Near space heat sink thermal simulation test device

Abstract

The application relates to the technical field of test equipment, in particular to a near-space heat sink thermal simulation test device, which comprises a low-pressure simulation unit, a measured heat sink unit, a thermal simulation electric control unit and a sensor unit, wherein the low-pressure simulation unit comprises a vacuum pump, a vacuum buffer tank, an adjusting valve and a check valve; the measured heat sink unit comprises an evaporator, a self-locking valve, a filter, an electromagnetic valve and a throttle valve; the thermal simulation electric control unit is arranged in a cabinet and comprises a display, an industrial computer, an input device, a data acquisition unit and a power supply; and the sensor unit comprises a thin film heater, a temperature sensor, a pressure sensor and a vacuum gauge. The application mainly simulates the low-pressure environment in the near space to test the performance of refrigeration equipment, the vacuum buffer tank is arranged to increase the effective volume of the heat sink tail end, reduce the influence of the sharp change of vacuum pressure caused by the opening and closing of the electromagnetic valve in the test process, and improve the stability of the test system.

Description

Technical Field

[0001] The present application relates to the technical field of testing equipment, and in particular to a near-space heat sink thermal simulation test device. Background Art

[0002] When an aircraft flies at high speed in near-space, aerodynamic heating will cause the inner and outer walls of the aircraft to be in a high-temperature state. Under such harsh conditions, the electronic instruments or equipment in the cabin will heat up rapidly due to their own heat, so corresponding cooling devices are required to control the temperature of the instruments and equipment in the cabin.

[0003] Evaporative cooling equipment is generally used for temperature control. However, evaporative cooling equipment is very sensitive to pressure changes in the external space. Therefore, testing equipment that simulates the pressure conditions in the adjacent space is needed to verify or evaluate the cooling performance of the cooling equipment. Currently, there is no similar test device that can simulate the low-pressure environment in the adjacent space to realize the performance test of evaporative cooling equipment. Summary of the Invention

[0004] The present application provides a near-space heat sink thermal simulation test device, which controls and tests the heat resistance of a consumable heat sink under low-pressure conditions by simulating the low-pressure environmental conditions of near-space.

[0005] In order to achieve the above-mentioned purpose, the present application provides a near-space heat sink thermal simulation test device, including a low-pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: the low-pressure simulation unit includes a vacuum pump, a vacuum buffer tank, a regulating valve and a check valve, and the vacuum pump, the regulating valve and the check valve are all connected to the vacuum buffer tank through a connecting pipe and a vacuum docking flange; the heat sink unit to be tested includes an evaporator, a self-locking valve, a filter, a solenoid valve and a throttle valve, one end of the evaporator is connected to the check valve, and the other end is connected to the throttle valve; the throttle valve is connected to the solenoid valve through a connecting pipe; the solenoid valve is connected to the filter through a connecting pipe; the filter is connected to the self-locking valve through a connecting pipe; the thermal simulation electronic control unit is arranged inside the cabinet, including a display The device, industrial computer, input device, data acquisition unit and power supply are electrically connected to the display and the industrial computer; the input device is electrically connected to the industrial computer; the data acquisition unit is electrically connected to the industrial computer; the power supply establishes a communication connection with the industrial computer on the one hand, and is electrically connected to the self-locking valve and the solenoid valve on the other hand; the sensor unit includes a thin film heater, a temperature sensor, a pressure sensor and a vacuum gauge, the thin film heater is arranged inside the evaporator and is electrically connected to the power supply; the temperature sensor is arranged on the evaporator and is connected to the data acquisition unit; the pressure sensors are respectively arranged on the pipeline connecting the self-locking valve and the check valve, and are both connected to the data acquisition unit; the vacuum gauge is arranged on the vacuum buffer tank through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit.

[0006] Furthermore, it also includes a first diaphragm valve and a second diaphragm valve, wherein: the first diaphragm valve is arranged on the connecting pipeline between the vacuum pump and the vacuum buffer tank; the connecting pipeline between the vacuum pump and the first diaphragm valve is a bellows; the second diaphragm valve is arranged on the connecting pipeline between the check valve and the vacuum buffer tank.

[0007] Furthermore, a vacuum sealing ring is provided between the end cover of the vacuum buffer tank and the tank body.

[0008] Furthermore, the power supply includes a self-locking valve power supply, a heater power supply and a solenoid valve power supply, wherein: the self-locking valve power supply is electrically connected to the self-locking valve, and is connected to the industrial computer through a communication module; the heater power supply is electrically connected to the film heater, and is connected to the industrial computer through a communication module; the solenoid valve power supply is electrically connected to the solenoid valve, and is connected to the industrial computer through a communication module.

[0009] Furthermore, it also includes a heater power meter, which is arranged inside the cabinet and connected to the data acquisition unit.

[0010] Furthermore, the vacuum pump, the regulating valve, the vacuum gauge and the check valve are respectively connected to the vacuum buffer tank in a side-by-side manner.

[0011] Furthermore, one or more thin film heaters and temperature sensors are provided; and two or more pressure sensors are provided.

[0012] The present application provides a near-space heat sink thermal simulation test device with the following beneficial effects:

[0013] This application mainly simulates the performance test of refrigeration equipment under the low-pressure environment conditions of near space. By setting up a vacuum buffer tank, the effective volume of the heat sink end is increased, and the impact of the rapid changes in vacuum pressure caused by the opening and closing of the solenoid valve during the test is reduced, thereby improving the stability of the test system; a computer intelligent control method is adopted to achieve precise temperature control of the heat sink and precise measurement of the cooling capacity, while realizing data collection, analysis, processing, heat sink pressure monitoring and other functions, thereby improving the control accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings that constitute part of this application are used to provide a further understanding of this application and make other features, objects and advantages of this application more apparent. The illustrative embodiment drawings of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application. In the drawings:

[0015] Figure 1 is a schematic diagram of a near-space heat sink thermal simulation test device provided according to an embodiment of the present application;

[0016] Figure 2This is a schematic diagram of the internal control principle of a cabinet of a near-space heat sink thermal simulation test device provided in accordance with an embodiment of the present application;

[0017] In the figure: 1-vacuum pump, 2-vacuum buffer tank, 3-regulating valve, 4-check valve, 5-evaporator, 6-locking valve, 7-filter, 8-solenoid valve, 9-throttle valve, 10-cabinet, 11-display, 12-industrial computer, 13-input device, 14-data acquisition unit, 15-locking valve power supply, 16-heater power supply, 17-solenoid valve power supply, 18-thin film heater, 19-temperature sensor, 20-pressure sensor, 21-vacuum gauge, 22-first diaphragm valve, 23-second diaphragm valve, 24-vacuum sealing ring, 25-heater power meter. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0020] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0021] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0022] Additionally, the term "plurality" shall mean two or more.

[0023] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] like Figure 1-2 As shown, the present application provides a near-space heat sink thermal simulation test device, including a low-pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: the low-pressure simulation unit includes a vacuum pump 1, a vacuum buffer tank 2, a regulating valve 3 and a check valve 4, and the vacuum pump 1, the regulating valve 3 and the check valve 4 are all connected to the vacuum buffer tank 2 through a connecting pipe and a vacuum docking flange; the heat sink unit to be tested includes an evaporator 5, a self-locking valve 6, a filter 7, a solenoid valve 8 and a throttle valve 9, one end of the evaporator 5 is connected to the check valve 4, and the other end is connected to the throttle valve 9; the throttle valve 9 is connected to the solenoid valve 8 through a connecting pipe; the solenoid valve 8 is connected to the filter 7 through a connecting pipe; the filter 7 is connected to the self-locking valve 6 through a connecting pipe; the thermal simulation electronic control unit is arranged inside the cabinet 10, and includes a display 11, an industrial computer 12, and an input device 13 , data acquisition unit 14 and power supply, the display 11 is electrically connected to the industrial computer 12; the input device 13 is electrically connected to the industrial computer 12; the data acquisition unit 14 is electrically connected to the industrial computer 12; the power supply establishes a communication connection with the industrial computer 12 on the one hand, and is electrically connected to the self-locking valve 6 and the solenoid valve 8 on the other hand; the sensor unit includes a thin film heater 18, a temperature sensor 19, a pressure sensor 20 and a vacuum gauge 21, the thin film heater 18 is arranged inside the evaporator 5 and is electrically connected to the power supply; the temperature sensor 19 is arranged on the evaporator 5 and is connected to the data acquisition unit 14; the pressure sensors 20 are respectively arranged on the pipeline connecting to the self-locking valve 6 and the pipeline connecting to the check valve 4, and are both connected to the data acquisition unit 14; the vacuum gauge 21 is arranged on the vacuum buffer tank 2 through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit 14.

[0025] Specifically, the near-space heat sink thermal simulation test device provided in the embodiment of the present application integrates low-pressure condition simulation, heat sink control, cooling capacity measurement, and pressure measurement, thereby realizing the performance test of evaporative refrigeration equipment under the conditions of a near-space low-pressure environment. Among them, the low-pressure simulation unit is used to simulate the low-pressure state of the near-space, control the evaporation temperature of the refrigerant in the evaporator 5 (heat sink), and ensure that the evaporator 5 (heat sink) is at an appropriate temperature; the heat sink unit to be tested is preferably the evaporator 5 and the refrigerant therein in the embodiment of the present application, and the self-locking valve 6 is used to seal and prevent refrigerant leakage before the heat sink works; the solenoid valve 8 is used to control the refrigerant flow; the throttle valve 9 is used for refrigerant throttling refrigeration; the thermal simulation electronic control unit is used to control the opening and closing of each valve of the evaporator 5 (heat sink) to be tested, and at the same time adopts the cold and heat balance method to measure the refrigeration performance of the heat sink; the sensor unit is mainly used to collect data parameters at each position.

[0026] More specifically, the low-pressure simulation unit evacuates the connecting pipeline through the vacuum pump 1; the regulating valve 3 controls the entire connecting pipeline to be in a low-pressure state in the adjacent space through switch operation; the vacuum buffer tank 2 prevents the impact of refrigerant evaporation in the evaporator 5 and controls the air pressure fluctuation of the connecting pipeline within a reasonable range; the vacuum gauge 21 is used for air pressure monitoring; the check valve 4 prevents air from flowing back to the evaporator 5 at the end of the test; and the thermal simulation electronic control unit collects the temperature sensor 19 signal, the vacuum gauge 21 signal and the pressure sensor 20 signal through the data acquisition unit 14, and uploads them to the controller inside the industrial computer 12 for data processing, and displays them through the display 11. Subsequently, the industrial computer 12 controls the power output through the input device 13 keyboard and mouse according to the uploaded signal, thereby realizing the control of each valve, thereby completing the control of the evaporator 5 of the refrigeration equipment under test and the thermal performance test; when the temperature stabilizes, the heating amount is equal to the cooling amount.

[0027] Furthermore, the system also includes a first diaphragm valve 22 and a second diaphragm valve 23. The first diaphragm valve 22 is provided in the connecting pipeline between the vacuum pump 1 and the vacuum buffer tank 2; the connecting pipeline between the vacuum pump 1 and the first diaphragm valve 22 is a bellows; the second diaphragm valve 23 is provided in the connecting pipeline between the check valve 4 and the vacuum buffer tank 2. Both the first and second diaphragm valves 22 and 23 are vacuum-sealing valves. The provision of two diaphragm valves enables segmented vacuuming of the pipeline. The use of bellows in the connecting pipeline reduces vibration, minimizing the impact of vacuum pump 1 vibration on sealing performance.

[0028] Furthermore, a vacuum sealing ring 24 is provided between the end cover and the tank body of the vacuum buffer tank 2. The vacuum sealing ring 24 is provided mainly to enhance the sealing effect of the vacuum buffer tank 2.

[0029] Furthermore, the power supply includes a latching valve power supply 15, a heater power supply 16, and a solenoid valve power supply 17. The latching valve power supply 15 is electrically connected to the latching valve 6 and is connected to the industrial computer 12 via a communication module. The heater power supply 16 is electrically connected to the thin film heater 18 and is connected to the industrial computer 12 via a communication module. The solenoid valve power supply 17 is electrically connected to the solenoid valve 8 and is connected to the industrial computer 12 via a communication module. The power supply is primarily used to power each valve and is controlled by the industrial computer 12. The latching valve 6, thin film heater 18, and solenoid valve 8 are opened and closed according to the control instructions of the industrial computer 12.

[0030] Furthermore, a heater power meter 25 is included. The heater power meter 25 is disposed inside the cabinet 10 and connected to the data acquisition unit 14. The heater power meter 25 is used to measure the thermal power of the thin film heater 18 and display the thermal power consumption of the thin film heater 18.

[0031] Furthermore, the vacuum pump 1, regulating valve 3, vacuum gauge 21, and check valve 4 are connected to the vacuum buffer tank 2 in a side-by-side manner. The vacuum pump 1, regulating valve 3, vacuum gauge 21, and check valve 4 all directly control the vacuum buffer tank 2 and are installed side by side to prevent mutual influence.

[0032] Furthermore, one or more thin film heaters 18 and temperature sensors 19 are provided; and two or more pressure sensors 20 are provided.

[0033] Specifically, the embodiment of the present application mainly provides a performance test for the evaporator 5 (or cold plate, etc.) in a near-space low-pressure environment. First, during the test, the pressure of the vacuum buffer tank 2 is modulated to the near-space pressure; the combination of the vacuum pump 1, the first diaphragm valve 22, and the vacuum gauge 21 can achieve more accurate low-pressure control of the vacuum buffer tank 2, and the regulating valve 3 is used for more precise low-pressure control; then, the heat sink device is turned on, in which the evaporator 5 and the auxiliary valves are connected to the test equipment, and the refrigerant (liquid) passes through the self-locking valve 6, the filter 7, the solenoid valve 8, and the throttle valve 9 in turn, and evaporates and cools in the evaporator 5. The temperature of the evaporator 5 decreases, and the low-pressure refrigerant gas enters the vacuum buffer tank 2 through the check valve 4 and the second diaphragm valve 23, and then passes through the heat sink. The refrigerant gas is sucked away and discharged by the vacuum pump 1 through the first diaphragm valve 22; then, the thermal simulation test device test system is turned on, the film heater 18 is powered, the temperature, pressure and vacuum degree of the evaporator 5 are measured, and the power supply current and voltage of the film heater 18 are measured; since refrigerant gas enters the vacuum buffer tank 2, the pressure of the vacuum buffer tank 2 needs to be readjusted to achieve rebalancing of the system pipeline pressure. At this time, the temperature will also reach stability, and the heating capacity is equal to the cooling capacity; finally, the signals of the entire process are collected, stored and displayed by the industrial computer 12, and the performance of the heat sink is analyzed based on the collected data.

[0034] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A near-space heat sink thermal simulation test device, characterized in that: It includes a low pressure simulation unit, a heat sink unit to be tested, a thermal simulation electronic control unit and a sensor unit, wherein: The low pressure simulation unit includes a vacuum pump, a vacuum buffer tank, a regulating valve and a check valve, and the vacuum pump, the regulating valve and the check valve are all connected to the vacuum buffer tank through a connecting pipe and a vacuum docking flange; The heat sink unit under test includes an evaporator, a self-locking valve, a filter, a solenoid valve and a throttle valve. One end of the evaporator is connected to the check valve, and the other end is connected to the throttle valve; the throttle valve is connected to the solenoid valve through a connecting pipe; the solenoid valve is connected to the filter through a connecting pipe; the filter is connected to the self-locking valve through a connecting pipe; The thermal simulation electronic control unit is arranged inside the cabinet, and includes a display, an industrial computer, an input device, a data acquisition unit, and a power supply. The display is electrically connected to the industrial computer; the input device is electrically connected to the industrial computer; the data acquisition unit is electrically connected to the industrial computer; the power supply is connected to the industrial computer on the one hand, and is electrically connected to the self-locking valve and the solenoid valve on the other hand. The sensor unit includes a thin film heater, a temperature sensor, a pressure sensor and a vacuum gauge. The thin film heater is arranged inside the evaporator and is electrically connected to the power supply; the temperature sensor is arranged on the evaporator and is connected to the data acquisition unit; the pressure sensors are respectively arranged on the pipeline connecting the self-locking valve and the pipeline connecting the check valve, and are both connected to the data acquisition unit; the vacuum gauge is arranged on the vacuum buffer tank through a connecting pipeline and a vacuum docking flange, and is connected to the data acquisition unit.

2. The near-space heat sink thermal simulation test device according to claim 1, characterized in that: Also included are a first diaphragm valve and a second diaphragm valve, wherein: The first diaphragm valve is arranged on the connecting pipeline between the vacuum pump and the vacuum buffer tank; The connecting pipe between the vacuum pump and the first diaphragm valve is a bellows; The second diaphragm valve is arranged on the connecting pipeline between the check valve and the vacuum buffer tank.

3. The near-space heat sink thermal simulation test device according to claim 2, characterized in that: A vacuum sealing ring is provided between the end cover and the tank body of the vacuum buffer tank.

4. The near-space heat sink thermal simulation test device according to claim 3, characterized in that: The power supply includes a self-locking valve power supply, a heater power supply and a solenoid valve power supply, wherein: The self-locking valve power supply is electrically connected to the self-locking valve and is connected to the industrial computer through a communication module; The heater power supply is electrically connected to the film heater and is connected to the industrial computer via a communication module; The solenoid valve power supply is electrically connected to the solenoid valve, and is connected to the industrial computer via a communication module.

5. The near-space heat sink thermal simulation test device according to claim 4, characterized in that: It also includes a heater power meter, which is arranged inside the cabinet and connected to the data acquisition unit.

6. The near-space heat sink thermal simulation test device according to claim 1, characterized in that: The vacuum pump, the regulating valve, the vacuum gauge and the check valve are respectively connected to the vacuum buffer tank in a side-by-side manner.

7. The near-space heat sink thermal simulation test device according to claim 5, characterized in that: One or more thin film heaters and temperature sensors are provided; two or more pressure sensors are provided.

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