Display panel, display module and electronic equipment

Abstract

The invention provides a display panel, a display module and electronic equipment. The display panel comprises a display area, an isolation area and a hole opening area, wherein the isolation area is connected between the display area and the hole opening area. The isolation region comprises a first substrate, an insulation isolation column and a cathode, the cathode comprises a first part and a second part, the first part of the cathode is arranged on the first substrate, the second part of the cathode is arranged on the side, away from the first substrate, of the insulation isolation column, and the insulation isolation column is used for isolating the first part of the cathode and the second part of the cathode. The insulation isolation column comprises a first metal part and an insulation part, the first metal part is arranged on the first substrate, the insulation part is arranged between the second part of the cathode and the first metal part, the insulation part comprises an inorganic layer, the inorganic layer adopts an inorganic insulation material, and the inorganic layer is arranged between the second part of the cathode and the first metal part. In this way, the inorganic layer made of the inorganic insulating material does not shrink after being heated, and the second part of the cathode is prevented from being electrically connected with the first metal part.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display module and an electronic device. Background Art

[0002] An isolation area is provided between the display area and the through hole of the OLED display panel. An insulating isolation column is provided in the isolation area. The insulating isolation column includes a metal part and an insulating part. The metal part is used to disconnect the cathode of the packaging area to prevent the cathode from forming a water vapor penetration channel. The insulating part is used to insulate the cathode and the metal part of the metal material, thereby preventing the disconnected cathode from being connected in series through the metal part, causing the packaging area to be charged. Since the traditional insulating part uses an organic insulating material, the organic insulating material shrinks due to the baking process and the tolerance caused by the alignment precision process during the preparation of the display panel, resulting in the horizontal size of the insulating part being smaller than the metal part. The insulating part cannot completely isolate the cathode and the metal part, and the cathode can still be connected to the metal part. The disconnected cathode is connected in series through the metal part again, causing the isolation area to be charged and electrochemical corrosion occurs, and the packaging of the isolation area fails, resulting in water vapor and oxygen invading the display area, the light-emitting layer of the display area is corroded, and cannot emit light normally, and "black spots" appear in the display area 1 ("black spots" are the parts where the display area 1 cannot emit light normally). Summary of the invention

[0003] The present application provides a display panel, a display module and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a display panel. The display panel includes a display area, an isolation area, and an opening area, wherein the isolation area is connected between the display area and the opening area. The isolation area includes a first substrate, an insulating isolation column, and a cathode, wherein the cathode includes a first part and a second part, wherein the first part of the cathode is disposed on the first substrate, and the second part of the cathode is disposed on a side of the insulating isolation column away from the first substrate, and the insulating isolation column is used to separate the first part of the cathode from the second part of the cathode. The insulating isolation column includes a first metal portion and an insulating portion, wherein the first metal portion and the insulating portion are used to separate the first part of the cathode from the second part of the cathode, wherein the first metal portion is disposed on the first substrate, and the insulating portion is disposed between the second part of the cathode and the first metal portion, and the insulating portion includes an inorganic layer, wherein the inorganic layer uses an inorganic insulating material, and wherein the inorganic layer is disposed between the second part of the cathode and the first metal portion.

[0005] The insulating isolation column is used to separate the first part of the cathode from the second part of the cathode, which can prevent water vapor and oxygen at the through-hole position from entering the display area through the hole wall of the through-hole along the cathode of the isolation area, causing the light-emitting layer of the display area to be corroded and unable to emit light normally, that is, avoiding the appearance of "black spots" in the display area ("black spots" are parts of the display area that cannot emit light normally). The insulating part is arranged between the second part of the cathode and the first metal part. The insulating part can be used for insulation between the second part of the cathode and the metal part, which can prevent the first part and the second part of the cathode from being connected in series through the first metal part, and prevent the current of the cathode of the display area from being conducted to the cathode of the isolation area, so that the isolation area is charged and electrochemical corrosion occurs, resulting in packaging failure of the isolation area. The insulating part can be used to prevent the isolation area from being charged and causing packaging failure, and water vapor and oxygen at the through-hole position from entering the display area through the location of the packaging failure.

[0006] The inorganic layer of the insulating part adopts an inorganic insulating material, and the inorganic layer is arranged between the second part of the cathode and the first metal part. Compared with the insulating part adopting an organic insulating material, the inorganic layer adopting the inorganic insulating material can achieve insulation between the second part of the cathode and the first metal part. In the process of manufacturing the display panel, the inorganic layer adopting the inorganic insulating material will not have the problem of heat shrinkage. The inorganic layer can better cover the first metal part, avoid electrical connection between the second part of the cathode and the first metal part, and further avoid the first part and the second part of the cathode being connected in series through the first metal part, thereby reducing the risk of electrochemical corrosion in the isolation area, and the packaging effect of the isolation area is better.

[0007] In one possible implementation, the inorganic layer is disposed between the second portion of the cathode and the first metal portion, including:

[0008] The inorganic layer is disposed between the second portion of the cathode and the top surface of the first metal portion; and / or, the inorganic layer is disposed between the second portion of the cathode and the first side surface of the first metal portion, and the top surface of the first metal portion is connected to the first side surface of the first metal portion. The position of the inorganic layer disposed on the first metal portion can be adjusted according to the actual situation between the first metal portion and the second portion of the cathode.

[0009] In one possible implementation, the insulating part also includes an organic layer, the organic layer is connected to the inorganic layer, the organic layer uses an organic insulating material, the inorganic layer is arranged between the second part of the cathode and the top surface of the first metal part, and the organic layer is arranged between the second part of the cathode and the first side surface of the first metal part.

[0010] When the inorganic layer is formed by a thin film deposition process (such as chemical vapor deposition, CVD), the thin film deposition process is greatly affected by the surface morphology of the metal part. If there are burrs or other uneven structures on the first side of the first metal part and the first side of the second metal part, it is difficult for the inorganic layer to form a continuous layer structure. The burrs or other uneven structures on the first side of the first metal part and the first side of the second metal part can easily penetrate the inorganic layer and be exposed. By arranging an organic layer to cover the burrs or uneven positions on the first side of the first metal part and the first side of the second metal part, the insulation effect between the second part of the cathode and the first metal part and the second metal part is further ensured, thereby avoiding the first part and the second part of the cathode being connected in series through the first metal part and the second metal part.

[0011] In addition, the organic layer uses organic insulating materials, which can absorb water vapor. When water vapor enters the isolation area, the organic layer can absorb the water vapor and slow down the spread of the water vapor. The more the number of insulating isolation columns, the more conducive it is to slowing down the spread of water vapor.

[0012] In a possible implementation, the first metal part further includes a second side surface, the first side surface of the first metal part and the second side surface of the first metal part are arranged at intervals, and the top surface of the first metal part is connected between the first side surface of the first metal part and the second side surface of the first metal part. The first metal part is provided with a groove, the opening of the groove is located at the second side surface of the first metal part, and the first part of the cathode and the second part of the cathode are disconnected at the groove.

[0013] In this way, the insulating isolation column is provided with a groove, and in the process of forming the cathode of the isolation region, the cathode will be disconnected at the opening position of the groove to form a layered first part and a second part.

[0014] In a possible implementation, the insulating isolation column further includes a second metal portion, the first metal portion and the second metal portion are disposed on the first substrate at intervals, and the second metal portion is disposed on a side of the first metal portion close to the display area;

[0015] The inorganic layer is arranged between the second part of the cathode and the top surface of the first metal part and between the second part of the cathode and the top surface of the second metal part, and the organic layer is arranged between the second part of the cathode and the first side surface of the first metal part, between the second part of the cathode and the first side surface of the second metal part and between the second part of the cathode and the first substrate. The first metal part and the second metal part are made of metal material, and the strength of the insulating isolation column is better.

[0016] In a possible implementation, along a direction from the first substrate toward the insulating isolation column, a distance from a top surface of the organic layer to the first substrate is greater than a distance from a top surface of the first metal portion to the first substrate.

[0017] In this way, the height of the entire insulating isolation column is relatively high. When the flexible interlayer is formed by inkjet printing, the flexible interlayer has fluidity before solidification. The insulating isolation column can be used to block the uncured flexible interlayer to prevent the flexible interlayer before solidification from flowing to the isolation area and flowing out to the opening area through the isolation area. In other words, the insulating isolation column can be used to prevent overflow (that is, to block the flow of the uncured flexible interlayer). The packaging area can omit the setting of the isolation dam, and the use of insulating isolation columns to block the flexible interlayer can reduce the area ratio of the packaging area on the display panel, increase the panel ratio of the display area in the display panel, so that the display panel has more area for displaying images, and the user experience is better.

[0018] In one possible implementation, the second side of the first metal part, the organic layer and the second side of the second metal part are arranged at intervals from each other, and the organic layer is arranged between the second side of the first metal part and the second side of the second metal part along the direction from the opening area toward the display area.

[0019] In this way, the risk of the organic layer shifting toward the display area or the isolation area due to the positioning accuracy tolerance when forming the organic layer can be reduced, and the organic layer can be prevented from covering and filling the first groove or the second groove after shifting toward the display area or the isolation area, resulting in poor disconnection effect of the first metal part and the second metal part on the cathode.

[0020] In a possible implementation manner, the inorganic layer is made of silicon oxide or silicon nitride; and / or the organic layer is made of polyimide, polyamide, polyacrylamide or phenolic resin.

[0021] In a possible implementation, the inorganic layer and the gate insulating layer, the first interlayer insulating layer, the second interlayer insulating layer or the third interlayer insulating layer of the display region are arranged in the same layer, thus eliminating the need for additional processes and increasing production costs.

[0022] In a possible implementation, the insulating isolation column further includes an insulating protection layer, the insulating protection layer and the inorganic layer are arranged at intervals, and the insulating protection layer is arranged between the first part of the cathode and the first metal part.

[0023] In this way, the insulating isolation column is provided with a first insulating protective layer. When the cathode is disconnected at the first metal part, the first insulating protective layer can be used to insulate the first part of the cathode from the first metal part. The first insulating protective layer can reduce the risk of the first part of the cathode being electrically connected to the first metal part, and further reduce the risk of the first part and the second part of the cathode being connected in series via the first metal part.

[0024] In a possible implementation, the insulating isolation column further includes a padding layer, the padding layer is disposed between the first metal portion and the first substrate, and the inorganic layer is disposed on a side of the first metal portion away from the padding layer.

[0025] In this way, the insulating spacer is provided with a cushioning layer, so that in the process of forming the cathode, the insulating spacer is at a greater distance from the first substrate, the cathode is more easily broken at the side of the insulating spacer, and the insulating spacer has a better effect of isolating the cathode. In addition, by providing the cushioning layer, the height of the insulating spacer can be increased in the thickness direction of the first substrate, which is conducive to improving the anti-overflow effect of the insulating spacer.

[0026] In a possible implementation, the isolation region further includes a metal isolation column, which is disposed on the first substrate and spaced apart from the first metal portion and the insulating portion, and the cathode further includes a third portion, and the metal isolation column is used to disconnect the first portion and the third portion of the cathode. A notch is provided on the side of the metal isolation column, and the third portion of the cathode is disposed on a side surface of the metal isolation column away from the first substrate, and the first portion of the cathode and the third portion of the cathode are disconnected at the notch.

[0027] In this way, by setting a metal isolation column to disconnect the cathode, the channel for water vapor and oxygen at the through hole position to invade the display area along the cathode of the isolation area through the hole wall of the through hole can be cut off as much as possible. In this way, water vapor and oxygen in the isolation area can be reduced, and the risk of packaging failure in the isolation area can be reduced.

[0028] In one possible implementation, the display panel also includes a fan-out area, which is connected between the isolation area and the display area. The fan-out area includes a second substrate, a fan-out wiring and an insulating layer. The insulating layer is arranged on the second substrate of the fan-out area, and the fan-out wiring is embedded in the insulating layer.

[0029] In a possible implementation, the insulating layer includes a first insulating layer, a second insulating layer, a third insulating layer, a fourth insulating layer, a fifth insulating layer and a sixth insulating layer which are stacked in sequence, and the first insulating layer is disposed on the second substrate of the fan-out region;

[0030] The fan-out routing includes a first fan-out routing, a second fan-out routing, a third fan-out routing, a fourth fan-out routing, a fifth fan-out routing and a sixth fan-out routing which are arranged at intervals. The first fan-out routing is embedded in the first insulating layer, the second fan-out routing is embedded in the second insulating layer, the third fan-out routing is embedded in the third insulating layer, the fourth fan-out routing is embedded in the third insulating layer, the fifth fan-out routing is embedded in the fifth insulating layer, and the sixth fan-out routing is embedded in the sixth insulating layer.

[0031] Compared with the solution of arranging the first fan-out routing, the second fan-out routing, the third fan-out routing, the fourth fan-out routing, the fifth fan-out routing and the sixth fan-out routing on the same layer, the first fan-out routing, the second fan-out routing, the third fan-out routing, the fourth fan-out routing, the fifth fan-out routing and the sixth fan-out routing are stacked along the thickness direction of the display panel, that is, the fan-out routing of the fan-out area can be arranged in six layers, which can further reduce the area ratio of the packaging area on the display panel, that is, reduce the size of the black border area, and increase the panel ratio of the display area in the display panel, so that the display panel has more area for displaying images, so that the user experience is better.

[0032] In a second aspect, an embodiment of the present application provides a display module, which includes a cover plate and a display panel, wherein the cover plate is stacked on the display panel.

[0033] In this way, the cover plate is stacked on the display panel, and the cover plate can be used to protect the display panel and prevent the display panel from being damaged by external interference. The display panel is not prone to "black spots", and the service life of the display module is longer.

[0034] In a third aspect, an embodiment of the present application provides an electronic device, wherein the electronic device comprises a housing and a display module, wherein the display module is mounted on the housing.

[0035] In this way, the display module is installed in the housing, and the display module and the housing can enclose the internal space of the electronic device. The internal space can be used to set functional components of the electronic device. The display screen is not prone to "black spots", and the service life of the electronic device is longer. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0037] Figure 1 It is a structural schematic diagram of an implementation mode of an electronic device provided in an embodiment of the present application;

[0038] Figure 2 yes Figure 1 a partially exploded schematic diagram of the electronic device shown;

[0039] Figure 3 yes Figure 2 An enlarged schematic diagram of the display panel at position A shown in FIG.

[0040] Figure 4 yes Figure 3 A partial cross-sectional view of an embodiment of the display panel shown in FIG. 1 at section line BB;

[0041] Figure 5 yes Figure 3A partial cross-sectional view of an embodiment of the display panel shown in FIG. 1 at section line BB;

[0042] Figure 6 yes Figure 5 An enlarged schematic diagram of an embodiment of the display panel shown in FIG.

[0043] Figure 7 yes Figure 3 A partial cross-sectional view of an embodiment of the display panel shown in FIG. 1 at section line BB;

[0044] Figure 8 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0045] Fig. 9 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0046] Fig.10 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0047] Fig.11 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0048] Fig.12 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0049] Fig.13 yes Figure 5 An enlarged schematic diagram of another embodiment of the display panel at position C shown in FIG.

[0050] Fig.14 yes Fig.13 A structural schematic diagram of another embodiment of the insulating isolation column shown in ;

[0051] Fig.15 yes Fig.13 A structural schematic diagram of another embodiment of the insulating isolation column shown in ;

[0052] Fig.16 yes Figure 2 A schematic structural diagram of another embodiment of the display panel at A shown in FIG.

[0053] Fig.17a yes Fig.16 A partial cross-sectional view of another embodiment of the display panel shown in FIG. 1 at a section line DD;

[0054] Fig.17b yes Fig.17a An enlarged structural diagram of an embodiment of the display panel at position E shown in FIG.

[0055] Fig.18 yes Fig.16 A partial cross-sectional view of another embodiment of the display panel shown in FIG. 1 at a section line DD;

[0056] Fig.19 yes Fig.16 A partial cross-sectional view of another embodiment of the display panel shown in FIG. 1 at a section line DD;

[0057] Fig. 20 yes Figure 2 A schematic diagram of yet another embodiment of a display panel shown in ;

[0058] Fig.21 yes Figure 2 A schematic diagram of another embodiment of a display panel shown in ;

[0059] Fig. 22 yes Figure 2 A partial structural schematic diagram of another embodiment of a display panel is shown in FIG. DETAILED DESCRIPTION

[0060] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. Among them, "fixed connection" means that the relative position relationship after connection remains unchanged. The orientation terms mentioned in the embodiments of the present application, such as "top", "bottom", "upper", "lower", "left" or "right", etc., are only reference directions of the accompanying drawings. Therefore, the orientation terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In the following, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In addition, multiple refers to at least two.

[0061] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0062] Figure 11 is a schematic diagram of a structure of an implementation of an electronic device 1000 provided in an embodiment of the present application. It should be noted that the figure only schematically shows some components included in the electronic device 1000, and the actual size, actual position and actual structure of these components are not limited by the figure. The following figures also only schematically show some components, and the actual size, actual position and actual structure of these components are also not limited by the following figures. The specific details will not be repeated below.

[0063] like Figure 1 As shown, the electronic device 1000 can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc., which have the display module 100. Figure 1 The electronic device 1000 is described by taking a mobile phone as an example.

[0064] Figure 2 yes Figure 1 A partially exploded schematic diagram of an electronic device 1000 is shown.

[0065] like Figure 1 and Figure 2 As shown, the electronic device 1000 may include a display module 100, a housing 200 and an electronic device 300. The housing 200 may serve as a structural bearing component of the display module 100 and the electronic device 300. The present application does not specifically limit the structure of the housing 200.

[0066] Exemplarily, the display module 100 is mounted on the housing 200. The display module 100 and the housing 200 may enclose an internal space of the electronic device 1000. The display module 100 may be a flat screen, that is, the edge of the display module 100 is not bent to form an arc surface. Alternatively, the display module 100 may be a curved screen, that is, the edge of the display module 100 is bent to form an arc surface. In addition, the display module 100 may be a non-foldable rigid screen or a foldable foldable screen.

[0067] Exemplarily, the electronic device 300 may be mounted on the housing 200, and the electronic device 300 may be located inside the electronic device 1000. The electronic device 300 may include a camera module, a fingerprint module, or other modules that need to receive external light. The electronic device 300 may also include a HOME button, an earpiece, or a speaker. The electronic device 300 of the present application is described by taking a camera module as an example.

[0068] like Figure 2 As shown, the display module 100 may include a display panel 10 and a cover plate 20. The cover plate 20 is stacked on the top surface 10a of the display panel 10. The cover plate 20 may be used to protect the display panel 10.

[0069] Exemplarily, the material of the cover plate 20 may be glass or polyimide, etc. The display panel 10 may be an organic light emitting diode (OLED) panel, a quantum dot light emitting diode (QLED) panel, etc. This embodiment is described by taking the OLED display panel 10 as an example.

[0070] like Figure 2 As shown, the display panel 10 may include a top surface 10a, a bottom surface 10b and a side surface 10c. The display panel 10 is provided with a through hole 10d. The through hole 10d may form an opening on the top surface 10a and the bottom surface 10b of the display panel 10. In other embodiments, the through hole 10d may also adopt other structures. The following will be specifically introduced in conjunction with the relevant drawings, and no further description will be given here.

[0071] like Figure 2 As shown, the light collecting surface 301 of the electronic device 300 is arranged relative to the through hole 10d. It should be understood that in the present application, the relative arrangement of component A and component B can be that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, and projection C and projection D can at least partially overlap. Figure 2 The target direction is indicated by a dash-dot line with an arrow.

[0072] When the electronic device 300 is a camera module, a fingerprint module, an infrared light sensor or other modules that need to receive external light, the electronic device 300 can receive light from outside the electronic device 1000 through the through hole 10d. When the electronic device 300 is a HOME key, the HOME key can be exposed relative to the top surface 10a of the display panel 10 through the through hole 10d to facilitate user pressing or touching. When the electronic device 300 is a receiver or a speaker, the through hole 10d can be used to allow sound to pass through.

[0073] The number of the through holes 10d is not limited to one as shown in the figure. In other embodiments, the number of the through holes 10d may also be multiple, which may be determined according to the requirements of the product. For example, when the number of the electronic devices 300 is two, the number of the through holes 10d is also two. In addition, the position and shape of the through holes 10d are not limited to Figure 2 For example, the cross-section of the through hole 10d may be rectangular, elliptical or other irregular shapes.

[0074] Figure 3 yes Figure 2 FIG. 1 is an enlarged schematic diagram of the display panel 10 at point A shown in FIG.

[0075] like Figure 2 and Figure 3 As shown, the display panel 10 includes a display (Active Area, AA) area 1, a packaging area 2 and an opening area 3. The area where the through hole 10d is located constitutes the opening area 3 of the display panel 10. The packaging area 2 is connected between the display area 1 and the through hole 10d (ie, the opening area 3). Figure 3 The display area 1 and the packaging area 2 are schematically distinguished by dot-dash lines. The display area 1 can be used for image display. The packaging area 2 can be used to isolate the opening area 3 from the display area 1 to prevent water and oxygen in the opening area 3 from entering the display area 1, causing the light-emitting structure in the display panel 10 to be damaged and unable to emit light. The packaging area 2 can also be used to set fan-out wiring, which can be used to electrically connect the pixel units in the display area 1.

[0076] Exemplarily, the shape of the packaging area 2 may be a ring structure. In other embodiments, the shape of the packaging area 2 may also be a rectangle, an ellipse or other irregular shapes, and the shape of the packaging area 2 is not specifically limited.

[0077] The above specifically introduces the structures of the electronic device 1000 and the display module 100 in conjunction with the relevant drawings. The following will introduce the structures of the display area 1 and the packaging area 2 respectively in conjunction with the relevant drawings.

[0078] Figure 4 yes Figure 3 FIG. 1 is a partial cross-sectional view of an embodiment of a display panel 10 at a section line BB.

[0079] like Figure 4 As shown, the display area 1 includes the substrate 11 (basal plate, BP), thin film transistor 12 (thin film transistor, TFT), pixel definition layer 13 (pixel define layer, PDL), pixel unit layer 14, encapsulation layer 15, protection layer 16, connection layer 17 and polarizer 18. In this embodiment, when the display panel 10 is in use, the substrate 11 is a layer of the display area 1 away from the user. Figure 4 Only one thin film transistor 12 is schematically shown. The number of the thin film transistors 12 in the display area 1 can be one or more, which is not specifically limited in the present application.

[0080] Exemplarily, the substrate 11 is used to provide a supporting base for the layers thereon (such as the thin film transistor 12). The material of the substrate 11 can be polyimide (PI), polyethylene terephthalate (PET), paper, metal, ultra-thin glass, etc.

[0081] like Figure 4 As shown, the thin film transistor 12 may include a buffer layer 121 (buffer), an active layer 122, a gate insulator 123 (gate insulator, GI), an interlayer dielectric 124 (inner layer dielectric, ILD), a gate 125 (gate), a source 126 (source, S), a drain 127 (drain, D), a planarization layer 128 (planarization, PLN), a first wiring 1291, a second wiring 1292 and a third wiring 1293. Exemplarily, the interlayer dielectric 124 includes a first interlayer dielectric 1241, a second interlayer dielectric 1242 and a third interlayer dielectric 1243. The source 126 includes a first source 1261, a second source 1262 and a third source 1263. The planarization layer 128 includes a first planarization layer 1281, a second planarization layer 1282 and a third planarization layer 1283.

[0082] The first wiring 1291, the second wiring 1292 and the third wiring 1293 are used to transmit a driving signal for driving the display image of the display area 1. Exemplarily, the first wiring 1291, the second wiring 1292 and the third wiring 1293 can be one or more of a clock signal (CLOCK, CLK) wiring, a frame start signal (Start Vertical, STV) wiring, a reset signal (Reset, RST) wiring and a low voltage logic signal (Vgatelow, VGL) wiring.

[0083] Exemplarily, the buffer layer 121 may be disposed on the substrate 11. The active layer 122 is disposed on a surface of the buffer layer 121 away from the substrate 11. The gate insulating layer 123 is disposed on a surface of the buffer layer 121 away from the substrate 11, and covers the active layer 122. The gate 125 and the first wiring 1291 are both disposed on a surface of the gate insulating layer 123 away from the buffer layer 121. The gate 125 and the first wiring 1291 are spaced apart. The first interlayer insulating layer 1241 is disposed on a surface of the gate insulating layer 123 away from the buffer layer 121, and covers the gate 125 and the first wiring 1291. The second wiring 1292 is disposed on a surface of the first interlayer insulating layer 1241 away from the gate insulating layer 123. The second interlayer insulating layer 1242 is disposed on a surface of the first interlayer insulating layer 1241 away from the gate insulating layer 123, and covers the second wiring 1292. The third interlayer insulating layer 1243 is disposed on a surface of the second interlayer insulating layer 1242 away from the first interlayer insulating layer 1241 and covers the third trace 1293 .

[0084] Exemplarily, the first source electrode 1261 may include a first portion 1264 and a second portion 1265. The drain electrode 127 may also include a first portion 1271 and a second portion 1272. The first portion 1264 of the first source electrode 1261 and the first portion 1271 of the drain electrode 127 are disposed on a surface of the second interlayer insulating layer 1242 away from the first interlayer insulating layer 1241. The second portion 1265 of the first source electrode 1261 and the second portion 1272 of the drain electrode 127 are connected to the active layer 122 through the gate insulating layer 123, the first interlayer insulating layer 1241, the second interlayer insulating layer 1242 and the third interlayer insulating layer 1243. The first planar layer 1281 is disposed on a surface of the third interlayer insulating layer 1243 away from the second interlayer insulating layer 1242 and covers a portion of the first source electrode 1261 and a portion of the drain electrode 127. The second source electrode 1262 may include a first portion 1266 and a second portion 1267. The first portion 1266 is disposed on a surface of the first flat layer 1281 away from the third interlayer insulating layer 1243. The second portion 1267 passes through the first flat layer 1281 to connect to the first source electrode 1261. The second flat layer 1282 is disposed on the first flat layer 1281 and covers a portion of the second source electrode 1262. The third source electrode 1263 may include a first portion 1268 and a second portion 1269. The first portion 1268 is disposed on a surface of the second flat layer 1282 away from the third interlayer insulating layer 1243. The second portion 1269 passes through the second flat layer 1282 to connect to the second source electrode 1262. The third flat layer 1283 is disposed on the second flat layer 1282 and covers a portion of the third source electrode 1263.

[0085] The above is an implementation of the thin film transistor 12. In other implementations, the thin film transistor 12 may also be provided with only the first source electrode 1261, the drain electrode 127 and the first planar layer 1281. The embodiment of the present application does not limit the specific layer structure of the thin film transistor 12.

[0086] like Figure 4As shown, the pixel definition layer 13 can be arranged on the surface of the third flat layer 1283 of the thin film transistor 12 away from the second flat layer 1282. The pixel unit layer 14 can be used to realize the display function of the display area 1, and the pixel unit layer 14 is also called a light-emitting device layer. The pixel unit layer 14 may include an anode 141 (anode), an emission layer 142 (emission layer, EL), and a cathode 143 (cathode) stacked in sequence. Among them. The anode 141 may include a first part 1411 and a second part 1412. The first part 1411 of the anode 141 can be arranged on the surface of the third flat layer 1283 away from the second flat layer 1282, and connected to the pixel definition layer 13. The second part 1412 of the anode 141 can pass through the third flat layer 1283 to connect the third source 1263. The light-emitting layer 142 can be arranged on the surface of the first part 1411 of the anode 141 away from the third flat layer 1283. The cathode 143 may be disposed on a side of the light emitting layer 142 away from the anode 141 .

[0087] In some embodiments of the present application, the cathode 143 can be prepared by full-surface evaporation, and the cathode 143 is a continuous structure in the display area 1. The material of the cathode 143 can be magnesium-silver alloy or other metal or non-metal material.

[0088] For example, the material of the light-emitting layer 142 may be an organic material, including an organic small molecule light-emitting material, a complex light-emitting material, a high molecular polymer, and the like.

[0089] like Figure 4 As shown, the encapsulation layer 15 may be disposed on a surface of the pixel unit layer 14 away from the thin film transistor 12. Exemplarily, the encapsulation layer 15 may include a first encapsulation layer 151, a second encapsulation layer 152, and a flexible interlayer 153. The first encapsulation layer 151 is located on a surface of the cathode 143 away from the light emitting layer 142. The flexible interlayer 153 is located between the first encapsulation layer 151 and the second encapsulation layer 152.

[0090] Since the material of the light-emitting layer 142 is an organic material, the organic material is easily oxidized when it comes into contact with water vapor and oxygen, resulting in failure of the light-emitting layer 142. At this time, the encapsulation layer 15 can encapsulate the pixel unit layer 14 of the display area 1, that is, protect the pixel unit layer 14, thereby preventing components such as water vapor and oxygen in the air from affecting the life of the light-emitting layer 142.

[0091] The flexible interlayer 153 can be used to buffer water and oxygen for the thin film transistor 12, the pixel unit layer 14 and other structures below the encapsulation layer 15, thereby reducing encapsulation failure caused by foreign matter. The first encapsulation layer 151 and the second encapsulation layer 152 can also seal the flexible interlayer 153.

[0092] For example, the first encapsulation layer 151 and the second encapsulation layer 152 may be SiO layers or SiN layers made by chemical vapor deposition (CVD). The flexible interlayer 153 may be an acrylate or cured polyester polymer organic layer formed by ink jet printing (IJP) technology.

[0093] The protective layer 16 may be disposed on a surface of the encapsulation layer 15 away from the substrate 11. The connecting layer 17 is disposed between the protective layer 16 and the polarizer 18. The material of the connecting layer 17 may be a pressure sensitive adhesive (PSA).

[0094] Figure 5 yes Figure 3 FIG. 1 is a partial cross-sectional view of an embodiment of a display panel 10 at a section line BB.

[0095] like Figure 3 and Figure 5 As shown, the encapsulation area 2 may include an isolation area 4 and a fan-out area 5. The fan-out area 5 may be connected between the isolation area 4 and the display area 1. Figure 3 The display area 1, the isolation area 4 and the fan-out area 5 are schematically distinguished by dot-dash lines. Exemplarily, the isolation area 4 may be annular and arranged around the through hole 10d. The fan-out area 5 may also be annular and arranged around the isolation area 4.

[0096] The isolation area 4 can be used to prevent water vapor and oxygen at the position of the through hole 10d from entering the display area 1 through the hole wall of the through hole 10d along the cathode 44 of the isolation area 4, causing the light-emitting layer of the display area 1 to be corroded and unable to emit light normally, that is, to avoid the appearance of "black spots" in the display area 1 ("black spots" are parts of the display area 1 that cannot emit light normally).

[0097] The fan-out area 5 may include a fan-out routing 52. Exemplarily, the fan-out routing 52 may be electrically connected to the pixel unit by electrically connecting the horizontal switch gate (Gate) routing, the horizontal light-emitting gate (Emit) routing and the vertical Data routing in the display panel 10, so as to avoid disconnection of the circuit due to the setting of the opening area 3, which may cause malfunction of the display panel 10. The routing electrically connected by the fan-out routing 52 is not limited to and does not need to completely include the above three routings, and the above three routings are only for example. In a special embodiment, one or more of the three routings can be disconnected in the fan-out area 5. The fan-out routing 52 may be a collection of metal routings that are wound along the edge of the opening area 3. The area where the fan-out routing 52 is located is the fan-out area 5.

[0098] like Figure 5 As shown, the isolation region 4 may include a first substrate 41 , an insulating layer 42 , an insulating isolation column 43 , a cathode 44 , an encapsulation layer 45 (Thin Film Encapsulation, TFE), a protective layer 47 , a connecting layer 48 and a polarizer 49 .

[0099] The first substrate 41 is used to provide a supporting base for the layers above it (such as the insulating isolation column 43). Exemplarily, the material of the first substrate 41 can be polyimide (PI), or polyethylene terephthalate (PET), paper, metal, ultra-thin glass, etc.

[0100] In some embodiments of the present application, the first substrate 41 of the encapsulation area 2 may be connected to the first substrate 41 of the display area 1 (eg Figure 4 In this way, no additional process is required and the production cost is not increased. When the two components are arranged on the same layer, the two components can be formed by the same process in terms of technology. When the two components are arranged on the same layer, the heights of the two components from the first substrate 41 can be equal or unequal.

[0101] The insulating layer 42 may be disposed on the first substrate 41. In some embodiments of the present application, the insulating layer 42 may be disposed on the buffer layer 121, the interlayer insulating layer 124 or the planar layer 128 (eg, Figure 4 In this way, no additional process is needed and the production cost is not increased.

[0102] The insulating spacer 43 may be disposed on a side of the insulating layer 42 away from the first substrate 41. Exemplarily, the insulating spacer 43 may be disposed on a side of the insulating layer 42 away from the first substrate 41. The insulating spacer 43 may be annular and disposed around the through hole 10d. The specific structure and function of the insulating spacer 43 will be described below in conjunction with the accompanying drawings.

[0103] The cathode 44 is disposed on the surface of the insulating isolation column 43 and the insulating layer 42 away from the first substrate 41. The insulating isolation column 43 can be used to isolate the cathode 44, so that the cathode 44 is isolated to form a first part 441 and a second part 442. The first part 441 of the cathode 44 can be disposed on the surface of the insulating layer 42 away from the first substrate 41. The second part 442 of the cathode 44 can be disposed on the surface of the insulating isolation column 43 away from the first substrate 41. It should be noted that the cathode 44 is isolated to form the first part 441 and the second part 442, which means that the first part 441 and the second part 442 are disconnected and isolated at the isolation point. Disconnection can be that the height of the first part 441 from the first substrate 41 at the isolation point and the height of the second part 442 from the first substrate 41 at the isolation point are not equal. The isolation of the first part 441 and the second part 442 at the isolation point means that there is a gap between the first part 441 and the second part 442 and they are electrically insulated.

[0104] The isolation area 4 is used to isolate the cathode 44 by setting the insulating isolation column 43. On the one hand, it can prevent the water vapor and oxygen at the position of the through hole 10d from entering the display area 1 through the hole wall of the through hole 10d along the cathode 44 of the isolation area 4, causing the light-emitting layer of the display area 1 to be corroded and unable to emit light normally, that is, to avoid the appearance of "black spots" in the display area 1 ("black spots" are the parts where the display area 1 cannot emit light normally). On the other hand, it can prevent the current of the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, so that the isolation area 4 is charged and electrochemically corroded, resulting in the packaging failure of the isolation area 4. It is prevented that the water vapor and oxygen at the position of the through hole 10d enter the display area 1 through the position where the packaging fails.

[0105] In other embodiments, when the isolation region 4 further includes a light-emitting layer (not shown), the insulating isolation column 43 may also be used to isolate the light-emitting layer of the isolation region 4 .

[0106] In some embodiments of the present application, the cathode 44 of the isolation region 4 may be connected to the cathode 143 of the display region 1 (eg, Figure 4In this way, no additional process is needed and the production cost is not increased.

[0107] In other embodiments, when the isolation region 4 is not provided with the insulating layer 42 , the insulating isolation column 43 and the first portion 441 of the cathode 44 may be provided on the surface of the first substrate 41 .

[0108] The encapsulation layer 45 may be disposed on a side of the insulating layer 42 away from the first substrate 41 and cover the insulating isolation column 43 and the cathode 44. The encapsulation layer 45 may be used to buffer water and oxygen for the structure below the flexible encapsulation layer 45, thereby reducing encapsulation failure caused by foreign matter.

[0109] Exemplarily, the encapsulation layer 45 may include a first encapsulation layer 451, a second encapsulation layer 452 and a flexible interlayer 453. The flexible interlayer 453 is located between the first encapsulation layer 451 and the second encapsulation layer 452. The first encapsulation layer 451 is disposed on a side of the cathode 44 away from the first substrate 41.

[0110] In some embodiments of the present application, the flexible encapsulation layer 45 of the encapsulation area 2 may be connected to the flexible encapsulation layer 15 (eg, Figure 4 In this way, no additional process is needed and the production cost is not increased.

[0111] For example, the material of the first encapsulation layer 451 and the second encapsulation layer 452 may be SiO or SiN. The material of the flexible interlayer 453 may be acrylate or cured polyester polymer organic matter.

[0112] The protective layer 47 may be disposed on a surface of the encapsulation layer 45 that is away from the first substrate 41. The connecting layer 48 is disposed between the protective layer 47 and the polarizer 49. Exemplarily, the material of the connecting layer 48 may be a pressure sensitive adhesive (PSA).

[0113] In some embodiments of the present application, the protective layer 47 of the isolation area 4 can be disposed on the same layer as the protective layer 16 of the display area 1. The connecting layer 48 of the isolation area 4 can be disposed on the same layer as the connecting layer 17 of the display area 1 (e.g. Figure 4 The polarizer 49 of the isolation area 4 can be arranged in the same layer as the polarizer 18 of the display area 1 (as shown). Figure 4 Same layer settings as shown).

[0114] The above specifically introduces a structure of the isolation region 4 in combination with the relevant drawings, and the following will further specifically introduce several structures of the insulating isolation column 43 in combination with the relevant drawings.

[0115] Figure 6 yes Figure 5 FIG. 1 is an enlarged schematic diagram of a portion of the structure of the display panel 10 at position C. FIG.

[0116] like Figure 6 As shown, the insulating isolation column 43 may include an insulating portion 431, a first metal portion 432, and a second metal portion 433. The first metal portion 432 and the second metal portion 433 are disposed on the insulating layer 42 at intervals, and the second metal portion 433 is disposed on a side of the first metal portion 432 close to the display area 1. The insulating portion 431 is disposed between the second portion 442 of the cathode 44 and the first metal portion 432 and the second metal portion 433.

[0117] The first metal part 432 and the second metal part 433 are made of metal material, and the strength of the insulating isolation column 43 is good. The first metal part 432 and the second metal part 433 can be used to disconnect the first part 441 and the second part 442 of the cathode 44.

[0118] Exemplarily, the first metal part 432 may include a top surface 4321, a bottom surface 4322, a first side surface 4324, and a second side surface 4323. The top surface 4321 of the first metal part 432 and the bottom surface 4322 of the first metal part 432 are disposed opposite to each other. The second side surface 4323 of the first metal part 432 and the first side surface 4324 of the first metal part 432 are disposed opposite to each other and spaced apart. The second side surface 4323 of the first metal part 432 is connected between the top surface 4321 of the first metal part 432 and the bottom surface 4322 of the first metal part 432, and the first side surface 4324 of the first metal part 432 is connected between the top surface 4321 of the first metal part 432 and the bottom surface 4322 of the first metal part 432.

[0119] The second metal part 433 may include a top surface 4331, a bottom surface 4332, a first side surface 4334, and a second side surface 4333. The top surface 4331 of the second metal part 433 and the bottom surface 4332 of the second metal part 433 are arranged opposite to each other. The second side surface 4333 of the second metal part 433 and the first side surface 4334 of the second metal part 433 are arranged opposite to each other and spaced apart. The second side surface 4333 of the second metal part 433 is connected between the top surface 4331 of the second metal part 433 and the bottom surface 4332 of the second metal part 433. The first side surface 4334 of the second metal part 433 is connected between the top surface 4331 of the second metal part 433 and the bottom surface 4332 of the second metal part 433.

[0120] When the first metal portion 432 and the second metal portion 433 are spaced apart on the insulating layer 42, the second side surface 4323 of the first metal portion 432 is located on a side of the first side surface 4324 of the first metal portion 432 away from the second metal portion 433. The second side surface 4333 of the second metal portion 433 is located on a side of the first side surface 4334 of the second metal portion 433 away from the first metal portion 432.

[0121] The first metal part 432 and the second metal part 433 may be provided with grooves. Exemplarily, the first metal part 432 may be provided with a first groove 4325. The opening of the first groove 4325 is located at the second side surface 4323 of the first metal part 432, and is spaced apart from the top surface 4321 of the first metal part 432. The second metal part 433 may be provided with a second groove 4335. The opening of the second groove 4335 is located at the second side surface 4333 of the second metal part 433, and is spaced apart from the top surface 4331 of the second metal part 433. The cathode 44 of the isolation region 4 is disconnected at the opening of the first groove 4325 and the opening position of the second groove 4335. The first part 441 of the cathode 44 may be provided on the surface of the insulating layer 42 away from the first substrate 41. The second part 442 of the cathode 44 may be provided on the surface of the insulating part 431 away from the first substrate 41.

[0122] The insulating isolation column 43 is provided with the first groove 4325 and the second groove 4335. In the process of forming the cathode 44 of the isolation region 4, the cathode 44 is disconnected at the opening of the first groove 4325 and the opening of the second groove 4335 to form the layered first part 441 and the second part 442. In addition, the cathode 44 can be disconnected twice at the opening of the first groove 4325 and the opening of the second groove 4335, and the insulating isolation column 43 has a better isolation effect on the cathode 44.

[0123] like Figure 6 The insulating isolation column 43 shown is provided with two metal parts (i.e., the first metal part 432 and the second metal part 433). In other embodiments, the insulating isolation column 43 may also be provided with only one metal part. For example, the insulating isolation column 43 may be provided with any one of the first metal part 432 and the second metal part 433. The details will be described in detail later through the drawings and will not be repeated here.

[0124] In other embodiments, when the isolation region 4 is not provided with the insulating layer 42 , the first metal portion 432 and the second metal portion 433 may be provided on the first substrate 41 .

[0125] like Figure 3 and Figure 6 As shown, the insulating isolation column 43 may be ring-shaped and disposed around the through hole 10d (ie, the opening area 3). Figure 3 The insulating isolation column 43 is schematically represented by a thick line. The first metal portion 432 and the second metal portion 433 may also be annular and arranged around the through hole 10d (that is, the opening area 3). The first groove 4325 and the second groove 4335 may also be annular and arranged around the through hole 10d (that is, the opening area 3). In this way, the insulating isolation column 43 has a better isolation effect on the cathode 44.

[0126] like Figure 6As shown, the insulating part 431 can be arranged between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433. The insulating part 431 is made of insulating material. The insulating part 431 can be used to insulate the second part 442 of the cathode 44 from the first metal part 432 and the second metal part 433, so as to avoid the first part 441 and the second part 442 of the cathode 44 being connected in series through the first metal part 432 and the second metal part 433, and the first part 441 and the second part 442 of the cathode 44 are insulated. The insulating part 431, the first metal part 432 and the second metal part 433 work together to isolate the first part 441 and the second part 442 of the cathode 44.

[0127] Exemplarily, the insulating portion 431 may include a top surface 4311 and a bottom surface 4312 that are spaced apart. The top surface 4311 of the insulating portion 431 is disposed on a side of the bottom surface 4312 of the insulating portion 431 that is away from the first substrate 41. The bottom surface 4312 of the insulating portion 431 may be connected to the insulating layer 42, the top surface 4321 of the first metal portion 432, the first side surface 4324 of the first metal portion 432, the top surface 4331 of the second metal portion 433, and the first side surface 4334 of the second metal portion 433. The second portion 442 of the cathode 44 is disposed on the top surface 4311 of the insulating portion 431, that is, the second portion 442 of the cathode 44 is disposed on a side of the insulating portion 431 that is away from the first substrate 41.

[0128] The insulating isolation column 43 can insulate the first part 441 and the second part 442 of the cathode 44 by setting the insulating part 431, thereby preventing the first part 441 and the second part 442 of the cathode 44 from being connected in series through the first metal part 432 and the second metal part 433, causing the isolation area 4 to be charged and electrochemically corroded, resulting in packaging failure of the isolation area 4.

[0129] In other embodiments, when the insulating layer 42 is not set in the isolation region 4, the bottom surface 4312 of the insulating part 431 can be connected to the first substrate 41, the top surface 4321 of the first metal part 432, the first side surface 4324 of the first metal part 432, the top surface 4331 of the second metal part 433, and the first side surface 4334 of the second metal part 433.

[0130] like Figure 3 and Figure 6As shown, the insulating isolation column 43 may be annular and arranged around the through hole 10d (i.e., the opening area 3). The insulating portion 431 may also be annular and arranged around the through hole 10d (i.e., the opening area 3). In this way, the insulating portion 431 has a better insulation effect between the first portion 441 and the second portion 442 of the cathode 44.

[0131] like Figure 6 As shown, the insulating portion 431 may include an inorganic layer 4313 and an organic layer 4314. The organic layer 4314 may be connected to a side of the inorganic layer 4313 away from the first substrate 41. A portion of the second portion 442 of the cathode 44 is disposed on a side of the inorganic layer 4313 away from the first substrate 41, and another portion is disposed on a side of the organic layer 4314 away from the first substrate 41. The inorganic layer 4313 may be made of an inorganic insulating material. The organic layer 4314 may be made of an organic insulating material.

[0132] Exemplarily, a portion of the inorganic layer 4313 may be connected between the top surface 4321 of the first metal part 432 and the second portion 442 of the cathode 44, a portion of the inorganic layer 4313 may be disposed between the top surface 4331 of the second metal part 433 and the second portion 442 of the cathode 44, and a portion of the inorganic layer 4313 may be disposed between the organic layer 4314 and the insulating layer 42, the first side surface 4324 of the first metal part 432, and the first side surface 4334 of the second metal part 433. In other embodiments, the insulating part 431 may not be provided with the organic layer 4314. At this time, the inorganic layer 4313 can be arranged between the second part 442 of the cathode 44 and the top surface 4321 of the first metal part 432, the top surface 4331 of the second metal part 433, the insulating layer 42, the first side surface 4324 of the first metal part 432 and the first side surface 4334 of the second metal part 433.

[0133] Compared with the solution that the insulating portion 431 is only provided with the organic layer 4314, and the organic layer 4314 is provided between the top surface 4321 of the first metal portion 432 and the second portion 442 of the cathode 44, and between the top surface 4331 of the second metal portion 433 and the second portion 442 of the cathode 44, the inorganic layer 4313 is provided between the top surface 4321 of the first metal portion 432, the top surface 4331 of the second metal portion 433 and the cathode 44. 44, the organic layer 4314 made of organic insulating material is prevented from shrinking in the inner direction of the organic layer 4314 due to the tolerance of alignment accuracy after being heated, and the organic layer 4314 cannot completely cover the top surface 4321 of the first metal part 432 and the top surface of the second metal part 433, resulting in the second part 442 of the cathode 44 being electrically connected to the top surface 4321 of the first metal part 432 and the top surface of the second metal part 433. In addition, the first part 441 and the second part 442 of the cathode 44 are prevented from being connected in series through the first metal part 432 and the second metal part 433, resulting in the isolation region 4 being charged and electrochemically corroded.

[0134] In some embodiments of the present application, the inorganic layer 4313 may be made of silicon oxide, silicon nitride, etc.

[0135] In some embodiments of the present application, the organic layer 4314 can be made of polyimide, polyamide, polyacrylamide, phenolic resin, etc.

[0136] In some embodiments of the present application, the organic layer 4314 may be located between the second portion 442 of the cathode 44 and the first side surface 4324 of the first metal portion 432, and between the second portion 442 of the cathode 44 and the first side surface 4334 of the second metal portion 433. That is, the organic layer 4314 may cover the first side surface 4324 of the first metal portion 432 and the first side surface 4334 of the second metal portion 433. In this way, when the inorganic layer 4313 is formed by a thin film deposition process (e.g., chemical vapor deposition, Deposition, CVD), the thin film deposition process is greatly affected by the surface morphology of the metal part. If there are burrs or other uneven structures on the first side 4324 of the first metal part 432 and the first side 4334 of the second metal part 433, it is difficult for the inorganic layer 4313 to form a continuous layer structure. The burrs or other uneven structures on the first side 4324 of the first metal part 432 and the first side 4334 of the second metal part 433 are easy to penetrate the inorganic layer 4313 and be exposed. By arranging the organic layer 4314 to cover the burrs or uneven positions of the first side 4324 of the first metal part 432 and the first side 4334 of the second metal part 433, the insulation effect between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433 is further ensured, and the first part 441 and the second part 442 of the cathode 44 are prevented from being connected in series through the first metal part 432 and the second metal part 433.

[0137] In addition, the organic layer 4314 is made of organic insulating material, which can absorb water vapor. When water vapor enters the isolation area 4, the organic layer 4314 can absorb the water vapor and slow down the spread of the water vapor. The more the number of the insulating isolation columns 43 is, the more conducive it is to slow down the spread of the water vapor.

[0138] In some embodiments of the present application, the distance between the top surface of the organic layer 4314 and the first substrate 41 may be greater than the distance between the top surface 4321 of the first metal part 432 and the first substrate 41. The distance between the top surface of the organic layer 4314 and the first substrate 41 may be greater than the distance between the top surface 4331 of the second metal part 433 and the first substrate 41. The top surface of the organic layer 4314 is the surface of the side of the organic layer 4314 away from the first substrate 41. In this way, the height of the entire insulating isolation column 43 is relatively high. When the flexible interlayer 453 is formed by inkjet printing, the flexible interlayer 453 has fluidity before curing. The insulating isolation column 43 can be used to block the uncured flexible interlayer 453 to prevent the uncured flexible interlayer 453 from flowing to the isolation area 4 and flowing out to the opening area 3 through the isolation area 4. That is, the insulating isolation column 43 can be used to prevent overflow (that is, to block the uncured flexible interlayer 453 from flowing). The packaging area 2 can omit the setting of the isolation dam, and use the insulating isolation column 43 to block the flexible interlayer 453, which can reduce the area occupied by the packaging area 2 on the display panel 10 and increase the panel proportion of the display area 1 in the display panel 10, so that the display panel 10 has more area for displaying images, so that the user experience is better.

[0139] In addition, the height of the insulating isolation column 43 of the isolation area 4 is relatively high. When the protective layer 16 of the display area 1 and the protective layer 47 of the isolation area 4 are arranged on the same layer, after the encapsulation layer 45 of the isolation area 4 is laid, the protective layer 16 of the display area 1 (such as Figure 4 As shown in the figure, the height difference between the protective layer 47 of the isolation area 4 and the protective layer 47 is small, which can avoid the large height difference of the protective layer 16 causing the edge stress of the opening area 3 to be large and the edge of the protective layer 47 to fall off.

[0140] In some embodiments of the present application, the organic layer 4314 may fill the gap between the first metal part 432 and the second metal part 433. The second portion 442 of the cathode 44 may be disposed on a side of the first metal part 432 and the second metal part 433 away from the first substrate 41.

[0141] In some embodiments of the present application, along the direction from the opening area 3 toward the display area 1, the second side surface 4323 of the first metal part 432, the organic layer 4314, and the second side surface 4333 of the second metal part 433 are arranged at intervals, and the organic layer 4314 is arranged between the second side surface 4323 of the first metal part 432 and the second side surface 4333 of the second metal part 433. It can be understood that this can reduce the risk of the organic layer 4314 shifting toward the display area 1 or the isolation area 4 due to the alignment accuracy tolerance when forming the organic layer 4314, and avoid the organic layer 4314 shifting toward the display area 1 or the isolation area 4 and covering and filling the first groove 4325 or the second groove 4335, resulting in poor disconnection effect of the first metal part 432 and the second metal part 433 on the cathode 44.

[0142] In some embodiments of the present application, along the thickness direction of the display panel 10, the projection of the second side surface 4323 of the first metal part 432 on the first substrate 41 is a first projection. The projection of the second side surface 4333 of the second metal part 433 on the first substrate 41 is a second projection. The projection of the organic layer 4314 on the first substrate 41 is a third projection. The third projection is located between the first projection and the second projection.

[0143] In some embodiments of the present application, the first side surface 4324 of the first metal part 432 is a plane (slight undulations are allowed). In this way, it is beneficial for the inorganic layer 4313 to form a layer structure with good continuity. The inorganic layer 4313 can better cover the first side surface 4324 of the first metal part 432, which is beneficial to speed up the process and save costs. When the insulating part 431 includes the organic layer 4314, the first side surface 4324 of the first metal part 432 is a plane, which is also beneficial for the organic layer 4314 to form a layer structure with good continuity, and to form better insulation protection for the first side surface 4324 of the first metal part 432.

[0144] In some embodiments of the present application, the first side surface 4334 of the second metal portion 433 may also be a plane, and the inorganic layer 4313 may better cover the first side surface 4334 of the second metal portion 433 .

[0145] In some embodiments of the present application, the first side surface 4324 of the first metal part 432 is a bevel. That is, the angle between the first side surface 4324 of the first metal part 432 and the first substrate 41 is less than 90°. Compared with the solution in which the first side surface 4324 of the first metal part 432 is perpendicular to the first substrate 41, when the inorganic layer 4313 is formed using a thin film deposition process, the first side surface 4324 of the first metal part 432 is a bevel, and the inorganic layer 4313 is not easy to break, which is conducive to the inorganic layer 4313 forming a layer structure with good continuity. When the insulating part 431 includes the organic layer 4314, the first side surface 4324 of the first metal part 432 is a bevel, which is also conducive to the organic layer 4314 forming a layer structure with good continuity, and forming better insulation protection for the first side surface 4324 of the first metal part 432.

[0146] In some embodiments of the present application, the inorganic layer 4313 may be connected to the gate insulating layer 123, the first interlayer insulating layer 1241, the second interlayer insulating layer 1242 or the third interlayer insulating layer 1243 (such as Figure 4 In this way, no additional process is needed and the production cost is not increased.

[0147] In some embodiments of the present application, the organic layer 4314 can be connected to the first flat layer 1281, the second flat layer 1282, the third flat layer 1283 or the pixel definition layer 13 (such as Figure 4 In this way, no additional process is needed and the production cost is not increased.

[0148] In some embodiments of the present application, Figure 6As shown, the first metal part 432 may include a first conductive layer 4326, a second conductive layer 4327, and a third conductive layer 4328 that are stacked. The first conductive layer 4326 may be disposed on a surface of the insulating layer 42 that is away from the first substrate 41. The second conductive layer 4327 may be disposed between the first conductive layer 4326 and the third conductive layer 4328. The inorganic layer 4313 of the insulating part 431 may be disposed on a surface of the third conductive layer 4328 that is away from the second conductive layer 4327. The surface of the third conductive layer 4328 that is away from the second conductive layer 4327 is the top surface 4321 of the first metal part 432. The surface of the first conductive layer 4326 that faces the first substrate 41 is the bottom surface 4322 of the first metal part 432. A side surface of the first conductive layer 4326 away from the second metal part 433, a side surface of the second conductive layer 4327 away from the second metal part 433, and a side surface of the third conductive layer 4328 away from the second metal part 433 constitute the second side surface 4323 of the first metal part 432. The first groove 4325 may be provided on the second side surface 4323 of the first metal part 432. A side surface of the first conductive layer 4326 facing the second metal part 433, a side surface of the second conductive layer 4327 facing the second metal part 433, and a side surface of the third conductive layer 4328 facing the second metal part 433 constitute the first side surface 4324 of the first metal part 432.

[0149] The opening of the first groove 4325 may be disposed at the second side surface 4323 of the first metal part 432. For example, the opening of the first groove 4325 may be disposed at the first side surface of the first conductive layer 4326, or the first side surface of the second conductive layer 4327, or the first side surface of the third conductive layer 4328. The first side surface of the first conductive layer 4326 is a side surface of the first conductive layer 4326 away from the second metal part 433. The first side surface of the second conductive layer 4327 is a side surface of the second conductive layer 4327 away from the second metal part 433. The first side surface of the third conductive layer 4328 is a side surface of the third conductive layer 4328 away from the second metal part 433.

[0150] Exemplarily, the widths of the first conductive layer 4326 and the third conductive layer 4328 may be greater than the width of the second conductive layer 4327. The first side surface of the second conductive layer 4327 may be disposed on a side of the first side surface of the first conductive layer 4326 close to the second metal portion 433, and the first side surface of the second conductive layer 4327 may be disposed on a side of the first side surface of the third conductive layer 4328 close to the second metal portion 433, so as to form the first groove 4325.

[0151] In other embodiments, the opening of the first groove 4325 may also be disposed on the first side surface of the first conductive layer 4326 and the first side surface of the second conductive layer 4327 at the same time.

[0152] In some embodiments of the present application, the material of the first conductive layer 4326 and the third conductive layer 4328 is metal titanium (Ti), and the material of the second conductive layer 4327 is metal aluminum (Al). In other embodiments, the material of the first conductive layer 4326 and the third conductive layer 4328 may also be metal molybdenum (Mo).

[0153] In some embodiments of the present application, the first metal portion 432 and the second metal portion 433 may be connected to the first source electrode 1261, the second source electrode 1262, the third source electrode 1263 or the drain electrode 127 (such as Figure 4 In this way, no additional process is needed and the production cost is not increased.

[0154] In other embodiments, the first metal portion 432 may also be provided with only one of the first conductive layer 4326 , the second conductive layer 4327 , and the third conductive layer 4328 .

[0155] The configuration of the second metal portion 433 and the second groove 4335 may refer to the configuration of the first metal portion 432 and the first groove 4325 , and will not be described in detail herein.

[0156] Figure 7 yes Figure 3 FIG. 1 is a partial cross-sectional view of an embodiment of a display panel 10 at a section line BB.

[0157] like Figure 5 and Figure 7 As shown, the fan-out region 5 may include a second substrate 51 , the fan-out wiring 52 , an insulating layer 53 , an encapsulation layer 54 , a cathode 55 , a protective layer 56 , a connecting layer 57 and a polarizer 58 .

[0158] Exemplarily, the second substrate 51 is used to provide a bearing base for the layers above it (such as the fan-out wiring 52). The material of the second substrate 51 can be polyimide (PI), polyethylene terephthalate (PET), paper, metal, ultra-thin glass, etc.

[0159] In some embodiments of the present application, the second substrate 51 of the fan-out area 5 can be connected to the second substrate 51 of the display area 1 (such as Figure 4 Same layer settings as shown).

[0160] The insulating layer 53 may be disposed on the surface of the second substrate 51. The fan-out trace 52 may be embedded in the insulating layer 53. The insulating layer 53 may be used to provide protection and insulation for the fan-out trace 52. The fan-out trace 52 embedded in the insulating layer 53 may be completely embedded in the insulating layer 53, or may be partially embedded in the insulating layer 53. When the fan-out trace 52 is completely embedded in the insulating layer 53, the fan-out trace 52 is completely wrapped by the insulating layer 53. When the fan-out trace 52 is partially embedded in the insulating layer 53, the fan-out trace 52 is partially exposed from the insulating layer 53.

[0161] Exemplarily, the fan-out trace 52 may include a first fan-out trace 521, a second fan-out trace 522, a third fan-out trace 523, a fourth fan-out trace 524, a fifth fan-out trace 525, and a sixth fan-out trace 526 arranged in a stacked manner. The insulating layer 53 may include a first insulating layer 531, a second insulating layer 532, a third insulating layer 533, a fourth insulating layer 534, a fifth insulating layer 535, and a sixth insulating layer 536 arranged in a stacked manner.

[0162] The first fan-out routing 521 may be disposed on the second substrate 51. The first insulating layer 531 may be disposed on the second substrate 51 and cover the first fan-out routing 521. In this way, the first insulating layer 531 may protect and insulate the first fan-out routing 521. The number of the first fan-out routing 521 may be multiple or one. When the number of the first fan-out routing 521 is multiple, the multiple first fan-out routings 521 are spaced apart and insulated from each other.

[0163] In some embodiments of the present application, the first fan-out wiring 521 may be connected to the gate 125 (eg, Figure 4 The first insulating layer 531 may be disposed on the same layer as the first interlayer insulating layer 1241 (as shown in FIG. Figure 4Same layer settings as shown).

[0164] In some embodiments of the present application, the fan-out region 5 may further include a buffer layer (not shown), and the first fan-out wiring 521 may be disposed on the buffer layer. The first insulating layer 531 may be disposed on the buffer layer and cover the first fan-out wiring 521. The buffer layer of the fan-out region 5 may be connected to the buffer layer 121 or the gate insulating layer 123 (such as the gate insulating layer 123) of the display region 1. Figure 4 Same layer settings as shown).

[0165] The second fan-out routing 522 may be disposed on a surface of the first insulating layer 531 away from the second substrate 51. The second insulating layer 532 may be disposed on a surface of the first insulating layer 531 away from the second substrate 51, and cover the second fan-out routing 522. In this way, the second insulating layer 532 may protect and insulate the second fan-out routing 522. The number of the second fan-out routing 522 may be multiple or one. When the number of the second fan-out routing 522 is multiple, the multiple second fan-out routings 522 are spaced apart and insulated from each other.

[0166] In some embodiments of the present application, the second fan-out wiring 522 may be connected to the second wiring 1292 (eg, Figure 4 The second insulating layer 532 may be disposed on the same layer as the second interlayer insulating layer 1242 (as shown in FIG. Figure 4 Same layer settings as shown).

[0167] The third fan-out routing 523 may be disposed on a surface of the second insulating layer 532 away from the first insulating layer 531. The third insulating layer 533 is disposed on a surface of the second insulating layer 532 away from the first insulating layer 531 and covers the third fan-out routing 523. In this way, the third insulating layer 533 may protect and insulate the third fan-out routing 523. The number of the third fan-out routing 523 may be multiple or one. When the number of the third fan-out routing 523 is multiple, the multiple third fan-out routings 523 are spaced apart and insulated from each other.

[0168] In some embodiments of the present application, the third fan-out wiring 523 may be connected to the third wiring 1293 (eg, Figure 4 The third insulating layer 533 may be disposed in the same layer as the third interlayer insulating layer 1243 (as shown in FIG. Figure 4 Same layer settings as shown).

[0169] The fourth fan-out routing 524 may be disposed on a surface of the third insulating layer 533 away from the second insulating layer 532. The fourth insulating layer 534 may be disposed on a surface of the third insulating layer 533 away from the second insulating layer 532, and cover the fourth fan-out routing 524. In this way, the fourth insulating layer 534 may protect and insulate the fourth fan-out routing 524. The number of the fourth fan-out routing 524 may be multiple or one. When the number of the fourth fan-out routing 524 is multiple, the multiple fourth fan-out routings 524 are spaced apart and insulated from each other.

[0170] In some embodiments of the present application, the fourth fan-out wiring 524 can be connected to the first source 1261 (such as Figure 4 The fourth insulating layer 534 may be disposed on the same layer as the first planar layer 1281 (as shown in FIG. Figure 4 Same layer settings as shown).

[0171] The fifth fan-out routing 525 may be disposed on a surface of the fourth insulating layer 534 away from the third insulating layer 533. The fifth insulating layer 535 may be disposed on a surface of the fourth insulating layer 534 away from the third insulating layer 533, and cover the fifth fan-out routing 525. In this way, the fifth insulating layer 535 may protect and insulate the fifth fan-out routing 525. The number of the fifth fan-out routing 525 may be multiple or one. When the number of the fifth fan-out routing 525 is multiple, the multiple fifth fan-out routings 525 are spaced apart and insulated from each other.

[0172] In some embodiments of the present application, the fifth fan-out wiring 525 can be connected to the second source 1262 (such as Figure 4 The fifth insulating layer 535 can be disposed on the same layer as the second planar layer 1282 (as shown in FIG. Figure 4 Same layer settings as shown).

[0173] The sixth fan-out routing 526 may be disposed on a surface of the fifth insulating layer 535 away from the fourth insulating layer 534. The sixth insulating layer 536 may be disposed on a surface of the fifth insulating layer 535 away from the fourth insulating layer 534, and cover the sixth fan-out routing 526. In this way, the sixth insulating layer 536 may protect and insulate the sixth fan-out routing 526. The number of the sixth fan-out routing 526 may be multiple or one. When the number of the sixth fan-out routing 526 is multiple, the multiple sixth fan-out routings 526 are spaced apart and insulated from each other.

[0174] In some embodiments of the present application, the sixth fan-out wiring 526 can be connected to the third source 1263 (such as Figure 4 The sixth insulating layer 536 may be disposed on the same layer as the third planar layer 1283 (as shown in FIG. Figure 4 Same layer settings as shown).

[0175] Compared with the scheme that the first fan-out routing 521, the second fan-out routing 522, the third fan-out routing 523, the fourth fan-out routing 524, the fifth fan-out routing 525 and the sixth fan-out routing 526 are arranged in the same layer, the first fan-out routing 521, the second fan-out routing 522, the third fan-out routing 523, the fourth fan-out routing 524, the fifth fan-out routing 525 and the sixth fan-out routing 526 are stacked along the thickness direction of the display panel 10, that is, the fan-out routing 52 of the fan-out area 5 can be arranged in six layers, which can further reduce the area ratio of the packaging area 2 on the display panel 10, that is, reduce the size of the black border area, and increase the panel ratio of the display area 1 in the display panel 10, so that the display panel 10 has more area for displaying images, so that the user experience is better. In other embodiments, the fan-out routing 52 may also include more than six layers of routing.

[0176] The cathode 55 may be disposed on a surface of the insulating layer 53 away from the second substrate 51. For example, the cathode 55 may be disposed on a surface of the sixth insulating layer 536 away from the second substrate 51.

[0177] The encapsulation layer 54 may be disposed on a surface of the cathode 55 away from the insulating layer 53. Exemplarily, the encapsulation layer 54 may include a first encapsulation layer 541, a second encapsulation layer 542, and a flexible interlayer 543. The flexible interlayer 543 is located between the first encapsulation layer 541 and the second encapsulation layer 542. The first encapsulation layer 541 is disposed on a side surface of the cathode 55 away from the insulating layer 53.

[0178] In some embodiments of the present application, the encapsulation layer 54 of the fan-out region 5 may be connected to the encapsulation layer 45 (eg, Figure 4 Same layer settings as shown).

[0179] The protective layer 56 may be disposed on a surface of the encapsulation layer 54 away from the second substrate 51. The connecting layer 57 is disposed between the protective layer 56 and the polarizer 58. The connecting layer 57 may be made of a pressure sensitive adhesive (PSA).

[0180] In some embodiments of the present application, the protection layer 56 of the fan-out area 5 can be connected to the protection layer 16 (such as Figure 4 The connection layer 57 of the fan-out area 5 can be arranged on the same layer as the connection layer 17 of the display area 1 (as shown in FIG. Figure 4 The polarizer 58 of the fan-out area 5 can be arranged in the same layer as the polarizer 18 of the display area 1 (as shown). Figure 4 Same layer settings as shown).

[0181] The present application specifically introduces a display panel 10 through the accompanying drawings. The display panel 10 includes the display area 1, the isolation area 4 and the opening area 3, and the isolation area 4 is connected between the display area 1 and the opening area 3. The isolation area 4 includes the first substrate 41, the insulating isolation column 43 and the cathode 44. The cathode 44 includes the first part 441 and the second part 442, the first part 441 of the cathode 44 is arranged on the first substrate 41, and the second part 442 of the cathode 44 is arranged on the side of the insulating isolation column 43 away from the first substrate 41, and the insulating isolation column 43 is used to separate the first part 441 of the cathode 44 and the second part 442 of the cathode 44. The insulating isolation column 43 includes the first metal part 432, the second metal part 433 and the insulating part 431. The first metal part 432 and the second metal part 433 can be arranged on the first substrate 41. The first metal part 432, the second metal part 433 and the insulating part 431 can be used to separate the first part 441 of the cathode 44 and the second part 442 of the cathode 44. The insulating part 431 is arranged between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433. The insulating part 431 is used to insulate the second part 442 of the cathode 44 from the first metal part 432 and the second metal part 433. The insulating part 431 includes the inorganic layer 4313. The inorganic layer 4313 is made of inorganic insulating material. The inorganic layer 4313 is arranged between the second part 442 of the cathode 44 and the top surface of the first metal part 432 and the top surface of the second metal part 433.

[0182] The first metal part 432 and the second metal part 433 of the insulating isolation column 43 are used to disconnect the cathode 44, which can prevent water vapor and oxygen at the position of the through hole 10d from entering the display area 1 through the hole wall of the through hole 10d along the cathode 44 of the isolation area 4, causing the light-emitting layer of the display area 1 to be corroded and unable to emit light normally, that is, avoiding the appearance of "black spots" in the display area 1 ("black spots" are parts of the display area 1 that cannot emit light normally). The insulating part 431 is disposed between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433. The insulating part 431 is used to insulate the second part 442 of the cathode 44 from the first metal part 432 and the second metal part 433, so as to prevent the first part 441 and the second part 442 of the cathode 44 from being connected in series through the first metal part 432 and the second metal part 433, and to prevent the current of the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, so that the isolation area 4 is charged and electrochemically corroded, resulting in the packaging failure of the isolation area 4. The insulating part 431 can be used to prevent the isolation area 4 from being charged and causing the packaging failure, and the water vapor and oxygen at the position of the through hole 10d from entering the display area 1 through the position of the packaging failure.

[0183] The inorganic layer 4313 of the insulating part 431 is made of inorganic insulating material, and the inorganic layer 4313 is arranged between the second part 442 of the cathode 44 and the top surface of the first metal part 432 and the top surface of the second metal part 433. Compared with the insulating part 431 made of organic insulating material, the inorganic layer 4313 made of inorganic insulating material can achieve insulation between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433. In the manufacturing process of the display panel 10, the inorganic layer 4313 made of inorganic insulating material will not shrink due to heat, and the inorganic layer 4313 can better cover the top surface 4321 of the first metal part 432 and the top surface 4331 of the second metal part 433, so as to avoid electrical connection between the second part 442 of the cathode 44 and the first metal part 432 and the second metal part 433. This can avoid the first part 441 and the second part 442 of the cathode 44 being connected in series through the first metal part 432 and the second metal part 433, thereby reducing the risk of electrochemical corrosion of the isolation area 4 and providing a better packaging effect for the isolation area 4.

[0184] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Figure 8 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at position C shown in FIG.

[0185] like Figure 8 As shown, the inorganic layer 4313 of the insulating isolation column 43 may include a first portion 4315 and a second portion 4316 that are spaced apart. The first portion 4315 of the inorganic layer 4313 may be disposed between the top surface 4321 of the first metal portion 432 and the second portion 442 of the cathode 44. The second portion 4316 of the inorganic layer 4313 may be disposed between the top surface 4331 of the second metal portion 433 and the second portion 442 of the cathode 44. The organic layer 4314 may be disposed between the first side surface 4324 of the first metal portion 432, the first side surface 4334 of the second metal portion 433, the insulating layer 42, and the second portion 442 of the cathode 44.

[0186] and Figure 6 Compared with the insulating isolation column 43 shown in FIG. Figure 8 The insulating isolation column 43 shown in the figure reduces the area of ​​the inorganic layer 4313, and the insulation between the second portion 442 of the cathode 44 and the first metal portion 432 and the second metal portion 433 is achieved through the organic layer 4314. In the preparation of the display panel 10, the cost of preparing an inorganic insulating material layer per unit area is higher than the cost of preparing an organic insulating material layer per unit area. Reducing the area of ​​the inorganic layer 4313 using inorganic insulating material can reduce the preparation cost of the display panel 10.

[0187] In other embodiments, the inorganic layer 4313 of the insulating isolation column 43 may be disposed between the first side surface 4324 of the first metal portion 432 , the first side surface 4334 of the second metal portion 433 , and the second portion 442 of the cathode 44 .

[0188] Fig. 9 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at C shown in FIG.

[0189] like Fig. 9As shown, the inorganic layer 4313 may include the first portion 4315 and the second portion 4316 that are spaced apart. The first portion 4315 of the inorganic layer 4313 may be disposed between the top surface 4321 of the first metal part 432 and the second portion 442 of the cathode 44. The second portion 4316 of the inorganic layer 4313 may be disposed between the top surface 4331 of the second metal part 433 and the second portion 442 of the cathode 44. The organic layer 4314 may be disposed between the top surface 4321 of the first metal part 432, the first side surface 4324 of the first metal part 432, the top surface 4331 of the second metal part 433, the first side surface 4334 of the second metal part 433, the insulating layer 42, and the second portion 442 of the cathode 44. The first portion 4315 of the inorganic layer 4313 may be disposed on a side of the organic layer 4314 away from the second metal part 433. The second portion 4316 of the inorganic layer 4313 may be disposed on a side of the organic layer 4314 away from the first metal portion 432. In this way, the area of ​​the inorganic layer 4313 may be further reduced, thereby reducing the manufacturing cost of the display panel 10.

[0190] In some embodiments of the present application, along the thickness direction of the display panel 10, the projection of the inorganic layer 4313 on the first substrate 41 and the projection of the organic layer 4314 on the first substrate 41 are connected and have no overlapping parts. Fig. 9 When the insulating isolation column 43 is shown in FIG, the order in which the inorganic layer 4313 and the organic layer 4314 are prepared is not limited. The organic layer 4314 can be prepared first, and then the inorganic layer 4313 is prepared. Alternatively, the inorganic layer 4313 is prepared first, and then the organic layer 4314 is prepared. When the inorganic layer 4313 and the organic layer 4314 are arranged in the same layer structure as the display area 1, there are fewer restrictions, and the preparation process of the insulating isolation column 43 can be set more flexibly.

[0191] In some embodiments of the present application, the top surface of the organic layer 4314 may be convex toward a side away from the first substrate 41 (eg, Figure 6 , Figure 8 and Fig. 9 Compared with the solution in which the top surface of the organic layer 4314 is concave toward the side away from the first substrate 41, the top surface of the organic layer 4314 is convex toward the side away from the first substrate 41, so that the height of the insulating isolation column 43 can be increased, and when the insulating isolation column 43 is used to block the uncured flexible interlayer 453, the blocking effect is better.

[0192] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig.10 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at position C shown in FIG.

[0193] like Fig.10 As shown, the inorganic layer 4313, the organic layer 4314 and the second portion 442 of the cathode 44 are stacked in sequence. The inorganic layer 4313 is disposed on the top surface 4321 of the first metal part 432, the first side surface 4324 of the first metal part 432, the top surface 4331 of the second metal part 433, the first side surface 4334 of the second metal part 433 and between the insulating layer 42 and the organic layer 4314. The organic layer 4314 is disposed on a side surface of the inorganic layer 4313 away from the first substrate 41. The second portion 442 of the cathode 44 is disposed on a side surface of the organic layer 4314 away from the first substrate 41. The second portion 442 of the cathode 44 and the inorganic layer 4313 are spaced apart. In this way, the distance between the second portion 442 of the cathode 44 and the top surface 4321 of the first metal portion 432 and the top surface 4331 of the second metal portion 433 can be increased, and the insulation effect is better.

[0194] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig.11 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at position C shown in FIG.

[0195] like Fig.11As shown, the insulating isolation column 43 may include the insulating portion 431 and the first metal portion 432, and the second metal portion 433 is not provided. At this time, the cathode 44 is separated by the first metal portion 432 and the insulating portion 431. The insulating portion 431 includes the inorganic layer 4313 and the organic layer 4314. Exemplarily, the second side surface 4323 of the first metal portion 432 may be provided on a side of the first side surface 4324 of the first metal portion 432 close to the opening area 3. The opening of the first groove 4325 is located on the second side surface 4323 of the first metal portion 432. The inorganic layer 4313 may be provided on the top surface 4321 of the first metal portion 432 and the first side surface 4324 of the first metal portion 432. The organic layer 4314 is provided between the inorganic layer 4313 and the second portion 442 of the cathode 44. Part of the second portion 442 of the cathode 44 is disposed on the inorganic layer 4313 , and part of the second portion 442 of the cathode 44 is disposed on the organic layer 4314 .

[0196] Compared with the solution in which the insulating isolation column 43 is provided with both the first metal part 432 and the second metal part 433, the insulating isolation column 43 is provided with only the first metal part 432, which can also realize the isolation of the cathode 44, and at the same time, the provision of one metal part can be reduced, and the width of the insulating isolation column 43 can be reduced, thereby reducing the area ratio of the isolation area 4 on the display panel 10, and increasing the panel ratio of the display area 1 in the display panel 10, so that the display panel 10 has more area for displaying images, so that the user experience is better. In addition, the preparation cost of the insulating isolation column 43 can also be reduced.

[0197] In other embodiments, the second side surface 4323 of the first metal part 432 may also be disposed on a side of the first side surface 4324 of the first metal part 432 that is away from the hole region 3. The opening of the first groove 4325 is located on the second side surface 4323 of the first metal part 432. The inorganic layer 4313 may be disposed on the top surface 4321 of the first metal part 432 and the first side surface 4324 of the first metal part 432.

[0198] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig.12 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at position C shown in FIG.

[0199] like Fig.12As shown, the insulating isolation column 43 also includes an insulating protective layer. The insulating protective layer is made of insulating material. The insulating protective layer can be arranged between the first part 441 of the cathode 44 and the metal part. The insulating protective layer can be arranged at intervals from the inorganic layer 4313. Exemplarily, when the insulating isolation column 43 includes the first metal part 432 and the second metal part 433, the insulating protective layer can include a first insulating protective layer 434 and a second insulating protective layer 435. The first insulating protective layer 434 can be arranged at intervals from the inorganic layer 4313 and arranged between the first metal part 432 and the first part 441 of the cathode 44. The second insulating protective layer 435 can be arranged at intervals from the inorganic layer 4313 and arranged between the second metal part 433 and the first part 441 of the cathode 44. In other embodiments, when the insulating isolation column 43 is provided with only one metal part, the number of insulating protective layers can also be one.

[0200] The insulating isolation column 43 is provided with the first insulating protection layer 434. When the cathode 44 is disconnected at the first metal part 432, the first insulating protection layer 434 can be used to insulate the first part 441 of the cathode 44 from the first metal part 432. The first insulating protection layer 434 can reduce the risk of the first part 441 of the cathode 44 being electrically connected to the first metal part 432, and further reduce the risk of the first part 441 and the second part 442 of the cathode 44 being connected in series via the first metal part 432. Similarly, the second insulating protection layer 435 can reduce the risk of the first part 441 of the cathode 44 being electrically connected to the second metal part 433, and further reduce the risk of the first part 441 and the second part 442 of the cathode 44 being connected in series via the second metal part 433.

[0201] The first insulating protective layer 434 is made of insulating material. The material of the first insulating protective layer 434 can be an organic insulating material or an inorganic insulating material. Exemplarily, the material of the first insulating protective layer 434 is an organic insulating material, such as acrylic organic glue. Compared with inorganic insulating materials, the process of preparing the first insulating protective layer 434 using organic insulating materials is simpler.

[0202] In some embodiments of the present application, when the first metal part 432 is provided with the first groove 4325 and the opening of the first groove 4325 is located on the second side 4323 of the first metal part 432, the first insulating protection layer 434 can be partially located in the first groove 4325 and partially provided on the second side 4323 of the first metal part 432.

[0203] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig.13 yes Figure 5 FIG. 1 is an enlarged schematic diagram of another embodiment of the display panel 10 at position C shown in FIG.

[0204] like Fig.13 As shown, the insulating isolation column 43 may include the insulating portion 431, the first metal portion 432, the second metal portion 433 and a padding layer 436. The padding layer 436 is disposed between the insulating portion 431, the first metal portion 432, the second metal portion 433 and the insulating layer 42, and is used to pad the insulating isolation column 43. Exemplarily, the inorganic layer 4313 may be disposed on a side of the first metal portion 432 away from the padding layer 436, and on a side of the second metal portion 433 away from the padding layer 436. The organic layer 4314 may be disposed on a side of the inorganic layer 4313 away from the padding layer 436.

[0205] The insulating spacer 43 is provided with the padding layer 436, so that in the process of forming the cathode 44, the insulating spacer 43 is at a greater distance from the first substrate 41, the cathode 44 is more easily broken at the side of the insulating spacer 43, and the insulating spacer 43 has a better effect of isolating the cathode 44. In addition, by providing the padding layer 436, the height of the insulating spacer 43 can be increased in the thickness direction of the first substrate 41, which is conducive to improving the anti-overflow effect of the insulating spacer 43.

[0206] In some embodiments of the present application, when the isolation region 4 does not include the insulating layer 42, the padding layer 436 may be disposed between the insulating portion 431, the first metal portion 432, the second metal portion 433, and the first substrate 41. Exemplarily, the inorganic layer 4313 may be disposed on a side of the first metal portion 432 away from the first substrate 41, and on a side of the second metal portion 433 away from the first substrate 41. The organic layer 4314 may be disposed on a side of the inorganic layer 4313 away from the first substrate 41.

[0207] Exemplarily, the padding layer 436 may be a three-layer structure, including a top layer 4361, a middle layer 4362, and a bottom layer 4363. The bottom layer 4363 is disposed on a surface of the insulating layer 42 away from the first substrate 41. The middle layer 4362 is located between the top layer 4361 and the bottom layer 4363. The insulating portion 431, the first metal portion 432, and the second metal portion 433 may be disposed on a surface of the top layer 4361 away from the first substrate 41.

[0208] In some embodiments of the present application, when the isolation region 4 does not include the insulating layer 42 , the bottom layer 4363 may be disposed on the first substrate 41 .

[0209] In some embodiments of the present application, the padding layer 436 may be made of insulating material, so as to avoid the first parts 441 of the cathode 44 on both sides of the insulating isolation column 43 being connected in series through the padding layer 436 .

[0210] In some embodiments of the present application, when the padding layer 436 includes the top layer 4361, the middle layer 4362 and the bottom layer 4363, the bottom layer 4363 may be connected to the gate insulating layer 123 (such as Figure 4 The intermediate layer 4362 may be disposed on the same layer as the first interlayer insulating layer 1241 (as shown in FIG. Figure 4 The top layer 4361 may be disposed on the same layer as the second interlayer insulating layer 1242 (as shown in FIG. Figure 4 In other embodiments, when the padding layer 436 is a single-layer structure, the padding layer 436 can be disposed on the same layer as the gate insulating layer 123, the first interlayer insulating layer 1241, and the second interlayer insulating layer 1242 (as shown in FIG. Figure 4 Any layer of the same layer settings).

[0211] In other embodiments, the cushioning layer 436 may also be a single-layer structure. The cushioning layer 436 may include only any one of the top layer 4361, the middle layer 4362, and the bottom layer 4363. The number of layers of the cushioning layer 436 may be reasonably set as needed. In addition, the cushioning layer 436 may also be set at the same layer as other layer structures of the display area 1. This application does not limit this.

[0212] Fig.14 yes Fig.13 FIG. 4 is a schematic structural diagram of another embodiment of the insulating isolation column 43 shown in FIG.

[0213] like Fig.14 As shown, the padding layer 436 may be provided with a third groove 4364, and the opening of the third groove 4364 may be located on the top layer 4361 of the padding layer 436 away from the surface of the first substrate 41, and between the first metal part 432 and the second metal part 433. Part of the insulating part 431 of the insulating isolation column 43 may be located in the third groove 4364. That is, the third groove 4364 may be used to accommodate part of the insulating part 431.

[0214] Exemplarily, the third groove 4364 may penetrate the padding layer 436. That is, the third groove 4364 penetrates the top layer 4361, the middle layer 4362, and the bottom layer 4363. The surface of the insulating layer 42 on one side away from the first substrate 41 serves as the bottom surface of the third groove 4364. In other embodiments, when the isolation region 4 does not include the insulating layer 42, the surface of the first substrate 41 may serve as the bottom surface of the third groove 4364.

[0215] In other embodiments, the third groove 4364 may also penetrate part of the raised layer 436. For example, the third groove 4364 may penetrate the top layer 4361 of the raised layer 436, and the side surface of the middle layer 4362 away from the first substrate 41 serves as the bottom surface of the third groove 4364. In the direction perpendicular to the first substrate 41, the depth of the third groove 4364 may be designed according to actual needs, and this application does not limit this.

[0216] In some embodiments of the present application, the third groove 4364 may be annular, and the third groove 4364 is arranged around the opening area 3. In other embodiments, the third groove 4364 may also be rectangular or other shapes.

[0217] Fig.15 yes Fig.13 FIG. 4 is a schematic structural diagram of another embodiment of the insulating isolation column 43 shown in FIG.

[0218] like Figure 4 and Fig.15 As shown, the padding layer 436 may further include a first metal layer 4365 and a second metal layer 4366. The first metal layer 4365 is disposed between the bottom layer 4363 and the middle layer 4362. The second metal layer 4366 may be disposed between the middle layer 4362 and the top layer 4361. By providing the first metal layer 4365 and the second metal layer 4366, the height of the insulating isolation column 43 may be further increased, the isolation effect of the insulating isolation column 43 on the cathode 44 and the anti-overflow effect on the encapsulation layer 45 may be improved, and the first metal layer 4365 and the second metal layer 4366 may strengthen the strength of the padding layer 436.

[0219] Exemplarily, the first metal layer 4365 includes a first portion 4367 and a second portion 4368. The first portion 4367 and the second portion 4368 are arranged in a spaced relationship. The first portion 4367 of the first metal layer 4365 and the first metal portion 432 are arranged opposite to each other. The second portion 4368 of the first metal layer 4365 and the second metal portion 433 are arranged opposite to each other.

[0220] Exemplarily, the second metal layer 4366 may also include a first portion 4369 and a second portion 4370. The first portion 4369 and the second portion 4370 are arranged in a spaced relationship. The first portion 4369 of the second metal layer 4366 and the first metal portion 432 are arranged opposite to each other. The second portion 4370 of the second metal layer 4366 and the second metal portion 433 are arranged opposite to each other.

[0221] Dividing the first metal layer 4365 and the second metal layer 4366 into two parts can make the raised layer 436 between the first metal part 432 and the second metal part 433 move away from the surface of the first substrate 41 and be recessed toward the first substrate 41 to form a groove, without the need to additionally set the third groove 4364.

[0222] The first metal layer 4365 and the second metal layer 4366 are made of metal materials. In this way, the strength of the insulating isolation column 43 can be enhanced. For example, the first metal layer 4365 can be connected to the gate 125 of the display area 1 or the first wiring 1291 (such as Figure 4 The second metal layer 4366 may be disposed in the same layer as the first source electrode 1261, the second source electrode 1262 or the third source electrode 1263 (as shown in FIG. 1 ) of the display area 1. Figure 4 Same layer settings as shown).

[0223] In some embodiments of the present application, the padding layer 436 may also include any one between the first metal layer 4365 and the second metal layer 4366 , or more metal layers may be provided.

[0224] In other embodiments, the padding layer 436 may be provided with the third groove 4364 while the first metal layer 4365 and the second metal layer 4366 are provided.

[0225] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig.16 yes Figure 2 FIG. 1 is a schematic structural diagram of another embodiment of the display panel 10 at A shown in FIG.

[0226] like Fig.16 As shown, the isolation region 4 may further include a metal isolation column 46. The metal isolation column 46 is disposed around the opening region 3. The metal isolation column 46 is disposed on the first substrate 41 and is spaced apart from the insulating isolation column 43. Fig.16The insulating isolation column 43 and the metal isolation column 46 are distinguished by lines of different thicknesses. The metal isolation column 46 can be used to disconnect the cathode 44.

[0227] Fig.17a yes Fig.16 FIG. 4 is a partial cross-sectional view of yet another embodiment of a display panel 10 at a section line DD.

[0228] like Fig.16 and Fig.17a As shown, the metal isolation column 46 is arranged on the insulating layer 42. The cathode 44 of the isolation region 4 also includes a third portion 443, and the third portion 443 is arranged on a side surface of the metal isolation column 46 away from the first substrate 41. The metal isolation column 46 can be used to disconnect the first portion 441 and the third portion 443 of the cathode 44. The encapsulation layer of the isolation region 4 covers the insulating isolation column 43, the metal isolation column 46 and the cathode 44. Exemplarily, the metal isolation column 46 includes a top surface 461, a bottom surface 462, a first side surface 463 and a second side surface 464. Among them, the bottom surface 462 is connected to the insulating layer 42, and the third portion 443 of the cathode 44 is arranged on the top surface 461. The first side surface 463 is a side surface of the metal isolation column 46 facing the opening area 3. The second side surface 464 is a side surface of the metal isolation column 46 facing the fan-out area 5.

[0229] In other embodiments, when the isolation region 4 is not provided with the insulating layer 42 , the metal isolation column 46 may be provided on the first substrate 41 , and the top surface 461 of the metal isolation column 46 is connected to the first substrate 41 .

[0230] Fig.17b yes Fig.17a FIG. 1 is an enlarged structural diagram of an embodiment of the display panel 10 at E shown in FIG.

[0231] like Fig.16 , Fig.17a and Fig.17bAs shown, the metal isolation column 46 may be provided with a notch. The first portion 441 and the third portion 443 of the cathode 44 may be disconnected at the notch of the metal isolation column 46. Exemplarily, the metal isolation column 46 may be provided with a first notch 465 and a second notch 466. The opening of the first notch 465 is located at the first side 463, and the opening of the first notch 465 may face the opening area 3. The opening of the second notch 466 is located at the second side 464, and the opening of the second notch 466 may face the display area 1. In this way, in the process of forming the cathode 44, the first portion 441 and the third portion 443 of the cathode 44 may be disconnected at the opening of the first notch 465 and the opening of the second notch 466 of the metal isolation column 46, thereby realizing the function of the metal isolation column 46 for disconnecting the cathode 44. In other embodiments, the metal isolation column 46 may also selectively set one of the first notch 465 and the second notch 466.

[0232] The metal isolation column 46 is provided to disconnect the cathode 44, and the channel for water vapor and oxygen at the through hole 10d to invade the display area 1 along the cathode 44 of the isolation area 4 through the hole wall of the through hole 10d is cut off as much as possible. In this way, water vapor and oxygen in the isolation area 4 can be reduced, and the risk of packaging failure in the isolation area 4 can be reduced.

[0233] Exemplarily, the metal isolation column 46 may include a first conductive layer 467, a second conductive layer 468, and a third conductive layer 469 that are stacked. The second conductive layer 468 is disposed between the first conductive layer 467 and the third conductive layer 469. The first conductive layer 467 is disposed on a surface of the insulating layer 42 away from the first substrate 41. The third portion 443 of the cathode 44 is disposed on the third conductive layer 469. The first recess 465 and the second recess 466 may be located in the second conductive layer 468. The opening of the first recess 465 may face the opening area 3. The opening of the second recess 466 may face the display area 1. The arrangement of the second recess 466 may refer to the arrangement of the first recess 465, and will not be repeated here.

[0234] In other embodiments, the metal isolation column 46 may include only one of the first conductive layer 467 , the second conductive layer 468 , and the third conductive layer 469 .

[0235] In some embodiments of the present application, the metal isolation column 46 may be disposed in the same layer as the first metal portion 432 of the insulating isolation column 43. Exemplarily, the first conductive layer 467 of the metal isolation column 46 is disposed in the same layer as the first conductive layer 467 of the first metal portion 432. The second conductive layer 468 of the metal isolation column 46 is disposed in the same layer as the second conductive layer 468 of the first metal portion 432. The third conductive layer 469 of the metal isolation column 46 is disposed in the same layer as the third conductive layer 469 of the first metal portion 432.

[0236] Fig.18 yes Fig.16 FIG. 4 is a partial cross-sectional view of another embodiment of a display panel 10 at a section line DD. Fig.19 yes Fig.16 FIG. 4 is a partial cross-sectional view of another embodiment of the display panel 10 at the section line DD.

[0237] like Figures 17a to 19 As shown, the number of the metal isolation pillars 46 provided in the isolation region 4 may be one or more. The number of the insulating isolation pillars 43 may also be one or more. For example, Fig.17a Two metal isolation columns 46 and three insulating isolation columns 43 are illustrated in FIG. Fig.18 Four insulating isolation columns 43 and two metal isolation columns 46 are shown in FIG. Fig.19 Two insulating isolation columns 43 and four metal isolation columns 46 are illustrated in FIG.

[0238] The metal isolation column 46 and the insulating isolation column 43 of the isolation region 4 are arranged at intervals. The metal isolation column 46 may be located between two adjacent insulating isolation columns 43, or may be located on a side of the insulating isolation column 43 close to the opening region 3, or may be located on a side of the insulating isolation column 43 close to the fan-out region 5. When there are multiple metal isolation columns 46 and multiple insulating isolation columns 43, the multiple metal isolation columns 46 may be arranged alternately with the multiple insulating isolation columns 43.

[0239] The arrangement and quantity of the metal isolation columns 46 and the insulating isolation columns 43 can be arranged according to requirements, and this application does not impose any restrictions.

[0240] The above text specifically introduces a structure of the opening area 3 in combination with the relevant drawings, and the following text will further specifically introduce several structures of the opening area 3 in combination with the relevant drawings.

[0241] In some embodiments of the present application, the same technical contents as those in the above-described embodiments are not repeated. Fig. 20 yes Figure 2Schematic diagram of yet another embodiment of a display panel 10 is shown in FIG. Fig. 20 The display area 1 and the packaging area 2 are schematically distinguished by a dot-dash line.

[0242] like Fig. 20 As shown, the shape of the opening area 3 can also be a runway shape. The runway-shaped opening area 3 can provide a larger channel for the electronic device 300 to allow light to pass through or sound to propagate. The opening area 3 can be located on the left side of the central axis M of the display panel 10. In other embodiments, the opening area 3 can also be located on the central axis M of the display panel 10, that is, the central axis M passes through the area of ​​the display panel 10 where the opening area 3 is located.

[0243] The shape of the opening area 3 is not limited to Figure 2 The circular and Fig. 20 In other embodiments, the shape of the opening area 3 may be rectangular, elliptical or other irregular shapes. In addition, the shape of the opening area 3 may be different from the shape of the packaging area 2. For example, the opening area 3 is rectangular and the packaging area 2 is circular. The shapes of the opening area 3 and the packaging area 2 may be designed according to requirements, and this application does not limit them.

[0244] In addition, the number of the opening areas 3 is not limited to Figure 2 and Fig. 20 In other embodiments, the number of the opening areas 3 may be multiple, for example, two, depending on the product requirements.

[0245] Fig.21 yes Figure 2 FIG. 1 is a schematic diagram of another embodiment of a display panel 10 shown in FIG. Fig.21 The display area 1 and the packaging area 2 are schematically distinguished by a dot-dash line.

[0246] like Fig.21 As shown, the opening area 3 may also form an opening on the side surface 10c of the display panel 10. Exemplarily, the opening area 3 may form an opening on the top side surface 101c of the display panel 10. In other embodiments, the opening area 3 may also form an opening on the bottom side surface 102c, the left side surface 103c, or the right side surface 104c of the display panel 10.

[0247] Since the opening area 3 forms an opening at the side 10c, the opening area 3 formed by the display panel 10 is an open area. At this time, when the encapsulation area 2 is arranged around the opening area 3, the shape of the encapsulation area 2 can be changed accordingly, and the encapsulation area 2 is also an open area. The shape of the insulating isolation column 43 of the encapsulation area 2 can be changed according to the position of the opening area 3, for example, the insulating isolation column 43 can be arc-shaped.

[0248] Fig. 22 yes Figure 2 A partial structural schematic diagram of another embodiment of the display panel 10 is shown in FIG. Fig. 22 The display area 1 and the packaging area 2 are schematically distinguished by dot-dash lines.

[0249] like Fig. 22 As shown, the opening area 3 forms an opening on the top side 101c and the left side 103c. In this way, the opening area 3 is more open. At this time, when the packaging area 2 is arranged around the opening area 3, the packaging area 2 presents a relatively large open area. In other embodiments, the opening area 3 may also form an opening on the top side 101c and the right side 104c, or on the bottom side 102c and the left side 103c, or on the bottom side 102c and the right side 104c.

[0250] The above describes several display panels 10, which include the display area 1, the isolation area 4 and the opening area 3, wherein the isolation area 4 is connected between the display area 1 and the opening area 3. The isolation area 4 includes the first substrate 41, the insulating isolation column 43 and the cathode 44. The cathode 44 includes the first portion 441 and the second portion 442, wherein the first portion 441 of the cathode 44 is disposed on the first substrate 41, and the second portion 442 of the cathode 44 is disposed on the side of the insulating isolation column 43 away from the first substrate 41, and the insulating isolation column 43 is used to separate the first portion 441 of the cathode 44 from the second portion 442 of the cathode 44. The insulating isolation column 43 includes the first metal portion 432 and the insulating portion 431, wherein the first metal portion 432 and the insulating portion 431 are used to separate the first portion 441 of the cathode 44 from the second portion 442 of the cathode 44. The first metal part 432 is arranged on the first substrate 41, the insulating part 431 is arranged between the second part 442 of the cathode 44 and the first metal part 432, the insulating part 431 is used to insulate between the second part 442 of the cathode 44 and the first metal part 432, the insulating part 431 includes the inorganic layer 4313, the inorganic layer 4313 adopts inorganic insulating material, and the inorganic layer 4313 is arranged between the second part 442 of the cathode 44 and the metal part.

[0251] The first metal part 432 of the insulating isolation column 43 can prevent water vapor and oxygen at the position of the through hole 10d from entering the display area 1 along the hole wall of the through hole 10d along the cathode 44 of the isolation area 4, causing the light-emitting layer of the display area 1 to be corroded and unable to emit light normally, that is, to avoid the appearance of "black spots" in the display area 1 ("black spots" are parts where the display area 1 cannot emit light normally). The insulating part 431 is arranged between the second part 442 of the cathode 44 and the first metal part 432. The insulating part 431 is used for insulation between the second part 442 of the cathode 44 and the metal part, which can prevent the first part 441 and the second part 442 of the cathode 44 from being connected in series through the first metal part 432, and prevent the current of the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, so that the isolation area 4 is charged and electrochemically corroded, resulting in packaging failure of the isolation area 4. The insulating portion 431 can be used to prevent the isolation region 4 from being charged and causing packaging failure, and water vapor and oxygen at the through hole 10d can enter the display region 1 through the location of packaging failure.

[0252] The inorganic layer 4313 of the insulating part 431 is made of inorganic insulating material, and the inorganic layer 4313 is arranged between the second part 442 of the cathode 44 and the top surface of the metal part. Compared with the insulating part 431 made of organic insulating material, the inorganic layer 4313 made of inorganic insulating material can achieve insulation between the second part 442 of the cathode 44 and the metal part. In the manufacturing process of the display panel 10, the inorganic layer 4313 made of inorganic insulating material will not have the problem of heat shrinkage. The inorganic layer 4313 can better cover the top surface of the metal part, avoid the electrical connection between the second part 442 of the cathode 44 and the metal part, and further avoid the first part 441 and the second part 442 of the cathode 44 are connected in series through the metal part, thereby reducing the risk of electrochemical corrosion of the isolation area 4, and the packaging effect of the isolation area 4 is better.

[0253] It can be understood that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0254] It is understood that all the above drawings are exemplary illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0255] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: It includes a display area, an isolation area and an opening area, wherein the isolation area is connected between the display area and the opening area; The isolation region includes a first substrate, an insulating isolation column and a cathode, wherein the cathode includes a first portion and a second portion, wherein the first portion of the cathode is disposed on the first substrate, and the second portion of the cathode is disposed on a side of the insulating isolation column away from the first substrate, and the insulating isolation column is used to separate the first portion of the cathode from the second portion of the cathode; The insulating isolation column includes a first metal part and an insulating part, the first metal part and the insulating part are used to separate the first part of the cathode and the second part of the cathode, the first metal part is arranged on the first substrate, the insulating part is arranged between the second part of the cathode and the first metal part, the insulating part includes an inorganic layer, the inorganic layer adopts an inorganic insulating material, and the inorganic layer is arranged between the second part of the cathode and the first metal part.

2. The display panel according to claim 1, characterized in that: The inorganic layer is disposed between the second portion of the cathode and the first metal portion and includes: The inorganic layer is disposed between the second portion of the cathode and the top surface of the first metal portion; and / or The inorganic layer is disposed between the second portion of the cathode and the first side surface of the first metal portion, and the top surface of the first metal portion is connected to the first side surface of the first metal portion.

3. The display panel according to claim 1 or 2, characterized in that: The insulating part also includes an organic layer, which is connected to the inorganic layer and uses an organic insulating material. The inorganic layer is arranged between the second part of the cathode and the top surface of the first metal part, and the organic layer is arranged between the second part of the cathode and the first side surface of the first metal part.

4. The display panel according to claim 3, characterized in that: The first metal part further includes a second side surface, the first side surface of the first metal part and the second side surface of the first metal part are spaced apart, and the top surface of the first metal part is connected between the first side surface of the first metal part and the second side surface of the first metal part; The first metal part is provided with a groove, the opening of the groove is located at the second side surface of the first metal part, and the first part of the cathode and the second part of the cathode are disconnected at the groove.

5. The display panel according to claim 3 or 4, characterized in that: The insulating isolation column further includes a second metal portion, the first metal portion and the second metal portion are arranged on the first substrate at intervals, and the second metal portion is arranged on a side of the first metal portion close to the display area; The inorganic layer is arranged between the second portion of the cathode and the top surface of the first metal part and between the second portion of the cathode and the top surface of the second metal part, and the organic layer is arranged between the second portion of the cathode and the first side surface of the first metal part, between the second portion of the cathode and the first side surface of the second metal part, and between the second portion of the cathode and the first substrate.

6. The display panel according to any one of claims 3 to 5, characterized in that: In a direction from the first substrate toward the insulating spacer, a distance from a top surface of the organic layer to the first substrate is greater than a distance from a top surface of the first metal portion to the first substrate.

7. The display panel according to claim 5, characterized in that: The second side of the first metal part, the organic layer and the second side of the second metal part are arranged at intervals from each other, and in the direction from the opening area toward the display area, the organic layer is arranged between the second side of the first metal part and the second side of the second metal part.

8. The display panel according to any one of claims 3 to 7, characterized in that: The inorganic layer is made of silicon oxide or silicon nitride; and / or the organic layer is made of polyimide, polyamide, polyacrylamide or phenolic resin.

9. The display panel according to any one of claims 1 to 8, characterized in that: The inorganic layer is disposed on the same layer as the gate insulating layer, the first interlayer insulating layer, the second interlayer insulating layer or the third interlayer insulating layer of the display area.

10. The display panel according to any one of claims 1 to 8, characterized in that: The insulating isolation column further includes an insulating protection layer, the insulating protection layer and the inorganic layer are spaced apart, and the insulating protection layer is disposed between the first portion of the cathode and the first metal portion.

11. The display panel according to any one of claims 1 to 10, characterized in that: The insulating isolation column further includes a padding layer, wherein the padding layer is disposed between the first metal portion and the first substrate, and the inorganic layer is disposed on a side of the first metal portion away from the padding layer.

12. The display panel according to any one of claims 1 to 11, characterized in that: The isolation region further includes a metal isolation column, which is disposed on the first substrate and spaced apart from the first metal portion and the insulating portion. The cathode further includes a third portion, and the metal isolation column is used to disconnect the first portion and the third portion of the cathode. A notch is provided on the side of the metal isolation column, the third part of the cathode is arranged on a surface of the metal isolation column away from the first substrate, and the first part of the cathode and the third part of the cathode are disconnected at the notch.

13. The display panel according to any one of claims 1 to 12, characterized in that: The display panel also includes a fan-out area, which is connected between the isolation area and the display area. The fan-out area includes a second substrate, a fan-out wiring and an insulating layer. The insulating layer is arranged on the second substrate of the fan-out area, and the fan-out wiring is embedded in the insulating layer.

14. The display panel according to claim 13, characterized in that: The insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer, a fourth insulating layer, a fifth insulating layer and a sixth insulating layer which are stacked in sequence, and the first insulating layer is arranged on the second substrate of the fan-out region; The fan-out routing includes a first fan-out routing, a second fan-out routing, a third fan-out routing, a fourth fan-out routing, a fifth fan-out routing and a sixth fan-out routing which are arranged at intervals, wherein the first fan-out routing is embedded in the first insulating layer, the second fan-out routing is embedded in the second insulating layer, the third fan-out routing is embedded in the third insulating layer, the fourth fan-out routing is embedded in the third insulating layer, the fifth fan-out routing is embedded in the fifth insulating layer, and the sixth fan-out routing is embedded in the sixth insulating layer.

15. A display module, characterized in that: The invention comprises a cover plate and the display panel according to any one of claims 1 to 14, wherein the cover plate is stacked on the display panel.

16. An electronic device, characterized in that: It comprises a housing and the display module as claimed in claim 15, wherein the display module is mounted on the housing.

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