.

[0247] [Chemical reaction formula 14]

[0248]

[0249] The mass analysis results of the synthesized target compound (compound 3B of formula 3B) are as follows:

[0250] <Quality Analysis Results>

[0251] LC-MS(+)m / z 465.7,LC-MS(-)m / z 287.9

[0252] Synthesis Example 15: Preparation of Compound 3C

[0253] In Chemical Reaction Formula 15, the compound of Chemical Formula 3C (Compound 3C) was synthesized by the same method as in Chemical Reaction Formula 13, except that 1.3 g of Compound 3C' was used instead of Compound 3A'.

[0254] [Chemical reaction formula 15]

[0255]

[0256] The mass analysis results of the synthesized target compound (compound 3C of formula 3C) are as follows:

[0257] <Quality Analysis Results>

[0258] LC-MS(+)m / z 472.1,LC-MS(-)m / z 287.9

[0259] Synthesis Example 16: Preparation of Compound 3D

[0260] In Chemical Reaction Formula 16, the compound of Chemical Formula 3D (Compound 3D) was synthesized by the same method as in Chemical Reaction Formula 13, except that 1.0 g of Compound 3D' was used instead of Compound 3A'.

[0261] [Chemical reaction formula 16]

[0262]

[0263] The mass analysis results of the synthesized target compound (compound 3D of formula 3D) are as follows:

[0264] <Quality Analysis Results>

[0265] LC-MS(+)m / z 532.1,LC-MS(-)m / z 287.9

[0266] Synthesis Example 17: Preparation of Compound 4A

[0267] In Chemical Reaction Formula 17, the compound of Chemical Formula 4A (Compound 4A) was synthesized by the same method as in Chemical Reaction Formula 13, except that 1.1 g of Compound 4A' was used instead of Compound 3A'.

[0268] [Chemical reaction formula 17]

[0269]

[0270] The mass analysis results of the synthesized target compound (compound 4A of formula 4A) are as follows:

[0271] <Quality Analysis Results>

[0272] LC-MS(+)m / z 489.7,LC-MS(-)m / z 287.9

[0273] Synthesis Example 18: Preparation of Compound 4B

[0274] In Chemical Reaction Formula 18, the compound of Chemical Formula 4B (Compound 4B) was synthesized by the same method as in Chemical Reaction Formula 13, except that 1.2 g of Compound 4B' was used instead of Compound 3A'.

[0275] [Chemical reaction formula 18]

[0276]

[0277] The mass analysis results of the synthesized target compound (compound 4B of formula 4B) are as follows:

[0278] <Quality Analysis Results>

[0279] LC-MS(+)m / z 636.4,LC-MS(-)m / z 287.9

[0280] The solubility of each compound synthesized above was evaluated. The solubility was evaluated based on the following criteria by evaluating the solubility of each compound in various solvents (cyclohexanone, toluene, methyl isobutyl ketone (MIBK) or methyl ethyl ketone (MEK)) at room temperature (about 25°C).

[0281] <Solubility Evaluation Criteria>

[0282] A: When the solubility is 1 mass % or more.

[0283] B: The solubility is 0.5 mass % or more and less than 1 mass %.

[0284] C: When the solubility is 0.2 mass % or more and less than 0.5 mass %.

[0285] D: Case where the solubility is less than 0.2 mass %.

[0286] The solubility evaluation results are summarized in Table 1 below.

[0287] [Table 1]

[0288] Cyclohexanone Toluene MIBK MEK Synthesis example 1 A B A A Synthesis example 2 A B A A Synthesis example 3 A A A A Synthesis example 4 A B A A Synthesis example 5 A A A A Synthesis example 6 A A A A Synthesis Example 7 A B A B Synthesis example 8 A A B B Synthesis example 9 A B B A Synthesis example 10 A B A A Synthesis Example 11 A A A A Synthesis example 12 B C B C Synthesis example 13 A B A A Synthesis Example 14 A A A A Synthesis Example 15 A B A A Synthesis Example 16 A A A A Synthesis Example 17 B B A B Synthesis example 18 A B A A

[0289] Example 1

[0290] An absorbent composition was prepared by mixing Compound 1A of Synthesis Example 1, Compound 2B of Synthesis Example 9, and Compound 4A of Synthesis Example 17 in a weight ratio of about 55:40:40 (1A:2B:4A).

[0291] Example 2

[0292] An absorbent composition was prepared by mixing Compound 1B of Synthesis Example 2, Compound 2A of Synthesis Example 8, and Compound 4B of Synthesis Example 18 in a weight ratio of about 55:40:40 (1B:2A:4B).

[0293] Example 3

[0294] An absorbent composition was prepared by mixing Compound 1C of Synthesis Example 3, Compound 2C of Synthesis Example 10, and Compound 3D of Synthesis Example 16 in a weight ratio of about 55:40:40 (1C:2C:3D).

[0295] Example 4

[0296] An absorbent composition was prepared by mixing Compound 1D of Synthesis Example 4, Compound 2B of Synthesis Example 9, and Compound 3C of Synthesis Example 15 in a weight ratio of about 55:40:40 (1D:2B:3C).

[0297] Example 5

[0298] An absorbent composition was prepared by mixing Compound 1E of Synthesis Example 5, Compound 2D of Synthesis Example 11, and Compound 3B of Synthesis Example 14 at a weight ratio of about 55:40:40 (1E:2D:3B).

[0299] Example 6

[0300] An absorbent composition was prepared by mixing Compound 1F of Synthesis Example 6, Compound 2A of Synthesis Example 8, and Compound 3A of Synthesis Example 13 in a weight ratio of about 55:40:40 (1F:2A:3A).

[0301] Comparative Example 1

[0302] An absorbent composition was prepared by mixing Compound 1AA of Synthesis Example 7, Compound 2AA of Synthesis Example 12, and Compound 4A of Synthesis Example 17 in a weight ratio of about 55:40:40 (1AA:2AA:4A).

[0303] The solubility of each absorbent composition in the examples and comparative examples was evaluated. The solubility was evaluated by injecting the resin composition prepared by dispersing the absorbent composition in a mixture containing a resin component and a solvent at room temperature (about 25° C.) using a syringe filter having a filter size of about 1 μm according to the following criteria.

[0304] <Solubility Evaluation Criteria>

[0305] A: The absorbent composition can pass through the filter well without clogging when injected into the syringe filter.

[0306] B: The absorbent composition passed through the filter, but the passing rate was significantly slowed down due to clogging of the syringe filter during injection.

[0307] C: The case where the absorbent composition does not pass through the filter when injected through the syringe filter.

[0308] The evaluation results are summarized and listed in Table 2 below.

[0309] Condition 1 in Table 2 is a mixture (resin component + solvent) for preparing a resin composition, in which an acrylic resin (polymethyl methacrylate (PMMA)) of LG Chemical is added to methyl isobutyl ketone (MIBK) at a concentration of about 15% by weight. Condition 2 is a mixture (resin component + solvent) in which a silicone resin (Dow Co., Ltd.) is dispersed in cyclohexanone at a concentration of about 15% by weight. Condition 3 is a mixture (resin component + solvent) in which a cycloolefin resin (TOPAS Co., Ltd.) is dispersed in cyclohexanone at a concentration of about 15% by weight. When preparing each resin composition, the concentration of the absorbent composition in the resin composition is set to about 1.2% by weight.

[0310] [Table 2]

[0311]

[0312] Example 7

[0313] Acrylic resin (polymethyl methacrylate (PMMA)), the absorbent composition of Example 3 and a solvent (MIBK) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for more than 12 hours to prepare a resin composition. As a result of evaluating the solubility of the composition in the above manner, the evaluation result was A (a case where the absorbent composition passes well through the filter without clogging when injected into the syringe filter).

[0314] The absorbent composition was spin-coated on a transparent substrate (SCHOTT Co., Ltd.) that does not substantially absorb or reflect light, and then heat-treated at a temperature of about 130° C. for about 2 hours to form an absorbent film with a thickness of about 3 μm.

[0315] Figure 4 : is a graph showing the evaluation results of the transmittance of the above-mentioned absorption film. In the graph, the X-axis is the wavelength (nm) and the Y-axis is the transmittance.

[0316] Example 8

[0317] Cycloolefin polymer (COP), the absorbent composition of Example 5 and a solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for 12 hours or more to prepare a resin composition. As a result of evaluating the solubility of the composition in the above manner, the evaluation result was A (a case where the absorbent composition passes well through the filter without clogging when injected into the syringe filter).

[0318] The absorbent composition was spin-coated on a transparent substrate (SCHOTT Co., Ltd.) that does not substantially absorb or reflect light, and then heat-treated at a temperature of about 130° C. for about 2 hours to form an absorbent film with a thickness of about 3 μm.

[0319] Figure 5 : is a graph showing the evaluation results of the transmittance of the above-mentioned absorption film. In the graph, the X-axis is the wavelength (nm) and the Y-axis is the transmittance.

[0320] Example 9

[0321] The silicone resin, the absorbent composition of Example 6 and the solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for more than 12 hours to prepare a resin composition. As a result of evaluating the solubility of the composition in the above manner, the evaluation result was A (a case where the absorbent composition passes well through the filter without clogging when injected into the syringe filter).

[0322] The absorbent composition was spin-coated on a transparent substrate (SCHOTT Co., Ltd.) that does not substantially absorb or reflect light, and then heat-treated at a temperature of about 130° C. for about 2 hours to form an absorbent film with a thickness of about 3 μm.

[0323] Figure 6 : is a graph showing the evaluation results of the transmittance of the above-mentioned absorption film. In the graph, the X-axis is the wavelength (nm) and the Y-axis is the transmittance.

[0324] Comparative Example 2

[0325] Cycloolefin polymer (COP), the absorbent composition of Comparative Example 1 and a solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for 12 hours or more to prepare a resin composition. As a result of evaluating the solubility of the composition in the above manner, the evaluation result was A (a case where the absorbent composition passes well through the filter without clogging when injected into the syringe filter).

[0326] The absorbent composition was spin-coated on a transparent substrate (SCHOTT Co., Ltd.) that does not substantially absorb or reflect light, and then heat-treated at a temperature of about 130° C. for about 2 hours to form an absorbent film with a thickness of about 3 μm.

[0327] Figure 7 : is a graph showing the evaluation results of the transmittance of the above-mentioned absorption film. In the graph, the X-axis is the wavelength (nm) and the Y-axis is the transmittance.

[0328] The absorption characteristics of the absorption films of Examples 7 to 9 and Comparative Example 2 were evaluated in the wavelength range of 600 nm to 900 nm. The results are summarized in Table 3 below.

[0329] In Table 3, T50% onset is the shortest wavelength at which the transmittance is 50% in the wavelength range of 600nm to 900nm in the transmission spectrum. T50% off is the longest wavelength showing 50% transmittance in the wavelength range of 600nm to 900nm in the transmission spectrum. It is the longest wavelength at which the transmittance is 50% in the wavelength range.

[0330] In Table 3, T20% onset is the shortest wavelength at which the transmittance is 20% in the wavelength range of 600nm to 900nm in the transmission spectrum. T20% off is the longest wavelength showing 20% ​​transmittance in the wavelength range of 600nm to 900nm in the transmission spectrum. It is the longest wavelength at which the transmittance is 20% in the wavelength range.

[0331] In Table 3, T(MIN) is the minimum transmittance confirmed in the wavelength range of 600 nm to 900 nm. T(AVG) is the average transmittance in the wavelength range of 600 nm to 900 nm.

[0332] [Table 3]

[0333]

Claims

1. A composition comprising: A first compound represented by Formula 1: in R 111 To R 117 and R 121 To R 127 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl, wherein in Formula 1, R 111 To R 117 and R 121 To R 127 at least one of which is the alkyl group, the alkoxy group, the alkoxyalkyl group, the alkylcarbonyl group, the alkoxycarbonyl group, the alkoxyalkylcarbonyl group, or the alkylsulfonyl group; The second compound represented by Formula 2: in R 211 To R 213 and R 221 To R 223 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, or alkylsulfonyl, wherein in Formula 2, R 211 To R 213 and R 221 To R 223 At least one of them is the alkyl group, the alkoxy group, the alkoxyalkyl group, the alkylcarbonyl group, the alkoxycarbonyl group, the alkoxyalkylcarbonyl group, or the alkylsulfonyl group, and A1, B1, A2 and B2 are each independently a benzene structure or do not exist; and A third compound represented by Formula 3: in R3 is hydrogen or halogen; R 311 , R 312 , R 321 and R 323 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl; R 313 and R 314 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl, or are linked to each other to form a benzene structure; R 323 and R 324 are each independently hydrogen, alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl, alkylsulfonyl or aryl, or are linked to each other to form a benzene structure; In formula 3, R 311 To R 314 and R 321 To R 324 At least one of them is alkyl, alkoxy, alkoxyalkyl, alkylcarbonyl, alkoxycarbonyl, alkoxyalkylcarbonyl or alkylsulfonyl, or includes Z, wherein Z is a heteroatom, Where the sum of A, B and C is 30 or more and the standard deviation of A, B and C is 15 or less, where A, B and C are defined as follows: A: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 1; B: the sum of the carbon numbers of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 2; and C: the total number of carbon atoms of the alkyl group, the alkyl group of the alkoxy group, the alkyl group of the alkoxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkoxycarbonyl group, the alkyl group of the alkoxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group in Formula 3.

2. The composition according to claim 1, wherein the average value of A, B and C is in the range of 8 to 35.

3. The composition according to claim 1, wherein the ratio of A to B A / B is in the range of 0.1 to 10, the ratio of B to C B / C is in the range of 0.1 to 10, and the ratio of A to C A / C is in the range of 0.5 to 15.

4. The composition according to claim 1, wherein in Formula 1, R 111 To R 117 and R 121 To R 127 At least one of them is the alkoxy group, the alkoxyalkyl group, the alkylcarbonyl group, the alkoxycarbonyl group, the alkoxyalkylcarbonyl group, or the alkylsulfonyl group; In formula 2, R 211 To R 213 and R 221 To R 223 are each independently hydrogen, the alkyl group, the alkoxy group, or the alkoxyalkyl group, wherein R 211 To R 213 and R 221 To R 223 At least one of them is the alkyl, the alkoxy, or the alkoxyalkyl; and In Formula 3, Z is oxygen and R 311 , R 312 , R 321 and R 322 are each independently hydrogen, the alkyl group, or the aryl group, wherein R 311 , R 312 , R 321 and R 322 At least one of them is the alkyl group. The composition according to claim 4 , wherein A1 or B1 forms a benzene structure and A2 or B2 forms a benzene structure.

6. The composition of claim 5, wherein the other of A1 and B1 is absent and the other of A2 and B2 is absent.

7. The composition according to claim 4, wherein R in Formula 3 313 and R 314 are connected to each other to form a benzene structure, and R 323 and R 324 Linked together to form the benzene structure.

8. The composition according to claim 4, wherein R 311 , R 312 , R 321 and R 323 At least one of them is a branched alkyl group.

9. A resin composition, comprising: A resin component; and a composition according to any one of claims 1 to 8. 10 . The resin composition according to claim 9 , further comprising a solvent.

11. A resin film, comprising: a resin component; and A composition according to any one of claims 1 to 8. 12 . The resin film according to claim 11 , wherein the resin film shows an absorption band having a bandwidth of 60 nm or more in a wavelength range of 600 nm to 900 nm. 13 . The resin film according to claim 12 , wherein the T50% onset wavelength is in the range of 600 nm to 800 nm. The resin film according to claim 12 , wherein a T50% cutoff wavelength is within a range of 700 nm to 900 nm.

15. A resin film according to claim 11, wherein the resin component includes at least one or more selected from the following group: cycloolefin (COP) based resins, polyester resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyparaphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins and silicone resins.

16. An optical filter, comprising: substrate; and The resin film according to claim 11 is formed on one side or both sides of the substrate.

17. The optical filter of claim 16, further comprising: A dielectric film in which the shortest wavelength exhibiting a reflectivity of 50% within a wavelength range of 600 nm to 900 nm is 710 nm or longer or does not exist.

18. A solid-state image capture device comprising the filter according to claim 16. 19 . An infrared sensor comprising the resin film according to claim 11 .

Citation Information

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  • Near-infrared cut filter and solid-state imaging device

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