Wafer film pasting apparatus and wafer film pasting method

Abstract

The embodiment of the application provides a wafer film pasting device and a wafer film pasting method, which comprise: a device base used for fixing a wafer to be coated with a film and placing a steel ring with a DDAF film; a positioning device arranged on the device base and used for moving the position of the steel ring to a fixed position, so that the center of the steel ring is aligned with the center of the wafer to be coated with a film; the positioning device comprises: a fixed structure fixed at a side edge position of the device base; and a moving structure arranged at another side edge position of the device base opposite to the fixed structure, wherein the moving structure pushes the steel ring to the fixed structure in a direction pointing to the center of the wafer to be coated with a film, so that the steel ring is located at the fixed position; and the center of the fixed position is the same as the center of the wafer to be coated with a film. In this way, the concentricity of the wafer to be coated with a film and the center of the steel ring can be improved, and the quality of a film coating process is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a wafer bonding device and a wafer bonding method. Background Technology

[0002] In semiconductor manufacturing, vacuum lamination involves attaching a dicing die attach film (DDAF film) to a wafer to facilitate wafer dicing and packaging. During vacuum lamination, the quality of the coating process affects the success rate of the dicing equipment, and consequently, the smooth execution of the entire vacuum lamination process. Therefore, improving the quality of the coating process has become a pressing issue for those skilled in the art. Summary of the Invention

[0003] In view of this, this application provides a wafer coating equipment and a wafer coating method to improve the quality of the coating process.

[0004] The wafer lamination equipment provided in this application includes:

[0005] The equipment base is used to support the wafer to be coated and to hold the steel ring with the DDAF film.

[0006] A positioning device, disposed on the base of the equipment, is used to move the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated;

[0007] The positioning device includes: a fixed structure fixed to one side edge of the equipment base; and a movable structure disposed on the other side edge of the equipment base opposite to the fixed structure. In a direction pointing towards the center of the wafer to be coated, the movable structure pushes the steel ring to the fixed structure so that the steel ring is located at the fixed position.

[0008] The center of the fixed position is the same as the center of the coated wafer.

[0009] Optionally, the number of the fixed structure and the movable structure is at least two.

[0010] Optionally, the fixed structure and the movable structure are distributed around the steel ring.

[0011] Optionally, the positioning device further includes: a movable structure fixing block, which has a track along the direction pointing to the center of the wafer to be coated, and the movable structure is disposed in the track.

[0012] Optionally, one end of the track near the outer contour of the wafer to be coated is aligned with the outer contour of the circular structure.

[0013] Optionally, the fixing structure is a positioning pin; the outer contour of the steel ring has a groove corresponding to the fixing position.

[0014] Optionally, the positioning device further includes: a fixing structure mounting platform, disposed at one edge of the equipment base, for supporting the fixing structure.

[0015] Optionally, it also includes a pressure detection device for detecting the pressure between the moving structure and the steel ring.

[0016] Optionally, a center detection device is used to detect whether the center of the steel ring is aligned with the center of the wafer to be coated, and to control the motor of the moving structure.

[0017] A signal transmission unit is disposed in the center detection device;

[0018] A signal receiving unit is provided on the motor that controls the moving structure.

[0019] This application also provides a wafer bonding method, applied to the wafer bonding equipment described in any of the above embodiments, including:

[0020] A device base is provided, which supports the wafer to be coated and holds a steel ring with DDAF film.

[0021] The moving structure of the positioning device is moved along the direction pointing to the center of the wafer to be coated, and the steel ring is pushed to the fixed structure of the positioning device so that the steel ring is located in a fixed position;

[0022] The center of the fixed position is the same as the center of the wafer to be coated.

[0023] The wafer polishing equipment provided in this application includes: an equipment base for supporting a wafer to be coated and placing a steel ring with a DDAF film thereon; a positioning device disposed on the equipment base for moving the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated; the positioning device includes: a fixing structure fixed at one edge of the fixed position; and a moving structure disposed at the other edge of the fixed position opposite to the fixing structure. The moving structure pushes the steel ring towards the fixing structure in a direction pointing towards the center of the wafer to be coated, so that the steel ring is located at the fixed position; the center of the fixed position is the same as the center of the coated wafer.

[0024] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the steel ring can be positioned at the fixed position each time it is used. Since the center of the fixed position is the same as the center of the wafer to be coated, ensuring that the steel ring is always in the fixed position during each operation guarantees that its center is aligned with the center of the wafer. This avoids the concentricity reduction problem caused by positional shifts during steel ring movement. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during die cutting and increasing the overall success rate of the vacuum coating process. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a wafer lamination device.

[0027] Figure 2 This is a partial structural diagram of a wafer lamination device;

[0028] Figure 3 This is a schematic diagram of the wafer lamination equipment provided in an embodiment of the present invention;

[0029] Figure 4 This is a schematic flowchart of the wafer bonding method provided in an embodiment of the present invention. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] The DDAF film is attached to the back of the wafer to support it and prevent breakage or damage during dicing. The DDAF film provides stable support, enabling precise dicing of individual dies. During vacuum lamination, the concentricity of the wafer and the steel ring supporting the DDAF film significantly impacts the quality of the coating process. Poor concentricity can lead to misalignment of the DDAF film and wafer, potentially causing positional deviations during dicing, affecting dicing accuracy, and resulting in wafer breakage. Furthermore, poor concentricity can result in uneven adhesion when the diced chips are bonded to the packaging substrate, leaving some chip edges without sufficient adhesive material, thus affecting the stability and performance of the package.

[0032] The DDAF film is attached to the back of the wafer to support it and prevent breakage or damage during dicing. The DDAF film provides stable support, enabling precise dicing of individual dies. During vacuum lamination, the concentricity of the wafer and the steel ring supporting the DDAF film significantly impacts the quality of the coating process. Poor concentricity can lead to misalignment of the DDAF film and wafer, potentially causing positional deviations during dicing, affecting dicing accuracy, and resulting in wafer breakage. Furthermore, poor concentricity can result in uneven adhesion when the diced chips are bonded to the packaging substrate, leaving some chip edges without sufficient adhesive material, thus affecting the stability and performance of the package.

[0033] A wafer lamination device, such as Figure 1 As shown, the working process of the wafer laminating equipment is as follows: At point ①, the equipment precisely positions the steel ring used to carry the DDAF film. Then, a robotic arm at point ② transfers the steel ring to point ③, where the DDAF film is applied. Next, the steel ring carrying the DDAF film is transferred to point ⑤ via a robotic arm at point ④. The robotic arm at point ⑤ then moves the steel ring to either the first laminating position CH1 or the second laminating position CH2 for vacuum lamination. Wafers to be laminated are pre-fixed at points CH1 and CH2.

[0034] As can be seen, after the wafer laminating equipment precisely positions the steel ring at point ①, it still needs to be repeatedly transferred by robotic arms at points ②, ④, and ⑤. This repeated transfer by robotic arms results in a significant positional offset error when the steel ring is finally placed at CH1 or CH2. Since the wafer to be laminated is pre-fixed at CH1 or CH2, this positional offset error of the steel ring affects the concentricity between the wafer to be laminated and the center of the steel ring.

[0035] Furthermore, since the movement of the robotic arm at point ④ is controlled by a limiting block, the limiting block will wear and age over time, leading to a decrease in the operational accuracy of the robotic arm at point ④. This will cause the steel ring to shift when it is finally placed at CH1 or CH2, affecting the concentricity of the wafer to be coated and the center of the steel ring. The equipment base at CH1 or CH2 in the wafer lamination equipment is as follows: Figure 2 As shown, it can be seen that the device base at CH1 or CH2 does not have a positioning structure to ensure that the steel ring is aligned with the center of the wafer to be coated.

[0036] To address the aforementioned problems, this application provides a wafer lamination apparatus. By adding a physical structure to the apparatus's base to fix the position of a steel ring that moves to the base, the wafer and the center of the steel ring are precisely aligned. As an optional implementation, Figure 3 A partial structural schematic diagram of the wafer lamination equipment provided in an embodiment of this application is shown. For example... Figure 3 As shown in the embodiments of this application, the wafer lamination equipment includes the following structure.

[0037] The equipment base 100 is used to support the wafer 110 to be coated and to place the steel ring 130 with the DDAF film 120.

[0038] It should be noted that the device base 100 is as follows Figure 1 A base positioned at CH1 or CH2 is used to support the wafer 110 to be coated and to apply the coating. After the wafer 110 to be coated and the steel ring 130 with the DDAF film 120 are fixed in position on the equipment base 100, the wafer coating equipment can be considered to have the center of the wafer 110 to be coated aligned with the center of the steel ring 130. Only then can the coating be applied to the wafer 110.

[0039] Please continue to refer to this. Figure 3 The wafer lamination equipment provided in this application embodiment further includes: a positioning device 200, disposed on the equipment base 100, for moving the position of the steel ring 130 to a fixed position so that the center of the steel ring 130 is aligned with the center of the wafer 110 to be laminated.

[0040] Specifically, the positioning device 200 includes: a fixed structure 210 fixed to one side edge of the device base 100; and a movable structure 220 disposed on the other side edge of the device base 100 opposite to the fixed structure 210. In the direction pointing to the center of the wafer 110 to be coated, the movable structure 220 pushes the steel ring 130 to the fixed structure 210 so that the steel ring 130 is located at the fixed position.

[0041] The fixed position refers to the position where the steel ring 130 should be when the center of the wafer 110 to be coated is aligned with the center of the steel ring 130. The fixed position is a region whose center is the same as the center of the wafer 110 to be coated, so that when the steel ring 130 is moved to the fixed position, the center of the steel ring 130 can be aligned with the center of the wafer 110 to be coated, improving concentricity.

[0042] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the steel ring can be positioned at the fixed position each time it is used. Since the center of the fixed position is the same as the center of the wafer to be coated, ensuring that the steel ring is always in the fixed position during each operation guarantees that its center is aligned with the center of the wafer. This avoids the concentricity reduction problem caused by positional shifts during steel ring movement. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during die cutting and increasing the overall success rate of the vacuum coating process.

[0043] Furthermore, in one optional implementation, the number of the fixing structure and the moving structure is at least two. It should be noted that both the steel ring 130 and the wafer 110 to be coated are circular, therefore at least three positioning devices 200 are required to fix the steel ring 130. Since the fixing structure 210 and the moving structure 220 are arranged in pairs, at least two pairs of fixing structures 210 and moving structures 220 are needed to meet the quantity requirement of the positioning devices 200.

[0044] Furthermore, in an optional implementation, the fixing structure 210 and the moving structure 220 are distributed around the steel ring. This allows for a more secure fixation of the steel ring 130, thereby aligning the center of the wafer 110 to be coated with that of the steel ring 130.

[0045] Furthermore, in an optional implementation, the positioning device 200 further includes a fixing structure mounting platform 211, disposed at one edge of the device base 100, for supporting the fixing structure 210. It should be noted that if the edge of the steel ring 130 is too close to the edge of the device base 100, or if the fixing structure 210 is an additional structure added to the device base 100, the fixing structure 210 may not be stably positioned between the edge of the steel ring 130 and the edge of the device base 100. Therefore, an outwardly extending fixing structure mounting platform 211 is needed on the device base 100 to support the fixing structure 210. This ensures the stability of the fixing structure 210 and guarantees that the steel ring 130 is aligned with the center of the wafer 110 to be coated.

[0046] Furthermore, in an optional implementation, the fixing structure 210 is a positioning pin; the outer contour of the steel ring 130 has a groove corresponding to the fixing position. Specifically, as shown... Figure 3 As shown, the outer contour of the steel ring 130 has a triangular groove. When the fixing structure 210 is a positioning pin, the fixing structure 210 is disposed in the triangular groove to hold the steel ring 130 in place at the fixed position. Correspondingly, in an optional implementation, the moving structure 220 is a moving pin.

[0047] Furthermore, such as Figure 3 As shown, in an optional implementation, the moving structure 220 further includes: a moving structure fixing block 221, which has a track 222 provided along the direction pointing to the center of the wafer 110 to be coated, and the moving structure 221 is disposed in the track 222.

[0048] It should be noted that the track 222 is as follows Figure 3 As shown, the track 222 is used to control the moving structure 220 to move along a predetermined straight line, and the track 222 points to the center of the wafer 110 to be coated. Since the moving structure 220 runs within the track 222, when the moving structure 220 runs to a position close to one end of the track 222 near the wafer 110 to be coated, the moving structure 220 can push the steel ring 130 to a fixed position.

[0049] Furthermore, in an alternative implementation, one end of the track 222 near the outer contour of the wafer 110 to be coated is fitted with the outer contour of the fixed position.

[0050] It should be noted that the position of the fixing structure 210 is the position of the outer contour of the steel ring 130 when the steel ring 130 is in the fixed position. Therefore, the track 222 is located near one end of the steel ring 130, that is, at the outer contour of the steel ring 130 when the steel ring 130 is in the fixed position.

[0051] In order to improve the alignment efficiency of the center of the steel ring 130 and the wafer 110 to be coated, we hope to achieve the alignment effect of the center of the steel ring 130 and the wafer 110 to be coated directly through specific steps, thereby reducing the center detection steps and improving efficiency.

[0052] Furthermore, since the fixed position of the fixed structure 210 is fixed and cannot be moved, the position of the steel ring 130 is determined by the moving structure 220. Therefore, we want the moving structure 220 to be in an ideal position when it finishes moving. This ideal position is when the moving structure 220 moves to the end of the track 222 near the outer contour of the steel ring 130, ensuring that the steel ring 130 is pushed to the fixed position. Therefore, when the end of the track 222 near the wafer 110 to be coated is in the fixed position, alignment between the wafer 110 to be coated and the center of the steel ring 130 is guaranteed.

[0053] Furthermore, in an optional implementation, it further includes: a center detection device for detecting whether the center of the steel ring 130 is aligned with the center of the wafer 110 to be coated, and controlling the motor driving the moving structure 220; a signal transmission unit disposed on the center detection device; and a signal receiving unit disposed on the motor controlling the moving structure.

[0054] It should be noted that if one end of the track 222 is not in an ideal position, it is necessary to check whether the center of the wafer 110 to be coated is aligned with the center of the steel ring 130. Therefore, an additional center detection device is required for detection. In an optional implementation, the center detection device can be an optical inspection device.

[0055] Furthermore, after detecting whether the center of the steel ring 130 is aligned with the center of the wafer 110 to be coated, the center detection device also needs to control the motor driving the moving structure 220 to move according to the detection result, so that the center of the steel ring 130 is aligned with the center of the wafer 110 to be coated. Accordingly, the center detection device and the motor need to be equipped with signal transmission units and signal receiving units, respectively, to facilitate signal interaction.

[0056] Furthermore, in an optional implementation, it further includes a pressure detection status device for detecting the pressure between the moving structure and the steel ring.

[0057] It should be noted that if one end of the track 222 is not in an ideal position, excessive movement of the moving structure 220 may compress the wafer 110 to be coated or the steel ring 130, resulting in misalignment of the centers of the wafer 110 to be coated or the steel ring 130, or affecting the airtightness of the equipment during the coating process, leading to coating failure. Therefore, by setting a pressure detection device, excessive compression of the wafer 110 to be coated or the steel ring 130 by the moving structure 220 can be avoided.

[0058] This application also provides a wafer bonding method applied to the wafer bonding equipment described above. By adding a physical structure to the base of the wafer bonding equipment to move the position of the steel ring to a fixed position on the base, the center of the wafer and the steel ring are precisely aligned. As an optional implementation, Figure 4 A schematic flowchart of a wafer bonding method provided in an embodiment of this application is shown. Figure 4 As shown in the embodiments of this application, the wafer lamination method includes the following steps.

[0059] Step S10: Provide a device base, which supports the wafer to be coated and places a steel ring with DDAF film on it.

[0060] Before placing the steel ring on the equipment base, the wafer to be coated is loaded onto the equipment base.

[0061] Step S20: Move the moving structure of the positioning device along the direction pointing to the center of the wafer to be coated, and push the steel ring to the fixed structure of the positioning device so that the steel ring is located in a fixed position.

[0062] Move the movable structure until the pressure between the movable structure and the steel ring reaches a preset value.

[0063] After aligning the steel ring and the center of the wafer to be coated, the film can be applied. Please refer to the following instructions. Figure 4 .

[0064] like Figure 4 As shown, the method may further include:

[0065] Step S30: Apply a film to the wafer to be coated.

[0066] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the steel ring can be positioned at the fixed position each time it is used. Since the center of the fixed position is the same as the center of the wafer to be coated, ensuring that the steel ring is always in the fixed position during each operation guarantees that its center is aligned with the center of the wafer. This avoids the concentricity reduction problem caused by positional shifts during steel ring movement. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during die cutting and increasing the overall success rate of the vacuum coating process.

[0067] Furthermore, in an optional implementation, the wafer lamination method provided in this application embodiment further includes: detecting whether the center of the steel ring is aligned with the center of the wafer to be laminated; if not, continuing to move the moving structure; and detecting whether the pressure between the moving pin and the steel ring meets the requirements; if a preset value is reached, stopping the movement of the moving structure.

[0068] It should be noted that if one end of the track is not in an ideal position, it is necessary to check whether the wafer to be coated and the center of the steel ring are aligned. Furthermore, excessive movement of the moving structure may compress the wafer to be coated or the steel ring, leading to misalignment of the wafer or the steel ring's center, or affecting the airtightness of the equipment during the coating process, resulting in coating failure. Therefore, by setting a pressure detection device, excessive compression of the wafer to be coated or the steel ring by the moving structure can be avoided. The preset pressure value is the maximum pressure that the steel ring can withstand.

[0069] The foregoing describes multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.

[0070] While the embodiments of the present invention have been disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer film attaching apparatus characterized by comprising: The application relates to a device for aligning the center of a wafer with the center of a DDAF film. The device comprises: a device base for carrying a wafer to be coated and placing a steel ring with a DDAF film; a positioning device arranged on the device base for moving the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated; the positioning device comprises: a fixed structure fixed at one side edge position of the device base; 2. The wafer film attaching apparatus according to claim 1, wherein a moving structure arranged at another side edge position of the device base opposite to the fixed structure, which pushes the steel ring to the fixed structure in a direction pointing to the center of the wafer to be coated so that the steel ring is located at the fixed position; 3. The wafer film attaching apparatus according to claim 1, wherein the center of the fixed position is the same as the center of the wafer to be coated.

4. The wafer film attaching apparatus according to claim 1, wherein The number of the fixed structure and the moving structure is at least two.

5. The wafer film attaching apparatus according to claim 4, wherein The fixed structure and the moving structure are distributed around the steel ring.

6. The wafer film attaching apparatus according to claim 1, wherein The positioning device further comprises:

7. The wafer film attaching apparatus according to claim 1, wherein a moving structure fixing block with a track opened in a direction pointing to the center of the wafer to be coated, and the moving structure is arranged in the track.

8. The wafer film attaching apparatus according to claim 1, wherein The track is close to one end of the outer contour of the wafer to be coated and is attached to the outer contour of the fixed position. The fixed structure is a positioning pin, and the outer contour of the steel ring is provided with a groove corresponding to the fixed position.

9. The wafer film attaching apparatus according to claim 1, wherein The positioning device further comprises: a fixed structure setting table arranged at one side edge position of the device base for carrying the fixed structure. The application further comprises: a pressure detection state device for detecting the pressure between the moving structure and the steel ring.

10. A wafer film attaching method applied to the wafer film attaching apparatus according to any one of claims 1 to 9, characterized by, The application further comprises: a center detection device for detecting whether the center of the steel ring is aligned with the center of the wafer to be coated and controlling the motor of the moving structure; a signal transmission unit arranged on the center detection device; a signal receiving unit arranged on the motor of the moving structure. The application relates to a device for aligning the center of a wafer with the center of a DDAF film. The device comprises: a device base for carrying a wafer to be coated and placing a steel ring with a DDAF film; a positioning device arranged on the device base for moving the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated; the positioning device comprises: a fixed structure fixed at one side edge position of the device base; a moving structure arranged at another side edge position of the device base opposite to the fixed structure, which pushes the steel ring to the fixed structure in a direction pointing to the center of the wafer to be coated so that the steel ring is located at the fixed position; the center of the fixed position is the same as the center of the wafer to be coated.

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