A compound, an acrylic resin, a planarization layer composition and its application

Abstract

This invention belongs to the field of polymer materials technology, and relates to a compound, an acrylic resin, a planarization layer composition, and its applications. This invention provides a compound in which an acrylic resin containing this compound, when used in the preparation of a planarization layer, exhibits good planarity, adhesion, low dielectric properties, and good durability. This invention solves the technical problems of insufficient adhesion, dielectric constant, and durability in planarization layer materials.

Description

Technical Field

[0001] This invention belongs to the field of polymer materials technology, and relates to a compound, acrylic resin, planarization layer composition and its application. Background Technology

[0002] With the rapid development of technology, Thin-Film Transistor Liquid Crystal Displays (TFT-LCDs), as a core component of modern display technology, have been widely used in various electronic products such as smartphones, tablets, televisions, and computer monitors. Their superior display performance and efficient manufacturing process have made them the mainstream choice in the market. However, in the manufacturing process of TFT-LCDs, the design and fabrication of the color filter substrate (CF) is one of the key steps, directly affecting the quality of the final display. The color filter substrate achieves full-color display through precisely arranged three primary color (red, green, and blue) pixels, but this process inevitably encounters two main problems: subpixel differences and corner differences leading to a decrease in display quality. Subpixel differences mainly stem from the slight differences in the thickness of the liquid crystal cell between different pixels, which affects light transmittance and thus brightness uniformity; while corner differences can cause disorder in the arrangement of liquid crystal molecules, resulting in light leakage and severely affecting the display effect.

[0003] To overcome the aforementioned problems, the traditional approach is to coat a planarization layer (OC) after the color resist process. This layer aims to eliminate or mitigate the adverse effects of subpixel and corner notches through its excellent planarization capabilities. However, since the color resist layer often contains metal ions, these components, if directly exposed to the liquid crystal layer, can cause display defects such as image retention. Therefore, the OC layer acts as a barrier, its high electrical resistance effectively preventing the diffusion of metal ions into the liquid crystal layer, protecting its purity and stability. Furthermore, the columnar spacers (PS), as a key structure for maintaining the gap between liquid crystal cells, are crucial for ensuring display quality due to their high uniformity. The planarization effect of the OC layer not only optimizes the surface morphology of the color filter substrate but also provides a good foundation for the uniform distribution of PS, contributing to more precise pixel control and a more stable display effect. However, currently widely used planarization layer materials still have shortcomings in several aspects of performance. For example, insufficient adhesion to ensure a tight bond with the color resist layer may lead to interlayer delamination; an excessively high dielectric constant may interfere with the normal operation of TFT devices; at the same time, in subsequent processes, insufficient tolerance to organic solvents (such as NMP and PGMEA) makes it easy to be damaged during cleaning or processing, affecting the yield and reliability of the product. Summary of the Invention

[0004] To overcome the above-mentioned technical problems, the present invention aims to provide a planarization layer material and its preparation method. This material not only has excellent surface coating performance, high density after heat drying, and good solvent resistance, but also significantly improves adhesion to the color resist layer and reduces the dielectric constant, thereby comprehensively optimizing the display effect and manufacturing efficiency of TFT-LCD.

[0005] On the one hand, the present invention relates to compounds having a structure as shown in formula (I),

[0006]

[0007] On the other hand, the present invention relates to an acrylic resin, wherein the constituent monomers of the acrylic resin include compounds represented by formula (I), acrylic compounds, acrylate compounds, styrene compounds, and epoxy compounds.

[0008] Generally, in planarization layer materials, the amount of compound of formula (I) added is 5% to 15% of the total amount of resin monomers, by mass percentage.

[0009] For example, in the acrylic resin provided by the present invention, the acrylic compound is selected from at least one of acrylic acid and methacrylic acid;

[0010] The acrylate compound is selected from at least one of methyl methacrylate, methacrylate inhibitor, butyl methacrylate, tert-butyl methacrylate, lauryl methacrylate, decyl methacrylate, isobornyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, hydroxyethyl methacrylate, adamantane methacrylate, dicyclopentyl methacrylate, and perfluorobutyl methacrylate.

[0011] The styrene compounds are selected from at least one of styrene, α-methylstyrene, 4-hydroxystyrene, 4-tert-butoxystyrene, 4-boc-styrene, p-divinylbenzene, and 4-isopropenylphenol;

[0012] The epoxy compound is selected from at least one of glycidyl methacrylate, tetrahydrofurfuryl methacrylate, and 3,4-epoxycyclohexyl methacrylate.

[0013] For example, in the acrylic resin provided by the present invention, the acrylic resin is formed by polymerizing the constituent monomers in a first solvent;

[0014] The first solvent is selected from at least one of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, γ-butyrolactone, methyl lactate, ethyl lactate, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and N-ethylpyrrolidone.

[0015] Furthermore, in the acrylic resin provided by the present invention, the acrylic resin has a molecular weight of 3000~10000Mw, a PDI of 2.0~3.0, and a solid content of 25%~35%.

[0016] On the other hand, the present invention relates to a planarization layer composition comprising the acrylic resin.

[0017] The acrylic resin in the planarization layer composition is generally prepared by free radical polymerization.

[0018] Furthermore, in the planarization layer composition provided by the present invention, the proportion of the acrylic resin in the planarization layer composition is 1~30wt%.

[0019] Furthermore, in the planarization layer composition provided by the present invention, the planarization layer composition comprises, by weight, the following components:

[0020] 10 to 300 parts of the acrylic resin described above;

[0021] 10-300 parts reactive diluent;

[0022] 1 to 10 parts of photoinitiator and / or thermal initiator;

[0023] 5-20 parts coupling agent;

[0024] 1~10 parts surfactant;

[0025] 1-10 parts antioxidant;

[0026] 10-80 parts of the second solvent.

[0027] Reactive diluents are generally small molecule monomers or polymers that can enhance the degree of polymerization of the composition through light or heat, and improve the physicochemical properties of the composition, such as the degree of crosslinking, viscosity, leveling properties, adhesion, and film surface smoothness; antioxidants are generally hindered phenolic compounds; coupling agents are generally multifunctional compounds.

[0028] For example, in the planarization layer composition provided by the present invention, the active diluent is selected from at least one of glycidyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, hydroxyethyl methacrylate, and styrene.

[0029] The photoinitiator is selected from at least one of Irgacure® OXE01, Irgacure® OXE02, IRGACURE® 819, Irgacure® 290, benzophenone, diphenyl ethyl ketone, and 2,2-dimethoxy-phenylacetophenone;

[0030] The thermal initiator is selected from at least one of benzoyl peroxide, azobisisobutyronitrile, azobisisoheptanenitrile, and dimethyl azobisisobutyrate;

[0031] The coupling agent is selected from at least one of divinylbenzene, 3,4-epoxycyclohexyl methacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, KH-560, and KH-570.

[0032] The surfactant is selected from at least one of Triton X-100, OP-10, polyoxyethylene sorbitan fatty acid ester, sulfobetaine, lecithin, KP-341, KP-420, KP-611, BYK-301, BYK-310, and BYK-3450.

[0033] The antioxidant is selected from at least one of antioxidant 330, antioxidant 1010, antioxidant 1076, and antioxidant 3114;

[0034] The second solvent is selected from at least one of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, γ-butyrolactone, methyl lactate, ethyl lactate, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and N-ethylpyrrolidone.

[0035] The compound, acrylic resin, and planarization layer composition provided by this invention exhibit good flatness, adhesion, low dielectric properties, and good durability. Therefore, this invention further claims protection for the application of the said compound, or the said acrylic resin, or the said planarization layer composition in a thin-film transistor liquid crystal display (TFT-LCD) having a planarization layer coated thereon, which improves at least one of the said flatness, adhesion, dielectric properties, and durability.

[0036] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects or advantages:

[0037] This invention provides a compound containing an acrylic resin that exhibits excellent flatness, adhesion, low dielectric properties, and good durability when used in the preparation of a planarization layer. This invention solves the technical problems of insufficient adhesion, dielectric constant, and durability in planarization layer materials. By optimizing the surface coating performance and the densification after heat drying, this invention effectively eliminates display quality problems caused by sub-pixel and corner differences during TFT-LCD manufacturing, such as uneven brightness and light leakage, thereby significantly improving the display effect of the final product, resulting in more vibrant colors and clearer images. The planarization layer material of this invention exhibits excellent adhesion to the color resist layer, effectively avoiding interlayer peeling problems and improving product reliability and durability. Simultaneously, this material shows good resistance to various organic solvents such as IPA, NMP, TMAH, and DIW, and is not easily damaged during cleaning or processing, ensuring the stability of yield and product quality during production. The low dielectric constant of the material provided by this invention helps reduce delay and energy loss during signal transmission, improves the electrical performance of TFT devices, and enhances the response speed and efficiency of the overall display system. The planarization layer material of this invention has a low density, which helps to reduce the overall weight of the device. Simultaneously, its high hardness, low water absorption, and low surface roughness provide better conditions for subsequent patterning and photolithography processes, simplifying the manufacturing process and improving production efficiency and yield. This invention demonstrates significant advantages in improving the display effect of TFT-LCDs, enhancing material properties, optimizing manufacturing processes, and improving product reliability and durability, and has broad application prospects and significant market value. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the planarization layer in the color filter substrate. In the diagram, 1 represents the glass substrate, 2 represents the black matrix, 3 represents the red pixel, 4 represents the green pixel, 5 represents the blue pixel, and 6 represents the planarization layer.

[0040] Figure 2 The image shows the 1H NMR spectrum of the intermediate methacrylate obtained in Example 1.

[0041] Figure 3 The 1H NMR spectrum of the compound of formula (I) obtained in Example 1.

[0042] Figure 4 The image shows the GPC diagram of acrylic resin R-1 prepared in Example 2.

[0043] Figure 5 The image shows the GPC diagram of acrylic resin R-2 prepared in Example 2.

[0044] Figure 6 The image shows the GPC diagram of acrylic resin R-3 prepared in Example 2.

[0045] Figure 7 The image shows the GPC diagram of acrylic resin R-4 prepared in Example 2.

[0046] Figure 8 GPC diagram of acrylic resin R-5 prepared for comparative examples.

[0047] Figure 9 This is a cross-cut adhesion test pattern.

[0048] Figure 10 This is an outgass (TGA) diagram. Detailed Implementation

[0049] The technical solution of the present invention will be described below with reference to embodiments. However, the present invention is not limited to the following embodiments. Unless otherwise specified, the experimental methods and detection methods described in each embodiment are conventional methods; unless otherwise specified, the reagents and materials can be purchased commercially. Unless otherwise specified, the percentages in the following embodiments refer to mass percentages.

[0050] Example 1

[0051] This embodiment provides the preparation process and characterization of the compound represented by formula (I).

[0052] Under nitrogen protection, 1 L of dichloromethane and 424 g of 4,4'-dihydroxystilbene were added to a 5 L three-necked flask. The mixture was stirred and cooled to 0 °C. 760 g of m-chloroperoxybenzoic acid and 1.5 L of dichloromethane solution were then added dropwise to the reaction system, maintaining the temperature between -5 °C and 5 °C during the addition. After the addition was complete, the reactants were monitored by TLC until they disappeared. After the reaction was finished, the reaction solution was poured into saturated brine with stirring. The organic phase was extracted, washed with saturated brine until neutral, concentrated, and dried to obtain 460 g of crude intermediate epoxide.

[0053] Under nitrogen protection, 2L of dichloromethane, 460g of the crude epoxy intermediate, and 202g of triethylamine were added to a 5L three-necked flask. The mixture was stirred and cooled to 0℃. 187.2g of methacryloyl chloride was added dropwise to the reaction mixture, maintaining the temperature between -5℃ and 5℃ during the addition. After the addition was complete, the starting material was monitored by TLC until it disappeared. After the reaction was complete, the solid was filtered off, and the filtrate was poured into saturated brine with stirring. The organic phase was extracted, washed with saturated brine until neutral, concentrated, dried, and subjected to column chromatography (hexane:dichloromethane = 2:8, v / v). Recrystallization yielded 248g of the methacrylate intermediate.

[0054] Under nitrogen protection, 1 L of dichloromethane, 102 g of methacrylate intermediate, and 37.6 g of triethylamine were added to a 3 L three-necked flask. 52.2 g of trimethoxychlorosilane was then added dropwise to the reaction mixture, maintaining the temperature between 20°C and 30°C during the addition. After the addition was complete, the starting material was monitored by TLC until it disappeared. After the reaction was finished, the filtrate was poured into saturated brine with stirring. The organic phase was extracted, washed with saturated brine until neutral, concentrated, dried, and subjected to column chromatography (hexane:dichloromethane = 5:3, v / v). Recrystallization yielded 71 g of compound (I).

[0055] Figure 2 The 1H NMR spectrum of methacrylate, the intermediate for preparing compound (I), shows that the two multiplets at chemical shifts 5.55-6.05 correspond to the chemical shifts of the two hydrogens on the glycidyl group, indicating that the epoxy group has been formed. The hydroxyl hydrogen integral is 1, indicating that one of the two hydroxyl groups in the starting material has formed an ester. This compound is the target compound.

[0056] Figure 3 For the preparation of compound (I), the 1H NMR spectrum is obtained by combining... Figure 2 The intermediate hydrogen spectrum shows the disappearance of the hydroxyl hydrogen signal and the presence of three additional methoxy hydrogen signals, indicating that the compound is the target compound (I).

[0057] Example 2

[0058] This embodiment provides the synthesis of acrylic resin R-1.

[0059] Under nitrogen protection, 125g of the compound shown in formula (I), 137.5g of methacrylic acid, 300g of glycidyl methacrylate, 210g of 3,4-epoxycyclohexyl methacrylate, 155g of styrene, 125g of tert-butyl methacrylate, 42.5g of α-methylstyrene dimer, 120g of azobisisobutyronitrile, and 2850g of diethylene glycol methyl ethyl ether were added to a 5L three-necked flask. The mixture was heated to 70℃ with stirring and reacted for 4 hours. The mixture was then cooled to room temperature to obtain an acrylic resin with Mw=7366, PDI=2.0, solid content of 26.95%, and viscosity of 18.59cP.

[0060] Example 3

[0061] This embodiment provides the synthesis of acrylic resin R-2.

[0062] Under nitrogen protection, 145g of the compound shown in formula (I), 137.5g of acrylic acid, 359g of tetrahydrofurfuryl methacrylate, 200g of 3,4-epoxycyclohexyl methacrylate, 145g of styrene, 88g of methyl methacrylate, 42.5g of α-methylstyrene dimer, 120g of azobisisobutyronitrile, and 2850g of diethylene glycol methyl ethyl ether were added to a 5L three-necked flask. The mixture was heated to 70℃ with stirring and reacted for 4 hours. The mixture was then cooled to room temperature to obtain an acrylic resin with Mw=8828, PDI=2.0, solid content of 27.35%, and viscosity of 19.03cP.

[0063] Example 4

[0064] This embodiment provides the synthesis of acrylic resin R-3.

[0065] Under nitrogen protection, 130g of the compound shown in formula (I), 137.5g of methacrylic acid, 359g of tetrahydrofurfuryl methacrylate, 205g of 3,4-epoxycyclohexyl methacrylate, 176g of α-methylstyrene, 223g of lauryl methacrylate, 42.5g of α-methylstyrene dimer, 120g of azobisisobutyronitrile, and 2850g of diethylene glycol diethyl ether were added to a 5L three-necked flask. The mixture was heated to 70℃ with stirring and reacted for 4h. The mixture was then cooled to room temperature to obtain an acrylic resin with Mw=9000, PDI=2.3, solid content of 26.80%, and viscosity of 18.44cP.

[0066] Example 5

[0067] This embodiment provides the synthesis of acrylic resin R-4.

[0068] Under nitrogen protection, 95g of the compound shown in formula (I), 137.5g of acrylic acid, 310g of glycidyl methacrylate, 182g of tetrahydrofurfuryl methacrylate, 165g of α-methylstyrene, 88g of methyl methacrylate, 42.5g of α-methylstyrene dimer, 120g of azobisisobutyronitrile, and 2850g of diethylene glycol methyl ethyl ether were added to a 5L three-necked flask. The mixture was heated to 70℃ with stirring and reacted for 4h. After cooling to room temperature, an acrylic resin with Mw=9714, PDI=2.47, solid content of 27.15%, and viscosity of 19.33cP was obtained.

[0069] Comparative Examples

[0070] This embodiment provides the synthesis of acrylic resin R-5 (prepared without compound I resin).

[0071] Under nitrogen protection, 137.5 g of methacrylic acid, 375 g of glycidyl methacrylate, 232 g of tetrahydrofurfuryl methacrylate, 155 g of α-methylstyrene, 88 g of methyl methacrylate, 42.5 g of α-methylstyrene dimer, 120 g of azobisisobutyronitrile, and 2850 g of diethylene glycol methyl ethyl ether were added to a 5 L three-necked flask. The mixture was stirred and heated to 70 °C, reacted for 4 h, and then cooled to room temperature to obtain an acrylic resin with Mw = 10498, PDI = 2.6, solid content of 28.42%, and viscosity of 19.56 cP.

[0072] Figure 4 The image shows the GPC diagram of acrylic resin R-1 prepared in Example 2. Figure 5 The image shows the GPC diagram of acrylic resin R-2 prepared in Example 3. Figure 6 The image shows the GPC diagram of acrylic resin R-3 prepared in Example 4. Figure 7 The image shows the GPC diagram of acrylic resin R-4 prepared in Example 5. Figure 8 The GPC diagram of acrylic resin R-5 prepared for the comparative example is shown. Figure 9 This is a cross-cut adhesion test pattern. Figure 10 This is an outgass (TGA) diagram.

[0073] Depend on Figures 4-8 As can be seen, the GPC plot indicates the molecular weight of the synthesized resin. Its molecular weights Mn and Mw, as well as its molecular weight distribution PD, conform to the molecular weight distribution range of photoresist resins in current literature and related reports. There are no mandatory requirements for photoresist resins in specific implementations. GPC is just a characterization parameter of the synthesized resin, indicating that the obtained product is a polymer compound and the molecular weight meets the expected requirements.

[0074] Figure 9 The adhesion of the film after formation was tested using the cross-cut adhesion test, referring to the national standard GB / T 9286-2021. Figure 9 It can be seen that the inner surface of the square formed after slicing is intact and there is no peeling, indicating that there is a good adhesion between the film and the substrate.

[0075] Figure 10 Outgass is used to measure the thermal stability of a material after film formation. The TG method test generally requires a weight loss of less than 5%. As can be seen from the figure, when the temperature reaches 230℃ (the temperature required by the production line), the material still has 99.64% residual weight, indicating that the material has good thermal stability and meets the usage requirements.

[0076] Example 6

[0077] This embodiment provides a planarization layer composition for comparison with a comparative embodiment.

[0078] Planarization layer composition 1:

[0079] Under nitrogen protection, 15g of glycidyl methacrylate, 18.5g of hydroxyethyl methacrylate, 15g of 4-isopropenylphenol, 10g of benzyl methacrylate, 10g of pentaerythritol triacrylate, 8.5g of Irgacure® OXE01, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-1 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 1.

[0080] After coating the above composition into a film, it is irradiated with UV light (high-temperature mixed line) for 5 to 10 minutes, and then cured at a temperature of 150°C to 250°C for 5 to 15 minutes to complete the curing and obtain a planarization layer material.

[0081] Planarization layer composition 2:

[0082] Under nitrogen protection, 15g of glycidyl methacrylate, 18.5g of hydroxyethyl methacrylate, 15g of 4-vinylphenol, 15g of phenoxyethyl methacrylate, 10g of ethylene glycol methacrylate, 5.5g of Irgacure® OXE01, 10g of benzoyl peroxide, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-2 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 2.

[0083] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0084] Planarization layer composition 3:

[0085] Under nitrogen protection, 20g of glycidyl methacrylate, 10.5g of hydroxyethyl methacrylate, 10g of dicyclopentyl methacrylate, 10g of 4-isopropenylphenol, 15g of phenoxyethyl methacrylate, 10g of ethylene glycol methacrylate, 4.5g of Irgacure® OXE01, 5.5g of 2,2-dimethoxy-phenylacetophenone, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-3 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 3.

[0086] After coating the above composition into a film, it is irradiated with UV light (high-temperature mixed line) for 5 to 10 minutes and cured at a temperature of 150°C to 250°C for 5 to 15 minutes to complete the curing and obtain a planarization layer material.

[0087] Planarization layer composition 4:

[0088] Under nitrogen protection, 15g of glycidyl methacrylate, 18.5g of hydroxyethyl methacrylate, 15g of 4-vinylphenol, 15g of benzyl methacrylate, 10g of ethylene glycol methacrylate, 5.5g of Irgacure® OXE01, 10g of benzoyl peroxide, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-4 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 4.

[0089] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0090] Planarization layer composition 5:

[0091] Under nitrogen protection, 10g of glycidyl methacrylate, 18.5g of hydroxybutyl methacrylate, 15g of 4-vinylphenol, 23g of benzyl methacrylate, 10g of ethylene glycol methacrylate, 5.0g of Irgacure® OXE01, 10g of benzoyl peroxide, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-4 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 5.

[0092] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0093] Planarization layer composition 6:

[0094] Under nitrogen protection, 10g of glycidyl methacrylate, 18.5g of hydroxyethyl methacrylate, 15g of 4-vinylphenol, 23g of phenoxyethyl methacrylate, 10g of ethylene glycol methacrylate, 6.4g of Irgacure® OXE02, 10g of benzoyl peroxide, 0.8g of antioxidant 1076, 1.0g of KP-340, 4.0g of KH-570, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-1 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 6.

[0095] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0096] Planarization layer composition 7:

[0097] Under nitrogen protection, 8g of glycidyl methacrylate, 20.5g of hydroxypropyl methacrylate, 10g of 4-vinylphenol, 5g of 4-tert-butoxystyrene, 22g of benzyl methacrylate, 5g of ethylene glycol methacrylate, 8g of pentaerythritol triacrylate, 7.8g of Irgacure® OXE02, 8g of benzoyl peroxide, 0.8g of antioxidant 1076, 1.0g of KP-341, 4.0g of KH-560, 2250g of propylene glycol methyl ether acetate, 280g of propylene glycol monomethyl ether, and 305g of acrylic resin R-3 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 7.

[0098] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0099] Planarization layer composition 8:

[0100] Under nitrogen protection, 7.5g of tetrahydrofurfuryl methacrylate, 20.5g of hydroxyethyl methacrylate, 10g of 4-vinylphenol, 5g of styrene, 20g of benzyl methacrylate, 3g of diethylene glycol methacrylate, 8g of trimethylolpropane triacrylate, 5.5g of Irgacure® OXE02, 8g of benzoyl peroxide, 0.8g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 295g of acrylic resin R-4 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 8.

[0101] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0102] Planarization layer composition 9 (composition formed in the comparative example):

[0103] Under nitrogen protection, 14g of glycidyl methacrylate, 14.5g of hydroxybutyl methacrylate, 13.5g of 4-vinylphenol, 30g of benzyl methacrylate, 12g of ethylene glycol methacrylate, 6.5g of Irgacure® OXE01, 8g of benzoyl peroxide, 1.0g of antioxidant 1010, 1.0g of KP-341, 4.0g of KH-560, 2450g of propylene glycol methyl ether acetate, and 285g of acrylic resin R-5 were added sequentially to a 5L three-necked flask. The mixture was stirred for 4 hours and filtered through a 0.22μm PTFE membrane to obtain planarization layer composition 6.

[0104] After coating the above composition into a film, it is cured at a temperature of 150℃~250℃ for 5~15 minutes to complete the curing and obtain a planarization layer material.

[0105] The results of comparing the planarization layer compositions prepared in the above embodiments with those in the comparative embodiments are shown in Table 1.

[0106] Table 1: Performance Comparison Results

[0107]

[0108] The planarization layer compositions (compositions 1 to 8) prepared in this invention exhibit performance comparable to or better than existing materials in several key performance indicators. Specifically, they have low density, which helps reduce the overall weight of the device; low dielectric constant, which helps reduce delay and energy loss in signal transmission; extremely low water absorption, demonstrating excellent moisture resistance; and high bulk resistivity, ensuring good electrical insulation. In terms of physical and chemical stability, all compositions showed no precipitation and good stability in the Shock and Bubble tests, and the Outgass (TGA) test also showed low volatility, moderate hardness, and low film surface roughness, which is beneficial for subsequent patterning and photolithography processes. Furthermore, the composition exhibits high transmittance with minimal impact on optical properties; it passed both VCD Mura and Pin Mura tests, indicating good pattern uniformity and defect-free performance; it demonstrates strong adhesion with no peeling, ensuring a firm bond with the substrate; and in terms of chemical resistance, it exhibits good tolerance to common solvents such as IPA, NMP, TMAH, and DIW, with film shrinkage within acceptable ranges, demonstrating excellent chemical stability. In contrast, while existing materials also perform well in most indicators, they exhibit slight peeling in adhesion tests and slightly lower transmittance, suggesting that the prepared composition is more advantageous for planarization applications.

[0109] As described above, the basic principles, main features, and advantages of the present invention have been well described. The above embodiments and specifications are merely descriptions of preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. Various changes and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the spirit and scope of the present invention should fall within the protection scope defined by the present invention.

Claims

1. A compound characterized by, having a structure as shown in formula (I), 2. An acrylic resin, characterized by, The composition monomers of the acrylic resin include the compound of claim 1, acrylic compounds, acrylate compounds, styrene compounds, epoxy compounds.

3. The acrylic resin according to claim 2, characterized in that, The acrylic compounds are selected from at least one of acrylic acid, methacrylic acid; The acrylate compounds are selected from at least one of methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, t-butyl methacrylate, lauryl methacrylate, decyl methacrylate, isobornyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, hydroxyethyl methacrylate, adamantyl methacrylate, dicyclopentyl methacrylate, perfluorobutyl methacrylate; The styrene compounds are selected from at least one of styrene, α-methylstyrene, 4-hydroxystyrene, 4-t-butoxystyrene, 4-boc-styrene, p-divinylbenzene, 4-isopropenyl phenol; The epoxy compounds are selected from at least one of glycidyl methacrylate, tetrahydrofurfuryl methacrylate, 3,4-epoxycyclohexyl methacrylate.

4. The acrylic resin according to claim 2, characterized in that, The acrylic resin is formed by polymerization of the composition monomers in a first solvent; The first solvent is selected from at least one of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, gamma-butyrolactone, methyl lactate, ethyl lactate, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, N-ethylpyrrolidone.

5. The acrylic resin according to any one of claims 2 to 4, characterized in that, The acrylic resin has a molecular weight of 3000-10000 Mw, a PDI of 2.0-3.0, and a solid content of 25%-35%.

6. A planarization layer composition comprising an acrylic resin, characterized in that, The acrylic resin is the acrylic resin of any one of claims 2-5.

7. The planarization layer composition of claim 6, wherein The acrylic resin accounts for 1-30 wt% in the planarization layer composition.

8. The planarization layer composition of claim 7, wherein The planarization layer composition is composed of the following components in parts by mass: 10-300 parts of the acrylic resin; 10-300 parts of an active diluent; 1-10 parts of a photoinitiator and / or a thermal initiator; 5-20 parts of a coupling agent; 1-10 parts of a surfactant; 1-10 parts of an antioxidant; 10-80 parts of a second solvent.

9. The planarization layer composition of claim 8, wherein, The active diluent is selected from at least one of glycidyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, hydroxyethyl methacrylate, styrene; The photoinitiator is selected from at least one of Irgacure® OXE01, Irgacure® OXE02, IRGACURE® 819, Irgacure® 290, benzophenone, diphenyl ketone, 2,2-dimethoxy-phenyl phenyl ketone; The thermal initiator is selected from at least one of benzoyl peroxide, azobisisobutyronitrile, azobisisoheptyl nitrile, dimethyl azobisisobutyrate. The coupling agent is at least one selected from the group consisting of divinylbenzene, 3,4-epoxycyclohexyl methacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, KH-560, KH-570; The surfactant is at least one selected from the group consisting of Triton X-100, OP-10, polyoxyethylene sorbitan fatty acid ester, sulfobetaine, lecithin, KP-341, KP-420, KP-611, BYK-301, BYK-310, BYK-3450; The antioxidant is at least one selected from the group consisting of antioxidant 330, antioxidant 1010, antioxidant 1076, antioxidant 3114; The second solvent is at least one selected from the group consisting of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, gamma-butyrolactone, methyl lactate, ethyl lactate, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, N-ethylpyrrolidone.

10. Use of the compound of claim 1, or the acrylic resin of any one of claims 2 to 5, or the planarization layer composition of any one of claims 6 to 9 in a thin film transistor liquid crystal display coated with a planarization layer.

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