Preparation process of semiconductor grade quartz device key raw material ultra-pure quartz sand

Abstract

The invention relates to the technical field of quartz sand preparation, and discloses a preparation process of ultra-pure quartz sand serving as a key raw material of a semiconductor-grade quartz device, which comprises the following steps: step 1, placing cleaned quartz sand on a mounting unit; and 2, the placed quartz sand can be heated and dried through the transmission unit. According to the device, when the first sliding mechanism moves downwards, a third sliding block in a third sliding mechanism can be driven to horizontally move through a movable rod, and when the third sliding block horizontally moves, a push plate can be driven to horizontally move, so that an overturning plate is pushed by the push plate to overturn until the concave discharging pipeline is blocked; at the moment, the push plate is located in the middle of the bottom of the turnover plate in the horizontal state, and the movable sliding block is located in the middle of the downward moving end of the special-shaped sliding groove, so that quartz sand feeding can be controlled, and it is guaranteed that more quartz sand cannot appear in the drying process.

Description

Technical Field

[0001] The invention belongs to the technical field of quartz sand preparation, and in particular relates to a preparation process of ultra-high purity quartz sand, which is a key raw material for semiconductor-grade quartz devices. Background Art

[0002] With the rapid development of semiconductor technology, the performance requirements for quartz devices are getting higher and higher. Ultra-high purity quartz sand is the key raw material for quartz devices, and its purity directly affects the quality and performance of quartz devices.

[0003] However, in the existing process of preparing quartz sand, the quartz sand after acid washing is often directly dried after cleaning, and all the quartz sand is placed in the drying equipment. Due to the large amount of quartz sand, the outer quartz sand is dried first during the drying process, while the inner quartz sand dries slowly, so it is impossible to determine whether the inner quartz sand is dried, and then it is taken out, resulting in low quartz sand drying efficiency. In view of this, the present invention is proposed. Summary of the invention

[0004] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is: A preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices, comprises the following steps: Step 1: Place the cleaned quartz sand on the mounting unit; Step 2: The placed quartz sand can be heated and dried through the transmission unit; Step 3: The transmission unit can then drive the rotating unit to rotate slightly, and transfer the heated quartz sand to the rotating unit, so that the rotating unit can swing and dehydrate the quartz sand; Step 4: When the transmission unit is running, it can drive the control unit to control the feeding of quartz sand; The mounting unit comprises a mounting base, lower supporting legs are fixedly mounted around the bottom of the mounting base, a working box is fixedly mounted above the mounting base, four upper supporting legs distributed in a circumferential manner are fixedly mounted on the upper end of the working box, and fixed plates are fixedly mounted on the tops of the upper supporting legs, and a feed hopper is fixedly mounted on one side wall opposite to the four fixed plates, a concave material discharge pipe is fixedly mounted on the bottom of the feed hopper, the concave material discharge pipe is located in the inner cavity of the working box, and a flip plate is rotatably mounted on one side wall of the concave material discharge pipe; The rotating unit comprises a rotating drum, and rotating rods are arranged on opposite side walls of the rotating drum, and the two rotating rods are symmetrical with each other, and bearings are arranged on opposite ends of the two rotating rods, and the two bearings are arranged on opposite side walls of the inner cavity of the working box, respectively. A placement slot is also provided on the rotating drum, and two symmetrical positioning plates are fixedly installed on the rotating drum. A base is rotatably arranged at the bottom of the rotating drum, and the two ends of the base are fixedly connected to the opposite side walls of the inner cavity of the working box, a slot is provided in the middle of the base, and a piston rod is arranged in the inner cavity of the slot; The transmission unit includes a driving assembly and a heating cylinder. A conical plate is attached to and arranged at the bottom of the heating cylinder. A mounting plate is fixedly installed at the bottom of the conical plate. A moving rod is fixedly installed at the bottom of the mounting plate. The driving assembly is used to drive the mounting plate to move vertically downward. The vertical downward movement of the mounting plate can drive the rotating cylinder to rotate and the control unit to move horizontally.

[0005] As a preferred embodiment of the present invention, the driving assembly includes a servo motor, which is installed above the inner cavity of the working box. A rotating rod is fixedly installed on the output end of the servo motor, and a driving gear is fixedly installed on the end of the rotating rod away from the servo motor. A driven gear is meshedly installed on one side wall of the driving gear, and a lower circular mounting cylinder is sleeved in the middle of the driven gear.

[0006] As a preferred embodiment of the present invention, a lower discharge port is provided at the bottom of the lower circular mounting tube, the lower discharge port and the placement slot are aligned with each other, an inclined surface is provided in the inner cavity of the lower circular mounting tube, an upper circular mounting tube is installed above the lower circular mounting tube, and an upper discharge port is provided at the top of the upper circular mounting tube.

[0007] As a preferred embodiment of the present invention, a circular limiting ring is fixedly installed on the inner wall of the upper circular mounting cylinder, and a special-shaped slide groove is opened on the inner wall of the upper circular mounting cylinder. The special-shaped slide groove is distributed in a wave shape on the inner wall of the upper circular mounting cylinder, and three movable sliders distributed in a circular manner are slidably installed in the inner cavity of the special-shaped slide groove, and the three movable sliders are respectively installed with mounting plates on one side wall away from the special-shaped slide groove.

[0008] As a preferred embodiment of the present invention, a circular positioning ring is fixedly installed on the outer wall of the heating tube, the circular positioning ring is located above the circular limiting ring, and an extrusion mechanism is arranged on the top of the heating tube.

[0009] As a preferred embodiment of the present invention, the extrusion mechanism includes two rectangular mounting cylinders, which are fixedly mounted on the bottom of the inner cavity of the upper circular mounting cylinder. The two rectangular mounting cylinders are symmetrical to each other, and the inner cavities of the two rectangular mounting cylinders are both provided with a second sliding mechanism.

[0010] As a preferred embodiment of the present invention, the second sliding mechanism includes four second sliding grooves, and the four second sliding grooves are respectively opened on the inner walls of the two upper circular mounting cylinders between two of them, and the four second sliding grooves are symmetrical with each other. The inner cavities of the four second sliding grooves are all slidably installed with second sliders, and the four second sliders are symmetrical with each other, and the four second sliders are fixedly connected with a placement plate between two of them.

[0011] As a preferred embodiment of the present invention, a rectangular plug-in rod is fixedly installed on one side wall of the two placement plates, and one end of the two rectangular plug-in rods away from the placement plates is fixedly connected to the top of the upper circular mounting tube, and one end of the two placement plates away from the rectangular plug-in rod is fixedly connected to a return spring, and the other end of the two return springs is fixedly connected to the top of the inner cavity of the rectangular mounting tube.

[0012] As a preferred embodiment of the present invention, a movable plate is fixedly installed at the bottom of the movable rod, and a first sliding mechanism is arranged on the movable plate. The first sliding mechanism includes two first sliding grooves, and the two first sliding grooves are opened on two side walls opposite to each other in the inner cavity of the working box. The two first sliding grooves are symmetrical to each other, and first sliding rods are slidably installed in the inner cavities of the two first sliding grooves, and one side wall opposite to the two first sliding rods is fixedly connected to the movable rod, and the movable plate and two positioning plates are slidably connected.

[0013] As a preferred embodiment of the present invention, a movable rod is movably installed above the first sliding rod, and a third sliding mechanism is arranged at the other end of the movable rod. The third sliding mechanism includes a third sliding groove, and a third slider is slidably installed in the inner cavity of the third sliding groove. A movable rod is movably installed on the third slider, and a push plate is fixedly installed on one side wall of the third slider, and the other end of the push plate is fitted on the flip plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention, firstly, the staff drives the lower circular mounting cylinder and the upper circular mounting cylinder to rotate through the driving assembly, so that the mounting plate can be driven to move vertically downward with the assistance of the moving rod, the moving plate and the first sliding mechanism through the special-shaped sliding groove and the moving slider arranged in the inner cavity of the upper circular mounting cylinder, so that when the moving plate moves vertically downward, the rotating drum can be driven to rotate, and at the same time, when the first sliding mechanism moves downward, the movable rod can drive the third slider in the third sliding mechanism to move horizontally, and when the third slider moves horizontally, it will be able to drive the push plate to move horizontally, thereby pushing the flip plate to flip through the push plate until the concave feeding pipe is blocked. At this time, the push plate is located in the middle position of the bottom of the flip plate in a horizontal state, and the moving slider is located in the middle position of the downward moving end of the special-shaped sliding groove, so that the quartz sand feeding can be controlled, ensuring that not too much quartz sand will appear during the drying process.

[0015] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In the attached picture: Figure 1 The three-dimensional structural diagram of the preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 2 The schematic diagram of the structure of the bottom view is a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 3 A cross-sectional view of a working box for the preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices (I) Structural schematic diagram; Figure 4 A cross-sectional view of a working box (II) for the preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 5 A schematic diagram of the inner cavity structure of a working box for the preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 6 The schematic diagram of the cross-sectional structure of the lower circular mounting tube of a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 7 It is a schematic diagram of the cross-sectional and bottom-view structure of an upper circular mounting cylinder of a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Figure 8 A schematic diagram of the inner cavity structure of an upper circular mounting tube in a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices; Fig. 9 The present invention is a schematic diagram of the extrusion mechanism structure of a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices.

[0017] In the figure: 100, mounting unit; 101, mounting base; 1011, lower supporting leg; 1012, working box; 102, upper supporting leg; 1021, fixing plate; 1022, feeding hopper; 103, concave feeding pipe; 1031, turning plate; 200, transmission unit; 201, servo motor; 2011, rotating rod; 2012, driving gear; 2013, driven gear; 202, lower circular mounting cylinder; 2021, lower discharge port; 2022, upper discharge port; 203, upper circular mounting cylinder; 2031, special-shaped slide groove; 2032, moving slider; 2033, circular limiting ring; 204, mounting plate; 2041, conical plate; 2042, heating cylinder; 2043, circular positioning ring; 205, moving rod; 2051, moving plate; 2052, first slide groove; 2053, first slide rod; 206, rectangular mounting cylinder; 2061, rectangular plug-in rod; 2062, second slide groove; 2063, second slider; 2064, placement plate; 2065, reset spring; 300, rotating unit; 301, rotating drum; 3011, rotating rod; 3012, bearing; 3013, placement notch; 3014, positioning plate; 302, base; 3021, piston rod; 500, control unit; 501, movable rod; 5011, third slide groove; 5012, third slide block; 5013, push plate. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0019] Embodiment 1:

[0020] like Figures 1 to 9As shown, a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices, includes the following method steps: step 1: placing the cleaned quartz sand on the mounting unit 100; step 2: heating and drying the placed quartz sand through the transmission unit 200; step 3: the transmission unit 200 can drive the rotating unit 300 to rotate slightly, and transmit the heated quartz sand to the rotating unit 300, so that the rotating unit 300 swings and dehydrates the quartz sand; step 4: while the transmission unit 200 is running, it can drive the control unit 500 to control the quartz sand to rotate slightly. Sand feeding; the installation unit 100 includes a mounting base 101, lower support legs 1011 are fixedly installed around the bottom of the mounting base 101, a working box 1012 is fixedly installed above the mounting base 101, four upper support legs 102 arranged in a circumferential distribution are fixedly installed on the upper end of the working box 1012, and fixed plates 1021 are fixedly installed on the top of the upper support legs 102, and a feeding hopper 1022 is fixedly installed on the side wall opposite to the four fixed plates 1021, and a concave feeding pipe 103 is fixedly installed at the bottom of the feeding hopper 1022, and the concave feeding pipe 103 is located in the inner cavity of the working box 1012, A flip plate 1031 is rotatably installed on one side wall of the concave discharge pipe 103; the rotating unit 300 includes a rotating drum 301, and rotating rods 3011 are arranged on opposite sides of the rotating drum 301. The two rotating rods 3011 are symmetrical to each other, and bearings 3012 are arranged on opposite ends of the two rotating rods 3011. The two bearings 3012 are respectively arranged on opposite sides of the inner cavity of the working box 1012. A placement slot 3013 is also opened on the rotating drum 301, and two mutually symmetrical positioning plates 3014 are fixedly installed on the rotating drum 301. A base 302 is rotatably arranged at the bottom of the rotating drum 301, and the base 302 is rotatably arranged at the bottom of the rotating drum 301. 02 are fixedly connected at both ends to the opposite side walls of the inner cavity of the working box 1012, a slot is opened in the middle of the base 302, and a piston rod 3021 is arranged in the inner cavity of the slot; the transmission unit 200 includes a driving assembly and a heating cylinder 2042, a conical plate 2041 is attached and arranged on the bottom of the heating cylinder 2042, a mounting plate 204 is fixedly installed on the bottom of the conical plate 2041, a moving rod 205 is fixedly installed on the bottom of the mounting plate 204, and the driving assembly is used to drive the mounting plate 204 to move vertically downward, and the vertical downward movement of the mounting plate 204 can drive the rotating cylinder 301 to rotate and the control unit 500 to move horizontally.First, the staff drives the lower circular mounting cylinder 202 and the upper circular mounting cylinder 203 to rotate through the driving assembly, so that the mounting plate 204 can be driven to move vertically downward with the assistance of the moving rod 205, the moving plate 2051 and the first sliding mechanism through the special-shaped sliding groove 2031 and the moving slider 2032 set in the inner cavity of the upper circular mounting cylinder 203, so that when the moving plate 2051 moves vertically downward, the rotating cylinder 301 can be driven to rotate, and at the same time, when the first sliding mechanism moves downward, the third sliding mechanism can be driven through the movable rod 501. The third slider 5012 in the mechanism moves horizontally. When the third slider 5012 moves horizontally, it will be able to drive the push plate 5013 to move horizontally, so that the flip plate 1031 is pushed to flip through the push plate 5013 until the concave discharge pipe 103 is blocked. At this time, the push plate 5013 is located in the middle position of the bottom of the flip plate 1031 in a horizontal state, and the moving slider 2032 is located in the middle position of the downward moving end of the special-shaped slide groove, so that the quartz sand feeding can be controlled to ensure that there will not be too much quartz sand during the drying process.

[0021] like Figures 3 to 5 As shown, in a specific embodiment, the driving assembly includes a servo motor 201, which is installed above the inner cavity of the working box 1012, and a rotating rod 2011 is fixedly installed at the output end of the servo motor 201, and a driving gear 2012 is fixedly installed at one end of the rotating rod 2011 away from the servo motor 201, and a driven gear 2013 is meshed and installed on one side wall of the driving gear 2012, and a lower circular installation cylinder 202 is sleeved in the middle of the driven gear 2013. In this configuration, the installation position and components of the driving assembly are determined.

[0022] like Figures 3 to 6 As shown, further, a lower discharge port 2021 is provided at the bottom of the lower circular installation cylinder 202, the lower discharge port 2021 and the placement slot 3013 are aligned with each other, an inclined surface is provided in the inner cavity of the lower circular installation cylinder 202, an upper circular installation cylinder 203 is installed through the upper part of the lower circular installation cylinder 202, and an upper discharge port 2022 is provided at the top of the upper circular installation cylinder 203. In this arrangement, it is ensured that the quartz sand that falls out can slide through the inclined surface of the inner cavity of the lower circular installation cylinder 202 to the lower discharge port 2021 provided at the bottom and fall into the rotating cylinder 301.

[0023] like Figures 3 to 7As shown, further, a circular stop ring 2033 is fixedly installed on the inner wall of the upper circular installation cylinder 203, and a special-shaped slide groove 2031 is opened on the inner wall of the upper circular installation cylinder 203. The special-shaped slide groove 2031 is distributed in a wave shape on the inner wall of the upper circular installation cylinder 203. Three movable sliders 2032 arranged in a circumferential distribution are slidably installed in the inner cavity of the special-shaped slide groove 2031. The three movable sliders 2032 are respectively installed with a mounting plate 204 on one side wall away from the special-shaped slide groove 2031. In this arrangement, it is ensured that when the lower circular installation cylinder 202 rotates, it can drive the upper circular installation cylinder 203 to rotate. When the upper circular installation cylinder 203 rotates, it can drive the mounting plate 204 to move vertically with the assistance of the moving rod 205 and the moving plate 2051 and the first slide groove 2052 and the first slide rod 2053 in the first sliding mechanism through the special-shaped slide groove 2031 and the movable slider 2032.

[0024] Embodiment 2:

[0025] The difference between the above embodiment and this embodiment is that: Figures 6 to 8 As shown, a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices, a circular positioning ring 2043 is fixedly installed on the outer wall of the heating cylinder 2042, and the circular positioning ring 2043 is located above the circular limiting ring 2033. An extrusion mechanism is provided on the top of the heating cylinder 2042. In this setting, the installation position of the circular positioning ring 2043 is determined.

[0026] like Figures 7 to 9 As shown, in a specific embodiment, the extrusion mechanism includes two rectangular mounting cylinders 206, which are fixedly mounted on the bottom of the inner cavity of the upper circular mounting cylinder 203, and the two rectangular mounting cylinders 206 are symmetrical to each other. The inner cavities of the two rectangular mounting cylinders 206 are both provided with a second sliding mechanism. In this setting, the installation position of the extrusion mechanism is determined.

[0027] like Fig. 9 As shown, further, the second sliding mechanism includes four second slide grooves 2062, and the four second slide grooves 2062 are respectively opened on the inner walls of the two upper circular mounting cylinders 203, and the four second slide grooves 2062 are symmetrical to each other, and the inner cavities of the four second slide grooves 2062 are all slidably mounted with second sliders 2063, and the four second sliders 2063 are symmetrical to each other, and the four second sliders 2063 are fixedly connected with placement plates 2064. In this setting, the installation position of the second sliding mechanism is determined.

[0028] like Fig. 9As shown, further, a rectangular plug rod 2061 is fixedly installed on one side wall of the two placement plates 2064, and one end of the two rectangular plug rods 2061 is respectively away from the placement plates 2064 and fixedly connected to the upper circular mounting tube 203, and one end of the two placement plates 2064 is respectively away from the rectangular plug rod 2061 and fixedly connected to a return spring 2065, and the other end of the two return springs 2065 is fixedly connected to the upper inner cavity of the rectangular mounting tube 206. In this configuration, since the return spring 2065 is provided in the extrusion mechanism, the return spring 2065 can always exert an extrusion force on the placement plates 2064, so that the placement plates 2064 can always move vertically downward with the assistance of the second slide groove 2062 and the second slider 2063 in the second sliding mechanism, and when the placement plates 2064 move, the rectangular plug rod 2061 can be driven to move downward, so that the heating tube 2042 and the mounting plate 204 can be squeezed to always fit.

[0029] Embodiment 3:

[0030] The difference between the above embodiment and this embodiment is that: Figures 3 to 6 As shown, a preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices, a moving plate 2051 is fixedly installed at the bottom of the moving rod 205, and a first sliding mechanism is arranged on the moving plate 2051. The first sliding mechanism includes two first slide grooves 2052, and the two first slide grooves 2052 are arranged on the two opposite side walls of the inner cavity of the working box 1012. The two first slide grooves 2052 are symmetrical to each other, and the inner cavities of the two first slide grooves 2052 are both slidably installed with first slide rods 2053, and the opposite side walls of the two first slide rods 2053 are both fixedly connected to the moving rod 205, and the moving plate 2051 is slidably connected to the two positioning plates 3014. In this setting, the installation position and components of the first sliding mechanism are determined.

[0031] like Figures 3 to 6As shown, in a specific embodiment, a movable rod 501 is movably installed above the first sliding rod 2053, and a third sliding mechanism is arranged at the other end of the movable rod 501. The third sliding mechanism includes a third sliding groove 5011, and a third slider 5012 is slidably installed in the inner cavity of the third sliding groove 5011. The movable rod 501 is movably installed on the third slider 5012, and a push plate 5013 is fixedly installed on one side wall of the third slider 5012. The other end of the push plate 5013 is fitted on the flip plate 1031. In this arrangement, it is ensured that when the first slide bar 2053 in the first sliding mechanism moves vertically downward, it will be able to drive the movable rod 501 to drive the third slider 5012 to move horizontally in the inner cavity of the third slide groove 5011. When the third slider 5012 moves horizontally, it will be able to drive the push plate 5013 to move horizontally, thereby pushing the flip plate 1031 to flip through the push plate 5013 until the concave discharge pipe 103 is blocked. At this time, the push plate 5013 is located in the middle position at the bottom of the flip plate 1031 in a horizontal state, and the movable slider 2032 is located in the middle position of the downward moving end of the special-shaped slide groove, so that the quartz sand feeding can be controlled, ensuring that not too much quartz sand will appear during the drying process.

[0032] The implementation principle of the preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices in this embodiment is as follows: First, the staff puts the cleaned quartz sand into the feed hopper 1022. When the placement is completed, the staff controls the servo motor 201 to operate through the controller. When the servo motor 201 operates, it can drive the rotating rod 2011 to rotate. When the rotating rod 2011 rotates, it can drive the driving gear 2012 to rotate. Because the driving gear 2012 and the driven gear 2013 are meshed with each other, when the driving gear 2012 rotates, it can drive the driven gear 2013 to rotate. Because the lower circular installation cylinder 202 is fixedly installed in the driven gear 2013, it can drive the lower circular installation cylinder 202 to rotate. When the lower circular installation cylinder 202 rotates, it can drive the upper circular installation cylinder 203 to rotate. When the upper circular installation cylinder 203 rotates, it can drive the installation plate 204 to move vertically with the assistance of the moving rod 205 and the moving plate 2051 and the first sliding groove 2052 and the first sliding rod 2053 in the first sliding mechanism through the special-shaped sliding groove 2031 and the moving slider 2032 (because the special-shaped sliding groove 2031 is distributed in a wave shape, it can drive the installation plate 204 to reciprocate up and down); When the mounting plate 204 moves vertically downward, the heating cylinder 2042 arranged above the mounting plate 204 can always fit on the mounting plate 204 with the assistance of the squeezing mechanism (because the squeezing mechanism is provided with a return spring 2065, the return spring 2065 can always exert a squeezing force on the placement plate 2064, so that the placement plate 2064 can always move vertically downward with the assistance of the second slide groove 2062 and the second slide block 2063 in the second sliding mechanism, and when the placement plate 2064 moves, it can drive the rectangular plug rod 2064 to move. 61 moves downward, thereby squeezing the heating cylinder 2042 and the mounting plate 204 to always fit together), until the circular positioning ring 2043 fixedly installed on the outer wall of the heating cylinder 2042 and the circular limiting ring 2033 come into contact. At this time, the heating cylinder 2042 cannot move downward under the limitation of the circular limiting ring 2033, but the mounting plate 204 can still move downward with the assistance of the special-shaped slide groove 2031 and the movable slider 2032, so that the mounting plate 204 and the heating cylinder 2042 can be separated, so that the quartz sand in the heating cylinder 2042 can fall out; At this time, the quartz sand that falls out will be able to fall into the rotating drum 301 through the lower discharge port 2021 opened at the bottom of the lower circular mounting cylinder 202, and at this time, when the mounting plate 204 is reset and moved upward, it will be able to drive the moving rod 205 and the moving plate 2051 to move vertically upward, so that the moving plate 2051 can drive the slidably connected positioning plate 3014 to drive the rotating drum 301 to rotate slightly with the assistance of the rotating rod 3011 and the bearing 3012, so that the quartz sand entering the rotating drum 301 can be rotated and swung, thereby ensuring that there will be moisture in the quartz sand after cleaning to a certain extent; At the same time, when the first slide bar 2053 in the first sliding mechanism moves vertically downward, it will be able to drive the movable rod 501 to drive the third slider 5012 to move horizontally in the inner cavity of the third slide groove 5011. When the third slider 5012 moves horizontally, it will be able to drive the push plate 5013 to move horizontally, thereby pushing the flip plate 1031 to flip through the push plate 5013 until the concave discharge pipe 103 is blocked. At this time, the push plate 5013 is located in the middle position of the bottom of the flip plate 1031 in a horizontal state, and the movable slider 2032 is located in the middle position of the downward moving end of the special-shaped slide groove, so that the quartz sand feeding can be controlled to ensure that there will not be too much quartz sand during the drying process.

Claims

1. A process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices, characterized in that: The method comprises the following steps: Step S1: placing the cleaned quartz sand on the mounting unit (100); Step S2: The placed quartz sand can be heated and dried by the transmission unit (200); Step S3: The transmission unit (200) can then drive the rotating unit (300) to rotate slightly, and transfer the heated quartz sand to the rotating unit (300), so that the rotating unit (300) can swing and dehydrate the quartz sand; Step S4: while the transmission unit (200) is running, it can drive the control unit (500) to control the feeding of quartz sand; The mounting unit (100) comprises a mounting base (101), lower supporting legs (1011) are fixedly mounted on all four sides of the bottom of the mounting base (101), a working box (1012) is fixedly mounted on the top of the mounting base (101), four upper supporting legs (102) arranged in a circumferential distribution are fixedly mounted on the upper end of the working box (1012), a fixing plate (1021) is fixedly mounted on the top of each of the upper supporting legs (102), a feeding hopper (1022) is fixedly mounted on one side wall opposite to the four fixing plates (1021), a concave material discharge pipe (103) is fixedly mounted on the bottom of the feeding hopper (1022), the concave material discharge pipe (103) is located in the inner cavity of the working box (1012), and a flip plate (1031) is rotatably mounted on one side wall of the concave material discharge pipe (103); The rotating unit (300) comprises a rotating drum (301), and rotating rods (3011) are arranged on opposite side walls of the rotating drum (301), and the two rotating rods (3011) are symmetrical to each other. A bearing (3012) is arranged on opposite ends of the two rotating rods (3011), and the two bearings (3012) are arranged on opposite side walls of the inner cavity of the working box (1012), respectively. A placement slot (3013) is also provided on the rotating drum (301), and two symmetrical positioning plates (3014) are also fixedly mounted on the rotating drum (301). A base (302) is rotatably arranged at the bottom of the rotating drum (301), and two ends of the base (302) are fixedly connected to opposite side walls of the inner cavity of the working box (1012). A slot is provided in the middle of the base (302), and a piston rod (3021) is arranged in the inner cavity of the slot. The transmission unit (200) comprises a driving assembly and a heating cylinder (2042); a conical plate (2041) is attached to and arranged at the bottom of the heating cylinder (2042); a mounting plate (204) is fixedly mounted at the bottom of the conical plate (2041); a moving rod (205) is fixedly mounted at the bottom of the mounting plate (204); the driving assembly is used to drive the mounting plate (204) to move vertically downward; the vertical downward movement of the mounting plate (204) can drive the rotating cylinder (301) to rotate and the control unit (500) to move horizontally.

2. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 1, characterized in that: The driving assembly comprises a servo motor (201), the servo motor (201) being mounted above the inner cavity of a working box (1012), a rotating rod (2011) being fixedly mounted on the output end of the servo motor (201), a driving gear (212) being fixedly mounted on one end of the rotating rod (2011) away from the servo motor (201), a driven gear (213) being meshingly mounted on a side wall of the driving gear (2012), and a lower circular mounting cylinder (202) being sleeved in the middle of the driven gear (2013).

3. The preparation process of ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 2, is characterized in that: The bottom of the lower circular installation cylinder (202) is provided with a lower discharge port (2021), the lower discharge port (2021) and the placement slot (3013) are aligned with each other, the inner cavity of the lower circular installation cylinder (202) is provided with an inclined surface, an upper circular installation cylinder (203) is installed through the top of the lower circular installation cylinder (202), and an upper discharge port (2022) is provided at the top of the upper circular installation cylinder (203).

4. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 3, is characterized in that: A circular limiting ring (2033) is fixedly mounted on the inner wall of the upper circular mounting cylinder (203); a special-shaped slide groove (2031) is provided on the inner wall of the upper circular mounting cylinder (203); the special-shaped slide groove (2031) is distributed in a wave shape on the inner wall of the upper circular mounting cylinder (203); three movable sliders (2032) are slidably mounted in a circular distribution in the inner cavity of the special-shaped slide groove (2031); and a mounting plate (204) is mounted on one side wall of the three movable sliders (2032) away from the special-shaped slide groove (2031), respectively.

5. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 1, characterized in that: A circular positioning ring (2043) is fixedly mounted on the outer wall of the heating cylinder (2042); the circular positioning ring (2043) is located above the circular limiting ring (2033); and a squeezing mechanism is arranged on the top of the heating cylinder (2042).

6. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 5, characterized in that: The extrusion mechanism comprises two rectangular mounting cylinders (206), the two rectangular mounting cylinders (206) being fixedly mounted on the bottom of the inner cavity of the upper circular mounting cylinder (203), the two rectangular mounting cylinders (206) being symmetrical to each other, and the inner cavities of the two rectangular mounting cylinders (206) are both provided with a second sliding mechanism.

7. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 6, characterized in that: The second sliding mechanism comprises four second sliding grooves (2062), the four second sliding grooves (2062) are respectively opened between two of the inner walls of the two upper circular mounting cylinders (203), the four second sliding grooves (2062) are symmetrical with each other, the inner cavities of the four second sliding grooves (2062) are all slidably mounted with second sliding blocks (2063), the four second sliding blocks (2063) are symmetrical with each other, and the four second sliding blocks (2063) are fixedly connected with a placement plate (2064) between two of them.

8. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 7, characterized in that: A rectangular plug-in rod (2061) is fixedly installed on one side wall of the two placement plates (2064); one end of the two rectangular plug-in rods (2061) away from the placement plates (2064) is fixedly connected to the top of the upper circular installation cylinder (203); one end of the two placement plates (2064) away from the rectangular plug-in rod (2061) is fixedly connected to a return spring (2065); the other end of the two return springs (2065) is fixedly connected to the top of the inner cavity of the rectangular installation cylinder (206).

9. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 1, characterized in that: A moving plate (2051) is fixedly installed at the bottom of the moving rod (205), and a first sliding mechanism is arranged on the moving plate (2051), and the first sliding mechanism includes two first sliding grooves (2052), and the two first sliding grooves (2052) are arranged on two opposite side walls of the inner cavity of the working box (1012), and the two first sliding grooves (2052) are symmetrical to each other, and the inner cavities of the two first sliding grooves (2052) are both slidably installed with first sliding rods (2053), and the opposite side walls of the two first sliding rods (2053) are both fixedly connected to the moving rod (205), and the moving plate (2051) and the two positioning plates (3014) are slidably connected.

10. The process for preparing ultra-high purity quartz sand, a key raw material for semiconductor-grade quartz devices according to claim 9, characterized in that: A movable rod (501) is movably mounted above the first sliding rod (2053), and a third sliding mechanism is arranged at the other end of the movable rod (501), and the third sliding mechanism comprises a third sliding groove (5011), and a third sliding block (5012) is slidably mounted in the inner cavity of the third sliding groove (5011), and the movable rod (501) is movably mounted on the third sliding block (5012), and a push plate (5013) is fixedly mounted on one side wall of the third sliding block (5012), and the other end of the push plate (5013) is fitted on the flip plate (1031).

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