Near space heat sink thermal simulation test device

Abstract

The invention relates to the technical field of test equipment, in particular to a near space heat sink thermal simulation test device, which comprises a low air pressure simulation unit, a tested heat sink unit, a thermal simulation electric control unit and a sensor unit, and is characterized in that the low air pressure simulation unit comprises a vacuum pump, a vacuum buffer tank, a regulating valve and a check valve; the tested heat sink unit comprises an evaporator, a self-locking valve, a filter, an electromagnetic valve and a throttling valve; the thermal simulation electric control unit is arranged in the cabinet and comprises a display, an industrial personal computer, input equipment, a data acquisition unit and a power supply; the sensor unit comprises a film heater, a temperature sensor, a pressure sensor and a vacuum gauge. The performance of the refrigeration equipment is tested mainly under the near space low-pressure environment condition, the effective volume of the tail end of the heat sink is increased by arranging the vacuum buffer tank, the influence of rapid change of vacuum pressure caused by opening and closing of an electromagnetic valve in the testing process is reduced, and the stability of a testing system is improved.

Description

Technical Field

[0001] The present application relates to the technical field of testing equipment, and in particular to a near-space heat sink thermal simulation test device. Background Art

[0002] When a spacecraft is flying at high speed in near-space, aerodynamic heating will cause the inner and outer walls of the spacecraft to be in a high temperature state. Under such harsh conditions, the electronic instruments or equipment in the cabin will heat up rapidly due to their own heat, so corresponding cooling devices are required to control the temperature of the instruments and equipment in the cabin.

[0003] Generally, evaporative refrigeration equipment is used to control the temperature. However, evaporative refrigeration equipment is very sensitive to pressure changes in the external space. Therefore, testing equipment that simulates the pressure conditions in the adjacent space is needed to verify or evaluate the refrigeration performance of the refrigeration equipment. Currently, there is no similar test device that can simulate the low-pressure environment in the adjacent space to realize the performance test of evaporative refrigeration equipment. Summary of the invention

[0004] The present application provides a near-space heat sink thermal simulation test device, which controls and tests the heat resistance of a consumable heat sink under low-pressure conditions by simulating the low-pressure environmental conditions of near-space.

[0005] In order to achieve the above-mentioned purpose, the present application provides a near-space heat sink thermal simulation test device, including a low-pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: the low-pressure simulation unit includes a vacuum pump, a vacuum buffer tank, a regulating valve and a check valve, and the vacuum pump, the regulating valve and the check valve are all connected to the vacuum buffer tank through a connecting pipe and a vacuum docking flange; the heat sink unit to be tested includes an evaporator, a self-locking valve, a filter, a solenoid valve and a throttle valve, one end of the evaporator is connected to the check valve, and the other end is connected to the throttle valve; the throttle valve is connected to the solenoid valve through a connecting pipe; the solenoid valve is connected to the filter through a connecting pipe; the filter is connected to the self-locking valve through a connecting pipe; the thermal simulation electronic control unit is arranged inside the cabinet, including a display The display is electrically connected to the industrial computer; the input device is electrically connected to the industrial computer; the data acquisition unit is electrically connected to the industrial computer; the power supply establishes a communication connection with the industrial computer on the one hand, and is electrically connected to the self-locking valve and the solenoid valve on the other hand; the sensor unit includes a film heater, a temperature sensor, a pressure sensor and a vacuum gauge, the film heater is arranged inside the evaporator and is electrically connected to the power supply; the temperature sensor is arranged on the evaporator and is connected to the data acquisition unit; the pressure sensors are respectively arranged on the pipeline connecting the self-locking valve and the check valve, and are all connected to the data acquisition unit; the vacuum gauge is arranged on the vacuum buffer tank through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit.

[0006] Furthermore, it also includes a first diaphragm valve and a second diaphragm valve, wherein: the first diaphragm valve is arranged on the connecting pipeline between the vacuum pump and the vacuum buffer tank; the connecting pipeline between the vacuum pump and the first diaphragm valve is a bellows; the second diaphragm valve is arranged on the connecting pipeline between the check valve and the vacuum buffer tank.

[0007] Furthermore, a vacuum sealing ring is provided between the end cover of the vacuum buffer tank and the tank body.

[0008] Furthermore, the power supply includes a self-locking valve power supply, a heater power supply and a solenoid valve power supply, wherein: the self-locking valve power supply is electrically connected to the self-locking valve, and is connected to the industrial computer through a communication module; the heater power supply is electrically connected to the film heater, and is connected to the industrial computer through a communication module; the solenoid valve power supply is electrically connected to the solenoid valve, and is connected to the industrial computer through a communication module.

[0009] Furthermore, it also includes a heater power meter, which is arranged inside the cabinet and connected to the data acquisition unit.

[0010] Furthermore, the vacuum pump, the regulating valve, the vacuum gauge and the check valve are respectively connected to the vacuum buffer tank in a side-by-side manner.

[0011] Furthermore, one or more thin film heaters and temperature sensors are provided; and two or more pressure sensors are provided.

[0012] The present application provides a near-space heat sink thermal simulation test device, which has the following beneficial effects:

[0013] This application mainly simulates the performance test of refrigeration equipment under the low-pressure environment conditions of near space. By setting a vacuum buffer tank, the effective volume of the heat sink end is increased, and the impact of the rapid changes in vacuum pressure caused by the opening and closing of the solenoid valve during the test is reduced, thereby improving the stability of the test system. Computer intelligent control methods are used to achieve precise temperature control of the heat sink and precise measurement of the cooling capacity, while realizing data collection, analysis, processing, heat sink pressure monitoring and other functions, thereby improving the control accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0015] Figure 1 is a schematic diagram of a near-space heat sink thermal simulation test device provided according to an embodiment of the present application;

[0016] Figure 2It is a schematic diagram of the internal control principle of a cabinet of a near-space heat sink thermal simulation test device provided in an embodiment of the present application;

[0017] In the figure: 1-vacuum pump, 2-vacuum buffer tank, 3-regulating valve, 4-check valve, 5-evaporator, 6-self-locking valve, 7-filter, 8-solenoid valve, 9-throttle valve, 10-cabinet, 11-display, 12-industrial computer, 13-input device, 14-data acquisition unit, 15-self-locking valve power supply, 16-heater power supply, 17-solenoid valve power supply, 18-thin film heater, 19-temperature sensor, 20-pressure sensor, 21-vacuum gauge, 22-first diaphragm valve, 23-second diaphragm valve, 24-vacuum sealing ring, 25-heater power meter. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0020] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0021] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0022] In addition, the term "plurality" shall mean two or more.

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] like Figure 1-2 As shown, the present application provides a near-space heat sink thermal simulation test device, including a low-pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: the low-pressure simulation unit includes a vacuum pump 1, a vacuum buffer tank 2, a regulating valve 3 and a check valve 4, and the vacuum pump 1, the regulating valve 3 and the check valve 4 are all connected to the vacuum buffer tank 2 through a connecting pipe and a vacuum docking flange; the heat sink unit to be tested includes an evaporator 5, a self-locking valve 6, a filter 7, a solenoid valve 8 and a throttle valve 9, one end of the evaporator 5 is connected to the check valve 4, and the other end is connected to the throttle valve 9; the throttle valve 9 is connected to the solenoid valve 8 through a connecting pipe; the solenoid valve 8 is connected to the filter 7 through a connecting pipe; the filter 7 is connected to the self-locking valve 6 through a connecting pipe; the thermal simulation electronic control unit is arranged inside the cabinet 10, and includes a display 11, an industrial computer 12, and an input device 13. , a data acquisition unit 14 and a power supply, the display 11 is electrically connected to the industrial computer 12; the input device 13 is electrically connected to the industrial computer 12; the data acquisition unit 14 is electrically connected to the industrial computer 12; the power supply establishes a communication connection with the industrial computer 12 on the one hand, and is electrically connected to the self-locking valve 6 and the solenoid valve 8 on the other hand; the sensor unit includes a film heater 18, a temperature sensor 19, a pressure sensor 20 and a vacuum gauge 21, the film heater 18 is arranged inside the evaporator 5 and is electrically connected to the power supply; the temperature sensor 19 is arranged on the evaporator 5 and is connected to the data acquisition unit 14; the pressure sensor 20 is respectively arranged on the pipeline connecting the self-locking valve 6 and the pipeline connecting the check valve 4, and both are connected to the data acquisition unit 14; the vacuum gauge 21 is arranged on the vacuum buffer tank 2 through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit 14.

[0025] Specifically, the near-space heat sink thermal simulation test device provided in the embodiment of the present application integrates low-pressure condition simulation, heat sink control, cold capacity measurement and pressure measurement, and realizes the test of the performance of evaporative refrigeration equipment under the condition of near-space low-pressure environment. Among them, the low-pressure simulation unit is used to simulate the low-pressure state of the near-space, control the evaporation temperature of the refrigerant in the evaporator 5 (heat sink), and ensure that the evaporator 5 (heat sink) is at an appropriate temperature; the heat sink unit to be tested is preferably the evaporator 5 and the refrigerant inside it in the embodiment of the present application, and the self-locking valve 6 is used to seal and prevent refrigerant leakage before the heat sink works; the solenoid valve 8 is used to control the refrigerant flow; the throttle valve 9 is used for refrigerant throttling refrigeration; the thermal simulation electronic control unit is used to control the opening and closing of each valve of the evaporator 5 (heat sink) to be tested, and at the same time, the cold and heat balance method is used to measure the refrigeration performance of the heat sink; the sensor unit is mainly used to collect data parameters at each position.

[0026] More specifically, the low-pressure simulation unit evacuates the connecting pipeline through the vacuum pump 1; the regulating valve 3 controls the entire connecting pipeline to be in a low-pressure state in the adjacent space through switch operation; the vacuum buffer tank 2 prevents the impact of refrigerant evaporation in the evaporator 5 and controls the air pressure fluctuation of the connecting pipeline within a reasonable range; the vacuum gauge 21 is used for air pressure monitoring; the check valve 4 prevents air from flowing back to the evaporator 5 during the test termination period; and the thermal simulation electronic control unit collects the temperature sensor 19 signal, the vacuum gauge 21 signal and the pressure sensor 20 signal through the data acquisition unit 14, and uploads them to the controller inside the industrial computer 12 for data processing, and displays them through the display 11. Subsequently, the industrial computer 12 controls the power supply output through the input device 13 keyboard and mouse according to the uploaded signal, thereby realizing the control of each valve, thereby completing the control of the evaporator 5 of the refrigeration equipment under test and the thermal performance test; when the temperature is stable, the heating amount is equal to the cooling amount.

[0027] Furthermore, it also includes a first diaphragm valve 22 and a second diaphragm valve 23, wherein: the first diaphragm valve 22 is arranged on the connecting pipeline between the vacuum pump 1 and the vacuum buffer tank 2; the connecting pipeline between the vacuum pump 1 and the first diaphragm valve 22 is a bellows; the second diaphragm valve 23 is arranged on the connecting pipeline between the check valve 4 and the vacuum buffer tank 2. The first diaphragm valve 22 and the second diaphragm valve 23 are both vacuum sealing valves, and two diaphragm valves are provided to enable segmented vacuuming of the pipeline. The use of a bellows in the connecting pipeline can reduce vibration, so that the influence of the vibration of the vacuum pump 1 on the sealing performance is minimized.

[0028] Furthermore, a vacuum sealing ring 24 is provided between the end cover and the tank body of the vacuum buffer tank 2. The vacuum sealing ring 24 is provided mainly to enhance the sealing effect of the vacuum buffer tank 2.

[0029] Furthermore, the power supply includes a self-latching valve power supply 15, a heater power supply 16 and a solenoid valve power supply 17, wherein: the self-latching valve power supply 15 is electrically connected to the self-latching valve 6, and is connected to the industrial computer 12 through a communication module; the heater power supply 16 is electrically connected to the film heater 18, and is connected to the industrial computer 12 through a communication module; the solenoid valve power supply 17 is electrically connected to the solenoid valve 8, and is connected to the industrial computer 12 through a communication module. The power supply is mainly used to supply power to each valve, and is controlled by the industrial computer 12 as a whole. According to the control instructions of the industrial computer 12, the self-latching valve 6, the film heater 18 and the solenoid valve 8 are opened and closed.

[0030] Furthermore, a heater power meter 25 is included, which is disposed inside the cabinet 10 and connected to the data acquisition unit 14. The heater power meter 25 is used to measure the thermal power of the film heater 18 and display the thermal power consumption of the film heater 18.

[0031] Furthermore, the vacuum pump 1, the regulating valve 3, the vacuum gauge 21 and the check valve 4 are respectively connected to the vacuum buffer tank 2 in a side-by-side manner. The vacuum pump 1, the regulating valve 3, the vacuum gauge 21 and the check valve 4 all directly control the vacuum buffer tank 2 and are installed side by side to prevent mutual influence.

[0032] Furthermore, one or more thin film heaters 18 and temperature sensors 19 are provided; and two or more pressure sensors 20 are provided.

[0033] Specifically, the embodiment of the present application mainly provides a performance test for the evaporator 5 (or cold plate, etc.) in a near-space low-pressure environment. First, during the test, the pressure of the vacuum buffer tank 2 is modulated to the near-space pressure; the combination of the vacuum pump 1, the first diaphragm valve 22, and the vacuum gauge 21 can achieve more accurate low-pressure control of the vacuum buffer tank 2, and the regulating valve 3 is used for more precise low-pressure control; then, the heat sink device is turned on, in which the evaporator 5 and the auxiliary valves are connected to the test equipment, and the refrigerant (liquid) passes through the self-locking valve 6, the filter 7, the solenoid valve 8, and the throttle valve 9 in turn, and then evaporates and cools in the evaporator 5. The temperature of the evaporator 5 decreases, and the low-pressure refrigerant gas enters the vacuum buffer tank 2 through the check valve 4 and the second diaphragm valve 23, and then passes through the heat sink 21. The refrigerant gas is sucked out by the vacuum pump 1 through the first diaphragm valve 22; then, the thermal simulation test device test system is turned on, the film heater 18 is powered, the temperature, pressure and vacuum degree of the evaporator 5 are measured, and the power supply current and voltage of the film heater 18 are measured; since the refrigerant gas enters the vacuum buffer tank 2, it is necessary to readjust the pressure of the vacuum buffer tank 2 to achieve the rebalancing of the system pipeline pressure. At this time, the temperature will also reach stability, and the heating amount is equal to the cooling amount; finally, the signals of the entire process are collected, stored and displayed by the industrial computer 12, and the performance of the heat sink is analyzed based on the collected data.

[0034] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A near-space heat sink thermal simulation test device, characterized in that: It includes a low pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: The low pressure simulation unit comprises a vacuum pump, a vacuum buffer tank, a regulating valve and a check valve, and the vacuum pump, the regulating valve and the check valve are all connected to the vacuum buffer tank through a connecting pipeline and a vacuum docking flange; The heat sink unit under test includes an evaporator, a self-locking valve, a filter, a solenoid valve and a throttle valve, one end of the evaporator is connected to the check valve, and the other end is connected to the throttle valve; the throttle valve is connected to the solenoid valve through a connecting pipeline; the solenoid valve is connected to the filter through a connecting pipeline; the filter is connected to the self-locking valve through a connecting pipeline; The thermal simulation electronic control unit is arranged inside the cabinet, and includes a display, an industrial computer, an input device, a data acquisition unit and a power supply. The display is electrically connected to the industrial computer; the input device is electrically connected to the industrial computer; the data acquisition unit is electrically connected to the industrial computer; the power supply is connected to the industrial computer for communication on the one hand, and is electrically connected to the self-locking valve and the solenoid valve on the other hand; The sensor unit includes a thin film heater, a temperature sensor, a pressure sensor and a vacuum gauge. The thin film heater is arranged inside the evaporator and is electrically connected to the power supply; the temperature sensor is arranged on the evaporator and is connected to the data acquisition unit; the pressure sensors are respectively arranged on the pipeline connecting the self-locking valve and the pipeline connecting the check valve, and are both connected to the data acquisition unit; the vacuum gauge is arranged on the vacuum buffer tank through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit.

2. The near-space heat sink thermal simulation test device according to claim 1, characterized in that: Also included are a first diaphragm valve and a second diaphragm valve, wherein: The first diaphragm valve is arranged on the connecting pipeline between the vacuum pump and the vacuum buffer tank; The connecting pipeline between the vacuum pump and the first diaphragm valve is a bellows; The second diaphragm valve is arranged on the connecting pipeline between the check valve and the vacuum buffer tank.

3. The near-space heat sink thermal simulation test device according to claim 2, characterized in that: A vacuum sealing ring is arranged between the end cover of the vacuum buffer tank and the tank body.

4. The near-space heat sink thermal simulation test device according to claim 3, characterized in that: The power supply includes a self-locking valve power supply, a heater power supply and a solenoid valve power supply, wherein: The self-latching valve power supply is electrically connected to the self-latching valve, and is connected to the industrial computer through a communication module; The heater power supply is electrically connected to the film heater and is connected to the industrial computer via a communication module; The solenoid valve power supply is electrically connected to the solenoid valve, and is connected to the industrial computer via a communication module.

5. The near-space heat sink thermal simulation test device according to claim 4, characterized in that: It also includes a heater power meter, which is arranged inside the cabinet and connected to the data acquisition unit.

6. The near-space heat sink thermal simulation test device according to claim 1, characterized in that: The vacuum pump, the regulating valve, the vacuum gauge and the check valve are respectively connected to the vacuum buffer tank in a side-by-side manner.

7. The near-space heat sink thermal simulation test device according to claim 5, characterized in that: One or more thin film heaters and temperature sensors are provided; and two or more pressure sensors are provided.

Images