Wafer carrier apparatus and wafer transport system

Abstract

The embodiment of the present specification provides a wafer carrying device and a wafer conveying system, wherein the wafer carrying device comprises: a carrying table, the carrying table has a carrying plane for carrying a wafer, and a plurality of guide grooves are arranged in the radial direction of the carrying plane; a limiting piece matched with the guide groove, and the limiting piece and the guide groove are in sliding fit; the number of limiting pieces is multiple; a driving device connected with each limiting piece and driving each limiting piece to slide along the matched guide groove, so that the limiting piece is in contact with the wafer. By using the above technical scheme, the probability of the wafer being thrown out during rotation can be reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present specification relate to the technical field of semiconductor manufacturing, and particularly relate to a wafer carrying device and a wafer conveying system. BACKGROUND

[0002] In the process of semiconductor production and manufacturing, a mechanical arm is usually used to place a wafer on a carrying table to perform processes such as cleaning and pre-alignment on the wafer.

[0003] During the rotation of the carrying table, centrifugal force will be generated, and there is a probability that the wafer will be thrown out, thereby causing wafer fragments. In this context, how to provide a technical solution to reduce the probability of the wafer being thrown out during rotation has become a technical problem that technicians in the field need to solve urgently. SUMMARY

[0004] Therefore, the present specification provides a wafer carrying device and a wafer conveying system, which can reduce the probability of the wafer being thrown out during rotation.

[0005] Firstly, the present specification provides a wafer carrying device, comprising:

[0006] a carrying table, the carrying table having a carrying plane for carrying a wafer, and a plurality of guide grooves being arranged radially on the carrying plane;

[0007] a plurality of limiting members adapted to the guide grooves and being in sliding fit with the guide grooves;

[0008] a driving device connected to each limiting member and driving each limiting member to slide along the adapted guide groove so that the limiting member abuts against the wafer.

[0009] Optionally, the limiting member comprises a first limiting rod in sliding fit with the adapted guide groove, and a first end of the first limiting rod being connected to the driving device.

[0010] Optionally, the limiting member further comprises a second limiting rod, a first end of the second limiting rod being connected to a second end of the first limiting rod, and a second end of the second limiting rod being directed towards a central region of the carrying plane.

[0011] Optionally, the first end of the second limiting rod is connected perpendicularly to the second end of the first limiting rod.

[0012] Optionally, the plurality of guide grooves are symmetrically distributed along the central region of the carrying plane.

[0013] Optionally, the driving device comprises:

[0014] a housing;

[0015] a sliding member in contact with the inner wall of the shell to form a driving chamber;

[0016] a resilient member in elastic cooperation with the sliding member and adapted to reset the sliding member;

[0017] a driving rod arranged in the shell and connected with the sliding member and the limiting member respectively.

[0018] Optionally, the shell is provided with a driving port for providing a gas source into the driving chamber to drive the sliding member to move.

[0019] The driving device further comprises a gas source channel arranged in the bearing table and in communication with the driving port.

[0020] Optionally, the driving device further comprises a guide member for defining the deformation direction of the resilient member.

[0021] Optionally, the bearing table further comprises:

[0022] a first region located on the surface of the bearing plane;

[0023] a channel located in the bearing table and in communication with the first region.

[0024] Correspondingly, the present specification also provides a wafer conveying system, characterized in comprising:

[0025] a wafer bearing device as described in any of the foregoing embodiments and adapted to bear a wafer;

[0026] a mechanical arm for picking and placing the wafer.

[0027] With the wafer bearing device provided by the present specification, during the rotation of the bearing table, the driving device can drive each limiting member to slide along the corresponding guide groove, so that the limiting member can abut against the wafer to restrict the wafer in the clamping space formed by the limiting members, so that the bearing table can stably bear the wafer, thereby reducing the probability of the wafer being thrown out during the rotation. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application or the prior art. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0029] Figure 1 Fig. 1 shows a structural schematic diagram of a wafer bearing device according to an embodiment of the present specification.

[0030] Figure 2 As shown in FIG. 1, a schematic structural view of a wafer carrying device is provided. Figure 1

[0031] Figure 3 As shown in FIG. 2, a sectional schematic view of the wafer carrying device is provided. Figure 1

[0032] As shown in FIG. 3, a structural schematic view of a driving device in the embodiments of the present specification is provided. Figure 4 DETAILED DESCRIPTION

[0033] As described in the background, during the rotation of the carrying table, the centrifugal force generated may cause the wafer to be thrown out of the carrying table, and then cause wafer fragments.

[0034] To solve the above technical problems, the embodiments of the present specification provide a wafer carrying device, during the rotation of the carrying table, the driving device can drive each limiting piece to slide along the matched guide groove, so that the limiting piece can abut against the wafer, so as to limit the wafer in the clamping space formed by each limiting piece, so that the carrying table can stably carry the wafer, thereby reducing the probability of the wafer being thrown out during the rotation.

[0035] In order for those skilled in the art to have a clearer understanding of the technical concepts, technical principles, advantages and the like contained in the embodiments of the present specification, the following will be described in detail with reference to the accompanying drawings, through specific embodiments, and in combination with specific application scenarios.

[0036] With reference to Figures 1 to 3 , Figure 1 As shown in FIG. 1, a schematic structural view of a wafer carrying device is provided. Figure 2 As shown in FIG. 2, a sectional schematic view of the wafer carrying device is provided. Figure 1 As shown in FIG. 1, a schematic structural view of a wafer carrying device is provided. Figure 3 As shown in FIG. 2, a sectional schematic view of the wafer carrying device is provided. Figure 1 As shown in FIG. 2, a sectional schematic view of the wafer carrying device is provided.

[0037] As shown in FIG. 1, a schematic structural view of a wafer carrying device is provided. Figures 1 to 3 As shown in FIG. 1, a schematic structural view of a wafer carrying device is provided.

[0038] The carrying table 110 can have a carrying plane A carrying a wafer (not shown), and the radial direction of the carrying plane A can be provided with a plurality of guide grooves; Figures 1 to 3 The limiting piece matched with the guide groove can be in sliding fit between the guide groove, and the number of the limiting piece can be multiple;

[0039] The limiting piece matched with the guide groove can be in sliding fit between the guide groove, and the number of the limiting piece can be multiple;

[0040] ​​The driving device is connected with each limiting piece and drives each limiting piece to slide along the matched guide groove, so that the limiting piece abuts against the wafer.

[0041] In combination Figures 1 to 3 , the radial direction of the bearing plane A is provided with guide grooves CH1-CH4, and limiting pieces 121, 122, 123 and 124 that are in sliding fit with the guide grooves CH1, CH2, CH3 and CH4 respectively, wherein the limiting piece 121 can be connected with the driving rod G1 in the driving device, the limiting piece 122 can be connected with the driving rod G2 in the driving device, the limiting piece 123 can be connected with the driving rod G3 in the driving device, and the limiting piece 124 can be connected with the driving rod G4 in the driving device, that is, the guide grooves, the limiting pieces and the driving rods in the driving device are in one-to-one correspondence.

[0042] Specifically, in the initial state, as shown in Figure 2 , the limiting pieces 121-124 are located at the edge position of the circumferential direction of the bearing plane A (i.e., away from the central region of the bearing plane A), and the space formed by the limiting pieces 121-124 can pass the wafer, so that the wafer can be placed on the top of the bearing plane A.

[0043] When the bearing table 110 rotates, under the action of the driving device, the limiting piece 121 can slide along the guide groove CH1 to the central region of the bearing plane A, the limiting piece 122 can slide along the guide groove CH2 to the central region of the bearing plane A, the limiting piece 123 can slide along the guide groove CH3 to the central region of the bearing plane A, and the limiting piece 124 can slide along the guide groove CH4 to the central region of the bearing plane A. In this process, the clamping space formed by the limiting pieces 121-124 gradually becomes smaller, until the limiting pieces 121-124 abut against the edge of the wafer. In this way, the wafer can be limited in the clamping space formed by the limiting pieces 121-124, so that the bearing table can stably bear the wafer, thereby reducing the probability of the wafer being thrown out during rotation.

[0044] When the corresponding processing process is completed, the bearing table 110 stops rotating, and under the action of the driving device, the limiting pieces 121-124 are reset to the initial position, and the space formed by the limiting pieces 121-124 can pass the wafer, so that the wafer can be taken out from the bearing plane A.

[0045] It should be noted that Figures 1 to 3The shape, number, distribution position and the like of the guide grooves and the limiting members are only examples for illustrating that the limiting members can be in contact with the wafer to restrict the wafer in the clamping space formed by the limiting members when the bearing table rotates by setting the sliding cooperation between the limiting members and the guide grooves, and should not be understood as a limitation on the wafer bearing device.

[0046] For example, the bearing plane can be provided with a larger number of guide grooves, for example, 6 guide grooves, and correspondingly, the wafer bearing device is provided with limiting members with the same number of guide grooves; for another example, the guide grooves can be strip-shaped holes with regular shapes such as oval or circular, or irregular shapes, and the embodiments of the present application do not make any limitation on this, as long as the sliding cooperation between the limiting members and the guide grooves can be achieved.

[0047] In a specific implementation, in order to improve the clamping effect of the limiting members on the wafer, when the guide grooves are arranged in the radial direction of the bearing plane, the plurality of guide grooves are symmetrically distributed along the center of the bearing plane.

[0048] As a specific implementation example, referring to Figure 2 , the guide grooves CH1 to CH4 can be symmetrically distributed along the center of the bearing plane A. By making the guide grooves CH1 to CH4 symmetrically distributed along the center of the bearing plane A, under the same other conditions, the sliding distance of the limiting member 121 along the guide groove CH1, the sliding distance of the limiting member 122 along the guide groove CH2, the sliding distance of the limiting member 123 along the guide groove CH3, and the sliding distance of the limiting member 124 along the guide groove CH4 can be the same in the same time period, the limiting members 121 to 124 can simultaneously contact the wafer, and the inclination of the wafer can be avoided, so that the parallelism between the wafer and the bearing plane A can be improved.

[0049] It can be understood that in some other optional implementation examples, the plurality of guide grooves can be non-uniformly distributed on the bearing plane, and the embodiments of the present application do not make any limitation on the distribution position of the guide grooves.

[0050] In some specific implementation examples of the present application, the limiting members can adopt the same structure to achieve the clamping effect on the wafer.

[0051] For the convenience of understanding and description, the structure of one of the limiting members is described by way of example below.

[0052] As an optional implementation example, referring to Figures 1 to 3 , the limiting member 121 can include a first limiting rod 1211, which can be in sliding cooperation with the corresponding guide groove CH1, and a first end of the first limiting rod 1211 can be connected with the driving device (specifically, a driving rod G1). Figure 2 ​

[0053] Specifically, the first end of the first limiting rod 1211 can pass through the guide groove CH1 and be connected with the driving device, and then under the action of the driving device (for example, the driving rod G1), the first limiting rod 1211 can slide back and forth along the guide groove CH1 to change the size of the clamping space formed by the first limiting rod 1211 and other limiting rods.

[0054] It can be understood that the limiting members 122 to 124 can have the same structure as the limiting member 121. For example, as shown in Figure 1 and Figure 3 , the limiting member 122 can include a first limiting rod 1221.

[0055] During the rotation of the carrier table, considering that relative motion can occur between the wafer and the abutting limiting members, scratches can occur on the edge of the wafer, resulting in a decrease in the yield of the subsequently formed devices.

[0056] In some optional implementation examples, the first limiting rod can be made of a material that is resistant to chemical corrosion, high temperature, and oxidation. For example, the material of the first limiting rod can be a fluoropolymer material.

[0057] In actual work, the inventors have further found that, due to the considerable centrifugal force generated by the carrier table during rotation, long-time operation can cause abrasion at the position where the first limiting rod contacts the wafer, or deformation and skewing of the first limiting rod, and the clamping space formed by the plurality of limiting members can not firmly clamp the wafer. When some of the first limiting rods are severely deformed and skewed, the wafer still has the risk of being thrown out.

[0058] Based on this, continuing to refer to Figures 1 to 3 , the limiting member 121 can further include a second limiting rod 1212, a first end of the second limiting rod 1212 can be connected with a second end of the first limiting rod 1211, and a second end of the second limiting rod 1212 can be directed toward the central region of the carrier plane A.

[0059] Specifically, when the first limiting rod 1211 is deformed and skewed, the wafer has the risk of being thrown out, and since the second end of the second limiting rod 1212 is directed toward the central region of the carrier plane A, in the direction perpendicular to the carrier plane A, the clamping spaces formed by the second limiting rods of different limiting members can limit the movement range of the wafer between the carrier plane A and each second limiting rod, so that even if the first limiting rod is deformed and skewed, the second limiting rod can play a limiting role, so that the wafer is still located in the clamping space formed by the first limiting rod and the second limiting rod, and the carrier table can still stably carry the wafer.

[0060] It should be noted that for the limiting member with the second limiting rod, the second limiting rod needs to satisfy the following conditions: 1) when each first limiting rod is in contact with the wafer, there are at least two projections of the second limiting rod in the axial direction that partially overlap the wafer; 2) when each limiting member is in other positions that are not in contact with the wafer, the space formed by the second limiting rod of each limiting member should be able to pass the wafer.

[0061] It can be understood that the limiting members 122 to 124 can also have second limiting rods. For example, as shown in Figure 1 and Figure 3 , the limiting member 122 can have a second limiting rod 1222.

[0062] In some optional implementation examples, the second limiting rod can be made of an elastic material, where the elastic material can include one or more of rubber, latex, polyurethane, or other elastic materials.

[0063] In some optional embodiments of the present specification, when the limiting member simultaneously includes a first limiting rod and a second limiting rod, the first end of the second limiting rod can be connected perpendicularly to the second end of the first limiting rod.

[0064] By connecting the first end of the second limiting rod perpendicularly to the second end of the first limiting rod, the contact area of the second limiting rod with the wafer can be increased, and the clamping effect of the limiting member on the wafer can be improved, under the condition that the size parameters of the second limiting rod are the same.

[0065] For example, as shown in Figure 1 , the first end of the second limiting rod 1212 can be connected perpendicularly to the second end of the first limiting rod 1211, and the first end of the second limiting rod 1222 can be connected perpendicularly to the second end of the first limiting rod 1221.

[0066] In some optional embodiments, the first limiting rod and the second limiting rod can be integrally formed, or the first limiting rod and the second limiting rod can be formed separately, and the embodiments of the present specification do not make any limitation in this regard.

[0067] By using the limiting member with the first limiting rod and the second limiting rod, the movement range of the wafer can be limited in the space formed by the bearing plane, the first limiting rod, and the second limiting rod, and the probability of the wafer being thrown out is greatly reduced.

[0068] In some optional embodiments of the present specification, according to actual needs, the sliding distance of the first limiting rod on the guide groove can be flexibly controlled by a corresponding driving device.

[0069] In some embodiments, a driving device can be configured for each limiting member to control the sliding distance of the limiting member respectively; or the sliding distance of each limiting member can be simultaneously controlled by the same driving device.

[0070] When the driving device is configured for each limiting member, each driving device can adopt the same structure.

[0071] As an optional implementation example, referring to Figure 4 the structural schematic diagram of a driving device in the embodiment of the present specification is shown in FIG. 13, the driving device 130 can control the sliding distance of the limiting member 121, and the driving device 130 can include: Figure 4

[0072] a housing 131;

[0073] a sliding member 132 in contact with the inner wall of the housing 131 to form a driving chamber;

[0074] a resilient member 133 in elastic cooperation with the sliding member 132 and suitable for resetting the sliding member 132;

[0075] a driving rod G1 penetrating the housing 131 and connected with the sliding member 132 and the limiting member 121 respectively.

[0076] Specifically, referring to Figures 1 to 4 When the carrier table 110 rotates, the sliding member 132 is driven to move along a first direction, which can compress the resilient member 133, and at the same time drive the driving rod G1 to move along the inner wall of the housing 131, and then drive the limiting member 121 connected with the driving rod G1 to move along the guide groove CH1 towards the central region of the bearing plane A, and then change the size of the clamping space formed by the limiting member 121 and other limiting members, until each limiting member abuts against the wafer.

[0077] During the corresponding processing process (for example, wafer cleaning process), the current state of the sliding member 132 is maintained, that is, the driving rod G1 no longer moves along the inner wall of the housing 131, and the limiting member 121 connected with the driving rod G1 remains in a static state.

[0078] When the carrier table 110 stops rotating, the sliding member 132 is stopped, and the resilient member 133 is reset from the compressed state to the natural state, and under the action of the elastic force of the resilient member 133 itself, the sliding member 132 can be driven to move along a second direction opposite to the first direction. Correspondingly, the sliding member 132 can drive the driving rod G1 to move along the second direction, and then drive the limiting member 121 to move along the guide groove CH1 towards a direction away from the central region of the bearing plane A, and then the space formed between each limiting member facilitates the removal of the wafer.

[0079] In a specific implementation example, in order to better control the movement process of the limiting member, the structure of the driving device can be further expanded.

[0080] Continuing to refer to Figure 4 ​The driving device 130 can further comprise a mounting plate 134 fixedly connected to the inner wall of the housing 131 and connected to one end of the elastic member 133.

[0081] When the sliding member 132 moves to the position of the mounting plate 134, the sliding member 132 stops moving, and the elastic member 133 is compressed to the surface of the mounting plate 134. Thus, the stroke of the elastic member 133 when compressed or stretched can be shortened, and the service life of the elastic member 133 can be improved.

[0082] Continuing to refer to Figure 4 When the driving device 130 comprises the mounting plate 134, in order to achieve the effect of driving the limiting member 121 to move by the driving rod G1, the mounting plate 134 further has a through hole through which the driving rod G1 can pass.

[0083] During the movement of the driving limiting member, the elastic member 133 can not move along the set path (for example, straight up or straight down), and when the elastic member 133 is reset from the compressed state to the natural state, the limiting member can not move smoothly; or the elastic member 133 can be twisted when compressed.

[0084] Based on this, continuing to refer to Figure 4 The driving device 130 can further comprise a guide member 135, which can define the deformation direction of the elastic member 133.

[0085] Specifically, the elastic member 133 can be spirally wound on the surface of the guide member 135, and since one end of the guide member 135 can be connected to the sliding member 132, when the sliding member 132 moves up and down along the inside of the housing 131, the elastic member 133 can be compressed along the path defined by the guide member 135, or reset to the natural state.

[0086] It should be noted that, as Figure 4 When the driving device 130 comprises both the mounting plate 134 and the guide member 135, the mounting plate 134 further has a through hole through which the guide member 135 can pass.

[0087] In actual application, the sliding member 132 can be driven to move in various ways to compress the elastic member 133 and drive the sliding member 132 to move.

[0088] As an optional implementation example, the sliding member 132 can be driven by ventilating the driving chamber.

[0089] For example, continuing to refer to Figure 4 The housing 131 can be provided with a driving port K1 for providing a gas source to the driving chamber to drive the sliding member 132 to move.

[0090] Correspondingly, the driving device 130 can further include a gas source channel (not shown) arranged in the bearing table and in communication with the driving port K1. Figure 4

[0091] Specifically, in use, the gas source (for example, high-pressure gas) is introduced through the driving port K1, so as to exert pressure on the sliding piece 132, thus driving the driving rod G1 to move downward and compress the elastic piece 133; when the gas source is stopped, the sliding piece 132 is not affected by the gas force, and is thus bounced upward by the elastic force of the elastic piece 133, thus driving the driving rod G1 to move upward.

[0092] It can be understood that the driving device 130 described in the above example can be used for the driving devices connected with the limiting pieces 122-124 respectively, and detailed description is not repeated here.

[0093] In a specific implementation, when the corresponding processing process is completed, the wafer needs to be transmitted to the next processing equipment for processing. In order to facilitate the wafer to be taken out, the bearing table in the embodiment of the present specification can further include a first area located on the surface of the bearing plane, and a channel located in the interior of the bearing table and in communication with the first area.

[0094] Specifically, the first area can be provided with gas through the channel, and the wafer can be lifted under the action of the gas, so that the wafer can be suspended above the bearing plane, and then the wafer can be transmitted to the next processing equipment through a corresponding grabbing assembly (for example, a mechanical arm).

[0095] In order to facilitate understanding of the working principle of the wafer bearing equipment provided by the present specification, the following will be described in detail through a specific example. Figures 1 to 4

[0096] In the initial state, the limiting pieces 121-124 are located at the edge region of the circumference of the bearing plane A, and the space formed by the limiting pieces 121-124 can allow the wafer to pass through, and the wafer can be placed on the bearing plane A.

[0097] When the bearing table 110 rotates, the driving port K1 can be ventilated through the gas source channel, and then the sliding piece 132 can move downward along the inner wall of the shell 131 under the action of the gas pressure, and then can compress the elastic piece 133 along the path defined by the guide piece 135 and drive the driving rod G1 to move downward, and then the limiting piece 121 can slide along the guide groove CH1 towards the center region of the bearing plane A; similarly, the limiting pieces 122-124 can slide along the matching guide grooves towards the center region of the bearing plane A, and the clamping space formed by each limiting piece becomes smaller until the edge of the wafer is in contact.

[0098] ​​During the processing, the driving chamber is continuously ventilated through the driving port K1, and under the action of air pressure, the sliding piece 132 remains in the current state, the elastic piece 133 is no longer compressed, the driving rod G1 stops moving downward, and the clamping space formed by each limiting piece remains unchanged and continues to abut against the edge of the wafer.

[0099] When the processing is completed, the driving chamber is stopped from being ventilated, and the elastic piece 133 is reset from the compressed state to the natural state. During this process, under the action of the elastic force of the elastic piece 133, the sliding piece 132 can move upward along the inner wall of the shell 131 and drive the driving rod G1 to move upward, and then the limiting piece 121 can slide along the guide groove CH1 toward the central region away from the bearing plane A; similarly, the limiting pieces 122 to 124 can slide along the matching guide grooves toward the central region away from the bearing plane A, and the space formed by each limiting piece becomes larger.

[0100] At this time, the first region can be ventilated through the channel to make the wafer hang and be placed, so as to facilitate taking the wafer from the bearing plane A.

[0101] It should be noted that the wafer bearing table provided by the embodiments of the present application can actually further include other components, such as a fixed support, a driving part (such as a suction pump), etc. In order to facilitate the description of the technical solutions of the present application and highlight the innovative part of the present application, in the present application, the components in the wafer bearing table that can be realized by the prior art are omitted.

[0102] It can be understood that the above examples are only illustrative, and in actual application, a person skilled in the art can adaptively select and / or deform the wafer bearing device provided by the embodiments of the present application according to actual needs and application scenarios. For example, the number of some components in the wafer bearing device is changed; for another example, some components in the wafer bearing device are replaced equally, etc. Based on this, more wafer bearing device implementation schemes can be extended, and the embodiments of the present application do not limit these extended schemes.

[0103] The present application also provides a wafer conveying system corresponding to the wafer bearing device described in any of the above embodiments, which is described below. It should be noted that the content of the wafer conveying system described below can be mutually corresponding and referred to the content of the wafer bearing device described above.

[0104] In specific implementation, the wafer conveying system provided by the embodiments of the present application can include:

[0105] The wafer bearing device described in any of the preceding embodiments is used to bear the wafer;

[0106] The mechanical arm is used to take and place the wafer.

[0107] The structure, connection relationship, function, working principle and other specific contents of the wafer carrying device can refer to the description of the above related parts and the drawings, and will not be described here.

[0108] It can be understood that the terms "first", "second" and the like are used only for descriptive purposes and not to indicate or imply relative importance or an indicated number of technical features. Therefore, the features defined with "first", "second" and the like can be explicitly or implicitly included one or more of the features. Moreover, the terms "first", "second" and the like are used to distinguish similar objects, and do not have to be used to describe a specific order or indicate importance. It can be understood that the terms thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than those illustrated or described herein.

[0109] Although the embodiments of the present application are disclosed as above, the application is not limited thereto. Any person skilled in the art, without departing from the spirit and scope of the application, can make various changes and modifications, therefore the protection scope of the application should be subject to the scope defined by the claims.

Claims

1. A wafer carrier apparatus, comprising: The application relates to a wafer carrier device, comprising: a carrier table having a carrier plane for carrying a wafer, wherein a plurality of guide grooves are arranged radially on the carrier plane; a plurality of limiters matched with the guide grooves and slidably matched with the guide grooves; a driving device connected with each of the limiters and driving each of the limiters to slide along the matched guide groove so that the limiters abut against the wafer, wherein the driving device comprises: a housing; a sliding member in contact with the inner wall of the housing to form a driving chamber; an elastic member in elastic contact with the sliding member and suitable for resetting the sliding member; a driving rod arranged in the housing and connected with the sliding member and the limiters respectively; a driving port provided on the housing to provide a gas source into the driving chamber so as to drive the sliding member to move; the driving device further comprises a gas source channel arranged in the carrier table and communicated with the driving port.

2. The wafer carrier apparatus of claim 1, wherein, The limiter comprises: a first limiting rod slidably matched with the matched guide groove, and a first end of the first limiting rod connected with the driving device.

3. The wafer carrier apparatus of claim 2, wherein, The limiter further comprises: a second limiting rod, a first end of the second limiting rod connected with a second end of the first limiting rod, and a second end of the second limiting rod directed to a central region of the carrier plane.

4. The wafer carrier apparatus of claim 3, wherein, The first end of the second limiting rod is perpendicularly connected with the second end of the first limiting rod.

5. The wafer carrier apparatus of claim 1, wherein, The plurality of guide grooves are symmetrically distributed along the central region of the carrier plane.

6. The wafer carrier apparatus of claim 1, wherein, The driving device further comprises a guide member defining the deformation direction of the elastic member.

7. The wafer carrier apparatus of claim 1, wherein, The carrier table further comprises: a first region on the surface of the carrier plane; a channel arranged in the carrier table and communicated with the first region.

8. A wafer transfer system characterized by, The application further relates to a wafer carrier device, comprising: the wafer carrier device according to any one of claims 1 to 7, suitable for carrying a wafer; a mechanical arm for taking and placing the wafer.

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