Alignment apparatus, film forming apparatus, alignment method, method for manufacturing electronic device, program, and storage medium

Abstract

The alignment device aligns a substrate and a mask using a substrate mark provided on the substrate and a mask mark provided on the mask. The plurality of detection members detect the substrate mark and the mask mark. The determination means determines the amount of adjustment in the relative position adjustment of the substrate and the mask using the detection results of the plurality of detection means. The position adjustment means adjusts the relative position of the substrate and the mask on the basis of the adjustment amount determined by the determination means. The determination means determines the adjustment amount on the basis of the detection results of the detection means other than a portion of the detection means, even if the substrate mark or the mask mark is not detected by the portion of the detection means among the plurality of detection means.

Description

Technical Field

[0001] The present invention relates to an alignment device, a film forming device, an alignment method, a method for manufacturing an electronic device, a program and a storage medium. Background Art

[0002] In the manufacture of an organic EL display device (organic EL display) and the like, when a deposition material is deposited on a substrate using a deposition mask, the substrate and the mask are aligned. Patent document 1 proposes that when a plurality of cameras are used to photograph alignment marks provided on a substrate or a mask, detection processing is repeatedly performed on cameras that cannot detect the marks until the marks can be detected.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-010504 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, in the above-mentioned conventional technology, when it is difficult to detect the alignment mark by any camera, the time required for alignment may be prolonged, which may result in a decrease in the productivity of the organic EL display device.

[0008] The present invention provides a technology for suppressing the time required for alignment between a substrate and a mask.

[0009] Means for solving problems

[0010] An alignment device as one aspect of the present invention uses a substrate mark provided on a substrate and a mask mark provided on a mask to align the substrate and the mask, and is characterized in that the alignment device comprises: a plurality of detection components, which detect the substrate mark and the mask mark; a determination component, which uses the detection results of the plurality of detection components to determine an adjustment amount in the relative position adjustment of the substrate and the mask; and a position adjustment component, which adjusts the relative position of the substrate and the mask based on the adjustment amount determined by the determination component, and the determination component determines the adjustment amount based on the detection results of detection components other than some of the plurality of detection components even when the substrate mark or the mask mark is not detected by the detection components of the some of the detection components.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to prevent the alignment between the substrate and the mask from taking a long time.

[0013] Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the accompanying drawings, the same or similar structures are denoted by the same reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0015] Figure 1 It is a plan view schematically showing a part of the structure of an electronic device manufacturing apparatus according to one embodiment.

[0016] Figure 2 It is a cross-sectional view schematically showing the structure of a film forming apparatus according to one embodiment.

[0017] Figure 3 This is a perspective view of a substrate holding unit according to an embodiment.

[0018] Figure 4 It is shown Figure 2 A diagram showing an example of the hardware configuration of a film forming apparatus.

[0019] Figure 5A It is a plan view showing a structural example of a mask and a substrate.

[0020] Figure 5B It is a top view showing a structural example of a mask and a substrate.

[0021] Figure 5C It is a plan view showing a structural example of a mask and a substrate.

[0022] Figure 6 This is a diagram schematically showing an outline of an alignment process performed by a film forming apparatus.

[0023] Figure 7 This is a diagram for explaining an example of a fine alignment process.

[0024] Figure 8 It is a flowchart which shows the process example of a processing part.

[0025] Fig. 9 It is a flowchart which shows the process example of a processing part.

[0026] Fig. 10A This is a diagram for explaining a method of determining an adjustment amount when a marker can be detected by three cameras.

[0027] Fig. 10B This is a diagram for explaining a method of determining an adjustment amount when a marker can be detected by two cameras.

[0028] Fig. 10C This is a diagram for explaining a method of determining an adjustment amount when a marker can be detected by two cameras.

[0029] Fig.11 It is a figure which shows the display example of a display part.

[0030] Fig. 12A This is an overall diagram of an organic EL display device.

[0031] Fig. 12B is a diagram showing a cross-sectional structure of one pixel. DETAILED DESCRIPTION

[0032] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the technical solutions involved in the claims. In addition, all combinations of the features described in the embodiments are not necessary for the invention. Two or more of the multiple features described in the embodiments may also be combined arbitrarily. In addition, the same or similar structures are marked with the same figure marks, and repeated descriptions are omitted.

[0033] In the following description, the X direction and the Y direction represent orthogonal horizontal directions, and the Z direction represents the vertical direction. In addition, the width direction (the direction parallel to the short side) of the substrate during film formation is set to the X direction, and the length direction (the direction parallel to the long side) is set to the Y direction. In addition, θ is used to represent the rotation angle around the Z axis. In addition, in the following description, the case where the shape of the substrate is a rectangle is described, but the shape of the substrate is not limited to a rectangle. In the case where the shape of the substrate is not a rectangle, it is sufficient to set the two orthogonal directions within the processed surface of the substrate to the X direction and the Y direction.

[0034] <First embodiment>

[0035] <Manufacturing equipment>

[0036] Figure 1 It is a plan view schematically showing a part of the structure of an electronic device manufacturing apparatus 100 according to one embodiment. Figure 1 The manufacturing apparatus 100 is used, for example, for manufacturing a display panel of an organic EL display device. In the case of a display panel for a smartphone, for example, a sixth-generation full-size (approximately 1850 mm × approximately 1500 mm) or half-cut size (approximately 1500 mm × approximately 925 mm) substrate 5 (see Figure 2 ) is used to form a film for forming an organic EL, and then the substrate 5 is cut to produce a plurality of small-sized panels.

[0037] exist Figure 1In the example, the manufacturing apparatus 100 has a structure in which a plurality of cluster units (CU1, CU2, CU3 (not shown) ...) are connected via a connecting chamber. The cluster unit refers to a film forming unit having a structure in which a plurality of film forming chambers are arranged around a conveying robot serving as a substrate conveying component. Figure 1 The structure of cluster units CU1, CU2 and connecting chambers CN1, CN2, which are part of the plurality of cluster units of the manufacturing device 100, is shown in FIG. 1 , but other cluster units and connecting chambers not shown in the figure also have the same structure. In addition, for example, a substrate storage device, a heating device, a pre-processing device such as a cleaning device, etc. may be provided upstream of the film forming unit, or a sealing device, a processing device, a storage device for processed substrates, etc. may be provided downstream of the film forming unit, or they may be combined as a whole to form a manufacturing device for electronic devices.

[0038] The cluster unit CU1 has a conveying chamber TR1 arranged in the center of the unit and a plurality of film forming chambers EV11~EV14 and mask chambers MS11~MS12 arranged around the conveying chamber TR1. Two adjacent units CU1 and CU2 are connected by a connecting chamber CN1, and similarly, two adjacent units CU2 and CU3 (not shown) are connected by a connecting chamber CN2. More specifically, the conveying chambers TR1 and TR2 of the units CU1 and CU2 are connected by a connecting chamber CN1, and the conveying chambers TR2 and TR3 (not shown) of the units CU2 and CU3 (not shown) are connected by a connecting chamber CN2. The chambers TR1, EV11~EV14, MS11~MS12 and the connecting chamber CN1 in the cluster unit CU1 are spatially connected, and the interior thereof is maintained in a vacuum or an inert gas atmosphere such as nitrogen. In the present embodiment, each chamber constituting the unit CUx and the connecting chamber CNx is connected to a vacuum pump (vacuum exhaust component) not shown, and can be vacuum exhausted independently. Each chamber is also referred to as a “vacuum chamber” or simply a “chamber.” In the present specification, “vacuum” refers to a state filled with a gas having a pressure lower than the atmospheric pressure, in other words, a reduced pressure state.

[0039] A conveying robot RR1 as a conveying component for conveying the substrate 5 and the mask 3 is provided in the conveying chamber TR1. The conveying robot RR1 is, for example, a multi-joint robot having a structure in which a manipulator for holding the substrate 5 and the mask 3 is installed on a multi-joint arm. In the cluster unit CU1, the substrate 3 is conveyed by conveying components such as the conveying robot RR1 and the conveying robot RC1 described later, while keeping the processed surface (film-forming surface) of the substrate 3 in a horizontal state facing downward in the direction of gravity. The manipulators of the conveying robots RR1 and RC1 have a holding portion to hold the peripheral area of ​​the processed surface of the substrate 3. The conveying robot RR1 conveys the substrate 3 between the passage chamber PS0 on the upstream side, the film-forming chambers EV11 to EV14, and the buffer chamber BC1 on the downstream side. In addition, the conveying robot RR1 conveys the mask 3 between the mask chamber MS11 and the film-forming chambers EV11 and EV13, and conveys the mask 3 between the mask chamber MS12 and the film-forming chambers EV13 and EV14. The manipulators of the conveying robots RR1 and RC1 are configured to perform predetermined actions according to the predetermined programs stored in the conveying control unit. The actions of each robot are set to efficiently convey multiple substrates when films are formed on multiple substrates sequentially or simultaneously in multiple film forming chambers or multiple units. In addition, the position of the substrate on the conveying path may sometimes deviate from the ideal conveying position due to errors in the movements of the manipulator caused by changes in the bending of the arm, etc. In order to fine-tune the movements of the manipulator, the program that determines the movements of the manipulator is corrected as needed.

[0040] Two mask stockers are provided in each of the mask chambers MS11 and MS12. One mask stocker provided in each chamber stores masks 3 before use, and the other mask stocker stores used masks 3. Mask chamber MS11 stores masks 3 before use in film formation in film formation chambers EV11 and EV13 and masks 3 after use, and mask chamber MS12 stores masks 3 used in film formation chambers EV12 and EV14.

[0041] Film forming chambers EV11 to EV14 are chambers for forming a material layer on the surface of the substrate 5. Here, film forming chambers EV11 and EV13 are chambers having the same function (chambers capable of performing the same film forming process), and similarly, film forming chambers EV12 and EV14 are also chambers having the same function. According to this structure, the film forming process in the first path such as film forming chamber EV11→EV12 and the film forming process in the second path such as film forming chamber EV13→EV14 can be performed in parallel.

[0042] The connection chamber CN1 has the function of connecting the unit CU1 and the unit CU2 and delivering the substrate 5 after film formation in the unit CU1 to the unit CU2 in the rear section. The connection chamber CN1 of the present embodiment is composed of a buffer chamber BC1, a rotation chamber TC1 and a passage chamber PS1 in sequence from the upstream side. However, the structure of the connection chamber CN1 is not limited to this, and the connection chamber CN1 can also be composed of only the buffer chamber BC1 or the passage chamber PS1.

[0043] The buffer chamber BC1 is a chamber for transferring substrates 5 between the conveying robot RR1 in the unit CU1 and the conveying robot RC1 in the connection chamber CN1. The buffer chamber BC1 has the following functions: when there is a difference in processing speed between the unit CU1 and the unit CU2 in the subsequent stage, or when the substrate 5 cannot be conveyed as usual due to a failure on the downstream side, the substrate 5 can be temporarily stored to adjust the speed and timing of the substrate 5 being transported. For example, a multi-layer substrate storage shelf (also called a box body) capable of storing multiple substrates 5 in a horizontal state with the processed surface of the substrate 5 facing downward in the direction of gravity and a lifting mechanism for lifting the substrate storage shelf in order to align the layer of the substrate 5 being transported in or out with the transport position are provided in the buffer chamber BC1.

[0044] The turning chamber TC1 is a chamber for rotating the orientation of the substrate 5 by 180 degrees. A conveying robot RC1 for delivering the substrate 5 from the buffer chamber BC1 to the passage chamber PS1 is provided in the turning chamber TC1. When the end on the upstream side of the substrate 5 is referred to as the "rear end" and the end on the downstream side is referred to as the "front end", the conveying robot RC1 rotates 180 degrees while supporting the substrate 5 obtained in the buffer chamber BC1 and delivers it to the passage chamber PS1, thereby exchanging the front end and the rear end of the substrate 5 in the buffer chamber BC1 and in the passage chamber PS1. Thus, the orientation of the substrate 5 when it is moved into the film forming chamber can be the same in the unit CU1 on the upstream side and the unit CU2 on the downstream side. As a result, the scanning direction of the film forming relative to the substrate 5 and the orientation of the mask 3 can be made consistent in each unit CUx, which can simplify the management of the mask M and improve the usability.

[0045] The passage chamber PS1 is a chamber for transferring the substrate 5 between the conveying robot RC1 in the connection chamber CN1 and the conveying robot RR2 in the unit CU2 on the downstream side. In the present embodiment, the alignment of the substrate 5 is performed in the passage chamber PS1. The substrate 5 is conveyed by the conveying robot RR1 and the conveying robot RC1, but the position of the substrate may be offset during the conveyance of the substrate or when the substrate is transferred. Therefore, by aligning the position of the substrate 5 in the passage chamber PS1 so as to align it with the ideal position, the position accuracy of the substrate when it is moved into each film forming chamber of the unit CU2 on the downstream side can be improved. As a result, the accuracy of the alignment in the film forming chamber can be improved, or the production cycle time required for the alignment can be shortened.

[0046] Between the film forming chambers EV11 to EV14 , the mask chambers MS11 to MS12 , the transfer chamber TR1 , the buffer chamber BC1 , the rotation chamber TC1 , and the passage chamber PS1 , openable and closable doors (such as gate valves or gate valves) may be provided, or a structure that is always open may be provided.

[0047] Each of the film forming chambers EV11 to EV14 is provided with a film forming device 10 (evaporation device). The film forming device 10 automatically receives and delivers the substrate 5 from the transfer robot RR1, and performs the substrate 5 and the mask 3 (see Figure 2 ) relative position adjustment (alignment), substrate 5 fixed to mask 3, film formation (evaporation) and a series of processes. In addition, although the film forming device 10 in each film forming chamber EV11~EV14 has an evaporation source (refer to Figure 2 ), and the mask 3 are different, but the main structure is common. The details of the film forming apparatus 10 will be described in <Film forming apparatus>.

[0048] In addition, the manufacturing device 100 is not limited to the display panel of the above-mentioned organic EL display device, and can be used to manufacture products of thin films (material layers) of desired patterns formed on the surface of the substrate by various film forming methods such as vacuum evaporation, sputtering, CVD, etc. during the manufacturing process. Specifically, the manufacturing device 100 can be used for the manufacture of organic electronic devices such as thin-film solar cells and organic photoelectric conversion elements (organic thin-film imaging elements), optical components, etc. In addition, as the material of the substrate 5 for film formation in the film forming device 10, materials such as glass, resin, and metal can be appropriately selected, and it is preferred to use a material having a resin layer such as polyimide formed on glass. In addition, as the evaporation material, organic materials, inorganic materials, etc. can be appropriately selected.

[0049] <Film forming equipment>

[0050] Figure 2 2 is a cross-sectional view schematically showing the structure of a film forming apparatus 10 according to one embodiment. Figure 31 is a perspective view of a substrate holding unit 13 according to an embodiment. The film forming device 10 is a device for forming a film in a predetermined pattern on the substrate 5 by evaporating a deposition material onto the substrate 5 using a mask 3. In this embodiment, the film forming device 10 includes a chamber 11, an evaporation source 12, a substrate holding unit 13, and a position adjustment mechanism 14 (see Figure 4 ), mask stage 15, detection unit 16 and cooling unit 17.

[0051] The chamber 11 maintains its interior in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. An evaporation source 12 , a substrate holding unit 13 , a mask stage 15 , and a cooling unit 17 are mainly provided inside the chamber 11 .

[0052] The evaporation source 12 is a film forming component that forms a film on the substrate 5 by evaporating or sublimating the evaporation material in the chamber 11 maintained in a vacuum atmosphere or an inert gas atmosphere. For example, the evaporation source 12 may include a heat source such as a heater for heating the evaporation material and evaporating it, a container for storing the evaporation material, and an evaporation monitor for monitoring the evaporation rate. In this embodiment, the evaporation source 12 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction and the evaporation material is discharged from each nozzle. The evaporation source 12 is reciprocated in the Y direction by an evaporation source moving mechanism (not shown).

[0053] The substrate holding unit 13 holds and transports the substrate 5 in the chamber 11 . In the present embodiment, the substrate holding unit 13 includes a support frame 131 , a substrate actuator 132 , a clamping member 133 , and a clamping actuator 134 .

[0054] The support frame 131 supports the substrate 5. In one embodiment, the support frame 131 has: a frame portion 1311, the frame portion 1311 is configured to surround the substrate 5 when supporting the substrate 5; and a plurality of support portions 1312, the plurality of support portions 1312 extend from the frame portion 1311 toward the inner side of the frame portion 1311 and support the vicinity of four sides of the substrate 5 (near a pair of short sides and near a pair of long sides) from the lower side. The substrate actuator 132 is configured to be connected to the frame portion 1311, and moves the support frame 131 in the up-down direction (Z direction) to move the substrate 5 supported by the support frame 131 up-down. In addition, in Figure 3 In the example, the frame 1311 is set to be a rectangular frame without gaps, such as surrounding the outer periphery of the rectangular substrate 5, but it is not limited to this, and it can also be a rectangular frame with a cutout partially. As a result, when the substrate 5 is handed over from the conveying robot RR1 to the supporting portion 1312 of the substrate holding unit 13, the conveying robot RR1 can avoid the frame 1311 and retreat. Therefore, the efficiency of conveying and handing over the substrate 5 can be improved.

[0055] The clamping member 133 holds the substrate 5 together with the support frame 131. Specifically, the clamping member 133 includes: a plurality of pressing members 1331, each of which is provided corresponding to the position of a plurality of supporting portions 1312 supporting the vicinity of the long side of the substrate 5 (hereinafter sometimes referred to as "long side"); and a base 1332, each of which is provided along each long side of the substrate 5 and supports the pressing members 1331, and the clamping member 133 presses the pressing members 1331 against the supporting portion 1312. Thus, the substrate 5 is clamped between the pressing members 1331 and the supporting portion 1312. The clamping actuator 134 moves the clamping member 133 in the up-down direction. Thus, the support frame 131 and the clamping member 133 clamp the substrate 5 or release it from the clamped state. In addition, the clamping actuator 134 can be configured to move in the up-down direction together with the support frame 131 by using the substrate actuator 132, so that even if the support frame 131 rises or falls, the clamping state of the substrate 5 does not change. In addition, the support portion 1312 is sometimes referred to as a "receiving claw" or "finger", and the pressing member 1331 is sometimes referred to as a "clamping member".

[0056] Position adjustment mechanism 14 (see Figure 4 ) to adjust the relative position of the substrate 5 and the mask 3. Specifically, the position adjustment mechanism 14 adjusts the relative position of the substrate 5 and the mask 3 in the XY direction and the relative angle around the Z axis. In the present embodiment, the position adjustment mechanism 14 includes an actuator for moving the substrate holding unit 13 along the X direction, an actuator for moving the substrate holding unit 13 along the Y direction, and an actuator for rotating the substrate holding unit 13 around the Z axis (none of which are shown in the figure). Thus, the position adjustment mechanism 14 performs position adjustment by moving the substrate holding unit 13 holding the substrate 5 while maintaining the position of the mask 3. However, the position adjustment mechanism 14 may also adjust the relative position of the substrate 5 by moving the mask 3 while maintaining the position of the substrate 5 or by moving both the substrate 5 and the mask 3.

[0057] Here, the film forming apparatus 10 of the present embodiment performs two-stage alignment of rough alignment and fine alignment as alignment between the substrate 5 and the mask 3 by means of the position adjustment mechanism 14. The rough alignment is a rough position adjustment of the substrate 5 and the mask 3, and the fine alignment is a high-precision position adjustment of the substrate 5 and the mask 3 with a higher accuracy than the rough alignment. The details of these will be described later.

[0058] The mask stage 15 is a stage for supporting a mask in the chamber 11, and is provided below the substrate holding unit 13 and above the evaporation source 12. During film formation, the substrate 5 is placed on the mask 3 supported by the mask stage 15.

[0059] The detection unit 16 detects the alignment marks provided on the substrate 5 and the mask 3. In the present embodiment, the detection unit 16 includes a plurality of cameras 1601 and 1602 for detecting the rough alignment marks and a plurality of cameras 1611 to 1614 for detecting the fine alignment marks. The cameras 1601 and 1602 respectively capture a predetermined area near the center of the short side of the substrate 5 and detect the mask marks 301 and 302 and the substrate marks 501 and 502 (see Figure 5A to Figure 5C ) is detected. In addition, cameras 1611 to 1614 respectively capture a predetermined area near the corner of substrate 5, and respectively detect mask marks 311 to 314 and substrate marks 511 to 514 (refer to Figure 5A to Figure 5C ) for detection. In addition, in the following description, sometimes cameras 1601 and 1602 are collectively referred to as coarse cameras 160, and cameras 1611 to 1614 are collectively referred to as fine cameras 161. In addition, the detection unit 16 is not limited to a camera, and the mark can also be detected by other optical methods.

[0060] The cooling unit 17 cools the substrate 5 and suppresses the temperature rise, thereby suppressing the change and degradation of the organic material. In the present embodiment, the cooling unit 17 includes a cooling plate 170 and a cooling plate actuator 171 .

[0061] The cooling plate 170 is a plate-shaped member for cooling the substrate 5, and has, for example, a size that is approximately the same as the area of ​​the substrate 5 on which the film is formed by the evaporation source 12. For example, the cooling plate 170 is arranged so as to be located on the upper side of the substrate 5 held by the substrate holding unit 13, and cools the substrate 5 by contacting the surface of the substrate 5 on the side opposite to the surface on which the film is formed. In addition, the cooling plate 170 may also be used as a magnet plate for attracting the mask 3 to the substrate 5 by magnetic force to improve the adhesion between the substrate 5 and the mask 3. In addition, a structure in which the magnet plate is provided separately from the cooling plate 170 may also be adopted. In addition, the cooling plate 170 is not limited to actively cooling the substrate 5 by a water cooling mechanism or the like, and may also be a plate-shaped member that absorbs the heat of the substrate 5 by contacting the substrate 5 even though a water cooling mechanism or the like is not provided. The cooling plate 170 may also be called a pressing plate.

[0062] The cooling plate actuator 171 moves the cooling plate 170 in the vertical direction (Z direction). When the cooling plate 170 and the magnet plate are provided separately, an actuator for moving the magnet plate in the vertical direction may be provided separately so that they can move independently.

[0063] <Control structure>

[0064] Figure 4 It is shown Figure 2 FIG. 1 is a diagram showing an example of a hardware configuration of the film forming apparatus 10. Figure 4, the structure related to the alignment between the substrate 5 and the mask 3 is mainly shown. For example, the film forming apparatus 10 performs a predetermined operation based on an instruction from a host computer H that performs overall control of the manufacturing apparatus 100.

[0065] The control unit 18 includes a processing unit 181, a storage unit 182, and an I / F unit 183 (interface unit), which are connected to each other via a bus not shown. The processing unit 181 is, for example, a CPU. The processing unit 181 controls the driving of the position adjustment mechanism 14 and various actuators 20 by executing the program stored in the storage unit 182. The storage unit 182 is, for example, a RAM, a ROM, a hard disk, etc., and in addition to storing the program executed by the processing unit 181, it also stores various data. The I / F unit 183 relays the transmission and reception of signals between the processing unit 181 and the external device. The I / F unit 183 is composed of, for example, a communication I / F and an input / output I / F.

[0066] The display unit 19 displays various information. In addition, the various actuators 20 may include the substrate actuator 132, the clamping actuator 134, the cooling plate actuator 171, and the like.

[0067] <Substrate and mask>

[0068] Figure 5A ~C is a top view showing a structural example of the mask 3 and the substrate 5, Figure 5A A single body of mask 3 is shown, Figure 5B A single body of the substrate 5 is shown, Figure 5C 3 shows a state where the mask 3 overlaps with the substrate 5. Figure 5C In FIG. 1 , regions R1 to R6 represent the detection areas of cameras 1611 to 1614, 1601, and 1602, respectively. Figure 5A ~C In order to facilitate understanding, each mark is emphasized and shown, and therefore, it is different from the actual size.

[0069] The mask 3 is used to deposit the evaporation material on the substrate 5 in a desired pattern. An opening of a predetermined pattern is formed in the region of the mask 3 that overlaps with the substrate 5 (in Figure 5A The evaporation material is deposited on the substrate 5 in a pattern corresponding to the opening by performing evaporation while the surface of one side of the substrate 5 is covered by the mask 3. In addition, as the mask 3, a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame can be used. The material of the mask 3 is not particularly limited, but it is preferable to use a metal with a small thermal expansion coefficient such as an Invar alloy material.

[0070] In addition, the mask 3 is provided with mask marks 301 and 302 for rough alignment and mask marks 311 to 314 for fine alignment. The mask marks 301 and 302 are respectively provided near the center of the short side of the mask 3 and are detected by the corresponding cameras 1601 and 1602. The mask marks 311 to 314 are respectively provided near the corners of the mask 3 and are detected by the corresponding cameras 1611 to 1614. In addition, in the following description, the mask marks 301 and 302 are sometimes collectively referred to as the rough mask marks 30, and the mask marks 311 to 314 are sometimes collectively referred to as the fine mask marks 31. That is, the rough mask marks 30 are detected by the rough camera 160, and the fine mask marks 31 are detected by the fine camera 161.

[0071] The substrate 5 is a member on which a deposition substance is to be vapor-deposited, and has a transparency that allows light to be transmitted by the detection unit 16. When the substrate 5 is transported into the chamber 11 by the transport robot RR1, the substrate 5 is held by the substrate holding unit 13, and the position between the substrate 5 and the mask 3 is adjusted by the position adjustment mechanism 14. In addition, by making the substrate 5 transparent, the detection unit 16 can detect the mask marks 30 and 31 even if the substrate 5 is arranged between the mask 3 and the detection unit 16.

[0072] The substrate 5 is provided with substrate marks 501 and 502 for rough alignment and substrate marks 511 to 514 for fine alignment. The substrate marks 501 and 502 are respectively provided near the center of the short side of the substrate 5 and are detected by the corresponding cameras 1601 and 1602. The substrate marks 511 to 514 are respectively provided near the corners of the substrate 5 and are detected by the corresponding cameras 1611 to 1614. In addition, in the following description, the substrate marks 501 and 502 are sometimes collectively referred to as the substrate rough mark 50, and the substrate marks 511 to 514 are sometimes collectively referred to as the substrate fine mark 51. That is, the substrate rough mark 50 is detected by the rough camera 160, and the substrate fine mark 51 is detected by the fine camera 161.

[0073] In the present embodiment, the substrate marks 50 and 51 are respectively composed of position detection marks 50a and 51a and angle detection marks 50b and 51b. However, it is also possible to adopt a structure in which they are integrated and only the position of each substrate mark 50 and 51 is detected. Alternatively, it is also possible that the substrate fine mark 51 is composed of the position detection mark 51a and the angle detection mark 51b, and the substrate rough mark 50 is composed of only the position detection mark 50a. In other words, it is also possible that either one of the substrate marks 50 and 51 is composed of the position detection mark and the angle detection mark, and the other is composed of only the position detection mark.

[0074] In addition, in the present embodiment, in the rough alignment, the relative positions of the substrate 5 and the mask 3 are adjusted so that the positional relationship between the substrate rough marks 50 and the corresponding mask rough marks 30 satisfies the prescribed conditions. In addition, in the fine alignment, the relative positions of the substrate 5 and the mask 3 are adjusted so that the positional relationship between the substrate fine marks 51 and the corresponding mask fine marks 31 satisfies the prescribed conditions.

[0075] <Overview of the alignment process>

[0076] Figure 6 Schematically showing the outline of the alignment process performed by the film forming apparatus 10. States ST1 to ST2 show the state before alignment is performed, state ST3 shows the state in which rough alignment is being performed, and states ST4 to ST8 show the state in which fine alignment is being performed.

[0077] State ST1 shows a state where the substrate 5 is carried into the chamber 11 by the transfer robot RR1. In this state, the substrate 5 is placed on the support frame 131, but the clamping member 133 is separated above the substrate 5. Therefore, the substrate 5 is not clamped. In addition, the central portion of the substrate 5 is bent due to its own weight.

[0078] State ST2 shows a state where the substrate 5 is clamped by the support frame 131 and the clamping member 133. Specifically, the support frame 131 and the clamping member 133 clamp the long side of the substrate 5 by moving the clamping member 133 downward from state ST1 by the clamping actuator 134.

[0079] State ST3 shows a state in which rough alignment is being performed. Specifically, the rough camera 160 detects the substrate rough mark 50 and the mask rough mark 30, and the position adjustment mechanism 14 adjusts the position of the substrate 5 in the XY direction and the rotation angle θ around the Z axis based on the detection result. In addition, after the adjustment based on the position adjustment mechanism 14, the rough camera 160 may be used to detect the substrate rough mark 50 and the mask rough mark 30 again, and if the detection result does not meet the conditions, the position adjustment based on the position adjustment mechanism 14 may be performed again.

[0080] State ST4 and later show the state in which fine alignment is being performed. State ST4 shows the state in which the substrate holding unit 13 is lowered by the substrate actuator 132 and the substrate fine mark 51 and the mask fine mark 31 are detected by the fine camera 161. In addition, when the detection result satisfies the conditions, states ST5 and ST6 can also be omitted. Here, in order to improve the accuracy of the position adjustment based on the alignment, it is required to improve the detection accuracy of each mark by the detection unit 16. Therefore, as the fine camera 161 used in the fine alignment requiring position adjustment with high accuracy, it is preferable to use a camera that can obtain images with high resolution. However, if the resolution of the camera is increased, the depth of field becomes shallower. Therefore, in order to simultaneously capture the mark formed on the substrate 5 and the mark formed on the mask 3 that become the shooting object, it is necessary to bring the two marks closer in the optical axis direction of the fine camera 161. Therefore, in the present embodiment, when detecting the substrate fine mark 51 and the mask fine mark 31 in the fine alignment, the substrate 5 is brought closer to the mask 3 than when detecting the substrate coarse mark 50 and the mask coarse mark 30 in the coarse alignment. At this time, as Figure 6 As shown in state ST4, the substrate 5 is partially in contact with the mask 3. Since the peripheral region of the substrate 5 is supported, the central portion of the substrate 5 is bent due to its own weight. Therefore, typically, the central portion of the substrate 5 is partially in contact with the mask 3.

[0081] Furthermore, in the rough alignment, e.g. Figure 6 As shown in state ST3, the substrate rough mark 50 and the mask rough mark 30 are detected and the positions of the substrate 5 and the mask 3 are adjusted in a state where the substrate 5 is separated from the mask 3. In the rough alignment, by using the rough camera 160 with a deep depth of field, it is possible to perform alignment in a state where the substrate 5 is separated from the mask 3. In the present embodiment, after roughly adjusting the position in a state where the substrate 5 is separated from the mask 3 by rough alignment in this way, fine alignment with higher accuracy of position adjustment is performed. Thus, when the substrate 5 and the mask 3 are brought close to and in contact in order to detect the mark in the fine alignment, since the relative positions of the substrate 5 and the mask 3 have been adjusted to a certain extent, the pattern of the film formed on the substrate 5 and the opening pattern of the mask 3 are in contact in a state where they are neatly arranged to a certain extent. Therefore, it is possible to reduce the damage to the film formed on the substrate 5 due to the contact between the substrate 5 and the mask 3. That is, by combining and performing rough alignment for roughly adjusting the position while the substrate 5 and the mask 3 are separated and fine alignment including a process of bringing the substrate 5 and the mask 3 into partial contact as in the present embodiment, it is possible to reduce damage to the film formed on the substrate 5 and achieve high-precision position adjustment.

[0082] State ST5 shows a state where the position of the substrate 5 is adjusted based on the detection result of the camera 161. Specifically, after the substrate actuator 132 raises the substrate holding unit 13 to separate the substrate 5 from the mask 3, the position adjustment mechanism 14 adjusts the position of the substrate 5 in the XY direction and the rotation angle θ around the Z axis.

[0083] State ST6 shows a state where the substrate 5 is brought close to the mask 3 again and the substrate mark 51 and the mask mark 31 are detected by the camera 161 while the substrate 5 is in contact with the mask 3. If the detection result satisfies the condition, the state ST7 is entered, and if not, the state ST5 is returned.

[0084] State ST7 shows a state where the substrate 5 is placed on the mask 3 and the cooling plate 170 is overlapped thereon. Specifically, after the substrate holding unit 13 is lowered by the substrate actuator 132 to place the substrate 5 on the mask 3, the cooling plate 170 is lowered by the cooling plate actuator 171 to make the cooling plate 170 contact the substrate 5.

[0085] State ST8 shows the state in which the final position confirmation is performed by the camera 161. After the substrate 5 is clamped by the mask 3 and the cooling plate 170 in state ST7, the clamping member 133 is moved upward by the clamping actuator 134, so that the clamping member 133 is separated from the substrate 5, and the clamping state of the long side of the substrate 5 is released. Thereafter, the substrate holding unit 13 is lowered by the substrate actuator 132, so that the plurality of support portions 1312 of the support frame 131 in contact with the peripheral area of ​​the substrate 5 are separated from the substrate 5. Thus, the substrate 5 is separated from the substrate holding unit 13 and becomes clamped by the mask 3 and the cooling plate 170. In this state, the substrate fine mark 51 and the mask fine mark 31 are detected by the fine camera 161 to confirm whether their positional relationship satisfies the conditions. If their positional relationship satisfies the conditions, the alignment of the substrate 5 and the mask 3 is terminated. If the conditions are not satisfied, the state returns to state ST5.

[0086] Figure 7 This is a diagram for explaining an example of a fine alignment process.

[0087] The processing unit 181 obtains the positions P1 to P4 of the plurality of mask marks 311 to 314 provided on the mask 3 based on the detection results of each camera 1611 to 1614. In the present embodiment, the positions P1 to P4 are the center positions of the circular mask marks 311 to 314, respectively. In addition, in the present embodiment, the storage unit 182 stores information that links the coordinate system (camera coordinate system) within the field of view of each camera 1611 to 1614 with the overall coordinate system (world coordinate system) of the film forming apparatus 10. The processing unit 181 calculates the coordinates of the positions P1 to P4 of the mask marks 311 to 314 in each camera coordinate system based on the detection results of each camera 1611 to 1614. The processing unit 181 obtains the coordinates of the positions P1 to P4 of the plurality of mask marks 311 to 314 in the world coordinate system from the information that links the camera coordinate system with the world coordinate system.

[0088] In addition, the processing unit 181 sets target positions 511T to 514T corresponding to the mask marks 311 to 314, respectively, on the substrate 5 from among the plurality of substrate marks 511 to 514 provided on the substrate 5 based on the detection results of the cameras 1611 to 1614. In addition, the target positions 511T to 514T are set by coordinates in the world coordinate system based on information linking the camera coordinate system to the world coordinate system, similarly to the positions P1 to P4 of the mask marks 311 to 314. In the present embodiment, the target positions 511T to 514T are set at a position on the inner side of the substrate 5 at a predetermined distance from a portion of the cross-shaped position detection marks 511a to 514a extending in the X direction. In addition, Figure 7 In FIG. 5 , the distance between the position P1 and the target position 511T is represented by L1. The distances between the positions P2 to P4 and the target positions 512T to 514T are similarly represented by L2 to L4.

[0089] Then, the processing unit 181 adjusts the relative position of the substrate 5 and the mask 3 using the position adjustment mechanism 14 based on the positions P1 to P4 of the plurality of mask marks 311 to 314 and the target positions 511T to 514T corresponding thereto. As an example, first, the processing unit 181 adjusts the position of the substrate 5 using the position adjustment mechanism 14 so that the center of gravity of the positions P1 to P4 coincides with the center of gravity of the target positions 511T to 514T. Thereafter, the processing unit 181 rotates the substrate 5 using the position adjustment mechanism 14 while maintaining the state in which the center of gravity of the positions P1 to P4 coincides with the center of gravity of the target positions 511T to 514T so that the sum of the squares of the distances L1 to L4 is minimized. In addition, the alignment method described is an example, and other known techniques can be applied.

[0090] In addition, here, the target positions 511T~514T are respectively set at positions away from the position detection marks 511a~514a, but the target positions 511T~514T may also be the positions of the position detection marks 511a~514a. In other words, the distances L1~L4 may also be 0. In addition, here, the positional relationship between the target positions 511T~514T and the positions P1~P4 of the mask marks 311~314 is adjusted. However, the position adjustment of the substrate 5 and the mask 3 may also be performed based on the positions of the position detection marks 511a~514a and the positions of four points away from the positions P1~P4 of the mask marks 311~314 by a specified distance. That is, in the present embodiment, the position adjustment of the substrate 5 and the mask 3 is performed based on the points corresponding to the substrate marks 511~514 and the points corresponding to the mask marks 311~314. Furthermore, the “points corresponding to the substrate marks 511 to 514” may be points indicating the positions of the substrate marks 511 to 514 themselves, or points (e.g., target positions 511T to 514T) that are in a predetermined positional relationship with the substrate marks 511 to 514. Similarly, the “points corresponding to the mask marks 311 to 314” may be points indicating the positions of the mask marks 311 to 314 themselves (e.g., positions P1 to P4), or points that are in a predetermined positional relationship with the mask marks 311 to 314.

[0091] In addition, as described above, in the present embodiment, a plurality of cameras 1611 to 1614 are used to perform fine alignment as alignment between the substrate 5 and the mask 3. At this time, there is a case where at least one of the plurality of cameras 1611 to 1614 cannot detect the alignment mark provided on the substrate 5 and the mask 3 due to some reasons. For example, the substrate 5 is sequentially transported to a plurality of film forming chambers and film formation using a plurality of evaporation materials is repeatedly performed, and therefore, during transportation or film formation, the area on which the mark is formed on the substrate 5 is sometimes attached with material and becomes dirty. Alternatively, sometimes, the area on which the mark is formed on the substrate 5 is dirty in the TFT circuit forming process (backplane process) before the evaporation process, and the dirty substrate 5 is carried into the film forming chamber for evaporation. In such a case, during alignment, the detection unit 16 may be unable to detect the substrate mark 51 due to the dirtiness of the substrate 5.

[0092] In the case where the alignment mark provided on the substrate 5 and the mask 3 cannot be detected, it is conceivable to repeatedly perform the detection process based on the detection unit 16 until the mark can be detected. However, if the detection process is repeated, the alignment may take a long time. In addition, as a result, the productivity of the organic EL display device may be reduced. Therefore, in this embodiment, in order to suppress the alignment of the substrate 5 and the mask 3 from taking a long time, the processing unit 181 performs the following processing.

[0093] <Processing example>

[0094] Figure 8 1 is a flowchart showing an example of processing by the processing unit 181, and shows an overview of processing when fine alignment is performed. More specifically, it shows processing when alignment is performed based on detectable marks even when all marks cannot be detected by the detection unit 16. For example, in this flowchart, Figure 6 The operation shown in the state ST4~ST5 is performed. In addition, this flowchart is implemented by, for example, the processing unit 181 reading and executing the program stored in the storage unit 182.

[0095] In step S1, the processing unit 181 performs a mark detection process. Specifically, the processing unit 181 detects the mask marks 311 to 314 provided on the mask 3 and the substrate marks 511 to 514 provided on the substrate 5 corresponding to the mask marks 311 to 314, respectively, using the cameras 1611 to 1614 as the detection unit 16. In addition, when there is a mark (mask fine mark 31 or substrate fine mark 51) that cannot be detected by the detection unit 16, the processing unit 181 can obtain information on this situation.

[0096] In step S2, the processing unit 181 performs a position adjustment process. Specifically, the processing unit 181 performs position adjustment of the substrate 5 and the mask 3 based on the mark detected in step S1. The details of the process will be described later.

[0097] In step S3, the processing unit 181 performs the mark detection process again after the position adjustment. The specific process is the same as step S1. In step S4, the processing unit 181 determines whether the detection result of step S3 satisfies the specified condition. If it does, the flowchart ends. If it does not, the process returns to step S2. For example, when the sum of the squares of the distances between the positions P1 to P4 of the plurality of mask marks 311 to 314 and the target positions 511T to 514T corresponding thereto is less than a specified value, the processing unit 181 determines that the specified condition is satisfied.

[0098] Fig. 9 is a flowchart showing an example of processing by the processing unit 181, showing Figure 8 A specific example of step S2 of the flowchart.

[0099] In step S21, the processing unit 181 checks the number of cameras that can detect the alignment mark among the cameras 1611 to 1614. If all (four) cameras detect the mark, the processing unit 181 proceeds to S22. If two or three cameras detect the mark, the processing unit 181 proceeds to S23. If zero or one camera detects the mark, the processing unit 181 proceeds to S25.

[0100] In step S22, the processing unit 181 determines the adjustment amount using the images captured by all cameras 1611 to 1614. For example, the processing unit 181 refers to Figure 7 The adjustment amount for adjusting the relative position of the substrate 5 and the mask 3 is determined by the method described above. That is, the adjustment amount determined here may be the amount of movement of the center of gravity of the substrate 5. In addition, for example, the adjustment amount determined here may be the amount of rotation (rotation angle) of the substrate 5 with the center of gravity as the rotation center.

[0101] In step S23, the processing unit 181 confirms the setting related to the alignment operation. The processing unit 181 proceeds to S24 when the setting related to the alignment operation is "setting 1", and proceeds to S25 when it is "setting 2". Here, the setting related to the alignment operation is a setting related to whether the adjustment amount of the position adjustment of the substrate 5 and the mask 3 is determined based on the detectable mark when at least any one of the cameras 1611 to 1614 cannot detect the mark. "Setting 1" is a setting that determines the adjustment amount of the position adjustment of the substrate 5 and the mask 3 based on the detectable mark even when at least any one of the cameras 1611 to 1614 cannot detect the mark. "Setting 2" is a setting that does not determine the adjustment amount when at least any one of the cameras 1611 to 1614 cannot detect the mark. For example, the user can pre-select the setting related to the alignment operation via the input unit (not shown) of the host computer H or the film forming apparatus 10. Information related to the setting pre-selected by the user can also be stored in the storage unit 182, for example. Alternatively, the processing unit 181 may confirm the setting related to the alignment operation by accepting the setting related to the alignment operation via the host computer H or the input unit (not shown) of the film forming apparatus 10 at the timing of entering S21 to S23 .

[0102] In step S24, the processing unit 181 determines the adjustment amount using the image captured by the camera that can detect the marker. In this embodiment, the adjustment amount is determined when the marker can be detected by two or three of the four cameras 1611 to 1614.

[0103] Figure 10A to Figure 10C This is a diagram for explaining a method of determining an adjustment amount when a marker can be detected by two or three cameras.

[0104] Fig. 10A1611, 1613, 1614) can detect the mark. In this case, the processing unit 181 determines the adjustment amount based on the midpoint 5001 of the hypotenuse of the right triangle with three points (target positions 511T, 513T, 514T) corresponding to the position detection marks 511a, 513a, 514a as vertices. For example, the processing unit 181 makes the position of the midpoint 5001 coincide with the positions P1, P3, P4 (refer to Figure 7 ) as vertices, the processing unit 181 determines the movement amount of the substrate 5 so that the midpoints of the hypotenuse of the right triangle with ) as vertices coincide with each other. Figure 7 The rotation amount of the substrate 5 is determined in such a way that the sum of the squares of ) becomes minimum.

[0105] Fig. 10B 1611 and 1614 are diagrams for explaining a method for determining an adjustment amount when two cameras (cameras 1611 and 1614) arranged diagonally can detect a mark. In this case, the processing unit 181 determines the adjustment amount based on the midpoint 5002 of the hypotenuse of a right triangle having two points (target positions 511T and 514T) corresponding to the position detection marks 511a and 514a as vertices. For example, the processing unit 181 sets the position of the midpoint 5002 to the positions P1 and P4 of the mask marks 311 and 314 (see Figure 7 ) is aligned with the midpoint of the distance L1 and the distance L4 (see Figure 7 The rotation amount of the substrate 5 is determined in such a way that the sum of the squares of ) becomes minimum.

[0106] Fig. 10C 1611 and 1613, respectively, are diagrams for explaining a method for determining an adjustment amount when two cameras (cameras 1611 and 1613) arranged on the same side of the substrate 5 can detect a mark. In this case, the processing unit 181 determines the adjustment amount based on the vertex 5003 corresponding to the apex angle of an isosceles triangle having two points (target positions 511T and 513T) corresponding to the position detection marks 511a and 513a as bases. For example, the processing unit 181 makes the position of the vertex 5003 coincide with the positions P1 and P3 (see FIG. 1611 and FIG. 1613) of the mask marks 311 and 313. Figure 7 ) is the base, the processing unit 181 determines the movement amount of the substrate 5 so that the positions of the vertices corresponding to the vertex angles of the isosceles triangle with ) as the base are consistent. Figure 7 The rotation amount of the substrate 5 is determined in such a way that the sum of the squares of ) becomes minimum.

[0107] In step S25, the processing unit 181 performs an error notification. For example, the processing unit 181 displays information that the mark for alignment cannot be detected on the display unit 19. Alternatively, when the number of cameras that have detected the mark is two or three and the setting related to the alignment operation is "setting 2" (S21→S23→S25), it may be confirmed together with the error notification whether the alignment operation is performed based on the detectable mark. Fig.11 Here, an error message 1101, a button 1102 for interrupting the alignment operation, and a button 1103 for executing the alignment operation based on the detectable mark are shown. Alternatively, when the user selects the button 1102 using an input device (not shown), the processing unit 181 terminates the alignment operation. Figure 8 and Fig. 9 Alternatively, when the user selects button 1103 using an input device (not shown), processing unit 181 proceeds to S24. In addition, when the number of detectable marks is zero or one, button 1103 is not displayed.

[0108] According to this embodiment, even when the alignment mark is not detected by some of the cameras 1611 to 1614, the adjustment amount of the substrate 5 and the mask 3 in alignment can be determined based on the detection results of the cameras that can detect the mark. Therefore, it is possible to suppress the alignment time caused by repeated detection of the mark.

[0109] In addition, according to the present embodiment, when the alignment mark is not detected in a part of the cameras 1611 to 1614, and when the setting related to the alignment operation is "setting 1", the adjustment amount of the substrate 5 and the mask 3 is determined. Therefore, it is possible to perform processing that reflects the user's intention of giving priority to suppressing the alignment time or ensuring the alignment accuracy. When the user gives priority to ensuring the alignment accuracy, the alignment operation can be temporarily interrupted, and the alignment operation can be restarted after removing the main reason why the camera cannot detect the mark.

[0110] <Other embodiments>

[0111] In the above embodiment, when the marker cannot be detected by a part of the four cameras, the alignment operation is performed based on the detection result of the camera that can detect the marker. However, it is also possible that when the marker cannot be detected by a part of the three or five cameras or more, the alignment operation is performed based on the detection result of the camera that can detect the marker. Fig. 10B and Fig. 10CAs shown, if at least two cameras can detect the marker, the alignment operation can be performed as in the above-mentioned embodiment. Therefore, when the marker can be detected by two or more cameras among the three or more cameras provided as the detection unit, the alignment operation can be performed.

[0112] In the above embodiment, the setting related to the alignment operation can be selected from "setting 1" and "setting 2". However, three or more settings may be selected. For example, any of the following settings may be selected.

[0113] Setting A: Determine the adjustment amount when all cameras can detect the mark

[0114] Setting B: Determine the adjustment amount when more than three cameras can detect the mark

[0115] Setting C: Determine the adjustment amount when two or more cameras can detect the mark

[0116] In addition, in the above-mentioned embodiment, in the fine alignment process, even if there is a camera that cannot detect the mark, the alignment action is performed based on the detection result of the camera that can detect the mark. However, the same process can also be applied in the rough alignment process. In this case, three or more marks for rough alignment can also be set on the substrate 5 and the mask 3. In addition, it is not limited to the case of performing alignment in two stages of rough alignment and fine alignment. In the case of implementing one alignment or implementing more than three stages of alignment, the structure of the above-mentioned embodiment can also be adopted.

[0117] The present invention may also be constituted by a program (software) for implementing one or more functions of the above-mentioned embodiments, in which a program (software) is provided to a system or device via a network or various storage media, and one or more processors in a computer of the system or device read and execute the program, and the program may be composed of a computer-readable non-temporary storage medium storing the program.

[0118] <Method for manufacturing electronic device>

[0119] Next, an example of a method for manufacturing an electronic device is described. Hereinafter, as an example of an electronic device, a structure and a method for manufacturing an organic EL display device are described.

[0120] First, the manufactured organic EL display device will be described. Fig. 12A is an overall diagram of an organic EL display device 50, Fig. 12B This is a diagram showing a cross-sectional structure of one pixel.

[0121] like Fig. 12AAs shown, a plurality of pixels 52 having a plurality of light-emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Each light-emitting element has a structure having an organic layer sandwiched by a pair of electrodes, and the details will be described later. In addition, the pixel mentioned here refers to the minimum unit that can display the desired color in the display area 51. In the case of a color organic EL display device, a pixel 52 is formed by a combination of a plurality of sub-pixels showing a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light differently from each other. Most of the pixels 52 are composed of a combination of three sub-pixels, namely, a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but it is not limited thereto. The pixel 52 only needs to include at least one sub-pixel, preferably includes two or more sub-pixels, and more preferably includes three or more sub-pixels. As the sub-pixels constituting the pixel 52, for example, it can also be a combination of four sub-pixels, namely, a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

[0122] Fig. 12B yes Fig. 12A Schematic diagram of a partial cross-section at line AB of the pixel 52. The pixel 52 has a plurality of sub-pixels formed by organic EL elements, and the organic EL element has a first electrode (anode) 54, a hole transport layer 55, any one of a red layer 56R / a green layer 56G / a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 are equivalent to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are respectively formed into patterns corresponding to light-emitting elements (sometimes also referred to as organic EL elements) that emit red light, green light, and blue light. In addition, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 can be formed in common for a plurality of light-emitting elements 52R, 52G, and 52B, or can be formed for each light-emitting element. That is, as Fig. 12B As shown, on the basis of forming the hole transport layer 55 as a common layer in the plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B may be separately formed for each sub-pixel region, and further on it, the electron transport layer 57 and the second electrode 58 may be formed as a common layer in the plurality of sub-pixel regions. In addition, in order to prevent short circuits between the adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. In addition, since the organic EL layer is degraded by moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen corrosion.

[0123] exist Fig. 12BIn the figure, the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but according to the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. In addition, a hole injection layer can be formed between the first electrode 54 and the hole transport layer 55, and the hole injection layer has an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55. Similarly, an electron injection layer can also be formed between the second electrode 58 and the electron transport layer 57.

[0124] Each of the red layer 56R, the green layer 56G, and the blue layer 56B can be formed by a single light-emitting layer or by stacking multiple layers. For example, the red layer 56R can be composed of two layers, with the red light-emitting layer forming the upper layer and the hole transport layer or the electron blocking layer forming the lower layer. Alternatively, the lower layer can be formed by the red light-emitting layer and the upper layer can be formed by the electron transport layer or the hole blocking layer. By arranging the layers on the lower or upper side of the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby having the effect of improving the color purity of the light-emitting element. In addition, an example of the red layer 56R is shown here, but the same structure can also be used in the green layer 56G and the blue layer 56B. In addition, the number of stacked layers can also be more than two layers. Moreover, layers of different materials can be stacked like the light-emitting layer and the electron blocking layer, or layers of the same material can be stacked, for example, more than two light-emitting layers can be stacked.

[0125] Next, an example of a method for manufacturing an organic EL display device is specifically described. Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light-emitting layer.

[0126] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 53 is not particularly limited, and it can be made of glass, plastic, metal, etc. In this embodiment, as the substrate 53, a substrate in which a polyimide film is laminated on a glass substrate is used.

[0127] A resin layer such as acrylic or polyimide is applied by bar coating or spin coating on the substrate 53 having the first electrode 54 formed thereon, and the resin layer is patterned by photolithography to form an opening in the portion having the first electrode 54 formed thereon, thereby forming an insulating layer 59. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0128] The substrate 53 with the patterned insulating layer 59 is carried into the first film forming chamber, and the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display area. The hole transport layer 55 is formed using a mask having an opening formed in each display area 51 of the panel portion of each organic EL display device.

[0129] Next, the substrate 53 formed up to the hole transport layer 55 is moved into the second film forming chamber. The substrate 53 and the mask are aligned, the substrate is placed on the mask, and the red layer 56R is formed on the portion of the substrate 53 on the hole transport layer 55 where the element emitting red light is arranged (the region forming the red sub-pixel). Here, the mask used in the second film forming chamber is a high-precision mask having openings formed only in the multiple regions that become red sub-pixels among the multiple regions on the substrate 53 that become the sub-pixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the region that becomes the red sub-pixel among the regions that become the multiple sub-pixels on the substrate 53. In other words, the red layer 56R is not formed in the region that becomes the blue sub-pixel and the region that becomes the green sub-pixel among the regions that become the multiple sub-pixels on the substrate 53, but is selectively formed in the region that becomes the red sub-pixel.

[0130] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film forming chamber, and the blue layer 56B is further formed in the fourth film forming chamber. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed in the entire display area 51 in the fifth film forming chamber. The electron transport layer 57 is formed as a common layer in the three color layers 56R, 56G, and 56B.

[0131] The substrate formed up to the electron transport layer 57 is moved to the sixth film forming chamber, and the second electrode 58 is formed. In the present embodiment, the film formation of each layer is performed by vacuum evaporation in the first film forming chamber to the sixth film forming chamber. However, the present invention is not limited to this, for example, the film formation of the second electrode 58 in the sixth film forming chamber can also be performed by sputtering. After that, the substrate formed up to the second electrode 68 is moved to the sealing device, and the protective layer 60 is formed by plasma CVD (sealing process), and the organic EL display device 50 is completed. In addition, here, the protective layer 60 is formed by the CVD method, but it is not limited to this, and it can also be formed by the ALD method or the inkjet method.

[0132] Here, the film formation in the first to sixth film forming chambers is performed using a mask having openings corresponding to the patterns of each layer to be formed. When forming the film, after the relative position adjustment (alignment) of the substrate 53 and the mask is performed, the substrate 53 is placed on the mask to form the film. Here, the alignment process performed in each film forming chamber is performed as in the above-mentioned alignment process.

[0133] The present invention is not limited to the above-described embodiments, and various modifications and changes can be made within the scope of the gist of the invention.

[0134] This application claims priority based on Japanese patent application No. 2022-124898 filed on August 4, 2022, and all the contents described therein are incorporated herein by reference.

Claims

1. An alignment device, wherein the alignment device uses a substrate mark provided on a substrate and a mask mark provided on a mask to align the substrate and the mask, wherein: The alignment device comprises: A plurality of detection components, wherein the plurality of detection components detect the substrate mark and the mask mark; a determining component that uses the detection results of the plurality of detection components to determine an adjustment amount in adjusting the relative positions of the substrate and the mask; as well as a position adjusting component for adjusting the relative positions of the substrate and the mask based on the adjustment amount determined by the determining component, Even when the substrate mark or the mask mark is not detected by some of the plurality of detection means, the determination means determines the adjustment amount based on detection results of the detection means other than the some of the detection means.

2. The alignment device according to claim 1, characterized in that As the plurality of detection components, three or more detection components are provided, The determining unit determines the adjustment amount when the substrate mark and the mask mark are detected by two or more detection units among the three or more detection units.

3. The alignment device according to claim 1, characterized in that: Four substrate marks are provided on the substrate. The mask is provided with four mask marks, As the plurality of detection components, four detection components are provided, The determination component determines the adjustment amount so that the distance between the center of gravity position of a rectangle with four points corresponding to the four substrate marks as vertices and the center of gravity position of a rectangle with four points corresponding to the four mask marks detected by the four detection components as vertices becomes less than a first threshold.

4. The alignment device according to claim 3, characterized in that: In a case where the substrate mark or the mask mark is not detected by one of the four detection components, the determination component determines the adjustment amount so that the distance between the midpoint of the hypotenuse of a right triangle with three points corresponding to the three substrate marks detected by three detection components other than the one detection component as vertices and the midpoint of the hypotenuse of a right triangle with three points corresponding to the three mask marks detected by the three detection components as vertices becomes below a second threshold.

5. The alignment device according to claim 1, characterized in that: The alignment device further includes a receiving component that receives settings related to the alignment operation. When the substrate mark or the mask mark is not detected by a part of the plurality of detection parts, the determination part determines the adjustment amount based on the detection results of the detection parts other than the part of the detection parts when the acceptance part accepts the first setting, When the substrate mark or the mask mark is not detected by some of the plurality of detection means, the determination means does not determine the adjustment amount when the acceptance means accepts a second setting different from the first setting.

6. The alignment device according to claim 5, characterized in that The alignment device further includes a notification unit configured to make a notification when the receiving unit receives the second setting, when the substrate mark or the mask mark is not detected by some of the plurality of detection units.

7. The alignment device according to claim 1, characterized in that: The plurality of detection components respectively include a plurality of cameras for photographing the substrate mark and the mask mark.

8. A film forming device, characterized in that: The film forming device comprises: The alignment device of claim 1; and A film forming member is provided for forming a film on the substrate via the mask.

9. An alignment method, wherein the alignment method uses a substrate mark provided on a substrate and a mask mark provided on a mask to align the substrate and the mask, wherein: The alignment method comprises: an inspection process, in which the substrate mark and the mask mark are inspected by using a plurality of inspection components; a determining step, in which the detection result in the detecting step is used to determine an adjustment amount in adjusting the relative positions of the substrate and the mask; as well as a position adjustment step, in which the relative positions of the substrate and the mask are adjusted based on the adjustment amount determined in the determination step, In the determining step, even when the substrate mark or the mask mark is not detected by some of the plurality of detection members, the adjustment amount is determined based on detection results of detection members other than the some of the detection members.

10. A method for manufacturing an electronic device, characterized in that: The method for manufacturing the electronic device comprises: an alignment step, in which the substrate and the mask are aligned by the alignment method according to claim 9; as well as and a film forming step of forming a film on the substrate via the mask aligned in the alignment step.

11. A program, characterized in that The program is for causing a computer to execute the alignment method according to claim 9.

12. A storage medium, characterized in that: The storage medium can be read by a computer, and stores a program for causing the computer to execute the alignment method according to claim 9.

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