Control method and control system for automatic alignment of silicon wafer cutting
By calibrating the origin, cutting point, and reference point, the position of the silicon rod is automatically adjusted using sensor components, solving the problems of wire mesh breakage and silicon material waste during silicon rod cutting. This achieves high-precision automatic tool setting, reducing the complexity of manual operation and silicon material waste.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JINWAN GAOJING SOLAR ENERGY TECH CO LTD
- Filing Date
- 2024-12-05
- Publication Date
- 2026-05-15
AI Technical Summary
In the existing technology, improper tool setting operation before silicon rod cutting can lead to contact between the silicon rod and the wire mesh, causing the wire mesh to break or silicon material to be wasted. Furthermore, the current operation accuracy relies on manual observation, which cannot guarantee the accuracy of tool setting.
By calibrating the origin, cutting point, and reference point, the position of the silicon rod is automatically adjusted using sensor components, achieving automatic tool setting and reducing manual intervention.
It improves the precision of silicon wafer cutting, reduces silicon waste and labor intensity, and increases silicon utilization and cutting efficiency.
Smart Images
Figure CN119635853B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon rod cutting technology, and in particular to a control method and control system for automatic tool alignment during silicon wafer cutting. Background Technology
[0002] Before cutting the silicon rod, a tool setting operation is required. The tool setting requires that the part of the silicon rod extending beyond the wire mesh at both ends not exceed 1.5mm, and the starting height of the cut not exceed 1mm from the wire mesh plane.
[0003] The existing specific operations are as follows: Silicon rod clamping steps: Feed the silicon rod into the machine compartment—the spindle clamping device clamps it. Horizontal (X-axis) tool setting steps: Feed the spindle downwards—visually check that the lower surface of the silicon rod is 3-5mm away from the wire mesh and stop feeding—move the silicon rod left and right—the end face of the silicon rod extends 1-1.5mm beyond the wire mesh—click confirm. Vertical (Z-axis) tool setting steps: Feed the spindle downwards—visually check that the lower surface of the silicon rod is 1mm away from the wire mesh and stop feeding—click zero on the control panel.
[0004] However, the above method has the following drawbacks: If the operator operates improperly in the vertical direction (z-axis) during tool setting, the silicon rod may press down onto the wire mesh, causing the entire wire mesh to snap. Additionally, if the silicon rod contacts the wire mesh, it can cause abnormalities such as wire twisting, uneven cutting thickness, and scratches on the cut surface during startup. If the operator operates improperly in the horizontal direction (X-axis) during tool setting, leaving an edge greater than 1.5mm, it will result in wasted silicon material (approximately 5-6 silicon wafers per mm thickness); leaving an edge less than 1mm, the edge material at both ends is prone to falling off during cutting, potentially breaking the wire mesh and causing cutting interruptions. Furthermore, the above operation process requires high precision, currently relying entirely on manual visual observation, which cannot guarantee tool setting accuracy. When the gap between the silicon rod and the wire mesh is greater than 1mm, it wastes steel wire cutting force and also carries the risk of scratches on the cut surface.
[0005] Therefore, there is an urgent need for control methods and systems for automatic tool alignment in silicon wafer cutting, in order to solve the technical problems existing in the current technology to a certain extent. Summary of the Invention
[0006] The purpose of this application is to provide a control method and control system for automatic tool alignment in silicon wafer cutting, which improves the cutting accuracy of silicon rods to a certain extent and reduces the workload of operators; in addition, it improves the utilization rate of silicon material and reduces batch quality abnormalities caused by excessive tool alignment errors.
[0007] The origin, cutting point, and reference point are calibrated.
[0008] This application provides a control method for automatic tool setting and alignment during silicon wafer cutting, comprising the following steps:
[0009] Origin calibration steps: Mark the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system;
[0010] Tool setting parameters: Let L be the length of both ends of the silicon rod extending beyond the two ends of the cutting part of the cutting assembly along its length direction; let H be the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod.
[0011] Cutting point calibration steps: The point formed by the tool setting parameters in the coordinate system is the cutting point, denoted as A, and the coordinates of A are (L, H);
[0012] Reference point calibration steps: Above the cutting component, and at the second preset position, a reference point is denoted as B and the coordinates of B are (x, y);
[0013] Steps for calculating the distance between the reference point and the cutting point: Using the origin O(0,0), the cutting point A(L,H), and the reference point B(x,y), we can determine the horizontal distance M between the reference point and the cutting point as xL; and the vertical distance N between the reference point and the cutting point as yH.
[0014] Silicon rod moving and tool setting steps: The silicon rod to be cut is moved to the reference point position at a first preset time, and then moved a distance xL along the first direction and a distance yH along the second direction from the reference point position at a second preset time that is later than the first preset time, so that the silicon rod to be cut is moved to the cutting point B, thereby realizing the moving and tool setting.
[0015] In the above technical solution, the cutting assembly further includes a rotating roller and a cutting line;
[0016] Multiple rotating rollers are provided, and the multiple rotating rollers are arranged at intervals to form a drive unit;
[0017] The cutting lines are provided in multiple ways, and the multiple cutting lines are wound around the driving part at intervals along the first direction to form the cutting part.
[0018] In the above technical solution, three rotating rollers are arranged in an isosceles triangle so that the end face of the cutting part facing the silicon rod is a plane.
[0019] In the above technical solution, the origin calibration step further includes the following steps:
[0020] Horizontal origin calibration steps: Drive the silicon rod to move horizontally until it is flush with the cutting line at the end of the cutting part;
[0021] Vertical origin calibration steps: Drive the silicon rod to move in the vertical direction until the end face of the silicon rod facing the cutting assembly contacts the cutting part.
[0022] In the above technical solution, the origin calibration step is further followed by an origin change step, which includes the following steps:
[0023] Origin horizontal direction change step: When the cutting part moves in the first direction, restart the horizontal direction origin calibration step and update the position of the origin in the horizontal direction;
[0024] Vertical origin change step: When the drive unit moves in the second direction, the vertical origin calibration step is restarted and the position of the origin in the vertical direction is updated.
[0025] In the above technical solution, the reference point calibration step further includes the following steps:
[0026] Horizontal reference point detection steps: A first sensor component that is communicatively connected to the controller is set at the second preset position;
[0027] Horizontal reference point calibration steps: Drive the silicon rod to move toward the first sensor assembly. When the silicon rod contacts the first sensor assembly, the controller can receive a first signal emitted by the first sensor assembly. The controller calibrates the horizontal position of the first sensor assembly in the coordinate system as the horizontal position of the reference point according to the first signal.
[0028] Vertical reference point detection steps: A second sensor component, which is communicatively connected to the controller, is disposed at the second preset position and at a distance from the first sensor component;
[0029] Vertical reference point calibration steps: Drive the silicon rod to move toward the second sensor assembly. When the silicon rod contacts the second sensor assembly, the controller can receive a second signal emitted by the second sensor assembly. The controller calibrates the vertical position of the second sensor assembly in the coordinate system as the vertical position of the reference point based on the second signal.
[0030] In the above technical solution, the first sensor assembly further includes a pressure sensor or a tension sensor; the second sensor assembly includes a pressure sensor or a tension sensor.
[0031] In the above technical solution, both the first sensor assembly and the second sensor assembly include a support frame, which can support the pressure sensor or the tension sensor.
[0032] In the above technical solution, the controller is further connected in communication with the silicon rod to be cut and is able to control the movement of the silicon rod to be cut.
[0033] This application also provides a control system for automatic tool alignment during silicon wafer cutting, based on a control method for automatic tool alignment during silicon wafer cutting.
[0034] Compared with the prior art, this application has the following beneficial effects:
[0035] This application provides a control method for automatic tool setting and alignment during silicon wafer cutting, comprising the following steps:
[0036] Origin calibration steps: Mark the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system;
[0037] Tool setting parameters: Let L be the length of both ends of the silicon rod extending beyond the two ends of the cutting part of the cutting assembly along its length direction; let H be the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod.
[0038] Cutting point calibration steps: The point formed by the tool setting parameters in the coordinate system is the cutting point, denoted as A, and the coordinates of A are (L, H);
[0039] Reference point calibration steps: Above the cutting component, and at the second preset position, a reference point is denoted as B and the coordinates of B are (x, y);
[0040] Steps for calculating the distance between the reference point and the cutting point: Using the origin O(0,0), the cutting point A(L,H), and the reference point B(x,y), we can determine the horizontal distance M between the reference point and the cutting point as xL; and the vertical distance N between the reference point and the cutting point as yH.
[0041] Silicon rod moving and tool setting steps: The silicon rod to be cut is moved to the reference point position at a first preset time, and then moved a distance xL along the first direction and a distance yH along the second direction from the reference point position at a second preset time that is later than the first preset time, so that the silicon rod to be cut is moved to the cutting point B, thereby realizing the moving and tool setting.
[0042] In summary, this application only requires manual calibration once during the cutting point calibration step, and no manual intervention is needed for subsequent tool setting. The overall solution provides more precise cutting of silicon rods, reduces the workload of operators, and improves work efficiency. In addition, it increases the utilization rate of silicon material and reduces batch quality abnormalities caused by excessive tool setting errors.
[0043] This application also provides a control system for automatic tool setting and alignment in silicon wafer dicing, based on a control method for automatic tool setting and alignment in silicon wafer dicing. Therefore, it possesses all the beneficial effects of the control method for automatic tool setting and alignment in silicon wafer dicing, and thus will not be described in detail. Attached Figure Description
[0044] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0045] Figure 1 A structural demonstration diagram of the control method for automatic tool alignment in silicon wafer dicing provided in this application, and a diagram from a first-person perspective;
[0046] Figure 2 for Figure 1 Enlarged view of point A in the image;
[0047] Figure 3 A structural demonstration diagram of the control method for automatic tool alignment in silicon wafer dicing provided in this application, and a diagram from a second-view perspective;
[0048] Figure 4 A structural demonstration diagram of the control method for automatic tool alignment in silicon wafer dicing provided in this application, shown from a third-person perspective.
[0049] Reference numerals: 1-Silicon rod; 2-Side end face; 3-Bottom end face; 4-Rotating roller; 5-Cutting line; 6-Drive unit; 7-Cutting unit; 8-First direction; 9-Second direction; 10-First sensor assembly; 11-Second sensor assembly. Detailed Implementation
[0050] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.
[0051] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.
[0052] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.
[0053] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.
[0054] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.
[0055] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.
[0056] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0057] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.
[0058] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.
[0059] Example 1
[0060] However, the above method has the following drawbacks: If the operator operates improperly in the vertical direction (z-axis) during tool setting, the silicon rod 1 may press down onto the wire mesh, causing the entire wire mesh to snap. Additionally, if the silicon rod 1 contacts the wire mesh, it can cause abnormalities such as wire twisting, uneven cutting thickness, and scratches on the cut surface during startup. If the operator operates improperly in the horizontal direction (X-axis) during tool setting, leaving an edge greater than 1.5mm, it will result in wasted silicon material (approximately 5-6 silicon wafers per mm thickness); leaving an edge less than 1mm, the edge material at both ends is prone to falling off during cutting, potentially breaking the wire mesh and causing cutting interruptions. Furthermore, the above operation process requires high precision, currently relying entirely on manual visual observation, which cannot guarantee tool setting accuracy. When the gap between the silicon rod 1 and the wire mesh is greater than 1mm, it wastes the cutting force of the steel wire and also carries the risk of scratches on the cut surface.
[0061] This application provides a control method for automatic tool setting and alignment during silicon wafer cutting, comprising the following steps:
[0062] Origin calibration step 100: Calibrate the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system.
[0063] Specifically, in combination Figure 1 and Figure 2 As shown, the cutting assembly includes rotating rollers 4 and cutting wires 5; multiple rotating rollers 4 are arranged at intervals to form a drive unit 6. Multiple cutting wires 5 are wound at intervals around the drive unit 6 along a first direction 8 to form a cutting unit 7. Figure 3As shown, one direction here refers to a horizontal leftward direction, meaning that multiple cutting lines 5 are arranged at intervals along a horizontal leftward direction, and the distance between adjacent cutting lines 5 is the thickness of the silicon wafer formed after the silicon rod 1 is cut. In the actual cutting process of the silicon rod 1, the rotating roller 4 is driven to rotate, and the rotating roller 4 will drive the cutting lines 5 to rotate, thereby cutting the silicon rod 1.
[0064] Furthermore, combined Figure 1 As shown, there are 3 rotating rollers 4 arranged in an isosceles triangle so that the end face of the cutting part 7 facing the silicon rod 1 is a plane.
[0065] Specifically, the origin calibration process includes the following steps:
[0066] Horizontal origin calibration step 101: Drive the silicon rod 1 to move horizontally until it is flush with the cutting line 5 at the end of the cutting section 7; specifically, in conjunction with Figure 1 As shown, in actual use, silicon rod 1 is first fed into the machine compartment, and the spindle clamping device clamps silicon rod 1.
[0067] Then the spindle drives the silicon rod 1 to move vertically downwards, stopping the feed when the lower surface of the silicon rod 1 is visually estimated to be 3-5mm away from the wire mesh; then the spindle drives the silicon rod 1 to move in the opposite direction to the first direction 8, until the side end face 2 of the silicon rod 1 is aligned with the wire mesh. Figure 1 The rightmost cutting line 5 is aligned with the center line; at this point, click the horizontal origin calibration button on the control panel to make it "OK".
[0068] The control panel described above is the control panel for the silicon rod cutting system 1. The silicon rod cutting system 1 is an existing technology and can be understood by those skilled in the art.
[0069] Vertical origin calibration step 102: Drive the silicon rod 1 to move vertically until the end face of the silicon rod 1 contacts the cutting part 7. Specifically, in conjunction with Figure 1 As shown, drive the silicon rod 1 to move vertically downward toward the cutting assembly until the bottom end face 3 of the silicon rod 1 contacts the cutting part 7; at this time, click the vertical direction origin calibration button on the control panel to make it in the OK state.
[0070] In summary, the aforementioned first preset position refers to... Figure 1 The center position of the rightmost cutting line 5. Through the above steps, the origin O(0,0) can be marked at the first preset position of the cutting component, and a coordinate system can be established.
[0071] Tool setting parameter setting step 200: Let the length of both ends of the silicon rod 1 extending beyond the two ends of the cutting part 7 of the cutting assembly along its length direction be L; let the distance between the end face of the silicon rod 1 facing the cutting assembly and the end face of the cutting part 7 facing the silicon rod 1 be H. Specifically, L here must not be greater than 1.5mm, and H here must not be greater than 1mm.
[0072] Cutting point calibration step 300: The tool setting parameters form a point in the coordinate system, which is the cutting point denoted as A, and the coordinates of A are (L, H).
[0073] Reference point calibration step 400: A reference point, denoted as B, is calibrated above the cutting component at a second preset position, with coordinates (x, y). Specifically, reference point calibration step 400 includes the following steps:
[0074] Horizontal reference point detection step 401: A first sensor assembly 10, which is communicatively connected to the controller, is installed at a second preset position. Preferably, the first sensor assembly 10 includes a pressure sensor or a tension sensor. Additionally, the first sensor assembly 10 also includes a support frame for supporting the pressure sensor or the tension sensor.
[0075] Horizontal reference point calibration step 402: Drive the silicon rod 1 to move toward the first sensor assembly 10. When the silicon rod 1 contacts the first sensor assembly 10, the controller can receive the first signal emitted by the first sensor assembly 10. The controller calibrates the horizontal position of the first sensor assembly 10 in the coordinate system as the horizontal position of the reference point according to the first signal.
[0076] Vertical reference point detection step 403: A second sensor assembly 11, which is communicatively connected to the controller, is disposed at a second preset position and spaced apart from the first sensor assembly 10; preferably, the second sensor assembly 11 includes a pressure sensor or a tension sensor. Additionally, the second sensor assembly 11 also includes a support frame for supporting the pressure sensor or the tension sensor.
[0077] Vertical reference point calibration step 404: Drive the silicon rod 1 to move toward the second sensor assembly 11. When the silicon rod 1 contacts the second sensor assembly 11, the controller can receive the second signal emitted by the second sensor assembly 11. The controller calibrates the vertical position of the second sensor assembly 11 in the coordinate system as the vertical position of the reference point according to the second signal.
[0078] In summary, combining Figure 4 As shown, the aforementioned second preset position refers to being above the cutting component and within... Figure 1 The right side of silicon rod 1. The cutting point can be calibrated through the above steps.
[0079] Step 500 for calculating the distance between the reference point and the cutting point: Using the origin O(0,0), the cutting point A(L,H) and the reference point B(x,y), the controller can calculate and determine the distance M between the reference point and the cutting point in the horizontal direction as xL; and the distance N between the reference point and the cutting point in the vertical direction as yH.
[0080] Silicon rod 1 moving and setting step 600: The silicon rod 1 to be cut is moved to the reference point position at the first preset time, and then moved xL distance along the first direction 8 and yH distance along the second direction 9 from the reference point position at the second preset time, which is later than the first preset time, so that the silicon rod 1 to be cut is moved to the cutting point B, thereby realizing the moving and setting of the tool.
[0081] In this embodiment, the origin calibration step is further followed by an origin modification step, which includes the following steps:
[0082] Origin horizontal direction change step: When the cutting part 7 moves in the first direction 8, restart the horizontal direction origin calibration step and update the position of the origin in the horizontal direction.
[0083] Vertical origin change procedure: When the drive unit 6 moves in the second direction 9, the vertical origin calibration procedure is restarted and the position of the origin in the vertical direction is updated.
[0084] In this embodiment, the controller is further connected in communication with the silicon rod 1 to be cut, and is able to control the movement of the silicon rod 1 to be cut.
[0085] In summary, this application only requires manual calibration once in the cutting point calibration step, and no manual intervention is required for subsequent tool setting. The overall solution makes the cutting of silicon rod 1 more accurate, reduces the workload of operators, and improves work efficiency. In addition, it improves the utilization rate of silicon material and reduces batch quality abnormalities caused by excessive tool setting errors.
[0086] Example 2
[0087] This application also provides a control system for automatic tool setting and alignment in silicon wafer cutting, which is based on the control method for automatic tool setting and alignment in silicon wafer cutting and has all the beneficial effects of the control method for automatic tool setting and alignment in silicon wafer cutting.
[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A control method for automatic tool setting and alignment during silicon wafer dicing, characterized in that, Includes the following steps: Origin calibration steps: Mark the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system; Tool setting parameters: Let L be the length of both ends of the silicon rod extending beyond the two ends of the cutting part of the cutting assembly along its length direction; let H be the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod. Cutting point calibration steps: The point formed by the tool setting parameters in the coordinate system is the cutting point, denoted as A, and the coordinates of A are (L, H); Reference point calibration steps: Above the cutting component, and at the second preset position, a reference point is denoted as B and the coordinates of B are (x, y); Steps for calculating the distance between the reference point and the cutting point: Using the origin O(0,0), the cutting point A(L,H), and the reference point B(x,y), we can determine the horizontal distance M between the reference point and the cutting point as xL; and the vertical distance N between the reference point and the cutting point as yH. Silicon rod moving and tool setting steps: The silicon rod to be cut is moved to the reference point position at a first preset time, and then moved a distance xL along the first direction and a distance yH along the second direction from the reference point position at a second preset time that is later than the first preset time, so that the silicon rod to be cut is moved to the cutting point B, thereby realizing the moving and tool setting. The cutting assembly includes a rotating roller and a cutting line; Multiple rotating rollers are provided, and the multiple rotating rollers are arranged at intervals to form a drive unit; The cutting lines are provided in multiple ways, and the multiple cutting lines are wound around the driving part at intervals along the first direction to form the cutting part; The origin calibration process includes the following steps: Horizontal origin calibration steps: Drive the silicon rod to move horizontally until it is flush with the cutting line at the end of the cutting part; Vertical origin calibration steps: Drive the silicon rod to move in the vertical direction until the end face of the silicon rod facing the cutting assembly contacts the cutting part; The reference point calibration process includes the following steps: Horizontal reference point detection steps: A first sensor component that is communicatively connected to the controller is set at the second preset position; Horizontal reference point calibration steps: Drive the silicon rod to move toward the first sensor assembly. When the silicon rod contacts the first sensor assembly, the controller can receive a first signal emitted by the first sensor assembly. The controller calibrates the horizontal position of the first sensor assembly in the coordinate system as the horizontal position of the reference point according to the first signal. Vertical reference point detection steps: A second sensor component, which is communicatively connected to the controller, is disposed at the second preset position and at a distance from the first sensor component; Vertical reference point calibration steps: Drive the silicon rod to move toward the second sensor assembly. When the silicon rod contacts the second sensor assembly, the controller can receive a second signal emitted by the second sensor assembly. The controller calibrates the vertical position of the second sensor assembly in the coordinate system as the vertical position of the reference point based on the second signal. The rotating rollers are provided in three ways, and the three rotating rollers are arranged in an isosceles triangle so that the end face of the cutting part facing the silicon rod is a plane; The origin calibration step is followed by an origin modification step, which includes the following steps: Origin horizontal direction change step: When the cutting part moves in the first direction, restart the horizontal direction origin calibration step and update the position of the origin in the horizontal direction; Vertical origin change step: When the driving unit moves in the second direction, restart the vertical origin calibration step and update the position of the origin in the vertical direction; The first sensor assembly includes a pressure sensor or a tension sensor; the second sensor assembly includes a pressure sensor or a tension sensor. Both the first sensor assembly and the second sensor assembly include a support frame, which is capable of supporting the pressure sensor or the tension sensor; The controller is communicatively connected to the silicon rod to be cut and is able to control the movement of the silicon rod to be cut.
2. A control system for automatic tool setting and alignment in silicon wafer cutting, characterized in that, The control method for automatic tool setting and alignment in silicon wafer cutting as described in claim 1.