Display device

Abstract

A display device is provided that includes a display panel including an active area and a peripheral area adjacent to the active area. The input sensor is on the display panel. The input sensor includes a sensing area corresponding to the active area and a non-sensing area corresponding to the peripheral area. The input sensor includes a plurality of sensing patterns disposed in a sensing area. The plurality of signal lines are connected to the plurality of sensing patterns, respectively. A plurality of signal lines are in the non-sensing area. A ground line is disposed in the non-sensing area. The ground wire receives a ground voltage. The additional electrode is in the non-sensing area. The additional electrode is electrically connected to the ground line. The display panel includes a sealing member disposed in the peripheral area. The additional electrode overlaps at least a portion of the sealing member in a plane.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2023-0120211 filed in the Korean Intellectual Property Office on September 11, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Embodiments of the present disclosure described herein relate to a display device, and more particularly, to a display device including an input sensor. Background Art

[0003] Multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and gaming devices include a display device that displays images to a user through a display screen. The display device may include a display panel that generates an image and an input sensor that detects a user input, such as a user's touch.

[0004] The input sensor may include a conductor that detects an external input. For example, an input sensor provided on a display panel may detect a user's input in a capacitive manner. In the capacitive manner, a drive signal is applied to a sensing electrode included in the input sensor, and a change in the capacitance of the sensing electrode is output as a sensing signal. The drive signal is applied to the sensing electrode through a sensing wiring. When a drive signal having a specific frequency is applied to the sensing electrode, an electromagnetic wave according to the drive signal may be radiated as an unnecessary electromagnetic signal.

[0005] Electromagnetic signals may act as noise to another device and may hinder the operation of such a device. This phenomenon may be defined as electromagnetic interference (EMI). Therefore, research on techniques for reducing EMI is ongoing. Summary of the invention

[0006] Embodiments of the present disclosure provide an input sensor and a display device including the input sensor.

[0007] According to an embodiment of the present disclosure, a display device includes a display panel, the display panel including an active area and a peripheral area adjacent to the active area. An input sensor is on the display panel. The input sensor includes a sensing area corresponding to the active area and a non-sensing area corresponding to the peripheral area. The input sensor includes a plurality of sensing patterns arranged in the sensing area. A plurality of signal lines are respectively connected to the plurality of sensing patterns. A plurality of signal lines are in the non-sensing area. A ground line is arranged in the non-sensing area. The ground line receives a ground voltage. An additional electrode is in the non-sensing area. The additional electrode is electrically connected to the ground line. The display panel includes a sealing member arranged in the peripheral area. The additional electrode overlaps at least a portion of the sealing member on a plane.

[0008] In an embodiment, the ground line may be spaced apart from the sensing region and the plurality of signal lines are placed between the ground line and the sensing region.

[0009] In an embodiment, the display panel may include a display substrate including a light emitting element, an encapsulation substrate is disposed on the display substrate, and a sealing member bonds the display substrate to the encapsulation substrate.

[0010] In an embodiment, one end of the sealing member may be aligned with one end of the package substrate.

[0011] In an embodiment, the package substrate may include an extension portion extending from one end of the sealing member. The input sensor may further include a low resistance pattern disposed directly on the extension portion.

[0012] In an embodiment, the additional electrode may include the same material as the plurality of sensing patterns.

[0013] In an embodiment, the additional electrode and each of the plurality of sensing patterns may include a transparent conductive oxide.

[0014] In an embodiment, the ground line may include the same material as the plurality of signal lines.

[0015] In an embodiment, the plurality of signal lines may include an outer signal line spaced apart from the sensing region with the ground line interposed therebetween. The input sensor may further include an insulating pattern covering an upper portion of the outer signal line.

[0016] In an embodiment, the input sensor may include: a first insulating layer disposed on the display panel; and a second insulating layer disposed on the first insulating layer.

[0017] In an embodiment, a plurality of signal lines and ground lines may be disposed below the first insulating layer. A plurality of sensing patterns and additional electrodes may be disposed above the first insulating layer.

[0018] A plurality of sensing patterns and additional electrodes may be disposed under the first insulating layer, and a plurality of signal lines and ground lines may be disposed over the first insulating layer.

[0019] In an embodiment, the display device may further include a window disposed on the input sensor. The window includes a base substrate, the base substrate includes an optically transparent transmission area and a frame area adjacent to the transmission area. The conductive electrode overlaps the frame area. The conductive electrode is disposed under the base substrate.

[0020] In an embodiment, the input sensor may further include a dummy pattern disposed in the non-sensing area, the dummy pattern and the plurality of signal lines are disposed in the same layer, and the dummy pattern is spaced apart from the plurality of signal lines on a plane.

[0021] In embodiments, the additional electrode may be electrically connected to at least a portion of the dummy pattern.

[0022] In an embodiment, at least a portion of the ground line may have a width greater than a width of each of the plurality of signal lines.

[0023] In an embodiment, the input sensor may include two short sides and two long sides, the two short sides extending along a first direction and spaced apart from each other along a second direction intersecting the first direction, and the two long sides extending along the second direction and spaced apart from each other along the first direction. The additional electrode may be provided on at least one side of the two short sides and the two long sides.

[0024] In an embodiment, the ground line and each of the plurality of signal lines may not overlap the sealing member on a plane.

[0025] According to an embodiment of the present disclosure, a display device includes a display panel, the display panel includes an effective area and a peripheral area adjacent to the effective area. An input sensor is arranged on the display panel. The input sensor includes a sensing area corresponding to the effective area and a non-sensing area corresponding to the peripheral area. The input sensor includes: a plurality of signal lines arranged in the non-sensing area; a ground line arranged in the non-sensing area; and an additional electrode arranged in the non-sensing area. The additional electrode is electrically connected to the ground line. The display panel includes a sealing member arranged in the peripheral area. The additional electrode overlaps with the sealing member on a plane. The plurality of signal lines and the ground line do not overlap with the sealing member on a plane.

[0026] According to an embodiment of the present disclosure, a display device includes a display panel, the display panel including an active area and a peripheral area adjacent to the active area. An input sensor is arranged on the display panel. The input sensor includes a sensing area corresponding to the active area and a non-sensing area corresponding to the peripheral area. The input sensor includes a plurality of sensing patterns arranged in the sensing area. The plurality of sensing patterns include transparent conductive oxides. A plurality of signal lines are respectively connected to the plurality of sensing patterns. The plurality of signal lines are arranged in the non-sensing area and include a low-resistance metal. A ground line is arranged in the non-sensing area. The ground line includes a low-resistance metal. An additional electrode is arranged in the non-sensing area. The additional electrode is electrically connected to the ground line. The additional electrode includes a transparent conductive oxide. The additional electrode is electrically insulated from the plurality of signal lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects and features of the present disclosure will become apparent by describing in detail non-limiting embodiments of the present disclosure with reference to the accompanying drawings.

[0028] Figure 1A is a perspective view of a display device according to an embodiment of the present disclosure.

[0029] Figure 1Bis an exploded perspective view of a display device according to an embodiment of the present disclosure.

[0030] Figure 1C According to an embodiment of the present disclosure, Figure 1B A cross-sectional view of the display module taken along line II'.

[0031] Figure 1D According to an embodiment of the present disclosure, Figure 1B A cross-sectional view of the display substrate taken along line II-II'.

[0032] FIG. 2A to FIG. 2D is a cross-sectional view illustrating a method for manufacturing a display module according to an embodiment of the present disclosure.

[0033] Figure 3 is a plan view of an input sensor according to an embodiment of the present disclosure.

[0034] Figure 4A is a plan view of a portion of an input sensor according to an embodiment of the present disclosure.

[0035] Figure 4B According to an embodiment of the present disclosure, Figure 4A A cross-sectional view of a portion of the input sensor taken along line III-III'.

[0036] Figure 5 According to an embodiment of the present disclosure, Figure 3 A cross-sectional view of the display module taken along line IV-IV'.

[0037] Fig. 6A is a graph depicting capacitances of an antenna and sensing patterns of corresponding channels of an input sensor according to an embodiment of the present disclosure and an input sensor of a comparative example.

[0038] Figure 6B is a graph depicting the intensity of electromagnetic interference with respect to frequency of an input sensor according to an embodiment of the present disclosure and an input sensor of a comparative example.

[0039] Figures 7 to 9 is a cross-sectional view of a display module according to an embodiment of the present disclosure.

[0040] Fig.10 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0041] FIG. 11A to FIG. 11C is a plan view of an input sensor according to an embodiment of the present disclosure.

[0042] Fig.12 is a plan view of an input sensor according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] In this specification, the expression that a first component (or region, layer, part, portion, etc.) is "on", "connected to" or "coupled to" a second component means that the first component is directly on, directly connected to or directly coupled to the second component, or means that a third component is placed between the first component and the second component.

[0044] The expression "directly disposed" may mean that a layer, a film, a region, a plate, or another intervening element is not added between a portion (such as a layer, a film, a region, and a plate) and another portion. For example, the expression "directly disposed" may mean that two layers or two members are disposed without using an additional member (for example, an intervening element) (such as an adhesive member) therebetween.

[0045] The same reference numerals represent the same components. In addition, in the drawings, the thickness, ratio, size of the components may be exaggerated in order to effectively describe the technical content. The term "and / or" includes one or more combinations that can be defined by the relevant components.

[0046] In addition, when describing various components, terms such as first and second may be used, but the present disclosure is not limited by the terms. The terms are only used to distinguish components. For example, without departing from the scope of the present disclosure, a first component may be named a second component, and similarly, a second component may also be named a first component. Unless an exception is clearly described in the context, a singular expression includes a plural expression.

[0047] In addition, terms such as "below", "beneath", "on", and "over" are used to describe association relationships between components shown in the drawings. The terms are relative concepts and are described with respect to the directions shown in the drawings.

[0048] When terms (such as "comprises" and / or variations thereof) are used in the specification, it should be understood that they illustrate the presence of the above-mentioned features, integers, steps, operations, components, parts and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts and / or combinations thereof.

[0049] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the specification and the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0050] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0051] Figure 1A is a perspective view of a display device EA according to an embodiment of the present disclosure. Figure 1B is an exploded perspective view of a display device EA according to an embodiment of the present disclosure. Figure 1C is a cross-sectional view of a display module 200 according to an embodiment of the present disclosure. Figure 1D is a cross-sectional view of a display substrate 210 -B according to an embodiment of the present disclosure. Figure 1C Shows the corresponding Figure 1B Section along line I-I'. Figure 1D Shows the corresponding Figure 1B In the following, reference will be made to Figures 1A to 1D A display apparatus EA according to an embodiment of the present disclosure and a display substrate 210 -B included in the display apparatus EA are described.

[0052] Reference Figure 1A , the display device EA may be a device activated according to an electrical signal. The display device EA may include various embodiments. For example, the display device EA may include a tablet computer, a notebook computer, a computer, a smart TV, and a display for a vehicle. Figure 1A In the embodiment shown in FIG. 1 , the display device EA is shown as a tablet computer. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0053] The display device EA can display an image IM through a display surface FS. In an embodiment, the display surface FS extends in a plane defined by a first direction DR1 and a second direction DR2. A normal direction of the display surface FS (such as a thickness direction of the display device EA) is represented by a third direction DR3. The front surface (e.g., upper surface) and the rear surface (e.g., lower surface) of a component or unit to be described below are spaced apart from each other in the third direction DR3. Hereinafter, the first direction DR1, the second direction DR2, and the third direction DR3 are defined as directions indicated by a first direction axis to a third direction axis, and refer to the same figure marks. Although Figure 1A The embodiment shown in FIG. 4 shows the first to third directions DR1 to DR3 that are perpendicular to each other, but the embodiments of the present disclosure are not necessarily limited thereto, and the first to third directions DR1 to DR3 may cross each other at various angles.

[0054] In an embodiment, the display surface FS on which the image IM is displayed may correspond to the front surface of the display device EA, and may correspond to the front surface FS of the window 100, which will be referred to below. Figure 1B Description. Hereinafter, the display surface and the front surface of the display device EA and the front surface of the window 100 are denoted by the same reference numerals. Figure 1A Software application icons, clocks, temperature, and calendar windows are shown as examples of the image IM. However, embodiments of the inventive concept are not necessarily limited thereto, and the image IM may be a variety of different themes.

[0055] Reference Figure 1B , the display device EA includes a window 100 and a display module 200. In an embodiment, the display device EA may further include an optical member POL (see FIG. 1 ) disposed between the window 100 and the display module 200 (eg, in the third direction DR3). Fig.10 ) and the adhesive layer ADL (see Fig.10 ). In an embodiment, the optical member may include a polarizing plate. Alternatively, the optical member may include a color filter member that reduces reflectivity of external light.

[0056] The window 100 includes a base substrate. For example, in an embodiment, the base substrate may include glass or plastic or a combination thereof. The front surface FS of the window 100 includes a transmission area TA and a frame area BZA. The transmission area TA may be an optically transparent area. For example, in an embodiment, the transmission area TA may be an area having a visible light transmittance greater than or equal to about 90%.

[0057] The frame area BZA may be an area having a relatively low light transmittance compared to the transmission area TA. The frame area BZA defines the shape of the transmission area TA. In an embodiment, the frame area BZA may be adjacent to the transmission area TA and may surround the transmission area TA (e.g., in the first direction DR1 and the second direction DR2). The window 100 may include a light shielding pattern disposed in the base substrate and defining the frame area BZA.

[0058] In an embodiment, the border area BZA may have a specific color. The border area BZA may prevent the peripheral area NAA from being viewed from the outside while covering the peripheral area NAA of the display module 200. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in the window 100 according to an embodiment of the present disclosure, the border area BZA may be reduced or omitted.

[0059] The display module 200 can generate an image IM (see Figure 1A ) and can detect external input. In an embodiment, the front surface IS of the display module 200 includes an active area AA and a peripheral area NAA. The active area AA may be an area activated according to an electrical signal. The active area AA and the peripheral area NAA may be defined in the display panel 210.

[0060] In an embodiment, the active area AA may be an area in which the image IM is displayed, and may also be an area in which an external input is sensed. The active area AA may correspond to the transmissive area TA, and the peripheral area NAA may correspond to the bezel area BZA. In the specification, the expression "an area / portion and another area / portion correspond to each other" means (for example, in the third direction DR3) "they at least partially overlap each other", and is not necessarily limited to having the same area and / or the same shape as each other.

[0061] Reference Figure 1B and Figure 1C In an embodiment, the display module 200 includes a display panel 210, an input sensor 220, a driver circuit (or driving circuit) DIC, and a circuit module FTC.

[0062] In an embodiment, the display panel 210 may be an organic light emitting display panel or an inorganic light emitting display panel. The panels are classified according to the constituent materials of the light emitting elements. The light emitting layer of the organic light emitting display panel may include an organic light emitting material. In an embodiment, the light emitting layer of the inorganic light emitting display panel may include quantum dots and / or quantum rods. Hereinafter, for ease of description, the display panel 210 will be described as an organic light emitting display panel.

[0063] The input sensor 220 senses external input applied from the outside. For example, in an embodiment, the external input may be input by a user's touch or a stylus. However, the embodiments of the present disclosure are not necessarily limited thereto, and the input may be sensed by proximity (e.g., hovering of a user, a stylus, or other object), etc. In an embodiment, the input sensor 220 may be a capacitive touch sensor. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0064] The driver circuit DIC is disposed on the display panel 210. For example, in an embodiment, the driver circuit DIC may be mounted on the display panel 210 (eg, directly mounted on the display panel 210). The driver circuit DIC is electrically connected to the display panel 210 to provide the display panel 210 with an electrical signal for driving the display panel 210.

[0065] The circuit module FTC is electrically connected to the input sensor 220. In an embodiment, the circuit module FTC may include a flexible circuit board CF and a sensor drive circuit TIC. The flexible circuit board CF includes an insulating layer and a plurality of wirings. The wirings electrically connect the input sensor 220 and the sensor drive circuit TIC to each other. In an embodiment, the sensor drive circuit TIC may be mounted on the flexible circuit board CF in the form of a chip on film.

[0066] The circuit module FTC may connect (e.g., electrically connect) the input sensor 220 and the display panel 210. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the sensor drive circuit TIC may be omitted. In an embodiment of the present disclosure, the sensor drive circuit TIC and the driver circuit DIC may be integrated.

[0067] Reference Figure 1C In an embodiment, the display panel 210 may include a display substrate 210-B, an encapsulation substrate 210-U, and a sealing member SM that combines the display substrate 210-B and the encapsulation substrate 210-U with each other. The display substrate 210-B includes pixels that basically generate an image. The encapsulation substrate 210-U prevents the pixels from being damaged by external moisture, oxygen or other contaminants by sealing the pixels. In an embodiment, the input sensor 220 may be directly disposed on the encapsulation substrate 210-U.

[0068] The driver circuit DIC may be coupled to the display substrate 210-B. In an embodiment, the driver circuit DIC may be provided in the form of an integrated chip. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment of the present disclosure, the driver circuit DIC may not be provided on the display substrate 210-B. In an embodiment, the driver circuit DIC may be mounted on a circuit board connected to the display substrate 210-B.

[0069] In an embodiment, the display substrate 210-B and the encapsulation substrate 210-U are base substrates and may include a glass substrate or a plastic substrate. The display substrate 210-B and the encapsulation substrate 210-U may include a glass substrate. The display substrate 210-B may have an area larger than that of the encapsulation substrate 210-U (e.g., an area in a plane defined in the first direction DR1 and the second direction DR2). In an embodiment, the driver circuit DIC may be disposed in a partial area of ​​the display substrate 210-B exposed from the encapsulation substrate 210-U. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment of the present disclosure, the display substrate 210-B and the encapsulation substrate 210-U may have the same area and the same shape as each other.

[0070] The sealing member SM may include, for example, glass frit. Glass frit is a ceramic bonding material and has a characteristic of being cured after exposure. In an embodiment, the glass frit contains about 15 wt % to about 40 wt % of V as a main component. 2 O 5 , about 10 wt % to about 30 wt % TeO 2 , about 1 wt % to about 15 wt % of P 2 O 5, about 1 wt % to about 15 wt % of BaO, about 1 wt % to about 20 wt % of ZnO, about 5 wt % to about 30 wt % of ZrO 2 and about 5 wt % to about 20 wt % of WO 3 and may include Fe as an additive 2 O 3 , CuO, MnO, Al 2 O 3 、Na 2 O and Nb 2 O 5 The sealing member SM overlaps the peripheral area NAA (eg, in the third direction DR3 ).

[0071] Reference Figure 1D In an embodiment, the display substrate 210-B includes a base substrate 210-G, a circuit element layer 210-CL disposed on the base substrate 210-G (e.g., directly disposed on the base substrate 210-G in the third direction DR3), and a display element layer 210-OLED disposed on the circuit element layer 210-CL (e.g., directly disposed on the circuit element layer 210-CL in the third direction DR3). The display substrate 210-B may further include a cover layer or an encapsulation layer covering the display element layer 210-OLED.

[0072] In an embodiment, the base substrate 210-G may include a glass substrate, a metal substrate, or an organic / inorganic composite material substrate. The circuit element layer 210-CL includes at least one insulating layer and a circuit element. The insulating layer includes at least one inorganic layer and at least one organic layer. The circuit element includes a signal line and a pixel driving circuit. In an embodiment, a pixel driving circuit may be provided for each pixel. However, the embodiments of the present disclosure are not necessarily limited thereto, and a pixel driving circuit may be provided in common for a plurality of pixels. The display element layer 210-OLED may include a light-emitting element OLED. In an embodiment, a light-emitting element OLED may be provided for each pixel. However, the embodiments of the present disclosure are not necessarily limited thereto. The light-emitting element OLED may be turned on and off according to the control of the pixel driving circuit, and its light-emitting brightness may be determined. In an embodiment, the light-emitting element OLED may include an organic light-emitting diode.

[0073] FIG. 2A to FIG. 2D is a cross-sectional view illustrating a method for manufacturing the display module 200 according to an embodiment of the present disclosure.

[0074] In an embodiment, Figure 2A As shown in FIG. 1 , first, a display substrate 210-B and an input sensor 220 are prepared. Figure 2A, a display substrate 210-B having a driver circuit DIC mounted thereon is shown, but the embodiments of the present disclosure are not necessarily limited thereto. In an embodiment, the driver circuit DIC may be omitted, or the driver circuit DIC may be mounted on the display substrate 210-B after a manufacturing process to be described below. The package substrate 210-U may be a base substrate on which the input sensor 220 may be formed. The input sensor 220 is formed on (e.g., directly formed on) one surface (e.g., an upper surface) of the package substrate 210-U (e.g., in the third direction DR3).

[0075] like Figure 2B As shown in FIG. 2 , a sealing composite material SM-P is disposed between the display substrate 210 -B and the encapsulation substrate 210 -U (eg, in the third direction DR3 ). Figure 1D The packaging composite material SM-P is disposed in the peripheral area NAA of the circuit element layer 210-CL shown in FIG. Thereafter, the packaging substrate 210-U is arranged on the display substrate 210-B. One surface of the packaging substrate 210-U (such as the lower surface of the packaging substrate 210-U on which the input sensor 220 is not disposed) may face the packaging composite material SM-P.

[0076] like Figure 2C As shown in FIG. 2 , the laser beam LB is irradiated to the sealing composite material SM-P from the upper side of the input sensor 220. The sealing composite material SM-P exposed to the laser beam LB is cured.

[0077] like Figure 2D As shown in FIG. 1 , the cured sealing composite material SM-P forms a sealing member SM. The sealing member SM is sealed with the package substrate 210-U. Figure 1D The display element layer 210-OLED protects the organic light emitting diode from external moisture, oxygen and other pollutants.

[0078] Figure 3 is a plan view of an input sensor 220 according to an embodiment of the present disclosure. Figure 3 FIG. 2 shows the sensing area AA0 and the non-sensing area NAA0 of the input sensor 220, and the sensing area AA0 and the non-sensing area NAA0 correspond to Figure 1B The active area AA and the peripheral area NAA of the display panel 210 are defined. The sensing area AA0 and the non-sensing area NAA0 are defined. Figure 1C For ease of description, Figure 3 The display panel 210 (see Figure 1C ) in a plane arrangement of the sealing member SM. However, embodiments of the present disclosure are not necessarily limited thereto.

[0079] The input sensor 220 includes a plurality of sensing electrodes SE1 and SE2 and a plurality of signal lines SL connected to the plurality of sensing electrodes SE1 and SE2. The input sensor 220 also includes a ground line GND and an additional electrode AP disposed in the non-sensing area NAA0.

[0080] The sensing electrodes SE1 and SE2 are disposed in the sensing area AA0. In an embodiment, the sensing electrodes SE1 and SE2 may include a plurality of first sensing electrodes SE1 and a plurality of second sensing electrodes SE2 crossing each other.

[0081] In an embodiment, the first sensing electrode SE1 may extend along the first direction DR1 and may be arranged along the second direction DR2. In an embodiment, each of the first sensing electrodes SE1 may include a plurality of first sensing patterns SP1 (hereinafter, sensing portions of the first group) and a plurality of middle portions BP1 (hereinafter, middle portions of the first group) arranged along the first direction DR1. In an embodiment, the second sensing electrode SE2 may extend along the second direction DR2 and may be arranged along the first direction DR1. In an embodiment, each of the second sensing electrodes SE2 may include a plurality of second sensing patterns SP2 (hereinafter, sensing portions of the second group) and a plurality of middle portions BP2 (hereinafter, middle portions of the second group) arranged along the second direction DR2.

[0082] The above terms of “first sensing electrode SE1 and second sensing electrode SE2” are terms defined to distinguish two electrodes. However, in an embodiment of the present disclosure, an electrode extending along the first direction DR1 may be defined as a second sensing electrode, and an electrode extending along the second direction DR2 may be defined as a first sensing electrode. In an embodiment of the present disclosure, the input sensor 220 may include only one type of sensing electrode. The input sensor 220 may sense an external input in a self-capacitance manner.

[0083] The signal line SL is disposed in the non-sensing area NAA0. In an embodiment, the signal line SL may include a plurality of first signal lines SL1 and a plurality of second signal lines SL2. In an embodiment, the plurality of first signal lines SL1 may include a 1-1th signal line SL1-1 and a 1-2th signal line SL1-2, and the plurality of second signal lines SL2 may include a 2-1th signal line SL2-1 and a 2-2nd signal line SL2-2. The above terms "first signal line SL1 and second signal line SL2" are terms defined to distinguish between two signal lines. However, the second signal line SL2 may be defined as a first signal line, and the first signal line SL1 may be defined as a second signal line. Pads (or referred to as "pads" or "soldering pads") PD are connected to the distal ends of the signal lines SL, respectively. As Figure 3 As shown in , the pads PD may be arranged along the first direction DR1.

[0084] The first signal line SL1 is electrically connected to the opposite end of the first sensing electrode SE1. The second signal line SL2 is electrically connected to the opposite end of the second sensing electrode SE2. The 1-1 signal line SL1-1 may be electrically connected to one of the opposite ends of the first sensing electrode SE1 (e.g., the right end in the first direction DR1), and the 1-2 signal line SL1-2 may be electrically connected to the other of the opposite ends of the first sensing electrode SE1 (e.g., the left end in the first direction DR1). The 2-1 signal line SL2-1 may be electrically connected to one of the opposite ends of the second sensing electrode SE2 (e.g., the lower end in the second direction DR2), and the 2-2 signal line SL2-2 may be electrically connected to the other of the opposite ends of the second sensing electrode SE2 (e.g., the upper end in the second direction DR2). As will be described below, the signal line SL may be provided at a different layer from the corresponding sensing electrodes SE1 and SE2. The expression "the above-mentioned signal line is electrically connected to the corresponding sensing electrode" means that the sensing electrode corresponding to the signal line and the signal line have an integral shape or are in direct contact with each other through a contact hole passing through an insulating layer.

[0085] However, the connection relationship between the sensing electrodes SE1 and SE2 and the signal line SL is not necessarily limited to the above description. According to an embodiment, at least any one of the 1-2 signal line SL1-2 and the 2-2 signal line SL2-2 may be omitted.

[0086] According to an embodiment, the second sensing electrode SE2 may receive a driving signal (hereinafter, a TX electrode function) through the 2-1st signal line SL2-1 and the 2-2nd signal line SL2-2, respectively. The sensor driving circuit TIC (see Figure 1B ) can receive a sensing signal (hereinafter, RX electrode function) through the 1-1 signal line SL1-1 and the 1-2 signal line SL1-2. The sensor driving circuit TIC can measure the change of the mutual capacitance between the first sensing electrode SE1 and the second sensing electrode SE2 through the sensing signal. However, the embodiments of the present disclosure are not necessarily limited to this, and the TX electrode function of the first sensing electrode SE1 and the RX electrode function of the second sensing electrode SE2 can be changed. For example, in an embodiment of the present disclosure, the 1-1 signal line SL1-1 and the 1-2 signal line SL1-2 can receive a driving signal respectively.

[0087] In an embodiment, the ground line GND receives a ground voltage and is disposed outside (eg, at the periphery) of the non-sensing area NAA0. Figure 3As shown in , the ground line GND can be set to be farther away from the sensing area AA0 than the plurality of signal lines SL (for example, in the first direction DR1 and / or the second direction DR2). For example, compared with the plurality of signal lines SL, the ground line GND can be set at the outside (for example, the periphery) of the non-sensing area NAA0. The plurality of signal lines SL can be set on a plane (for example, in the first direction DR1 and / or the second direction DR2) between the ground line GND and the sensing electrodes SE1 and SE2. A ground voltage can be applied to the ground line GND to reduce electromagnetic interference generated in the plurality of signal lines SL and the sensing electrodes SE1 and SE2.

[0088] The input sensor 220 of the embodiment may further include a dummy pattern DMP. The dummy pattern DMP may be disposed between the signal line SL and the ground line GND (eg, in the first direction DR1 and / or the second direction DR2), and a wiring area SGA (see FIG. 1 ) in which the signal line SL and the ground line GND are disposed. Figure 5 ) may be adjusted to be constant. In an embodiment, the dummy pattern DMP may be disposed at the same layer as the signal line SL, and may be spaced apart from the signal line SL and the ground line GND (e.g., in the first direction DR1 and / or the second direction DR2). In an embodiment, the dummy pattern DMP may be formed by the same process as that for the signal line SL, and may include the same material. For example, the dummy pattern DMP may include a low-resistance metal. The dummy pattern DMP may be an electrically isolated floating pattern. However, the embodiments of the present disclosure are not necessarily limited thereto, and the dummy pattern DMP may be omitted in some embodiments.

[0089] The input sensor 220 of the embodiment may further include a guard line GDL. The guard line GDL may be provided between each of the signal lines SL and the ground line GND and the dummy pattern DMP, or may be provided between one first signal line SL1 and one second signal line SL2 disposed adjacent to each other among the plurality of first signal lines SL1 and the plurality of second signal lines SL2. The guard line GDL may reduce parasitic capacitance between two lines disposed adjacent to each other.

[0090] The sealing member SM is disposed outside the signal line SL and the ground line GND on a plane (for example, in the first direction DR1 and / or the second direction DR2). In order to reduce the area of ​​the non-sensing area NAA0, the sealing member SM may overlap the pad PD. As described above, since the sealing member SM is formed by using the laser beam LB (see Figure 2C ) Curing sealing composite material SM-P (see Figure 2C ), so the sealing member SM may not overlap with the ground line GND and the signal line SL including the reflective metal on a plane.

[0091] The input sensor 220 includes an additional electrode AP overlapping at least a portion of the sealing member SM on a plane (e.g., in the third direction DR3). The additional electrode AP is electrically connected to the ground line GND. The additional electrode AP may be electrically insulated from the signal line SL. The additional electrode AP may overlap at least a portion of the ground line GND on a plane (e.g., in the third direction DR3) and may be electrically connected to the ground line GND, whereby the additional electrode AP may also receive a ground voltage. For example, Figure 3 As shown in , the remaining portion of the additional electrode AP except for the region in which the pad PD is disposed may be disposed to overlap the sealing member SM (eg, in the third direction DR3 ).

[0092] The additional electrode AP overlaps the sealing member SM on a plane (for example, in the third direction DR3). Since the additional electrode AP includes a material that transmits light, unlike the signal line SL and the ground line GND, in the process of forming the sealing member SM, although the additional electrode AP is overlapped with the packaging composite material SM-P (see Figure 2C ) are superimposed, but the laser beam LB (see Figure 2C ) can pass through the additional electrode AP to encapsulate the composite material SM-P (see Figure 2C ) solidification.

[0093] Figure 4A is a plan view of a portion of the input sensor 220 according to an embodiment of the present disclosure. Figure 4B is a cross-sectional view of a portion of the input sensor 220 according to an embodiment of the present disclosure. Figure 4A yes Figure 3 A plan view of the first area A1. Figure 4B is corresponding to Figure 4A In the following, reference will be made to Figure 3 The structure of the sensing electrodes SE1 and SE2 of the input sensor 220 is described in detail.

[0094] like Figure 4A and Figure 4B As shown in , the first area A1 corresponds to a unit area UA. In the embodiment, Figure 3 The sensing area AA0 may include Figure 4A and Figure 4B A crossing region of the first sensing electrode SE1 and the second sensing electrode SE2 is disposed in each of the unit regions UA.

[0095] In an embodiment, any one of the first sensing electrode SE1 and the second sensing electrode SE2 may have an integral shape, and the other may include a plurality of patterns spaced apart from each other. Figure 4AIn the embodiment shown in FIG. 1 , the first sensing electrode SE1 having an integral shape is shown as an example. Figure 3 Among the groups of the sensing part and the middle part of the first group described and the sensing part and the middle part of the second group, hereinafter, the group having an integral shape in the group will be described as a sensing pattern and a middle part, and the group not having an integral shape in the group will be described as a sensing pattern and a bridge.

[0096] In such Figure 4A In the embodiment shown in , the second sensing electrode SE2 may include a plurality of second sensing patterns SP2 and a bridge BP2 disposed between adjacent second sensing patterns SP2 to electrically connect the adjacent second sensing patterns SP2. One of the two adjacent sensing patterns may be defined as a second first sensing pattern SP2-1, and the other may be defined as a second second sensing pattern SP2-2. The second first sensing pattern SP2-1 and the second second sensing pattern SP2-2 are disposed to be spaced apart from each other in the second direction DR2.

[0097] The first sensing electrode SE1 may include a plurality of first sensing patterns SP1 and a middle portion BP1 disposed between adjacent first sensing patterns SP1 to electrically connect adjacent first sensing patterns SP1 (e.g., in the first direction DR1). One of two adjacent first sensing patterns SP1 may be defined as a first first sensing pattern SP1-1, and the other may be defined as a first second sensing pattern SP1-2. The middle portion BP1 is disposed between the first first sensing pattern SP1-1 and the first second sensing pattern SP1-2 in the first direction DR1. In the example shown in FIG. Figure 4A In the embodiment shown in , since the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the middle portion BP1 have an integral shape, their boundaries are not distinguished. According to an embodiment, a portion of the first sensing electrode SE1 disposed between the second first sensing pattern SP2-1 and the second second sensing pattern SP2-2 in the second direction DR2 may be defined as the middle portion BP1. Figure 4A , the boundary lines between the middle portion BP1 and the first and second sensing patterns SP1 - 1 and SP1 - 2 are indicated by dotted lines.

[0098] Figure 4ATwo bridges BP2 are shown. However, the number of bridges BP2 in the unit area UA is not necessarily limited thereto, and three or more bridges BP2 may be included in the unit area UA. In an embodiment, the bridge BP2 may include a first bridge pattern B1, a second bridge pattern B2, and a third bridge pattern B3. Each of the first bridge pattern B1, the second bridge pattern B2, and the third bridge pattern B3 may be a conductive pattern. In an embodiment, the first bridge pattern B1 may be disposed at a layer different from that of the second bridge pattern B2 and the third bridge pattern B3. For example, in an embodiment, the first bridge pattern B1 may be disposed at the same layer as that of the second sensing pattern SP2. The first bridge pattern B1 is disposed at the inner side of the opening BP1-OP defined in the middle portion BP1.

[0099] However, the embodiments of the present disclosure are not necessarily limited thereto, and the configuration of the bridge BP2 may vary. For example, in the embodiments of the present disclosure, the bridge BP2 may include only one of the second bridge pattern B2 and the third bridge pattern B3. One bridge pattern may be disposed at a layer different from that of the second first sensing pattern SP2-1 and the second second sensing pattern SP2-2, and the bridge pattern may be directly connected to the second first sensing pattern SP2-1 and the second second sensing pattern SP2-2.

[0100] The dummy electrode DE may be disposed between the second first sensing pattern SP2-1 and the first first sensing pattern SP1-1, between the second first sensing pattern SP2-1 and the first second sensing pattern SP1-2, between the second second sensing pattern SP2-2 and the first first sensing pattern SP1-1, and between the second second sensing pattern SP2-2 and the first second sensing pattern SP1-2, respectively. The dummy electrode DE may be an electrically isolated floating pattern. However, the embodiments of the present disclosure are not necessarily limited thereto, and the dummy electrode DE may be omitted in some embodiments.

[0101] Figure 4A The boundaries of the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the dummy electrode DE are shown only by boundary lines, and the boundaries are not shown in detail. However, the boundary lines simply indicate that two adjacent structures among the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the dummy electrode DE are set to be spaced apart from each other.

[0102] like Figure 4BAs shown in , in an embodiment, the second bridge pattern B2 and the third bridge pattern B3 are disposed on the package substrate 210 -U (eg, directly disposed on the package substrate 210 -U). In an embodiment, the second bridge pattern B2 and the third bridge pattern B3 may include a low resistance metal.

[0103] At least one insulating layer is disposed on the upper surface of the package substrate 210-U. In an embodiment, the first insulating layer 221 may cover the second bridge pattern B2 and the third bridge pattern B3. In an embodiment, the second first sensing pattern SP2-1 and the second second sensing pattern SP2-2 are disposed on the first insulating layer 221 (e.g., directly above the first insulating layer 221). The middle portion BP1 is disposed between the second first sensing pattern SP2-1 and the second second sensing pattern SP2-2 (e.g., in the second direction DR2). The first bridge pattern B1 is disposed in the opening BP1-OP of the middle portion BP1.

[0104] The second first sensing pattern SP2-1 and the first bridge pattern B1 directly contact the second bridge pattern B2 through the contact hole 221-TH passing through the first insulating layer 221. The first bridge pattern B1 and the second second sensing pattern SP2-2 directly contact the third bridge pattern B3 through the contact hole 221-TH passing through the first insulating layer 221.

[0105] In an embodiment, Figure 4A and Figure 4BThe second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the first bridge pattern B1 may be formed by the same photolithography process and may include the same material as each other. For example, in an embodiment, the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the first bridge pattern B1 may include a transparent conductive oxide (TCO). In an embodiment, the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the first bridge pattern B1 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In an embodiment, the thickness (e.g., the length in the third direction DR3) of the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2, and the first bridge pattern B1 may be in the range of about 700 angstroms to about 100 angstroms. Since the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, and the first second sensing pattern SP1-2 include transparent conductive oxide, even if Figure 3 The sensing electrodes SE1 and SE2 are connected to Figure 1D The corresponding light emitting elements OLED among the light emitting elements OLED shown in the figure are stacked, which can also prevent the degradation of the light emitting brightness. In the embodiment of the present disclosure, the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the first first sensing pattern SP1-1, the first second sensing pattern SP1-2 and the first bridge pattern B1 may include PEDOT, metal nanowires or graphene.

[0106] like Figure 4B As shown in, in an embodiment, the second insulating layer 222 is disposed on the first insulating layer 221. The second insulating layer 222 may cover the second first sensing pattern SP2-1, the second second sensing pattern SP2-2, the middle portion BP1, and the first bridge pattern B1. The first insulating layer 221 and the second insulating layer 222 may include an inorganic material or an organic material. In an embodiment, the first insulating layer 221 and the second insulating layer 222 may include silicon oxide, silicon nitride, or silicon oxynitride. In an embodiment, the first insulating layer 221 and the second insulating layer 222 may be a silicon oxide layer having a thickness in the range of 2500 angstroms to 3500 angstroms. In an embodiment, an organic layer may also be disposed between the upper surface of the encapsulation substrate 210-U and the second bridge pattern B2 and the third bridge pattern B3.

[0107] Figure 5is a cross-sectional view of a display module 200 according to an embodiment of the present disclosure. Figure 5 Shows the corresponding Figure 3 Section along line IV-IV'.

[0108] Reference Figure 3 and Figure 5 , the display module 200 may include a display panel 210 and an input sensor 220, and the display panel 210 includes a display substrate 210-B, an encapsulation substrate 210-U, and a sealing member SM combining the display substrate 210-B and the encapsulation substrate 210-U with each other.

[0109] In an embodiment, the display substrate 210-B includes a base substrate 210-G, a circuit element layer 210-CL disposed on the base substrate 210-G (e.g., directly disposed on the base substrate 210-G), and a display element layer 210-OLED disposed on the circuit element layer 210-CL (e.g., directly disposed on the circuit element layer 210-CL). The active area AA of the display panel 210 may correspond to an area in which the display element layer 210-OLED is disposed, and the peripheral area NAA may correspond to an area that does not overlap the display element layer 210-OLED (e.g., in the third direction DR3). In an embodiment, the active area AA of the display panel 210 may correspond to the sensing area AA0 of the input sensor 220, and the peripheral area NAA of the display panel 210 may correspond to the non-sensing area NAA0. In an embodiment, a specific gap GP may be defined between the display substrate 210-B and the encapsulation substrate 210-U (e.g., in the third direction DR3).

[0110] In the display module 200 of the embodiment, one side of the sealing member SM may define surfaces that are aligned with the base substrate 210-G and the encapsulation substrate 210-U, respectively. For example, one side of the sealing member SM, one side of the base substrate 210-G, and one side of the encapsulation substrate 210-U may define an alignment surface extending in the third direction DR3. One side of the encapsulation substrate 210-U does not protrude from one side of the sealing member SM. However, the embodiments of the present disclosure are not necessarily limited thereto, and in the embodiments, the encapsulation substrate 210-U may include an extension protruding from one side of the sealing member SM.

[0111] The input sensor 220 may include a sensing pattern SP, a plurality of signal lines SL, a ground line GND, and an additional electrode AP.

[0112] The sensing pattern SP may be included in Figure 3 Any one of the sensing patterns SP1 and SP2 in the sensing electrodes SE1 and SE2 described in the embodiment. In an embodiment, the sensing pattern SP may include a transparent conductive oxide. The sensing pattern SP may be disposed in the active area AA.

[0113] A plurality of signal lines SL and a ground line GND are arranged in the peripheral area NAA. Each of the signal lines SL may be electrically connected to a corresponding sensing pattern SP. In an embodiment, the peripheral area NAA may include a wiring area SGA in which the signal lines SL and the ground lines GND are arranged and a sealing area SLA overlapping with the sealing member SM (for example, in the third direction DR3). The plurality of signal lines SL and the ground line GND overlap with the wiring area SGA (for example, in the third direction DR3) and may not overlap with the sealing area SLA (for example, in the third direction DR3).

[0114] like Figure 5 As shown in , in an embodiment, the ground line GND may be disposed at the outermost side of the wiring area SGA. For example, compared with the signal line SL, the ground line GND may be disposed at the outer edge (e.g., the periphery) of the wiring area SGA. The ground line GND may be spaced apart from the active area AA and the signal line SL is placed between the ground line GND and the active area AA.

[0115] The input sensor 220 includes an additional electrode AP, and the additional electrode AP overlaps the sealing member SM (eg, in the third direction DR3 ). The additional electrode AP may be disposed in the sealing area SLA and may be electrically connected to the ground line GND.

[0116] The input sensor 220 may include at least one insulating layer. For example, in an embodiment, the input sensor 220 may include a first insulating layer 221 disposed on the package substrate 210 -U (eg, directly disposed on the package substrate 210 -U) and a second insulating layer 222 disposed on the first insulating layer 221 .

[0117] In an embodiment, the sensing pattern SP and the additional electrode AP may be disposed at the same layer as each other. In an embodiment, the sensing pattern SP and the additional electrode AP may include the same material and may be formed by the same process. In an embodiment, the sensing pattern SP and the additional electrode AP may be disposed on the first insulating layer 221 (e.g., directly above the first insulating layer 221), and may be covered by the second insulating layer 222. In an embodiment, the sensing pattern SP and the additional electrode AP may include a transparent conductive oxide.

[0118] In an embodiment, the signal line SL and the ground line GND may be disposed at the same layer as each other. In an embodiment, the signal line SL and the ground line GND may include the same material and may be formed by the same process. The signal line SL and the ground line GND may be disposed on the package substrate 210-U (e.g., directly on the package substrate 210-U) and may be covered by the first insulating layer 221. For example, the signal line SL and the ground line GND may be disposed under the first insulating layer 221. The signal line SL and the ground line GND may include a low resistance metal.

[0119] In an embodiment, the sensing pattern SP may be connected to a corresponding one of the signal lines SL (e.g., directly connected to a corresponding one of the signal lines SL) through a contact hole passing through the first insulating layer 221. In an embodiment, the additional electrode AP may be connected to the ground line GND (e.g., directly physically and electrically connected to the ground line GND) through a contact hole passing through the first insulating layer 221. The additional electrode AP may be connected to the ground line GND and may receive a ground voltage. The additional electrode AP may not overlap the signal line SL on a plane (e.g., in the third direction DR3).

[0120] In an embodiment, the first insulating layer 221 and the second insulating layer 222 included in the input sensor 220 may not overlap the wiring area SGA and the sealing area SLA. In an embodiment in which the first insulating layer 221 and the second insulating layer 222 do not overlap the wiring area SGA and the sealing area SLA, a portion of the sensing pattern SP may be disposed on and connected to a corresponding one of the signal lines SL without a separate contact hole. When the insulating layers 221 and 222 do not overlap the wiring area SGA and the sealing area SLA, a portion of the additional electrode AP may be disposed on and connected to the ground line GND (e.g., directly electrically and physically connected to the ground line GND) without a separate contact hole.

[0121] The input sensor according to the embodiment may include a ground line for reducing electromagnetic interference generated in the signal line and the sensing electrode, and the area of ​​the conductive pattern to which the ground voltage is applied may be increased by an additional electrode connected to the ground line to reduce scattering of capacitance between the signal line and the sensing electrode, thereby improving the electromagnetic interference reduction effect. In an embodiment in which the additional electrode includes a light-transmitting material (such as a transparent conductive oxide), even if the additional electrode is disposed to overlap with the sealing member, the process of curing the sealing member by a laser beam is not hindered, thereby improving the process performance of the display device including the input sensor.

[0122] In more detail, the electromagnetic interference of the sensing electrode included in the input sensor and the signal line connected thereto can be removed by the phase of the sensing electrode and the signal line through the electromagnetic interference elimination driving, and when the difference between the capacitances of adjacent sensing electrodes and signal lines is large, the electromagnetic interference elimination driving may not be smoothly performed. However, since the input sensor according to the embodiment can increase the area of ​​the conductive pattern to which the ground voltage is applied by an additional electrode connected to the ground line, the difference between the capacitances of adjacent sensing electrodes and signal lines can be reduced, thereby smoothly performing the electromagnetic interference elimination driving. Therefore, the electromagnetic interference reduction effect of the input sensor can be improved, and the sensing performance of the input sensor and the display device including the input sensor can be improved.

[0123] Fig. 6A is a graph depicting capacitances of an antenna and sensing patterns of corresponding channels of an input sensor according to an embodiment of the present disclosure and an input sensor of a comparative example. Figure 6B is a graph depicting the intensity of electromagnetic interference with respect to frequency of an input sensor according to an embodiment of the present disclosure and an input sensor of a comparative example.

[0124] exist Fig. 6A In the present invention, a "channel" refers to a sensing electrode and a signal line connected to it. Fig. 6A The simulation results obtained by measuring the capacitance difference between the antenna for measuring EMI and the channels in the input sensors of the embodiment of the present disclosure and the comparative example are shown, and among the total 27 channels, channel No. 1 corresponds to the channel closest to the ground surface, and channel No. 27 corresponds to the channel farthest from the ground surface. The input sensor of the embodiment of the present disclosure is composed of the above Figure 3 and Figure 5 The input sensor of the comparative example is an input sensor in which the additional electrode is excluded from the input sensor of the embodiment. Figure 6B Simulation results obtained by measuring electromagnetic interference intensity with respect to frequency in input sensors of the embodiment of the present disclosure and comparative examples during mutual driving are shown.

[0125] Reference Fig. 6A and Figure 6B As a result, the electromagnetic interference intensity with respect to the frequency of the input sensor of the embodiment is lower than that of the input sensor of the comparative example, and it can be confirmed that the electromagnetic interference intensity decreases at the frequency having a peak point having the highest electromagnetic interference intensity. In addition, it can be confirmed that in the input sensor of the comparative example, the capacitance difference between channels No. 25 to No. 27 away from the ground surface is large, but compared with the input sensor of the comparative example, in the input sensor of the embodiment, the deviation of the capacitance difference between channels No. 25 to No. 27 separated from the ground surface is reduced. Fig. 6A and Figure 6B The simulation results can confirm that the input sensor of the embodiment increases the area of ​​the conductive pattern to which the ground voltage is applied by the additional electrode connected to the ground line, and thus reduces the capacitance difference between channels that are far away from the ground surface, and thus smoothly performs electromagnetic interference elimination drive between adjacent channels, thereby reducing the electromagnetic interference intensity.

[0126] Figures 7 to 9 2 are cross-sectional views of display modules 200 - 1 , 200 - 2 , and 200 - 3 according to embodiments of the present disclosure, respectively. Fig.10 is a cross-sectional view of a display device EA-1 according to an embodiment of the present disclosure. Figures 7 to 9 Shown with Figure 5 The display module 200 of the embodiment shown in FIG. 2 is a display module 200 - 1 , 200 - 2 , and 200 - 3 of different embodiments. Fig.10 Shown include Figure 5 The display module 200 of the embodiment shown in FIG.

[0127] Reference Figure 7 In the display panel 210-1 included in the display module 200-1 of the embodiment, each of the encapsulation substrate 210-U and the base substrate 210-G may include a portion protruding from the one side SM-S of the sealing member SM. In the embodiment, the encapsulation substrate 210-U included in the display module 200-1 may include an extension portion EP protruding from the one side SM-S of the sealing member SM.

[0128] exist Figure 7 In the display module 200-1 of the embodiment shown in , the input sensor 220-1 may further include a low resistance pattern LRP disposed on the extension portion EP. For example, in an embodiment, the low resistance pattern LRP may be directly disposed on the extension portion EP of the package substrate 210-U.

[0129] In an embodiment, the low resistance pattern LRP may be disposed at the same layer as the signal line SL and the ground line GND. In an embodiment, the low resistance pattern LRP may include the same material as the signal line SL and the ground line GND, and the low resistance pattern LRP, the signal line SL, and the ground line GND may be formed by the same process. The low resistance pattern LRP may be disposed on the package substrate 210-U together with the signal line SL and the ground line GND (e.g., directly disposed on the package substrate 210-U), and may be covered by the first insulating layer 221. The low resistance pattern LRP may include a low resistance metal.

[0130] In an embodiment, the low resistance pattern LRP may be connected to the additional electrode AP (eg, directly connected to the additional electrode AP). Figure 7 As shown in , in an embodiment, the low resistance pattern LRP may be connected to the additional electrode AP (e.g., directly physically and electrically connected to the additional electrode AP) through a contact hole passing through the first insulating layer 221. The low resistance pattern LRP may be connected to the additional electrode AP to which a ground voltage is applied, and may receive the ground voltage. The input sensor 220-1 of the embodiment may further include the low resistance pattern LRP, and the area of ​​the conductive pattern to which a ground voltage is applied may be further increased.

[0131] Reference Figure 8 ,and Figure 5 Unlike the illustration of FIG. 2 , in the input sensor 220-2 included in the display module 200-2 of the embodiment, the sensing pattern SP and the additional electrode AP may be disposed on the lower side (eg, the lower layer), and the plurality of signal lines SL and the ground line GND may be disposed on the upper side (eg, the upper layer). Figure 8 In the embodiment shown in , the sensing pattern SP and the additional electrode AP may be disposed under the first insulating layer 221 , and the plurality of signal lines SL and the ground line GND may be disposed over the first insulating layer 221 .

[0132] exist Figure 8 In the input sensor 220-2 of the embodiment shown in , the sensing pattern SP and the additional electrode AP may be disposed at the same layer as each other. In an embodiment, the sensing pattern SP and the additional electrode AP may include the same material as each other and may be formed by the same process. The sensing pattern SP and the additional electrode AP may be disposed on the package substrate 210-U (e.g., directly disposed on the package substrate 210-U) and may be covered by the first insulating layer 221. In an embodiment, the sensing pattern SP and the additional electrode AP may include a transparent conductive oxide.

[0133] In an embodiment, the signal line SL and the ground line GND may be disposed at the same layer as each other. In an embodiment, the signal line SL and the ground line GND may include the same material as each other and may be formed by the same process. The signal line SL and the ground line GND may be disposed on the first insulating layer 221 and may be covered by the second insulating layer 222. For example, the signal line SL and the ground line GND may be directly disposed on the upper surface of the first insulating layer 221. In an embodiment, the signal line SL and the ground line GND may include a low resistance metal.

[0134] Any corresponding one of the signal lines SL may be connected to the sensing pattern SP through a contact hole passing through the first insulating layer 221. The ground line GND may be connected to (e.g., directly physically and electrically connected to) the additional electrode AP through a contact hole passing through the first insulating layer 221. The additional electrode AP may be connected to the ground line GND and may receive a ground voltage.

[0135] Reference Fig. 9 ,and Figure 5 Unlike the illustration of FIG. 2 , in the input sensor 220-3 included in the display module 200-3 of the embodiment, the ground line GND is not disposed at the outermost side of the wiring area SGA, and at least one of the plurality of signal lines SL may be disposed at the outer side (eg, periphery) of the wiring area SGA compared to the ground line GND. Fig. 9 As shown in FIG. 1 , the plurality of signal lines SL may include an outer signal line SL- 1 disposed outside the wiring area SGA compared to the ground line GND. The outer signal line SL- 1 may be spaced apart from the active area AA with the ground line GND interposed therebetween. Fig. 9 It is shown that one outer signal line SL- 1 is provided as an example. However, the embodiments of the present disclosure are not necessarily limited thereto, and two or more outer signal lines SL- 1 may be provided in some embodiments.

[0136] In an embodiment, the additional electrode AP may be connected to the ground line GND through a contact hole passing through the first insulating layer 221. The additional electrode AP may be connected to the ground line GND (eg, directly physically and electrically connected to the ground line GND) and may receive a ground voltage.

[0137] The outer signal line SL-1 is insulated from the additional electrode AP. The outer signal line SL-1 overlaps with the additional electrode AP in a plane (for example, in the third direction DR3), but may be insulated from the additional electrode AP by an insulating pattern IL-P disposed on the outer signal line SL-1 (such as an upper portion of the outer signal line SL-1) and extending between the outer signal line SL-1 and the additional electrode AP (for example, in the third direction DR3). Fig. 9 As shown in FIG, the insulating pattern IL-P may be a part of the first insulating layer 221. However, the embodiments of the present disclosure are not necessarily limited thereto, and in some embodiments, the insulating pattern IL-P may be a pattern provided separately from the first insulating layer 221 to cover the outer signal line SL-1.

[0138] Reference Fig.10, the display device EA-1 of the embodiment may include a window 100, and the window 100 may include a base substrate WIN and a light shielding pattern BZP disposed under the base substrate WIN (for example, directly under the base substrate WIN). The light shielding pattern BZP may define a frame area BZA and may include a colored light shielding material to shield light. The light shielding pattern BZP may prevent the peripheral area NAA of the display module 200 from being viewed from the outside while covering the peripheral area NAA.

[0139] The window 100 may further include a conductive electrode CDP disposed under the base substrate WIN (e.g., directly under the base substrate WIN). The lower portion of the conductive electrode CDP may be covered by the ink layer INK. The conductive electrode CDP may overlap with the border area BZA. In an embodiment, the conductive electrode CDP may completely overlap with the additional electrode AP on a plane (e.g., in the third direction DR3). In an embodiment, the conductive electrode CDP may be arranged to extend (e.g., extend to) the outside of the sealing area SLA in which the additional electrode AP is arranged.

[0140] In an embodiment, the conductive electrode CDP may include a metal material with high conductivity. In the display device EA-1 of the embodiment, since the window 100 includes the conductive electrode CDP, a large capacitance may be formed between the conductive electrode CDP and the additional electrode AP, and thus a potential corresponding to the ground voltage may also be formed in the conductive electrode CDP. Therefore, the display device EA-1 of the embodiment may further increase the area of ​​the conductive pattern to which the ground voltage is applied. In an embodiment, the conductive electrode CDP may be directly connected to the additional electrode AP (e.g., electrically connected to the additional electrode AP) through wiring to receive the ground voltage.

[0141] FIG. 11A to FIG. 11C is a plan view of input sensors 220 - a , 220 - b , and 220 - c according to an embodiment of the present disclosure. Fig.12 is a plan view of an input sensor 220 - d according to an embodiment of the present disclosure. FIG. 11A to FIG. 11C and Fig.12 Shown with Figure 3 The input sensor 220 of the embodiment shown in FIG. 2 is an input sensor 220 - a , 220 - b , 220 - c , and 220 - d of different embodiments.

[0142] Reference Fig.11A, the input sensor 220-a of the embodiment may include two relatively long sides S1-1 and S1-2 extending along the second direction DR2 and spaced apart from each other along the first direction DR1, and two relatively short sides S2-1 and S2-2 extending along the first direction DR1 and spaced apart from each other along the second direction DR2. The input sensor 220-a may include a first long side S1-1 and a second long side S1-2. The input sensor 220-a may include a first short side S2-1 and a second short side S2-2.

[0143] In the input sensor 220-a, the additional electrode AP-1 may be disposed on at least one side of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2. Fig.11A As shown in , the additional electrode AP-1 may be disposed only at a portion of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2. Fig.11A As shown in , the additional electrode AP-1 may be disposed at the first long side S1-1 (for example, disposed at the entire first long side S1-1), and may not be disposed at the second long side S1-2. The additional electrode AP-1 may be disposed at a portion of the first short side S2-1, and may be disposed at the second short side S2-2 (for example, disposed at the entire second short side S2-2). However, the embodiments of the present disclosure are not necessarily limited to this. For example, in an embodiment, as Figure 3 The additional electrode AP shown in FIG. 1 may be disposed at all of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2, may be patterned and disposed only at a portion of each of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2, and the like.

[0144] Reference Fig. 11B In the input sensor 220-b of the embodiment, the additional electrode AP-2 may be disposed on at least one side of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2, and a plurality of additional electrodes AP-2 may be disposed on one side of the two long sides S1-1 and S1-2 and the two short sides S2-1 and S2-2. Fig. 11B As shown in , the additional electrode AP-2 disposed at the second short side S2-2 may include a plurality of unit additional electrodes AP-U1 and AP-U2. Among the additional electrodes AP-2 disposed at the second short side S2-2, the first unit additional electrode AP-U1 and the second unit additional electrode AP-U2 may be spaced apart from each other in the first direction DR1. Fig. 11BIt is exemplarily shown that the additional electrode AP-2 disposed at the second short side S2-2 includes two unit additional electrodes AP-U1 and AP-U2. However, the embodiments of the present disclosure are not necessarily limited thereto, and the additional electrode AP-2 disposed at one side of the input sensor 220-b may include three or more unit additional electrodes.

[0145] In an embodiment, an opening OPP may be defined in the additional electrode AP-2 included in the input sensor 220-b of the embodiment. Due to the opening OPP, cracks may be prevented from being generated in the additional electrode AP-2. In addition, due to the opening OPP, loop current may be prevented from being generated in the additional electrode AP-2.

[0146] Reference Fig. 11C , the input sensor 220-c of the embodiment may further include a dummy pattern DMP. In the input sensor 220-c of the embodiment, the additional electrode AP-3 may not only overlap the ground line GND (for example, in the third direction DR3), but may also be additionally extended to overlap at least a portion of the dummy pattern DMP (for example, in the third direction DR3). In the embodiment, the additional electrode AP-3 may be electrically connected to at least some of the dummy patterns DMP. For example, in the embodiment, the additional electrode AP-3 may be formed by passing through the first insulating layer 221 (see Figure 5 ) is connected to at least some of the dummy patterns DMP (e.g., directly physically and electrically connected to at least some of the dummy patterns DMP). The input sensor 220-c of the embodiment can further increase the area of ​​the conductive pattern to which the ground voltage is applied through a structure in which the additional electrode AP-3 is also connected to the dummy pattern DMP.

[0147] Reference Fig.12 In the input sensor 220-d, the ground line GND-1 overlaps with the additional electrode AP on a plane (eg, in the third direction DR3) and is electrically connected to the additional electrode AP. Figure 3 Unlike the illustration shown in FIG. 1 , the ground line GND-1 may have a width (eg, a length in the first direction DR1 and / or the second direction DR2) greater than that of the plurality of signal lines SL. Fig.12 As shown in the figure, the ground line GND-1 can be set to extend into Figure 3The input sensor 220 is provided with a region of the dummy pattern DMP. In an embodiment, the ground line GND-1 may overlap with the plurality of signal lines SL in the extension direction of the signal line SL. For example, the ground line GND-1 may overlap with the plurality of 2nd-2nd signal lines SL2-2 among the 2nd-2nd signal lines SL2-2 in the first direction DR1 which is the extension direction of the 2nd-2nd signal line SL2-2. The ground line GND-1 may overlap with the plurality of 1st-1st signal lines SL1-1 among the 1st-1st signal lines SL1-1 in the second direction DR2 which is the extension direction of the 1st-1st signal line SL1-1.

[0148] According to the embodiment, in an input sensor included in a display device, scattering of capacitance between a signal line and a sensing electrode can be reduced, thereby improving an electromagnetic interference reduction effect, and thus improving sensing performance of the input sensor and the display device including the input sensor.

[0149] Furthermore, a process of curing the sealing member by a laser beam may be performed, and thus the process performance of the display device may be increased.

[0150] Although the present disclosure has been described with reference to non-limiting embodiments, those skilled in the art to which the present disclosure pertains will appreciate that modifications and variations may be made to the present disclosure within the scope of the appended claims without departing from the spirit and technical field of the present disclosure.

Claims

1. A display device, comprising: A display panel comprising an active area and a peripheral area adjacent to the active area; as well as an input sensor, disposed on the display panel, the input sensor comprising a sensing area corresponding to the effective area and a non-sensing area corresponding to the peripheral area, Wherein, the input sensor comprises: A plurality of sensing patterns are arranged in the sensing area; a plurality of signal lines, respectively connected to the plurality of sensing patterns, the plurality of signal lines being arranged in the non-sensing area; a ground line, disposed in the non-sensing area, the ground line receiving a ground voltage; and an additional electrode disposed in the non-sensing area, the additional electrode being electrically connected to the ground line, wherein the display panel includes a sealing member disposed in the peripheral area, and The additional electrode overlaps with at least a portion of the sealing member in a plane.

2. The display device according to claim 1, wherein: The ground line is spaced apart from the sensing region and the plurality of signal lines are placed between the ground line and the sensing region.

3. The display device according to claim 1, wherein: The display panel comprises: A display substrate including a light emitting element; and an encapsulation substrate disposed on the display substrate, the sealing member bonding the display substrate to the encapsulation substrate, and Wherein, the input sensor is directly arranged on the packaging substrate.

4. The display device according to claim 3, wherein: One end of the sealing member is aligned with one end of the package substrate.

5. The display device according to claim 3, wherein: The package substrate includes an extension portion extending from one end of the sealing member, and Wherein, the input sensor further includes: a low resistance pattern directly disposed on the extension portion.

6. The display device according to claim 1, wherein: The additional electrode includes the same material as the plurality of sensing patterns.

7. The display device according to claim 1, wherein: The additional electrode and each of the plurality of sensing patterns include a transparent conductive oxide.

8. The display device according to claim 1, wherein: The ground line includes a same material as the plurality of signal lines.

9. The display device according to claim 1, wherein: The plurality of signal lines include an outer signal line that is spaced apart from the sensing region and the ground line is disposed between the outer signal line and the sensing region, and Wherein, the input sensor further includes: an insulating pattern covering the upper portion of the outer signal line.

10. The display device according to claim 1, wherein: The input sensor comprises: A first insulating layer, disposed on the display panel; and The second insulating layer is arranged on the first insulating layer.

11. The display device according to claim 10, wherein: The plurality of signal lines and the ground line are disposed under the first insulating layer; and The plurality of sensing patterns and the additional electrode are disposed over the first insulating layer.

12. The display device according to claim 10, wherein: The plurality of sensing patterns and the additional electrode are disposed under the first insulating layer; and The plurality of signal lines and the ground line are disposed above the first insulating layer.

13. The display device according to claim 1, further comprising: a window disposed on the input sensor, The window comprises: a base substrate, comprising an optically transparent transmission area and a frame area adjacent to the transmission area; and a conductive electrode, overlapping the frame area, and the conductive electrode is arranged under the base substrate.

14. The display device according to claim 1, wherein: The input sensor also includes: A dummy pattern is disposed in the non-sensing area, the dummy pattern and the plurality of signal lines are disposed in the same layer, wherein the dummy pattern is spaced apart from the plurality of signal lines on a plane.

15. The display device according to claim 14, wherein: The additional electrode is electrically connected to at least a portion of the dummy pattern.

16. The display device according to claim 1, wherein: At least a portion of the ground line has a width greater than a width of each of the plurality of signal lines.

17. The display device according to claim 1, wherein: The input sensor comprises: two short sides and two long sides, the two short sides extending along a first direction and spaced apart from each other along a second direction intersecting the first direction, the two long sides extending along the second direction and spaced apart from each other along the first direction, and Wherein, the additional electrode is arranged on at least one side of the two short sides and the two long sides.

18. The display device according to claim 1, wherein: The ground line and each of the plurality of signal lines do not overlap the sealing member in a plane.

19. A display device, comprising: A display panel comprising an active area and a peripheral area adjacent to the active area; as well as an input sensor, disposed on the display panel, the input sensor comprising a sensing area corresponding to the effective area and a non-sensing area corresponding to the peripheral area, Wherein, the input sensor comprises: A plurality of signal lines are arranged in the non-sensing area; a ground line, disposed in the non-sensing area; and an additional electrode disposed in the non-sensing area, the additional electrode being electrically connected to the ground line, wherein the display panel includes a sealing member disposed in the peripheral area, wherein the additional electrode overlaps the sealing member on a plane, and The plurality of signal lines and the ground line do not overlap with the sealing member in a plane.

20. A display device, comprising: A display panel comprising an active area and a peripheral area adjacent to the active area; as well as an input sensor, disposed on the display panel, the input sensor comprising a sensing area corresponding to the effective area and a non-sensing area corresponding to the peripheral area, Wherein, the input sensor comprises: a plurality of sensing patterns disposed in the sensing region, the plurality of sensing patterns comprising a transparent conductive oxide; a plurality of signal lines, respectively connected to the plurality of sensing patterns, the plurality of signal lines being disposed in the non-sensing area and comprising a low-resistance metal; a grounding line disposed in the non-sensing area, the grounding line comprising a low-resistance metal; and an additional electrode disposed in the non-sensing region, the additional electrode being electrically connected to the ground line, the additional electrode comprising a transparent conductive oxide, and Wherein, the additional electrode is electrically insulated from the plurality of signal lines.

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