CD-ROM integrated laminated packaging structure, preparation method thereof and lamp panel

Abstract

The invention provides a CD-ROM integrated laminated packaging structure, a preparation method thereof and a lamp panel, the laminated packaging structure comprises a packaging carrier plate, an LED chip and a driving chip, the packaging carrier plate comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are stacked in sequence; the LED chip is arranged on one side, deviating from the first insulating layer, of the first metal layer, and the LED chip is electrically connected with the third metal layer through the first metal layer; the driving chip is arranged on one side, deviating from the first insulating layer, of the second metal layer, and the driving chip is electrically connected with the third metal layer through the second metal layer; wherein the third metal layer is used for being electrically connected with the printed circuit board. According to the LED lamp panel, the number of partitions of the lamp panel can be increased, a finer picture effect is achieved, meanwhile, the driving circuit is transferred into the packaging carrier plate, the plane wiring difficulty of the printed circuit board is effectively reduced, the length difference of the driving circuit between the driving chip and the LED chip is improved, and the light emitting quality is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a stacked packaging structure integrated with an optical drive, a preparation method thereof, and a light board. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. It has been widely used in lighting, display, medical treatment, optical communication and other fields because of its advantages of low energy consumption, small size, long life, good stability, fast response and stable luminous wavelength.

[0003] Taking the display field as an example, the current display industry is developing towards high resolution, ultra-thinness, high dynamic range imaging, high contrast and wide color gamut. The light board in the display device, by using Mini LED chips and matching local dimming technology, can enable each partition in the light board to achieve independent switching or brightness adjustment, and finely control the light and dark state of each partition, thereby making the light and dark levels of the picture clearer and improving the user's visual experience.

[0004] However, the applicant discovered in internal research that currently the Mini LED chip and the driver chip are independently arranged on the printed circuit board, and the drive circuit connecting the Mini LED chip and the driver chip is also integrated in the printed circuit board. As the number of partitions increases, the difficulty of planar wiring of the drive circuit in the printed circuit board will increase significantly, which will lead to reduced production efficiency and yield of the printed circuit board, as well as increased energy consumption caused by complex wiring. In addition, especially in large-size display devices, since the drive circuits are all integrated in the printed circuit board, and the driver chip will simultaneously connect a large number of Mini LED chips, at least two Mini LED chips connected to the same driver chip may have a large difference in the length of the drive circuit, which will lead to the IR Drop problem, affecting the overall light output effect of the light board.

[0005] Therefore, how to effectively reduce the difficulty of planar wiring of the printed circuit board while increasing the number of partitions of the light board and improve the difference in driving line length between the driving chip and the Mini LED chip is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0006] The present application provides a stacked packaging structure with an integrated optical drive and a preparation method and a light board, which can effectively solve the problem existing in the related art that it is difficult to increase the number of partitions of the light board while reducing the difficulty of planar wiring of the printed circuit board and improving the difference in driving line length between the driving chip and the Mini LED chip.

[0007] In a first aspect, the present application provides a laminated packaging structure integrated with an optical drive, the laminated packaging structure comprising: The package carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are stacked in sequence; An LED chip is arranged on a side of the first metal layer away from the first insulating layer, and the LED chip is electrically connected to the third metal layer through the first metal layer; A driving chip is arranged on a side of the second metal layer away from the first insulating layer, and the driving chip is electrically connected to the third metal layer through the second metal layer; Wherein, the third metal layer is used for electrically connecting to a printed circuit board.

[0008] Optionally, the second insulating layer includes a solid portion and an opening, the solid portion surrounds the opening, wherein the third metal layer is disposed on the solid portion, the opening exposes the second metal layer, and the driving chip is embedded in the opening and fixed and electrically connected to the second metal layer.

[0009] Optionally, a vertical projection of the LED chip on the packaging carrier is located within a vertical projection of the driver chip on the packaging carrier.

[0010] Optionally, the stacked packaging structure further includes an adhesive, and the adhesive is filled between the driving chip and the side wall of the opening.

[0011] Optionally, the thickness of the second insulating layer is greater than the thickness of the first insulating layer, and the thickness of the second insulating layer is greater than the sum of the thicknesses of the second metal layer and the driving chip.

[0012] Optionally, the stacked packaging structure further includes a padding layer, which is arranged on a side of the driver chip away from the second metal layer, wherein a surface of the padding layer away from the driver chip is flush with a surface of the third metal layer away from the second insulating layer.

[0013] Optionally, the pad layer contacts the printed circuit board, and the material of the pad layer includes metal or ceramic.

[0014] Optionally, the first insulating layer and the second insulating layer are made of different materials.

[0015] In a second aspect, the present application provides a method for preparing an optical drive-integrated laminated packaging structure, the method for preparing the optical drive-integrated laminated packaging structure comprising the following steps: A packaging carrier is provided, wherein the packaging carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked, the second insulating layer comprises a solid portion and an opening, the solid portion surrounds the opening, the third metal layer is arranged on the solid portion, and the opening exposes the second metal layer; Embedding a driving chip in the opening and electrically connecting the driving chip to the second metal layer; Filling an adhesive in the gap between the driver chip and the side wall of the opening, and curing the adhesive; The LED chip is arranged on a side of the packaging substrate away from the driver chip, and the LED chip is electrically connected to the first metal layer, wherein the vertical projection of the LED chip on the packaging substrate is located within the vertical projection of the driver chip on the packaging substrate.

[0016] In a third aspect, the present application provides a light board, comprising a printed circuit board and at least one optical drive-integrated stacked packaging structure as described in any one of the above items, wherein the stacked packaging structure is electrically connected to the printed circuit board.

[0017] Beneficial effects of this application: The present application can integrate the LED chip, the driver chip and the packaging carrier with a multi-layer structure into an independent stacked packaging structure, thereby reducing its planar size on the printed circuit board, which is beneficial to the improvement of the layout density of the LED chip, thereby increasing the number of partitions of the light board and achieving a more delicate picture effect; and can also transfer the drive circuit to the packaging carrier without affecting the connection stability of the LED chip, the driver chip and the printed circuit board, thereby effectively reducing the difficulty of planar wiring of the printed circuit board, thereby improving the production efficiency and yield of the printed circuit board, improving the problem of increased energy consumption caused by complex wiring, and standardizing the drive circuit path between the driver chip and the LED chip, thereby improving the difference in drive circuit length between the driver chip and the MiniLED chip, improving the resistance-capacitance delay problem, and improving the overall light output effect of the light board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0019] Figure 1 A schematic diagram of the film layer structure of an optical drive-integrated stacked packaging structure provided in some embodiments of the present application.

[0020] Figure 2 A schematic top view of a packaging carrier provided in some embodiments of the present application.

[0021] Figure 3 A schematic top view of another packaging carrier provided for some embodiments of the present application.

[0022] Figure 4 A schematic top view of yet another packaging carrier provided for some embodiments of the present application.

[0023] Figure 5 A schematic diagram of the film layer structure of another stacked packaging structure provided for some embodiments of the present application.

[0024] Figure 6 A schematic diagram of the film layer structure of another stacked packaging structure provided in some embodiments of the present application.

[0025] Figure 7 A schematic flow chart of a method for preparing an optical drive-integrated stacked packaging structure provided in some embodiments of the present application.

[0026] Figure 8 Schematic diagram of the film layer structure of the light panel provided in some embodiments of the present application.

[0027] Description of reference numerals: A stacked packaging structure 100; a packaging substrate 10; a first metal layer 11; a first metal circuit pad 111; a first type first metal circuit pad 111-1; a second type first metal circuit pad 111-2; a first through-hole pad 112; a first insulating layer 12; a second metal layer 13; a second insulating layer 14; a solid portion 141; an opening 142; a third metal layer 15; an LED chip 20; a driver chip 30; an adhesive 40; a pad layer 50; a packaging layer 60; a white wall glue layer 70; and a printed circuit board 200. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0029] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0032] Figure 1 This is a schematic diagram of the film structure of the optical drive integrated stacked packaging structure provided in some embodiments of the present application. Figure 1 As shown, the present application provides a stacked packaging structure 100 with an integrated optical drive, the stacked packaging structure 100 includes a packaging carrier 10, an LED chip 20 and a driver chip 30, the packaging carrier 10 includes a first metal layer 11, a first insulating layer 12, a second metal layer 13, a second insulating layer 14 and a third metal layer 15 stacked in sequence; the LED chip 20 is arranged on a side of the first metal layer 11 away from the first insulating layer 12, and the LED chip 20 is electrically connected to the third metal layer 15 through the first metal layer 11; the driver chip 30 is arranged on a side of the second metal layer 13 away from the first insulating layer 12, and the driver chip 30 is electrically connected to the third metal layer 15 through the second metal layer 13; wherein the third metal layer 15 is used to be electrically connected to a printed circuit board 200 (full name in English: Printed Circuit Board; abbreviated as: PCB).

[0033] In the stacked packaging structure 100 provided in the embodiment of the present application, the LED chip 20, the driver chip 30 and the packaging carrier 10 with a multi-layer structure are integrated into an independent stacked packaging structure 100, thereby reducing the plane size of the stacked packaging structure 100 on the printed circuit board 200, which is beneficial to the improvement of the layout density of the LED chip 20, thereby helping to increase the number of partitions of the light board and achieve a more delicate picture effect; and it is also possible to transfer the drive circuit to the packaging carrier 10 without affecting the connection stability of the LED chip 20, the driver chip 30 and the printed circuit board 200, so that the film layer structure of the printed circuit board 200 with a large plane area is simplified (can be simplified to a single wiring layer), thereby effectively reducing the difficulty of planar wiring of the printed circuit board 200, thereby improving the production efficiency and yield of the printed circuit board 200, improving the problem of increased energy consumption caused by complex wiring, and standardizing the drive circuit path between the driver chip 30 and the LED chip 20, shortening the signal transmission distance between the driver chip 30 and the LED chip 20, thereby improving the connection between the driver chip 30 and the Mini The difference in driving line length between the LED chips 20 improves the resistance-capacitance delay problem, reduces the response time difference, and improves the overall light output effect and uniformity of the lamp board using the stacked packaging structure.

[0034] In some embodiments of the present application, the second insulating layer 14 includes a solid portion 141 and an opening 142, the solid portion 141 surrounds the opening 142, wherein the third metal layer 15 is disposed on the solid portion 141, the opening 142 exposes the second metal layer 13, and the driving chip 30 is embedded in the opening 142 and fixed to and electrically connected to the second metal layer 13.

[0035] In the stacked package structure 100 provided in the embodiment of the present application, the second metal layer 13, the second insulating layer 14, and the third metal layer 15 are all arranged on the side of the first insulating layer 12 away from the LED chip 20, and the printed circuit board 200 and the driver chip 30 are also arranged on the side of the first insulating layer 12 away from the LED chip 20. Therefore, the applicant needs to consider how to achieve the electrical connection between the driver chip 30 and the second metal layer 13, and the electrical connection between the printed circuit board 200 and the third metal layer 15, while eliminating the obstruction of the second insulating layer 14 to the electrical connection between the driver chip 30 and the second metal layer 13, and eliminating the structural interference between the printed circuit board 200 and the driver chip 30.

[0036] The applicant further discovered that the function of the third metal layer 15 is to be electrically connected to the printed circuit board 200, that is, it is sufficient as long as the metal pattern of the third metal layer 15 is electrically connected to the connection point on the printed circuit board 200. Therefore, the position of the metal pattern in the third metal layer 15 can be designed, and the position of the connection point on the printed circuit board 200 can be matched and designed, so that there is no metal pattern of the third metal layer 15 in the specific area that can accommodate the lower driver chip 30. Furthermore, the second insulating layer 14 can be grooved so that the second insulating layer 14 has a solid part 141 that can carry the metal pattern of the third metal layer 15, and also has an opening 142 that exposes the second metal layer 13 and has an area larger than the driver chip 30, so that the driver chip 30 can be embedded in the opening 142 and electrically connected to the second metal layer 13.

[0037] In the stacked package structure 100 provided in the embodiment of the present application, this arrangement can fully utilize the space in the multi-layer structure of the package carrier 10, and while realizing the electrical connection between the driver chip 30 and the inner metal layer (i.e., the second metal layer 13) in the package carrier 10, it does not affect the electrical connection between the package carrier 10 and the printed circuit board 200, and does not cause structural interference between the printed circuit board 200 and the driver chip 30. In addition, since the driver chip 30 can be embedded in the opening 142, the positioning accuracy, structural stability and assembly efficiency of the driver chip 30 can also be improved.

[0038] In some embodiments of the present application, a vertical projection of the LED chip 20 on the packaging substrate 10 is located within a vertical projection of the driver chip 30 on the packaging substrate 10 .

[0039] In the stacked package structure 100 provided in the embodiment of the present application, the vertical projection of the LED chip 20 on the package carrier 10 is located within the vertical projection of the driver chip 30 on the package carrier 10, that is, the plane area of ​​the LED chip 20 is smaller than the plane area of ​​the driver chip 30. It should be noted that the plane area of ​​the LED chip 20 herein refers to the plane area of ​​all the LED chips 20 in the stacked package structure 100, that is, the stacked package structure 100 includes at least one LED chip 20. The significance of this design is that when the LED chip 20 is fixed on the packaging carrier 10, the packaging carrier 10 will be subjected to a certain amount of pressure. Since the second insulating layer 14 has an opening 142, it is easy to cause the packaging carrier 10 to have a reduced pressure-bearing capacity and poor flatness in the area corresponding to the LED chip 20, which may further affect the optical effect of the stacked packaging structure 100. In this application, the vertical projection of the driver chip 30 on the packaging carrier 10 covers the vertical projections of all the LED chips 20 on the packaging carrier 10, and thus the driver chip 30 can be used to reinforce the structure of the area where the LED chip 20 is located, thereby improving the stability of the overall structure and further improving the optical effect of the stacked packaging structure 100.

[0040] In some embodiments of the present application, the stacked package structure 100 further includes an adhesive 40 , and the adhesive 40 is filled between the driving chip 30 and the sidewall of the opening 142 .

[0041] In the stacked packaging structure 100 provided in the embodiment of the present application, the driver chip 30 welded and fixed on the surface of the second metal layer 13 on the side away from the first insulating layer 12 can structurally reinforce the area where the LED chip 20 is located to a certain extent. However, when there is a gap between the driver chip 30 and the side wall of the opening 142, since the driver chip 30 and the solid part 141 of the second insulating layer 14 are not connected, the packaging carrier 10 may still produce a certain degree of warping. In order to improve this problem, the present application further sets an adhesive 40 in the gap area between the driver chip 30 and the side wall of the opening 142, and then uses the adhesive 40 to combine the driver chip 30 and the second insulating layer 14 into a whole, thereby further improving the deformation resistance of the packaging carrier 10 in the area corresponding to the LED chip 20.

[0042] In some embodiments of the present application, the adhesive 40 is silicone.

[0043] In the stacked packaging structure 100 provided in the embodiment of the present application, the silicone can not only tightly bond the driver chip 30 and the side wall of the opening 142 (i.e., the solid portion 141), but also enable the driver chip 30 to be well sealed within the opening 142, thereby reducing the risk of water and oxygen intrusion at the joint between the solder pad of the driver chip 30 and the solder pad of the second metal layer 13.

[0044] In some embodiments of the present application, the adhesive 40 is a photocurable adhesive layer.

[0045] In some embodiments of the present application, the thickness of the second insulating layer 14 is greater than the thickness of the first insulating layer 12 , and the thickness of the second insulating layer 14 is greater than the sum of the thicknesses of the second metal layer 13 and the driving chip 30 .

[0046] In the stacked packaging structure 100 provided in the embodiment of the present application, the first insulating layer 12 can play the role of electrically isolating part of the first metal layer 11 and part of the second metal layer 13, so the first insulating layer 12 has a certain thickness, for example, the first insulating layer 12 has a reference insulating thickness. However, the second insulating layer 14 not only needs to play the role of electrically isolating part of the second metal layer 13 and part of the third metal layer 15, but the opening 142 in the second insulating layer 14 also needs to accommodate the driving chip 30 to avoid structural interference between the driving chip 30 and the driving circuit board. Therefore, the second insulating layer 14 needs to be thickened so that the second insulating layer 14 has a thickness greater than the reference insulating thickness. Furthermore, since the pads of the driver chip 30 and the pads of the second metal layer 13 need to be fixed by welding, a thickening problem may occur at the joint, but the increased thickness often does not exceed the thickness of a single metal layer (such as the third metal layer 15). Therefore, it is necessary to make the thickness of the second insulating layer 14 greater than the sum of the thicknesses of the second metal layer 13 and the driver chip 30, so that the thickening design margin of the joint is greater than the thickness of the third metal layer 15, thereby avoiding structural interference between the driver chip 30 and the printed circuit board 200 caused by the bulging surface of the driver chip 30 on the side away from the second metal layer 13, which is beneficial to improving the bonding stability of the stacked packaging structure 100 and the driver circuit board.

[0047] In some embodiments of the present application, the stacked packaging structure 100 also includes a padding layer 50, which is arranged on the side of the driving chip 30 away from the second metal layer 13, wherein the surface of the padding layer 50 away from the driving chip 30 is flush with the surface of the third metal layer 15 away from the second insulating layer 14.

[0048] In the stacked package structure 100 provided in the embodiment of the present application, as mentioned above, in order to avoid the structural interference problem between the driver chip 30 and the printed circuit board 200 caused by the convex surface of the driver chip 30 on the side away from the second metal layer 13, it is necessary to make the thickness of the second insulating layer 14 greater than the sum of the thicknesses of the second metal layer 13 and the driver chip 30. However, this structural setting may cause a tiny gap between the surface of the driver chip 30 on the side away from the second metal layer 13 and the printed circuit board 200. During assembly and use of the light board, the stacked package structure 100 may collapse at the tiny gap, thereby affecting the optical effect of the light board. The present application sets the liner layer 50 so that the surface of the liner layer 50 on the side away from the driver chip 30 is flush with the surface of the third metal layer 15 on the side away from the second insulating layer 14, which can effectively improve the above problem and enhance the stability and optical effect of the stacked package structure 100.

[0049] In some embodiments of the present application, the liner layer 50 is in contact with the printed circuit board 200 , and the material of the liner layer 50 includes metal or ceramic.

[0050] In the stacked package structure 100 provided in the embodiment of the present application, the applicant found in internal research that since the driver chip 30 generates heat in the process of driving the LED chip 20, and the driver chip 30 is embedded in the opening 142, the heat is difficult to be discharged to the outside, and thus the driver chip 30 is prone to overheating and failure due to long-term use of the stacked package structure 100. In the present application, by making the material of the liner layer 50 include materials with excellent heat dissipation performance such as metal or ceramic, on the one hand, the liner layer 50 can be used to fill the gap between the driver chip 30 and the printed circuit board 200, thereby supporting the driver chip 30 and improving the supporting strength of the package carrier 10 in the area where the LED chip 20 is located; on the other hand, the printed circuit board 200 in contact with the liner layer 50 can be used to discharge the heat in the driver chip 30 to the outside through the printed circuit board 200, thereby reducing the risk of overheating and failure of the driver chip 30.

[0051] In some embodiments of the present application, the side of the driving chip 30 facing away from the second metal layer 13 may be provided with a functional layer or not provided with a functional layer, and the functional layer may be the pad layer 50, or other film layer, but the functional layer is not connected to any of the second insulating layer 14, the adhesive 40, and the third metal layer 15.

[0052] In the stacked packaging structure 100 provided in the embodiment of the present application, since the functional layer is not set on the side of the driver chip 30 away from the second metal layer 13, or when the functional layer is set, the functional layer is not connected to any one of the second insulating layer 14, the adhesive 40, and the third metal layer 15, after the driver chip 30 is combined with the packaging carrier 10, when the electrical test finds that there is an electrical abnormality in the driver chip 30, the driver chip 30 can be easily removed and replaced, thereby improving the disassembly and rework efficiency.

[0053] In some embodiments of the present application, in the package carrier 10, the first insulating layer 12 and the second insulating layer 14 are made of the same material. Optionally, the first insulating layer 12 is made of resin, and the second insulating layer 14 is made of resin. In the process of preparing the package carrier 10, the component consisting of the second insulating layer 14 and the third metal layer 15 can be fixed on another component consisting of the first metal layer 11, the first insulating layer 12, and the second metal layer 13 through a molding process, thereby forming a package carrier 10 with an integrated structure.

[0054] In some embodiments of the present application, in the package carrier 10, the first insulating layer 12 and the second insulating layer 14 are made of different materials, and the thermal conductivity of the first insulating layer 12 is greater than that of the second insulating layer 14. Optionally, the first insulating layer 12 is made of ceramic, and the second insulating layer 14 is made of resin or other organic materials. In the process of preparing the package carrier 10, the component consisting of the second insulating layer 14 and the third metal layer 15 can be fixed on another component consisting of the first metal layer 11, the first insulating layer 12 and the second metal layer 13 through a plastic sealing process, thereby forming a package carrier 10 with an integrated structure.

[0055] In the stacked packaging structure 100 provided in the embodiment of the present application, since the first insulating layer 12, which serves as the basic supporting film layer for supporting the LED chip 20 in the packaging carrier 10, is made of ceramic, the deformation resistance of the first insulating layer 12 can be greatly improved, thereby improving the pressure bearing capacity of the packaging carrier 10 in the area corresponding to the LED chip 20, improving the stability of the overall structure, and thus improving the optical effect of the stacked packaging structure 100.

[0056] In some embodiments of the present application, in the package carrier 10, the first insulating layer 12 and the second insulating layer 14 are made of different materials, and the thermal conductivity of the second insulating layer 14 is greater than that of the first insulating layer 12. Optionally, the second insulating layer 14 is made of ceramic, and the first insulating layer 12 is made of resin. In the process of preparing the package carrier 10, the component consisting of the first metal layer 11, the first insulating layer 12 and the second metal layer 13 can be fixed on another component consisting of the second insulating layer 14 and the third metal layer 15 through a plastic packaging process, thereby forming a package carrier 10 with an integrated structure.

[0057] In the stacked packaging structure 100 provided in the embodiment of the present application, since the material of the second insulating layer 14 in the packaging carrier 10 is ceramic, the heat energy in the driving chip 30 can be more efficiently discharged to the outside through the second insulating layer 14 on its peripheral side with excellent heat dissipation efficiency via the printed circuit board 200.

[0058] Figure 2 A schematic top view of a package carrier provided in some embodiments of the present application. Figure 2 As shown, in some embodiments of the present application, the number of LED chips 20 in the stacked package structure 100 is one. Optionally, the type of the LED chip 20 is an LED blue light chip.

[0059] In some embodiments of the present application, Figure 1 The film layer structure of the stacked package structure 100 shown in FIG. Figure 2 The cross-sectional diagram of the AB line in the figure, combined with Figure 1 and Figure 2 As shown, the first metal layer 11 includes a plurality of first metal circuit pads 111 and a plurality of first through-hole pads 112, wherein the first metal circuit pads 111 are used to solder and fix the LED chip 20, wherein each of the first metal circuit pads 111 is electrically connected to one of the first through-hole pads 112 disposed on the periphery of the metal circuit pad. Exemplarily, the plurality of first metal circuit pads 111 include a first-type first metal circuit pad 111-1 and a second-type first metal circuit pad 111-2; wherein the number of the first through-hole pads 112 on one side is one less than the number of the first through-hole pads 112 on the opposite other side.

[0060] In some embodiments of the present application, the second metal layer 13 includes a plurality of second metal circuit pads (not shown in the figure) and a plurality of second through-hole pads (not shown in the figure), and the second metal circuit pads are used to weld and fix the driving chip 30, wherein the number of the second through-hole pads is the same as the number of the first through-hole pads 112 and are arranged correspondingly; the number of the second metal circuit pads is one less than the number of the second through-hole pads, each of the second metal circuit pads is electrically connected to a second through-hole pad, and the second through-hole pad electrically connected to the second metal circuit pad does not correspond to the first through-hole pad 112 electrically connected to the first type first metal circuit pad 111-1, or in other words, the second through-hole pad corresponding to the first through-hole pad 112 electrically connected to the first type first metal circuit pad 111-1 is not electrically connected to the second metal circuit pad.

[0061] In some embodiments of the present application, the third metal layer 15 includes a plurality of third through-hole pads, and the number of the third through-hole pads is the same as the number of the second through-hole pads and is arranged correspondingly.

[0062] Figure 3 A schematic top view of another packaging carrier provided in some embodiments of the present application. Figure 3 As shown, in some embodiments of the present application, the number of LED chips 20 in the stacked package structure 100 can be multiple. Optionally, the stacked package structure 100 includes multiple LED chips 20, and the multiple LED chips 20 are LED red chips, LED green chips, and LED blue chips, that is, each of the stacked package structures 100 includes an RGB LED chipset.

[0063] Continue to refer to Figure 3 As shown, the first metal layer 11 includes a plurality of first metal circuit pads 111 and a plurality of first through-hole pads 112, wherein the first metal circuit pads 111 are used to solder and fix the LED chip 20, wherein each of the first metal circuit pads 111 is electrically connected to one of the first through-hole pads 112 disposed on the periphery of the metal circuit pad, and Figure 2 The difference is that the plurality of first metal circuit pads 111 include one first-type first metal circuit pad 111 - 1 and three second-type first metal circuit pads 111 - 2 .

[0064] Figure 4 A schematic top view of another packaging carrier provided in some embodiments of the present application. Figure 4As shown, in some embodiments of the present application, the number of LED chips 20 in the stacked package structure 100 can be multiple. Optionally, the stacked package structure 100 includes multiple LED chips 20, and the multiple LED chips 20 are respectively LED red light chips, LED green light chips, LED blue light chips and LED white light chips, that is, each of the stacked package structures 100 includes an RGBW LED chipset.

[0065] Continue to refer to Figure 4 As shown, the first metal layer 11 includes a plurality of first metal circuit pads 111 and a plurality of first through-hole pads 112, wherein the first metal circuit pads 111 are used to solder and fix the LED chip 20, wherein each of the first metal circuit pads 111 is electrically connected to one of the first through-hole pads 112 disposed on the periphery of the metal circuit pad, and Figure 2 , Figure 3 The difference is that the plurality of first metal circuit pads 111 include one first-type first metal circuit pad 111 - 1 and four second-type first metal circuit pads 111 - 2 .

[0066] In some embodiments of the present application, the driver chip 30 is a four-channel control chip, which can independently control the on / off and size of the four channels under the control of a programming language to adapt to the situation where there are one or more LED chips 20. The communication protocol applicable to the driver chip 30 can be the Serial Parallel Broadcast protocol (SPB protocol for short), and the number of its signal output channels can be 4 or 8.

[0067] In some embodiments of the present application, the driver chip 30 may be a chip that has completed a pre-packaging process, wherein the driver chip 30 may be packaged in a chip-scale package (CSP). The bonding process between the pads of the driver chip 30 and the pads in the second metal layer 13 may be BGA ball planting.

[0068] Continue to refer to Figure 1 In some embodiments of the present application, the stacked packaging structure 100 further includes a packaging layer 60, and the packaging layer 60 covers the LED chip 20, wherein the packaging layer 60 has a top light emitting surface and four side light emitting surfaces. Optionally, the packaging layer 60 is a transparent packaging adhesive layer or a fluorescent packaging adhesive layer.

[0069] Figure 5 A schematic diagram of a film layer structure of another stacked packaging structure provided in some embodiments of the present application. Figure 5As shown, Figure 2 The difference between the stacked packaging structure 100 shown is that, in some embodiments of the present application, the stacked packaging structure 100 also includes a white wall glue layer 70, and the white wall glue layer 70 is arranged on the top light-emitting surface of the packaging layer 60 to suppress the front light emission and increase the light emission angle of the stacked packaging structure 100.

[0070] Continue to refer to Figure 5 As shown, in some embodiments of the present application, the packaging adhesive layer 60 is a transparent packaging adhesive layer.

[0071] Figure 6 A schematic diagram of a film layer structure of another stacked packaging structure provided in some embodiments of the present application. Figure 6 As shown, Figure 2 The difference between the stacked packaging structure 100 shown is that, in some embodiments of the present application, the packaging layer 60 covers the LED chip 20, wherein the light-emitting surface of the packaging layer 60 is a curved surface to form a hemispherical lens, thereby increasing the front light-emitting angle of the stacked packaging structure 100.

[0072] In some embodiments of the present application, the surface of the encapsulation layer 60 is provided with textures or microstructures to improve light extraction efficiency or enhance light extraction uniformity.

[0073] Continue to refer to Figure 6 As shown, in some embodiments of the present application, the packaging adhesive layer 60 is a transparent packaging adhesive layer.

[0074] In some embodiments of the present application, the printed circuit board 200 is a single-sided PCB aluminum substrate. Specifically, the single-sided PCB aluminum substrate includes an aluminum base material layer, an electrical insulation layer and a conductive layer stacked in sequence, and the pads in the conductive layer are electrically connected to the pads in the third metal layer 15.

[0075] In the stacked packaging structure 100 provided in the embodiment of the present application, since the driving circuit electrically connecting the LED chip 20 and the driving chip 30 is integrated in the packaging carrier 10, the structure of the printed circuit board 200 can be simplified, making it possible to use a single-sided PCB aluminum substrate with lower cost and higher yield in Mini LED light panels with a large number of partitions.

[0076] In some embodiments of the present application, the LED chip 20 may be a Mini LED chip, which refers to an LED chip having a long side dimension between 50 microns and 300 microns.

[0077] Figure 7 A schematic diagram of a method for preparing a stacked packaging structure integrated with an optical drive provided in some embodiments of the present application. Figures 1 to 7 As shown, in the second aspect, an embodiment of the present application provides a method for preparing an optical drive-integrated stacked packaging structure, and the method for preparing the optical drive-integrated stacked packaging structure 100 includes step S01, step S02, step S03 and step S04.

[0078] Step S01 includes: providing a packaging carrier 10, wherein the packaging carrier 10 includes a first metal layer 11, a first insulating layer 12, a second metal layer 13, a second insulating layer 14 and a third metal layer 15 stacked in sequence, the second insulating layer 14 includes a solid portion 141 and an opening 142, the solid portion 141 surrounds the opening 142, the third metal layer 15 is arranged on the solid portion 141, and the opening 142 exposes the second metal layer 13.

[0079] Step S02 includes: embedding the driving chip 30 in the opening 142 , and electrically connecting the driving chip 30 to the second metal layer 13 .

[0080] Step S03 includes: filling the gap between the driving chip 30 and the sidewall of the opening 142 with an adhesive 40 , and curing the adhesive 40 .

[0081] Step S04 includes: disposing the LED chip 20 on a side of the packaging carrier 10 away from the driver chip 30, and electrically connecting the LED chip 20 to the first metal layer 11, wherein the vertical projection of the LED chip 20 on the packaging carrier 10 is located within the vertical projection of the driver chip 30 on the packaging carrier 10.

[0082] In the stacked packaging structure 100 prepared by the above-mentioned preparation method provided in the embodiment of the present application, the LED chip 20, the driver chip 30 and the packaging carrier 10 with a multi-layer structure are integrated into an independent stacked packaging structure 100, thereby reducing the plane size of the stacked packaging structure 100 on the printed circuit board 200, which is conducive to improving the layout density of the LED chip 20, thereby increasing the number of partitions of the light board, and achieving a more delicate picture effect; and it is also possible to transfer the drive circuit to the packaging carrier 10 without affecting the connection stability of the LED chip 20, the driver chip 30 and the printed circuit board 200, so that the film layer structure of the printed circuit board 200 with a larger plane area is simplified (can be simplified to a single wiring layer), thereby effectively reducing the difficulty of planar wiring of the printed circuit board 200, thereby improving the production efficiency and yield of the printed circuit board 200, improving the problem of increased energy consumption caused by complex wiring, and standardizing the drive circuit path between the driver chip 30 and the LED chip 20, shortening the signal transmission distance between the driver chip 30 and the LED chip 20, thereby improving the driver chip 30 and Mini The difference in driving line length between the LED chips 20 improves the resistance-capacitance delay problem, reduces the difference in response time, and improves the overall light output effect of the lamp board.

[0083] In addition, in the preparation method described above, the present application first embeds the driver chip 30 in the opening 142 and electrically connects it to the second metal layer 13, and then combines the driver chip 30 and the second insulating layer 14 into a whole through the adhesive 40, thereby greatly improving the supporting strength of the packaging carrier 10 in the opening 142 area, and thus in the subsequent step of setting the LED chip 20 on the packaging carrier 10, the problem of reduced flatness of the packaging carrier 10 in the area where the LED chip 20 is located can be avoided, which can effectively improve the assembly yield and ensure the stability and optical effect of the subsequent stacked packaging structure 100.

[0084] In some embodiments of the present application, in step S03, after the step of filling the gap between the driver chip 30 and the side wall of the opening 142 with the adhesive 40 and curing the adhesive 40, it also includes: setting a pad layer 50 on the side of the driver chip 30 away from the second metal layer 13, wherein the surface of the pad layer 50 away from the driver chip 30 is flush with the surface of the third metal layer 15 away from the second insulating layer 14.

[0085] In the preparation method of the optical drive-integrated stacked packaging structure 100 provided in an embodiment of the present application, the present application sets the pad layer 50 and makes the surface of the pad layer 50 facing away from the driver chip 30 flush with the surface of the third metal layer 15 facing away from the second insulating layer 14. This can effectively improve the problem of reduced flatness of the packaging carrier 10 during the preparation process due to a gap between the surface of the driver chip 30 facing away from the second insulating layer 14 and the surface carrying the packaging carrier 10, and insufficient supporting strength in the opening 142 area. This can improve the stability and optical effect of the stacked packaging structure 100.

[0086] In some embodiments of the present application, the method for preparing the optical drive integrated stacked packaging structure 100 also includes step S05, which includes: setting a packaging layer 60 on the side of the packaging carrier 10 away from the driver chip 30, and the packaging layer 60 covers the LED chip 20.

[0087] In some embodiments of the present application, after completing step S05 , the prepared stacked package structure 100 can be disposed on a printed circuit board 200 , and the third metal layer 15 can be electrically connected to the printed circuit board 200 .

[0088] Figure 8 This is a schematic diagram of the film structure of the light board provided in some embodiments of the present application. Figure 8 As shown, in a third aspect, the present application implements a light board, the light board includes a printed circuit board 200 and at least one of the above-mentioned optical drive integrated stacked packaging structures 100, wherein the stacked packaging structure 100 is electrically connected to the printed circuit board 200. Specifically, the stacked packaging structure 100 is electrically connected to the printed circuit board 200 via a packaging carrier 10.

[0089] In summary, the present application provides a stacked packaging structure with an integrated optical drive, a preparation method thereof, and a light board, the stacked packaging structure comprising a packaging carrier, an LED chip and a driver chip, the packaging carrier comprising a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer stacked in sequence; the LED chip is arranged on a side of the first metal layer away from the first insulating layer, and the LED chip is electrically connected to the third metal layer through the first metal layer; the driver chip is arranged on a side of the second metal layer away from the first insulating layer, and the driver chip is electrically connected to the third metal layer through the second metal layer; wherein the third metal layer is used to be electrically connected to a printed circuit board. The present application can integrate the LED chip, the driver chip and the packaging carrier with a multi-layer structure into an independent stacked packaging structure, thereby reducing its planar size on the printed circuit board, which is beneficial to the improvement of the layout density of the LED chip, thereby increasing the number of partitions of the light board and achieving a more delicate picture effect; and can also transfer the drive circuit to the packaging carrier without affecting the connection stability of the LED chip, the driver chip and the printed circuit board, thereby effectively reducing the difficulty of planar wiring of the printed circuit board, thereby improving the production efficiency and yield of the printed circuit board, improving the problem of increased energy consumption caused by complex wiring, and standardizing the drive circuit path between the driver chip and the LED chip, thereby improving the difference in drive circuit length between the driver chip and the Mini LED chip, improving the resistance-capacitance delay problem, and improving the overall light output effect of the light board.

[0090] The above is a detailed introduction to a stacked packaging structure with an integrated optical drive and its preparation method and a light board provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A laminated packaging structure integrated with an optical drive, characterized in that: The stacked package structure comprises: The package carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are stacked in sequence; An LED chip is arranged on a side of the first metal layer away from the first insulating layer, and the LED chip is electrically connected to the third metal layer through the first metal layer; A driving chip is arranged on a side of the second metal layer away from the first insulating layer, and the driving chip is electrically connected to the third metal layer through the second metal layer; Wherein, the third metal layer is used for electrically connecting to a printed circuit board.

2. The optical drive integrated stacked packaging structure according to claim 1, characterized in that: The second insulating layer includes a solid portion and an opening, wherein the solid portion surrounds the opening, wherein the third metal layer is arranged on the solid portion, the opening exposes the second metal layer, and the driving chip is embedded in the opening and fixed to and electrically connected to the second metal layer.

3. The stacked package structure according to claim 2, characterized in that: The vertical projection of the LED chip on the packaging carrier is located within the vertical projection of the driver chip on the packaging carrier.

4. The stacked package structure according to claim 3, characterized in that: The stacked package structure further includes an adhesive, and the adhesive is filled between the driving chip and the side wall of the opening.

5. The stacked package structure according to claim 2, characterized in that: The thickness of the second insulating layer is greater than the thickness of the first insulating layer, and the thickness of the second insulating layer is greater than the sum of the thicknesses of the second metal layer and the driving chip.

6. The stacked package structure according to claim 5, characterized in that: The stacked packaging structure also includes a liner layer, which is arranged on a side of the driver chip away from the second metal layer, wherein a surface of the liner layer away from the driver chip is flush with a surface of the third metal layer away from the second insulating layer.

7. The stacked package structure according to claim 6, characterized in that: The pad layer contacts the printed circuit board, and the material of the pad layer includes metal or ceramic.

8. The stacked package structure according to claim 1, characterized in that: The first insulating layer and the second insulating layer are made of different materials.

9. A method for preparing a laminated packaging structure integrated with an optical drive, characterized in that: The method for preparing the optical drive integrated laminated packaging structure comprises the following steps: A packaging carrier is provided, wherein the packaging carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked, the second insulating layer comprises a solid portion and an opening, the solid portion surrounds the opening, the third metal layer is arranged on the solid portion, and the opening exposes the second metal layer; Embedding a driving chip in the opening, and electrically connecting the driving chip to the second metal layer; Filling an adhesive in the gap between the driver chip and the side wall of the opening, and curing the adhesive; The LED chip is arranged on a side of the packaging substrate away from the driver chip, and the LED chip is electrically connected to the first metal layer, wherein the vertical projection of the LED chip on the packaging substrate is located within the vertical projection of the driver chip on the packaging substrate.

10. A light board, characterized in that: The light board includes a printed circuit board and at least one optical drive-integrated stacked packaging structure as described in any one of claims 1 to 8, wherein the stacked packaging structure is electrically connected to the printed circuit board.

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