High-temperature-resistant SBC system hot melt adhesive prepared by solvent method and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant SBC system hot melt adhesive prepared by a solvent method and a preparation method thereof, and the high-temperature-resistant SBC system hot melt adhesive prepared by the solvent method is prepared from the following raw materials in parts by mass: 40-60 parts of an organic solvent, 29-39 parts of SBC, 10-20 parts of tackifying resin and 0.5-1 part of an antioxidant. The organic solvent is any one of methylbenzene and ethyl acetate; the melt index of the SBC is 5 to 40 g / 10 min. In addition, the invention also provides a preparation method of the high-temperature-resistant SBC system hot melt adhesive prepared by the solvent method, and the high-temperature-resistant SBC system hot melt adhesive prepared by the solvent method and the preparation method of the high-temperature-resistant SBC system hot melt adhesive provided by the invention solve the problems that in the prior art, in order to ensure the flowability, the viscosity is limited, and the peeling strength and the temperature resistance are insufficient; the problem that the fluidity of the prepared hot melt adhesive in later processing is slightly influenced by the viscosity of the hot melt adhesive is solved, and the peel strength and the temperature resistance are enhanced.

Description

Technical Field

[0001] The invention relates to the technical field of adhesives, and in particular to a high-temperature resistant SBC system hot melt adhesive prepared by a solvent method and a preparation method thereof. Background Art

[0002] SBC system hot melt adhesive refers to hot melt adhesive based on styrene block copolymer (SBC). SBC is a thermoplastic elastomer, mainly including styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), hydrogenated SBS (SEBS) and hydrogenated SIS (SEPS). SBC has the elasticity of rubber at room temperature and plasticity at high temperature, and is an ideal raw material for preparing hot melt adhesive.

[0003] The preparation method of the traditional SBC system hot melt adhesive is to soften the SBC with cyclohexane oil as a plasticizer, then heat it to above 120°C, and stir and melt it to prepare it evenly. However, in the above preparation method, the amount of cyclohexane oil added is generally increased and the proportion of SBC in the hot melt adhesive is reduced to ensure that the SBC system hot melt adhesive has good fluidity during the later processing. Among them, in order to ensure that the prepared hot melt adhesive does not have oil leakage, the amount of cyclohexane oil used is generally controlled within 40% of the mass of SBC; since cyclohexane oil cannot be added in large quantities, it is necessary to reduce the proportion of SBC to ensure fluidity. Therefore, in the prior art, SBC generally accounts for less than 40% of the mass of the hot melt adhesive, so that the viscosity of the hot melt adhesive is stabilized in a lower range of less than 50,000cps / 170°C to ensure that the hot melt adhesive has high fluidity and meets the requirements of the later processing process.

[0004] However, due to the small proportion of SBC, the cohesion of the hot melt adhesive is poor to a certain extent, which leads to a certain limit in the peel strength and temperature resistance of the hot melt adhesive, making it difficult to meet the application requirements with high performance requirements. In addition, the preparation of SBC system hot melt adhesive using the above method requires heating, resulting in increased energy consumption. Summary of the invention

[0005] The purpose of the present invention is to provide a high-strength and high-temperature resistant SBC system hot melt adhesive prepared by a solvent method, so as to solve the problem that the SBC system hot melt adhesive in the prior art has limited viscosity in order to ensure fluidity, and has insufficient peel strength and temperature resistance.

[0006] Another object of the present invention is to propose a method for preparing a high-strength and high-temperature resistant SBC system hot melt adhesive prepared by a solvent method, to ensure that the fluidity of the prepared hot melt adhesive in later processing is less affected by its own viscosity, the peel strength and temperature resistance are enhanced, and to solve the problem of high energy consumption in the existing preparation process.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A high-temperature resistant SBC system hot melt adhesive prepared by a solvent method comprises the following raw materials, calculated by weight: 40-60 parts of an organic solvent, 29-39 parts of SBC, 10-20 parts of a tackifying resin and 0.5-1 part of an antioxidant; the organic solvent is any one of toluene and ethyl acetate; and the melt index of the SBC is 5-40 g / 10 min.

[0009] Furthermore, the styrene content in the SBC is 15-30% by mass.

[0010] Preferably, the tackifying resin has a softening point of 100-140°C.

[0011] Furthermore, the tackifying resin is any one of rosin resin, rosin modified resin, petroleum resin, terpene phenol resin and monomer resin.

[0012] Furthermore, the petroleum resin is any one of C5 petroleum resin, modified C5 petroleum resin, C9 petroleum resin and modified C9 petroleum resin.

[0013] Preferably, the antioxidant is 1010 antioxidant.

[0014] Preferably, the SBC is any one or more combinations of SIS, SBS and SEBS.

[0015] Furthermore, the SBC is a SIS.

[0016] A method for preparing a high temperature resistant SBC system hot melt adhesive prepared by a solvent method comprises the following steps:

[0017] A. Add the formulated amount of organic solvent and tackifying resin into a reaction kettle, and stir at room temperature until they are uniformly dissolved to obtain a mixed solution I;

[0018] B. Add the formulated amount of SBC and antioxidant to the mixed solution I, and stir until they are uniformly dissolved to obtain a mixed solution II;

[0019] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0020] Furthermore, in step A and step B, the stirring speed is 30-50RPM.

[0021] The technical solution provided by the present invention may include the following beneficial effects:

[0022] 1. This technical solution increases the proportion of SBC by adding corresponding mass fractions of SBC and tackifying resin, so that the prepared hot melt adhesive has good temperature resistance and peel strength, and has high viscosity.

[0023] 2. This technical solution uses a solvent method to prepare hot melt adhesive, which ensures good fluidity during the later processing while ensuring that the proportion of SBC reaches the required level, and omits the heating step, thereby reducing energy consumption. DETAILED DESCRIPTION

[0024] The technical solution of the present invention is further illustrated below through specific implementation methods.

[0025] In order to facilitate the understanding of the present invention, the present invention is described more fully below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0026] If no specific techniques or conditions are specified in the examples, the techniques or conditions described in the literature in the field or the product instructions are used. If no manufacturer is specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0027] The technical solution provides a high-temperature resistant SBC system hot melt adhesive prepared by a solvent method, which includes the following raw materials, calculated by weight: 40-60 parts of an organic solvent, 29-39 parts of SBC, 10-20 parts of a tackifying resin and 0.5-1 part of an antioxidant; the organic solvent is any one of toluene and ethyl acetate; the melt index of the SBC is 5-40g / 10min.

[0028] In order to solve the problems existing in the prior art, the present technical solution proposes a high temperature resistant SBC system hot melt adhesive prepared by a solvent method, wherein the raw materials include an organic solvent, SBC, a tackifying resin and an antioxidant. Compared with the prior art which uses cyclohexane oil as a plasticizer to soften SBC, the present technical solution uses an organic solvent to dissolve SBC. The organic solvent is any one of toluene and ethyl acetate, both of which are good organic solvents, and both can dissolve the styrene component in SBC and reduce the interaction between the molecular chains of SBC. At the same time, the organic solvent has a low viscosity and can be mixed with the polymer in the hot melt adhesive to reduce the overall viscosity, thereby ensuring that the hot melt adhesive has good fluidity and is easy to apply during the subsequent processing. During this period, according to the characteristics of good volatility of toluene and ethyl acetate, they are easy to remove or recycle, and will not affect the viscosity of the hot melt adhesive obtained in the end, and there is no need to limit the amount of SBC added to ensure that the hot melt adhesive has good fluidity during the later processing.

[0029] Specifically, SBC is the abbreviation of styrene block copolymer, which has good rubber-like elasticity and flexibility, is a thermoplastic elastomer with the most similar properties to rubber, and has excellent tensile length. It is the basic material of SBC system hot melt adhesive. At the same time, there is also a tackifying resin in the raw materials. The tackifying resin has good adhesion and good compatibility with SBC. It can be evenly distributed in the hot melt adhesive to ensure that it plays its role, which is beneficial to the hot melt adhesive bonding material.

[0030] Secondly, the raw materials of hot melt adhesive also include antioxidants, which can effectively terminate free radical chain reactions caused by factors such as heat, light, and oxygen, prevent the polymer chains contained in the hot melt adhesive from producing peroxides under the action of long-term heat and oxygen, thereby improving the thermal stability of the hot melt adhesive and effectively improving the anti-aging properties of the hot melt adhesive.

[0031] It is worth noting that since this solution uses toluene or ethyl acetate as a solvent, the hot melt adhesive has good fluidity in the later processing. Therefore, the viscosity limit of the hot melt adhesive is relaxed during the early preparation, that is, the proportion of SBC in the hot melt adhesive can be increased. Calculated by mass, the formula amount of SBC added in this technical solution is 29-39 parts, and the formula amount of tackifying resin is 10-20 parts. Within this range, the viscosity of the prepared hot melt adhesive is as high as 100,000 cps / 170°C, which has better bonding strength and can provide stronger adhesion, and is suitable for bonding occasions that need to withstand greater stress. And the proportion of SBC is greater than 59%, SBC has good thermal stability, and its molecular structure can withstand high temperatures without significant degradation; in addition, as the mass proportion of SBC increases, the polymer network structure of the hot melt adhesive will become more complex and stable, which can effectively disperse stress and prevent the softening and deformation of the cured hot melt adhesive to a certain extent when heated. Compared with the prior art that softens SBC by using cyclopentane oil as a plasticizer, the proportion of SBC is less than 40%. The proportion of SBC in the hot melt adhesive of the present technical solution is increased, which can effectively improve the temperature resistance of the hot melt adhesive, reduce the performance degradation caused by high temperature, and make the hot melt adhesive less brittle under high temperature conditions, thereby maintaining the corresponding bonding performance and mechanical strength, and solving the problem that the proportion of SBC in the prior art is small, the cohesion of the obtained hot melt adhesive is poor, and then the temperature resistance and peel strength of the hot melt adhesive are insufficient, and it is difficult to meet the application requirements with high performance requirements.

[0032] In addition, this scheme also limits the melt index of SBC. The melt index reflects the molecular weight of SBC. If the melt index is too low and the molecular weight of SBC is too large, the viscosity of the hot melt adhesive produced will be too high, the fluidity will be poor, and it will be difficult to apply during use. From a performance perspective, the wetting and penetration of the hot melt adhesive into the substrate will be poor, which will reduce the bonding performance and initial adhesion performance of the hot melt adhesive. On the contrary, if the melt index is too high, the strength of the rubber will be weakened, which will also affect the bonding effect and heat resistance of the hot melt adhesive. Therefore, this scheme limits the melt index of SBC to 5-40g / 10min. While the hot melt adhesive can have the required fluidity, the proportion of SBC can also be increased, which can not only meet the needs of later processing, but also improve the heat resistance and peel strength of the hot melt adhesive.

[0033] Secondly, according to the weight percentage, the formula amount of organic solvent is 40-60 parts. If the amount of organic solvent is too low, it is difficult to dissolve other components. If the amount is too much, the proportion of other components is too small, and the amount of hot melt adhesive prepared is too small. The solvent needs to be removed later, which increases the cost. At the same time, the formula amount of antioxidant is 0.5-1 part. If the amount of antioxidant added is too low, the anti-aging performance of the hot melt adhesive is poor. If the amount added is too high, the performance improvement of excessive use is not obvious, resulting in cost waste.

[0034] Preferably, the styrene content in the SBC is 15-30% by mass.

[0035] Specifically, styrene plays a physical crosslinking role in SBC, that is, it provides rigidity and strength to SBC. Increasing the styrene content can effectively improve the tensile strength of SBC and affect the elasticity and flexibility of SBC. The styrene content of the SBC is 15-30%. Within this range, the physical crosslinking effect is moderate, meeting the strength requirements while having corresponding flexibility, and can effectively improve the bonding performance of the hot melt adhesive.

[0036] At the same time, styrene monomer has high thermal stability and temperature resistance. A styrene content of 15-30% can make the hot melt adhesive have good thermal stability and maintain stable performance under high temperature conditions.

[0037] Preferably, the tackifying resin has a softening point of 100-140°C.

[0038] It is worth noting that the tackifying resin can mainly improve the bonding performance of the hot melt adhesive to the substrate, and the softening point of the tackifying resin will affect the holding strength, melt viscosity and thermal stability of the hot melt adhesive. If the softening point of the tackifying resin is too low, the high-temperature bonding effect is poor; if the softening point of the tackifying resin is too high, the flexibility of the prepared hot melt adhesive is poor. The softening point of the tackifying resin is 100-140°C. Within this range, the obtained hot melt adhesive can have good cohesive strength, and the corresponding holding strength is also within the required range, ensuring that the hot melt adhesive has good bonding properties without affecting fluidity and coating properties.

[0039] Furthermore, the tackifying resin is any one of rosin resin, rosin modified resin, petroleum resin, terpene phenol resin and monomer resin.

[0040] Specifically, the tackifying resin used is one of rosin resin, rosin modified resin, petroleum resin, terpene phenol resin and monomer resin. These tackifying resins have good compatibility with SBC, can be evenly distributed in the hot melt adhesive to play a role, can reduce the melt viscosity of the hot melt adhesive, improve the wettability and initial adhesion to the bonded surface, so as to achieve the purpose of improving the bonding strength. At the same time, these tackifying resins have certain aging resistance and can extend the service life of the hot melt adhesive.

[0041] Furthermore, the petroleum resin is any one of C5 petroleum resin, modified C5 petroleum resin, C9 petroleum resin and modified C9 petroleum resin.

[0042] Specifically, C5 petroleum resin, C9 petroleum resin and modified resins of the above two petroleum resins have the excellent properties of low acid value, good miscibility, water resistance, ethanol resistance and chemical resistance. Compared with other types of petroleum resins, the above petroleum resins have better compatibility and heat resistance, high transparency, low cost, and are more suitable for use as tackifying resins.

[0043] Preferably, the antioxidant is 1010 antioxidant.

[0044] Specifically, the antioxidant can improve the anti-aging performance of the hot melt adhesive. The antioxidant is 1010 antioxidant, that is, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] antioxidant. Antioxidant 1010 is a large molecular multifunctional hindered phenol antioxidant. It has excellent antioxidant properties on polypropylene and polyethylene, can effectively extend the service life of the hot melt adhesive, and has low volatility and good extraction resistance, which means that during the use of the hot melt adhesive, it is not easy to evaporate or be extracted, thereby maintaining the stable performance of the hot melt adhesive.

[0045] Preferably, the SBC is any one or more combinations of SIS, SBS and SEBS.

[0046] Specifically, SIS, SBS and SEBS are styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer and styrene-ethylene / butylene-styrene block copolymer respectively. All three are environmentally friendly and non-toxic products. Among them, SIS is a mid-block polyisoprene with a side chain methyl group in its structure, so it has good cohesion and excellent adhesion properties, while SEBS is a hydrogenated SBS with better weather resistance and aging resistance and can be used in a wider temperature range.

[0047] Furthermore, the SBC is a SIS.

[0048] It is worth noting that compared with styrene block copolymers of other structures, styrene-isoprene-styrene block copolymer (SIS) rubber has better compatibility with other materials and has a lower modulus and solution viscosity, which makes it have better processing performance and better fluidity.

[0049] A method for preparing a high temperature resistant SBC system hot melt adhesive prepared by a solvent method comprises the following steps:

[0050] A. Add the formulated amount of organic solvent and tackifying resin into a reaction kettle, and stir at room temperature until they are uniformly dissolved to obtain a mixed solution I;

[0051] B. Add the formulated amount of SBC and antioxidant to the mixed solution I, and stir until they are uniformly dissolved to obtain a mixed solution II;

[0052] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0053] Specifically, the tackifying resin is first dissolved evenly in an organic solvent, and then the corresponding amount of SBC and antioxidant are added and dissolved evenly, which can effectively ensure that the tackifying resin is evenly distributed in the mixed solution II and improve its compatibility with SBC. Moreover, the tackifying resin is easier to dissolve and disperse in organic solvents than SBC. Dissolving the tackifying resin first can reduce the complexity and time of the preparation process, help reduce the instability of the hot melt adhesive during the preparation process, and improve the consistency and reliability of the final product.

[0054] Among them, the vacuum operation is used in step C to remove bubbles in the solution, which can effectively ensure the uniformity and stability of the colloid, reduce defects in the finished product (such as pinholes and unevenness), and help reduce the oxidation of the hot melt adhesive and extend the service life.

[0055] Furthermore, this solution does not require heating and can effectively reduce energy consumption.

[0056] Preferably, in step A and step B, the stirring speed is 30-50RPM.

[0057] Specifically, the stirring speed is 30-50RPM. Within this range, a high dissolution rate can be ensured while the molecular chains are not easily broken and liquid splashing can be prevented.

[0058] The technical solution of the present invention is further illustrated below through specific implementation methods.

[0059] Performance Test:

[0060] 190℃ melt viscosity: According to "HG / T 3660-1999 Determination of Melt Viscosity of Hot Melt Adhesives", the test temperature is 190℃ to test the melt viscosity.

[0061] 180° peel strength (N / 25mm, 23°C): The peel strength is measured according to GB / T 2792-1998 Adhesive tape 180° peel strength test method.

[0062] Holding strength (min / 60℃): The holding strength is tested according to the test method of "GB / T 4851-2014 Test method for holding strength of adhesive tapes".

[0063] SAFT (1 kg weight): According to the test method for shear failure temperature (SAFT) of pressure-sensitive adhesive tapes, the corresponding temperature at the corresponding strength is measured.

[0064] Example Group

[0065] Example 1

[0066] A. Calculated by mass, 50 parts of organic solvent and 15 parts of tackifying resin were added into a reaction kettle, and stirred at room temperature until they were uniformly dissolved at a stirring speed of 30 RPM to obtain a mixed solution I;

[0067] B. Add 34 parts of SBC and 1 part of antioxidant to mixed solution I according to the weight fractions, stir until dissolved evenly at a stirring speed of 30 RPM to obtain mixed solution II;

[0068] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0069] Wherein, the organic solvent is toluene, the tackifying resin is hydrogenated C5 petroleum resin (specifically 6130 resin produced by Ningbo Jinhai Chenguang Chemical Co., Ltd.), the SBC is SIS (specifically 20 parts of 4113N produced by Taiwan Rubber Co., Ltd. and 14 parts of SIS1209 produced by Hunan Baling Petrochemical), the corresponding melt index is 10g / 10min (200°C, 5kg), and the antioxidant is 1010 antioxidant.

[0070] Example 2

[0071] A. Calculated by mass, 40 parts of organic solvent and 20 parts of tackifying resin were added into a reaction kettle, and stirred at room temperature until they were uniformly dissolved at a stirring speed of 50 RPM to obtain a mixed solution I;

[0072] B. Add 29 parts of SBC and 0.5 parts of antioxidant to mixed solution I according to the weight fractions, and stir until dissolved uniformly at a stirring speed of 50 RPM to obtain mixed solution II;

[0073] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0074] Wherein, the organic solvent is toluene, the tackifying resin is KA120 resin produced by Guangdong Kemao Linchan Chemical Co., Ltd., the SBC is SIS (specifically SIS1125 produced by Hunan Baling Petrochemical), the corresponding melt index is 12g / 10min (200°C, 5kg), and the antioxidant is 1010 antioxidant.

[0075] Example 3

[0076] A. Calculated by mass, 60 parts of organic solvent and 10 parts of tackifying resin were added into a reaction kettle, and stirred at room temperature until they were uniformly dissolved at a stirring speed of 40 RPM to obtain a mixed solution I;

[0077] B. Add 39 parts of SBC and 0.8 parts of antioxidant to mixed solution I according to the weight fractions, and stir until dissolved evenly at a stirring speed of 40 RPM to obtain mixed solution II.

[0078] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0079] Wherein, the organic solvent is toluene, the tackifying resin is a monomer resin (specifically 290 resin produced by Eastman Company of the United States), the SBC is SIS (specifically SISD1163 produced by Kraton Corporation), the corresponding melt index is 22g / 10min (200°C, 5kg), and the antioxidant is 1010 antioxidant.

[0080] Comparative group

[0081] Comparative Example 1

[0082] Calculated by mass percentage, the raw materials of the hot melt adhesive include 10% cyclohexane oil, 34% high molecular polymer, 55% hydrogenated petroleum resin and 1% antioxidant; wherein the high molecular polymer includes 13% high melt index SIS rubber, 15% SBS rubber and 4% SSBR rubber.

[0083] The cyclohexane oil, high molecular polymer and antioxidant are mixed evenly according to the proportion, heated to 120-150°C, evacuated, and stirred continuously until all components are completely melted; hydrogenated petroleum resin is added, heated at a temperature of 120-150°C until the hydrogenated petroleum resin is completely melted, stirred evenly, and evacuated until there are no bubbles, thereby obtaining a hot melt adhesive prepared by heating and melting the cyclohexane oil as a plasticizer according to the prior art.

[0084] Comparative Example 2

[0085] Compared with Example 2, the raw material ratio of Comparative Example 2 is different, and the raw materials used and the preparation method are the same.

[0086] A. According to the formula of the hot melt adhesive, 40 parts of organic solvent and 20 parts of tackifying resin are added into a reaction kettle by weight, and stirred at room temperature until they are uniformly dissolved at a stirring speed of 50 RPM to obtain a mixed solution I;

[0087] B. Add 20 parts of SBC and 0.5 parts of antioxidant to mixed solution I according to the weight fractions, and stir until dissolved evenly at a stirring speed of 50 RPM to obtain mixed solution II.

[0088] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0089] Wherein, the organic solvent is toluene, the tackifying resin is KA120 resin produced by Guangdong Kemao Linchan Chemical Co., Ltd., the SBC is SIS (specifically SIS1125 produced by Hunan Baling Petrochemical), the corresponding melt index is 12g / 10min (200°C, 5kg), and the antioxidant is 1010 antioxidant.

[0090] Comparative Example 3

[0091] Compared with Example 2, the raw materials of Comparative Example 3 are different, but the raw material ratio and preparation method are the same.

[0092] A. According to the formula of the hot melt adhesive, 40 parts of organic solvent and 20 parts of tackifying resin are added into a reaction kettle by weight, and stirred at room temperature until they are uniformly dissolved at a stirring speed of 50 RPM to obtain a mixed solution I;

[0093] B. Add 29 parts of SBC and 0.5 parts of antioxidant to mixed solution I according to the weight fractions, and stir until dissolved uniformly at a stirring speed of 50 RPM to obtain mixed solution II;

[0094] C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

[0095] Among them, the organic solvent is toluene, the tackifying resin is KA120 resin produced by Guangdong Kemao Forest Products Co., Ltd., the SBC is SBS (specifically 3201N produced by Taiwan Rubber Co., Ltd.), the corresponding melt index is 1g / 10min (200°C, 5kg), and the antioxidant is 1010 antioxidant.

[0096] Hot melt adhesives were prepared according to the above embodiments and comparative examples, wherein the melt index of the SBC used in comparative example 3 was not within the range defined by the present technical solution, the melt index was less than 5 g / 10 min, the fluidity was poor, and in the later processing, it could not be normally coated for performance testing, and the feasibility was low.

[0097] The hot melt adhesives prepared in the above examples and comparative examples 1-2 were subjected to performance tests, and the specific test results are shown in Table 1 below:

[0098] Table 1 Hot melt adhesive related performance test results

[0099]

[0100] From the test results in Table 1, it can be seen that the 190°C melt viscosity of the SBC system hot melt adhesive prepared by the present technical solution is 55000-68000cps, the 180-degree peel force is 105-110 (N / 25mm, 23°C), and the holding force is greater than 1500min / 60°C. Under a weight of 1kg, the temperature that can be reached is 80°C-85°C, wherein the 190°C melt viscosity, 180-degree peel force, holding force, and the temperature that can be withstood at the same strength are all greater than those of Comparative Example 1, indicating that the present technical solution uses a solvent method, and while having good fluidity, the proportion of SBC is increased, which can significantly enhance the peel strength and high temperature resistance of the hot melt adhesive, while also having good holding force and fluidity.

[0101] In Comparative Example 1, cyclohexane oil was used as a plasticizer to soften SBC, which was then heated to above 120° C. and stirred to melt uniformly to prepare a hot melt adhesive. The melt viscosity, peel strength, and holding strength of the obtained hot melt adhesive at 190° C., as well as the temperature that can be withstood at the same strength, were not as good as those of Examples 1-3.

[0102] In Comparative Example 2, the number of SBC added is 20 parts by mass, which is not within the range specified by the present technical solution. The obtained hot melt adhesive has poor cohesion. Correspondingly, under high temperature conditions, the melt viscosity is less than that of Example 2, and the peel force, holding force and strength are not as good as those of Example 2.

[0103] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A high temperature resistant SBC system hot melt adhesive prepared by a solvent method, characterized in that: Calculated by weight, the following raw materials are included: 40-60 parts of organic solvent, 29-39 parts of SBC, 10-20 parts of tackifying resin and 0.5-1 parts of antioxidant; The organic solvent is any one of toluene and ethyl acetate; The SBC has a melt index of 5-40 g / 10 min.

2. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 1, characterized in that: In terms of mass percentage, the styrene content in the SBC is 15-30%.

3. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 1, characterized in that: The softening point of the tackifying resin is 100-140°C.

4. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 3, characterized in that: The tackifying resin is any one of rosin resin, rosin modified resin, petroleum resin, terpene phenol resin and monomer resin.

5. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 4, characterized in that: The petroleum resin is any one of C5 petroleum resin, modified C5 petroleum resin, C9 petroleum resin and modified C9 petroleum resin.

6. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 1, characterized in that: The antioxidant is 1010 antioxidant.

7. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 1, characterized in that: The SBC is any one or more combinations of SIS, SBS and SEBS.

8. The high temperature resistant SBC system hot melt adhesive prepared by solvent method according to claim 7, characterized in that: The SBC is a SIS.

9. A method for preparing a high temperature resistant SBC system hot melt adhesive prepared by a solvent method, characterized in that: The following steps are involved: A. Add the formulated amount of organic solvent and tackifying resin into a reaction kettle, and stir at room temperature until they are uniformly dissolved to obtain a mixed solution I; B. Add the formulated amount of SBC and antioxidant to the mixed solution I, and stir until they are uniformly dissolved to obtain a mixed solution II; C. Vacuum the mixed liquid II until there are no bubbles in the mixed liquid II to obtain hot melt adhesive.

10. The method for preparing a high temperature resistant SBC system hot melt adhesive prepared by a solvent method according to claim 9, characterized in that: In step A and step B, the stirring speed is 30-50RPM.

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