Carrier plate for amorphous silicon deposition of heterojunction cell

Abstract

The invention provides a carrier plate for amorphous silicon deposition of a heterojunction cell, and relates to the technical field of auxiliary tools for production of the heterojunction cell, the carrier plate comprises a carrier plate body, a bearing seat and a limiting piece, the carrier plate body is provided with a plurality of through holes and is provided with a first wall surface and a second wall surface which are opposite to each other along a first direction, the plurality of through holes extend from the first wall surface to the second wall surface and are arranged in an array; the bearing seats are installed in the through holes in a one-to-one correspondence mode, each bearing seat is provided with a containing groove used for containing silicon wafers, and one end, in the first direction, of each containing groove is provided with an opening; the limiting piece is movably connected with the bearing seat and has a first position and a second position, the limiting piece is located on the peripheral side of the containing groove at the first position, at least part of the limiting piece is located in the containing groove at the second position, the limiting piece and the silicon wafer are arranged in the first direction, and the silicon wafer is limited in the containing groove. According to the invention, the silicon wafer in the accommodating groove can be limited, the influence of separation of the silicon wafer from the accommodating groove on the transfer of the carrier plate is reduced, and the production quality of the heterojunction battery is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of auxiliary tooling for heterojunction battery production, and in particular to a carrier for amorphous silicon deposition of heterojunction batteries. Background Art

[0002] Heterojunction cells have gradually increased their market share in the field of solar cells due to their advantages such as high conversion efficiency, high open circuit voltage, low temperature coefficient, low temperature process preparation and anti-attenuation. Among them, the deposition of amorphous silicon thin film is the core process of heterojunction cells. This process requires a carrier as an auxiliary tooling to hold up the substrate. Since the performance of heterojunction cells has extremely high requirements on the surface cleanliness and friction of silicon wafers, the carrier has a vital impact on heterojunction cells. In actual use, the carriers in the related art are mostly transported by interlocking two carriers to facilitate the transportation of the carriers and reduce the pollution of the surface of the silicon wafers placed in the carriers by external dust. However, the silicon wafers in the carriers are often easy to run out of the carriers, which affects the transportation of the carriers. After the carriers are interlocked, the adjacent silicon wafers will fit each other. In the later use, they need to be manually separated, which is time-consuming and labor-intensive, reducing the production efficiency and quality of heterojunction cells. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] To this end, an embodiment of the present invention proposes a carrier for amorphous silicon deposition of heterojunction cells, which can limit the silicon wafers in the receiving grooves to effectively reduce the impact of the silicon wafers detaching from the receiving grooves on the transportation of the carrier, thereby ensuring the production efficiency and quality of the heterojunction cells.

[0005] According to an embodiment of the present invention, a carrier for amorphous silicon deposition in a heterojunction battery comprises a carrier body, a carrier seat and a limiting member, wherein the carrier body is provided with a plurality of through holes and has a first wall and a second wall opposite to each other along a first direction, wherein the plurality of through holes extend from the first wall to the second wall and are arranged in an array; the carrier seat has a plurality of through holes and is installed one-to-one in the through holes, wherein the carrier seat has a receiving groove for accommodating a silicon wafer, wherein one end of the receiving groove is open along the first direction; the limiting member is movably connected to the carrier seat and has a first position and a second position, wherein the limiting member is located on the outer peripheral side of the receiving groove in the first position, and at least a part of the limiting member is located in the receiving groove in the second position and is suitable for being arranged with the silicon wafer along the first direction to limit the silicon wafer in the receiving groove.

[0006] According to the carrier for amorphous silicon deposition of heterojunction cells according to the embodiment of the present invention, the through holes on the carrier body cooperate with the supporting seat to form a plurality of independent spaces for containing silicon wafers, which can meet the support requirements of the same carrier for multiple silicon wafers, and the limiting member can limit the silicon wafers in the receiving groove, so that the silicon wafers are not easy to escape from the receiving groove when the carrier is transported, thereby ensuring that the silicon wafers are reliably contained in the receiving groove, and when the two carriers are interlocked for transportation, the adjacent silicon wafers will not fit each other, thereby avoiding the need to manually separate the two silicon wafers at a later stage. Therefore, compared with the related art, the present invention can limit the silicon wafers in the receiving groove, so as to effectively reduce the influence of the silicon wafers detaching from the receiving groove on the transportation of the carrier, thereby ensuring the production efficiency and quality of the heterojunction cells.

[0007] In some embodiments, the bearing seat is provided with a mounting groove, the mounting groove is located on the outer peripheral side of the accommodating groove, the carrier plate further includes an actuating assembly, and the actuating assembly includes a mounting plate, a button and a first elastic member.

[0008] Wherein, the mounting plate is connected to the bearing seat and is used to block the mounting groove;

[0009] Wherein, at least a portion of the button is located in the mounting groove, the button is movably connected to the bearing seat and has a disengagement position and an extrusion position, and when the limiting member is switched from the first position to the second position, the button can slide relative to the bearing seat from the disengagement position toward the extrusion position along the first direction;

[0010] Wherein, the first elastic member is located in the mounting groove and connected between the mounting plate and the limiting member, and the first elastic member can press the limiting member toward the first position.

[0011] In some embodiments, the first elastic member is connected to the limiting member via a slider, and the slider is located in the mounting groove and has a guide surface;

[0012] The button includes a pressing head, a sliding column and an extrusion block connected in sequence, the pressing head is located on the outer peripheral side of the bearing seat, at least a portion of the sliding column is slidably connected to the bearing seat, the extrusion block is located in the mounting groove and has a pressing surface, the pressing surface is movably connected to the guide surface along the extension direction of the guide surface, and the guide surface can push the extrusion block from the extrusion position to the disengagement position under the action of the elastic force of the first elastic member.

[0013] In some embodiments, the carrier further includes a second elastic member, the second elastic member is connected between the slider and the limiting member, and the second elastic member can press the limiting member toward the silicon wafer along the first direction.

[0014] In some embodiments, the button is provided with a slot, the slot and the accommodating groove are arranged along the first direction, the carrier plate further includes a locking assembly, and the locking assembly includes an insert rod and a third elastic member.

[0015] The insertion rod has an unlocking position and a locking position. In the unlocking position, the insertion rod is arranged with the slot along the first direction and pressed against the outer peripheral wall of the button. In the locking position, at least a portion of the insertion rod is fitted in the slot.

[0016] Wherein, the third elastic member is connected between the bearing seat and the insertion rod, and when the limiting member is located at the second position, the third elastic member presses the insertion rod toward the locking position along a second direction, and the second direction is perpendicular to the first direction.

[0017] In some embodiments, there are multiple limiting members and they are arranged at intervals on the supporting seat, there are multiple actuating assemblies and they correspond one-to-one with the limiting members, and there are multiple locking assemblies and they correspond one-to-one with the actuating assemblies.

[0018] In some embodiments, the limiting member may be one of a limiting rod and a limiting plate, and the limiting member is suitable for contacting the edge of the silicon wafer.

[0019] In some embodiments, the top of the accommodating groove is located between the planes where the first wall surface and the second wall surface of the carrier body are located, and the top of the accommodating groove, the inner peripheral wall of the through hole and the first wall surface of the carrier body jointly define an accommodating area, and the locking assembly and at least part of the button are located in the accommodating area.

[0020] In some embodiments, the first wall surface of the carrier body is also provided with positioning holes and positioning columns, and the positioning holes and the positioning columns are both located on the outer peripheral side of all the through holes, and the positioning holes and the positioning columns are arranged at intervals so as to position any two first wall surfaces of the carrier body when they are pressed against each other.

[0021] In some embodiments, the supporting seat is detachably connected to the through hole.

[0022] In some embodiments, the mounting plate is detachably connected to the supporting base.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of a carrier for amorphous silicon deposition in heterojunction cells according to an embodiment of the present invention.

[0025] Figure 2 Schematic diagram of the exploded structure of a carrier for amorphous silicon deposition of a heterojunction cell according to an embodiment of the present invention (only one carrier and silicon wafer are shown in the figure).

[0026] Figure 3 Schematic diagram of the connection structure between the support seat, the actuating assembly and the locking assembly in the carrier for amorphous silicon deposition of heterojunction cells according to an embodiment of the present invention Figure 1 .

[0027] Figure 4 yes Figure 3 Schematic diagram of the connection structure between the actuating component and the locking component.

[0028] Figure 5 Schematic diagram of the connection structure between the support seat, the actuating assembly and the locking assembly in the carrier for amorphous silicon deposition of heterojunction cells according to an embodiment of the present invention Figure 2 .

[0029] Figure 6 yes Figure 5 Schematic diagram of the connection structure between the actuating component and the locking component.

[0030] Figure 7 yes Figure 6 A schematic diagram of the structure from another perspective.

[0031] Figure 8 It is a schematic diagram of an exploded structure in which a carrier for amorphous silicon deposition of a heterojunction cell according to an embodiment of the present invention is buckled with another carrier.

[0032] Figure markings: 1. carrier body, 11. through hole, 12. positioning hole, 13. positioning column, 2. bearing seat, 21. accommodating groove, 211. through hole, 22. mounting groove, 3. limit member, 4. actuating assembly, 41. mounting plate, 42. button, 421. pressing head, 422. sliding column, 423. extrusion block, 4231. pressing surface, 424. slot, 43. first elastic member, 44. slider, 441. guide surface, 5. second elastic member, 6. locking assembly, 61. insertion rod, 62. third elastic member. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0034] like Figure 1 and Figure 2As shown, a carrier for amorphous silicon deposition of a heterojunction battery according to an embodiment of the present invention comprises a carrier body 1, a carrier seat 2 and a limiter 3. The carrier body 1 is provided with a plurality of through holes 11 and has a first wall and a second wall opposite to each other along a first direction. The plurality of through holes 11 extend from the first wall to the second wall and are arranged in an array. The carrier seat 2 has a plurality of through holes 11 and is installed one by one in the through holes 11. The carrier seat 2 has a receiving groove 21 for accommodating silicon wafers, and one end of the receiving groove 21 is open along the first direction. The limiter 3 is movably connected to the carrier seat 2 and has a first position and a second position. The limiter 3 is located at the outer peripheral side of the receiving groove 21 at the first position, and at least a part of the limiter 3 is located in the receiving groove 21 at the second position and is suitable for being arranged with the silicon wafer along the first direction to limit the silicon wafer in the receiving groove 21.

[0035] It can be understood that the carrier for amorphous silicon deposition of heterojunction cells according to the embodiment of the present invention is composed of the through holes 11 on the carrier body 1 and the supporting seat 2, forming a plurality of independent spaces for containing silicon wafers, which can meet the support requirements of the same carrier for multiple silicon wafers, and the limiting member 3 can limit the silicon wafers in the receiving groove 21, so that the silicon wafers are not easy to escape from the receiving groove 21 when the carrier is transported, thereby ensuring that the silicon wafers are reliably contained in the receiving groove 21, and when the two carriers are interlocked for transportation, adjacent silicon wafers will not fit each other, thereby avoiding the need to manually separate the two silicon wafers at a later stage. Therefore, compared with the related art, the present invention can limit the silicon wafers in the receiving groove 21, so as to effectively reduce the influence of the silicon wafers detaching from the receiving groove 21 on the carrier transportation, thereby ensuring the production efficiency and quality of the heterojunction cells.

[0036] Specifically, the first direction may be the up-down direction in the figure, that is, the thickness direction of the carrier (or the height direction of the carrier). The first wall surface of the carrier body 1 may correspond to the top wall of the carrier body 1 in the figure, and the second wall surface of the carrier body 1 may correspond to the bottom wall of the carrier body 1 in the figure. The through hole 11 may extend along the first direction. The through hole 11 may be a rectangular hole or a square hole. The bearing seat 2 may be loaded into the through hole 11 from bottom to top, and the bearing seat 2 cooperates with the through hole 11. The top of the accommodating groove 21 is open. At least a part of the limiting member 3 is located above the silicon wafer in the second position to limit the silicon wafer from the up-down direction, and cooperates with the accommodating groove 21 to limit the silicon wafer in the left-right direction and the front-back direction, so that the silicon wafer can be limited in the accommodating groove 21.

[0037] like Figures 2 to 7 As shown, in some embodiments, the support seat 2 is provided with a mounting groove 22, which is located on the outer peripheral side of the accommodating groove 21, and the carrier plate also includes an actuating assembly 4, which includes a mounting plate 41, a button 42 and a first elastic member 43.

[0038] The mounting plate 41 is connected to the supporting base 2 and is used to block the mounting groove 22 .

[0039] Among them, at least part of the button 42 is located in the installation groove 22, the button 42 is movably connected to the supporting seat 2 and has a disengagement position and an extrusion position. When the limit member 3 switches from the first position to the second position, the button 42 can slide from the disengagement position to the extrusion position along the first direction relative to the supporting seat 2.

[0040] The first elastic member 43 is located in the mounting groove 22 and connected between the mounting plate 41 and the limiting member 3 . The first elastic member 43 can press the limiting member 3 toward the first position.

[0041] It can be understood that by sliding the button 42 from the disengagement position to the extrusion position on the supporting base 2, and with the cooperation of the first elastic member 43, the limiting member 3 can be switched from the first position to the second position to achieve the limitation of the silicon wafer. Similarly, when the silicon wafer needs to be removed from the carrier, the operation can be reversed to move the limiting member 3 away from the accommodating groove 21 to release the limitation on the silicon wafer.

[0042] Specifically, taking the figure as an example, the installation groove 22 can be located on the left or right side of the receiving groove 21. The button 42 and the bearing seat 2 can be slidably connected along the first direction (i.e., the up and down direction in the figure). The first elastic member 43 can push and pull the limiting member 3 along the left and right directions. A through hole 211 connecting the receiving groove 21 and the installation groove 22 can be provided on the peripheral wall surface of the receiving groove 21, and the limiting member 3 and the through hole 211 can be slidably matched, so that when the limiting member 3 switches between the first position and the second position, at least a part of the limiting member 3 can pass through the through hole 211 to retract into the installation groove 22 or enter the receiving groove 21.

[0043] like Figures 2 to 7 As shown, in some embodiments, the first elastic member 43 is connected to the limiting member 3 through a sliding block 44 . The sliding block 44 is located in the mounting groove 22 and has a guide surface 441 .

[0044] The button 42 includes a pressing head 421, a sliding column 422 and an extrusion block 423 which are connected in sequence. The pressing head 421 is located on the outer peripheral side of the bearing seat 2. At least a portion of the sliding column 422 is slidably connected to the bearing seat 2. The extrusion block 423 is located in the mounting groove 22 and has a pressing surface 4231. The pressing surface 4231 is movably connected to the guide surface 441 along the extension direction of the guide surface 441. The guide surface 441 can push the extrusion block 423 from the extrusion position to the disengagement position under the action of the elastic force of the first elastic member 43.

[0045] It is understandable that, through the interaction between the pressing surface 4231 on the squeezing block 423 and the guiding surface 441 of the slider 44 , the button 42 can be pushed to automatically reset, so as to further improve the operational convenience of the actuating assembly 4 .

[0046] Specifically, the mounting groove 22 may be provided with a slideway, and the bottom of the slider 44 is movably connected to the slideway to ensure that the slider 44 slides smoothly in the mounting groove 22. The wall of the slider 44 that is away from the guide surface 441 is installed with a stopper 3. The pressing head 421 is located above the bearing seat 2. The slide post 422 extends along the first direction. The guide surface 441 and the pressing surface 4231 are both inclined surfaces, that is, the planes where the guide surface 441 and the pressing surface 4231 are located form an angle with the vertical plane.

[0047] Therefore, when the limiting member 3 is used to limit the silicon wafer, the button 42 can be pressed downward first, so that the pressing surface 4231 of the extrusion block 423 reacts with the guide surface 441 of the slider 44, pushing the slider 44 away from the mounting plate 41. At this time, the first elastic member 43 is stretched until at least part of the limiting member 3 extends into the accommodating groove 21, keeping the button 42 in the extrusion position and making the limiting member 3 in the second position, thereby achieving the limitation of the silicon wafer.

[0048] like Figures 5 to 7 As shown, in some embodiments, the carrier further includes a second elastic member 5, which is connected between the slider 44 and the limiting member 3, and the second elastic member 5 can press the limiting member 3 toward the silicon wafer along the first direction.

[0049] It can be understood that since the limit member 3 is connected to the slider 44 through the second elastic member 5, the limit member 3 can be in elastic contact with the silicon wafer, while ensuring the limiting performance of the silicon wafer, reducing the pressure loss problem on the surface of the silicon wafer caused by the limit member 3, thereby further improving the performance of the carrier.

[0050] Specifically, there may be a plurality of second elastic members 5 arranged at intervals to ensure the connection reliability between the limiting member 3 and the slider 44 and the elastic contact performance between the limiting member 3 and the silicon wafer.

[0051] like Figures 3 to 7 As shown, in some embodiments, the button 42 is provided with a slot 424 , the slot 424 and the receiving groove 21 are arranged along the first direction, and the carrier plate further includes a locking assembly 6 , and the locking assembly 6 includes an insert rod 61 and a third elastic member 62 .

[0052] The rod 61 has an unlocking position and a locking position. In the unlocking position, the rod 61 is arranged with the slot 424 along the first direction and pressed against the outer wall of the button 42. In the locking position, at least a portion of the rod 61 fits in the slot 424.

[0053] The third elastic member 62 is connected between the bearing seat 2 and the insertion rod 61. When the limiting member 3 is at the second position, the third elastic member 62 presses the insertion rod 61 toward the locking position along the second direction, and the second direction is perpendicular to the first direction.

[0054] It can be understood that, through the cooperation between the insertion rod 61 and the third elastic member 62, the button 42 can be automatically locked during the adjustment process of the button 42, and the limiting function of the carrier for the silicon wafer is further optimized. Specifically, when the button 42 is pressed down to the extrusion position, the sliding column 422 moves down relative to the support seat 2, and the slot 424 corresponds to the insertion rod 61. The insertion rod 61 is pushed into the slot 424 under the elastic force of the third elastic member 62, that is, the insertion rod 61 is in the locking position, so that after the downward pressure on the button 42 disappears, the sliding column 422 cannot move up and reset due to the limiting of the insertion rod 61, and the locking mechanism is locked. The button 42 is locked. When it is necessary to release the limit of the silicon wafer by the limit member 3, the insertion rod 61 can be pulled out of the slot 424. At this time, the limit member 3 will pull the slider 44 towards the mounting plate 41 under the elastic force of the first elastic member 43 until the first elastic member 43 is reset and the limit member 3 is away from the accommodating groove 21. Under the interaction between the pressing surface 4231 on the extrusion block 423 and the guide surface 441 of the slider 44, the slide column 422 moves up and resets, and the slot 424 moves up accordingly. The insertion rod 61 is in the unlocking position and presses against the outer peripheral wall of the slide column 422.

[0055] Specifically, a slot 424 may be provided on the slide post 422 of the button 42, and the slot 424 may extend along the radial direction of the slide post 422. The slot 424 is located above the receiving groove 21, that is, when the slide post 422 slides along the first direction on the bearing seat 2, the portion of the slide post 422 where the slot 424 is provided is always located above the receiving groove 21. The second direction may be the front-rear direction in the figure.

[0056] In addition, the first elastic member 43, the second elastic member 5 and the third elastic member 62 may all be springs.

[0057] like Figures 3 to 7 As shown, in some embodiments, there are multiple limiting members 3 and they are arranged at intervals on the bearing seat 2, there are multiple actuating components 4 and they correspond one-to-one with the limiting members 3, and there are multiple locking components 6 and they correspond one-to-one with the actuating components 4.

[0058] It can be understood that the arrangement of multiple limiting members 3 can further ensure reliable limiting of the silicon wafer.

[0059] Specifically, taking the figure as an example, there may be two limiters 3 arranged opposite to each other on the support base 2, and located on the outer peripheral side of the accommodating groove 21 on the support base 2. Of course, the two limiters 3 may also be arranged along the diagonal line of the support base 2. The specific number and arrangement of the limiters 3 can be determined according to the actual situation, mainly to ensure the limiting performance of the silicon wafer, and will not be expanded here.

[0060] like Figure 4 and Figure 6As shown, in some embodiments, the stopper 3 may be one of a stopper rod and a stopper plate, and the stopper 3 is suitable for contacting the edge of the silicon wafer. Preferably, the stopper 3 is a stopper rod, so that the outer peripheral wall of the stopper 3 is in rolling contact with the upper surface of the silicon wafer, reducing the wear of the silicon wafer and ensuring the production quality of the silicon wafer. The stopper rod may extend in the front-to-back direction or the left-to-right direction in the figure, for example.

[0061] like Figure 1 and Figure 2 As shown, in some embodiments, the top of the accommodating groove 21 is located between the planes where the first wall surface and the second wall surface of the carrier body 1 are located, that is, the top of the accommodating groove 21 is lower than the top wall of the carrier body 1, and the top of the accommodating groove 21, the inner peripheral wall of the through hole 11 and the first wall surface of the carrier body 1 jointly define an accommodating area, and at least part of the locking component 6 and the button 42 are located in the accommodating area (that is, a countersunk area is formed between the through hole 11 and the top wall of the carrier body 1) to avoid the problem that the two carriers cannot fit tightly together due to the protrusion of the locking component 6 and the button 42 from the first wall surface of the carrier body 1 when the two carriers are buckled together for transportation later.

[0062] like Figure 2 and Figure 8 As shown, in some embodiments, the first wall surface of the carrier body 1 is further provided with positioning holes 12 and positioning posts 13, and the positioning holes 12 and positioning posts 13 are all located on the outer peripheral side of all the through holes 11, and the positioning holes 12 and positioning posts 13 are arranged at intervals so that when the first walls of any two carrier bodies 1 are pressed against each other, both can be positioned to prevent the two interlocking carriers from moving against each other during transportation, thereby ensuring the stability of carrier transportation.

[0063] Specifically, taking the figure as an example, the carrier body 1 is a rectangular plate, and there may be two positioning holes 12 and two positioning posts 13, wherein the two positioning holes 12 may be formed on the first wall surface of the carrier body 1 along the first diagonal line, and the two positioning posts 13 may be arranged on the first wall surface of the carrier body 1 along the second diagonal line. When any two carrier bodies 1 are buckled together, the positioning posts 13 of one carrier body 1 correspond to the positioning holes 12 of the other carrier body 1 one by one and are movably connected, that is, the positioning posts 13 of one carrier body 1 are slidably matched in the positioning holes 12 of the other carrier body 1.

[0064] like Figure 2 As shown, in some embodiments, the support seat 2 is detachably connected to the through hole 11 .

[0065] like Figure 3 and Figure 5 As shown, in some embodiments, the mounting plate 41 is detachably connected to the supporting seat 2 .

[0066] It can be understood that the bearing seat 2 and the through hole 11 are designed to be detachable, which facilitates the disassembly and assembly between the bearing seat 2 and the through hole 11. According to the number of silicon wafers that need to be contained, a corresponding number of bearing seats 2 can be assembled on the carrier body 1 to improve the flexibility of use of the carrier. The mounting plate 41 and the bearing seat 2 are designed to be detachable, which also facilitates the disassembly and assembly between the mounting plate 41 and the bearing seat 2. When either the bearing seat 2 or the actuator assembly 4 needs to be replaced, only the corresponding replacement is required, thereby ensuring the service life of the carrier and saving costs.

[0067] Specifically, the support base 2 and the through hole 11 of the support body 1 may be fixedly connected by bolts, and the mounting plate 41 and the support base 2 may be fixedly connected by bolts, and the mounting plate 41 ...

[0068] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0070] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0073] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A carrier for amorphous silicon deposition in heterojunction cells, characterized in that: include: A carrier body, the carrier body is provided with a plurality of through holes and has a first wall surface and a second wall surface opposite to each other along a first direction, the plurality of through holes all extend from the first wall surface to the second wall surface and are arranged in an array; A bearing seat, wherein the bearing seats are provided in a plurality and are mounted in the through holes in a one-to-one correspondence, and the bearing seat has a receiving groove for holding a silicon wafer, and one end of the receiving groove is open along the first direction; and A limiting member, the limiting member is movably connected to the supporting seat and has a first position and a second position, the limiting member is located on the outer peripheral side of the receiving groove in the first position, and at least a part of the limiting member is located in the receiving groove in the second position and is suitable for being arranged with the silicon wafer along the first direction to limit the silicon wafer in the receiving groove.

2. The carrier for amorphous silicon deposition of heterojunction cells according to claim 1, characterized in that: The bearing seat is provided with a mounting groove, and the mounting groove is located at the outer peripheral side of the accommodating groove. The carrier plate also includes an actuating assembly, and the actuating assembly includes: A mounting plate connected to the bearing seat and used to block the mounting groove; a button, at least a portion of which is located in the mounting groove, the button being movably connected to the bearing seat and having a disengagement position and a compression position, and when the limiting member is switched from the first position to the second position, the button can slide from the disengagement position toward the compression position relative to the bearing seat along the first direction; and A first elastic member, wherein the first elastic member is located in the mounting groove and connected between the mounting plate and the limiting member, and the first elastic member can press the limiting member toward the first position.

3. The carrier for amorphous silicon deposition of heterojunction cells according to claim 2, characterized in that: The first elastic member is connected to the limiting member via a slider, and the slider is located in the mounting groove and has a guide surface; The button includes a pressing head, a sliding column and an extrusion block connected in sequence, the pressing head is located on the outer peripheral side of the bearing seat, at least a portion of the sliding column is slidably connected to the bearing seat, the extrusion block is located in the mounting groove and has a pressing surface, the pressing surface is movably connected to the guide surface along the extension direction of the guide surface, and the guide surface can push the extrusion block from the extrusion position to the disengagement position under the action of the elastic force of the first elastic member.

4. The carrier for amorphous silicon deposition in heterojunction cells according to claim 3, characterized in that: It also includes a second elastic member, which is connected between the slider and the limiting member, and the second elastic member can press the limiting member toward the silicon wafer along the first direction.

5. The carrier for amorphous silicon deposition of heterojunction cells according to any one of claims 2 to 4, characterized in that: The button is provided with a slot, and the slot and the containing groove are arranged along the first direction. The carrier plate further includes a locking assembly, and the locking assembly includes: an insertion rod, the insertion rod having an unlocking position and a locking position, the insertion rod being arranged with the slot along the first direction and pressed against the outer peripheral wall of the button at the unlocking position, and at least a portion of the insertion rod being fitted into the slot at the locking position; and A third elastic member is connected between the bearing seat and the insertion rod. When the limiting member is located at the second position, the third elastic member presses the insertion rod toward the locking position along a second direction, and the second direction is perpendicular to the first direction.

6. The carrier for amorphous silicon deposition in heterojunction cells according to claim 5, characterized in that: There are a plurality of the limiting members which are arranged at intervals on the bearing seat, there are a plurality of the actuating assemblies which correspond one-to-one to the limiting members, and there are a plurality of the locking assemblies which correspond one-to-one to the actuating assemblies.

7. The carrier for amorphous silicon deposition in heterojunction cells according to claim 1, characterized in that: The limiting member may be one of a limiting rod and a limiting plate, and the limiting member is suitable for contacting the edge of the silicon wafer.

8. The carrier for amorphous silicon deposition in heterojunction cells according to claim 5, characterized in that: The top of the accommodating groove is located between the planes where the first wall surface and the second wall surface of the carrier body are located. The top of the accommodating groove, the inner peripheral wall of the through hole and the first wall surface of the carrier body jointly define an accommodating area. The locking assembly and at least part of the button are located in the accommodating area.

9. The carrier for amorphous silicon deposition in heterojunction cells according to claim 8, characterized in that: The first wall surface of the carrier body is also provided with positioning holes and positioning posts, and the positioning holes and the positioning posts are both located on the outer peripheral side of all the through holes, and the positioning holes and the positioning posts are arranged at intervals so as to position any two first wall surfaces of the carrier bodies when they are pressed against each other.

10. The carrier for amorphous silicon deposition in heterojunction cells according to claim 2, characterized in that: The bearing seat is detachably connected to the through hole; And / or, the mounting plate is detachably connected to the bearing seat.

Images