A highly efficient wafer automatic sorting and testing equipment

Abstract

The present invention discloses a high-efficiency automatic wafer sorting and detection equipment, which specifically relates to the field of wafer detection technology, including an equipment frame, a device bottom plate is fixedly installed on the top of the equipment frame, a sorting mechanism is provided on one side of the equipment bottom plate, a wafer placing mechanism is fixedly installed on the side of the top of the equipment bottom plate close to the sorting mechanism, a material conveying mechanism is provided between the wafer placing mechanism and the sorting mechanism, and a detection mechanism is provided on one side of the sorting mechanism; a horizontal slide groove corresponding to the sorting mechanism is opened on one side of the equipment bottom plate, and the sorting mechanism includes two symmetrically distributed first linear electric rails and two symmetrically distributed groups of first frames. According to the present invention, by setting the sorting mechanism, wafers can automatically drop into storage frames in corresponding storage components, and the wafers can be automatically sorted, dropped, stacked and placed without the need for re-adsorption, positioning and transmission, thereby improving the sorting efficiency of the wafers and reducing the damage to the wafers.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a highly efficient wafer automatic sorting and detection device. Background Art

[0002] Wafers are thin sheets used in semiconductor manufacturing, usually processed from single crystal silicon. They are the basis for manufacturing integrated circuits. Electronic components such as transistors, capacitors and resistors are all formed on wafers. Wafers need to be inspected and sorted during the processing and production process. Traditional wafer inspection and sorting mostly uses a suction cup mechanism to adsorb and position multiple cut wafers in sequence and transfer them to the inspection station for inspection. After the inspection is completed, the wafers are adsorbed, positioned, moved and classified and placed in a suitable frame. This method of adsorption, positioning and transmission has a long transmission distance, is time-consuming and easily causes damage to the wafer. To this end, we propose an efficient wafer automatic sorting and inspection equipment to solve the above problems. Summary of the invention

[0003] The purpose of the present invention is to provide a high-efficiency wafer automatic sorting and detection equipment to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solutions: an efficient wafer automatic sorting and testing device, comprising a device chassis, a device bottom plate is fixedly installed on the top of the device chassis, a sorting mechanism is provided on one side of the device bottom plate, a wafer placing mechanism is fixedly installed on the side of the top of the device bottom plate close to the sorting mechanism, a material conveying mechanism is provided between the wafer placing mechanism and the sorting mechanism, and a testing mechanism is provided on one side of the sorting mechanism;

[0005] A transverse sliding groove corresponding to the sorting mechanism is opened on one side of the equipment bottom plate, and the sorting mechanism includes two symmetrically distributed first linear electric rails and two symmetrically distributed first frames, the first linear electric rails are fixedly installed on one side of the bottom end of the equipment bottom plate close to the transverse sliding groove, a transverse sliding seat is fixedly installed on the driving end of the first linear electric rail, the transverse sliding seat is slidably connected in the transverse sliding groove, a storage mechanism is fixedly provided in the transverse sliding seat, the first frame is fixedly installed on one side of the top end of the equipment bottom plate close to the transverse sliding groove, a device top frame is fixedly installed on the top end of the first frame, and a material placing mechanism is provided in the middle of the device top frame.

[0006] Preferably, the storage mechanism includes two symmetrically distributed storage parts, the storage parts include a bottom longitudinal frame, the storage parts are fixedly connected to the horizontal sliding seat through the top of the bottom longitudinal frame, the top of the bottom longitudinal frame is fixedly installed with a mounting longitudinal frame, a storage frame is fixedly installed on the mounting longitudinal frame by bolts, an observation longitudinal groove is opened on the storage frame, a storage base is slidably provided in the observation longitudinal groove, a mounting seat is fixedly installed on the middle part of the bottom end of the storage base, a longitudinal sliding cylinder is fixedly provided on the bottom of the mounting seat by bolts, the bottom of the longitudinal sliding cylinder is slidably connected to the top of the bottom longitudinal frame, the bottom of the longitudinal sliding cylinder extends to the bottom longitudinal frame, and a lifting screw is rotatably installed on the bottom end of the bottom longitudinal frame, and the lifting screw is threadedly installed in the longitudinal sliding cylinder.

[0007] Preferably, a one-way bearing is fixedly installed at the bottom of the lifting screw in the sub-storage component, a first gear is fixedly installed on the outer side of the one-way bearing, a first rack is provided on the outer side of the first gear, the first rack can be meshed and connected with the first gear, the first rack is located between the two sub-storage components, a second vertical frame is fixedly installed at the bottom end of the bottom plate of the equipment, and the first rack is fixedly installed at the bottom end of the second vertical frame.

[0008] Preferably, the material loading mechanism comprises a material loading top frame, the material loading top frame is fixedly mounted in the middle of the equipment top frame, the material loading top frame is located above the sub-storage mechanism, the material loading top frame is located between the two sub-storage parts, both sides of the bottom of the material loading top frame are rotatably mounted with flip shafts, the outer side of the flip shaft is fixedly mounted with a support seat, the support seat is movably connected to the bottom of the material loading top frame, one end of the flip shaft is fixedly mounted with a driven worm gear, the outer side of the driven worm gear is meshedly connected with a driving worm, the two ends of the driving worm are rotatably mounted with rotating frames, the rotating frame is fixedly mounted on the outer side of the material loading top frame, and one end of the driving worm is fixedly mounted with a second gear.

[0009] Preferably, a third frame is fixedly installed on the top of the vertical frame installed in the storage component close to one side of the second gear, and a second rack is fixedly installed on the top of the third frame. The side of the top of the second rack away from the material placement mechanism can be meshed and connected with the bottom of the second gear.

[0010] Preferably, a fourth frame is fixedly installed on the top of the longitudinal frame installed in the storage component away from the side of the second gear, a third rack is fixedly installed on the top of the fourth frame, and the bottom end of the third rack close to the side of the fourth frame can be meshed and connected with the top of the second gear.

[0011] Preferably, the film placement mechanism includes two groups of symmetrically distributed film placement frames, the film placement frames are fixedly mounted on the top of the equipment bottom plate, a second linear electric rail is fixedly mounted on the top of the film placement frames, and the film placement bottom plate is fixedly mounted on the driving end of the second linear electric rail.

[0012] Preferably, the material conveying mechanism includes two groups of symmetrically distributed material conveying frames, the material conveying frames are fixedly installed on the top of the bottom plate of the equipment, the top of the material conveying frames is fixedly installed with a third linear electric rail, the third linear electric rail and the second linear electric rail are vertically distributed, the driving end of the third linear electric rail is fixedly installed with a mounting top frame, the end of the mounting top frame is fixedly installed with a first lifting rod, the driving end of the first lifting rod is fixedly installed with a mounting frame, and the end of the mounting frame is fixedly installed with a suction cup.

[0013] Preferably, the detection mechanism includes a detection base frame, which is fixedly mounted on the top side of the equipment bottom plate close to the sorting mechanism, a supporting top frame is fixedly mounted on the top of the detection base frame, a second lifting rod is fixedly mounted on the top of the supporting top frame, a detection auxiliary frame is fixedly mounted on the driving end of the second lifting rod, and a detection module is fixedly mounted on the end of the detection auxiliary frame.

[0014] Preferably, the position of the detection module corresponds vertically to the position of the material placing top frame.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. By setting up a sorting mechanism, the wafers can automatically fall into the storage frame in the corresponding storage part, and the wafers can be automatically sorted, dropped, and stacked without the need for adsorption, positioning, and transmission again, thereby improving the sorting efficiency of the wafers and reducing wafer damage.

[0017] 2. By setting up a wafer placement mechanism and using a material transfer mechanism in conjunction, multiple wafer originals on the wafer placement base plate can be transferred in sequence to the material placement top frame in the material placement mechanism for subsequent automatic positioning detection and automatic sorting, thereby further improving the wafer sorting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the structure of the present invention.

[0020] Figure 2 It is a schematic diagram of the structural connection between the equipment base plate and the sorting mechanism in the present invention.

[0021] Figure 3 It is a structural schematic diagram of the storage mechanism in the present invention.

[0022] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle.

[0023] Figure 5 For the present invention Figure 4 Enlarged view of point B in the middle.

[0024] Figure 6 For the present invention Figure 4 Enlarged view of point C in the middle.

[0025] Figure 7 For the present invention Figure 3 Enlarged view of point D in the middle.

[0026] Figure 8 It is a schematic diagram of the structure of the storage component in the present invention.

[0027] Fig. 9 For the present invention Figure 8 Enlarged view of point E in the middle.

[0028] Fig.10 For the present invention Figure 8 Enlarged view of point F in the middle.

[0029] Fig.11 It is a structural schematic diagram of the material placing mechanism in the present invention.

[0030] Fig.12 For the present invention Fig.11 Enlarged view of point G in the middle.

[0031] Fig.13 It is a structural schematic diagram of the plate-mounting mechanism in the present invention.

[0032] Fig.14 It is a structural schematic diagram of the material conveying mechanism in the present invention.

[0033] Fig.15 It is a structural schematic diagram of the detection mechanism in the present invention.

[0034] In the figure: 1. Equipment bottom frame; 2. Equipment bottom plate; 3. Sorting mechanism; 4. Sheet placement mechanism; 5. Material transfer mechanism; 6. Detection mechanism; 201. Horizontal slide; 31. First linear electric rail; 32. Horizontal slide seat; 33. Storage mechanism; 34. First frame; 35. Equipment top frame; 36. Material placement mechanism; 37. One-way bearing; 371. First gear; 372. First rack; 373. Second vertical frame; 331. Storage component; 332. Bottom vertical frame; 333. Installation vertical frame; 3331. Fourth frame; 3332. Third frame; 334. Material storage frame; 3341. Observation vertical slot; 335. Material storage base; 3351. Installation card Seat; 336, longitudinal slide cylinder; 337, lifting screw; 361, material placement top frame; 362, flip axis; 363, support seat; 364, driven worm gear; 365, driving worm; 366, rotating frame; 367, second gear; 3671, second rack; 3672, third rack; 41, film placement base frame; 42, second linear electric rail; 43, film placement base plate; 51, material transfer base frame; 52, third linear electric rail; 53, installation top frame; 54, first lifting rod; 55, installation base frame; 56, suction cup; 61, detection base frame; 62, support top frame; 63, second lifting rod; 64, detection auxiliary frame; 65, detection module. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Example: Figure 1-15 As shown, the present invention provides a high-efficiency wafer automatic sorting and testing device, including a device chassis 1, a device bottom plate 2 is fixedly installed on the top of the device chassis 1, a sorting mechanism 3 is provided on one side of the device bottom plate 2, a wafer placing mechanism 4 is fixedly installed on one side of the top of the device bottom plate 2 close to the sorting mechanism 3, a material conveying mechanism 5 is provided between the wafer placing mechanism 4 and the sorting mechanism 3, and a testing mechanism 6 is provided on one side of the sorting mechanism 3;

[0037] A transverse sliding groove 201 corresponding to the sorting mechanism 3 is opened on one side of the equipment base plate 2. The sorting mechanism 3 includes two symmetrically distributed first linear electric rails 31 and two symmetrically distributed first frames 34. The first linear electric rail 31 is fixedly installed on the side of the bottom end of the equipment base plate 2 close to the transverse sliding groove 201. A transverse sliding seat 32 is fixedly installed on the driving end of the first linear electric rail 31. The transverse sliding seat 32 is slidably connected in the transverse sliding groove 201. A storage mechanism 33 is fixedly provided in the transverse sliding seat 32. The first linear electric rail 31 is controlled to open to drive the transverse sliding seat 32 to translate and slide in the transverse sliding groove 201, thereby controlling the storage mechanism 33 to translate and slide. The first frame 34 is fixedly installed on the side of the top of the equipment base plate 2 close to the transverse sliding groove 201. A device top frame 35 is fixedly installed on the top of the first frame 34, and a material placement mechanism 36 is provided in the middle of the device top frame 35.

[0038] The storage mechanism 33 includes two symmetrically distributed storage parts 331, the storage part 331 includes a bottom longitudinal frame 332, the storage part 331 is fixedly connected to the horizontal sliding seat 32 through the top of the bottom longitudinal frame 332, a mounting longitudinal frame 333 is fixedly installed on the top of the bottom longitudinal frame 332, a storage frame 334 is fixedly installed on the mounting longitudinal frame 333 by bolts, so as to facilitate the disassembly and replacement of the storage frame 334, an observation longitudinal groove 3341 is provided on the storage frame 334, a storage base 335 is slidably provided in the observation longitudinal groove 3341, and the storage base 335 is convenient for vertical sliding in the storage frame 334, a mounting card seat 3351 is fixedly installed in the middle of the bottom end of the storage base 335, and a longitudinal slide cylinder 33 is fixedly provided on the bottom of the mounting card seat 3351 by bolts 6. It is convenient to install and disassemble the card holder 3351 and the longitudinal slide cylinder 336. The bottom of the longitudinal slide cylinder 336 is slidably connected to the top of the bottom longitudinal frame 332. The bottom of the longitudinal slide cylinder 336 extends into the bottom longitudinal frame 332. The bottom end of the bottom longitudinal frame 332 is rotatably installed with a lifting screw 337. The lifting screw 337 is threadedly installed in the longitudinal slide cylinder 336. In the initial state, the storage base 335 is at the top position of the storage frame 334. By controlling the lifting screw 337 to rotate, the longitudinal slide cylinder 336 is driven to descend, and then the storage base 335 is controlled to vertically descend in the storage frame 334, so that the storage base 335 descends one storage space, which is convenient for the detected wafers to be stacked in the storage frame 334 in sequence for sorting and placement.

[0039] The bottom of the lifting screw 337 in the storage component 331 is fixedly installed with a one-way bearing 37, the outer side of the one-way bearing 37 is fixedly installed with a first gear 371, the outer side of the first gear 371 is provided with a first rack 372, the first rack 372 can be meshed and connected with the first gear 371, the first rack 372 is located between the two storage components 331, the bottom end of the equipment bottom plate 2 is fixedly installed with a second vertical frame 373, the first rack 372 is fixedly installed at the bottom end of the second vertical frame 373, and the first rack 372 is fixed. When one of the storage components 331 moves to the bottom of the material placement mechanism 36, the The first gear 371 and the first rack 372 under the storage component 331 are meshed, and the first rack 372 drives the first gear 371 to rotate. At this time, the outer ring and the inner ring in the one-way bearing 37 are not self-locking, and the rotation of the first gear 371 cannot drive the lifting screw 337 in the storage component 331 to rotate. Then, the storage component 331 is moved in the reverse direction for reset, and the first rack 372 drives the corresponding first gear 371 to rotate in the reverse direction again. At this time, the outer ring and the inner ring in the one-way bearing 37 are self-locking, and the first gear 371 rotates to drive the lifting screw 337 in the storage component 331 to rotate.

[0040] The material placement mechanism 36 includes a material placement top frame 361, which is fixedly installed in the middle of the equipment top frame 35, and is located above the storage mechanism 33. The material placement top frame 361 is located between the two storage components 331. Both sides of the bottom of the material placement top frame 361 are rotatably installed with flip shafts 362, and the outer side of the flip shaft 362 is fixedly installed with a support seat 363. In the initial state, the support seat 363 is in a horizontal state, which is convenient for placing the wafer in the material placement top frame 361 and supported by the support seat 363. The support seat 363 is movably connected to the bottom of the material placement top frame 361, and one end of the flip shaft 362 is fixedly installed with a driven worm gear 364, and the outer side of the driven worm gear 364 is meshed and connected with a driving worm 365. The two ends of the driving worm 365 are rotatably installed with a rotating frame 366, and the rotating frame 366 is fixedly installed on the outer side of the material placement top frame 361. A second gear 367 is fixedly installed at one end of the driving worm 365. By driving the second gears 367 on both sides to rotate synchronously, the driving worm 365 drives the corresponding driven worm wheel 364 to rotate, thereby controlling the flip shafts 362 on both sides to flip down synchronously, and then driving the support seats 363 on both sides to flip down synchronously. The wafer loses support and the wafer automatically falls into the storage frame 334 in the corresponding storage part 331, and the wafer is automatically sorted and dropped without the need for re-adsorption, positioning and transmission, thereby improving the sorting efficiency of the wafer and reducing wafer damage. On the contrary, by driving the second gears 367 on both sides to rotate synchronously in the opposite direction, the driving worm 365 drives the corresponding driven worm wheel 364 to rotate in the opposite direction, thereby controlling the flip shafts 362 on both sides to flip up synchronously, and then driving the support seats 363 on both sides to flip up synchronously for resetting, so as to facilitate the subsequent continued support of the wafer.

[0041] A third frame 3332 is fixedly installed on the top of the vertical frame 333 installed in the storage component 331 near the side of the second gear 367, and a second rack 3671 is fixedly installed on the top of the third frame 3332. The top of the second rack 3671 is away from the side of the material placement mechanism 36 and can be meshed and connected with the bottom of the second gear 367. When the storage component 331 moves to the bottom of the material placement mechanism 36, the top of the second rack 3671 meshes with the bottom of the second gear 367, and the second rack 3671 drives the second gears 367 on both sides to rotate synchronously. When the storage component 331 moves in the opposite direction to reset, the second rack 3671 drives the second gears 367 on both sides to rotate synchronously in the opposite direction.

[0042] A fourth frame 3331 is fixedly installed on the top of the vertical frame 333 installed in the storage component 331 away from the side of the second gear 367, and a third rack 3672 is fixedly installed on the top of the fourth frame 3331. The bottom end of the third rack 3672 is close to the side of the fourth frame 3331 and can be meshed and connected with the top of the second gear 367. When the storage component 331 moves to the bottom of the material placement mechanism 36, the bottom end of the third rack 3672 meshes with the bottom of the second gear 367, and the third rack 3672 drives the second gears 367 on both sides to rotate synchronously. When the storage component 331 moves in the opposite direction to reset, the third rack 3672 drives the second gears 367 on both sides to rotate synchronously in the opposite direction.

[0043] The wafer placing mechanism 4 includes two groups of symmetrically distributed wafer placing frames 41, the wafer placing frames 41 are fixedly mounted on the top of the equipment bottom plate 2, a second linear electric rail 42 is fixedly mounted on the top of the wafer placing frames 41, a wafer placing bottom plate 43 is fixedly mounted on the driving end of the second linear electric rail 42, when in use, the cut wafer original is placed on the upper surface of the wafer placing bottom plate 43, the second linear electric rail 42 is controlled to open to drive the wafer placing bottom plate 43 and the wafer original to move longitudinally, and the position of the wafer original is adjusted.

[0044] The material transfer mechanism 5 includes two groups of symmetrically distributed material transfer frames 51. The material transfer frames 51 are fixedly installed on the top of the equipment base plate 2. A third linear electric rail 52 is fixedly installed on the top of the material transfer frame 51. The third linear electric rail 52 and the second linear electric rail 42 are vertically distributed. A mounting top frame 53 is fixedly installed on the driving end of the third linear electric rail 52. A first lifting rod 54 is fixedly installed on the end of the mounting top frame 53. A mounting frame 55 is fixedly installed on the driving end of the first lifting rod 54. A suction cup 56 is fixedly installed on the end of the mounting frame 55. The second linear electric rail 42 is controlled to be turned on to drive the suction cup 56 to move back and forth horizontally between the wafer placement mechanism 4 and the material placement mechanism 36. The first lifting rod 54 is controlled to be turned on to drive the suction cup 56 to rise and fall, and multiple wafer originals on the wafer placement base plate 43 are sequentially transferred to the material placement top frame 361 in the material placement mechanism 36 for subsequent positioning automatic detection and automatic sorting, thereby further improving the wafer sorting efficiency.

[0045] The detection mechanism 6 includes a detection base frame 61, which is fixedly installed on the top side of the equipment bottom plate 2 close to the sorting mechanism 3. A supporting top frame 62 is fixedly installed on the top of the detection base frame 61, and a second lifting rod 63 is fixedly installed on the top of the supporting top frame 62. A detection auxiliary frame 64 is fixedly installed on the driving end of the second lifting rod 63, and a detection module 65 is fixedly installed on the end of the detection auxiliary frame 64; the position of the detection module 65 vertically corresponds to the position of the material placement top frame 361. When the wafer is placed in the material placement top frame 361, the second lifting rod 63 is controlled to open to drive the detection module 65 to descend, and the wafer in the material placement top frame 361 is automatically detected by the detection module 65.

[0046] Working principle: When in use, the cut wafer original piece is placed on the upper surface of the wafer placement base plate 43, and the second linear electric track 42 is controlled to drive the wafer placement base plate 43 and the wafer original piece to move longitudinally to adjust the position of the wafer original piece;

[0047] The second linear electric rail 42 is controlled to drive the suction cup 56 to move back and forth horizontally between the wafer placement mechanism 4 and the material placement mechanism 36, and the first lifting rod 54 is controlled to drive the suction cup 56 to move up and down, so that the multiple wafer originals on the wafer placement bottom plate 43 are sequentially transferred to the material placement top frame 361 in the material placement mechanism 36, and supported by the support seat 363, so as to facilitate the subsequent automatic positioning detection and automatic sorting;

[0048] When the wafer is placed in the material placement top frame 361, the second lifting rod 63 is controlled to start and drive the detection module 65 to descend, and the detection module 65 automatically detects the wafer in the material placement top frame 361;

[0049] After the wafers are automatically inspected, they are automatically sorted. When the wafers meet the inspection quality requirements, the first linear electric rail 31 is controlled to drive the horizontal slide seat 32 to slide in the horizontal slide slot 201, thereby controlling the storage mechanism 33 to slide in a horizontal manner.

[0050] The corresponding storage part 331 is moved to the bottom of the material placing mechanism 36, and the first gear 371 under the storage part 331 is meshed with the corresponding first rack 372, and the first rack 372 drives the first gear 371 to rotate. At this time, the outer ring and the inner ring of the one-way bearing 37 are not self-locking, and the rotation of the first gear 371 cannot drive the lifting screw 337 in the storage part 331 to rotate. At the same time, the top of the second rack 3671 at this position is meshed with the bottom of the second gear 367, and the second rack 3671 drives the second gears 367 on both sides to rotate synchronously, driving the driving worm 365 to drive the corresponding driven worm gear 364 to rotate, thereby controlling the flip shafts 362 on both sides to flip down synchronously, and then driving the supporting seats 363 on both sides to flip down synchronously, the wafers lose support, and the wafers automatically fall into the storage frame 334 in the corresponding storage part 331, and the wafers are automatically sorted and dropped, without the need for adsorption, positioning and transmission again, thereby improving the sorting efficiency of the wafers and reducing the damage to the wafers;

[0051] The first gear 372 is driven by the second gear 364 to rotate in the opposite direction, thereby driving the first gear 365 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby driving the first gear 364 to rotate in the opposite direction, thereby controlling ...

[0052] When the wafer inspection quality does not meet the requirements, the first linear electric rail 31 is controlled to be turned on to drive the horizontal slide seat 32 to slide in the horizontal slide groove 201, thereby controlling the storage mechanism 33 to slide in a horizontal manner, and moving another storage component 331 to the bottom of the material placement mechanism 36. The first gear 371 under the storage component 331 is meshed with the corresponding first rack 372, and the first rack 372 drives the first gear 371 to rotate. At this time, the outer ring and the inner ring of the one-way bearing 37 are not self-locking, and the rotation of the first gear 371 cannot drive the lifting screw 337 in the storage component 331 to rotate. At the same time, the position The bottom end of the third rack 3672 is meshed with the bottom of the second gear 367, and the third rack 3672 drives the second gears 367 on both sides to rotate synchronously, driving the driving worm 365 to drive the corresponding driven worm gear 364 to rotate, thereby controlling the flip shafts 362 on both sides to flip down synchronously, and then driving the supporting seats 363 on both sides to flip down synchronously, and the wafers lose support, and the wafers automatically fall into the storage frame 334 in the corresponding storage part 331, and the wafers are automatically sorted and dropped, without the need for adsorption, positioning and transmission again, thereby improving the sorting efficiency of the wafers and reducing the damage to the wafers;

[0053] Afterwards, the sub-storage component 331 is moved in the reverse direction to reset, and the first rack 372 drives the corresponding first gear 371 to rotate in the reverse direction again. At this time, the outer ring and the inner ring in the one-way bearing 37 are self-locking, and the first gear 371 rotates to drive the lifting screw 337 in the sub-storage component 331 to rotate, thereby driving the longitudinal slide cylinder 336 to descend, and then controlling the storage base 335 to descend vertically in the storage frame 334, so that the storage base 335 descends one storage space, so that the wafers after inspection are stacked in sequence and placed in the storage frame 334 for sorting and placement; at the same time, the third rack 3672 drives the second gears 367 on both sides to rotate in the reverse direction synchronously, driving the driving worm 365 to drive the corresponding driven worm wheel 364 to rotate in the reverse direction, thereby controlling the flip shafts 362 on both sides to flip up synchronously, and then driving the support seats 363 on both sides to flip up synchronously for reset, so as to continue to support the wafers in the future.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An efficient wafer automatic sorting and testing device, comprising a device chassis (1), characterized in that: A device bottom plate (2) is fixedly mounted on the top of the device bottom frame (1); a sorting mechanism (3) is provided on one side of the device bottom plate (2); a sheet placing mechanism (4) is fixedly mounted on the top of the device bottom plate (2) on the side close to the sorting mechanism (3); a material conveying mechanism (5) is provided between the sheet placing mechanism (4) and the sorting mechanism (3); and a detection mechanism (6) is provided on one side of the sorting mechanism (3); A transverse sliding groove (201) corresponding to the sorting mechanism (3) is provided on one side of the equipment bottom plate (2). The sorting mechanism (3) comprises two symmetrically distributed first linear electric rails (31) and two symmetrically distributed first frames (34). The first linear electric rails (31) are fixedly mounted on the bottom end of the equipment bottom plate (2) near the transverse sliding groove (201). A transverse sliding seat (32) is fixedly mounted on the driving end of the first linear electric rail (31). The transverse sliding seat (32) is slidably engaged in the transverse sliding groove (201). A storage mechanism (33) is fixedly mounted in the transverse sliding seat (32). The first frame (34) is fixedly mounted on the top end of the equipment bottom plate (2) near the transverse sliding groove (201). A device top frame (35) is fixedly mounted on the top end of the first frame (34). A material placement mechanism (36) is provided in the middle of the device top frame (35). The storage mechanism (33) comprises two storage components (331) that are symmetrically distributed, the storage components (331) comprising a bottom longitudinal frame (332), the storage components (331) being fixedly connected to the horizontal sliding seat (32) via the top of the bottom longitudinal frame (332), a mounting longitudinal frame (333) being fixedly mounted on the top of the bottom longitudinal frame (332), a storage frame (334) being fixedly mounted on the mounting longitudinal frame (333) via bolts, the storage frame (334) being provided with an observation longitudinal slot (3341), a sliding slot (3341) being provided in the observation longitudinal slot (3341) A material storage base (335) is provided, a mounting base (3351) is fixedly installed in the middle of the bottom end of the material storage base (335), a longitudinal slide cylinder (336) is fixedly installed at the bottom of the mounting base (3351) by means of bolts, the bottom of the longitudinal slide cylinder (336) is slidably clamped on the top end of the bottom longitudinal frame (332), the bottom of the longitudinal slide cylinder (336) extends into the bottom longitudinal frame (332), a lifting screw (337) is rotatably installed at the bottom end of the bottom longitudinal frame (332), and the lifting screw (337) is threadedly installed in the longitudinal slide cylinder (336).

2. The high-efficiency wafer automatic sorting and testing equipment according to claim 1 is characterized in that: A one-way bearing (37) is fixedly installed at the bottom of the lifting screw (337) in the storage component (331), and a first gear (371) is fixedly installed on the outer side of the one-way bearing (37). A first rack (372) is provided on the outer side of the first gear (371), and the first rack (372) can be meshed and connected with the first gear (371). The first rack (372) is located between the two storage components (331). A second vertical frame (373) is fixedly installed at the bottom end of the equipment base plate (2), and the first rack (372) is fixedly installed at the bottom end of the second vertical frame (373).

3. The high-efficiency wafer automatic sorting and testing equipment according to claim 1 is characterized in that: The material placement mechanism (36) comprises a material placement top frame (361), the material placement top frame (361) is fixedly mounted in the middle of the equipment top frame (35), the material placement top frame (361) is located above the storage mechanism (33), the material placement top frame (361) is located between the two storage components (331), both sides of the bottom of the material placement top frame (361) are rotatably mounted with a turning shaft (362), the outer side of the turning shaft (362) is fixedly mounted with a support seat (363), and the support seat (363) is fixedly mounted on the outer side of the turning shaft (362). 63) is movably connected to the bottom of the material placement top frame (361), one end of the flip shaft (362) is fixedly mounted with a driven worm gear (364), the outer side of the driven worm gear (364) is meshingly connected with a driving worm (365), both ends of the driving worm (365) are rotatably mounted with a rotating frame (366), the rotating frame (366) is fixedly mounted on the outer side of the material placement top frame (361), and one end of the driving worm (365) is fixedly mounted with a second gear (367).

4. The high-efficiency wafer automatic sorting and testing equipment according to claim 3 is characterized by: A third frame (3332) is fixedly mounted on the top of a longitudinal frame (333) installed in a storage member (331) close to one side of the second gear (367), and a second rack (3671) is fixedly mounted on the top of the third frame (3332). The side of the top of the second rack (3671) away from the material placement mechanism (36) can be meshed and connected with the bottom of the second gear (367).

5. The high-efficiency wafer automatic sorting and testing equipment according to claim 4 is characterized in that: A fourth frame (3331) is fixedly mounted on the top of a longitudinal frame (333) installed in a storage member (331) at a position away from the second gear (367). A third rack (3672) is fixedly mounted on the top of the fourth frame (3331). The bottom end of the third rack (3672) is close to the side of the fourth frame (3331) and can be meshed with the top of the second gear (367).

6. The high-efficiency wafer automatic sorting and testing equipment according to claim 1, characterized in that: The film placement mechanism (4) comprises two groups of symmetrically distributed film placement frames (41), the film placement frames (41) being fixedly mounted on the top of the device bottom plate (2), a second linear electric rail (42) being fixedly mounted on the top of the film placement frames (41), and a film placement bottom plate (43) being fixedly mounted on the driving end of the second linear electric rail (42).

7. The high-efficiency wafer automatic sorting and testing equipment according to claim 1, characterized in that: The material conveying mechanism (5) comprises two groups of symmetrically distributed material conveying frames (51), the material conveying frames (51) being fixedly mounted on the top of the equipment bottom plate (2), the top of the material conveying frames (51) being fixedly mounted with a third linear electric rail (52), the third linear electric rail (52) and the second linear electric rail (42) being vertically distributed, a mounting top frame (53) being fixedly mounted on the driving end of the third linear electric rail (52), a first lifting rod (54) being fixedly mounted on the end of the mounting top frame (53), a mounting bottom frame (55) being fixedly mounted on the driving end of the first lifting rod (54), and a suction cup (56) being fixedly mounted on the end of the mounting bottom frame (55).

8. The high-efficiency wafer automatic sorting and testing equipment according to claim 3 is characterized by: The detection mechanism (6) comprises a detection base frame (61), the detection base frame (61) being fixedly mounted on a side of the top of the equipment bottom plate (2) close to the sorting mechanism (3), a support top frame (62) being fixedly mounted on the top of the detection base frame (61), a second lifting rod (63) being fixedly mounted on the top of the support top frame (62), a detection auxiliary frame (64) being fixedly mounted on the driving end of the second lifting rod (63), and a detection module (65) being fixedly mounted on the end of the detection auxiliary frame (64).

9. The high-efficiency wafer automatic sorting and testing equipment according to claim 8, characterized in that: The position of the detection module (65) corresponds vertically to the position of the material placement top frame (361).

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