Electronic device including digitizer

Abstract

An electronic device may be provided. The electronic device may include: a housing; a display; the digitizer is arranged below the display; the absorption sheet is arranged below the digitizer; and the metal sheet is arranged below the absorption sheet. The absorbent sheet may include: first particles containing iron, silicon, and aluminum; and second particles comprising iron and silicon. The ratio of the second particles to the first particles may be 3: 7 or greater.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to an electronic device including a digitizer. Background Art

[0002] Due to the progress of information and communication technology and semiconductor technology, various functions are continuously integrated into a single portable electronic device. For example, the electronic device can realize not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, as well as schedule management functions and electronic wallet functions. These electronic devices are being miniaturized to facilitate users to carry.

[0003] The electronic device may receive various inputs from a user via an input device (e.g., a digital pen). The electronic device may recognize a position specified by the input device on the electronic device, and may perform a corresponding function. For example, the electronic device may recognize a position specified by the input device on the electronic device by using an electromagnetic resonance (hereinafter referred to as “EMR”) method or an active electrostatic (hereinafter referred to as “AES”) method. Summary of the invention

[0004] According to an embodiment of the present disclosure, an electronic device may include a housing, a display, a digitizer located below the display, an absorption sheet located below the digitizer, and a metal sheet located below the absorption sheet. The absorption sheet may include: first particles containing iron, silicon, and aluminum, and second particles containing iron and silicon. The ratio of the second particles to the first particles may be at least 7:3.

[0005] According to an embodiment of the present disclosure, a foldable electronic device may include: a housing including a first housing and a second housing; a display including a first display area on the first housing, a second display area on the second housing, and a folding area between the first display area and the second display area; a hinge structure connecting the first housing and the second housing, wherein at least a portion of the hinge structure is located below at least a portion of the folding area; a digitizer located below the display; and an absorbent sheet located below the digitizer. The absorbent sheet may include: first particles containing iron, silicon, and aluminum, and second particles containing iron and silicon. The ratio of the second particles to the first particles may be 3:7 or higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0007] Figure 2 is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0008] Figure 3 is a view showing an electronic device in a folded state according to an embodiment of the present disclosure.

[0009] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 5 2 is a view illustrating the operation of the digital pen according to an embodiment of the present disclosure.

[0011] Figure 6 is a block diagram illustrating a digital pen according to an embodiment of the present disclosure.

[0012] Figure 7 is an enlarged view of an absorbent sheet according to an embodiment of the present disclosure.

[0013] Figure 8a is a reference diagram for describing the magnetic permeability of first particles of an absorbent sheet according to an embodiment of the present disclosure. Figure 8b is a reference diagram for describing the magnetic permeability of second particles of an absorbent sheet according to an embodiment of the present disclosure.

[0014] Fig. 9 is a cross-sectional view of an electronic device including an electronic component according to an embodiment of the present disclosure.

[0015] Fig.10 is a cross-sectional view of an electronic device including a hinge structure according to an embodiment of the present disclosure.

[0016] Fig.11 is a reference diagram for describing a digitizer assembly with a shielding structure attached according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0017] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0018] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0019] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0020] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0021] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0022] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0023] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0024] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as being separated from the speaker, or as part of the speaker.

[0025] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0026] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0027] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0028] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0029] The connection end 178 may include a connector, via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0031] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0033] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in the communication network (e.g., the first network 198 or the second network 199) using the user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0035] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0036] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, for example, at least one antenna suitable for a communication scheme used in a communication network (e.g., a first network 198 or a second network 199) may be selected from the plurality of antennas by the communication module 190 (e.g., a wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0037] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0038] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0039] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same device as the electronic device 101, or a different type of device from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0040] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0041] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or replacement forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrases in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding parts from another part, and do not limit the parts in other aspects (e.g., importance or order). It will be understood that regardless of whether the term "operably" or "communicatively" is present, if an element (e.g., a first element) is referred to as being "coupled with another element (e.g., a second element)", "coupled to another element (e.g., the second element)", "connected with another element (e.g., the second element)" or "connected to another element (e.g., the second element)", it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0042] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0043] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0044] Figure 2 is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 3 is a view showing an electronic device in a folded state according to an embodiment of the present disclosure.

[0045] refer to Figure 2 and Figure 3 , the electronic device 101 may include: a housing 201, a hinge cover 240 configured to cover a foldable portion of the housing 201, and a display 230 disposed in a space defined by the housing 201. According to an embodiment, a surface exposing a screen output from the display 230 is defined as a front surface of the electronic device 101 (e.g., a first front surface 210a and a second front surface 220a). The surface opposite to the front surface is defined as a rear surface of the electronic device 101 (e.g., a first rear surface 210b and a second rear surface 220b). In addition, a surface surrounding a space between the front surface and the rear surface is defined as a side surface of the electronic device 101 (e.g., a first side surface 210c and a second side surface 220c). The side surface of the electronic device 101 may be a side surface of at least one of the first housing 210 or the second housing 220. Figure 2 and Figure 3 The electronic device 101 may be referred to as a “foldable electronic device”, a “portable electronic device” or a “portable foldable electronic device”. According to an embodiment, the housing 201 may be referred to as a “foldable housing”.

[0046] According to an embodiment, the housing 201 may include: a first housing 210, a second housing 220 rotatable relative to the first housing 210, a first rear surface cover 280 and a second rear surface cover 290. The housing 201 of the electronic device 101 is not limited to Figure 2 and Figure 3 The shapes and components shown in the figure can be realized by the combination and / or assembly of other shapes or components. For example, in an embodiment, the first housing 210 and the first rear surface cover 280 can be configured as a whole, and the second housing 220 and the second rear surface cover 290 can be configured as a whole.

[0047] According to an embodiment, the first housing 210 may include: a hinge structure (eg, Figure 4 The second housing 220 may include: a second front surface 220a connected to the hinge structure 202 and facing a third direction, and a second rear surface 220b facing a fourth direction opposite to the third direction, and the second housing 220 may rotate around the hinge structure 202 relative to the first housing 210. Therefore, the electronic device 101 can be changed to a folded state or an unfolded state. When the electronic device 101 is in the folded state, the first front surface 210a can face the second front surface 220a, and when the electronic device 101 is in the unfolded state, the third direction can be the same as the first direction. In the following, unless otherwise stated, the direction will be described with reference to the unfolded state of the electronic device 101.

[0048] According to an embodiment, the first housing 210 and the second housing 220 may be disposed on opposite sides about the folding axis A, and may have a substantially symmetrical shape with respect to the folding axis A. As will be described later, the angle or distance between the first housing 210 and the second housing 220 may vary depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. According to an embodiment, the second housing 220 further includes a sensor area 224 in which a sensor (e.g., a front camera) is disposed, but the second housing 220 may have a symmetrical shape with respect to the first housing 210 in other areas.

[0049] According to an embodiment, the folding axis A may be a plurality of (e.g., two) parallel folding axes. In the present disclosure, the folding axis A is arranged along the longitudinal direction (Y-axis direction) of the electronic device 101, but the direction of the folding axis A is not limited thereto. For example (not shown), the electronic device 101 may include a folding axis A extending along the width direction (e.g., X-axis direction).

[0050] According to an embodiment, the electronic device 101 may include a structure to which a digital pen may be attached. For example, the electronic device 101 may include a magnet configured to attach the digital pen to a side surface of the first housing 210 or a side surface of the second housing 220. According to an embodiment, the electronic device 101 may include a structure into which a digital pen may be inserted. For example, a hole (not shown) into which a digital pen may be inserted may be provided in a side surface of the first housing 210 or a side surface of the second housing 220 of the electronic device 101.

[0051] According to an embodiment, the first housing 210 and the second housing 220 may be at least partially made of a metal or non-metal material having a certain degree of hardness to support the display 230. At least a portion made of a metal material may provide a ground plane for the electronic device 101 and may be electrically connected to a printed circuit board (e.g., Figure 4 The ground wire on the board unit 260).

[0052] According to an embodiment, the sensor area 224 may be defined as a predetermined area having an edge or corner adjacent to the second housing 220. However, the arrangement, shape and size of the sensor area 224 are not limited to the example shown. For example, in other embodiments, the sensor area 224 may be provided at another corner in the second housing 220 or the first housing 210, or at any area between the upper end corner and the lower end corner. In an embodiment, components embedded in the electronic device 101 to perform various functions may be exposed on the front surface of the electronic device 101 through the sensor area 224 or through one or more openings provided in the sensor area 224. In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0053] According to an embodiment, the first rear surface cover 280 may be provided on the rear surface of the electronic device 101 on one side of the folding axis A, and may have, for example, a substantially rectangular periphery that may be surrounded by the first housing 210. Similarly, the second rear surface cover 290 may be arranged on the rear surface of the electronic device 101 on the other side of the folding axis A, and the periphery of the second rear surface cover 290 may be surrounded by the second housing 220.

[0054] According to an embodiment, the first rear surface cover 280 and the second rear surface cover 290 may have a shape that is substantially symmetrical about the folding axis (axis A). However, the first rear surface cover 280 and the second rear surface cover 290 do not necessarily have mutually symmetrical shapes, and in another embodiment, the electronic device 101 may include the first rear surface cover 280 and the second rear surface cover 290 having various shapes.

[0055] According to an embodiment, the first rear surface cover 280, the second rear surface cover 290, the first housing 210, and the second housing 220 may define a space in which various components of the electronic device 101 (e.g., a printed circuit board or a battery) may be disposed. According to an embodiment, one or more components may be disposed on the rear surface of the electronic device 101 or may be visibly exposed on the rear surface of the electronic device 101. For example, a sub-display (e.g., Figure 4 At least a portion of the sub-display 244 in the display may be visibly exposed through at least a portion of the first rear surface cover 280. In another embodiment, one or more components or sensors may be visibly exposed through at least a portion of the second rear surface cover 290. In various embodiments, the sensor may include a proximity sensor and / or a camera module 206 (e.g., a rear camera).

[0056] According to an embodiment, the front camera exposed to the front surface of the electronic device 101 through one or more openings provided in the sensor area 224 or the camera module 206 exposed through at least a portion of the second rear surface cover 290 may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101.

[0057] According to an embodiment, the hinge cover 240 is disposed between the first housing 210 and the second housing 220 and may cover internal components (eg, Figure 4 According to an embodiment, the hinge cover 240 may be covered by a portion of the first housing 210 and a portion of the second housing 220, or may be exposed to the outside, depending on the state of the electronic device 101 (the unfolded state (flat state) or the folded state).

[0058] According to the embodiment, Figure 2 As shown, when the electronic device 101 is in the unfolded state, the hinge cover 240 may be covered by the first housing 210 and the second housing 220 without being exposed. Figure 3 As shown, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge cover 240 may be exposed to the outside between the first housing 210 and the second housing 220. As another example, when the first housing 210 and the second housing 220 are in an intermediate state where the first housing 210 and the second housing 220 are folded at a certain angle between the first housing 210 and the second housing 220, the hinge cover 240 may be partially exposed to the outside between the first housing 210 and the second housing 220. However, in this case, the exposed area may be smaller than the exposed area in the fully folded state. According to an embodiment, the hinge cover 240 may include a curved surface.

[0059] According to an embodiment, the display 230 may be located in a space defined by the housing 201. For example, the display 230 may be located in a groove defined by the housing 201, and may constitute most of the front surface of the electronic device 101. Therefore, the front surface of the electronic device 101 may include the display 230 and partial areas of the first housing 210 and the second housing 220 adjacent to the display 230. The rear surface of the electronic device 101 may include a first rear surface cover 280, a partial area of ​​the first housing 210 adjacent to the first rear surface cover 280, a second rear surface cover 290, and a partial area of ​​the second housing 220 adjacent to the second rear surface cover 290.

[0060] According to an embodiment, the display 230 may refer to a display that is at least partially deformable into a flat surface or a curved surface. For example, the display 230 may be a foldable or flexible display. According to an embodiment, the display 230 may include: a folding area 233, a side of the folding area 233 (for example, Figure 2 The first display area 231 is provided on the left side of the folding area 233 as shown, and the other side of the folding area 233 (for example, Figure 2 The second display area 232 is on the right side of the folding area 203 shown.

[0061] According to an embodiment, the display 230 may include: a first display area 231 provided on the first housing 210, a second display area 232 provided on the second housing 220, and a folding area 233 located between the first display area 231 and the second display area 232. According to an embodiment, the first display area 231 and the second display area 232 may be rotatable around a folding axis A.

[0062] However, the area division of the display 230 is illustrative, and the display 230 may be divided into a plurality of areas (eg, four or more areas or two areas) depending on its structure or function. Figure 2 In the illustrated embodiment, the area of ​​the display 230 may be divided by the folding area 233 or the folding axis (axis A) extending parallel to the Y axis. However, in another embodiment, the area of ​​the display 230 may be divided based on another folding area (e.g., a folding area parallel to the X axis) or another folding axis (e.g., a folding axis parallel to the X axis). According to an embodiment, the display 230 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect a magnetic field type stylus (not shown), or disposed adjacent to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect a magnetic field type stylus (not shown).

[0063] According to an embodiment, the first display area 231 and the second display area 232 may have a shape that is substantially symmetrical with respect to the folding area 233. According to an embodiment (not shown), unlike the first display area 231, the second display area 232 may include a notch cut due to the presence of the sensor area 224, but may have a shape symmetrical to the first display area 231 in an area other than the sensor area. In other words, the first display area 231 and the second display area 232 may include portions that are symmetrical in shape to each other and portions that are asymmetrical in shape to each other.

[0064] Hereinafter, operations of the first housing 210 and the second housing 220 according to the state of the electronic device 101 (eg, a flat or unfolded state and a folded state) and various areas of the display 230 will be described.

[0065] According to an embodiment, when the electronic device 101 is in an unfolded state (flat state) (eg, Figure 2 ), the first housing 210 and the second housing 220 may be arranged to form an angle of 180 degrees therebetween and be oriented in the same direction. The surface of the first display area 231 of the display 230 and the surface of the second display area 232 may form 180 degrees therebetween and may be oriented in the same direction (e.g., the front direction of the electronic device). The folding area 233 may define the same plane as the first display area 231 and the second display area 232.

[0066] According to an embodiment, when the electronic device 101 is in a folded state (eg, Figure 3 ), the first housing 210 and the second housing 220 may be arranged to face each other. The surface of the first display area 231 and the surface of the second display area 232 of the display 230 may face each other while forming a narrow angle (e.g., between 0 and 10 degrees) therebetween. At least a portion of the folding area 233 may be arranged to be a curved surface having a predetermined curvature.

[0067] According to an embodiment, when the electronic device 101 is in an intermediate state (not shown), the first housing 210 and the second housing 220 may be arranged to form a certain angle therebetween. The surface of the first display area 231 and the surface of the second display area 232 of the display 230 may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. At least a portion of the folded area 233 may form a curved surface having a predetermined curvature, and the curvature in this case may be smaller than the curvature in the folded state.

[0068] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0069] refer to Figure 4 , the electronic device 101 may include a housing 201, a display 230, a hinge structure 202, a battery 250, and a board unit 260. The housing 201 may include a first housing 210, a second housing 220, a first rear surface cover 280, and a second rear surface cover 290. Figure 4 The configuration of the first shell 210, the second shell 220, the hinge cover 240, the first rear surface cover 280 and the second rear surface cover 290 may be the same as Figure 2 and / or Figure 3 The configurations of the first shell 210, the second shell 220, the hinge cover 240, the first rear surface cover 280 and the second rear surface cover 290 are completely or partially the same.

[0070] According to an embodiment, the first housing 210 and the second housing 220 may be assembled with each other to be coupled to opposite sides of the hinge structure 202. According to an embodiment, the first housing 210 may include: a first support area 212 capable of supporting components of the electronic device 101 (e.g., a first circuit board 262 and / or a first battery 252), and a first side wall 211 surrounding at least a portion of the first support area 212. The first side wall 211 may include a first side surface of the electronic device 101 (e.g., Figure 2 According to an embodiment, the second housing 220 may include: a second supporting area 222 capable of supporting components of the electronic device 101 (e.g., a second circuit board 264 and / or a second battery 254), and a second side wall 221 surrounding at least a portion of the second supporting area 222. The second side wall 221 may include a second side surface of the electronic device 101 (e.g., Figure 2 The second side surface 220c).

[0071] According to an embodiment, the display 230 may include a first display area 231 , a second display area 232 , a folding area 233 , and a sub-display 244 . Figure 3 The configuration of the first display area 231, the second display area 232 and the folding area 233 can be the same as Figure 1 and / or Figure 2 The configurations of the first display area 231, the second display area 232 and the folding area 233 are completely or partially the same or similar.

[0072] According to an embodiment, the sub display 244 may display a screen in a direction different from the display areas 231 and 232. For example, the sub display 234 may output a screen in a direction opposite to the first display area 231. According to an embodiment, the sub display 234 may be provided on the first rear surface cover 280.

[0073] According to an embodiment, the battery 250 may include a first battery 252 disposed in the first housing 210 and a second battery 254 disposed in the second housing 220. According to an embodiment, the first battery 252 may be connected to the first circuit board 262, and the second battery 254 may be connected to the second circuit board 264. According to an embodiment, the battery 250 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0074] According to an embodiment, the board unit 260 may include a first circuit board 262 disposed in the first housing 210 and a second circuit board 264 disposed in the second housing 220. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be electrically connected to each other through at least one flexible circuit board 266. According to an embodiment, at least a portion of the flexible circuit board 266 may be disposed across the hinge structure 202. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be disposed in a space defined by the first housing 210, the second housing 220, the first rear surface cover 280, and the second rear surface cover 290. Components for implementing various functions of the electronic device 101 may be mounted on the first circuit board 262 and the second circuit board 264.

[0075] According to an embodiment, the electronic device 101 may include speakers 208a and 208b. According to an embodiment, the speakers 208a and 2008b may convert electrical signals into sounds. According to an embodiment, the speakers 208a and 208b may be disposed in a space defined by the first housing 210, the second housing 220, the first rear surface cover 280, and the second rear surface cover 290. According to an embodiment, the speakers 208a and 208b may include an upper speaker 208a located at the upper portion (+Y direction) of the electronic device 101 and a lower speaker 208b located at the lower portion (-Y direction) of the electronic device 101. In the present disclosure, the speakers 208a and 208b are shown as being located in one housing (e.g., Figure 4 The speaker 208a and the speaker 208b may be located in at least one of the first housing 210 and the second housing 220. Figure 4 The configuration of the speakers 208a and 208b in Figure 1 The configuration of the sound output module 155 in FIG. 1 is completely or partially the same.

[0076] According to an embodiment, the electronic device 101 may include a rear member 270 (or a rear case). According to an embodiment, the rear member 270 may be disposed within the case 201 (eg, the second case 220). According to an embodiment, the rear member 270 may accommodate at least one antenna 275.

[0077] According to an embodiment, the electronic device 101 may include an antenna 275. The antennas 275a and 275b may include, for example, an ultra-wideband (UWB) antenna 275a, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna 275b. For example, the antenna 275 may perform short-range communication with an external device, or may wirelessly transmit / receive power required for charging to / from an external device.

[0078] In an embodiment, the antenna structure may be provided by a portion of the housing 201 or a combination thereof. For example, the antenna 275 may include a communication antenna 275c that is at least partially exposed to the outside of the electronic device 101 and defines at least a portion of the outside of the electronic device 101. The communication antenna 275c may be used for communication with an external electronic device (e.g., Wi-Fi). The communication antenna 275c may be connected to the upper portion 271a or the lower portion 271b of the rear member 270.

[0079] In the detailed description below, paired shells may be exemplified for a configuration in which the shells are rotatably coupled to each other via a hinge structure. It should be noted that the electronic device according to the various embodiments disclosed herein is not limited by these embodiments. For example, the electronic device according to the various embodiments disclosed herein may include three or more shells, and the "paired shells" in the embodiments disclosed below may mean "two shells rotatably coupled to each other among the three or more shells".

[0080] Herein, the electronic device 101 is described as having a foldable electronic device structure, but the structure of the electronic device 101 is not limited thereto. For example, the electronic device 101 may be a tablet or a bar-shaped smart phone.

[0081] Figure 5 2 is a view illustrating the operation of the digital pen according to an embodiment of the present disclosure.

[0082] refer to Figure 5 , the electronic device 300 may include a display 310 , a digitizer 320 , an absorption sheet 330 , and a metal sheet 340 . Figure 5 The configuration of the electronic device 101 and the display 310 may be similar to Figure 2 , Figure 3 and / or Figure 4 The configurations of the electronic device 101 and the display 230 are completely or partially identical.

[0083] According to an embodiment, the digitizer 320 may be a device configured to detect a signal from a digital pen (eg, Figure 6The digitizer 320 may be referred to as an electromagnetic induction panel. The digital pen may provide input to the electronic device 101 using an electromagnetic resonance (EMR), an active electronic stylus (AES), or an electrically coupled resonance (ECR) method. The digital pen may be referred to as a stylus. For example, the digitizer 320 may include a circuit board (e.g., a printed circuit board or a flexible printed circuit board) and a plurality of coils located within the circuit board. The plurality of coils may generate a magnetic field. The digital pen may resonate based on the magnetic field generated from the digitizer, and a resonant magnetic field may be formed in the coil of the digital pen. Through the magnetic field formed from the digital pen, a current may be output from the coil of the digitizer 320. The electronic device 101 may identify (or detect) the position of the digital pen 400 based on the magnitude of the current per channel output from the plurality of coils of the digitizer 320 (e.g., the converted digital value). According to an embodiment, the digitizer 320 may include a pattern layer forming a transmission pattern and a pattern layer forming a reception pattern. The transmission pattern layer and the reception pattern layer may be stacked on each other to generate or detect an electromagnetic field. The electronic device 101 can detect the magnetic field generated from the digital pen by the EMR method using the digitizer 320, and can detect various actions such as approach, click, or drag of the digital pen. According to an embodiment, the digitizer 320 may include coils 321 and 321 capable of generating a magnetic field based on the movement of the digital pen 400. For example, the digitizer 320 may include a first coil 321 facing the display 310 and a second coil 322 facing the absorption sheet 330.

[0084] According to an embodiment, the digitizer 320 may be referred to as a part of the display 310. For example, the display 310 and the digitizer 320 may be provided as a single modular component (eg, a display assembly).

[0085] According to an embodiment, the absorption sheet 330 may enhance the sensitivity of detecting an input (e.g., approach) of the digital pen 400. For example, the absorption sheet 330 may increase the inductance of the coil 401 of the digital pen 400. For example, the absorption sheet 330 may have a specified magnetic permeability and / or thickness to increase the inductance of the coil 401. According to an embodiment, the absorption sheet 330 may support the digitizer 320. For example, the absorption sheet 330 may be located below the digitizer (320) (in the -Z direction).

[0086] According to an embodiment, the absorption sheet 330 can reduce electromagnetic interference of the digitizer 320. According to an embodiment, the absorption sheet 330 may include magnetic metal powder. For example, the absorption sheet 330 may be referred to as a layer of magnetic metal powder applied under the digitizer 320. In addition to the signal input from the digital pen, the absorption sheet 330 may also reduce the electromagnetic interference of the housing (e.g., Figure 4The magnitude of the magnetic field transmitted from the electronic components in the housing 201 of the electronic device 101 to the digitizer 320. By reducing the magnetic field transmitted from the electronic components in the electronic device 101 to the digitizer 320, the noise of the digitizer 320 can be reduced. According to an embodiment, the absorption sheet 330 can be called a high-frequency absorption sheet.

[0087] According to an embodiment, the metal sheet 340 may provide uniform inductance. For example, the metal sheet 340 may include a metal (e.g., copper), and may reduce destructive interference due to eddy currents. For example, the metal sheet 340 may reduce eddy currents generated in the digitizer 320 by allowing at least a portion of the magnetic field passing through the digitizer 320 and the absorption sheet 330 to flow inside the metal sheet 340.

[0088] According to an embodiment, the metal sheet 340 may support the digitizer 320 and / or the absorption sheet 330. For example, the metal sheet 340 may be disposed below (in the -Z direction) the absorption sheet 330. According to an embodiment, the metal sheet 340 may be referred to as a support sheet or a support plate.

[0089] According to an embodiment, the digital pen 400 may respond to a magnetic field generated from the digitizer 320. For example, the digital pen 400 may include a coil 401 configured to resonate based on the magnetic field generated from the digitizer 320. The digital pen 400 may generate a magnetic field using the resonance of the coil 401. The digitizer 320 may output a current based on the magnetic field generated from the digital pen 400.

[0090] According to an embodiment, the digital pen 400 may store power using a capacitor. For example, the digital pen 400 may include at least one variable capacitor 402 and at least one fixed capacitor 403.

[0091] According to an embodiment, the memory (eg, Figure 1 The memory 130 in the electronic device 300 may store calibration values ​​for the digital pen 400 to operate in a non-interference state. Figure 1 The processor 120 in the memory 130 may determine the input of the digital pen 400 using the calibration value stored in the memory 130. However, when the magnetic permeability of the digitizer 320 and / or the absorption sheet 330 changes due to the magnetic field generated from the surrounding magnets, the accuracy of the processor 120 in determining the position of the digital pen 400 may be reduced. The absorption sheet 330 may have a saturation magnetic flux density value to reduce the change in magnetic permeability.

[0092] Figure 6 is a block diagram illustrating a digital pen according to an embodiment of the present disclosure.

[0093] refer to Figure 6, the digital pen 400 may include a processor 460, a memory 470, a resonant circuit 487, a charging circuit 488, a battery 489, a communication circuit 490, an antenna 497, and / or a trigger circuit 498. In some embodiments, the processor 460, at least a portion of the resonant circuit 487, and / or at least a portion of the communication circuit 490 of the digital pen 400 may be configured on a printed circuit board or in the form of a chip. The processor 460, the resonant circuit 487, and / or the communication circuit 490 may be electrically connected to the memory 470, the charging circuit 488, the battery 489, the antenna 497, or the trigger circuit 498. The digital pen 400 according to the embodiment may include only a resonant circuit and a button.

[0094] The processor 460 may include a customized hardware module or a general-purpose processor configured to execute software (e.g., an application). The processor may include hardware components (functions) or software elements (programs), including at least one of various sensors provided in the digital pen 400, a data measurement module, an input / output interface, a module configured to manage the state or environment of the digital pen 400, or a communication module. The processor 460 may include, for example, one of hardware, software, or firmware, or a combination of two or more. According to an embodiment, the processor 460 may receive and receive data from an electronic device (e.g., a computer) via the resonant circuit 487. Figure 1 When the proximity signal is recognized, the resonance circuit 487 may be controlled to send an electromagnetic resonance (EMR) input signal to the electronic device 101.

[0095] The memory 470 may store information related to the operation of the digital pen 400. For example, the information may include information communicated with the electronic device 101 and frequency information associated with the input operation of the digital pen 400.

[0096] The resonant circuit 487 may include at least one of a coil, an inductor, or a capacitor. The digital pen 400 may generate a signal including a resonant frequency using the resonant circuit 487. For example, in order to generate a signal, the digital pen 400 may use at least one of an electromagnetic resonance (EMR) method, an active electrostatic (AES) method, or an electric coupling resonance (ECR) method. When the digital pen 400 sends a signal by the EMR method, the digital pen 400 may generate a signal including a resonant frequency based on an electromagnetic field generated by a sensing panel of the electronic device 101. When the digital pen 400 sends a signal by the AES method, the digital pen 400 may generate a signal by using capacitive coupling with the electronic device 101. When the digital pen 400 sends a signal by the ECR method, the digital pen 400 may generate a signal including a resonant frequency based on an electric field generated by a capacitive device of the electronic device 101. According to an embodiment, the resonant circuit 487 may be used to change the intensity or frequency of the electromagnetic field according to the operation state of the user. For example, the resonant circuit 487 may provide a frequency for identifying a hover input, a drawing input, a button input, or an erase input.

[0097] When the charging circuit 488 is connected to the resonance circuit 487 based on the switching circuit, the resonance signal generated by the resonance circuit 487 may be rectified into a DC signal and may be provided to the battery 489. According to an embodiment, the digital pen 400 may recognize whether the digital pen 400 is inserted into a protective cover (e.g., Figure 5 In the protective cover 300).

[0098] The battery 489 may be configured to store power required for the operation of the digital pen 400. The battery may include, for example, a lithium-ion battery or a capacitor, and may be rechargeable or replaceable. According to an embodiment, the battery 489 may be charged by using power (e.g., a DC signal (DC power)) supplied from the charging circuit 488.

[0099] The communication circuit 490 may be configured to perform communication between the digital pen 400 and an electronic device (eg, Figure 1 The communication module (eg, Figure 1 According to an embodiment, the communication circuit 490 may transmit the state information and input information of the digital pen 400 to the electronic device 101 by using a short-range communication method. For example, the communication circuit 490 may transmit the direction information (e.g., motion sensor data) of the digital pen 400 acquired by the trigger circuit 498, voice information input via a microphone, or information about the remaining power of the battery 489 to the electronic device 101. As an example, the short-range communication method may include at least one of Bluetooth, Bluetooth Low Energy (BLE), or wireless LAN.

[0100] The antenna 497 may be used to transmit / receive signals or power to / from the outside (e.g., the electronic device 101). According to an embodiment, the digital pen 400 may include a plurality of antennas 497, and at least one suitable antenna 497 for a communication method may be selected from among the plurality of antennas 497. The communication circuit 490 may exchange signals or power with an external electronic device via the selected at least one antenna 497.

[0101] The trigger circuit 498 may include at least one button or sensor circuit. According to an embodiment, the processor 460 may identify an input method (e.g., touch or press) or type (e.g., EMR button or BLE button) of a button of the digital pen 400. According to an embodiment, the sensor circuit may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the digital pen 400. For example, the sensor circuit may include at least one of a motion sensor, a remaining battery capacity detection sensor, a pressure sensor, an optical sensor, a temperature sensor, a geomagnetic sensor, and a biosensor. According to an embodiment, the trigger circuit 498 may send a trigger signal to the electronic device 101 by using an input signal of a button or a signal obtained by a sensor.

[0102] Figure 6 The configuration of the resonant circuit 487 and the battery 489 can be Figure 5 The configurations of the coil 401 and the capacitors 402, 403 are completely or partially the same.

[0103] Figure 7 is an enlarged view of an absorbent sheet according to an embodiment of the present disclosure. Figure 8a is a reference diagram for describing the magnetic permeability of first particles of an absorbent sheet according to an embodiment of the present disclosure. Figure 8b is a diagram illustrating the magnetic permeability of the second particles of the absorbent sheet according to an embodiment of the present disclosure. Figure 8a and Figure 8b , the Y-axis represents the magnetic permeability (unit: μ), and the X-axis represents the particle size of the particles (unit: μm).

[0104] refer to Figure 7 , the absorbent sheet 330 may include first particles 331 and second particles 332 . Figure 7 The configuration of the absorbent sheet 330 can be Figure 5 The configuration of the absorbent sheet 330 is completely or partially the same. Figure 7 The structure of the absorbent sheet 330 described may be applied to the absorbent sheet 330 described herein.

[0105] According to an embodiment, the absorption sheet 330 may have a structure for achieving a coefficient of performance and a performance retention rate. For example, the absorption sheet 330 may include first particles 331 and second particles 332 having different materials.

[0106] According to an embodiment, the first particles 331 may be made of a material for improving the magnetic permeability of the absorption sheet 330. The first particles 331 may include iron (Fe), silicon (Si) and aluminum (Al). For example, the first particles 331 may be iron, silicon and aluminum alloy powder. According to an embodiment, the first particles 331 may have a flake shape. For example, the first particles 331 may be iron, silicon and aluminum alloy powder processed into a flake shape. According to an embodiment, the particle size of the first particles 331 may be 90 μm or less. For example, the particle size of the first particles 331 may be 40 to 90 μm.

[0107] According to an embodiment, the second particles 332 may be made of a material that improves the saturation magnetic flux density. The second particles 332 may include iron (Fe) and silicon (Si). According to an embodiment, the particle size of the second particles 332 may be 15 μm or larger. For example, the particle size of the second particles 332 may be 20 to 40 μm. According to an embodiment, the particle size of the second particles 332 may be 15 to 40 μm. According to an embodiment, the second particles 332 may be located in the empty space formed by the first particles 331.

[0108] According to an embodiment, the second particles 332 may be in a flake shape. For example, the second particles 332 may be iron and silicon alloy powder processed into a flake shape.

[0109] According to an embodiment, the magnetic permeability of the first particles 331 may be higher than that of the second particles 332. According to an embodiment, the saturation magnetic flux density of the second particles 332 may be higher than that of the first particles 331. For example, the performance coefficient of the second particles 332 may be higher than that of the first particles 331.

[0110] According to an embodiment, the magnetic permeability of the first particles 331 may be about 200μ. The saturation magnetic flux density of the second particles 331 may be about 0.8 T. According to an embodiment, the magnetic permeability of the second particles 332 may be about 60 to 80. The saturation magnetic flux density of the second particles 332 may be about 1.6T.

[0111] Here, the particle size (or grain size) of the first particle 331 and / or the second particle 332 may be defined by a D50 method. For example, the particle size of the first particle 331 may be referred to as a particle size corresponding to an intermediate value.

[0112] According to an embodiment, the absorption sheet 330 including the first particles 331 and the second particles 332 may have a specified magnetic permeability. For example, the absorption sheet 330 may have a magnetic permeability for improving the magnetic conductivity of a digital pen (eg, Figure 5 and / or Figure 6 According to an embodiment, the absorption sheet 330 may have a magnetic permeability of 100 μ or more. In order to improve the inductance of the digital pen 400, the performance coefficient (CP) of the absorption sheet 330 may satisfy the following formula 1.

[0113] (Formula 1)

[0114] CP=D×P

[0115] In Formula 1, D refers to the thickness D of the absorbent sheet 330, and P refers to the magnetic permeability of the absorbent sheet 330. For example, the coefficient of performance (CP) of the absorbent sheet 330 may be the product of the thickness D of the absorbent sheet 330 and the magnetic permeability P of the absorbent sheet 330. The coefficient of performance (CP) of the absorbent sheet 330 may be about 4700 or more. In an embodiment, the coefficient of performance (CP) of the absorbent sheet 330 may be about 4750. In order to make electronic devices (e.g., Figure 2 In order to make the electronic device 101 thinner and lighter, the thickness D of the absorption sheet 330 can be limited. For example, the thickness D of the absorption sheet 330 can be about 40 to 50 μm.

[0116] The performance coefficient (CP) of the absorption sheet 330 may be selectively designed. In an embodiment, the performance coefficient (CP) of the absorption sheet 330 may be about 3000 or more. Since the performance coefficient (CP) of the absorption sheet 330 is designed to be 3000 or more, an input (e.g., hovering) of the digital pen 400 may be detected by the digitizer 320.

[0117] According to an embodiment, the absorption sheet 330 may have a specified saturation magnetic flux density. The absorption sheet 330 may have a saturation magnetic flux density for reducing the inductance drop caused by other components (e.g., the electronic component 370 and / or the hinge structure 380). According to an embodiment, the absorption sheet 330 may have a saturation magnetic flux density of 1.5T or more.

[0118] According to an embodiment, since the absorption sheet 330 has a specified saturation magnetic flux density, the performance retention rate of the absorption sheet 330 may satisfy the following formula 2. The performance retention rate of the absorption sheet 330 may be a ratio of a first magnetic permeability in a state where a magnetic field of a specified magnitude (e.g., 50 Gauss) is applied to the absorption sheet 330 to a second magnetic permeability in a state where a magnetic field of a specified magnitude is not applied to the absorption sheet 330. According to an embodiment, the magnetic field of a specified magnitude applied to the absorption sheet 330 is exemplary. For example, the specified magnitude of the magnetic field may be the magnetic field from a component of the electronic device 300 (e.g., Figure 4The magnetic field transmitted by the hinge structure 202 in the digitizer 320 to the absorber 330 needs to be shielded to keep the performance of the digitizer 320 to a minimum.

[0119] The performance maintenance ratio (CM) of the absorbent sheet 330 may satisfy the following Formula 2. The performance maintenance ratio (CM) of the absorbent sheet 330 may be referred to as a tolerance factor.

[0120] (Formula 2)

[0121]

[0122] In the above formula 2, CP1 can be referred to as the performance coefficient of the absorption sheet 330 in a state where a magnetic field of a specified size (e.g., 50 Gauss or 40 Gauss) is applied to the absorption sheet 330. CP2 can be referred to as the performance coefficient of the absorption sheet 330 in a state where a magnetic field of a specified size (e.g., 50 Gauss or 40 Gauss) is applied to the absorption sheet 330. The numerical value of the magnitude of the magnetic field applied to the absorption sheet 330 is exemplary. For example, CP1 can be the performance coefficient of the absorption sheet 330 facing or adjacent to the electronic component 370 or the hinge structure 380 configured to generate a magnetic field. CP2 can be referred to as the performance coefficient of the absorption sheet 330 that is not facing or adjacent to the electronic component 370 or the hinge structure 380 configured to generate a magnetic field, or the performance coefficient detected using the absorption sheet 330 in a state where the electronic component 370 or the hinge structure 380 is removed.

[0123] According to an embodiment, the absorption sheet 330 may have a performance retention rate of 30% or more. Since the absorption sheet 330 has a performance retention rate of 30% or more, a processor (eg, Figure 1 The processor 120 in the embodiment of the present invention can improve the accuracy of the position determination of the digital pen 400. For example, as the performance retention rate is higher, the change in the magnetic permeability of the absorption sheet 330 can be reduced, and the calibration accuracy of the processor 120 can be improved.

[0124] The design of the performance retention rate of the absorbent sheet 330 may vary. For example, in an embodiment, the absorbent sheet 330 may have a performance retention rate of 20% or more. In an embodiment, the absorbent sheet 330 may have a performance retention rate of 15% or more.

[0125] According to an embodiment, the absorbent sheet 330 may include first particles 331 and second particles 332, and the first particles 331 and the second particles 332 have a composition ratio for achieving a coefficient of performance and a performance retention rate. According to an embodiment, the weight ratio of the first particles 331 to the absorbent sheet 330 may be 30w% or less. According to an embodiment, the weight ratio of the second particles 332 to the absorbent sheet 330 may be 70w% or more. According to an embodiment, the mixing ratio of the second particles 332 may be about 80% to 90%. According to an embodiment, the ratio of the second particles 332 to the first particles 331 may be 3:7 or more. According to an embodiment, the absorbent sheet 330 may be composed of the first particles 331 and the second particles 332.

[0126] According to an embodiment, the magnetic permeability P of the absorbent sheet 330 may be determined based on the ratio of the first particles 331 to the second particles 332. For example, the magnetic permeability P of the absorbent sheet 330 may be the sum of the product of the magnetic permeability of the first particles 331 and the ratio of the first particles 331 and the product of the magnetic permeability of the second particles 332 and the ratio of the second particles 332.

[0127] refer to Figure 8a , the magnetic permeability of the first particles 331 may vary based on the particle size of the first particles 331. For example, referring to a first graph g1 showing the first magnetic permeability according to the first particle size d1 of the first particles 331, the first magnetic permeability E1 of the first particles 331 may substantially satisfy Formula 3 below.

[0128] (Formula 3)

[0129] E1=50+2.5×d1

[0130] refer to Figure 8b , the magnetic permeability of the second particles 332 may vary based on the particle size of the second particles 332. For example, the second graph g2 shows the second magnetic permeability E2 according to the second particle size d2 of the second particles 332. The second magnetic permeability E2 of the second particles 332 may substantially satisfy Formula 4 below.

[0131] (Formula 4)

[0132] E2=30+1.88×d2

[0133] The ratio, magnetic permeability and / or particle size of the first particles 331 and the second particles 332 of the absorbent sheet 330 may be selected to achieve a coefficient of performance and a performance retention rate. For example, the ratio, magnetic permeability and / or particle size of the first particles 331 and the second particles 332 may be selected to achieve a coefficient of performance of a specified size (e.g., 4750) and a performance retention rate of a specified size (e.g., 20% or 30%) or more. According to an embodiment, the ratio, magnetic permeability and / or performance retention rate of the first particles 331 and the second particles 332 may be changed based on the thickness of the absorbent sheet 330. According to an embodiment, when a magnetic field of a specified size (e.g., 50 Gauss) is applied to the absorbent sheet 330, the magnetic permeability of the first particles 331 may be reduced by about 87%, and the magnetic permeability of the second particles 332 may be reduced by about 64%.

[0134] The first to sixth embodiments are exemplary embodiments for describing the structure of the absorbent sheet 330 .

[0135] According to an embodiment, when a magnetic field of a specified size (e.g., 50 Gauss) is applied to the first particles 331, the performance retention rate of the first particles 331 may be 13%. When a magnetic field of a specified size (e.g., 50 Gauss) is applied to the second particles 332 of the second embodiment, the performance retention rate may be about 36%.

[0136] According to the embodiments (eg, the first embodiment, the second embodiment, and the third embodiment), the thickness of the absorption sheet 330 may be about 50 μm.

[0137] In the embodiment (first embodiment), the absorbent sheet 330 may not include the first particles 331, but may include the second particles 332. The particle size of the second particles 332 may be about 34.6 μm, and the magnetic permeability may be 95.048 μm. The absorbent sheet 330 of the first embodiment may have a magnetic permeability of about 95 μm, a performance coefficient of about 4750, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 34 μm and a performance retention rate of about 36%.

[0138] In one embodiment (second embodiment), the absorbent sheet 330 may include a first particle 331 having a weight ratio of about 11w% and a second particle 332 having a weight ratio of about 89w%. The first particle 331 may have a particle size of about 76μm and a magnetic permeability of about 240μ. The second particle 332 may have a particle size of about 25μm and a magnetic permeability of about 77μ. The absorbent sheet 330 of the second embodiment may have a magnetic permeability of about 95μ, a performance coefficient of about 4747, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 28μ and a performance retention rate of about 30%.

[0139] In an embodiment (third embodiment), the absorbent sheet 330 may include a first particle 331 having a weight ratio of about 25w% and a second particle 332 having a weight ratio of about 75w%. The first particle 331 may have a particle size of about 20μm and a magnetic permeability of 100μ. The second particle 332 may have a particle size of about 33.7μm and a magnetic permeability of about 93.356μ. The absorbent sheet 330 of the third embodiment may have a magnetic permeability of about 95μ, a performance coefficient of about 4751, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 28μ and a performance retention rate of about 30%.

[0140] According to embodiments (eg, the fourth embodiment, the fifth embodiment, and the sixth embodiment), the thickness of the absorbent sheet 330 may be about 40 μm.

[0141] In the embodiment (fourth embodiment), the absorbent sheet 330 may not include the first particles 331, but may include the second particles 332. The second particles 332 may have a particle size of about 47.3 μm and a magnetic permeability of about 118.92 μm. The absorbent sheet 330 of the fourth embodiment may have a magnetic permeability of about 119 μm, a performance coefficient of about 4757, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 43 μm and a performance retention rate of about 36%.

[0142] In an embodiment (fifth embodiment), the absorbent sheet 330 may include a first particle 331 having a weight ratio of about 13.3w% and a second particle 332 having a weight ratio of about 86.7w%. The first particle 331 may have a particle size of about 80μm and a magnetic permeability of 250μ. The second particle 332 of the fifth embodiment may have a particle size of about 25μm and a magnetic permeability of about 77μ. The absorbent sheet 330 of the second embodiment may have a magnetic permeability of about 95μ, a performance coefficient of about 4750, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 35μ and a performance retention rate of about 30%.

[0143] In an embodiment (sixth embodiment), the absorbent sheet 330 may include a first particle 331 having a weight ratio of about 25w% and a second particle 332 having a weight ratio of about 75w%. The first particle 331 may have a particle size of about 20μm and a magnetic permeability of 100μ. The second particle 332 may have a particle size of about 50.6μm and a magnetic permeability of about 125.128μ. The absorbent sheet 330 of the sixth embodiment may have a magnetic permeability of about 119μ, a performance coefficient of about 4754, and when a magnetic field of a specified size (e.g., 50 Gauss) is applied, it may have a magnetic permeability of about 37μ and a performance retention rate of about 31%.

[0144] The structures of the first particles 331 and the second particles 332 of the absorbent sheet 330 described in the first to sixth embodiments are exemplary. For example, the absorbent sheet 330 may be selected in various ways as long as it has a performance coefficient of 4750 and a performance retention rate of 30% or more.

[0145] According to an embodiment, the absorbent sheet 330 may include a polymer binder (not shown). For example, the absorbent sheet 330 may be manufactured together with the polymer binder using a coating press process. According to an embodiment, the absorbent sheet 330 may be referred to as an absorbent film.

[0146] Fig. 9 is a cross-sectional view of an electronic device including an electronic component according to an embodiment of the present disclosure. Fig.10 is a cross-sectional view of an electronic device including a hinge structure according to an embodiment of the present disclosure. Fig.11 is a reference diagram for describing a shield member attached to a housing according to an embodiment of the present disclosure.

[0147] refer to Fig. 9 , Fig.10 and / or Fig.11 , the electronic device 300 may include a display 310 , a digitizer 320 , an absorbent sheet 330 , a metal sheet 340 , a housing 350 , a shielding member 360 , and an electronic component 370 . The electronic device 300 may detect an input of a digital pen 400 . Fig. 9 , Fig.10 and / or Fig.11 The configuration of the electronic device 300, the display 310, the digitizer 320, the absorbent sheet 330, the metal sheet 340, the housing 350, the digital pen 400 and the coil 401 may be the same as Figure 4 and / or Figure 5 The configurations of the electronic device 300 , the display 310 , the digitizer 320 , the absorbent sheet 330 , the metal sheet 340 , the housing 201 , the digital pen 400 , and the coil 401 are completely or partially the same.

[0148] According to an embodiment, the display 310, the digitizer 320, the absorbent sheet 330 and / or the metal sheet 340 may be disposed on the housing 350. The housing 350 may be a support area (e.g., Figure 4 The first supporting area 212 and / or the second supporting area 222 in the embodiment of the present invention are shown in FIG.

[0149] According to an embodiment, the shielding member 360 can reduce the magnetic field transmitted to the digitizer 320. For example, the shielding member 360 can be located between the digitizer 320 and the electronic component 370, which includes a magnet or is configured to generate a magnetic field. The shielding member 360 can be located between the housing 350 and the electronic component 370.

[0150] According to an embodiment (for example, Fig.11 ), the shielding member 360 may include a plurality of shielding members 360a, 360b, 360c, 360d and 360e for shielding a plurality of electronic components 370. For example, the shielding member 360 may include: a covering hinge structure (eg, Figure 4 The first shielding member 360a of at least a portion of the hinge structure 202 in the embodiment of the present invention covers the Hall sensor (eg, Figure 1 The second shielding member 360b of at least a portion of the sensor module 176 in the embodiment of the present invention covers the camera module (eg, Figure 2 The third shielding member 360c includes at least a portion of the camera module 206 in the embodiment of the present invention, covering the receiver (eg, Figure 1 The fourth shielding member 360d may be configured to cover at least a portion of the audio module 170 in the embodiment of the present invention, and / or cover a portion of the audio module 170 in the embodiment of the present invention for attaching accessories (e.g., Figure 5 The fifth shielding member 360e of at least a portion of the attachment magnet of the digital pen 400).

[0151] According to an embodiment, at least one of the plurality of shielding members 360a, 360b, 360c, 360d, and 360e may be omitted. For example, if the coefficient of performance and the performance retention rate of the absorption sheet 330 are greater than or equal to a specified level, the shielding member 360 for shielding the magnetic field of the electronic component 370 may not be required. According to an embodiment, the first to fourth shielding members 360a, 360b, 360c, and 360d may be omitted. For example, at least a portion of the electronic component 370 may be directly attached to the bottom (in the -Z direction) of the housing 350.

[0152] According to the embodiment, the thickness of the shielding member 360 may be reduced due to the absorption sheet 330. As the thickness of the shielding member 360 is reduced, the internal space of the electronic device 300 may be increased, and the weight of the electronic device 300 may be reduced.

[0153] According to an embodiment, the shielding member 360 may be made of a material for shielding a magnetic field transmitted to an electronic component. For example, the shielding member 360 may be a soft magnetic material. The shielding member 360 may include at least one of a cold rolled steel plate (steel plate cold commercial, (SPCC)) or a resin material (e.g., acrylonitrile butadiene styrene (ABS)). According to an embodiment, the maximum relative permeability of the shielding member 360 may be 3000 to 10000. The thickness of the shielding member 360 may be 0.2 mm to 5 mm. The saturation flux density of the shielding member 360 may be 1.7 T to 2.3 T. The coercive force of the shielding member 360 may be 380 A / m.

[0154] According to an embodiment, the electronic component 370 may be a component configured to generate a magnetic field. For example, the electronic component 370 may be a camera (eg, Figure 3 camera module 206 in the example), Hall sensor (e.g., Figure 1 sensor module 176 in the embodiment of the present invention), hinge structure (e.g., Figure 4 The electronic component 370 may be located below the shielding member 360 .

[0155] According to an embodiment, the digitizer 320, the absorption sheet 330, and the metal sheet 340 may be connected to the hinge structure 380. The hinge structure 380 may be located below the absorption sheet 330 (in the -Z direction). According to an embodiment, at least a portion of the hinge structure 380 may be made of a magnetic material. The absorption sheet 330 may reduce the interference of the digitizer 320 due to the magnetic field generated by the hinge structure 380.

[0156] An electronic device may use a digitizer to detect a magnetic field generated by using an input device (e.g., a digital pen or stylus) to identify the coordinates of the input device. An electronic device using a digitizer may include an absorption sheet to reduce the inductance drop or eddy current generation caused by metal parts. The absorption sheet may have a relatively high magnetic permeability to increase the sensitivity of the input device. However, when a magnetic field of a specified size or greater is formed around the peripheral parts of the absorption sheet, the effective magnetic permeability of the absorption sheet is reduced, which may result in reduced function of the absorption sheet, reduced sensitivity of the digitizer substrate, and reduced accuracy in position determination of the input device.

[0157] In order to maintain the effective magnetic permeability of the absorbent sheet, the electronic device may include a shielding member around the component capable of generating magnetic force. However, due to the shielding member, the thickness and / or weight of the electronic device may increase, and the internal space of the electronic device may decrease.

[0158] According to an embodiment of the present disclosure, an electronic device including an absorption sheet can be provided, which has improved responsiveness to performance degradation caused by an external magnetic field while reducing inductance drop and / or eddy current generation caused by metal parts. For example, the absorption sheet of the present disclosure can have a performance coefficient and performance retention rate greater than or equal to a specified level.

[0159] Since the absorption sheet has a performance retention rate greater than or equal to a specified level, the number and / or size of shielding members for shielding the magnetic field of the magnet can be reduced.

[0160] The problems that the present disclosure seeks to solve are not limited to the above-mentioned problems, and can be expanded in various ways without departing from the spirit and scope of the present disclosure.

[0161] According to an embodiment of the present disclosure, an electronic device (eg, Figure 2 The electronic device 101 in the embodiment may include: a housing (eg, Figure 2 housing 201 in the housing), a display (e.g., Figure 2 230 in the display), a digitizer located below the display (e.g., Figure 5 digitizer 320 in the digitizer), an absorbent sheet located below the digitizer (e.g., Figure 5 ), and a metal sheet located below the absorbent sheet (e.g., Figure 5 The absorbent sheet may include: first particles including iron, silicon and aluminum (eg, Figure 7 ), and second particles comprising iron and silicon (e.g., Figure 7 The weight ratio of the second particles to the absorbent sheet may be 70w% or more.

[0162] According to an embodiment, the first magnetic permeability of the absorbent sheet in a state where a magnetic field of a specified magnitude (eg, 50 Gauss) is applied to the absorbent sheet is at least 20% of the second magnetic permeability of the absorbent sheet in a state where no magnetic field is applied.

[0163] According to an embodiment, the first size of the first particles may be 90 μm or less. According to an embodiment, in the electronic device, the second size of the second particles is 15 μm or more.

[0164] According to an embodiment, the absorbent sheet may be located between the digitizer and the housing.

[0165] According to an embodiment, the performance coefficient, which is the product of the thickness of the absorption sheet and the magnetic permeability of the absorption sheet, may be 3000 or more. Since the absorption sheet has a performance coefficient of 3000 or more, the performance of the digitizer may be improved.

[0166] According to an embodiment, the metal sheet may include copper.

[0167] According to an embodiment, the housing may include a first housing (eg, Figure 2 The first shell 210 and the second shell (eg, Figure 2 The display may include: a first display area (eg, Figure 2 A first display area 231 in the housing), a second display area connected to the second housing (eg, Figure 2 The second display area 232 in the first display area) and the folding area between the first display area and the second display area (for example, Figure 2 The electronic device may include a hinge structure connecting the first housing and the second housing (eg, Figure 4 The hinge structure 202 in FIG.

[0168] According to an embodiment, the hinge structure may be located below the absorbent sheet.

[0169] According to an embodiment, the electronic device may include a shielding member located below the absorbent sheet, wherein the shielding member (eg, Fig. 9 The shielding member 360) includes a cold-rolled steel plate or a resin material.

[0170] According to an embodiment, the electronic device may include a processor (eg, Figure 1 A processor 120 in the embodiment of the present invention is configured to use a digitizer to determine the position of the input device.

[0171] According to an embodiment, the electronic device may further include an electronic component configured to generate a magnetic field (eg, Fig. 9 The electronic component 370 is located under the absorbent sheet.

[0172] According to an embodiment, the electronic component may include a Hall sensor (eg, Figure 1 sensor module 176 in), camera module (e.g., Figure 2 camera module 206 in the example) or a receiver (e.g., Figure 1 At least one of the audio modules 170).

[0173] According to an embodiment, the magnetic permeability of the first particles may be higher than the magnetic permeability of the second particles. The saturation magnetic flux density of the second particles may be higher than the saturation magnetic flux density of the first particles.

[0174] According to an embodiment, the first particles and the second particles may be in a flake shape.

[0175] According to an embodiment, a weight ratio of the second particles to the absorbent sheet may be 80 to 90 w %.

[0176] According to an embodiment of the present disclosure, a foldable electronic device (eg, Figure 2 The electronic device 101 in the embodiment may include: a housing (eg, Figure 2 The housing 201 in the embodiment includes a first housing (eg, Figure 2 The first shell 210 and the second shell (eg, Figure 2 a second housing 220 in the housing); a display (eg, Figure 2 The display 230 in the embodiment includes a first display area (eg, Figure 2 A first display area 231 in the housing), a second display area on the second housing (eg, Figure 2 , and a folding area between the first display area and the second display area (eg, Figure 2 folding region 233 in the hinge structure (eg, Figure 2A hinge structure 202 in the folding area) connecting the first shell and the second shell, wherein at least a portion of the hinge structure is located below at least a portion of the folding area; a digitizer (e.g., Figure 5 digitizer 320 in the display), which is located below the display; and an absorbent sheet (e.g., Figure 5 The absorber 330 is located below the digitizer. The absorber may include: first particles (e.g., Figure 7 ), and second particles comprising iron and silicon (e.g., Figure 7 The ratio of the second particles to the first particles may be 3:7 or higher.

[0177] According to an embodiment, a first size of the first particles may be 90 μm or less, and a second size of the second particles may be 20 μm or more.

[0178] According to an embodiment, the magnetic permeability of the absorption sheet may be 100 μ or more, and the saturation magnetic flux density of the absorption sheet may be 1.5 T or more.

[0179] According to an embodiment, the foldable electronic device may further include a metal sheet (eg, Figure 5 A metal sheet 340 is provided in the embodiment of the present invention, wherein the metal sheet comprises copper.

[0180] According to an embodiment, the magnetic permeability of the first particles may be higher than the magnetic permeability of the second particles. The saturation magnetic flux density of the second particles may be higher than the saturation magnetic flux density of the first particles.

[0181] It is clear to those skilled in the art that the electronic device including a digitizer according to the present disclosure is not limited to the above embodiments and drawings, and various replacements, modifications and changes can be made within the technical scope of the present disclosure.

Claims

1. An electronic device (101, 300), comprising: Housing (210, 350); Display (230, 310); a digitizer (320), the digitizer being located below the display; An absorption sheet (330), the absorption sheet being arranged below the digitizer; as well as a metal sheet (340), the metal sheet being located below the absorbent sheet, The absorbent sheet comprises: first particles (331) containing iron, silicon and aluminum and second particles (332) containing iron and silicon, and Wherein, the ratio of the second particles to the first particles is 3:7 or higher.

2. The electronic device according to claim 1, wherein: A first magnetic permeability of the absorbent sheet in a state where a magnetic field of a specified magnitude is applied to the absorbent sheet is at least 20% of a second magnetic permeability of the absorbent sheet in a state where no magnetic field is applied.

3. The electronic device according to claim 1 or 2, wherein: A first size of the first particles is 90 μm or less, and a second size of the second particles is 15 μm or more.

4. An electronic device according to any one of the preceding claims, wherein: The absorption sheet is located between the digitizer and the housing.

5. An electronic device according to any one of the preceding claims, wherein: The performance coefficient is at least 3000, and the performance coefficient is the product of the thickness and the magnetic permeability of the absorbent sheet.

6. An electronic device according to any one of the preceding claims, wherein: The metal sheet includes copper.

7. An electronic device according to any one of the preceding claims, wherein: The housing comprises a first housing (210) and a second housing (220), The display comprises: a first display area (231) connected to the first shell, a second display area (232) connected to the second shell, and a folding area (233) located between the first display area and the second display area, and The electronic device further comprises a hinge structure (202, 380) connecting the first shell and the second shell.

8. An electronic device according to any one of the preceding claims, wherein: The hinge structure is located below the absorbent sheet.

9. The electronic device according to any one of the preceding claims, further comprising: A shielding member (360) is located below the absorption sheet and comprises a cold-rolled steel plate or a resin material.

10. The electronic device according to any one of the preceding claims, further comprising: A processor (120) is configured to determine a position of an input device using the digitizer.

11. The electronic device according to any one of the preceding claims, further comprising: An electronic component (370) is configured to generate a magnetic field and is located below the absorption sheet.

12. An electronic device according to any one of the preceding claims, wherein: The electronic component includes at least one of a Hall sensor (176), a camera module (206), or a receiver (170).

13. An electronic device according to any one of the preceding claims, wherein: The magnetic permeability of the first particles is higher than the magnetic permeability of the second particles, and The saturation magnetic flux density of the second particles is higher than the saturation magnetic flux density of the first particles.

14. An electronic device according to any one of the preceding claims, wherein: The first particles and the second particles are in a flake shape.

15. An electronic device according to any one of the preceding claims, wherein: The weight ratio of the second particles in the absorbent sheet is 80 to 90 w %.

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