An intelligent re-inspection machine for SMT (surface mount technology)

Abstract

This invention relates to the field of SMT (Surface Mount Technology) assembly inspection technology, specifically to an intelligent re-inspection machine for SMT surface mount assembly. It includes a base plate and a PCB circuit board for inspection. The base plate has an inspection mechanism, which includes two first electric telescopic rods fixedly mounted on the base plate. A connecting block is fixedly connected to the output end of each first electric telescopic rod. An L-shaped plate is fixedly connected to the outer side of the connecting block. A crossbeam is fixedly connected between the two L-shaped plates. Multiple inspection units are fixedly connected to the front side of the crossbeam. Each inspection unit includes two L-shaped blocks. A rotating rod is rotatably connected to the rear inner wall of each L-shaped block, and a rectangular block is fixedly connected to the front end of the rotating rod. This invention can quickly detect whether the position of electronic components soldered on the PCB circuit board has shifted, and can determine whether the shift range is within the allowable range, thereby determining the degree of shift of the electronic components soldered on the PCB circuit board.

Description

Technical Field

[0001] This invention relates to the field of SMT (Surface Mount Technology) inspection technology, specifically to an intelligent re-inspection machine for SMT surface mount technology. Background Technology

[0002] SMT (Surface Mount Technology) is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then assembles them by reflow soldering or dip soldering.

[0003] Existing PCB assembly inspection methods include stability testing and offset testing. Stability testing checks the secure mounting of components on the PCB, while offset testing checks the accuracy of component mounting. Current methods primarily rely on personnel observation or image acquisition equipment to capture and analyze images of the PCB assembly. While these methods can achieve the purpose of SMT assembly inspection, the mounting errors of electronic components are very small and difficult to observe directly through images. Therefore, it is impossible to accurately determine the degree of component offset on the PCB and effectively judge whether the offset range is within the allowable range (different electronic components have different allowable error ranges, such as the width range of leads or wires).

[0004] This invention proposes an intelligent inspection machine for SMT surface mount technology, which can quickly detect whether the position of electronic components soldered on the PCB board has shifted, and can determine whether the range of electronic component shift is within the allowable range, thereby determining the degree of shift of electronic components soldered on the PCB board. Summary of the Invention

[0005] The purpose of this invention is to provide an intelligent inspection machine for SMT surface mount technology, which can quickly detect whether the position of electronic components soldered on the PCB board has shifted, and can determine whether the range of electronic component shift is within the allowable range, thereby determining the degree of shift of the electronic components soldered on the PCB board.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an intelligent inspection machine for SMT surface mount technology, comprising a base plate and a PCB circuit board for inspection, wherein the base plate is provided with an inspection mechanism, the inspection mechanism comprising two first electric telescopic rods fixedly mounted on the base plate, a connecting block fixedly connected to the output end of the first electric telescopic rods, an L-shaped plate fixedly connected to the outer side of the connecting block, a crossbeam fixedly connected between the two L-shaped plates, and multiple inspection units fixedly connected to the front side of the crossbeam;

[0007] Each detection unit includes two L-shaped blocks. A rotating rod is rotatably connected to the inner rear wall of each L-shaped block. A rectangular block is fixedly connected to the front end of the rotating rod. A trapezoidal block is fixedly connected to the bottom of the rectangular block, and the bottom of the trapezoidal block has an inclined surface. A tension spring is fixedly connected between the side wall of the L-shaped block and the corresponding rectangular block. A cylinder is fixedly connected to the top of the rectangular block. In the initial state, the cylinder is perpendicular to the base plate. The position and width W between the two trapezoidal blocks in each detection unit match the width and position of the corresponding electronic component. When the electronic component is not offset, the trapezoidal block can slide downwards past the side of the electronic component. When the electronic component is offset, the inclined surface of one of the trapezoidal blocks in the detection unit will contact the electronic component downwards, and the cylinder will tilt.

[0008] In this invention, the installation position of the detection unit corresponds to the position of the electronic components on the fixed PCB circuit board. During the downward movement of the trapezoidal block, the tilt of the cylinder is increased by the lever structure to amplify the offset value of the electronic components, thereby achieving sensitive detection.

[0009] This invention can quickly detect whether the position of electronic components soldered on the PCB circuit board has shifted, and can determine whether the range of electronic component shift is within the allowable range, thereby determining the degree of shift of the electronic components soldered on the PCB circuit board.

[0010] When in use, place the soldered PCB board between the two U-shaped clamps, start the second electric telescopic rod, the second electric telescopic rod works to drive the corresponding U-shaped clamps, the two U-shaped clamps move towards each other and fix the PCB board.

[0011] Different sized electronic components have different allowable offset errors when soldered onto a PCB circuit board. When the allowable offset error of an electronic component is small, the width of the thin plate determines the error range of the detection unit, representing the allowable error of the electronic component. Therefore, it is not necessary to adjust the rotation angle of the thin plate. The start motor rotates via a screw, causing the rectangular seat to slide outside the two positioning rods. The rectangular seat moves the U-shaped seat, which in turn moves the laser emitter and laser receiver to the front and rear sides of the corresponding left thin plate of the electronic component, respectively. The first electric telescopic rod is activated, causing the L-shaped plate to move downwards via the connecting block. The L-shaped plate is then moved downwards via the crossbeam. The L-shaped block moves downwards, causing the trapezoidal block to move downwards as well. When the trapezoidal block slides down past the left side of the electronic component, the thin sheet does not tilt, and the laser emitted by the laser emitter is blocked by the thin sheet, preventing the laser receiver from receiving the emitted laser. Similarly, the motor is started again, causing the U-shaped seat to move the laser emitter and laser receiver to the front and rear sides of the corresponding right-side thin sheet of the electronic component, respectively. Similarly, the first electric telescopic rod is started, causing the rectangular block to move the trapezoidal block downwards. When the trapezoidal block slides down past the right side of the electronic component, the electronic component is considered to be installed correctly. The steps are repeated to test the next electronic component.

[0012] More preferably, a screw is rotatably connected between the two L-shaped plates, and a rectangular seat is threaded to the outer side of the screw. A U-shaped seat is fixedly connected to the front side of the rectangular seat. A laser emitter and a laser receiver are fixedly connected to the front inner wall and the rear inner wall of the U-shaped seat, respectively. When there is no obstruction between the laser emitter and the laser receiver, the laser emitter emits laser light, and the laser receiver can receive the laser light.

[0013] When the trapezoidal block slides down from the right side of the electronic component and contacts it, the trapezoidal block rotates. This rotation, via a rectangular block, drives the cylinder to rotate. Both the trapezoidal block and the cylinder are connected to a rotating rod via the rectangular block. The rotation of the trapezoidal block and cylinder forms a lever structure, and the longer length of the cylinder effectively amplifies the error of the electronic component's offset. The cylinder, through the rotating rod, drives the thin plate to rotate. The width of the thin plate determines the error range of the detection unit, representing the allowable error of the electronic component. When the angle of rotation of the trapezoidal block is small, the angle of rotation of the thin plate driven by the cylinder is also small. At this time, the laser emitted by the laser emitter is still blocked by the thin plate, and the laser receiver cannot receive the emitted laser. In this case, although the electronic component has a positional offset, it is within the allowable offset error range and is a qualified product. When the angle of rotation of the trapezoidal block is large, the laser receiver can receive the laser emitted by the laser emitter, and the positional offset of the electronic component exceeds the allowable offset error. At this time, the laser receiver sends information to the control panel, which displays the unqualified electronic component soldered on the PCB circuit board.

[0014] In a further preferred embodiment, the detection mechanism also includes a detection accuracy adjustment component, which includes a cavity and a thin sheet. The cylinder has a cavity, and a circular seat is rotatably connected to the bottom inner wall of the cavity. A square rod is fixedly connected to the top of the circular seat, and a round rod is slidably connected to the outer side of the square rod. The top of the round rod extends to the top of the corresponding cylinder and is fixedly connected to the thin sheet.

[0015] More preferably, a motor is fixedly connected to the left side of one of the L-shaped plates on the left side, and the output shaft end of the motor is fixedly connected to the left end of the screw.

[0016] More preferably, two positioning rods are fixedly connected between the two L-shaped plates on their adjacent sides, and a rectangular seat is slidably sleeved on the outside of the two positioning rods.

[0017] More preferably, a spring is fixedly connected between the top of the circular seat and the bottom of the circular rod, and the spring is movably sleeved on the outside of the square rod.

[0018] In a further preferred embodiment, the cylinder is slidably sleeved on the outside of the round rod, a horizontal plate is fixedly connected to the outside of the round rod, a pointer is fixedly connected to the bottom of the horizontal plate, and a circular scale plate is fixedly connected to the top of the cylinder. When the thin sheet is pinched and moved upward and rotated, the thin sheet drives the horizontal plate to move upward and rotate through the round rod. At this time, under the action of the scale lines set on the circular scale plate, the horizontal plate drives the pointer to rotate to the maximum allowable position offset of the electronic component.

[0019] When the allowable offset error of electronic components is large, the rotation angle of the thin plate can be adjusted according to the actual situation. Under the action of the lever structure, the tilt angle of the thin plate determines the detection error. When the thin plate abutment becomes wider, a larger tilt angle is required so that the laser receiver can receive the laser emitted by the laser emitter. At this time, pinching the thin plate moves the round rod upward. The round rod, through the L-shaped rod, moves the round block upward and separates it from the rubber ring. The round rod slides on the outside of the square rod and stretches the spring. Then, the thin plate is rotated. The thin plate drives the horizontal plate to rotate through the round rod, and the horizontal plate drives the pointer to rotate. Under the action of the scale lines set on the circular scale plate, the horizontal plate drives the pointer to rotate to the maximum allowable positional offset of the larger electronic components, so that the thin sheet becomes wider after rotation. When the thin sheet rotates to the appropriate position, the tension on the thin sheet is released. At this time, the spring in the tensioned state returns to its original state. The spring force drives the round rod to move downward, the round rod drives the two L-shaped rods to move downward, and the L-shaped rods drive the corresponding circular blocks to move downward. The bottom of the circular block contacts the top of the rubber ring. Under the action of friction between the circular block and the rubber ring, the rotated thin sheet is fixed.

[0020] Repeat the same steps, start the first electric telescopic rod to move the trapezoidal block downwards, and proceed to test the next electronic component. When the trapezoidal block slides down past the outside of the electronic component without contacting it, the next electronic component is considered to be installed successfully.

[0021] When the trapezoidal block contacts the electronic component from the bottom, the laser emitted by the laser emitter is blocked by the thin sheet with a widened blocking surface. If this is within the allowable offset error range, the product is qualified. If the laser emitted by the laser emitter is not blocked and the laser receiver can receive the laser emitted by the laser emitter, then the installation of the next electronic component is unqualified.

[0022] More preferably, L-shaped rods are fixedly connected to both sides of the round rod, a circular block is fixedly connected to the bottom of the L-shaped rod, a rubber ring is fixedly connected to the bottom inner wall of the cavity, and the bottom of the circular block is in contact with the top of the rubber ring.

[0023] More preferably, the top of the base plate is fixedly connected to two support plates, and a second electric telescopic rod is fixedly connected to the side of the two support plates that are close to each other. A U-shaped clamp is fixedly connected to the output end of the second electric telescopic rod. The two sides of the PCB circuit board are in movable contact with the inner wall of the side of the two U-shaped clamps that are far from each other. The top and bottom of the PCB circuit board are slidably connected to the top inner wall and bottom inner wall of the U-shaped clamp, respectively.

[0024] More preferably, the top of the base plate is fixedly connected to two support columns, and the top of the two support columns is fixedly connected to the same control panel. The laser receiver receives the laser emitted by the laser emitter and sends the information to the control panel. The control panel displays the unqualified electronic components mounted on the PCB circuit board.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. In this invention, the starting motor drives the rectangular base to move via the rotation of the screw. The rectangular base, through the U-shaped base, drives the laser emitter and laser receiver to move. The first electric telescopic rod is activated, causing the trapezoidal block to move downwards. When the trapezoidal block slides downwards past the left side of the electronic component, the thin sheet does not tilt. The laser emitted by the laser emitter is blocked by the thin sheet, and the laser receiver cannot receive the emitted laser. Similarly, the motor is activated again, causing the U-shaped base to move the laser emitter and laser receiver to the front and rear sides of the corresponding right-side thin sheet of the electronic component, respectively. Similarly, the first electric telescopic rod is activated, causing the rectangular block to drive the trapezoidal block downwards. When the trapezoidal block slides downwards past the right side of the electronic component, the electronic component is considered to be installed correctly. The steps are repeated for the next electronic component to be tested.

[0027] 2. In this invention, when the trapezoidal block slides downwards from the right side of the electronic component and contacts it, the trapezoidal block rotates. The trapezoidal block drives the cylinder to rotate through the rectangular block, and the cylinder drives the thin plate to rotate through the rotating rod. When the angle of rotation of the trapezoidal block is small, the angle of rotation of the thin plate driven by the cylinder is also small. At this time, the laser emitted by the laser emitter is still blocked by the thin plate, and the laser receiver cannot receive the emitted laser. At this time, although the electronic component has a positional shift, it is within the allowable offset error range and is a qualified product. When the angle of rotation of the trapezoidal block is large, the laser receiver can receive the laser emitted by the laser emitter, and the positional shift of the electronic component exceeds the allowable offset error, making it a defective electronic component.

[0028] 3. In this invention, when the allowable offset error of the electronic component is large, the thin sheet is pinched to drive the round rod upward. The round rod drives the round block upward through the L-shaped rod to separate from the rubber ring. The round rod slides on the outside of the square rod and stretches the spring. Then the thin sheet is rotated. The thin sheet drives the horizontal plate to rotate through the round rod. The horizontal plate drives the pointer to rotate. Under the action of the scale lines set on the circular scale plate, the horizontal plate drives the pointer to rotate to the maximum allowable position offset of the electronic component, so that the thin sheet abutment becomes wider after rotation.

[0029] 4. Repeat the steps, start the first electric telescopic rod to move the trapezoidal block downwards to test the next electronic component. When the trapezoidal block slides down past the outside of the electronic component without contacting it, the next electronic component is considered to be installed successfully. When the trapezoidal block slides down and contacts the electronic component, and the laser emitted by the laser emitter is blocked by the widened thin plate, it is within the allowable offset error range and is considered a qualified product. When the laser emitted by the laser emitter is not blocked and the laser receiver can receive the laser emitted by the laser emitter, the next electronic component is not installed successfully. This method can quickly detect whether the position of the electronic component soldered on the PCB circuit board has shifted, and can determine whether the offset range of the electronic component is within the allowable range, thereby determining the degree of offset of the electronic component soldered on the PCB circuit board. Attached Figure Description

[0030] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention;

[0031] Figure 2 This is a rear-view stereoscopic structural diagram of the present invention;

[0032] Figure 3 This is a front view structural diagram of the present invention;

[0033] Figure 4 This is a three-dimensional view showing the connection between the rectangular block, trapezoidal block, and cylinder in this invention;

[0034] Figure 5 This is a perspective view of the connection between the L-shaped plate and the screw in this invention;

[0035] Figure 6 This is a perspective view showing the connection between the U-shaped base, the laser transmitter, and the laser receiver in this invention.

[0036] Figure 7 This is a schematic diagram of the internal cross-sectional structure of the cylinder in this invention;

[0037] Figure 8 This is a perspective view showing the connection between the horizontal plate, the pointer, and the circular scale plate in this invention.

[0038] Figure 9 This is a schematic diagram showing the connection between the PCB circuit board and electronic components in this invention.

[0039] In the picture:

[0040] 1. Base plate; 101. First electric telescopic rod; 102. Connecting block; 103. L-shaped plate; 104. Crossbeam; 105. L-shaped block; 106. Rotating rod; 107. Rectangular block; 108. Trapezoidal block; 109. Tension spring; 110. Cylinder; 111. Screw; 112. Rectangular seat; 113. U-shaped seat; 114. Laser emitter; 115. Laser receiver; 116. Motor; 117. Positioning rod;

[0041] 2. Cavity; 201. Circular seat; 202. Square rod; 203. Round rod; 204. Thin sheet; 205. Spring; 206. Horizontal plate; 207. Pointer; 208. Circular scale plate; 209. L-shaped rod; 210. Circular block; 211. Rubber ring;

[0042] 3. Support plate; 4. Second electric telescopic rod; 5. U-shaped clamp; 6. PCB circuit board; 7. Control panel (where x-axis represents left and right direction, arrow direction is right; y-axis represents up and down direction, arrow direction is up; z-axis represents front and back direction, arrow direction is back). Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] For examples, please refer to Figure 1-9The present invention provides a technical solution: an intelligent inspection machine for SMT surface mount technology, including a base plate 1 and a PCB circuit board 6 for inspection. The base plate 1 is provided with an inspection mechanism, which includes two first electric telescopic rods 101 fixedly installed on the base plate 1. The output end of the first electric telescopic rods 101 is fixedly connected to a connecting block 102. An L-shaped plate 103 is fixedly connected to the outside of the connecting block 102. A crossbeam 104 is fixedly connected between the two L-shaped plates 103. Multiple inspection units are fixedly connected to the front side of the crossbeam 104.

[0045] Each detection unit includes two L-shaped blocks 105. A rotating rod 106 is rotatably connected to the inner rear wall of the L-shaped block 105. A rectangular block 107 is fixedly connected to the front end of the rotating rod 106. A trapezoidal block 108 is fixedly connected to the bottom of the rectangular block 107. The bottom of the trapezoidal block 108 has an inclined surface. A tension spring 109 is fixedly connected between the side wall of the L-shaped block 105 and the corresponding rectangular block 107. A cylinder 110 is fixedly connected to the top of the rectangular block 107. In the initial state, the cylinder 110 is perpendicular to the base plate 1. The position and width W between the two trapezoidal blocks 108 in each detection unit match the width and position of the corresponding electronic component. When the electronic component is not offset, the trapezoidal block 108 can slide down past the side of the electronic component. When the electronic component is offset, the inclined surface of one of the trapezoidal blocks 108 in the detection unit will contact the electronic component downwards, and the cylinder 110 will tilt.

[0046] In this invention, the installation position of the detection unit corresponds to the position of the electronic components on the fixed PCB circuit board 6. During the downward movement of the trapezoidal block 108, the tilt of the cylinder 110 is increased by the lever structure to amplify the offset value of the electronic components and achieve sensitive detection.

[0047] This invention can quickly detect whether the position of electronic components soldered on the PCB circuit board 6 has shifted, and can determine whether the range of electronic component shift is within the allowable range, thereby determining the degree of shift of the electronic components soldered on the PCB circuit board 6.

[0048] When in use, place the soldered PCB circuit board 6 between the two U-shaped clamps 5, start the second electric telescopic rod 4, the second electric telescopic rod 4 works to drive the corresponding U-shaped clamps 5 to work, the two U-shaped clamps 5 move towards each other and fix the PCB circuit board 6.

[0049] Different sized electronic components have different allowable offset errors when soldered onto PCB circuit board 6. When the allowable offset error of an electronic component is small, the width of the thin plate 204 determines the error range of the detection unit, representing the allowable error of the electronic component. Therefore, it is not necessary to adjust the rotation angle of the thin plate 204. The start motor 116 rotates through the screw 111, causing the rectangular seat 112 to slide outside the two positioning rods 117. The rectangular seat 112 drives the U-shaped seat 113 to move. The U-shaped seat 113 drives the laser emitter 114 and the laser receiver 115 to move to the front and rear sides of the left thin plate 204 corresponding to the electronic component, respectively. The first electric telescopic rod 101 is activated, driving the L-shaped plate 103 downward through the connecting block 102. The L-shaped plate 103 is carried by the crossbeam 104. The L-shaped block 105 moves downward, causing the trapezoidal block 108 to move downward. When the trapezoidal block 108 slides downward past the left side of the electronic component, the thin plate 204 does not tilt. The laser emitted by the laser emitter 114 is blocked by the thin plate 204, and the laser receiver 115 cannot receive the emitted laser. Similarly, the motor 116 is started, causing the U-shaped seat 113 to move the laser emitter 114 and the laser receiver 115 to the front and rear sides of the thin plate 204 on the right side of the electronic component, respectively. Similarly, the first electric telescopic rod 101 is started, causing the rectangular block 107 to move the trapezoidal block 108 downward. When the trapezoidal block 108 slides downward past the right side of the electronic component, the electronic component is considered to be installed correctly. The steps are repeated to test the next electronic component.

[0050] In this embodiment, specifically: a screw 111 is rotatably connected between two L-shaped plates 103, a rectangular seat 112 is threaded to the outer side of the screw 111, a U-shaped seat 113 is fixedly connected to the front side of the rectangular seat 112, and a laser emitter 114 and a laser receiver 115 are fixedly connected to the inner front wall and the inner rear wall of the U-shaped seat 113, respectively. When there is no obstruction between the laser emitter 114 and the laser receiver 115, the laser emitter 114 emits laser light, and the laser receiver 115 can receive the laser light.

[0051] When the trapezoidal block 108 slides downwards from the right side of the electronic component and contacts it, the trapezoidal block 108 rotates. The trapezoidal block 108 drives the cylinder 110 to rotate via the rectangular block 107. Both the trapezoidal block 108 and the cylinder 110 are rotatably connected to the rotating rod 106 via the rectangular block 107. The trapezoidal block 108 and the cylinder 110 form a lever structure through the rotation of the rotating rod 106. The relatively long length of the cylinder 110 effectively amplifies the error caused by the offset of the electronic component. The cylinder 110 drives the thin plate 204 to rotate via the rotation of the rod 203. The width of the thin plate 204 determines the error range of the detection unit, representing the allowable error of the electronic component. When the trapezoidal block 108... When the angle of rotation of block 108 is small, the angle of rotation of the cylinder 110 and the thin plate 204 is also small. At this time, the laser emitted by the laser emitter 114 is still blocked by the thin plate 204, and the laser receiver 115 cannot receive the emitted laser. At this time, although the electronic component has a positional shift, it is within the allowable offset error range and is a qualified product. When the angle of rotation of trapezoidal block 108 is large, the laser receiver 115 can receive the laser emitted by the laser emitter 114, and the positional shift of the electronic component exceeds the allowable offset error. At this time, the laser receiver 115 sends information to the control panel 7, and the control panel 7 displays the unqualified electronic components soldered on the PCB circuit board 6.

[0052] In this embodiment, specifically: the detection mechanism also includes a detection accuracy adjustment component, which includes a cavity 2 and a thin sheet 204. The cavity 2 is provided on the cylinder 110. A circular seat 201 is rotatably connected to the bottom inner wall of the cavity 2. A square rod 202 is fixedly connected to the top of the circular seat 201. A round rod 203 is slidably connected to the outer side of the square rod 202. The top end of the round rod 203 extends to the top of the corresponding cylinder 110 and is fixedly connected to the thin sheet 204.

[0053] In this embodiment, specifically: a motor 116 is fixedly connected to the left side of an L-shaped plate 103 on the left side, and the output shaft end of the motor 116 is fixedly connected to the left end of the screw 111.

[0054] In this embodiment, specifically: two positioning rods 117 are fixedly connected between the two L-shaped plates 103 on their sides that are close to each other, and the rectangular seat 112 is slidably sleeved on the outside of the two positioning rods 117;

[0055] In this embodiment, specifically: a spring 205 is fixedly connected between the top of the circular seat 201 and the bottom of the circular rod 203, and the spring 205 is movably sleeved on the outside of the square rod 202;

[0056] In this embodiment, specifically: the cylinder 110 is slidably sleeved on the outside of the rod 203, a horizontal plate 206 is fixedly connected to the outside of the rod 203, a pointer 207 is fixedly connected to the bottom of the horizontal plate 206, and a circular scale plate 208 is fixedly connected to the top of the cylinder 110. When the thin sheet 204 is pinched and moved upward and rotated, the thin sheet 204 drives the horizontal plate 206 to move upward and rotate through the rod 203. At this time, under the action of the scale lines set on the circular scale plate 208, the horizontal plate 206 drives the pointer 207 to rotate to the maximum value allowed for the position offset of the electronic component.

[0057] When the allowable offset error of electronic components is large, the rotation angle of the thin plate 204 can be adjusted according to the actual situation. Under the action of the lever structure, the tilt angle of the thin plate 204 determines the detection error. When the abutment of the thin plate 204 becomes wider, a larger tilt angle is required so that the laser receiver 115 can receive the laser emitted by the laser emitter 114. At this time, pinching the thin plate 204 drives the round rod 203 to move upward. The round rod 203 drives the round block 210 to move upward and separate from the rubber ring 211 through the L-shaped rod 209. The round rod 203 slides on the outside of the square rod 202 and stretches the spring 205. Then, the thin plate 204 is rotated. The thin plate 204 drives the horizontal plate 206 to rotate through the round rod 203. The horizontal plate 206 drives the pointer 207. As the scale lines on the annular scale plate 208 are rotated, the horizontal plate 206 drives the pointer 207 to rotate to the maximum allowable positional offset of the electronic component, making the abutment surface of the thin plate 204 wider after rotation. When the thin plate 204 rotates to the appropriate position, the tension on the thin plate 204 is released, and the spring 205, which is in a stretched state, returns to its original position. The elastic force of the spring 205 drives the round rod 203 to move downward, and the round rod 203 drives the two L-shaped rods 209 to move downward. The L-shaped rods 209 drive the corresponding circular blocks 210 to move downward. The bottom of the circular block 210 contacts the top of the rubber ring 211. Under the friction between the circular block 210 and the rubber ring 211, the rotated thin plate 204 is fixed.

[0058] Similarly, repeat the steps to start the first electric telescopic rod 101 to move the trapezoidal block 108 downwards for the next electronic component to be tested. When the trapezoidal block 108 slides down past the outside of the electronic component without contacting it, the next electronic component is considered to be installed successfully.

[0059] When the trapezoidal block 108 contacts the electronic component from below, the laser emitted by the laser emitter 114 is blocked by the thin plate 204 with a widened blocking surface. If this is within the allowable offset error range, it is a qualified product. If the laser emitted by the laser emitter 114 is not blocked and the laser receiver 115 can receive the laser emitted by the laser emitter 114, then the installation of the next electronic component is unqualified.

[0060] In this embodiment, specifically: L-shaped rods 209 are fixedly connected to both sides of the round rod 203, a round block 210 is fixedly connected to the bottom of the L-shaped rod 209, a rubber ring 211 is fixedly connected to the bottom inner wall of the cavity 2, and the bottom of the round block 210 is in contact with the top of the rubber ring 211.

[0061] In this embodiment, specifically: two support plates 3 are fixedly connected to the top of the base plate 1, and a second electric telescopic rod 4 is fixedly connected to the side of the two support plates 3 that are close to each other. A U-shaped clamp 5 is fixedly connected to the output end of the second electric telescopic rod 4. The two sides of the PCB circuit board 6 are in movable contact with the inner wall of the side of the two U-shaped clamps 5 that are far from each other. The top and bottom of the PCB circuit board 6 are slidably connected to the top inner wall and bottom inner wall of the U-shaped clamp 5, respectively.

[0062] In this embodiment, specifically: two support columns are fixedly connected to the top of the base plate 1, and the same control panel 7 is fixedly connected to the top of the two support columns. The laser receiver 115 receives the laser emitted by the laser emitter 114 and sends the information to the control panel 7. The control panel 7 displays the unqualified electronic components mounted on the PCB circuit board 6.

[0063] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intelligent inspection machine for SMT surface mount technology, comprising a base plate (1) and a PCB circuit board (6) for inspection, characterized in that: The base plate (1) is provided with a detection mechanism, which includes two first electric telescopic rods (101) fixedly installed on the base plate (1). The output end of the first electric telescopic rod (101) is fixedly connected to a connecting block (102). An L-shaped plate (103) is fixedly connected to the outside of the connecting block (102). A crossbeam (104) is fixedly connected between the two L-shaped plates (103). Multiple detection units are fixedly connected to the front side of the crossbeam (104). A screw (111) is rotatably connected between the two L-shaped plates (103). A rectangular seat (112) is threaded onto the outer side of the screw (111). A U-shaped seat (113) is fixedly connected to the front side of the rectangular seat (112). A laser emitter (114) and a laser receiver (115) are fixedly connected to the inner front wall and the inner rear wall of the U-shaped seat (113), respectively. When there is no obstruction between the laser emitter (114) and the laser receiver (115), the laser emitter (114) emits laser light, and the laser receiver (115) can receive the laser light. Each detection unit includes two L-shaped blocks (105). A rotating rod (106) is rotatably connected to the inner rear wall of each L-shaped block (105). A rectangular block (107) is fixedly connected to the front end of the rotating rod (106). A trapezoidal block (108) is fixedly connected to the bottom of the rectangular block (107). The bottom of the trapezoidal block (108) has an inclined surface. A tension spring (109) is fixedly connected between the side wall of the L-shaped block (105) and the corresponding rectangular block (107). The top of the rectangular block (107) A cylinder (110) is fixedly connected. In the initial state, the cylinder (110) is perpendicular to the base plate (1). The position and width W between the two trapezoidal blocks (108) in each detection unit match the width and position of the corresponding electronic component. When the electronic component is not offset, the trapezoidal block (108) can slide down from the side of the electronic component. When the electronic component is offset, the inclined surface in one of the trapezoidal blocks (108) in the detection unit will contact the electronic component downward, and the cylinder (110) will tilt.

2. The intelligent inspection machine for SMT surface mount technology according to claim 1, characterized in that: A motor (116) is fixedly connected to the left side of one of the L-shaped plates (103) on the left side, and the output shaft end of the motor (116) is fixedly connected to the left end of the screw (111).

3. An intelligent inspection machine for SMT surface mount technology according to any one of claims 1-2, characterized in that: The testing mechanism also includes a testing accuracy adjustment component, which includes a cavity (2) and a thin plate (204). The cavity (2) is provided on the cylinder (110). A circular seat (201) is rotatably connected to the bottom inner wall of the cavity (2). A square rod (202) is fixedly connected to the top of the circular seat (201). A round rod (203) is slidably connected to the outside of the square rod (202). The top end of the round rod (203) extends to the top of the corresponding cylinder (110) and is fixedly connected to the thin plate (204).

4. The intelligent inspection machine for SMT surface mount technology according to claim 3, characterized in that: Two positioning rods (117) are fixedly connected between the two L-shaped plates (103) on their adjacent sides, and a rectangular seat (112) is slidably sleeved on the outside of the two positioning rods (117).

5. The intelligent inspection machine for SMT surface mount technology according to claim 4, characterized in that: A spring (205) is fixedly connected between the top of the circular seat (201) and the bottom of the circular rod (203), and the spring (205) is movably sleeved on the outside of the square rod (202).

6. The intelligent inspection machine for SMT surface mount technology according to claim 5, characterized in that: The cylinder (110) is slidably sleeved on the outside of the rod (203). A horizontal plate (206) is fixedly connected to the outside of the rod (203). A pointer (207) is fixedly connected to the bottom of the horizontal plate (206). A circular scale plate (208) is fixedly connected to the top of the cylinder (110). When the thin sheet (204) is pinched and moved upward and rotated, the thin sheet (204) drives the horizontal plate (206) to move upward and rotate through the rod (203). At this time, with the reference of the scale line set on the circular scale plate (208), the horizontal plate (206) drives the pointer (207) to rotate to the maximum value allowed for the position offset of the electronic component.

7. The intelligent inspection machine for SMT surface mount technology according to claim 6, characterized in that: Both sides of the round rod (203) are fixedly connected to L-shaped rods (209), and the bottom of the L-shaped rod (209) is fixedly connected to a circular block (210). A rubber ring (211) is fixedly connected to the bottom inner wall of the cavity (2). The bottom of the circular block (210) is in contact with the top of the rubber ring (211).

8. The intelligent inspection machine for SMT surface mount technology according to claim 7, characterized in that: The top of the base plate (1) is fixedly connected to two support plates (3). The two support plates (3) are fixedly connected to a second electric telescopic rod (4) on the side that is close to each other. The output end of the second electric telescopic rod (4) is fixedly connected to a U-shaped clamp (5). The two sides of the PCB circuit board (6) are in movable contact with the inner wall of the side that is far away from each other of the two U-shaped clamps (5). The top and bottom of the PCB circuit board (6) are slidably connected to the top inner wall and the bottom inner wall of the U-shaped clamp (5) respectively.

9. The intelligent inspection machine for SMT surface mount technology according to claim 8, characterized in that: The top of the base plate (1) is fixedly connected to two support columns, and the top of the two support columns is fixedly connected to the same control panel (7). The laser receiver (115) receives the laser emitted by the laser emitter (114) and sends the information to the control panel (7). The control panel (7) displays the unqualified electronic components mounted on the PCB circuit board (6).

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