Inspection device and method for inspecting components

Abstract

An apparatus for inspecting a component and a method for inspecting an apparatus. The inspection apparatus includes a robot arm; a micro XRF instrument having an instrument head, the instrument head coupled to the robotic arm; a seat that supports the component within the scanning area during the inspection; and a computer in communication with the robotic arm and the micro XRF instrument.

Description

Technical Field

[0001] The present disclosure relates generally to an inspection device and, more particularly, to a method for inspecting a surface of a component for chemical anomalies. Background Art

[0002] Manufactured components require inspection prior to and during operation. Ultrasonic (UT) evaluation, macro etching, eddy current (ECI), X-ray / computed tomography (CT), and micro X-ray fluorescence (XRF) are all techniques used to inspect components. Each technique has limitations that make it difficult or limited in scope to detect chemical anomalies on the surface of manufactured components. Additionally, inspection can be a slow process that requires a significant amount of time and resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] A full and enabling disclosure of the present disclosure, including the best mode thereof, to one of ordinary skill in the art is set forth in the specification with reference to the accompanying drawings, in which:

[0004] Figure 1 is a schematic diagram of an inspection device for components for communicating with a computer.

[0005] Figure 2 is a schematic diagram of an inspection process using an inspection device and including a local scanning module.

[0006] Figure 3 is a schematic diagram of processing a local dataset from the local scanning module.

[0007] Figure 4 is a flow chart illustrating a method for inspecting a component for chemical anomalies. DETAILED DESCRIPTION

[0008] Reference will now be made in detail to the present embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. The detailed description uses numerical and letter designations to refer to features in the drawings. The same or similar reference numerals in the drawings and description are used to refer to the same or similar parts of the present disclosure.

[0009] Aspects of the present disclosure are generally directed to an inspection apparatus and method for inspecting a component, and more specifically to a micro-XRF inspection method for identifying potential chemical anomalies on the surface of a field component, a non-limiting example being a turbine engine component. The turbine engine component may be from a jet engine or a land-based heavy-duty gas turbine. For purposes of illustration, the present disclosure will be described with respect to the inspection of the surface of a turbine engine component. However, it should be understood that the aspects of the present disclosure described herein are not limited thereto and may have general applicability in other inspection methods and apparatuses other than manufactured turbine engine components for jet engines, i.e., any component for a gas turbine engine, whether the component is in the field or newly manufactured, may be envisioned.

[0010] Some known inspection methods have disadvantages, which are overcome by the methods and apparatus discussed herein. For example, ultrasonic (UT) evaluation lacks the ability to find certain chemical anomalies in certain embodiments because the grain size variation within the chemical anomaly is not sufficient to result in a measurable change in the speed of sound compared to the parent material. Macro-etching requires a chemical attack on the surface of the component, and analysis of that surface depends on the quality of the etch and the interpretation of the resulting microstructure, which can result in a lower probability of detection than desired. Eddy current inspection (ECI) is unable to inspect some smaller chemical anomalies on very rough surfaces (e.g., shot-peened surfaces) and relies on the interpretation of microstructure-driven signals rather than a direct assessment of the microstructure of the inspected component. X-ray / CT scanning can effectively find chemical anomalies that have significant differences in density compared to the parent material. However, chemical anomalies with smaller density differences compared to the parent material require thinner section thicknesses than production parts, limiting its capabilities. Finally, historically, micro-XRF inspections have been very time-consuming on larger components when looking for small chemical anomalies because the pixel size must be limited to ensure adequate signal is obtained in the potential chemical anomaly of interest. Furthermore, typical micro XRF systems are limited to X / Y scanning modes with limited Z motion capabilities, which makes them impractical for scanning complex geometric parts, at least because the micro XRF system and the part remain fixed relative to each other. This fixed relationship causes the scan distance between the part area and the micro XRF system's detector to vary throughout the scan as the part geometry changes.

[0011] The micro-XRF inspection method and apparatus discussed herein incorporates a micro-XRF head including an X-ray source and at least one detector as part of a robotic and turntable system, utilizes computer detection algorithms to identify potential chemical anomalies on the surface of a component, and performs a multi-scan inspection approach to reduce historically long inspection times.

[0012] Various aspects of the present disclosure provide an inspection method and inspection apparatus that utilizes micro-XRF technology to reduce the inspection (scanning) time required to discover surface chemical anomalies while still meeting accuracy and call requirements. Although the micro-XRF inspection method will be primarily utilized, it should be understood that various aspects disclosed herein can be applied to other inspection processes.

[0013] As used herein, "precision level" is an indicator of the number of false positives found in a population and is given by the ratio: (true positives) / (true positives + false positives).

[0014] As used herein, "call level" is an indicator of the number of false negatives found in a population and is given by the ratio: (true positives) / (true positives + false negatives).

[0015] As used herein, a "chemical anomaly" is an area where the composition of one or more elements or any combination of elements is statistically significantly different from other areas. Typically, a chemical anomaly is an area that is statistically significantly different from the intended master alloy from which the part will be formed. Based on a set of predetermined inspection requirements, the variations found in the elemental composition establish statistical thresholds, which are a function of the detection limits associated with the scanning instrument used and ultimately the speed at which the part is scanned.

[0016] As used herein, the term "high-speed scanning" refers to a complete scan of a component surface, or a predetermined portion of a component surface, completed as quickly as possible while still meeting a predetermined set of inspection requirements.

[0017] As used herein, the term "higher resolution" may refer to a spatial resolution having a smaller pixel size, or to an increased signal produced by a slower scan rate. Higher resolution is an improvement in resolution relative to the resolution, signal-to-noise ratio, or both of a high-speed scan.

[0018] As used herein, the term "high-resolution scan" refers to a complete local scan centered on the location of a possible chemical anomaly. A high-resolution scan has a higher resolution and is based on a set of predetermined inspection requirements. In one aspect, a high-resolution scan can be performed after a high-speed scan is completed. In another aspect, a high-resolution scan occurs only based on a set of inspection requirements.

[0019] As used herein, the term "inspection criteria" describes a series of inspection limits that must be met in order to successfully inspect a part. These include achieving a desired level of accuracy and recall, finding anomalies larger than a certain defined size, and finding anomalies of a certain shape. Specific inspection criteria must be defined for each anomaly type.

[0020] The term "elemental map" as used herein describes a multi-channel pixelated data set. Each pixel represents an area at a position defined in scan coordinates and a set of values ​​representing the integral of the detector data within one or more energy windows or metadata associated with the readout occurring at the specified pixel location. Each channel represents an aggregation of detector data from one or more energy windows, which is typically centered on a specific X-ray fluorescence peak or combination of peaks. The energy window definitions used to create an elemental map are analysis-specific and can be adjusted to specific features associated with the chemical anomaly being examined. The data set can be collected via point, line, or surface scans.

[0021] The word "exemplary" may be used herein to mean "serving as an example, instance, or illustration." Any implementation described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations. In addition, unless expressly noted otherwise, all embodiments described herein should be considered exemplary.

[0022] The singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Also, as used herein, the term "set" or "set" of elements may be any number of elements, including only one.

[0023] All directional references (e.g., radial, axial, proximal, distal, upper, lower, upward, downward, left, right, lateral, front, rear, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise, upstream, downstream, forward, backward, etc.) are used only for identification purposes to help the reader understand the present disclosure and do not create limitations, particularly with respect to the position, orientation, or use of the various aspects of the present disclosure described. Connection references (e.g., attachment, coupling, connection, and engagement) should be interpreted broadly and may include intermediate structural elements between sets of elements and relative motion between elements, unless otherwise specified. Therefore, connection references do not necessarily infer that two elements are directly connected and have a fixed relationship to each other. The exemplary drawings are for illustrative purposes only, and the sizes, positions, orders, and relative sizes reflected in the attached drawings may vary.

[0024] Figure 11 is an inspection apparatus 10 for inspecting a part 12. The inspection apparatus 10 may include a base 14 on which a seat 16 and a robotic arm 18 may be mounted. Although shown as a robotic arm 18, the robotic arm may be a device capable of positioning an object in space based on operator coordinate input. This may be, for example but not limited to, a linear motor, a combination of linear motors and / or rotary actuators. The seat 16 may include a turntable 20 on which the part 12 may be placed for inspecting a surface 22 of the part 12. A micro XRF instrument 23 is coupled to the robotic arm 18 and may include an instrument head 24, an X-ray excitation source 26, and at least one X-ray detector 28. The instrument head 24 may move in at least one dimension of a 3D space, shown as the XYZ axis. It is contemplated that the instrument head 24 may be moved along the x-axis, the y-axis, and the z-axis by the robotic arm 18. The turntable 20 may provide rotational motion about a line parallel to the Y-axis, which is located at the center of the part 12 and defines a horizontal plane (denoted as "HP") perpendicular to the y-axis. The instrument head 24 can be rotated relative to the horizontal plane HP to provide the movement required to access the area (as a non-limiting example, the borehole 30 in the component 12). Although the rotary table 20 can be rotated in any plane, including the horizontal plane shown, it should be understood that vertical and tilted rotations are also contemplated. In addition, the component 12 can remain stationary while the instrument head 24 moves relative to the entire component 12. In addition, the instrument head 24 can remain stationary while the component 12 moves in 3-D space. An encoder 32 can be located on an axis 34 (all schematically shown in dashed lines) of the rotary table 20 for determining the position of the component 12 during operation. In other words, the encoder 32 can provide position information to the computer 42 during operation.

[0025] Typical micro-XRF instruments cannot be used for industrial inspection of complex shaped parts due to motion limitations. Current micro-XRF instruments are limited to motion systems that largely restrict access in two dimensions (“X” and “Y”). While the unit does have the ability to change the standoff distance to the part being inspected (“Z”), that distance cannot be changed during map acquisition (described herein as elemental maps). Instead, typical micro-XRF instruments can only be used to perform single point analysis when the part has significant height variations. Additionally, typical systems do not allow the distance from the instrument head to the part surface to be changed during map collection to account for contour variations on complex shaped parts. Being able to maintain a constant distance and angle between the micro-XRF head and the part surface ensures that a consistent signal is collected. Without a consistent signal, detection algorithm A cannot be universally implemented.

[0026] The micro-XRF instrument 23 described herein overcomes these limitations by attaching an X-ray excitation source 26 and at least one X-ray detector 28 to a robotic arm 18 that can manipulate the separation distance SO dand at least one X-ray detector 28 as a function of the geometry of the part 12. In other words, the robotic arm 18 moves the instrument head 24 relative to the part 12 while maintaining a separation distance SO from the surface 22 of the part 12. d The robot arm 18 is able to fully control the separation distance SO d and angle, maintaining a constant separation distance SO during inspection d .

[0027] The component 12 may be a field component 12f that has been used for a predetermined amount of time and is ready for inspection. The field component 12f may be an engine component, and more specifically a jet engine component. Additionally, the component 12 may be a heavy duty gas turbine component. Additionally, the component 12 may be a newly manufactured component, a billet, a forging, or a casting.

[0028] The micro XRF controller 40 can communicate with the micro XRF instrument 23, and the robotic controller 48 can communicate with the robotic arm 18. Both wired and / or wireless communications are contemplated. In addition, either or both of the controllers 40, 48 can be integrated with the inspection device 10 and the computer 42. In addition, the encoder 32 can communicate with the robotic controller 48. The robotic controller 48 can include scanning instructions 36 for the surface 22, which are divided into scanning modules. These modules vary the scanning area and a set of micro XRF parameters, so when used in combination, they can minimize or otherwise reduce the total inspection time while meeting a desired set of inspection criteria. The micro XRF inspection parameters may include tube excitation parameters, scan head speed relative to the part surface, spot and pixel size, scan head spacing, and angles constrained by part geometry limitations.

[0029] A single scanning module may be utilized. It is also contemplated that multiple scanning modules may be used in series. In one non-limiting example, the scanning instructions include a global scanning module (denoted as "G") and a local scanning module (denoted as "L"). In addition, the computer 42 may include a detection algorithm (denoted as "A") and a user interface 38. In one non-limiting example, an operator may communicate with the controllers 40, 48 to initiate the scanning instructions 36 via the robot controller 48 and input instructions associated with a predetermined set of inspection requirements (denoted as "R") via the micro XRF controller 40, the predetermined set of inspection requirements including scanning position, direction, and speed.

[0030] The predetermined set of inspection requirements R may also include predetermined boundaries of normal chemical variation that are input into the global scanning module G prior to scanning. The set of predetermined boundaries may be input by an operator, or from a database, or from a combination of an operator and a database. The predetermined set of inspection requirements R may vary depending on the type of component 12 being inspected. The predetermined set of inspection requirements R may be input into a computer and forwarded to the controller 40 before the inspection process begins. The predetermined set of inspection requirements R may include predefined thresholds established based on, as a non-limiting example, historical data.

[0031] The global scanning module G includes instructions for scanning the surface 22 of the part 12 at a high speed. The high speed scanning as described herein may be performed by movement of the part 12, or in other aspects, may be performed by movement of the robotic arm 18. Regardless, the purpose of the high speed scanning is to scan the surface 22 as quickly as possible while still maintaining a predetermined set of inspection requirements R.

[0032] Inspection algorithm A is a computer algorithm implemented to output information regarding a collected data set of elemental maps 54 on the surface 22 of the engine component 12 based on information received from the high-speed scans. In addition, inspection algorithm A may include the ability to evaluate the cleanliness of the surface 22 of the component 12 in order to identify target cleaning locations.

[0033] In general, software can be used to communicate with the controllers 40, 48. The software can set parameters for the instrument head 24, including voltage, current, and detector readout settings. The X-ray detector 28 collects XRF signals, which are processed via software for the micro-XRF controller and sent in parallel to the user interface 38 and the detection algorithm A for processing and simultaneous display. When the detection algorithm A is completed, the information shared via the user interface 38 is updated.

[0034] The local scanning module L includes instructions for scanning only the locations identified by the detection algorithm A. The local scanning module L is completed with a high-resolution scan having a higher level of accuracy than the high-speed scan. This results in an overall reduction in inspection time compared to the slower high-speed scan required to complete the entire process at the same level of accuracy. It should be understood that the local scanning module L occurs after the global scanning module G, or in series with the global scanning module G.

[0035] Any scanning module may include instructions that include rotating the turntable 20 a full 360° while the robot arm 18 moves the instrument head 24 radially. It is also conceivable that the instructions may include rotating the turntable 20 back and forth in an arc. At the same time, the robot arm 18 may move the instrument head 24 radially. Rotating the turntable while moving the instrument head radially may produce a spiral scan. Rotating the turntable with the instrument head fixed may produce an annular scan. Concentric ring scans may be composed by radially moving the scanning head by one pixel width at the completion of each rotation. In addition, scanning may include moving the robot arm 18 while the component 12 remains stationary. For example, the robot arm 18 moves linearly back and forth on the stationary component 12 above the area covering the identified possible chemical anomaly location. It should be understood that the scanning discussed herein may be any combination of the rotation of the turntable 20 or the movement of the robot arm 18 with the other of the robot arm 18 or the turntable 20 remaining stationary.

[0036] Steering Figure 2 , a schematic diagram of an inspection process 50 is shown. The global scanning module G returns a global data set 52 generated by the high-speed scanning. The global data set 52 has a resolution high enough to detect possible chemical anomaly locations 46 at a high enough recall level, while the high-speed scanning is fast enough to effectively scan the surface 22. This balance is determined by the part 12, the material forming the part 12, and the potential chemical anomaly 76 being inspected, so that the global scanning module G meets all predetermined inspection requirements R of the part 12. Scanning under high-speed scanning can include rotating the turntable 20 through a full 360° when the robotic arm 18 radially moves the instrument head 24. In addition, scanning using high-speed scanning can include moving the robotic arm 18 while the part 12 remains stationary.

[0037] When the global scan module G is completed, the detection algorithm A is executed. The detection algorithm A processes the global data set 52 via the computer 42. Anomaly detection is based on determining statistical deviations from baseline components. In one example, the detection algorithm A includes a series of steps, including denoising the element map 54, selecting specific element maps 54 that indicate the screened surface or structural anomalies, and calculating the deviation of intensity from the central tendency to identify potential chemical anomalies 76. In one example, denoising uses a bilateral filter algorithm to reduce sensitivity to X-ray detector noise sources while maintaining spatial consistency of boundary states (including anomalies). The median absolute deviation (MAD) is calculated for each pixel in each selected element map 54. The MAD results are then combined via quadrature summation. The MAD algorithm is part of the M estimation method family and can provide a robust indicator of variability in univariate samples. A threshold is then applied to the distribution in the combined sample to establish a predetermined set of inspection requirements R for anomaly detection.

[0038] The detection algorithm A can generate readable data 44 in the form of a first set of element maps 54 representing the surface 22 of the component 12. The readable data 44 may include a first set of element maps 54 output by a high-speed scan. In a non-limiting example, the first set of element maps 54 may be two-dimensional. The first set of element maps 54 may be processed to locate any possible chemical anomaly locations 46 on the surface 22. In the case of detecting a potential chemical anomaly 76, the detection algorithm may also include marking the possible chemical anomaly locations 46 with a marker 64 to provide a physical record of the possible chemical anomaly locations 46. The detection algorithm A may utilize different detection processes. In one example, the marker 64 is based on a direct chemical assessment detected on the surface 22. In another example, the detection algorithm A may work by detecting differences from a baseline (as a non-limiting example, a chemical background). In yet another example, the detection algorithm A may work by directly detecting a chemical anomaly of interest.

[0039] In one example, if the surface 22 satisfies a predetermined set of inspection requirements R associated with the presence of any chemical anomalies, a first elemental map 56 without any markers 64 is generated by the detection algorithm A. In this case, a signal 58 indicating that the component 12 satisfies the predetermined set of inspection requirements R may be sent to an operator via (as a non-limiting example) the user interface 38.

[0040] Some specific examples of chemical anomalies that may occur in turbine engine components are freckles, white spots, dirty white spots, streaks, oxidation, corrosion, and coating loss. Freckles are chemical anomalies that form during solidification due to interdendritic microsegregation of the liquid alloy and fluid flow. White spots, dirty white spots, and streaks are chemical anomalies caused by incomplete melting of the molten material that falls into the liquid pool during the final melting step. Oxidation occurs when metals react with atmospheric oxygen to form oxides. Corrosion occurs when metals react with contaminants during the combustion process, causing low melting point compounds to attack the metal surface. Coating loss occurs when an applied coating chip or flakes off, allowing the operating environment to contact the underlying substrate. All of these chemical anomalies result in a surface chemistry at the location of the anomaly that is statistically distinguishable from the starting baseline chemistry.

[0041] At the end of the high-speed scan, the first set of elemental maps 54 and the corresponding metadata are processed by the computer 42 via the detection algorithm A. In another example, when the presence of a possible chemical anomaly is detected, the first set of elemental maps 54 includes a second elemental map 62 that includes a marker 64. If the generated readable data 44 includes the marker 64, the local scanning module L is initiated.

[0042] If the inspection algorithm A returns the first set of elemental maps 54 including the second elemental map 62, the software initiates a high-resolution scan by sending instructions 66 to the robotic controller 48 and the micro-XRF controller 40 to scan the surface 22 of the part 12. These instructions 66 may include scanning only a predetermined area 68 of the surface 22 surrounding the possible chemical anomaly location 46 corresponding to each mark 64. The instructions to the robotic arm 18 may include scanning at a high-resolution scan and may include rotating the turret 20 back and forth in a short arc covering the predetermined area 68 of the surface 22. At the same time, the robotic arm 18 may move the instrument head 24 radially while maintaining a standoff distance SO as described herein. d The local scanning module L returns a local data set 70 associated with each possible chemical anomaly location 46 .

[0043] When the local scan module L is completed, the algorithm is implemented. In one non-limiting example, the detection algorithm A is again implemented. However, it should be understood that any algorithm is contemplated. The detection algorithm A processes the local data set 70 via the computer 42 to produce readable data 44, which includes a second set of element maps 72 representing the predetermined area 68 of the surface 22. The readable data 44 is then again presented via the user interface 38 (as a non-limiting example) for review by an operator to make a determination regarding the presence of a possible chemical anomaly.

[0044] While the operator may make the final determination regarding the presence of a chemical anomaly, it is contemplated that the computer includes an anomaly determination module (denoted as "D") wherein the computer determines that an actual chemical anomaly is actually present at the component 12. In one example, the component 12 has an oxidation resistant overlay coating of varying chemical composition applied to the surface. In one area, the overlay coating is missing, exposing the surface of the component 12. The absence of the coating is a chemical anomaly of the target surface and may be automatically detected and converted to a signal 73. In this case, the signal 73 indicating that the component 12 has a loss of coating (defining a chemical anomaly) is sent to the operator via the user interface 38 (as a non-limiting example).

[0045] Steering Figure 3 , a more detailed schematic diagram of processing a local data set 70 is shown. As a non-limiting example, the second set of elemental maps 72 can be a collection of three elemental maps 72a, 72b, 72c that are tuned to specific signatures associated with different elements. In one non-limiting example, the specific signature is specific to metallic elements. On the one hand, an enhanced map 74 is derived from the second set of elemental maps 72, and as a non-limiting example, a denoised map of a potential chemical anomaly 76 is determined and displayed from the detection algorithm A. A specific set of detection indicators must be defined for each type of potential chemical anomaly 76 and substrate type.

[0046] The detection algorithm A may include determining a threshold map 78 with a marker 64 based on an inspection state of the component surface 22 determined by the second set of elemental maps 72, wherein a group of pixels 65 on the enhancement map 74 exceeds a predefined threshold, the group of pixels 65 being at least one pixel. The inspection state refers to using the component surface 22 to establish an overall chemical distribution reflected in the second set of elemental maps 72. Possible chemical anomaly locations 46 may be associated with the presence of spots, dirty spots, or streaks on the surface 22. In addition, possible chemical anomaly locations 46 may include localized areas of oxidation, corrosion, repair, chemical etching, coating loss, or deviation from the expected base metal composition defined by the expected alloy statistical characteristics. A subsequent determination may then be performed as to whether the marker 64 is confirmed to be a true chemical anomaly.

[0047] In one non-limiting example, threshold map 78 may be presented alongside second set of elemental maps 72 associated with possible chemical anomaly location 46. An operator or user may then make a determination as to whether possible chemical anomaly location 46 matches a potential chemical anomaly or whether possible chemical anomaly location 46 is a false positive.

[0048] High-resolution scanning results in a slower inspection speed than the inspection speed used in high-speed scanning. Limiting the area covered by the slower high-resolution scanning to a predetermined area 68 of the surface reduces the total scanning time. The resolution of the high-resolution scanning enables a higher call level and a higher precision level compared to the high-speed scanning. The higher call level and higher precision level of the high-resolution scanning provide greater confidence in determining whether the potential anomaly identified by the global scanning module G is a true positive (chemical anomaly of concern) or a false positive (chemical anomaly of no concern). The detection algorithm A as described herein is tuned to minimize the number of false positives to achieve a precision level as close to 100% as possible and minimize the number of false negatives to achieve a call level as close to 100% as possible.

[0049] Steering Figure 4, a flow chart of a method 100 for inspecting a surface connection chemical anomaly of a component 12 is shown. At box 102, the surface 22 of the component 12 is scanned with a micro XRF instrument 23 to define a data set. In one non-limiting example, the scanning may include scanning at a high speed scan to define a global data set 52. In another non-limiting example, the scanning may include scanning at a high resolution scan to define a local data set 70. At box 104, the data sets 52, 70 are processed with a computer algorithm (e.g., as a non-limiting example, a detection algorithm A). At box 106, the local data set 70 is inspected with a computer algorithm according to a predefined threshold. At 108, readable data 44 in the form of a set of elemental maps 54 is generated using the computer algorithm. At 110, the set of elemental maps 54 is evaluated to determine whether a set of pixels 65 on the set of elemental maps exceeds a predefined threshold. As a non-limiting example, the set of elemental maps 54 can be evaluated using the MAD algorithm described herein. At 112, if the set of pixels 65 exceeds the predefined threshold, at least one possible chemical anomaly location 46 is identified using the computer algorithm. In other words, when the composition of surface 22 is determined to be outside of a statistical deviation from a baseline composition.

[0050] The method 100 may also include moving the part 12 while being scanned by the micro XRF instrument 23. The method 100 may also include moving the instrument head 24 while scanning the part 12. The method 100 may also include marking any possible chemical anomaly locations 46 with at least one marker 64.

[0051] The detection algorithm A described herein may also include collating relevant element signals of interest, pre-filtering of signal noise, smoothing of input data, and statistical analysis for anomaly detection, wherein a set of micro-XRF parameters are optimized based on real scan data. In another embodiment, the detection algorithm A described herein may also include collating relevant element signals of interest and ground truth information to perform anomaly detection using machine learning or deep learning methods.

[0052] Benefits associated with the disclosure discussed herein include reducing inspection time for inspecting on-site engine components while meeting a required set of inspection criteria. In other non-limiting examples, benefits may include reducing inspection time for off-site components or components in industrial quality control. Reducing inspection time while maintaining inspection requirements may allow for more timely cleaning of operating components, thereby benefiting consumers and manufacturers.

[0053] It should be understood that any combination of geometries associated with the inspection devices discussed herein are contemplated. The various aspects of the disclosure discussed herein are for illustrative purposes and are not meant to be limiting. It should be understood that application of the disclosed designs may be applicable to any component, including field components from any engine including jet engines, where the component is made of a material capable of producing a chemical anomaly.

[0054] This written description uses examples to describe the various aspects of the disclosure described herein, including the best mode, and also enables any person skilled in the art to practice the various aspects of the disclosure, including making and using any device or system and performing any combined method. The patentable scope of the various aspects of the disclosure is defined by the claims, and may include other examples that occur to one skilled in the art. These other examples are intended to fall within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements that do not differ substantially from the literal language of the claims.

[0055] Further aspects of the disclosure are provided by the subject matter of the following clauses:

[0056] An inspection device for inspecting surface-connected chemical anomalies of a component, the inspection device comprising a robotic arm; a micro XRF instrument, the micro XRF instrument comprising an instrument head coupled to the robotic arm, the instrument head comprising an X-ray excitation source and at least one X-ray detector; a seat, the seat supporting the component within a scanning area during inspection; and a computer, the computer communicating with at least the robotic arm and the micro XRF instrument, the computer comprising: at least one scanning module, the at least one scanning module comprising instructions for scanning the surface of the component with the micro XRF instrument and collecting and combining element maps output by the scan; and a detection algorithm, the detection algorithm comprising instructions for evaluating the element maps collected from the micro XRF instrument to identify possible chemical anomaly locations on the surface of the component while achieving a desired set of detection indicators.

[0057] An inspection device according to any of the preceding clauses, wherein the at least one scanning module includes a local scanning module, the local scanning module including instructions for scanning the possible chemical anomaly locations on the surface of the component identified by the detection algorithm with the micro XRF instrument.

[0058] An inspection device according to any of the preceding clauses, wherein the at least one scanning module includes a global scanning module, the global scanning module including instructions for scanning the surface of the component at high speed with the micro XRF instrument before the local scanning module and collecting and combining the element map output by the scan for analysis using the detection algorithm.

[0059] Inspection apparatus according to any of the preceding clauses, wherein a set of micro-XRF parameters is selected such that the local scanning module occurs at a higher resolution than the global scanning module.

[0060] Inspection device according to any of the preceding clauses, wherein the seat comprises a turntable rotatable in at least one plane.

[0061] An inspection apparatus according to any preceding clause, wherein the at least one scanning module includes instructions to rotate the turntable a full circle while the robotic arm radially moves the micro XRF instrument.

[0062] An inspection apparatus as described in any preceding clause, wherein the at least one scanning module includes instructions to rotate the turntable back and forth in a short arc while the robotic arm radially moves the micro XRF instrument.

[0063] An inspection apparatus according to any of the preceding clauses, wherein the at least one scanning module includes instructions to rotate the turntable back and forth in a short arc that covers the possible chemical anomaly locations identified while the robotic arm radially moves the micro XRF instrument.

[0064] Inspection apparatus as described in any preceding clause wherein the robotic arm is movable in at least one dimension relative to the scanning area.

[0065] An inspection apparatus as described in any preceding clause, wherein the at least one scanning module includes instructions to cause the robotic arm to move back and forth over a stationary component.

[0066] Inspection apparatus according to any of the preceding clauses, wherein the detection algorithm further comprises determining the presence of a surface chemical anomaly by identifying a group of pixels lying outside a predefined threshold based on an inspection state of the component surface determined by the elemental map.

[0067] The inspection apparatus of any of the preceding clauses, further comprising a user interface for viewing the set of element maps.

[0068] A method for inspecting the surface connection chemical anomalies of a component, the method comprising scanning the surface of the component with a micro XRF instrument to define a data set; and processing the data set with a computer algorithm, the computer algorithm comprising: generating a set of readable data in the form of an element map and evaluating the set of element maps to determine whether a set of pixels on the set of element maps exceeds a predefined threshold, and identifying at least one possible chemical anomaly location when the set of pixels exceeds the predefined threshold.

[0069] A method according to any of the preceding clauses, wherein scanning the surface comprises scanning the at least one possible chemical anomaly location with the micro-XRF instrument using a high resolution scan to define a local data set.

[0070] A method as in any preceding clause, wherein scanning the surface comprises scanning the surface using a high speed scan prior to scanning with a high resolution scan to define a global data set.

[0071] A method according to any of the preceding clauses, wherein the computer algorithm further comprises identifying from the global data set the at least one possible chemical anomaly location wherein the set of pixels on the set of elemental maps exceeds the predefined threshold.

[0072] A method as in any preceding clause, further comprising processing the local data set and marking any possible anomaly locations with landmarks to define a threshold map using at least one landmark.

[0073] A method as in any preceding clause, further comprising determining whether a group of pixels in the threshold map having the at least one flag exceeds the predefined threshold.

[0074] A method according to any of the preceding clauses, further comprising sending the threshold map with the at least one flag to a user interface when the group of pixels exceeds the predefined threshold.

[0075] A method as in any preceding clause, further comprising moving the micro XRF instrument whilst scanning.

[0076] A method as in any preceding clause, further comprising moving the component whilst scanning.

Claims

1. An inspection device for inspecting chemical anomalies of surface connections of components, characterized in that: The inspection device comprises: Robotic arm; a micro-XRF instrument comprising an instrument head coupled to the robotic arm, the instrument head comprising an X-ray excitation source and at least one X-ray detector; a seat that supports the component within a scanning area during inspection; and a computer in communication with at least the robot arm and the micro-XRF instrument, the computer comprising: at least one scanning module including instructions for scanning a surface of the component with the micro-XRF instrument and collecting and assembling an elemental map output by the scan; and a detection algorithm including instructions for evaluating the elemental map collected from the micro-XRF instrument to identify locations of possible chemical anomalies on the surface of the component while achieving a desired set of detection metrics; The robot arm moves the instrument head relative to the component while maintaining a certain distance from the surface of the component to scan the component.

2. The inspection device according to claim 1, characterized in that: in, The at least one scanning module includes a local scanning module including instructions for scanning, with the micro-XRF instrument, the locations of possible chemical anomalies on the surface of the component identified by the detection algorithm.

3. The inspection device according to claim 2, characterized in that: in, The at least one scanning module includes a global scanning module including instructions for scanning the surface of the component at high speed with the micro XRF instrument prior to the local scanning modules and collecting and combining element maps output by the scanning for analysis using the detection algorithm.

4. The inspection device according to claim 3, characterized in that: in, A set of micro-XRF parameters is selected such that the local scanning module occurs at a higher resolution than the global scanning module.

5. The inspection device according to claim 1, characterized in that: in, The seat comprises a turntable rotatable in at least one plane.

6. The inspection device according to claim 5, characterized in that: in, The at least one scanning module includes instructions to rotate the turntable a full circle while the robotic arm radially moves the micro XRF instrument.

7. The inspection device according to claim 5, characterized in that: in, The at least one scanning module includes instructions to rotate the turntable back and forth in a short arc while the robotic arm radially moves the micro XRF instrument.

8. The inspection device according to claim 1, characterized in that: in, The robotic arm is movable in at least one dimension relative to the scanning area.

9. The inspection device according to claim 8, characterized in that: in, The at least one scanning module includes instructions to cause the robotic arm to move back and forth over a stationary component.

10. The inspection device according to claim 1, characterized in that: in, The detection algorithm further includes determining the presence of a surface chemical anomaly by identifying a group of pixels that are outside a predefined threshold based on an inspection state of the component surface determined by the elemental map.

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