Display panel

Abstract

The embodiment of the invention discloses a display panel, and the display panel comprises a first conductive layer which comprises a first electrode and a second electrode; the first light-emitting stacking layer is arranged on the first conductive layer and comprises a first color light-emitting part stacked with the first electrode and a first cushion layer part stacked with the second electrode; the second conductive layer is arranged on the first light-emitting stacking layer and comprises a third electrode stacked with the first cushion layer part; the second light-emitting stacking layer is arranged on the second conductive layer and comprises a second color light-emitting part stacked with the third electrode, and the common electrode is arranged on the second light-emitting stacking layer and electrically connected with the first color light-emitting part and the second color light-emitting part; the display panel further comprises a first through hole penetrating through the first cushion layer part and a first connecting electrode filling the first through hole, and the third electrode is electrically connected with the second electrode through the first connecting electrode. According to the display panel, the resolution ratio of the display panel is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel. Background Art

[0002] With the maturity and development of wearable consumer electronic technologies such as AR (Augmented Reality, abbreviated as AR) and VR (Virtual Reality, abbreviated as VR), the requirements for displays are getting higher and higher, especially in terms of the life, resolution and brightness of display products. For example, the resolution (PPI) is required to be greater than 2000PPI, the brightness is required to be greater than 3000nits, and the longer the life is required, the better. Traditional LCD or OLED displays cannot meet the requirements of AR and VR products for displays. Micro semiconductor light emitting diodes (uLED, micro LED) are considered to be the best display solution for AR and VR products. The most mainstream manufacturing method of micro semiconductor light emitting diode display panels is to transfer R, G, B monochrome micro LEDs to the driving substrate by mass transfer to assemble and manufacture full-color displays. However, it is very challenging to integrate millions or even tens of millions of micro LEDs with pixel driving circuit arrays. It becomes very difficult to ensure the stability and efficiency of the manufacturing process and the reliability of the transfer, and this method is difficult to achieve a micro LED display with higher resolution.

[0003] Therefore, the current micro LED display panels have the problem of difficulty in improving the resolution. Summary of the invention

[0004] The embodiments of the present application provide a display panel that can solve the problem that the resolution of current micro LED display panels is difficult to improve.

[0005] An embodiment of the present application provides a display panel, including:

[0006] substrate;

[0007] A first conductive layer is disposed on the substrate, wherein the first conductive layer includes a first electrode and a second electrode;

[0008] A first light-emitting stacked layer is disposed on the first conductive layer, wherein the first light-emitting stacked layer includes a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode;

[0009] A second conductive layer is disposed on the first light-emitting stacked layer, wherein the second conductive layer includes a third electrode stacked with the first pad layer;

[0010] A second light-emitting stacked layer is disposed on the second conductive layer, wherein the second light-emitting stacked layer includes a second color light-emitting portion stacked with the third electrode;

[0011] A common electrode, disposed on the second light-emitting stack layer and electrically connected to the first color light-emitting portion and the second color light-emitting portion;

[0012] The display panel further includes a first through hole penetrating the first pad layer portion, and a first connecting electrode filling the first through hole, and the third electrode is electrically connected to the second electrode through the first connecting electrode.

[0013] Optionally, in some embodiments of the present application, the first conductive layer further includes a fourth electrode, the first light-emitting stacked layer further includes a second pad layer portion, the second conductive layer further includes a fifth electrode, the second light-emitting stacked layer further includes a third pad layer portion, and the display panel further includes:

[0014] A third conductive layer, disposed between the second light-emitting stacked layer and the common electrode, the third conductive layer comprising a sixth electrode;

[0015] A third light-emitting stacked layer is disposed between the third conductive layer and the common electrode layer, and the third light-emitting stacked layer includes a third color light-emitting portion;

[0016] The fourth electrode, the second pad portion, the fifth electrode, the third pad portion, the sixth electrode and the third color light emitting portion are stacked, and the common electrode is also electrically connected to the third color light emitting portion;

[0017] The display panel further includes a second through hole penetrating the second pad layer portion and the third pad layer portion, and a second connecting electrode filling the second through hole, and the sixth electrode is electrically connected to the fourth electrode through the second connecting electrode.

[0018] Optionally, in some embodiments of the present application, the second through hole includes a first sub-through hole passing through the second pad layer portion and a second sub-through hole passing through the third pad layer portion, the second connecting electrode includes a first sub-connecting electrode filling the first sub-through hole and a second sub-connecting electrode filling the second sub-through hole, the first sub-connecting electrode is connected between the fifth electrode and the fourth electrode, and the second sub-connecting electrode is connected between the sixth electrode and the fifth electrode.

[0019] Optionally, in some embodiments of the present application, the method further includes:

[0020] a protective layer, disposed between the first color light-emitting portion, the second color light-emitting portion, the third color light-emitting portion and the common electrode, the protective layer comprising a first opening exposing the top of the first color light-emitting portion, a second opening exposing the top of the second color light-emitting portion, and a third opening exposing the top of the third color light-emitting portion;

[0021] The common electrode is connected to the first color light emitting portion, the second color light emitting portion, and the third color light emitting portion through the first opening, the second opening, and the third opening, respectively.

[0022] Optionally, in some embodiments of the present application, the second conductive layer further includes a seventh electrode, the second light-emitting stacked layer further includes a fourth pad portion, the third conductive layer further includes an eighth electrode and a ninth electrode, and the third light-emitting stacked layer further includes a fifth pad portion and a sixth pad portion;

[0023] The seventh electrode, the fourth pad portion, the eighth electrode and the fifth pad portion are stacked with the first color light emitting portion, and the ninth electrode and the sixth pad portion are stacked with the second color light emitting portion;

[0024] The common electrode covers the fifth pad portion, the sixth pad portion, and the third-color light-emitting portion.

[0025] Optionally, in some embodiments of the present application, the display panel further includes a protective layer, and the protective layer is disposed between the fifth pad portion, the sixth pad portion, the third color light-emitting portion, and the common electrode;

[0026] On the plane of the display panel, one end of the first color light emitting portion extends relative to the seventh electrode to form a first step, and one end of the second color light emitting portion extends relative to the ninth electrode to form a second step;

[0027] The protective layer includes a fourth opening at the first step exposing the top of the first color light-emitting portion, a fifth opening at the second step exposing the top of the second color light-emitting portion, and a sixth opening exposing the top of the third color light-emitting portion;

[0028] The common electrode is respectively connected to the first color light emitting portion, the second color light emitting portion, and the third color light emitting portion through the fourth opening, the fifth opening, and the sixth opening.

[0029] Optionally, in some embodiments of the present application, the film layer structure of the first light-emitting stacked layer includes a first epitaxial layer, a first light-emitting layer, and a second epitaxial layer sequentially stacked on the first conductive layer;

[0030] The film layer structure of the second light-emitting stacked layer includes a third epitaxial layer, a second light-emitting layer and a fourth epitaxial layer which are sequentially stacked on the second conductive layer;

[0031] The film layer structure of the third light-emitting stacked layer includes a fifth epitaxial layer, a third light-emitting stacked layer and a sixth epitaxial layer which are sequentially stacked on the third conductive layer.

[0032] Optionally, in some embodiments of the present application, the method further includes:

[0033] A second color filter layer, disposed between the first light-emitting stack layer and the second conductive layer;

[0034] A first bonding layer, disposed between the first light-emitting stack layer and the second color filter layer;

[0035] A third color filter layer is disposed between the second light-emitting stack layer and the third conductive layer;

[0036] A second bonding layer is disposed between the second light-emitting stack layer and the third color filter layer;

[0037] The second color filter layer and the first bonding layer have the same pattern as the second light-emitting stacked layer, and the third color filter layer and the second bonding layer have the same pattern as the third light-emitting stacked layer.

[0038] Optionally, in some embodiments of the present application, the light emitted by the first color light-emitting portion, the second color light-emitting portion, and the third color light-emitting portion are all emitted to a side of the common electrode away from the substrate.

[0039] Optionally, in some embodiments of the present application, the first color light emitting unit emits red light, the second color light emitting unit emits green light, and the third color light emitting unit emits blue light.

[0040] In an embodiment of the present application, a display panel is provided, comprising: a substrate; a first conductive layer, arranged on the substrate, the first conductive layer comprising a first electrode and a second electrode, a first light-emitting stacking layer, arranged on the first conductive layer, the first light-emitting stacking layer comprising a first color light-emitting portion stacked with the first electrode, and a first pad portion stacked with the second electrode; a second conductive layer, arranged on the first light-emitting stacking layer, the second conductive layer comprising a third electrode stacked with the first pad portion; a second light-emitting stacking layer, arranged on the second conductive layer, the second light-emitting stacking layer comprising a second color light-emitting portion stacked with the third electrode, a common electrode, arranged on the second light-emitting stacking layer, and electrically connected to the first color light-emitting portion and the second color light-emitting portion; wherein the display panel also comprises a first through hole penetrating the first pad portion, and a first connecting electrode filling the first through hole, and the third electrode is electrically connected to the second electrode via the first connecting electrode. In the present application, by setting a first through hole in the first pad layer portion and filling the first connecting electrode in the first through hole, the third electrode is electrically connected to the second electrode through the first connecting electrode, and the second electrode can be connected to the driving circuit on the substrate, so that the third electrode is electrically connected to the driving circuit. Since the first through hole passes through the first pad layer portion, that is, the first through hole is arranged inside the first pad layer portion, the first through hole and the first connecting electrode will not occupy the layout space of the display panel alone, thus saving the layout space and allowing more sub-pixels to be arranged, thereby greatly improving the resolution of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 A schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 1 of the present application;

[0043] Figure 2 A schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 1 of the present application;

[0044] Figure 3 A schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 2 of the present application;

[0045] Figure 4 A schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 2 of the present application;

[0046] Figure 5A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application;

[0047] Figure 6 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application;

[0048] Figure 7 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application;

[0049] Figure 8 A schematic diagram of a fourth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application;

[0050] Fig. 9 A schematic diagram of a fifth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 of the present application;

[0051] Fig.10 A schematic diagram of a sixth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 of the present application;

[0052] Fig.11 A schematic diagram of the seventh intermediate process of a method for manufacturing a display panel provided in Embodiment 3 of the present application;

[0053] Fig.12 A schematic diagram of a fifth intermediate process of a method for manufacturing a display panel provided in Embodiment 4 of the present application;

[0054] Fig.13 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel provided in Embodiment 4 of the present application. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0056] An embodiment of the present application provides a display panel, comprising: a substrate; a first conductive layer, arranged on the substrate, the first conductive layer comprising a first electrode and a second electrode, a first light-emitting stacking layer, arranged on the first conductive layer, the first light-emitting stacking layer comprising a first color light-emitting portion stacked with the first electrode, and a first pad portion stacked with the second electrode; a second conductive layer, arranged on the first light-emitting stacking layer, the second conductive layer comprising a third electrode stacked with the first pad portion; a second light-emitting stacking layer, arranged on the second conductive layer, the second light-emitting stacking layer comprising a second color light-emitting portion stacked with the third electrode, a common electrode, arranged on the second light-emitting stacking layer, and electrically connected to the first color light-emitting portion and the second color light-emitting portion; wherein the display panel also comprises a first through hole penetrating the first pad portion, and a first connecting electrode filling the first through hole, and the third electrode is electrically connected to the second electrode via the first connecting electrode.

[0057] It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0058] Embodiment 1

[0059] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 1 of the present application; Figure 2 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 1 of the present application.

[0060] The present application provides a display panel 100, which includes: a substrate 10, a first conductive layer 11, a first light-emitting stacked layer 12, a second conductive layer 15, a second light-emitting stacked layer 16, and a common electrode 22. The first conductive layer 11 is disposed on the substrate 10, and the first conductive layer 11 includes a first electrode 11-1 and a second electrode 11-2; the first light-emitting stacked layer 12 is disposed on the first conductive layer 11, and the first light-emitting stacked layer 12 includes a first color light-emitting portion 12A1 stacked with the first electrode 11-1, and a first pad portion 12B1 stacked with the second electrode 11-2; the second conductive layer 15 is disposed on the first light-emitting stacked layer 12, and the second conductive layer 15 includes a third electrode 15-3 stacked with the first pad portion 12B1; the second light-emitting stacked layer 16 includes a first color light-emitting portion 12A1 stacked with the first electrode 11-1, and a first pad portion 12B1 stacked with the second electrode 11-2; The stack 16 is arranged on the second conductive layer 15, and the second light-emitting stack layer 16 includes a second color light-emitting portion 16A2 stacked with the third electrode 15-3; the common electrode 22 is arranged on the second light-emitting stack layer 16, and is electrically connected to the first color light-emitting portion 12A1 and the second color light-emitting portion 16A2; wherein, the display panel 100 also includes a first through hole 31 passing through the first pad portion 12B1, and a first connecting electrode 41 filling the first through hole 31, and the third electrode 15-3 is electrically connected to the second electrode 11-2 through the first connecting electrode 41.

[0061] Specifically, the substrate 10 may include glass, quartz, silicon, an organic polymer or an organic-inorganic composite material, but is not limited thereto. In some exemplary embodiments, various structures such as drive wiring and drive circuits may also be provided on the substrate 10 to drive the corresponding color light-emitting portion to emit light. A drive device including a thin film transistor may also be provided on the substrate 10 to drive each epitaxial stack in an active matrix method. To this end, the substrate 10 may be provided as a printed circuit board or a composite substrate, and a printed circuit board or a composite substrate may be formed by forming a line portion and / or a drive device on glass, quartz, silicon, an organic polymer or an organic-inorganic composite material.

[0062] Specifically, the first conductive layer 11 may include a first sub-conductive layer 111 and a second sub-conductive layer 112. The first sub-conductive layer 111 may be a conductive layer formed on the substrate 10, and the second sub-conductive layer 112 may be a conductive layer bonded to the first sub-conductive layer 111. When the first sub-conductive layer 111 and the second sub-conductive layer 112 are bonded, the first sub-conductive layer 111 and the second sub-conductive layer 112 may be regarded as the same conductive layer.

[0063] Specifically, the film structure of the first conductive layer 11 may include a first sub-conductive layer 111 and a second sub-conductive layer 112. After patterning on the substrate 10, the first conductive layer 11 may include a first electrode 11-1, a second electrode 11-2, and a fourth electrode 11-4 described in subsequent embodiments distributed at different locations.

[0064] Specifically, in this embodiment, by setting a first through hole 31 in the first pad portion 12B1 and filling the first connecting electrode 41 in the first through hole 31, the third electrode 15-3 is electrically connected to the second electrode 11-2 through the first connecting electrode 41, and the second electrode 11-2 can be connected to the driving circuit on the substrate 10, so that the third electrode 15-3 is electrically connected to the driving circuit. Since the first through hole 31 passes through the first pad portion 12B1, that is, the first through hole 31 is arranged inside the first pad portion 12B1, the first through hole 31 and the first connecting electrode 41 will not occupy the layout space of the display panel separately, which saves the layout space and allows more sub-pixels to be arranged, thereby greatly improving the resolution of the display panel.

[0065] In some embodiments, the first conductive layer 11 further includes a fourth electrode 11-4, the first light-emitting stacked layer 12 further includes a second pad portion 12B2, the second conductive layer 15 further includes a fifth electrode 15-5, and the second light-emitting stacked layer 16 further includes a third pad portion 16B3; the display panel 100 further includes a third conductive layer 19 and a third light-emitting stacked layer 20; the third conductive layer 19 is disposed between the second light-emitting stacked layer 16 and the common electrode 22, and the third conductive layer 19 includes a sixth electrode 19-6; the third light-emitting stacked layer 20 is disposed between the third conductive layer 19 and the common electrode 22, and the third light-emitting stacked layer 20 includes a sixth electrode 19-6. The stack 20 includes a third color light-emitting portion 20A3; wherein the fourth electrode 11-4, the second pad portion 12B2, the fifth electrode 15-5, the third pad portion 16B3, the sixth electrode 19-6 and the third color light-emitting portion 20A3 are stacked, and the common electrode 22 is also electrically connected to the third color light-emitting portion 20A3; wherein the display panel 100 also includes a second through hole 32 passing through the second pad portion 12B2 and the third pad portion 16B3, and a second connecting electrode 42 filling the second through hole 32, and the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42.

[0066] Specifically, the display panel includes a first light-emitting stack layer 12, a second light-emitting stack layer 16 and a third light-emitting stack layer 20; the first light-emitting stack layer 12 includes a first color light-emitting portion 12A1, a first pad portion 12B1 and a second pad portion 12B2; the second light-emitting stack layer 16 includes a second color light-emitting portion 16A2 and a third pad portion 16B3; the third light-emitting stack layer 20 includes a third color light-emitting portion 20A3.

[0067] Specifically, the second color light emitting portion 16A2 is stacked on the first pad portion 12B1; the third pad portion 16B3 is stacked on the second pad portion 12B2, and the third color light emitting portion 20A3 is stacked on the third pad portion 16B3.

[0068] Specifically, the first color light-emitting portion 12A1 can be any one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion, the second color light-emitting portion 16A2 can be any one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion, and the third color light-emitting portion 20A3 can be any one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion, and the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, and the third color light-emitting portion 20A3 are light-emitting portions of different colors of light, that is, the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, and the third color light-emitting portion 20A3 emit light of different colors.

[0069] Specifically, the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42, and the fourth electrode 11-4 is connected to the driving circuit on the substrate 10, so that the sixth electrode 19-6 is electrically connected to the driving circuit on the substrate 10. Since the second through hole 32 passes through the second pad portion 12B2 and the third pad portion 16B3, that is, the second through hole 32 is arranged inside the second pad portion 12B2 and the third pad portion 16B3, the second through hole 32 and the second connecting electrode 42 will not occupy the layout space of the display panel alone, which saves the layout space and allows more sub-pixels to be arranged, thereby greatly improving the resolution of the display panel.

[0070] In some embodiments, Figure 2 As shown, the second through hole 32 includes a first sub-through hole 321 that passes through the second pad portion 12B2 and a second sub-through hole 322 that passes through the third pad portion 16B3, the second connecting electrode 42 includes a first sub-connecting electrode 421 that fills the first sub-through hole 321 and a second sub-connecting electrode 422 that fills the second sub-through hole 322, the first sub-connecting electrode 421 is connected between the fifth electrode 15-5 and the fourth electrode 11-4, and the second sub-connecting electrode 422 is connected between the sixth electrode 19-6 and the fifth electrode 15-5.

[0071] Specifically, Figure 2 As shown, the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42. The second connecting electrode 42 includes a first sub-connecting electrode 421 filling the first sub-through hole 321 and a second sub-connecting electrode 422 filling the second sub-through hole 322. The first sub-connecting electrode 421 is connected between the fifth electrode 15-5 and the fourth electrode 11-4, and the second sub-connecting electrode 422 is connected between the sixth electrode 19-6 and the fifth electrode 15-5.

[0072] Specifically, compared Figure 1 and Figure 2 As shown, in Figure 1In the figure, the second through hole 32 is an integral through hole that penetrates the second pad layer portion 12B2, the third pad layer portion 16B3 and the fifth electrode 15-5, that is, the first sub-through hole 321 and the second sub-through hole 322 are interconnected to form an integral second sub-through hole 322.

[0073] Specifically, compared Figure 1 and Figure 2 As shown, in Figure 2 In the embodiment, the second through hole 32 does not penetrate the fifth electrode 15 - 5 , which is equivalent to that the first sub-through hole 321 and the second sub-through hole 322 are not interconnected as a whole.

[0074] Specifically, Figure 1 and Figure 2 The second through hole 32 is a difference caused by different manufacturing processes of the display panel, but the beneficial effects of the above embodiments can be achieved.

[0075] In some embodiments, the display panel 100 also includes a protective layer 21, which is disposed between the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, the third color light-emitting portion 20A3 and the common electrode 22, and the protective layer 21 includes a first opening 51 exposing the top of the first color light-emitting portion 12A1, a second opening 52 exposing the top of the second color light-emitting portion 16A2, and a third opening 53 exposing the top of the third color light-emitting portion 20A3; the common electrode 22 is respectively connected to the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, and the third color light-emitting portion 20A3 through the first opening 51, the second opening 52, and the third opening 53.

[0076] Specifically, the top of the first color light-emitting portion 12A1, the top of the second color light-emitting portion 16A2 and the top of the third color light-emitting portion 20A3 respectively refer to the surfaces of the first color light-emitting portion 12A1, the second color light-emitting portion 16A2 and the third color light-emitting portion 20A3 away from the substrate 10.

[0077] Specifically, the protective layer 21 may be an insulating layer including one layer, two layers, or multiple layers. For example, the protective layer 21 may include a first sub-insulating layer and a second sub-insulating layer. The first sub-insulating layer may be atomic layer deposited, and the material of the first sub-insulating layer may include an Al2O3 / SiO2 / TiO2 stack. The second sub-insulating layer may be a dielectric protective layer, and the material of the second insulating layer may include silicon dioxide.

[0078] Specifically, the first light-emitting stack layer 12 is patterned to include a first color light-emitting portion 12A1, a first pad portion 12B1 and a second pad portion 12B2. The first color light-emitting portion 12A1, the first pad portion 12B1 and the second pad portion 12B2 are spaced apart from each other. A partition structure 71 or a partition gap may be provided between the first color light-emitting portion 12A1, the first pad portion 12B1 and the second pad portion 12B2. The protective layer 21 may fill the partition structure 71 or the partition gap between the first color light-emitting portion 12A1, the first pad portion 12B1 and the second pad portion 12B2.

[0079] Specifically, the common electrode 22 is connected to the first color light-emitting portion 12A1, the second color light-emitting portion 16A2 and the third color light-emitting portion 20A3 through the first opening 51, the second opening 52 and the third opening 53 respectively, so that the first color light-emitting portion 12A1 can emit light at a voltage between the first electrode 11-1 and the common electrode 22, the second color light-emitting portion 16A2 can emit light at a voltage between the third electrode 15-3 and the common electrode 22, and the third color light-emitting portion 20A3 can emit light at a voltage between the sixth electrode 19-6 and the common electrode 22.

[0080] In some embodiments, the film layer structure of the first light-emitting stack layer 12 includes a first epitaxial layer 121, a first light-emitting layer 122, and a second epitaxial layer 123 sequentially stacked on the first conductive layer 11; the film layer structure of the second light-emitting stack layer 16 includes a third epitaxial layer 161, a second light-emitting layer 162, and a fourth epitaxial layer 163 sequentially stacked on the second conductive layer 15; the film layer structure of the third light-emitting stack layer 20 includes a fifth epitaxial layer 201, a third light-emitting layer 202, and a sixth epitaxial layer 203 sequentially stacked on the third conductive layer 19.

[0081] Specifically, the first epitaxial layer 121 , the third epitaxial layer 161 and the fifth epitaxial layer 201 may be epitaxial layers of P-type materials; the second epitaxial layer 123 , the fourth epitaxial layer 163 and the sixth epitaxial layer 203 may be epitaxial layers of N-type materials.

[0082] Specifically, the first light-emitting layer 122 , the second light-emitting layer 162 , and the third light-emitting layer 202 may be quantum well light-emitting layers of corresponding colors.

[0083] Specifically, in some embodiments, when only the second conductive layer 15 is provided between the first light-emitting stack layer 12 and the second light-emitting stack layer 16, the second conductive layer 15 may be a film layer that plays a bonding role; when only the third conductive layer 19 is provided between the second light-emitting stack layer 16 and the third light-emitting stack layer 20, the third conductive layer 19 may be a film layer that plays a bonding role.

[0084] In some embodiments, the display panel 100 also includes a second color filter layer 14G, a first bonding layer 13, a third color filter layer 18B, and a second bonding layer 17; the second color filter layer 14G is disposed between the first light-emitting stack layer 12 and the second conductive layer 15; the first bonding layer 13 is disposed between the first light-emitting stack layer 12 and the second color filter layer 14G; the third color filter layer 18B is disposed between the second light-emitting stack layer 16 and the third conductive layer 19; the second bonding layer 17 is disposed between the second light-emitting stack layer 16 and the third color filter layer 18B, wherein the second color filter layer 14G and the first bonding layer 13 have the same pattern as the second light-emitting stack layer 16, and the third color filter layer 18B and the second bonding layer 17 have the same pattern as the third light-emitting stack layer 20.

[0085] Specifically, the second color filter layer 14G can absorb or reflect the light emitted from the second color light-emitting unit 16A2 toward the substrate 10, and the third color filter layer 18B can absorb or reflect the light emitted from the third color light-emitting unit 20A3 toward the substrate 10, thereby improving the light extraction efficiency of the second color light-emitting unit 16A2 and the third color light-emitting unit 20A3.

[0086] Specifically, when the second color light emitting portion 16A2 emits green light, the second color filter layer 14G can absorb or reflect the green light; when the third color light emitting portion 20A3 emits blue light, the third color filter layer 18B can absorb or reflect the blue light.

[0087] Specifically, since the second color filter layer 14G and the first bonding layer 13 are patterned with the second light-emitting stack layer 16 through the same process during the manufacturing process, the second color filter layer 14G and the first bonding layer 13 have the same pattern as the second light-emitting stack layer 16, the manufacturing process can be simplified.

[0088] Specifically, since the third color filter layer 18B and the second bonding layer 17 are patterned with the third light-emitting stack layer 20 through the same process during the manufacturing process, the third color filter layer 18B and the second bonding layer 17 have the same pattern as the third light-emitting stack layer 20, the manufacturing process can be simplified.

[0089] Specifically, in this implementation, the first bonding layer 13 and the second bonding layer 17 play a bonding role, and the first bonding layer 13 and the second bonding layer 17 may each include two sub-layers, and the two sub-layers are bonded together by bonding.

[0090] In some embodiments, the light emitted by the first color light emitting portion 12A1 , the second color light emitting portion 16A2 , and the third color light emitting portion 20A3 are all emitted to a side of the common electrode 22 away from the substrate 10 .

[0091] Specifically, the light emitting direction of the display panel 100 is the side of the common electrode 22 away from the substrate 10 .

[0092] Specifically, the functions of the first color light-emitting portion 12A1, the second color light-emitting portion 16A2 and the third color light-emitting portion 20A3 are to emit display light, the function of the first padding portion 12B1 is to carry and support the second color light-emitting portion 16A2 thereon, and the function of the second padding portion 12B2 and the third padding portion 16B3 is to carry and support the third color light-emitting portion 20A3 thereon.

[0093] Specifically, the first pad portion 12B1 , the second pad portion 12B2 , and the third pad portion 16B3 do not emit light.

[0094] In some embodiments, the first color light emitting portion 12A1 emits red light, the second color light emitting portion 16A2 emits green light, and the third color light emitting portion 20A3 emits blue light.

[0095] Embodiment 2

[0096] The display panel of this embodiment is the same or similar to any one of the above embodiments, and the similarities are not repeated here, and only the differences are introduced here.

[0097] See also Figure 3 and Figure 4 , Figure 3 A schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 2 of the present application; Figure 4 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 2 of the present application.

[0098] In some embodiments, the second conductive layer 15 also includes a seventh electrode 15-7, the second light-emitting stack layer 16 also includes a fourth pad portion 16B4, the third conductive layer 19 also includes an eighth electrode 19-8 and a ninth electrode 19-9, and the third light-emitting stack layer 20 also includes a fifth pad portion 20B5 and a sixth pad portion 20B6; the seventh electrode 15-7, the fourth pad portion 16B4, the eighth electrode 19-8 and the fifth pad portion 20B5 are stacked with the first color light-emitting portion 12A1, and the ninth electrode 19-9 and the sixth pad portion 20B6 are stacked with the second color light-emitting portion 16A2; the common electrode 22 covers the fifth pad portion 20B5, the sixth pad portion 20B6 and the third color light-emitting portion 20A3.

[0099] Specifically, compared Figure 1 and Figure 3 ,contrast Figure 2 and Figure 4 , it can be found Figure 3 and Figure 4In the embodiment, the seventh electrode 15-7, the fourth pad layer 16B4, the eighth electrode 19-8 and the fifth pad layer 20B5 are stacked with the first color light emitting portion 12A1, and the ninth electrode 19-9 and the sixth pad layer 20B6 are stacked with the second color light emitting portion 16A2; the common electrode 22 covers the fifth pad layer 20B5, the sixth pad layer 20B6 and the third color light emitting portion 20A3. This difference is caused by the difference in manufacturing process, and Figure 3 and Figure 4 The display panel 100 has the beneficial effects of the display panel 100 in any one of the above embodiments.

[0100] Specifically, the fourth pad portion 16B4 , the fifth pad portion 20B5 , and the sixth pad portion 20B6 do not emit display light.

[0101] In some embodiments, the display panel 100 also includes a protective layer 21, which is arranged between the fifth pad portion 20B5, the sixth pad portion 20B6, the third color light-emitting portion 20A3 and the common electrode 22; on the plane of the display panel 100, one end of the first color light-emitting portion 12A1 extends relative to the seventh electrode 15-7 to form a first step JT1, and one end of the second color light-emitting portion 16A2 extends relative to the ninth electrode 19-9 to form a second step JT2; the protective layer 21 includes a fourth opening 54 exposing the top of the first color light-emitting portion 12A1 at the first step JT1, a fifth opening 55 exposing the top of the second color light-emitting portion 16A2 at the second step JT2, and a sixth opening 56 exposing the top of the third color light-emitting portion 20A3; the common electrode 22 is connected to the first color light-emitting portion 12A1, the second color light-emitting portion 16A2 and the third color light-emitting portion 20A3 through the fourth opening 54, the fifth opening 55 and the sixth opening 56 respectively.

[0102] Specifically, the first color light emitting portion 12A1 and the film structure above it form a first step JT1, and the second color light emitting portion 16A2 and the film structure above it form a second step JT2. The common electrode 22 covers the fifth pad portion 20B5, the sixth pad portion 20B6, the third color light emitting portion 20A3, the first step JT1 and the second step JT2.

[0103] Embodiment 3

[0104] This embodiment provides a method for manufacturing the display panel 100 of any one of the first embodiments above.

[0105] Please refer to Figure 5-8 , Figure 9-11 , Figure 5 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 6A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 7 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 8 A schematic diagram of a fourth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Fig. 9 A schematic diagram of a fifth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 of the present application; Fig.10 A schematic diagram of a sixth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 of the present application; Fig.11 This is a schematic diagram of the seventh intermediate process of a method for manufacturing a display panel provided in Example 3 of the present application. Figure 6 Figure a in the middle illustrates a process of forming a first light-emitting stacked layer 12 on a substrate, and forming a portion of a first through hole 31 and a portion of a second through hole 32 (first sub-through hole 321) on the first light-emitting stacked layer 12; Figure 6 Figure b illustrates a process of forming a second light-emitting stacked layer 16 on the epitaxial substrate back plate, and forming a portion of the first through hole 31 and a portion of the second through hole 32 (first sub-through hole 321 ) on the second light-emitting stacked layer 16 .

[0106] S100, the first step is to deposit a bonding metal layer on the surface of the substrate 10, form a first light-emitting stacked layer 12 on the epitaxial substrate backplane, deposit a bonding metal layer on the surface of the first light-emitting stacked layer 12, bond the bonding metal layer on the first light-emitting stacked layer 12 and the bonding metal layer on the substrate 10 together by full-surface metal bonding to obtain a first conductive layer 11, transfer the first light-emitting stacked layer 12 from the epitaxial substrate backplane to the substrate 10, and then remove the epitaxial substrate backplane to obtain a conductive layer 11 as shown in FIG. Figure 5 The structure shown.

[0107] S200, second step, such as Figure 6 As shown in Figure a, a transparent bonding layer (a sublayer of the first bonding layer 13) is deposited on the first light-emitting stacked layer 12 that has been bonded; Figure 6 As shown in Figure b, a second light-emitting stack layer 16 is formed on the epitaxial substrate backplane, and a conductive layer (second conductive layer 15), a second color filter layer 14G and a transparent bonding layer (a sublayer of the first bonding layer 13) are deposited on the second light-emitting stack layer 16; through holes are etched on the first light-emitting stack layer 12 and the second light-emitting stack layer 16 (part of the first through hole 31 and part of the second through hole 32 (or the first sub-through hole 321) are etched, and conductive metal is filled in the through holes, and the metal in other areas except the through holes is removed by grinding, and the first light-emitting stack layer 12 and the second light-emitting stack layer 16 are bonded together by alignment medium bonding, and finally the epitaxial substrate backplane of the second light-emitting stack layer 16 is peeled off and removed to obtain a structure as shown in Figure b. Figure 7The structure shown.

[0108] S300, the third step, depositing a transparent bonding layer on the surface of the completed second light-emitting stack layer 16, forming a third light-emitting stack layer 20 on the epitaxial substrate backplane, depositing a conductive layer, a third color filter layer 18B and a transparent bonding layer on the third light-emitting stack layer 20, etching through holes (part of the second through hole 32 or the second sub-through hole 322) on the second light-emitting stack layer 16 and the third light-emitting stack layer 20 respectively, and filling the through holes with conductive metal, grinding and removing the metal in other areas except the through holes, bonding the second light-emitting stack layer 16 and the third light-emitting stack layer 20 together by alignment medium bonding, and finally peeling off the epitaxial substrate backplane of the third light-emitting stack layer 20 to obtain Figure 8 The structure shown.

[0109] S400, the fourth step, patterning the vertically bonded multi-layer LED epitaxial layer into a single LED pixel unit through a patterning etching process, specifically, etching away the entire pixel area of ​​the second light-emitting stack layer 16 and the third light-emitting stack layer 20 on the top of the first color light-emitting portion 12A1, and etching away the entire pixel area of ​​the third light-emitting stack layer 20 on the top of the second color light-emitting portion 16A2, and etching stays on the surface of the fourth epitaxial layer 163 of the second color light-emitting portion 16A2. The third color light-emitting portion 20A3 does not need to be etched, and the following is obtained. Fig. 9 The structure shown.

[0110] S500, the fifth step, the first color light emitting portion 12A1, the second color light emitting portion 16A2 and the third color light emitting portion 20A3 are removed by epitaxial etching to form an independent pixel unit, as shown in FIG. Fig.10 The structure shown; the first sub-insulating layer (such as a dielectric protection layer, ALD) is deposited on the side wall of the patterned LED pixel unit, and the bonding metal layer (first conductive layer 11) between the LED pixel units is etched away by ion beam etching (IBE) to form an independent channel.

[0111] S600, step 6, filling the bonding metal etching trench with a second sub-insulating layer (e.g., a dielectric protection layer), the first sub-insulating layer and the second sub-insulating layer form a protection layer 21, and etching away portions of the protection layer 21 above the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, and the third color light-emitting portion 20A3, respectively, to obtain a first opening 51, a second opening 52, and a third opening 53, as shown in FIG. Fig.11 The structure shown.

[0112] S700, the seventh step, depositing a common electrode 22 on the first color light emitting portion 12A1, the second color light emitting portion 16A2 and the third color light emitting portion 20A3, and etching away the area where the common electrode 22 is not needed, so that the common electrodes of the first color light emitting portion 12A1, the second color light emitting portion 16A2 and the third color light emitting portion 20A3 are connected to each other and are conductive, so as to obtain Figure 1 Or a display panel 100 with the structure shown in FIG. 2 .

[0113] Embodiment 4

[0114] This embodiment provides a method for manufacturing the display panel 100 of any one of the above-mentioned second embodiments.

[0115] Please refer to Figure 5-8 , Figure 12-13 , Figure 5 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 6 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 7 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Figure 8 A schematic diagram of a fourth intermediate process of a method for manufacturing a display panel provided in Embodiment 3 / 4 of the present application; Fig.12 A schematic diagram of a fifth intermediate process of a method for manufacturing a display panel provided in Embodiment 4 of the present application; Fig.13 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel provided in Embodiment 4 of the present application.

[0116] S10, the first step, is the same as step S100 in the third embodiment.

[0117] S20, the second step, is the same as step S200 in the third embodiment.

[0118] S30, the third step, is the same as step S300 in the third embodiment.

[0119] S40, the fourth step, patterns the vertically bonded multi-layer LED epitaxial layers into a single LED pixel unit through a patterned etching process, specifically, etches the channels between pixels to the position of the underlying bonding metal layer, and etches the first color light-emitting portion 12A1 to stay on the surface of the second epitaxial layer 123 and the surface of the sixth epitaxial layer 203 of the first color light-emitting portion 12A1 to form a first step JT1; etches the second color light-emitting portion 16A2 to stay on the surface of the fourth epitaxial layer 163 and the surface of the sixth epitaxial layer 203 of the second color light-emitting portion 16A2 to form a second step JT2, and the B pixel unit does not need to be etched.

[0120] S50, the fifth step, etching the side wall of the patterned LED pixel unit to deposit a first sub-insulating layer (such as a dielectric protection layer, ALD), and removing the bonding metal layer (first conductive layer 11) between the LED pixel units by ion beam etching (IBE) to form an independent channel, the structure is as follows Fig.12 The structure shown.

[0121] S60, the sixth step, filling the bonding metal etching trench with a second sub-insulating layer (for example, a dielectric protection layer), the first sub-insulating layer and the second sub-insulating layer form a protection layer 21, and etching away the protection layer 21 above the first color light-emitting portion 12A1, the second color light-emitting portion 16A2, and the third color light-emitting portion 20A3 to obtain a fourth opening 54, a fifth opening 55, and a sixth opening 56, respectively, to obtain Fig.13 The structure shown.

[0122] S70, the seventh step, depositing a common electrode 22 on the fifth pad portion 20B5, the fifth pad portion 20B6 and the third color light-emitting portion 20A3, and etching away the area where the common electrode 22 is not needed, so that the common electrodes of the first color light-emitting portion 12A1, the second color light-emitting portion 16A2 and the third color light-emitting portion 20A3 are connected to each other and are conductive, so as to obtain Figure 3 Or a display panel 100 with the structure shown in FIG. 4 .

[0123] It should be noted that the present application provides a method for manufacturing a high-PPI color micro-LED display panel. It does not require mass transfer, and integrates the three LED epitaxial layers of R, G, and B on a silicon-based driving substrate by vertical stacking. Then, through a graphical process, the vertically stacked LED epitaxial wafers are formed into a micro-LED display device structure in which R, G, and B can be driven and controlled separately, thereby solving the problem that traditional methods cannot manufacture high-PPI color micro-LED displays.

[0124] It should be noted that the present application uses a silicon (Si) substrate as a driving circuit. Silicon-based semiconductor technology is relatively mature, with good process stability and high yield. Integrating LEDs into a silicon-based backplane can achieve higher pixel density and lower power consumption; by vertically stacking R, G, and B LEDs into a silicon-based driving backplane, a high-PPI micro-color LED display can be achieved without the need for a mass transfer method; by using internal through holes (the first through hole 31 and the second through hole 32) for connection, the effective light-emitting area of ​​a single pixel can be increased, thereby increasing the brightness of the LED micro-display device; by using internal through holes (the first through hole 31 and the second through hole 32) for connection, the conduction capability of the P-type electrode can be increased, and the conductive resistance of the P-type electrode can be reduced, thereby improving the performance of the LED micro-display device and improving the manufacturing yield of the LED micro-display device.

[0125] It should be noted that this application is a technology applied to the field of silicon-based LED micro-display, which can achieve a resolution of more than 2000PPI. This technology is to first make a driving circuit on a silicon substrate, then vertically bond the R, G, and B LED epitaxial wafers to the silicon-based backplane, and use a graphical process to realize the production of a micro-display after the integrated LED. Figures 1 to 4 Shown is a cross-sectional view of an RGB pixel of an LED microdisplay after the patterning process is completed.

[0126] The above is a detailed introduction to a display panel 100 provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: substrate; A first conductive layer is disposed on the substrate, wherein the first conductive layer includes a first electrode and a second electrode; A first light-emitting stacked layer is disposed on the first conductive layer, wherein the first light-emitting stacked layer includes a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode; A second conductive layer is disposed on the first light-emitting stacked layer, wherein the second conductive layer includes a third electrode stacked with the first pad layer; A second light-emitting stacked layer is disposed on the second conductive layer, wherein the second light-emitting stacked layer includes a second color light-emitting portion stacked with the third electrode; A common electrode, disposed on the second light-emitting stack layer and electrically connected to the first color light-emitting portion and the second color light-emitting portion; The display panel further includes a first through hole penetrating the first pad layer portion, and a first connecting electrode filling the first through hole, and the third electrode is electrically connected to the second electrode through the first connecting electrode.

2. The display panel according to claim 1, wherein: The first conductive layer further includes a fourth electrode, the first light-emitting stacked layer further includes a second pad layer portion, the second conductive layer further includes a fifth electrode, the second light-emitting stacked layer further includes a third pad layer portion, and the display panel further includes: A third conductive layer, disposed between the second light-emitting stacked layer and the common electrode, the third conductive layer comprising a sixth electrode; A third light-emitting stacked layer is disposed between the third conductive layer and the common electrode layer, and the third light-emitting stacked layer includes a third color light-emitting portion; The fourth electrode, the second pad portion, the fifth electrode, the third pad portion, the sixth electrode and the third color light emitting portion are stacked, and the common electrode is also electrically connected to the third color light emitting portion; The display panel further includes a second through hole penetrating the second pad layer portion and the third pad layer portion, and a second connecting electrode filling the second through hole, and the sixth electrode is electrically connected to the fourth electrode through the second connecting electrode.

3. The display panel according to claim 2, wherein: The second through hole includes a first sub-through hole passing through the second pad layer portion and a second sub-through hole passing through the third pad layer portion, the second connecting electrode includes a first sub-connecting electrode filling the first sub-through hole and a second sub-connecting electrode filling the second sub-through hole, the first sub-connecting electrode is connected between the fifth electrode and the fourth electrode, and the second sub-connecting electrode is connected between the sixth electrode and the fifth electrode.

4. The display panel according to claim 2, wherein: Also includes: a protective layer, disposed between the first color light-emitting portion, the second color light-emitting portion, the third color light-emitting portion and the common electrode, the protective layer comprising a first opening exposing the top of the first color light-emitting portion, a second opening exposing the top of the second color light-emitting portion, and a third opening exposing the top of the third color light-emitting portion; The common electrode is connected to the first color light emitting portion, the second color light emitting portion, and the third color light emitting portion through the first opening, the second opening, and the third opening, respectively.

5. The display panel according to claim 2, wherein: The second conductive layer further includes a seventh electrode, the second light-emitting stacked layer further includes a fourth pad portion, the third conductive layer further includes an eighth electrode and a ninth electrode, and the third light-emitting stacked layer further includes a fifth pad portion and a sixth pad portion; The seventh electrode, the fourth pad portion, the eighth electrode and the fifth pad portion are stacked with the first color light emitting portion, and the ninth electrode and the sixth pad portion are stacked with the second color light emitting portion; The common electrode covers the fifth pad portion, the sixth pad portion, and the third-color light-emitting portion.

6. The display panel according to claim 5, wherein: The display panel further includes a protective layer, which is disposed between the fifth pad portion, the sixth pad portion, the third color light emitting portion and the common electrode; On the plane of the display panel, one end of the first color light emitting portion extends relative to the seventh electrode to form a first step, and one end of the second color light emitting portion extends relative to the ninth electrode to form a second step; The protective layer includes a fourth opening at the first step exposing the top of the first color light-emitting portion, a fifth opening at the second step exposing the top of the second color light-emitting portion, and a sixth opening exposing the top of the third color light-emitting portion; The common electrode is respectively connected to the first color light emitting portion, the second color light emitting portion, and the third color light emitting portion through the fourth opening, the fifth opening, and the sixth opening.

7. The display panel according to any one of claims 2 to 6, characterized in that: The film layer structure of the first light-emitting stacked layer includes a first epitaxial layer, a first light-emitting layer, and a second epitaxial layer which are sequentially stacked on the first conductive layer; The film layer structure of the second light-emitting stacked layer includes a third epitaxial layer, a second light-emitting layer and a fourth epitaxial layer which are sequentially stacked on the second conductive layer; The film layer structure of the third light-emitting stacked layer includes a fifth epitaxial layer, a third light-emitting stacked layer and a sixth epitaxial layer which are sequentially stacked on the third conductive layer.

8. The display panel according to claim 7, wherein: Also includes: A second color filter layer, disposed between the first light-emitting stack layer and the second conductive layer; A first bonding layer, disposed between the first light-emitting stack layer and the second color filter layer; A third color filter layer is disposed between the second light-emitting stack layer and the third conductive layer; A second bonding layer is disposed between the second light-emitting stack layer and the third color filter layer; The second color filter layer and the first bonding layer have the same pattern as the second light-emitting stacked layer, and the third color filter layer and the second bonding layer have the same pattern as the third light-emitting stacked layer.

9. The display panel according to claim 2, wherein: The light emitted by the first color light emitting portion, the second color light emitting portion and the third color light emitting portion are all emitted to a side of the common electrode away from the substrate.

10. The display panel according to claim 9, wherein: The first color light emitting portion emits red light, the second color light emitting portion emits green light, and the third color light emitting portion emits blue light.

Images